WO2024055700A1 - Module d'encapsulation en plastique, procédé d'encapsulation en plastique et dispositif électronique - Google Patents

Module d'encapsulation en plastique, procédé d'encapsulation en plastique et dispositif électronique Download PDF

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Publication number
WO2024055700A1
WO2024055700A1 PCT/CN2023/104167 CN2023104167W WO2024055700A1 WO 2024055700 A1 WO2024055700 A1 WO 2024055700A1 CN 2023104167 W CN2023104167 W CN 2023104167W WO 2024055700 A1 WO2024055700 A1 WO 2024055700A1
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Prior art keywords
solder resist
plastic
substrate
solder
module
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PCT/CN2023/104167
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English (en)
Chinese (zh)
Inventor
郎丰群
刘海燕
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华为数字能源技术有限公司
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Publication of WO2024055700A1 publication Critical patent/WO2024055700A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73221—Strap and wire connectors
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/808—Bonding techniques
    • H01L2224/80801—Soldering or alloying

Definitions

  • the present application relates to the field of electronic technology, and in particular to a plastic packaging module, a plastic packaging method and electronic equipment.
  • Power modules in electronic equipment are evolving towards high power density and high reliability.
  • Power modules adopt new structures such as three-dimensional (3D) plastic packaging mode, which can improve the heat dissipation, power density and reliability of power modules in electronic equipment.
  • 3D three-dimensional
  • Welding is the core process technology of electronic product manufacturing.
  • a substrate such as a copper-clad ceramic substrate (direct bonded copper, DBC)
  • the module is welded to a radiator or heat sink
  • it is necessary to control the thickness of the welding layer (bonding line thickness) and the tilt of the solder layer, especially It is the overflow of solder to prevent the overflow of solder from causing electrical short circuits, welding voids, and the risk of delamination of the combination of plastic packaging material and solder.
  • Solder resist is a common method to prevent solder from overflowing during reflow.
  • This application provides a plastic packaging module, a plastic packaging method and electronic equipment to improve the combination performance of solder resist and plastic packaging material.
  • a plastic package module including a substrate, a solder resist layer is provided on the surface of the substrate, solder is placed in a closed area formed by the solder resist layer, and the chip and the substrate pass through The solder realizes fixation, and the substrate and the chip fixed on the substrate are plastic-sealed to form the plastic-sealed module.
  • the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the heat dissipation structure substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
  • solder resist is embedded inside the module.
  • the solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
  • solder resist provides soldering resistance, it can not only achieve a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the above-mentioned new solder resist is printed on the substrate according to the predetermined welding topology.
  • the printing thickness can be 5nm-500um; or by spraying the solder resist onto the substrate to form a solder resist layer; or by dispensing glue method to form a solder mask.
  • the pattern of the solder resist can be rectangular or any other shape, which is determined according to the number, size and arrangement of chips, resistors and capacitors in the module to be soldered.
  • the embodiment of the present application does not limit the pattern of the solder resist.
  • the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
  • solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
  • the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, imidazole, etc. can be used.
  • Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • Polyimide has long-term temperature resistance of -269-280°C and stable structure.
  • Solder resist made of polyimide can be combined with base The copper layer of the board is combined with the plastic sealant.
  • solder resist layer can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resists made of any material that meet the characteristics of combining with copper (Cu), nickel (Ni) and other metals and also with plastic packaging materials are within the scope of protection of this application. Inside.
  • one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the other end of the functional group of the solder resist is bonded to the plastic molding material of the plastic module through a chemical bond.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • the substrate further includes a heat dissipation structure.
  • the heat dissipation structure includes any one of the following: a heat dissipation plate or a radiator.
  • the base plate is copper, which allows for even heat dissipation.
  • the radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
  • the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
  • the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
  • Active metal brazed copper (AMB) technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The formation of ceramics can Reactive layer wetted by liquid solder.
  • active metal elements such as Ti/Ag/Zr/Cu
  • the mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
  • the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
  • solder resist By applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • a plastic packaging method includes: setting a solder resist layer on the surface of the substrate; placing solder in a closed area formed by the solder resist layer; placing a gap between the chip and the substrate Fixing is achieved through the solder; the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
  • the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
  • solder resist is embedded inside the module.
  • the solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
  • the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
  • solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
  • the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • Polyimide has a long-term temperature resistance of -269-280°C and a stable structure.
  • the solder resist made of polyimide can be combined with the copper layer of the substrate and the plastic packaging material.
  • potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resist made of any material that meets the characteristics of combining with metals such as copper and nickel as well as with plastic packaging materials is within the scope of protection of this application.
  • one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the solder resist The other end of the functional group is combined with the plastic molding material of the plastic molding module through chemical bonds.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • the substrate further includes a heat dissipation structure.
  • the heat dissipation structure includes any one of the following: a heat dissipation plate and a radiator.
  • the base plate is copper, which allows for even heat dissipation.
  • the radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
  • the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
  • the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
  • Active metal brazing copper technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The ceramics form a reaction layer that can be wetted by liquid solder. .
  • active metal elements such as Ti/Ag/Zr/Cu
  • the mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
  • the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
  • solder resist By applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • an electronic device including at least one plastic packaging module that implements the first aspect or any one of the first aspects, and the at least one plastic packaging module passes through a chip in the at least one plastic packaging module.
  • the pins are electrically connected.
  • Figure 1 is the molecular structural formula of a polyimide provided in the embodiment of the present application.
  • Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application;
  • Figure 3 is a schematic flow chart of a plastic sealing method provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional view of a plastic packaging module provided by an embodiment of the present application.
  • Figure 5 is a schematic diagram of solder resist coating near the trench of the copper-clad ceramic substrate provided by the embodiment of the present application.
  • Figure 6 is a schematic cross-sectional view of another plastic packaging module provided by an embodiment of the present application.
  • solder overflow may cause electrical short circuits, soldering voids, risks of delamination of the combination of plastic packaging material and solder, etc.
  • the current methods to prevent solder overflow during reflow are as follows:
  • solder resist is a material coated on the substrate. It can prevent solder from overflowing during reflow (solder melting) and cause short circuits in the circuit. It can also prevent non-soldered points from being contaminated by solder and other problems. It can also effectively prevent moisture and protect the circuit. wait.
  • Green oil solder resist is a liquid photo solder resist, which is an acrylic oligomer. As a protective layer, it is coated on the circuits and substrates of the printed circuit board (PCB) that do not need to be soldered, and is used as a solder resist. The purpose is to protect the formed circuit pattern for a long time; to prevent solder from overflowing and causing short circuit in electrical circuits; to prevent physical disconnection of conductor circuits; to reduce copper pollution to the soldering tank; to prevent insulation deterioration caused by external environmental factors such as dust and moisture. , corrosion; with high insulation, making high-density circuits possible.
  • this solder resist is suitable for 2D packaging.
  • the upper surface of the green oil solder resist layer is weakly bonded to the plastic packaging material and cannot be molded into the plastic packaging module.
  • Another way to prevent solder spillage during reflow is a laser oxidation trench solder mask solution.
  • a laser is used to create grooves around the pads. Due to laser ablation in air, the metal of the laser groove is oxidized. Solder resistance is achieved by utilizing the solder resistance of oxides.
  • the reflow process using solder sheets is generally carried out in reducing atmospheres such as N 2 -formic acid (HCOOH) mixed gas and N 2 -H 2 mixed gas.
  • HCOOH N 2 -formic acid
  • N 2 -H 2 mixed gas N 2 -H 2 mixed gas
  • solder resist groove can be formed around the pad by etching, so that the overflowed solder flows into the groove.
  • too many solder resist grooves may degrade the performance of the substrate, may destroy the stress state of the substrate after molding, and cause glue to overflow after the substrate is molded.
  • Another way to prevent solder from overflowing during reflow is to roughen the surface of the green oil (such as roughening through mechanical processing) to enhance the bonding force between the green oil and the plastic packaging material.
  • roughening the green oil plastic seal it on the surface of the green oil.
  • the surface of the green oil is first roughened and then plastic-sealed.
  • the roughening of the surface of the green oil solder mask layer increases the bonding area and anchoring effect, thereby increasing the bonding force between the green oil and the plastic sealing material.
  • mechanical action can weaken the bonding layer between the green oil solder resist and the substrate, posing reliability risks.
  • the bonding force between the green oil surface and the plastic sealant is also weak.
  • this application provides a plastic packaging module, a plastic packaging method and an electronic device.
  • the solder resist layer provided on the surface of the substrate provides While acting as a solder resist, it can not only achieve a highly reliable combination between the solder resist layer and the metal layer of the substrate, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • first, second, etc. are used for descriptive purposes only and shall not be understood as indicating or implying the relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined by “first,” “second,” etc. may explicitly or implicitly include one or more of such features.
  • plural means two or more. Orientation terms such as “up”, “down”, “left” and “right” are defined relative to the schematically placed directions of the components in the drawings. It should be understood that these directional terms are relative concepts and they are used in Descriptions and clarifications relative to the drawings may vary accordingly depending on the orientation of components in the drawings.
  • a structure generally assumes a certain shape, which means that the structure generally exhibits the shape when viewed from a macro perspective, and may have local adjustments. For example, if it is roughly square, it can be understood that shapes in which one side is an arc rather than a straight line are also included in the scope.
  • shape in which one side is an arc rather than a straight line are also included in the scope.
  • shape to be substantially coaxial with another feature is understood to mean that the distance between the axes of the two features does not exceed 20% of the dimension of either feature perpendicular to the axis.
  • connection should be understood in a broad sense.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • and/or includes any and all combinations of one or more of the associated listed items.
  • the power module refers to a semiconductor module that converts the voltage, current, cycle number, etc. of the power supply. It is the core module of power conversion.
  • Plastic-encapsulated modules refer to the power module’s internal electronic components being assembled to the substrate, and then the module is encapsulated with plastic encapsulation material to improve the module’s reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • Copper-clad ceramic substrate also known as direct bonded copper, is a method of directly bonding copper with alumina oxide (Al 2 O 3 ) and aluminum nitride ceramics through thermal fusion at high temperatures.
  • alumina oxide Al 2 O 3
  • aluminum nitride ceramics Al 2 O 3
  • Ceramic copper-clad laminates have the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high electrical conductivity and excellent welding performance of oxygen-free copper, and can be etched with various patterns like PCB circuit boards. .
  • AMB technology is a further development of DBC technology. It uses active metal elements in solder (such as Ti/Ag/Zr/Cu) to achieve the combination of ceramics and metals.
  • solder such as Ti/Ag/Zr/Cu
  • the ceramics form a reaction layer that can be wetted by liquid solder.
  • the combination of ceramic and solder in AMB ceramic substrates is achieved through the chemical reaction of ceramic and active metal solder at temperature. After solidification, the active metal solder solders the ceramic and copper layers together.
  • the silicon nitride (Si3N4) ceramic used in AMB has a higher thermal conductivity (>90W/mK 25°C) and is closer to the thermal expansion coefficient of silicon carbide (2.6x10-6/ K). Therefore, AMB substrate has high bonding strength and reliability.
  • the AMB copper layer with active metal coating can achieve high power, better heat dissipation and high reliability packaged modules (can withstand 3000 thermal shocks), which has been widely used in Electric cars, electric locomotives and high-speed trains.
  • the thickness of the solder layer refers to the thickness of the solder layer of the module.
  • the thickness of the solder layer has an important impact on the reliability of the solder bond.
  • the inclination of the solder layer refers to the inclination of the soldering layer of the module.
  • the thickness and slope of the solder layer affect whether the solder will overflow during reflow.
  • 2D packaging (two dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate.
  • the upper surface of electronic parts is no longer combined with other items.
  • the electronic components and the substrate are on the same plane.
  • 3D packaging (three dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate. The upper surface of electronic parts is then combined with other items.
  • Soldering pad refers to the soldered part of the substrate or device.
  • solder resist is based on the current mainstream surface mounted technology (SMT) 2D packaging solder resist technology.
  • Solder resist is printed onto the copper layer of the substrate around the pads, forming the desired shape. After drying, the solder resist can ensure the shape of the solder during reflow and prevent solder from overflowing and causing electrical short circuits.
  • the current solder resist corresponding to 2D packaging can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • This embodiment proposes a new solder resist layer for plastic packaging modules. After welding, the solder resist and the module are embedded in the plastic compound.
  • the solder resist needs to be combined with metals such as copper and plastic packaging materials, and must have high temperature resistance and high reliability.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • polyimide refers to a type of polymer containing an imide ring (-CO-NR-CO-) in the main chain. It is one of the organic polymer materials with the best comprehensive properties. It has a high temperature resistance of over 400°C and a long-term use temperature range of -200 ⁇ 300°C. Some parts have no obvious melting point and have high insulation properties.
  • the dielectric constant is 4.0 at 10 3 Hz and the dielectric loss is only 0.004 ⁇ 0.007. It belongs to F to H class insulation. .
  • Epoxy resin is a high molecular polymer with the molecular formula (C 11 H 12 O 3 ) n . It refers to a class of polymers containing more than two epoxy groups in the molecule. It is the condensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring and solidify and cross-link to form a network structure, so it is a thermosetting resin.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • the molecular structure formula of a polyimide is provided in the embodiment of the present application.
  • the polyimide has a long-term temperature resistance of -269-280°C and a stable structure.
  • the solder resist made of polyimide can It can be combined with the copper layer of the substrate and with the plastic packaging material.
  • potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resist made of any material that meets the characteristics of combining with metals such as copper and plastic packaging materials is within the scope of protection of this application.
  • the solder resist can be applied to a certain thickness, such as 5nm-500um.
  • the embodiments of this application do not limit the thickness of the solder resist coating.
  • Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application.
  • Traditional solder resist is generally called green oil. It is a unipolar solder resist, and its functional groups can only be combined with copper and other metals on the substrate. The upper surface of the green oil solder resist cannot be combined with the plastic packaging material of the plastic module.
  • FIG. 1 shows a schematic diagram of the combination of functional groups of the solder resist provided in this embodiment. This embodiment provides a bipolar, high-temperature resistant, and high-reliability solder resist for metal and plastic packaging materials.
  • This new type of solder resist is a bipolar solder resist.
  • One end of the functional group can be highly reliably combined with the metal of the substrate (such as DBC copper) through chemical bonds, and the other end of the functional group can be highly reliably combined with the plastic packaging material of the plastic module through chemical bonds. combine.
  • the above-mentioned functional groups are atoms or atomic groups that determine the chemical properties of organic compounds.
  • Common functional groups include hydroxyl, carboxyl, ether bonds, aldehyde groups, carbonyl groups, etc.
  • a plastic packaging method provided by this embodiment is described by taking the manufacturing method of a built-in solder resist layer in which a plastic packaging module is welded to a substrate as an example.
  • a solder resist layer is provided on the surface of the substrate.
  • the base plate includes a heat sink.
  • the above-mentioned new solder resist can be printed on the heat sink plate through a mold (such as a steel mesh) according to a predetermined welding topology map, and the printing thickness can be 5nm-500um.
  • the material of the heat sink can be bare copper or nickel plated.
  • the solder resist can also be sprayed onto the heat sink, or the solder resist can be applied onto the heat sink by dispensing glue.
  • the pattern of the solder resist can be a rectangle as shown in Figure 3, or can be any other shape, which is determined according to the number and size of chips, resistors, capacitors and other components in the module to be soldered. Book The application embodiment does not limit the pattern of the solder resist.
  • the color of the solder resist before curing should be uniform (clear, unpigmented solder resist is allowed).
  • the fluidity of UV-curable, heat-curable, and liquid photosensitive solder resists should be consistent, without crusting, settling, gelling, etc.; the thickness of dry film solder resist should be uniform, without pinholes, bubbles, particles, or impurities. , glue layer flow and other phenomena.
  • the solder resist is required to have a certain thickness and hardness, solvent resistance test and adhesion test should meet the standards, and the surface of the printed circuit board should be free of garbage and redundant marks. Therefore, after the solder resist is printed, the solder resist is cured (or dried).
  • the types of solder resist involved are divided according to process processing characteristics: UV-curable solder resist, thermal-curable solder resist, liquid photosensitive solder resist, and dry film solder resist. For example, taking a thermally curable solder resist as an example, depending on the curing characteristics of the solder resist, it can be cured at room temperature or at high temperature.
  • the curing environment can be the atmosphere or a protective atmosphere. Among them, the protective atmosphere is a kind of environment that prevents oxidation and so on.
  • the cured solder mask layer should be uniform and free of foreign objects, cracks, inclusions, peeling and roughness that would affect the assembly and use of the printed board; the discoloration of the metal surface under the cured solder mask layer should be acceptable, but the resist The solder layer itself should not have obvious discoloration. After the solder resist pattern is cured, it forms a pad as shown in the figure, which is a closed area.
  • solder is then placed in the enclosed area created by the solder mask.
  • the first solder can be placed into the pad surrounded by the solder resist.
  • the first solder includes solder pieces or solder paste.
  • solder tabs may be implanted into pads surrounded by solder resist.
  • solder paste (a paste composed of metal balls and flux) can also be printed or dotted into a pad surrounded by solder resist.
  • the thickness of the solder layer is higher than the thickness of the solder resist.
  • the amount of solder paste printed or inserted is determined by the thickness of the solder. When the solder paste is reflowed, the flux is melted, and the thickness of the solder paste after reflow (that is, the solder paste is melted) is approximately 50% of the solder paste thickness.
  • the solder resist layer on the heat sink prevents solder from overflowing and ensures the thickness and slope of the first solder.
  • the first solder is reflowed, it will not flow out of the periphery of the pad formed by the solder resist, causing a short circuit in the circuit.
  • the substrate with the second solder printed on it and the chip attached to the second solder (this process is called SMT) is placed on the first solder (solder piece or solder paste) surrounded by solder resist.
  • the substrate includes at least one of the following: DBC, AMB.
  • the chip and the substrate are fixed with solder.
  • the chip and the substrate, and the substrate and the substrate can be welded together through a reflow process to form a module.
  • some modules may not require a substrate.
  • the substrate is made of metal (such as copper), which can enhance uniform heat dissipation.
  • the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
  • the above-mentioned module can be plastic-sealed using plastic packaging material.
  • the molding compound flows into every gap in the module and/or onto the surface of the chip.
  • the solder resist prevents solder from overflowing, it provides the possibility of tightness between the plastic packaging material and the substrate.
  • the solder resist also binds to the molding compound on and around it, improving the reliability of the molded module.
  • the new solder resist has good bonding properties with copper and plastic packaging materials, and will not cause welding voids or the risk of delamination between plastic packaging materials and solder.
  • the above-mentioned solder resist is embedded in the plastic packaging material and can be called built-in solder resist.
  • FIG. 4 it is a schematic cross-sectional view of a plastic module provided by an embodiment of the present application, illustrating a plastic module with a heat dissipation plate and a built-in solder resist.
  • the plastic module includes a substrate (such as a DBC), and a solder resist layer is provided on the surface of the DBC.
  • the base plate also includes a heat sink.
  • the built-in solder resist layer can be manufactured on the substrate according to the above plastic sealing method.
  • the solder mask is bonded to the copper surface of the substrate, or the nickel plated surface.
  • the first solder is placed in the enclosed area formed by the solder mask layer, and the mounted substrate is placed on it.
  • the chip and the substrate are fixed by solder.
  • solder mask layer on the substrate prevents solder from overflowing and ensures the thickness and slope of the solder. Because the combination of solder and plastic encapsulation material is the worst, preventing solder overflow provides the possibility of tightness between the plastic encapsulation material and the substrate.
  • the solder resist also binds to the molding compound on and around it, improving the reliability of the molded module.
  • support pillars for substrate support
  • support line segments can be manufactured on the substrate, or metal wires (copper wires or nickel wires, etc.) can be placed between the DBC and the heat sink. ), which helps ensure the thickness and thickness uniformity of the solder layer.
  • the above-mentioned DBC chip has electronic components such as chips, resistors and capacitors located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
  • the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • the chip is welded on the part of the DBC substrate close to the copper layer.
  • the solder used for chip welding overflows onto the copper layer at the edge of the trench, causing excessive stress at the interface between the copper layer and ceramic.
  • the copper layer near the trench peels off from the ceramic, causing heat dissipation at the chip.
  • the ability is weakened, the thermal resistance is increased, and electrical current sharing is destroyed, causing module failure. Because of the high-density packaging of the module, the chip soldering parts are close to the trenches, and there is no space to create solder overflow trenches.
  • the copper-clad ceramic provided in the embodiment of the present application Schematic diagram of applying solder resist near the trench of the substrate, and applying plastic-encapsulated solder resist near the DBC trench (ceramic layer of DBC). After molding, the solder resist is combined with the molding compound to prevent the DBC from delaminating from the edges.
  • solder resist layer is located around the trench of the DBC, which can prevent solder from overflowing and avoid delamination of copper and ceramics.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • FIG. 6 it is a schematic cross-sectional view of another plastic module provided by an embodiment of the present application, illustrating a plastic module solution with a heat sink and a built-in solder resist.
  • the plastic module with a radiator can be applied to vehicle scenarios.
  • a car's motor control unit (MCU) also called a motor controller. It controls the rotation state of the motor according to the instructions of the VCU
  • MCU motor control unit
  • This embodiment proposes a plastic module with a radiator.
  • a built-in solder mask is fabricated on the substrate containing the heat sink.
  • the solder mask is bonded to the copper surface of the substrate, or the nickel plated surface.
  • the solder is built into the enclosed area formed by the solder mask layer, and the completed AMB is placed on it (its mechanical, mechanical, thermal, impact and other comprehensive properties are better than DBC).
  • the AMB is formed by using active metal elements (such as Ti/Ag/Zr/Cu) in the solder to combine ceramics (such as silicon nitride (Si3N4)) with metals (Cu).
  • active metal elements such as Ti/Ag/Zr/Cu
  • ceramics such as silicon nitride (Si3N4)
  • Cu metals
  • the AMB and the solder on it are soldered to the AMB, and the AMB and the heat sink are soldered together.
  • the solder mask prevents solder from overflowing and prepares the conditions for subsequent plastic packaging.
  • the solder resist combines with the surrounding molding compound and becomes part of the module.
  • the above-mentioned AMB has chips, resistors, capacitors and other electronic components located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
  • the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • the solder resist in the solder resist provides a soldering resistance, and can not only achieve high reliability combination of the solder resist and the Cu metal of the substrate, but also enable the solder resist and the plastic packaging of the plastic module. materials to achieve high reliability.
  • the solder resist is molded into the module together during molding, making the solder resist a part of the module.
  • the new solder resist can be combined with plastic packaging materials and has solder resistance. In the future, we will solve the problem that solder resist cannot be applied to plastic modules in high-power plastic modules, as well as in small and medium-power plastic modules.
  • the solder resist may be a stress buffering material.
  • the stress buffering material has a certain stress buffering effect and can improve the reliability of the plastic module.
  • the stress buffering material combines well with both the metal of the substrate and the plastic encapsulation material. And because the stress buffer material is mainly organic material, it has a solder mask effect.
  • a, b, or c can mean: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .
  • words such as “first” and “second” are used to distinguish identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as “first” and “second” do not limit the number and execution order, and words such as “first” and “second” do not limit the number and execution order.
  • words such as “exemplary” or “for example” are used to represent examples, illustrations or explanations. Any embodiment or design described as “exemplary” or “such as” in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as “exemplary” or “such as” is intended to present related concepts in a concrete manner that is easier to understand.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente invention divulgue un module d'encapsulation en plastique, un procédé d'encapsulation en plastique et un dispositif électronique. Le module d'encapsulation en plastique comprend un substrat, une couche de réserve de soudure est disposée sur une surface du substrat, une soudure est placée dans une zone fermée formée par la couche de réserve de soudure, une puce et le substrat sont fixés au moyen de la soudure, et le substrat et la puce fixés sur le substrat sont encapsulés sous plastique pour former le module d'encapsulation en plastique. Sont également divulgués un procédé d'encapsulation en plastique correspondant et un dispositif électronique. À l'aide de la solution de la présente demande, la couche de réserve de soudure fournit non seulement un effet de réserve de soudure, mais peut également fournir une jonction hautement fiable de la couche de réserve de soudure et du substrat, et une jonction hautement fiable entre la couche de réserve de soudure et le matériau d'encapsulation en plastique du module d'encapsulation en plastique.
PCT/CN2023/104167 2022-09-16 2023-06-29 Module d'encapsulation en plastique, procédé d'encapsulation en plastique et dispositif électronique WO2024055700A1 (fr)

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CN115497889A (zh) * 2022-09-16 2022-12-20 华为数字能源技术有限公司 塑封模块、塑封方法及电子设备
CN117650204A (zh) * 2023-12-15 2024-03-05 浙江方泰显示技术有限公司 一种用于可变情报板的超高亮smd模组封装及控制方法

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CN113794461A (zh) * 2021-09-13 2021-12-14 江苏卓胜微电子股份有限公司 一种模组芯片封装结构及电路板
CN115497889A (zh) * 2022-09-16 2022-12-20 华为数字能源技术有限公司 塑封模块、塑封方法及电子设备

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US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
CN104952824A (zh) * 2015-05-07 2015-09-30 嘉兴斯达微电子有限公司 一种用激光阻焊的功率模块
CN113794461A (zh) * 2021-09-13 2021-12-14 江苏卓胜微电子股份有限公司 一种模组芯片封装结构及电路板
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