WO2024055700A1 - Plastic packaging module, plastic packaging method and electronic device - Google Patents

Plastic packaging module, plastic packaging method and electronic device Download PDF

Info

Publication number
WO2024055700A1
WO2024055700A1 PCT/CN2023/104167 CN2023104167W WO2024055700A1 WO 2024055700 A1 WO2024055700 A1 WO 2024055700A1 CN 2023104167 W CN2023104167 W CN 2023104167W WO 2024055700 A1 WO2024055700 A1 WO 2024055700A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder resist
plastic
substrate
solder
module
Prior art date
Application number
PCT/CN2023/104167
Other languages
French (fr)
Chinese (zh)
Inventor
郎丰群
刘海燕
Original Assignee
华为数字能源技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为数字能源技术有限公司 filed Critical 华为数字能源技术有限公司
Publication of WO2024055700A1 publication Critical patent/WO2024055700A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73221—Strap and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/808—Bonding techniques
    • H01L2224/80801—Soldering or alloying

Definitions

  • the present application relates to the field of electronic technology, and in particular to a plastic packaging module, a plastic packaging method and electronic equipment.
  • Power modules in electronic equipment are evolving towards high power density and high reliability.
  • Power modules adopt new structures such as three-dimensional (3D) plastic packaging mode, which can improve the heat dissipation, power density and reliability of power modules in electronic equipment.
  • 3D three-dimensional
  • Welding is the core process technology of electronic product manufacturing.
  • a substrate such as a copper-clad ceramic substrate (direct bonded copper, DBC)
  • the module is welded to a radiator or heat sink
  • it is necessary to control the thickness of the welding layer (bonding line thickness) and the tilt of the solder layer, especially It is the overflow of solder to prevent the overflow of solder from causing electrical short circuits, welding voids, and the risk of delamination of the combination of plastic packaging material and solder.
  • Solder resist is a common method to prevent solder from overflowing during reflow.
  • This application provides a plastic packaging module, a plastic packaging method and electronic equipment to improve the combination performance of solder resist and plastic packaging material.
  • a plastic package module including a substrate, a solder resist layer is provided on the surface of the substrate, solder is placed in a closed area formed by the solder resist layer, and the chip and the substrate pass through The solder realizes fixation, and the substrate and the chip fixed on the substrate are plastic-sealed to form the plastic-sealed module.
  • the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the heat dissipation structure substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
  • solder resist is embedded inside the module.
  • the solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
  • solder resist provides soldering resistance, it can not only achieve a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the above-mentioned new solder resist is printed on the substrate according to the predetermined welding topology.
  • the printing thickness can be 5nm-500um; or by spraying the solder resist onto the substrate to form a solder resist layer; or by dispensing glue method to form a solder mask.
  • the pattern of the solder resist can be rectangular or any other shape, which is determined according to the number, size and arrangement of chips, resistors and capacitors in the module to be soldered.
  • the embodiment of the present application does not limit the pattern of the solder resist.
  • the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
  • solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
  • the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, imidazole, etc. can be used.
  • Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • Polyimide has long-term temperature resistance of -269-280°C and stable structure.
  • Solder resist made of polyimide can be combined with base The copper layer of the board is combined with the plastic sealant.
  • solder resist layer can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resists made of any material that meet the characteristics of combining with copper (Cu), nickel (Ni) and other metals and also with plastic packaging materials are within the scope of protection of this application. Inside.
  • one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the other end of the functional group of the solder resist is bonded to the plastic molding material of the plastic module through a chemical bond.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • the substrate further includes a heat dissipation structure.
  • the heat dissipation structure includes any one of the following: a heat dissipation plate or a radiator.
  • the base plate is copper, which allows for even heat dissipation.
  • the radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
  • the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
  • the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
  • Active metal brazed copper (AMB) technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The formation of ceramics can Reactive layer wetted by liquid solder.
  • active metal elements such as Ti/Ag/Zr/Cu
  • the mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
  • the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
  • solder resist By applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • a plastic packaging method includes: setting a solder resist layer on the surface of the substrate; placing solder in a closed area formed by the solder resist layer; placing a gap between the chip and the substrate Fixing is achieved through the solder; the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
  • the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
  • solder resist is embedded inside the module.
  • the solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
  • the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
  • solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
  • the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • Polyimide has a long-term temperature resistance of -269-280°C and a stable structure.
  • the solder resist made of polyimide can be combined with the copper layer of the substrate and the plastic packaging material.
  • potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resist made of any material that meets the characteristics of combining with metals such as copper and nickel as well as with plastic packaging materials is within the scope of protection of this application.
  • one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the solder resist The other end of the functional group is combined with the plastic molding material of the plastic molding module through chemical bonds.
  • the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • the traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • the substrate further includes a heat dissipation structure.
  • the heat dissipation structure includes any one of the following: a heat dissipation plate and a radiator.
  • the base plate is copper, which allows for even heat dissipation.
  • the radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
  • the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
  • the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
  • Active metal brazing copper technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The ceramics form a reaction layer that can be wetted by liquid solder. .
  • active metal elements such as Ti/Ag/Zr/Cu
  • the mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
  • the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
  • solder resist By applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • an electronic device including at least one plastic packaging module that implements the first aspect or any one of the first aspects, and the at least one plastic packaging module passes through a chip in the at least one plastic packaging module.
  • the pins are electrically connected.
  • Figure 1 is the molecular structural formula of a polyimide provided in the embodiment of the present application.
  • Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application;
  • Figure 3 is a schematic flow chart of a plastic sealing method provided by an embodiment of the present application.
  • Figure 4 is a schematic cross-sectional view of a plastic packaging module provided by an embodiment of the present application.
  • Figure 5 is a schematic diagram of solder resist coating near the trench of the copper-clad ceramic substrate provided by the embodiment of the present application.
  • Figure 6 is a schematic cross-sectional view of another plastic packaging module provided by an embodiment of the present application.
  • solder overflow may cause electrical short circuits, soldering voids, risks of delamination of the combination of plastic packaging material and solder, etc.
  • the current methods to prevent solder overflow during reflow are as follows:
  • solder resist is a material coated on the substrate. It can prevent solder from overflowing during reflow (solder melting) and cause short circuits in the circuit. It can also prevent non-soldered points from being contaminated by solder and other problems. It can also effectively prevent moisture and protect the circuit. wait.
  • Green oil solder resist is a liquid photo solder resist, which is an acrylic oligomer. As a protective layer, it is coated on the circuits and substrates of the printed circuit board (PCB) that do not need to be soldered, and is used as a solder resist. The purpose is to protect the formed circuit pattern for a long time; to prevent solder from overflowing and causing short circuit in electrical circuits; to prevent physical disconnection of conductor circuits; to reduce copper pollution to the soldering tank; to prevent insulation deterioration caused by external environmental factors such as dust and moisture. , corrosion; with high insulation, making high-density circuits possible.
  • this solder resist is suitable for 2D packaging.
  • the upper surface of the green oil solder resist layer is weakly bonded to the plastic packaging material and cannot be molded into the plastic packaging module.
  • Another way to prevent solder spillage during reflow is a laser oxidation trench solder mask solution.
  • a laser is used to create grooves around the pads. Due to laser ablation in air, the metal of the laser groove is oxidized. Solder resistance is achieved by utilizing the solder resistance of oxides.
  • the reflow process using solder sheets is generally carried out in reducing atmospheres such as N 2 -formic acid (HCOOH) mixed gas and N 2 -H 2 mixed gas.
  • HCOOH N 2 -formic acid
  • N 2 -H 2 mixed gas N 2 -H 2 mixed gas
  • solder resist groove can be formed around the pad by etching, so that the overflowed solder flows into the groove.
  • too many solder resist grooves may degrade the performance of the substrate, may destroy the stress state of the substrate after molding, and cause glue to overflow after the substrate is molded.
  • Another way to prevent solder from overflowing during reflow is to roughen the surface of the green oil (such as roughening through mechanical processing) to enhance the bonding force between the green oil and the plastic packaging material.
  • roughening the green oil plastic seal it on the surface of the green oil.
  • the surface of the green oil is first roughened and then plastic-sealed.
  • the roughening of the surface of the green oil solder mask layer increases the bonding area and anchoring effect, thereby increasing the bonding force between the green oil and the plastic sealing material.
  • mechanical action can weaken the bonding layer between the green oil solder resist and the substrate, posing reliability risks.
  • the bonding force between the green oil surface and the plastic sealant is also weak.
  • this application provides a plastic packaging module, a plastic packaging method and an electronic device.
  • the solder resist layer provided on the surface of the substrate provides While acting as a solder resist, it can not only achieve a highly reliable combination between the solder resist layer and the metal layer of the substrate, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
  • first, second, etc. are used for descriptive purposes only and shall not be understood as indicating or implying the relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined by “first,” “second,” etc. may explicitly or implicitly include one or more of such features.
  • plural means two or more. Orientation terms such as “up”, “down”, “left” and “right” are defined relative to the schematically placed directions of the components in the drawings. It should be understood that these directional terms are relative concepts and they are used in Descriptions and clarifications relative to the drawings may vary accordingly depending on the orientation of components in the drawings.
  • a structure generally assumes a certain shape, which means that the structure generally exhibits the shape when viewed from a macro perspective, and may have local adjustments. For example, if it is roughly square, it can be understood that shapes in which one side is an arc rather than a straight line are also included in the scope.
  • shape in which one side is an arc rather than a straight line are also included in the scope.
  • shape to be substantially coaxial with another feature is understood to mean that the distance between the axes of the two features does not exceed 20% of the dimension of either feature perpendicular to the axis.
  • connection should be understood in a broad sense.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary.
  • and/or includes any and all combinations of one or more of the associated listed items.
  • the power module refers to a semiconductor module that converts the voltage, current, cycle number, etc. of the power supply. It is the core module of power conversion.
  • Plastic-encapsulated modules refer to the power module’s internal electronic components being assembled to the substrate, and then the module is encapsulated with plastic encapsulation material to improve the module’s reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • Copper-clad ceramic substrate also known as direct bonded copper, is a method of directly bonding copper with alumina oxide (Al 2 O 3 ) and aluminum nitride ceramics through thermal fusion at high temperatures.
  • alumina oxide Al 2 O 3
  • aluminum nitride ceramics Al 2 O 3
  • Ceramic copper-clad laminates have the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high electrical conductivity and excellent welding performance of oxygen-free copper, and can be etched with various patterns like PCB circuit boards. .
  • AMB technology is a further development of DBC technology. It uses active metal elements in solder (such as Ti/Ag/Zr/Cu) to achieve the combination of ceramics and metals.
  • solder such as Ti/Ag/Zr/Cu
  • the ceramics form a reaction layer that can be wetted by liquid solder.
  • the combination of ceramic and solder in AMB ceramic substrates is achieved through the chemical reaction of ceramic and active metal solder at temperature. After solidification, the active metal solder solders the ceramic and copper layers together.
  • the silicon nitride (Si3N4) ceramic used in AMB has a higher thermal conductivity (>90W/mK 25°C) and is closer to the thermal expansion coefficient of silicon carbide (2.6x10-6/ K). Therefore, AMB substrate has high bonding strength and reliability.
  • the AMB copper layer with active metal coating can achieve high power, better heat dissipation and high reliability packaged modules (can withstand 3000 thermal shocks), which has been widely used in Electric cars, electric locomotives and high-speed trains.
  • the thickness of the solder layer refers to the thickness of the solder layer of the module.
  • the thickness of the solder layer has an important impact on the reliability of the solder bond.
  • the inclination of the solder layer refers to the inclination of the soldering layer of the module.
  • the thickness and slope of the solder layer affect whether the solder will overflow during reflow.
  • 2D packaging (two dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate.
  • the upper surface of electronic parts is no longer combined with other items.
  • the electronic components and the substrate are on the same plane.
  • 3D packaging (three dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate. The upper surface of electronic parts is then combined with other items.
  • Soldering pad refers to the soldered part of the substrate or device.
  • solder resist is based on the current mainstream surface mounted technology (SMT) 2D packaging solder resist technology.
  • Solder resist is printed onto the copper layer of the substrate around the pads, forming the desired shape. After drying, the solder resist can ensure the shape of the solder during reflow and prevent solder from overflowing and causing electrical short circuits.
  • the current solder resist corresponding to 2D packaging can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
  • This embodiment proposes a new solder resist layer for plastic packaging modules. After welding, the solder resist and the module are embedded in the plastic compound.
  • the solder resist needs to be combined with metals such as copper and plastic packaging materials, and must have high temperature resistance and high reliability.
  • solder resist is made of class-based materials, which changes the chemical polarity of the solder resist.
  • potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc.
  • Solder resist can be made from polymers of any number of materials in the class.
  • polyimide refers to a type of polymer containing an imide ring (-CO-NR-CO-) in the main chain. It is one of the organic polymer materials with the best comprehensive properties. It has a high temperature resistance of over 400°C and a long-term use temperature range of -200 ⁇ 300°C. Some parts have no obvious melting point and have high insulation properties.
  • the dielectric constant is 4.0 at 10 3 Hz and the dielectric loss is only 0.004 ⁇ 0.007. It belongs to F to H class insulation. .
  • Epoxy resin is a high molecular polymer with the molecular formula (C 11 H 12 O 3 ) n . It refers to a class of polymers containing more than two epoxy groups in the molecule. It is the condensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring and solidify and cross-link to form a network structure, so it is a thermosetting resin.
  • solder resist made of room-temperature or low-temperature two-component epoxy resin.
  • the solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • solder resist made of polyimide which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
  • the molecular structure formula of a polyimide is provided in the embodiment of the present application.
  • the polyimide has a long-term temperature resistance of -269-280°C and a stable structure.
  • the solder resist made of polyimide can It can be combined with the copper layer of the substrate and with the plastic packaging material.
  • potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
  • solder resist made of any material that meets the characteristics of combining with metals such as copper and plastic packaging materials is within the scope of protection of this application.
  • the solder resist can be applied to a certain thickness, such as 5nm-500um.
  • the embodiments of this application do not limit the thickness of the solder resist coating.
  • Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application.
  • Traditional solder resist is generally called green oil. It is a unipolar solder resist, and its functional groups can only be combined with copper and other metals on the substrate. The upper surface of the green oil solder resist cannot be combined with the plastic packaging material of the plastic module.
  • FIG. 1 shows a schematic diagram of the combination of functional groups of the solder resist provided in this embodiment. This embodiment provides a bipolar, high-temperature resistant, and high-reliability solder resist for metal and plastic packaging materials.
  • This new type of solder resist is a bipolar solder resist.
  • One end of the functional group can be highly reliably combined with the metal of the substrate (such as DBC copper) through chemical bonds, and the other end of the functional group can be highly reliably combined with the plastic packaging material of the plastic module through chemical bonds. combine.
  • the above-mentioned functional groups are atoms or atomic groups that determine the chemical properties of organic compounds.
  • Common functional groups include hydroxyl, carboxyl, ether bonds, aldehyde groups, carbonyl groups, etc.
  • a plastic packaging method provided by this embodiment is described by taking the manufacturing method of a built-in solder resist layer in which a plastic packaging module is welded to a substrate as an example.
  • a solder resist layer is provided on the surface of the substrate.
  • the base plate includes a heat sink.
  • the above-mentioned new solder resist can be printed on the heat sink plate through a mold (such as a steel mesh) according to a predetermined welding topology map, and the printing thickness can be 5nm-500um.
  • the material of the heat sink can be bare copper or nickel plated.
  • the solder resist can also be sprayed onto the heat sink, or the solder resist can be applied onto the heat sink by dispensing glue.
  • the pattern of the solder resist can be a rectangle as shown in Figure 3, or can be any other shape, which is determined according to the number and size of chips, resistors, capacitors and other components in the module to be soldered. Book The application embodiment does not limit the pattern of the solder resist.
  • the color of the solder resist before curing should be uniform (clear, unpigmented solder resist is allowed).
  • the fluidity of UV-curable, heat-curable, and liquid photosensitive solder resists should be consistent, without crusting, settling, gelling, etc.; the thickness of dry film solder resist should be uniform, without pinholes, bubbles, particles, or impurities. , glue layer flow and other phenomena.
  • the solder resist is required to have a certain thickness and hardness, solvent resistance test and adhesion test should meet the standards, and the surface of the printed circuit board should be free of garbage and redundant marks. Therefore, after the solder resist is printed, the solder resist is cured (or dried).
  • the types of solder resist involved are divided according to process processing characteristics: UV-curable solder resist, thermal-curable solder resist, liquid photosensitive solder resist, and dry film solder resist. For example, taking a thermally curable solder resist as an example, depending on the curing characteristics of the solder resist, it can be cured at room temperature or at high temperature.
  • the curing environment can be the atmosphere or a protective atmosphere. Among them, the protective atmosphere is a kind of environment that prevents oxidation and so on.
  • the cured solder mask layer should be uniform and free of foreign objects, cracks, inclusions, peeling and roughness that would affect the assembly and use of the printed board; the discoloration of the metal surface under the cured solder mask layer should be acceptable, but the resist The solder layer itself should not have obvious discoloration. After the solder resist pattern is cured, it forms a pad as shown in the figure, which is a closed area.
  • solder is then placed in the enclosed area created by the solder mask.
  • the first solder can be placed into the pad surrounded by the solder resist.
  • the first solder includes solder pieces or solder paste.
  • solder tabs may be implanted into pads surrounded by solder resist.
  • solder paste (a paste composed of metal balls and flux) can also be printed or dotted into a pad surrounded by solder resist.
  • the thickness of the solder layer is higher than the thickness of the solder resist.
  • the amount of solder paste printed or inserted is determined by the thickness of the solder. When the solder paste is reflowed, the flux is melted, and the thickness of the solder paste after reflow (that is, the solder paste is melted) is approximately 50% of the solder paste thickness.
  • the solder resist layer on the heat sink prevents solder from overflowing and ensures the thickness and slope of the first solder.
  • the first solder is reflowed, it will not flow out of the periphery of the pad formed by the solder resist, causing a short circuit in the circuit.
  • the substrate with the second solder printed on it and the chip attached to the second solder (this process is called SMT) is placed on the first solder (solder piece or solder paste) surrounded by solder resist.
  • the substrate includes at least one of the following: DBC, AMB.
  • the chip and the substrate are fixed with solder.
  • the chip and the substrate, and the substrate and the substrate can be welded together through a reflow process to form a module.
  • some modules may not require a substrate.
  • the substrate is made of metal (such as copper), which can enhance uniform heat dissipation.
  • the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
  • the above-mentioned module can be plastic-sealed using plastic packaging material.
  • the molding compound flows into every gap in the module and/or onto the surface of the chip.
  • the solder resist prevents solder from overflowing, it provides the possibility of tightness between the plastic packaging material and the substrate.
  • the solder resist also binds to the molding compound on and around it, improving the reliability of the molded module.
  • the new solder resist has good bonding properties with copper and plastic packaging materials, and will not cause welding voids or the risk of delamination between plastic packaging materials and solder.
  • the above-mentioned solder resist is embedded in the plastic packaging material and can be called built-in solder resist.
  • FIG. 4 it is a schematic cross-sectional view of a plastic module provided by an embodiment of the present application, illustrating a plastic module with a heat dissipation plate and a built-in solder resist.
  • the plastic module includes a substrate (such as a DBC), and a solder resist layer is provided on the surface of the DBC.
  • the base plate also includes a heat sink.
  • the built-in solder resist layer can be manufactured on the substrate according to the above plastic sealing method.
  • the solder mask is bonded to the copper surface of the substrate, or the nickel plated surface.
  • the first solder is placed in the enclosed area formed by the solder mask layer, and the mounted substrate is placed on it.
  • the chip and the substrate are fixed by solder.
  • solder mask layer on the substrate prevents solder from overflowing and ensures the thickness and slope of the solder. Because the combination of solder and plastic encapsulation material is the worst, preventing solder overflow provides the possibility of tightness between the plastic encapsulation material and the substrate.
  • the solder resist also binds to the molding compound on and around it, improving the reliability of the molded module.
  • support pillars for substrate support
  • support line segments can be manufactured on the substrate, or metal wires (copper wires or nickel wires, etc.) can be placed between the DBC and the heat sink. ), which helps ensure the thickness and thickness uniformity of the solder layer.
  • the above-mentioned DBC chip has electronic components such as chips, resistors and capacitors located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
  • the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • the chip is welded on the part of the DBC substrate close to the copper layer.
  • the solder used for chip welding overflows onto the copper layer at the edge of the trench, causing excessive stress at the interface between the copper layer and ceramic.
  • the copper layer near the trench peels off from the ceramic, causing heat dissipation at the chip.
  • the ability is weakened, the thermal resistance is increased, and electrical current sharing is destroyed, causing module failure. Because of the high-density packaging of the module, the chip soldering parts are close to the trenches, and there is no space to create solder overflow trenches.
  • the copper-clad ceramic provided in the embodiment of the present application Schematic diagram of applying solder resist near the trench of the substrate, and applying plastic-encapsulated solder resist near the DBC trench (ceramic layer of DBC). After molding, the solder resist is combined with the molding compound to prevent the DBC from delaminating from the edges.
  • solder resist layer is located around the trench of the DBC, which can prevent solder from overflowing and avoid delamination of copper and ceramics.
  • the solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
  • FIG. 6 it is a schematic cross-sectional view of another plastic module provided by an embodiment of the present application, illustrating a plastic module solution with a heat sink and a built-in solder resist.
  • the plastic module with a radiator can be applied to vehicle scenarios.
  • a car's motor control unit (MCU) also called a motor controller. It controls the rotation state of the motor according to the instructions of the VCU
  • MCU motor control unit
  • This embodiment proposes a plastic module with a radiator.
  • a built-in solder mask is fabricated on the substrate containing the heat sink.
  • the solder mask is bonded to the copper surface of the substrate, or the nickel plated surface.
  • the solder is built into the enclosed area formed by the solder mask layer, and the completed AMB is placed on it (its mechanical, mechanical, thermal, impact and other comprehensive properties are better than DBC).
  • the AMB is formed by using active metal elements (such as Ti/Ag/Zr/Cu) in the solder to combine ceramics (such as silicon nitride (Si3N4)) with metals (Cu).
  • active metal elements such as Ti/Ag/Zr/Cu
  • ceramics such as silicon nitride (Si3N4)
  • Cu metals
  • the AMB and the solder on it are soldered to the AMB, and the AMB and the heat sink are soldered together.
  • the solder mask prevents solder from overflowing and prepares the conditions for subsequent plastic packaging.
  • the solder resist combines with the surrounding molding compound and becomes part of the module.
  • the above-mentioned AMB has chips, resistors, capacitors and other electronic components located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
  • the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
  • the solder resist in the solder resist provides a soldering resistance, and can not only achieve high reliability combination of the solder resist and the Cu metal of the substrate, but also enable the solder resist and the plastic packaging of the plastic module. materials to achieve high reliability.
  • the solder resist is molded into the module together during molding, making the solder resist a part of the module.
  • the new solder resist can be combined with plastic packaging materials and has solder resistance. In the future, we will solve the problem that solder resist cannot be applied to plastic modules in high-power plastic modules, as well as in small and medium-power plastic modules.
  • the solder resist may be a stress buffering material.
  • the stress buffering material has a certain stress buffering effect and can improve the reliability of the plastic module.
  • the stress buffering material combines well with both the metal of the substrate and the plastic encapsulation material. And because the stress buffer material is mainly organic material, it has a solder mask effect.
  • a, b, or c can mean: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .
  • words such as “first” and “second” are used to distinguish identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as “first” and “second” do not limit the number and execution order, and words such as “first” and “second” do not limit the number and execution order.
  • words such as “exemplary” or “for example” are used to represent examples, illustrations or explanations. Any embodiment or design described as “exemplary” or “such as” in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as “exemplary” or “such as” is intended to present related concepts in a concrete manner that is easier to understand.

Abstract

Disclosed in the present invention are a plastic packaging module, a plastic packaging method and an electronic device. The plastic packaging module comprises a substrate, a solder resist layer is provided on a surface of the substrate, solder is placed in an enclosed area formed by the solder resist layer, a chip and the substrate are fixed by means of the solder, and the substrate and the chip fixed on the substrate are plastic-packaged to form the plastic packaging module. Also disclosed are a corresponding plastic packaging method and an electronic device. Using the solution of the present application, the solder resist layer not only provides a solder resist effect, but can also provide highly reliable joining of the solder resist layer and the substrate, and highly reliable joining between the solder resist layer and the plastic packaging material of the plastic packaging module.

Description

塑封模块、塑封方法及电子设备Plastic packaging module, plastic packaging method and electronic equipment
本申请要求于2022年09月16日提交中国国家知识产权局、申请号为202211128971.5、发明名称为“塑封模块、塑封方法及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application submitted to the State Intellectual Property Office of China on September 16, 2022, with application number 202211128971.5 and the invention name "Plastic Sealing Module, Plastic Sealing Method and Electronic Equipment", the entire content of which is incorporated by reference in in this application.
技术领域Technical field
本申请涉及电子技术领域，尤其涉及一种塑封模块、塑封方法及电子设备。The present application relates to the field of electronic technology, and in particular to a plastic packaging module, a plastic packaging method and electronic equipment.
背景技术Background technique
电子设备中的功率模块(power module)等向高功率密度和高可靠性方向演进。功率模块等采用三维(three-dimensional，3D)塑封模式等新的结构，可以提高电子设备中功率模块的散热性，功率密度和可靠性等。Power modules in electronic equipment are evolving towards high power density and high reliability. Power modules adopt new structures such as three-dimensional (3D) plastic packaging mode, which can improve the heat dissipation, power density and reliability of power modules in electronic equipment.
焊接是电子产品制造的核心工艺技术。芯片焊接到基板如覆铜陶瓷基板(direct bonded copper，DBC)上，模块焊接到散热器或散热板时，需要控制焊接层的厚度(bonding line thickness)和焊料层的倾斜度(tilt)，特别是焊料的溢出，以免焊料溢出造成电气短路，焊接空洞，塑封料与焊料结合分层风险等。阻焊剂(solder resist)是防止回流时焊料溢出的常用方法。Welding is the core process technology of electronic product manufacturing. When the chip is welded to a substrate such as a copper-clad ceramic substrate (direct bonded copper, DBC), and the module is welded to a radiator or heat sink, it is necessary to control the thickness of the welding layer (bonding line thickness) and the tilt of the solder layer, especially It is the overflow of solder to prevent the overflow of solder from causing electrical short circuits, welding voids, and the risk of delamination of the combination of plastic packaging material and solder. Solder resist is a common method to prevent solder from overflowing during reflow.
传统的阻焊剂，基于二维(two-dimensional，2D)封装，只与基板的铜(Cu)层结合良好，而与塑封模块(molding module)的塑封料的结合性差，有阻焊剂与塑封料分层的风险。而且，在高温下，阻焊剂也有不安定的风险。Traditional solder resist, based on two-dimensional (2D) packaging, only combines well with the copper (Cu) layer of the substrate, but has poor combination with the plastic molding material of the molding module. Stratified risks. Moreover, there is a risk that the solder resist will become unstable at high temperatures.
有鉴于此，如何提高阻焊剂与塑封料的结合性能，是亟待解决的问题。In view of this, how to improve the bonding performance of solder resist and plastic packaging materials is an issue that needs to be solved urgently.
发明内容Contents of the invention
本申请提供一种塑封模块、塑封方法及电子设备，以提高阻焊剂与塑封料的结合性能。This application provides a plastic packaging module, a plastic packaging method and electronic equipment to improve the combination performance of solder resist and plastic packaging material.
第一方面，提供了一种塑封模块，包括基板，所述基板的表面设置阻焊层，焊料被放置在所述阻焊层形成的四周封闭的区域内，芯片与所述基板之间通过所述焊料实现固定，所述基板和固定在所述基板上的所述芯片被塑封，形成所述塑封模块。In a first aspect, a plastic package module is provided, including a substrate, a solder resist layer is provided on the surface of the substrate, solder is placed in a closed area formed by the solder resist layer, and the chip and the substrate pass through The solder realizes fixation, and the substrate and the chip fixed on the substrate are plastic-sealed to form the plastic-sealed module.
在该方面中，阻焊层提供阻焊作用的同时，既能使阻焊层与散热结构基板实现高可靠性结合，又能使阻焊层与塑封模块的塑封料实现高可靠性结合。In this aspect, the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the heat dissipation structure substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
模组内部埋入阻焊剂。阻焊剂可以与模组的线路板金属和塑封料结合，防止溢锡的同时，增加模块的可靠性。Solder resist is embedded inside the module. The solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
阻焊剂提供阻焊作用的同时，既能使阻焊剂与散热结构的金属层等实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。While the solder resist provides soldering resistance, it can not only achieve a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
通过模具(例如钢网)，根据预先制定的焊接拓扑图，将上述新型阻焊剂印刷到基板上，印刷厚度可以5nm-500um；或者通过喷涂阻焊剂到基板上形成阻焊层；或者通过点胶方式形成阻焊层。Through a mold (such as a steel mesh), the above-mentioned new solder resist is printed on the substrate according to the predetermined welding topology. The printing thickness can be 5nm-500um; or by spraying the solder resist onto the substrate to form a solder resist layer; or by dispensing glue method to form a solder mask.
阻焊剂的图形可以是长方形，也可以是其它任意形状，根据待焊接的模组中的芯片、阻容等元器件的数量、大小、排布等确定。本申请实施例对阻焊剂的图形不作限制。The pattern of the solder resist can be rectangular or any other shape, which is determined according to the number, size and arrangement of chips, resistors and capacitors in the module to be soldered. The embodiment of the present application does not limit the pattern of the solder resist.
在一种可能的实现中，所述阻焊层由阻焊剂固化形成，所述阻焊剂也位于所述塑封模块内。In a possible implementation, the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
在该实现中，所述阻焊剂被埋入所述塑封料中。因此，该阻焊层被称为内置式阻焊层。In this implementation, the solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
在又一种可能的实现中，所述阻焊剂与所述基板结合直接接合、且所述阻焊剂与所述塑封模块的塑封料结合也直接接合。In yet another possible implementation, the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
在该实现中，阻焊剂提供阻焊作用的同时，既能使阻焊剂与基板实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。In this implementation, the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
在又一种可能的实现中，所述阻焊剂为以下一种或多种材料：灌封胶，聚酰亚胺，环氧树脂，咪类。In yet another possible implementation, the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
在该实现中，通过使用灌封胶，聚酰亚胺，环氧树脂，咪类为主的材料制作阻焊剂，改变了阻焊剂的化学极性。示例性地，可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意一种材料制作阻焊剂，也可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意多种材料的聚合物制作阻焊剂。In this implementation, by using potting glue, polyimide, epoxy resin, mic The solder resist is made of class-based materials, which changes the chemical polarity of the solder resist. Exemplarily, potting glue, polyimide, epoxy resin, imidazole, etc. can be used. Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc. Solder resist can be made from polymers of any number of materials in the class.
例如，使用室温或低温双组分环氧树脂制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。For example, use a solder resist made of room-temperature or low-temperature two-component epoxy resin. The solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
又例如，使用聚酰亚胺制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。聚酰亚胺长期耐温-269-280℃，结构稳定，采用聚酰亚胺制成的阻焊剂既可以与基 板的铜层结合，又可以与塑封料结合。Another example is the use of solder resist made of polyimide, which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit. Polyimide has long-term temperature resistance of -269-280℃ and stable structure. Solder resist made of polyimide can be combined with base The copper layer of the board is combined with the plastic sealant.
又例如，可以使用灌封胶喷涂到基板上，加热固化，形成阻焊层。本申请对阻焊剂使用的材料不作限制，使用任意材料制成的阻焊剂满足既与铜(Cu)，镍(Ni)等金属结合、还与塑封料结合的特性，都在本申请的保护范围内。For another example, potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer. This application does not limit the materials used for the solder resist. Solder resists made of any material that meet the characteristics of combining with copper (Cu), nickel (Ni) and other metals and also with plastic packaging materials are within the scope of protection of this application. Inside.
在又一种可能的实现中，所述阻焊剂的官能团的一端与所述基板的金属通过化合键结结合，所述阻焊剂的官能团的另一端与所述塑封模块的塑封料结合通过化合键结合。In yet another possible implementation, one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the other end of the functional group of the solder resist is bonded to the plastic molding material of the plastic module through a chemical bond. combine.
在该实现中，阻焊剂提供阻焊作用的同时，既能使阻焊剂与基板实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。In this implementation, the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
而传统的绿油阻焊剂只能与基板的铜层结合而不能与其上的塑封料结合，难以实现高密度的3D塑封封装。The traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
在又一种可能的实现中，所述基板还包括散热结构。In yet another possible implementation, the substrate further includes a heat dissipation structure.
例如，所述散热结构包括以下任意一种：散热板、散热器。For example, the heat dissipation structure includes any one of the following: a heat dissipation plate or a radiator.
在该实现中，基板是铜的，可以均匀散热。散热器是通过水冷散热，尤其适用于车载场景。In this implementation, the base plate is copper, which allows for even heat dissipation. The radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
在又一种可能的实现中，所述基板包括以下任意一种：覆铜陶瓷基板，活性金属钎焊铜。In yet another possible implementation, the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
在该实现中，陶瓷覆铜板具有陶瓷的高导热、高电绝缘、高机械强度、低膨胀等特性，又兼具无氧铜的高导电性和优异焊接性能，且能像PCB线路板一样刻蚀出各种图形。In this implementation, the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
活性金属钎焊铜(active metal brazed copper，AMB)技术是DBC技术的进一步发展，是利用焊料中的活性金属元素(如Ti/Ag/Zr/Cu)实现陶瓷与金属结合的方法，陶瓷形成可被液态焊料润湿的反应层。Active metal brazed copper (AMB) technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The formation of ceramics can Reactive layer wetted by liquid solder.
活性金属钎焊铜的机械、力学、热、冲击等综合性能优于DBC。The mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
在又一种可能的实现中，所述基板为所述覆铜陶瓷基板，所述阻焊层接位于所述覆铜陶瓷基板的沟槽周围。In yet another possible implementation, the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
在该实现中，通过在DBC的芯片靠近沟槽的焊接部位的周边，涂敷塑封用阻焊剂，可以防止焊料溢出，避免铜与陶瓷的分层。阻焊剂与塑封料和铜良好结合，改善沟槽处的应力状态，抑制铜层的剥离。In this implementation, by applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided. The solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
第二方面，提供了一种塑封方法，所述方法包括：在基板的表面设置阻焊层；将焊料放置在所述阻焊层形成的四周封闭的区域内；将芯片与所述基板之间通过所述焊料实现固定；将所述基板和固定在所述基板上的所述芯片进行塑封，形成塑封模块。In a second aspect, a plastic packaging method is provided, which method includes: setting a solder resist layer on the surface of the substrate; placing solder in a closed area formed by the solder resist layer; placing a gap between the chip and the substrate Fixing is achieved through the solder; the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
在该方面中，阻焊层提供阻焊作用的同时，既能使阻焊层与基板实现高可靠性结合，又能使阻焊层与塑封模块的塑封料实现高可靠性结合。In this aspect, the solder resist layer not only provides a solder resisting effect, but also enables a highly reliable combination between the solder resist layer and the substrate, and a highly reliable combination between the solder resist layer and the plastic packaging material of the plastic module.
模组内部埋入阻焊剂。阻焊剂可以与模组的线路板金属和塑封料结合，防止溢锡的同时，增加模块的可靠性。Solder resist is embedded inside the module. The solder resist can be combined with the circuit board metal and plastic sealing material of the module to prevent tin overflow and increase the reliability of the module.
在一种可能的实现中，所述阻焊层由阻焊剂固化形成，所述阻焊剂也位于所述塑封模块内。In a possible implementation, the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
在该实现中，所述阻焊剂被埋入所述塑封料中。因此，该阻焊层被称为内置式阻焊层。In this implementation, the solder resist is embedded in the molding compound. Therefore, this solder mask is called built-in solder mask.
在另一种可能的实现中，所述阻焊剂与所述基板直接接合、且所述阻焊剂与所述塑封模块的塑封料也直接接合。In another possible implementation, the solder resist is directly bonded to the substrate, and the solder resist is also directly bonded to the plastic molding material of the molded module.
在该实现中，阻焊剂提供阻焊作用的同时，既能使阻焊剂与基板实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。In this implementation, the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the substrate, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
在又一种可能的实现中，所述阻焊剂为以下一种或多种材料：灌封胶，聚酰亚胺，环氧树脂，咪类。In yet another possible implementation, the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, kind.
在该实现中，通过使用灌封胶，聚酰亚胺，环氧树脂，咪类为主的材料制作阻焊剂，改变了阻焊剂的化学极性。示例性地，可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意一种材料制作阻焊剂，也可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意多种材料的聚合物制作阻焊剂。In this implementation, by using potting glue, polyimide, epoxy resin, mic The solder resist is made of class-based materials, which changes the chemical polarity of the solder resist. For example, potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc. Solder resist can be made from polymers of any number of materials in the class.
例如，使用室温或低温双组分环氧树脂制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。For example, use a solder resist made of room-temperature or low-temperature two-component epoxy resin. The solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
又例如，使用聚酰亚胺制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。聚酰亚胺长期耐温-269-280℃，结构稳定，采用聚酰亚胺制成的阻焊剂既可以与基板的铜层结合，又可以与塑封料结合。Another example is the use of solder resist made of polyimide, which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit. Polyimide has a long-term temperature resistance of -269-280°C and a stable structure. The solder resist made of polyimide can be combined with the copper layer of the substrate and the plastic packaging material.
又例如，可以使用灌封胶喷涂到基板上，加热固化，形成阻焊层。For another example, potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
本申请对阻焊剂使用的材料不作限制，使用任意材料制成的阻焊剂满足既与铜、镍等金属结合、还与塑封料结合的特性，都在本申请的保护范围内。This application does not limit the materials used for the solder resist. Solder resist made of any material that meets the characteristics of combining with metals such as copper and nickel as well as with plastic packaging materials is within the scope of protection of this application.
在又一种可能的实现中，所述阻焊剂的官能团的一端与所述基板的金属通过化合键结合，所述阻焊剂 的官能团的另一端与所述塑封模块的塑封料通过化合键结合。In yet another possible implementation, one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the solder resist The other end of the functional group is combined with the plastic molding material of the plastic molding module through chemical bonds.
在该实现中，阻焊剂提供阻焊作用的同时，既能使阻焊剂与散热结构的金属层等实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。In this implementation, the solder resist not only provides a soldering resistance, but also enables a highly reliable combination between the solder resist and the metal layer of the heat dissipation structure, and a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
而传统的绿油阻焊剂只能与基板的铜层结合而不能与其上的塑封料结合，难以实现高密度的3D塑封封装。The traditional green oil solder resist can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
在又一种可能的实现中，所述基板还包括散热结构。In yet another possible implementation, the substrate further includes a heat dissipation structure.
所述散热结构包括以下任意一种：散热板、散热器。The heat dissipation structure includes any one of the following: a heat dissipation plate and a radiator.
在该实现中，基板是铜的，可以均匀散热。散热器是通过水冷散热，尤其适用于车载场景。In this implementation, the base plate is copper, which allows for even heat dissipation. The radiator dissipates heat through water cooling, which is especially suitable for automotive scenarios.
在又一种可能的实现中，所述基板包括以下任意一种：覆铜陶瓷基板，活性金属钎焊铜。In yet another possible implementation, the substrate includes any one of the following: a copper-clad ceramic substrate, and active metal brazing copper.
在该实现中，陶瓷覆铜板具有陶瓷的高导热、高电绝缘、高机械强度、低膨胀等特性，又兼具无氧铜的高导电性和优异焊接性能，且能像PCB线路板一样刻蚀出各种图形。In this implementation, the ceramic copper-clad laminate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high conductivity and excellent welding performance of oxygen-free copper, and can be engraved like a PCB circuit board. Etch out various shapes.
活性金属钎焊铜技术是DBC技术的进一步发展，是利用焊料中的活性金属元素(如Ti/Ag/Zr/Cu)实现陶瓷与金属结合的方法，陶瓷形成可被液态焊料润湿的反应层。Active metal brazing copper technology is a further development of DBC technology. It is a method that uses active metal elements (such as Ti/Ag/Zr/Cu) in solder to achieve the combination of ceramics and metals. The ceramics form a reaction layer that can be wetted by liquid solder. .
活性金属钎焊铜的机械、力学、热、冲击等综合性能优于DBC。The mechanical, mechanical, thermal, impact and other comprehensive properties of active metal brazing copper are better than DBC.
在又一种可能的实现中，所述基板为所述覆铜陶瓷基板，所述阻焊层接位于所述覆铜陶瓷基板的沟槽周围。In yet another possible implementation, the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the trench of the copper-clad ceramic substrate.
在该实现中，通过在DBC的芯片靠近沟槽的焊接部位的周边，涂敷塑封用阻焊剂，可以防止焊料溢出，避免铜与陶瓷的分层。阻焊剂与塑封料和铜良好结合，改善沟槽处的应力状态，抑制铜层的剥离。In this implementation, by applying plastic solder resist around the welding part of the DBC chip close to the trench, solder overflow can be prevented and delamination of copper and ceramic can be avoided. The solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
第三方面，提供了一种电子设备，包括至少一个如第一方面或第一方面的任意一种实现所述的塑封模块，所述至少一个塑封模块通过所述至少一个塑封模块中的芯片的引脚电连接。In a third aspect, an electronic device is provided, including at least one plastic packaging module that implements the first aspect or any one of the first aspects, and the at least one plastic packaging module passes through a chip in the at least one plastic packaging module. The pins are electrically connected.
附图说明Description of drawings
图1为本申请实施例提供的一种聚酰亚胺的分子结构式；Figure 1 is the molecular structural formula of a polyimide provided in the embodiment of the present application;
图2为本申请实施例提供的新阻焊剂与传统的阻焊剂的结合对比示意图；Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application;
图3为本申请实施例提供的一种塑封方法的流程示意图；Figure 3 is a schematic flow chart of a plastic sealing method provided by an embodiment of the present application;
图4为本申请实施例提供的一种塑封模块的剖面示意图；Figure 4 is a schematic cross-sectional view of a plastic packaging module provided by an embodiment of the present application;
图5为本申请实施例提供的覆铜陶瓷基板的沟槽附近涂覆阻焊剂的示意图；Figure 5 is a schematic diagram of solder resist coating near the trench of the copper-clad ceramic substrate provided by the embodiment of the present application;
图6为本申请实施例提供的另一种塑封模块的剖面示意图。Figure 6 is a schematic cross-sectional view of another plastic packaging module provided by an embodiment of the present application.
具体实施方式Detailed ways
如背景技术所述，回流时焊料溢出会造成电气短路，焊接空洞，塑封料与焊料结合分层风险等。目前防止回流时焊料溢出的方式如下：As mentioned in the background art, overflow of solder during reflow may cause electrical short circuits, soldering voids, risks of delamination of the combination of plastic packaging material and solder, etc. The current methods to prevent solder overflow during reflow are as follows:
一种防止回流时焊料溢出的方式是使用阻焊剂。其中，阻焊剂是一种涂敷在基板上的材料，可以防止回流(焊料融化)时焊锡外溢造成电路短路，以及防止非焊接点被焊锡沾污等问题，还可以有效地防潮，保护好电路等。One way to prevent solder spillage during reflow is to use solder resist. Among them, solder resist is a material coated on the substrate. It can prevent solder from overflowing during reflow (solder melting) and cause short circuits in the circuit. It can also prevent non-soldered points from being contaminated by solder and other problems. It can also effectively prevent moisture and protect the circuit. wait.
目前业界广泛使用是的绿油阻焊剂。绿油阻焊剂即液态光致阻焊剂，是一种丙烯酸低聚物。作为一种保护层，涂覆在印制电路板(printed circuit board，PCB)不需焊接的线路和基板上，用作阻焊剂。目的是长期保护所形成的线路图形；防止焊料外溢，导致电器回路短路；防止导体电路的物理性断线；减少对焊接料槽的铜污染；防止因灰尘、水份等外界环境因素造成绝缘恶化、腐蚀；具有高绝缘性，使电路的高密度化成为可能。然而，这种阻焊剂适用于2D封装，绿油阻焊层的上表面与塑封料结合弱，不能塑封到塑封模块中。Currently, green oil solder resist is widely used in the industry. Green oil solder resist is a liquid photo solder resist, which is an acrylic oligomer. As a protective layer, it is coated on the circuits and substrates of the printed circuit board (PCB) that do not need to be soldered, and is used as a solder resist. The purpose is to protect the formed circuit pattern for a long time; to prevent solder from overflowing and causing short circuit in electrical circuits; to prevent physical disconnection of conductor circuits; to reduce copper pollution to the soldering tank; to prevent insulation deterioration caused by external environmental factors such as dust and moisture. , corrosion; with high insulation, making high-density circuits possible. However, this solder resist is suitable for 2D packaging. The upper surface of the green oil solder resist layer is weakly bonded to the plastic packaging material and cannot be molded into the plastic packaging module.
另一种防止回流时焊料溢出的方式是激光氧化沟道阻焊方案。用激光在焊盘的周围加工成沟槽。由于在空气激光烧蚀，激光槽的金属被氧化。利用氧化物的阻焊作用实现阻焊。然而，在使用焊片的回流过程，一般在N2-甲酸(HCOOH)混合气，N2-H2混合气等还原性气氛中进行。在还原性气氛中，阻焊沟槽的金属氧化物容易被还原成金属，从而失去阻焊功能。或者，在焊膏焊接过程中，焊膏的阻焊剂会将沟槽的氧化物还原成金属，导致阻焊功能失效。Another way to prevent solder spillage during reflow is a laser oxidation trench solder mask solution. A laser is used to create grooves around the pads. Due to laser ablation in air, the metal of the laser groove is oxidized. Solder resistance is achieved by utilizing the solder resistance of oxides. However, the reflow process using solder sheets is generally carried out in reducing atmospheres such as N 2 -formic acid (HCOOH) mixed gas and N 2 -H 2 mixed gas. In a reducing atmosphere, the metal oxide in the solder mask trench is easily reduced to metal, thereby losing the solder mask function. Or, during the soldering process, the solder resist of the solder paste will reduce the oxide of the groove to metal, causing the solder mask function to fail.
又一种防止回流时焊料溢出的方式是激光氧化沟道蚀刻或机械加工阻焊方案。通过蚀刻或机械加工在焊盘的周围加工成沟槽。回流时，溢出的焊料流进沟槽中，防止焊料过度外溢。然而，对于基板上防止焊料外溢的方案，可以在焊盘周围通过蚀刻形成阻焊槽，使溢出的焊料流入槽中。但是，过多的阻焊槽可能劣化基板的性能，可能破坏基板塑封后的应力状态，使基板塑封后溢胶。 Another way to prevent solder spillage during reflow is to laser oxide trench etching or machined solder mask solutions. Grooves are created around the pads by etching or machining. During reflow, the overflowing solder flows into the groove to prevent excessive solder overflow. However, for the solution to prevent solder overflow on the substrate, a solder resist groove can be formed around the pad by etching, so that the overflowed solder flows into the groove. However, too many solder resist grooves may degrade the performance of the substrate, may destroy the stress state of the substrate after molding, and cause glue to overflow after the substrate is molded.
又一种防止回流时焊料溢出的方式是还可以对绿油表面进行粗化处理(如通过机械加工进行粗化处理)，以增强绿油与塑封料的结合力。对绿油粗化处理后，在绿油表面进行塑封。然而，先对绿油表面进行粗化处理，然后进行塑封，通过绿油阻焊层表面的粗化增加结合面积和锚定(anchor)作用，从而增加绿油与塑封料的结合力。然而，采用该方案，机械作用可对绿油阻焊剂与基板的结合层形成弱化，带来可靠性的风险。绿油表面与塑封料的结合力也弱。Another way to prevent solder from overflowing during reflow is to roughen the surface of the green oil (such as roughening through mechanical processing) to enhance the bonding force between the green oil and the plastic packaging material. After roughening the green oil, plastic seal it on the surface of the green oil. However, the surface of the green oil is first roughened and then plastic-sealed. The roughening of the surface of the green oil solder mask layer increases the bonding area and anchoring effect, thereby increasing the bonding force between the green oil and the plastic sealing material. However, with this solution, mechanical action can weaken the bonding layer between the green oil solder resist and the substrate, posing reliability risks. The bonding force between the green oil surface and the plastic sealant is also weak.
针对阻焊剂不能与塑封料结合良好的问题，且其它防止回流时焊料溢出的方式不可靠的问题，本申请提供一种塑封模块、塑封方法及电子设备，在基板的表面设置的阻焊层提供阻焊作用的同时，既能使阻焊层与基板的金属层等实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。In order to solve the problem that the solder resist cannot combine well with the plastic packaging material, and other methods to prevent solder from overflowing during reflow are unreliable, this application provides a plastic packaging module, a plastic packaging method and an electronic device. The solder resist layer provided on the surface of the substrate provides While acting as a solder resist, it can not only achieve a highly reliable combination between the solder resist layer and the metal layer of the substrate, but also achieve a highly reliable combination between the solder resist and the plastic packaging material of the plastic module.
以下由特定的具体实施例说明本申请的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本申请的其他优点及功效。虽然本申请的描述将结合较佳实施例一起介绍，但这并不代表此申请的特征仅限于该实施方式。恰恰相反，结合实施方式作申请介绍的目的是为了覆盖基于本申请的权利要求而有可能延伸出的其它选择或改造。为了提高对本申请的深度了解，以下描述中将包含许多具体的细节。本申请也可以不使用这些细节实施。此外，为了避免混乱或模糊本申请的重点，有些具体细节将在描述中被省略。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。The implementation of the present application is described below with specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of the present application are limited to this embodiment. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of the application. In order to provide a thorough understanding of the present application, the following description will contain many specific details. The application may be implemented without these details. Furthermore, some specific details will be omitted from the description in order to avoid confusing or obscuring the focus of the present application. It should be noted that, as long as there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other.
以下，如果有用到，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。“上”、“下”、“左”、“右”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and shall not be understood as indicating or implying the relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined by "first," "second," etc. may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise stated, "plurality" means two or more. Orientation terms such as "up", "down", "left" and "right" are defined relative to the schematically placed directions of the components in the drawings. It should be understood that these directional terms are relative concepts and they are used in Descriptions and clarifications relative to the drawings may vary accordingly depending on the orientation of components in the drawings.
在本申请中，一结构大致呈某一形状，指从宏观看该结构总体呈现该形状，并在局部可能具有调整。如大致呈方形，可以理解为其中一边为弧形而非直线的形状也包括在范围内。一特征与另一特征大致同轴，可以理解为两特征的轴线之间的距离不超过任一特征在垂直于轴线的尺寸的20％。In this application, a structure generally assumes a certain shape, which means that the structure generally exhibits the shape when viewed from a macro perspective, and may have local adjustments. For example, if it is roughly square, it can be understood that shapes in which one side is an arc rather than a straight line are also included in the scope. For one feature to be substantially coaxial with another feature is understood to mean that the distance between the axes of the two features does not exceed 20% of the dimension of either feature perpendicular to the axis.
在本申请中，如果有用到，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以说直接相连，也可以通过中间媒介间接连接。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。In this application, if used, unless otherwise clearly stated and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral body; it can be said that Directly connected, or indirectly connected through an intermediary. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
在下述实施例结合示意图进行详细描述时，为便于说明，表示器件局部结构的图会不依一般比例作局部放大，而且该示意图只是示例，其在此不应限制本申请保护的范围。When the following embodiments are described in detail in combination with schematic diagrams, for convenience of explanation, the diagrams showing the partial structure of the device are not enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of the present application.
为使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请的实施方式作进一步地详细描述。In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
首先描述本申请实施例可能涉及的几个术语：First, several terms that may be involved in the embodiments of this application are described:
本实施例中，功率模块是指将电源的电压，电流，周波数等进行变换的半导体模块。是电力变换的核心模块。In this embodiment, the power module refers to a semiconductor module that converts the voltage, current, cycle number, etc. of the power supply. It is the core module of power conversion.
塑封模块是指功率模块的内部电子器件装配到基板后，用塑封料将模块封装起来，以提高模块的可靠性，防潮性，散热性，减少模块体积等。Plastic-encapsulated modules refer to the power module’s internal electronic components being assembled to the substrate, and then the module is encapsulated with plastic encapsulation material to improve the module’s reliability, moisture resistance, heat dissipation, and reduce the module volume.
覆铜陶瓷基板(direct bonding copper，DBC)，又称为直接键合铜，是将铜在高温下通过热熔结合的方法直接与氧化铝(aluminium oxide，Al2O3)和氮化铝陶瓷(Aluminum Nitride Ceramic)表面结合而成的复合基板，在覆铜表面上，可以根据电路设计或产品结构蚀刻相应的图案，已经广泛用于智能电源模块和电动汽车电源模块的封装。陶瓷覆铜板具有陶瓷的高导热、高电绝缘、高机械强度、低膨胀等特性，又兼具无氧铜的高导电性和优异焊接性能，且能像PCB线路板一样刻蚀出各种图形。Copper-clad ceramic substrate (direct bonding copper, DBC), also known as direct bonded copper, is a method of directly bonding copper with alumina oxide (Al 2 O 3 ) and aluminum nitride ceramics through thermal fusion at high temperatures. (Aluminum Nitride Ceramic) surface bonded composite substrate, on the copper-clad surface, corresponding patterns can be etched according to the circuit design or product structure, and have been widely used in the packaging of smart power modules and electric vehicle power modules. Ceramic copper-clad laminates have the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics, as well as the high electrical conductivity and excellent welding performance of oxygen-free copper, and can be etched with various patterns like PCB circuit boards. .
AMB技术是DBC技术的进一步发展，是利用焊料中的活性金属元素(如Ti/Ag/Zr/Cu)实现陶瓷与金属结合的方法，陶瓷形成可被液态焊料润湿的反应层。AMB technology is a further development of DBC technology. It uses active metal elements in solder (such as Ti/Ag/Zr/Cu) to achieve the combination of ceramics and metals. The ceramics form a reaction layer that can be wetted by liquid solder.
AMB陶瓷基板中陶瓷和焊料的结合是通过陶瓷和活性金属钎料在温度下的化学反应实现的，凝固后，活性金属钎料将陶瓷和铜层焊接到一起。与传统的氧化铝陶瓷基板相比，AMB中使用的氮化硅(Si3N4)陶瓷具有更高的热导率(>90W/mK 25℃)，更接近碳化硅的热膨胀系数(2.6x10-6/K)。因此，AMB基板具有较高的粘合强度和可靠性。结合银烧结工艺和大功率碳化硅芯片，带有活性金属涂层的AMB铜层可以实现高功率、更好的散热和高可靠性的封装模块(可承受3000次热冲击)，已广泛应用于电动汽车、电力机车和高速列车。The combination of ceramic and solder in AMB ceramic substrates is achieved through the chemical reaction of ceramic and active metal solder at temperature. After solidification, the active metal solder solders the ceramic and copper layers together. Compared with traditional alumina ceramic substrates, the silicon nitride (Si3N4) ceramic used in AMB has a higher thermal conductivity (>90W/mK 25℃) and is closer to the thermal expansion coefficient of silicon carbide (2.6x10-6/ K). Therefore, AMB substrate has high bonding strength and reliability. Combining the silver sintering process and high-power silicon carbide chips, the AMB copper layer with active metal coating can achieve high power, better heat dissipation and high reliability packaged modules (can withstand 3000 thermal shocks), which has been widely used in Electric cars, electric locomotives and high-speed trains.
焊料层的厚度是指模组的焊接层的焊料厚度。焊接层厚度对焊料结合的可靠性等有重要影响。The thickness of the solder layer refers to the thickness of the solder layer of the module. The thickness of the solder layer has an important impact on the reliability of the solder bond.
焊料层的倾斜度是指模组的焊接层的倾斜度。 The inclination of the solder layer refers to the inclination of the soldering layer of the module.
其中，焊料层的厚度和倾斜度影响焊料回流时是否会溢出。Among them, the thickness and slope of the solder layer affect whether the solder will overflow during reflow.
2D封装(two dimensional package)，是指将芯片，阻容等电子部品结合到基板上。电子部品上表面不再结合其他物品。电子部品与基板在一个平面上。2D packaging (two dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate. The upper surface of electronic parts is no longer combined with other items. The electronic components and the substrate are on the same plane.
3D封装(three dimensional package)，是指将芯片，阻容等电子部品结合到基板上。电子部品上表面再结合其他物品。3D packaging (three dimensional package) refers to combining electronic components such as chips, resistors and capacitors onto a substrate. The upper surface of electronic parts is then combined with other items.
焊盘(soldering pad)是指基板或器件的被焊接部分。Soldering pad refers to the soldered part of the substrate or device.
随着电子产品的高效率，高密度化和高可靠性，电子产品向3D塑封结构演进。为防止回流时焊料溢出，以及使阻焊剂与基板的Cu金属等实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合，这需要有满足3D塑封结构的阻焊层。With the high efficiency, high density and high reliability of electronic products, electronic products are evolving towards 3D plastic packaging structures. In order to prevent solder from overflowing during reflow, achieve high-reliability combination between the solder resist and the Cu metal of the substrate, and achieve high-reliability combination between the solder resist and the plastic packaging material of the plastic module, this requires a solder resist that meets the 3D plastic packaging structure. layer.
而传统阻焊剂是基于目前主流的表面封装技术(surface mounted technology，SMT)2D封装的阻焊技术。阻焊剂印刷到基板的铜层的焊盘周围，形成所需的形状。阻焊剂干燥后能保证焊料回流时焊料的形状，防止焊料溢出导致电气短路等。但是，目前的对应于2D封装的阻焊剂只能与基板的铜层结合而不能与其上的塑封料结合，难以实现高密度的3D塑封封装。The traditional solder resist is based on the current mainstream surface mounted technology (SMT) 2D packaging solder resist technology. Solder resist is printed onto the copper layer of the substrate around the pads, forming the desired shape. After drying, the solder resist can ensure the shape of the solder during reflow and prevent solder from overflowing and causing electrical short circuits. However, the current solder resist corresponding to 2D packaging can only be combined with the copper layer of the substrate and cannot be combined with the plastic packaging material on it, making it difficult to achieve high-density 3D plastic packaging.
本实施例提出了一种新的用于塑封模块的阻焊层。焊接后阻焊剂与模组一起埋入塑封料中。阻焊剂既要与铜等金属结合，还需要与塑封料结合，并具有耐高温性和高可靠性。This embodiment proposes a new solder resist layer for plastic packaging modules. After welding, the solder resist and the module are embedded in the plastic compound. The solder resist needs to be combined with metals such as copper and plastic packaging materials, and must have high temperature resistance and high reliability.
本实施例通过使用灌封胶，聚酰亚胺，环氧树脂，咪类为主的材料制作阻焊剂，改变了阻焊剂的化学极性。示例性地，可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意一种材料制作阻焊剂，也可以使用灌封胶，聚酰亚胺，环氧树脂，咪类等中的任意多种材料的聚合物制作阻焊剂。This embodiment uses potting glue, polyimide, epoxy resin, imi The solder resist is made of class-based materials, which changes the chemical polarity of the solder resist. For example, potting glue, polyimide, epoxy resin, mic Solder resist can be made from any material such as potting glue, polyimide, epoxy resin, microphone, etc. Solder resist can be made from polymers of any number of materials in the class.
其中，聚酰亚胺(polyimide，PI)指主链上含有酰亚胺环(-CO-NR-CO-)的一类聚合物，是综合性能最佳的有机高分子材料之一。其耐高温达400℃以上，长期使用温度范围-200～300℃，部分无明显熔点，高绝缘性能，103赫兹下介电常数4.0，介电损耗仅0.004～0.007，属F至H级绝缘。Among them, polyimide (PI) refers to a type of polymer containing an imide ring (-CO-NR-CO-) in the main chain. It is one of the organic polymer materials with the best comprehensive properties. It has a high temperature resistance of over 400°C and a long-term use temperature range of -200~300°C. Some parts have no obvious melting point and have high insulation properties. The dielectric constant is 4.0 at 10 3 Hz and the dielectric loss is only 0.004~0.007. It belongs to F to H class insulation. .
环氧树脂是一种高分子聚合物，分子式为(C11H12O3)n，是指分子中含有两个以上环氧基团的一类聚合物的总称。它是环氧氯丙烷与双酚A或多元醇的缩聚产物。由于环氧基的化学活性，可用多种含有活泼氢的化合物使其开环，固化交联生成网状结构，因此它是一种热固性树脂。Epoxy resin is a high molecular polymer with the molecular formula (C 11 H 12 O 3 ) n . It refers to a class of polymers containing more than two epoxy groups in the molecule. It is the condensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of the epoxy group, a variety of compounds containing active hydrogen can be used to open the ring and solidify and cross-link to form a network structure, so it is a thermosetting resin.
例如，使用室温或低温双组分环氧树脂制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。For example, use a solder resist made of room-temperature or low-temperature two-component epoxy resin. The solder resist can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit.
又例如，使用聚酰亚胺制成的阻焊剂，该阻焊剂既能与基板的铜层结合，又能与塑封料结合，实现无短路风险的塑封模块。如图1所示，为本申请实施例提供的一种聚酰亚胺的分子结构式，聚酰亚胺长期耐温-269-280℃，结构稳定，采用聚酰亚胺制成的阻焊剂既可以与基板的铜层结合，又可以与塑封料结合。Another example is the use of solder resist made of polyimide, which can be combined with the copper layer of the substrate and the plastic packaging material to achieve a plastic packaging module without the risk of short circuit. As shown in Figure 1, the molecular structure formula of a polyimide is provided in the embodiment of the present application. The polyimide has a long-term temperature resistance of -269-280°C and a stable structure. The solder resist made of polyimide can It can be combined with the copper layer of the substrate and with the plastic packaging material.
又例如，可以使用灌封胶喷涂到基板上，加热固化，形成阻焊层。For another example, potting glue can be sprayed onto the substrate and heated and solidified to form a solder resist layer.
本实施例对阻焊剂使用的材料不作限制，使用任意材料制成的阻焊剂满足既与铜等金属结合、还与塑封料结合的特性，都在本申请的保护范围内。This embodiment does not limit the material used for the solder resist. A solder resist made of any material that meets the characteristics of combining with metals such as copper and plastic packaging materials is within the scope of protection of this application.
根据需要，阻焊剂可以涂敷到一定厚度，例如5nm-500um。本申请实施例对阻焊剂涂覆的厚度不作限制。According to needs, the solder resist can be applied to a certain thickness, such as 5nm-500um. The embodiments of this application do not limit the thickness of the solder resist coating.
图2为本申请实施例提供的新阻焊剂与传统的阻焊剂的结合对比示意图。如左图所示，为传统的阻焊剂的官能团的结合示意图，传统的阻焊剂一般称为绿油，是一种单极性阻焊剂，其官能团只能与基板的铜等金属结合在一起。该绿油阻焊剂的上表面不能与塑封模块的塑封料结合。如右图所示，为本实施例提供的阻焊剂的官能团的结合示意图，本实施例提供了一种金属和塑封料双极性、耐高温、高可靠性阻焊剂。该新型阻焊剂是双极性阻焊剂，官能团的一端能与基板的金属(例如DBC的铜)通过化合键高可靠地结合，官能团的另一端能与塑封模块的塑封料通过化合键高可靠地结合。Figure 2 is a schematic diagram comparing the combination of the new solder resist and the traditional solder resist provided by the embodiment of the present application. As shown in the picture on the left, it is a schematic diagram of the combination of functional groups of traditional solder resist. Traditional solder resist is generally called green oil. It is a unipolar solder resist, and its functional groups can only be combined with copper and other metals on the substrate. The upper surface of the green oil solder resist cannot be combined with the plastic packaging material of the plastic module. As shown in the figure on the right, it is a schematic diagram of the combination of functional groups of the solder resist provided in this embodiment. This embodiment provides a bipolar, high-temperature resistant, and high-reliability solder resist for metal and plastic packaging materials. This new type of solder resist is a bipolar solder resist. One end of the functional group can be highly reliably combined with the metal of the substrate (such as DBC copper) through chemical bonds, and the other end of the functional group can be highly reliably combined with the plastic packaging material of the plastic module through chemical bonds. combine.
其中，上述官能团，是决定有机化合物的化学性质的原子或原子团。常见官能团包括羟基、羧基、醚键、醛基、羰基等。有机化学反应主要发生在官能团上，官能团对有机物的性质起决定作用。Among them, the above-mentioned functional groups are atoms or atomic groups that determine the chemical properties of organic compounds. Common functional groups include hydroxyl, carboxyl, ether bonds, aldehyde groups, carbonyl groups, etc. Organic chemical reactions mainly occur on functional groups, which play a decisive role in the properties of organic matter.
如图3所示，以塑封模块焊接到基板上的内置式阻焊层的制造方法为例，描述本实施例提供的一种塑封方法。As shown in FIG. 3 , a plastic packaging method provided by this embodiment is described by taking the manufacturing method of a built-in solder resist layer in which a plastic packaging module is welded to a substrate as an example.
首先，在基板的表面设置阻焊层。该基板包括散热板。First, a solder resist layer is provided on the surface of the substrate. The base plate includes a heat sink.
具体地，可以通过模具(例如钢网)，根据预先制定的焊接拓扑图，将上述新型阻焊剂印刷到散热板上，印刷厚度可以5nm-500um。其中，散热板的材料可以是裸铜，也可以镀镍。可替换地，也可以将阻焊剂喷涂到散热板上，或者通过点胶的方式将阻焊剂点到散热板上。其中，阻焊剂的图形可以是如图3所示的长方形，也可以是其它任意形状，根据待焊接的模组中的芯片、阻容等元器件的数量、大小等确定。本 申请实施例对阻焊剂的图形不作限制。固化前的阻焊剂的颜色应均匀一致(允许使用透明、无颜料的阻焊剂)。紫外光固化型、热固化型、液态感光型阻焊剂的流动性应一致，无结皮、沉降、凝胶等现象；干膜型阻焊剂厚度应均匀一致，无针孔、气泡、颗粒、杂质、胶层流动等现象。Specifically, the above-mentioned new solder resist can be printed on the heat sink plate through a mold (such as a steel mesh) according to a predetermined welding topology map, and the printing thickness can be 5nm-500um. Among them, the material of the heat sink can be bare copper or nickel plated. Alternatively, the solder resist can also be sprayed onto the heat sink, or the solder resist can be applied onto the heat sink by dispensing glue. Among them, the pattern of the solder resist can be a rectangle as shown in Figure 3, or can be any other shape, which is determined according to the number and size of chips, resistors, capacitors and other components in the module to be soldered. Book The application embodiment does not limit the pattern of the solder resist. The color of the solder resist before curing should be uniform (clear, unpigmented solder resist is allowed). The fluidity of UV-curable, heat-curable, and liquid photosensitive solder resists should be consistent, without crusting, settling, gelling, etc.; the thickness of dry film solder resist should be uniform, without pinholes, bubbles, particles, or impurities. , glue layer flow and other phenomena.
阻焊剂要求其有一定的厚度和硬度、耐溶剂性试验和附着力试验应符合标准，印制电路板表面无垃圾、无多余印记。因此，阻焊剂印刷完毕后，固化(或者称干燥)阻焊剂。涉及的阻焊剂类型按工艺加工特点分为：紫外光固化型阻焊剂、热固化型阻焊剂、液态感光型阻焊剂、干膜型阻焊剂。示例性地，以热固化型阻焊剂为例，根据阻焊剂的固化特性，可以是室温固化，也可以是高温固化。固化环境可以是大气，也可以是保护性气氛。其中，保护性气氛是种某种防氧化等的环境中。固化后的阻焊层应均匀一致，应无影响印制板组装和使用的外来物、裂口、包含物、脱落及粗糙；固化后的阻焊层下的金属表面的变色应可接收，但阻焊层本身不能有明显的变色。阻焊剂图形固化好后，围成一个如图所示的焊盘，是一种四周封闭的区域。The solder resist is required to have a certain thickness and hardness, solvent resistance test and adhesion test should meet the standards, and the surface of the printed circuit board should be free of garbage and redundant marks. Therefore, after the solder resist is printed, the solder resist is cured (or dried). The types of solder resist involved are divided according to process processing characteristics: UV-curable solder resist, thermal-curable solder resist, liquid photosensitive solder resist, and dry film solder resist. For example, taking a thermally curable solder resist as an example, depending on the curing characteristics of the solder resist, it can be cured at room temperature or at high temperature. The curing environment can be the atmosphere or a protective atmosphere. Among them, the protective atmosphere is a kind of environment that prevents oxidation and so on. The cured solder mask layer should be uniform and free of foreign objects, cracks, inclusions, peeling and roughness that would affect the assembly and use of the printed board; the discoloration of the metal surface under the cured solder mask layer should be acceptable, but the resist The solder layer itself should not have obvious discoloration. After the solder resist pattern is cured, it forms a pad as shown in the figure, which is a closed area.
然后，将焊料放置在阻焊层形成的四周封闭的区域内。The solder is then placed in the enclosed area created by the solder mask.
具体地，阻焊剂图形固化好后，可以将第一焊料放入阻焊剂围成的焊盘中。其中，第一焊料包括焊片或焊膏。在一个示例中，可以将焊片植入到阻焊剂围成的焊盘中。在另一个示例中，也可以将焊膏(金属球和助焊剂构成的膏状物)印刷，或者是点到阻焊剂围成的焊盘中。焊接层的厚度要高于阻焊剂的厚度。焊膏印刷量或点入量，根据焊料的厚度决定。焊膏回流时，助焊剂被熔化，焊膏回流(即焊膏熔化)后的厚度约为焊膏厚度的50％。因为有阻焊剂，散热板上的阻焊层防止了焊料溢出，保证了第一焊料的厚度和倾斜度。第一焊料回流时不会流出阻焊剂形成的焊盘的外围，造成电路短路等。Specifically, after the solder resist pattern is solidified, the first solder can be placed into the pad surrounded by the solder resist. Wherein, the first solder includes solder pieces or solder paste. In one example, solder tabs may be implanted into pads surrounded by solder resist. In another example, solder paste (a paste composed of metal balls and flux) can also be printed or dotted into a pad surrounded by solder resist. The thickness of the solder layer is higher than the thickness of the solder resist. The amount of solder paste printed or inserted is determined by the thickness of the solder. When the solder paste is reflowed, the flux is melted, and the thickness of the solder paste after reflow (that is, the solder paste is melted) is approximately 50% of the solder paste thickness. Because of the solder resist, the solder resist layer on the heat sink prevents solder from overflowing and ensures the thickness and slope of the first solder. When the first solder is reflowed, it will not flow out of the periphery of the pad formed by the solder resist, causing a short circuit in the circuit.
将印刷上第二焊料并在第二焊料上贴上芯片的基板(该过程称为贴片)放到阻焊剂围成的第一焊料(焊片或焊膏)上。其中，基板包括以下至少一种：DBC、AMB。The substrate with the second solder printed on it and the chip attached to the second solder (this process is called SMT) is placed on the first solder (solder piece or solder paste) surrounded by solder resist. Wherein, the substrate includes at least one of the following: DBC, AMB.
进一步地，将芯片与基板之间通过焊料实现固定。Further, the chip and the substrate are fixed with solder.
具体地，可以通过回流工艺将芯片与基板，基板与基板焊接在一起，形成模组。在另外的实施例中，有的模组可以不要基板。本实施例中，基板是金属(例如铜)的，可以起到加强均匀散热的作用。Specifically, the chip and the substrate, and the substrate and the substrate, can be welded together through a reflow process to form a module. In other embodiments, some modules may not require a substrate. In this embodiment, the substrate is made of metal (such as copper), which can enhance uniform heat dissipation.
焊接完后，在芯片上键合打线，并植上引脚(pin)等。After soldering, wire bonding is done on the chip and pins are installed.
最后，将基板和固定在基板上的芯片进行塑封，形成塑封模块。Finally, the substrate and the chip fixed on the substrate are plastic-sealed to form a plastic-sealed module.
具体地，可以使用塑封料对上述模组进行塑封。塑封料流入模组的每个缝隙中和/或流到芯片的表面。因为阻焊剂防止了焊料的溢出，为塑封料与基板的密接性提供了可能。阻焊剂也与其上和周围的塑封料结合在一起，提高了塑封模块的可靠性。且由于使用新型阻焊剂，新型阻焊剂与铜、塑封料都有良好的结合性，不会造成焊接空洞，塑封料与焊料结合分层风险等。上述阻焊剂被埋入到塑封料中，可以称为内置的阻焊剂。Specifically, the above-mentioned module can be plastic-sealed using plastic packaging material. The molding compound flows into every gap in the module and/or onto the surface of the chip. Because the solder resist prevents solder from overflowing, it provides the possibility of tightness between the plastic packaging material and the substrate. The solder resist also binds to the molding compound on and around it, improving the reliability of the molded module. And due to the use of new solder resist, the new solder resist has good bonding properties with copper and plastic packaging materials, and will not cause welding voids or the risk of delamination between plastic packaging materials and solder. The above-mentioned solder resist is embedded in the plastic packaging material and can be called built-in solder resist.
采用该塑封方法制成的塑封模块，因为新型阻焊剂与铜、塑封料都有良好的结合性，对塑封模块的塑封料的分层无影响。For plastic-sealed modules made using this plastic-sealing method, because the new solder resist has good bonding properties with copper and plastic packaging materials, it has no effect on the delamination of the plastic packaging materials of the plastic-sealed modules.
下面示例性地描述两种采用上述塑封方法塑封得到的塑封模块：The following is an exemplary description of two plastic-sealed modules obtained by using the above-mentioned plastic packaging method:
如图4所示，为本申请实施例提供的一种塑封模块的剖面示意图，示例了一种内置阻焊剂的带散热板的塑封模块。该塑封模块包括基板(如DBC)，DBC的表面设置阻焊层。该基板还包括散热板。具体地，可以在基板上，按照上述塑封方法制造内置式阻焊层。阻焊层与基板的铜表面，或镀镍表面结合在一起。第一焊料被放置在阻焊层形成的四周封闭的区域内，上面放置贴片完毕的基板，芯片与基板之间通过焊料实现固定。即芯片和基板一起回流后，焊接在一起。基板上的阻焊层防止了焊料溢出，保证了焊料的厚度和倾斜度。因为焊料与塑封料的结合最差，焊料溢出的防止，为塑封料与基板的密接性提供了可能。阻焊剂也与其上和周围的塑封料结合在一起，提高了塑封模块的可靠性。另外，可以在基板上制造支撑柱(用于基板支撑)，如冲压成型微小支撑柱，或在基板上制造支撑线段，或者在DBC与散热板之间置入金属线(铜线或镍线等)，有利于保证焊料层的厚度和厚度均匀性。As shown in FIG. 4 , it is a schematic cross-sectional view of a plastic module provided by an embodiment of the present application, illustrating a plastic module with a heat dissipation plate and a built-in solder resist. The plastic module includes a substrate (such as a DBC), and a solder resist layer is provided on the surface of the DBC. The base plate also includes a heat sink. Specifically, the built-in solder resist layer can be manufactured on the substrate according to the above plastic sealing method. The solder mask is bonded to the copper surface of the substrate, or the nickel plated surface. The first solder is placed in the enclosed area formed by the solder mask layer, and the mounted substrate is placed on it. The chip and the substrate are fixed by solder. That is, after the chip and the substrate are reflowed together, they are soldered together. The solder mask layer on the substrate prevents solder from overflowing and ensures the thickness and slope of the solder. Because the combination of solder and plastic encapsulation material is the worst, preventing solder overflow provides the possibility of tightness between the plastic encapsulation material and the substrate. The solder resist also binds to the molding compound on and around it, improving the reliability of the molded module. In addition, support pillars (for substrate support) can be manufactured on the substrate, such as stamping and forming tiny support pillars, or support line segments can be manufactured on the substrate, or metal wires (copper wires or nickel wires, etc.) can be placed between the DBC and the heat sink. ), which helps ensure the thickness and thickness uniformity of the solder layer.
上述DBC上贴片有位于多个平面的芯片、阻容等电子部品，因此，该塑封模块采用3D塑封技术。The above-mentioned DBC chip has electronic components such as chips, resistors and capacitors located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
模组的内部电子器件装配到基板后，用塑封料将模块封装起来，可以提高模块的可靠性，防潮性，散热性，减少模块体积等。After the internal electronic components of the module are assembled to the substrate, the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
进一步地，对于如图4所示的塑封模块，DBC基板的靠近铜层的部位焊接芯片。用于芯片焊接的焊料溢出到沟槽边缘的铜层上，造成此处铜层和陶瓷界面的应力过大，在循环热应力作用下，沟槽附近的铜层与陶瓷剥离，造成芯片处散热能力减弱，热阻增大，破坏电气均流，导致模组失效。因为模组的高密度封装，芯片焊接部位靠近沟槽，没有空间制造焊料溢出沟槽。如图5所示，为本申请实施例提供的覆铜陶瓷 基板的沟槽附近涂覆阻焊剂的示意图，在DBC沟槽(DBC的陶瓷层)附近处涂敷塑封内置型阻焊剂。塑封后，阻焊剂与塑封料结合在一起，防止DBC从边缘处分层。Further, for the plastic module shown in Figure 4, the chip is welded on the part of the DBC substrate close to the copper layer. The solder used for chip welding overflows onto the copper layer at the edge of the trench, causing excessive stress at the interface between the copper layer and ceramic. Under the action of cyclic thermal stress, the copper layer near the trench peels off from the ceramic, causing heat dissipation at the chip. The ability is weakened, the thermal resistance is increased, and electrical current sharing is destroyed, causing module failure. Because of the high-density packaging of the module, the chip soldering parts are close to the trenches, and there is no space to create solder overflow trenches. As shown in Figure 5, the copper-clad ceramic provided in the embodiment of the present application Schematic diagram of applying solder resist near the trench of the substrate, and applying plastic-encapsulated solder resist near the DBC trench (ceramic layer of DBC). After molding, the solder resist is combined with the molding compound to prevent the DBC from delaminating from the edges.
通过在DBC的芯片靠近沟槽的焊接部位的周边，涂敷塑封用阻焊剂，阻焊层接位于DBC的沟槽周围，可以防止焊料溢出，避免铜与陶瓷的分层。阻焊剂与塑封料和铜良好结合，改善沟槽处的应力状态，抑制铜层的剥离。By applying solder resist for plastic packaging around the soldering part of the DBC chip close to the trench, the solder resist layer is located around the trench of the DBC, which can prevent solder from overflowing and avoid delamination of copper and ceramics. The solder resist combines well with the plastic packaging material and copper, improving the stress state at the trench and inhibiting the peeling of the copper layer.
如图6所示，为本申请实施例提供的另一种塑封模块的剖面示意图，示例了一种内置阻焊剂的带散热器的塑封模块方案。示例性地，该带散热器的塑封模块可以应用于车载场景。例如，汽车的电机控制单元(motor control unit，MCU)(又称为即电机控制器。根据VCU的指令，控制电机的旋转状态)需要有散热器，该散热器是通过水冷散热，而上述带基板模组的塑封模块中基板的是不通水的，因此，本实施例提出一种带散热器的塑封模块。如图5所示，包含散热器的基板上制造内置式阻焊层。阻焊层与基板的铜表面，或镀镍表面结合。阻焊层形成的四周封闭的区域中内置焊料，上面放置贴片完毕的AMB(其机械、力学、热、冲击等综合性能优于DBC)。该AMB是利用焊料中的活性金属元素(如Ti/Ag/Zr/Cu)实现陶瓷(如氮化硅(Si3N4))与金属(Cu)结合形成的。回流后，AMB及其上的焊料与AMB焊接到一起，同时AMB与散热器焊接在一起。阻焊层防止了焊料溢出，为后续的塑封准备了条件。阻焊剂与其周围的塑封料结合在一起，成为模组的一部分。As shown in FIG. 6 , it is a schematic cross-sectional view of another plastic module provided by an embodiment of the present application, illustrating a plastic module solution with a heat sink and a built-in solder resist. For example, the plastic module with a radiator can be applied to vehicle scenarios. For example, a car's motor control unit (MCU) (also called a motor controller. It controls the rotation state of the motor according to the instructions of the VCU) requires a radiator, which dissipates heat through water cooling, and the above-mentioned The substrate in the plastic module of the substrate module is impermeable to water. Therefore, this embodiment proposes a plastic module with a radiator. As shown in Figure 5, a built-in solder mask is fabricated on the substrate containing the heat sink. The solder mask is bonded to the copper surface of the substrate, or the nickel plated surface. The solder is built into the enclosed area formed by the solder mask layer, and the completed AMB is placed on it (its mechanical, mechanical, thermal, impact and other comprehensive properties are better than DBC). The AMB is formed by using active metal elements (such as Ti/Ag/Zr/Cu) in the solder to combine ceramics (such as silicon nitride (Si3N4)) with metals (Cu). After reflow, the AMB and the solder on it are soldered to the AMB, and the AMB and the heat sink are soldered together. The solder mask prevents solder from overflowing and prepares the conditions for subsequent plastic packaging. The solder resist combines with the surrounding molding compound and becomes part of the module.
上述AMB上贴片有位于多个平面的芯片、阻容等电子部品，因此，该塑封模块采用3D塑封技术。The above-mentioned AMB has chips, resistors, capacitors and other electronic components located on multiple planes. Therefore, the plastic packaging module uses 3D plastic packaging technology.
模组的内部电子器件装配到基板后，用塑封料将模块封装起来，可以提高模块的可靠性，防潮性，散热性，减少模块体积等。After the internal electronic components of the module are assembled to the substrate, the module is encapsulated with plastic sealant, which can improve the module's reliability, moisture resistance, heat dissipation, and reduce the module volume.
根据本申请实施例提供的一种塑封模块，其中的阻焊剂提供阻焊作用的同时，既能使阻焊剂与基板的Cu金属等实现高可靠性结合，又能使阻焊剂与塑封模块的塑封料实现高可靠性结合。回流后，塑封时阻焊剂一起塑封到模块中，使阻焊剂成为模块的一部分。经理论分析和初步试验验证，新型阻焊剂可与塑封料结合，并具有焊料阻焊性。后续在大功率塑封模组中，以及在中小功率塑封模组中，解决塑封模组不能应用阻焊剂的问题。According to a plastic packaging module provided by an embodiment of the present application, the solder resist in the solder resist provides a soldering resistance, and can not only achieve high reliability combination of the solder resist and the Cu metal of the substrate, but also enable the solder resist and the plastic packaging of the plastic module. materials to achieve high reliability. After reflow, the solder resist is molded into the module together during molding, making the solder resist a part of the module. After theoretical analysis and preliminary testing, the new solder resist can be combined with plastic packaging materials and has solder resistance. In the future, we will solve the problem that solder resist cannot be applied to plastic modules in high-power plastic modules, as well as in small and medium-power plastic modules.
在另一个实施例中，阻焊剂可以是应力缓冲材料。应力缓冲材料具有一定的应力缓冲作用，可以提高塑封模块的可靠性。应力缓冲材料既与基板的金属结合良好，也与塑封料良好结合。且因为应力缓冲材料是有机物为主的材料，有阻焊作用。In another embodiment, the solder resist may be a stress buffering material. The stress buffering material has a certain stress buffering effect and can improve the reliability of the plastic module. The stress buffering material combines well with both the metal of the substrate and the plastic encapsulation material. And because the stress buffer material is mainly organic material, it has a solder mask effect.
在本申请的各个实施例中，如果没有特殊说明以及逻辑冲突，不同的实施例之间的术语和/或描述具有一致性、且可以相互引用，不同的实施例中的技术特征根据其内在的逻辑关系可以组合形成新的实施例。In the various embodiments of this application, if there is no special explanation or logical conflict, the terms and/or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments are based on their inherent Logical relationships can be combined to form new embodiments.
应理解，在本申请的描述中，除非另有说明，“/”表示前后关联的对象是一种“或”的关系，例如，A/B可以表示A或B；其中A，B可以是单数或者复数。并且，在本申请的描述中，除非另有说明，“多个”是指两个或多于两个。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b，或c中的至少一项(个)，可以表示：a，b，c，a-b，a-c，b-c，或a-b-c，其中a，b，c可以是单个，也可以是多个。另外，为了便于清楚描述本申请实施例的技术方案，在本申请的实施例中，采用了“第一”、“第二”等字样对功能和作用基本相同的相同项或相似项进行区分。本领域技术人员可以理解“第一”、“第二”等字样并不对数量和执行次序进行限定，并且“第一”、“第二”等字样也并不限定一定不同。同时，在本申请实施例中，“示例性的”或者“例如”等词用于表示作例子、例证或说明。本申请实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念，便于理解。It should be understood that in the description of this application, unless otherwise stated, "/" indicates that the related objects are in an "or" relationship. For example, A/B can mean A or B; where A and B can be singular numbers. Or plural. Furthermore, in the description of this application, unless otherwise specified, "plurality" means two or more than two. "At least one of the following" or similar expressions thereof refers to any combination of these items, including any combination of a single item (items) or a plurality of items (items). For example, at least one of a, b, or c can mean: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple . In addition, in order to facilitate a clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as “first” and “second” are used to distinguish identical or similar items with basically the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the number and execution order, and words such as "first" and "second" do not limit the number and execution order. At the same time, in the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete manner that is easier to understand.
可以理解的是，在本申请的实施例中涉及的各种数字编号仅为描述方便进行的区分，并不用来限制本申请的实施例的范围。上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定。It can be understood that the various numerical numbers involved in the embodiments of the present application are only for convenience of description and are not used to limit the scope of the embodiments of the present application. The size of the serial numbers of the above processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic.
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的边缘部分，可以参见其他实施例的相关描述。In the above-mentioned embodiments, each embodiment is described with its own emphasis. For marginal parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.
本申请实施例装置中的部件可以根据实际需要进行合并、划分和删减。本领域的技术人员可以将本说明书中描述的不同实施例以及不同实施例的特征进行结合或组合。The components in the device of the embodiment of the present application can be combined, divided, and deleted according to actual needs. Persons skilled in the art may combine or combine the different embodiments and features of different embodiments described in this specification.
在本申请的各个实施例中，如果没有特殊说明以及逻辑冲突，不同的实施例之间的术语和/或描述具有一致性、且可以相互引用，不同的实施例中的技术特征根据其内在的逻辑关系可以组合形成新的实施例。In the various embodiments of this application, if there is no special explanation or logical conflict, the terms and/or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments are based on their inherent Logical relationships can be combined to form new embodiments.
尽管在此结合各实施例对本申请进行了描述，然而，在实施所要求保护的本申请过程中，本领域技术 人员通过查看所述附图、公开内容、以及所附权利要求书，可理解并实现所述公开实施例的其他变化。在权利要求中，“包括”(comprising)一词不排除其他组成部分或步骤，“一”或“一个”不排除多个的情况。单个处理器或其他单元可以实现权利要求中列举的若干项功能。相互不同的从属权利要求中记载了某些措施，但这并不表示这些措施不能组合起来产生良好的效果。 Although the present application has been described herein in conjunction with various embodiments, in practicing the claimed application, those skilled in the art will Other variations of the disclosed embodiments can be understood and implemented by one reviewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. A single processor or other unit may perform several of the functions recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not mean that a combination of these measures cannot be combined to advantageous effects.

Claims (12)

  1. 一种塑封模块，其特征在于，包括：A plastic sealing module is characterized in that it includes:
    基板，所述基板的表面设置阻焊层，a substrate, a solder resist layer is provided on the surface of the substrate,
    焊料被放置在所述阻焊层形成的四周封闭的区域内，The solder is placed in an enclosed area formed by the solder mask,
    芯片与所述基板之间通过所述焊料实现固定，The chip and the substrate are fixed by the solder,
    所述基板和固定在所述基板上的所述芯片被塑封，形成所述塑封模块。The substrate and the chip fixed on the substrate are plastic-sealed to form the plastic-sealed module.
  2. 根据权利要求1所述的塑封模块，其特征在于，所述阻焊层由阻焊剂固化形成，所述阻焊剂也位于所述塑封模块内。The plastic module according to claim 1, wherein the solder resist layer is formed by curing solder resist, and the solder resist is also located in the plastic module.
  3. 根据权利要求2所述的塑封模块，其特征在于，所述阻焊剂与所述基板直接接合、且所述阻焊剂与所述塑封模块的塑封料也直接接合。The plastic module according to claim 2, wherein the solder resist is directly connected to the substrate, and the solder resist is also directly connected to the plastic material of the plastic module.
  4. 根据权利要求2或3所述的塑封模块，其特征在于，所述阻焊剂为以下一种或多种材料：灌封胶，聚酰亚胺，环氧树脂，咪类。The plastic module according to claim 2 or 3, characterized in that the solder resist is one or more of the following materials: potting glue, polyimide, epoxy resin, mic kind.
  5. 根据权利要求2-4中任一项所述的塑封模块，其特征在于，所述阻焊剂的官能团的一端与所述基板的金属通过化合键结合，所述阻焊剂的官能团的另一端与所述塑封模块的塑封料通过化合键结合。The plastic module according to any one of claims 2 to 4, characterized in that one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the other end of the functional group of the solder resist is bonded to the metal of the substrate. The plastic sealing materials of the plastic sealing module are combined through chemical bonds.
  6. 根据权利要求1-5中任一项所述的塑封模块，其特征在于，所述基板还包括散热结构。The plastic module according to any one of claims 1 to 5, wherein the substrate further includes a heat dissipation structure.
  7. 根据权利要求1-6中任一项所述的塑封模块，其特征在于，所述基板包括以下任意一种：覆铜陶瓷基板，活性金属钎焊铜。The plastic module according to any one of claims 1 to 6, characterized in that the substrate includes any one of the following: copper-clad ceramic substrate, active metal brazing copper.
  8. 根据权利要求1-7中任一项所述的塑封模块，其特征在于，所述基板为所述覆铜陶瓷基板，所述阻焊层接位于所述覆铜陶瓷基板的沟槽周围。The plastic module according to any one of claims 1 to 7, wherein the substrate is the copper-clad ceramic substrate, and the solder resist layer is located around the groove of the copper-clad ceramic substrate.
  9. 一种塑封方法，其特征在于，所述方法包括：A plastic sealing method, characterized in that the method includes:
    在基板的表面设置阻焊层，Set a solder mask layer on the surface of the substrate,
    将焊料放置在所述阻焊层形成的四周封闭的区域内，Place the solder in the enclosed area formed by the solder mask,
    将芯片与所述基板之间通过所述焊料实现固定；Fixing the chip and the substrate with the solder;
    将所述基板和固定在所述基板上的所述芯片进行塑封，形成所述塑封模块。The substrate and the chip fixed on the substrate are plastic-sealed to form the plastic-sealed module.
  10. 根据权利要求9所述的塑封方法，其特征在于，所述阻焊层由阻焊剂固化形成，所述阻焊剂与所述基板结合直接接合、且所述阻焊剂与所述塑封模块的塑封料结合也直接接合。The plastic packaging method according to claim 9, characterized in that the solder resist layer is formed by solidifying a solder resist, the solder resist is directly bonded to the substrate, and the solder resist is combined with the plastic sealing material of the plastic seal module. The bonding is also direct joining.
  11. 根据权利要求10所述的塑封方法，其特征在于，所述阻焊剂的官能团的一端与所述基板结合的金属通过化合键结合，所述阻焊剂的官能团的另一端与所述塑封模块的塑封料结合通过化合键结合。The plastic sealing method according to claim 10, characterized in that one end of the functional group of the solder resist is bonded to the metal of the substrate through a chemical bond, and the other end of the functional group of the solder resist is bonded to the plastic seal of the molded module. Materials are combined through chemical bonds.
  12. 一种电子设备，其特征在于，包括至少一个如权利要求1-8中任一项所述的塑封模块，所述至少一个塑封模块通过所述至少一个塑封模块中的芯片的引脚电连接。 An electronic device, characterized in that it includes at least one plastic package module according to any one of claims 1 to 8, and the at least one plastic package module is electrically connected through the pins of the chip in the at least one plastic package module.
PCT/CN2023/104167 2022-09-16 2023-06-29 Plastic packaging module, plastic packaging method and electronic device WO2024055700A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211128971.5A CN115497889A (en) 2022-09-16 2022-09-16 Plastic package module, plastic package method and electronic equipment
CN202211128971.5 2022-09-16

Publications (1)

Publication Number Publication Date
WO2024055700A1 true WO2024055700A1 (en) 2024-03-21

Family

ID=84468225

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/104167 WO2024055700A1 (en) 2022-09-16 2023-06-29 Plastic packaging module, plastic packaging method and electronic device

Country Status (2)

Country Link
CN (1) CN115497889A (en)
WO (1) WO2024055700A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115497889A (en) * 2022-09-16 2022-12-20 华为数字能源技术有限公司 Plastic package module, plastic package method and electronic equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
CN104952824A (en) * 2015-05-07 2015-09-30 嘉兴斯达微电子有限公司 Laser resistance welding power module
CN113794461A (en) * 2021-09-13 2021-12-14 江苏卓胜微电子股份有限公司 Module chip packaging structure and circuit board
CN115497889A (en) * 2022-09-16 2022-12-20 华为数字能源技术有限公司 Plastic package module, plastic package method and electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5650595A (en) * 1995-05-25 1997-07-22 International Business Machines Corporation Electronic module with multiple solder dams in soldermask window
CN104952824A (en) * 2015-05-07 2015-09-30 嘉兴斯达微电子有限公司 Laser resistance welding power module
CN113794461A (en) * 2021-09-13 2021-12-14 江苏卓胜微电子股份有限公司 Module chip packaging structure and circuit board
CN115497889A (en) * 2022-09-16 2022-12-20 华为数字能源技术有限公司 Plastic package module, plastic package method and electronic equipment

Also Published As

Publication number Publication date
CN115497889A (en) 2022-12-20

Similar Documents

Publication Publication Date Title
US8003415B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing
WO2024055700A1 (en) Plastic packaging module, plastic packaging method and electronic device
KR20000062265A (en) Printed wiring board and method of manufacturing the same
JP3390661B2 (en) Power module
CN116053144A (en) Power module and packaging method thereof
JP2005056944A (en) Electronic circuit device
WO2022249808A1 (en) Semiconductor device
CN216413057U (en) Semiconductor circuit having a plurality of transistors
CN112038245A (en) Connection process of internal binding line of power module
CN112447633A (en) Heat dissipation device and electronic device comprising same
JP2005051204A (en) Module for mounting electrical component and method for manufacturing the same
CN217334056U (en) Semiconductor circuit module
WO2022249813A1 (en) Semiconductor device
CN216563126U (en) Semiconductor circuit with a voltage regulator circuit
WO2022249810A1 (en) Semiconductor device
WO2022249805A1 (en) Semiconductor device
WO2022249814A1 (en) Semiconductor device
WO2022249806A1 (en) Semiconductor device
WO2022249807A1 (en) Semiconductor device
WO2022249804A1 (en) Semiconductor device
WO2022249809A1 (en) Semiconductor device
WO2022249811A1 (en) Semiconductor device
WO2022249803A1 (en) Semiconductor device
JP3281864B2 (en) Manufacturing method of hybrid integrated circuit device
CN114038806A (en) Semiconductor circuit and method for manufacturing semiconductor circuit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23864439

Country of ref document: EP

Kind code of ref document: A1