WO2024051603A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2024051603A1
WO2024051603A1 PCT/CN2023/116545 CN2023116545W WO2024051603A1 WO 2024051603 A1 WO2024051603 A1 WO 2024051603A1 CN 2023116545 W CN2023116545 W CN 2023116545W WO 2024051603 A1 WO2024051603 A1 WO 2024051603A1
Authority
WO
WIPO (PCT)
Prior art keywords
area
antenna
electronic device
frame
circuit board
Prior art date
Application number
PCT/CN2023/116545
Other languages
English (en)
French (fr)
Other versions
WO2024051603A9 (zh
Inventor
殷明
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Publication of WO2024051603A1 publication Critical patent/WO2024051603A1/zh
Publication of WO2024051603A9 publication Critical patent/WO2024051603A9/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/58—Electric connections to or between contacts; Terminals
    • H01H1/5805—Connections to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/14—Operating parts, e.g. push-button
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/20—Driving mechanisms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H04M1/236—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof including keys on side or rear faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to an electronic equipment.
  • the high-speed electronic devices inside them may generate high-frequency noise when working.
  • the frequency of the high-frequency electromagnetic waves generated by the high-speed electronic devices falls within the communication frequency band of the antenna, a coupling phenomenon will occur. At this time, , will cause interference to the signal transmitted by the antenna, thereby affecting the performance of the antenna.
  • Embodiments of the present application provide an electronic device for solving the problem of internal coupling phenomena in electronic products, causing interference to antenna signals and thereby affecting antenna performance.
  • An embodiment of the present application provides an electronic device, including a middle frame, a display module, a circuit board, an antenna and a connection structure.
  • the middle frame is provided with connection holes.
  • the display module is located on one side of the middle frame and is stacked with the middle frame.
  • the circuit board is arranged on the side of the middle frame away from the display module.
  • the antenna is arranged on the middle frame.
  • the antenna includes a radiator.
  • the radiator has a feed point and a ground point. The midpoint of the portion of the radiator between the feed point and the ground point is the reference point.
  • connection structure is electrically connected to the circuit board, and the other end of the connection structure passes through the connection hole and is electrically connected to the display module.
  • a connection hole is provided in the first area on the middle frame.
  • the connection hole can allow the connection structure to pass through and connect the circuit boards and display modules on both sides of the middle frame; due to the first
  • the area is located in the range of 1/4 times the wavelength to 3/4 times the wavelength from the reference point of the antenna on the middle frame, and the weak area of the electromagnetic field emitted by the antenna is in this first area. Since the distribution of the electromagnetic field gradually increases, and then gradually weakened. Therefore, the weak area of the electromagnetic field in the first area and the intensity of the electromagnetic field in the nearby area are both weak.
  • the connection hole is opened in the first area, it is beneficial to reduce the coupling efficiency of the high-frequency noise generated by the antenna and the connection structure. , which can reduce the interference to the antenna signal, which is beneficial to optimizing the antenna performance.
  • the antenna includes a GPS antenna.
  • the frequency range of the antenna is 700MHz ⁇ 1GHz.
  • the electronic device further includes a battery
  • the battery is disposed on a side of the middle frame away from the display module, and the vertical projection of the battery on the middle frame covers the first area. That is, the connection hole is opened in the area of the middle frame corresponding to the battery, so that it will not affect the installation of the circuit board and other electronic components.
  • the area on the middle frame that is within the range of 1/8 times the wavelength to 5/8 times the wavelength from the edge of the battery close to the circuit board is the first sub-region.
  • the area is located in the first area, and the connecting hole is opened in the first sub-area. In this way, the scope of the first region can be further reduced, from It is ensured that the electromagnetic field distributed in the first sub-region is relatively weak.
  • the first area has a second sub-area, and the connection hole is opened in the second sub-area.
  • the first area In a plane parallel to the middle frame, the first area is close to the edge of the circuit board and the battery is close to the circuit board.
  • the distance between the edge of the second sub-region away from the circuit board and the edge of the battery away from the circuit board is L2, where L2 ⁇ 15 mm.
  • the electromagnetic field formed by the antenna inside the electronic device has a second area.
  • the intensity of the electromagnetic field distributed in the second area is smaller than the intensity of the electromagnetic field distributed in areas other than the second area.
  • the vertical projection of the second area on the middle frame Located in the first area, the connection hole is opened in the vertical projection of the second area on the middle frame. Since the intensity of the electromagnetic field distributed in the second area is smaller than the intensity of the electromagnetic field outside the second area, the second area is a weak area of the electromagnetic field. In this way, opening the connection hole in the second area can further reduce the coupling efficiency between the antenna and high-frequency noise, thereby further reducing interference to the antenna signal.
  • connection hole is opened at a position where the vertical projection of the second region on the middle frame coincides with the vertical projection of the connecting structure on the middle frame. That is to say, the connecting structure can be moved along the width direction of the middle frame according to the usage requirements. No matter where the connecting structure is set, it will have an area that overlaps with the projection of the above-mentioned second area on the middle frame. Therefore, the connecting hole is opened in At the overlapping position of the projections, it can be ensured that the part of the connection structure that passes through the connection hole is located in the weak area of the electromagnetic field, thereby reducing the coupling effect between the high-frequency noise signal generated by the connection structure and the electromagnetic field.
  • the middle frame includes a middle panel and a border.
  • the connection hole is opened in the middle plate, and the middle plate is fixed in the frame; the antenna is arranged on the frame.
  • the frame includes a first part, a second part and two third parts. The first part and the second part are distributed on both sides of the middle plate along the length direction, and the first part is arranged on the upper side of the middle plate, and the two third parts are arranged on the middle part. Both sides of the board along its width. In this way, the antennas can be placed at different positions on the frame, which is helpful for adapting to different usage scenarios.
  • the antenna is disposed on the first part, and the radiator forms part of the frame. That is, a frame antenna is formed on the top of the frame.
  • the antenna is disposed on the inner wall of the first part. Under this structure, it is beneficial to reduce process difficulty and improve process efficiency.
  • the antenna is disposed at one end of the third part close to the first part, and the radiator forms part of the frame. In this way, the frame antenna can be placed on the top side of the frame.
  • the antenna is disposed at an end of the third part close to the first part, and the antenna is disposed on the inner wall of the third part. Under this structure, it is beneficial to reduce process difficulty and improve process efficiency.
  • Figure 1 is a structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 2 is an exploded view of an electronic device provided by an embodiment of the present application.
  • Figure 3 is a cross-sectional view of an electronic device provided by an embodiment of the present application.
  • Figure 4 is a structural diagram of the first area on the midboard of the electronic device provided by the embodiment of the present application.
  • Figure 5 is a structural diagram of the first sub-region on the mid-board of the electronic device provided by the embodiment of the present application.
  • Figure 6 is a structural diagram of yet another first area on the midboard of the electronic device provided by the embodiment of the present application.
  • Figure 7 is a distribution effect diagram of the electromagnetic field inside the electronic device provided by the embodiment of the present application.
  • Figure 8 is another distribution effect diagram of the electromagnetic field inside the electronic device provided by the embodiment of the present application.
  • Figure 9 is another distribution effect diagram of the electromagnetic field of the electronic device provided by this application.
  • Figure 10 is a graph of noise current simulation results of the electronic device shown in Figure 9;
  • Figure 11 is another distribution effect diagram of the electromagnetic field inside the electronic device provided by the embodiment of the present application.
  • FIG. 12 is a graph of noise current simulation results of the electronic device shown in FIG. 11 .
  • first”, “second”, etc. are used for descriptive purposes only and shall not be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined by “first,” “second,” etc. may explicitly or implicitly include one or more of such features.
  • connection should be understood in a broad sense.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection or a detachable connection. Can be connected indirectly through intermediaries.
  • the electronic device may be a portable electronic device or other types of electronic devices.
  • the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, an augmented reality device Augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses or VR helmets, etc.
  • PDA personal digital assistant
  • AR Augmented reality
  • VR virtual reality
  • the following examples take the electronic device as a mobile phone as an example.
  • FIG. 1 is a structural diagram of the electronic device 10 provided by the embodiment of the present application.
  • the electronic device 10 is a mobile phone, and the electronic device 10 may be approximately in the shape of a rectangular plate.
  • an XYZ coordinate system is established, defining the width direction of the electronic device 10 as the X-axis direction, the length direction of the electronic device 10 as the Y-axis direction, and the thickness direction of the electronic device 10 as Z-axis direction.
  • the coordinate system of the electronic device 10 can be flexibly set according to actual needs. Please only give one example and cannot be considered as a special limitation on this application.
  • FIG. 2 is an exploded view of the electronic device 10 provided in this embodiment of the present application.
  • the above-mentioned electronic device 10 may include a display module 100, a housing 200, a main circuit board 300, a secondary circuit board 400, a battery 500 and an antenna 600.
  • the above-mentioned display module 100 is used to display images, videos, etc.
  • the display module 100 may include a light-transmitting cover 110 and a display screen 120 .
  • the light-transmitting cover 110 and the display screen 120 are stacked, and the two can be fixed by optical glue.
  • the light-transmitting cover 110 can be an ordinary light-transmitting cover 110 to protect the display screen 120 to prevent damage to the display screen 120 due to external force collision and to prevent dust; a transparent cover with a touch function can also be used.
  • the optical cover 110 is provided so that the electronic device 10 has a touch function, thereby making it more convenient for users to use. Therefore, this application does not specifically limit the specific material of the light-transmitting cover 110 .
  • the display screen 120 may be a flexible display screen or a rigid display screen.
  • the display screen 120 may be an organic light-emitting diode (OLED) display screen, an active matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED).
  • OLED organic light-emitting diode
  • AMOLED active-matrix organic light-emitting diode
  • Display screen mini organic light-emitting diode display screen, micro light-emitting diode display screen, micro organic light-emitting diode display screen, quantum dot light-emitting diode ( quantum dot light emitting diodes (QLED) display, or liquid crystal display (LCD), etc.
  • QLED quantum dot light-emitting diodes
  • LCD liquid crystal display
  • the above-mentioned housing 200 is used to protect the electronic components inside the electronic device 10 .
  • the casing 200 may include a back cover 210 and a frame 220.
  • the back cover 210 is located on the side of the display screen 120 away from the light-transmitting cover 110, and is stacked and spaced apart from the light-transmitting cover 110 and the display screen 120.
  • the frame 220 is located on the side of the light-transmitting cover 110. between the cover 110 and the back cover 210 .
  • the frame 220 is fixed on the back cover 210.
  • the frame 220 can be fixed on the back cover 210 by bonding, snapping, welding or threaded connection.
  • the frame 220 can also be an integrally formed structure with the back cover 210, that is, The frame 220 and the back cover 210 are an integral structural member.
  • the light-transmitting cover 110 can be fixed on the frame 220 through adhesive, so that the light-transmitting cover 110 , the back cover 210 and the frame 220 form an internal accommodation space of the electronic device 10 .
  • the above-mentioned display screen 120, main circuit board 300, auxiliary circuit board 400 and battery 500 are all arranged in the internal accommodation space.
  • the materials of the frame 220 and the back cover 210 include but are not limited to metal, ceramics, plastic, and glass, and the materials of the frame 220 and the back cover 210 may be the same or different. Therefore, the embodiments of the present application do not impose special limitations on this.
  • the above-mentioned housing 200 may further include a middle plate 230 .
  • the middle plate 230 is disposed in the above-mentioned internal accommodation space, and the middle plate 230 is located on the side of the display screen 120 away from the light-transmitting cover 110 .
  • the middle plate 230 is fixedly connected to the frame 220.
  • the middle plate 230 and the frame 220 can be fixedly connected by gluing, snapping, welding or threaded connection.
  • the middle plate 230 and the frame 220 can also be integrally formed.
  • the structure, that is, the middle panel 230 and the frame 220 form an integral structural member, that is, the middle frame.
  • the middle plate 230 divides the above-mentioned internal accommodation space into two mutually independent spaces.
  • a space is located between the above-mentioned light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located in this space.
  • Another space is located between the middle panel 230 and the back cover 210 , and the main circuit board 300 , the secondary circuit board 400 and the battery 500 are all disposed in this space.
  • the above-mentioned main circuit board 300 is used for arranging electronic components of the electronic device 10 and realizing electrical connections between the electronic components.
  • the electronic components can be control chips (such as system on chip, SOC), graphics control chips (graphics processing unit, GPU), universal memory (universal flash storage, UFS), camera modules and flashlights. Modules etc.
  • the main circuit board 300 can be fixed on the middle plate 230 through threaded connection, gluing, clamping or welding.
  • the main circuit board 300 may be a rigid circuit board, a flexible circuit board, or a soft-hard structure circuit board. Therefore, the embodiments of the present application do not impose special limitations on this.
  • the above-mentioned secondary circuit board 400 and the main circuit board 300 are distributed along the Y-axis direction.
  • the secondary circuit board 400 can be fixed on the middle board 230, and the secondary circuit board 400 and the main circuit board 300 can be connected through a connector.
  • the connection The component can be a flexible printed circuit (FPC); it can also be a wire or enameled wire.
  • the secondary circuit board 400 can be fixed on the middle plate 230 by snapping, gluing, welding, or threaded connection.
  • the secondary circuit board 400 may be a rigid circuit board, a flexible circuit board, or a soft-hard structure circuit board.
  • the secondary circuit board 400 and the main circuit board 300 can be made of the same material or different materials.
  • the secondary circuit board 400 is integrated with a serial bus (universal serial bus, USB) device.
  • the USB device 410 can be a USB type-C interface device, a USB type-A interface device, a USB type Micro-B interface device or a USB type-B interface device.
  • a socket 221 is provided on the frame 220 at a position corresponding to the USB device 410. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device 410 through the socket 221 to realize the transmission of power, signals, and data.
  • the above-mentioned battery 500 is fixed in the internal accommodation space of the electronic device 10 .
  • the battery 500 is located between the main circuit board 300 and the secondary circuit board 400 .
  • the battery 500 is used to provide power to the main circuit board 300, the secondary circuit board 400, the display module 100 and other electronic components.
  • the battery 500 may include, but is not limited to, a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery, or other types of batteries containing bare cells. Moreover, in the battery 500 device provided by the embodiment of the present application, the number of batteries 500 may be one or multiple. The specific number and arrangement of the batteries 500 can be set according to actual needs. Therefore, the embodiments of the present application do not impose special limitations on this.
  • the above-mentioned antenna 600 is used to receive or transmit signals for the electronic device 10 .
  • the antenna 600 may include a communication antenna, a Bluetooth antenna, a WIFI antenna, a GPS antenna, etc.
  • the antenna 600 may be disposed on the frame 220 or inside the casing 200 .
  • the above-mentioned antenna 600 is a GPS antenna, and the antenna 600 is disposed on the frame 220 and is located on the top of the frame 220 .
  • the frame 220 may include a first part 220a, a second part 220b, and two third parts 220c.
  • the first part 220a is a part of the frame 220 that is provided along the X-axis direction and is disposed on the top of the electronic device 10.
  • 220b is the bottom end of the frame 220 which is arranged along the X-axis direction and is arranged on the bottom of the electronic device 10.
  • Two third parts 220c are arranged along the Y-axis direction and is arranged between the first part 220a and the second part 220b. part.
  • the above-mentioned antenna 600 may be disposed on the first part 220a of the frame 220. It may also be disposed near the end of the first part 220a of the third part 220c of the frame 220. Therefore, when the antenna 600 transmits a signal, an electromagnetic field will be formed inside the housing 200 . Furthermore, the radiator of the antenna 600 may form a frame A part of 220 forms the frame antenna. The antenna 600 can also be disposed on the inner wall of the frame 220 . Therefore, this application does not specifically limit the specific arrangement form of the antenna 600 .
  • the antenna 600 shown in FIG. 2 is disposed at the first part 220a and forms the above-mentioned frame antenna. The following uses this structure as an example for description.
  • connection structure may include an FPC board 700. Therefore, please refer to Figure 3.
  • Figure 3 is a cross-sectional view of the electronic device 10 provided by the embodiment of the present application.
  • a connection hole 234 can be provided on the middle plate 230. The connection hole 234 is used for the FPC board 700 to pass through, so that the FPC board One end of the FPC board 700 is electrically connected to the display screen 120 , and the other end of the FPC board 700 is electrically connected to the main circuit board 300 .
  • the middle plate 230 can be divided into three parts, which are formed by the vertical projection of the main circuit board 300 on the middle plate 230.
  • the above-mentioned connection holes 234 are generally opened in the battery area 232 .
  • connection hole 234 can be opened at the edge of the above-mentioned battery area 232 close to the mainboard area 231, which can ensure the largest bonding area between the battery 500 and the middle plate 230, thereby helping to increase the adhesion of the overall structure. connection strength.
  • connection hole 234 can also be opened at the edge of the battery area 232 close to the sub-board area 233, so that the distance between the FPC board 700 located in the connection hole 234 on the middle plate 230 and the antenna 600 can be maximized.
  • the portion of the FPC board 700 that passes through the connection hole 234 (hereinafter referred to as the bending section 700a) needs to be bent along the Z-axis direction due to the structure of the bending section 700a. Therefore, the structure of the bending section 700a is not suitable.
  • the electromagnetic waves emitted by the bending section 700a are evenly distributed, so that the electromagnetic waves emitted by the bending section 700a are easily coupled with the electromagnetic field generated by the antenna 600.
  • the intensity of the electromagnetic field formed by the antenna 600 is different in various areas inside the electronic device 10 , and the above-mentioned two locations where the connection holes 234 are opened are located in areas where the intensity of the electromagnetic field formed by the antenna 600 is relatively strong. Therefore, it is easy for the electromagnetic waves emitted by the FPC board 700 to couple with the electromagnetic field generated by the antenna 600 , thus affecting the performance of the antenna 600 .
  • Figure 4 is a structural diagram of the first area 235 on the middle plate 230 of the electronic device 10 provided by the embodiment of the present application.
  • the middle plate 230 can be applied to the above-mentioned electronic device 10, and, as The above antenna 600 is a GPS antenna as an example for detailed description.
  • the above-mentioned middle plate 230 is fixed in the frame 220 , and the antenna 600 is disposed on the first part 220 a of the frame 220 , that is, the antenna 600 is disposed on the top of the electronic device 10 .
  • the antenna 600 includes a radiator.
  • the radiator has a feed point and a ground point, and the midpoint of the line connecting the feed point and the ground point on the radiator is the reference point.
  • a first region 235 is formed on the middle plate 230 .
  • the first region 235 is a region along the Y-axis direction and is within a range of 1/4 times the wavelength to 3/4 times the wavelength from the reference point.
  • the above-mentioned connection holes 234 are opened. within the first area 235. It should be noted that this wavelength is the wavelength of the antenna 600 .
  • the weak area of the electromagnetic field generated by the antenna 600 is located in the first area 235, and the distribution of the electromagnetic field gradually increases and then weakens. Therefore, the weak area of the electromagnetic field located in the first area 235 and the electromagnetic field in the surrounding area are relatively weak, that is, the overall intensity of the electromagnetic field distributed in the first area 235 is weak.
  • the bending section 700a of the FPC board 700 can be located in an area with weak electromagnetic field intensity, which is beneficial to weakening the electromagnetic radiation emitted by the bending section 700a of the FPC board 700.
  • the coupling effect between electromagnetic waves and the electromagnetic field generated by the antenna 600 is beneficial to reducing interference to the antenna 600 to ensure the performance of the antenna 600.
  • the antenna 600 shown in Figure 4 is a frame antenna, and the specific location of the above-mentioned reference point is not shown in the figure. However, the first area is defined based on the above-mentioned reference point and cannot be defined based on the figure. The limits are based on the inner wall of the frame shown in .
  • FIG. 5 is a structural diagram of the first sub-region 235 a on the middle panel 230 of the electronic device 10 according to the embodiment of the present application.
  • the range of the first sub-region 235 a may be an upper distance from the battery region 232 .
  • the edge (that is, the edge where the battery area 232 and the mainboard area 231 are connected) is an area of 1/8 times to 5/8 times the wavelength, and the first sub-area 235a is located in the above-mentioned first area 235, and the connection hole 234 is opened in within the first sub-region 235a.
  • the connection hole 234 is located in the battery area 232, which will not affect the installation of the above-mentioned main circuit board 300 and the auxiliary circuit board 400, as well as the installation of electronic components on the main circuit board 300; on the other hand, it also It can be ensured that the weak area of the electromagnetic field is located within the battery area 232 .
  • the above-mentioned antenna 600 may also be an antenna with a frequency in the range of 700 MHz to 1 GHz.
  • the interference to the antenna 600 can also be reduced. Therefore, the embodiment of the present application does not specifically limit the specific type of the antenna 600 .
  • FIG. 6 is a structural diagram of the second sub-region 235b on the midplane 230 of the electronic device 10 according to an embodiment of the present application.
  • the above-mentioned antenna 600 is a GPS antenna 600, and the working frequency of the GPS antenna 600 is 1.5754GHz, and its corresponding 1/4 wavelength is about 4.76cm. Therefore, a second sub-region 235b can also be formed in the above-mentioned first area 235. , excluding the length of the mainboard area 231 along the Y-axis direction, the distance between the upper edge of the second sub-area 235b (that is, the edge close to the mainboard area 231) and the upper edge of the battery area 232 is L1, where L1 ⁇ 25mm.
  • the distance between the lower edge of the second sub-region 235b (the edge close to the sub-plate area 233) and the lower edge of the battery area 232 (that is, the edge where the battery area 232 and the sub-plate area 233 are connected) is L2, where , L2 ⁇ 15mm.
  • L1 can be 26mm, 27mm, 28mm, 29mm, 30mm, 31mm, 32mm, 33mm, 34mm, 35mm, 38mm, 40mm, etc.
  • L2 can be 16mm, 17mm, 18mm, 19mm, 20mm, 22mm, 25mm, etc.
  • the two sub-regions 235b can be formed by any combination of the above to form its limited range. Therefore, this application does not impose special limitations on this.
  • L1 and L2 are the distances from the geometric center of the connection hole 234 to the edge of the battery area 232.
  • L1 and L2 are The distance from the intersection of the two diagonals of the rectangular hole to the edge of the battery area 232; when the connection hole 234 is a round hole, L1 and L2 are the distances from the center of the circular hole to the edge of the battery area 232 .
  • FIG. 7 is a distribution effect diagram of the electromagnetic field inside the electronic device 10 provided by the embodiment of the present application.
  • the electromagnetic field formed by the above-mentioned antenna 600 inside the electronic device 10 has a second area 236, and the magnetic field intensity of the second area 236 is smaller than the magnetic field intensity of areas other than the second area 236, that is, the second area 236 is a weak area of the electromagnetic field, and
  • the vertical projection of the second area 236 on the middle panel 230 is located in the first area 235 , and the connecting hole 234 is opened in the vertical projection of the second area 236 on the middle panel 230 .
  • the position of the wave node of the traveling standing wave is the area with the weakest electromagnetic field intensity, that is, the above-mentioned second area 236.
  • connection hole 234 can be located in the area with the weakest electromagnetic field intensity, thereby further reducing the friction between the bending section 700a of the FPC board 700 and the antenna 600.
  • the coupling effect of the electromagnetic field can further reduce interference to the antenna 600 .
  • the antenna 600 may be disposed at different positions along the X-axis direction of the first part 220 a of the frame 220 . This will cause the position of the second area 236 to change. Therefore, the connection hole 234 can be opened at a position where the vertical projection of the second region 236 on the middle plate 230 coincides with the vertical projection of the FPC board 700 on the middle plate 230 .
  • the extension direction of the second region 236 forms an angle with the X-axis direction, that is, as shown in FIG. It gradually extends from left to right to the lower right.
  • the connection hole 234 may be opened in the overlapping area of the second area 236 shown in the figure and the vertical projection of the FPC board 700 on the middle board 230 (ie, in the XY plane).
  • the second area 236 extends obliquely in the XY plane, when the installation position of the FPC board 700 moves along the X-axis direction, the position of the connecting hole 234 needs to move along the extension direction of the second area 236. That is, the connecting hole 234 will move in the Y-axis direction while moving in the X-axis direction.
  • FIG. 8 is another distribution effect diagram of the electromagnetic field inside the electronic device 10 provided by the embodiment of the present application.
  • the above-mentioned antenna 600 can also be disposed at the position as shown in the figure (the upper right corner of the XY plane). In this case, the extending direction of the second region 236 is opposite to the direction shown in the figure, that is, gradually extending from right to left to the lower left.
  • the antenna 600 may also be disposed in the middle of the first part 220a of the frame 220. In this case, the second area 236 may extend along the X-axis direction.
  • the electromagnetic waves emitted by the bent section 700a of the FPC board 700 couple with the electromagnetic field generated by the antenna 600, thereby causing interference to the antenna 600.
  • the intensity of the electromagnetic field received by the antenna 600 when the FPC board 700 is excited is the same as the intensity of the electromagnetic field received by the FPC board 700 when the antenna 600 is excited. Therefore, during the production process, by stimulating the port of the sensitive antenna 600 (for example, the GPS antenna 600) and then observing the intensity of the electromagnetic field in each area, the intensity of interference to the antenna at different locations can be determined.
  • Figure 9 is another distribution effect diagram of the electromagnetic field of the electronic device 10 provided by this application.
  • Figure 10 is the noise current simulation result curve of the electronic device 10 shown in Figure 9. picture.
  • the antenna 600 is disposed at the upper right corner of the electronic device 10, and Figure 9 also shows the opening positions of three connection holes 234, which are the first position 234a, the second position 234b and the third position along the Y-axis direction.
  • Three positions 234c are the first position 234a is located on the upper side of the first area 235
  • the second position 234b is located within the first area 235, and is located at a position where the second area 236 coincides with the vertical projection of the FPC board 700 on the middle board 230.
  • the third position 234c is located below the first area 235.
  • Table 1 The noise current simulation results are shown in Table 1.
  • the noise current at the second position 234b is the lowest, that is, the electromagnetic compatibility performance at the second position 234b is optimal. It can be seen that opening the connection hole 234 at the position with the weakest electromagnetic field distribution can obtain The best electromagnetic compatibility performance, therefore, is beneficial to reducing interference to the antenna 600 to improve the sensitivity of the antenna 600.
  • Figure 11 is another distribution effect diagram of the internal electromagnetic field of the electronic device 10 provided by the embodiment of the present application.
  • Figure 12 is the noise of the electronic device 10 shown in Figure 11.
  • Current simulation result graph In Figure 11, the antenna 600 is disposed at the upper left corner of the electronic device 10. The edge where the battery area 232 and the motherboard area 231 are connected is used as the reference edge, and five locations 20mm, 35mm, 50mm, 65mm and 80mm away from the reference edge are respectively detected.
  • the noise current magnitudes of the positions (respectively represented as position one 234d, position two 234e, position three 234f, position four 234g, and position five 234h in Figure 11).
  • the original position of the connection hole 234 of the related technology is located 20mm away from the reference edge. Compared with the original position, the other positions are moved downwards by 15mm, 30mm, 45mm and 60mm respectively, and are 50mm away from the reference edge (compared to the original position).
  • the position shifted by 30 mm) is located in the above-mentioned second area 236, that is, it is located in the weak area of the electromagnetic field.
  • the noise current simulation results are shown in Table 2.
  • the noise current is smallest at the position of the weak area of the electromagnetic field, that is, 50mm away from the reference edge (position three 234f), so that the best electromagnetic compatibility performance can be obtained. Opening the connection hole 234 at this position can The interference caused by the uneven electromagnetic waves emitted by the bent section 700a of the FPC board 700 to the antenna 600 is minimized, thereby improving the sensitivity of the antenna 600.
  • opening the above-mentioned connection hole 234 in the second area 236, that is, the weak area of the electromagnetic field is beneficial to reducing the coupling effect between the electromagnetic wave emitted by the bent section 700a of the FPC board 700 and the electromagnetic field generated by the antenna 600, thereby achieving It is beneficial to reduce interference to the antenna 600 to improve the performance of the antenna 600.

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Abstract

本申请提供一种电子设备，涉及电子设备技术领域。用于解决电子产品内部因耦合现象，导致对天线信号产生干扰的问题。上述电子设备包括中框、显示模组、电路板、天线以及连接结构。中框上开设有连接孔。显示模组位于中框的一侧，并与中框层叠设置。电路板设置于中框远离显示模组的一侧。天线设置于中框上，天线包括辐射体，辐射体具有馈电点和接地点，辐射体上位于馈电点和接地点之间的部分的中点为参考点，沿中框的长度方向，中框上距离参考点在1/4倍波长～3/4倍波长范围内的区域为第一区域，连接孔开设于第一区域内。连接结构，连接结构的一端与电路板电连接，连接结构的另一端穿过连接孔，并与显示模组电连接。

Description

一种电子设备
本申请要求于2022年9月8日提交国家知识产权局、申请号为202211095621.3、发明名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电子设备。
背景技术
在现有的电子产品中，其内部的高速电子器件工作时或产生高频噪声，当高速电子器件产生的高频电磁波的频率落在天线的通讯频带内时，则会发生耦合现象，此时，会对天线发射的信号产生干扰，从而影响天线的性能。
发明内容
本申请实施例提供一种电子设备，用于解决电子产品内部引耦合现象，导致对天线信号产生干扰，从而影响天线性能的问题。
为达到上述目的，本申请的实施例采用如下技术方案：
[根据细则91更正 16.01.2024]
本申请实施例提供了一种电子设备，包括中框、显示模组、电路板、天线以及连接结构。中框上开设有连接孔。显示模组位于中框的一侧，并与中框层叠设置。电路板设置于中框远离显示模组的一侧。天线设置于中框上，天线包括辐射体，辐射体具有馈电点和接地点，辐射体上位于馈电点和接地点之间的部分的中点为参考点，沿中框的长度方向，中框上距离参考点在1/4倍波长～3/4倍波长范围内的区域为第一区域，连接孔开设于第一区域内。连接结构的一端与电路板电连接，连接结构的另一端穿过连接孔，并与显示模组电连接。
本申请实施例提供的电子设备，在中框上的第一区域内开设连接孔，该连接孔可以使连接结构穿过，并且连接中框两侧的电路板和显示模组；由于该第一区域位于中框上距离天线的参考点1/4倍波长～3/4倍波长范围内，而天线发出的电磁场的弱区处于该第一区域内，又由于电磁场的分布是逐渐增强，然后逐渐减弱的。因此，第一区域内的电磁场的弱区以及附近区域的电磁场的强度均较弱，将连接孔开设于该第一区域内时，有利于降低天线与连接结构产生的高频噪声发生耦合的效率，从而能够减小对天线信号的干扰，进而有利于优化天线性能。
本申请的一些实施例中，天线包括GPS天线。
本申请的一些实施例中，天线的频率范围为700MHz～1GHz。
本申请的一些实施例中，电子设备还包括电池，电池设置于中框远离显示模组的一侧，电池在中框上的垂直投影覆盖第一区域。即连接孔开设于中框对应电池的区域，这样一来，则不会影响电路板的安装以及其他电子元器件的安装。
本申请的一些实施例中，沿中框的长度方向，中框上距离电池靠近电路板的边沿在1/8倍波长～5/8倍波长范围内的区域为第一子区域，第一子区域位于第一区域内，且连接孔开设于第一子区域内。这样一来，能够进一步缩小第一区域的范围，从 而确保第一子区域内分布的电磁场相对较弱。
本申请的一些实施例中，第一区域内具有第二子区域，连接孔开设于第二子区域内，在平行于中框的平面内，第一区域靠近电路板的边沿与电池靠近电路板的边沿之间的距离为L1，其中，L1≥25mm。通过该距离则能够精确确定第二子区域的上边沿的位置，并且该距离是以连接孔的几何中心为基准进行测量，即当L1＝25mm，且连接孔开设于该上边沿处时，是连接孔的几何中心位于该上边沿上。
本申请的一些实施例中，在平行于中框的平面内，第二子区域远离电路板的边沿与电池远离电路板的边沿之间的距离为L2，其中，L2≥15mm。通过该距离则能够精确确定第二子区域的下边沿的位置，同样该距离是以连接孔的几何中心为基准进行测量，即当L2＝15mm，且连接孔开设于该下边沿处时，是连接孔的几何中心位于该下边沿上。
[根据细则91更正 16.01.2024]
本申请的一些实施例中，天线在电子设备内部形成的电磁场具有第二区域，第二区域分布的电磁场强度小于第二区域以外的区域分布的电磁场强度，第二区域在中框上的垂直投影位于第一区域内，连接孔开设于第二区域在中框上的垂直投影内。由于第二区域分布的电磁场强度小于第二区域以外的电磁场强度，因此，第二区域为电磁场的弱区。这样一来，将连接孔开设于该第二区域内，则能够更进一步降低天线与高频噪声发生耦合的效率，从而更进一步降低对天线信号的干扰。
本申请的一些实施例中，连接孔开设于第二区域在中框上的垂直投影，与连接结构在中框上的垂直投影的重合位置处。即连接结构可以根据使用需求，沿中框的宽度方向进行移动，不论连接结构设置于哪一个位置，均会与上述第二区域在中框上具有投影重合的区域，因此，将连接孔开设于该投影重合的位置处，即可确保连接结构穿过连接孔的部分位于电磁场的弱区，从而能够降低连接结构产生的高频噪声信号与电磁场的耦合效果。
本申请的一些实施例中，中框包括中板和边框。连接孔开设于中板上，中板固定于边框内；天线设置于边框上。边框包括第一部分、第二部分以及两个第三部分，第一部分和第二部分分布于中板沿长度方向的两侧，且第一部分设置于中板上侧，两个第三部分设置于中板沿宽度方向的两侧。这样一来，天线可以设置于边框的不同位置上，从而有利于适应不同的使用场景。
本申请的一些实施例中，天线设置于第一部分上，且辐射体形成边框的一部分。即在边框的顶部形成边框天线。
本申请的一些实施例中，天线设置于第一部分的内壁上。在该结构下，有利于降低工艺难度，提高工艺效率。
本申请的一些实施例中，天线设置于第三部分靠近第一部分的一端，且辐射体形成边框的一部分。这样一来，可以将边框天线设置于边框的侧边顶端。
本申请的一些实施例中，天线设置于第三部分靠近第一部分的一端，且天线设置于第三部分的内壁上。在该结构下，有利于降低工艺难度，提高工艺效率。
附图说明
图1为本申请实施例提供的一种电子设备的结构图；
图2为本申请实施例提供的一种电子设备的爆炸图；
图3为本申请实施例提供的电子设备的剖面图；
图4为本申请实施例提供的电子设备的中板上的第一区域的结构图；
图5为本申请实施例提供的电子设备的中板上的第一子区域的结构图；
图6为本申请实施例提供的电子设备的中板上的又一种第一区域的结构图；
图7为本申请实施例提供的电子设备内部电磁场的分布效果图；
图8为本申请实施例提供的电子设备内部电磁场的另一种分布效果图；
图9为本申请提供的电子设备的电磁场的又一种分布效果图；
图10为图9所示的电子设备的噪声电流仿真结果曲线图；
图11为本申请实施例提供的电子设备内部电磁场的又一种分布效果图；
图12为图11所示的电子设备的噪声电流仿真结果曲线图。
附图标记：10-电子设备；100-显示模组；110-透光盖板；120-显示屏；200-壳体；210-后盖；220-边框；220a-第一部分；220b-第二部分；221-插口；230-中板；231-主板区域；232-电池区域；233-副板区域；234-连接孔；235-第一区域；235a-第一子区域；235b-第二子区域；236-第二区域；300-主电路板；400-副电路板；410-USB器件；500-电池；600-天线；700-FPC板；700a-弯折段。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
此外，本申请中，“上”、“下”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连。
本申请实施例提供一种电子设备。具体地，该电子设备可以是便携式电子装置或者其他类型的电子装置。例如，电子设备可以是手机、平板电脑(tablet personal computer)、膝上型电脑(laptop computer)、个人数码助理(personal digital assistant，PDA)、个人计算机、笔记本电脑、车载设备、可穿戴设备、增强现实(augmented reality，AR)眼镜、AR头盔、虚拟现实(virtual reality，VR)眼镜或者VR头盔等等。以下为了方便说明，均是以该电子设备为手机为例进行的举例说明。
由上述可知，请参阅图1，图1为本申请实施例提供的电子设备10的结构图。在本实施例中，该电子设备10为手机，且电子设备10可以近似呈矩形板状。在此基础上，为了方便后文各实施例的描述，建立XYZ坐标系，定义电子设备10的宽度方向为X轴方向，电子设备10的长度方向为Y轴方向，电子设备10的厚度方向为Z轴方向。可以理解的是，电子设备10的坐标系可以根据实际需要进行灵活设置，本申 请仅给出了一种示例，并不能认为是对本申请构成的特殊限制。
在本实施例中，请参阅图2，图2为本申请实施例提供的电子设备10的爆炸图。上述电子设备10可以包括显示模组100、壳体200、主电路板300、副电路板400、电池500以及天线600。
上述显示模组100用于显示图像、视频等。显示模组100可以包括透光盖板110和显示屏120。具体地，透光盖板110与显示屏120层叠设置，且二者之间可以通过光学胶粘接固定。透光盖板110可以采用普通的透光盖板110，用于保护显示屏120，以避免显示屏120因外力碰撞导致损坏，并且能够起到防尘作用；也可以采用具有触控功能的透光盖板110，以使电子设备10具有触控功能，从而使用户使用更加方便。因此，本申请对于透光盖板110的具体材质不作特殊限定。
[根据细则91更正 16.01.2024]
此外，显示屏120可以采用柔性显示屏，也可以采用刚性显示屏。例如，显示屏120可以为有机发光二极管(organic light-emitting diode，OLED)显示屏，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light-emitting diode，AMOLED)显示屏，迷你发光二极管(mini organic light-emitting diode)显示屏，微型发光二极管(micro light-emitting diode)显示屏，微型有机发光二极管(micro organic light-emitting diode)显示屏，量子点发光二极管(quantum dot light emitting diodes，QLED)显示屏，或者液晶显示屏(liquid crystal display，LCD)等等。
上述壳体200用于保护电子设备10内部的电子元器件。壳体200可以包括后盖210和边框220，后盖210位于显示屏120远离透光盖板110的一侧，并与透光盖板110、显示屏120层叠且间隔设置，边框220位于透光盖板110与后盖210之间。边框220固定于后盖210上，示例性地，边框220可以通过粘接、卡接、焊接或者螺纹连接等方式固定于后盖210上，边框220也可以与后盖210为一体成型结构，即边框220与后盖210为一个结构件整体。透光盖板110可以通过胶粘固定于边框220上，以使透光盖板110、后盖210以及边框220围成电子设备10的内部容纳空间。上述显示屏120、主电路板300、副电路板400以及电池500均设置于该内部容纳空间内。
另外，上述边框220与后盖210的材质包括但不限于金属、陶瓷、塑料以及玻璃，并且边框220的材质与后盖210的材质可以相同，也可以不同。因此，本申请实施例对此不作特殊限定。
在一些实施例中，请继续参阅图2，上述壳体200还可以包括中板230。中板230设置于上述内部容纳空间内，并且中板230位于显示屏120远离透光盖板110的一侧。该中板230与边框220固定连接，示例性地，中板230与边框220之间可以通过胶粘、卡接、焊接或者螺纹连接等方式固定连接，中板230与边框220也可以为一体成型结构，即中板230与边框220形成一个结构件整体，即中框。
其中，中板230将上述内部容纳空间分隔为两个相互独立的空间。一个空间位于上述透光盖板110与中板230之间，显示屏120位于该空间内。另一个空间位于中板230与后盖210之间，上述主电路板300、副电路板400以及电池500均设置于该空间内。
上述主电路板300用于设置电子设备10的电子元器件，并实现电子元器件之间的电连接。示例性地，电子元器件可以为控制芯片(例如系统级芯片，system on chip，SOC)、图形控制芯片(graphics processing unit，GPU)、通用存储器(universal flash storage，UFS)、摄像头模组以及闪光灯模组等。
其中，主电路板300可以通过螺纹连接、胶粘、卡接或者焊接等方式固定于中板230上。主电路板300可以为硬质电路板，也可以为柔性电路板，还可以为软硬结构电路板。因此，本申请实施例对此不作特殊限定。
上述副电路板400与主电路板300沿Y轴方向分布，副电路板400可以固定于中板230上，并且副电路板400与主电路板300之间可以通过连接件连接，例如，该连接件可以为柔性电路板(flexible printed circuit，FPC)；也可以为导线或者漆包线。
具体地，副电路板400可以通过卡接、胶粘、焊接或者螺纹连接等方式固定于中板230上。副电路板400可以为硬质电路板，也可以为柔性电路板，还可以为软硬结构电路板。并且，副电路板400与主电路板300可以采用相同材质，也可以采用不同材质。
此外，副电路板400上集成有串行总线(universal serial bus，USB)器件。该USB器件410可以为USB type-C接口器件、USB type-A接口器件、USB type Micro-B接口器件或者USB type-B接口器件。并且，边框220上对应USB器件410的位置设有插口221，充电器、耳机、数据线等配件可经由该插口221与USB器件410电连接，以实现电源、信号以及数据的传输。
上述电池500固定于电子设备10的内部容纳空间内。沿Y轴方向，电池500位于主电路板300和副电路板400之间。电池500用于为主电路板300、副电路板400、显示模组100以及其他电子元器件提供电量。
其中，上述电池500可以包括但不限于镍镉电池、镍氢电池、锂电池或其他类型的包含裸电芯的电池。并且，本申请实施例提供的电池500设备中，电池500的数量可以为一个，也可以为多个。电池500的具体数量以及排布方式可以根据实际需要进行设置。因此，本申请实施例对此不作特殊限定。
上述天线600用于为电子设备10接收或者发射信号。其中，天线600可以包括通讯天线、蓝牙天线、WIFI天线、GPS天线等。并且，天线600可以设置于边框220上，也可以设置于壳体200内部。
示例性地，请继续参阅图2，上述天线600为GPS天线，且该天线600设置于边框220上，且位于边框220的顶部。具体地，该边框220可以包括第一部分220a、第二部分220b和两个第三部分220c，第一部分220a为边框220上沿X轴方向设置，且设置于电子设备10顶端的部分，第二部分220b为边框220上沿X轴方向设置，且设置于电子设备10的底部的底端，两个第三部分220c为沿Y轴方向设置，且设置于第一部分220a和第二部分220b之间的部分。
在一些实施例中，上述天线600可以设置于边框220的第一部分220a上。也可以设置于边框220的第三部分220c靠近第一部分220a端部处。因此，天线600发射信号时，会在壳体200内部形成电磁场。并且，上述天线600的辐射体可以形成边框 220的一部分，即形成边框天线。也可以将天线600设置于边框220的内壁上。因此，本申请对于天线600的具体设置形式不作特殊限定。图2中示出的天线600设置于第一部分220a处，并且形成上述边框天线。以下均以该结构为例进行说明。
上述显示屏120和主电路板300由于分别设置于中板230的两侧，并且，显示屏120与主电路板300之间通过连接结构连接，示例性地，该连接结构可以包括FPC板700。因此，请参阅图3，图3为本申请实施例提供的电子设备10的剖面图，中板230上可以开设连接孔234，该连接孔234用于供FPC板700穿过，从而使FPC板700的一端与显示屏120电连接，FPC板700的另一端与主电路板300电连接。
其中，对应主电路板300、电池500以及副电路板400在中板230上的垂直投影，可以将中板230分为三部分，分别为主电路板300在中板230上的垂直投影形成的主板区域231、电池500在中板230上的垂直投影形成的电池区域232以及副电路板400在中板230上的垂直投影形成的副板区域233。为避免影响主电路板300和副电路板400的安装以及电子元器件的安装，上述连接孔234一般开设于电池区域232内。
具体地，上述连接孔234可以开设于上述电池区域232靠近主板区域231的边沿处，这样可以确保电池500与中板230之间粘接固定的粘接面积最大，从而有利于增加整体结构的粘接强度。或者，上述连接孔234也可以开设于上述电池区域232靠近副板区域233的边沿处，这样能够使FPC板700处于中板230上的连接孔234内的部分距离天线600的距离最大。
但是，由于电子设备10的显示模组100以及主电路板300上的一些电子元器件均为高速电子器件，这些高速电子器件在工作时会产生电磁波。当这些电子元器件产生电磁波时，则会通过连接主电路板300和显示屏120的FPC板700进行传播。当FPC板700的发出的电磁波频率落入天线600的通讯频带内时，则会在壳体200内部发生耦合。这样一来，则会对天线600信号造成干扰，即对天线600接收信号的灵敏度造成影响，进而会导致天线600性能恶化。
[根据细则91更正 16.01.2024]
具体地，上述FPC板700穿过连接孔234的部分(以下称为弯折段700a)，由于弯折段700a的结构需要沿Z轴方向进行弯折，因此，导致弯折段700a的结构不均匀分布，从而使其发出的电磁波同样分布不均匀，进而导致弯折段700a发出的电磁波容易与天线600产生的电磁场发生耦合现象。
并且，经过噪声电流仿真可知，天线600形成的电磁场在电子设备10内部各个区域的强度是不同的，而上述的两个开设连接孔234的位置均位于天线600形成的电磁场的强度较强的区域内，因此，容易导致FPC板700发出的电磁波与天线600产生的电磁场发生耦合，从而会影响天线600性能。
基于此，请参阅图4，图4为本申请实施例提供的电子设备10的中板230上的第一区域235的结构图，该中板230可以应用于上述电子设备10中，并且，以上述天线600为GPS天线为例进行详细说明。
具体地，上述中板230固定于边框220内，天线600设置于边框220的第一部分220a上，即天线600设置于电子设备10的顶端。其中，天线600包括辐射体，辐射体具有馈电点和接地点，并且辐射体上的馈电点与接地点之间连线的中点为参考点， 中板230上形成有第一区域235，该第一区域235为沿Y轴方向，与上述参考点距离在1/4倍波长～3/4倍波长的范围内的区域，上述连接孔234开设于该第一区域235内。需要说明的是，该波长为天线600的波长。
经过上述噪声电流仿真可知，天线600产生的电磁场的弱区位于该第一区域235内，并且，电磁场的分布为逐步增强，然后逐步减弱。因此，以位于第一区域235内的电磁场的弱区以及周围区域的电磁场相对较弱，即在第一区域235内分布的电磁场的整体强度较弱。这样一来，将上述连接孔234开设于第一区域235内，则能够使FPC板700的弯折段700a位于电磁场强度较弱的区域内，有利于减弱FPC板700的弯折段700a发出的电磁波与天线600产生的电磁场的耦合效果，从而有利于降低对天线600的干扰，以确保天线600性能。
需要说明的是，图4中所示的天线600为边框天线，图中未示出上述参考点的具体位置，但是，该第一区域是以上述参考点为基准进行限定的，并不能以图中所示的边框内壁为基准进行限定。
此外，由于上述连接孔234的开设位置一般设置于电池500在中板230上的垂直投影区域内，即上述电池区域232内。因此，请参阅图5，图5为本申请实施例提供的电子设备10的中板230上的第一子区域235a的结构图，该第一子区域235a的范围可以为距离电池区域232的上边沿(即电池区域232与主板区域231相接的边沿)1/8倍波长～5/8倍波长的区域，且该第一子区域235a位于上述第一区域235内，且连接孔234开设于该第一子区域235a内。这样一来，一方面使连接孔234位于电池区域232内，不会影响上述主电路板300和副电路板400的安装，以及主电路板300上的电子元器件的安装；另一方面，也能够确保电磁场的弱区位于电池区域232内。
此外，上述天线600还可以是频率在700MHz～1GHz范围内的天线，通过上述结构，同样能够减小对天线600产生的干扰。因此，本申请实施例对于天线600的具体种类不作特殊限定。
在一些实施例中，请参阅图6，图6为本申请实施例提供的电子设备10的中板230上的第二子区域235b的结构图。上述天线600为GPS天线600，且GPS天线600的工作频率为1.5754GHz，其对应的1/4倍波长约为4.76cm，因此，在上述第一区域235内还可以形成有第二子区域235b，除去主板区域231沿Y轴方向的长度，该第二子区域235b的上边沿(即靠近主板区域231的边沿)与电池区域232的上边沿之间的距离为L1，其中，L1≥25mm。并且，该第二子区域235b的下边沿(靠近副板区域233的边沿)与电池区域232的下边沿(即电池区域232与副板区域233相接的边沿)之间的距离为L2，其中，L2≥15mm。
这样一来，即距离电池区域232的上边沿至少25mm处，至距离电池区域232的下边沿至少15mm处的范围内则形成第二子区域235b，连接孔234开设于该第二子区域235b内。即L1＝25mm，且L2＝15mm的范围内形成第二子区域235b，并且该尺寸形成第二子区域235b的最大范围。此外，上述L1可以为26mm、27mm、28mm、29mm、30mm、31mm、32mm、33mm、34mm、35mm、38mm、40mm等；L2可以为16mm、17mm、18mm、19mm、20mm、22mm、25mm等；第二子区域235b可以由上述任意组合形成其限定范围。因此，本申请对此不作特殊限定。
需要说明的是，上述距离L1和L2均是以连接孔234的几何中心至电池区域232的边沿之间的距离，示例性地，当连接孔234为矩形孔是时，L1和L2则为该矩形孔的两条对角线的交点至电池区域232的边沿之间的距离；当连接孔234为圆孔时，L1和L2则为该圆孔的圆心至电池区域232的边沿之间的距离。
在此基础上，请参阅图7，图7为本申请实施例提供的电子设备10内部电磁场的分布效果图。上述天线600在电子设备10内部形成的电磁场具有第二区域236，该第二区域236的磁场强度小于第二区域236以外的区域的磁场强度，即该第二区域236为电磁场的弱区，且该第二区域236在中板230上的垂直投影位于上述第一区域235内，连接孔234开设于该第二区域236在中板230上的垂直投影内。
具体来讲，即天线600在电子设备10内部发出的电磁场在传播过程中，电磁场的至少一部分会因电子设备10的壳体200内壁而发生反射，从而在电子设备10内部形成行驻波，而行驻波的波节点的位置为电磁场强度最弱的区域，即上述第二区域236。
[根据细则91更正 16.01.2024]
这样一来，将连接孔234开设于上述第二区域236内，则能够使连接孔234处于电磁场强度最弱的区域内，从而能够更进一步的降低FPC板700的弯折段700a与天线600的电磁场的耦合效果，进而能够更进一步降低对天线600的干扰。
在一些实施例中，请继续参阅图7，上述天线600可以设置于边框220的第一部分220a沿X轴方向的不同位置处，这样一来，则会导致上述第二区域236的位置发生改变。因此，可以将连接孔234开设于上述第二区域236在中板230上的垂直投影与FPC板700在中板230上的垂直投影的重合位置处。
示例性地，请继续参阅图7，当天线600设置于如图所示位置(XY平面的左上角处)时，此时，第二区域236的延伸方向与X轴方向形成夹角，即图中由左向右逐渐向右下方延伸。其中，连接孔234可以开设于图中所示的第二区域236与FPC板700在中板230(即XY平面内)的垂直投影的重合区域内。
需要说明的是，由于第二区域236在XY平面内倾斜延伸，因此，当FPC板700的设置位置沿X轴方向移动使，则连接孔234的位置需要沿第二区域236的延伸方向移动，即连接孔234会在沿X轴方向移动的同时，沿Y轴方向移动。
在另一些实施例中，请参阅图8，图8为本申请实施例提供的电子设备10内部电磁场的另一种分布效果图。上述天线600也可以设置于如图所示位置(XY平面的右上角处)，此时，第二区域236的延伸方向与图中所示方向相反，即由右向左逐渐向左下方延伸。或者，上述天线600还可以设置于边框220第一部分220a的正中间位置，此时，第二区域236可以沿X轴方向延伸。
以下对于上述连接孔234的位置的检测方法进行详细说明。
在实际存在的问题中，是FPC板700的弯折段700a发出的电磁波，与天线600产生的电磁场形成耦合，从而对天线600产生干扰的。基于互易定理分析可知，实际问题中，激励FPC板700时，天线600接收到的电磁场强度，与激励天线600时，FPC板700处接收到的电磁场强度相同。因此，在生产过程中，通过激励敏感天线600(例如，GPS天线600)的端口，然后，观察各区域内电磁场的强度大小，即可判断不同位置对天线形成干扰的强弱。
在一些示例中，请参阅图9和图10，图9为本申请提供的电子设备10的电磁场的又一种分布效果图，图10为图9所示的电子设备10的噪声电流仿真结果曲线图。图9中天线600设置于电子设备10的右上角处，并且图9中还分别示出了三个连接孔234的开设位置，沿Y轴方向分别为第一位置234a、第二位置234b以及第三位置234c。其中，第一位置234a位于第一区域235上侧，第二位置234b位于第一区域235内，且位于上述第二区域236与FPC板700在中板230上的垂直投影重合的位置处，第三位置234c位于第一区域235下侧。其噪声电流仿真结果见表1。
表1
由表1可知，位于第二位置234b处的噪声电流最低，即第二位置234b处的电磁兼容性能最优，从而可以看出，将连接孔234开设于电磁场分布最弱的位置处，能够得到最好的电磁兼容性能，因此，有利于降低对天线600的干扰，以提升天线600的灵敏度。
在另一种示例中，请参阅图11和图12，图11为本申请实施例提供的电子设备10内部电磁场的又一种分布效果图，图12为图11所示的电子设备10的噪声电流仿真结果曲线图。图11中天线600设置于电子设备10的左上角处，其中，以电池区域232与主板区域231相接的边沿为基准边沿，分别检测距离基准边沿20mm、35mm、50mm、65mm以及80mm的五个位置(图11中分别表示为位置一234d、位置二234e、位置三234f、位置四234g、位置五234h)的噪声电流大小。其中，距离基准边沿20mm处为相关技术开设连接孔234的原始位置，相比于原始位置，其余位置分别向下移动15mm、30mm、45mm以及60mm，并且距离基准边沿50mm(相比于原始位置下移30mm)的位置位于上述第二区域236内，即位于电磁场的弱区内。噪声电流仿真结果见表2。
表2
由表2可知，位于电磁场的弱区的位置，即距离基准边沿50mm处(位置三234f)的噪声电流最小，从而可以获得最好的电磁兼容性能，将连接孔234开设于该位置处，能够将FPC板700的弯折段700a发出的不均匀部分的电磁波对天线600形成的干扰降到最低，从而有利于提升天线600的灵敏度。
基于此，能够确定将上述连接孔234开设于第二区域236内，即电磁场的弱区，有利于降低FPC板700的弯折段700a发出的电磁波与天线600产生的电磁场的耦合效果，从而有利于降低对天线600的干扰，以提升天线600性能。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种电子设备，其特征在于，包括：
    中框，所述中框上具有连接孔；
    显示模组，所述显示模组位于所述中框的一侧，并与所述中框层叠设置；
    电路板，所述电路板位于所述中框远离所述显示模组的一侧；
    天线，所述天线包括辐射体，所述辐射体具有馈电点和接地点，所述馈电点和所述接地点之间包括参考点，沿所述中框的长度方向，所述中框上距离所述参考点在1/4倍波长至3/4倍波长范围内的区域为第一区域，所述连接孔位于所述第一区域内；
    连接结构，所述连接结构的一端与所述电路板电连接，所述连接结构的另一端穿过所述连接孔，并与所述显示模组电连接。
  2. 根据权利要求1所述的电子设备，其特征在于，所述天线包括GPS天线。
  3. 根据权利要求1所述的电子设备，其特征在于，所述天线的频率范围为700MHz至1GHz。
  4. 根据权利要求1～3任一项所述的电子设备，其特征在于，所述电子设备还包括：
    电池，所述电池位于所述中框远离所述显示模组的一侧，所述连接孔位于所述电池在所述中框上的垂直投影区域内。
  5. 根据权利要求4所述的电子设备，其特征在于，沿所述中框的长度方向，所述电池具有靠近所述电路板的边沿，所述中框上距离所述边沿的1/8倍波长至5/8倍波长范围内的区域为第一子区域，所述连接孔位于所述第一子区域内。
  6. 根据权利要求4所述的电子设备，其特征在于，所述第一区域内具有第二子区域，所述连接孔位于所述第二子区域内，在平行于所述中框的平面内，所述第二子区域靠近所述电路板的边沿与所述电池靠近所述电路板的边沿之间的距离为L1，其中，L1≥25mm。
  7. 根据权利要求6所述的电子设备，其特征在于，在平行于所述中框的平面内，所述第二子区域远离所述电路板的边沿与所述电池远离所述电路板的边沿之间的距离为L2，其中，L2≥15mm。
  8. 根据权利要求1～3任一项所述的电子设备，其特征在于，所述天线在所述电子设备内部形成的电磁场具有弱区，所述弱区的磁场强度小于所述弱区以外的区域分布的磁场强度，所述中板上具有第二区域，所述第二区域位于所述弱区内，所述第二区域位于所述第一区域内，所述连接孔位于所述第二区域内。
  9. 根据权利要求8所述的电子设备，其特征在于，所述连接结构在所述中框上的垂直投影区域与所述第二区域有重合区域，所述连接孔位于所述重合区域。
  10. 根据权利要求1～3任一项所述的电子设备，其特征在于，所述中框包括：
    中板，所述连接孔位于所述中板上；
    边框，所述中板位于所述边框内；所述天线位于所述边框上；所述边框包括第一部分、第二部分以及两个第三部分，所述第一部分和所述第二部分分布于所述中板沿 长度方向的两侧，且所述第一部分设置于所述中板上侧，两个所述第三部分设置于所述中板沿宽度方向的两侧。
  11. 根据权利要求10所述的电子设备，其特征在于，所述天线位于所述第一部分上，且所述辐射体形成所述边框的一部分。
  12. 根据权利要求10所述的电子设备，其特征在于，所述天线位于所述第一部分的内壁上。
  13. 根据权利要求10所述的电子设备，其特征在于，所述天线位于所述第三部分靠近所述第一部分的一端，且所述辐射体形成所述边框的一部分。
  14. 根据权利要求10所述的电子设备，其特征在于，所述天线位于所述第三部分靠近所述第一部分的一端，且所述天线位于所述第三部分的内壁上。
  15. 一种电子设备，其特征在于，包括：
    中框，所述中框包括边框和中板，所述中板固定于所述边框内，所述中板上具有连接孔；所述中板上具有第一区域，所述连接孔位于所述第一区域内，所述第一区域为所述中板上距离所述天线的1/4倍波长至3/4倍波长范围内的区域；
    显示模组，所述显示模组位于所述中板的一侧，与所述中板层叠设置；
    电路板，所述电路板位于所述中板远离所述显示模组的一侧；
    天线，所述天线设置于所述中框；
    连接结构，所述连接结构的一端与所述电路板电连接，所述连接结构的另一端穿过所述连接孔与所述显示模组电连接；
    其中，所述连接孔在所述中板上的垂直投影区域位于所述天线的行驻波的波节点附近，所述波节点位于所述第一区域内。
  16. 根据权利要求15所述的电子设备，其特征在于，所述天线包括辐射体，所述辐射体具有馈电点和接地点，所述馈电点和所述接地点之间包括参考点，所述中板上距离所述参考点的1/4倍波长至3/4倍波长范围内的区域为所述第一区域。
  17. 根据权利要求15或16所述的电子设备，其特征在于，所述天线在所述电子设备内部形成的电磁场具有弱区，所述中板上具有第二区域，所述第二区域位于所述弱区内，所述连接孔位于所述第二区域内。
  18. 根据权利要求17所述的电子设备，其特征在于，所述连接结构在所述中板上的垂直投影区域与所述第二区域有重合区域，所述连接孔位于所述重合区域。
  19. 根据权利要求17或18所述的电子设备，其特征在于，所述第二区域位于所述第一区域内。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142921A (ja) * 1993-11-15 1995-06-02 Matsushita Electric Ind Co Ltd ワイヤレスマイクロホン内蔵アンテナ
KR20080021985A (ko) * 2006-09-05 2008-03-10 엘지.필립스 엘시디 주식회사 평판 표시장치
CN214045690U (zh) * 2020-09-30 2021-08-24 荣耀终端有限公司 一种电子设备
CN113410679A (zh) * 2020-03-16 2021-09-17 华为技术有限公司 电子设备
CN113725592A (zh) * 2020-05-26 2021-11-30 Oppo广东移动通信有限公司 天线装置及电子设备
CN115175454A (zh) * 2022-09-08 2022-10-11 荣耀终端有限公司 一种电子设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080266193A1 (en) * 2007-04-30 2008-10-30 Telefonaktiebolaget L M Ericsson (Publ) Antenna
TWI391844B (zh) * 2008-08-28 2013-04-01 Ind Tech Res Inst 多維度光學控制裝置及其方法
JP4929390B1 (ja) * 2010-10-22 2012-05-09 株式会社東芝 電子機器およびアンテナユニット
US9349282B2 (en) * 2013-03-15 2016-05-24 Aliphcom Proximity sensing device control architecture and data communication protocol
CN208738416U (zh) * 2018-09-12 2019-04-12 Oppo广东移动通信有限公司 天线组件及电子设备
CN112468621B (zh) * 2020-11-26 2023-01-31 Oppo广东移动通信有限公司 电子设备
CN112542678A (zh) * 2020-11-30 2021-03-23 Oppo广东移动通信有限公司 电子设备
CN114614242B (zh) * 2020-12-08 2023-08-22 华为技术有限公司 天线装置及电子设备
CN114243256A (zh) * 2021-11-09 2022-03-25 Oppo广东移动通信有限公司 一种电子设备
CN114937867B (zh) * 2022-07-20 2022-12-23 荣耀终端有限公司 显示装置和终端设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07142921A (ja) * 1993-11-15 1995-06-02 Matsushita Electric Ind Co Ltd ワイヤレスマイクロホン内蔵アンテナ
KR20080021985A (ko) * 2006-09-05 2008-03-10 엘지.필립스 엘시디 주식회사 평판 표시장치
CN113410679A (zh) * 2020-03-16 2021-09-17 华为技术有限公司 电子设备
CN113725592A (zh) * 2020-05-26 2021-11-30 Oppo广东移动通信有限公司 天线装置及电子设备
CN214045690U (zh) * 2020-09-30 2021-08-24 荣耀终端有限公司 一种电子设备
CN115175454A (zh) * 2022-09-08 2022-10-11 荣耀终端有限公司 一种电子设备

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