WO2024051251A1 - 显示装置及其制备方法、电子设备 - Google Patents

显示装置及其制备方法、电子设备 Download PDF

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Publication number
WO2024051251A1
WO2024051251A1 PCT/CN2023/100191 CN2023100191W WO2024051251A1 WO 2024051251 A1 WO2024051251 A1 WO 2024051251A1 CN 2023100191 W CN2023100191 W CN 2023100191W WO 2024051251 A1 WO2024051251 A1 WO 2024051251A1
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WO
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Prior art keywords
substrate
light
emitting unit
display device
electrode layer
Prior art date
Application number
PCT/CN2023/100191
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English (en)
French (fr)
Inventor
黄皓
李荣荣
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惠科股份有限公司
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Publication of WO2024051251A1 publication Critical patent/WO2024051251A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1347—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
    • G02F1/13471—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells in which all the liquid crystal cells or layers remain transparent, e.g. FLC, ECB, DAP, HAN, TN, STN, SBE-LC cells
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1323—Arrangements for providing a switchable viewing angle
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133526—Lenses, e.g. microlenses or Fresnel lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the present application relates to the field of display technology, and in particular, to a display device, a preparation method thereof, and electronic equipment.
  • Display technology has always been one of the important research directions in electronic equipment. With the increasing development of display technology, various display screens have appeared, and functional modules can also be integrated on the display screens to achieve more Function. However, integrating functional modules on the display screen will inevitably bring about the problem of larger overall thickness.
  • This application discloses a display device that reduces the thickness of the display device in the stacking direction and also reduces material costs.
  • the present application provides a display device.
  • the display device includes a display module and a functional module.
  • the display module includes a first substrate and a plurality of light-emitting units.
  • the plurality of light-emitting units are disposed on the On one side of the first substrate, the light emitting direction of the light-emitting unit is toward the first substrate, and the functional module is disposed on a side surface of the first substrate away from the light-emitting unit.
  • the functional module and The light-emitting units share the first substrate, and the surface of the functional module close to the first substrate is in direct contact with the surface of the first substrate away from the light-emitting unit.
  • this application also provides a method for manufacturing a display device.
  • the method for manufacturing a display device includes:
  • a display module is provided, and the light-emitting unit of the display module is configured to be flip-chip;
  • a surface of the functional module close to the first substrate is in direct contact with a surface of the first substrate facing away from the light-emitting unit.
  • the present application also provides an electronic device.
  • the electronic device includes a housing and the display device as described in the first aspect.
  • the housing is used to carry the display device.
  • the functional module can be arranged on a side surface of the first substrate away from the light-emitting unit.
  • the functional module and the The light-emitting units share the first substrate, thereby reducing the thickness in the stacking direction of the functional module and the first substrate, and also reducing material costs.
  • FIG. 1 is a schematic top view of a display device according to the first embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view along line I-I in FIG. 1 .
  • FIG. 3 is a schematic diagram of the visible area of a possible display device in the prior art.
  • Figure 4 is a schematic cross-sectional view of a functional module provided by the first embodiment of the present application.
  • Figure 5 is a schematic cross-sectional view of a functional module provided by the second embodiment of the present application.
  • Figure 6 is a schematic cross-sectional view of a display module provided in the second embodiment of the present application.
  • FIG. 7 is a schematic top view of a display device according to a third embodiment of the present application.
  • FIG. 8 is a partial cross-sectional view along line I-I in FIG. 7 .
  • FIG. 9 is a partial enlarged schematic diagram along line I-I in FIG. 7 .
  • FIG. 10 is a schematic flowchart of a method for manufacturing a display device according to the first embodiment of the present application.
  • FIG. 11 is a schematic top view of an electronic device according to the first embodiment of the present application.
  • FIG. 1 is a schematic top view of the display device provided in the first embodiment of the present application
  • FIG. 2 is a schematic cross-sectional view along line I-I in FIG. 1.
  • the display device 1 includes a display module 11 and a functional module 12.
  • the display module 11 includes a first substrate 111 and a plurality of light-emitting units 112.
  • the plurality of light-emitting units 112 are disposed on the first substrate 111.
  • the light emitting direction of the light-emitting unit 112 faces the first substrate 111
  • the functional module 12 is disposed on a side surface of the first substrate 111 away from the light-emitting unit 112 .
  • the functional module 12 The first substrate 111 is shared with the light-emitting unit 112 , and the surface of the functional module 12 close to the first substrate 111 is in direct contact with the surface of the first substrate 111 away from the light-emitting unit 112 .
  • the light-emitting unit 112 usually includes a plurality of color sub-pixels.
  • the light-emitting unit 112 works to emit light and processes the light emitted by the light-emitting unit 112, thereby realizing the display function of the display module 11. .
  • the light-emitting unit 112 is disposed on one side of the first substrate 111.
  • the light-emitting direction of the light-emitting unit 112 may be a side direction away from the first substrate 111, that is, the light-emitting unit 112 is installed Arrangement; It may also be arranged as shown by the dotted arrow in FIG. 2 toward one side of the first substrate 111, that is, the light-emitting unit 112 is flip-chip mounted.
  • the plurality of light-emitting units 112 are flip-chip arranged on one side of the first substrate 111 , and may be arranged on one side surface of the first substrate 111 , or may be arranged on one side of the first substrate 111 direction, this application does not impose any restrictions on this.
  • the functional module 12 is light-transmissive, and can realize various functions by processing the light emitted by the light-emitting unit 112 .
  • the functional module 12 is a privacy-preventing liquid crystal box, by rotating the light emitted by the light-emitting unit 112 and changing the direction of the light, privacy-preventing functions at different angles can be achieved. Therefore, the functional module 12 needs to be disposed in the light emitting direction of the light emitting unit 112 .
  • the light-emitting unit 112 can be a Micro LED or a Mini LED, and the light-emitting unit 112 can directly emit light of three colors: red, blue or yellow, which is not limited in this application.
  • the light-emitting unit 112 is flip-chip mounted on one side of the first substrate 111 so that the first substrate 111 has excess space on one side of the light-emitting direction of the light-emitting unit 112 for arranging the functional module. 12, thereby realizing that the functional module 12 and the light-emitting unit 112 share the first substrate 111.
  • the functional module 12 can be arranged on the first substrate 111 away from the light-emitting unit.
  • the functional module 12 and the light-emitting unit 112 share the first substrate 111, so that in the stacking direction of the functional module 12 and the first substrate 111 (as shown in Figure 2 (shown by the middle solid arrow) reduces the thickness and also reduces the material cost.
  • the functional module 12 includes a first electrode layer 121, a functional liquid crystal layer 122, a second electrode layer 123 and a second substrate 124.
  • the first electrode layer 121 is disposed on the first substrate 111 away from the display module.
  • the first electrode layer 121 has a side surface facing away from the first substrate 111, and the second electrode layer 123 is disposed on a side surface of the functional liquid crystal layer 122 facing away from the first electrode layer 121.
  • the substrate 124 is disposed on a side surface of the second electrode layer 123 facing away from the functional liquid crystal layer 122 , and on the side of the first electrode layer 121 and the second electrode layer 123 adjacent to the functional liquid crystal layer 122 The surfaces are respectively coated with alignment materials.
  • the functional module 12 is a privacy-preventing liquid crystal cell
  • the alignment material is polyimide material.
  • the center of the functional liquid crystal layer 122 of liquid crystal molecules standing.
  • the liquid crystal molecules in the functional liquid crystal layer 122 rotate under the action of an electric field, thereby changing the emission of the light-emitting unit 112.
  • the angle at which the light emerges from the functional module 12 changes the size of the original visible area as shown in Figure 3.
  • the light emitted by the light-emitting unit 112 passes through the liquid crystal molecules in the functional liquid crystal layer 122 and is optically rotated, so that the light is concentrated. It emits light toward the visible area as shown in Figure 4, but not toward the privacy-protected area, thereby achieving the privacy-preventing function.
  • the functional module 12 can also be other devices that perform different processing on the light emitted by the light-emitting unit 112 to achieve different functions, which is not included in this application. limit.
  • FIG. 5 is a schematic cross-sectional view of a functional module provided in the second embodiment of the present application.
  • the display module 11 further includes a driving circuit 113 for driving the light-emitting unit 112 to operate.
  • the driving circuit 113 is formed on the first electrode layer 121 or the second electrode layer 123 .
  • the light-emitting unit 112 requires the driving circuit 113 to provide a driving signal to drive the light-emitting unit 112 to work.
  • the driving circuit 113 is formed on the first electrode layer 121 or the second electrode layer 123.
  • the driving circuit 113 is disposed in the display module 11, which further reduces the thickness of the display module 11 in the stacking direction (as indicated by the solid arrows in FIGS. 4 and 5).
  • the driving signal provided by the driving line 113 can be directly loaded to the first electrode layer 121; or, when the driving line 113 is formed on When the second electrode layer 123 is installed, the driving signal provided by the driving circuit 113 can be directly loaded to the second electrode layer 123 , thus saving a certain amount of circuit design.
  • the driving circuit 113 can be electrically connected to the light-emitting unit 112 by punching holes in the display area of the display module 11 , or can also be routed through the non-display area of the display module 11 .
  • the wire is electrically connected to the light-emitting unit 112, which is not limited by this application.
  • FIG. 6 is a schematic cross-sectional view of a display module provided in a second embodiment of the present application.
  • the display module 11 also includes a third substrate 114 and an array substrate 115.
  • the light-emitting unit 112 is flip-chip mounted on one side surface of the third substrate 114.
  • the array substrate 115 is mounted on the third substrate 114.
  • the array substrate 115 and the light-emitting unit 112 share the third substrate 114, and the surface of the array substrate 115 close to the third substrate 114 is in contact with the third substrate 114.
  • the surface of the substrate 114 facing away from the light-emitting unit 112 is in direct contact.
  • the display module 11 also includes an encapsulation layer 116, a frame 117, a display liquid crystal layer 118,
  • the color filter substrate 119 includes the first polarizer 11a and the second polarizer 11b.
  • the encapsulation layer 116 is used to encapsulate the light-emitting unit 112.
  • the frame 117 is used to prevent the liquid crystal in the display liquid crystal layer 118 from flowing.
  • the color filter substrate 119 is used to filter the color of the light emitted by the light-emitting unit 112.
  • the first polarizer 11a is disposed on a side surface of the array substrate 115 away from the third substrate 114 to make the light emitting
  • the light emitted by the unit 112 is polarized
  • the second polarizer 11b is disposed on a side surface of the color filter substrate 119 away from the display liquid crystal layer 118 for polarizing the light emitted by the light emitting unit 112 .
  • the light-emitting unit 112 is the light-emitting unit 112 of the backlight module in the display device 1, and the color of the light emitted by the light-emitting unit 112 is After mixing, white light is emitted.
  • a plurality of thin film transistors are provided on the array substrate 115 for selectively driving the corresponding light-emitting unit 112 to operate under the loading of the driving signal transmitted by the driving line 113 .
  • the array substrate 115 and the light-emitting unit 112 share the third substrate 114.
  • a plurality of thin film transistors are formed on the third substrate through exposure and development, coating, etching and other technical processes.
  • the side surface of the substrate 114 is away from the light-emitting unit 112 , thereby reducing the thickness of the display module 11 in the stacking direction (as shown by the solid arrow in FIG. 6 ).
  • the color filter substrate 119 is obtained by forming red/green/blue color filters on a glass substrate through technical processes such as exposure and development, coating, and etching.
  • the light-emitting unit 112 is transferred to one side surface of the third substrate 114 through mass transfer technology.
  • the encapsulation layer 116 also needs to use spontaneous blue light and Y
  • the encapsulation layer 116 is usually made of high temperature resistant and corrosion resistant materials.
  • the color filter substrate 119 and the array substrate 115 are optically aligned through Fine Seam Vertical Alignment (FSA) technology to align the gaps between the two, and when the array substrate 115 faces away from the One side surface of the third substrate 114 is adhered to the first polarizer 11a.
  • FSA Fine Seam Vertical Alignment
  • the array substrate 115 and the light-emitting unit 112 share the third substrate 114, so that when the display module 11 is manufactured in a modular manner, the light source part of the module can be omitted.
  • Its production module only needs to produce a backplane as a frame, making the production module thinner and lighter.
  • the thickness of the display module 11 in the stacking direction can be approximately 1.5 mm. Without a driving motherboard, the thickness of the display device 1 in the stacking direction can be approximately 3 mm.
  • FIG. 7 is a schematic top view of a display device according to a third embodiment of the present application.
  • the number of the third substrates is greater than or equal to two, and a plurality of the third substrates are spliced to form a display area of the display module.
  • the number of the light-emitting units 112 that can be carried and driven by a single third substrate 114 is usually limited. Therefore, in order to meet the display device 1 with a larger display size, multiple light-emitting units 112 are usually used.
  • the third substrate 114 is spliced. Therefore, in this embodiment, the display size of the display device 1 is increased by splicing a plurality of third substrates 114 .
  • FIG. 8 is a partial cross-sectional view along line I-I in FIG. 7 .
  • the display module 11 also includes an optical component 11c.
  • the optical component 11c is used to change the direction of the light emitted by the light-emitting unit 112.
  • the optical component 11c is disposed in the third substrate 114 away from the light-emitting unit 112. side surface.
  • the optical component 11c changes the direction of the light emitted by the light-emitting unit 112, which can further improve the display effect of the display device 1, or change the size of the visible area of the display device 1 to achieve better results. privacy protection effect.
  • the optical component 11c is disposed in the third substrate 114 to avoid affecting the thickness of the display device 1 in the stacking direction.
  • the surface of the third substrate 114 away from the light-emitting unit 112 is flat and can Direct contact with other hierarchies.
  • the optical component 11c in order to ensure that the surface of the third substrate 114 can be provided with circuits, that is, to ensure that the surface of the third substrate 114 is flat, the optical component 11c can be formed by opening grooves and etching the side surfaces. and other technical processes are formed inside the third substrate 114. This application does not limit the formation process of the optical component 11c.
  • the optical component 11c includes a refractive component 11c1, and the refractive component 11c1 is disposed adjacent to the gap.
  • the light emitted by the light-emitting unit 112 is deflected to one side of the gap.
  • the refracting member 11c1 is disposed adjacent to the gap, so that the light emitted by the light-emitting unit 112 is deflected to one side of the gap, and the light emitted by the light-emitting unit 112 passes through the refraction.
  • the refraction effect of the component 11c1 is shown by the dotted arrow in Figure 8, thereby supplementing the luminous brightness at the gap and improving the display effect.
  • the peripheral portion of the display area of the display device 1 may easily produce dark edges and other undesirable display phenomena due to insufficient brightness of the light-emitting unit 112 .
  • the refracting member 11c1 can also be disposed corresponding to the periphery of the third substrate 114 to deflect the light emitted by the light-emitting unit 112 toward the non-display area side of the display device 1 , that is, deflected to one side of the dark edge area, thereby solving the dark edge problem and improving the display effect of the display device 1 .
  • FIG. 9 is a partial cross-sectional view along line I-I in FIG. 7 .
  • the optical component 11c includes a collimating component 11c2.
  • the collimating component 11c2 is arranged corresponding to the lighting unit 112 along the direction of the light emitted by the lighting unit 112.
  • the collimating component 11c2 is used to collimate the light emitting unit 112. The light emitted by unit 112.
  • the collimator 11c2 collimates the light emitted by the light-emitting unit 112, so that in addition to the light emitted by the light-emitting unit 112 along the stacking direction (as shown by the solid arrow in FIG. 9) The remaining light is eliminated or weakened, thereby achieving the effect of increasing the privacy area.
  • the first substrate 111, the second substrate 124 and the third substrate 114 mentioned in this application are all light-transmissive.
  • the first substrate 111, the The second substrate 124 and the third substrate 114 are glass substrates. It can be understood that as long as it does not affect the light transmittance of the first substrate 111 , the second substrate 124 and the third substrate 114 , this application does not apply to the first substrate 111 , the second substrate 124 and the third substrate 114 .
  • the material of the third substrate 114 is not limited.
  • the first substrate 111 , the second substrate 124 and the third substrate 114 In order to ensure that circuits can be disposed on the surfaces of the first substrate 111 , the second substrate 124 and the third substrate 114 , that is, to ensure that the first substrate 111 , the second substrate 124 and the third substrate 114 The surfaces of the first substrate 111 , the second substrate 124 and the third substrate 114 are flat and can be formed on the first substrate 111 , the second substrate 111 and the second substrate 114 by making grooves, side etching and other technical processes.
  • the inside of the substrate 124 and the third substrate 114 is not limited by this application.
  • FIG. 10 is a schematic flow chart of a method for manufacturing a display device according to the first embodiment of the present application.
  • the preparation method of the display device includes steps S101 and S102, wherein the details of steps S101 and S102 are as follows.
  • S101 provide a display module 11, and configure the light-emitting unit 112 of the display module 11 to be flip-chip;
  • the surface of the functional module 12 close to the first substrate 111 is in direct contact with the surface of the first substrate 111 away from the light-emitting unit 112 .
  • the display module 11 the light-emitting unit 112 , the functional module 12 and the first substrate 111 , and will not be described again here.
  • the functional module 12 can be arranged on the first substrate 111 away from the light-emitting unit.
  • the functional module 12 and the light-emitting unit 112 share the first substrate 111, thereby reducing the thickness in the stacking direction of the functional module 12 and the first substrate 111, Material costs are also reduced.
  • the step of forming the functional module 12 on a side surface of the first substrate 111 of the display module 11 away from the light-emitting unit 112 specifically includes:
  • the functional module 12 is subjected to vertical alignment processing of fine seams.
  • the second electrode layer 123 may be formed on one side surface of the second substrate 124 first, and then the first electrode layer 121 and the first electrode layer 121 may be formed respectively.
  • the functional liquid crystal layer 122 is combined with the second electrode layer 123 on the functional liquid crystal layer 122; the functional liquid crystal layer 122 can also be formed on the side of the second electrode layer 123 away from the second substrate 124 On the surface, this application does not limit this.
  • the preparation method of the display device before forming the first electrode layer 121 on a side surface of the first substrate 111 facing away from the light-emitting unit 112 , the preparation method of the display device further includes:
  • the method of preparing the display device further includes:
  • the driving circuit 113 is formed on one side surface of the second substrate 124 .
  • FIG. 11 is a schematic top view of the electronic device provided in the first embodiment of the present application.
  • the electronic device 2 includes a housing 21 and the display device 1 as mentioned above.
  • the housing 21 is used to carry the display device 1 .
  • the electronic device 2 in the embodiment of the present application can be an electronic device 2 in a mobile phone, a smart phone, a tablet computer, an e-reader, a portable device when worn, a notebook computer, etc., which can be connected to the Internet through the Internet.
  • the data transfer server communicates, and the data transfer server can be an instant messaging server, SNS (Social Networking Services, social network services) servers, etc., the implementation of this application does not limit this.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示装置及其制备方法，显示装置（1）包括显示模组（11）及功能模组（12），显示模组（11）包括第一基板（111）及多个发光单元（112），多个发光单元（112）设置于第一基板（111）的一侧，发光单元（112）的出光方向朝向第一基板（111），功能模组（12）设置于第一基板（111）背离发光单元（112）的一侧表面，功能模组（12）和发光单元（112）共用第一基板（111），且功能模组（12）靠近第一基板（111）的表面与第一基板（111）背离发光单元（112）的表面直接接触。

Description

显示装置及其制备方法、电子设备
本申请要求于2022年09月09日提交中国专利局、申请号为202211100723.X、申请名称为“显示装置及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其是涉及一种显示装置及其制备方法、电子设备。
背景技术
显示技术一直以来都是电子设备中重要的研究方向之一，随着显示技术的日益发展，出现了各种各样的显示屏，并且在显示屏上还可以集成功能模组，以实现更多功能。然而，在显示屏上集成功能模组，必然带来整体厚度较大的问题。
发明内容
本申请公开了一种显示装置，减少了显示装置层叠方向上的厚度，同时还减少了物料成本。
第一方面，本申请提供了一种显示装置，所述显示装置包括显示模组及功能模组，所述显示模组包括第一基板及多个发光单元，所述多个发光单元设置于所述第一基板的一侧，所述发光单元的出光方向朝向所述第一基板，所述功能模组设置于所述第一基板背离所述发光单元的一侧表面，所述功能模组和所述发光单元共用所述第一基板，且所述功能模组靠近所述第一基板的表面与所述第一基板背离所述发光单元的表面直接接触。
第二方面，本申请还提供了一种显示装置的制备方法，所述显示装置的制备方法包括：
提供显示模组，将所述显示模组的发光单元配置为倒装；
形成功能模组于所述显示模组的第一基板背离所述发光单元的一侧表面；
其中，所述功能模组靠近所述第一基板的表面与所述第一基板背离所述发光单元的表面直接接触。
第三方面，本申请还提供了一种电子设备，所述电子设备包括壳体及如第一方面所述的显示装置，所述壳体用于承载所述显示装置。
由于所述发光单元倒装设置于所述第一基板的一侧，使得所述功能模组能够设置于所述第一基板背离所述发光单元的一侧表面，所述功能模组和所述发光单元共用所述第一基板，从而在所述功能模组和所述第一基板的层叠方向上减少了厚度，同时还减少了物料成本。
附图说明
为了更清楚的说明本申请实施方式中的技术方案，下面将对实施方式中所需要使用的附图作简单的介绍，显而易见的，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本申请第一实施方式提供的显示装置俯视示意图。
图2为图1中沿I-I线的剖视示意图。
图3为现有技术中一种可能的显示装置可视区域示意图。
图4为本申请第一实施方式提供的功能模组剖视示意图。
图5为本申请第二实施方式提供的功能模组剖视示意图。
图6为本申请第二实施方式提供的显示模组剖视示意图。
图7为本申请第三实施方式提供的显示装置俯视示意图。
图8为图7中沿I-I线的局部剖视示意图。
图9为图7中沿I-I线的局部放大示意图。
图10为本申请第一实施方式提供的显示装置的制备方法流程示意图。
图11为本申请第一实施方式提供的电子设备俯视示意图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整的描述，显然，所描述的实施方式仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
本申请提供了一种显示装置1，请一并参阅图1及图2，图1为本申请第一实施方式提供的显示装置俯视示意图；图2为图1中沿I-I线的剖视示意图。所述显示装置1包括显示模组11及功能模组12，所述显示模组11包括第一基板111及多个发光单元112，所述多个发光单元112设置于所述第一基板111的一侧，所述发光单元112的出光方向朝向所述第一基板111，所述功能模组12设置于所述第一基板111背离所述发光单元112的一侧表面，所述功能模组12和所述发光单元112共用所述第一基板111，且所述功能模组12靠近所述第一基板111的表面与所述第一基板111背离所述发光单元112的表面直接接触。
需要说明的是，所述发光单元112通常包括多个颜色子像素，所述发光单元112工作发光，并对所述发光单元112发出的光线进行处理，从而实现所述显示模组11的显示功能。通常情况下，所述发光单元112设置于所述第一基板111的一侧，所述发光单元112的出光方向可以是背离所述第一基板111的一侧方向，即所述发光单元112正装设置；也可以是如图2虚线箭头所示，朝向所述第一基板111的一侧方向，即所述发光单元112倒装设置。所述多个发光单元112倒装设置于所述第一基板111的一侧，可以是设置于所述第一基板111的一侧表面，也可以是设置于所述第一基板111的一侧方向上，本申请对此不加以限制。
具体的，所述功能模组12具有透光性，通过对所述发光单元112发出的光线进行处理，能够实现各种不同的功能。举例来说，当所述功能模组12为防窥液晶盒时，通过对所述发光单元112发出的光线进行旋光，改变光线的方向，能够实现不同角度的防窥功能。因此，所述功能模组12需要设置于所述发光单元112的出光方向上。
在本实施方式中，所述发光单元112可以是Micro LED或Mini LED，所述发光单元112可以直接发出红色、蓝色或黄色三种颜色的光线，本申请对此不加以限制。所述发光单元112倒装设置于所述第一基板111的一侧，使得所述第一基板111在所述发光单元112出光方向的一侧具有多余的设置空间，以设置所述功能模组12，从而实现所述功能模组12和所述发光单元112共用所述第一基板111。
可以理解的，在本实施方式中，由于所述发光单元112倒装设置于所述第一基板111的一侧，使得所述功能模组12能够设置于所述第一基板111背离所述发光单元112的一侧表面，所述功能模组12和所述发光单元112共用所述第一基板111，从而在所述功能模组12和所述第一基板111的层叠方向上(如图2中实线箭头所示)减少了厚度，同时还减少了物料成本。
在一种可能的实施方式中，请一并参阅图3及图4，图3为现有技术中一种可能的显示 装置可视区域示意图；图4为本申请第一实施方式提供的功能模组剖视示意图。所述功能模组12包括第一电极层121、功能液晶层122、第二电极层123及第二基板124，所述第一电极层121设置于所述第一基板111背离所述显示模组11的一侧表面，且所述第一电极层121靠近所述第一基板111的表面与所述第一基板111背离所述发光单元112的表面直接接触，所述功能液晶层122设置于所述第一电极层121背离所述第一基板111的一侧表面，所述第二电极层123设置于所述功能液晶层122背离所述第一电极层121的一侧表面，所述第二基板124设置于所述第二电极层123背离所述功能液晶层122的一侧表面，所述第一电极层121和所述第二电极层123与所述功能液晶层122相邻的一侧表面分别涂布有配向材料。
在本实施方式中，所述功能模组12为防窥液晶盒，所述配向材料为聚酰亚胺材料。如图4所示，由于所述第一电极层121和所述第二电极层123与所述功能液晶层122相邻的一侧表面分别涂布有配向材料，使得所述功能液晶层122中的液晶分子站立。通过在所述第一电极层121和所述第二电极层123两端加载不同的电压，使得所述功能液晶层122中的液晶分子在电场的作用下旋转，从而改变所述发光单元112发射的光线由所述功能模组12出射的角度，实现改变如图3中原可视区域的大小。可以理解的，在所述第一电极层121和所述第二电极层123加载电压的情况下，所述发光单元112发射的光线经过所述功能液晶层122中的液晶分子旋光，使得光线集中向如图4中可视区域出射，而不会向防窥区域出射，从而实现防窥功能。
可以理解的，在其他可能的实施方式中，所述功能模组12还可以是其他器件，对所述发光单元112发出的光线进行不同的处理，以实现不同的功能，本申请对此不加以限制。
在一种可能的实施方式中，请一并参阅图4及图5，图5为本申请第二实施方式提供的功能模组剖视示意图。所述显示模组11还包括驱动线路113，所述驱动线路113用于驱动所述发光单元112工作，所述驱动线路113形成于所述第一电极层121或所述第二电极层123。
具体的，通常情况下，所述发光单元112需要所述驱动线路113提供驱动信号，以驱动所述发光单元112工作。可以理解的，在本实施方式中，由于所述发光单元112倒装设置，所述驱动线路113形成于所述第一电极层121或所述第二电极层123，相对于现有技术中所述驱动线路113设置于所述显示模组11内，进一步缩小了所述显示模组11在所述层叠方向上(如图4及图5中实线箭头所示)的厚度。
同时，当所述驱动线路113形成于所述第一电极层121时，所述驱动线路113提供的驱动信号可以直接加载至所述第一电极层121；或者，当所述驱动线路113形成于所述第二电极层123时，所述驱动线路113提供的驱动信号可以直接加载至所述第二电极层123，节省了一定的电路设计。
需要说明的是，所述驱动线路113可以通过所述显示模组11的显示区面内打孔的方式与所述发光单元112电连接，也可以通过所述显示模组11的非显示区走线与所述发光单元112电连接，本申请对此不加以限制。
在一种可能的实施方式中，请一并参阅图6，图6为本申请第二实施方式提供的显示模组剖视示意图。所述显示模组11还包括第三基板114及阵列基板115，所述发光单元112倒装设置于所述第三基板114的一侧表面，所述阵列基板115设置于所述第三基板114背离所述发光单元112的一侧表面，所述阵列基板115和所述发光单元112共用所述第三基板114，且所述阵列基板115靠近所述第三基板114的表面与所述第三基板114背离所述发光单元112的表面直接接触。
具体的，如图6所示，所述显示模组11还包括封装层116、框体117、显示液晶层118、 彩膜基板119第一偏光片11a及第二偏光片11b，所述封装层116用于封装所述发光单元112，所述框体117用于防止所述显示液晶层118中的液晶流动，所述彩膜基板119用于过滤所述发光单元112发射的光线颜色，所述第一偏光片11a设置于所述阵列基板115背离所述第三基板114的一侧表面，用于使所述发光单元112发射的光线起偏，所述第二偏光片11b设置于所述彩膜基板119背离所述显示液晶层118的一侧表面，用于对所述发光单元112发射的光线检偏。需要说明的是，不同于第一实施方式，在本实施方式中，所述发光单元112为所述显示装置1中的背光模组的所述发光单元112，所述发光单元112发出的光线颜色混合后形成白光出射。
需要说明的是，通常情况下，所述阵列基板115上设置有多个薄膜晶体管，用于在所述驱动线路113传输的驱动信号的加载下，选择性的驱动对应的所述发光单元112工作。在本实施方式中，所述阵列基板115和所述发光单元112共用所述第三基板114，换句话说，多个薄膜晶体管通过曝光显影、涂布、蚀刻等技术工艺形成于所述第三基板114背离所述发光单元112的一侧表面，从而减少了所述显示模组11在层叠方向上(如图6中实线箭头所示)的厚度。
在本实施方式中，所述彩膜基板119通过曝光显影、涂布、蚀刻等技术工艺将红/绿/蓝颜色的滤光片形成于玻璃基板上得到。所述发光单元112通过巨量转移技术转移至所述第三基板114的一侧表面，举例而言，当所述发光单元112为Mini LED时，所述封装层116还需要采用自发蓝光和Y荧光粉进行处理，所述封装层116的材质通常选择耐高温、耐腐蚀的材料。
具体的，所述彩膜基板119与所述阵列基板115合板后，再通过细缝垂直对齐(Fine Seam Vertical Alignment，FSA)技术光配向，对齐两者的缝隙，并在所述阵列基板115背离所述第三基板114的一侧表面贴覆所述第一偏光片11a。
可以理解的，在本实施方式中，所述阵列基板115和所述发光单元112共用所述第三基板114，从而使得模组化生产所述显示模组11时，可以省略模组光源部分，其生产模组仅需要生产背板作为框架即可，使得生产模组更加轻薄。具体的，所述显示模组11在所述层叠方向上的厚度可以实现约为1.5mm左右，在不包含驱动主板的情况下，所述显示装置1在所述层叠方向上的厚度可以实现3mm以内。
在一种可能的实施方式中，请一并参阅图7，图7为本申请第三实施方式提供的显示装置俯视示意图。所述第三基板的数量大于或等于两个，多个所述第三基板拼接构成所述显示模组的显示区域。
需要说明的是，单独一个所述第三基板114所能够承载、驱动的所述发光单元112的数量通常有限，因此，为了满足较大显示尺寸的显示装置1，通常情况下会采用多个所述第三基板114拼接。因此，在本实施方式中，通过多个所述第三基板114拼接的设置方式，增大了所述显示装置1的显示尺寸。
在一种可能的实施方式中，请一并参阅图8，图8为图7中沿I-I线的局部剖视示意图。所述显示模组11还包括光学件11c，所述光学件11c用于改变所述发光单元112发出的光线方向，所述光学件11c设置于所述第三基板114内背离所述发光单元112的一侧表面。
在本实施方式中，所述光学件11c改变所述发光单元112发出的光线方向，可以进一步改善所述显示装置1的显示效果，或者改变所述显示装置1的可视区域大小，实现更好的防窥效果。同时，所述光学件11c设置于所述第三基板114内，避免影响所述显示装置1在层叠方向上的厚度，并且，所述第三基板114背离所述发光单元112的表面平整，可以与其他层级结构直接接触。
需要说明的是，在本实施方式中，为了保证所述第三基板114的表面能够设置电路，即保证所述第三基板114的表面平整，所述光学件11c可以通过开设凹槽、侧面蚀刻等技术工艺形成于所述第三基板114的内部，本申请对所述光学件11c的形成工艺不加以限制。
在一种可能的实施方式中，请再次参阅图8，相邻所述第三基板114之间存在间隙，所述光学件11c包括折射件11c1，所述折射件11c1邻近所述间隙设置，用于将所述发光单元112发出的光线向所述间隙的一侧偏折。
可以理解的，采用多个所述基板114拼接的设置方式，在多个所述第三基板114拼接处可能存在如图8所示的所述间隙。由于所述间隙的存在，邻近所述间隙设置的所述发光单元112发光之间的距离，将大于其余部分相邻的所述发光单元112之间的距离，导致所述间隙处的所述发光单元112发光亮度不足，容易产生“暗缝”的不良显示效果。
因此，在本实施方式中，所述折射件11c1邻近所述间隙设置，使得所述发光单元112发出的光线向所述间隙的一侧偏折，所述发光单元112发出的光线经过所述折射件11c1的折射效果如图8虚线箭头所示，从而补足所述间隙处的发光亮度，改善显示效果。
可以理解的，对于所述第三基板114的数量为一个的所述显示装置1，即显示尺寸较小的所述显示装置1，尤其是所述发光单元112为Mini LED的所述显示装置1来说，所述显示装置1的显示区域周缘部分可能由于所述发光单元112的亮度不足，容易产生暗边等不良显示现象。在其他可能的实施方式中，所述折射件11c1还可以对应所述第三基板114的周缘设置，从而将所述发光单元112发出的光线向所述显示装置1的非显示区域一侧偏折，即向暗边区域一侧偏折，从而解决暗边问题，改善所述显示装置1的显示效果。
在一种可能的实施方式中，请一并参阅图9，图9为图7中沿I-I线的局部剖视示意图。所述光学件11c包括准直件11c2，所述准直件11c2沿所述发光单元112发出的光线方向上，对应所述发光单元112设置，所述准直件11c2用于准直所述发光单元112发出的光线。
需要说明的是，所述发光单元112初始发出的光线为发散的，即如图9中未经过所述准直件11c2部分的虚线箭头所示。因此，在本实施方式中，所述准直件11c2准直所述发光单元112发出的光线，使得除所述发光单元112沿所述层叠方向(如图9中实线箭头所示)发射的其余光线被消除或削弱，从而实现增大防窥区域的效果。
需要说明的是，本申请中提及的所述第一基板111、所述第二基板124及所述第三基板114均具有透光性，举例而言，所述第一基板111、所述第二基板124及所述第三基板114为玻璃基板。可以理解的，只要不影响所述第一基板111、所述第二基板124及所述第三基板114均具有透光性，本申请对所述第一基板111、所述第二基板124及所述第三基板114的材质不加以限制。为了保证所述第一基板111、所述第二基板124及所述第三基板114的表面能够设置电路，即保证所述第一基板111、所述第二基板124及所述第三基板114的表面平整，设置于所述第一基板111、所述第二基板124及所述第三基板114可以通过开设凹槽、侧面蚀刻等技术工艺形成于所述第一基板111、所述第二基板124及所述第三基板114的内部，本申请对此不加以限制。
本申请还提供了一种显示装置的制备方法，请一并参阅图10，图10为本申请第一实施方式提供的显示装置的制备方法流程示意图。所述显示装置的制备方法包括步骤S101、S102，其中，步骤S101、S102的详细介绍如下。
S101，提供显示模组11，将所述显示模组11的发光单元112配置为倒装；
S102，形成功能模组12于所述显示模组11的第一基板111背离所述发光单元112的一 侧表面；
其中，所述功能模组12靠近所述第一基板111的表面与所述第一基板111背离所述发光单元112的表面直接接触。
具体的，所述显示模组11、所述发光单元112、所述功能模组12及所述第一基板111请参阅上文描述，在此不再赘述。可以理解的，在本实施方式中，由于所述发光单元112倒装设置于所述第一基板111的一侧，使得所述功能模组12能够设置于所述第一基板111背离所述发光单元112的一侧表面，所述功能模组12和所述发光单元112共用所述第一基板111，从而在所述功能模组12和所述第一基板111的层叠方向上减少了厚度，同时还减少了物料成本。
在一种可能的实施方式中，所述形成功能模组12于所述显示模组11的第一基板111背离所述发光单元112的一侧表面的步骤，具体包括：
形成第一电极层121于所述第一基板111背离所述发光单元112的一侧表面；
涂布配向材料于所述第一电极层121背离所述第一基板111的一侧表面；
形成功能液晶层122于所述第一电极层121背离所述第一基板111的一侧表面；
提供第二基板124；
形成第二电极层123于所述第二基板124的一侧表面；
涂布配向材料于所述第二电极层123背离所述第二基板124的一侧表面；
将所述第二电极层123背离所述第二基板124的一侧表面与所述功能液晶层122接合，形成所述功能模组12；
对所述功能模组12进行细缝垂直对齐处理。
具体的，所述第一电极层121、所述配向材料、所述功能液晶层122、所述第二基板124、所述第二电极层123请参阅上文描述，在此不再赘述。需要说明的是，在其他可能的实施方式中，也可以是先形成所述第二电极层123于所述第二基板124的一侧表面，再分别形成所述第一电极层121、所述功能液晶层122，并结合所述第二电极层123于所述功能液晶层122；还可以将所述功能液晶层122形成于所述第二电极层123背离所述第二基板124的一侧表面，本申请对此不加以限制。
在一种可能的实施方式中，在所述形成第一电极层121于所述第一基板111背离所述发光单元112的一侧表面之前，所述显示装置的制备方法还包括：
形成驱动线路113于所述第一基板111背离所述发光单元112的一侧表面；或者，
在所述形成第二电极层123于所述第二基板124的一侧表面之前，所述显示装置的制备方法还包括：
形成驱动线路113于所述第二基板124的一侧表面。
具体的，所述驱动线路113请参阅上文描述，在此不再赘述。
本申请还提供了一种电子设备2，请一并参阅图11，图11为本申请第一实施方式提供的电子设备俯视示意图。所述电子设备2包括壳体21及如上文所述的显示装置1，所述壳体21用于承载所述显示装置1。具体的，所述显示装置1请参阅上文描述，在此不再赘述。
需要说明的是，本申请实施方式中的所述电子设备2可以为手机、智能手机、平板电脑、电子阅读器、佩戴时便携设备、笔记本电脑等设备中的电子设备2，其可以通过互联网与数据转移服务器进行通信，所述数据转移服务器可以为即时通讯服务器、SNS(Social Networking  Services，社会性网络服务)服务器等，本申请实施方式对此不加以限制。
本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施方式的说明只是用于帮助理解本申请的核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (15)

  1. 一种显示装置，所述显示装置包括显示模组及功能模组，所述显示模组包括第一基板及多个发光单元，所述多个发光单元设置于所述第一基板的一侧，所述发光单元的出光方向朝向所述第一基板，所述功能模组设置于所述第一基板背离所述发光单元的一侧表面，所述功能模组和所述发光单元共用所述第一基板，且所述功能模组靠近所述第一基板的表面与所述第一基板背离所述发光单元的表面直接接触。
  2. 如权利要求1所述的显示装置，其中，所述发光单元倒装设置于所述第一基板的一侧表面；或者，所述发光单元倒装设置于所述第一基板的一侧方向上。
  3. 如权利要求1所述的显示装置，其中，所述功能模组包括第一电极层、功能液晶层、第二电极层及第二基板，所述第一电极层设置于所述第一基板背离所述显示模组的一侧表面，且所述第一电极层靠近所述第一基板的表面与所述第一基板背离所述发光单元的表面直接接触，所述功能液晶层设置于所述第一电极层背离所述第一基板的一侧表面，所述第二电极层设置于所述功能液晶层背离所述第一电极层的一侧表面，所述第二基板设置于所述第二电极层背离所述功能液晶层的一侧表面，所述第一电极层和所述第二电极层与所述功能液晶层相邻的一侧表面分别涂布有配向材料。
  4. 如权利要求3所述的显示装置，其中，所述显示模组还包括驱动线路，所述驱动线路用于驱动所述发光单元工作，所述驱动线路形成于所述第一电极层或所述第二电极层。
  5. 如权利要求4所述的显示装置，其中，所述驱动线路通过所述显示模组的显示区面内打孔与所述发光单元电连接；或者，所述驱动线路通过所述显示模组的非显示区走线与所述发光单元电连接。
  6. 如权利要求1所述的显示装置，其中，所述显示模组还包括第三基板及阵列基板，所述发光单元设置于所述第三基板的一侧表面，所述阵列基板设置于所述第三基板背离所述发光单元的一侧表面，所述阵列基板和所述发光单元共用所述第三基板，且所述阵列基板靠近所述第三基板的表面与所述第三基板背离所述发光单元的表面直接接触。
  7. 如权利要求6所述的显示装置，其中，所述显示模组在层叠方向上的厚度小于或等于1.5mm；所述显示装置在所述层叠方向上的厚度小于或等于3mm。
  8. 如权利要求6所述的显示装置，其中，所述第三基板的数量大于或等于两个，多个所述第三基板拼接构成所述显示模组的显示区域。
  9. 如权利要求8所述的显示装置，其中，所述显示模组还包括光学件，所述光学件用于改变所述发光单元发出的光线方向，所述光学件设置于所述第三基板内背离所述发光单元的一侧表面。
  10. 如权利要求9所述的显示装置，其中，相邻所述第三基板之间存在间隙，所述光学件包括折射件，所述折射件邻近所述间隙设置，用于将所述发光单元发出的光线向所述间隙的一侧偏折。
  11. 如权利要求9所述的显示装置，其中，所述光学件包括准直件，所述准直件沿所述发光单元发出的光线方向上，对应所述发光单元设置，所述准直件用于准直所述发光单元发出的光线。
  12. 一种显示装置的制备方法，所述显示装置的制备方法包括：
    提供显示模组，将所述显示模组的发光单元配置为倒装；
    形成功能模组于所述显示模组的第一基板背离所述发光单元的一侧表面；
    其中，所述功能模组靠近所述第一基板的表面与所述第一基板背离所述发光单元的表面直接接触。
  13. 如权利要求12所述的显示装置的制备方法，其中，所述形成功能模组于所述显示模组的第一基板背离所述发光单元的一侧表面的步骤，具体包括：
    形成第一电极层于所述第一基板背离所述发光单元的一侧表面；
    涂布配向材料于所述第一电极层背离所述第一基板的一侧表面；
    形成功能液晶层于所述第一电极层背离所述第一基板的一侧表面；
    提供第二基板；
    形成第二电极层于所述第二基板的一侧表面；
    涂布配向材料于所述第二电极层背离所述第二基板的一侧表面；
    将所述第二电极层背离所述第二基板的一侧表面与所述功能液晶层接合，形成所述功能模组；
    对所述功能模组进行细缝垂直对齐处理。
  14. 如权利要求13所述的显示装置的制备方法，其中，在所述形成第一电极层于所述第一基板背离所述发光单元的一侧表面之前，所述显示装置的制备方法还包括：
    形成驱动线路于所述第一基板背离所述发光单元的一侧表面；或者，
    在所述形成第二电极层于所述第二基板的一侧表面之前，所述显示装置的制备方法还包括：
    形成驱动线路于所述第二基板的一侧表面。
  15. 一种电子设备，所述电子设备包括壳体及如权利要求1-11任意一项所述的显示装置，所述壳体用于承载所述显示装置。
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