WO2024050710A1 - 一种制备精细线路的绝缘胶膜材料及其制备方法 - Google Patents

一种制备精细线路的绝缘胶膜材料及其制备方法 Download PDF

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WO2024050710A1
WO2024050710A1 PCT/CN2022/117467 CN2022117467W WO2024050710A1 WO 2024050710 A1 WO2024050710 A1 WO 2024050710A1 CN 2022117467 W CN2022117467 W CN 2022117467W WO 2024050710 A1 WO2024050710 A1 WO 2024050710A1
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film
protective film
ppm
resin
polymer
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PCT/CN2022/117467
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English (en)
French (fr)
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孙蓉
于均益
罗遂斌
于淑会
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深圳先进电子材料国际创新研究院
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition

Definitions

  • the present invention belongs to the technical field of electronic packaging materials. More specifically, the present invention relates to an insulating adhesive film material used in semiconductor system-level packaging.
  • the present invention provides a laminated insulating adhesive film material that can be used for the conductor package and is suitable for the additive or semi-additive method to prepare fine circuits.
  • the present invention adopts the following technical solutions.
  • One aspect of the present invention provides an insulating adhesive film material, which is composed of a polymer composite composed of an adhesive film layer and a carrier film, and a polymer protective film covering the surface of the adhesive film layer by hot pressing or rolling;
  • the surface of the polymer protective film has undergone release treatment;
  • the adhesive film layer is made of a slurry containing a resin composition, filler particles, resin curing agent, other additives and solvent;
  • the roughness Ra of the polymer protective film is 5 nm to 1 ⁇ m;
  • the thermal expansion coefficient (CTE) of the polymer protective film is 10 ppm/K to 300 ppm/K;
  • the softening temperature point of the polymer protective film is 40°C to 350°C;
  • the polymer protective film has an elongation at break of 10% to 1000%.
  • the molecular structure of the polymer protective film contains one or more of them.
  • the release treatment method is a release treatment using one or more combinations of silicon-containing release agents, silicon-free release agents, fluoroplastic release agents, corona, frosting, and polishing. .
  • the thickness of the polymer protective film is 5 ⁇ m to 200 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m, and more preferably 20 ⁇ m to 40 ⁇ m.
  • the thermal expansion coefficient (CTE) of the polymer protective film is preferably 15 ppm/K to 200 ppm/K, and more preferably 35 ppm/K to 160 ppm/K.
  • the softening temperature point of the polymer protective film is preferably 50°C to 250°C, and more preferably 60°C to 200°C.
  • the roughness Ra of the polymer protective film is preferably 10 nm to 0.8 ⁇ m, and more preferably 10 nm to 200 nm.
  • the tensile strength of the polymer protective film is 50-150MPa, preferably 70-130MPa.
  • the elongation at break of the polymer protective film is greater than the elongation at break and is greater than 120% to 1000%, preferably the elongation at break is 150% to 500%.
  • the thermal expansion coefficient CTE of the polymer composite is 5 ppm/K to 200 ppm/K, preferably 30 ppm/k to 150 ppm/k, and more preferably 40 ppm/k to 100 ppm/k.
  • the elongation at break before curing of the polymer composite is 1%-300%, preferably 30%-200%, and more preferably 50%-160%.
  • the resin composition is selected from the group consisting of epoxy resin, rubber resin, phenolic resin, polyester resin, polyamide resin, urea-formaldehyde resin, melamine formaldehyde resin, furan resin, silicone resin, polyester resin, acrylic resin, cyanide resin, One or more combinations of acid ester resin, vinyl resin, hydrocarbon resin, polyether resin.
  • the epoxy resin is selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic epoxy resin, o-cresol type epoxy resin, multifunctional epoxy resin, alicyclic epoxy resin, m- One or more of diphenol epoxy resin, rubber modified epoxy resin, polyurethane modified epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, and chemical epoxy resin.
  • the rubber resin is selected from styrene-butadiene rubber, butadiene rubber, isoprene rubber, ethylene-propylene rubber, chloroprene rubber, nitrile rubber, chloroprene rubber, chlorine-based rubber, fluorine rubber, chloroether rubber, silicone rubber, polyurethane rubber, polyurethane rubber, One or more of sulfur rubber and acrylic rubber.
  • the phenolic resin includes linear phenol formaldehyde resin, linear bisphenol A formaldehyde resin, linear o-cresol formaldehyde resin, phenol aralkyl phenolic resin, nitrogen-containing phenolic resin, dicyclopentadiene phenolic resin, biphenyl-type phenolic resin, tetracycline-type phenolic resin, One or more types of phenolic ethane phenolic resin and nye-type phenolic resin.
  • the polyester resin includes one or more of bisphenol A polyester resin, bisphenol F polyester resin, dicyclopentadiene polyester resin, biphenyl polyester resin, and naphtha polyester resin.
  • the acrylic resin includes monofunctional urethane acrylic resin, bifunctional aliphatic acrylic resin, trifunctional aliphatic acrylic resin, tetrafunctional aliphatic acrylic resin, polyester acrylic resin, bisphenol A epoxy acrylic resin, phenolic epoxy acrylic resin , one or more of dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, and di-trimethylolpropane tetraacrylate.
  • the polyester resin includes one or more of bisphenol A polyester resin, bisphenol F polyester resin, dicyclopentadiene polyester resin, biphenyl polyester resin, and naphtha polyester resin.
  • the resin curing agent is selected from the group consisting of aliphatic polyamine curing agents, alicyclic polyamine curing agents, latent curing agents, acid anhydride curing agents, aromatic amine curing agents, polyamide curing agents, and synthetic resin curing agents. .
  • the aliphatic polyamine type curing agent is selected from ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, dimethylaminopropylamine, diethylaminopropylamine, Trimethylhexamethylenediamine, dihexyltriamine, trimethylhexamethylenediamine, polyetherdiamine, etc.;
  • the alicyclic polyamine type curing agent is selected from diaminomethylcyclohexane, Mengdiamine Ammonia, aminoethylpyridine, hexahydropyridine, diaminocyclohexane, diaminomethylcyclohexylmethane, diaminocyclohexylmethane, etc.
  • the latent curing agent is selected from dicyanodiamine, boron trifluoride mono Ethylamine, boron trifluoride phenethylamine, boron trifluoride
  • the inorganic filler is silica, aluminum oxide, boron nitride, titanium dioxide, zinc oxide, zirconium oxide, magnesium oxide, calcium carbonate, barium titanate, strontium titanate, barium strontium titanate, lead zirconate titanate , one or more mixtures of copper calcium titanate, etc.
  • the size of the inorganic filler is 20 nm to 10 ⁇ m, preferably 50 nm to 3 ⁇ m, more preferably 200 nm to 1 ⁇ m, or a multi-scale mixture.
  • the shape of the inorganic filler particles is mainly spherical or spherical-like particles, and some particles of other shapes such as rods, wires, sheets, etc. may also exist.
  • the inorganic filler particles account for 20% to 80%, preferably 30% to 60%, and more preferably 45% to 55% of the solid content of the composite, that is, excluding volatile components such as solvents.
  • the carrier film is selected from polymer film materials and paper-based film materials, further, is selected from polyester film (PET), polyether ether ketone film (PEEK), polyetherimide film (PEI), polyamide film Imine film (PI), polycarbonate film (PC), release paper, laminated paper, etc.
  • the carrier film is selected from a carrier film with a release film, and the release film is selected from a silicon-containing release film, a silicon-free release film, a fluoroplastic release film, a corona release film, a frosted release film, Polished release film, matte release film.
  • the thickness of the supporting film is 10 ⁇ m to 300 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m, and more preferably 30 ⁇ m to 60 ⁇ m.
  • the solvent is selected from volatile solvents, including one of aromatic solvents, halogenated hydrocarbon solvents, aliphatic hydrocarbon solvents, alicyclic hydrocarbon solvents, alcohol solvents, ester solvents, ketone solvents, amide solvents, or A variety of; more preferably, the aromatic solvent includes one or more of xylene, o-xylene, m-xylene, p-xylene, hexamethylbenzene, and ethylbenzene; more preferably, the halogenated Hydrocarbon solvents include one or more of chlorobenzene, dichlorobenzene, and methylene chloride; more preferably, the aliphatic hydrocarbon solvents include one or more of pentane, hexane, and octane; and more Preferably, the alicyclic hydrocarbon solvent includes one or more of cyclohexane, cyclohexanone, and toluene; more preferably, the alcohol solvent includes methanol,
  • the ester solvent includes one or more of methyl acetate, ethyl acetate, and propyl acetate; more preferably, the ketone solvent includes acetone, butanone, One or more of methyl isobutyl ketone; more preferably, the amide solvent includes dimethylformamide, hexamethylphosphoramide, N,N-dimethylformamide, dimethylacetamide one or more of them.
  • auxiliary agent is selected from one or more combinations of epoxy resin curing accelerators, dispersants, defoaming agents, leveling agents, and coupling agents.
  • the epoxy resin curing accelerator includes phenol, bisphenol A, resorcinol, 2,4,6-tris(dimethylaminomethylene)phenol, benzyldimethylamine, acylguanidine, and benzene peroxide Formyl, copper acetylacetonate, aluminum acetylacetonate, zirconium acetylacetonate, imidazoles, the imidazoles are selected from 2-methylimidazole, 2-ethylimidazole, 2,4-diethylimidazole, 2-methyl- One or more of 4-ethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, etc.
  • the dispersant is selected from fatty acids, such as polyethylene glycol fatty acid ester, sodium fatty acid methyl ester sulfonate, sucrose fatty acid ester, polyglycerol fatty acid ester, fatty acid polyoxyethylene ether, nonylphenol polyoxyethylene ether, Polyoxyethylene sorbitan fatty acid ester, polyvinylpyrrolidone K30, polyvinylpyrrolidone K90, sodium lignosulfonate, polyacrylamide, sodium dodecylbenzenesulfonate, sodium methylenebismethylnaphthalenesulfonate and a combination of one or more of esters and aliphatic amides.
  • fatty acids such as polyethylene glycol fatty acid ester, sodium fatty acid methyl ester sulfonate, sucrose fatty acid ester, polyglycerol fatty acid ester, fatty acid polyoxyethylene ether, nonylphenol polyoxyethylene ether, Polyoxyethylene sorbitan
  • the defoaming agent is selected from one or a combination of silicone, polyether, and polyether modified polysiloxane defoaming agents.
  • the leveling agent is selected from polydimethylsiloxane, polyether polyester modified organosiloxane, alkyl modified organosiloxane, end group modified organosiloxane, organic modified polysiloxane acrylic One or a combination of one or more of acrylic leveling agents and acrylic leveling agents.
  • the coupling agent is preferably a silane coupling agent with the general formula RSiX3, in which R represents groups such as amino, mercapto, vinyl, epoxy, cyano and methacryloyloxy, and X represents hydrolyzable Alkoxy (such as methoxy, ethoxy, etc.).
  • R represents groups such as amino, mercapto, vinyl, epoxy, cyano and methacryloyloxy
  • X represents hydrolyzable Alkoxy (such as methoxy, ethoxy, etc.).
  • the thermal expansion coefficient (CTE) of the polymer composite suitable for the protective film of the present invention is 5 ppm/K to 200 ppm/K; the elongation at break before curing is 1% to 300%;
  • Another aspect of the present invention provides the use of the insulating adhesive film material of the present invention in preparing packaging materials for printed circuit boards (PCBs), substrates, carriers, and semiconductor electronics.
  • PCBs printed circuit boards
  • substrates substrates
  • carriers substrates
  • semiconductor electronics semiconductor electronics
  • Another aspect of the present invention provides a method for preparing the above-mentioned insulating film material, which includes the following steps:
  • the lamination temperature of hot pressing or roller pressing in S3) is 25°C-200°C, preferably 25°C-150°C, and more preferably 25°C-100°C.
  • Yet another aspect of the present invention provides the use of a polymer protective film as a protective film for packaging adhesive films for printed circuit boards (PCBs), substrates, carrier boards, and semiconductor electronics;
  • PCBs printed circuit boards
  • substrates substrates
  • carrier boards substrates
  • semiconductor electronics semiconductor electronics
  • the polymer protective film has a roughness Ra of 5 nm to 1 ⁇ m;
  • the thermal expansion coefficient (CTE) of the polymer protective film is 10 ppm/K to 300 ppm/K;
  • the softening temperature point of the polymer protective film is 40°C to 350°C;
  • the polymer protective film has an elongation at break of 10% to 1000%.
  • the thermal expansion coefficient (CTE) of the encapsulating adhesive film is 5 ppm/K to 200 ppm/K; the elongation at break before curing of the encapsulating adhesive film is 1% to 300%; the thermal expansion coefficient of the encapsulating adhesive film is Preferably it is 30ppm/k-150ppm/k, more preferably 40ppm/k-100ppm/k; the elongation at break before curing is preferably 30%-200%, more preferably 50%-160%.
  • the obtained adhesive film has good surface morphology, no holes, no defects, and uniform thickness.
  • the adhesive film has good line filling ability and high reliability.
  • Figure 1 is a schematic structural diagram of an insulating film material, in which 1-1 is a polymer composite and 1-2 is a polymer protective film.
  • FIG. 1 Microscope photo of the line filling section of the insulating film material. 2-1 Cross-sectional view of line filling with insulating adhesive film material in Example 1, 2-2 Cross-sectional view of line filling with insulating adhesive film material in Example 2, 2-3 Cross-sectional view of line filling with insulating adhesive film material in Comparative Example 1. 2-4 Comparative Example 1 Surface image of the insulating film material after the protective film is peeled off.
  • This embodiment provides an insulating adhesive film material suitable for semiconductor packaging and suitable for the preparation of fine circuits by the additive method or the semi-additive method, which is prepared through the following steps:
  • the molecular structure of the polymer protective film is selected from the group consisting of
  • the thermal expansion coefficient (CTE) of the polymer protective film is 10 ppm/K to 300 ppm/K, preferably 15 ppm/K to 200 ppm/K, and more preferably 15 ppm/K to 150 ppm/K. If the CTE is lower than 10ppm/K or higher than 300ppm/K, during the lamination process of the protective film, its elongation is greatly different from that of the polymer compound, which will lead to lamination misalignment, defects, and affect the quality of the film.
  • the polymer protective film needs to apply tension at a certain temperature for lamination, its softening temperature point is 40°C to 350°C, preferably 50°C to 250°C, and more preferably 60°C to 200°C, ensuring that during the lamination process The protective film is not affected by tension. Excessively high temperatures during the lamination process will cause the polymer composite to solidify and affect circuit filling. Therefore, there is no need for an excessively high softening temperature point.
  • the thickness of the polymer protective film is 5 ⁇ m to 200 ⁇ m, preferably 20 ⁇ m to 100 ⁇ m, and more preferably 20 ⁇ m to 40 ⁇ m.
  • the roughness Ra of the polymer protective film is 5nm to 1 ⁇ m, preferably 10nm to 0.8 ⁇ m, more preferably 10nm to 0.5 ⁇ m.
  • Ra When Ra is lower than 5nm, an overly smooth surface is not conducive to the composite adhesion of the protective film and the polymer. , causing defects such as bubbles; when Ra is higher than 1 ⁇ m, it will affect the thickness error of the polymer composite, thereby leading to a decrease in its reliability.
  • the surface of the polymer protective film is treated with one or more combinations of silicone-containing release agents, silicone-free release agents, fluoroplastic release agents, corona, frosting, and polishing to avoid leakage during lamination. Defects occur due to transfer of the polymer composite to the polymer protective film.
  • the slurry is obtained and coated on the surface of the silicon-free release carrier film to form a polymer composite.
  • the CTE of the obtained polymer composite is 50 ppm/k, and the elongation at break before curing is 120%.
  • the molecular structure of polymer protective film contains The surface is treated with silicone-free release agent.
  • the roughness Ra is 20nm
  • the elongation at break is greater than 360%
  • the tensile strength is 79MPa
  • the CTE is 109ppm/K
  • the softening temperature point is 80°C.
  • the slurry is obtained and coated on the surface of the silicon-free release carrier film to form a polymer composite.
  • the CTE of the obtained polymer composite is 40 ppm/k, and the elongation at break before curing is 60%.
  • the molecular structure of polymer protective film contains The surface is corona treated.
  • the roughness Ra is 59nm
  • the elongation at break is 376%
  • the tensile strength is 90MPa
  • the CTE is 102ppm/K
  • the softening temperature point is 80°C.
  • the slurry is obtained and coated on the surface of the silicon-free release carrier film to form a polymer composite.
  • the CTE of the obtained polymer composite is 45 ppm/k, and the elongation at break before curing is 120%.
  • the molecular structure of polymer protective film contains The surface is treated with release agent.
  • the roughness Ra is 100nm
  • the elongation at break is greater than 150%
  • the tensile strength is 120MPa
  • the CTE is 40ppm/K
  • the softening temperature point is 180°C.
  • the slurry is obtained and coated on the surface of the silicon-free release carrier film to form a polymer composite.
  • the CTE of the obtained polymer composite is 100 ppm/k, and the elongation at break before curing is 150%.
  • the molecular structure of polymer protective film contains The surface is corona treated.
  • the roughness Ra is 190nm
  • the elongation at break is greater than 200%
  • the tensile strength is 100MPa
  • the CTE is 150ppm/K
  • the softening temperature point is 160°C.
  • the slurry is obtained and coated on the surface of the fluoroplastic release carrier film to form a polymer composite.
  • the molecular structure of polymer protective film contains The surface is corona treated.
  • the roughness Ra is 2 ⁇ m
  • the elongation at break is 2.25%
  • the tensile strength is 99 MPa
  • the CTE is 9 ppm/K.
  • the slurry is obtained and coated on the surface of the fluoroplastic release carrier film to form a polymer composite.
  • the molecular structure of polymer protective film contains The roughness Ra is 4nm, the tensile strength is 99MPa, and the CTE is 9ppm/K.

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Abstract

本发明公开一种制备精细线路的绝缘胶膜材料及其制备方法，具体地，其由胶膜层和载体膜组成的聚合物复合物和通过热压或辊压覆盖于胶膜层表面的聚合物保护膜两部分组成；所述聚合物保护膜的粗糙度Ra为5nm～1μm；热膨胀系数为10ppm/K～300ppm/K；软化温度点为40℃～350℃；断裂伸长率为10％～1000％。本发明通过发现聚合物保护膜具有适宜的热膨胀系数、软化点及断裂伸长率，能够保障绝缘胶膜的加工性能。

Description

一种制备精细线路的绝缘胶膜材料及其制备方法 技术领域
本发明属于电子封装材料技术领域，更具体地，本发明涉及一种应用于半导体系统级封装用的绝缘胶膜材料。
技术背景
随着电子信息技术的发展，特别是近年来以可穿戴电子、智能手机、超薄电脑、无人驾驶、物联网技术和5G通讯技术为主的快速发展，对电子系统的小型化、轻薄化、多功能、高性能等方面提出了越来越高的要求。为此，集成电路的层数越来越多，线路线宽越来越小以增加布线密度。随着芯片制程能力的提升与之相匹配的基板也向着多层，高线路密度的趋势发展。要求绝缘胶膜具有更好的线路填充能力和可靠性。
发明内容
为了克服现有技术的缺陷，本发明提供一种可用于本导体封装的、适用于加成法或半加成法制备精细线路的积层绝缘胶膜材料。
为了实现上述发明目的，本发明采取了以下技术方案。
本发明一个方面提供了一种绝缘胶膜材料，由胶膜层和载体膜组成的聚合物复合物和通过热压或辊压覆盖于胶膜层表面的聚合物保护膜两部分组成；所述聚合物保护膜表面经过离型处理；所述胶膜层由包含树脂组合物、填料粒子、树脂固化剂、其他助剂以及溶剂的浆料制成；
所述聚合物保护膜的粗糙度Ra为5nm～1μm；
所述聚合物保护膜的热膨胀系数(CTE)为10ppm/K～300ppm/K；
所述聚合物保护膜软化温度点为40℃～350℃；
所述聚合物保护膜断裂伸长率为10％～1000％。
进一步地，所述聚合物保护膜的其分子结构中包含
Figure PCTCN2022117467-appb-000001
Figure PCTCN2022117467-appb-000002
Figure PCTCN2022117467-appb-000003
中的一种或多种。
进一步地，所述离型处理的方法为以含硅离型剂、无硅离型剂、氟塑离型剂、电晕、磨砂、抛光中的一种或多种方法组合进行的离型处理。
进一步地，聚合物保护膜厚度为5μm～200μm，优选为20μm～100μm，更优选为20μm～40μm。
进一步地，聚合物保护膜的热膨胀系数(CTE)优选为15ppm/K～200ppm/K，更优选为35ppm/K～160ppm/K。
进一步地，所述聚合物保护膜软化温度点优选为50℃～250℃，更优选为60℃～200℃。
进一步地，所述聚合物保护膜的粗糙度Ra优选为10nm～0.8μm，更优选为10nm～200nm。
进一步地，所述聚合物保护膜的拉伸强度50-150MPa，优选为70-130MPa。
进一步地，所述聚合物保护膜的断裂伸长率为大于断裂伸长率大于120％～1000％，优选为断裂伸长率为150％-500％。
进一步地，所述聚合物复合物的热膨胀系数CTE为5ppm/K～200ppm/K，优选为30ppm/k-150ppm/k，更优选为40ppm/k-100ppm/k。
进一步地，所述聚合物复合物的固化前断裂伸长率为1％-300％，优选为30％-200％，更优选为50％-160％。
进一步地，所述树脂组合物选自环氧树脂、橡胶树脂、酚醛树脂、聚酯树脂、聚酰胺树脂、脲醛树脂、三聚氰胺甲醛树脂、呋喃树脂、有机硅树脂、聚酯树脂、丙烯酸树脂、氰酸酯树脂、乙烯基树脂、烃类树脂、聚醚类树脂中的一种或多种组合。其中环氧树脂选自双酚A型环氧树脂、双酚F型环氧树脂、酚醛型环氧树脂、邻甲酚醛型环氧树脂、多官能团环氧树脂、脂环族环氧树脂、间苯二酚环氧树脂、橡胶改性环氧树脂、聚氨酯改性环氧树脂、联苯环氧树脂、双环戊二烯环氧树脂、化环氧树脂中的一种或多种。橡胶树脂选自丁苯橡胶、顺丁橡胶、异戊橡胶、乙丙橡胶、氯丁橡胶、丁腈橡胶、氯丁橡胶、氯基橡胶、氟橡胶、氯醚橡胶、硅橡胶、聚氨酯橡胶、聚硫橡胶、丙烯酸酯橡胶中的一种或多种。所述酚醛树脂包括线性苯酚甲醛树脂、线性双酚A甲醛树脂、线性邻甲酚甲醛树脂、苯酚芳烷基酚醛树脂、含氮酚醛树脂、双环戊二烯酚醛树脂、联苯型酚醛树脂、四酚基乙烷酚醛树脂、奈型酚醛树脂中的一种或多种。所述聚酯树脂包括双酚A型聚酯树脂、双酚F型聚酯树脂、双环戊二烯聚酯树脂、联苯型聚酯树脂、奈型聚酯树脂中的一种或多种。所述丙烯酸树脂包括单官能聚 氨酯丙烯酸树脂、双官能脂肪族丙烯酸树脂、三官能脂肪族丙烯酸树脂、四官能脂肪族丙烯酸树脂、聚酯丙烯酸树脂、双酚A环氧丙烯酸树脂、酚醛环氧丙烯酸树脂、二季戊四醇六丙烯酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯、二-三羟甲基丙烷四丙烯酸酯中的一种或多种。所述聚酯树脂包括双酚A型聚酯树脂、双酚F型聚酯树脂、双环戊二烯聚酯树脂、联苯型聚酯树脂、奈型聚酯树脂中的一种或多种。
进一步地，所述树脂固化剂选自脂肪多元胺型固化剂、脂环多元胺型固化剂、潜伏固化剂、酸酐类固化剂、芳香胺类固化剂、聚酰胺固化剂、合成树脂类固化剂。更进一步地，所述脂肪多元胺型固化剂选自乙二胺、二乙烯三胺、三乙烯四胺、四乙烯五胺、二丙烯三胺、二甲胺基丙胺、二乙胺基丙胺、三甲基六亚甲基二胺、二己基三胺、三甲基己二胺、聚醚二胺等；所述脂环多元胺型固化剂选自二氨甲基环己烷、孟烷二氨、氨乙基呱嗪、六氢吡啶、二氨基环己烷、二氨甲基环己基甲烷、二氨基环己基甲烷等；所述潜伏固化剂选自二氰二胺、三氟化硼单乙胺、三氟化硼苯乙胺、三氟化硼邻甲基苯胺、三氟化硼卞胺、三氟化硼二甲基苯胺、三氟化硼乙基苯胺、三氟化硼吡啶、MS-1微胶囊、MS-2微胶囊、葵二酸三酰肼等；所述酸酐类固化剂选自苯酮四羧酸二酐、甲基内次甲基四氢邻苯二甲酸酐、四氢邻苯二甲酸酐、甲基四氢邻苯二甲酸酐、戊二酸酐、聚壬二酸酐、二氯代顺丁烯二酸酐、甲基六氢邻苯二甲酸酐、邻苯二甲酸酐、偏苯三酸酐、均苯四甲酸酐、偏苯四酸二酐、二苯酮四羧基二酸酐、顺丁烯二酸酐、十二烷基代顺丁烯二酸酐、琥珀酸酐、六氢苯二甲酸酐、环戊烷四酸二酐、二顺丁烯二酸酐基甲乙苯等；所述芳香胺类固化剂选自间苯二胺、间苯二甲胺、二氨基二苯基甲烷、双环芴二胺、二氨基二苯基砜、4-氯邻苯二胺等；所述合成树脂类固化剂选自苯胺甲醛树脂、苯酚甲醛树脂、线性酚醛树脂等中的一种或多种。
进一步地，所述无机填料为二氧化硅、氧化铝、氮化硼、二氧化钛、氧化锌、氧化锆、氧化镁、碳酸钙、钛酸钡、钛酸锶、钛酸锶钡、锆钛酸铅、钛酸铜钙等中的一种或多种混合物。无机填料的尺寸为20nm～10μm，优选为50nm～3μm,更优选为200nm～1μm，或多尺度的混合物。无机填料粒子的形状主要为球形或类球形颗粒，也可以存在部分其他形状如棒、线、片等的颗粒。无机填料粒子占复合物固体成分即不含溶剂等挥发成分质量的20％～80％，优选为30％～60％，更优选为45％～55％。
进一步地，载体膜选自聚合物薄膜材料和纸基膜材料，进一步地，选自聚酯薄膜(PET)、聚醚醚酮薄膜(PEEK)、聚醚酰亚胺薄膜(PEI)、聚酰亚胺薄膜(PI)、聚碳酸酯薄膜(PC)、离型纸、淋膜纸等。所述载体膜选自具有离型膜的载体膜，所述离型膜选自含硅离型膜、无硅离型膜、氟塑离型膜、电晕离型膜、磨砂离型膜、抛光离型膜、哑光离型膜。起支撑作用 的载体膜厚度为10μm～300μm，优选为20μm～100μm，更优选为30μm～60μm。
所述溶剂选自可挥发溶剂，包括芳香类溶剂、卤化烃类溶剂、脂肪烃类溶剂、脂环烃类溶剂、醇类溶剂、酯类溶剂、酮类溶剂、酰胺类溶剂中的一种或多种；更优选地，所述芳香类溶剂包括二甲苯、邻二甲苯、间二甲苯、对二甲苯、六甲基苯、乙苯中的一种或多种；更优选地，所述卤化烃类溶剂包括氯苯、二氯苯、二氯甲烷中的一种或多种；更优选地，所述脂肪烃类溶剂包括戊烷、己烷、辛烷中的一种或多种；更优选地，所述脂环烃类溶剂包括环己烷、环己酮、甲苯环己酮中的一种或多种；更优选地，所述醇类溶剂包括甲醇、乙醇、异丙醇中的一种或多种；更优选地，所述酯类溶剂包括醋酸甲酯、醋酸乙酯、醋酸丙酯中的一种或多种；更优选地，所述酮类溶剂包括丙酮、丁酮、甲基异丁基甲酮中的一种或多种；更优选地，所述酰胺类溶剂包括二甲基甲酰胺、六甲基磷酰胺、N,N-二甲基甲酰胺、二甲基乙酰胺中的一种或多种。
进一步地，所述助剂选自环氧树脂固化促进剂、分散剂、消泡剂、流平剂、偶联剂中的一种或多种组合。
所述环氧树脂固化促进剂，包括苯酚、双酚A、间苯二酚、2,4,6-三(二甲氨基亚甲基)苯酚、卞基二甲胺、酰基胍、过氧化苯甲酰、乙酰丙酮铜、乙酰丙酮铝、乙酰丙酮锆、咪唑类，所述咪唑类选自2-甲基咪唑、2-乙基咪唑、2,4-二乙基咪唑、2-甲基-4-乙基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑等中的一种或多种。
所述分散剂选自脂肪酸类，如聚乙二醇脂肪酸酯、脂肪酸甲酯磺酸钠、蔗糖脂肪酸酯、聚甘油脂肪酸酯、脂肪酸聚氧乙烯醚、壬基酚聚氧乙烯醚、聚氧乙烯失水山梨醇脂肪酸酯、聚乙烯吡咯烷酮K30、聚乙烯吡咯烷酮K90、木质素磺酸钠、聚丙烯酰胺、十二烷基苯磺酸钠、亚甲基双甲基萘磺酸钠及酯类和脂肪族酰胺类中一种或多种的组合。
所述消泡剂选自有机硅类、聚醚类、聚醚改性聚硅氧烷类消泡剂中的一种或多种的组合。
所述流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、烷基改性有机硅氧烷、端基改性有机硅、有机改性聚硅氧烷丙烯酸型流平剂及丙烯酸酯型流平剂中的一种或多种的组合。
所述偶联剂优选为硅烷偶联剂，通式为RSiX3，式中R代表氨基、巯基、乙烯基、环氧基、氰基及甲基丙烯酰氧基等基团，X代表能够水解的烷氧基(如甲氧基、乙氧基等)。如KH550，KH560，KH570，KH792，DL602，DL171中的一种或多种的组合。
本发明的保护膜适用的聚合物复合物的热膨胀系数(CTE)为5ppm/K～200ppm/K；固化前断裂伸长率为1％～300％；
本发明另一个方面提供了本发明上述绝缘胶膜材料在制备用于印刷线路板(PCB)、基板、载板、半导体电子的封装材料中的用途。
本发明再一个方面提供了上述绝缘胶膜材料的制备方法，其包括如下步骤：
S1)称取制备浆料的原料；
S2)将制备浆料的原料混合，涂布于载体膜表面，形成聚合物复合物；
S3)经过热压或辊压将聚合物保护膜贴附于聚合物复合物表面，制成绝缘胶膜材料。
进一步地，S3)中热压或者辊压的压合温度为25℃-200℃，优选为25℃-150℃，更优选为25℃-100℃。
本发明再一个方面提供了一种聚合物保护膜在作为用于印刷线路板(PCB)、基板、载板、半导体电子的封装胶膜的保护膜中的用途；
所述聚合物保护膜粗糙度Ra为5nm～1μm；
所述聚合物保护膜的热膨胀系数(CTE)为10ppm/K～300ppm/K；
所述聚合物保护膜软化温度点为40℃～350℃；
所述聚合物保护膜断裂伸长率为10％～1000％。
进一步地，所述封装胶膜的热膨胀系数(CTE)为5ppm/K～200ppm/K；所述封装胶膜的固化前断裂伸长率为1％～300％；所述封装胶膜的热膨胀系数优选为30ppm/k-150ppm/k，更优选为40ppm/k-100ppm/k；固化前断裂伸长率优选为30％-200％，更优选为50％-160％。
有益效果
所制得的胶膜具有良好表面形貌，无孔洞，无缺陷，厚度均匀，该胶膜的线路填充能力良好和可靠性高。
附图说明
图1为绝缘胶膜材料的结构示意图，其中1-1为聚合物复合物，1-2为聚合物保护膜。
图2绝缘胶膜材料线路填充截面显微镜照片。2-1实施例1绝缘胶膜材料线路填充截面图，2-2实施例2绝缘胶膜材料线路填充截面图，2-3对比例1绝缘胶膜材料线路填充截面图。2-4对比例1绝缘胶膜材料保护膜剥离后的表面图。
具体实施方式
为了使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明，但不能理解为对本发明的可实施范围的限定。
本实施例提供了一种适用于用于半导体封装的、适用于加成法或半加成法制备精细线路的绝缘胶膜材料，其是通过以下步骤制备的：
所述聚合物保护膜的其分子结构选自
Figure PCTCN2022117467-appb-000004
Figure PCTCN2022117467-appb-000005
聚合物保护膜的热膨胀系数(CTE)为10ppm/K～300ppm/K，优选为15ppm/K～200ppm/K，更优选为15ppm/K～150ppm/K。CTE低于10ppm/K或高于300ppm/K，则在保护膜贴合过程中由于其伸长率与聚合物复合物相差较大，从而导致贴合错位，产生缺陷，影响胶膜质量。
由于聚合物保护膜需要在一定温度下施加张力进行贴合，因此其软化温度点为40℃～350℃，优选为50℃～250℃，更优选为60℃～200℃，保障贴合过程中保护膜不受张力影响，在贴合过程中过高的温度将会导致聚合物复合物发生固化而影响线路填充，因此就不需要过高的软化温度点。
完成贴合过程中及完成贴合后的收卷过程都需要对聚合物保护膜施加不同程度的应力，因此其断裂伸长率为10％～1000％，优选为50％～800％，更优选为100％～500％，避免因保护膜断裂而导致绝缘胶膜失效，过高的断裂伸长率则会导致聚合物复合物在贴合是发生断裂。聚合物保护膜厚度为5μm～200μm，优选为20μm～100μm，更优选为20μm～40μm。聚合物保护膜的粗糙度Ra为5nm～1μm，优选为10nm～0.8μm，更优选为10nm～0.5μm，当Ra低于5nm时，过于光滑的表面不利于保护膜与聚合物复合的贴附，而造成气泡等缺陷；当Ra高于1μm，将会对聚合物复合物的厚度误差产生影响，进而导致其可靠性下降。聚合物保护膜表面经过含硅离型剂、无硅离型剂、氟塑离型剂、电晕、磨砂、抛光中的一种或多种方法组合进行离型处理，以避免在压合时聚合物复合物转移到聚合物保护膜而产生缺陷。
实施例1
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000006
Figure PCTCN2022117467-appb-000007
2.经过600rpm球磨12小时后得到浆料涂布于无硅离型载体膜表面形成聚合物复合物，制得的聚合物复合物CTE为50ppm/k，固化前断裂伸长率120％。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000008
表面经过无硅离型剂处理。粗糙度Ra为20nm，断裂伸长率大于360％，拉伸强度79MPa，CTE为109ppm/K，软化温度点为80℃。
4.在100℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充良好无孔洞(图2-1)。胶膜厚度误差为±4％。
实施例2
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000009
2.经过600rpm球磨12小时后得到浆料涂布于无硅离型载体膜表面形成聚合物复合物，制得的聚合物复合物CTE为40ppm/k，固化前断裂伸长率60％。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000010
表面经过电晕处理。粗糙度Ra为 59nm，断裂伸长率为376％，拉伸强度为90MPa，CTE为102ppm/K，软化温度点为80℃。
4.在100℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充良好无孔洞(图2-2)。胶膜厚度误差为±6％。
实施例3
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000011
2.经过600rpm球磨12小时后得到浆料涂布于无硅离型载体膜表面形成聚合物复合物，制得的聚合物复合物CTE为45ppm/k，固化前断裂伸长率120％。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000012
表面经过离型剂处理。粗糙度Ra为100nm，断裂伸长率大于150％，拉伸强度120MPa，CTE为40ppm/K，软化温度点为180℃。
4.在105℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充良好无孔洞。胶膜厚度误差为±5％。
实施例4
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000013
Figure PCTCN2022117467-appb-000014
2.经过600rpm球磨12小时后得到浆料涂布于无硅离型载体膜表面形成聚合物复合物，制得的聚合物复合物CTE为100ppm/k，固化前断裂伸长率150％。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000015
表面经过电晕处理。粗糙度Ra为190nm，断裂伸长率大于200％，拉伸强度100MPa，CTE为150ppm/K，软化温度点为160℃。
4.在105℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充良好无孔洞。胶膜厚度误差为±5％。
对比例1
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000016
2.经过600rpm球磨12小时后得到浆料涂布于氟塑离型载体膜表面形成聚合物复合物。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000017
表面经过电晕处理。粗糙度Ra为2μm，断裂伸长率为2.25％，拉伸强度为99MPa，CTE为9ppm/K。
4.在100℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充不良有孔洞(图2-3)。胶膜厚度误差大于±10％。
对比例2
1.称取以下制备浆料的原料：
Figure PCTCN2022117467-appb-000018
2.经过600rpm球磨12小时后得到浆料涂布于氟塑离型载体膜表面形成聚合物复合物。
3.在120℃下干燥5分钟后，在60℃下将聚合物保护膜热压于聚合物复合物表面制备成绝缘胶膜材料。聚合物保护膜分子结构包含
Figure PCTCN2022117467-appb-000019
粗糙度Ra为4nm，拉伸强度为99MPa，CTE为9ppm/K。
4.在100℃下将绝缘胶膜材料真空热压在线路表面，观察绝缘胶膜线路填充能力。线路填充不良有孔洞。且保护膜剥离产生表面缺陷(图2-4)。

Claims (10)

  1. 一种绝缘胶膜材料，其由胶膜层和载体膜组成的聚合物复合物和通过热压或辊压覆盖于胶膜层表面的聚合物保护膜两部分组成；所述聚合物保护膜表面经过离型处理；所述胶膜层由包含树脂组合物、填料粒子、树脂固化剂、其他助剂以及溶剂的浆料制成；其特征在于，
    所述聚合物保护膜的粗糙度Ra为5nm～1μm；
    所述聚合物保护膜的热膨胀系数(CTE)为10ppm/K～300ppm/K；
    所述聚合物保护膜软化温度点为40℃～350℃；
    所述聚合物保护膜断裂伸长率为10％～1000％；
    优选，所述聚合物保护膜的其分子结构中包含
    Figure PCTCN2022117467-appb-100001
    Figure PCTCN2022117467-appb-100002
    Figure PCTCN2022117467-appb-100003
    中的一种或多种结构。
  2. 权利要求1所述的绝缘胶膜材料，其特征在于，聚合物保护膜的热膨胀系数为15ppm/K～200ppm/K，所述聚合物保护膜软化温度点为50℃～250℃，所述聚合物保护膜的粗糙度Ra为10nm～0.8μm，所述聚合物保护膜的拉伸强度为50MPa-150MPa，所述聚合物保护膜的断裂伸长率为大于断裂伸长率为120％～1000％；
    优选地，聚合物保护膜的热膨胀系数为35ppm/K～160ppm/K，所述聚合物保护膜软化温度点为60℃～200℃，所述聚合物保护膜的粗糙度Ra为10nm～200nm，所述聚合物保护膜的拉伸强度为70MPa-130MPa，所述聚合物保护膜的的断裂伸长率为150％-500％。
  3. 权利要求1所述的绝缘胶膜材料，其特征在于，所述聚合物复合物的热膨胀系数为5ppm/K～200ppm/K，所述聚合物复合物的固化前断裂伸长率为1％-300％；
    优选地，所述聚合物复合物的热膨胀系数为30ppm/k-150ppm/k，所述聚合物复合物的固化前断裂伸长率为30％-200％；
    更优选地，所述聚合物复合物的热膨胀系数为40ppm/k-100ppm/k，所述聚合物复合物的固化前断裂伸长率为50％-160％。
  4. 权利要求1所述的绝缘胶膜材料，其特征在于，聚合物保护膜厚度为5μm～200μm，优选为20μm～100μm，更优选为20μm～40μm。
  5. 权利要求1所述的绝缘胶膜材料，其特征在于，所述树脂组合物选自环氧树脂、橡胶树脂、酚醛树脂、聚酯树脂、聚酰胺树脂、脲醛树脂、三聚氰胺甲醛树脂、呋喃树脂、有机硅树脂、聚酯树脂、丙烯酸树脂、氰酸酯树脂、乙烯基树脂、烃类树脂、聚醚类树脂中的一种或多种组合；
    所述树脂固化剂选自脂肪多元胺型固化剂、脂环多元胺型固化剂、潜伏固化剂、酸酐类固化剂、芳香胺类固化剂、聚酰胺固化剂、合成树脂类固化剂；
    所述无机填料为二氧化硅、氧化铝、氮化硼、二氧化钛、氧化锌、氧化锆、氧化镁、碳酸钙、钛酸钡、钛酸锶、钛酸锶钡、锆钛酸铅、钛酸铜钙等中的一种或多种混合物。
    所述溶剂选自可挥发溶剂，包括芳香类溶剂、卤化烃类溶剂、脂肪烃类溶剂、脂环烃类溶剂、醇类溶剂、酯类溶剂、酮类溶剂、酰胺类溶剂中的一种或多种；
    所述助剂选自环氧树脂固化促进剂、分散剂、消泡剂、流平剂、偶联剂中的一种或多种组合；
    优选地，所述环氧树脂固化促进剂选自苯酚、双酚A、间苯二酚、2,4,6-三(二甲氨基亚甲基)苯酚、卞基二甲胺、酰基胍、过氧化苯甲酰、乙酰丙酮铜、乙酰丙酮铝、乙酰丙酮锆、咪唑类，所述咪唑类选自2-甲基咪唑、2-乙基咪唑、2,4-二乙基咪唑、2-甲基-4-乙基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑等中的一种或多种；
    优选地，所述分散剂选自聚乙二醇脂肪酸酯、脂肪酸甲酯磺酸钠、蔗糖脂肪酸酯、聚甘油脂肪酸酯、脂肪酸聚氧乙烯醚、壬基酚聚氧乙烯醚、聚氧乙烯失水山梨醇脂肪酸酯、聚乙烯吡咯烷酮K30、聚乙烯吡咯烷酮K90、木质素磺酸钠、聚丙烯酰胺、十二烷基苯磺酸钠、亚甲基双甲基萘磺酸钠及酯类和脂肪族酰胺类中一种或多种的组合；
    优选地，所述消泡剂选自有机硅类、聚醚类、聚醚改性聚硅氧烷类消泡剂中的一种或多种的组合；
    优选地，所述流平剂选自聚二甲基硅氧烷、聚醚聚酯改性有机硅氧烷、烷基改性有机硅氧烷、端基改性有机硅、有机改性聚硅氧烷丙烯酸型流平剂及丙烯酸酯型流平剂中的一种或多种的组合；
    优选地，所述偶联剂为硅烷偶联剂。
  6. 权利要求1所述的绝缘胶膜材料，其特征在于，进一步地，载体膜选自聚合物薄膜材料和纸基膜材料；
    优选地，聚合物薄膜材料选自聚酯薄膜、聚醚醚酮薄膜、聚醚酰亚胺薄膜、聚酰亚胺薄膜、聚碳酸酯薄膜；
    优选地，纸基膜材料选自离型纸、淋膜纸；
    优选地，所述载体膜选自具有离型膜的载体膜，更优选地，所述离型膜选自含硅离型膜、无硅离型膜、氟塑离型膜、电晕离型膜、磨砂离型膜、抛光离型膜、哑光离型膜；
    优选地，载体膜厚度为10μm～300μm。
  7. 权利要求1-6任一项所述绝缘胶膜材料在制备用于印刷线路板(PCB)、基板、载板、半导体电子的封装材料中的用途。
  8. 权利要求1-6任一项所述绝缘胶膜材料的制备方法，其包括如下步骤：
    S1)称取制备浆料的原料；
    S2)将制备浆料的原料混合，涂布于载体膜表面，形成聚合物复合物；
    S3)经过热压或辊压将聚合物保护膜贴附于聚合物复合物表面，制成绝缘胶膜材料；
    优选地，S3)中热压或者辊压的压合温度为25℃-200℃，优选为25℃-150℃，更优选为25℃-100℃。
  9. 一种聚合物保护膜在作为用于印刷线路板(PCB)、基板、载板、半导体电子的封装胶膜的保护膜中的用途；
    所述聚合物保护膜粗糙度Ra为5nm～1μm；
    所述聚合物保护膜的热膨胀系数(CTE)为10ppm/K～300ppm/K；
    所述聚合物保护膜软化温度点为40℃～350℃；
    所述聚合物保护膜断裂伸长率为10％～1000％。
  10. 权利要求9所述的用途，其特征在于，所述封装胶膜的热膨胀系数为5ppm/K～200ppm/K；所述封装胶膜的固化前断裂伸长率为1％～300％；
    优选地，所述封装胶膜的热膨胀系数优选为30ppm/k-150ppm/k，更优选为40ppm/k-100ppm/k；
    优选地，固化前断裂伸长率优选为30％-200％，更优选为50％-160％。
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