WO2024042750A1 - パネルおよび製造方法 - Google Patents

パネルおよび製造方法 Download PDF

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Publication number
WO2024042750A1
WO2024042750A1 PCT/JP2023/008368 JP2023008368W WO2024042750A1 WO 2024042750 A1 WO2024042750 A1 WO 2024042750A1 JP 2023008368 W JP2023008368 W JP 2023008368W WO 2024042750 A1 WO2024042750 A1 WO 2024042750A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible wiring
wiring board
resin
panel
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/008368
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
西室　健一
貴仁 真船
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Alpine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Alpine Co Ltd filed Critical Alps Alpine Co Ltd
Priority to JP2024542576A priority Critical patent/JPWO2024042750A1/ja
Priority to KR1020257001586A priority patent/KR20250024997A/ko
Priority to DE112023003509.1T priority patent/DE112023003509T5/de
Priority to CN202380055318.7A priority patent/CN119585096A/zh
Publication of WO2024042750A1 publication Critical patent/WO2024042750A1/ja
Priority to US19/040,186 priority patent/US20250174921A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Definitions

  • the present invention relates to a panel and a manufacturing method.
  • Patent Document 1 listed below discloses a technique of integrally molding a circuit film on one main surface of a molded body by molding the molded body by injection molding.
  • Patent Document 1 since the wiring is arranged between the molded body and the circuit film, a gap is created between the molded body and the circuit film, and water can enter the gap. There is a risk that the quality may deteriorate, such as infiltration of the material or the appearance of the gap as a shade of color.
  • Patent Document 1 the technology disclosed in Patent Document 1 is to fill the first area in the mold with molten resin and the second area in the mold with molten resin. Since it is necessary to inject the molten resin twice, the device configuration and the manufacturing process become complicated, and there is a risk that some areas will not be filled with the molten resin or that the time and cost related to manufacturing will increase.
  • a panel includes an insulating film, a molded resin integrally formed with the insulating film by injection molding, an electric circuit provided on the back side of the insulating film, and one end connected to a connecting terminal of the electric circuit.
  • the flexible wiring board has a connecting portion that passes through the molded resin and is drawn out from the back side of the molded resin, and both surfaces of the flexible wiring board are coated with adhesive resin.
  • high-quality panels can be manufactured at low cost and in a short time.
  • a diagram schematically showing a laminated structure of a panel according to an embodiment A diagram schematically showing a method for manufacturing a panel according to an embodiment
  • a diagram schematically showing a method for manufacturing a panel according to an embodiment A diagram schematically showing a method for manufacturing a panel according to an embodiment
  • a diagram schematically showing a method for manufacturing a panel according to an embodiment A diagram schematically showing a method for manufacturing a panel according to an embodiment
  • a diagram schematically showing a method for manufacturing a panel according to an embodiment A diagram schematically showing a method for manufacturing a panel according to an embodiment
  • a diagram schematically showing a method for manufacturing a panel according to an embodiment A diagram schematically showing a method for manufacturing a panel according to an embodiment
  • FIG. 1 is a diagram schematically showing a laminated structure of a panel 100 according to an embodiment.
  • the panel 100 includes a decorative film 110, an FPC 130, a molded resin 140, an adhesive member 150, and a protection member 160.
  • the decorative film 110 decorates the surface of the panel 100 by being provided on the surface of the panel 100 so as to cover the entire surface of the panel 100.
  • the surface 110A of the decorative film 110 becomes an operation surface 100A on which a proximity operation is performed using an operation object.
  • Decorative film 110 includes a base film 111, a decorative layer 112, and an electrostatic sensor 113.
  • the base film 111 is a transparent film-like member.
  • the base film 111 is an example of an "insulating film.”
  • the base film 111 is formed using a transparent film-like member having flexibility and insulation properties (for example, PMMA (Poly Methyl Methacrylate), PC (Polycarbonate), urethane, ABS, etc.).
  • the decorative layer 112 represents a decorative pattern (for example, a wood grain pattern, a metal pattern, etc.) presented on the surface of the panel 100 (that is, the operation surface 100A).
  • the decorative layer 112 is provided over the entire back surface of the base film 111.
  • the decorative layer 112 is formed by printing multiple color inks (for example, CMYK) on the back surface of the base film 111 in pixel units according to the pattern presented on the surface of the panel 100. .
  • the electrostatic sensor 113 is provided on the back surface 112A of the decorative layer 112 (the surface on the molded resin 140 side).
  • the electrostatic sensor 113 is an example of an "electric circuit.”
  • the electrostatic sensor 113 has a thin film shape.
  • the electrostatic sensor 113 can detect a proximity operation by the operating body by changing its capacitance according to the proximity distance of the operating body to the operating surface 100A.
  • the electrostatic sensor 113 has a connecting terminal 113B on a main surface 113A facing the molded resin 140.
  • the electrostatic sensor 113 is formed by printing on the back surface 112A of the decorative layer 112 by screen printing. Note that since the electrostatic sensor 113 is provided integrally with the decorative film 110, alignment during injection molding is not necessary.
  • the FPC 130 is an example of a "flexible wiring board” and is a flexible sheet-like and band-like wiring board.
  • the FPC 130 has a connecting portion 131 at one end.
  • the FPC 130 is physically and electrically connected to the connection terminal 113B of the electrostatic sensor 113 at the connection portion 131 using a conductive adhesive.
  • a part of one end of the FPC 130 is embedded in the molded resin 140 by injection molding the molded resin 140 .
  • the FPC 130 has a part on the other end side provided on the back surface 140A of the molded resin 140 (the surface opposite to the surface facing the decorative film 110).
  • the molded resin 140 is drawn out from the outlet 140B.
  • the FPC 130 has a first extension part 132 and a second extension part 133.
  • the first extending portion 132 is a portion extending from the connecting portion 131 in a direction along the decorative film 110.
  • the second extending portion 133 is a portion that extends in a direction away from the decorative film 110 following the first extending portion 132 .
  • the FPC 130 has adhesive resin layers 134 formed on both sides by coating both sides with adhesive resin.
  • the panel 100 can increase the degree of adhesion between the FPC 130 (the part embedded in the molded resin 140) and the molded resin 140, and It is possible to make it difficult to form a gap with the resin 140.
  • the molded resin 140 is a resin member that is integrally formed with the back surface 110B of the decorative film 110 by injection molding.
  • the molded resin 140 is a member that becomes the base of the panel 100, and is formed into a predetermined shape depending on the application by injection molding.
  • a draw-out port 140B for drawing out the FPC 130 to the outside of the molded resin 140 is provided on the back surface 140A (the surface opposite to the surface facing the decorative film 110) of the molded resin 140.
  • the drawer opening 140B is sealed by applying a sealant 141 from the outside.
  • the panel 100 according to one embodiment can suppress the intrusion of water and the like into the molded resin 140 from the drawer opening 140B.
  • the adhesive member 150 is provided between the first extending portion 132 of the FPC 130 and the back surface 110B of the decorative film 110.
  • the adhesive member 150 adheres the first extending portion 132 of the FPC 130 to the back surface 110B of the decorative film 110. That is, the adhesive member 150 plays a role of filling the gap between the first extending portion 132 of the FPC 130 and the back surface 110B of the decorative film 110.
  • the panel 100 can make it difficult to create a gap between the back surface 110B of the decorative film 110 and the molded resin 140.
  • the protective member 160 is a sheet-like member that covers the connection portion 131 of the FPC 130 that is connected to the connection terminal 113B of the electrostatic sensor 113.
  • As the protection member 160 for example, a heat-resistant tape is used.
  • the panel 100 according to one embodiment includes the protection member 160 to protect the connection part 131 of the FPC 130 from molten resin during injection molding, and to bond the connection part 131 of the FPC 130 and the connection terminal 113B of the electrostatic sensor 113. The effects of heat and pressure (softening, etc.) on the conductive adhesive can be suppressed.
  • FIGS. 2 to 8. are diagrams schematically showing a method for manufacturing the panel 100 according to one embodiment.
  • the FPC 130 is connected to the decorative film 110 (on which the decorative layer 112 and the electrostatic sensor 113 are provided). Specifically, the connection portion 131 provided at one end of the FPC 130 is bonded to the connection terminal 113B provided on the main surface 113A of the electrostatic sensor 113 using a conductive adhesive. Further, the first extending portion 132 of the FPC 130 is bonded to the back surface 110B of the decorative film 110 using the adhesive member 150. Further, a protective member 160 is attached to the connecting portion 131 of the FPC 130 so as to cover the connecting portion 131 of the FPC 130 .
  • the decorative film 110 to which the FPC 130 is connected is installed on the inner wall surface (inner bottom surface) of the first mold 11 facing the space 11A.
  • a columnar protection block 20 is installed in the first mold 11, and the second extension part 133 of the FPC 130 is protected by the protection block 20.
  • the protection block 20 can be divided into a first protection block 20A and a second protection block 20B, and the second extension part 133 of the FPC 130 is placed in the groove 21 formed in the first protection block 20A.
  • the protection block 20 is disposed and fixed at a predetermined position by being fitted into the recess 11B of the first mold 11.
  • the second extending portion 133 of the FPC 130 can be placed inside the protective block 20 without the second mold 12 being fastened to the first mold 11. The portion 133 can be easily protected.
  • the second mold 12 is fastened to the first mold 11. As a result, a cavity 10 closed by the first mold 11 and the second mold 12 is formed. Note that since the second mold 12 is formed with a through hole 12A, the protection block 20 can be fitted into the through hole 12A.
  • injection process Next, as shown in FIG. 6, from the two gates 12G1 and 12G2 provided in the second mold 12, the inside of the cavity 10 closed by the first mold 11 and the second mold 12 is simultaneously opened.
  • the molding resin 140 is injection molded by injecting molten resin.
  • suitable injection conditions gate position, gate aperture, gate opening diameter, injection pressure, etc. determined in advance by simulation are used.
  • the molten resin injected from the gate 12G1 the first surface side of the second extension part 133 of the FPC 130
  • the molten resin injected from the gate 12G2 the second surface side of the second extension part 133 of the FPC 130
  • the molten resin injected from the FPC 130 can be made to intersect at the position of the second extending portion 133 of the FPC 130 (that is, to arrive at the second extending portion 133 of the FPC 130 substantially at the same time).
  • the molded resin 140 can be formed by one injection, so the device configuration and manufacturing process can be simplified, thereby suppressing increases in time and cost related to manufacturing the panel 100. I can do it.
  • the first extending portion 132 of the FPC 130 is bonded to the back surface 110B of the decorative film 110, it is difficult to create a gap between the back surface 110B of the decorative film 110 and the molded resin 140. This can prevent water from entering the gap and preventing the gap from appearing as a shade of color on the outside.
  • the second extending portion 133 of the FPC 130 is protected by the protection block 20 in the through hole 12A of the second mold 12, the second extending portion 133 of the FPC 130 is protected by the second extending portion 133 of the FPC 130. Interference with the mold 12 can be prevented.
  • connection part 131 of the FPC 130 is protected by the protection member 160, the conductive adhesive that bonds the connection part 131 of the FPC 130 and the connection terminal 113B of the electrostatic sensor 113 is protected from the molten resin. The effects of applied heat and pressure can be suppressed.
  • the degree of adhesion between the second extension part 133 of the FPC 130 (the part embedded in the molded resin 140) and the molded resin 140 is This can be enhanced by the adhesive resin layer 134. Therefore, in the main injection process, it is difficult to form a gap between the second extension part 133 of the FPC 130 (the part embedded in the molded resin 140) and the molded resin 140, and water intrusion into the gap is suppressed. be able to.
  • the panel 100 is taken out from the first mold 11.
  • the removed panel 100 has a decorative film 110 integrally provided in front of a molded resin 140 having a predetermined outer shape (the same shape as the cavity 10 closed by the first mold 11 and the second mold 12).
  • the FPC 130 is pulled out from the pull-out opening 140B of the back surface 140A of the molded resin 140.
  • the outlet 140B for the molded resin 140 in the panel 100 is sealed by applying a sealant 141 from the outside. Thereby, it is possible to prevent water from entering the inside of the molded resin 140 from the outlet 140B.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
PCT/JP2023/008368 2022-08-22 2023-03-06 パネルおよび製造方法 Ceased WO2024042750A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2024542576A JPWO2024042750A1 (https=) 2022-08-22 2023-03-06
KR1020257001586A KR20250024997A (ko) 2022-08-22 2023-03-06 패널 및 제조 방법
DE112023003509.1T DE112023003509T5 (de) 2022-08-22 2023-03-06 Paneel und verfahren zur herstellung
CN202380055318.7A CN119585096A (zh) 2022-08-22 2023-03-06 面板以及制造方法
US19/040,186 US20250174921A1 (en) 2022-08-22 2025-01-29 Panel and manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-131653 2022-08-22
JP2022131653 2022-08-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/040,186 Continuation US20250174921A1 (en) 2022-08-22 2025-01-29 Panel and manufacturing method

Publications (1)

Publication Number Publication Date
WO2024042750A1 true WO2024042750A1 (ja) 2024-02-29

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ID=90012895

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/008368 Ceased WO2024042750A1 (ja) 2022-08-22 2023-03-06 パネルおよび製造方法

Country Status (6)

Country Link
US (1) US20250174921A1 (https=)
JP (1) JPWO2024042750A1 (https=)
KR (1) KR20250024997A (https=)
CN (1) CN119585096A (https=)
DE (1) DE112023003509T5 (https=)
WO (1) WO2024042750A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012011691A (ja) * 2010-07-01 2012-01-19 Nissha Printing Co Ltd 導電回路一体化成形品及びその製造方法
JP2014035805A (ja) * 2012-08-07 2014-02-24 Hosiden Corp 部品モジュール及び部品モジュールの製造方法
CN104465548A (zh) * 2014-12-10 2015-03-25 华进半导体封装先导技术研发中心有限公司 一种三维柔性封装结构及其注塑成型方法
JP2021068755A (ja) * 2019-10-18 2021-04-30 Ｎｉｓｓｈａ株式会社 成形品、電気製品及び成形品の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3035634B2 (ja) * 1991-05-20 2000-04-24 オムロン株式会社 電子機器の基板製造方法
JP4705807B2 (ja) * 2005-05-16 2011-06-22 多治見無線電機株式会社 コネクタ
JP2016004702A (ja) * 2014-06-18 2016-01-12 日立金属株式会社 モールド成形体付きケーブルの製造方法及びモールド成形体付きケーブル
JP2017159624A (ja) * 2016-03-11 2017-09-14 本田技研工業株式会社 インサート成形方法およびインサート成形装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012011691A (ja) * 2010-07-01 2012-01-19 Nissha Printing Co Ltd 導電回路一体化成形品及びその製造方法
JP2014035805A (ja) * 2012-08-07 2014-02-24 Hosiden Corp 部品モジュール及び部品モジュールの製造方法
CN104465548A (zh) * 2014-12-10 2015-03-25 华进半导体封装先导技术研发中心有限公司 一种三维柔性封装结构及其注塑成型方法
JP2021068755A (ja) * 2019-10-18 2021-04-30 Ｎｉｓｓｈａ株式会社 成形品、電気製品及び成形品の製造方法

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JPWO2024042750A1 (https=) 2024-02-29
DE112023003509T5 (de) 2025-06-26
CN119585096A (zh) 2025-03-07
KR20250024997A (ko) 2025-02-20
US20250174921A1 (en) 2025-05-29

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