WO2024024027A1 - コア基板およびインターポーザ - Google Patents

コア基板およびインターポーザ Download PDF

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Publication number
WO2024024027A1
WO2024024027A1 PCT/JP2022/029114 JP2022029114W WO2024024027A1 WO 2024024027 A1 WO2024024027 A1 WO 2024024027A1 JP 2022029114 W JP2022029114 W JP 2022029114W WO 2024024027 A1 WO2024024027 A1 WO 2024024027A1
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WO
WIPO (PCT)
Prior art keywords
magnetic body
conductor
core substrate
interposer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/029114
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
芳嗣 若園
信 谷
孝浩 安藤
安紗美 名取
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to PCT/JP2022/029114 priority Critical patent/WO2024024027A1/ja
Priority to JP2024536682A priority patent/JP7780020B2/ja
Publication of WO2024024027A1 publication Critical patent/WO2024024027A1/ja
Priority to US19/023,701 priority patent/US20250167091A1/en
Anticipated expiration legal-status Critical
Priority to JP2025200371A priority patent/JP2026020289A/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Definitions

  • the present invention relates to a core substrate and an interposer, and particularly to a core substrate with a built-in inductor for forming an interposer on which a semiconductor element is mounted.
  • an interposer is disposed between a semiconductor element and a motherboard.
  • the semiconductor element and the motherboard are connected to the interposer using solder balls.
  • a multilayer wiring printed board is shown as an interposer, which consists of a core substrate, three conductor circuit layers laminated on the core substrate facing the semiconductor element, and a conductive circuit layer laminated on the core substrate facing the motherboard. It includes three laminated conductor circuit layers.
  • the wiring size is gradually reduced by passing through three conductive circuit layers.
  • Efficient power management is sometimes required for semiconductor devices such as integrated circuits (ICs).
  • ICs integrated circuits
  • the voltage supplied to each of a plurality of arithmetic cores included in a processor chip (semiconductor element) is controlled by a voltage regulator depending on the amount of arithmetic processing of the processor.
  • Configuring a voltage regulator typically requires switches, capacitors, and inductors.
  • a switch, a capacitor, and an inductor are required for each computing core.
  • This package substrate has a built-in inductor for the purpose described above. Specifically, this package substrate has a substrate core, a conductive through hole passing through the substrate core, and a magnetic coating around the conductive through hole.
  • the magnetic coating may include magnetic particles.
  • the substrate core may be any substrate on which a build-up layer (conductor circuit layer) is to be formed.
  • An organic material is exemplified as the core substrate.
  • a core substrate provided with an inductor is disclosed.
  • a through hole is formed in the axial direction of a magnetic body extending in the longitudinal direction, and a conductor is formed on the inner surface of the through hole by metal plating. By forming a hollow in the conductor, stress caused by the difference in thermal expansion between the conductor and the magnetic material is released.
  • a through hole is formed in the substrate, the inductor is inserted into the through hole, and the space between the inductor and the substrate is filled with resin.
  • the die that will be bonded to the interposer is equipped with multiple processing cores.
  • high-performance processors such as those for data servers have many computing cores to increase their computing power, so the number of computing cores per die area is large, and the die area per computing core is becoming smaller. ing.
  • a high-density inductor having a larger inductance per unit area of the interposer is required.
  • a substrate core mainly made of an organic material has a conductive through hole (conductor part) and a magnetic coating provided around the conductor part and containing magnetic particles. (magnetic body part) and are exemplified.
  • the magnetic material portion needs to be formed at a temperature lower than the allowable temperature limit of the organic material of the substrate core.
  • a typical construction method that satisfies this requirement is a method of solidifying a resin in which magnetic particles are dispersed.
  • the magnetic body part is composed of magnetic particles dispersed in a resin
  • ratio of magnetic particles per volume ratio of magnetic particles per volume
  • the space between the inductor and the substrate is filled with resin. Since resin materials generally have lower heat resistance than inorganic materials, the heat resistance of the core substrate may be lowered due to the use of this resin. Further, the conductor (conductor portion) of the inductor is made of a plating film. In other words, a plating method is used as a method for forming the conductor portion. Due to this, variations in electrical properties (particularly conductivity) of the conductor portion tend to increase.
  • the present invention has been made to solve the above problems, and its purpose is to provide a core substrate with a built-in inductor for configuring an interposer on which a semiconductor element is mounted, the core substrate having a built-in inductor. It is an object of the present invention to provide a core substrate having a built-in inductor having a large inductance per unit area, and having high heat resistance and stable electrical characteristics.
  • the first aspect is a core substrate with a built-in inductor for forming an interposer on which a semiconductor element is mounted.
  • the core substrate includes a ceramic substrate, a conductor portion, and a magnetic material portion.
  • the ceramic substrate has a first surface and a second surface opposite to the first surface in the thickness direction, and has a through hole between the first surface and the second surface. .
  • the conductor portion passes through the through hole and is made of a sintered material containing sintered metal.
  • the magnetic body part surrounds the conductor part in the through hole and is made of ceramics.
  • the ceramic substrate and the magnetic body portion are inorganically bonded to each other, and the magnetic body portion and the conductor portion are inorganically bonded to each other.
  • a second aspect is the core substrate according to the first aspect, in which the conductor portion is a non-hollow body.
  • a third aspect is a core board according to the first or second aspect, further comprising a terminal.
  • the terminal faces each of the conductor portion and the magnetic body portion in the thickness direction, and is made of a sintered material containing sintered metal.
  • the terminal, each of the conductor section and the magnetic body section are inorganically bonded to each other.
  • a fourth aspect is the core substrate according to any one of the first to third aspects, wherein the ceramic substrate and the magnetic body portion are bonded to each other without intervening an organic material, and The magnetic body portion and the conductor portion are coupled to each other without intervening an organic material.
  • a fifth aspect is the core substrate according to any one of the first to fourth aspects, wherein the ceramic substrate and the magnetic body part are sintered with each other, and the magnetic body part and the conductor The parts are sintered together.
  • a sixth aspect is the core substrate according to any one of the first to fifth aspects, wherein the magnetic body part has a protruding structure toward the ceramic substrate, and a step facing the ceramic substrate. structure.
  • a seventh aspect is the core substrate according to any one of the first to sixth aspects, in which the conductor portion has a protruding structure toward the magnetic body portion.
  • An eighth aspect is an interposer, which includes a core substrate according to any one of the first to seventh aspects, and a wiring portion including a connection via having a bottom surface connected to the conductor portion of the core substrate. It is equipped with The bottom surface of the connection via is spaced apart from the magnetic body portion and the ceramic substrate.
  • a ninth aspect is an interposer according to the eighth aspect, further comprising an insulator layer having a via hole in which the connection via is arranged.
  • the insulator layer separates each of the magnetic body portion of the core substrate and the ceramic substrate from the wiring portion.
  • a tenth aspect is the interposer according to the ninth aspect, in which the via hole of the insulator layer is tapered toward the conductor portion.
  • An eleventh aspect is the interposer according to the ninth or tenth aspect, in which the insulator layer contains an organic substance.
  • a twelfth aspect is the interposer according to any one of the eighth to eleventh aspects, in which the wiring portion is a plating layer.
  • a thirteenth aspect is an interposer, which includes the core substrate according to any one of the first to seventh aspects, an electrode pad connected to the conductor part of the core substrate, and an interposer connected to the electrode pad.
  • a wiring portion including a connection via having a bottom surface. The bottom surface of the connection via is spaced apart from the magnetic body part and the ceramic substrate.
  • a fourteenth aspect is an interposer according to the thirteenth aspect, in which the electrode pad has a portion that covers the magnetic body portion.
  • a fifteenth aspect is the interposer according to the thirteenth or fourteenth aspect, in which the electrode pad contains silver.
  • a sixteenth aspect is the interposer according to any one of the thirteenth to fifteenth aspects, in which the electrode pad is made of a sintered material containing sintered metal.
  • a seventeenth aspect is the interposer according to any one of the thirteenth to sixteenth aspects, wherein the wiring portion is a plating layer.
  • the magnetic body portion is not made of resin in which magnetic particles are dispersed, but made of ceramics.
  • the core substrate can incorporate an inductor having a large inductance per unit area.
  • the ceramic substrate and the magnetic body portion are inorganically bonded to each other. This eliminates the need to use resin to bond the ceramic substrate and the magnetic body portion to each other. Therefore, it is possible to avoid a decrease in heat resistance of the core substrate due to the use of resin.
  • the conductor portion is made of a sintered material containing sintered metal.
  • the core substrate can incorporate an inductor having a large inductance per unit area, and can have high heat resistance and stable electrical characteristics.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of an electronic device in Embodiment 1.
  • FIG. FIG. 2 is a sectional view showing a modification of the electronic device shown in FIG. 1;
  • FIG. 2 is a schematic diagram showing the configuration of an inductor built into a core substrate in Embodiment 1 of the present invention.
  • 4 is a circuit diagram showing an example of electrical connection between the first inductor and the second inductor shown in FIG. 3.
  • FIG. 7 is a diagram schematically showing the configuration of a core substrate in Embodiment 1, and is a partial cross-sectional view taken along line VV in FIG. 6.
  • FIG. 6 is a partial cross-sectional view taken along line VI-VI in FIG. 5;
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 2.
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 3.
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 4.
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 5.
  • FIG. FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 6.
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 7.
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 8.
  • FIG. 9 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 9.
  • FIG. 10 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 10.
  • FIG. 19 is a diagram schematically showing the configuration of an interposer in Embodiment 11, and is a partial sectional view taken along line XVII-XVII in FIG. 18.
  • FIG. 18 is a partial plan view schematically showing the configuration of the second surface of the interposer of FIG. 17.
  • FIG. 18 is a partial plan view schematically showing the configuration of the second surface of the interposer of FIG. 17.
  • FIG. 21 is a diagram schematically showing the configuration of an interposer in Embodiment 12, and is a partial sectional view taken along line XIX-XIX in FIG. 20.
  • FIG. 20 is a partial plan view schematically showing the configuration of the second surface of the interposer of FIG. 19.
  • FIG. FIG. 12 is a partial plan view schematically showing the configuration of a core substrate in Embodiment 13.
  • 22 is a partial cross-sectional view taken along line XXII-XXII in FIG. 21.
  • FIG. FIG. 12 is a partial plan view schematically showing the configuration of a core substrate in Embodiment 14.
  • FIG. 24 is a partial cross-sectional view taken along line XXIV-XXIV in FIG. 23.
  • FIG. 24 is a partial plan view showing a modification of FIG. 23.
  • FIG. FIG. 12 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 15.
  • 27 is a partially enlarged view of FIG. 26.
  • FIG. FIG. 28 is a perspective view of FIG. 27; This is a modification of FIG. 27.
  • FIG. 30 is a perspective view of FIG. 29;
  • FIG. 7 is a partial cross-sectional view schematically showing the configuration of a core substrate in Embodiment 16.
  • 32 is a partially enlarged view of FIG. 31.
  • FIG. 33 is a partial perspective view of FIG. 32.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of an electronic device 901 according to the first embodiment.
  • the electronic device 901 includes an interposer 700, a semiconductor element 811 (die), a motherboard 812, and a package substrate 813.
  • the interposer 700 includes a core substrate 601, a wiring layer 791, and a wiring layer 792.
  • Each of the wiring layer 791 and the wiring layer 792 is provided directly or indirectly on one surface and the other surface of the core substrate 601 (specifically, on a first surface SF1 and a second surface SF2, which will be described later). ) are laminated.
  • Each of the wiring layer 791 and the wiring layer 792 may be laminated on the core substrate 601 by a build-up method, a sputtering method, or the like, or may be joined as separate wiring boards.
  • the wiring layer 791 is a multilayer wiring configured such that the wiring dimensions (for example, line and space (L/S) dimensions) are reduced from the side facing the core substrate 601 to the side facing the semiconductor element 811.
  • it is a layer.
  • the wiring layer 791 may be a laminate of a normal wiring layer facing the core substrate 601 and a fine wiring layer facing the semiconductor element 811.
  • the wiring layer is formed by providing a wiring structure in a plate-shaped organic material (e.g., epoxy material) or inorganic material (e.g., low temperature co-fired ceramics (LTCC) material or non-magnetic ferrite material).
  • a plate-shaped organic material e.g., epoxy material
  • inorganic material e.g., low temperature co-fired ceramics (LTCC) material or non-magnetic ferrite material
  • LTCC low temperature co-fired ceramics
  • Cu is used to form a wiring structure on this organic material.
  • the wiring structure is simultaneously formed by firing Ag (silver), AgPd (silver palladium), or Cu (copper).
  • the fine wiring layer is preferably formed by providing a wiring structure on a plate-shaped organic material (for example, an epoxy-based or polyimide-based member).
  • a plate-shaped organic material for example, an epoxy-based or polyimide-based member.
  • Cu plating is used to form a wiring structure on this organic material.
  • the semiconductor element 811 is mounted on the wiring layer 791 of the interposer 700.
  • the semiconductor element 811 is connected to the wiring layer 791 of the interposer 700 by, for example, a solder ball 821.
  • the semiconductor element 811 may be an IC (Integrated Circuit) chip.
  • the IC chip is a processor chip having a plurality of arithmetic cores
  • the voltage regulator described above can be configured using an inductor, which will be described later.
  • the interposer 700 is mounted on the package substrate 813 by bonding the wiring layer 792 to the package substrate 813. This bonding is performed, for example, by solder balls 823.
  • the package substrate 813 is mounted on the motherboard 812, for example, by bonding using solder balls 822.
  • the element side of the interposer 700 (the side facing the semiconductor element 811) is constituted by the wiring layer 791
  • the substrate side of the interposer 700 (the side facing the package substrate 813 and the motherboard 812) is constituted by the wiring layer 792. It is made up of.
  • a plurality of terminals (not shown) are provided on each of the element side and the substrate side of the interposer 700.
  • the terminal pitch on the element side may be smaller than the terminal pitch on the substrate side, and in this case, the interposer 700 has a function of converting the terminal pitch.
  • either or both of the wiring layer 791 and the wiring layer 792 may be omitted depending on the use of the interposer.
  • FIG. 2 is a cross-sectional view showing an electronic device 902 that is a modification of the electronic device 901 (FIG. 1).
  • interposer 700 is bonded to motherboard 812 without intervening package substrate 813 (FIG. 1), and this bonding is performed by, for example, solder balls 822.
  • FIG. 3 is a schematic diagram showing the configuration of an inductor built into the core substrate 601 in Embodiment 1 of the present invention.
  • the core substrate 601 includes a plurality of inductors L1 and L2, and may include additional inductors L3 to L6, etc., and the number of inductors is arbitrary. Note that although the configurations of the inductors L1 and L2 will be described in detail below, the inductors L3 to L6, etc. may also have similar configurations.
  • FIG. 4 is a circuit diagram showing an example of electrical connection between inductor L1 and inductor L2 shown in FIG. 3.
  • the series connection of inductor L1 and inductor L2 constitutes an inductor having a composite inductance larger than the inductance of each of these, and both ends of the inductor face the semiconductor element 811 (FIG. 1). It is placed on the second surface SF2 that will be used. Thereby, an inductor having a sufficiently large inductance can be easily connected to the semiconductor element 811.
  • the electrical connections between the plurality of inductors built into the core board are not limited to those shown in FIG. 4, and may be designed as appropriate depending on the use of the core board. This may configure any number of inductors in series, any number of inductors in parallel, or a combination thereof.
  • FIG. 5 is a diagram schematically showing the configuration of the core substrate 601 in Embodiment 1 of the present invention, and is a partial sectional view taken along line VV in FIG. 6.
  • FIG. 6 is a partial cross-sectional view taken along line VI-VI in FIG.
  • the core substrate 601 is for configuring the interposer 700, and includes the inductor L1 and the inductor L2.
  • the core substrate 601 includes a ceramic substrate 100, a first conductor section 201, a second conductor section 202, a first magnetic body section 301, a second magnetic body section 302, an interconnection section 450 (terminal), and an electrode. It has a section 401 (terminal) and an electrode section 402 (terminal).
  • the first conductor section 201 and the second conductor section 202 are also collectively referred to as the conductor section 200.
  • the first magnetic body part 301 and the second magnetic body part 302 are also collectively referred to as the magnetic body part 300.
  • the ceramic substrate 100 has a first surface SF1 and a second surface SF2 opposite to the first surface SF1 in the thickness direction.
  • the ceramic substrate 100 is a substrate made of a ceramic sintered body.
  • the ceramic sintered body does not substantially contain an organic component and may contain a glass component.
  • the ceramic substrate 100 may be made of glass ceramics.
  • the ceramic substrate 100 is made of LTCC.
  • LTCC is a ceramic that can be sintered at temperatures below about 900°C, and can be sintered at a temperature well below the melting point of Ag, AgPd or Cu. A conductor with low resistance can be built-in and simultaneously sintered.
  • the ceramic substrate 100 has a first through hole HL1 and a second through hole HL2 between the first surface SF1 and the second surface SF2. It is preferable that the ceramic substrate 100 has a coefficient of thermal expansion of 4 ppm/°C or more and 16 ppm/°C or less.
  • the ceramic substrate 100 preferably has a dielectric constant of 8 or less and a dielectric loss tangent of 0.01 or less at 1 GHz.
  • the first conductor portion 201 and the second conductor portion 202 each penetrate the first through hole HL1 and the second through hole HL2.
  • These conductor portions 200 are non-hollow bodies. In other words, the conductor portion 200 does not have a hollow space inside.
  • these conductor parts 200 are made of a sintered material containing sintered metal.
  • This sintered metal is made of, for example, at least one of Ag, AgPd, and Cu.
  • the sintered material of the conductor portion 200 may include a ceramic material, which is a material having lower conductivity than sintered metal, as long as its function as an electrical wiring is maintained.
  • the ratio of the ceramic material to the sintered metal is preferably 5% by volume or more and 30% by volume or less.
  • the coupling between the conductor section 200 and the magnetic body section 300 can be strengthened.
  • the particle size of the ceramic material is preferably 0.5 ⁇ m or more and 10 ⁇ m or less. Ceramic materials are, for example, alumina, zirconia, magnesium oxide or titanium oxide.
  • the first magnetic body portion 301 surrounds the first conductor portion 201 in the first through hole HL1.
  • the second magnetic body portion 302 surrounds the second conductor portion 202 in the second through hole HL2.
  • Each of the first magnetic body part 301 and the second magnetic body part 302 may be in direct contact with the first conductor part 201 and the second conductor part 202.
  • Each of these magnetic body parts 300 may have a circular inner edge and a circular outer edge in a cross-sectional view (FIG. 6) perpendicular to the thickness direction. Note that these inner edges and outer edges may have other shapes instead of circular shapes, for example, they may have elliptical shapes or polygonal shapes such as quadrangular shapes. The corners of the polygon may be chamfered. Similarly, in cross-sectional view, the first through hole HL1, the second through hole HL2, and each conductor portion 200 may also have other shapes instead of the circular shape shown in FIG.
  • the magnetic body part 300 is made of ceramics (ceramic sintered body) and does not contain any organic components. In order to reduce the volume of the inductor, it is desirable that the magnetic material constituting the magnetic body part 300 has high magnetic permeability, and it is preferable that the magnetic body part 300 has a density of 70% or more. In order to reduce the electrical loss of the inductor, the magnetic material constituting the magnetic body part 300 is desirably a soft magnetic material with small magnetic loss at high frequencies, for example, the tangent of magnetic loss at a frequency of 100 MHz is 0. It is desirable that the soft magnetic material is 1 or less.
  • the magnetic material constituting the magnetic body section 300 desirably has a high volume electrical resistivity in order to reduce magnetic loss at high frequencies, and specifically, is desirably an electrical insulator.
  • the magnetic body portion 300 is preferably made of a ferrite-based material, and the crystal structure of the material is preferably a spinel structure from the viewpoint of ease of manufacture, for example, Ni-Zn-based ferrite or Ni-Zn-Cu-based material. Ferrite is used, and from the viewpoint of high magnetic permeability, it is preferable that it has a hexagonal crystal structure with c-axis orientation along the thickness direction (vertical direction in FIG. 5).
  • the method for manufacturing the core substrate 601 includes a firing process.
  • the conductor part 200 first conductor part 201 and second conductor part 202 and magnetic body part 300 (first magnetic body part 301 and second magnetic body part 302) are fired at the same time as the ceramic substrate 100. be done. Therefore, the inorganic material that constitutes the conductor section 200 and the inorganic material that constitutes the magnetic body section 300 are bonded to each other without intervening an organic material. In other words, the conductor section 200 and the magnetic body section 300 are inorganically coupled to each other. Specifically, the conductor section 200 and the magnetic body section 300 are sintered with each other.
  • the inorganic material constituting the magnetic body portion 300 and the inorganic material constituting the ceramic substrate 100 are bonded to each other without intervening an organic material.
  • the magnetic body portion 300 and the ceramic substrate 100 are inorganically bonded to each other.
  • the magnetic body portion 300 and the ceramic substrate 100 are sintered together.
  • the interconnection section 450 electrically connects one end of the first conductor section 201 and one end of the second conductor section 202 to each other on the first surface SF1 of the ceramic substrate 100.
  • the electrode section 401 is connected to the other end of the first conductor section 201
  • the electrode section 402 is connected to the other end of the second conductor section 202. Electrode section 401 and electrode section 402 are separated from each other. Therefore, one end of the first conductor section 201 and one end of the second conductor section 202 are electrically connected to each other, and the other end of the first conductor section 201 and the other end of the second conductor section 202 are connected to each other electrically. are electrically isolated from each other. As a result, the circuit shown in FIG. 4 is configured.
  • the electrode section 401 faces each of the first conductor section 201 and the first magnetic body section 301 in the thickness direction (vertical direction in FIG. 5).
  • the electrode section 402 faces each of the second conductor section 202 and the second magnetic body section 302 in the thickness direction (vertical direction in FIG. 5).
  • the interconnection part 450 faces each of the first conductor part 201, the second conductor part 202, the first magnetic part 301, and the second magnetic part 302 in the thickness direction (vertical direction in FIG. 5).
  • At least one of the electrode section 401, the electrode section 402, and the interconnection section 450 is preferably a terminal made of a sintered material containing a sintered metal, and the sintered material is a terminal made of a sintered material containing a sintered metal. In addition, it may contain a small amount of glass component.
  • the sintered metal has, for example, Ag, AgPd, or Cu as a main component.
  • the electrode section 401 and each of the first conductor section 201 and the first magnetic body section 301 are inorganically bonded to each other.
  • the electrode section 402 and each of the second conductor section 202 and the second magnetic body section 302 are inorganically bonded to each other.
  • the interconnection section 450 and each of the first conductor section 201, the second conductor section 202, and the second magnetic body section 302 are inorganically bonded to each other.
  • the ceramic substrate 100 has a square shape with sides of 50 mm in the in-plane direction, and has dimensions of 550 ⁇ m in the thickness direction.
  • the plurality of through holes (first through hole HL1, second through hole HL2, etc.) are arranged at a pitch of 450 ⁇ m.
  • the ceramic substrate 100 is made of, for example, an LTCC material containing Ba-Si-Al-O elements as a main component or glass alumina.
  • Each of the magnetic body parts 300 (FIG. 6) has an outer diameter of 350 ⁇ m and an inner diameter of 100 ⁇ m.
  • Each of the conductor sections 200 has an outer diameter of 100 ⁇ m.
  • the conductor portion 200 is formed by powder sintering of Ag or AgPd.
  • the magnetic body portion 300 is made of a ferrite sintered body, and its relative magnetic permeability is estimated to be 16.
  • the inductance of one inductor eg, inductor L1 is approximately 2 nH at 140 MHz, according to the inventor's estimate.
  • FIG. 7 is a partial cross-sectional view showing the configuration of a core substrate 690 of a comparative example.
  • a first through hole HL1 and a second through hole are formed in a resin substrate 190 made of glass epoxy resin.
  • a first magnetic body portion 391 and a first conductor portion 291 are formed in this order on the side wall of the first through hole HL1, and the first conductor portion 291 has a hollow structure filled with a resin material 281.
  • a second magnetic material portion 392 and a second conductor portion 292 are formed in this order on the side wall of the second through hole HL2, and the second conductor portion 292 has a hollow structure filled with a resin material 282.
  • the first conductor section 291 and the second conductor section 292 are also collectively referred to as the conductor section 290.
  • the first magnetic body portion 391 and the second magnetic body portion 392 are formed within the resin substrate 190. Therefore, the step of forming the magnetic body portion 390 needs to be performed at a temperature lower than the allowable temperature limit of the resin substrate 190. Due to this restriction, the magnetic body portion 390 is made of resin in which magnetic particles are dispersed, rather than a ceramic sintered body. In this case, the gaps between the magnetic particles in the magnetic body portion 390 are filled with resin, and it is usually difficult to increase this filling rate to 70% or more. As a result, it is difficult to increase the relative magnetic permeability of the first magnetic body part 391 and the second magnetic body part 392 compared to the first magnetic body part 301 and the second magnetic body part 302 (FIG. 5). , for example, about 6.
  • the resin substrate 190 has a square shape with sides of 50 mm in the in-plane direction, and has a dimension of 1000 ⁇ m in the thickness direction.
  • the plurality of through holes (first through hole HL1, second through hole HL2, etc.) are arranged at a pitch of 500 ⁇ m.
  • Each of the magnetic body parts 390 has an outer diameter of 400 ⁇ m and an inner diameter of 200 ⁇ m.
  • Each of the conductor parts 200 has an outer diameter of 200 ⁇ m.
  • the conductor portion 200 is formed by Cu plating.
  • the magnetic body portion 390 is made of resin in which magnetic particles are dispersed, and its relative magnetic permeability is estimated to be 6.
  • the inductance of one inductor (for example, inductor L1) in this case is approximately 1 nH at 140 MHz, according to the inventor's estimate. This value is half of the approximately 2 nH estimated in the case of this embodiment.
  • the magnetic body part 300 (FIG. 5) is not made of resin in which magnetic particles are dispersed like the magnetic body part 390 (FIG. 7), but is made of a ceramic sintered body.
  • the core substrate 601 can incorporate an inductor having a large inductance per unit area.
  • the ceramic substrate 100 and the magnetic body part 300 are inorganically bonded to each other. Thereby, there is no need to use resin to bond the ceramic substrate 100 and the magnetic body part 300 to each other. Therefore, it is possible to avoid a decrease in heat resistance of the core substrate 601 due to the use of resin.
  • the conductor portion 200 is made of a sintered material containing sintered metal. This makes it possible to suppress variations in the electrical properties, particularly the conductivity, of the conductor section 200 compared to the case where the conductor section 200 is a plated film. Therefore, the electrical characteristics of the core substrate can be stabilized. From the above, the core substrate 601 can incorporate an inductor having a large inductance per unit area, and can have high heat resistance and stable electrical characteristics.
  • the conductor portion 200 is a non-hollow body. Thereby, the electrical resistance of the conductor portion 200 can be reduced.
  • the conductor section 200 and the magnetic body section 300 are coupled to each other without intervening an organic material.
  • the conductor section 200 and the magnetic body section 300 are inorganically coupled to each other.
  • the conductor section 200 and the magnetic body section 300 are sintered with each other. Thereby, the heat resistance of the core substrate 601 can be improved compared to the case where the conductor section 200 and the magnetic body section 300 are coupled to each other via an organic material.
  • the ceramic substrate 100 (FIG. 5) has higher rigidity than the resin substrate 190 (FIG. 7). Thereby, even after other members are added to the ceramic substrate 100, the ceramic substrate 100 is unlikely to warp. Therefore, a core substrate 601 with small warpage can be obtained.
  • the formation yield of the wiring layer 791 and the wiring layer 792 (FIG. 1) is improved.
  • the yield of mounting semiconductor elements 811 is improved.
  • the magnetic body part 300 When the magnetic body part 300 has a circular inner edge and a circular outer edge in a cross-sectional view perpendicular to the thickness direction (FIG. 6), the magnetic body part 300 is They can be arranged isotropically in view.
  • the magnetic body part 300 When the magnetic body part 300 has a density of 70% or more, it is easy to sufficiently increase the magnetic permeability of the magnetic body part 300.
  • the thermal expansion coefficient of the ceramic substrate 100 is determined by adjusting the thermal expansion coefficient of the ceramic substrate 100 to the semiconductor element 811 ( 1) and that of a typical motherboard 812 (FIG. 1) on which the interposer 700 will be mounted. Thereby, it is possible to suppress the occurrence of warpage in the electronic device 901 (FIG. 1) or the electronic device 902 (FIG. 2) due to thermal expansion and contraction.
  • the magnetic body part 300 is made of an insulator, even if the magnetic body part 300 is in direct contact with the conductor part 200 as shown in FIGS. Diffusion can be avoided.
  • the magnetic body part 300 When the magnetic body part 300 is in direct contact with the conductor part 200, it becomes easy to secure a sufficient area for arranging the magnetic body part 300.
  • the core board 601 has an inductor L1 configured by the first conductor part 201 and the first magnetic body part 301, and an inductor L2 constituted by the second conductor part 202 and the second magnetic body part 302. . Thereby, a plurality of inductors can be built into the core substrate 601.
  • the interconnection section 450 electrically connects one end of the first conductor section 201 (lower end in FIG. 5) and one end of the second conductor section 202 (lower end in FIG. 5) on the first surface SF1 of the ceramic substrate 100. is connected to. Thereby, the inductor L1 formed by the first conductor part 201 and the first magnetic body part 301 and the inductor L2 formed by the second conductor part 202 and the second magnetic body part 302 are electrically connected to each other. be able to.
  • FIG. 8 is a partial cross-sectional view schematically showing the configuration of the core substrate 602 in the second embodiment.
  • Core substrate 602 does not have interconnect 450 (FIG. 5: Embodiment 1). Further, the core substrate 602 does not have the electrode portion 401 and the electrode portion 402 (FIG. 5: Embodiment 1). Note that the configuration other than these is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are given the same reference numerals and the description thereof will not be repeated.
  • the core board 602 of this embodiment the structure is simplified compared to the core board 601 while incorporating the inductor L1 and the inductor L2 like the core board 601 (FIG. 5: Embodiment 1). Can be done.
  • FIG. 9 is a partial cross-sectional view schematically showing the configuration of the core substrate 603 in the third embodiment.
  • Core substrate 603 does not have second magnetic body portion 302 (FIG. 5: Embodiment 1).
  • the configuration other than this is almost the same as the configuration of the first embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • an inductor can be disposed between the electrode section 401 and the electrode section 402, similarly to the core substrate 601 (FIG. 5: Embodiment 1). Note that although the inductor includes the inductor L1 as in the first embodiment, unlike the first embodiment, the inductor does not include the inductor L2 (FIG. 5).
  • FIG. 10 is a partial cross-sectional view schematically showing the configuration of the core substrate 604 in the fourth embodiment.
  • Core substrate 604 does not have interconnect 450 (FIG. 9: Embodiment 3).
  • the core substrate 603 does not have the electrode portion 401 and the electrode portion 402 (FIG. 9: Embodiment 3).
  • the configuration other than these is almost the same as the configuration of the third embodiment described above, so the same or corresponding elements are given the same reference numerals and the description thereof will not be repeated.
  • the structure can be simplified compared to the core board 603 while incorporating the inductor L1 like the core board 603 (FIG. 9: Embodiment 3).
  • FIG. 11 is a partial cross-sectional view schematically showing the configuration of the core substrate 605 in the fifth embodiment.
  • Core substrate 605 does not have interconnection section 450 and second conductor section 202 (FIG. 9: Embodiment 3).
  • the core substrate 605 has an electrode portion 403 (terminal) connected to one end of the first conductor portion 201 on the first surface instead of the electrode portion 402 on the second surface SF2.
  • the electrode section 403 faces each of the first conductor section 201 and the first magnetic body section 301 in the thickness direction (vertical direction in FIG. 5).
  • the electrode portion 403 is preferably a terminal made of a sintered material containing sintered metal.
  • the configuration other than these is almost the same as the configuration of the third embodiment described above, so the same or corresponding elements are given the same reference numerals and the description thereof will not be repeated.
  • the structure can be simplified compared to the core board 603 while incorporating the inductor L1 like the core board 603 (FIG. 9: Embodiment 1).
  • FIG. 12 is a partial cross-sectional view schematically showing the configuration of the core substrate 606 in the sixth embodiment.
  • Core substrate 606 does not have electrode section 401 and electrode section 403 (FIG. 11: Embodiment 5).
  • the configuration other than these is almost the same as the configuration of the fifth embodiment described above, so the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the structure can be simplified compared to the core board 605 while incorporating the inductor L1 like the core board 605 (FIG. 11: Embodiment 5).
  • FIG. 13 is a partial cross-sectional view schematically showing the configuration of the core substrate 607 in the seventh embodiment.
  • the core substrate 607 has a plurality of insulating ceramic films 550 including a first insulating ceramic film 551 and a second insulating ceramic film 552.
  • the first insulating ceramic film 551 separates the first magnetic body part 301 from the first conductor part 201.
  • the second insulating ceramic film 552 separates the second magnetic body portion 302 from the second conductor portion 202 .
  • the core substrate 607 has an insulating layer 511 that at least partially covers each of the first magnetic body part 301 and the second magnetic body part 302 along a plane including the first surface SF1 of the ceramic substrate 100. .
  • the insulator layer 511 separates each of the first magnetic body portion 301 and the second magnetic body portion 302 from the interconnection portion 450 .
  • the insulator layer 511 may partially cover each of the first magnetic body part 301 and the second magnetic body part 302, as illustrated.
  • the core substrate 607 has an insulating layer 512 that at least partially covers each of the first magnetic body part 301 and the second magnetic body part 302 along a plane including the second surface SF2 of the ceramic substrate 100. .
  • the insulator layer 512 separates the first magnetic body part 301 from the electrode part 401, and also separates the second magnetic body part 302 from the electrode part 402.
  • the insulator layer 512 may entirely cover each of the first magnetic body part 301 and the second magnetic body part 302, as illustrated.
  • the insulator layer 511 and the insulator layer 512 may be made of non-magnetic material.
  • the insulator layer 511 and the insulator layer 512 are made of an inorganic material, an organic material, or a mixture thereof.
  • the inorganic material may be the same as the material of the ceramic substrate 100 or may be different.
  • the insulating ceramic film 550 may be made of a nonmagnetic material.
  • the material of the insulating ceramic film 550 may be the same as the material of the ceramic substrate 100, or may be different.
  • the material of the insulating layer 511, the material of the insulating layer 512, and the material of the insulating ceramic film 550 may be different from each other, but are preferably made of the same material. This common material may be the same as the material of ceramic substrate 100 or may be different.
  • the insulating ceramic film 550 separates the magnetic body part 300 from the conductor part 200. Thereby, it is possible to avoid adverse effects caused by direct contact between the conductor section 200 and the magnetic body section 300. In particular, when the magnetic body part 300 has non-negligible electrical conductivity (especially when the magnetic body part 300 is a conductor), diffusion of current from the conductor part 200 to the magnetic body part 300 can be prevented. .
  • FIG. 14 is a partial cross-sectional view schematically showing the configuration of the core substrate 608 in the eighth embodiment.
  • the core substrate 608 has an insulating layer 501 that at least partially covers each of the first magnetic body part 301 and the second magnetic body part 302 along a plane including the first surface SF1 of the ceramic substrate 100.
  • the insulator layer 501 separates each of the first magnetic body portion 301 and the second magnetic body portion 302 from the interconnection portion 450 . As illustrated, the insulator layer 501 may entirely cover the first magnetic body part 301 and the second magnetic body part 302 along a plane including the first surface SF1.
  • the core substrate 608 has an insulating layer 502 that at least partially covers each of the first magnetic body part 301 and the second magnetic body part 302 along a plane including the second surface SF2 of the ceramic substrate 100.
  • the insulator layer 502 separates the first magnetic body part 301 and the electrode part 401, and also separates the second magnetic body part 302 and the electrode part 402. As illustrated, the insulator layer 502 may entirely cover the first magnetic body part 301 and the second magnetic body part 302 along a plane including the second surface SF2.
  • the insulator layer 501 and the insulator layer 502 may be made of a nonmagnetic material.
  • the insulator layer 501 and the insulator layer 502 are made of an inorganic material, an organic material, or a mixture thereof.
  • the inorganic material may be the same as the material of the ceramic substrate 100 or may be different.
  • the material of the insulator layer 501 and the material of the insulator layer 502 may be different from each other, but are preferably the same material. This common material may be the same as the material of ceramic substrate 100 or may be different.
  • the insulator layer 501 at least partially covers the magnetic body part 300 along the plane including the first surface SF1 of the ceramic substrate 100. Thereby, the influence between the magnetic body part 300 and the structure on the first surface SF1 can be suppressed. Further, the insulating layer 502 at least partially covers the magnetic body portion 300 along a plane including the second surface SF2 of the ceramic substrate 100. Thereby, the influence between the magnetic body part 300 and the structure on the second surface SF2 can be suppressed.
  • FIG. 15 is a partial cross-sectional view schematically showing the configuration of the core substrate 609 in the ninth embodiment.
  • Core substrate 609 has an insulating ceramic film 550 (FIG. 13: Embodiment 7) in addition to the structure of core substrate 608 (FIG. 14: Embodiment 8).
  • the material of insulator layer 501 and insulator layer 502 may be the same as the material of ceramic substrate 100, or may be different. In each of the former and latter cases, the material of the insulating ceramic film 550 may be the same as the material of the ceramic substrate 100, or may be different.
  • the interface between the conductor section 200 and the interconnection section 450, and the interface between the insulator layer 501 and the The interface with the connecting portion 450 is substantially on the same plane.
  • the interface between the electrode section 401 and the first conductor section 201 and the interface between the electrode section 401 and the insulating layer 502 are on substantially the same plane, and , the interface between the electrode section 402 and the second conductor section 202 and the interface between the electrode section 402 and the insulator layer 502 are substantially on the same plane.
  • the arrangement of the boundary surfaces is not limited to this. For example, there is a difference in the arrangement of the boundary surfaces between the ninth embodiment described above and the tenth embodiment described below.
  • FIG. 16 is a partial cross-sectional view schematically showing the configuration of the core substrate 610 in the tenth embodiment.
  • the interface between the conductor portion 200 and the interconnection portion 450 substantially coincides with the first surface SF1 of the ceramic substrate 100.
  • each of the interface between the electrode section 401 and the first conductor section 201 and the interface between the electrode section 402 and the second conductor section 202 substantially coincides with the second surface SF2 of the ceramic substrate 100.
  • the boundary surface may be a microscopically observable boundary surface, but may alternatively be a virtual boundary surface. Virtual interfaces may be envisioned independently of microscopic interfaces.
  • FIG. 17 is a diagram schematically showing the configuration of interposer 701 in the eleventh embodiment, and is a partial sectional view taken along line XVII-XVII in FIG. 18.
  • FIG. 18 is a partial plan view schematically showing the configuration of the second surface SF2 of the interposer 701 in FIG. 17.
  • Interposer 701 is an example of interposer 700 (FIG. 1 or 2).
  • the interposer 701 includes a core substrate 606 (FIG. 12: Embodiment 6), a wiring portion 441 and an insulator layer 502 as a wiring layer 791 (FIG.
  • FIG. 18 in order to make the diagram easier to read, the structure of the core board 606 is shown by a solid line, and other structures added to the core board 606 are shown by broken lines.
  • the wiring section 441 has a wiring pattern 441p and a connection via 441v.
  • the connection via 441v has a bottom surface connected to the first conductor portion 201 of the core board 606.
  • the bottom surface of the connection via 441v is separated from the first magnetic body portion 301 and the ceramic substrate 100.
  • the pattern layout of the wiring pattern 441p has a circular shape in FIG. 18, it is not limited to this, and may be designed as appropriate depending on the circuit configuration required of the interposer 701.
  • the wiring section 443 has a wiring pattern 443p and a connection via 443v.
  • the connection via 443v has a bottom surface connected to the first conductor portion 201 of the core board 606.
  • the bottom surface of the connection via 443v is separated from the first magnetic body portion 301 and the ceramic substrate 100.
  • the pattern layout of the wiring pattern 443p may be designed as appropriate depending on the circuit configuration required of the interposer 701.
  • the insulator layer 502 has a via hole HV2 in which a connection via 441v is arranged.
  • the via hole HV2 is preferably tapered toward the first conductor portion 201 as shown in FIG. 17, but the shape of the via hole HV2 is not limited to this, and may be straight. There may be.
  • the insulator layer 502 separates the wiring section 441 from each of the first magnetic body section 301 and the ceramic substrate 100 of the core substrate 606 .
  • the insulator layer 502 preferably contains an organic substance, and may be an organic insulator layer, for example, an epoxy resin layer.
  • the insulator layer 501 has a via hole HV1 in which a connection via 443v is arranged.
  • the via hole HV1 is preferably tapered toward the first conductor portion 201 as shown in FIG. 17, but the shape of the via hole HV1 is not limited to this, and may be straight. There may be.
  • the insulator layer 501 separates the wiring portion 443 from each of the first magnetic body portion 301 and the ceramic substrate 100 of the core substrate 606 .
  • the insulator layer 501 preferably contains an organic substance, and may be an organic insulator layer, for example, an epoxy resin layer.
  • the wiring portion 441 may be a plating layer.
  • the wiring portion 441 and the insulating layer 502 may be formed by a semi-additive method, and for example, may be formed roughly as follows.
  • An organic insulating film serving as the insulating layer 502 is pasted onto the second surface SF2 of the core substrate 606, in which the via hole HV2 is not yet formed.
  • via hole HV2 is formed by laser processing.
  • a seed layer is formed on the surface of the insulator layer 502, including the inner surface of the via hole HV2, by electroless copper plating.
  • a plating resist is formed on the insulator layer 502 to expose a region where the wiring pattern 443p of the wiring portion 441 is to be formed.
  • the wiring section 441 is formed.
  • the wiring portion 443 and the insulator layer 501 may also be formed in the same manner.
  • the bottom surface of the connection via 441v is separated from the magnetic body portion 301 and the ceramic substrate 100.
  • the insulator layer 502 separates the wiring portion 441 from each of the first magnetic body portion 301 and the ceramic substrate 100 of the core substrate 606 . This prevents components of the first magnetic body portion 301 and the ceramic substrate 100 from entering the wiring portion 441. Specifically, components of the first magnetic body part 301 and the ceramic substrate 100 are prevented from being eluted into the plating solution for forming the plating layer as the wiring part 441. Thereby, variations in electrical characteristics (particularly conductivity) of the wiring portion 441 can be suppressed. The same applies to the wiring section 443.
  • the size of the via hole HV2 at a position away from the first conductor part 201 is set as follows while ensuring the above configuration. Can be made larger. Thereby, the electrical resistance of the connection via 441v arranged therein can be further reduced. The same applies to the via hole HV1 of the insulator layer 501.
  • the insulating layer 502 contains an organic substance (especially when the insulating layer 502 is an organic insulating layer), it is better to prevent components of the first magnetic body part 301 and the ceramic substrate 100 from entering the wiring part 441. Easy to avoid. Specifically, it is easier to prevent the components of the first magnetic body part 301 and the ceramic substrate 100 from being eluted into the plating solution for forming the plating layer as the wiring part 441.
  • the core substrate 606 of Embodiment 6 is used as the core substrate of the interposer, but core substrates of other embodiments may be used.
  • FIG. 19 is a diagram schematically showing the configuration of interposer 702 in the twelfth embodiment, and is a partial sectional view taken along line XIX-XIX in FIG. 20.
  • FIG. 20 is a partial plan view schematically showing the configuration of the second surface SF2 of the interposer 702 in FIG. 19.
  • Interposer 702 is an example of interposer 700 (FIG. 1 or 2).
  • the interposer 702 includes a core substrate 606 (FIG. 12: Embodiment 6), a wiring portion 441 as a wiring layer 791 (FIG. 1 or 2), an insulator layer 502, and an electrode pad 481 (terminal).
  • FIG. 20 in order to make the diagram easier to read, the structure of the core board 606 is shown by a solid line, and other structures added to the core board 606 are shown by broken lines.
  • the electrode pad 481 is connected to the first conductor portion 201 of the core substrate 606.
  • the electrode pad 481 faces each of the first conductor section 201 and the first magnetic body section 301 in the thickness direction (vertical direction in FIG. 19).
  • the electrode pad 481 and each of the first conductor section 201 and the first magnetic body section 301 are inorganically bonded to each other.
  • the bottom surface of the connection via 441v of the wiring portion 441 is connected to the electrode pad 481 in this embodiment, unlike the eleventh embodiment described above.
  • the bottom surface of the connection via 441v is separated from the first magnetic body portion 301 and the ceramic substrate 100.
  • Electrode pad 481 covers first conductor portion 201 .
  • the electrode pad 481 may have a portion that covers the first magnetic body portion 301.
  • the electrode pad 481 may partially cover the first magnetic body portion 301 along the second surface SF2, as shown in FIG. 19. In that case, the edge of the electrode pad 481 is placed on the first magnetic body part 301, as shown in FIGS. 19 and 20. As a modification, the electrode pad 481 may just cover the first magnetic body part 301 along the second surface SF2, and in that case, the edge of the electrode pad 481 is formed between the first magnetic body part 301 and the ceramic substrate 100. placed on the border. As another modification, the electrode pad 481 may cover the first magnetic body part 301 with a margin, and in that case, the edge of the electrode pad 481 may be placed on the ceramic substrate 100 away from the boundary. Ru.
  • Electrode pad 481 is made of a sintered material containing sintered metal. Electrode pads 481 made of sintered material can be formed by printing a paste layer and sintering it.
  • the electrode pad 481 may contain silver, copper, a silver-palladium alloy, or a silver-copper alloy as a main component, for example, a sintered silver layer, a sintered copper layer, a sintered silver-palladium alloy layer, or It may be a sintered silver-copper alloy layer.
  • the electrode pad 483 is connected to the first conductor portion 201 of the core substrate 606.
  • the electrode pad 483 faces each of the first conductor section 201 and the first magnetic body section 301 in the thickness direction (vertical direction in FIG. 19).
  • the electrode pad 483 and each of the first conductor section 201 and the first magnetic body section 301 are inorganically coupled to each other.
  • the bottom surface of the connection via 443v of the wiring portion 443 is connected to the electrode pad 483 in this embodiment, unlike the eleventh embodiment described above.
  • the bottom surface of the connection via 443v is separated from the first magnetic body portion 301 and the ceramic substrate 100.
  • Electrode pad 483 covers first conductor portion 201 .
  • the electrode pad 483 may have a portion that covers the first magnetic body portion 301.
  • the electrode pad 483 may partially cover the first magnetic body portion 301 along the first surface SF1 as shown in FIG. 19 . In that case, the edge of the electrode pad 483 is placed on the first magnetic body part 301, as shown in FIG. As a modification, the electrode pad 483 may just cover the first magnetic body part 301 along the first surface SF1, and in that case, the edge of the electrode pad 483 is formed between the first magnetic body part 301 and the ceramic substrate 100. placed on the border. As another modification, the electrode pad 483 may cover the first magnetic body part 301 with a margin, and in that case, the edge of the electrode pad 483 is placed on the ceramic substrate 100 away from the boundary. Ru. Electrode pad 483 is made of a sintered material containing sintered metal.
  • Electrode pads 483 made of sintered material can be formed by printing a paste layer and sintering it.
  • the electrode pad 483 may contain silver, copper, a silver-palladium alloy, or a silver-copper alloy as a main component, for example, a sintered silver layer, a sintered copper layer, a silver-palladium alloy layer, or a sintered silver layer. It may be a silver-copper alloy layer.
  • the bottom surface of the connection via 441v is separated from the first magnetic body part 301 and the ceramic substrate 100.
  • the insulator layer 502 and the electrode pad 481 separate the wiring portion 441 from each of the first magnetic body portion 301 of the core substrate 606 and the ceramic substrate 100 .
  • components of the first magnetic body part 301 and the ceramic substrate 100 are prevented from being eluted into the plating solution for forming the plating layer as the wiring part 441. This makes it possible to suppress variations in the electrical properties of the wiring portion 441, particularly in the conductivity. The same applies to the wiring section 443.
  • the electrode pad 481 has a portion that covers the first magnetic body part 301, mixing of components of the first magnetic body part 301 can be more reliably avoided. The same applies to the electrode pad 483.
  • the electrode pad 481 contains silver, copper, or a silver-copper alloy as a main component, it is easy to prevent the components of the electrode pad 481 from entering the wiring portion 441. Specifically, it is easy to prevent components of the electrode pad 481 from being eluted into the plating solution for forming the plating layer as the wiring portion 441. Thereby, variations in the electrical characteristics (especially conductivity) of the wiring portion 441 can be suppressed more reliably. This effect can be more reliably obtained when the electrode pad 481 is substantially made of silver, silver-palladium alloy, or copper. Further, this effect can be more reliably obtained when the electrode pad 481 is a sintered silver layer, a sintered silver palladium alloy layer, or a sintered copper layer. Therefore, the electrode pad 481 is preferably a sintered silver layer, a sintered silver palladium alloy layer, or a sintered copper layer. The same applies to the electrode pad 483.
  • the core substrate 606 of Embodiment 6 is used as the core substrate of the interposer, but core substrates of other embodiments may be used.
  • FIG. 21 is a partial plan view schematically showing the configuration of the core substrate 613 in the thirteenth embodiment.
  • FIG. 22 is a partial cross-sectional view taken along line XXII-XXII in FIG. 21.
  • Core board 613 has two inductors L1 and L2 (FIG. 22).
  • the inductor L1 has a conductor portion 201A and a magnetic body portion 301A provided in the through hole HL1A.
  • the inductor L2 has a conductor portion 201B and a magnetic body portion 301B provided in the through hole HL1B.
  • the magnetic body portion 301A and the magnetic body portion 301B are separated from each other.
  • each of inductors L1 and L2 of core board 613 may have the same configuration as inductor L1 of core board 606 (FIG. 12: Embodiment 6).
  • FIG. 23 is a partial plan view schematically showing the configuration of the core substrate 614 in the fourteenth embodiment.
  • FIG. 24 is a partial cross-sectional view taken along line XXIV-XXIV in FIG. 23.
  • Core substrate 614 has two inductors L1 and L2 (FIG. 24).
  • inductor L1 and inductor L2 each have a conductor portion 201A and a conductor portion 201B.
  • the inductor L1 and the inductor L2 share the magnetic body portion 301 provided in the through hole HL1. Therefore, the conductor portion 201A and the conductor portion 201B are separated not by the ceramic substrate 100 but by the magnetic body portion 301.
  • FIG. 25 is a partial plan view showing a modification of FIG. 23.
  • six conductor parts 201A to 201F are provided in a common magnetic body part 301.
  • the arrangement includes an array along a first direction (vertical direction in the figure) and an array along a second direction (diagonal direction in the figure).
  • FIG. 26 is a partial cross-sectional view schematically showing the configuration of the core substrate 621 in the fifteenth embodiment.
  • FIG. 27 is a partially enlarged view of FIG. 26.
  • FIG. 28 is a perspective view of FIG. 27.
  • the core board 621 (FIG. 26) has a first magnetic body part 301Pa and a second magnetic body part 302Pa instead of the first magnetic body part 301 and the second magnetic body part 302 of the core board 601 (FIG. 5).
  • the first magnetic body part 301Pa and the second magnetic body part 302Pa have a protrusion structure PMa toward the ceramic substrate 100 in a cross-sectional view including the thickness direction (vertical direction in FIG. 26).
  • the first magnetic body part 301Pa and the second magnetic body part 302Pa have a protrusion structure PMa into the ceramic substrate 100 in a cross-sectional view including the thickness direction (vertical direction in FIG. 26).
  • the core substrate 621 includes a layer LC1, a layer LC2, and a layer LPa between them in the thickness direction (vertical direction in FIG. 27).
  • Layer LPa is in contact with each of layer LC1 and layer LC2.
  • the layer LC1, the layer LPa, and the layer LC2 are directly stacked in this order in the thickness direction.
  • Layer LC1, layer LPa, and layer LC2 may correspond to layers that are laminated when core substrate 621 is manufactured using laminated ceramic technology.
  • the first magnetic body portion 301Pa falls within the range BMa in the in-plane direction (direction perpendicular to the thickness direction) in the layer LC1 and the layer LC2, and protrudes beyond the range BMa in the layer LPa. ing. A portion of the first magnetic body portion 301Pa that protrudes beyond the range BMa corresponds to the protrusion structure PMa.
  • the arrangement of the first magnetic body portion 301Pa in the in-plane direction in each of the layers LC1 and LC2 is the same, but as long as these arrangements fall within the range BMa, They may be the same or different from each other.
  • the minimum range within which the first magnetic body portion 301Pa can fit in both the layer LC1 and the layer LC2 is the range BMa.
  • the protrusion structure PMa has a thickness dimension TPa and a width dimension WPa (dimension in the direction perpendicular to the thickness direction). As shown in FIG. 27, the protrusion structure PMa may have a roughly rectangular shape in cross-sectional view, and in that case, the width dimension WPa and the thickness dimension TPa correspond to the dimensions of the sides of the rectangle.
  • the protrusion structure PMa is formed using the multilayer ceramic technology as described above, it is possible to easily form the protrusion structure PMa in a rectangular shape.
  • end surfaces FT substantially parallel to the thickness direction are provided on the protrusion structure PMa. For example, as shown in FIG.
  • the pattern (shape in the in-plane direction) of the first magnetic body portion 301Pa in each of the layer LC1, layer LPa, and layer LC2 has a circular outer edge.
  • the protrusion structure PMa may be formed by shifting the pattern in the layer LPa from the patterns in the layers LC1 and LC2.
  • the protrusion structure can also be formed by making the diameter of the circular shape in the layer LPa larger than the diameter of the circular shapes in the layers LC1 and LC2.
  • the protrusion structure PMa may have a rectangular shape as described above in cross-sectional view, or may have another shape.
  • the maximum width dimension and maximum thickness dimension of the protrusion structure PMa may be regarded as the width dimension WPa and the thickness dimension TPa.
  • the width dimension WPa and the thickness dimension TPa are larger than the particle diameter of the ceramic forming the ceramic substrate 100.
  • the width WPa is preferably 10 ⁇ m or more and 100 ⁇ m or less.
  • the width dimension WPa is 10 ⁇ m or more, it is easy to sufficiently obtain the anchor effect by the protrusion structure PMa.
  • the thickness dimension TPa is preferably 50 ⁇ m or more and 200 ⁇ m or less.
  • the second magnetic body portion 302 may also have a protrusion structure PMa similar to the above. As shown in the cross-sectional view of FIG. 26, in the in-plane direction (horizontal direction in the figure), the protrusion structure PMa of the first magnetic body part 301 and the concave structure CMa of the second magnetic body part 302 are , it is okay to face each other.
  • the configuration of the core board 621 other than the above is almost the same as the configuration of the core board 601 described above (FIG. 5: Embodiment 1), so the same reference numerals are given to the same or corresponding elements, and the description thereof will be omitted. Do not repeat.
  • the mechanical coupling between each of the first magnetic body portion 301Pa and the second magnetic body portion 302Pa and the ceramic substrate 100 is strengthened by the protrusion structure PMa. This suppresses deterioration of the electrical characteristics of the core substrate 621 due to temperature cycles. Therefore, the electrical characteristics of the core substrate 621 can be made more stable.
  • FIG. 29 shows a core substrate 622 that is a modification of the core substrate 621 (FIG. 27).
  • FIG. 30 is a perspective view of FIG. 29.
  • the core board 622 (FIG. 29) has a first magnetic body part 301Pb instead of the first magnetic body part 301Pa of the core board 621 (FIG. 27).
  • the first magnetic body portion 301Pb has a step structure PMb facing the ceramic substrate 100.
  • the core substrate 622 includes a layer LC and a layer LPb that are directly stacked on each other in the thickness direction (vertical direction in the figure).
  • Layer LC and layer LPb may correspond to layers that are laminated when core substrate 622 is manufactured using laminated ceramic technology.
  • the first magnetic body portion 301Pb falls within a range BMb in the in-plane direction (direction perpendicular to the thickness direction) in the layer LC, and extends beyond the range BMb in the layer LPb.
  • a portion of the first magnetic body portion 301Pb that extends beyond the range BMb corresponds to the step structure PMb.
  • the step structure PMb has a surface FW that extends substantially parallel to the in-plane direction from the range BMb, and an end surface FT that extends substantially parallel to the thickness direction from the end of the surface FW.
  • a cross-sectional view FIG.
  • the dimension of the surface FW is defined as the width dimension WPb of the step structure PMb
  • the dimension of the end surface FT is defined as the thickness dimension TPb.
  • the width dimension WPb and the thickness dimension TPb are larger than the particle diameter of the ceramic forming the ceramic substrate 100.
  • the particle size is 1 ⁇ m or more and 10 ⁇ m or less, preferably the width dimension WPb is 10 ⁇ m or more and 100 ⁇ m or less, and the thickness dimension TPb is 50 ⁇ m or more and 200 ⁇ m or less.
  • the pattern (shape in the in-plane direction) of the first magnetic body portion 301Pb in each of the layer LC and the layer LPb has a circular outer edge.
  • the step structure PMb may be formed by shifting the pattern in the layer LPb from the pattern in the layer LC.
  • the step structure can be formed by making the diameter of the circular shape in the layer LPb larger than the diameter of the circular shape in the layer LC.
  • the layer LC1 and the layer LPa in the fifteenth embodiment (FIG. 27) described above can be regarded as the layer LC and the layer LPb in this modification, respectively, and therefore the core substrate 621 having the protrusion structure PMa is It also has a structure. Compared to the step structure PMb that does not include a protrusion structure, the protrusion structure PMa can more easily increase the effect of increasing mechanical strength.
  • FIG. 31 is a partial cross-sectional view schematically showing the configuration of the core substrate 631 in the sixteenth embodiment.
  • FIG. 32 is a partially enlarged view of FIG. 31.
  • FIG. 33 is a partial perspective view of FIG. 32.
  • the core board 631 (FIG. 31) has a first conductor part 201Q and a second conductor part 202Q instead of the first conductor part 201 and the second conductor part 202 of the core board 601 (FIG. 5).
  • Each of the first conductor part 201Q and the second conductor part 202Q has a protrusion structure QC toward the first magnetic body part 301 and the second magnetic body part 302 in a cross-sectional view including the thickness direction (vertical direction in FIG. 32).
  • each of the first conductor part 201Q and the second conductor part 202Q is inserted into the first magnetic body part 301 and the second magnetic body part 302 in a cross-sectional view including the thickness direction (vertical direction in FIG. 32). It has a protrusion structure QC.
  • the core substrate 631 includes a layer LD1, a layer LD2, and a layer LQ between them in the thickness direction (vertical direction in FIG. 32).
  • Layer LQ is in contact with each of layer LD1 and layer LD2.
  • the layer LD1, the layer LQ, and the layer LD2 are directly stacked in this order in the thickness direction.
  • Layer LD1, layer LQ, and layer LD2 may correspond to layers that are laminated when core substrate 631 is manufactured using laminated ceramic technology.
  • the first conductor portion 201Q falls within the range BC in the in-plane direction (direction perpendicular to the thickness direction) in the layer LD1 and the layer LD2, and protrudes beyond the range BC in the layer LQ. There is. A portion of the first conductor portion 201Q that protrudes beyond the range BC corresponds to the protrusion structure QC. Note that in the example shown in FIG. 32, the arrangement of the first conductor portions 201Q in the in-plane direction in each of the layers LD1 and LD2 is the same, but these arrangements are the same as long as they fall within the range BC. may be different from each other.
  • the minimum range within which the first conductor portion 201Q can fit in both the layer LD1 and the layer LD2 is the range BC.
  • the protrusion structure QC has a thickness dimension TQ and a width dimension WQ (dimension in the direction perpendicular to the thickness direction).
  • the maximum width dimension and maximum thickness dimension of the protrusion structure QC may be regarded as the width dimension WQ and the thickness dimension TQ.
  • the width dimension WQ and the thickness dimension TQ are larger than the particle diameter of the sintered metal forming the magnetic body portion 300.
  • the width WQ is preferably 10 ⁇ m or more and 100 ⁇ m or less.
  • the thickness dimension TQ is 5 ⁇ m or more and 30 ⁇ m or less.
  • the protrusion structure QC may include a disk portion QCa having an approximately disk shape and a truncated cone portion QCb approximately having a truncated cone shape. . Further, this protrusion structure QC may be sandwiched between a cylindrical portion CL having an approximately cylindrical shape in the thickness direction. The disk portion QCa is in contact with the bottom surface (the larger of the pair of circular surfaces of the truncated cone) of the truncated cone portion QCb. The central axis of the disk portion QCa and the central axis of the truncated cone portion QCb approximately coincide.
  • the central axis of the truncated conical portion QCb and the central axis of the cylindrical portion CL connected to the truncated conical portion QCb approximately coincide with each other.
  • the diameter of the bottom surface of the truncated cone portion QCb is larger than the diameter of the cylindrical portion CL.
  • the diameter of the disc portion QCa is larger than the diameter of the bottom surface of the truncated cone portion QCb.
  • the protrusion structure QC (FIG. 32) constituted by the disk portion QCa and the truncated cone portion QCb can be easily formed when a manufacturing method using laminated ceramic technology is used. An example of this manufacturing method will be briefly described below.
  • One green sheet is prepared, which is a portion of the ceramic substrate 100 included in the layer LD1 and the layer LQ (FIG. 32).
  • a through hole corresponding to the through hole HL1 (FIG. 31) is formed in this green sheet.
  • This through hole of the green sheet is filled with a magnetic powder paste which is the material of the first magnetic body portion 301 .
  • a magnetic material filling portion is formed in the through hole of the green sheet.
  • a through hole smaller than the through hole of the green sheet is formed in the magnetic material filling part. The diameter of this through hole in the magnetic material-filled portion is approximately the same as the diameter of the cylindrical portion CL, if firing shrinkage is ignored.
  • the through-hole of the magnetic material filling part is filled with conductor powder paste, which is the material of the first conductor part 201Q, by a paste printing process.
  • This printing process is performed so that the conductor powder paste is not only filled inside the through hole of the magnetic material filling part but also applied around the through hole on the upper surface of the magnetic material filling part.
  • the extent to which the conductive powder paste is applied around the through holes can be easily adjusted depending on the size of the printed pattern and the like.
  • green sheets that will become the layer LD1 and the layer LQ are formed. Further, a green sheet that becomes a portion including the layer LD2 is formed by a process similar to this process. Further, green sheets serving as other parts may also be formed. For example, in the configuration illustrated in FIG. 31, a total of seven green sheets are formed. A laminate is formed by stacking these green sheets on each other. By firing this laminate, a fired body having a ceramic substrate 100, a first magnetic body part 301, a second magnetic body part 302, a first conductor part 201Q, and a second conductor part 202Q shown in FIG. 31 is obtained. is obtained. An electrode paste is printed on this fired body, and the electrode paste is fired to form terminals (specifically, the electrode portion 401, the electrode portion 402, and the interconnection portion 450). Thereby, a core substrate 631 is obtained.
  • the portion of the conductive powder paste that is filled inside the through hole of the magnetic material filling portion becomes the cylindrical portion CL. Further, the portion of the conductor powder paste applied around the through hole on the upper surface of the magnetic material filling portion becomes the disk portion QCa.
  • a truncated conical portion QCb is formed near the portion where the cylindrical portion CL and the disc portion QCa are connected as a result of meeting the various conditions in the manufacturing method described above.
  • the diameter of the disk portion QCa can be easily adjusted by adjusting the size of the printed pattern of the conductive powder paste. In other words, the width dimension WQ (FIG. 32) of the protrusion structure QC can be easily adjusted.
  • the protrusion structure QC of the first conductor part 201 and the protrusion structure QC of the second conductor part 202 may face each other in the in-plane direction. Further, as shown in FIG. 32, there is a protrusion structure QC in one direction along the in-plane direction (right direction in FIG. 32) and in another direction along the in-plane direction (left direction in FIG. 32). The protrusion structures QC may be arranged at a common position in the thickness direction (vertical direction in FIG. 32).
  • the configuration of the core board 631 other than the above is almost the same as the configuration of the core board 601 described above (FIG. 5: Embodiment 1), so the same reference numerals are given to the same or corresponding elements, and the description thereof will be omitted. Do not repeat.
  • the mechanical coupling between each of the first conductor portion 201Q and the second conductor portion 202Q and the magnetic body portion 300 is strengthened by the protrusion structure QC. This suppresses deterioration of the electrical characteristics of the core substrate 631 due to temperature cycles. Therefore, the electrical characteristics of the core substrate 631 can be made more stable.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2022/029114 2022-07-28 2022-07-28 コア基板およびインターポーザ Ceased WO2024024027A1 (ja)

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JP2024536682A JP7780020B2 (ja) 2022-07-28 2022-07-28 コア基板およびインターポーザ
US19/023,701 US20250167091A1 (en) 2022-07-28 2025-01-16 Core substrate and interposer
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WO2026033882A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034394A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034390A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ

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US20130285256A1 (en) * 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
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WO2026033882A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
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WO2026034390A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ

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