JPWO2024024027A1 - - Google Patents

Info

Publication number
JPWO2024024027A1
JPWO2024024027A1 JP2024536682A JP2024536682A JPWO2024024027A1 JP WO2024024027 A1 JPWO2024024027 A1 JP WO2024024027A1 JP 2024536682 A JP2024536682 A JP 2024536682A JP 2024536682 A JP2024536682 A JP 2024536682A JP WO2024024027 A1 JPWO2024024027 A1 JP WO2024024027A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024536682A
Other languages
Japanese (ja)
Other versions
JPWO2024024027A5 (https=
JP7780020B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024024027A1 publication Critical patent/JPWO2024024027A1/ja
Publication of JPWO2024024027A5 publication Critical patent/JPWO2024024027A5/ja
Priority to JP2025200371A priority Critical patent/JP2026020289A/ja
Application granted granted Critical
Publication of JP7780020B2 publication Critical patent/JP7780020B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024536682A 2022-07-28 2022-07-28 コア基板およびインターポーザ Active JP7780020B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025200371A JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029114 WO2024024027A1 (ja) 2022-07-28 2022-07-28 コア基板およびインターポーザ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025200371A Division JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Publications (3)

Publication Number Publication Date
JPWO2024024027A1 true JPWO2024024027A1 (https=) 2024-02-01
JPWO2024024027A5 JPWO2024024027A5 (https=) 2025-02-03
JP7780020B2 JP7780020B2 (ja) 2025-12-03

Family

ID=89705758

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024536682A Active JP7780020B2 (ja) 2022-07-28 2022-07-28 コア基板およびインターポーザ
JP2025200371A Pending JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025200371A Pending JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Country Status (3)

Country Link
US (1) US20250167091A1 (https=)
JP (2) JP7780020B2 (https=)
WO (1) WO2024024027A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034389A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034394A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026033882A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034390A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) * 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) * 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) * 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) * 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) * 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) * 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) * 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) * 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) * 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) * 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) * 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) * 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) * 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) * 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) * 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) * 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Also Published As

Publication number Publication date
WO2024024027A1 (ja) 2024-02-01
JP7780020B2 (ja) 2025-12-03
US20250167091A1 (en) 2025-05-22
JP2026020289A (ja) 2026-02-06

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