JP7780020B2 - コア基板およびインターポーザ - Google Patents

コア基板およびインターポーザ

Info

Publication number
JP7780020B2
JP7780020B2 JP2024536682A JP2024536682A JP7780020B2 JP 7780020 B2 JP7780020 B2 JP 7780020B2 JP 2024536682 A JP2024536682 A JP 2024536682A JP 2024536682 A JP2024536682 A JP 2024536682A JP 7780020 B2 JP7780020 B2 JP 7780020B2
Authority
JP
Japan
Prior art keywords
magnetic material
core substrate
conductor
substrate
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024536682A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024024027A5 (https=
JPWO2024024027A1 (https=
Inventor
芳嗣 若園
信 谷
孝浩 安藤
安紗美 名取
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2024024027A1 publication Critical patent/JPWO2024024027A1/ja
Publication of JPWO2024024027A5 publication Critical patent/JPWO2024024027A5/ja
Priority to JP2025200371A priority Critical patent/JP2026020289A/ja
Application granted granted Critical
Publication of JP7780020B2 publication Critical patent/JP7780020B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2024536682A 2022-07-28 2022-07-28 コア基板およびインターポーザ Active JP7780020B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025200371A JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/029114 WO2024024027A1 (ja) 2022-07-28 2022-07-28 コア基板およびインターポーザ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025200371A Division JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Publications (3)

Publication Number Publication Date
JPWO2024024027A1 JPWO2024024027A1 (https=) 2024-02-01
JPWO2024024027A5 JPWO2024024027A5 (https=) 2025-02-03
JP7780020B2 true JP7780020B2 (ja) 2025-12-03

Family

ID=89705758

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024536682A Active JP7780020B2 (ja) 2022-07-28 2022-07-28 コア基板およびインターポーザ
JP2025200371A Pending JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025200371A Pending JP2026020289A (ja) 2022-07-28 2025-11-20 コア基板

Country Status (3)

Country Link
US (1) US20250167091A1 (https=)
JP (2) JP7780020B2 (https=)
WO (1) WO2024024027A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034389A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034394A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026033882A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ
WO2026034390A1 (ja) * 2024-08-07 2026-02-12 日本碍子株式会社 コア基板およびインターポーザ

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058945A1 (ja) 2009-11-11 2011-05-19 株式会社村田製作所 積層セラミック電子部品
US20130285256A1 (en) 2010-11-22 2013-10-31 Andreas Fischer Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
JP2014143312A (ja) 2013-01-24 2014-08-07 Napura:Kk 受動素子内蔵基板
JP2017157792A (ja) 2016-03-04 2017-09-07 イビデン株式会社 電子部品内蔵基板及びその製造方法
WO2018139046A1 (ja) 2017-01-27 2018-08-02 株式会社村田製作所 インターポーザ基板、回路モジュール、インターポーザ基板の製造方法
JP2021061264A (ja) 2019-10-02 2021-04-15 味の素株式会社 インダクタ機能を有する配線基板及びその製造方法
JP2021061387A (ja) 2019-10-08 2021-04-15 インテル コーポレイション 予め製造されたフェライトコアを有する同軸磁性インダクタ
JP2021086856A (ja) 2019-11-25 2021-06-03 イビデン株式会社 インダクタ内蔵基板、インダクタ内蔵基板の製造方法

Also Published As

Publication number Publication date
WO2024024027A1 (ja) 2024-02-01
JPWO2024024027A1 (https=) 2024-02-01
US20250167091A1 (en) 2025-05-22
JP2026020289A (ja) 2026-02-06

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