WO2024017163A1 - 电路板、主板及电子设备 - Google Patents

电路板、主板及电子设备 Download PDF

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Publication number
WO2024017163A1
WO2024017163A1 PCT/CN2023/107472 CN2023107472W WO2024017163A1 WO 2024017163 A1 WO2024017163 A1 WO 2024017163A1 CN 2023107472 W CN2023107472 W CN 2023107472W WO 2024017163 A1 WO2024017163 A1 WO 2024017163A1
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WO
WIPO (PCT)
Prior art keywords
sub
pad
welding
shielding frame
area
Prior art date
Application number
PCT/CN2023/107472
Other languages
English (en)
French (fr)
Inventor
李梦园
秦熙琨
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024017163A1 publication Critical patent/WO2024017163A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference

Definitions

  • the embodiments of the present application relate to the technical field of terminal equipment, and specifically relate to a circuit board, a motherboard and an electronic device.
  • Electronic devices such as mobile phones, tablet computers, etc. generally have a motherboard.
  • the motherboard includes: a circuit board, electronic devices provided on the circuit board, and a shielding frame covering the electronic devices.
  • the shielding frame is a metal frame that can achieve electromagnetic shielding to avoid signal interference.
  • the circuit board is provided with a welding pad extending along the edge of the electronic device, and the welding pad is welded to the shielding frame to achieve fixation between the shielding frame and the circuit board.
  • Embodiments of the present application provide a circuit board, a motherboard and an electronic device, aiming to solve the problem of easy formation of virtual soldering between the shield frame and the pad.
  • a circuit board which includes: a board body; the board body includes a core board; a circuit with a certain pattern is provided on the core board; and the circuit can be connected to an electronic device.
  • the surface of the board body has a device area, and the device area is an area in the board body used for installing electronic devices.
  • the circuit board also includes a shielding frame.
  • the shielding frame is installed on the surface of the board body, and the shielding frame surrounds the outside of the device area, so that the shielding frame can be placed around the outside of the electronic device.
  • the surface of the board body also has first welding areas and second welding areas spaced apart along the edge of the device area.
  • the circuit board also includes a soldering pad.
  • the soldering pad includes a first sub-soldering pad and a second sub-soldering pad.
  • the first sub-soldering pad and the second sub-soldering pad are spaced apart in the first welding area.
  • the first sub-soldering pad and the second sub-soldering pad are spaced apart from each other.
  • the two sub-pads are welded to the shielding frame to fix the shielding frame to the circuit board.
  • the first sub-pads and the second sub-pads are arranged spaced apart along corresponding edges of the device area within the first bonding area.
  • the board is welded to the shielding frame in multiple places in a direction parallel to the edge of the device area, which can improve the uniformity of the connection force between the shielding frame and the board; at the same time, it can also reduce signal leakage between the shielding frame and the board. .
  • the distances between the respective device areas of the first sub-pad and the second sub-pad in the first bonding area are unequal.
  • the first sub-pad and the second sub-pad are arranged in the direction of the corresponding edge of the first welding area, they are also arranged in the direction away from the device area; the shielding frame has a larger end toward the board body. Even if the size error is small, the welding to the shielding frame can still be completed. In addition, when there is a large welding error, the welding between the first sub-pad and the second sub-pad and the shielding frame can also be completed. In other words, the requirements for the size of the shielding frame and the position accuracy of the shielding frame during welding can be reduced to reduce the difficulty of making and installing the shielding frame.
  • the first sub-pad in the first bonding area is further away from the device area than the second sub-pad.
  • the first sub-bonding pad and the second sub-bonding pad are distributed in the direction away from the device area, which increases the distribution width of the first sub-bonding pad and the second sub-bonding pad in the direction away from the device area. , thereby reducing the requirements for the size of the shielding frame and the position accuracy of the shielding frame during welding, so as to reduce the difficulty of making and installing the shielding frame.
  • first sub-bonding pads and multiple second sub-bonding pads there are multiple first sub-bonding pads and multiple second sub-bonding pads in the first welding area, and the multiple first sub-bonding pads are arranged at intervals along the edge of the device area.
  • a second sub-pad is disposed adjacent to the first sub-pad. In this way, the first sub-pad and the second sub-pad are staggered. Under the influence of the dimensional accuracy of the shielding frame or the position accuracy during welding, when the end of the shielding frame facing the board body is farther or closer to the device area, the first At least one of the sub-pad and the second sub-pad must be well welded to the shielding frame to avoid signal leakage.
  • the staggered arrangement of the first sub-bonding pads and the second sub-bonding pads can make the welding between the shielding frame and the board body more uniform when the end of the shielding frame facing the board body is farther or closer to the device area, which improves the The uniformity of the connection force between the shielding frame and the board body.
  • the distance between each first sub-pad and the device area is equal, and the distance between each second sub-pad and the device area is equal.
  • Such an arrangement can make the first sub-pad and the second sub-pad evenly distributed, which facilitates the Production of sub-pads.
  • the distance between an end of the second sub-pad away from the device area and the device area in the first welding area is greater than the distance between an end of the first sub-pad facing the device area and the device area.
  • the distance is such that along the direction perpendicular to the edge of the device area corresponding to the welding area, the first sub-pad partially overlaps with the second sub-pad.
  • a distance between an end of the second sub-pad away from the device area and the device in the first welding area is equal to a distance between an end of the first sub-pad facing the device area and the device area.
  • the distance difference is 0.2mm-0.4mm.
  • the distance difference can be 0.2mm, 0.3mm, 0.4mm, etc.
  • the distance difference between the first sub-pad and the device area and the distance between the second sub-pad and the device area is 0.08mm-0.12mm.
  • the distance between the first sub-pad and the second sub-pad in the first welding area is 0.15mm-0.2mm. In this way, it can be ensured that there is sufficient distance between the first sub-bonding pad and the second sub-bonding pad, so that during welding, a sufficient amount of solder flows into the first sub-bonding pad and the second sub-bonding pad, thereby making the first sub-bonding pad
  • the sub-pad and the second sub-pad are welded well to the shield frame.
  • the width of the first sub-pad and the second sub-pad is greater than or equal to 0.35mm; wherein the direction of the width of the first sub-pad and the second sub-pad is consistent with the direction of the width of the first sub-pad and the second sub-pad.
  • the edges of the device area where a soldering area is located are parallel.
  • the projection of the first sub-pad and the second sub-pad on the surface of the board body is square or circular.
  • a first sub-bonding pad and a second sub-bonding pad may also be provided in the second welding area, and the first sub-bonding pad and the second sub-bonding pad are in the second welding area.
  • both the first sub-pad and the second sub-pad are welded to the shielding frame to improve the connection force between the board and the shielding frame, and at the same time to avoid signal leakage between the board and the shielding frame.
  • the first welding area and the second welding area are arranged at intervals along the edge of the device area, and the first welding area and the second welding area correspond to one side of the device area; or, The first welding area and the second welding area correspond to different sides of the device area.
  • first welding areas there may be multiple first welding areas and multiple second welding areas.
  • the multiple first welding areas are arranged at intervals along the edge of the device area, and two adjacent first welding areas are A second welding zone is provided between the zones.
  • the circuit board further includes a shielding frame, the shielding frame is surrounding the outside of the device area, and between one end of the shielding frame facing the device area and the first sub-pad and the second sub-pad.
  • the shielding frame can form an electromagnetic shield to prevent electromagnetic signals in the device area from radiating outside the device area to avoid the impact of electronic devices on other electronic devices in the electronic equipment; it can also prevent external electromagnetic signals from radiating into the device area. to avoid affecting the operation of electronic devices.
  • the circuit board further includes a shielding cover, and the shielding cover is disposed on an end of the shielding frame away from the board body.
  • the shielding cover can seal the end of the shielding frame away from the board body, so that the shielding frame, the shielding cover and the board body form a closed space for accommodating electronic devices, thus improving the electromagnetic shielding effect.
  • embodiments of the present application also provide a motherboard, including:
  • Electronic devices the electronic devices are arranged on the board body and located in the device area;
  • the shielding frame is located around the electronic device, between one end of the shielding frame facing the board body and the first sub-pad and the second sub-pad.
  • a welded body connection formed by welding.
  • embodiments of the present application also provide an electronic device, including: the motherboard as described above.
  • embodiments of the present application also provide a method for manufacturing a motherboard, including:
  • the circuit board includes:
  • a board body, the surface of the board body has a device area, and first welding areas and second welding areas spaced along the edge of the device area;
  • the soldering pad includes a first sub-soldering pad and a second sub-soldering pad, and the first sub-soldering pad and the second sub-soldering pad are spaced apart in the first welding area;
  • solder on the first welding area, the solder covering the first sub-pad and the second sub-pad and the first welding area between the first sub-pad and the second sub-pad;
  • Welding is performed to melt the solder and form a welded body connecting the first sub-pad and the shield frame, and the second sub-pad and the shield frame.
  • the circuit board, motherboard and electronic equipment provided by the embodiments of the present application have first welding areas and second welding areas spaced apart along the edge of the device area on the board body, and first sub-pads are spaced apart in the first welding area. and the second subpad.
  • first welding areas and second welding areas spaced apart along the edge of the device area on the board body
  • first sub-pads are spaced apart in the first welding area. and the second subpad.
  • solder When welding between the board and the shield frame, apply solder on the first welding area. At this time, the solder will cover the first and second sub-pads as well as the first and second sub-pads.
  • the molten solder flows to the first sub-pad and the second sub-pad, and then between the first sub-pad and the shielding frame, and between the second sub-pad and the shielding frame A welded body is formed between them.
  • the first sub-pad and the second sub-pad are spaced apart, the space between the first sub-pad and the second sub-pad and the shielding frame is smaller, and when the solder melts , the solder between the first sub-pad and the second sub-pad will flow to the first sub-pad and the second sub-pad, and the formed solder body is only located between the first sub-pad and the shield frame, and the second Between the sub-pad and the shielding frame, this increases the thickness of the welding body; thereby avoiding the poor flatness of the end faces welded between the shielding frame and the sub-pad, resulting in large distances between some shielding frames and sub-pads, There is insufficient solder between the shielding frame and the sub-pads to avoid false soldering and improve the electromagnetic shielding effect of the shielding frame.
  • Figure 1 is a schematic structural diagram of a column plate in the related art
  • Figure 2 is a top view of the pad in the related art
  • Figure 3 is a top view of the circuit board provided by the embodiment of the present application.
  • Figure 4 is a schematic structural diagram of a circuit board provided by an embodiment of the present application.
  • Figure 5 is a schematic structural diagram of the mainboard provided by the embodiment of the present application in which the shielding frame is attached to the board body;
  • Figure 6 is a partial enlarged view of position A in Figure 5;
  • Figure 7 is a schematic structural diagram of the mainboard provided by the embodiment of the present application in which the shielding frame is attached to the welding area on the board body;
  • Figure 8 is a schematic structural diagram of a welded body formed in a motherboard according to an embodiment of the present application.
  • Figure 9 is a partial enlarged view of B in Figure 8.
  • FIG. 10 is a schematic structural diagram of the shielding frame in the motherboard provided by the embodiment of the present application.
  • Figure 11 is a comparison view of the welded body formed in the related art and the embodiment of the present application.
  • Figure 12 is a top view 2 of the soldering pad in the related art
  • FIG. 13 is a flow chart of the manufacturing method of the motherboard provided by the embodiment of the present application.
  • Figure 14 is a top view of the circuit board in the motherboard manufacturing method provided by the embodiment of the present application.
  • Figure 15 is a schematic structural diagram after solder is formed in the motherboard manufacturing method provided by the embodiment of the present application.
  • Figure 16 is a view of the interface between the sub-pad and the board facing the direction of the solder after the solder is formed in the motherboard manufacturing method provided by the embodiment of the present application;
  • Figure 17 is a schematic structural diagram of attaching the shielding frame to the solder in the motherboard manufacturing method provided by the embodiment of the present application;
  • FIG. 18 is a schematic structural diagram of a soldered body formed in the motherboard manufacturing method provided by the embodiment of the present application.
  • an electronic device generally has a motherboard 100.
  • the motherboard 100 includes a circuit board 10 and an electronic device 20 disposed on the circuit board 10.
  • the electronic device 20 may be a memory to implement data storage through the memory. Since the memory will generate electromagnetic signals when working, other electronic devices in the same electronic device will also generate electromagnetic signals when working. In order to avoid electromagnetic signals from affecting the work of the memory, it is also necessary to avoid the electromagnetic signals generated by the memory from affecting the work of other electronic devices.
  • a shielding frame 30 is provided on the outer cover of the memory, and the shielding frame 30 is a metal frame to achieve electromagnetic shielding through the shielding frame 30 .
  • the surface of the circuit board 10 on which the memory is installed has a soldering pad 104 extending along the edge of the memory.
  • the soldering pad 104 is a whole piece of metal.
  • solder paste is applied to the pad 104, and then the shielding frame 30 shown in Figure 1 is placed on the memory, and the shielding frame 30 is in contact with the solder paste; then the solder paste is melted through a reflow soldering process.
  • a welded body connecting the pad 104 and the shield frame 30 is formed, thereby realizing welding between the shield frame 30 and the circuit board 10 .
  • the size of the shielding frame 30 is large, and the shielding frame 30 may be easily deformed during the manufacturing or transportation process, which may lead to poor flatness of the end face of the shielding frame 30 used for welding with the soldering pad 104 (ie, the end face of the soldering pad 104 Coplanarity is difficult to control), and the distance between some end faces and the pad 104 is relatively large.
  • the amount of solder paste at the location where the distance between the end face and the pad 104 is large is insufficient, making it difficult for the formed solder body to connect the shield frame 30 and the pad 104, thus forming a virtual solder; which can easily lead to the leakage of electromagnetic signals, and thus Affects the electromagnetic shielding effect of the shielding frame 30.
  • the electronic device may include a mobile phone, a tablet computer, etc.; this embodiment does not limit the electronic device.
  • the electronic device includes a motherboard 100 , through which functions such as control and data storage can be implemented.
  • the mainboard 100 includes a circuit board 10 and electronic devices 20 arranged on the circuit board 10 .
  • the electronic devices 20 are connected to circuits on the circuit board 10 .
  • the electronic device 20 may include: a memory, a power management unit (PMU for short), etc., wherein the memory can store data, and the power management unit can implement functions such as detecting and managing batteries in the electronic device. .
  • PMU power management unit
  • the circuit board 10 includes a board body 110 , and the board body 110 includes a core board.
  • a circuit with a certain pattern is provided on the core board, and the circuit can be connected to the electronic device 20 .
  • the surface of the board body 110 has a device area 101.
  • the device area 101 is used for installing electronic devices in the board body 110. 20 (as shown in Figure 1) area.
  • the circuit board 10 also includes a shielding frame 30 (as shown in FIG. 1 ).
  • the shielding frame 30 is installed on the surface of the board body 110 and surrounds the outside of the device area 101 so that the shielding frame 30 can be surrounded by electronic components.
  • the outside of the device 20 further forms an electromagnetic shield, preventing electromagnetic signals in the device area 101 from radiating outside the device area 101 to prevent the electronic device 20 from affecting other electronic devices in the electronic equipment; at the same time, it can also prevent external electromagnetic signals. Radiate into the device area 101 to avoid affecting the operation of the electronic device 20 .
  • the shielding frame 30 is a metal frame, so that after the shielding frame 30 is installed on the board 110 , the shielding frame 30 is located outside the device area 101 , that is to say, the shielding frame 30 is located around the electronic device 20 outside to act as electromagnetic shielding.
  • the device area 101 may be in a rectangular shape.
  • the shielding frame 30 may be in a rectangular ring shape and surround the device area 101. That is, the shielding frame 30 is a rectangular frame.
  • the device area 101 may also be circular.
  • the shielding frame 30 is annular and is located outside the area between the device areas 101. That is, the shielding frame 30 is a circular frame.
  • the device area 101 can also have other non-returning shapes.
  • the shielding frame 30 can have an irregular shape, as long as it is ensured that the shielding frame 30 is surrounded by the device area 101 so that the shielding frame 30 is surrounded by The electronic device is only 20 meters away.
  • the circuit board 10 may also include a shielding cover 40 .
  • the shielding cover 40 is disposed on an end of the shielding frame 30 facing away from the board body 110 .
  • the shielding cover 40 can protect the shielding frame 30 from the board body 110 .
  • One end is closed, so that the shielding frame 30 , the shielding cover 40 and the board body 110 form a sealed space for accommodating the electronic device 20 , thereby improving the electromagnetic shielding effect.
  • the shielding cover 40 is a metal cover to prevent electromagnetic signals from entering the closed space from the end of the shielding frame 30 facing away from the plate body 110, and at the same time, it can also prevent the electromagnetic signals in the closed space from passing away from the plate body 110 through the end of the shielding frame 30.
  • the shielding cover 40 can be connected to the shielding frame 30 by welding or snapping.
  • the shielding cover 40 can also be formed into an integrated structure with the shielding frame 30 by casting or stamping to simplify the shielding frame 30 and the shielding cover 40 production difficulty.
  • the surface of the board 110 also has first welding areas 102 and second welding areas 103 spaced along the edge of the device area 101 (direction a in Figure 3).
  • the area 102 and the second welding area 103 are used for welding between the shielding frame 30 and the plate body 110 to achieve fixation between the shielding frame 30 and the plate body 110 .
  • the circuit board 10 further includes a soldering pad 104.
  • the soldering pad 104 includes a first sub-soldering pad 106 and a second sub-soldering pad 105.
  • the first sub-soldering pad 106 and the second sub-soldering pad 105 are spaced apart from each other.
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 are welded to the shielding frame 30 to fix the shielding frame 30 on the circuit board 10 .
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 may be connected to a ground circuit to achieve grounding of the shielding frame 30 to further improve the electromagnetic shielding effect.
  • the first sub-bonding pads 106 and the second sub-bonding pads 105 can be arranged at intervals along the corresponding edges of the device area 101 in the first welding area 102; it can be understood that the corresponding edges of the device area 101 are Close to the edge of the first welding area 102 .
  • the first sub-bonding pads 106 and the second sub-bonding pads 105 are spaced apart in a direction parallel to one side of the rectangle, which side is in the rectangle and is in contact with the first welding pad. Area 102 is close to the edge.
  • the first sub-pads 106 and the second sub-pads 105 are spaced apart on the concentric circles of the device area 101; of course, in the implementation where the device area 101 is irregularly shaped , the first sub-bonding pad 106 and the second sub-bonding pad 105 may be arranged at intervals along the corresponding edge of the device area 101, and the edge distance between the first sub-bonding pad 106 and the second sub-pad 105 and the device area 101 may be The distance may be equal or unequal, and the distance is the distance between the edges of the first sub-pad 106 and the second sub-pad 105 facing the device area 101 and the corresponding edges of the device area 101 .
  • the plate body 110 is welded to the shielding frame 30 in multiple places in a direction parallel to the edge of the device area 101, which can improve the uniformity of the connection force between the shielding frame 30 and the plate body 110; at the same time, it can also reduce the number of connections between the shielding frame 30 and the plate body 110. Signal leakage between boards 110.
  • first sub-pad 106 and the second sub-pad 105 can be formed at the same time as the circuit on the board 110.
  • a metal layer can be formed on the core board first, and then part of the metal layer can be removed by etching. , to form a circuit with a certain pattern and the first sub-pad 106 and the second sub-pad 105; or, directly form a circuit with a certain pattern and the first sub-pad 106 and the second sub-pad 105 on the core board by electroplating.
  • Subpad 105 can also be installed on the board 110 after the circuit is formed on the board 110 .
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 may also be provided in the second welding area 103 , and the first sub-bonding pad 106 and the second sub-bonding pad 105 are in the The first sub-welding pad 106 and the second sub-pad 105 are both welded to the shielding frame 30 shown in Figure 1 to improve the connection force between the board 110 and the shielding frame 30. Signal leakage between the board 110 and the shielding frame 30 can also be avoided.
  • first sub-pad 106 and the second sub-pad The arrangement of 105 in the second welding area 103 is substantially the same as the arrangement of the first sub-bonding pad 106 and the second sub-bonding pad 105 in the first welding area 102, which will not be described again.
  • first welding area 102 and the second welding area 103 are arranged at intervals along the edge of the device area 101, and the first welding area 102 and the second welding area 103 can correspond to one side of the device area 101; of course, the first welding area 102 and the second welding area 103 The first welding area 102 and the second welding area 103 may also correspond to different sides of the device area 101, which is not limited in this embodiment.
  • first welding areas 102 there may be a plurality of first welding areas 102 and a plurality of second welding areas 103 .
  • the plurality of first welding areas 102 are arranged at intervals along the edge of the device area 101 .
  • Two adjacent first welding areas 102 A second welding area 103 is provided between them.
  • Figure 6 is a partial enlarged view of position A in Figure 5.
  • solder 50 such as solder paste, etc.
  • the board body 110 between the sub-pad 106 and the second sub-pad 105 and the first sub-pad 106 and the second sub-pad 105 (as shown in Figure 7, Figure 7 is the first welding area 102 in the circuit board 10 Corresponding structure diagram).
  • the shielding frame 30 is attached to the board 110 , and one end of the shielding frame 30 facing the board 110 is in contact with the solder 50 .
  • Figure 9 is a partial enlarged view of B in Figure 8, and then heating (such as reflow soldering, etc.) is performed to melt the solder 50, and the first sub-pad 106 and the second sub-pad 106 are The solder 50 between the pads 105 melts and flows to the first sub-pad 106 and the second sub-pad 105; then it is cooled to form the first sub-pad 106, the shield frame 30, and the second sub-pad.
  • the welding body 501 of the pad 105 and the shielding frame 30 that is to say, the shielding frame 30 is fixed on the board 110 through the welding body 501 .
  • solder resist layer 108 part of the solder resist layer 108 can be filled between the first sub-pad 106 and the second sub-pad 105 .
  • the solder resist layer 108 can promote the flow of the melted solder 50 to the first sub-pad 106 and the second sub-pad 105, so as to form a connection between the first sub-pad 106 and the shield frame 30, and the second sub-pad.
  • the solder body 501 of the bonding pad 105 and the shield frame 30 (as shown in Figure 9).
  • the solder resist layer 108 may be a green oil layer, and the material of the green oil layer may include: acrylic oligomer, acrylic monomer, etc.
  • the distance between the first sub-pad 106 and the second sub-pad 105 in the first welding area 102 is 0.15mm-0.2mm.
  • the first The distance between the sub-pad 106 and the second sub-pad 105 may be 0.15mm, 0.18mm, 0.2mm, etc. In this way, it can be ensured that there is a sufficient distance between the first sub-pad 106 and the second sub-pad 105, so that a sufficient amount of solder 50 flows into the first sub-pad 106 and the second sub-pad 105 during soldering.
  • to increase the volume of the welded body 501 shown in FIG. 9 so that the first sub-bonding pad 106 and the second sub-bonding pad 105 and the shielding frame 30 are well welded.
  • the width of the first sub-pad 106 and the second sub-pad 105 (the n value in Figure 3) is greater than or equal to 0.35mm; where the direction of the width of the first sub-pad 106 and the second sub-pad 105 is consistent with The edges of the device area 101 where the first welding area 102 is located are parallel.
  • the width of the first sub-pad 106 and the second sub-pad 105 may be 0.35mm, 0.4mm, 0.5mm, etc.
  • Such an arrangement can ensure that the first sub-bonding pad 106 and the second sub-bonding pad 105 have sufficient area to increase the volume of the welding body 501 between the first sub-bonding pad 106 and the second sub-bonding pad 105 and the shielding frame 30 , to improve the connection force between the first sub-pad 106 and the second sub-pad 105 and the shielding frame 30 .
  • the shielding frame 30 can be formed by connecting multiple shielding plates (not shown) in sequence.
  • the multiple shielding plates surround a columnar shielding channel.
  • the center line of the shielding channel is perpendicular to the plate body 110, and the device area 101 is located within the projection of the shielding channel on the surface of the plate 110 .
  • the corresponding shielding frame 30 includes a first shielding plate, a second shielding plate, a third shielding plate and a fourth shielding plate perpendicular to the plate body 110.
  • the first shielding plate has an edge parallel to the plate.
  • One end of the body 110 is connected to one end of the second shielding plate, the other end of the second shielding plate is connected to one end of the third shielding plate, the other end of the third shielding plate is connected to one end of the fourth shielding plate, and the fourth shielding plate The other end is connected to the other end of the first shielding plate to form a rectangular frame.
  • the shielding frame 30 has a fixing part at one end facing the plate body 110 as shown in FIG. 1 .
  • the fixing part may include a fixing plate 301 extending from the shielding frame 30 to the plate body 110 .
  • the fixing plate 301 is relative to the plate body.
  • 110 is arranged at an angle (for example, the angle A between the fixed plate 301 and the plate body 110 is 30°, 45°, 60°, etc.), so that the end of the fixed plate 301 facing the plate body 110 is closer to the end away from the plate body 110 Device area 101.
  • One end of the fixed plate 301 facing the board body 110 has a welding end surface 302 parallel to the board body 110.
  • the welding end surface 302 is welded to the first sub-soldering pad 106 and the second sub-soldering pad 105 shown in Figure 3 to weld the shielding frame 30 on the plate body 110.
  • one end of the shielding frame 30 facing the plate body 110 has a plurality of fixed plates 301 arranged at intervals.
  • the first welding area 102 and the second welding area 103 are welded to different fixing plates 301.
  • the fixing plate 301 is continuously disposed on one end of the shielding frame 30 toward the board body 110 , that is to say, the fixing plate 301 is disposed around the device area 101 , and at this time, the first welding area 102 and the second welding area 103 are Both the first sub-bonding pad 106 and the second sub-bonding pad 105 are welded to the welding end face 302 .
  • the fixing plate 301 can be an integrated structure with the shield frame 30 , and the integrated structure formed by casting or stamping simplifies the manufacturing difficulty of the shield frame 30 .
  • the fixing plate 301 can also be connected to the shielding frame 30 through welding, snapping, etc., which is not limited in this embodiment.
  • the circuit board 10 provided in this embodiment has a first welding area 102 and a second welding area 103 spaced apart along the edge of the device area 101 on the board body 110.
  • the first welding area 102 is spaced apart from each other.
  • a solder body 501 is formed between the first sub-bonding pad 106 and the shielding frame 30 and between the second sub-bonding pad 105 and the shielding frame 30 (as shown in FIG. 9 ).
  • the entire solder pad 104 is filled in the entire solder pad 104 and the shield frame after the solder 50 is melted.
  • the space between the pad 104 and the shield frame 30 is large, which easily causes insufficient solder 50; as shown in the first welding area 102 on the right side in Figure 11, in this embodiment, the first sub-pad 106
  • the space between the first sub-pad 106 and the second sub-pad 105 and the shield frame 30 is small, and when the solder 50 melts, the first sub-pad 106 and the second sub-pad 105 are spaced apart from each other.
  • the solder 50 between the two sub-pads 105 will flow to the first sub-pad 106 and the second sub-pad 105, and the formed solder body 501 is only located between the first sub-pad 106 and the shield frame 30, and between the second sub-pad 106 and the second sub-pad 105.
  • the thickness of the welding body 501 is increased in this way; thus, it is avoided that due to the poor flatness of the end face welded between the shielding frame 30 and the sub-bonding pad 104, part of the space between the shielding frame 30 and the sub-bonding pad 104 is The distance is relatively large, and there is insufficient solder 50 between part of the shielding frame 30 and the sub-pad 104 , thereby avoiding the formation of false soldering and improving the electromagnetic shielding effect of the shielding frame 30 .
  • the pad 104 in the welding area is a whole pad, and a notch 107 is provided on one side of the pad 104.
  • the solder 50 is coated on the pad 104 and the notch 107.
  • the solder corresponding to the notch 107 will flow into the space between the pad 104 and the shield frame 30 after being melted.
  • the gap between the pad 104 and the shield frame 30 can be increased to a certain extent.
  • the volume of the welded body However, the size of the notch 107 limits the increase in volume of the welded body.
  • the first sub-pad 106 and the second sub-pad 105 shown in Figure 3 are spaced apart in the first welding area 102.
  • the surface area of the first sub-pad 106 and the second sub-pad 105 is small.
  • the solder 50 is coated on the first sub-pad 106 and the second sub-pad 105 as well as the first sub-pad 106 and the second On the board 110 between the sub-pads 105, the solder 50 around the first sub-pad 106 and the second sub-pad 105 flows toward the first sub-pad 106 and the second sub-pad 105 during heating.
  • the volume of the soldering body 501 between the first sub-pad 106 and the second sub-pad 105 and the shield frame 30 is significantly increased to avoid the occurrence of false soldering.
  • the first sub-pad 106 and the second sub-pad 105 in the first welding area 102 have different distances between the device areas 101, that is, the second sub-pad
  • the distance between 105 and the device area 101 is L1
  • the distance between the first sub-pad 106 and the device area 101 is L2
  • L1 is not equal to L2.
  • first sub-pad 106 and the second sub-pad 105 are arranged in the direction of the corresponding edge of the first welding area 102, they are also arranged in the direction away from the device area 101; in the shield shown in Figure 1
  • the welding with the shielding frame 30 can still be completed.
  • there is a large welding error for example, when the positional deviation between the shield frame 30 and the device area 101 is large during welding
  • the first sub-bonding pad 106 in the first welding area 102 is further away from the device area 101 than the second sub-bonding pad 105 . That is to say, the first sub-bonding pad 106 is separated from the device area.
  • the distance L2 between 101 is greater than the distance L1 between the second sub-pad 105 and the device area 101 .
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 are distributed in the direction away from the device area 101, which increases the distance between the first sub-bonding pad 106 and the second sub-bonding pad 105 along the direction away from the device area 101.
  • the distribution width in the direction of the device area 101 further reduces the requirements for the size of the shielding frame 30 and the position accuracy of the shielding frame 30 during welding, thereby reducing the difficulty of manufacturing and installing the shielding frame 30 .
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 in the first welding area 102 are both There are a plurality of first sub-pads 106 arranged at intervals along the edge of the device area 101 , and one second sub-pad 105 is arranged between adjacent first sub-pads 106 . In this way, the first sub-bonding pads 106 and the second sub-bonding pads 105 are arranged in a staggered manner.
  • the end of the shielding frame 30 facing the board body 110 is farther away from the device area 101 or Closely, at least one of the first sub-bonding pad 106 and the second sub-bonding pad 105 is well welded to the shielding frame 30 to avoid signal leakage.
  • the staggered arrangement of the first sub-bonding pads 106 and the second sub-bonding pads 105 can make the gap between the shielding frame 30 and the board 110 smaller when the end of the shielding frame 30 facing the board 110 is farther or closer to the device area 101 .
  • the welding is relatively uniform, which improves the uniformity of the connection force between the shielding frame 30 and the plate body 110 .
  • first sub-bonding pads 106 and the second sub-bonding pads 105 are arranged in a staggered manner, the distance between each first sub-bonding pad 106 and the device area 101 is equal, and the distance between each second sub-bonding pad 105 and the device area 101 is equal. The distance between them is equal. With this arrangement, the first sub-bonding pad 106 and the second sub-bonding pad 105 can be evenly distributed, which facilitates the production of each sub-bonding pad.
  • the distance between the end of the second sub-pad 105 in the first welding area 102 away from the device area 101 and the device area 101 is greater than the distance between the end of the first sub-pad 106 facing the device area 101 and The distance between the device areas 101 (L2 in FIG. 3) is such that the first sub-pad 106 and the second sub-pad 105 partially overlap in a direction perpendicular to the edge of the device area 101 corresponding to the first welding area 102.
  • both the first sub-bonding pad 106 and the second sub-bonding pad 105 can be welded to the shielding frame 30 to improve the connection force between the shielding frame 30 and the board body 110 .
  • the distance between the end of the second sub-pad 105 in the first welding area 102 away from the device area 101 and the device area 101 (L3 in FIG. 3 ) and the first sub-pad 106 facing the device area 101 is 0.2mm-0.4mm.
  • the distance difference can be 0.2mm, 0.3mm, 0.4mm, etc.
  • the distance difference between the first sub-pad 106 and the device area 101 and the distance between the second sub-pad 105 and the device area 101 is 0.08mm-0.12mm (k value in Figure 3).
  • the distance difference can be 0.08mm, 0.1mm, 0.12mm, etc.
  • the projection of the first sub-bonding pad 106 and the second sub-bonding pad 105 on the surface of the board 110 may be in a regular shape such as a square or a circle, so that the first sub-bonding pad 106 and the second sub-bonding pad 105 can be easily Fabrication of pad 105.
  • the projections of the first sub-bonding pad 106 and the second sub-bonding pad 105 on the surface of the board 110 may also have other irregular shapes, which is not limited in this embodiment.
  • the sides of the first sub-pad 106 and the second sub-pad 105 are The length can be 0.35mm-0.5mm, such as: 0.35mm, 0.4mm, 0.5mm, etc., so that the first sub-pad 106 and the second sub-pad 105 have sufficient area, and then the first sub-pad 106 and the second sub-pad 105 have sufficient area.
  • the welding body 501 between the second sub-bonding pad 105 and the shielding frame 30 has sufficient volume to ensure sufficient connection force between the first sub-bonding pad 106 and the second sub-bonding pad 105 and the shielding frame 30 .
  • This embodiment provides a method for manufacturing a motherboard, which can be used to manufacture the motherboard 100 in the above embodiment.
  • the motherboard manufacturing method provided in this embodiment includes:
  • S101 Provide circuit boards.
  • the circuit board 10 includes a board body 110 , the surface of the board body 110 has a device area 101 , and the device area 101 is an area in the board body 110 for installing electronic devices.
  • the surface of the board 110 also has first welding areas 102 and second welding areas 103 spaced apart along the edge of the device area 101 .
  • the circuit board 10 further includes a first sub-bonding pad 106 and a second sub-bonding pad 105.
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 are spaced apart in the first welding area 102.
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 are both used for soldering to the shield frame.
  • the first sub-bonding pad 106 and the second sub-bonding pad 105 in the first welding area 102 are arranged at intervals along corresponding edges of the device area 101 .
  • the first sub-pads 106 and the second sub-pads 105 are arranged in a staggered manner.
  • the end of the shielding frame facing the board body 110 is farther or closer to the device area 101
  • At least one of the first sub-bonding pad 106 and the second sub-bonding pad 105 is well welded to the shielding frame to avoid signal leakage.
  • the staggered arrangement of the first sub-bonding pads 106 and the second sub-bonding pads 105 can enable welding between the shielding frame and the circuit board 10 when the end of the shielding frame facing the board body 110 is farther or closer to the device area 101 It is relatively uniform, which improves the uniformity of the connection force between the shield frame and the plate body 110 .
  • first sub-bonding pads 106 and the second sub-bonding pads 105 are arranged in a staggered manner, the distance between each first sub-bonding pad 106 and the device area 101 is equal, and the distance between each second sub-bonding pad 105 and the device area 101 is equal. The distance between them is equal. With this arrangement, the first sub-bonding pad 106 and the second sub-bonding pad 105 can be evenly distributed, which facilitates the production of the first sub-bonding pad 106 and the second sub-bonding pad 105 .
  • the motherboard manufacturing method provided in this embodiment also includes:
  • S102 Form solder on the first welding area, and the solder covers the first sub-soldering pad and the second sub-soldering pad and the first welding area between the first sub-soldering pad and the second sub-soldering pad.
  • the solder 50 may include solder paste or the like.
  • a steel mesh (not shown) can be covered on the board body 110 first.
  • the steel mesh has mesh holes corresponding to the first welding area 102, and then solder paste is applied on the steel mesh. At this time, the solder paste will pass through the mesh. Holes are coated onto the first weld area 102 .
  • the solder paste covers the first sub-pad 106 and the second sub-pad 105 in the first soldering area 102 and the surface of the board 110 between the first sub-pad 106 and the second sub-pad 105 .
  • the width of the solder paste in the direction away from the device area 101 can be appropriately increased so that the solder paste can completely cover
  • Figure 16 is a view of the interface between the first sub-pad 106, the second sub-pad 105 and the board body 110 facing the direction of the solder 50 after the solder 50 is applied. Please refer to Figure 16 to ensure that the amount of solder paste is sufficient.
  • the width of the solder paste in the direction away from the surrounding device area 101 can also be appropriately reduced, that is, one end of the first sub-pad 106 facing the device area 101 is exposed to the outside of the solder paste, and/or the second sub-pad 105 is away from the device area 101 One end is exposed to the solder paste to appropriately reduce the amount of solder paste and save costs.
  • the motherboard manufacturing method provided in this embodiment after forming the solder 50 on the first soldering area 102 , also includes:
  • S103 Provide a shielding frame so that the shielding frame is located outside the device area and is in contact with the solder.
  • the shielding frame 30 can be aligned with the solder 50 through a placement device (such as a placement machine), and the shielding frame 30 is in contact with the solder 50 to improve the positional accuracy of the shielding frame 30 and simplify the placement process.
  • a placement device such as a placement machine
  • the method for manufacturing a motherboard further includes: after attaching the shielding frame 30 to the board body 110 :
  • S104 Perform welding to melt the solder and form a welded body connecting the first sub-pad and the shielding frame, and the second sub-pad and the shielding frame.
  • soldering operation can be simplified by placing the board 110 on which the shielding frame 30 is mounted in a reflow furnace for heating and cooling.
  • the process before forming the solder 50 on the first soldering area 102 , the process further includes: providing electronic devices and installing the electronic devices in the device area 101 .
  • the electronic device can be a memory, a power management unit (PMU for short), etc.
  • the motherboard produced by the motherboard manufacturing method provided in this embodiment has a first welding area 102 and a second welding area 103 spaced apart along the edge of the device area 101 on the board body 110 .
  • Settings with intervals have No. One sub-pad 106 and a second sub-pad 105.
  • the solder 50 shown in Figure 15 is applied to the first welding area 102. At this time, the solder 50 will cover the first sub-pad 106 and the second sub-pad 105.
  • the molten solder 50 flows onto the first sub-pad 106 and the second sub-pad 105, and then on A solder body 501 shown in FIG. 18 is formed between the first sub-pad 106 and the shield frame, and between the second sub-pad 105 and the shield frame.
  • a solder body 501 shown in FIG. 18 is formed between the first sub-pad 106 and the shield frame, and between the second sub-pad 105 and the shield frame.
  • the first sub-pad 106 and the second sub-pad 105 are arranged at intervals.
  • the space between the first sub-pad 106 and the second sub-pad 105 and the shielding frame 30 is small, and when the solder 50 melts, , the solder 50 between the first sub-pad 106 and the second sub-pad 105 will flow to the first sub-pad 106 and the second sub-pad 105, and the formed solder body 501 is only located between the first sub-pad 106 and the second sub-pad 105.
  • the thickness of the welding body 501 is increased in this way; thereby avoiding the poor flatness of the end faces of the shielding frame 30 and the first sub-bonding pad 106 and the second sub-bonding pad 105 due to welding,
  • the distance between the partial shielding frame 30 and the first sub-pad 106 and the second sub-pad 105 is relatively large, resulting in insufficient solder 50 , thereby avoiding the formation of false soldering and improving the electromagnetic shielding effect of the shielding frame 30 .
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an integral connection; it can also be It can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two components.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or an integral connection; it can also be It can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two components.

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Abstract

本申请实施例属于终端设备技术领域，具体涉及一种电路板、主板及电子设备。本申请实施例旨在解决屏蔽框与焊盘之间容易形成虚焊的问题。本实施例提供的电路板、主板及电子设备，板体上具有沿器件区边缘间隔设置的第一焊接区和第二焊接区，第一焊接区内间隔的设置有第一子焊盘和第二子焊盘，第一子焊盘和第二子焊盘与屏蔽框之间的空间较小，在焊料熔化时，第一子焊盘和第二子焊盘之间的焊料会流向第一子焊盘和第二子焊盘，增大了第一子焊盘和第二子焊盘与屏蔽框之间的焊接体厚度；进而避免形成虚焊，提高了屏蔽框的电磁屏蔽效果。

Description

电路板、主板及电子设备
本申请要求于2022年07月20日提交国家知识产权局、申请号为202210861499.X、申请名称为“电路板、主板及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及终端设备技术领域，具体涉及一种电路板、主板及电子设备。
背景技术
电子设备(如手机、平板电脑等)一般具有主板，主板包括：电路板、设置在电路板上的电子器件以及罩设在电子器件上的屏蔽框。屏蔽框为金属框，可以实现电磁屏蔽，进而避免信号干扰。电路板上设置有沿电子器件的边缘延伸的焊盘，焊盘与屏蔽框焊接，以实现屏蔽框与电路板之间的固定。
然而，屏蔽框朝向电路板的一端存在尺寸误差，容易导致部分屏蔽框与焊盘之间的焊料较少，而形成虚焊，进而影响屏蔽框的电磁屏蔽效果。
发明内容
本申请实施例提供一种电路板、主板及电子设备，旨在解决屏蔽框与焊盘之间容易形成虚焊的问题。
一方面，本申请实施例提供一种电路板，包括：板体，板体包括芯板，芯板上设置有具有一定图形的电路，电路可以与电子器件连接。板体的表面具有器件区，器件区为板体中用于安装电子器件的区域。电路板还包括屏蔽框，屏蔽框安装于板体的表面上，并且屏蔽框环绕在器件区的外侧，以使得屏蔽框可以围设在电子器件的外侧。板体的表面还具有沿器件区的边缘间隔设置的第一焊接区和第二焊接区。
电路板还包括焊盘，焊盘包括第一子焊盘和第二子焊盘，第一子焊盘和第二子焊盘间隔的设置在第一焊接区内，第一子焊盘和第二子焊盘均与屏蔽框进行焊接，以将屏蔽框固定在电路板上。
在可以包括上述实施例的一些实施例中，第一子焊盘和第二子焊盘在第一焊接区内沿器件区的对应边缘间隔的排布。如此设置，板体沿平行于器件区边缘的方向多处与屏蔽框焊接，可以提高屏蔽框与板体之间连接力的均匀性；同时，也可以减少屏蔽框与板体之间的信号泄露。
在可以包括上述实施例的一些实施例中，第一焊接区内第一子焊盘和第二子焊盘分别器件区之间的距离不等。如此设置，在第一子焊盘和第二子焊盘沿第一焊接区对应边缘的方向排布的同时，还沿着远离器件区的方向排布；在屏蔽框朝向板体一端具有较大的尺寸误差时，仍然能够完成与屏蔽框之间的焊接。另外，在具有较大的焊接误差时，也能够完成第一子焊盘和第二子焊盘与屏蔽框之间的焊接。也就是说，可以降低对屏蔽框的尺寸、以及焊接时屏蔽框位置精度的要求，以降低屏蔽框的制作和安装难度。
在可以包括上述实施例的一些实施例中，第一焊接区内的第一子焊盘较第二子焊盘更远离器件区。如此设置，第一焊接区内，第一子焊盘和第二子焊盘沿远离器件区的方向分布，增大了第一子焊盘和第二子焊盘沿远离器件区方向的分布宽度，进而降低对屏蔽框的尺寸、以及焊接时屏蔽框位置精度的要求，以降低屏蔽框的制作和安装难度。
在可以包括上述实施例的一些实施例中，第一焊接区内第一子焊盘和第二子焊盘均为多个，多个第一子焊盘沿器件区的边缘间隔的设置，相邻第一子焊盘之间设置有一个第二子焊盘。如此设置，第一子焊盘和第二子焊盘交错设置，在屏蔽框尺寸精度或者焊接时位置精度的影响下，屏蔽框朝向板体的一端距离器件区较远或较近时，第一子焊盘和第二子焊盘中至少有一个与屏蔽框焊接良好，以避免发生信号泄露。另外，交错布置的第一子焊盘和第二子焊盘，在屏蔽框朝向板体的一端距离器件区较远或较近时，可以使屏蔽框与板体之间焊接较为均匀，提高了屏蔽框与板体之间连接力的均匀性。
在可以包括上述实施例的一些实施例中，各第一子焊盘到器件区之间的距离相等，各第二子焊盘到器件区之间的距离相等。如此设置，可以使第一子焊盘和第二子焊盘均匀分布，方便了各 子焊盘的制作。
在可以包括上述实施例的一些实施例中，第一焊接区内第二子焊盘背离器件区的一端与器件区之间的距离大于第一子焊盘朝向器件区的一端与器件区之间的距离，以使得沿垂直于焊接区对应的器件区边缘方向，第一子焊盘与第二子焊盘部分重叠。如此设置，可以第一子焊盘和第二子焊盘均与屏蔽框焊接，以提高屏蔽框与板体之间的连接力。
在可以包括上述实施例的一些实施例中，第一焊接区内第二子焊盘背离器件区的一端和器件之间的距离与第一子焊盘朝向器件区的一端和器件区之间的距离差为0.2mm-0.4mm，示例性的，该距离差可以为0.2mm、0.3mm、0.4mm等。如此设置，在第一子焊盘和第二子焊盘均与屏蔽框焊接的基础上，可以保证第一子焊盘和第二子焊盘与屏蔽框之间具有较大体积的焊接体，以进一步提高屏蔽框与板体之间的连接力。
在可以包括上述实施例的一些实施例中，第一焊接区内，第一子焊盘到器件区的距离和第二子焊盘到器件区的距离差为0.08mm-0.12mm。如此设置，在降低对屏蔽框尺寸精度要求、以及焊接时屏蔽框的位置精度要求的同时，可以使第一子焊盘和第二子焊盘均与屏蔽框之间焊接，以避免第一子焊盘和第二子焊盘到器件区之间的距离差过大，导致的第一子焊盘、或者第二子焊盘与屏蔽框焊接，进而提高了屏蔽框与板体之间的连接力。
在可以包括上述实施例的一些实施例中，第一焊接区内第一子焊盘和第二子焊盘之间的距离为0.15mm-0.2mm。如此，可以保证第一子焊盘和第二子焊盘之间具有足够的距离，以在焊接时，有足够量的焊料流入到第一子焊盘和第二子焊盘，进而使第一子焊盘和第二子焊盘与屏蔽框焊接良好。
在可以包括上述实施例的一些实施例中，第一子焊盘和第二子焊盘的宽度大于或等于0.35mm；其中，第一子焊盘和第二子焊盘的宽度的方向与第一焊接区所在的器件区的边缘平行。如此设置，可以保证第一子焊盘和第二子焊盘具有足够的面积，以增大第一子焊盘和第二子焊盘与屏蔽框之间的焊接体体积，提高第一子焊盘和第二子焊盘与屏蔽框之间的连接力。
在可以包括上述实施例的一些实施例中，第一子焊盘和第二子焊盘在板体的表面上的投影呈正方形或圆形。
在可以包括上述实施例的一些实施例中，第二焊接区内也可以设置有第一子焊盘和第二子焊盘，第一子焊盘和第二子焊盘在第二焊接区内间隔的设置，第一子焊盘和第二子焊盘均与屏蔽框焊接，以提高板体与屏蔽框之间的连接力，同时也可以避免板体与屏蔽框之间发生信号泄露。
在可以包括上述实施例的一些实施例中，第一焊接区和第二焊接区沿器件区的边缘间隔的设置，第一焊接区和第二焊接区与器件区的一个边对应；或者，第一焊接区和第二焊接区对应于器件区的不同边。
在可以包括上述实施例的一些实施例中，第一焊接区和第二焊接区可以均为多个，多个第一焊接区沿器件区的边缘间隔的设置，相邻的两个第一焊接区之间设置有一个第二焊接区。如此设置，可以进一步提高板体与屏蔽框之间的连接力，同时也可以进一步避免板体与屏蔽框之间发生信号泄露。
在可以包括上述实施例的一些实施例中，电路板还包括屏蔽框，屏蔽框围设在器件区的外侧，屏蔽框朝向器件区的一端与第一子焊盘和第二子焊盘之间通过焊接形成的焊接体连接。通过屏蔽框可以形成电磁屏蔽，阻止器件区内的电磁信号向器件区外辐射，以避免的电子器件对电子设备中的其他电子器件造成影响；同时也可以阻止外部的电磁信号向器件区内辐射，以避免影响电子器件工作。
在可以包括上述实施例的一些实施例中，电路板还包括屏蔽盖，屏蔽盖罩设在屏蔽框背离板体的一端。屏蔽盖可以实现对屏蔽框背离板体一端的封闭，以使得屏蔽框、屏蔽盖和板体围设成容置电子器件的密闭空间，进而提高了电磁屏蔽效果。
另一方面，本申请实施例还提供一种主板，包括：
如上所述的电路板；
电子器件，电子器件设置在板体上，且位于器件区；
屏蔽框，屏蔽框围设在电子器件外，屏蔽框朝向板体的一端与第一子焊盘和第二子焊盘之间 通过焊接形成的焊接体连接。
另一方面，本申请实施例还提供一种电子设备，包括：如上所述的主板。
再一方面，本申请实施例还提供一种主板的制作方法，包括：
提供电路板；
电路板包括：
板体，板体的表面具有器件区、以及沿器件区边缘间隔设置的第一焊接区和第二焊接区；
焊盘，焊盘包括第一子焊盘和第二子焊盘，第一子焊盘和第二子焊盘间隔的设置在第一焊接区内；
在第一焊接区上形成焊料，焊料覆盖第一子焊盘和第二子焊盘以及第一子焊盘和第二子焊盘之间的第一焊接区；
提供屏蔽框，使屏蔽框围设在器件区的外侧，并且屏蔽框与焊料接触；
进行焊接，以使焊料熔化，并形成连接第一子焊盘和屏蔽框、以及第二子焊盘和屏蔽框的焊接体。
本申请实施例提供的电路板、主板及电子设备，板体上具有沿器件区的边缘间隔设置的第一焊接区和第二焊接区，第一焊接区内间隔的设置有第一子焊盘和第二子焊盘。在进行板体和屏蔽框之间的焊接时，在第一焊接区涂布焊料，此时焊料会覆盖第一子焊盘和第二子焊盘以及第一子焊盘和第二子焊盘之间的板体；在进行加热时，熔化的焊料流淌至第一子焊盘和第二子焊盘，进而在第一子焊盘与屏蔽框之间、以及第二子焊盘与屏蔽框之间均形成焊接体。与整片的焊盘相比，第一子焊盘和第二子焊盘间隔的设置，第一子焊盘和第二子焊盘与屏蔽框之间的空间较小，并且在焊料熔化时，第一子焊盘和第二子焊盘之间的焊料会流向第一子焊盘和第二子焊盘，形成的焊接体仅位于第一子焊盘和屏蔽框之间、以及第二子焊盘和屏蔽框之间，如此增大了焊接体厚度；进而避免了因屏蔽框与子焊盘焊接的端面平面度较差，部分屏蔽框与子焊盘之间的距离较大，部分屏蔽框与子焊盘之间的焊料不足，避免形成虚焊，提高了屏蔽框的电磁屏蔽效果。
附图说明
图1为相关技术中柱板的结构示意图；
图2为相关技术中焊盘的俯视图一；
图3为本申请实施例提供的电路板的俯视图；
图4为本申请实施例提供的电路板结构示意图；
图5为本申请实施例提供的主板中将屏蔽框贴附在板体上的结构示意图；
图6为图5中A处的局部放大图；
图7为本申请实施例提供的主板中将屏蔽框贴附在板体上焊接区的结构示意图；
图8为本申请实施例提供的主板中形成焊接体的结构示意图；
图9为图8中B处的局部放大图；
图10为本申请实施例提供的主板中屏蔽框的结构示意图；
图11为相关技术和本申请实施例中形成的焊接体的对比图；
图12为相关技术中焊盘的俯视图二；
图13为本申请实施例提供的主板的制作方法流程图；
图14为本申请实施例提供的主板的制作方法中电路板的俯视图；
图15为本申请实施例提供的主板的制作方法中形成焊料后的结构示意图；
图16为本申请实施例提供的主板的制作方法中形成焊料后沿子焊盘和板体的交界面向焊料方向的视图；
图17为本申请实施例提供的主板的制作方法中将屏蔽框贴附在焊料上的结构示意图；
图18为本申请实施例提供的主板的制作方法中形成焊接体的结构示意图。
附图标记说明：
10：电路板；
20：电子器件；
30：屏蔽框；
40：屏蔽盖；
50：焊料；
100：主板；
101：器件区；
102：第一焊接区；
103：第二焊接区；
104：焊盘；
105：第二子焊盘；
106：第一子焊盘；
107：缺口；
108：阻焊层；
109：焊接区；
110：板体；
301：固定板；
302：焊接端面；
501：焊接体。
具体实施方式
随着终端设备技术的发展，手机、平板电脑等电子设备已经得到广泛的应用。如图1所示，电子设备一般具有主板100，主板100包括电路板10以及设置在电路板10上的电子器件20，电子器件20可以为存储器，以通过存储器实现数据存储。由于存储器在工作时会产生电磁信号，相同的电子设备中的其他电子器件工作时也会产生电磁信号，为了避免电磁信号影响存储器工作，同时也为了避免存储器产生的电磁信号影响其他的电子器件工作，一般在存储器外罩设屏蔽框30，屏蔽框30为金属框，以通过屏蔽框30实现电磁屏蔽。
具体的，如图2所示，电路板10安装存储器的表面具有沿存储器的边缘延伸的焊盘104，焊盘104为整片金属片。安装时，在焊盘104上涂布锡膏，之后将图1所示的屏蔽框30罩设在存储器上，并且屏蔽框30与锡膏接触；之后通过回流焊的工艺使锡膏熔化，以形成连接焊盘104和屏蔽框30的焊接体，进而实现屏蔽框30与电路板10之间的焊接。
然而，屏蔽框30的尺寸较大，在制作或者运输的过程中，容易造成屏蔽框30变形，进而导致屏蔽框30用于与焊盘104焊接的端面平面度较差(即焊盘104的端面共面度难以控制)，部分端面与焊盘104之间的距离较大。在进行焊接时，该端面与焊盘104之间距离大的位置的锡膏量不足，使得形成的焊接体难以连接屏蔽框30和焊盘104，而形成虚焊；容易导致电磁信号泄露，进而影响屏蔽框30的电磁屏蔽效果。
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例一
本申请实施例提供一种电子设备，示例性的，电子设备可以包括手机、平板电脑等；本实施例对电子设备不作限制。继续参照图1，该电子设备包括主板100，通过主板100可以实现控制、数据存储等功能。
主板100包括电路板10以及设置在电路板10上的电子器件20，电子器件20与电路板10上的电路连接。可以理解的是，电子器件20可以包括：存储器、电源管理单元(power management unit简称PMU)等，其中，存储器可以实现数据的存储，电源管理单元可以实现对电子设备中电池的检测和管理等功能。
电路板10包括板体110，板体110包括芯板，芯板上设置有具有一定图形的电路，电路可以与电子器件20连接。
请参照图3，板体110的表面具有器件区101，器件区101为板体110中用于安装电子器件 20(如图1所示)的区域。电路板10还包括屏蔽框30(如图1所示)，屏蔽框30安装于板体110的表面上，并且屏蔽框30环绕在器件区101的外侧，以使得屏蔽框30可以围设在电子器件20的外侧，进而形成电磁屏蔽，阻止器件区101内的电磁信号向器件区101外辐射，以避免的电子器件20对电子设备中的其他电子器件造成影响；同时也可以阻止外部的电磁信号向器件区101内辐射，以避免影响电子器件20工作。
可以理解的是，屏蔽框30为金属框，以在屏蔽框30安装在板体110上后，屏蔽框30围设在器件区101的外侧，也就是说屏蔽框30围设在电子器件20的外侧，以起到电磁屏蔽的作用。示例性的，器件区101可以呈矩形，相应的，屏蔽框30呈矩形环状，并围设在器件区101外侧，即屏蔽框30为矩形框。当然，器件区101也可以呈圆形，相应的，屏蔽框30呈圆环状，并围设在器件区101间区外侧，即屏蔽框30为圆形框。本实施例中，器件区101还可以呈其他的不归则形状，相应的，屏蔽框30呈不规则形状，只要保证屏蔽框30围设在器件区101外，以使得屏蔽框30围设在电子器件20外即可。
请参照图4，在上述实现方式中，电路板10还可以包括屏蔽盖40，屏蔽盖40罩设在屏蔽框30背离板体110的一端，屏蔽盖40可以实现对屏蔽框30背离板体110一端的封闭，以使得屏蔽框30、屏蔽盖40和板体110围设成容置电子器件20的密闭空间，进而提高了电磁屏蔽效果。可以理解的是，屏蔽盖40为金属盖，以阻止电磁信号由屏蔽框30背离板体110的一端进入密闭空间，同时也可以阻止密闭空间内的电磁信号经屏蔽框30背离板体110的一端向外传播。示例性的，屏蔽盖40可以通过焊接或者卡接的方式与屏蔽框30连接，当然屏蔽盖40也可以通过铸造或者冲压的方式与屏蔽框30形成一体结构，以简化屏蔽框30和屏蔽盖40的制作难度。
继续参照图3，本实施例中，板体110的表面还具有沿器件区101的边缘(如图3中的方向a)间隔设置的第一焊接区102和第二焊接区103，第一焊接区102和第二焊接区103用于进行屏蔽框30和板体110之间的焊接，以实现屏蔽框30与板体110之间的固定。
上述实现方式中，电路板10还包括焊盘104，焊盘104包括第一子焊盘106和第二子焊盘105，第一子焊盘106和第二子焊盘105间隔的设置在第一焊接区102内，第一子焊盘106和第二子焊盘105均与屏蔽框30进行焊接，以将屏蔽框30固定在电路板10上。在一些实施例中，第一子焊盘106和第二子焊盘105可以与接地电路连接，以实现屏蔽框30的接地，以进一步提高电磁屏蔽效果。
继续参照图3，第一子焊盘106和第二子焊盘105可以在第一焊接区102内沿器件区101的对应边缘间隔的排布；可以理解的是，器件区101对应的边缘为靠近该第一焊接区102的边缘。示例性的，在器件区101呈矩形的实现方式中，第一子焊盘106和第二子焊盘105沿平行于矩形一个边的方向间隔的排布，该边为矩形中与第一焊接区102靠近的边。在器件区101呈圆形的实现方式中，第一子焊盘106和第二子焊盘105在器件区101的同心圆上间隔的排布；当然在器件区101呈不规则形状的实现方式中，第一子焊盘106和第二子焊盘105可以沿着器件区101对应的边缘间隔排布，并且第一子焊盘106和第二子焊盘105与器件区101的边缘距离可以相等也可以不等，该距离为第一子焊盘106和第二子焊盘105朝向器件区101的边缘与器件区101的对应边缘之间的距离。通过上述设置，板体110沿平行于器件区101边缘的方向多处与屏蔽框30焊接，可以提高屏蔽框30与板体110之间连接力的均匀性；同时，也可以减少屏蔽框30与板体110之间的信号泄露。
可以理解的是，第一子焊盘106和第二子焊盘105可以与板体110上的电路同时形成，例如，可以先在芯板上形成金属层，之后通过蚀刻的方式去除部分金属层，以形成具有一定图形的电路以及第一子焊盘106和第二子焊盘105；或者，通过电镀的方式直接在芯板上形成具有一定图形的电路以及第一子焊盘106和第二子焊盘105。当然本实施例中，也可以在板体110上的电路形成之后，在板体110上安装第一子焊盘106和第二子焊盘105。
继续参照图3，在上述实现方式中，第二焊接区103内也可以设置有第一子焊盘106和第二子焊盘105，第一子焊盘106和第二子焊盘105在第二焊接区103内间隔的设置，第一子焊盘106和第二子焊盘105均与图1所示的屏蔽框30焊接，以提高板体110与屏蔽框30之间的连接力，同时也可以避免板体110与屏蔽框30之间发生信号泄露。相应的，第一子焊盘106和第二子焊盘 105在第二焊接区103内的排布方式与第一子焊盘106和第二子焊盘105在第一焊接区102内的排布方式大致相同，在此不再赘述。
可以理解的是，第一焊接区102和第二焊接区103沿器件区101的边缘间隔的设置，第一焊接区102和第二焊接区103可以与器件区101的一个边对应；当然，第一焊接区102和第二焊接区103也可以对应于器件区101的不同边，本实施例对此不作限制。
在一些实施例中，第一焊接区102和第二焊接区103可以均为多个，多个第一焊接区102沿器件区101的边缘间隔的设置，相邻的两个第一焊接区102之间设置有一个第二焊接区103。如此设置，可以进一步提高板体110与屏蔽框30之间的连接力，同时也可以进一步避免板体110与屏蔽框30之间发生信号泄露。
继续参照图5和图6，其中图6为图5中A处的局部放大图，在进行焊接时，在第一焊接区102上涂布焊料50(如锡膏等)，焊料50覆盖第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110(如图7所示，图7为电路板10中第一焊接区102对应的结构图)。之后将屏蔽框30贴附在板体110上，并使屏蔽框30朝向板体110的一端与焊料50接触。如图8和图9所示，其中图9为图8中B处的局部放大图，之后进行加热(如进行回流焊等工艺)，使焊料50熔化，第一子焊盘106和第二子焊盘105之间的焊料50熔化后流淌至第一子焊盘106和第二子焊盘105；之后进行冷却处理，进而形成连接子第一子焊盘106和屏蔽框30、以及第二子焊盘105和屏蔽框30的焊接体501，也就是说通过焊接体501将屏蔽框30固定在板体110上。
继续参照图6，可以理解的是，板体110的表面上覆盖有阻焊层108，部分阻焊层108可以填充在第一子焊盘106和第二子焊盘105之间。在进行焊接时，阻焊层108可以促进熔化后的焊料50流向第一子焊盘106和第二子焊盘105，以便于形成连接第一子焊盘106和屏蔽框30、以及第二子焊盘105和屏蔽框30的焊接体501(如图9所示)。示例性的，阻焊层108可以为绿油层，绿油层的材质可以包括：丙烯酸低聚物、丙烯酸单体等。
本实施例中，第一焊接区102内第一子焊盘106和第二子焊盘105之间的距离(如图3中的m值)为0.15mm-0.2mm，示例性的，第一子焊盘106和第二子焊盘105之间的距离可以为0.15mm、0.18mm、0.2mm等。如此，可以保证第一子焊盘106和第二子焊盘105之间具有足够的距离，以在焊接时，有足够量的焊料50流入到第一子焊盘106和第二子焊盘105，以增大图9所示焊接体501的体积，进而使第一子焊盘106和第二子焊盘105与屏蔽框30焊接良好。
第一子焊盘106和第二子焊盘105的宽度(如图3中的n值)大于或等于0.35mm；其中，第一子焊盘106和第二子焊盘105的宽度的方向与第一焊接区102所在的器件区101的边缘平行。示例性的，第一子焊盘106和第二子焊盘105的宽度可以为0.35mm、0.4mm、0.5mm等。如此设置，可以保证第一子焊盘106和第二子焊盘105具有足够的面积，以增大第一子焊盘106和第二子焊盘105与屏蔽框30之间的焊接体501体积，提高第一子焊盘106和第二子焊盘105与屏蔽框30之间的连接力。
可以理解的是，屏蔽框30可以由多个屏蔽板(未示出)依次连接形成，多个屏蔽板围设成柱状的屏蔽通道，该屏蔽通道的中心线与板体110垂直，并且器件区101位于屏蔽通道在板体110表面上的投影内。以屏蔽框30为矩形框为例，相应的屏蔽框30包括与板体110垂直的第一屏蔽板、第二屏蔽板、第三屏蔽板以及第四屏蔽板，第一屏蔽板沿平行于板体110的一端与第二屏蔽板的一端连接，第二屏蔽板的另一端与第三屏蔽板的一端连接，第三屏蔽板的另一端与第四屏蔽板的一端连接，第四屏蔽板的另一端与第一屏蔽板的另一端连接，进而形成矩形的框体。
如图10所示，屏蔽框30朝向如图1所示的板体110的一端具有固定部，固定部可以包括由屏蔽框30向板体110延伸的固定板301，固定板301相对于板体110倾斜设置(例如固定板301与板体110之间的夹角A为30°、45°、60°等)，以使得固定板301朝向板体110的一端较背离板体110的一端更靠近器件区101。固定板301面向板体110的一端具有与板体110平行的焊接端面302，焊接端面302与图3所示的第一子焊盘106和第二子焊盘105焊接，以将屏蔽框30焊接的在板体110上。
可以理解的是，屏蔽框30朝向板体110的一端具有间隔设置的多个固定板301，第一焊接区 102和第二焊接区103与不同的固定板301焊接。在其他实现方式中，固定板301在屏蔽框30朝向板体110的一端连续设置，也就是说固定板301环绕器件区101设置，此时第一焊接区102和第二焊接区103内的第一子焊盘106和第二子焊盘105均与焊接端面302焊接。
上述实现方式中，固定板301可以与屏蔽框30为一体结构，通过铸造或者冲压等方式形成的一体结构，简化了屏蔽框30的制造难度。当然，固定板301也可以通过焊接、卡接等方式与屏蔽框30连接，本实施例对此不做限制。
请参照图3，本实施例提供的电路板10，板体110上具有沿器件区101的边缘间隔设置的第一焊接区102和第二焊接区103，第一焊接区102内间隔的设置有第一子焊盘106和第二子焊盘105。在进行板体110和屏蔽框30之间的焊接时，在第一焊接区102涂布焊料50(如图7所示)，此时焊料50会覆盖第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110；在进行加热时，熔化的焊料50流淌至第一子焊盘106和第二子焊盘105，进而在第一子焊盘106与屏蔽框30之间、以及第二子焊盘105与屏蔽框30之间均形成焊接体501(如图9所示)。与整片的焊盘104(如图2所示)相比，如图11中左侧焊接区109所示，由于整片焊盘104在焊料50熔化后填充在整片焊盘104和屏蔽框30之间，焊盘104和屏蔽框30之间的空间较大，容易造成焊料50不足；如图11中右侧第一焊接区102所示，而本实施例中，第一子焊盘106和第二子焊盘105间隔的设置，第一子焊盘106和第二子焊盘105与屏蔽框30之间的空间较小，并且在焊料50熔化时，第一子焊盘106和第二子焊盘105之间的焊料50会流向第一子焊盘106和第二子焊盘105，形成的焊接体501仅位于第一子焊盘106和屏蔽框30之间、以及第二子焊盘105和屏蔽框30之间，如此增大了焊接体501厚度；进而避免了因屏蔽框30与子焊盘104焊接的端面平面度较差，部分屏蔽框30与子焊盘104之间的距离较大，部分屏蔽框30与子焊盘104之间的焊料50不足，避免形成虚焊，提高了屏蔽框30的电磁屏蔽效果。
如图12所示，相关技术中，焊接区内的焊盘104为整片焊盘，在焊盘104的一侧设置缺口107，在进行焊接时，焊料50涂布在焊盘104以及缺口107对应的板体110上；在进行加热时，缺口107对应的焊料熔化后会流入到焊盘104和屏蔽框30之间，焊后在一定程度上可以增大焊盘104和屏蔽框30之间的焊接体体积。然而，缺口107的大小限制了焊接体体积的增大程度。而本实施例中，如图11中右侧第一焊接区102所示，图3所示的第一子焊盘106和第二子焊盘105间隔的设置在第一焊接区102内，第一子焊盘106和第二子焊盘105的表面积较小，在进行焊接时，焊料50涂布在第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110上，在进行加热时第一子焊盘106和第二子焊盘105周围的焊料50均向第一子焊盘106和第二子焊盘105流动，使得第一子焊盘106和第二子焊盘105与屏蔽框30之间的焊接体501体积明显增大，以避免发生虚焊。
请参照图3，本实施例提供的电路板10，第一焊接区102内第一子焊盘106和第二子焊盘105分别器件区101之间的距离不等，即第二子焊盘105到器件区101的距离为L1，第一子焊盘106到器件区101的距离为L2，L1不等于L2。如此设置，在第一子焊盘106和第二子焊盘105沿第一焊接区102对应边缘的方向排布的同时，还沿着远离器件区101的方向排布；在图1所示屏蔽框30朝向板体110一端具有较大的尺寸误差时(例如屏蔽框30朝向板体110的一端距离器件区101较近或较远时)，仍然能够完成与屏蔽框30之间的焊接。另外，在具有较大的焊接误差时(例如焊接时屏蔽框30与器件区101之间的位置偏差较大时)，也能够完成第一子焊盘106和第二子焊盘105与屏蔽框30之间的焊接。也就是说，可以降低对屏蔽框30的尺寸、以及焊接时屏蔽框30位置精度的要求，以降低屏蔽框30的制作和安装难度。
继续参照图3，在上述实现方式中，第一焊接区102内的第一子焊盘106较第二子焊盘105更远离器件区101，也就是说，第一子焊盘106与器件区101之间的距离L2大于第二子焊盘105与器件区101之间的距离L1。如此设置，第一焊接区102内，第一子焊盘106和第二子焊盘105沿远离器件区101的方向分布，增大了第一子焊盘106和第二子焊盘105沿远离器件区101方向的分布宽度，进而降低对屏蔽框30的尺寸、以及焊接时屏蔽框30位置精度的要求，以降低屏蔽框30的制作和安装难度。
继续参照图3，在一些实现方式中，第一焊接区102内第一子焊盘106和第二子焊盘105均 为多个，多个第一子焊盘106沿器件区101的边缘间隔的设置，相邻第一子焊盘106之间设置有一个第二子焊盘105。如此设置，第一子焊盘106和第二子焊盘105交错设置，在屏蔽框30尺寸精度或者焊接时位置精度的影响下，屏蔽框30朝向板体110的一端距离器件区101较远或较近时，第一子焊盘106和第二子焊盘105中至少有一个与屏蔽框30焊接良好，以避免发生信号泄露。另外，交错布置的第一子焊盘106和第二子焊盘105，在屏蔽框30朝向板体110的一端距离器件区101较远或较近时，可以使屏蔽框30与板体110之间焊接较为均匀，提高了屏蔽框30与板体110之间连接力的均匀性。
在第一子焊盘106和第二子焊盘105交错设置的实现方式中，各第一子焊盘106到器件区101之间的距离相等，各第二子焊盘105到器件区101之间的距离相等。如此设置，可以使第一子焊盘106和第二子焊盘105均匀分布，方便了各子焊盘的制作。
进一步地，第一焊接区102内第二子焊盘105背离器件区101的一端与器件区101之间的距离(图3中的L3)大于第一子焊盘106朝向器件区101的一端与器件区101之间的距离(图3中的L2)，以使得沿垂直于第一焊接区102对应的器件区101边缘方向，第一子焊盘106与第二子焊盘105部分重叠。如此设置，可以使第一子焊盘106和第二子焊盘105均与屏蔽框30焊接，以提高屏蔽框30与板体110之间的连接力。
在上述实现方式中，第一焊接区102内第二子焊盘105背离器件区101的一端和器件区101之间的距离(图3中的L3)与第一子焊盘106朝向器件区101的一端和器件区101之间的距离(图3中的L2)差为0.2mm-0.4mm，示例性的，该距离差可以为0.2mm、0.3mm、0.4mm等。如此设置，在第一子焊盘106和第二子焊盘105均与屏蔽框30焊接的基础上，可以保证第一子焊盘106和第二子焊盘105与屏蔽框30之间具有较大体积的焊接体501(如图9所示)，以进一步提高屏蔽框30与板体110之间的连接力。
如图3所示，第一子焊盘106到器件区101的距离和第二子焊盘105到器件区101的距离差为0.08mm-0.12mm(图3中k值)，示例性的，该距离差可以为0.08mm、0.1mm、0.12mm等。如此设置，在降低对屏蔽框30尺寸精度要求、以及焊接时屏蔽框30的位置精度要求的同时，可以使第一子焊盘106和第二子焊盘105均与屏蔽框30之间焊接，以避免该距离差过大，导致的第一子焊盘106、或者第二子焊盘105与屏蔽框30焊接，进而提高了屏蔽框30与板体110之间的连接力。
本实施例中，第一子焊盘106和第二子焊盘105在板体110的表面上的投影可以呈正方形、或圆形等规则形状，以便于第一子焊盘106和第二子焊盘105的制作。当然第一子焊盘106和第二子焊盘105在板体110的表面上的投影也可以呈其他的不规则形状，本实施例对此不做限制。
可以理解的是，在第一子焊盘106和第二子焊盘105在板体110的表面上的投影呈正方形的实现方式中，第一子焊盘106和第二子焊盘105的边长可以为0.35mm-0.5mm，例如：0.35mm、0.4mm、0.5mm等，以使得第一子焊盘106和第二子焊盘105具有足够的面积，进而使第一子焊盘106和第二子焊盘105与屏蔽框30之间的焊接体501具有足够的体积，以保证第一子焊盘106和第二子焊盘105与屏蔽框30之间具有足够的连接力。
实施例二
本实施例提供一种主板的制作方法，可以用于制作上述实施例中的主板100。
请参照图13，本实施例提供的主板制作方法，包括：
S101：提供电路板。
一些实施例中，如图14所示，其中，电路板10包括板体110，板体110的表面具有器件区101，器件区101为板体110中用于安装电子器件的区域。板体110的表面还具有沿器件区101的边缘间隔设置的第一焊接区102和第二焊接区103。电路板10还包括第一子焊盘106和第二子焊盘105，第一子焊盘106和第二子焊盘105间隔的设置在第一焊接区102内。第一子焊盘106和第二子焊盘105均用于与屏蔽框焊接。
继续参照图14，上述板体110中，第一焊接区102内的第一子焊盘106和第二子焊盘105沿器件区101对应的边缘间隔的设置。第一子焊盘106和第二子焊盘105可以均为多个，相邻第一 子焊盘106之间设置有一个第二子焊盘105，第一子焊盘106与器件区101之间的距离大于第二子焊盘105与器件区101之间的距离。如此设置，第一子焊盘106和第二子焊盘105交错设置，在屏蔽框尺寸精度或者焊接时位置精度的影响下，屏蔽框朝向板体110的一端距离器件区101较远或较近时，第一子焊盘106和第二子焊盘105中至少有一个与屏蔽框焊接良好，以避免发生信号泄露。另外，交错布置的第一子焊盘106和第二子焊盘105，在屏蔽框朝向板体110的一端距离器件区101较远或较近时，可以使屏蔽框与电路板10之间焊接较为均匀，提高了屏蔽框与板体110之间连接力的均匀性。
在第一子焊盘106和第二子焊盘105交错设置的实现方式中，各第一子焊盘106到器件区101之间的距离相等，各第二子焊盘105到器件区101之间的距离相等。如此设置，可以使第一子焊盘106和第二子焊盘105均匀分布，方便了第一子焊盘106和第二子焊盘105的制作。
继续参照图13，本实施例提供的主板制作方法还包括：
S102：在第一焊接区上形成焊料，焊料覆盖第一子焊盘和第二子焊盘以及第一子焊盘和第二子焊盘之间的第一焊接区。
如图15所示，示例性的，焊料50可以包括锡膏等。相应的，可以先在板体110上罩设钢网(未示出)，钢网具有与第一焊接区102对应的网孔，之后在钢网上涂布锡膏，此时锡膏会经网孔涂布到第一焊接区102上。锡膏覆盖第一焊接区102内的第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110表面。
在第一焊接区102内的第一子焊盘106和第二子焊盘105交错布置的实现方式中，可以适当增大锡膏沿远离器件区101方向的宽度，以使得锡膏可以完全覆盖第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110。图16为涂布焊料50后沿第一子焊盘106、第二子焊盘105和板体110的交界面向焊料50方向的视图，请参照图16，在保证锡膏量充足的情况下，也可以适当减小锡膏沿远离环绕器件区101方向的宽度，即第一子焊盘106朝向器件区101的一端暴露于锡膏外，和/或，第二子焊盘105背离器件区101的一端暴露于锡膏外，以适当减少锡膏的用量，节约成本。
继续参照图13，本实施提供的主板的制作方法，在第一焊接区102上形成焊料50之后，还包括：
S103：提供屏蔽框，使屏蔽框围设在器件区的外侧，并且屏蔽框与焊料接触。
如图17所示，合理的控制屏蔽框30与板体110之间的距离可以保证屏蔽框30与焊料50接触，并且不会将焊料50挤出至屏蔽框30的外侧。
可以理解的是，可以通过贴片设备(如贴片机)使屏蔽框30对准焊料50，并且屏蔽框30与焊料50接触，以提高屏蔽框30的位置精度，同时简化贴装过程。
继续参照图13，本实施例提供的主板的制作方法，在将屏蔽框30贴装在板体110上之后还包括：
S104：进行焊接，以使焊料熔化，并形成连接第一子焊盘和屏蔽框、以及第二子焊盘和屏蔽框的焊接体。
请参照图18，可以理解的是，在焊接的过程中，先进行加热，以使焊料50熔化，第一子焊盘106和第二子焊盘105之间的焊料50会流向第一子焊盘106和第二子焊盘105(即爬锡)。之后进行冷却，以使第一子焊盘106和屏蔽框30之间、以及第二子焊盘105和屏蔽框30之间的焊料50凝固，进而形成连接子第一子焊盘106和屏蔽框30、以及第二子焊盘105和屏蔽框30的焊接体501。
示例性的，可以通过将贴装有屏蔽框30的板体110放置在回流炉中，以进行加热和冷却，进而简化焊接操作。
本实施例中，在第一焊接区102上形成焊料50之前还包括：提供电子器件，并将电子器件安装在器件区101内。其中，电子器件可以为存储器、电源管理单元(power management unit简称PMU)等。
继续参照图14，本实施例提供的主板的制作方法制作的主板，板体110上具有沿器件区101的边缘间隔设置的第一焊接区102和第二焊接区103，第一焊接区102内设置有间隔的设置有第 一子焊盘106和第二子焊盘105。在进行板体110和屏蔽框之间的焊接时，在第一焊接区102涂布如图15所示的焊料50，此时焊料50会覆盖第一子焊盘106和第二子焊盘105以及第一子焊盘106和第二子焊盘105之间的板体110；在进行加热时，熔化的焊料50流淌至第一子焊盘106和第二子焊盘105上上，进而在第一子焊盘106和屏蔽框之间、以及第二子焊盘105和屏蔽框之间形成图18所示的焊接体501。与整片的焊盘相比，由于整片焊盘在焊料熔化后填充在整片焊盘和屏蔽框之间，焊盘和屏蔽框之间的空间较大，容易造成焊料不足；而本实施例中，第一子焊盘106和第二子焊盘105间隔的设置，第一子焊盘106和第二子焊盘105与屏蔽框30之间的空间较小，并且在焊料50熔化时，第一子焊盘106和第二子焊盘105之间的焊料50会流向第一子焊盘106和第二子焊盘105，形成的焊接体501仅位于第一子焊盘106和第二子焊盘105与屏蔽框30之间，如此增大了焊接体501厚度；进而避免了因屏蔽框30与第一子焊盘106和第二子焊盘105焊接的端面平面度较差，部分屏蔽框30与第一子焊盘106和第二子焊盘105之间的距离较大，导致的焊料50不足，避免形成虚焊，提高了屏蔽框30的电磁屏蔽效果。
需要说明的是，本申请实施例的描述中，除非另有明确的规定和限定，术语中“相连”、“连接”应做广义理解，例如，可以是固定连接，或一体地连接；也可以是机械连接，也可以是电连接；可以是直接的连接，也可以是通过中间媒介间接的连接，也可以是两个构件内部的连通。对于本领域技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其进行限制；尽管参照前述各实施例对本申请进行了详细说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中的部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (14)

  1. 一种电路板，其特征在于，包括：
    板体，所述板体的表面具有器件区、以及沿所述器件区的边缘间隔设置的第一焊接区和第二焊接区；
    焊盘，所述焊盘包括第一子焊盘和第二子焊盘，所述第一子焊盘和所述第二子焊盘间隔的设置在所述第一焊接区内；所述第一子焊盘和所述第二子焊盘均用于与屏蔽框焊接。
  2. 根据权利要求1所述的电路板，其特征在于，所述第一子焊盘和所述第二子焊盘在所述第一焊接区内沿所述器件区的对应边缘间隔的设置。
  3. 根据权利要求2所述的电路板，其特征在于，所述第一子焊盘和所述第二子焊盘分别与所述器件区之间的距离不等。
  4. 根据权利要求3所述的电路板，其特征在于，所述第一焊接区内的所述第一子焊盘为多个，多个所述第一子焊盘沿所述器件区的对应边缘间隔的设置，相邻的所述第一子焊盘之间设置有一个所述第二子焊盘。
  5. 根据权利要求4所述的电路板，其特征在于，各所述第一子焊盘到所述器件区的距离相等，各所述第二子焊盘到所述器件区的距离相等。
  6. 根据权利要求5所述的电路板，其特征在于，所述第二子焊盘背离所述器件区的一端与所述器件区之间的距离大于所述第一子焊盘朝向所述器件区的一端与所述器件区之间的距离。
  7. 根据权利要求6所述的电路板，其特征在于，所述第一子焊盘到所述器件区的距离和所述第二子焊盘到所述器件区的距离差为0.08mm-0.12mm。
  8. 根据权利要求1-7任一项所述的电路板，其特征在于，所述第一子焊盘和所述第二子焊盘之间的距离为0.15mm-0.2mm。
  9. 根据权利要求1-8任一项所述的电路板，其特征在于，所述第一子焊盘和所述第二子焊盘的宽度大于或等于0.35mm；其中，所述第一子焊盘和所述第二子焊盘的宽度的方向与所述第一焊接区所在的所述器件区的边缘平行。
  10. 根据权利要求1-9任一项所述的电路板，其特征在于，所述第一子焊盘和所述第二子焊盘在所述板体的所述表面上的投影呈正方形或圆形。
  11. 根据权利要求1-10任一项所述的电路板，其特征在于，所述电路板还包括屏蔽框，所述屏蔽框围设在所述器件区的外侧，所述屏蔽框朝向所述器件区的一端与所述第一子焊盘和所述第二子焊盘通过焊接形成的焊接体连接。
  12. 根据权利要求11所述的电路板，其特征在于，所述电路板还包括屏蔽盖，所述屏蔽盖罩设在所述屏蔽框背离所述板体的一端。
  13. 一种主板，其特征在于，包括：
    权利要求1-12任一项所述的电路板；
    电子器件，所述电子器件设置在所述板体上，且位于所述器件区；
    屏蔽框，所述屏蔽框围设在所述电子器件外，所述屏蔽框朝向所述板体的一端与所述第一子焊盘和所述第二子焊盘通过焊接形成的焊接体连接。
  14. 一种电子设备，其特征在于，包括：权利要求13所述的主板。
PCT/CN2023/107472 2022-07-20 2023-07-14 电路板、主板及电子设备 WO2024017163A1 (zh)

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JP2013235961A (ja) * 2012-05-09 2013-11-21 Sharp Corp 電子部品モジュールおよびその製造方法
JP2015192076A (ja) * 2014-03-28 2015-11-02 シャープ株式会社 回路基板および電子機器
CN216253738U (zh) * 2021-08-20 2022-04-08 深圳市大疆创新科技有限公司 一种电子线路板中屏蔽框的焊盘和可移动平台
CN115348720A (zh) * 2022-07-20 2022-11-15 华为技术有限公司 电路板、主板及电子设备

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JP2013235961A (ja) * 2012-05-09 2013-11-21 Sharp Corp 電子部品モジュールおよびその製造方法
JP2015192076A (ja) * 2014-03-28 2015-11-02 シャープ株式会社 回路基板および電子機器
CN216253738U (zh) * 2021-08-20 2022-04-08 深圳市大疆创新科技有限公司 一种电子线路板中屏蔽框的焊盘和可移动平台
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