JP4746990B2 - 電子回路基板 - Google Patents
電子回路基板 Download PDFInfo
- Publication number
- JP4746990B2 JP4746990B2 JP2006002275A JP2006002275A JP4746990B2 JP 4746990 B2 JP4746990 B2 JP 4746990B2 JP 2006002275 A JP2006002275 A JP 2006002275A JP 2006002275 A JP2006002275 A JP 2006002275A JP 4746990 B2 JP4746990 B2 JP 4746990B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- outflow prevention
- hole
- electronic component
- prevention layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (2)
- 電子部品が半田付けされる位置に設けられるスルーホールと、前記電子部品が半田付けされる面の裏面において前記スルーホールの周囲に設けられる枠状の半田流出阻止層とを備える共に、前記枠状の半田流出阻止層に少なくとも1箇所の切れ目部を形成したことを特徴とする電子回路基板。
- 電子部品が半田付けされる位置に設けられるスルーホールと、前記電子部品が半田付けされる面の裏面に半田付けされる放熱板と、前記放熱板において前記スルーホールと対峙する部位の周囲に設けられる枠状の半田流出阻止層とを備え、前記枠状の半田流出阻止層に少なくとも1箇所の切れ目部を形成したことを特徴とする電子回路基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006002275A JP4746990B2 (ja) | 2006-01-10 | 2006-01-10 | 電子回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006002275A JP4746990B2 (ja) | 2006-01-10 | 2006-01-10 | 電子回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007184455A JP2007184455A (ja) | 2007-07-19 |
JP4746990B2 true JP4746990B2 (ja) | 2011-08-10 |
Family
ID=38340272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006002275A Active JP4746990B2 (ja) | 2006-01-10 | 2006-01-10 | 電子回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4746990B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015056546A (ja) * | 2013-09-12 | 2015-03-23 | アルプス電気株式会社 | 電子回路モジュール |
CN108513433A (zh) * | 2018-04-24 | 2018-09-07 | 苏州维信电子有限公司 | 一种隔锡的柔性线路板pad及其制造方法 |
JP7455078B2 (ja) * | 2021-02-02 | 2024-03-25 | 株式会社日立産機システム | プリント配線板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441102B2 (ja) * | 1975-03-04 | 1979-12-06 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318579A (ja) * | 2002-04-24 | 2003-11-07 | Toyoda Mach Works Ltd | 放熱板付きfetの放熱方法 |
-
2006
- 2006-01-10 JP JP2006002275A patent/JP4746990B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5441102B2 (ja) * | 1975-03-04 | 1979-12-06 |
Also Published As
Publication number | Publication date |
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JP2007184455A (ja) | 2007-07-19 |
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