WO2024016510A1 - 一种控制器壳体、中央控制器和汽车 - Google Patents

一种控制器壳体、中央控制器和汽车 Download PDF

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Publication number
WO2024016510A1
WO2024016510A1 PCT/CN2022/128803 CN2022128803W WO2024016510A1 WO 2024016510 A1 WO2024016510 A1 WO 2024016510A1 CN 2022128803 W CN2022128803 W CN 2022128803W WO 2024016510 A1 WO2024016510 A1 WO 2024016510A1
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WO
WIPO (PCT)
Prior art keywords
middle frame
circuit board
electromagnetic shielding
central controller
cover
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Application number
PCT/CN2022/128803
Other languages
English (en)
French (fr)
Inventor
郭文韬
陈晴
李月清
黄其光
冯飞
Original Assignee
岚图汽车科技有限公司
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Filing date
Publication date
Application filed by 岚图汽车科技有限公司 filed Critical 岚图汽车科技有限公司
Publication of WO2024016510A1 publication Critical patent/WO2024016510A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0043—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • the present disclosure belongs to the field of automobile integrated control technology, and in particular relates to a controller housing, a central controller and an automobile.
  • the central controller is the core component of electric vehicles. It usually includes motor controllers, vehicle controllers, vehicle management systems, vehicle chargers and other control components. When these control components are integrated into an integrated central controller circuit board, the area It is larger and cannot meet the installation and modal requirements.
  • the present disclosure aims to solve, at least to a certain extent, the technical problem that the integrated central controller circuit board is large in area and cannot meet installation and modal requirements.
  • the present disclosure provides a controller housing, a central controller and an automobile.
  • a central controller housing including: a middle frame; a first cover buckled on a first side of the middle frame, so that the first cover and the A first cavity is formed between the middle frames; and a second cover is buckled on the second side of the middle frame to form a second cavity between the second cover and the middle frame.
  • a central controller including the above-mentioned central controller housing and a first circuit board and a second circuit board disposed in the central controller housing.
  • an automobile including the above-mentioned central controller.
  • Figure 1 shows a schematic structural diagram of a central controller according to some embodiments of the present disclosure
  • Figure 2 shows an exploded view of the central controller in Figure 1;
  • Figure 3 shows a schematic structural diagram of the middle frame of the central controller housing in Figure 2;
  • Figure 4 shows a schematic structural diagram of the middle frame in Figure 3 from another angle
  • Figure 5 shows a schematic structural view of the first cover of the central controller housing in Figure 2;
  • Figure 6 shows a schematic structural view of the second cover of the central controller housing in Figure 2;
  • Figure 7 shows a schematic structural diagram of the cooling device of the central controller in Figure 2;
  • Figure 8 shows an exploded view of the cooling device in Figure 7;
  • Figure 9 shows a schematic diagram of the installation state of the cooling device in Figure 7 in the middle frame
  • Figure 10 shows an exploded view of the housing and cooling device of the central controller in Figure 2;
  • Figure 11 shows an exploded view of the housing of the central controller in Figure 2;
  • Figure 12 shows a schematic structural diagram of the first circuit board of the central controller in Figure 2;
  • FIG. 13 shows a schematic structural diagram of the second circuit board of the central controller in FIG. 2 .
  • a central controller 1000 housing 100 according to an embodiment of the present disclosure is shown in Figures 1 to 6.
  • the central controller 1000 housing 100 in this embodiment includes: a middle frame 110; a first cover 120, which is buckled on the first side of the middle frame 110 to form a first cavity between the first cover 120 and the middle frame 110; and the second cover 130 is buckled on the second side of the middle frame 110 to form a first cavity between the first cover 120 and the middle frame 110.
  • a second cavity is formed between the two covers 130 and the middle frame 110 .
  • the housing 100 is divided into at least a first cavity and a second cavity.
  • the cavity can integrate each control component of the central controller 1000 into at least two circuit boards with a smaller area, so that the circuit boards are arranged in parallel in the housing 100 of the central controller 1000, that is, the area of a single circuit board is reduced.
  • the circuit board is arranged in the first cavity and the second cavity in parallel, which can It is ensured that the housing 100 of the central controller 1000 is compact in size, and the maximum orthographic projection area of the housing 100 is reduced to facilitate the installation of the central controller 1000 in the car.
  • the housing 100 of the central controller 1000 may include a plurality of middle frames 110 arranged one above another.
  • the housing 100 of the central controller 1000 includes two stacked middle frames 110 , and a first cover 120 and a second cover 130 are respectively provided on both sides of the two stacked middle frames 110 .
  • the middle frame 110 divides the housing 100 into a first cavity, a second cavity and a central cavity between the first cavity and the second cavity, so that three central controllers 1000 can be installed in the housing 100. circuit board.
  • the middle frame 110 of this embodiment includes a partition 111 and is surrounded by a partition 111 side walls 112.
  • the partition 111 of the middle frame 110 can divide the housing 100 into a first cavity and a second cavity, thereby forming two installation spaces in the housing 100 for the placement of the circuit board of the central controller 1000 .
  • the partition 111 and side walls 112 of the middle frame 110 can be used to fix circuit boards, cooling devices 200 and other structures.
  • the partition 111 of this embodiment is provided with a connector avoidance area 116 for avoiding inter-board connectors.
  • the housing 100 of the central controller 1000 is provided with a first cavity and a second cavity, and the first circuit board 300 and the second circuit board 400 can be respectively disposed in the first cavity and the second cavity.
  • the first circuit board 300 and the second circuit board 400 may be connected through an inter-board connector.
  • a connector avoidance area 116 is provided on the partition 111 so that the inter-board connectors can smoothly pass through the middle frame 110 and be connected to the first circuit board 300 and the second circuit board 400 respectively.
  • the inter-board connector can use a 3cm high-speed inter-board connector, which not only reduces the projected area but also achieves an overall communication efficiency of >8Gbps.
  • the partition 111 of this embodiment is provided with a cooling avoidance area 115 that avoids the cooling device 200 .
  • the circuit board of the central controller 1000 integrates a variety of chips, so the circuit board generates a large amount of heat, and a corresponding cooling device 200 needs to be provided to dissipate heat from the circuit board.
  • the cooling device 200 may be separately provided for the first circuit board 300 and the second circuit board 400 for heat dissipation.
  • the cooling device 200 can be disposed on the first side or the second side of the middle frame 110 , and can dissipate heat to the circuit board on the other side of the middle frame 110 through the cooling area on the partition 111 of the middle frame 110 .
  • the partition 111 of the middle frame 110 realizes the connection between the first side and the second side of the middle frame 110 by opening connector avoidance areas 116, cooling avoidance areas 115 and other avoidance areas to facilitate the installation of inter-board connectors and cooling.
  • part of the partition 111 is reserved for fixing circuit boards, cold zone devices and other structures, and can enhance the structural strength of the middle frame 110.
  • the middle frame 110 may be provided with only a surrounding wall without a partition 111 to facilitate the installation of the inter-board connector and the cooling device 200 .
  • the surrounding wall may be provided with a wall for fixing the circuit board and cooling the device 200 .
  • the mounting portion of the device 200 is used to facilitate the installation of the circuit board and the cooling device 200 in the housing 100 of the central controller 1000 .
  • the central controller 1000 housing 100 of this embodiment also includes: a connecting frame 500, which is detachably provided on the middle frame 110, the first cover 120 or the second cover. Body 130 on.
  • central controller 1000 housings 100 In related technologies, in order to adapt to different vehicle models, it is necessary to provide central controller 1000 housings 100 with different structures.
  • the connecting frame 500 and fixing the central controller 1000 housing 100 on the automobile through the connecting frame 500 the central controller 1000 housing 100 can be applied across different vehicle types and configured for different vehicle types.
  • the embodiment of the present disclosure also proposes a central controller 1000.
  • the central controller 1000 includes the above-mentioned central controller 1000 housing 100 and a first circuit disposed in the central controller 1000 housing 100. board 300 and the second circuit board 400 .
  • the central controller 1000 provided by the present disclosure includes the central controller 1000 housing 100 of the above technical solution, the central controller 1000 provided by the present disclosure has all the beneficial effects of the above central controller 1000 housing 100, which will not be discussed here. Repeat.
  • the central controller 1000 also includes: a cooling device 200, which is disposed on the middle frame 110, so that both sides of the cooling device 200 are respectively attached to the first circuit board 300 and the second circuit board 400. .
  • the cooling device 200 is provided on the middle frame 110 of the central controller 1000, and a corresponding cooling escape area 115 is provided on the partition 111 of the middle frame 110, so that the cooling device 200 provided on the middle frame 110 can be This ensures that the cooling device 200 can simultaneously cool and dissipate the first circuit board 300 and the second circuit board 400 on both sides of the middle frame 110 .
  • the cooling device 200 can be fixed on the side wall 112 or the partition 111 of the middle frame 110 through bolts or other connecting members.
  • the cooling device 200 includes: a cooling plate 210, including a cooling plate body 211 and a cooling flow channel 212 provided in the body of the cooling plate 210; a first heat dissipation plate 220 provided on the first side of the cooling plate 210 On the other side, the first heat dissipation plate 220 is used to fit the first circuit board 300; and the second heat dissipation plate 230 is provided on the second side of the cooling plate 210, and the second heat dissipation plate 230 is used to fit the second circuit board 400. .
  • the above-mentioned cooling device 200 includes a cooling plate 210, a first heat dissipation plate 220 disposed on the first side of the cooling plate 210, and a second heat dissipation plate 230 disposed on the second side of the cooling plate 210.
  • the first heat sink 220 exchanges and dissipates heat from the first circuit board 300, and can also isolate the cooling plate 210 from the first circuit board 300 through the first heat sink 220 to avoid the cooling flow channel 212 provided in the cooling plate body 211.
  • the leakage causes damage to the first circuit board 300 to protect the first circuit board 300 from damage.
  • the second heat sink 230 can be used to exchange heat and dissipate heat from the second circuit board 400, and the second heat sink 230 can also be used to isolate the cooling plate 210 from the second circuit board 400 to avoid heat dissipation in the cooling plate body 211.
  • the leakage of the cooling flow channel 212 causes damage to the second circuit board 400 to protect the first circuit board 300 from damage.
  • the above-mentioned cooling device 200 can simultaneously cool the circuit boards located on both sides of the cooling device 200 through the first heat sink 220 and the second heat sink 230, avoiding the need to set up a separate cooling device 200 for each circuit board. The number of cooling devices 200 and the space occupied are reduced.
  • the above-mentioned cooling device 200 can meet the heat dissipation requirements of different circuit boards by changing the structures of the first heat dissipation plate 220 and the second heat dissipation plate 230 on both sides of the cooling plate 210, so that the applicable scope of the cooling plate 210 is further improved.
  • cooling water or refrigerant flows in the cooling flow channel 212 .
  • the central controller 1000 can be air-cooled for heat dissipation, mainly through air convection.
  • the natural air convection heat transfer efficiency is 5-25W/m2*K.
  • Larger cooling fins are required to meet the 85% requirement of the entire vehicle. °C heat dissipation requirements in harsh scenarios.
  • water cooling can be used for heat dissipation.
  • the forced convection coefficient of water cooling heat dissipation can reach 1000-15000W/m2*K. Therefore, the use of water cooling for heat dissipation can avoid the use of larger heat dissipation fins and reduce the overall volume of the central controller 1000. , and the heat exchange efficiency is higher, which can meet the heat dissipation needs of the vehicle in harsh environments.
  • the cooling flow channel 212 provided in the body of the cooling plate 210 is provided with a cooling inlet and a cooling outlet, and the cooling water path can be introduced from the entire vehicle.
  • the inlet water temperature is 55°C
  • the outlet water temperature is 100°C (the minimum junction temperature of the car chip is 105°C).
  • a rough calculation shows that the heat transfer amount of the cooling device 200 is: 900W ⁇ 13500W. Considering the heat transfer loss caused by the actual thermal conductive device, it can also meet the heat dissipation of the future central controller 1000500W need.
  • the first heat sink 220 of this embodiment includes a first heat sink body 221 on a side adjacent to the first circuit board 300 At least one first thermally conductive boss 222 is provided, and the first thermally conductive boss 222 is used to fit on the heating element on the first circuit board 300; and/or the second heat sink 230 includes a second heat sink body 231, At least one second thermally conductive boss is provided on the side of the second heat sink body 231 adjacent to the second circuit board 400 , and the second thermally conductive boss is used to be attached to the heating element on the second circuit board 400 .
  • the circuit board of the central controller 1000 adopts an integrated design. Not only are there many integrated chips on the circuit board, but also considering factors such as the layout area, the chip positions are different, the heights are different, and the amounts of heat are different, so the heat dissipation requirements are also different.
  • the cooling device 200 can perform point-selected cooling of the circuit board.
  • the first circuit board 300 and the second circuit board are first cooled.
  • Each chip and component on the 400 is subjected to thermodynamic parameter simulation experiments, and the structural design of the first heat sink 220 and the second heat sink 230 is carried out according to the simulation results.
  • the main components on the first heat sink 220 and the first circuit board 300 are Corresponding first heat-conducting bosses 222 are provided at positions corresponding to the hot spots.
  • corresponding second heat-conducting bosses are provided on the second heat dissipation plate 230 at positions corresponding to the main heating spots on the second circuit board 400 .
  • the flow path of the cooling channel 212 in the cooling plate 210 passes through at least the first thermal conductive boss 222 and/or the second thermal conductive boss. .
  • the position where the first thermal conductive boss 222 and the second thermal conductive boss are provided is a position with a high demand for heat dissipation.
  • the heat exchange efficiency is such that the flow path of the cooling flow channel 212 in the cooling plate 210 at least passes through the first heat conduction boss 222 and/or the second heat conduction boss, thereby achieving a better heat dissipation effect.
  • the cooling escape area 115 provided on the middle frame 110 can allow the first thermal conductive boss 222 or the second thermal conductive boss to penetrate therein to dissipate heat from the circuit board.
  • a thermal conductive adhesive layer is provided between the first thermally conductive boss 222 and the first circuit board 300 , and/or a thermally conductive adhesive layer is provided between the second thermally conductive boss 222 and the second circuit board 400 . There is a thermally conductive adhesive layer.
  • the thermal conductive adhesive layer can be made of heat dissipating silicone material with thermal conductive function, by providing a thermal conductive adhesive layer between the first thermal conductive boss 222 and the first circuit board 300, and/or, A thermally conductive adhesive layer is provided between the second thermally conductive boss and the second circuit board 400, which can realize flexible contact between each chip on the circuit board and the thermally conductive boss, thereby avoiding vibration and other reasons caused by rigid contact between each chip and the thermally conductive boss. Chip damage.
  • the first heat dissipation plate 220 and the cooling plate 210 of this embodiment are provided with first positioning holes 213 corresponding to each other.
  • the first heat dissipation plate 220 and the cooling plate 210 pass through the first positioning holes 213.
  • a connecting piece is connected to the first positioning hole 213; and/or, the second heat dissipation plate 230 and the cooling plate 210 have corresponding second positioning holes 214, and the second heat dissipation plate 230 and the cooling plate 210 are connected through the second connecting piece and the second Positioning holes 214 are connected.
  • the first heat dissipation plate 220 can be fixedly connected to the cooling plate 210 through the first connecting piece passing through the first positioning hole 213, and the second heat dissipating plate 230 can be passed through the second connecting piece.
  • the second heat dissipation plate 230 and the cooling plate 210 are fixedly connected through the second positioning hole 214 .
  • the first positioning hole 213 and the second positioning hole 214 can overlap, that is, a connecting piece can pass through the first heat dissipation plate 220, the cooling plate 210 and the second heat dissipation plate 230 in order to achieve the positioning of the cooling device 200. connect.
  • first heat dissipation plate 220 and/or the second heat dissipation plate 230 of this embodiment are fixed on the cooling plate 210 by brazing.
  • the first heat dissipation plate 220 and the second heat dissipation plate 230 can be pre-positioned on the cooling plate 210 through positioning pins, and then the first heat dissipation plate 220 and the second heat dissipation plate 230 can be fixed on the cooling plate 210 by soldering. on the cooling plate 210. Brazing can provide a sealed connection between the first heat conducting plate and the water cooling plate, and a sealing connection between the second heat conducting plate and the water cooling plate.
  • the cooling flow channel 212 is surrounded by the first thermal conductive plate and the second thermal conductive plate to prevent leakage from the cooling flow channel 212 due to machining accuracy, vibration, etc. from entering the circuit board.
  • the first thermally conductive boss 222 of this embodiment is fixed on the first heat dissipation plate 220 through soldering, and the second thermally conductive boss can be fixed on the second heat dissipation plate 230 through soldering.
  • the first heat dissipation plate 220 and the first heat conduction boss 222 adopt a split design.
  • the first heat conduction boss 222 can be flexibly arranged on the first heat dissipation plate 220 according to heat dissipation requirements; the same applies to the second heat dissipation plate 230 .
  • the heat sink block can be adjusted to maximize the reuse of molds and reduce production costs.
  • the cooling device 200 may be integrally connected to the middle frame 110 through a screw connection.
  • the first circuit board 300 and the second circuit board 400 can also be connected to the middle frame 110 through screw management, so that the first circuit board 300 and the second circuit board 400 are fixed on the middle frame 110 and passed through the cooling device. 200 for heat dissipation.
  • the middle frame 110 may be provided with an assembly positioning portion corresponding to the cooling device 200 and an assembly positioning portion corresponding to the circuit board, so that the cooling device 200 and the circuit board can be accurately assembled to the middle frame 110 and the The thermally conductive bosses of the cooling device 200 correspond to the chips on the circuit board.
  • a first electromagnetic shielding layer is provided on both sides of the first circuit board 300; a second electromagnetic shielding layer is provided on both sides of the second circuit board 400; and a first side of the middle frame 110 is provided with a second electromagnetic shielding layer.
  • the electromagnetic shielding wall is buckled on the second side of the middle frame 110 so that the second cover 130 and the electromagnetic shielding wall are in contact with the electromagnetic shielding wall of the second middle frame 110 .
  • the first circuit board 300 is realized.
  • the inter-board electromagnetic shielding of the second circuit board 400 also realizes electromagnetic shielding to the surface of the central controller 1000; further, the housing 100 of the control controller is also provided with mutually matched electromagnetic shielding walls.
  • the cooperation of the walls realizes electromagnetic shielding around the central controller 1000, thus achieving full shielding of the circuit board. That is, in this embodiment, the first circuit board 300 forms an all-round three-dimensional electromagnetic shielding by the first cover 120 , the middle frame 110 and the first circuit board 300 itself, and the second circuit board 400 consists of the second cover 130 , the middle frame 110 and the first circuit board 300 itself.
  • the frame 110 and the second circuit board 400 themselves form an all-round three-dimensional electromagnetic shielding.
  • the electromagnetic shielding layer provided on the circuit board can also be replaced by providing an electromagnetic shielding layer on the surface of the housing 100 corresponding to the surface of the circuit board.
  • the first cover 120 is provided with an electromagnetic shielding layer on the inner side of the first cover 120
  • the first electromagnetic shielding layer of the first middle frame 110 is provided on the first side of the middle frame 110 to replace the first electromagnetic shielding layer on both sides of the first circuit board 300 .
  • Electromagnetic shielding layer similarly, the second cover 130 is provided with an electromagnetic shielding layer on the inner side of the second cover 130 , and the second electromagnetic shielding layer of the second middle frame 110 is provided on the second side of the middle frame 110 to replace the second circuit board 400 Second electromagnetic shielding layer on both sides.
  • the cooling device 200 may not be provided, that is, the cooling avoidance area 115 is not provided on the partition 111 of the middle frame 110, so that the cooling device 200 can be installed in the middle frame 110.
  • a complete first electromagnetic shielding layer and a second electromagnetic shielding layer of the middle frame 110 are formed on the partition 111 of the frame 110 .
  • the power of the first circuit board 300 or the second circuit board 400 is relatively high, a cooling device 200 needs to be provided, and a cooling avoidance area 115 needs to be set up on the partition 111 of the middle frame 110.
  • the area 115 has an electromagnetic shielding function, so an electromagnetic shielding layer can be provided on any one or several plate structures of the cooling plate 210, the first heat dissipation plate 220 and the second heat dissipation plate 230 of the cooling device 200 to replace the middle frame 110.
  • An electromagnetic shielding layer is used to realize electromagnetic shielding between the first circuit board 300 and the second circuit board 400 .
  • the first cover 120 electromagnetic shielding layer, the first cover electromagnetic shielding wall 121, the first middle frame 110 electromagnetic shielding layer, and the first middle frame electromagnetic shielding wall 113 form an electromagnetic shielding layer for the first circuit board 300.
  • the first circuit board 300 and the second circuit board 400 and other devices can be electromagnetically isolated to achieve electromagnetic shielding of the first circuit board 300.
  • the electromagnetic shielding of the second circuit board 400 is the same as that of the first circuit board 300 and will not be described again here.
  • a first electromagnetic radiation interrupting portion 114 is provided between the first middle frame electromagnetic shielding wall 113 and the first cover electromagnetic shielding wall 121;
  • a second electromagnetic radiation interrupting portion is provided between the electromagnetic shielding wall of the second middle frame 110 and the electromagnetic shielding wall of the second cover 130 .
  • the present disclosure provides a first electromagnetic radiation interruption part. 114 and the second electromagnetic radiation interruption part, thereby forming an electromagnetic shielding grid structure between the middle frame 110 and the first cover 120 and between the middle frame 110 and the second cover 130, allowing the electromagnetic field to pass through the electromagnetic shielding grid structure Eddy currents are generated when the electromagnetic field is internally offset, ultimately achieving an electromagnetic shielding effect.
  • the spacing between adjacent first electromagnetic radiation interrupting parts 114 is 8 cm to 12 cm; the spacing between adjacent second electromagnetic radiation interrupting parts 114 The distance between the two parts is 8cm ⁇ 12cm. In some embodiments, the distance between adjacent first electromagnetic radiation interruption parts 114 may be 10 cm; the distance between adjacent second electromagnetic radiation interruption parts 114 may be 10 cm.
  • the first harmonic frequency of the vehicle device signal frequency is ⁇ 2GHz.
  • ⁇ cutoff 2a, where a is the shielding wall aperture.
  • the first electromagnetic radiation interruption part 114 of this embodiment includes a metal protrusion provided on the side wall 112 on the first side of the middle frame 110 and/or is provided on the side of the first cover 120 Metal protrusions on the wall 112; the second electromagnetic radiation interruption part includes metal protrusions provided on the second side wall 112 of the middle frame 110 and/or metal protrusions provided on the side wall 112 of the second cover 130 bulge.
  • metal protrusions are provided on each side wall 112 of the housing 100, and a similar metal grid structure is formed on each side wall 112 of the housing 100 through the metal protrusions, so as to isolate by the metal grid structure.
  • External electromagnetic radiation of the central controller 1000 External electromagnetic radiation of the central controller 1000.
  • first electromagnetic shielding layers are provided on both sides of the first circuit board 300; and second electromagnetic shielding layers are provided on both sides of the second circuit board 400.
  • first electromagnetic shielding layers are respectively provided on both sides of the first circuit board 300 to achieve external electromagnetic radiation shielding on the upper and lower surfaces of the first circuit board 300, and then the first cover body electromagnetic shielding wall 121 and The first middle frame electromagnetic shielding wall 113 can shield external electromagnetic radiation around the first circuit board 300; similarly, by setting second electromagnetic shielding layers on both sides of the second circuit board 400, the upper and lower sides of the second circuit board 400 can be shielded.
  • the external electromagnetic radiation is shielded on the surface, and the external electromagnetic radiation is shielded around the second circuit board 400 through the electromagnetic shielding wall of the second cover 130 and the electromagnetic shielding wall of the second middle frame 110 .
  • the edge of the first circuit board 300 is provided with a first edge electromagnetic shielding wire 310; the edge of the second circuit board 400 is provided with a second edge electromagnetic shielding wire 310. Shielded wire 410.
  • the first edge electromagnetic shielding wire 310 may be in contact with the first cover electromagnetic shielding wall 121 or the first middle frame electromagnetic shielding wall 113; the second edge electromagnetic shielding wire 410 may be in contact with the second cover body.
  • the electromagnetic shielding wall 130 or the electromagnetic shielding wall of the second middle frame 110 is in contact with each other.
  • an inter-board connector is provided between the first circuit board 300 and the second circuit board 400; accordingly, the middle frame 110 is provided with a connector avoidance area 116 , the first side of the middle frame 110 is provided with a first connector electromagnetic shielding surrounding wall 117 around the connector avoidance area 116, and the second side of the middle frame 110 is provided with a second connector electromagnetic shielding surrounding wall 118 around the connector avoidance area 116. . Further preferably, the first circuit board 300 and the second circuit board 400 are provided with connector electromagnetic shielding lines at corresponding positions surrounding the connector avoidance area 116 .
  • a first connector electromagnetic shielding wall is provided on the middle frame 110 around the connector avoidance area 116.
  • 117 is in contact with the electromagnetic shielding wire of the connector located on the first circuit board 300
  • a second connector electromagnetic shielding wall 118 is provided around the connector avoidance area 116 on the middle frame 110 to connect with the connector located on the second circuit board 400.
  • the electromagnetic screen wires of the device are in contact with each other, thereby covering the inter-board connectors to avoid electromagnetic interference between boards.
  • the electromagnetic shielding wall and the electromagnetic shielding layer are made of metal materials. Electromagnetic shielding is achieved through metal materials.
  • the metal material can be copper.
  • embodiments of the present disclosure also provide an automobile, which includes the above-mentioned central controller 1000.
  • the car provided by the present disclosure includes the central controller 1000 of the above technical solution, the car provided by the present disclosure has all the beneficial effects of the above central controller 1000, which will not be described again here.

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Abstract

本文公开了一种中央控制器壳体(100)、中央控制器(1000)和汽车，中央控制器壳体(100)通过中框(110)与第一盖体(120)、第二盖体(130)的组合，将壳体(100)至少分割为第一腔体和第二腔体，可以将各控制部件至少集成为两个面积较小的电路板，减小单个电路板的面积以方便安装，同时改善电路板的模态以减少工作过程中承受各类振动和冲击载荷。

Description

一种控制器壳体、中央控制器和汽车
相关申请的交叉引用
本申请要求于2022年07月20日提交、申请号为202210863000.9且名称为“一种控制器壳体、中央控制器和汽车”的中国专利申请的优先权，其全部内容通过引用合并于此。
技术领域
本公开属于汽车集成控制技术领域，尤其涉及一种控制器壳体、中央控制器和汽车。
背景技术
中央控制器是电动汽车的核心部件，其通常包括电机控制器、整车控制器、整车管理系统和车载充电机等控制部件组成，将这些控制部件集成为一体式中央控制器电路板时面积较大，无法满足安装、模态要求。
发明内容
本公开旨在至少能够在一定程度上解决一体式中央控制器电路板面积较大，无法满足安装、模态要求的技术问题。为此，本公开提供了一种控制器壳体、中央控制器和汽车。
在本公开的第一方面，提供了一种中央控制器壳体，包括：中框；第一盖体，扣设在所述中框的第一侧，以在所述第一盖体、所述中框之间形成第一腔体；以及，第二盖体，扣设在所述中框的第二侧，以在所述第二盖体、所述中框之间形成第二腔体。
在本公开的第二方面，提供了一种中央控制器，包括上述的中央控制器壳体和设置在所述中央控制器壳体内的第一电路板、第二电路板。
在本公开的第三方面，提供了一种汽车，所述汽车包括上述的中央控制器。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出了本公开一些实施例的中央控制器的结构示意图；
图2示出了图1中的中央控制器的爆炸图；
图3示出了图2中的中央控制器的壳体的中框的结构示意图；
图4示出了图3中的中框的另一角度的结构示意图；
图5示出了图2中的中央控制器的壳体的第一盖体的结构示意图；
图6示出了图2中的中央控制器的壳体的第二盖体的结构示意图；
图7示出了图2中的中央控制器的冷却装置的结构示意图；
图8示出了图7中的冷却装置的爆炸图；
图9示出了图7中的冷却装置在中框中的安装状态示意图；
图10示出了图2中的中央控制器的壳体和冷却装置的爆炸图；
图11示出了图2中的中央控制器的壳体的爆炸图；
图12示出了图2中的中央控制器的第一电路板的结构示意图；以及
图13示出了图2中的中央控制器的第二电路板的结构示意图。
附图标记：
100、壳体；110、中框；111、隔板；112、侧壁；113、第一中框电磁屏蔽围壁；114、第一电磁辐射打断部；115、冷却避让区；116、连接器避让区；117、第一连接器电磁屏蔽围壁；118、第二连接器电磁屏蔽围壁；120、第一盖体；121、第一盖体电磁屏蔽围壁；130、第二盖体；200、冷却装置；210、冷却板；211、冷却板本体；212、冷却流道；213、第一定位孔；214、第二定位孔；220、第一散热板；221、第一散热板本体；222、第一导热凸台；230、第二散热板；231、第二散热板本体；300、第一电路板；310、第一边沿电磁屏蔽线；400、第二电路板；410、第二边沿电磁屏蔽线；500、连接架；1000、中央控制器。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开的一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
此外，本公开可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本公开提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
下面结合附图并参考具体实施例描述本公开。
本公开提出的一实施例的中央控制器1000壳体100，如图1至图6所示，本实施例的中央控制器1000壳体100包括：中框110；第一盖体120，扣设在中框110的第一侧，以在第一盖体120、中框110之间形成第一腔体；以及，第二盖体130，扣设在中框110的第二侧，以在第二盖体130、中框110之间形成第二腔体。
在本实施例中，通过中框110与第一盖体120、第二盖体130的组合，将壳体100至少分割为第一腔体和第二腔体，通过第一腔体和第二腔体可以将中央控制器1000的各控制部件至少集成为两个面积较小的电路板，使电路板呈平行地设置在中央控制器1000壳体100内，即减小了单个电路板的面积，可以方便电路板的安装，又可以改善电路板的模态，减少电路板在工作过程中承受各类振动和冲击载荷；同时，电路板平行设置在第一腔体和第二腔体内，能够确保中央控制器1000壳体100的体积较为紧凑，减小壳体100的最大正投影面积，方便中央控制器1000在汽车内的设置。
在其他实施例中，中央控制器1000壳体100可以包括若干依次叠设设置的中框110。例如，在中央控制器1000的壳体100中包括两个叠设的中框110，进而在两个叠设的中框110两侧分别设置第一盖体120和第二盖体130，通过两个中框110将壳体100分割为第一腔体、第二腔体以及位于第一腔体 和第二腔体之间的中央腔体，以使中央控制器1000壳体100内可以设置三个电路板。
作为一种可选实施方式，在本实施例的中央控制器1000壳体100中，如图3和图4所示，本实施例的中框110包括隔板111和围设在隔板111上的侧壁112。
在本实施例中，中框110的隔板111能够将壳体100分割为第一腔体和第二腔体，从而在壳体100内形成两个安装空间供中央控制器1000电路板的设置。在一些实施例中，中框110的隔板111和侧壁112可以用于固定电路板、冷却装置200等结构。
如图3和图4所示，本实施例的隔板111上开设有避让板间连接器的连接器避让区116。
在本实施例中，中央控制器1000壳体100内设有第一腔体和第二腔体，可以在第一腔体和第二腔体内分别设置第一电路板300和第二电路板400，第一电路板300和第二电路板400可以通过板间连接器连接。在隔板111上开设有连接器避让区116，能够使板间连接器顺利穿过中框110分别与第一电路板300和第二电路板400连接。
可选的，板间连接器可以采用3cm的高速板间连接器，实现投影面积小型化的同时也达成了总体>8Gbps的通讯效率。
如图3和图4所示，本实施例的隔板111开设有避让冷却装置200的冷却避让区115。
中央控制器1000的电路板集成有多种芯片，因此电路板的产热量较大，需要设置相应的冷却装置200以对电路板进行散热。可以针对第一电路板300和第二电路板400分别单独设置冷却装置200进行散热。为了使中央控制器1000整体的结构更为简单，优选的在中央控制器1000的壳体100内设置一个冷却装置200同时对第一电路板300和第二电路板400进行散热。在本实施例中，冷却装置200可以设置在中框110的第一侧或第二侧，并可以通过中框110的隔板111上冷却区对中框110另一侧的电路板进行散热。
在本实施例中，中框110的隔板111通过开设连接器避让区116、冷却 避让区115等避让区域实现中框110第一侧和第二侧的连通以方便设置板间连接器和冷却装置200等结构，保留部分隔板111用于固定电路板、冷区装置等结构，并且可以增强中框110的结构强度。
在其他实施例中，中框110也可以仅设置围壁而不设有隔板111，方便板间连接器和冷却装置200的设置，例如，可以在围壁上设有用于固定电路板和冷却装置200的安装部以方便在中央控制器1000壳体100内设置电路板和冷却装置200。
作为一种可选实施方式，如图2所示，本实施例的中央控制器1000壳体100还包括：连接架500，可拆卸地设置在中框110、第一盖体120或第二盖体130上。
在相关技术中，为了适配不同的车型，需要设置不同结构的中央控制器1000壳体100。在本实施例中，通过可拆卸地设置连接架500并通过连接架500将中央控制器1000壳体100固定在汽车中国，能够使中央控制器1000壳体100跨车型应用，针对不同的车型配置不同的连接架500，跨车型应用时只需要更换与车型适配的连接架500即可，降低了中央控制器1000的生产成本，提高了经济效益。
基于同样的公开构思，本公开实施例还提出了一种中央控制器1000，该中央控制器1000包括上述的中央控制器1000壳体100和设置在中央控制器1000壳体100内的第一电路板300、第二电路板400。
因本公开提供的中央控制器1000包括了上述技术方案的中央控制器1000壳体100，因此本公开提供的中央控制器1000具备上述中央控制器1000壳体100的全部有益效果，在此不做赘述。
如图2和图8所示，中央控制器1000还包括：冷却装置200，设置在中框110上，以使冷却装置200的两侧分别与第一电路板300和第二电路板400贴合。
随着中央控制器1000中的电路板的集成度增高，且对高算力AI芯片的需求增加，中央控制器1000对散热的需求也相应增加以避免电器热害。在本实施例中，通过在中央控制器1000的中框110上设置冷却装置200，同时中 框110的隔板111上设有相应的冷却避让区115，从而能够使设置在中框110上的了冷却装置200能够同时对中框110两侧的第一电路板300和第二电路板400进行冷却散热。可选的，在本实施例中，冷却装置200可以通过螺栓等连接件固定在中框110的侧壁112或隔板111上。
如图7至图9所示，冷却装置200包括：冷却板210，包括冷却板本体211和设置在冷却板210体内的冷却流道212；第一散热板220，设置在冷却板210的第一侧，第一散热板220用于贴合第一电路板300；以及，第二散热板230，设置在的冷却板210的第二侧，第二散热板230用于贴合第二电路板400。
上述冷却装置200包括冷却板210、设置在冷却板210第一侧的第一散热板220以及设置在冷却板210第二侧的第二散热板230，通过分体式结构的冷却装置200，即能够通过第一散热板220对第一电路板300进行交换散热，还能够通过第一散热板220将冷却板210与第一电路板300隔绝开，避免设置在冷却板本体211内的冷却流道212泄漏导致第一电路板300的损伤，以保护第一电路板300免受损害。同理，能够通过第二散热板230对第二电路板400进行交换散热，还能够通过第二散热板230将冷却板210与第二电路板400隔绝开，避免设置在冷却板本体211内的冷却流道212泄漏导致第二电路板400的损伤，以保护第一电路板300免受损害。
在一些实施例中，上述冷却装置200可以通过第一散热板220和第二散热板230同时对位于冷却装置200两侧的电路板进行冷却，避免了针对各个电路板需要单独设置冷却装置200，减少了冷却装置200的数量和占用的空间。
在一些实施例中，上述的冷却装置200可以通过更换冷却板210两侧的第一散热板220和第二散热板230的结构以满足不同电路板的散热需求，使冷却板210的适用范围更广，
在一些实施例中，上述的冷却装置200中，冷却流道212中流通有冷却水或制冷剂。
在相关技术中，中央控制器1000可以采用风冷散热，主要以空气对流方式进行散热，空气自然对流换热效率5-25W/㎡*K，需要使用较大的散热翅 片才能满足整车85℃恶劣场景下的散热需求。而在本公开中，可以采用水冷散热，水冷散热的强制对流系数可以达到1000-15000W/㎡*K，因此采用水冷散热既能够避免使用较大的散热翅片，缩小中央控制器1000的整体体积，而且换热效率更高，能够满足整车恶劣环境下的散热需求。
在一些实施例中，如图7至图9所示，设置在冷却板210体内的冷却流道212设有冷却入口和冷却出口，可以从整车介入冷却水路。按照最小流速1L/min，入口水温55℃，出口水温100℃(车规芯片最低结温105℃)，例如该冷却板210的换热面积为0.2m2，可以通过公式Q＝K水*0.2*45(K水1000-15000W/㎡*K)粗算得出该冷却装置200的换热量为：900W～13500W，考虑实际导热器件导致的传热折损，也可以满足未来中央控制器1000500W的散热需求。
作为一种可选实施方式，如图7至图9所示，本实施例的第一散热板220包括第一散热板本体221，在第一散热板本体221邻近第一电路板300的一侧设有至少一个第一导热凸台222，第一导热凸台222用于贴合在第一电路板300上的发热元件上；和/或，第二散热板230包括第二散热板本体231，在第二散热板本体231邻近第二电路板400的一侧设有至少一个第二导热凸台，第二导热凸台用于贴合在第二电路板400上的发热元件上。
中央控制器1000的电路板采用集成设计，不仅电路板上集成芯片较多，且考虑布板面积等因素则芯片位置不同、高度不同、发热量不同，故而对散热需求也不同。
在本实施例中，冷却装置200可以对电路板进行选点冷却，例如，在对第一散热板220和第二散热板230进行结构实际前，先对第一电路板300和第二电路板400上各芯片、元器件进行热力学参数仿真实验，从而根据仿真结果对第一散热板220和第二散热板230进行结构设计，在第一散热板220上与第一电路板300上的主要发热点对应位置设置相应的第一导热凸台222，同理，在第二散热板230上与第二电路板400上的主要发热点对应位置设置相应的第二导热凸台。以实现通过第一导热凸台222和第二导热凸台分别对第一电路板300和第二电路板400实现定点散热，以提高散热效率。
作为一种可选实施方式，如图7至图9所示，本实施例中冷却流道212在冷却板210内的流经途径至少经过第一导热凸台222和/或第二导热凸台。
在本实施例中，设有第一导热凸台222和第二导热凸台的位置是对散热需求较高的位置，为了进一步提高第一导热凸台222、第二导热凸台与冷却板210的换热效率，使冷却流道212在冷却板210内的流经途径至少经过第一导热凸台222和/或第二导热凸台，从而达到更好的散热效果。相应的，中框110上开设的冷却避让区115能够供第一导热凸台222或第二导热凸台穿设于其中以对电路板进行散热。
作为一种可选实施方式，本实施例的第一导热凸台222与第一电路板300之间设有导热胶层，和/或，第二导热凸台与第二电路板400之间设有导热胶层。
在本实施例中，导热胶层可以采用具有导热功能的散热硅胶能材料制备而成，通过在第一导热凸台222与第一电路板300之间设有导热胶层，和/或，第二导热凸台与第二电路板400之间设有导热胶层，能够实现电路板上各芯片与导热凸台的柔性接触，从而能够避免各芯片与导热凸台刚性接触下由于振动等原因导致芯片损伤。
作为一种可选实施方式，如图7至图9所示，本实施例的第一散热板220与冷却板210对应开设有第一定位孔213，第一散热板220与冷却板210通过第一连接件和第一定位孔213连接；和/或，第二散热板230与冷却板210对应开设有第二定位孔214，第二散热板230与冷却板210通过第二连接件和第二定位孔214连接。
在本实施例中，第一散热板220能够通过第一连接件穿过第一定位孔213实现第一散热板220与冷却板210的固定连接，第二散热板230能够通过第二连接件穿过第二定位孔214实现第二散热板230与冷却板210的固定连接。在某些情况下，第一定位孔213和第二定位孔214可以重叠，即通过一个连接件可以依次穿过第一散热板220、冷却板210以及第二散热板230实现冷却装置200的定位连接。
作为进一步可选的实施方式，本实施例的第一散热板220和/或第二散热 板230通过钎焊固定在冷却板210上。
在本实施例中，可以首先通过定位销将第一散热板220和第二散热板230预先定位在冷却板210上，进而可以通过钎焊将第一散热板220和第二散热板230固定在冷却板210上。通过钎焊可以是第一导热板与水冷板之间密闭连接、第二导热板与水冷板之间密闭连接。通过第一导热板和第二导热板将冷却流道212围设在其中，避免由于加工精度、振动等原因冷却流道212产生的泄漏进入电路板。
作为一种可选的实施方式，本实施例的第一导热凸台222通过钎焊固定在第一散热板220上，第二导热凸台可以通过钎焊固定在第二散热板230上。
在本实施例中，第一散热板220与第一导热凸台222采用分体式设计，第一导热凸台222可以根据散热需求灵活设置在第一散热板220上；第二散热板230同理。以实现在电路板结构变更后可以提供调整散热块实现最大程度的复用模具，降低生产成本。
作为一种可选实施方式，如图2和9所示，冷却装置200可以通过螺接关系整体连接到中框110上。相应的，第一电路板300和第二电路板400也可以通过螺接管理连接到中框110上，以使第一电路板300和第二电路板400固定在中框110上并通过冷却装置200进行散热。
在一些实施例中，中框110上可以设有与冷却装置200对应的装配定位部、与电路板对应的装配定位部，进而使冷却装置200和电路板能够准确装配至中框110上并且使冷却装置200的导热凸台与电路板上的芯片相对应。
作为一种可选实施方式，第一电路板300的两侧分别设有第一电磁屏蔽层；第二电路板400的两侧分别设有第二电磁屏蔽层；中框110的第一侧设有第一中框电磁屏蔽围壁113，中框110的第二侧设有第二中框110电磁屏蔽围壁；第一盖体120的内侧设有第一盖体电磁屏蔽围壁121且扣设在中框110的第一侧，以使第一盖体电磁屏蔽围壁121与第一中框电磁屏蔽围壁113相抵接；以及，第二盖体130的内侧设有第二盖体130电磁屏蔽围壁且扣设在中框110的第二侧，以使第二盖体130电磁屏蔽围壁与第二中框110电磁屏蔽围壁相抵接。
在本实施例中，通过在第一电路板300的两侧分别设有第一电磁屏蔽层；在第二电路板400的两侧分别设有第二电磁屏蔽层，即实现第一电路板300、第二电路板400的板间电磁屏蔽，又实现了向中央控制器1000表面的电磁屏蔽；进一步地，控制控制器的壳体100还设有相互配合的电磁屏蔽围壁，通过电磁屏蔽围壁的配合实现了向中央控制器1000四周的电磁屏蔽，从而实现电路板全屏蔽。即在本实施例中，第一电路板300由第一盖体120、中框110以及第一电路板300本身形成全方位立体的电磁屏蔽，第二电路板400由第二盖体130、中框110以及第二电路板400本身形成全方位立体的电磁屏蔽，通过电路板与壳体100的配合实现电路板间的电磁屏蔽和中央控制器1000向外的电磁屏蔽。
作为一种可选实施方式，在其他实施例中，也可以通过在壳体100上与电路板表面对应壳体100表面设置电磁屏蔽层替代电路板上设置的电磁屏蔽层。例如，第一盖体120的内侧设有第一盖体120电磁屏蔽层，中框110的第一侧设有第一中框110电磁屏蔽层，以替代第一电路板300两侧的第一电磁屏蔽层；同理，第二盖体130的内侧设有第二盖体130电磁屏蔽层，中框110的第二侧设有第二中框110电磁屏蔽层，以替代第二电路板400两侧的第二电磁屏蔽层。
在该实施例中，若第一电路板300和第二电路板400的功率较小，可以不设置冷却装置200，即中框110的隔板111上未开设冷却避让区115，从而能够在中框110的隔板111上形成完整的第一中框110电磁屏蔽层和第二电磁屏蔽层。在该实施例中，若第一电路板300或第二电路板400的功率较大，需要设置冷却装置200，同时需要在中框110的隔板111上开设冷却避让区115，为了使冷却避让区115具有电磁屏蔽功能，故而可以在冷却装置200的冷却板210、第一散热板220以及第二散热板230中的任意一个或几个板体结构上设置电磁屏蔽层替代中框110上的电磁屏蔽层，以实现第一电路板300和第二电路板400间的电磁屏蔽。
针对第一电路板300，第一盖体120电磁屏蔽层、第一盖体电磁屏蔽围壁121、第一中框110电磁屏蔽层以及第一中框电磁屏蔽围壁113形成对第一 电路板300的全包围，故而可以将第一电路板300与第二电路板400以及其他设备进行电磁隔离，实现对第一电路板300的电磁屏蔽。第二电路板400的电磁屏蔽与第一电路板300相同，在此不再赘述。
作为一种可选实施方式，如图3和图10所示，第一中框电磁屏蔽围壁113与第一盖体电磁屏蔽围壁121之间设有第一电磁辐射打断部114；第二中框110电磁屏围壁与第二盖体130电磁屏蔽围壁之间设有第二电磁辐射打断部。
在本实施例中，由于中框110与两块电路板或两个盖体无法做到绝对平行，因此无法做到完整平面屏蔽，为了提高屏蔽效果，本公开通过设置第一电磁辐射打断部114和第二电磁辐射打断部，从而在中框110与第一盖体120之间、中框110与第二盖体130之间形成电磁屏蔽网格结构，使电磁场通过电磁屏蔽网格结构时产生涡流，使电磁场进行内部抵消最终实现电磁屏蔽效果。
作为一种可选实施方式，如图3和图10所示，在本实施例中，相邻的第一电磁辐射打断部114的间距为8cm～12cm；相邻的第二电磁辐射打断部的间距为8cm～12cm。在一些实施例中，相邻的第一电磁辐射打断部114的间距可以为10cm；相邻的第二电磁辐射打断部的间距为10cm。
在本实施例中，经过实验验证，车载器件信号频率一次谐波频率<2GHz根据电磁波屏蔽原理公式：λ截止＝2a，其中，a为屏蔽墙孔径。例如当第一电磁辐射打断部114的间距a和第二电磁辐射打断部的间距a均为10cm时，则根据式f＝c/λ＝c/2a＝2.794Ghz，其中，c＝3*108m/s。即第一电磁辐射打断部114的间距和第二电磁辐射打断部的间距为10cm时，对电磁波的截止频率为2.794GHz,即小于该频段的对外辐射可以被隔离屏蔽。
作为一种可选实施方式，本实施例的第一电磁辐射打断部114包括设置在中框110第一侧的侧壁112上的金属凸起和/或设置在第一盖体120的侧壁112上的金属凸起；第二电磁辐射打断部包括设置在中框110第二次的侧壁112上的金属凸起和/或设置在第二盖体130的侧壁112上的金属凸起。
在本实施例中，通过在壳体100的各侧壁112上设置金属凸起，通过金 属凸起在壳体100的各侧壁112形成类似金属网格结构，以通过该金属网格结构隔离中央控制器1000的对外电磁辐射。
作为一种可选实施方式，本实施例的第一电路板300的两侧分别设有第一电磁屏蔽层；第二电路板400的两侧分别设有第二电磁屏蔽层。
在本实施例中，通过第一电路板300的两侧分别设置第一电磁屏蔽层，实现对第一电路板300上下表面的对外电磁辐射屏蔽，进而通过第一盖体电磁屏蔽围壁121与第一中框电磁屏蔽围壁113实现对第一电路板300四周对外电磁辐射屏蔽；同理，通过第二电路板400的两侧分别设置第二电磁屏蔽层，实现对第二电路板400上下表面的对外电磁辐射屏蔽，进而通过第二盖体130电磁屏蔽围壁与第二中框110电磁屏蔽围壁实现对第二电路板400四周对外电磁辐射屏蔽。
作为一种可选实施方式，如图12和图13所示，本实施例第一电路板300的边沿设有第一边沿电磁屏蔽线310；第二电路板400的边沿设有第二边沿电磁屏蔽线410。
在一些实施例中，第一边沿电磁屏蔽线310可以与第一盖体电磁屏蔽围壁121或第一中框电磁屏蔽围壁113相抵接；第二边沿电磁屏蔽线410可以与第二盖体130电磁屏蔽围壁或第二中框110电磁屏蔽围壁相抵接。
作为一种可选实施方式，如图2至图4所示，第一电路板300与第二电路板400之间设有板间连接器；相应地，中框110开设有连接器避让区116，中框110的第一侧绕连接器避让区116设有第一连接器电磁屏蔽围壁117，中框110的第二侧绕连接器避让区116设有第二连接器电磁屏蔽围壁118。进一步优选的，第一电路板300、第二电路板400与围绕连接器避让区116对应位置设有连接器电磁屏线。
在本实施例中，为了避免第一电路板300与第二电路板400之前通过连接器避让区116的电磁干扰，故而在中框110绕连接器避让区116设置第一连接器电磁屏蔽围壁117以与位于第一电路板300上的连接器电磁屏线抵接，在中框110绕连接器避让区116设置第二连接器电磁屏蔽围壁118以与位于第二电路板400上的连接器电磁屏线抵接，从而将板间连接器包覆在其中，避 免板间电磁干扰。
作为一种可选实施方式，电磁屏蔽围壁以及电磁屏蔽层由金属材料制备而成。通过金属材料实现电磁屏蔽作用。可选的，金属材料可以为铜。
基于同样的公开构思，本公开实施例还提供了一种汽车，汽车包括上述的中央控制器1000。
因本公开提供的汽车包括了上述技术方案的中央控制器1000，因此本公开提供的汽车具备上述中央控制器1000的全部有益效果，在此不做赘述。
需要说明的是，本公开实施例中所有方向性指示仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本公开中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者多个所述特征。在本公开的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本公开要求的保护范围之内。

Claims (10)

  1. 一种中央控制器壳体，包括：中框；第一盖体，扣设在所述中框的第一侧，以在所述第一盖体、所述中框之间形成第一腔体；以及，第二盖体，扣设在所述中框的第二侧，以在所述第二盖体、所述中框之间形成第二腔体。
  2. 如权利要求1所述的中央控制器壳体，其中，所述中框包括隔板和围设在所述隔板上的侧壁。
  3. 如权利要求2所述的中央控制器壳体，其中，所述隔板上开设有避让板间连接器的连接器避让区。
  4. 如权利要求2所述的中央控制器壳体，其中，所述隔板开设有避让冷却装置的冷却避让区。
  5. 如权利要求1至4任意一项所述的中央控制器壳体，还包括：
    连接架，可拆卸地设置在所述中框、第一盖体或所述第二盖体上。
  6. 一种中央控制器，包括如权利要求1至5任意一项所述的中央控制器壳体和设置在所述中央控制器壳体内的第一电路板、第二电路板。
  7. 如权利要求6所述的中央控制器，还包括：冷却装置，设置在所述中框上，以使所述冷却装置的两侧分别与第一电路板和所述第二电路板贴合。
  8. 如权利要求6所述的中央控制器，其中，所述第一电路板的两侧分别设有第一电磁屏蔽层；所述第二电路板的两侧分别设有第二电磁屏蔽层；所述中框的第一侧设有第一中框电磁屏蔽围壁，所述中框的第二侧设有第二中框电磁屏蔽围壁；所述第一盖体的内侧设有第一盖体电磁屏蔽围壁且扣设在所述中框的第一侧，以使所述第一盖体电磁屏蔽围壁与所述第一中框电磁屏蔽围壁相抵接；以及，所述第二盖体的内侧设有第二盖体电磁屏蔽围壁且扣设在所述中框的第二侧，以使所述第二盖体电磁屏蔽围壁与所述第二中框电磁屏蔽围壁相抵接。
  9. 如权利要求8所述的中央控制器，其中，所述第一中框电磁屏蔽围壁与所述第一盖体电磁屏蔽围壁之间设有第一电磁辐射打断部；所述第二中框电磁屏围壁与所述第二盖体电磁屏蔽围壁之间设有第二电磁辐射打断部。
  10. 一种汽车，包括如权利要求6至9任意一项所述的中央控制器。
PCT/CN2022/128803 2022-07-20 2022-10-31 一种控制器壳体、中央控制器和汽车 WO2024016510A1 (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4417432A1 (de) * 1993-05-28 1994-12-01 Steyr Daimler Puch Ag Flüssigkeitsgekühlte Antriebseinheit für ein Elektromobil
CN106231871A (zh) * 2016-08-23 2016-12-14 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
CN107340729A (zh) * 2017-08-31 2017-11-10 合肥巨动力系统有限公司 一种基于小型集成的分腔式模块化控制器结构
EP3604049A1 (en) * 2018-08-03 2020-02-05 Aptiv Technologies Limited Secure vehicle control unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN210491558U (zh) * 2020-04-03 2020-05-08 华人运通(上海)新能源驱动技术有限公司 带有分隔筋的控制装置及车辆
CN214705910U (zh) * 2021-05-31 2021-11-12 广东高标电子科技有限公司 一种mos管封装结构及电动车控制器
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CN215582151U (zh) * 2021-08-04 2022-01-18 上海金蔚实业有限公司 一种工程机械用总线控制器
CN216491716U (zh) * 2021-11-19 2022-05-10 东软睿驰汽车技术（沈阳）有限公司 控制器的液冷结构及控制器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4417432A1 (de) * 1993-05-28 1994-12-01 Steyr Daimler Puch Ag Flüssigkeitsgekühlte Antriebseinheit für ein Elektromobil
CN106231871A (zh) * 2016-08-23 2016-12-14 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
CN107340729A (zh) * 2017-08-31 2017-11-10 合肥巨动力系统有限公司 一种基于小型集成的分腔式模块化控制器结构
EP3604049A1 (en) * 2018-08-03 2020-02-05 Aptiv Technologies Limited Secure vehicle control unit

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