WO2024017042A1 - 一种冷却装置、中央控制器和汽车 - Google Patents

一种冷却装置、中央控制器和汽车 Download PDF

Info

Publication number
WO2024017042A1
WO2024017042A1 PCT/CN2023/105308 CN2023105308W WO2024017042A1 WO 2024017042 A1 WO2024017042 A1 WO 2024017042A1 CN 2023105308 W CN2023105308 W CN 2023105308W WO 2024017042 A1 WO2024017042 A1 WO 2024017042A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
cooling
heat dissipation
plate
cooling device
Prior art date
Application number
PCT/CN2023/105308
Other languages
English (en)
French (fr)
Inventor
张贵海
付斌
陈晴
司华超
郭文韬
王泉
黄其光
冯飞
李月清
贾飞
Original Assignee
岚图汽车科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 岚图汽车科技有限公司 filed Critical 岚图汽车科技有限公司
Publication of WO2024017042A1 publication Critical patent/WO2024017042A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating

Definitions

  • the present disclosure belongs to the field of automobile integrated control technology, and in particular relates to a cooling device, a central controller and an automobile.
  • the central controller is the core component of electric vehicles, which usually includes control components such as motor controllers, vehicle controllers, vehicle management systems, and vehicle chargers. Integrating these control components into an integrated central controller circuit board requires a large area and cannot meet installation and modal requirements. If the circuit board of the central controller is divided into multi-layer circuit boards, the demand for cooling and heat dissipation will be high. Therefore, how to set up a cooling device to dissipate heat from the circuit board is an urgent problem to be solved in this field.
  • the present disclosure aims to solve the technical problem of heat dissipation of multi-layer circuit boards, at least to a certain extent. To this end, the present disclosure provides a cooling device, a central controller, and an automobile.
  • a cooling device includes: a cooling plate, including a cooling plate body and a cooling flow channel provided in the cooling plate body; and a first heat dissipation plate disposed on a first side of the cooling plate, the first heat dissipation plate Used to fit the first circuit board.
  • a central controller is also provided.
  • the central controller includes: a housing; the above-mentioned cooling device is provided in the housing to divide the housing into adjacent first a cavity and a second cavity; a first circuit board disposed in the first cavity; and a second circuit board disposed in the second cavity.
  • a car is also provided, and the car includes the above-mentioned central controller.
  • Figure 1 shows a schematic structural diagram of a central controller according to some embodiments of the present disclosure
  • Figure 2 shows an exploded view of the central controller in Figure 1;
  • Figure 3 shows a schematic structural diagram of the middle frame of the central controller housing in Figure 2;
  • Figure 4 shows a schematic structural diagram of the middle frame in Figure 3 from another angle
  • Figure 5 shows a schematic structural view of the first cover of the central controller housing in Figure 2;
  • Figure 6 shows a schematic structural view of the second cover of the central controller housing in Figure 2;
  • Figure 7 shows a schematic structural diagram of the cooling device of the central controller in Figure 2;
  • Figure 8 shows an exploded view of the cooling device in Figure 7;
  • Figure 9 shows a schematic diagram of the installation state of the cooling device in Figure 7 in the middle frame
  • Figure 10 shows an exploded view of the housing and cooling device of the central controller in Figure 2;
  • Figure 11 shows an exploded view of the housing of the central controller in Figure 2;
  • Figure 12 shows a schematic structural diagram of the first circuit board of the central controller in Figure 2;
  • FIG. 13 shows a schematic structural diagram of the second circuit board of the central controller in FIG. 2 .
  • Shell 100. Shell; 110. Middle frame; 111. Partition; 112. Side panels; 113. First middle frame electromagnetic shielding wall; 114. First electromagnetic radiation interruption part; 115. Cooling avoidance zone; 116. Connection 117. The electromagnetic shielding wall of the first connector; 118. The electromagnetic shielding wall of the second connector; 119. The electromagnetic shielding wall of the second middle frame; 120. The first cover; 121. The first cover Electromagnetic shielding wall; 130, second cover; 200, cooling device; 210, cooling plate; 211, cooling plate body; 212, cooling flow channel; 213, first positioning hole; 214, second positioning hole; 220.
  • Figure 1 shows a schematic structural diagram of a central controller according to some embodiments of the present disclosure
  • Figure 2 shows an exploded view of the central controller in Figure 1
  • Figure 8 shows an exploded view of the cooling device in Figure 7.
  • a cooling device 200 is provided. As shown in Figures 2 and 8, the cooling device 200 according to some embodiments may include: a cooling plate 210, including a cooling plate body 211 and a cooling plate disposed on the cooling plate. The cooling flow channel 212 in the body 210; and the first heat dissipation plate 220 is provided on the first side of the cooling plate 210, and the first heat dissipation plate 220 is used to fit the first circuit board 300.
  • the cooling device 200 may include a cooling plate 210 and a first heat dissipation plate 220 disposed on a first side of the cooling plate 210.
  • the cooling device 200 with a split structure can be used to control the first circuit through the first heat dissipation plate 220.
  • the plate 300 exchanges heat and can also isolate the cooling plate 210 from the first circuit board 300 through the first heat dissipation plate 220 to avoid damage to the first circuit board 300 caused by leakage of the cooling flow channel 212 provided in the cooling plate body 211. to protect the first circuit board 300 from damage.
  • FIGS. 2 to 8 show a schematic structural view of the middle frame of the housing of the central controller in Figure 2;
  • Figure 4 shows a schematic structural view of the middle frame in Figure 3 from another angle;
  • Figure 5 shows a schematic structural view of the middle frame in Figure 2 A schematic structural view of the first cover of the housing of the central controller;
  • Figure 6 shows a schematic structural view of the second cover of the housing of the central controller in Figure 2;
  • Figure 7 shows the central control in Figure 2 Structural diagram of the cooling device of the machine.
  • the cooling device 200 may further include: a second heat dissipation plate 230 disposed on the second side of the cooling plate 210 , and the second heat dissipation plate 230 is used for The second circuit board 400 is attached.
  • FIG. 9 shows a schematic diagram of the cooling device in FIG. 7 being installed in the middle frame.
  • the cooling device 200 may include:
  • the cooling plate 210 includes a cooling plate 210 body and a cooling flow channel 212 provided in the cooling plate 210 body;
  • the first heat dissipation plate 220 is provided on the first side of the cooling plate 210, and the first heat dissipation plate 220 is used to fit the first circuit board 300; and,
  • the second heat dissipation plate 230 is disposed on the second side of the cooling plate 210 , and the second heat dissipation plate 230 is used to fit the second circuit board 400 .
  • cooling device 200 It may include a cooling plate 210, a first heat dissipation plate 220 disposed on the first side of the cooling plate 210, and a second heat dissipation plate 230 disposed on the second side of the cooling plate 210.
  • the heat sink 220 exchanges heat with the first circuit board 300 and can also isolate the cooling plate 210 from the first circuit board 300 through the first heat sink 220 to avoid leakage of the cooling flow channel 212 provided in the cooling plate 210 body.
  • the second heat sink 230 can be used to exchange heat and dissipate heat from the second circuit board 400, and the second heat sink 230 can also be used to isolate the cooling plate 210 from the second circuit board 400 to avoid heat dissipation inside the cooling plate 210 body.
  • the leakage of the cooling flow channel 212 causes damage to the second circuit board 400 to protect the first circuit board 300 from damage.
  • the cooling device 200 can simultaneously cool the circuit boards located on both sides of the cooling device 200 through the first heat dissipation plate 220 and the second heat dissipation plate 230, avoiding the need to set up a separate cooling device 200 for each circuit board, reducing The number of cooling devices 200 and the space occupied are determined.
  • the cooling device 200 can meet the heat dissipation requirements of different circuit boards by changing the structures of the first heat dissipation plate 220 and the second heat dissipation plate 230 on both sides of the cooling plate 210, making the cooling plate 210 more applicable.
  • cooling water or refrigerant flows in the cooling flow channel 212 .
  • the central controller 1000 can be air-cooled for heat dissipation, mainly through air convection.
  • the natural air convection heat transfer efficiency is 5-25W/m2*K.
  • Larger cooling fins are required to meet the 85% requirement of the entire vehicle. °C heat dissipation requirements in harsh scenarios.
  • water cooling can be used for heat dissipation.
  • the forced convection coefficient of water cooling heat dissipation can reach 1000-15000W/m2*K. Therefore, using water cooling for heat dissipation can avoid using larger heat dissipation fins and reduce the overall size of the central controller 1000.
  • the volume is smaller and the heat exchange efficiency is higher, which can meet the heat dissipation needs of the entire vehicle in harsh environments.
  • the cooling flow channel 212 provided in the body of the cooling plate 210 is provided with a cooling inlet and a cooling outlet, and the cooling water path can be inserted from the entire vehicle.
  • the inlet water temperature is 55°C
  • the outlet water temperature is 100°C (the lowest junction temperature of the car chip is 105°C).
  • a rough calculation shows that the heat transfer amount of the cooling device 200 is: 900W ⁇ 13500W. Considering the heat transfer loss caused by the actual thermal conductive device, it can also meet the requirements of the future central controller 1000. 500W cooling requirement.
  • the first heat dissipation plate is provided with at least one first thermally conductive boss 222 on a side adjacent to the first circuit board 300 .
  • the first thermally conductive boss 222 222 is used to be attached to the heating element on the first circuit board 300; and/or, the second heat dissipation plate 230 is provided with at least one second thermally conductive boss on one side adjacent to the second circuit board 400.
  • the second thermally conductive boss 232 is used to fit on the heating element on the second circuit board 400.
  • the first heat dissipation plate 220 includes a first heat dissipation plate body 221 and at least one first thermal conductive boss 222 provided on the first heat dissipation plate body 221 , that is, At least one first thermal conductive boss 222 is provided on the side of the first heat sink body 221 adjacent to the first circuit board 300 .
  • the first thermal conductive boss 222 is used to fit on the first circuit board 300 on the heating element; and/or, the second heat dissipation plate 230 includes a second heat dissipation plate body 231 and at least one second heat conduction boss 232 provided on the second heat dissipation plate body 231, that is, on the second heat dissipation plate body 232 At least one second thermally conductive boss 232 is provided on the side of 231 adjacent to the second circuit board 400 . The second thermally conductive boss 232 is used to fit on the heating element on the second circuit board 400 .
  • the circuit board of the central controller 1000 adopts an integrated design. Not only are there many integrated chips on the circuit board, but also considering factors such as the layout area, the chip positions are different, the heights are different, and the amounts of heat are different, so the heat dissipation requirements are also different.
  • the cooling device 200 can perform point-selected cooling of the circuit board. For example, before performing structural actualization of the first heat sink 220 and the second heat sink 230, the first circuit board 300 and the second circuit board are first cooled. Each chip and component on the 400 is subjected to thermodynamic parameter simulation experiments, and the structural design of the first heat sink 220 and the second heat sink 230 is carried out according to the simulation results.
  • the main components on the first heat sink 220 and the first circuit board 300 are Corresponding first heat-conducting bosses 222 are provided at positions corresponding to the hot spots. Similarly, corresponding second heat-conducting bosses 232 are provided on the second heat dissipation plate 230 at positions corresponding to the main heating spots on the second circuit board 400 . In order to realize fixed-point heat dissipation of the first circuit board 300 and the second circuit board 400 through the first heat conduction boss 222 and the second heat conduction boss 232 respectively, so as to improve the heat dissipation efficiency.
  • the flow path of the cooling channel 212 in the cooling plate 210 at least passes through the first heat conductive boss 222 and/or the The second thermally conductive boss 232.
  • the position where the first thermal conductive boss 222 and the second thermal conductive boss 232 are provided is a position with high heat dissipation requirements.
  • the heat exchange efficiency of the plate 210 makes the flow path of the cooling channel 212 in the cooling plate 210 at least pass through the first heat conduction boss 222 and/or the second heat conduction boss 232, thereby achieving better heat radiation.
  • the cooling escape area 115 provided on the middle frame 110 can allow the first thermal conductive boss 222 or the second thermal conductive boss 232 to pass through it to dissipate heat from the circuit board.
  • a thermally conductive adhesive layer is provided between the first thermally conductive boss 222 and the first circuit board 300 , and/or, a thermally conductive adhesive layer is provided between the second thermally conductive boss 232 and the second circuit board 400 There is a thermal conductive adhesive layer between them.
  • the thermally conductive adhesive layer can be made of heat-dissipating silicone material with thermal conductivity.
  • a thermally conductive adhesive layer between the first thermally conductive boss 222 and the first circuit board 300 , and/or disposing a thermally conductive adhesive layer between the second thermally conductive boss 232 and the second circuit board 400 The layer can achieve flexible contact between each chip on the circuit board and the thermally conductive boss, thereby avoiding damage to the chip due to vibration and other reasons when each chip is in rigid contact with the thermally conductive boss.
  • the first heat dissipation plate 220 and the cooling plate 210 have first positioning holes 213 corresponding to the first heat dissipation plate 220 and the cooling plate 210 .
  • the first connecting piece is connected to the first positioning hole 213; and/or the second heat dissipation plate 230 has a second positioning hole 214 corresponding to the cooling plate 210, and the second heat dissipation plate 230 is connected to the first positioning hole 213.
  • the cooling plate 210 is connected to the second positioning hole 214 through a second connecting piece.
  • the first heat dissipation plate 220 can pass through the first positioning hole 213 through a first connecting piece to achieve a fixed connection between the first heat dissipating plate 220 and the cooling plate 210
  • the second heat dissipating plate 230 can pass through the second connecting piece.
  • the second heat dissipation plate 230 and the cooling plate 210 are fixedly connected through the second positioning hole 214 .
  • the first positioning hole 213 and the second positioning hole 214 may overlap, that is, a connecting member may pass through the first heat dissipation plate 220, the cooling plate 210 and the second heat dissipation plate in sequence. 230 realizes the positioning connection of the cooling device 200 .
  • the first heat dissipation plate 220 and/or the second heat dissipation plate 230 are fixed on the cooling plate 210 by brazing.
  • the first heat dissipation plate 220 and the second heat dissipation plate 230 can be pre-positioned on the cooling plate 210 through positioning pins, and then the first heat dissipation plate 220 and the second heat dissipation plate 230 can be fixed on the cooling plate 210 through brazing. on the cooling plate 210. Through brazing, the first heat conduction plate and the water cooling plate can be airtightly connected, and the second heat conduction plate and the water cooling plate can be airtightly connected.
  • the cooling flow channel 212 is surrounded by the first thermal conductive plate and the second thermal conductive plate to prevent leakage from the cooling flow channel 212 due to machining accuracy, vibration, etc. from entering the circuit board.
  • the first heat dissipation plate 220 and the second heat dissipation plate 230 can be pre-positioned on the cooling plate 210 through positioning pins, and then the first heat dissipation plate 220 and the second heat dissipation plate 230 can be fixed on the cooling plate 210 through brazing. on the cooling plate 210. Through brazing, the first heat dissipation plate 220 and the cooling plate 210 can be airtightly connected, and the second heat conduction plate and the water cooling plate can be airtightly connected.
  • the cooling flow channel 212 is surrounded by the first heat dissipation plate 220 and the second heat dissipation plate 230 to prevent leakage from the cooling flow channel 212 due to processing accuracy, vibration, etc. from affecting the circuit board.
  • the first thermally conductive boss 222 is fixed on the first heat dissipation plate 220 through soldering
  • the second thermally conductive boss 232 may be fixed on the second heat dissipation plate 230 through soldering.
  • the first heat dissipation plate 220 and the first heat conduction boss 222 adopt a split design, and the first heat conduction boss 222 can be flexibly arranged on the first heat dissipation plate 220 according to heat dissipation requirements; the same applies to the second heat dissipation plate 230 .
  • the heat dissipation block can be adjusted to maximize the reuse of molds and reduce production costs.
  • the cooling device 200 may be integrally connected to the middle frame 110 through a screwing relationship.
  • the first circuit board 300 and the second circuit board 400 can also be connected to the middle frame 110 through screw management, so that the first circuit board 300 and the second circuit board 400 are fixed on the middle frame 110 and passed through the cooling device. 200 for heat dissipation.
  • the middle frame 110 is provided with an assembly positioning portion corresponding to the cooling device 200 and an assembly positioning portion corresponding to the circuit board, so that the cooling device 200 and the circuit board can be accurately assembled to the middle frame 110 and cooling
  • the thermally conductive bosses of the device 200 correspond to the chips on the circuit board.
  • a central controller 1000 is provided according to the second aspect of the present disclosure.
  • the central controller 1000 may include: a housing 100 of the central controller 1000; a cooling device 200, disposed in the housing 100 to divide the housing 100 into adjacent first cavity Q1 and second cavity Q2; first circuit board 300, is disposed in the first cavity Q1; and a second circuit board 400 is disposed in the second cavity Q2.
  • the housing 100 of the central controller 1000 is divided into two cavities by the cooling device 200.
  • the cooling device 200 can be respectively attached to the first circuit board 300 in the first cavity Q1 and the second cavity.
  • the second circuit board 400 in the body Q2 is bonded together, so that the first circuit board 300 and the second circuit board 400 can be cooled and dissipated at the same time.
  • Figure 1 shows a schematic structural diagram of a central controller according to some embodiments of the present disclosure.
  • the housing 100 of the central controller 1000 may include: a cooling avoidance area 115 for arranging the cooling device 200 and for avoiding the cooling device 200 ;
  • a cover 120 is buckled on the first side of the middle frame 110 to form the first cavity Q1 between the first cover 120, the middle frame 110 and the cooling device 200;
  • the second cover 130 is buckled on the second side of the middle frame 110 to form the second cavity between the second cover 130 , the middle frame 110 and the cooling device 200 Body Q2.
  • the housing 100 is divided into at least a first cavity Q1 and a second cavity Q2 through the combination of the middle frame 110 and the first cover 120 and the second cover 130 .
  • the second cavity Q2 can integrate each control component of the central controller 1000 into at least two circuit boards with a smaller area, so that the circuit boards are arranged in parallel in the housing 100 of the central controller 1000, that is, reducing the The area of a single circuit board can facilitate the installation of the circuit board, and can also improve the mode of the circuit board and reduce the circuit board from bearing various vibrations and impact loads during work; at the same time, the circuit boards are arranged in parallel between the first cavity Q1 and In the second cavity Q2, it is possible to ensure that the housing 100 of the central controller 1000 is relatively compact, reducing the maximum front projection area of the housing 100, and facilitating the installation of the central controller 1000 in the car.
  • the housing 100 of the central controller 1000 may include a plurality of middle frames 110 arranged one above another.
  • the housing 100 of the central controller 1000 includes two stacked middle frames 110 , and a first cover 120 and a second cover 130 are respectively provided on both sides of the two stacked middle frames 110 .
  • the middle frame 110 divides the housing 100 into a first cavity Q1, a second cavity Q2, and a central cavity between the first cavity Q1 and the second cavity Q2, so that the housing of the central controller 1000 Three circuit boards can be set within 100.
  • the middle frame 110 may include a partition 111 and a side plate 112 surrounding the partition 111. .
  • the partition 111 of the middle frame 110 can divide the housing 100 into a first cavity Q1 and a second cavity Q2, thereby forming two installation spaces within the housing 100 for the central controller 1000 circuit board. setting.
  • the partition plate 111 and the side plates 112 of the middle frame 110 can be used to fix circuit boards, cooling devices 200 and other structures.
  • a connector avoidance area 116 is provided on the partition 111 to avoid inter-board connectors.
  • the housing 100 of the central controller 1000 is provided with a first cavity Q1 and a second cavity Q2, and the first circuit board 300 can be respectively disposed in the first cavity Q1 and the second cavity Q2. and the second circuit board 400.
  • the first circuit board 300 and the second circuit board 400 may be connected through an inter-board connector.
  • a connector avoidance area 116 is provided on the partition 111 so that the inter-board connectors can smoothly pass through the middle frame 110 and be connected to the first circuit board 300 and the second circuit board 400 respectively.
  • the inter-board connector can use a 3cm high-speed inter-board connector, which not only achieves miniaturization of the projected area but also achieves an overall communication efficiency of >8Gbps.
  • the partition 111 is provided with a cooling avoidance area 115 that avoids the cooling device 200 .
  • the circuit board of the central controller 1000 integrates a variety of chips, so the circuit board generates a large amount of heat, and a corresponding cooling device 200 needs to be provided to dissipate heat from the circuit board.
  • the cooling device 200 may be separately provided for the first circuit board 300 and the second circuit board 400 for heat dissipation.
  • a cooling device 200 is provided in the housing 100 of the central controller 1000 to simultaneously dissipate heat from the first circuit board 300 and the second circuit board 400 .
  • the cooling device 200 can be disposed on the first side or the second side of the middle frame 110 , and can dissipate heat to the circuit board on the other side of the middle frame 110 through the cooling area on the partition 111 of the middle frame 110 .
  • the partition 111 of the middle frame 110 realizes the connection between the first side and the second side of the middle frame 110 by opening connector avoidance areas 116, cooling avoidance areas 115 and other avoidance areas to facilitate the installation of inter-board connectors and cooling.
  • Device 200 and other structures retain part of the partition 111 for fixing circuit boards, cold zone devices and other structures, and can enhance the structural strength of the middle frame 110 Spend.
  • the middle frame 110 can also be provided with only a surrounding wall without a partition 111 to facilitate the installation of the inter-board connector and the cooling device 200; in some embodiments, there can be a fixed wall on the surrounding wall.
  • the mounting portion of the circuit board and the cooling device 200 facilitates the installation of the circuit board and the cooling device 200 in the housing 100 of the central controller 1000 .
  • the housing 100 of the central controller 1000 may further include: a connecting frame 500 , which is detachably provided on the middle frame 110 , the first cover 120 or the second cover. Body 130 on.
  • the housing 100 of the central controller 1000 in order to adapt to different vehicle models, it is necessary to provide the housing 100 of the central controller 1000 with different structures.
  • the connecting frame 500 by detachably arranging the connecting frame 500 and fixing the housing 100 of the central controller 1000 in the car through the connecting frame 500, the housing 100 of the central controller 1000 can be applied across different vehicle models, targeting different vehicles.
  • Different vehicle models are configured with connecting frames 500.
  • connecting frame 500 When applying across vehicle models, only the connecting frame 500 that matches the model needs to be replaced, which reduces the production cost of the central controller 1000 and improves economic benefits.
  • first electromagnetic shielding layers are provided on both sides of the first circuit board 300; second electromagnetic shielding layers are provided on both sides of the second circuit board 400;
  • a first middle frame electromagnetic shielding wall 113 is provided on the first side of the middle frame 110, and a second middle frame electromagnetic shielding wall 119 is provided on the second side of the middle frame 110;
  • a first cover electromagnetic shielding wall 121 is provided on the inner side of the first cover 120 and buckled on the first side of the middle frame 110, so that the first cover electromagnetic shielding wall 121 is connected to the first side of the middle frame 110.
  • the first middle frame electromagnetic shielding wall 113 is in contact with each other; and,
  • a second electromagnetic shielding wall is disposed inside the second cover 130 and buckled on the second side of the middle frame 110 so that the second cover 130 is connected to the electromagnetic shielding wall.
  • the electromagnetic shielding walls 119 of the second middle frame are in contact with each other.
  • the first circuit board 300 is realized.
  • the inter-board electromagnetic shielding of the second circuit board 400 also realizes electromagnetic shielding to the surface of the central controller 1000; in some embodiments, the controller casing 100 is also provided with mutually matched electromagnetic shielding walls, through electromagnetic The cooperation of the shielding walls realizes electromagnetic shielding around the central controller 1000, thus achieving full shielding of the circuit board.
  • the first circuit board 300 forms an all-round three-dimensional electromagnetic shielding by the first cover 120 , the middle frame 110 and the first circuit board 300 itself
  • the second circuit board 400 consists of the second cover 130 , the middle frame 110 and the first circuit board 300 itself.
  • the frame 110 and the second circuit board 400 themselves form an all-round three-dimensional electromagnetic shielding.
  • the electromagnetic shielding layer provided on the circuit board can also be replaced by providing an electromagnetic shielding layer on the surface of the housing 100 corresponding to the surface of the circuit board.
  • an electromagnetic shielding layer of the first cover 120 is provided on the inside of the first cover 120
  • an electromagnetic shielding layer of the first middle frame 110 is provided on the first side of the middle frame 110 to replace both sides of the first circuit board 300 .
  • the first electromagnetic shielding layer on the side; similarly, the second cover 130 is provided with an electromagnetic shielding layer on the inside of the second cover 130, and the second electromagnetic shielding layer of the second middle frame 110 is provided on the second side of the middle frame 110 to replace the third electromagnetic shielding layer.
  • the second electromagnetic shielding layer on both sides of the second circuit board 400 is provided on the inside of the first cover 120
  • an electromagnetic shielding layer of the first middle frame 110 is provided on the first side of the middle frame 110 to replace both sides of the first circuit board 300 .
  • the first electromagnetic shielding layer on the side; similarly, the second cover 130 is provided with an electromagnetic shielding layer on
  • the cooling device 200 may not be provided, that is, the cooling avoidance area 115 is not provided on the partition 111 of the middle frame 110, so that the cooling device 200 can be installed in the middle frame 110.
  • a complete first electromagnetic shielding layer and a second electromagnetic shielding layer of the middle frame 110 are formed on the partition 111 of the frame 110 .
  • a cooling device 200 needs to be provided, and a cooling escape area 115 needs to be set up on the partition 111 of the middle frame 110.
  • the area 115 has an electromagnetic shielding function, so an electromagnetic shielding layer can be provided on any one or several plate structures of the cooling plate 210, the first heat dissipation plate 220 and the second heat dissipation plate 230 of the cooling device 200 to replace the middle frame 110.
  • An electromagnetic shielding layer is used to realize electromagnetic shielding between the first circuit board 300 and the second circuit board 400 .
  • the first cover 120 electromagnetic shielding layer, the first cover electromagnetic shielding wall 121, the first middle frame 110 electromagnetic shielding layer and the first middle frame electromagnetic shielding wall 113 form an electromagnetic shielding layer for the first circuit board 300.
  • the first circuit board 300, the second circuit board 400 and other devices can be electromagnetically isolated, thereby achieving electromagnetic shielding of the first circuit board 300.
  • the electromagnetic shielding of the second circuit board 400 is the same as that of the first circuit board 300 and will not be described again here.
  • Figure 10 shows an exploded view of the housing and cooling device of the central controller in Figure 2, the first middle frame electromagnetic shielding wall 113 is connected to the between the electromagnetic shielding walls 121 of the first cover A first electromagnetic radiation interruption part 114 is provided; a second electromagnetic radiation interruption part is provided between the electromagnetic shielding wall of the second middle frame 110 and the electromagnetic shielding wall of the second cover 130 .
  • the present disclosure provides a first electromagnetic radiation interruption part. 114 and the second electromagnetic radiation interruption part, thereby forming an electromagnetic shielding grid structure between the middle frame 110 and the first cover 120 and between the middle frame 110 and the second cover 130, allowing the electromagnetic field to pass through the electromagnetic shielding grid structure Eddy currents are generated when the electromagnetic field is internally offset, ultimately achieving an electromagnetic shielding effect.
  • the distance between adjacent first electromagnetic radiation interrupting parts 114 is 8 cm to 12 cm; the distance between adjacent second electromagnetic radiation interrupting parts 114 The distance between the broken parts is 8cm ⁇ 12cm. In some embodiments, the distance between adjacent first electromagnetic radiation interrupting parts 114 is 10 cm; the distance between adjacent second electromagnetic radiation interrupting parts is 10 cm.
  • the first harmonic frequency of the vehicle device signal frequency is ⁇ 2GHz.
  • ⁇ cutoff 2a, where a is the shielding wall aperture.
  • the first electromagnetic radiation interruption part 114 may include a metal protrusion provided on the side wall of the first side of the middle frame 110 and/or provided on the side of the first cover 120 Metal protrusions on the wall; the second electromagnetic radiation interruption part includes metal protrusions provided on the side wall of the second side of the middle frame 110 and/or provided on the side wall of the second cover 130 metal bumps on the.
  • metal protrusions are provided on each side wall of the housing 100 to form a similar metal grid structure on each side wall of the housing 100 to isolate the central control unit through the metal grid structure.
  • the external electromagnetic radiation of the device 1000 is provided on each side wall of the housing 100 to form a similar metal grid structure on each side wall of the housing 100 to isolate the central control unit through the metal grid structure.
  • first electromagnetic shielding layers are provided on both sides of the first circuit board 300; and second electromagnetic shielding layers are provided on both sides of the second circuit board 400.
  • first electromagnetic shielding layers are respectively provided on both sides of the first circuit board 300 to achieve external electromagnetic radiation shielding on the upper and lower surfaces of the first circuit board 300, and then the first cover electromagnetic shielding wall 121 and The first middle frame electromagnetic shielding wall 113 achieves shielding of external electromagnetic radiation around the first circuit board 300; similarly, second electromagnetic shielding layers are respectively provided on both sides of the second circuit board 400 to achieve shielding of the second circuit board.
  • the upper and lower surfaces of the second circuit board 400 are shielded from external electromagnetic radiation, and the second cover 130 and the second middle frame electromagnetic shielding wall 119 are used to shield the surroundings of the second circuit board 400 from external electromagnetic radiation.
  • FIG. 12 shows a schematic structural diagram of the first circuit board 300 of the central controller 1000 in FIG. 2 ;
  • FIG. 13 shows a schematic structural diagram of the second circuit board 400 of the central controller 1000 in FIG. 2 .
  • the edge of the first circuit board 300 is provided with a first edge electromagnetic shielding wire 310 ; the edge of the second circuit board 400 is provided with a second edge electromagnetic shielding wire 310 .
  • Edge electromagnetic shielding wire 410 is provided.
  • the first edge electromagnetic shielding wire 310 is in contact with the first cover electromagnetic shielding wall 121 or the first middle frame electromagnetic shielding wall 113; the second edge electromagnetic shielding wire 410 is in contact with the second cover body.
  • the electromagnetic shielding wall 130 or the electromagnetic shielding wall 119 of the second middle frame is in contact with each other.
  • an inter-board connector is provided between the first circuit board 300 and the second circuit board 400; accordingly, the middle frame 110 is provided with a connection
  • the first side of the middle frame 110 is provided with a first connector electromagnetic shielding surrounding wall 117 around the connector avoidance area 116, and the second side of the middle frame 110 is surrounded by the connector avoidance area.
  • 116 is provided with a second connector electromagnetic shielding wall 118 .
  • connector electromagnetic shield lines are provided on the first circuit board 300 and the second circuit board 400 at corresponding positions surrounding the connector avoidance area 116 .
  • a first connector electromagnetic shielding wall is provided on the middle frame 110 around the connector avoidance area 116.
  • 117 is in contact with the connector electromagnetic screen wire located on the first circuit board 300
  • a third connector avoidance area 116 is provided on the middle frame 110.
  • the two connector electromagnetic shielding walls 118 are in contact with the connector electromagnetic screen wires located on the second circuit board 400, thereby covering the inter-board connectors therein to avoid inter-board electromagnetic interference.
  • the electromagnetic shielding wall and the electromagnetic shielding layer are made of metal materials. Electromagnetic shielding is achieved through metal materials. In some embodiments, the metallic material may be copper.
  • a car is also provided according to the third aspect of the present disclosure, and the car may include the above-mentioned central controller 1000.
  • the cooling device provided by the embodiments of the present disclosure includes a cooling plate and a first heat dissipation plate disposed on the first side of the cooling plate.
  • the cooling device with a split structure can use the first heat dissipation plate to The first circuit board exchanges heat and can also isolate the cooling plate from the first circuit board through the first heat dissipation plate to avoid damage to the first circuit board caused by leakage of the cooling flow channel provided in the cooling plate body to protect the first circuit board.
  • the circuit board is protected from damage.
  • the cooling device provided by the embodiment of the present disclosure also includes a second heat dissipation plate disposed on the second side of the cooling plate.
  • the first heat dissipation plate and the second heat dissipation plate can be aligned with each other at the same time.
  • the circuit boards on both sides of the device are cooled, which avoids the need to set up separate cooling devices for each circuit board, reducing the number of cooling devices and the space occupied.
  • the car provided by the present invention includes the central controller of the above technical solution, the car provided by the present invention has all the beneficial effects of the above central controller, which will not be described again here.
  • a first feature "on” or “below” a second feature may include the first and second features in direct contact, or may include the first and second features. Not in direct contact but through additional characteristic contact between them.
  • the terms “above”, “above” and “above” a first feature on a second feature include the first feature being directly above and diagonally above the second feature, or simply mean that the first feature is higher in level than the second feature.
  • “Below”, “under” and “under” the first feature is the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature is less horizontally than the second feature.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.
  • fixing can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种冷却装置(200)，包括：冷却板(210)，包括冷却板本体(211)和设置在冷却板(210)体内的冷却流道(212)；第一散热板(220)，设置在冷却板(210)的第一侧，用于贴合第一电路板(300)。

Description

一种冷却装置、中央控制器和汽车
相关申请的交叉引用
本申请要求于2022年07月20日提交的申请号为202210861586.5的中国专利申请的优先权，其全部内容通过引用并入本文。
技术领域
本公开属于汽车集成控制技术领域，尤其涉及一种冷却装置、中央控制器和汽车。
背景技术
中央控制器是电动汽车的核心部件，其通常包括电机控制器、整车控制器、整车管理系统和车载充电机等控制部件。将这些控制部件集成为一体式中央控制器电路板时需占用的面积较大，无法满足安装、模态要求。若将中央控制器的电路板分设为多层电路板，则对冷却散热需求较高。因此，如何设置冷却装置以对电路板进行散热是本领域亟待解决的问题。
发明内容
本公开旨在至少能够在一定程度上解决多层电路板散热的技术问题。为此，本公开提供了一种冷却装置、中央控制器和汽车。
依据本公开的第一方面，提供了一种冷却装置。所述冷却装置包括：冷却板，包括冷却板本体和设置在所述冷却板体内的冷却流道；以及，第一散热板，设置在所述冷却板的第一侧，所述第一散热板用于贴合第一电路板。
依据本公开第二方面，还提供了一种中央控制器，所述中央控制器包括：壳体；上述的冷却装置，设置在所述壳体内以将所述壳体分割为相邻的第一腔体和第二腔体；第一电路板，设置在所述第一腔体中；以及第二电路板，设置在所述第二腔体中。
依据本公开第三方面，还提供了一种汽车，所述汽车包括上述的中央控制器。
附图说明
为了更清楚地说明本公开实施方式中的技术方案，下面将对实施方式描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本公开的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出了依据本公开一些实施方式的中央控制器的结构示意图；
图2示出了图1中的中央控制器的爆炸图；
图3示出了图2中的中央控制器的壳体的中框的结构示意图；
图4示出了图3中的中框的另一角度的结构示意图；
图5示出了图2中的中央控制器的壳体的第一盖体的结构示意图；
图6示出了图2中的中央控制器的壳体的第二盖体的结构示意图；
图7示出了图2中的中央控制器的冷却装置的结构示意图；
图8示出了图7中的冷却装置的爆炸图；
图9示出了图7中的冷却装置在中框中的安装状态示意图；
图10示出了图2中的中央控制器的壳体和冷却装置的爆炸图；
图11示出了图2中的中央控制器的壳体的爆炸图；
图12示出了图2中的中央控制器的第一电路板的结构示意图；
图13示出了图2中的中央控制器的第二电路板的结构示意图。
附图标记：
100、壳体；110、中框；111、隔板；112、侧板；113、第一中框电磁屏蔽围壁；114、第一电磁辐射打断部；115、冷却避让区；116、连接器避让区；117、第一连接器电磁屏蔽围壁；118、第二连接器电磁屏蔽围壁；119、第二中框电磁屏蔽围壁；120、第一盖体；121、第一盖体电磁屏蔽围壁；130、第二盖体；200、冷却装置；210、冷却板；211、冷却板本体；212、冷却流道；213、第一定位孔；214、第二定位孔；220、第一散热板；221、第一散热板本体；222、第一导热凸台；230、第二散热板；231、第二散热板本体；232、第二导热凸台；300、第一电路板；310、第一边沿电磁屏蔽线；400、第二电路板；410、第二边沿电磁屏蔽线；500、连接架；1000、中央控制器；Q1、第一腔体；Q2、第二腔体。
具体实施方式
下面将结合本公开实施方式中的附图，对本公开实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本公开的一部分实施方式，而不是全部的实施方式。基于本公开中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本公开保护的范围。
此外，本公开可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本公开提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
下面结合附图并参考具体实施方式描述本公开：
图1示出了依据本公开一些实施方式的中央控制器的结构示意图；图2示出了图1中的中央控制器的爆炸图；图8示出了图7中的冷却装置的爆炸图。
依据本公开第一方面提供了一种冷却装置200，如图2和图8所示，根据一些实施方式的冷却装置200可以包括：冷却板210，包括冷却板本体211和设置在所述冷却板210体内的冷却流道212；以及，第一散热板220，设置在所述冷却板210的第一侧，所述第一散热板220用于贴合第一电路板300。
在一些实施方式中，冷却装置200可以包括冷却板210和设置在冷却板210第一侧的第一散热板220，通过分体式结构的冷却装置200即能够通过第一散热板220对第一电路板300进行交换散热，还能够通过第一散热板220将冷却板210与第一电路板300隔绝开，避免设置在冷却板本体211内的冷却流道212泄漏导致第一电路板300的损伤，以保护第一电路板300免受损害。
图3示出了图2中的中央控制器的壳体的中框的结构示意图；图4示出了图3中的中框的另一角度的结构示意图；图5示出了图2中的中央控制器的壳体的第一盖体的结构示意图；图6示出了图2中的中央控制器的壳体的第二盖体的结构示意图；图7示出了图2中的中央控制器的冷却装置的结构示意图。在一些实施方式中，如图2至图8所示，冷却装置200还可以包括：第二散热板230，设置在所述的冷却板210的第二侧，所述第二散热板230用于贴合第二电路板400。
图9示出了图7中的冷却装置在中框中的安装状态示意图。在一些实施方式中，如图7至图9所示，冷却装置200可以包括：
冷却板210，包括冷却板210本体和设置在所述冷却板210体内的冷却流道212；
第一散热板220，设置在所述冷却板210的第一侧，所述第一散热板220用于贴合第一电路板300；以及，
第二散热板230，设置在所述的冷却板210的第二侧，所述第二散热板230用于贴合第二电路板400。
随着中央控制器1000中的电路板的集成度增高，且对高算力AI芯片的需求增加，中央控制器1000对散热的需求也相应增加以避免电器热害。在一些实施方式中，冷却装置200 可以包括冷却板210、设置在冷却板210第一侧的第一散热板220以及设置在冷却板210第二侧的第二散热板230，通过分体式结构的冷却装置200，即能够通过第一散热板220对第一电路板300进行交换散热，还能够通过第一散热板220将冷却板210与第一电路板300隔绝开，避免设置在冷却板210本体内的冷却流道212泄漏导致第一电路板300的损伤，以保护第一电路板300免受损害。同理，能够通过第二散热板230对第二电路板400进行交换散热，还能够通过第二散热板230将冷却板210与第二电路板400隔绝开，避免设置在冷却板210本体内的冷却流道212泄漏导致第二电路板400的损伤，以保护第一电路板300免受损害。
在一些实施方式中，冷却装置200可以通过第一散热板220和第二散热板230同时对位于冷却装置200两侧的电路板进行冷却，避免了针对各个电路板需要单独设置冷却装置200，减少了冷却装置200的数量和占用的空间。
在一些实施方式中，冷却装置200可以通过更换冷却板210两侧的第一散热板220和第二散热板230的结构以满足不同电路板的散热需求，使冷却板210的适用范围更广，
在一些实施方式的冷却装置200中，冷却流道212中流通有冷却水或制冷剂。
在相关技术中，中央控制器1000可以采用风冷散热，主要以空气对流方式进行散热，空气自然对流换热效率5-25W/㎡*K，需要使用较大的散热翅片才能满足整车85℃恶劣场景下的散热需求。而在一些实施方式中，可以采用水冷散热，水冷散热的强制对流系数可以达到1000-15000W/㎡*K，因此采用水冷散热既能够避免使用较大的散热翅片，缩小中央控制器1000的整体体积，而且换热效率更高，能够满足整车恶劣环境下的散热需求。
在一些实施方式中，如图7至图9所示，设置在所述冷却板210体内的冷却流道212设有冷却入口和冷却出口，可以从整车介入冷却水路。按照最小流速1L/min，入口水温55℃，出口水温100℃(车规芯片最低结温105℃)，例如该冷却板210的换热面积为0.2m2，可以通过公式Q＝K水×0.2×45(K水1000-15000W/㎡×K)粗算得出该冷却装置200的换热量为：900W～13500W，考虑实际导热器件导致的传热折损，也可以满足未来中央控制器1000的500W的散热需求。
在一些实施方式中，如图7至图9所示，所述第一散热板邻近所述第一电路板300的一侧设有至少一个第一导热凸台222，所述第一导热凸台222用于贴合在所述第一电路板300上的发热元件上；和/或，所述第二散热板230邻近所述第二电路板400的一侧设有至少一个第二导热凸台232，所述第二导热凸台232用于贴合在所述第二电路板400上的发热元件上。
在一些实施方式中，如图7至图9所示，所述第一散热板220包括第一散热板本体221和设置在第一散热板本体221上的至少一个第一导热凸台222，即在第一散热板本体221邻近所述第一电路板300的一侧设有至少一个第一导热凸台222，所述第一导热凸台222用于贴合在所述第一电路板300上的发热元件上；和/或，所述第二散热板230包括第二散热板本体231和设置在第二散热板本体231上的至少一个第二导热凸台232，即在第二散热板本体231邻近所述第二电路板400的一侧设有至少一个第二导热凸台232，所述第二导热凸台232用于贴合在所述第二电路板400上的发热元件上。
中央控制器1000的电路板采用集成设计，不仅电路板上集成芯片较多，且考虑布板面积等因素则芯片位置不同、高度不同、发热量不同，故而对散热需求也不同。在一些实施方式中，冷却装置200可以对电路板进行选点冷却，例如，在对第一散热板220和第二散热板230进行结构实际前，先对第一电路板300和第二电路板400上各芯片、元器件进行热力学参数仿真实验，从而根据仿真结果对第一散热板220和第二散热板230进行结构设计，在第一散热板220上与第一电路板300上的主要发热点对应位置设置相应的第一导热凸台222，同理，在第二散热板230上与第二电路板400上的主要发热点对应位置设置相应的第二导热凸台232。以实现通过第一导热凸台222和第二导热凸台232分别对第一电路板300和第二电路板400实现定点散热，以提高散热效率。
在一些实施方式中，如图7至图9所示，一些实施方式中所述冷却流道212在所述冷却板210内的流经途径至少经过所述第一导热凸台222和/或所述第二导热凸台232。
在一些实施方式中，设有第一导热凸台222和第二导热凸台232的位置是对散热需求较高的位置，为了进一步提高第一导热凸台222、第二导热凸台232与冷却板210的换热效率，使冷却流道212在所述冷却板210内的流经途径至少经过所述第一导热凸台222和/或所述第二导热凸台232，从而达到更好的散热效果。相应的，中框110上开设的冷却避让区115能够供第一导热凸台222或第二导热凸台232穿设于其中以对电路板进行散热。
在一些实施方式中，所述第一导热凸台222与所述第一电路板300之间设有导热胶层，和/或，所述第二导热凸台232与所述第二电路板400之间设有导热胶层。
在一些实施方式中，导热胶层可以采用具有导热功能的散热硅胶材料制备而成。通过在第一导热凸台222与所述第一电路板300之间设有导热胶层，和/或，所述第二导热凸台232与所述第二电路板400之间设有导热胶层，能够实现电路板上各芯片与导热凸台的柔性接触，从而能够避免各芯片与导热凸台刚性接触下由于振动等原因导致芯片损伤。
在一些实施方式中，如图7至图9所示，所述第一散热板220与所述冷却板210对应开设有第一定位孔213，所述第一散热板220与所述冷却板210通过第一连接件和所述第一定位孔213连接；和/或，所述第二散热板230与所述冷却板210对应开设有第二定位孔214，所述第二散热板230与所述冷却板210通过第二连接件和所述第二定位孔214连接。
在一些实施方式中，第一散热板220能够通过第一连接件穿过第一定位孔213实现第一散热板220与冷却板210的固定连接，第二散热板230能够通过第二连接件穿过第二定位孔214实现第二散热板230与冷却板210的固定连接。在一些实施方式中，在某些情况下，第一定位孔213和第二定位孔214可以重叠，即，通过一个连接件可以依次穿过第一散热板220、冷却板210以及第二散热板230实现冷却装置200的定位连接。
在一些实施方式中，所述第一散热板220和/或所述第二散热板230通过钎焊固定在所述冷却板210上。
在一些实施方式中，可以首先通过定位销将第一散热板220和第二散热板230预先定位在冷却板210上，进而可以通过钎焊将第一散热板220和第二散热板230固定在冷却板210上。通过钎焊可以使第一导热板与水冷板之间密闭连接、第二导热板与水冷板之间密闭连接。通过第一导热板和第二导热板将冷却流道212围设在其中，避免由于加工精度、振动等原因冷却流道212产生的泄漏进入电路板。
在一些实施方式中，可以首先通过定位销将第一散热板220和第二散热板230预先定位在冷却板210上，进而可以通过钎焊将第一散热板220和第二散热板230固定在冷却板210上。通过钎焊可以使第一散热板220与冷却板210之间密闭连接、第二导热板与水冷板之间密闭连接。通过第一散热板220和第二散热板230将冷却流道212围设在其中，避免由于加工精度、振动等原因冷却流道212产生的泄漏影响电路板。
在一些实施方式中，第一导热凸台222通过钎焊固定在第一散热板220上，第二导热凸台232可以通过钎焊固定在第二散热板230上。
在一些实施方式中，第一散热板220与第一导热凸台222采用分体式设计，第一导热凸台222可以根据散热需求灵活设置在第一散热板220上；第二散热板230同理。以实现在电路板结构变更后可以提供调整散热块实现最大程度的复用模具，降低生产成本。
在一些实施方式中，如图2和图9所示，冷却装置200可以通过螺接关系整体连接到中框110上。相应的，第一电路板300和第二电路板400也可以通过螺接管理连接到中框110上，以使第一电路板300和第二电路板400固定在中框110上并通过冷却装置200进行散热。
在一些实施方式中，中框110上设有与冷却装置200对应的装配定位部、与电路板对应的装配定位部，进而使冷却装置200和电路板能够准确装配至中框110上并且使冷却装置200的导热凸台与电路板上的芯片相对应。
基于同样的发明构思，依据本公开第二方面还了一种中央控制器1000，如图1至图6所示，中央控制器1000可以包括：中央控制器1000的壳体100；冷却装置200，设置在所述壳体100内以将所述壳体100分割为相邻的第一腔体Q1和第二腔体Q2；第一电路板300， 设置在所述第一腔体Q1中；以及第二电路板400，设置在所述第二腔体Q2中。
在一些实施方式中，中央控制器1000的壳体100被冷却装置200分割为两个腔体，冷却装置200可以分别与第一腔体Q1内的第一电路板300贴合、与第二腔体Q2内的第二电路板400贴合，从而可以同时对第一电路板300和第二电路板400进行冷却散热。
图1示出了依据本公开一些实施方式的中央控制器的结构示意图。
在一些实施方式中，如图1至图6所示，中央控制器1000的壳体100可以包括：用于设置所述冷却装置200并开设有避让所述冷却装置200的冷却避让区115；第一盖体120，扣设在所述中框110的第一侧，以在所述第一盖体120、所述中框110以及所述冷却装置200之间形成所述第一腔体Q1；以及，第二盖体130，扣设在所述中框110的第二侧，以在所述第二盖体130、所述中框110以及所述冷却装置200之间形成所述第二腔体Q2。
在一些实施方式中，通过中框110与第一盖体120、第二盖体130的组合，将壳体100至少分割为第一腔体Q1和第二腔体Q2，通过第一腔体Q1和第二腔体Q2可以将中央控制器1000的各控制部件至少集成为两个面积较小的电路板，使电路板呈平行地设置在中央控制器1000的壳体100内，即减小了单个电路板的面积，可以方便电路板的安装，又可以改善电路板的模态，减少电路板在工作过程中承受各类振动和冲击载荷；同时，电路板平行设置在第一腔体Q1和第二腔体Q2内，能够确保中央控制器1000的壳体100的体积较为紧凑，减小壳体100的最大正投影面积，方便中央控制器1000在汽车内的设置。
在一些实施方式中，在其他实施方式中，中央控制器1000的壳体100可以包括若干依次叠设设置的中框110。例如，在中央控制器1000的壳体100中包括两个叠设的中框110，进而在两个叠设的中框110两侧分别设置第一盖体120和第二盖体130，通过两个中框110将壳体100分割为第一腔体Q1、第二腔体Q2以及位于第一腔体Q1和第二腔体Q2之间的中央腔体，以使中央控制器1000的壳体100内可以设置三个电路板。
在一些实施方式中，在中央控制器1000的壳体100中，如图3和图4所示，所述中框110可以包括隔板111和围设在所述隔板111上的侧板112。
在一些实施方式中，中框110的隔板111能够将壳体100分割为第一腔体Q1和第二腔体Q2，从而在壳体100内形成两个安装空间供中央控制器1000电路板的设置。在一些实施方式中，中框110的隔板111和侧板112可以用于固定电路板、冷却装置200等结构。
在一些实施方式中，如图3和图4所示，所述隔板111上开设有避让板间连接器的连接器避让区116。
在一些实施方式中，中央控制器1000的壳体100内设有第一腔体Q1和第二腔体Q2，可以在第一腔体Q1和第二腔体Q2内分别设置第一电路板300和第二电路板400，第一电路板300和第二电路板400可以通过板间连接器连接。在隔板111上开设有连接器避让区116，能够使板间连接器顺利穿过中框110分别与第一电路板300和第二电路板400连接。
在一些实施方式中，板间连接器可以采用3cm的高速板间连接器，实现投影面积小型化的同时也达成了总体>8Gbps的通讯效率。
在一些实施方式中，如图3和图4所示，所述隔板111开设有避让冷却装置200的冷却避让区115。
中央控制器1000的电路板集成有多种芯片，因此电路板的产热量较大，需要设置相应的冷却装置200以对电路板进行散热。可以针对第一电路板300和第二电路板400分别单独设置冷却装置200进行散热。为了使中央控制器1000整体的结构更为简单，在中央控制器1000的壳体100内设置一个冷却装置200同时对第一电路板300和第二电路板400进行散热。在一些实施方式中，冷却装置200可以设置在中框110的第一侧或第二侧，并可以通过中框110的隔板111上冷却区对中框110另一侧的电路板进行散热。
在一些实施方式中，中框110的隔板111通过开设连接器避让区116、冷却避让区115等避让区域实现中框110第一侧和第二侧的连通以方便设置板间连接器和冷却装置200等结构，保留部分隔板111用于固定电路板、冷区装置等结构，并且可以增强中框110的结构强 度。
在其他实施方式中，中框110也可以仅设置围壁而不设有隔板111，方便板间连接器和冷却装置200的设置；在一些实施方式中，可以在围壁上设有用于固定电路板和冷却装置200的安装部以方便在中央控制器1000的壳体100内设置电路板和冷却装置200。
在一些实施方式中，如图2所示，中央控制器1000的壳体100还可以包括：连接架500，可拆卸地设置在所述中框110、第一盖体120或所述第二盖体130上。
在相关技术中，为了适配不同的车型，需要设置不同结构的中央控制器1000的壳体100。在一些实施方式中，通过可拆卸地设置连接架500并通过连接架500将中央控制器1000的壳体100固定在汽车中，能够使中央控制器1000的壳体100跨车型应用，针对不同的车型配置不同的连接架500，跨车型应用时只需要更换与车型适配的连接架500即可，降低了中央控制器1000的生产成本，提高了经济效益。
在一些实施方式中，所述第一电路板300的两侧分别设有第一电磁屏蔽层；所述第二电路板400的两侧分别设有第二电磁屏蔽层；
所述中框110的第一侧设有第一中框电磁屏蔽围壁113，所述中框110的第二侧设有第二中框电磁屏蔽围壁119；
所述第一盖体120的内侧设有第一盖体电磁屏蔽围壁121且扣设在所述中框110的第一侧，以使所述第一盖体电磁屏蔽围壁121与所述第一中框电磁屏蔽围壁113相抵接；以及，
所述第二盖体130的内侧设有第二盖体130电磁屏蔽围壁且扣设在所述中框110的第二侧，以使所述第二盖体130电磁屏蔽围壁与所述第二中框电磁屏蔽围壁119相抵接。
在一些实施方式中，通过在第一电路板300的两侧分别设有第一电磁屏蔽层；在第二电路板400的两侧分别设有第二电磁屏蔽层，即实现第一电路板300、第二电路板400的板间电磁屏蔽，又实现了向中央控制器1000表面的电磁屏蔽；在一些实施方式中，控制器的壳体100还设有相互配合的电磁屏蔽围壁，通过电磁屏蔽围壁的配合实现了向中央控制器1000四周的电磁屏蔽，从而实现电路板全屏蔽。即在一些实施方式中，第一电路板300由第一盖体120、中框110以及第一电路板300本身形成全方位立体的电磁屏蔽，第二电路板400由第二盖体130、中框110以及第二电路板400本身形成全方位立体的电磁屏蔽，通过电路板与壳体100的配合实现电路板间的电磁屏蔽和中央控制器1000向外的电磁屏蔽。
在一些实施方式中，在其他实施方式中，也可以通过在壳体100上与电路板表面对应壳体100表面设置电磁屏蔽层替代电路板上设置的电磁屏蔽层。例如，所述第一盖体120的内侧设有第一盖体120电磁屏蔽层，所述中框110的第一侧设有第一中框110电磁屏蔽层，以替代第一电路板300两侧的第一电磁屏蔽层；同理，第二盖体130的内侧设有第二盖体130电磁屏蔽层，中框110的第二侧设有第二中框110电磁屏蔽层，以替代第二电路板400两侧的第二电磁屏蔽层。在一些实施方式中，若第一电路板300和第二电路板400的功率较小，可以不设置冷却装置200，即中框110的隔板111上未开设冷却避让区115，从而能够在中框110的隔板111上形成完整的第一中框110电磁屏蔽层和第二电磁屏蔽层。在一些实施方式中，若第一电路板300或第二电路板400的功率较大，需要设置冷却装置200，同时需要在中框110的隔板111上开设冷却避让区115，为了使冷却避让区115具有电磁屏蔽功能，故而可以在冷却装置200的冷却板210、第一散热板220以及第二散热板230中的任意一个或几个板体结构上设置电磁屏蔽层替代中框110上的电磁屏蔽层，以实现第一电路板300和第二电路板400间的电磁屏蔽。
针对第一电路板300，第一盖体120电磁屏蔽层、第一盖体电磁屏蔽围壁121、第一中框110电磁屏蔽层以及第一中框电磁屏蔽围壁113形成对第一电路板300的全包围，故而可以将第一电路板300与第二电路板400以及其他设备进行电磁隔离，实现对第一电路板300的电磁屏蔽。第二电路板400的电磁屏蔽与第一电路板300相同，在此不再赘述。
在一些实施方式中，如图3和图10所示，图10示出了图2中的中央控制器的壳体和冷却装置的爆炸图，所述第一中框电磁屏蔽围壁113与所述第一盖体电磁屏蔽围壁121之间 设有第一电磁辐射打断部114；所述第二中框110电磁屏围壁与所述第二盖体130电磁屏蔽围壁之间设有第二电磁辐射打断部。
在一些实施方式中，由于中框110与两块电路板或两个盖体无法做到绝对平行，因此无法做到完整平面屏蔽，为了提高屏蔽效果，本公开通过设置第一电磁辐射打断部114和第二电磁辐射打断部，从而在中框110与第一盖体120之间、中框110与第二盖体130之间形成电磁屏蔽网格结构，使电磁场通过电磁屏蔽网格结构时产生涡流，使电磁场进行内部抵消最终实现电磁屏蔽效果。
在一些实施方式中，如图3和图10所示，在一些实施方式中，相邻的所述第一电磁辐射打断部114的间距为8cm～12cm；相邻的所述第二电磁辐射打断部的间距为8cm～12cm。在一些实施方式中，相邻的所述第一电磁辐射打断部114的间距为10cm；相邻的所述第二电磁辐射打断部的间距为10cm。
在一些实施方式中，经过实验验证，车载器件信号频率一次谐波频率<2GHz根据电磁波屏蔽原理公式：λ截止＝2a，其中，a为屏蔽墙孔径。例如当第一电磁辐射打断部114的间距a和第二电磁辐射打断部的间距a均为10cm时，则根据式f＝c/λ＝c/2a＝2.794Ghz，其中，c＝3*108m/s。即第一电磁辐射打断部114的间距和第二电磁辐射打断部的间距为10cm时，对电磁波的截止频率为2.794GHz,即小于该频段的对外辐射可以被隔离屏蔽。
在一些实施方式中，所述第一电磁辐射打断部114可以包括设置在所述中框110第一侧的侧壁上的金属凸起和/或设置在所述第一盖体120的侧壁上的金属凸起；所述第二电磁辐射打断部包括设置在所述中框110第二侧的侧壁上的金属凸起和/或设置在所述第二盖体130的侧壁上的金属凸起。
在一些实施方式中，通过在壳体100的各侧壁上设置金属凸起，通过金属凸起在壳体100的各侧壁形成类似金属网格结构，以通过该金属网格结构隔离中央控制器1000的对外电磁辐射。
在一些实施方式中，第一电路板300的两侧分别设有第一电磁屏蔽层；所述第二电路板400的两侧分别设有第二电磁屏蔽层。
在一些实施方式中，通过第一电路板300的两侧分别设置第一电磁屏蔽层，实现对第一电路板300上下表面的对外电磁辐射屏蔽，进而通过第一盖体电磁屏蔽围壁121与所述第一中框电磁屏蔽围壁113实现对第一电路板300四周对外电磁辐射屏蔽；同理，通过第二电路板400的两侧分别设置第二电磁屏蔽层，实现对第二电路板400上下表面的对外电磁辐射屏蔽，进而通过第二盖体130电磁屏蔽围壁与所述第二中框电磁屏蔽围壁119实现对第二电路板400四周对外电磁辐射屏蔽。
图12示出了图2中的中央控制器1000的第一电路板300的结构示意图；图13示出了图2中的中央控制器1000的第二电路板400的结构示意图。
在一些实施方式中，如图12和图13所示，一些实施方式所述第一电路板300的边沿设有第一边沿电磁屏蔽线310；所述第二电路板400的边沿设有第二边沿电磁屏蔽线410。
在一些实施方式中，第一边沿电磁屏蔽线310与第一盖体电磁屏蔽围壁121或所述第一中框电磁屏蔽围壁113相抵接；第二边沿电磁屏蔽线410与第二盖体130电磁屏蔽围壁或所述第二中框电磁屏蔽围壁119相抵接。
在一些实施方式中，如图2至图4所示，所述第一电路板300与所述第二电路板400之间设有板间连接器；相应地，所述中框110开设有连接器避让区116，所述中框110的第一侧绕所述连接器避让区116设有第一连接器电磁屏蔽围壁117，所述中框110的第二侧绕所述连接器避让区116设有第二连接器电磁屏蔽围壁118。在一些实施方式中，第一电路板300、第二电路板400与围绕连接器避让区116对应位置设有连接器电磁屏线。
在一些实施方式中，为了避免第一电路板300与第二电路板400之前通过连接器避让区116的电磁干扰，故而在中框110绕连接器避让区116设置第一连接器电磁屏蔽围壁117以与位于第一电路板300上的连接器电磁屏线抵接，在中框110绕连接器避让区116设置第 二连接器电磁屏蔽围壁118以与位于第二电路板400上的连接器电磁屏线抵接，从而将板间连接器包覆在其中，避免板间电磁干扰。
在一些实施方式中，所述电磁屏蔽围壁以及所述电磁屏蔽层由金属材料制备而成。通过金属材料实现电磁屏蔽作用。在一些实施方式中，金属材料可以为铜。
基于同样的发明构思，依据本公开第三方面还提供了一种汽车，所述汽车可以包括上述的中央控制器1000。
本公开实施方式至少具有如下有益效果：本公开实施方式提供的冷却装置包括冷却板和设置在冷却板第一侧的第一散热板，通过分体式结构的冷却装置即能够通过第一散热板对第一电路板进行交换散热，还能够通过第一散热板将冷却板与第一电路板隔绝开，避免设置在冷却板本体内的冷却流道泄漏导致第一电路板的损伤，以保护第一电路板免受损害。本公开实施方式提供的冷却装置还包括设置在冷却板第二侧的第二散热板，即在本公开实施方式提供的冷却装置中，可以通过第一散热板和第二散热板同时对位于冷却装置两侧的电路板进行冷却，避免了针对各个电路板需要单独设置冷却装置，减少了冷却装置的数量和占用的空间。
因本发明提供的汽车包括了上述技术方案的中央控制器，因此本发明提供的汽车具备上述中央控制器的全部有益效果，在此不做赘述。
在本公开中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本公开的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
需要说明的是，本公开实施方式中所有方向性指示仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
在本公开中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本公开中的具体含义。
另外，在本公开中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者多个所述特征。在本公开的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。此外，本领域的技术人员可以将本说明书中描述的不同实施方式或示例进行接合和组合。
另外，各个实施方式之间的技术方案可以相互结合，但是必须是以本领域普通技术人 员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本公开要求的保护范围之内。
尽管已经示出和描述了本公开的实施方式，本领域的普通技术人员可以理解：在不脱离本公开的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本公开的范围由权利要求及其等同物限定。

Claims (10)

  1. 一种冷却装置，包括：
    冷却板，包括冷却板本体和设置在所述冷却板体内的冷却流道；以及
    第一散热板，设置在所述冷却板的第一侧，所述第一散热板用于贴合第一电路板。
  2. 如权利要求1所述的冷却装置，还包括：
    第二散热板，设置在所述的冷却板的第二侧，所述第二散热板用于贴合第二电路板。
  3. 如权利要求1或2所述的冷却装置，其中，所述第一散热板邻近所述第一电路板的一侧设有至少一个第一导热凸台，所述第一导热凸台用于贴合在所述第一电路板上的发热元件上；和/或，所述第二散热板邻近所述第二电路板的一侧设有至少一个第二导热凸台，所述第二导热凸台用于贴合在所述第二电路板上的发热元件上。
  4. 如权利要求3所述的冷却装置，其中，所述第一导热凸台的设置位置和数量与所述第一电路板的发热位置和发热量相对应；和/或，所述第二导热凸台的设置位置和数量与所述第二电路板的发热位置和发热量相对应。
  5. 如权利要求4所述的冷却装置，其中，所述冷却流道在所述冷却板内的流经途径至少经过所述第一导热凸台和/或所述第二导热凸台。
  6. 如权利要求4所述的冷却装置，其中，所述第一导热凸台与所述第一电路板之间设有导热胶层，和/或，所述第二导热凸台与所述第二电路板之间设有导热胶层。
  7. 如权利要求1或2所述的冷却装置，其中，所述第一散热板与所述冷却板对应开设有第一定位孔，所述第一散热板与所述冷却板通过第一连接件和所述第一定位孔连接；和/或，所述第二散热板与所述冷却板对应开设有第二定位孔，所述第二散热板与所述冷却板通过第二连接件和所述第二定位孔连接。
  8. 如权利要求7所述的冷却装置，其中，所述第一散热板和/或所述第二散热板通过钎焊固定在所述冷却板上。
  9. 一种中央控制器，包括：
    中央控制器壳体；
    如权利要求1至8任意一项所述的冷却装置，设置在所述壳体内以将所述壳体分割为相邻的第一腔体和第二腔体；
    第一电路板，设置在所述第一腔体中；以及
    第二电路板，设置在所述第二腔体中。
  10. 一种汽车，包括如权利要求9所述的中央控制器。
PCT/CN2023/105308 2022-07-20 2023-06-30 一种冷却装置、中央控制器和汽车 WO2024017042A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210861586.5 2022-07-20
CN202210861586.5A CN115515380A (zh) 2022-07-20 2022-07-20 一种冷却装置、中央控制器和汽车

Publications (1)

Publication Number Publication Date
WO2024017042A1 true WO2024017042A1 (zh) 2024-01-25

Family

ID=84525281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/105308 WO2024017042A1 (zh) 2022-07-20 2023-06-30 一种冷却装置、中央控制器和汽车

Country Status (2)

Country Link
CN (1) CN115515380A (zh)
WO (1) WO2024017042A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116033730A (zh) * 2023-03-27 2023-04-28 之江实验室 机箱及飞行设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649646A (en) * 1987-07-01 1989-01-12 Fujitsu Ltd Cooling module
CN101060768A (zh) * 2006-04-20 2007-10-24 波音公司 混合陶瓷芯的冷却板
CN108925119A (zh) * 2018-08-21 2018-11-30 苏州申川精密部件有限公司 一种新能源汽车控制器电路板用水冷板及其制造方法
CN109152310A (zh) * 2018-10-22 2019-01-04 桂林电子科技大学 一种多圆弧微通道散热装置
CN113412013A (zh) * 2021-07-07 2021-09-17 湖北博格智能控制系统有限公司 一种智能密封型渣土车控制器
CN114379393A (zh) * 2022-01-19 2022-04-22 深圳威迈斯新能源股份有限公司 一种复用金属基电路板的冷却流道结构及车载充电机

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649646A (en) * 1987-07-01 1989-01-12 Fujitsu Ltd Cooling module
CN101060768A (zh) * 2006-04-20 2007-10-24 波音公司 混合陶瓷芯的冷却板
CN108925119A (zh) * 2018-08-21 2018-11-30 苏州申川精密部件有限公司 一种新能源汽车控制器电路板用水冷板及其制造方法
CN109152310A (zh) * 2018-10-22 2019-01-04 桂林电子科技大学 一种多圆弧微通道散热装置
CN113412013A (zh) * 2021-07-07 2021-09-17 湖北博格智能控制系统有限公司 一种智能密封型渣土车控制器
CN114379393A (zh) * 2022-01-19 2022-04-22 深圳威迈斯新能源股份有限公司 一种复用金属基电路板的冷却流道结构及车载充电机

Also Published As

Publication number Publication date
CN115515380A (zh) 2022-12-23

Similar Documents

Publication Publication Date Title
JP6384609B2 (ja) パワー半導体モジュール及び冷却器
CN212278664U (zh) 适于电子设备液冷散热的液冷板及具有其的散热单元
WO2024017042A1 (zh) 一种冷却装置、中央控制器和汽车
JP7339075B2 (ja) 電気機器、電子制御装置
CN113133279B (zh) 电子设备
WO2024016510A1 (zh) 一种控制器壳体、中央控制器和汽车
CN115051531A (zh) 功率转换装置及其制造方法
CN212936500U (zh) 具有双层冷却结构的散热器
CN114430643A (zh) 具有改善的空间利用率和热管理特性的功率电子器件模块
CN115515408A (zh) 一种中央控制器和汽车
CN218788785U (zh) 工业相机
US11625079B2 (en) Staggered arrangement graphite heat sink for liquid cooling cold plate
CN211128733U (zh) 散热装置及用户驻地设备
US20200236811A1 (en) Thermally conductive insert element for electronic unit
CN206442659U (zh) 气冷散热装置
JP3947797B2 (ja) 三次元実装型放熱モジュール
CN220191319U (zh) 散热器、电路模组及电子设备
CN217985809U (zh) 全封闭风冷散热结构
CN220674183U (zh) 散热盒及其电气设备
CN220274137U (zh) 液冷壳体及电子设备
JP2019106459A (ja) 電子制御装置
CN219536639U (zh) 电力电子设备的散热结构、散热风道、电力电子设备
CN210537191U (zh) 一种多流向液冷板
CN219576843U (zh) 电源功率装置
CN219679045U (zh) 车载电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23842107

Country of ref document: EP

Kind code of ref document: A1