WO2024011789A1 - Procédé de préparation d'une résine phénol phénolique et produit ainsi obtenu - Google Patents
Procédé de préparation d'une résine phénol phénolique et produit ainsi obtenu Download PDFInfo
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- WO2024011789A1 WO2024011789A1 PCT/CN2022/129223 CN2022129223W WO2024011789A1 WO 2024011789 A1 WO2024011789 A1 WO 2024011789A1 CN 2022129223 W CN2022129223 W CN 2022129223W WO 2024011789 A1 WO2024011789 A1 WO 2024011789A1
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- Prior art keywords
- phenol
- acid
- salt
- heteropoly
- heteropoly acid
- Prior art date
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title claims abstract description 257
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 30
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000005011 phenolic resin Substances 0.000 title abstract description 15
- 150000003839 salts Chemical class 0.000 claims abstract description 86
- 239000011964 heteropoly acid Chemical class 0.000 claims abstract description 83
- 238000006243 chemical reaction Methods 0.000 claims abstract description 61
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000003756 stirring Methods 0.000 claims abstract description 41
- 239000012299 nitrogen atmosphere Substances 0.000 claims abstract description 37
- 150000007524 organic acids Chemical class 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000018044 dehydration Effects 0.000 claims abstract description 7
- 238000006297 dehydration reaction Methods 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims description 64
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 51
- 229920003986 novolac Polymers 0.000 claims description 37
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 30
- 235000006408 oxalic acid Nutrition 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 14
- 229920002866 paraformaldehyde Polymers 0.000 claims description 14
- -1 poly salt bromide Chemical class 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 10
- IYDGMDWEHDFVQI-UHFFFAOYSA-N phosphoric acid;trioxotungsten Chemical compound O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.O=[W](=O)=O.OP(O)(O)=O IYDGMDWEHDFVQI-UHFFFAOYSA-N 0.000 claims description 10
- KAIPKTYOBMEXRR-UHFFFAOYSA-N 1-butyl-3-methyl-2h-imidazole Chemical compound CCCCN1CN(C)C=C1 KAIPKTYOBMEXRR-UHFFFAOYSA-N 0.000 claims description 8
- OIALIKXMLIAOSN-UHFFFAOYSA-N 2-Propylpyridine Chemical compound CCCC1=CC=CC=N1 OIALIKXMLIAOSN-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 8
- IQQRAVYLUAZUGX-UHFFFAOYSA-N 1-butyl-3-methylimidazolium Chemical group CCCCN1C=C[N+](C)=C1 IQQRAVYLUAZUGX-UHFFFAOYSA-N 0.000 claims description 6
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- HSNVNALJRSJDHT-UHFFFAOYSA-N P(=O)(=O)[Mo] Chemical compound P(=O)(=O)[Mo] HSNVNALJRSJDHT-UHFFFAOYSA-N 0.000 claims description 5
- CGFYHILWFSGVJS-UHFFFAOYSA-N silicic acid;trioxotungsten Chemical compound O[Si](O)(O)O.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1.O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 CGFYHILWFSGVJS-UHFFFAOYSA-N 0.000 claims description 5
- 239000005711 Benzoic acid Substances 0.000 claims description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 4
- 235000010233 benzoic acid Nutrition 0.000 claims description 4
- DHRLEVQXOMLTIM-UHFFFAOYSA-N phosphoric acid;trioxomolybdenum Chemical compound O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.O=[Mo](=O)=O.OP(O)(O)=O DHRLEVQXOMLTIM-UHFFFAOYSA-N 0.000 claims description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- 235000011054 acetic acid Nutrition 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- OIWSIWZBQPTDKI-UHFFFAOYSA-N 1-butyl-3-methyl-2h-imidazole;hydrobromide Chemical compound [Br-].CCCC[NH+]1CN(C)C=C1 OIWSIWZBQPTDKI-UHFFFAOYSA-N 0.000 claims 1
- CRTKBIFIDSNKCN-UHFFFAOYSA-N 1-propylpyridin-1-ium Chemical compound CCC[N+]1=CC=CC=C1 CRTKBIFIDSNKCN-UHFFFAOYSA-N 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 229940102396 methyl bromide Drugs 0.000 claims 1
- GZUXJHMPEANEGY-UHFFFAOYSA-N methyl bromide Substances BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 21
- 239000003054 catalyst Substances 0.000 description 15
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004090 dissolution Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000006068 polycondensation reaction Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 125000005842 heteroatom Chemical group 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012295 chemical reaction liquid Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- WNUPENMBHHEARK-UHFFFAOYSA-N silicon tungsten Chemical compound [Si].[W] WNUPENMBHHEARK-UHFFFAOYSA-N 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- KYCQOKLOSUBEJK-UHFFFAOYSA-M 1-butyl-3-methylimidazol-3-ium;bromide Chemical compound [Br-].CCCCN1C=C[N+](C)=C1 KYCQOKLOSUBEJK-UHFFFAOYSA-M 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010494 dissociation reaction Methods 0.000 description 2
- 230000005593 dissociations Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004811 liquid chromatography Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- GALOTNBSUVEISR-UHFFFAOYSA-N molybdenum;silicon Chemical compound [Mo]#[Si] GALOTNBSUVEISR-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical class [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004737 colorimetric analysis Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000007336 electrophilic substitution reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004413 injection moulding compound Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- UYDPQDSKEDUNKV-UHFFFAOYSA-N phosphanylidynetungsten Chemical compound [W]#P UYDPQDSKEDUNKV-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids
Definitions
- the present application belongs to the technical field of phenolic resin preparation, and in particular relates to a preparation method of phenol-novolac resin and the resulting product.
- Phenol novolac epoxy resin is a light brown viscous liquid. It is produced by the polycondensation reaction of phenol and formaldehyde in an acidic medium to obtain a novolac resin, which is then polycondensed with excess propylene oxide in the presence of sodium hydroxide. Because the molecular structure contains many epoxy groups and aromatic nuclei, the cured product has a high cross-linking density and excellent heat resistance and chemical resistance. Therefore, it has gained a good reputation in electronic packaging, copper-clad laminates, rubber and other electronic and electrical fields. Wide range of applications.
- the ideal injection molding compound should have good fluidity in the barrel and the ability to solidify quickly in the mold. Injection plastics with fast curing characteristics can reduce molding time and improve production efficiency.
- Phenol novolac resin is used as a tackifier and reinforcing resin in rubber compound formulations, but the relatively slow curing speed and relatively high heat production of phenol novolac resin can affect the adhesion of tire cord to rubber.
- the biggest feature of high-ortho-position phenolic resin is its fast polymerization speed, relatively low softening point, and curing at a lower temperature. Therefore, the characteristics of high ortho phenolic resin exactly meet this requirement.
- the preparation of high ortho phenolic resin is mainly carried out in the presence of catalysts (such as divalent metal ions such as calcium, magnesium, zinc, strontium, cadmium, lead and barium oxides, hydroxides or organic acid salts).
- catalysts such as divalent metal ions such as calcium, magnesium, zinc, strontium, cadmium, lead and barium oxides, hydroxides or organic acid salts.
- the catalytic efficiency of this type of divalent metal weak acid salt catalyst is relatively low, and the reaction process is unstable. The resin is prone to gelation during high-temperature dehydration.
- one aspect of the embodiments of the present application provides a method for preparing phenol novolac resin, including the following steps:
- the steps 1) to 3) are all performed under nitrogen atmosphere.
- the temperature during mixing in step 1) is 40-60°C; the molar ratio of formaldehyde to phenol is 1: (0.3-0.7); the molar ratio of water to phenol It is 1: (0.5 ⁇ 1.2).
- the formaldehyde is paraformaldehyde or an aqueous formaldehyde solution.
- the organic acid is added in batches in step 2), and the organic acid is one or more of oxalic acid, formic acid, acetic acid, butyric acid, benzoic acid and oxalic acid;
- the added amount of the organic acid is 0.1% to 1.0% of the molar amount of phenol.
- the heteropoly acid salt is added in batches, and the heteropoly acid salt is 1-butyl-3-methylimidazolium phosphotungstic heteropoly acid salt, 1 bromide -Butyl-3-methylimidazolium phosphotungstic heteropoly acid salt, 1-(3-sulfonate)propyl-3-methylimidazolium phosphotungstic heteropoly acid salt, 1-(3-sulfonate)propyl 1-Butyl-3-methylimidazole silicotungstic heteropoly acid salt, 1-butyl-3-methylimidazole silicotungstic heteropoly acid salt, 1-(3-methylimidazole silicotungsten heteropoly acid salt) Sulfonate)propyl-3-methylimidazole silicon tungsten heteropoly salt, 1-(3-sulfonate)propylpyridine silicon tungsten heteropoly salt, 1-butyl-3-methylimidazole phosphomolybden
- the temperature of the stirring reaction in step 2) is 60-100°C, and the time is 1-3 hours.
- the heteropoly acid is added in batches in step 3), and the heteropoly acid is one or more of phosphotungstic acid, silicotungstic acid, phosphomolybdic acid and silicomolybdic acid. ;
- the addition amount of the heteropolyacid is 0.1% to 1.0% of the molar amount of phenol.
- the reaction temperature in step 3) is 60-100°C, and the reaction time is 0.5-1.5h.
- step 4 high temperature and high pressure are used to dehydrate and remove phenol; the pressure during dehydration is 10-20KPa, and the temperature is 100-140°C; The pressure is 0.1 ⁇ 10Kpa and the temperature is 150 ⁇ 200°C.
- Another aspect of the embodiments of the present application also provides a phenol novolac resin prepared by any of the above methods, the ortho position content of the phenol novolac resin is 25% to 95%, and the residual phenol is ⁇ 1000ppm; Gadde Color absorption ⁇ 1.
- the preparation method provided by at least one embodiment of the present application has stable reaction, is not easy to produce gel, has high production efficiency, and the prepared phenol novolac resin has low residual phenol and Gardner color and controllable ortho-position content.
- the preparation method provided by at least one embodiment of the present application uses organic acids and heteropolyacid salts as catalysts in the early stage of the reaction.
- the catalytic ability is weak, so that the reaction is moderated and the intense heat generation in the early stage of the reaction is avoided to cross-link the resin;
- heteropoly acid is used as the catalyst, which has large hydrogen dissociation ability and strong catalytic ability, which can effectively further increase the polycondensation reaction rate, increase the conversion rate and yield of o-cresol, shorten the reaction cycle, and reduce production costs.
- the preparation method provided by at least one embodiment of the present application uses a composite of catalyst heteropolyacid salt and organic acid, and under the action of heteroatoms with high activity and obvious positioning effect, through the polycondensation reaction of phenolic aldehyde, different products are prepared. Ortho content of phenol novolac resin.
- the phenol novolac resin prepared in at least one embodiment of the present application has controllable ortho-para content, low residual phenol content, and low chroma.
- the embodiments of the present application provide a method for preparing phenol novolac resin, which includes the following steps:
- the steps 1) to 3) are all performed under nitrogen atmosphere.
- phenol, formaldehyde and water are mixed to obtain a transparent solution.
- the molar ratio of formaldehyde to phenol is 1:(0.3 ⁇ 0.7), optionally 1:(0.4 ⁇ 0.6), further optionally 1:0.5.
- the molar ratio of water and phenol is 1:(0.5-1.2), optionally 1:1.1.
- the mixing temperature is 40-60°C.
- the formaldehyde is optionally formaldehyde or paraformaldehyde.
- the embodiment of the present application mixes the transparent solution with an organic acid and a heteropolyacid salt, and performs a stirring reaction to obtain a first reaction liquid.
- the added amount of the organic acid is 0.1% to 1.0% of the molar amount of phenol, optionally 0.2% to 0.6%, further optionally 0.3% to 0.5%.
- the organic acid is one or more of oxalic acid, formic acid, acetic acid, butyric acid, benzoic acid and oxalic acid, optionally one of oxalic acid, benzoic acid and oxalic acid. or more, further optionally oxalic acid.
- the organic acid is optionally added in batches.
- the addition amount of the heteropolyacid salt is 5% to 20% of the molar amount of phenol, optionally 6% to 15%, further optionally 8% to 10%.
- the heteropoly acid salt is 1-butyl-3-methylimidazolium phosphotungstic heteropoly acid salt, bromide 1-butyl-3-methylimidazolium phosphotungstic heteropoly acid salt, 1 -(3-Sulfonate)propyl-3-methylimidazolium phosphorus tungsten heteropoly salt, 1-(3-sulfonate)propylpyridine phosphotungstic heteropoly salt, 1-butyl-3-methyl 1-butyl-3-methylimidazole silicotungstic heteropoly acid salt, 1-butyl-3-methylimidazole silicotungstic heteropoly acid salt, 1-(3-sulfonate)propyl-3-methylimidazole silicotungstic heteropoly acid Salt, 1-(3-sulfonate)
- the temperature of the stirring reaction is 60-100°C, and the time is 1-3 hours.
- the embodiment of the present application mixes the first reaction liquid and the heteropolyacid and performs a reaction to obtain a phenol-formaldehyde resin.
- the heteropoly acid is one or more of phosphotungstic acid, silicotungstic acid, phosphomolybdic acid and silicomolybdic acid, optionally phosphotungstic acid or silicotungstic acid, further optionally The ground is phosphotungstic acid.
- the addition amount of the heteropolyacid is 0.1% to 1.0% of the molar amount of phenol, optionally 0.2% to 0.6%, further optionally 0.3% to 0.5%.
- the heteropoly acid is optionally added in portions.
- the reaction temperature is 60-100°C, optionally 70-90°C; the reaction time is 0.5-1.5h, optionally 0.8-1h.
- the phenol-formaldehyde resin is dehydrated and dephenolized to obtain a phenol-formaldehyde resin.
- high temperature and high pressure are used to perform dehydration and phenol removal; the pressure during dehydration is optionally 10-20KPa, and further optionally 12-15KPa; the temperature during dehydration is optionally 100-15KPa. 140°C, further optionally 110 to 130°C.
- the pressure during dephenolization is optionally 0.1-10KPa, further optionally 1-5Mpa; the temperature during dephenolization is optionally 150-200°C, further optionally 170-180°C.
- heteropolyacid salts and organic acids are used as catalysts in combination, and under the action of heteroatoms with high activity and obvious positioning effects, ortho-ocresol aldehydes with different contents are prepared through the polycondensation reaction of phenolic aldehydes. resin.
- a composite of organic acid and heteropolyacid salt is used as a catalyst, which has weak catalytic ability and moderate reaction, which can avoid the severe exotherm in the early stage of the reaction to cross-link the resin.
- heteropoly acid is selected as a catalyst in the middle stage of the reaction, which has large hydrogen dissociation ability and strong catalytic ability, which can effectively further increase the polycondensation reaction rate and increase the conversion rate and yield of o-cresol. Shorten the reaction cycle and reduce production costs.
- the phenolic phenolic resin prepared by this method has controllable ortho-para content, controllable softening point and low chroma.
- the ortho-para position content of the phenol novolac resin is controlled through the type and addition amount of the heteropoly acid salt.
- the reaction mechanism for synthesizing the ortho-controllable phenol novolac resin is as follows: by selecting mixed catalysis of the heteropolyacid acid salt and an organic acid.
- the heteropoly acid salt provides a weakly acidic reaction environment, highlighting the difference in the degree of electrophilic substitution of the hydroxyl "OH" at the ortho and para positions on the phenol ring, and selecting heteroatoms with ortho-guiding functions during the synthesis process (such as P , Si, Fe, Co, etc.) and polyatoms (such as Mo, W, V, Nb, Ta, etc.), so that formaldehyde can react preferentially with the ortho position of phenol to form an unstable chelate.
- the polycondensation reaction with phenol continues to form ortho-linked and highly active diphenolmethane.
- the type and content of heteroatoms and polyatoms are controlled, and the reaction with formaldehyde continues to form Phenol novolac resins with different ortho positions.
- the embodiments of the present application also provide a phenol novolac resin prepared by any of the above methods.
- the ortho position content of the phenol novolac resin is 25% to 95%, the residual phenol is ⁇ 1000ppm; the Gardner color is ⁇ 1.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 75°C. After stirring and dissolving completely, add acetic acid with a molar mass of phenol 0.3% and 1-butyl-3 with a molar mass of phenol 5% in 4 batches. -Methylimidazole phosphotungstic heteropoly salt catalyst, stir and react for 2 hours after addition;
- step 4 After dehydrating the solution obtained in step 3) at 110°C and a pressure of 20KPa, the temperature is raised to 180°C and the pressure is 1KPa to remove phenol to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolving completely, add oxalic acid with a molar mass of phenol 0.3% and 1-butyl-3 with a molar mass of phenol 8% in 5 batches. -Methylimidazole phosphotungstic heteropoly salt catalyst, stir and react for 3 hours after addition;
- step 4 Dehydrate the solution obtained in step 3) at 120°C and a pressure of 15KPa, then raise the temperature to 190°C and remove phenol under a pressure of 10KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 80°C. After stirring and dissolution, add oxalic acid with a molar mass of 0.7% of phenol and 1-(3 with a molar mass of phenol of 10% in 5 batches. -Sulfonate)propylpyridinium phosphotungstic heteropoly salt catalyst, stir and react for 1 hour after addition;
- step 4 After dehydrating the solution obtained in step 3) at 120°C and a pressure of 20KPa, the temperature is raised to 200°C and the pressure is 5KPa to remove phenol to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolving completely, add oxalic acid with a molar mass of phenol 0.6% and 1-butyl bromide with a molar mass of phenol 12% in 4 batches. -3-methylimidazole silicon molybdenum heteropoly salt catalyst, stir and react for 2 hours after adding;
- step 4 After dehydrating the solution obtained in step 3) at 110°C and a pressure of 10KPa, the temperature is raised to 200°C and the phenol is removed under a pressure of 10KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 75°C. After stirring and dissolving completely, add acetic acid with a molar mass of phenol 0.3% and 1-butyl-3 with a molar mass of phenol 8% in 4 batches. -Methylimidazole phosphotungstic heteropoly salt catalyst, stir and react for 2 hours after addition;
- step 4 After dehydrating the solution obtained in step 3) at 110°C and a pressure of 20KPa, the temperature is raised to 180°C and the pressure is 1KPa to remove phenol to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 75°C. After stirring and dissolution, add acetic acid with a molar mass of 0.3% of phenol and 1-butyl-3 with a molar mass of phenol of 12% in 4 batches. -Methylimidazole phosphotungstic heteropoly salt catalyst, stir and react for 2 hours after addition;
- step 3 After the solution obtained in step 3) is dehydrated under reduced pressure at 110°C and a pressure of 20KPa, the temperature is raised to 180°C and the phenol is removed under reduced pressure at a pressure of 1KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolution, add 0.6% oxalic acid with phenol molar mass in 4 batches. After the addition is completed, stir and react for 3 hours;
- step 3 After the solution obtained in step 3) is dehydrated under reduced pressure at 110°C and a pressure of 20KPa, the temperature is raised to 200°C and the phenol is removed under reduced pressure at a pressure of 1KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolution, add acetic acid with phenol molar mass 0.4% in 4 batches. After the addition is completed, stir and react for 5 hours;
- step 3 After the solution obtained in step 3) is dehydrated under reduced pressure at 105°C and a pressure of 20KPa, the temperature is raised to 190°C and the phenol is removed under reduced pressure at a pressure of 1KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 75°C. After stirring and dissolving completely, add acetic acid with a molar mass of phenol 0.3% and 1-butyl-3 with a molar mass of phenol 5% in 4 batches. -Methylimidazole phosphotungstic heteropoly salt catalyst, stir and react for 2 hours after addition;
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolution, add acetic acid with 0.2% molar mass of phenol in 4 batches. After the addition is completed, stir and react for 5 hours;
- step 3 After the solution obtained in step 3) is dehydrated under reduced pressure at 105°C and a pressure of 20KPa, the temperature is raised to 190°C and the phenol is removed under reduced pressure at a pressure of 1KPa to obtain a phenol novolac resin.
- step 1) Under a nitrogen atmosphere, heat the solution in step 1) to 70°C. After stirring and dissolution, add acetic acid with phenol molar mass 0.8% in 4 batches. After the addition is completed, stir and react for 5 hours;
- step 3 After the solution obtained in step 3) is dehydrated under reduced pressure at 105°C and a pressure of 20KPa, the temperature is raised to 190°C and the phenol is removed under reduced pressure at a pressure of 1KPa to obtain a phenol novolac resin.
- the phenol novolac resin prepared in Examples 1 to 6 has an ortho ratio of 25-95%, residual phenol ⁇ 1000 ppm, chroma ⁇ 1, and the softening point meets the design requirements.
- the specific method for controlling the ortho-para position is: using the technical solution provided by this application, first determine the specific reaction raw materials, heteropoly acid salts, heteropoly acids, raw material dosage, specific reaction conditions and processes before preparation, and first conduct a small Batch test, determine the ortho-para content in the obtained phenol phenolic resin, then adjust the amount of heteropoly acid salt according to the ortho-para content in the product, and test again to obtain the phenol phenolic resin with the target ortho-para content. , and then industrial production can be carried out.
- test methods for ortho-para content, residual phenol, softening point and colorimetry of phenol phenolic resin are as follows:
- the epoxy resin was tested according to GBT12007.1-1989 epoxy resin color determination method.
- the epoxy resin was tested according to the GB/T 12007.6-1989 epoxy resin softening point determination method.
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Abstract
L'invention concerne un procédé de préparation de résine phénol phénolique et un produit ainsi obtenu, appartenant au domaine technique de la préparation de résine phénolique. Le procédé de préparation de résine phénol phénolique comprend les étapes suivantes, consistant à : 1) mélanger du phénol, du formaldéhyde et de l'eau pour obtenir une solution transparente ; 2) mélanger la solution transparente avec un acide organique et un sel d'hétéropolyacide et faire réagir sous agitation pour obtenir une première solution réactionnelle ; 3) mélanger la première solution réactionnelle avec un hétéropolyacide et faire réagir pour obtenir une résine phénol-formaldéhyde ; et 4) effectuer un traitement de déshydratation et de déphénolisation sur la résine phénol-formaldéhyde pour obtenir une résine phénol phénolique. Les étapes 1) -3) sont toutes effectuées sous une atmosphère d'azote.
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