WO2024007401A1 - Led排列结构 - Google Patents

Led排列结构 Download PDF

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Publication number
WO2024007401A1
WO2024007401A1 PCT/CN2022/110067 CN2022110067W WO2024007401A1 WO 2024007401 A1 WO2024007401 A1 WO 2024007401A1 CN 2022110067 W CN2022110067 W CN 2022110067W WO 2024007401 A1 WO2024007401 A1 WO 2024007401A1
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WO
WIPO (PCT)
Prior art keywords
led lamp
lamp bead
led
lamp beads
beads
Prior art date
Application number
PCT/CN2022/110067
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English (en)
French (fr)
Inventor
张海波
何胜斌
顾伟
Original Assignee
江西兆驰晶显有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江西兆驰晶显有限公司 filed Critical 江西兆驰晶显有限公司
Priority to EP22919303.2A priority Critical patent/EP4325470A4/en
Priority to US18/220,201 priority patent/US20240014185A1/en
Publication of WO2024007401A1 publication Critical patent/WO2024007401A1/zh

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the present application relates to the field of LED display technology, and in particular to an LED arrangement structure.
  • LED display screen is a flat multimedia display terminal composed of light-emitting diode dot matrix modules or pixel units. It has the characteristics of high brightness, wide viewing range, long life and low cost.
  • this application provides an LED arrangement structure, aiming to solve the technical problem of high production cost of LED display screens in the existing technology.
  • an LED arrangement structure which includes:
  • a plurality of first LED lamp beads and a plurality of second LED lamp beads are arranged on the PCB board; the first LED lamp beads and the second LED lamp beads are arranged in an array in the first direction and the second direction. arrangement; arrangement;
  • the plurality of first LED lamp beads form a plurality of first LED lamp bead rows along the second direction
  • the plurality of second LED lamp beads form a plurality of second LED lamp bead rows along the second direction
  • a plurality of the first LED lamp beads and a plurality of the second LED lamp beads form a plurality of third LED lamp bead rows along the first direction;
  • the common terminals between the first LED lamp beads in each of the first LED lamp bead rows are electrically connected to form a scan line;
  • the second LED lamps in each of the second LED lamp bead rows are The common terminal electrical connection between beads to form a scan line;
  • Common terminals or non-common terminals between two adjacent first LED lamp beads and second LED lamp beads in each third LED lamp bead row are adjacent; the scan line, the Data lines are located on different layers in the PCB board.
  • each of the scan lines is located on the surface layer of the PCB board, and each of the data lines is located on the bottom layer of the PCB board.
  • first LED lamp beads in each row of first LED lamp beads constitute a light-emitting pixel.
  • first LED lamp beads in each first LED lamp bead row are sequentially arranged along the second direction to form one of the light-emitting pixels.
  • each second LED lamp bead row is arranged sequentially along the second direction to form one of the light-emitting pixels.
  • each of the light-emitting pixels is the same.
  • the first LED lamp beads and the second LED lamp beads in each third LED lamp bead row are LED lamp beads of the same luminous color.
  • each of the first LED lamp beads is an LED lamp bead of the same size.
  • the first LED lamp bead is any one of a red LED lamp bead, a blue LED lamp bead, and a green LED lamp bead.
  • the second LED lamp bead is any one of a red LED lamp bead, a blue LED lamp bead, and a green LED lamp bead.
  • the non-common terminal between the two adjacent first LED lamp beads and the second LED lamp beads in each third LED lamp bead row is at The surface layer of the PCB board is electrically connected.
  • the non-common terminals of the first LED lamp beads in each third LED lamp bead row are electrically connected through via holes on the PCB board.
  • the non-common terminals of the second LED lamp beads in each third LED lamp bead row are electrically connected through via holes on the PCB board.
  • the non-common terminals between the first LED lamp beads and the second LED lamp beads in each third LED lamp bead row pass through the PCB board. vias for electrical connection.
  • the first LED lamp bead and the second LED lamp bead are packaged on the PCB board in a COB manner or an SMD manner.
  • the common terminals between the second LED lamp beads in each second LED lamp bead row are electrically connected to form a scan line
  • the first LED lamp bead and the second LED lamp in each third LED lamp bead row are The non-common terminals between the beads are electrically connected to form a data line.
  • the common terminals or non-common terminals between two adjacent first LED lamp beads and second LED lamp beads in each third LED lamp bead row are adjacent.
  • the scan lines and data lines are located on different layers in the PCB board, which can not only reduce the number of via holes on the PCB board, but also eliminate the need to increase the width or number of layers of the PCB board, improve the yield rate of the PCB board, and reduce the cost of the LED display screen production costs.
  • Figure 1 is a schematic diagram of an LED arrangement structure in the prior art
  • Figure 3 is a schematic diagram of an LED arrangement structure provided by an embodiment of the present application.
  • Figure 4 is a schematic diagram of an LED arrangement structure provided by another embodiment of the present application.
  • Figure 5 is a schematic diagram of an LED arrangement structure provided by another embodiment of the present application.
  • Figure 6 is a schematic diagram of an LED arrangement structure provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of an LED arrangement structure provided by another embodiment of the present application.
  • FIG 1 is a schematic diagram of an LED arrangement structure in the prior art.
  • a plurality of luminescent pixels 20 with the same structure are arranged in an array on the PCB board 10.
  • Each luminescent pixel 20 is composed of three LED lamp beads with different luminous colors, namely a red LED lamp bead and a blue LED lamp.
  • the LED lamp beads and the green LED lamp beads constitute a light-emitting pixel 20, so that the LED lamp beads and the light-emitting pixels 20 are arranged in an array on the PCB board 10.
  • the number of vias 101 on the PCB board 10 is determined by the number of LED beads.
  • Each light-emitting pixel 20 requires three vias 101 to lead the data line 40 to the inside of the PCB board 10. layer or bottom layer.
  • FIG. 2 is another schematic diagram of an LED arrangement structure in the prior art.
  • a plurality of luminescent pixels 20 with the same structure are arranged in an array on the PCB board 10.
  • Each luminescent pixel 20 is composed of three LED lamp beads with different luminous colors, namely a red LED lamp bead and a blue LED lamp.
  • the LED lamp beads and the green LED lamp beads constitute a light-emitting pixel 20, so that the LED lamp beads and the light-emitting pixels 20 are arranged in an array on the PCB board 10.
  • the common terminals of all the LED lamp beads in each row of luminescent pixels 20 are electrically connected at the inner layer or bottom layer of the PCB board 10 through the via holes 101 on the PCB board 10 to form a row scanning line, and the luminescent pixels 20 in each column emit the same light.
  • the non-common terminals of the colored LED lamp beads are electrically connected on the surface of the PCB board 10 to form a column data line 40 .
  • each light-emitting pixel 20 in Figure 2 only requires one via hole 101, due to the constraints of the wiring rules of the PCB board 10, the data line 40 passing between the positive and negative electrodes of the LED lamp bead will inevitably increase the size of the LED lamp bead. size, which will cause a sharp increase in cost.
  • the distance between the positive and negative electrodes of the COB chip is only 75um, and the spacing between the pads generally designed on the PCB board 10 is smaller than the spacing between the pads on the COB chip. To prevent misalignment, this value is generally taken as 70um.
  • the line width and line spacing of the general traces are both 100um. If the two data lines 40 both pass between the positive and negative electrodes of the COB chip, then the line width and distance between the positive and negative electrodes of the COB chip will The distance must be at least 500um. At this time, the COB chip will definitely be much larger than the original 75um design size of the diode, which will make the diode very large and the manufacturing cost will rise sharply.
  • FIG. 3 is a schematic diagram of an LED arrangement structure provided by an embodiment of the present application.
  • an LED arrangement structure includes:
  • a plurality of first LED lamp beads 201 and a plurality of second LED lamp beads 202 are arranged on the PCB board 10; the first LED lamp beads 201 and the second LED lamp beads 202 are arranged in the first direction and the second direction. Arranged in an array in two directions;
  • the plurality of first LED lamp beads 201 form several first LED lamp bead rows 210 along the second direction, and the plurality of second LED lamp beads 202 form several second LED lamps along the second direction.
  • Bead row 220, a plurality of first LED lamp beads 201 and a plurality of second LED lamp beads 202 form a plurality of third LED lamp bead rows 230 along the first direction;
  • the common terminals between the first LED lamp beads 201 in each of the first LED lamp bead rows 210 are electrically connected to form a scan line 30; each of the first LED lamp beads in each of the second LED lamp bead rows 220
  • the common terminals between the second LED lamp beads 202 are electrically connected to form a scan line 30; each of the first LED lamp beads 201 and each of the second LED lamp beads in each of the third LED lamp bead rows 230
  • the non-common terminals between 202 are electrically connected to form a data line 40;
  • each of the third LED lamp bead rows 230 the common terminals or non-common terminals between the two adjacent first LED lamp beads 201 and the second LED lamp beads 202 are adjacent; the scan line 30.
  • the data lines 40 are located on different layers in the PCB board 10 .
  • a plurality of first LED lamp beads 201 and a plurality of second LED lamp beads 202 are arranged on the PCB board 10.
  • the first LED lamp beads 201 and the second LED lamp beads 202 are arranged on the PCB board 10.
  • the plurality of first LED lamp beads 201 form a plurality of first LED lamp bead rows 210 along the second direction
  • the plurality of second LED lamp beads 202 form a plurality of first LED lamp bead rows 210 along the second direction.
  • each third LED lamp bead row 230 is electrically connected to form a data line 40 along the first direction, and each third LED lamp bead row 230 is The common or non-common terminals between two adjacent first LED lamp beads 201 and second LED lamp beads 202 in the three-LED lamp bead row 230 are adjacent, and the scan line 30 and the data line 40 are located on the PCB board 10
  • Different layers can not only reduce the number of vias 101 on the PCB board 10, but also eliminate the need to increase the width or number of layers of the PCB board 10, improve the yield rate of the PCB board 10, and reduce the production cost of the LED display screen.
  • three adjacent first LED lamp beads 201 in the first LED lamp bead row 210 can form one luminous pixel 20
  • the adjacent three first LED lamp beads 201 in the second LED lamp bead row 220 can form a luminous pixel 20
  • Three second LED lamp beads 202 can form a light-emitting pixel 20.
  • Each first LED lamp bead 201 in the light-emitting pixel 20 is arranged vertically
  • each second LED lamp bead 202 in the light-emitting pixel 20 is also arranged vertically.
  • the scan line 30 formed by the common terminal electrical connection between the first LED lamp beads 201 in each first LED lamp bead row 210 is a column scan line, and each second LED in each second LED lamp bead row 220
  • the scan lines 30 formed by the common terminal electrical connections between the lamp beads 202 are also column scan lines.
  • the non-common scan lines between the first LED lamp beads 201 and the second LED lamp beads 202 in each third LED lamp bead row 230 The terminals are electrically connected to form data lines 40 as row data lines, and the common terminal or non-common terminal between two adjacent first LED lamp beads 201 and second LED lamp beads 202 in each third LED lamp bead row 230 Adjacent, thereby making it possible that at least the LED lamp beads in the first LED lamp bead row 210 or the second LED lamp bead row 220 do not need to be equipped with via holes 101 on the PCB board 10 , and each LED lamp bead does not need to be on the PCB board 10 A via hole 101 is configured on the PCB board 10 , thereby reducing the number of via holes 101 on the PCB board 10 without increasing the size of the LED and the width or thickness of the PCB board 10 , thereby improving the yield rate of the PCB board 10 while reducing the cost of the LED. Display production costs.
  • each of the scan lines 30 is located on the surface layer of the PCB board 10
  • each of the data lines 40 is located on the bottom layer or inner layer of the PCB board 10
  • the scanning lines 30 formed by the common terminal electrical connections between the first LED lamp beads 201 in each first LED lamp bead row 210 are located on the surface of the PCB board 10
  • each of the second LED lamp bead rows 220 is located on the surface of the PCB board 10
  • the scanning line 30 formed by the common terminal electrical connection between the second LED lamp beads 202 is also located on the surface of the PCB board 10.
  • the data lines 40 formed by non-common terminal electrical connections are located on the bottom or inner layer of the PCB board 10 .
  • a plurality of adjacent first LED lamp beads 201 in each first LED lamp bead row 210 constitute a light-emitting pixel 20
  • a plurality of adjacent first LED lamp beads 201 in each second LED lamp bead row 220 constitute two adjacent second LED lamp beads 202 constitute one light-emitting pixel 20 .
  • one luminescent pixel 20 may be composed of multiple LED lamp beads. There may be one or more LED lamp beads of the same or different luminous colors in one luminescent pixel 20.
  • the LED lamp beads between two luminescent pixels 20 are Specifications, quantities, and colors may or may not be exactly the same, and their specific settings can be configured according to actual applications.
  • the first LED lamp beads 201 and the second LED lamp beads 202 in each third LED lamp bead row 230 are LED lamp beads of the same luminous color; the first LED The lamp beads 201 and the second LED lamp beads 202 are LED lamp beads of the same size; the first LED lamp beads 201 and the second LED lamp beads 202 are red LED lamp beads, blue LED lamp beads, and green LED lamp beads. Any kind of LED lamp beads.
  • each luminescent pixel 20 is the same, and each luminescent pixel 20 is composed of a red LED lamp bead, a blue LED lamp bead, and a green LED lamp bead.
  • the green LED lamp beads are arranged vertically from top to bottom along the second direction, thereby making the left and right viewing angles of the LED display screen symmetrical, and the finished LED display screen has the largest left and right viewing angles.
  • each luminescent pixel 20 can be composed of a red LED lamp bead, a blue LED lamp bead, and a green LED lamp bead.
  • the first LED lamp bead 201 and the second LED lamp bead 202 form the luminescent pixel 20 on the PCB board 10
  • An array arrangement is also performed on the PCB board 10, and the red LED lamp beads, blue LED lamp beads, and green LED lamp beads in each light-emitting pixel 20 can be arranged vertically from top to bottom.
  • first LED lamp beads 201 and the second LED lamp beads 202 in each third LED lamp bead row 230 can be LED lamp beads of the same specification and size, or they can be LED lamp beads of different specifications and sizes. It is only necessary to exchange the common terminal and the non-common terminal of the second LED lamp bead 202 in two adjacent first LED lamp bead rows 210 and second LED lamp bead rows 220 as shown in Figure 3, and then you can Omit at least one row of vias 101 on the PCB board 10 .
  • the non-common terminal between the two adjacent first LED lamp beads 201 and the second LED lamp beads 202 in each third LED lamp bead row 230 is on the PCB.
  • the surface layer of the board 10 is electrically connected. Specifically, when the common ends between two adjacent first LED lamp beads 201 and second LED lamp beads 202 in each third LED lamp bead row 230 are adjacent, if the corresponding first LED lamp bead row If there is only one row of LED lamp beads 210 on the PCB board 10, the first LED lamp bead row 210 cannot be placed at the edge of the array and needs to be arranged in the middle of the array; if the corresponding second LED lamp bead row 220 is on the PCB board 10 If there is only one row, the second LED lamp bead row 220 cannot be placed at the edge of the array and needs to be arranged in the middle of the array.
  • two adjacent first LEDs in the third LED lamp bead row 230 can be realized.
  • the non-common terminals between the lamp bead 201 and the second LED lamp bead 202 are electrically connected on the surface of the PCB board 10, thus reducing the number of vias 101 on the PCB board 10; when there are two in each third LED lamp bead row 230
  • the non-common poles between the adjacent first LED lamp beads 201 and the second LED lamp beads 202 are adjacent, at this time, the two adjacent first LED lamp beads in the third LED lamp bead row 230 can be directly realized.
  • the non-common terminals between the second LED lamp beads 202 are electrically connected on the surface of the PCB board 10 , thereby reducing the number of vias 101 on the PCB board 10 .
  • the number of rows of the first LED lamp bead rows 210 and the number of the second LED lamp bead rows 220 on the PCB board 10 may or may not be equal.
  • the LED lamp bead rows 210 and the second LED lamp bead rows 220 may be arranged alternately on the PCB board 10 , or they may not be alternately arranged. Only two adjacent third LED lamp bead rows 230 in each third LED lamp bead row 230 may be arranged alternately. If the common or non-common terminals between the first LED lamp bead 201 and the second LED lamp bead 202 are adjacent, the number of vias 101 on the PCB board 10 can be reduced.
  • the number of the first LED lamp bead row 210 in FIG. 3 is equal to the number of the second LED lamp bead row 220. Arrange alternately. At this time, half of the via holes 101 can be omitted on the PCB board 10 compared to Figure 1. In Figure 4, the number of rows of the first LED lamp bead row 210 is smaller than the number of the second LED lamp bead row 220.
  • the via holes 101 of row a can be omitted on the PCB board 10; Figure In 5, the number of the first LED lamp bead row 210 is greater than the number of the second LED lamp bead row 220. If the number of the first LED lamp bead row 210 is a, the number of the second LED lamp bead row 220 is b. , at this time, the via holes 101 in row b can be omitted on the PCB board 10 compared to FIG. 1 .
  • the non-common terminals of the first LED lamp beads 201 in each third LED lamp bead row 230 are electrically connected through the via holes 101 on the PCB board 10 .
  • the non-common terminals of each first LED lamp bead 201 in the third LED lamp bead row 230 are electrically connected through the via holes 101 on the PCB board 10 .
  • the non-common terminal of the second LED lamp bead 202 adjacent to the first LED lamp bead 201 is electrically connected to the non-common terminal of the first LED lamp bead 201 on the surface layer of the PCB board 10 to reduce via holes on the PCB board 10 101 quantity.
  • the non-common terminals of the second LED lamp beads 202 in each third LED lamp bead row 230 are electrically connected through the via holes 101 on the PCB board 10 .
  • the non-common terminals of the second LED lamp beads 202 in the third LED lamp bead row 230 are electrically connected through the via holes 101 on the PCB board 10 .
  • the non-common terminal of the first LED lamp bead 201 adjacent to the second LED lamp bead 202 is electrically connected to the non-common terminal of the second LED lamp bead 202 on the surface layer of the PCB board 10 to reduce via holes on the PCB board 10 101 quantity.
  • the non-common terminal between the first LED lamp bead 201 and the second LED lamp bead 202 in each third LED lamp bead row 230 passes through the pass on the PCB board 10 Hole 101 enables electrical connection. Specifically, as shown in FIG.
  • a first LED lamp bead 201 corresponds to a single first LED lamp bead row 210
  • a second LED lamp bead 202 corresponds to a single second LED lamp bead row 220.
  • the first LED lamp bead row 210 and the second LED lamp bead row 220 are the arrangement of LED lamp beads in the first direction
  • the third LED lamp bead row 230 is the arrangement of the LED lamp beads in the second direction.
  • each of the above units or structures can be implemented as an independent entity or can be combined in any way to be implemented as the same or several entities.
  • each of the above units or structures please refer to the previous embodiments and will not be discussed here. Again.

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种LED排列结构，其包括：PCB板（10）；在PCB板（10）上进行阵列排布的多个第一LED灯珠（201）、第二LED灯珠（202）；多个第一LED灯珠（201）、第二LED灯珠（202）分别沿第二方向形成第一LED灯珠行（210）、第二LED灯珠行（220），多个第一LED灯珠（201）、第二LED灯珠（202）沿第一方向形成第三LED灯珠行（230），第一LED灯珠行（210）中第一LED灯珠（201）之间的共极端连接、第二LED灯珠行（220）中第二LED灯珠（202）之间的共极端连接形成扫描线（30），第三LED灯珠行（230）中第一LED灯珠（201）、第二LED灯珠（202）之间的非共极端连接形成数据线（40），第三LED灯珠行（230）中两个相邻的第一LED灯珠（201）、第二LED灯珠（202）之间的共极端或非共极端相邻，扫描线（30）、数据线（40）位于不同层，降低了PCB板上的过孔数量。

Description

LED排列结构 技术领域
本申请涉及LED显示技术领域，尤其涉及一种LED排列结构。
 背景技术
LED显示屏是一种利用发光二极管点阵模块或像素单元组成的平面式多媒体显示终端，其具有亮度高、可视范围广、寿命长以及成本低等特点。
目前，LED显示屏在进行设计和生产过程中，通常需要对PCB板进行开孔、或增加PCB板的宽度、或增加PCB板的层数，然而PCB板上开孔数量过多极易增加PCB板的不良率，增加PCB板的宽度或层数则会极大的提高物料成本，进而极大的提高了LED显示屏的生产成本。因此，发明人意识到如何降低LED显示屏的生产成本，已成为目前亟待解决的技术问题。
 技术问题
针对现有技术的不足，本申请提供了一种LED排列结构，旨在解决现有技术中LED显示屏生产成本较高的技术问题。
 技术解决方案
为解决上述问题，本申请实施例提供了一种LED排列结构，其包括：
PCB板；
设置在所述PCB板上的多个第一LED灯珠以及多个第二LED灯珠；所述第一LED灯珠、所述第二LED灯珠在第一方向、第二方向上呈阵列排布；
多个所述第一LED灯珠沿所述第二方向形成若干个第一LED灯珠行，多个所述第二LED灯珠沿所述第二方向形成若干个第二LED灯珠行，若干个所述第一LED灯珠、若干个所述第二LED灯珠沿所述第一方向形成多个第三LED灯珠行；
每一所述第一LED灯珠行中各所述第一LED灯珠之间的共极端电连接以形成一条扫描线；每一所述第二LED灯珠行中各所述第二LED灯珠之间的共极端电连接以形成一条扫描线；每一所述第三LED灯珠行中各所述第一LED灯珠、各所述第二LED灯珠之间的非共极端电连接以形成一条数据线；
每一所述第三LED灯珠行中两个相邻的所述第一LED灯珠、所述第二LED灯珠之间的共极端或非共极端相邻；所述扫描线、所述数据线在所述PCB板中位于不同层。
优选地，在所述的LED排列结构中，各所述扫描线位于所述PCB板的表层，各所述数据线位于所述PCB板的底层。
优选地，在所述的LED排列结构中，各所述扫描线位于所述PCB板的表层，各所述数据线位于所述PCB板的内层。
优选地，在所述的LED排列结构中，每一所述第一LED灯珠行中若干个相邻的所述第一LED灯珠构成一个发光像素。
更优选地，在所述的LED排列结构中，每一所述第一LED灯珠行中若干个相邻的所述第一LED灯珠沿第二方向依次排列以构成一个所述发光像素。
优选地，在所述的LED排列结构中，每一所述第二LED灯珠行中若干个相邻的所述第二LED灯珠构成一个所述发光像素。
更优选地，在所述的LED排列结构中，每一所述第二LED灯珠行中若干个相邻的所述第二LED灯珠沿第二方向依次排列以构成一个所述发光像素。
更优选地，在所述的LED排列结构中，每个所述发光像素包括红色LED灯珠、蓝色LED灯珠、绿色LED灯珠。
更优选地，在所述的LED排列结构中，每个所述发光像素均相同。
优选地，在所述的LED排列结构中，每一所述第三LED灯珠行中所述第一LED灯珠、所述第二LED灯珠均为相同发光颜色的LED灯珠。
优选地，在所述的LED排列结构中，各所述第一LED灯珠为相同尺寸的LED灯珠。
优选地，在所述的LED排列结构中，各所述第二LED灯珠为相同尺寸的LED灯珠。
优选地，在所述的LED排列结构中，所述第一LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
优选地，在所述的LED排列结构中，所述第二LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
优选地，在所述的LED排列结构中，每一所述第三LED灯珠行中两个相邻的所述第一LED灯珠、所述第二LED灯珠之间的非共极端在所述PCB板的表层电连接。
优选地，在所述的LED排列结构中，每一所述第三LED灯珠行中各所述第一LED灯珠的非共极端之间通过所述PCB板上的过孔实现电连接。
优选地，在所述的LED排列结构中，每一所述第三LED灯珠行中各所述第二LED灯珠的非共极端之间通过所述PCB板上的过孔实现电连接。
优选地，在所述的LED排列结构中，每一所述第三LED灯珠行中所述第一LED灯珠、所述第二LED灯珠之间的非共极端通过所述PCB板上的过孔实现电连接。
优选地，在所述的LED排列结构中，所述第一LED灯珠行与所述第二LED灯珠行在所述PCB板上交替排列。
优选地，在所述的LED排列结构中，所述第一LED灯珠、所述第二LED灯珠以COB的方式或SMD的方式封装在所述PCB板上。
 有益效果
本申请实施例提供的LED排列结构，通过在PCB板上设置多个第一LED灯珠以及多个第二LED灯珠，第一LED灯珠、第二LED灯珠在第一方向、第二方向上呈阵列排布，多个第一LED灯珠沿第二方向形成多个第一LED灯珠行，多个第二LED灯珠沿第二方向形成多个第二LED灯珠行，多个第一LED灯珠以及多个第二LED灯珠沿第一方向上形成多个第三LED灯珠行，同时各第一LED灯珠行中第一LED灯珠之间的共极端电连接以形成一条扫描线，各第二LED灯珠行中第二LED灯珠之间的共极端电连接以形成一条扫描线，各第三LED灯珠行中第一LED灯珠、第二LED灯珠之间的非共极端电连接以形成一条数据线，各第三LED灯珠行中两个相邻的第一LED灯珠、第二LED灯珠之间的共极端或非共极端相邻，扫描线、数据线在PCB板中位于不同层，不仅可以减少PCB板上过孔的数量，而且无需额外增加PCB板的宽度或层数，并提高PCB板良品率的同时，降低了LED显示屏的生产成本。
 附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中LED排列结构的示意图；
图2为现有技术中LED排列结构的另一示意图；
图3为本申请实施例提供的LED排列结构的示意图；
图4为本申请另一实施例提供的LED排列结构的示意图；
图5为本申请另一实施例提供的LED排列结构的示意图；
图6为本申请另一实施例提供的LED排列结构的示意图；
图7为本申请另一实施例提供的LED排列结构的示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在申请的描述中，需要理解的是，术语“中心”、“横向”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“列”、“行”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在申请中，“一些实施例”一词用来表示“用作例子、例证或说明”。本申请中被描述为示例性的任何实施例不一定被解释为比其它实施例更优选或更具优势。为使本领域任何技术人员能够实现和使用本申请，给出了以下描述。在以下描述，为了解释的目的而列出了细节。应当明白的是，本领域普通技术人员可以认识到，在不使用这些特定细节的情况下也可以实现本申请。在其它实例中，不会对已知的结构和过程进行详细阐述，以避免不必要的细节使本申请的描述变得晦涩。因此，本申请并非旨在限于所示的实施例，而是与符合本申请所公开的原理的最广范围相一致。
需要说明的是，本申请实施例中提及的第一方向、第二方向互相垂直，第一方向可以为列方向，也可以为行方向，同样的，第二方向则对应为行方向或列方向，第一方向、第二方向在实际应用时可以进行互换。其中，当第一方向为图1-7中标识的x方向时，即第一LED灯珠行、第二LED灯珠行均为一列LED灯珠，第二方向为图1-7中标识的y方向，即第三LED灯珠行为一行LED灯珠，图1-7中的x方向为行方向，y方向为列方向。
请参阅图1，图1为现有技术中LED排列结构的示意图。如图1所示，PCB板10上阵列排布有多个相同结构的发光像素20，每个发光像素20由三颗不同发光颜色的LED灯珠构成，即红色LED灯珠、蓝色LED灯珠、绿色LED灯珠构成一个发光像素20，从而使得LED灯珠以及发光像素20均以阵列的方式在PCB板10上进行排布。其中，每行发光像素20中所有LED灯珠的共极端在PCB板10的表层电连接以形成一条行扫描线，每列发光像素20中相同发光颜色的LED灯珠的非共极端通过PCB板10上的过孔101在PCB板10的内层或底层电连接以形成一条列数据线。其中，选通芯片通过扫描线30对PCB板10上的像素进行逐行扫描，驱动芯片通过数据线40施加不同的电流，以在每个发光像素20中得到不同颜色，进而在PCB板10上得到一幅完整的图像。
从图1中可以看出，PCB板10上过孔101的数量由LED灯珠的数量决定，每一个发光像素20需要三个过孔101，以实现将数据线40引至PCB板10的内层或底层。
请参阅图2，图2为现有技术中LED排列结构的另一示意图。如图2所示，PCB板10上阵列排布有多个相同结构的发光像素20，每个发光像素20由三颗不同发光颜色的LED灯珠构成，即红色LED灯珠、蓝色LED灯珠、绿色LED灯珠构成一个发光像素20，从而使得LED灯珠以及发光像素20均以阵列的方式在PCB板10上进行排布。其中，每行发光像素20中所有LED灯珠的共极端通过PCB板10上的过孔101在PCB板10的内层或底层电连接以形成一条行扫描线，每列发光像素20中相同发光颜色的LED灯珠的非共极端在PCB板10的表层电连接以形成一条列数据线40。
从图2中可以看出，为了避免扫描线30和数据线40出现交叉的问题，每列发光像素20中由两条数据线40均需要穿过一个或多个LED灯珠的正负极之间。虽然图2中每个发光像素20只需要一个过孔101，但是由于PCB板10走线规则的约束，数据线40穿过LED灯珠的正负极之间势必会加大该LED灯珠的尺寸，从而会引起成本的急剧上升。以常用的COB芯片0408（4 mil×8 mil）为例，COB芯片的正负极之间的距离只有75um，而一般PCB板10上设计焊盘的间距要小于COB芯片上的焊盘间距以防止出现错位，因此该数值一般取70um。而按照PCB板10的工艺水平，一般的走线的线宽和线距均为100um，若两条数据线40均穿过COB芯片的正负极之间，则COB芯片的正负极之间的距离至少要500um，此时COB芯片必定会远远大于二极管原本的75um的设计尺寸，进而会使二极管变得非常大，制造成本急剧上升。
请参阅图3，图3为本申请实施例提供的LED排列结构的示意图。如图3所示，一种LED排列结构，其包括：
PCB板10；
设置在所述PCB板10上的多个第一LED灯珠201以及多个第二LED灯珠202；所述第一LED灯珠201、所述第二LED灯珠202在第一方向、第二方向上呈阵列排布；
多个所述第一LED灯珠201沿所述第二方向形成若干个第一LED灯珠行210，多个所述第二LED灯珠202沿所述第二方向成若干个第二LED灯珠行220，若干个所述第一LED灯珠201、若干个所述第二LED灯珠202沿所述第一方向形成多个第三LED灯珠行230；
每一所述第一LED灯珠行210中各所述第一LED灯珠201之间的共极端电连接以形成一条扫描线30；每一所述第二LED灯珠行220中各所述第二LED灯珠202之间的共极端电连接以形成一条扫描线30；每一所述第三LED灯珠行230中各所述第一LED灯珠201、各所述第二LED灯珠202之间的非共极端电连接以形成一条数据线40；
每一所述第三LED灯珠行230中两个相邻的所述第一LED灯珠201、所述第二LED灯珠202之间的共极端或非共极端相邻；所述扫描线30、所述数据线40在所述PCB板10中位于不同层。
本申请实施例提供的LED排列结构，通过在PCB板10上设置多个第一LED灯珠201以及多个第二LED灯珠202，第一LED灯珠201、第二LED灯珠202在第一方向、第二方向上呈阵列排布，多个第一LED灯珠201沿第二方向形成多个第一LED灯珠行210，多个第二LED灯珠202沿第二方向形成多个第二LED灯珠行220，多个第一LED灯珠201以及多个第二LED灯珠202沿第一方向形成多个第三LED灯珠行230，同时各第一LED灯珠行210中第一LED灯珠201之间的共极端电连接以沿第二方向形成一条扫描线30，各第二LED灯珠行220中第二LED灯珠202之间的共极端电连接以沿第二方向形成一条扫描线30，各第三LED灯珠行230中第一LED灯珠201、第二LED灯珠202之间的非共极端电连接以沿第一方向形成一条数据线40，各第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的共极端或非共极端相邻，扫描线30、数据线40在PCB板10中位于不同层，不仅可以减少PCB板10上过孔101的数量，而且无需额外增加PCB板10的宽度或层数，并提高PCB板10良品率的同时，降低了LED显示屏的生产成本。
具体的，在图3所示的实施例中，第一LED灯珠行210中相邻的三个第一LED灯珠201可以组成一个发光像素20，第二LED灯珠行220中相邻的三个第二LED灯珠202可以组成一个发光像素20，发光像素20中各第一LED灯珠201采用竖向排列的方式，发光像素20中各第二LED灯珠202同样也采用竖向排列的方式，各第一LED灯珠行210中各第一LED灯珠201之间的共极端电连接所形成的扫描线30为列扫描线，各第二LED灯珠行220中各第二LED灯珠202之间的共极端电连接所形成的扫描线30同样也为列扫描线，各第三LED灯珠行230中第一LED灯珠201、第二LED灯珠202之间的非共极端电连接以形成的数据线40为行数据线，各第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的共极端或非共极端相邻，进而可以使得至少第一LED灯珠行210或第二LED灯珠行220中的LED灯珠无需在PCB板10上配备过孔101，无需每个LED灯珠均需在PCB板10上配置一个过孔101，进而在不增加LED尺寸以及PCB板10宽度或厚度的前提下，减少PCB板10上过孔101的数量，从而在提高了PCB板10良品率的同时，降低了LED显示屏的生产成本。
在一些实施例中，各所述扫描线30位于所述PCB板10的表层，各所述数据线40位于所述PCB板10的底层或内层。具体的，各第一LED灯珠行210中各第一LED灯珠201之间的共极端电连接所形成的扫描线30均位于PCB板10的表层，各第二LED灯珠行220中各第二LED灯珠202之间的共极端电连接所形成的扫描线30同样也位于PCB板10的表层，各第三LED灯珠行230中第一LED灯珠201、第二LED灯珠202之间的非共极端电连接所形成的数据线40位于PCB板10的底层或内层。
在一些实施例中，每一所述第一LED灯珠行210中若干个相邻的所述第一LED灯珠201构成一个发光像素20，每一所述第二LED灯珠行220中若干个相邻的所述第二LED灯珠202构成一个所述发光像素20。具体的，一个发光像素20可以由多个LED灯珠构成，一个发光像素20中可以存在一个或多个相同或不相同发光颜色的LED灯珠，两个发光像素20之间的LED灯珠的规格、数量、颜色可以完全相同，也可以不完全相同，其具体设置可根据实际应用进行配置。
在一些实施例中，每一所述第三LED灯珠行230中所述第一LED灯珠201、所述第二LED灯珠202均为相同发光颜色的LED灯珠；所述第一LED灯珠201、所述第二LED灯珠202为相同尺寸的LED灯珠；所述第一LED灯珠201、所述第二LED灯珠202为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
具体的，本实施例中每个发光像素20均相同，且每个发光像素20由红色LED灯珠、蓝色LED灯珠、绿色LED灯珠组成，红色LED灯珠、蓝色LED灯珠、绿色LED灯珠沿第二方向依次从上往下进行竖向排列，进而使得LED显示屏的左右视角对称，做成成品后的LED显示屏左右视角最大。
具体的，每个发光像素20可以由红色LED灯珠、蓝色LED灯珠、绿色LED灯珠构成，第一LED灯珠201、第二LED灯珠202在PCB板10上形成的发光像素20同样也在PCB板10上进行阵列排布，每个发光像素20中红色LED灯珠、蓝色LED灯珠、绿色LED灯珠可以依次由上至下依次竖向排列。
需要说明的是，每一第三LED灯珠行230中第一LED灯珠201、第二LED灯珠202可以为相同规格尺寸的LED灯珠，也可以为不同规格尺寸的LED灯珠，仅仅只需两个相邻第一LED灯珠行210、第二LED灯珠行220中第二LED灯珠202的共极端和非共极端进行如图3所示的左右调换即可，进而便可以省略掉PCB板10上至少一列的过孔101。
在一些实施例中，每一所述第三LED灯珠行230中两个相邻的所述第一LED灯珠201、所述第二LED灯珠202之间的非共极端在所述PCB板10的表层电连接。具体的，当每一第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的共极端相邻时，若对应的第一LED灯珠行210在PCB板10上只存在一行，则该第一LED灯珠行210不能放置于在阵列的最边缘，需排布在阵列中间；若对应的第二LED灯珠行220在PCB板10上只存在一行，则该第二LED灯珠行220不能放置于在阵列的最边缘，需排布在阵列中间，此时便可以实现第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的非共极端在PCB板10的表层电连接，进而减少PCB板10上过孔101的数量；当每一第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的非共极端相邻时，此时则可以直接实现第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的非共极端在PCB板10的表层电连接，进而减少PCB板10上过孔101的数量。
在一些实施例中，如图3至图5所示，PCB板10上第一LED灯珠行210的行数与第二LED灯珠行220的行数可以相等，也可以不相等，第一LED灯珠行210与第二LED灯珠行220之间可以在PCB板10上进行交替排列，也可以不用进行交替排列，只需每一第三LED灯珠行230中两个相邻的第一LED灯珠201、第二LED灯珠202之间的共极端或非共极端相邻，便可以减少PCB板10上过孔101的数量。其中，图3中第一LED灯珠行210的行数与第二LED灯珠行220的行数相等，第一LED灯珠行210与第二LED灯珠行220之间在PCB板10上进行交替排列，此时相对于图1中可以在PCB板10上省去一半的过孔101；图4中第一LED灯珠行210的行数小于第二LED灯珠行220的行数，若第一LED灯珠行210的行数为a，第二LED灯珠行220的行数为b，此时相对于图1中可以在PCB板10上省去a行的过孔101；图5中第一LED灯珠行210的行数大于第二LED灯珠行220的行数，若第一LED灯珠行210的行数为a，第二LED灯珠行220的行数为b，此时相对于图1中可以在PCB板10上省去b行的过孔101。
在一些实施例中，每一所述第三LED灯珠行230中各所述第一LED灯珠201的非共极端之间通过所述PCB板10上的过孔101实现电连接。具体的，如图3所示，当第三LED灯珠行230中各第一LED灯珠201的非共极端之间通过PCB板10上的过孔101实现电连接时，此时只需将与第一LED灯珠201相邻的第二LED灯珠202的非共极端与该第一LED灯珠201的非共极端在PCB板10的表层进行电连接，以减少PCB板10上过孔101的数量。
在一些实施例中，每一所述第三LED灯珠行230中各所述第二LED灯珠202的非共极端之间通过所述PCB板10上的过孔101实现电连接。具体的，如图6所示，当第三LED灯珠行230中各第二LED灯珠202的非共极端之间通过PCB板10上的过孔101实现电连接时，此时只需将与第二LED灯珠202相邻的第一LED灯珠201的非共极端与该第二LED灯珠202的非共极端在PCB板10的表层进行电连接，以减少PCB板10上过孔101的数量。
在一些实施例中，每一所述第三LED灯珠行230中所述第一LED灯珠201、所述第二LED灯珠202之间的非共极端通过所述PCB板10上的过孔101实现电连接。具体的，如图7所示，当第三LED灯珠行230中第一LED灯珠201、第二LED灯珠202之间的非共极端通过PCB板10上的过孔101实现电连接时，此时与该第一LED灯珠201相邻的第二LED灯珠202的非共极端与该第一LED灯珠201的非共极端在PCB板10的表层进行电连接；与该第二LED灯珠202相邻的第一LED灯珠201的非共极端与该第二LED灯珠202的非共极端在PCB板10的表层进行电连接，以减少PCB板10上过孔101的数量。
可以理解，第三LED灯珠行230中一个第一LED灯珠201对应有一个单独第一LED灯珠行210，一个第二LED灯珠202对应有一个单独的第二LED灯珠行220，第一LED灯珠行210、第二LED灯珠行220为在第一方向上LED灯珠的排布方式，第三LED灯珠行230为第二方向上LED灯珠的排布方式。
还可以理解，图3至图7中LED灯珠的排布方式可以在实际应用中旋转90度，即图3-7中所形成的列扫描线变成行扫描线，行数据线变成列数据线，每个发光像素20中各LED灯珠的则会变成横向排列。
还可以理解，本申请实施例提供的LED灯板结构中的LED灯珠201既可以以COB的方式封装在PCB板10上，也可以以SMD的方式封装在PCB板10上，实际应用可以根据具体情况进行选择，本申请不做具体限定。
具体实施时，以上各个单元或结构可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个单元或结构的具体实施可参见前面的实施例，在此不再赘述。
以上对本申请实施例所提供的一种LED排列结构进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种LED排列结构，包括：
    PCB板；
    设置在所述PCB板上的多个第一LED灯珠以及多个第二LED灯珠；所述第一LED灯珠、所述第二LED灯珠在第一方向、第二方向上呈阵列排布；
    多个所述第一LED灯珠沿所述第二方向形成若干个第一LED灯珠行，多个所述第二LED灯珠沿所述第二方向形成若干个第二LED灯珠行，若干个所述第一LED灯珠、若干个所述第二LED灯珠沿所述第一方向形成多个第三LED灯珠行；
    每一所述第一LED灯珠行中各所述第一LED灯珠之间的共极端电连接以形成一条扫描线；每一所述第二LED灯珠行中各所述第二LED灯珠之间的共极端电连接以形成一条扫描线；每一所述第三LED灯珠行中各所述第一LED灯珠、各所述第二LED灯珠之间的非共极端电连接以形成一条数据线；
    每一所述第三LED灯珠行中两个相邻的所述第一LED灯珠、所述第二LED灯珠之间的共极端或非共极端相邻；所述扫描线、所述数据线在所述PCB板中位于不同层。
  2. 根据权利要求1所述的LED排列结构，其中，各所述扫描线位于所述PCB板的表层，各所述数据线位于所述PCB板的底层。
  3. 根据权利要求1所述的LED排列结构，其中，各所述扫描线位于所述PCB板的表层，各所述数据线位于所述PCB板的内层。
  4. 根据权利要求1所述的LED排列结构，其中，每一所述第一LED灯珠行中若干个相邻的所述第一LED灯珠构成一个发光像素。
  5. 根据权利要求4所述的LED排列结构，其中，每一所述第一LED灯珠行中若干个相邻的所述第一LED灯珠沿第二方向依次排列以构成一个所述发光像素。
  6. 根据权利要求1所述的LED排列结构，其中，每一所述第二LED灯珠行中若干个相邻的所述第二LED灯珠构成一个所述发光像素。
  7. 根据权利要求6所述的LED排列结构，其中，每一所述第二LED灯珠行中若干个相邻的所述第二LED灯珠沿第二方向依次排列以构成一个所述发光像素。
  8. 根据权利要求4或6所述的LED排列结构，其中，每个所述发光像素包括红色LED灯珠、蓝色LED灯珠、绿色LED灯珠。
  9. 根据权利要求4或6所述的LED排列结构，其中，每个所述发光像素均相同。
  10. 根据权利要求1所述的LED排列结构，其中，每一所述第三LED灯珠行中所述第一LED灯珠、所述第二LED灯珠均为相同发光颜色的LED灯珠。
  11. 根据权利要求1所述的LED排列结构，其中，各所述第一LED灯珠为相同尺寸的LED灯珠。
  12. 根据权利要求1所述的LED排列结构，其中，各所述第二LED灯珠为相同尺寸的LED灯珠。
  13. 根据权利要求1所述的LED排列结构，其中，所述第一LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
  14. 根据权利要求1所述的LED排列结构，其中，所述第二LED灯珠为红色LED灯珠、蓝色LED灯珠、绿色LED灯珠中的任意一种。
  15. 根据权利要求1所述的LED排列结构，其中，每一所述第三LED灯珠行中两个相邻的所述第一LED灯珠、所述第二LED灯珠之间的非共极端在所述PCB板的表层电连接。
  16. 根据权利要求1所述的LED排列结构，其中，每一所述第三LED灯珠行中各所述第一LED灯珠的非共极端之间通过所述PCB板上的过孔实现电连接。
  17. 根据权利要求1所述的LED排列结构，其中，每一所述第三LED灯珠行中各所述第二LED灯珠的非共极端之间通过所述PCB板上的过孔实现电连接。
  18. 根据权利要求1所述的LED排列结构，其中，每一所述第三LED灯珠行中所述第一LED灯珠、所述第二LED灯珠之间的非共极端通过所述PCB板上的过孔实现电连接。
  19. 根据权利要求1所述的LED排列结构，其中，所述第一LED灯珠行与所述第二LED灯珠行在所述PCB板上交替排列。
  20. 根据权利要求1所述的LED排列结构，其中，所述第一LED灯珠、所述第二LED灯珠以COB的方式或SMD的方式封装在所述PCB板上。
PCT/CN2022/110067 2022-07-05 2022-08-03 Led排列结构 WO2024007401A1 (zh)

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