WO2024000209A1 - 显示模组和显示装置 - Google Patents

显示模组和显示装置 Download PDF

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Publication number
WO2024000209A1
WO2024000209A1 PCT/CN2022/102100 CN2022102100W WO2024000209A1 WO 2024000209 A1 WO2024000209 A1 WO 2024000209A1 CN 2022102100 W CN2022102100 W CN 2022102100W WO 2024000209 A1 WO2024000209 A1 WO 2024000209A1
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WO
WIPO (PCT)
Prior art keywords
binding
impedance test
substrate
display
connection
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Application number
PCT/CN2022/102100
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English (en)
French (fr)
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WO2024000209A9 (zh
Inventor
刘�文
陆旭
伏安
龚庆
崔志新
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2022/102100 priority Critical patent/WO2024000209A1/zh
Priority to CN202280001945.8A priority patent/CN117652223A/zh
Publication of WO2024000209A1 publication Critical patent/WO2024000209A1/zh
Publication of WO2024000209A9 publication Critical patent/WO2024000209A9/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals

Definitions

  • the embodiments of the present disclosure belong to the field of display technology, and specifically relate to a display module and a display device.
  • an embodiment of the present disclosure provides a display module having a display area and a binding area.
  • the binding area is located at one edge of the display area, and the binding area is adjacent to the display area. adjacency;
  • the display module includes a display substrate and a flexible circuit board
  • the display substrate includes a first substrate, a plurality of first binding terminals, a plurality of first impedance test binding terminals and at least one antenna radiation structure;
  • the plurality of first binding terminals, the plurality of first impedance test binding terminals and the at least one antenna radiation structure are located on the first substrate and in the binding area;
  • the plurality of first impedance test binding terminals are located at at least one end of the plurality of first binding terminals arranged to form a straight line;
  • the flexible circuit board includes a second substrate, a plurality of second binding terminals, a plurality of second impedance test binding terminals and at least one antenna receiving structure;
  • the plurality of second binding terminals, the plurality of second impedance test binding terminals and the at least one antenna receiving structure are located on the second substrate and in the binding area;
  • the plurality of second impedance test binding terminals are located at at least one end of the plurality of second binding terminals arranged to form a straight line;
  • the first binding end and the second binding end are bound and connected;
  • the first impedance test binding end and the second impedance test binding end are bound and connected;
  • One end of the antenna radiation structure is connected to one of the first impedance test binding terminals; the other end is connected to another first impedance test binding terminal;
  • One end of the antenna receiving structure is connected to one of the second impedance test binding terminals, and the other end is connected to another second impedance test binding terminal;
  • the two first impedance test binding ends connected to the antenna radiating structure and the two second impedance test binding ends connected to the antenna receiving structure are bound and connected in a one-to-one correspondence.
  • the antenna radiation structure is located on a side of the first binding end close to the first impedance test binding end;
  • the antenna radiation structure includes spiral wiring, first connecting lines and second connecting lines;
  • One end of the spiral wiring is connected to the first connection line, and the first connection line is connected to one of the first impedance test binding ends;
  • the other end of the spiral trace is connected to the second connection line, and the second connection line is connected to the other first impedance test binding end.
  • the first connection line and the second connection line are located on the same insulating film layer on the first substrate;
  • the spiral wiring and the first connection line are located on different insulating film layers on the first substrate.
  • the spiral trace and the first impedance test binding end are located on the same insulating film layer on the first substrate;
  • the spiral trace and the first impedance test binding end are located on different insulating film layers on the first substrate.
  • the first binding end and the first impedance test binding end are located on the surface of the display side panel of the display substrate.
  • the antenna receiving structure is located on a side of the second binding end close to the second impedance test binding end;
  • the antenna receiving structure includes a third connection line, a fourth connection line, a first connection end and a second connection end;
  • One end of the third connection line is connected to one of the second impedance test binding ends, and the other end is connected to the first connection end;
  • One end of the fourth connection line is connected to the other second impedance test binding end, and the other end is connected to the second connection end.
  • connection line and the fourth connection line are located on the same insulating film layer on the second substrate;
  • the first connection end and the second connection end are located on the same insulating film layer on the second substrate;
  • the third connection line and the first connection terminal are located on different insulating film layers on the second substrate.
  • first connection end and the second connection end are located on the surface of the first side panel of the flexible circuit board
  • the second binding end and the second impedance test binding end are located on the surface of the second side surface of the flexible circuit board;
  • the first side panel surface and the second side panel surface of the flexible circuit board are opposite to each other.
  • it further includes a heat dissipation layer disposed on the back side of the display substrate away from the display side thereof;
  • the heat dissipation layer includes a non-metal sub-layer and a metal sub-layer stacked in sequence away from the display substrate;
  • the binding area of the display substrate is bent to its back side and is located on a side of the heat dissipation layer facing away from the display substrate;
  • the orthographic projection of the antenna radiation structure on the first substrate falls on the heat dissipation layer
  • the orthographic projection of the antenna radiating structure on the first substrate overlaps with the non-metal sub-layer, and the orthographic projection of the antenna radiating structure on the first substrate does not overlap with the metal sub-layer. .
  • the heat dissipation layer further includes an insulating glue layer located on a side of the non-metal sublayer facing away from the display substrate;
  • the orthographic projection of the antenna radiation structure on the first substrate coincides with the insulating glue layer
  • the surface of the side of the insulating glue layer facing away from the non-metal sub-layer is flush with the surface of the side of the metal sub-layer facing away from the non-metal sub-layer.
  • an adhesive layer is further included, located between the binding area of the display substrate that is bent to its back side and the heat dissipation layer, so as to bend the display substrate to its back side.
  • the binding area is bonded to the heat dissipation layer;
  • the adhesive layer has openings in a region corresponding to the antenna radiation structure
  • the openings extend through the thickness of the adhesive layer.
  • the flexible circuit board is located on a side of the heat dissipation layer facing away from the display substrate, and the orthographic projection of the flexible circuit board on the display substrate overlaps with the heat dissipation layer;
  • the first connection end and the second connection end are located on a side surface of the flexible circuit board away from the display substrate.
  • it also includes an antenna radiation signal source located on the side of the flexible circuit board away from the display substrate;
  • the antenna radiation signal source includes a signal output end and a signal feed end
  • the signal output terminal is connected to the first connection terminal, and the signal feed terminal is connected to the second connection terminal.
  • both the first connection end and the second connection end are spring-type connection ends; the signal output end and the signal feed-in end are both spring-type connection terminals.
  • an embodiment of the present disclosure provides a display device, which includes the above-mentioned display module.
  • Figure 1 is a top view of the structure of the NFC antenna.
  • Figure 2 is a schematic diagram of the wiring for testing the bonding connection impedance between the display panel and the flexible circuit board after they are bonded and connected.
  • FIG. 3 is a schematic top view of a partial structure of a display substrate in an embodiment of the present disclosure.
  • Figure 4 is a structural cross-sectional view along the AA' section line in Figure 3.
  • FIG. 5 is a schematic top view of a partial structure of a flexible circuit board in an embodiment of the present disclosure.
  • Figure 6 is a structural cross-sectional view along the BB' line in Figure 5.
  • FIG. 7 is a schematic top view of the partial structure of the display module in the display module according to the embodiment of the present disclosure before the binding area is bent after the display substrate and the flexible circuit board are bound and connected.
  • FIG. 8 is a partial structural side view of the display module in the embodiment of the present disclosure, in which the binding area is bent to the back side of the display substrate after the display substrate and the flexible circuit board are bound and connected.
  • FIG. 9 is a schematic top view of a structure in which an antenna radiation structure is disposed on a flexible circuit board in an embodiment of the present disclosure.
  • Figure 10 is a schematic diagram of the connection structure between the antenna radiation signal source and the antenna receiving structure in an embodiment of the present disclosure.
  • NFC Near Field Communication
  • the general communication distance is about 10cm
  • the operating frequency is 13.5MHZ
  • the maximum transmission rate is 424Kbit; it can be used in mobile devices and consumer products Short-range wireless communication between electronic products, PCs and smart control tools.
  • NFC provides a simple, touch-based solution that allows consumers to exchange information and access content and services simply and intuitively.
  • NFC consists of NFC module and NFC antenna.
  • NFC modules generally consist of a high-speed microcontroller, radio frequency chip and matching circuit.
  • the NFC module provides a radiation signal source for the NFC antenna.
  • the NFC module provides a changing current for the NFC antenna.
  • Figure 1 is a top view of the structure of the NFC antenna; the NFC antenna 16 is generally designed in the form of a closed coil, and the NFC antenna 16 can be regarded as a coupling coil.
  • Ampere's law when the current flows through a section of wire, it will flow around the conductor. A magnetic field is generated, and the magnetic field induction intensity is proportional to the number of coil turns and the coil area, and attenuates with the third power of the distance.
  • the NFC antenna 16 forms an inductance through changes in current in the closed coil to radiate signals outward.
  • the NFC antenna of a mobile phone is usually connected to the NFC module through the ipex interface, and then connected through the antenna transmission line and pasted on the back of the casing, which will have a certain impact on the thickness of the fuselage.
  • FIG 2 is a wiring schematic diagram of testing the impedance of the bonded connection between the display panel and the flexible circuit board after they are bonded and connected.
  • the display panel 17 is connected to the device mainboard by being bonded and connected to the flexible circuit board 11. (such as the main control circuit board, not shown in the figure).
  • the display panel 17 includes a binding area 100 located at one edge of the display area 101.
  • the binding area 100 is adjacent to the display area 101; signal binding terminals 18 are provided in the binding area 100, and the signal binding terminals 18 are connected to flexible
  • the binding end 19 on the circuit board 11 is bonded and connected to realize the connection between the circuit in the display panel 17 and the circuit on the main board of the device.
  • the signal binding terminals 18 in the binding area 100 are usually arranged in a straight line; in order to detect the stability of the binding connection between the display panel 17 and the flexible circuit board 11, it is necessary to test the signal binding terminals 18 in the binding area 100 of the display panel 17.
  • the binding impedance between the terminal 18 and the binding terminal 19 on the flexible circuit board 11 is determined; in actual design, the impedance test binding terminal 20 is usually set at the end of the arrangement of the signal binding terminals 18 in the binding area 100 of the display panel 17 , correspondingly, an impedance test binding terminal 20 is also provided at the end of the binding terminal 19 arrangement of the flexible circuit board 11; during binding, the signal binding terminal 18 in the binding area 100 of the display panel 17 is connected to the flexible circuit board
  • the binding terminal 19 on the display panel 11 is correspondingly bonded and connected; at the same time, the impedance test binding terminal 20 in the binding area 100 of the display panel 17 is correspondingly bonded and connected to the impedance test binding terminal 20 on the flexible circuit board 11 .
  • Two leads 21 are drawn out from one or more (usually four) bonded impedance test binding terminals 20 on the flexible circuit board 11.
  • the two leads 21 are connected to two test points 22 respectively.
  • Each test lead contacts two test points 22 respectively, and the binding impedance between the impedance test binding terminals 20 can be measured.
  • the bonding impedance test between the display panel 17 and the flexible circuit board 11 is carried out during the product trial production stage.
  • the control range of the bonding impedance is set according to the actual measured value of the bonding impedance during the product trial production stage.
  • the actual measured value of the bonding impedance is within the control range.
  • the bonding impedance is deemed to be qualified.
  • the bonding impedance test is performed during the trial production phase of each batch of products. After the bonding impedance test is completed, the impedance test bonding end 20 on the display panel 17 and the flexible circuit board 11 and the test circuit composed thereof (including the leads 21 and Test point 22) remains in the product, but is unused and no longer in use.
  • FIG. 3 shows the present disclosure.
  • the embodiment shows a schematic top view of the partial structure of the substrate;
  • Figure 4 is a structural cross-sectional view along the AA' section line in Figure 3;
  • Figure 5 is a schematic top view of the partial structure of the flexible circuit board in the embodiment of the present disclosure;
  • Figure 6 is a structural cross-sectional view along the BB' line in Figure 5; wherein, the display module has a display area 101 and a binding area 100.
  • the binding area 100 is located at one edge of the display area 101, and the binding area 100 and The display areas 101 are adjacent;
  • the display module includes a display substrate 10 and a flexible circuit board 11;
  • the display substrate 10 includes a first substrate 1, a plurality of first binding terminals 2, a plurality of first impedance test binding terminals 3 and at least One antenna radiating structure 4;
  • a plurality of first binding terminals 2, a plurality of first impedance test binding terminals 3 and at least one antenna radiating structure 4 are located on the first substrate 1 and in the binding area 100;
  • a plurality of first The impedance test binding terminal 3 is located at at least one end of the straight line formed by the plurality of first binding terminals 2;
  • the flexible circuit board 11 includes a second substrate 6, a plurality of second binding terminals 7, and a plurality of second impedance test binding terminals.
  • a plurality of second binding terminals 7, a plurality of second impedance test binding terminals 8 and at least one antenna receiving structure 9 are located on the second substrate 6 and located in the binding area 100;
  • the plurality of second impedance test binding terminals 8 are located at at least one end of the plurality of second binding terminals 7 arranged to form a straight line; the first binding terminal 2 and the second binding terminal 7 are bonded and connected; the first impedance test binding terminal Terminal 3 and the second impedance test binding terminal 8 are bonded and connected; one end of the antenna radiation structure 4 is connected to a first impedance test binding terminal 3; the other end is connected to another first impedance test binding terminal 3; the antenna receiving structure 9 One end is connected to a second impedance test binding terminal 8, and the other end is connected to another second impedance test binding terminal 8; the two first impedance test binding terminals 3 connected to the antenna radiation structure 4 are connected to the antenna receiving structure 9
  • the two second impedance test binding terminals 8 are bonded
  • the plurality of first binding ends 2 are arranged in sequence along the linear direction L; the plurality of second binding ends 7 are arranged in sequence along the linear direction L; the plurality of second binding ends 7 are connected to the plurality of third binding ends.
  • the binding terminals 2 are respectively bound and connected in one-to-one correspondence to realize the connection between the display substrate 10 and the device mainboard through the flexible circuit board 11, so that the device mainboard provides driving or control signals to the display substrate 10.
  • the plurality of second impedance test binding terminals 8 and the plurality of first impedance test binding terminals 3 are respectively bound and connected in a one-to-one correspondence.
  • the first impedance test binding terminal 3 and the second impedance test binding terminal 8 are bonded and connected to test the bonding connection impedance between the display substrate 10 and the flexible circuit board 11 .
  • the two first impedance test binding terminals 3 connected to the antenna radiation structure 4 and the two second impedance test binding terminals 8 connected to the antenna receiving structure 9 are bound in one-to-one correspondence.
  • the connection enables the antenna radiating structure 4 and the antenna receiving structure 9 to form an NFC antenna through the first impedance test binding end 3 and the second impedance test binding end 8 after bonding and connection, that is, the technology disclosed in this embodiment
  • the bonded impedance test circuit originally formed in the display module is reused as an NFC antenna, so that the NFC antenna no longer needs to be pasted on the back of the display module's case, and the thickness of the display module will not be increased, which can be achieved Ultra-thin display module.
  • the antenna radiation structure 4 is located on a side of the first binding end 2 close to the first impedance test binding end 3; the antenna radiation structure 4 includes a spiral trace 40, a first connection line 41 and a second Connecting wire 42; one end of the spiral wire 40 is connected to the first connecting wire 41, and the first connecting wire 41 is connected to a first impedance test binding end 3; the other end of the spiral wire 40 is connected to the second connecting wire 42, and The second connecting wire 42 is connected to the other first impedance test binding terminal 3 .
  • a spiral trace 40 is formed near the first impedance test binding terminal 3 in the binding area 100.
  • the trace 40 can be used as the coil of the NFC antenna; after the first impedance test binding terminal 3 is bonded and connected to the second impedance test binding terminal 8 on the flexible circuit board, the disclosed technology can be formed in the display module
  • the binding impedance test circuit is reused as an NFC antenna, so that the NFC antenna no longer needs to be pasted on the back of the display module's casing, and the thickness of the display module will not be increased, allowing an ultra-thin display module to be realized.
  • a plurality of first impedance test binding terminals 3 are located at both ends of a straight line formed by a plurality of first binding terminals 2 .
  • two antenna radiation structures 4 can also be provided, one is located at both ends of the plurality of first binding ends 2 arranged to form a straight line, and one is located at two ends of the plurality of first binding ends 2 arranged to form a straight line.
  • the first impedance test binds both ends of the Terminal 3 connection.
  • more than three antenna radiation structures 4 may be provided. The area where the two ends of the straight line formed by the plurality of first binding ends 2 is free from other wiring interference can ensure normal signal radiation of the antenna radiation structure 4 .
  • connection between the spiral wiring 40 and the first connection line 41 and the second connection line 42 can be achieved by drilling holes in the insulating film layer 5 .
  • the spiral trace 40 and the first impedance test binding end 3 are located on the same insulating film layer 5 on the first substrate 1 .
  • the spiral trace and the first impedance test binding end are located on different insulation film layers on the first substrate (not shown in the figure).
  • the spiral traces 40 can be formed by laser direct-structuring, printing or etching processes.
  • the first binding terminal 2 and the first impedance test binding terminal 3 are located on the surface of the display side panel of the display substrate 10 . This arrangement facilitates the binding connection between the first binding terminal 2 and the first impedance test binding terminal 3 and the flexible circuit board 11 .
  • the display area 101 is provided with a pixel driving circuit and a light-emitting unit.
  • the pixel driving circuit drives the light-emitting unit to perform display; the light-emitting unit is such as an organic electroluminescent element (ie, an OLED element).
  • the circuit traces in the display area 101 extend to the binding area 100 and are connected to the plurality of first binding terminals 2 in the binding area 100 respectively, so as to be bound to the flexible circuit board through the first binding terminals 2
  • the end-to-end bonded connection is connected to the device motherboard.
  • the device motherboard is used to provide driving or control signals for the display of the light-emitting units in the display area 101 .
  • the spiral trace 40 is simulated and designed to radiate signals toward the display side of the display substrate. Since other antennas in display products (such as wifi antennas, Bluetooth antennas, operator antennas, etc.) are mostly designed on the back side of the display substrate away from the display side, such an arrangement can reduce the mutual signals between the NFC antenna and other antennas. interference to ensure the radiation signal strength of the NFC antenna.
  • the antenna receiving structure 9 is located on a side of the second binding end 7 close to the second impedance test binding end 8; the antenna receiving structure 9 includes a third connecting wire 91, a third Four connecting wires 92, a first connecting terminal 93 and a second connecting terminal 94; one end of the third connecting wire 91 is connected to a second impedance test binding terminal 8, and the other end is connected to the first connecting terminal 93; one end of the fourth connecting wire 92 is connected Another second impedance test binding end 8, the other end is connected to the second connection end 94.
  • the antenna receiving structure 9 is a bonded impedance test circuit originally provided on the flexible circuit board in the public technology.
  • the bonded impedance test circuit originally provided on the flexible circuit board can be reused as an antenna receiving structure. 9; After the second impedance test binding terminal 8 and the first impedance test binding terminal 3 are bound and connected, the circuit connection is realized between the antenna receiving structure 9 and the antenna radiation structure 4, and the overall connected circuit can be used as an NFC Antenna; the first connection terminal 93 and the second connection terminal 94 can be connected to the NFC module provided in the display module, so that the NFC module provides a variable current signal for the NFC antenna, and the spiral wiring in the NFC antenna passes through the variable current An inductance can be formed, thereby radiating signals outward.
  • the NFC antenna no longer needs to be pasted on the back of the display module casing, thereby eliminating the need for It will increase the body thickness of the display module and achieve an ultra-thin display module.
  • the third connection line 91 and the fourth connection line 92 are located on the same insulating film layer 5 on the second substrate 6; the first connection terminal 93 and the second connection terminal 94 are located on the second substrate.
  • the third connection line 91 and the first connection terminal 93 are located on different insulating film layers 5 on the second substrate 6 .
  • the third connection line 91 and the first connection terminal 93 are connected through a via hole opened in the insulating film layer 5 ; the fourth connection line 92 and the second connection terminal 94 are connected through a via hole opened in the insulating film layer 5 Via connection.
  • the third connection line 91 and the fourth connection line 92 are located on the same insulating film layer 5 on the second substrate 6 ; the third connection line 91 and the second impedance test binding end 8 are located on the second substrate 6 on the different insulating film layers 5 on.
  • connection line 91 and the fourth connection line 92 can be connected to the second impedance test binding end 8 through via holes opened in the insulation film layer 5 respectively.
  • the first connection terminal 93 and the second connection terminal 94 are located on the surface of the first side surface of the flexible circuit board 11 ; the second binding terminal 7 and the second impedance test binding terminal 8 are located on the flexible circuit board 11
  • the surface layer of the second side panel; the first side panel and the second side panel of the flexible circuit board 11 are opposite to each other.
  • Such an arrangement facilitates the subsequent binding connection of the second binding terminal 7 with the first binding terminal 2 on the display substrate 10, and the binding connection of the second impedance test binding terminal 8 with the first impedance test binding terminal 3; at the same time,
  • the first connection terminal 93 and the second connection terminal 94 are exposed on the surface of the flexible circuit board 11 to facilitate the connection between the first connection terminal 93 and the second connection terminal 94 and the NFC module.
  • both the first connection end 93 and the second connection end 94 are spring-type connection ends.
  • the spring-type connection terminal enables the connection between the first connection terminal 93 and the second connection terminal 94 and the NFC module without using an ipex interface.
  • the spring-clip type connection terminal can also shorten the antenna transmission line between the NFC antenna and the NFC module. length, thereby reducing the cost of the NFC antenna and the signal interference of the internal circuitry of the display module on the NFC antenna.
  • FIG. 7 is a schematic top view of the partial structure of the display module before the binding area is not bent after the display substrate and the flexible circuit board are bound and connected according to an embodiment of the present disclosure
  • FIG. 8 This is a side view of a partial structure of the display module in the display module according to the embodiment of the present disclosure. After the display substrate and the flexible circuit board are bound and connected, the binding area is bent to the back side of the display substrate.
  • the display module also includes a heat dissipation layer 12 disposed on the display the back side of the substrate 10 away from its display side; the heat dissipation layer 12 includes a non-metal sub-layer 121 and a metal sub-layer 122 stacked in sequence away from the display substrate 10; the binding area 100 of the display substrate 10 is bent to its back side, and Located on the side of the heat dissipation layer 12 away from the display substrate 10; the orthographic projection of the antenna radiation structure 4 of the display substrate 10 on the first substrate falls on the heat dissipation layer 12; the orthographic projection of the antenna radiation structure 4 on the first substrate is different from The metal sub-layers 121 overlap, and the orthographic projection of the antenna radiation structure 4 on the first substrate does not overlap with the metal sub-layers 122 .
  • the display side of the display substrate 10 is also covered with a transparent cover 13 , and the antenna radiation structure 4 is simulated and designed to radiate signals to the transparent cover 13 side.
  • the non-metallic sub-layer 121 includes a foam layer and a glue layer, and the glue layer can attach the heat dissipation layer 12 to the back side of the display substrate 10.
  • the metal sub-layer 122 is made of a metal material with good thermal conductivity, such as copper.
  • the driver chip (such as a data driver chip, not shown in the figure) of the display module is at least partially located on the back side of the display substrate 10 in the area corresponding to the antenna radiation structure 4 in the binding area 100.
  • the driver chip is covered by the non-metal sub-layer 121 of the heat dissipation layer 12, so the absence of the metal sub-layer 122 in the corresponding area of the antenna radiation structure 4 will not affect the heat dissipation of the driver chip.
  • the heat dissipation layer 12 also includes an insulating glue layer 123 located on the side of the non-metallic sub-layer 121 away from the display substrate 10 ; the orthographic projection of the antenna radiation structure 4 on the first substrate is in contact with the insulating glue layer 123 .
  • the layers 123 overlap; the side surface of the insulating glue layer 123 facing away from the non-metal sub-layer 121 is flush with the side surface of the metal sub-layer 122 facing away from the non-metal sub-layer 121 .
  • the provision of the insulating glue layer 123 can avoid step differences on the surface of the heat dissipation layer 12 facing away from the display substrate 10 , thereby avoiding the impact of step differences on the radiation signal of the antenna radiation structure 4 .
  • the display module further includes an adhesive layer 14 located between the binding area 100 of the display substrate 10 that is bent to its back side and the heat dissipation layer 12 to reduce the bending of the display substrate 10 .
  • the binding area 100 folded to its back side is bonded with the heat dissipation layer 12; the adhesive layer 14 has an opening 140 in a region corresponding to the antenna radiation structure 4; the opening 140 runs through the thickness of the adhesive layer 14.
  • the antenna radiation structure 4 requires a relatively open area (i.e., a forbidden area) on one side of the antenna radiation structure 4, a cavity can be formed by opening the opening 140 in the area of the adhesive layer 14 corresponding to the antenna radiation structure 4, thereby ensuring The antenna radiation structure 4 radiates signals to the transparent cover 13 side while maintaining a certain intensity.
  • the adhesive layer 14 may be made of foam glue or other materials.
  • the flexible circuit board 11 is located on the side of the heat dissipation layer 12 away from the display substrate 10 , and the orthographic projection of the flexible circuit board 11 on the display substrate 10 overlaps with the heat dissipation layer 12 .
  • the area on the flexible circuit board 11 except for the second binding end and the second impedance test binding end 8 does not overlap with the binding area 100 of the display substrate 10 bent to the back side; the flexible circuit board 11
  • This arrangement method and the binding method with the display substrate 10 are called reverse binding methods; and the orthographic projection of the flexible circuit board 11 on the display substrate 10 and the binding method in which the display substrate 10 is bent to the back side
  • the arrangement method of the flexible circuit board 11 and the binding method with the display substrate 10 are called forward binding methods; compared with the forward binding method of the flexible circuit board 11, the flexible circuit board 11 is
  • the reverse binding method of the circuit board 11 can make the binding area 100 of the display substrate 10 bent to the back side exposed to a larger area outside the coverage area of the flexible circuit board 11, so that the antenna radiation structure 4 in the binding area 100 can The radiation simulation space utilized is also larger.
  • first connection end 93 and the second connection end 94 of the flexible circuit board 11 are located on a side surface of the flexible circuit board 11 away from the display substrate 10 . This arrangement facilitates the connection of the first connection terminal 93 and the second connection terminal 94 with the NFC module.
  • FIG. 9 a schematic top view of a structure in which an antenna radiation structure is arranged on a flexible circuit board in an embodiment of the present disclosure is shown.
  • the antenna radiation structure 4 is arranged on a display substrate 10 Binding area 100.
  • the wiring area of the circuit on the flexible circuit board 11 is saved, thereby reducing the volume and area of the flexible circuit board 11 and reducing the flexibility.
  • the cost of the circuit board 11; the power supply battery of the display module is usually arranged in an area outside the area where the flexible circuit board 11 is located on the back side of the display substrate 10, and the orthographic projection of the battery on the display substrate 10 falls on the heat dissipation layer 12; then in the flexible circuit
  • the volume and area of the board 11 is reduced, the area occupied by the battery placement area located on the back side of the display substrate 10 in the display module can be increased. Therefore, the battery can be made larger, and the battery has a greater impact on the display module.
  • the power supply also lasts longer.
  • the surface layer of the flexible circuit board 11 is used to protect the protective film layer (usually Anti-electromagnetic interference film or anti-electromagnetic radiation film) does not need to be dug, which makes the protective film layer on the surface of the flexible circuit board 11 have better protective performance.
  • the protective film layer usually Anti-electromagnetic interference film or anti-electromagnetic radiation film
  • the antenna radiation structure 4 is arranged in the binding area 100 of the display substrate 10. The inductance in each area of the spiral wiring 40 is consistent, which can effectively reduce the simulation difficulty of the antenna radiation structure 4.
  • the antenna radiation structure 4 requires a longer trace to be connected to the NFC module, and the longer trace will cause the antenna to Radiating structure 4 is subject to greater signal interference.
  • the solution of arranging the antenna radiation structure 4 in the binding area 100 of the display substrate 10 makes the wiring connecting the antenna radiation structure 4 to the NFC module shorter, reducing the signal interference to the antenna radiation structure 4, thereby ensuring The intensity of the signal radiated by the antenna radiation structure 4 is determined.
  • FIG. 10 is a schematic diagram of the connection structure between the antenna radiation signal source and the antenna receiving structure in the embodiment of the present disclosure; wherein, the display module also includes an antenna radiation signal source 15 located away from the flexible circuit board 11 One side of the display substrate; the antenna radiation signal source 15 includes a signal output terminal 151 and a signal feed terminal 152; the signal output terminal 151 is connected to the first connection terminal 93, and the signal feed terminal 152 is connected to the second connection terminal 94.
  • the antenna radiation signal source 15 is the NFC module.
  • the NFC module generally consists of a high-speed microcontroller, a radio frequency chip and a matching circuit.
  • the NFC module provides a variable current signal to the NFC antenna formed by connecting the antenna radiating structure and the antenna receiving structure.
  • the spiral wiring in the NFC antenna can form an inductance when the variable current passes through, thereby radiating the signal outward.
  • the signal output terminal 151 and the signal feed terminal 152 are spring-type terminals.
  • the spring-type terminal block allows the connection between the first connection terminal 93 and the second connection terminal 94 and the signal output terminal 151 and the signal feed-in terminal 152 without using an ipex interface.
  • the spring-type terminal block can also shorten the NFC antenna.
  • the length of the antenna transmission line between the antenna radiation signal source 15 and the antenna radiation signal source 15 reduces the cost of the NFC antenna and the signal interference of the internal circuitry of the display product on the NFC antenna.
  • the display module provided in the embodiment of the present disclosure uses two first impedance test binding terminals 3 connected to the antenna radiation structure 4 and two second impedance test binding terminals 8 connected to the antenna receiving structure 9 one by one.
  • the antenna radiating structure 4 and the antenna receiving structure 9 can form an NFC antenna through the first impedance test binding terminal 3 and the second impedance test binding terminal 8 after the binding connection, which will be disclosed in the original technology.
  • the bonded impedance test circuit formed in the display module is reused as an NFC antenna, so that the NFC antenna no longer needs to be pasted on the back of the display module's casing, and the thickness of the display module will not be increased, making it possible to achieve ultra-thin Display module.
  • an embodiment of the present disclosure also provides a display device, including the display module in the above embodiment.
  • the NFC antenna no longer needs to be attached to the back of the casing of the display device, thereby not increasing the thickness of the display device, thus enabling an ultra-thin display device.
  • the display device provided by the embodiments of the present disclosure can be an OLED panel, an OLED TV, an OLED billboard, a monitor, a mobile phone, a navigator, or any other product or component with a display function.

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Abstract

本公开实施例提供一种显示模组，包括显示基板和柔性线路板；显示基板包括第一基底、多个第一绑定端、多个第一阻抗测试绑定端和至少一个天线辐射结构；柔性线路板包括第二基底、多个第二绑定端、多个第二阻抗测试绑定端和至少一个天线接收结构；第一绑定端和第二绑定端绑定连接；第一阻抗测试绑定端和第二阻抗测试绑定端绑定连接；天线辐射结构的一端连接一个第一阻抗测试绑定端；另一端连接另一个第一阻抗测试绑定端；天线接收结构的一端连接一个第二阻抗测试绑定端，另一端连接另一个第二阻抗测试绑定端；天线辐射结构连接的两个第一阻抗测试绑定端与天线接收结构连接的两个第二阻抗测试绑定端分别一一对应绑定连接。

Description

显示模组和显示装置 技术领域
本公开实施例属于显示技术领域，具体涉及一种显示模组和显示装置。
背景技术
手机产品内部天线众多，如运营商天线、wifi天线、蓝牙天线、GPS天线等等。公开技术中通常采用贴设到手机背面的钢片天线。由于整机空间限制以及钢片天线尺寸、厚度、组装设计难度和仿真难度较大等缺点，目前主流天线均采用了LDS天线技术。LDS天线技术是激光直接成型技术(Laser-Direct-structuring)，利用计算机按照导电图形的轨迹控制激光的运动，将激光投照到模塑成型的三维塑料器件上，在几秒钟的时间内，活化出电路图案。简单的说(对于手机天线设计与生产)，在成型的塑料支架上，利用激光镭射技术直接在支架上化镀形成金属天线图形。LDS天线技术，可以直接将天线镭射在手机外壳上。
发明内容
第一方面，本公开实施例提供一种显示模组，具有显示区和绑定区，所述绑定区位于所述显示区的一侧边缘，且所述绑定区与所述显示区相邻接；
所述显示模组包括显示基板和柔性线路板；
所述显示基板包括第一基底、多个第一绑定端、多个第一阻抗测试绑定端和至少一个天线辐射结构；
所述多个第一绑定端、所述多个第一阻抗测试绑定端和所述至少一个天线辐射结构位于所述第一基底上，且位于所述绑定区；
所述多个第一阻抗测试绑定端位于所述多个第一绑定端排布形成直线的至少一端；
所述柔性线路板包括第二基底、多个第二绑定端、多个第二阻抗测试绑定端和至少一个天线接收结构；
所述多个第二绑定端、所述多个第二阻抗测试绑定端和所述至少一个 天线接收结构位于所述第二基底上，且位于所述绑定区；
所述多个第二阻抗测试绑定端位于所述多个第二绑定端排布形成直线的至少一端；
所述第一绑定端和所述第二绑定端绑定连接；
所述第一阻抗测试绑定端和所述第二阻抗测试绑定端绑定连接；
所述天线辐射结构的一端连接一个所述第一阻抗测试绑定端；另一端连接另一个所述第一阻抗测试绑定端；
所述天线接收结构的一端连接一个所述第二阻抗测试绑定端，另一端连接另一个所述第二阻抗测试绑定端；
所述天线辐射结构连接的两个所述第一阻抗测试绑定端与所述天线接收结构连接的两个所述第二阻抗测试绑定端分别一一对应绑定连接。
在一些实施例中，所述天线辐射结构位于所述第一绑定端的靠近所述第一阻抗测试绑定端的一侧；
所述天线辐射结构包括螺旋状走线、第一连接线和第二连接线；
所述螺旋状走线的一端连接所述第一连接线，所述第一连接线连接一个所述第一阻抗测试绑定端；
所述螺旋状走线的另一端连接所述第二连接线，所述第二连接线连接另一个所述第一阻抗测试绑定端。
在一些实施例中，所述第一连接线和所述第二连接线位于所述第一基底上的同一绝缘膜层上；
所述螺旋状走线与所述第一连接线位于所述第一基底上的不同绝缘膜层上。
在一些实施例中，所述螺旋状走线与所述第一阻抗测试绑定端位于所述第一基底上的同一绝缘膜层上；
或者，所述螺旋状走线与所述第一阻抗测试绑定端位于所述第一基底上的不同绝缘膜层上。
在一些实施例中，所述第一绑定端和所述第一阻抗测试绑定端位于所述显示基板显示侧板面的表层。
在一些实施例中，所述天线接收结构位于所述第二绑定端的靠近所述 第二阻抗测试绑定端的一侧；
所述天线接收结构包括第三连接线、第四连接线、第一连接端和第二连接端；
所述第三连接线一端连接一个所述第二阻抗测试绑定端，另一端连接所述第一连接端；
所述第四连接线一端连接另一个所述第二阻抗测试绑定端，另一端连接所述第二连接端。
在一些实施例中，所述第三连接线和所述第四连接线位于所述第二基底上的同一绝缘膜层上；
所述第一连接端和所述第二连接端位于所述第二基底上的同一绝缘膜层上；
所述第三连接线和所述第一连接端位于所述第二基底上的不同绝缘膜层上。
在一些实施例中，所述第一连接端和所述第二连接端位于所述柔性线路板第一侧板面的表层；
所述第二绑定端和所述第二阻抗测试绑定端位于所述柔性线路板第二侧板面的表层；
所述柔性线路板的第一侧板面和第二侧板面相对。
在一些实施例中，还包括散热层，设置于所述显示基板的背离其显示侧的背侧；
所述散热层包括依次远离所述显示基板叠置的非金属子层和金属子层；
所述显示基板的绑定区弯折至其背侧，且位于所述散热层的背离所述显示基板的一侧；
所述天线辐射结构在第一基底上的正投影落入所述散热层上；
所述天线辐射结构在所述第一基底上的正投影与所述非金属子层交叠，且所述天线辐射结构在所述第一基底上的正投影与所述金属子层不交叠。
在一些实施例中，所述散热层还包括绝缘胶层，位于所述非金属子层 的背离所述显示基板的一侧；
所述天线辐射结构在所述第一基底上的正投影与所述绝缘胶层重合；
所述绝缘胶层的背离所述非金属子层的一侧表面与所述金属子层的背离所述非金属子层的一侧表面平齐。
在一些实施例中，还包括粘结层，位于所述显示基板的弯折至其背侧的绑定区与所述散热层之间，以将所述显示基板的弯折至其背侧的绑定区与所述散热层粘结在一起；
所述粘结层在对应所述天线辐射结构的区域开设有开口；
所述开口贯穿所述粘结层的厚度。
在一些实施例中，所述柔性线路板位于所述散热层背离所述显示基板的一侧，且所述柔性线路板在所述显示基板上的正投影与所述散热层交叠；
所述第一连接端和所述第二连接端位于所述柔性线路板的背离所述显示基板的一侧表面。
在一些实施例中，还包括天线辐射信号源，位于所述柔性线路板背离所述显示基板的一侧；
所述天线辐射信号源包括信号输出端和信号馈入端；
所述信号输出端连接所述第一连接端，所述信号馈入端连接所述第二连接端。
在一些实施例中，所述第一连接端和所述第二连接端均为弹片式连接端；所述信号输出端和所述信号馈入端均为弹片式接线端子。
第二方面，本公开实施例提供一种显示装置，其中，包括上述显示模组。
附图说明
附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细示例实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见，在附图中：
图1为NFC天线的结构俯视图。
图2为显示面板与柔性线路板绑定连接后测试二者之间绑定连接阻抗 的走线示意图。
图3为本公开实施例中显示基板的局部结构俯视示意图。
图4为沿图3中AA＇剖切线的结构剖视图。
图5为本公开实施例中柔性线路板的局部结构俯视示意图。
图6为沿图5中BB＇剖切线的结构剖视图。
图7为本公开实施例的显示模组中显示基板与柔性线路板绑定连接后绑定区未弯折前的局部结构俯视示意图。
图8为本公开实施例的显示模组中显示基板与柔性线路板绑定连接后绑定区弯折到显示基板背侧的局部结构侧视图。
图9为本公开实施例中一种将天线辐射结构设置在柔性线路板上的结构俯视示意图。
图10为本公开实施例中天线辐射信号源与天线接收结构之间的连接结构示意图。
具体实施方式
为使本领域技术人员更好地理解本公开实施例的技术方案，下面结合附图和具体实施方式对本公开实施例提供的一种显示模组和显示装置作进一步详细描述。
在下文中将参考附图更充分地描述本公开实施例，但是所示的实施例可以以不同形式来体现，且不应当被解释为限于本公开阐述的实施例。反之，提供这些实施例的目的在于使本公开透彻和完整，并将使本领域技术人员充分理解本公开的范围。
本公开实施例不限于附图中所示的实施例，而是包括基于制造工艺而形成的配置的修改。因此，附图中例示的区具有示意性属性，并且图中所示区的形状例示了区的具体形状，但并不是旨在限制性的。
NFC(Near Field Communication，近距离无线通讯技术)是一种非接触式射频识别的近场通讯技术，一般通信距离为10cm左右，运行频率13.5MHZ，传输速率最大424Kbit；可以在移动设备、消费类电子产品、PC和智能控件工具间进行近距离无线通信。NFC提供了一种简单、触控式的解决方案，可以让消费者简单直观地交换信息、访问内容与服务。
NFC由NFC模块与NFC天线组成。NFC模块一般由一个高速单片机、射频芯片与匹配电路组成。NFC模块为NFC天线提供辐射信号源，如NFC模块为NFC天线提供变化的电流。
公开技术中，参照图1，为NFC天线的结构俯视图；NFC天线16一般设计为闭合式线圈形态，NFC天线16可以看作一个耦合线圈,根据安培定律，电流流过一段导线时会在导体周围产生磁场,且该磁场感应强度正比于线圈匝数和线圈面积，并随着距离的3次方衰减。NFC天线16通过闭合线圈中电流的变化形成电感，以向外辐射信号。
公开技术中，手机的NFC天线通常是通过ipex接口连接NFC模块，然后通过天线传输线连接并粘贴在机壳背面，这会对机身厚度产生一定影响。
公开技术中，参照图2，为显示面板与柔性线路板绑定连接后测试二者之间绑定连接阻抗的走线示意图，显示面板17通过与柔性线路板11绑定连接实现其与设备主板(如主控制电路板，图中未示出)之间的电路连接。显示面板17包括绑定区100，位于显示区101的一侧边缘，绑定区100与显示区101相邻接；绑定区100内设置有信号绑定端子18，信号绑定端子18与柔性线路板11上的绑定端19绑定连接，以实现显示面板17中的电路与设备主板上电路的连接。绑定区100内的信号绑定端子18通常排布呈直线；为了检测显示面板17与柔性线路板11之间的绑定连接的稳定性，需要测试显示面板17绑定区100内的信号绑定端子18与柔性线路板11上的绑定端19之间的绑定阻抗；实际设计中，通常在显示面板17绑定区100信号绑定端子18排布的末端设置阻抗测试绑定端20，相应地，在柔性线路板11的绑定端19排布的末端也设置阻抗测试绑定端20；绑定时，将显示面板17绑定区100内的信号绑定端子18与柔性线路板11上的绑定端19对应绑定连接；同时将显示面板17绑定区100内的阻抗测试绑定端20与柔性线路板11上的阻抗测试绑定端20相应绑定连接。柔性线路板11上在一个或多个(一般为四个)绑定连接的阻抗测试绑定端20上引出两条引线21，两条引线21分别连接到两个测试点22，通过万用表的两个表笔分别接触两个测试点22，即可测出阻抗测试绑定端20之间的绑定阻抗。
显示面板17与柔性线路板11之间的绑定阻抗测试在产品试产阶段进 行，根据产品试产阶段的绑定阻抗实测值设定绑定阻抗的管控范围，绑定阻抗实测值在管控范围内即认为绑定阻抗合格。绑定阻抗测试在每个批次产品的试产阶段进行，绑定阻抗测试完毕后显示面板17和柔性线路板11上的阻抗测试绑定端20以及由其构成的测试电路(包括引线21和测试点22)保留在产品中，但闲置不再使用。
为了解决手机的NFC天线粘贴在机壳背面，会对机身厚度产生一定影响的问题，第一方面，本公开实施例提供一种显示模组，参照图3和图4，图3为本公开实施例中显示基板的局部结构俯视示意图；图4为沿图3中AA＇剖切线的结构剖视图；参照图5和图6，图5为本公开实施例中柔性线路板的局部结构俯视示意图；图6为沿图5中BB＇剖切线的结构剖视图；其中，显示模组，具有显示区101和绑定区100，绑定区100位于显示区101的一侧边缘，且绑定区100与显示区101相邻接；显示模组包括显示基板10和柔性线路板11；显示基板10包括第一基底1、多个第一绑定端2、多个第一阻抗测试绑定端3和至少一个天线辐射结构4；多个第一绑定端2、多个第一阻抗测试绑定端3和至少一个天线辐射结构4位于第一基底1上，且位于绑定区100；多个第一阻抗测试绑定端3位于多个第一绑定端2排布形成直线的至少一端；柔性线路板11包括第二基底6、多个第二绑定端7、多个第二阻抗测试绑定端8和至少一个天线接收结构9；多个第二绑定端7、多个第二阻抗测试绑定端8和至少一个天线接收结构9位于第二基底6上，且位于绑定区100；多个第二阻抗测试绑定端8位于多个第二绑定端7排布形成直线的至少一端；第一绑定端2和第二绑定端7绑定连接；第一阻抗测试绑定端3和第二阻抗测试绑定端8绑定连接；天线辐射结构4的一端连接一个第一阻抗测试绑定端3；另一端连接另一个第一阻抗测试绑定端3；天线接收结构9的一端连接一个第二阻抗测试绑定端8，另一端连接另一个第二阻抗测试绑定端8；天线辐射结构4连接的两个第一阻抗测试绑定端3与天线接收结构9连接的两个第二阻抗测试绑定端8分别一一对应绑定连接。
在一些实施例中，多个第一绑定端2沿直线方向L依次排布；多个第二绑定端7沿直线方向L依次排布；多个第二绑定端7与多个第一绑定端2 分别一一对应绑定连接，以实现显示基板10通过柔性线路板11与设备主板之间的连接，从而实现设备主板为显示基板10提供驱动或者控制信号。多个第二阻抗测试绑定端8与多个第一阻抗测试绑定端3分别一一对应绑定连接。第一阻抗测试绑定端3和第二阻抗测试绑定端8绑定连接，以测试显示基板10与柔性线路板11之间的绑定连接阻抗。
本实施例中所提供的显示模组，天线辐射结构4连接的两个第一阻抗测试绑定端3与天线接收结构9连接的两个第二阻抗测试绑定端8分别一一对应绑定连接，能使天线辐射结构4和天线接收结构9之间通过绑定连接后的第一阻抗测试绑定端3和第二阻抗测试绑定端8形成NFC天线，即本实施例中将公开技术中原本形成在显示模组中的绑定阻抗测试电路复用作NFC天线，从而使NFC天线无需再粘贴在显示模组的机壳背面，进而不会增加显示模组的机身厚度，可以实现超薄显示模组。
在一些实施例中，天线辐射结构4位于第一绑定端2的靠近第一阻抗测试绑定端3的一侧；天线辐射结构4包括螺旋状走线40、第一连接线41和第二连接线42；螺旋状走线40的一端连接第一连接线41，第一连接线41连接一个第一阻抗测试绑定端3；螺旋状走线40的另一端连接第二连接线42，第二连接线42连接另一个第一阻抗测试绑定端3。
本实施例中，基于公开技术中原本设置在显示基板上的第一阻抗测试绑定端3，在绑定区100内第一阻抗测试绑定端3的附近形成螺旋状走线40，螺旋状走线40可作为NFC天线的线圈；在第一阻抗测试绑定端3与柔性线路板上的第二阻抗测试绑定端8绑定连接之后，可将公开技术中原本形成在显示模组中的绑定阻抗测试电路复用作NFC天线，从而使NFC天线无需再粘贴在显示模组的机壳背面，进而不会增加显示模组的机身厚度，可以实现超薄显示模组。
在一些实施例中，多个第一阻抗测试绑定端3位于多个第一绑定端2排布形成直线的两端。
在一些实施例中，天线辐射结构4可以设置一个，位于多个第一绑定端2排布形成直线的一端，且与位于多个第一绑定端2排布形成直线一端的第一阻抗测试绑定端3连接。
在一些实施例中，天线辐射结构4也可以设置两个，分别位于多个第一绑定端2排布形成直线的两端，且分别与位于多个第一绑定端2排布形成直线两端的第一阻抗测试绑定端3连接。在一些实施例中，天线辐射结构4也可以设置三个以上。多个第一绑定端2排布形成直线的两端所在区域没有其他走线干扰，能够确保天线辐射结构4的正常信号辐射。
在一些实施例中，参照图4，第一连接线41和第二连接线42位于第一基底1上的同一绝缘膜层5上；螺旋状走线40与第一连接线41位于第一基底1上的不同绝缘膜层5上。
其中，螺旋状走线40与第一连接线41和第二连接线42之间的连接可通过在绝缘膜层5中打过孔实现。
在一些实施例中，参照图4，螺旋状走线40与第一阻抗测试绑定端3位于第一基底1上的同一绝缘膜层5上。
在一些实施例中，螺旋状走线与第一阻抗测试绑定端位于第一基底上的不同绝缘膜层上(图中未示出)。
在一些实施例中，螺旋状走线40可以通过激光直接成型技术(Laser-Direct-structuring)、印刷或者蚀刻工艺制作形成。
在一些实施例中，参照图3，第一绑定端2和第一阻抗测试绑定端3位于显示基板10显示侧板面的表层。如此设置，便于第一绑定端2和第一阻抗测试绑定端3与柔性线路板11之间的绑定连接。
在一些实施例中，显示区101设置有像素驱动电路和发光单元，像素驱动电路驱动发光单元进行显示；发光单元如有机电致发光元件(即OLED元件)。显示区101内的电路走线延伸至绑定区100，并与绑定区100内的多个第一绑定端2分别对应连接，以便通过第一绑定端2与柔性线路板上绑定端的绑定连接与设备主板连接。设备主板用于为显示区101内发光单元的显示提供驱动或者控制信号。
在一些实施例中，将螺旋状走线40仿真设计为朝向显示基板的显示侧辐射信号。由于显示产品中的其他天线(如wifi天线、蓝牙天线、运营商天线等)大多设计在显示基板的背离其显示侧的背侧，所以如此设置，能够减少NFC天线与其他天线之间的相互信号干扰，确保NFC天线的辐射信 号强度。
在一些实施例中，第一基底1可以采用柔性材料，如聚酰亚胺等材料。显示基板中的绝缘膜层5也可以包含柔性材料，从而可以实现显示基板的柔性弯折，进而可实现显示基板或者显示产品的柔性显示。
在一些实施例中，参照图5和图6，天线接收结构9位于第二绑定端7的靠近第二阻抗测试绑定端8的一侧；天线接收结构9包括第三连接线91、第四连接线92、第一连接端93和第二连接端94；第三连接线91一端连接一个第二阻抗测试绑定端8，另一端连接第一连接端93；第四连接线92一端连接另一个第二阻抗测试绑定端8，另一端连接第二连接端94。
其中，天线接收结构9是公开技术中原本设置在柔性线路板上的绑定阻抗测试线路，本实施例中，该原本设置在柔性线路板上的绑定阻抗测试线路可复用作天线接收结构9；在第二阻抗测试绑定端8与第一阻抗测试绑定端3绑定连接之后，天线接收结构9与天线辐射结构4之间实现了电路连接，整体连接后的电路可用作NFC天线；第一连接端93和第二连接端94可与设置在显示模组中NFC模块连接，以便NFC模块为NFC天线提供可变电流信号，NFC天线中的螺旋状走线在可变电流经过时可形成电感，从而向外辐射信号。
本公开实施例中，通过将公开技术中原本设置在柔性线路板上的绑定阻抗测试线路复用作天线接收结构9，从而使NFC天线无需再粘贴在显示模组的机壳背面，进而不会增加显示模组的机身厚度，可以实现超薄显示模组。
在一些实施例中，参照图6，第三连接线91和第四连接线92位于第二基底6上的同一绝缘膜层5上；第一连接端93和第二连接端94位于第二基底6上的同一绝缘膜层5上，第三连接线91和第一连接端93位于第二基底6上的不同绝缘膜层5上。
在一些实施例中，第三连接线91与第一连接端93通过开设在绝缘膜层5中的过孔连接；第四连接线92与第二连接端94通过开设在绝缘膜层5中的过孔连接。
在一些实施例中，第三连接线91和第四连接线92位于第二基底6上 的同一绝缘膜层5上；第三连接线91与第二阻抗测试绑定端8位于第二基底6上的不同绝缘膜层5上。
在一些实施例中，第三连接线91和第四连接线92可分别通过开设在绝缘膜层5中的过孔连接第二阻抗测试绑定端8。
在一些实施例中，第一连接端93和第二连接端94位于柔性线路板11第一侧板面的表层；第二绑定端7和第二阻抗测试绑定端8位于柔性线路板11第二侧板面的表层；柔性线路板11的第一侧板面和第二侧板面相对。如此设置，便于后续第二绑定端7与显示基板10上的第一绑定端2绑定连接，第二阻抗测试绑定端8与第一阻抗测试绑定端3绑定连接；同时还便于第一连接端93和第二连接端94裸露在柔性线路板11的表面，以方便第一连接端93和第二连接端94与NFC模块之间的连接。
在一些实施例中，第一连接端93和第二连接端94均为弹片式连接端。弹片式连接端使第一连接端93和第二连接端94与NFC模块之间无需再采用ipex接口即可实现连接，同时，弹片式连接端还能缩短NFC天线与NFC模块之间的天线传输线的长度，从而降低了NFC天线成本以及显示模组内部线路对NFC天线的信号干涉。
在一些实施例中，参照图7和图8，图7为本公开实施例的显示模组中显示基板与柔性线路板绑定连接后绑定区未弯折前的局部结构俯视示意图；图8为本公开实施例的显示模组中显示基板与柔性线路板绑定连接后绑定区弯折到显示基板背侧的局部结构侧视图；其中，显示模组还包括散热层12，设置于显示基板10的背离其显示侧的背侧；散热层12包括依次远离显示基板10叠置的非金属子层121和金属子层122；显示基板10的绑定区100弯折至其背侧，且位于散热层12的背离显示基板10的一侧；显示基板10的天线辐射结构4在第一基底上的正投影落入散热层12上；天线辐射结构4在第一基底上的正投影与非金属子层121交叠，且天线辐射结构4在第一基底上的正投影与金属子层122不交叠。
在一些实施例中，参照图8，显示基板10的显示侧还覆盖有透明盖板13，天线辐射结构4被仿真设计为向透明盖板13侧辐射信号。
在一些实施例中，非金属子层121包括泡棉层和胶层，胶层能将散热 层12贴设于显示基板10背侧。金属子层122采用具有良好导热性能的金属材料，如铜。通过使天线辐射结构4在第一基底上的正投影与金属子层122不交叠，能够避免金属子层122对天线辐射结构4辐射的信号造成屏蔽，从而确保天线辐射结构4辐射的信号能够正常向显示基板的显示侧辐射。
在一些实施例中，显示模组的驱动芯片(如数据驱动芯片，图中未示出)至少部分位于显示基板10背侧对应绑定区100内天线辐射结构4的区域，但由于该区域的驱动芯片被散热层12的非金属子层121覆盖，所以天线辐射结构4对应区域金属子层122的缺失并不会影响驱动芯片的散热。
在一些实施例中，参照图8，散热层12还包括绝缘胶层123，位于非金属子层121的背离显示基板10的一侧；天线辐射结构4在第一基底上的正投影与绝缘胶层123重合；绝缘胶层123的背离非金属子层121的一侧表面与金属子层122的背离非金属子层121的一侧表面平齐。绝缘胶层123的设置，能够避免散热层12的背离显示基板10的一侧表面出现段差，从而避免段差对天线辐射结构4辐射信号的影响。
在一些实施例中，参照图8，显示模组还包括粘结层14，位于显示基板10的弯折至其背侧的绑定区100与散热层12之间，以将显示基板10的弯折至其背侧的绑定区100与散热层12粘结在一起；粘结层14在对应天线辐射结构4的区域开设有开口140；开口140贯穿粘结层14的厚度。由于天线辐射结构4在其辐射信号的一侧需要一个相对空旷的区域(即禁空区)，通过在粘结层14对应天线辐射结构4的区域开设开口140，能够形成一个空腔，从而确保天线辐射结构4辐射信号能够保持一定强度向透明盖板13侧辐射。
在一些实施例中，粘结层14可以采用泡棉胶等材料。
在一些实施例中，参照图8，柔性线路板11位于散热层12背离显示基板10的一侧，且柔性线路板11在显示基板10上的正投影与散热层12交叠。本实施例中，柔性线路板11上除第二绑定端和第二阻抗测试绑定端8以外的区域与显示基板10弯折到背侧的绑定区100不交叠；柔性线路板11的这种设置方式和与显示基板10之间的绑定方式被称作反向绑定方式；而柔性线路板11在显示基板10上的正投影与显示基板10弯折到背侧的绑定 区100基本完全交叠时，柔性线路板11的设置方式和与显示基板10之间的绑定方式被称作正向绑定方式；相比于柔性线路板11的正向绑定方式，柔性线路板11的反向绑定方式能使显示基板10弯折到背侧的绑定区100裸露在柔性线路板11覆盖区域以外的面积更大，从而使绑定区100内天线辐射结构4可利用的辐射仿真空间也更大。
在一些实施例中，柔性线路板11的第一连接端93和第二连接端94位于柔性线路板11的背离显示基板10的一侧表面。如此设置，便于第一连接端93和第二连接端94与NFC模块连接。
参照图9，为本公开实施例中一种将天线辐射结构设置在柔性线路板上的结构俯视示意图；本实施例中，参照图7和图8，将天线辐射结构4设置在显示基板10的绑定区100。相较于图9中将天线辐射结构4设置在柔性线路板11上的方案，节省了柔性线路板11上线路的走线面积，从而可以使柔性线路板11的体积和面积减小，降低柔性线路板11成本；显示模组的供电电池通常设置在显示基板10背侧柔性线路板11所在区域以外的区域，且电池在显示基板10上的正投影落在散热层12上；进而在柔性线路板11体积和面积减小的情况下，能使显示模组中位于显示基板10背侧的电池安置区所占区域面积增大，由此，电池可以做的更大，电池对显示模组的供电也更持久。
另外，参照图7-图9，相比较于将天线辐射结构4设置在柔性线路板11上的方案，本实施例中柔性线路板11表层用于保护其中电路走线的保护膜层(通常为防电磁干扰膜或者防电磁辐射膜)可以不用挖开，这使柔性线路板11表层的保护膜层的防护性能更好。
进一步地，参照图7-图9，将天线辐射结构4设置在柔性线路板11上的方案，由于绑定端的影响，螺旋状走线40的靠近绑定端的区域与远离绑定端的区域电感量不能做到一致，天线辐射结构4的仿真难度较高。而本实施例中将天线辐射结构4设置在显示基板10绑定区100的方案，螺旋状走线40各区域的电感量一致，可以有效降低天线辐射结构4的仿真难度。
更进一步地，参照图7-图9，将天线辐射结构4设置在柔性线路板11上的方案，天线辐射结构4需要较长的走线才能连接到NFC模块，较长的 走线会使天线辐射结构4受到较大的信号干扰。而本实施例中将天线辐射结构4设置在显示基板10绑定区100的方案，则使天线辐射结构4连接到NFC模块的走线更短，减少天线辐射结构4受到的信号干扰，从而确保了天线辐射结构4辐射信号的强度。
在一些实施例中，参照图10，为本公开实施例中天线辐射信号源与天线接收结构之间的连接结构示意图；其中，显示模组还包括天线辐射信号源15，位于柔性线路板11背离显示基板的一侧；天线辐射信号源15包括信号输出端151和信号馈入端152；信号输出端151连接第一连接端93，信号馈入端152连接第二连接端94。
其中，天线辐射信号源15即NFC模块，NFC模块一般由一个高速单片机、射频芯片与匹配电路组成。NFC模块为由天线辐射结构和天线接收结构连接形成的NFC天线提供可变电流信号，NFC天线中的螺旋状走线在可变电流经过时可形成电感，从而向外辐射信号。
在一些实施例中，参照图10，信号输出端151和信号馈入端152均为弹片式接线端子。弹片式接线端子使第一连接端93和第二连接端94与信号输出端151和信号馈入端152之间无需再采用ipex接口即可实现连接，同时，弹片式接线端子还能缩短NFC天线与天线辐射信号源15之间的天线传输线的长度，从而降低了NFC天线成本以及显示产品内部线路对NFC天线的信号干涉。
本公开实施例中所提供的显示模组，通过使天线辐射结构4连接的两个第一阻抗测试绑定端3与天线接收结构9连接的两个第二阻抗测试绑定端8分别一一对应绑定连接，能使天线辐射结构4和天线接收结构9之间通过绑定连接后的第一阻抗测试绑定端3和第二阻抗测试绑定端8形成NFC天线，即将公开技术中原本形成在显示模组中的绑定阻抗测试电路复用作NFC天线，从而使NFC天线无需再粘贴在显示模组的机壳背面，进而不会增加显示模组的机身厚度，可以实现超薄显示模组。
第二方面，本公开实施例还提供一种显示装置，包括上述实施例中的显示模组。
通过采用上述实施例中的显示模组，使NFC天线无需再粘贴在显示装 置的机壳背面，进而不会增加显示装置的机身厚度，可以实现超薄显示装置。
本公开实施例所提供的显示装置可以为OLED面板、OLED电视、OLED广告牌、显示器、手机、导航仪等任何具有显示功能的产品或部件。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (15)

  1. 一种显示模组，具有显示区和绑定区，所述绑定区位于所述显示区的一侧边缘，且所述绑定区与所述显示区相邻接；
    所述显示模组包括显示基板和柔性线路板；
    所述显示基板包括第一基底、多个第一绑定端、多个第一阻抗测试绑定端和至少一个天线辐射结构；
    所述多个第一绑定端、所述多个第一阻抗测试绑定端和所述至少一个天线辐射结构位于所述第一基底上，且位于所述绑定区；
    所述多个第一阻抗测试绑定端位于所述多个第一绑定端排布形成直线的至少一端；
    所述柔性线路板包括第二基底、多个第二绑定端、多个第二阻抗测试绑定端和至少一个天线接收结构；
    所述多个第二绑定端、所述多个第二阻抗测试绑定端和所述至少一个天线接收结构位于所述第二基底上，且位于所述绑定区；
    所述多个第二阻抗测试绑定端位于所述多个第二绑定端排布形成直线的至少一端；
    所述第一绑定端和所述第二绑定端绑定连接；
    所述第一阻抗测试绑定端和所述第二阻抗测试绑定端绑定连接；
    所述天线辐射结构的一端连接一个所述第一阻抗测试绑定端；另一端连接另一个所述第一阻抗测试绑定端；
    所述天线接收结构的一端连接一个所述第二阻抗测试绑定端，另一端连接另一个所述第二阻抗测试绑定端；
    所述天线辐射结构连接的两个所述第一阻抗测试绑定端与所述天线接收结构连接的两个所述第二阻抗测试绑定端分别一一对应绑定连接。
  2. 根据权利要求1所述的显示模组，其中，所述天线辐射结构位于所述第一绑定端的靠近所述第一阻抗测试绑定端的一侧；
    所述天线辐射结构包括螺旋状走线、第一连接线和第二连接线；
    所述螺旋状走线的一端连接所述第一连接线，所述第一连接线连接一个所述第一阻抗测试绑定端；
    所述螺旋状走线的另一端连接所述第二连接线，所述第二连接线连接另一个所述第一阻抗测试绑定端。
  3. 根据权利要求2所述的显示模组，其中，所述第一连接线和所述第二连接线位于所述第一基底上的同一绝缘膜层上；
    所述螺旋状走线与所述第一连接线位于所述第一基底上的不同绝缘膜层上。
  4. 根据权利要求3所述的显示模组，其中，所述螺旋状走线与所述第一阻抗测试绑定端位于所述第一基底上的同一绝缘膜层上；
    或者，所述螺旋状走线与所述第一阻抗测试绑定端位于所述第一基底上的不同绝缘膜层上。
  5. 根据权利要求1-4任意一项所述的显示模组，其中，所述第一绑定端和所述第一阻抗测试绑定端位于所述显示基板显示侧板面的表层。
  6. 根据权利要求1所述的显示模组，其中，所述天线接收结构位于所述第二绑定端的靠近所述第二阻抗测试绑定端的一侧；
    所述天线接收结构包括第三连接线、第四连接线、第一连接端和第二连接端；
    所述第三连接线一端连接一个所述第二阻抗测试绑定端，另一端连接所述第一连接端；
    所述第四连接线一端连接另一个所述第二阻抗测试绑定端，另一端连接所述第二连接端。
  7. 根据权利要求6所述的显示模组，其中，所述第三连接线和所述第四连接线位于所述第二基底上的同一绝缘膜层上；
    所述第一连接端和所述第二连接端位于所述第二基底上的同一绝缘膜层上；
    所述第三连接线和所述第一连接端位于所述第二基底上的不同绝缘膜层上。
  8. 根据权利要求7所述的显示模组，其中，所述第一连接端和所述第二连接端位于所述柔性线路板第一侧板面的表层；
    所述第二绑定端和所述第二阻抗测试绑定端位于所述柔性线路板第二侧板面的表层；
    所述柔性线路板的第一侧板面和第二侧板面相对。
  9. 根据权利要求8所述的显示模组，其中，还包括散热层，设置于所述显示基板的背离其显示侧的背侧；
    所述散热层包括依次远离所述显示基板叠置的非金属子层和金属子层；
    所述显示基板的绑定区弯折至其背侧，且位于所述散热层的背离所述显示基板的一侧；
    所述天线辐射结构在第一基底上的正投影落入所述散热层上；
    所述天线辐射结构在所述第一基底上的正投影与所述非金属子层交叠，且所述天线辐射结构在所述第一基底上的正投影与所述金属子层不交叠。
  10. 根据权利要求9所述的显示模组，其中，所述散热层还包括绝缘胶层，位于所述非金属子层的背离所述显示基板的一侧；
    所述天线辐射结构在所述第一基底上的正投影与所述绝缘胶层重合；
    所述绝缘胶层的背离所述非金属子层的一侧表面与所述金属子层的背离所述非金属子层的一侧表面平齐。
  11. 根据权利要求10所述的显示模组，其中，还包括粘结层，位于所 述显示基板的弯折至其背侧的绑定区与所述散热层之间，以将所述显示基板的弯折至其背侧的绑定区与所述散热层粘结在一起；
    所述粘结层在对应所述天线辐射结构的区域开设有开口；
    所述开口贯穿所述粘结层的厚度。
  12. 根据权利要求9所述的显示模组，其中，所述柔性线路板位于所述散热层背离所述显示基板的一侧，且所述柔性线路板在所述显示基板上的正投影与所述散热层交叠；
    所述第一连接端和所述第二连接端位于所述柔性线路板的背离所述显示基板的一侧表面。
  13. 根据权利要求12所述的显示模组，其中，还包括天线辐射信号源，位于所述柔性线路板背离所述显示基板的一侧；
    所述天线辐射信号源包括信号输出端和信号馈入端；
    所述信号输出端连接所述第一连接端，所述信号馈入端连接所述第二连接端。
  14. 根据权利要求13所述的显示模组，其中，所述第一连接端和所述第二连接端均为弹片式连接端；所述信号输出端和所述信号馈入端均为弹片式接线端子。
  15. 一种显示装置，其中，包括权利要求1-14任意一项所述的显示模组。
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