WO2023280673A1 - Lösbares folienlaminat und verfahren zum lösen dauerhafter verklebungen - Google Patents
Lösbares folienlaminat und verfahren zum lösen dauerhafter verklebungen Download PDFInfo
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- WO2023280673A1 WO2023280673A1 PCT/EP2022/068079 EP2022068079W WO2023280673A1 WO 2023280673 A1 WO2023280673 A1 WO 2023280673A1 EP 2022068079 W EP2022068079 W EP 2022068079W WO 2023280673 A1 WO2023280673 A1 WO 2023280673A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- adhesive
- film laminate
- acrylate
- film
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
- C09J2400/123—Ceramic in the substrate
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Definitions
- the present invention relates to a film laminate, designed and set up to be separated after permanent bonding, comprising a first layer of adhesive, a first carrier material, a release layer and a second layer of adhesive. Furthermore, the present invention includes a method for detaching a permanent bond effected by means of such a film laminate.
- Small household appliances also included in white goods: for example vacuum cleaners, coffee machines, microwaves;
- Information and communication technology devices for example computers, monitors, printers, Flandys, telephones;
- Consumer electronics devices for example televisions, video recorders, digital cameras;
- Foil laminates in the form of double-sided adhesive tapes are used, for example, to bond two components together. As a rule, these components should be permanently bonded to one another by such a film laminate. This should lead to a corresponding longevity and resilience of the bond or the product. Examples of components connected in this way are touch panels, such as those used in computer screens or mobile electronic devices. If one of the two components is damaged, the bonded assembly cannot be separated at all or only with a great deal of (force) effort in order to replace a component. There is also a risk that damage will occur to the undamaged component during separation.
- DE 102020209557 A1 discloses a film laminate, designed and set up to be separated after permanent bonding, comprising the following layers:
- the separating layer having a thickness of 40 nm to 500 nm, that the first PSA layer is laser beam translucent and that the separating layer consists of a metal that can be at least partially removed by laser irradiation.
- a metal is removed by means of a laser, which leads to the separation.
- Translucency is the partial transparency of a body. The word is derived from the Latin lux for light. Wax, human skin, leaves and many other materials are translucent because they partially transmit light but are not transparent. In contrast to transparency, translucency can be described as the transmission of light. The reciprocal property of translucency is opacity. So if a substance has a high translucency, it has a low opacity and vice versa.
- light transmission means transparent at the respective wavelength of the light.
- a black body for example a black-colored polymer is opaque in the visible range of light for humans, but is translucent in the non-visible range such as NIR, i.e. it can be irradiated in this wavelength range.
- EP 3390553 A1 relates to a method for bonding two surfaces using a reactive adhesive film system comprising at least two adhesive films (F1 and F2), the adhesive films each comprising at least one reactive component (R1 and R2), the bond being carried out by a reaction is effected, which requires the presence of both reactive components (R1 and R2), whereby before the bonding between the adhesive films (F1 and F2) to be brought into contact with one another for the reaction, a separating layer (T ) is provided.
- the separating layer (T) is removed at least partially by means of a laser in order to effect the adhesion, so that the adhesive films (F1 and F2) come into direct contact with one another and the reaction begins with the presence of the two reactive components (R1 and R2).
- the separating layer can be a metal layer. This can be a metal foil that is inserted between the adhesive films during the manufacture of the adhesive tape; for example by a lamination process.
- EP 3 178 660 B1 discloses a personalizable security element having a carrier substrate and an optically variable layer, the security element having the following layer sequence: a) a carrier substrate consisting of a flexible plastic film that has a laser-writable black metallic coating or a coating of a thermally activated dye or of paper which has a direct thermal coating b) optionally a laminating adhesive layer c) a layer of a liquid-crystalline material or a color-shift effect coating With regard to the laser-writable black metallization, reference is made to EP 1 567 363 B1.
- EP 1 567 363 B1 describes a film that can be inscribed with a laser beam, which has at least one single-layer or multi-layer top film that is permeable to the laser beam, underneath which a medium that can be changed by the laser beam is arranged at least over part of the surface, which medium is embedded in a matrix material and is microscopic metallic Has particles that give the medium opacity and are so destructible by laser action that the medium is locally transparent. Microscopic is to be understood as meaning particles whose diameter in the direction of their greatest extent does not significantly exceed 100 ⁇ m. The metallic particles impart opacity to the medium that can be altered by the laser beam, but can be destroyed locally by the laser effect.
- lasers for ablation are widespread, for example in micromachining some laser beam sources can be used for ablative processes. Extremely thin layers can be removed from substrates, as local heating leads to particulate debris or carbonization/evaporation.
- lasers in the wavelength range from 800 to 2000 nm are mainly used.
- Excimer lasers are often used for photochemical reactions with low heat exposure.
- Excimer laser means that the laser beams are in the UV wavelength range. The emission wavelengths of the most important lasers are clearly shown in FIG.
- Metal-coated foils can be decoated excellently at 1.064 ⁇ m since the carrier foils typically used (for example polyester, polypropylene) are permeable at this wavelength.
- the translucency allows the metal layer to be removed without damaging the polymer film. The beam path can therefore also go through the film.
- the Nd:YAG laser is ideal for removing metal layers over a large area, since the layer is ablated via sublimation.
- USP ultra short pulse
- Laser beam sources that emit pulsed laser light with pulse durations in the picosecond and femtosecond range are referred to as ultrashort pulse lasers.
- Ultra-short pulse lasers emit light pulses in which the light energy is compressed to extremely short times, which means that light outputs in the megawatt range are achieved during the pulse. Intensities of many gigawatts per square centimeter can be achieved through appropriate spatial focusing. At such high intensities, non-linear effects occur in the interaction of light and matter. One of these effects is the so-called multi-photon absorption, which leads to the fact that at sufficient almost any material can be removed at high intensities. This is especially true for femtosecond lasers. Neither their absorption, hardness nor evaporation temperature play a role here, and even demanding materials such as composites can be processed without any problems.
- ultrashort pulse lasers are their high precision. Focus diameters in the micrometer range and the low energy input per pulse enable spatially highly resolved laser ablation. The following applies: the shorter the pulse duration, the less the surrounding material is damaged by the laser beam and the more precisely the material can be removed. The result is clean cut edges without burrs, so that post-processing is not necessary. In metal processing, nanosecond pulses are usually sufficient, picosecond pulses are required for more delicate processing, and femtosecond pulses are used for non-metallic materials such as ceramics, polymers and many composite materials. However, the lower material removal with a shorter pulse duration means that the processing takes longer overall.
- the present invention relates to a film laminate configured and adapted to be separated after permanent bonding, comprising the following
- Layers a) a first layer of adhesive, preferably a pressure-sensitive adhesive layer, b) a first carrier material, preferably in the form of a film, c) a release layer, d) optionally a second carrier material, preferably in the form of a film, e) a second layer of adhesive, preferably one flat adhesive layer
- the release layer is characterized by the following properties:
- the release layer has a thickness of 40 nm to 500 nm.
- the release liner is black.
- the release layer has a maximum transmittance of 30%.
- the separating layer consists of a metal that can be at least partially removed by laser irradiation.
- the second layer of adhesive is laser beam translucent and/or the first layer of adhesive and the first backing material are laser beam translucent.
- the object is also achieved by a method for releasing a permanent bond created by means of a film laminate according to the invention, in that the separating layer is removed at least over part of the area by means of laser irradiation and the film laminate is separated into a first partial laminate and a second partial laminate.
- Two substrates for example glass/glass, glass/metal, glass/plastic or plastic/plastic, can be permanently bonded with such a foil laminate.
- the bond strength between the two (flaft) adhesive layers can be reduced to such an extent that the layers can be separated very easily. In the best case, the bond strength is almost completely abolished. This means that a bond that actually took place as a connection that could no longer be changed can still be canceled again.
- the metal layer is removed by ablating or sublimating the metal layer.
- the film laminate also comprises a first backing layer, which can be laser beam translucent.
- adhesion of the metal can be ensured with such a backing layer, since the material of the backing layer can be adapted to the requirements of the metal without having to take the properties of the layer of adhesive into account.
- the material of the carrier layer can be selected in such a way that the adhesion of the metal separating layer is particularly good.
- the film laminate has a second backing material between the second layer of adhesive and the separating layer, which is also optionally laser beam translucent.
- the first backing material is laser beam translucent at least together with the first layer of adhesive if the second layer of adhesive and/or the optionally provided second backing material are not laser beam translucent.
- the second layer of adhesive and the optionally provided second backing material are laser beam translucent if the first backing material and/or the first layer of adhesive are not laser beam translucent.
- first carrier material and/or the second carrier material are connected to the release layer via a laminating adhesive.
- a laminating adhesive is preferably located only between the second carrier material and the separating layer.
- laminating adhesives are used as the laminating adhesive.
- a carrier layer with the metal and to connect the other carrier layer by means of the laminating adhesive, which can also be referred to as a laminating or laminating adhesive layer.
- the present invention further relates to a method for detaching a permanent bond created by means of a film laminate according to the invention, in which the release layer is removed at least partially by means of laser irradiation and the film laminate is separated into a first partial laminate and a second partial laminate. Forces are preferably applied to at least one of the partial laminates, which increase the distance between the two partial laminates. A particularly good and safe separation of the foil laminate into two partial laminates is thus possible.
- a typical structure of a film laminate according to the invention is thus as follows: a) first layer of flat adhesive b) first backing layer c) laminating adhesive layer d) release layer e) laminating adhesive layer f) second backing layer g) second layer of flat adhesive, with only layers a), b), d) and g) are mandatory, while the other layers are optional, albeit preferred.
- first layer of flat adhesive and the first backing layer are translucent for the laser radiation used, or the second layer of flat adhesive is translucent so that the laser can penetrate to the separating layer.
- the substrate to be bonded at least on the side from which the laser radiation is introduced. This substrate must also be permeable to the laser radiation.
- the release layer itself absorbs the laser radiation.
- laminating adhesive in principle, all solvent-based, solvent-free and aqueous laminating adhesives known in the prior art with different polymer bases, for example polyurethane, polyester, polyethylene or ethylene vinyl acetate, can be used as the laminating or laminating adhesive.
- the laminating adhesive is preferably a polyurethane-based laminating adhesive.
- Polyurethane-based means here that a polyurethane or the totality of several polyurethanes form the main component of the polymer composition of this laminating adhesive, i.e. make up the largest proportion of the polymer composition.
- Solvent-free polyurethane laminating adhesives can be available as one- or two-component systems. Other differences can arise from the structure of the Polyurethane and the type of crosslinking result. The following polymers are often preferred:
- 1-component system low molecular weight prepolymers, NCO-terminated, moisture-curing;
- 2-component system prepolymers with NCO end groups + polyols.
- Aromatic isocyanates are often used, but they are problematic when they come into contact with food, since primary aromatic amines can be formed. Occasionally, aliphatic isocyanates are used, especially when UV stability is required. In principle, better adhesion and faster curing can be achieved with aromatic isocyanates.
- Polyether-polyurethanes usually have a higher temperature stability than polyester-polyurethanes.
- the polyol component often consists of a mixture of polyester and polyether polyols. Tri- and higher functionalized polyols are also often used to generate additional crosslinking effects, which in turn often results in higher temperature stability.
- the laminating adhesive is preferably a polyether-polyurethane-based laminating adhesive that is based on a solvent-free 2-component system. It has also proven to be advantageous to subject the surfaces to be bonded to one another to a corona pretreatment before bonding.
- the laminating adhesive layer(s) are advantageously used in thicknesses of 1 to 10 ⁇ m, more preferably in thicknesses of 3 to 5 ⁇ m.
- the backing layer or layers of the film laminate are preferably made of polyethylene terephthalate, polyethylene or polypropylene, with biaxially oriented polypropylene (BOPP) or biaxially oriented polyethylene terephthalate (PET) films being particularly preferred.
- BOPP biaxially oriented polypropylene
- PET biaxially oriented polyethylene terephthalate
- Metals adhere particularly well to PET and PP foils. PET and PP films can also be vapour-deposited very well in a vacuum, which simplifies the application of the metal.
- the carrier layers can be colored, it being necessary to ensure that the substances used for the coloring ensure that the laser beam permeability is maintained.
- Organic dyes are therefore particularly suitable for coloring.
- the thickness of the respective carrier material is preferably 2 to 100 ⁇ m, more preferably 10 to 80 ⁇ m, in particular 12 to 50 ⁇ m.
- a shiny metallic appearance of adhesive tapes is undesirable, particularly in display bonding.
- Adhesive tapes for fixing/mounting displays are therefore usually deep black and have a very high opacity. These also serve as a design element in the displays. Therefore, the use of a black metallization is the subject of this invention.
- one of the two carrier layers that may be present is colored black, for example with a black pigment such as carbon black, in particular pigment black.
- the opacity can be further increased by using a black film.
- Black pigments are added to the carrier materials for coloring.
- black pigments are carbon black, organic azo dyes and/or chromium complexes.
- chromium complex-based black pigments are [1-[(2-hydroxy-4-nitrophenyl)azo]-2-naphthalenolato(2-)][1-[(2-hydroxy-5-nitrophenyl)azo]-2-naphthalenolato( 2-)]chromate(1-), bis[1-[(2-hydroxy-4-nitrophenyl)azo]-2-naphthalenolato (2-)]chromate(1-) and bis[1-[(2-hydroxy -5-nitrophenyl)azo]-2-naphthalenolato(2-)] chromate(1-).
- Black pigments are preferably used in amounts such that the proportion of black pigments is not more than 8% by volume.
- black pigments are added in the range from 1.3 to 1.8% by volume.
- carbon black particles are added as black pigments, they are preferably used in an amount of up to 12% by weight, based on the colored (ie mixed with color pigments) adhesive. So that excellent coloring is achieved, it is advantageous to use carbon black in an amount of at least 1.2% by weight. If carbon black is used as the black pigment, this is very preferably used in an amount such that the carrier material has a proportion by weight of carbon black of from 2.1 to 3.1% by weight.
- Suitable carbon blacks are:
- the separating layer is designed as a black metal layer, also referred to as a metallic layer.
- a black metal layer also referred to as a metallic layer.
- metal includes metals, but also alloys or metal oxides.
- the metal layer can be a metal foil which is introduced during manufacture of the laminate; for example by a lamination process.
- the separating layer can also be realized excellently by vapor deposition, sputtering, electrostatic coating or other application of the material in small-scale, atomic, ionic or molecular form, in particular metals, metal oxides or the like. This can be done, for example, on one of the pressure-sensitive adhesive layers or on one of the carrier materials.
- the separating layer provided according to the invention very preferably lies over the entire surface and as a closed layer between the first carrier material and the second adhesive layer or between the first carrier material and the second carrier material.
- the release layer can also be in contact with one or two layers of laminating adhesive.
- the separating layer provided according to the invention is advantageously used in thicknesses of 40 nm to 500 nm, more preferably in thicknesses of 100 nm to 250 nm.
- a layer of Al, Cu, Ag, Au, Pt, Pd, Zn, Cr, Ti and the like is particularly suitable as the metal layer, with the usual impurities in the metals not being ruled out.
- Aluminum has proven to be particularly suitable as a metal.
- a layer made of an alloy is also within the scope of the invention.
- An alloy is a macroscopically homogeneous metallic material made up of at least two elements (components), of which at least one is a metal and which together have the metal-typical feature of metal bonding.
- layers made of copper or titanium or of metal oxide (MeOx layers) can be used as separating layers according to the invention.
- beneficial Metal oxide layers consist, for example, of silicon dioxide (S1O2), titanium dioxide (T1O2) or zinc tin oxide (ZnSnO), or they comprise one or more of these metal oxides.
- the metal oxides more preferably include boron oxides, aluminum oxides, molybdates, vanadates and include their hydroxides and hydrated oxides or mixtures thereof.
- the coating is advantageously deposited over the entire surface and as a closed layer, in particular by metals—such as, for example, aluminum, copper, or titanium—or metal oxides—such as, for example, S1O2, T1O2, and/or ZnSnO.
- the layer thicknesses produced have a thickness of 40 nm to 500 nm.
- the metal or metal oxide layer is optimally produced by coating using the sputtering process.
- Sputtering (“sputter coating”), also called cathode atomization under high vacuum, means the removal or dusting of material from a solid by energetic ion bombardment in order to coat a substrate with the dusted material.
- the magnetron sputtering method that can be used according to the invention is a so-called PVD (Physical Vapor Deposition) method.
- the stable vacuum coating process enables a high level of uniformity and purity of the layer.
- the procedure is preferably such that the coating source (sputtering source) generates a low-pressure plasma from an inert gas (typically argon), which takes place in a vacuum chamber in the pressure range from 10 3 to 10 2 mbar.
- the starting material for the layer is the so-called target, which is located in the sputtering source.
- the sputter process technology is technically at a very high level and is also suitable as a manufacturing process for mass production. However, galvanic electrolysis or the CVD (Chemical Vapor Deposition) process can also be used to produce the separating layer.
- the metallic separating layer has a transmission of at most 30%, preferably at most 20%, particularly preferably at most 5%. This means that most of the incoming laser radiation is absorbed in the separating layer.
- the following values are preferably realized for the metallic separating layer:
- the metallic separating layer consists of aluminum oxide and has a maximum transmission of 20% and/or the above parameters in the L * a * b * color space CIE 1976.
- the separating layer is removed by a laser, in particular by ablation or sublimation.
- the procedure is such that the laser is radiated from one side through the foil laminate.
- the separating layer can be removed over the entire area, or it is only removed in one or more areas or in sections. This can be used to control how large the remaining contact area should be. In this way, a predetermined breaking point can be produced at which a separation occurs with little further stress, while initially (ie after the laser irradiation) a connection is maintained. If the separating layer is completely removed, the film laminate can also be separated 100% within less than a second. Originally permanently connected substrates can thus be separated from one another very quickly and cleanly in a simple manner.
- customary standard lasers can be used as lasers.
- the laser wavelength used is preferably selected in such a way that the laser radiation can emit with the highest transmission through the pressure-sensitive adhesive and other possible layers of the film laminate. In the wavelength range from 800 to 2000 nm, for example, there is little or no readiness for absorption for customary acrylate PSAs.
- the adhesive systems according to the invention are also translucent in this area. Preference is given to using solid-state lasers whose wavelength is outstandingly suitable for irradiating conventional adhesives and release materials. Nd:YAG solid-state lasers are particularly preferably used.
- An Nd:YAG laser (short for neodymium-doped yttrium aluminum garnet laser) is a solid-state laser that uses a neodymium-doped YAG crystal as the active medium and mostly emits infrared radiation with a wavelength of 1064 nm. Further transitions exist at 946 nm, 1320 nm and 1444 nm. The wavelength of the emitted light of this laser is - as described above - in the range of 1064 pm. As a rule, this wavelength is not absorbed by the adhesive layers used, so that these materials are translucent for the relevant wavelength.
- the carrier layers - for example made of polyethylene terephthalate (PET) - can be irradiated with this wavelength without damage.
- the radiation can be converted into other wavelengths by generating the second (532 nm) and third (355 nm) harmonics.
- all gas lasers, dye lasers, solid-state lasers, metal vapor lasers and excimer lasers with the appropriate wavelengths are suitable.
- the sets of laser parameters used for an application and the associated laser strategy depend on the adhesive systems used (absorbing and non-absorbing adhesives).
- a pressure-sensitive adhesive or a pressure-sensitive adhesive mass is understood to mean a substance which—particularly at room temperature—is permanently tacky and adhesive.
- a characteristic of a pressure-sensitive adhesive is that it can be applied to a substrate by pressure and remains stuck there, with the pressure to be applied and the duration of action of this pressure not being defined in more detail. In some cases, depending on the exact nature of the pressure-sensitive adhesive, the temperature and humidity, and the substrate, exposure to momentary, minimal pressure, beyond a light touch for a brief moment, is sufficient does not go beyond this in order to achieve the adhesion effect, in other cases a longer period of exposure to high pressure may also be necessary.
- Pressure-sensitive adhesives have special, characteristic viscoelastic properties that result in permanent tack and adhesiveness.
- the proportionate viscous flow is necessary to achieve adhesion. Only the viscous portions, caused by macromolecules with relatively high mobility, enable good wetting and good flow onto the substrate to be bonded. A high proportion of viscous flow leads to high pressure-sensitive tack (also known as tack or surface tack) and therefore often to high bond strength.
- Highly crosslinked systems, crystalline or glass-like solidified polymers are generally not, or at least only slightly, tacky due to the lack of free-flowing components.
- the proportional elastic restoring forces are necessary to achieve cohesion. They are caused, for example, by very long-chained and heavily entangled macromolecules as well as by physically or chemically crosslinked macromolecules and enable the forces acting on an adhesive bond to be transmitted. They mean that an adhesive bond can withstand a permanent load acting on it, for example in the form of a permanent shearing load, to a sufficient extent over a longer period of time.
- the quantities storage modulus (G') and loss modulus (G") which can be determined using dynamic mechanical analysis (DMA), can be used for a more precise description and quantification of the extent of elastic and viscous components and the ratio of the components to one another.
- G' is a measure of the elastic part
- G" a measure for the viscous part of a substance. Both quantities depend on the deformation frequency and the temperature. The sizes can be determined using a rheometer.
- the material to be examined is exposed to a sinusoidal oscillating shear stress in a plate-plate arrangement, for example.
- the deformation is measured as a function of time and the time offset of this deformation compared to the introduction of the shear stress. This time offset is referred to as the phase angle d.
- a substance is generally considered to be pressure-sensitive and is defined as pressure-sensitive for the purposes of this document if, at room temperature, here by definition at 23 °C, in the deformation frequency range of 10° to 10 1 rad/sec, G' is at least partly in the range of 10 3 to 10 7 Pa and if G" also lies at least in part in this range. In part means that at least a portion of the G' curve lies within the window defined by the strain frequency range of 10° to 10 1 rad inclusive /sec (abscissa) and the range of G' values from 10 3 to 10 7 Pa inclusive (ordinate) and when at least a portion of the G'' curve lies within this window accordingly.
- the two PSA layers preferably contain at least one polymer selected from the group consisting of poly(meth)acrylates, natural rubber, synthetic rubbers, here in particular vinylaromatic block copolymers, silicones, polyurethanes and mixtures of two or more of the polymers listed above.
- the outer layer of PSA particularly preferably comprises at least one poly(meth)acrylate.
- at least one of the two pressure-sensitive adhesive layers contains at least 40% by weight of one or more poly(meth)acrylate(s).
- the outer layer of PSA contains no further polymers apart from one or more poly(meth)acrylates.
- poly (meth) acrylates are - according to the general understanding - understood poly mers, which are accessible by free-radical polymerization of acrylic and / or methylacrylic monomers and optionally other copolymerizable monomers.
- the term "poly(meth)acrylate” includes both polymers based on acrylic acid and derivatives thereof, those based on acrylic acid and methacrylic acid and derivatives thereof, and those based on methacrylic acid and derivatives thereof, the polymers always being acrylic esters , Methacrylic acid esters or mixtures of acrylic and methacrylic acid esters.
- the poly(meth)acrylates of the outer PSA layer preferably have an average molar mass M w of not more than 2,000,000 g/mol.
- the monomers of the poly(meth)acrylates of the outer layer of pressure-sensitive adhesive and their quantitative composition are preferably selected in such a way that according to the so-called Fox equation (E1)
- n represents the running number over the monomers used
- w n the mass fraction of the respective monomer n (% by weight)
- Tb,h the respective glass transition temperature of the homopolymer from the respective monomers n in Kelvin.
- the two layers of pressure-sensitive adhesive preferably contain one or more poly(meth)acrylate(s), which can be traced back to the following monomer composition: a) acrylic esters and/or methacrylic esters of the formula (F1)
- Examples of monomers a) are methyl acrylate, methyl methacrylate, ethyl acrylate, n-butyl acrylate, n-butyl methacrylate, n-pentyl acrylate, n-hexyl acrylate, n-heptyl acrylate, n-octyl acrylate, n-octyl methacrylate, n-nonyl acrylate, lauryl acrylate, stearyl acrylate, Behenyl acrylate and its branched isomers such as isobutyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isooctyl acrylate, isooctyl methacrylate.
- R" particularly preferably represents a methyl, an n-butyl and a 2-ethylhexyl group, in particular an n-butyl and a 2-ethylhexyl group, or the monomers a) are selected from n-butyl acrylate and 2-ethylhexyl acrylate.
- the monomers b) are preferably olefinically unsaturated monomers with functional groups which can react with epoxide groups.
- the monomers b) particularly preferably each contain at least one functional group selected from the group consisting of hydroxy, carboxy, sulfonic acid and phosphonic acid groups, acid anhydride functions, epoxide groups and substituted or unsubstituted amino groups.
- the monomers b) are selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid, aconitic acid, dimethylacrylic acid, ß-acryloyloxypropionic acid, trichloroacrylic acid, vinylacetic acid, vinylphosphonic acid, maleic anhydride, 2-hydroxyethyl acrylate, 3-hydroxy propyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 6-hydroxyhexyl methacrylate, allyl alcohol, glycidyl acrylate and glycidyl methacrylate. Very particular preference is given to the monomers b) acrylic acid and/or methacrylic acid, especially acrylic acid.
- Possible monomers c) are in principle all vinylically functionalized compounds which are copolymerizable with the monomers a) and the monomers b). Properties of the pressure-sensitive adhesive of the invention can advantageously be regulated with the selection and amount of the monomers c).
- the monomers c) are particularly preferably selected from the group consisting of methyl acrylate, ethyl acrylate, n-propyl acrylate, methyl methacrylate, ethyl methacrylate, benzyl acrylate, benzyl methacrylate, sec-butyl acrylate, tert-butyl acrylate, phenyl acrylate, phenyl methacrylate, isobornyl acrylate, isobornyl methacrylate, tert-butylphenyl acrylate, tert-butylaphenyl methacrylate, dodecyl methacrylate, isodecyl acrylate, lauryl acrylate, n-undecyl acrylate, stearyl acrylate, tridecyl acrylate, behenyl acrylate, cyclohexyl methacrylate, cyclopentyl methacrylate, phenoxyethy
- the monomer c) is methyl acrylate.
- the monomers c) can advantageously also be selected in such a way that they contain functional groups which support radiation-chemical crosslinking (for example by electron beams or UV).
- suitable copolymerizable photoinitiators are benzoin acrylate and acrylate-functionalized benzophenone derivatives.
- monomers that promote electron beam crosslinking are tetrahydrofurfuryl acrylate, N-tert-butylacrylamide, and allyl acrylate.
- the layers of PSA comprise a plurality of poly(meth)acrylates
- preference is given to attributing all the poly(meth)acrylates of the layers of PSA to the monomer composition described above.
- all the poly(meth)acrylates of the layers of PSA can be traced back to a monomer composition consisting of acrylic acid, n-butyl acrylate, 2-ethylhexyl acrylate and methyl acrylate.
- the poly(meth)acrylate or all poly(meth)acrylates of the pressure-sensitive adhesive layers are very particularly preferably due to the following monomer composition:
- 2-ethylhexyl acrylate from 30 to 60% by weight, n-butyl acrylate from 25 to 50% by weight, the proportions of the monomers adding up to 100% by weight.
- the pressure-sensitive adhesive layers contain at least one tackifying resin which is selected from the group consisting of pinene, indene and rosin resins and their disproportionated, hydrogenated, polymerized, esterified derivatives and salts; aliphatic and aromatic hydrocarbon resins, terpene resins, terpene phenolic resins, and mixtures of two or more of the tackifying resins listed above.
- tackifying resin which is selected from the group consisting of pinene, indene and rosin resins and their disproportionated, hydrogenated, polymerized, esterified derivatives and salts; aliphatic and aromatic hydrocarbon resins, terpene resins, terpene phenolic resins, and mixtures of two or more of the tackifying resins listed above.
- hydrocarbon resins all (soluble) resins compatible with the corresponding poly(meth)acrylate can be used, in particular all aliphatic, aromatic, alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins, in particular on C 5 to Cg hydrocarbon resins.
- the layers of pressure-sensitive adhesive particularly preferably contain at least one tackifying resin selected from terpene phenolic resins and C 5 to Cg hydrocarbon resins.
- the pressure-sensitive adhesive layers contain a terpene-phenolic resin.
- Substrates that are particularly suitable for bonding using the adhesive system according to the invention are metals, glass and/or plastics.
- the substrates to be bonded can be the same or different.
- the reactive adhesive system according to the invention is used for bonding metals, glass and plastics.
- polycarbonates and anodized aluminum are bonded.
- the surfaces of the substrates may be bonded to be pretreated by a physical, chemical and/or physico-chemical process.
- a primer or an adhesion promoter composition is advantageous.
- the metal substrates to be bonded can generally be made from all common metals and metal alloys. Metals such as aluminum, stainless steel, steel, magnesium, zinc, nickel, brass, copper, titanium, ferrous metals and alloys are preferably used. The parts to be bonded can also be made of different metals.
- Suitable plastic substrates are, for example, acrylonitrile butadiene styrene copolymers (ABS), polycarbonates (PC), ABS/PC blends, PMMA, polyamides, glass fiber reinforced polyamides, polyvinyl chloride, polyvinylene fluoride, cellulose acetate, cycloolefin copolymers, liquid crystal polymers (LCP), Polylactide, polyetherketones, polyetherimide, polyethersulfone, polymethacrylmethylimide, polymethylpentene, polyphenylether, polyphenylene sulfide, polyphthalamide, polyurethanes, polyvinyl acetate, styrene, acrylonitrile copolymers, polyacrylates or polymethacrylates, polyoxymethylene, acrylic ester-styrene-acrylonitrile copolymers, polyethylene, polystyrene, polypropylene and/or Polyesters such as polybutylene terephthalate (P
- the film laminate according to the invention is in particular in the form of a flat adhesive tape, specifically a double-sided flat adhesive tape.
- adheresive tape flat adhesive tape
- adheresive strips pressure-sensitive adhesive strips
- the adhesive tape thus has a longitudinal extension (x-direction) and a width extension (y-direction).
- the adhesive tape also has a thickness (z-direction) perpendicular to both dimensions, with the width dimension and longitudinal dimension being many times greater than the thickness.
- the thickness is as uniform as possible, preferably exactly the same, over the entire surface area of the adhesive tape, which is determined by length and width.
- the double-sided adhesive tape it is possible to use different layers of flat adhesive or a combination of layers of adhesive and backing.
- the properties that can be influenced in this way include the thickness, stiffness, flexibility, temperature resistance, elasticity and flame resistance of the adhesive tape.
- the same (flat) adhesives can also be used for the two (pressure-sensitive) adhesive layers.
- the film laminate according to the invention There are a large number of possible applications for the film laminate according to the invention.
- the dismantling of touch panels has already been mentioned. Given the importance of mobile phones, this is a particularly important area of application. On the one hand, a very strong and, above all, sealing adhesion of mobile phone displays is required. On the other hand, it is often necessary to remove the display.
- the film laminate according to the invention is ideally suited for this purpose.
- a further field of application for the present invention is security labels. In principle, it is not desirable for security labels to be removable. However, there are also applications where a certain level of security combined with removability under certain circumstances is desired. By using the present invention, which requires the use of a laser, simple removal is not possible, so that there is a certain protection against manipulation. With the appropriate technical effort, however, the label can then be removed again.
- the present invention can also be used when processing material in roll form in so-called splicing.
- the solution according to the invention offers advantages, in particular when the release layer is in direct contact with the two carrier layers or in contact with the preferably non-tacky laminating adhesive layers.
- the molecular weight determinations of the number-average molecular weights Mn and the weight-average molecular weights Mw are carried out by means of gel permeation chromatography (GPC). THF (tetrahydrofuran) with 0.1% by volume of trifluoroacetic acid is used as the eluent. The measurement takes place at 23 °C. PSS-SDV, 10 m, 10 3 ⁇ , ID 8.0 mm x 50 mm is used as the guard column. The columns PSS-SDV, 10 m, 10 3 as well as 10 5 and 10 7 each with an ID of 8.0 mm x 300 mm are used for the separation. The sample concentration is 0.5 g/l, the flow rate is 0.5 ml per minute.
- the calibration is carried out using the commercially available ReadyCal kit Poly(styrene) high from PSS Polymer Standard Service GmbH, Mainz. This is universally converted to polymethyl methacrylate (PMMA) using the Mark-Houwink parameters K and alpha, so that the data is given in PMMA mass equivalents.
- PMMA polymethyl methacrylate
- An FAYb (fiber laser) laser emitting at 1.06 pm is used.
- the laser is manufactured by SUNX/Panasonic Electric Works.
- the laser is marketed under the designation LP-V10.
- a black metallized film with a thickness of 12 gm and consisting of a transparent PET film is coated on the exposed surface with an acrylate-based adhesive at an application weight of 50 g/m 2 .
- the metallic layer consists of aluminum oxide and has a thickness of 100 nm.
- the transmission from the metallic layer is 20% compared to the laser light used for laser treatment.
- a second PET film colored black with carbon black and having a thickness of 12 gm is coated on the underside with an acrylate-based adhesive with an application weight of 50 g/m 2 .
- the film On the top side, the film has a polyurethane-based laminating adhesive layer with a thickness of 3 gm. This is glued to the metallic layer.
- the double-sided adhesive tape is glued between two glass bodies so that they are connected to each other.
- the glass bodies each have a thickness of 2 mm.
- the optimum sublimation of the metallic layer between the two layers of adhesive is set using a test matrix of laser power, frequency and deflection speed.
- the multi-layer composite is separated by the resulting material-free intermediate layer. As a result of the sublimation and the subsequent condensation of the gaseous metal vapor on the adhesive, this surface is no longer adhesive. The connection can then be separated.
- the following parameters are set on the laser:
- FIG. 2 shows the structure of the double-sided adhesive tape 2 and the use thereof.
- the adhesive tape 2 is located between two substrates 11, 12, both of which consist of glass layers here.
- the adhesive tape 2 has a 12 ⁇ m thick PET film 22 to which a black metallic layer 23 with a thickness of 100 nm is applied.
- An adhesive layer 21 , 24 is applied to the top and bottom of the carrier made of PET film 22 and metallic layer 23 .
- the laser beam 31 ablates the metallic layer 23, as a result of which the layer 12 of adhesive underneath is passivated, which leads to a loss of adhesive strength.
- FIG. 3 shows the structure of a variant of the double-sided adhesive tape 2 and the use thereof.
- the adhesive tape 2 is located between two substrates 11, 12, both of which consist of glass layers here.
- the adhesive tape 2 has a 12 ⁇ m thick PET film 22 to which a metallic layer 23 with a thickness of 100 nm is applied.
- the metallic layer 23 is connected to a black-colored PET film 25 with a thickness of 12 ⁇ m via a non-adhesive laminating adhesive layer 26 with a thickness of 3 ⁇ m.
- An adhesive layer 21 , 24 is applied to the first PET film 22 and the second PET film 25 in each case, which ensures the connection to the substrates.
- the laser beam 31 ablates the metallic layer 23, as a result of which the layer 12 of adhesive underneath is passivated, which leads to a loss of adhesive strength.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN202280057004.6A CN117916051A (zh) | 2021-07-07 | 2022-06-30 | 可分离的膜层压体和用于分离持久的胶粘剂粘合的方法 |
KR1020247003922A KR20240029068A (ko) | 2021-07-07 | 2022-06-30 | 분리 가능한 필름 라미네이트 및 영구 접착 결합을 분리하기 위한 방법 |
EP22744654.9A EP4366909A1 (de) | 2021-07-07 | 2022-06-30 | Lösbares folienlaminat und verfahren zum lösen dauerhafter verklebungen |
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DE102021207161.9 | 2021-07-07 | ||
DE102021207161.9A DE102021207161A1 (de) | 2021-07-07 | 2021-07-07 | Lösbares Folienlaminat und Verfahren zum Lösen dauerhafter Verklebungen |
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EP (1) | EP4366909A1 (de) |
KR (1) | KR20240029068A (de) |
CN (1) | CN117916051A (de) |
DE (1) | DE102021207161A1 (de) |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1522606A1 (de) | 2003-10-10 | 2005-04-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Beschichtigung von bandförmigem material mit schwarzem Aluminiumoxid |
EP1567363B1 (de) | 2002-12-03 | 2007-03-28 | Schreiner Group GmbH & Co. KG | Laserbeschriftbare folie |
DE102016108216A1 (de) * | 2016-05-03 | 2017-11-09 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Schutz vor Manipulation |
EP3390553A1 (de) | 2015-12-18 | 2018-10-24 | tesa SE | Reaktives 2-komponentenklebesystem in filmform und verfahren zu verklebung |
EP3178660B1 (de) | 2015-12-07 | 2019-02-06 | Hueck Folien Ges.m.b.H | Personalisierbares sicherheitselement |
DE102020209557A1 (de) | 2019-07-31 | 2021-02-04 | Tesa Se | Lösbares Folienlaminat und Verfahren zum Lösen dauerhafter Verklebungen |
-
2021
- 2021-07-07 DE DE102021207161.9A patent/DE102021207161A1/de active Pending
-
2022
- 2022-06-30 KR KR1020247003922A patent/KR20240029068A/ko unknown
- 2022-06-30 WO PCT/EP2022/068079 patent/WO2023280673A1/de active Application Filing
- 2022-06-30 CN CN202280057004.6A patent/CN117916051A/zh active Pending
- 2022-06-30 EP EP22744654.9A patent/EP4366909A1/de active Pending
- 2022-07-04 TW TW111124945A patent/TWI833269B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1567363B1 (de) | 2002-12-03 | 2007-03-28 | Schreiner Group GmbH & Co. KG | Laserbeschriftbare folie |
EP1522606A1 (de) | 2003-10-10 | 2005-04-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Beschichtigung von bandförmigem material mit schwarzem Aluminiumoxid |
EP3178660B1 (de) | 2015-12-07 | 2019-02-06 | Hueck Folien Ges.m.b.H | Personalisierbares sicherheitselement |
EP3390553A1 (de) | 2015-12-18 | 2018-10-24 | tesa SE | Reaktives 2-komponentenklebesystem in filmform und verfahren zu verklebung |
DE102016108216A1 (de) * | 2016-05-03 | 2017-11-09 | Schreiner Group Gmbh & Co. Kg | Folienaufbau mit Schutz vor Manipulation |
DE102020209557A1 (de) | 2019-07-31 | 2021-02-04 | Tesa Se | Lösbares Folienlaminat und Verfahren zum Lösen dauerhafter Verklebungen |
Non-Patent Citations (1)
Title |
---|
T.G. FOX, BULL. AM. PHYS. SOC., vol. 1, 1956, pages 123 |
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TWI833269B (zh) | 2024-02-21 |
KR20240029068A (ko) | 2024-03-05 |
EP4366909A1 (de) | 2024-05-15 |
CN117916051A (zh) | 2024-04-19 |
TW202311028A (zh) | 2023-03-16 |
DE102021207161A1 (de) | 2023-01-12 |
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