WO2023275990A1 - Procédé de fabrication de dispositif de guide d'ondes optique et dispositif de guide d'ondes optique - Google Patents

Procédé de fabrication de dispositif de guide d'ondes optique et dispositif de guide d'ondes optique Download PDF

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Publication number
WO2023275990A1
WO2023275990A1 PCT/JP2021/024551 JP2021024551W WO2023275990A1 WO 2023275990 A1 WO2023275990 A1 WO 2023275990A1 JP 2021024551 W JP2021024551 W JP 2021024551W WO 2023275990 A1 WO2023275990 A1 WO 2023275990A1
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WO
WIPO (PCT)
Prior art keywords
optical fiber
optical
substrate
optical waveguide
recess
Prior art date
Application number
PCT/JP2021/024551
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English (en)
Japanese (ja)
Inventor
貴 山田
雄一郎 伊熊
Original Assignee
日本電信電話株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電信電話株式会社 filed Critical 日本電信電話株式会社
Priority to PCT/JP2021/024551 priority Critical patent/WO2023275990A1/fr
Priority to JP2023531194A priority patent/JPWO2023275990A1/ja
Publication of WO2023275990A1 publication Critical patent/WO2023275990A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device

Definitions

  • the present invention relates to an optical waveguide device manufacturing method and an optical waveguide device, and more particularly to a technique for connecting an optical fiber to an optical waveguide substrate.
  • the technique of connecting an optical fiber to such an optical waveguide first involves dicing the optical waveguide substrate in the vertical and horizontal directions to divide the substrate into chips of several millimeters each, and input and output of the optical waveguide. The part is subjected to optical polishing using an abrasive such as selenium oxide. Then, a plurality of optical fibers for inputting and outputting optical signals are connected to the optical waveguide substrate.
  • Non-Patent Document 1 When connecting multiple optical fibers, prepare a substrate with multiple V-grooves whose spacing is adjusted to match the spacing of the optical waveguides to be connected. The optical fibers are then placed in alignment with the corresponding V-grooves. (Non-Patent Document 1) After that, the optical fiber is pressed toward the substrate by a glass plate so that the optical fiber is in close contact with the slope of the V-groove. In the above steps, the connection end faces of the bundle of optical fibers (optical fiber array) are optically polished in the same manner as the substrate side of the optical waveguide.
  • the optical polishing process for the substrate and the optical fiber member includes a rough polishing process using an abrasive containing coarse abrasive grains, a medium polishing process using an abrasive containing coarse abrasive grains, and a polishing process using fine silica particles. It is carried out through the final polishing process used, which requires a relatively long time.
  • the polishing process requires special jigs and tools for controlling the polishing angle of the end face. In order to protect the surface from contamination generated in the process, a special treatment process such as providing a cover is required.
  • the optical waveguide substrate or the optical fiber array is fixed on a fine movement stage with a resolution of 0.1 ⁇ m or less, and a separately prepared light source and optical power monitor are attached to the optical fiber. Align by active alignment so as to connect and maximize the optical power. After that, the ultraviolet (UV) curable adhesive dropped on the connection end face is cured to fix the connection.
  • UV ultraviolet
  • An object of the present invention is to provide a method of manufacturing a fiber array that can omit the polishing process and the alignment process when connecting the optical waveguide substrate and the optical fiber.
  • an optical fiber is arranged in a concave portion of a substrate, and after temporarily fixing the optical fiber with a plate for temporary holding, a fixing block is provided.
  • the substrate provided with the recess and the optical fiber arranged in the recess are diced to match the length of the recess formed in the waveguide substrate in the longitudinal direction, and the recess is
  • a method for manufacturing an optical waveguide device wherein the block, from which the provided substrate is removed and the optical fiber is fixed, is connected to the waveguide substrate such that the optical fiber is arranged in a concave portion of the waveguide substrate.
  • the concave portion of the substrate provided with the concave portion is aligned with the concave portion of the waveguide substrate.
  • FIG. 1 shows a diagram of a fiber array implementation according to an embodiment of the invention
  • FIG. The figure of the preparation process of the fiber array concerning embodiment of this invention is shown.
  • the figure of the preparation process of the fiber array concerning embodiment of this invention is shown.
  • 1 shows a diagram of a fiber array implementation according to an embodiment of the invention;
  • FIG. It is a figure which shows the fiber array of a comparative example.
  • a recess in this specification, the cross-sectional shape of the recess is a substantially V-shaped is called a V-groove).
  • the cross-sectional shape of the concave portion may be approximately U-shaped, as long as it has a concave portion.
  • the depth of the V-groove is determined according to the height of the waveguide. That is, the depth of the V-groove is determined so that the center of the core of the optical fiber matches the height of the optical waveguide when the optical fiber is placed and fixed in the V-groove.
  • a fiber array is mounted in a plurality of V-grooves formed in accordance with the positions (heights) of the optical waveguides, as described above, in the optical signal input/output part of the substrate on which the silicon photonics optical waveguides are formed. It is a figure which shows that.
  • a plurality of V-grooves 103 are formed in a substrate (hereinafter simply referred to as an optical waveguide substrate) 101 on which a silicon photonics waveguide is formed.
  • the number of V-grooves 103 corresponds to the number of optical fibers forming the optical fiber array 102 .
  • the optical fiber array 102 is fixed to a block 104 made of glass. A block 104 holding a portion of the optical fiber array 102 in this way is connected to the substrate 101 while aligning each optical fiber 102a of the optical fiber array 102 with the corresponding V-groove 103 .
  • the optical fiber array 102 is fixed to the optical waveguide substrate 101 by filling the interface between the optical waveguide substrate 101 and the block 104 in contact with each other with an ultraviolet (UV) curable adhesive.
  • UV ultraviolet
  • the corresponding optical fiber 102a is placed in the V-groove 103 and adhered and fixed while being pressed against the optical waveguide so as to be in close contact.
  • the optical coupling between the optical fiber and the waveguide can be ensured, and the bonding strength can be ensured.
  • the adhesive leaks into the V-groove 103 of the optical waveguide substrate 101, it contributes to fixation of the optical fiber array 102, so there is no problem.
  • FIGS. 2(a) to (c) and FIGS. 3(a) and (b) are diagrams for sequentially explaining the method of fabricating the fiber array.
  • the optical fiber array 102 is passed through a block 104 made of glass for fixing.
  • the block 104 is formed with through holes several tens of ⁇ m larger than the diameter of each optical fiber 102a.
  • the optical fiber 102a from which the coating material has been removed and the cleave cut is passed through this through hole.
  • a substrate 105 having the same number of V-grooves 105a as the optical fibers is prepared. Align to . At this time, the optical fiber array 102 and the block 104 are not fixed to each other.
  • the V-groove substrate 105 is prepared separately from the V-groove 103 of the optical waveguide substrate 101 to be finally connected.
  • the V-shaped grooves of the substrate 105 are formed to have the same arrangement pitch (interval) and depth as the plurality of V-shaped grooves 103 of the optical waveguide substrate 101 .
  • the block 104 used in this embodiment may be of a vertically split type. In this case, the block 104 is divided into upper and lower halves, and the optical fibers 102a are aligned and then arranged on the V-groove substrate 105.
  • the optical fiber array 102 is temporarily held by the V-groove substrate 105 with the holding plate 106 for temporary fixing made of glass. . Then, in this state, each optical fiber 102a is adhesively fixed to the corresponding V-groove. Furthermore, after being temporarily held by the temporary holding plate 106, the through holes of the block 104 are filled with a UV curing adhesive, and the optical fiber array 102 is fixed to the block 104 by UV irradiation. In addition, reinforcing resin 107 is piled up at the base of the coated side of the optical fiber array 102 to protect it.
  • the V-groove substrate 105 is cut by the dicing device 108. Specifically, the holding plate 106 for temporary fixation is cut by dicing to obtain the optical fiber array 102 having oblique end faces with a predetermined angle, as will be described later in detail with reference to FIG.
  • the optical fiber array 102 is fixed by the V-groove of the V-groove substrate 105, and the dicing cut is performed in a state of being temporarily fixed by the holding plate 106, so that the precision of the cut surface can be improved.
  • a cut surface similar to the polished surface can be obtained. As a result, it is possible to omit the optical polishing step, which requires a relatively large number of man-hours.
  • the optical fiber array 102 is pulled out together with the block 104 from the V-groove substrate 105 for temporary fixing, and the optical fiber array is completed as shown in FIG. 3(b).
  • FIG. 4 is a diagram for explaining the connection relationship between the optical waveguide substrate and the optical fiber array according to this embodiment.
  • the optical fiber is connected to the optical waveguide while being inclined by ⁇ from the vertical direction of the connecting surface.
  • ⁇ is several degrees (about 8 to 10 degrees). This makes it possible to prevent reflection on the connection surface when optically coupled.
  • this inclination is made by the dicing cut described above.
  • the position at which the optical fiber array 102 is cut is determined according to the length of the V-groove formed in the optical waveguide substrate 101 .
  • the optical fiber array 102 fixed to the completed block 104 is connected to the optical waveguide substrate 101 to manufacture an optical waveguide device.
  • the optical fiber array 102 fixed to the block 104 is spaced equally from the V-groove 103 of the optical waveguide substrate 101 through the V-groove of the V-groove substrate 105.
  • the fabricated optical fiber array 102 is connected to the optical waveguide substrate 101, they can be connected with their cores aligned.
  • the present optical waveguide device employs a plurality of optical fibers, it is not limited to this form.
  • a single-function device using an optical waveguide for example, a single-core device such as an optical modulator alone is also possible.
  • FIGS. 5A and 5B are diagrams illustrating connection of optical fiber arrays according to a comparative example. As shown in these figures, each optical fiber 202a of the optical fiber array is arranged in a V-groove of a V-groove substrate 205 and fixed with an adhesive 209 for fixing the fiber V-groove. Also, the root portion of the fiber is fixed with an adhesive 210 .
  • the optical fiber 202a fixed to the V-groove substrate 205 in this way is then connected to a waveguide (not shown) formed on the substrate (not shown).
  • the optical fiber 202a is simply fixed to the V-groove of the V-groove substrate 205, and the V-groove of the V-groove substrate 205 is not aligned with the waveguide, so alignment is required. . Also, since the dicing described above is not performed, an optical polishing process for the optical fiber is required.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Il existe un problème selon lequel, afin d'assurer une fonction d'entrée/sortie de lumière d'un substrat de guide d'ondes optique photonique en silicium, un temps et un coût énormes sont nécessaires pour une étape de polissage optique, une étape d'alignement actif et similaire de chaque élément. Dans la présente invention, une rainure en V (103) est formée sur un substrat en Si (101) d'un guide d'ondes optique photonique en silicium en fonction de la position du guide d'ondes optique par une technologie de photolithographie et une étape de gravure. La profondeur de la rainure en V (103) est ajustée de telle sorte que le centre d'une âme d'une fibre optique (102a) correspond à la hauteur du guide d'ondes optique. Une surface d'extrémité de la fibre optique (102a) est une surface découpée en dés. Une connexion optique à faible perte est établie en disposant la fibre optique (102a) dans la rainure en V (103).
PCT/JP2021/024551 2021-06-29 2021-06-29 Procédé de fabrication de dispositif de guide d'ondes optique et dispositif de guide d'ondes optique WO2023275990A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2021/024551 WO2023275990A1 (fr) 2021-06-29 2021-06-29 Procédé de fabrication de dispositif de guide d'ondes optique et dispositif de guide d'ondes optique
JP2023531194A JPWO2023275990A1 (fr) 2021-06-29 2021-06-29

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PCT/JP2021/024551 WO2023275990A1 (fr) 2021-06-29 2021-06-29 Procédé de fabrication de dispositif de guide d'ondes optique et dispositif de guide d'ondes optique

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WO2023275990A1 true WO2023275990A1 (fr) 2023-01-05

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07281060A (ja) * 1994-02-09 1995-10-27 Corning Inc シ−ト状に配列された光ファイバの端部を組み立てる方法および装置
JPH10246838A (ja) * 1997-03-05 1998-09-14 Nippon Telegr & Teleph Corp <Ntt> 光ファイバアレイ装置
US20030021545A1 (en) * 2001-07-24 2003-01-30 Bookham Technology Plc Connection of optical fibres to optical devices
JP2005352453A (ja) * 2004-05-12 2005-12-22 Nec Corp 光ファイバ部品及び光導波路モジュール並びにこれらの製造方法
JP2015072330A (ja) * 2013-10-02 2015-04-16 富士通株式会社 光導波路部品、その製造方法及び光導波路デバイス
US9423561B1 (en) * 2015-06-19 2016-08-23 Inphi Corporation Method of attaching fiber block to silicon photonics

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07281060A (ja) * 1994-02-09 1995-10-27 Corning Inc シ−ト状に配列された光ファイバの端部を組み立てる方法および装置
JPH10246838A (ja) * 1997-03-05 1998-09-14 Nippon Telegr & Teleph Corp <Ntt> 光ファイバアレイ装置
US20030021545A1 (en) * 2001-07-24 2003-01-30 Bookham Technology Plc Connection of optical fibres to optical devices
JP2005352453A (ja) * 2004-05-12 2005-12-22 Nec Corp 光ファイバ部品及び光導波路モジュール並びにこれらの製造方法
JP2015072330A (ja) * 2013-10-02 2015-04-16 富士通株式会社 光導波路部品、その製造方法及び光導波路デバイス
US9423561B1 (en) * 2015-06-19 2016-08-23 Inphi Corporation Method of attaching fiber block to silicon photonics

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