WO2023273676A1 - 电路板组件及电子设备 - Google Patents

电路板组件及电子设备 Download PDF

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Publication number
WO2023273676A1
WO2023273676A1 PCT/CN2022/093606 CN2022093606W WO2023273676A1 WO 2023273676 A1 WO2023273676 A1 WO 2023273676A1 CN 2022093606 W CN2022093606 W CN 2022093606W WO 2023273676 A1 WO2023273676 A1 WO 2023273676A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
outer frame
board assembly
stepped surface
intermediate body
Prior art date
Application number
PCT/CN2022/093606
Other languages
English (en)
French (fr)
Inventor
刘道德
史洪宾
邹梦若
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023273676A1 publication Critical patent/WO2023273676A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment.
  • Electronic devices may include circuit board assemblies for securing components.
  • the circuit board assembly may include a plurality of printed circuit boards (PCBs).
  • PCBs printed circuit boards
  • Each PCB can host components or other PCBs so that the PCB can power the components. Since electronic equipment needs to realize more and more functions, more and more components are arranged inside the electronic equipment. Correspondingly, the occupied space of the circuit board assembly in the electronic equipment is also increasing.
  • the circuit board assembly may include a plurality of lower-layer boards and a plurality of upper-layer boards, and a plurality of mutually independent frame boards are arranged between the upper-layer boards and the lower-layer boards.
  • the upper layer board, the lower layer board and each mutually independent frame board surround and form a plurality of accommodating cavities arranged at intervals and mutually independent.
  • the multiple frame plates have different heights, thereby forming multiple accommodating cavities with different heights to respectively accommodate components of different heights, which can reduce the space occupied by the thickness direction of the circuit board assembly.
  • each frame plate is independent, a safe installation gap needs to be avoided between two adjacent frame plates during installation, but this leads to the underutilization of the space between two adjacent accommodating cavities , so that under the condition that the circuit board assembly occupies a certain space, the volumes of two adjacent accommodating cavities are small, which is not conducive to the arrangement of components.
  • the present application provides a circuit board assembly and electronic equipment, which solves the technical problem that two adjacent accommodating cavities have smaller volumes due to the need to avoid a safe installation gap between adjacent frame boards.
  • the first aspect of the embodiments of the present application provides a circuit board assembly, at least including: a lower board and an upper board, one of the lower board and the upper board is integrally formed with an outer frame and at least one intermediate body, the outer frame and the intermediate body Located between the lower plate and the upper plate;
  • the end surface of one end of the outer frame has at least a first stepped surface and a second stepped surface, the upper or lower plate is located on the first stepped surface and the second stepped surface, and the first stepped surface and the second stepped surface are on the circuit board assembly
  • the height is different in the thickness direction;
  • the intermediate body divides the cavity surrounded by the upper layer board, the lower layer board and the outer frame into at least two accommodating cavities with different heights and separated from each other, and components are arranged in each accommodating cavity.
  • an intermediate body is arranged between two adjacent accommodation cavities in the circuit board assembly, and the two accommodation cavities are separated by the intermediate body.
  • the intermediate body is an integral structure.
  • the intermediate body can separate the two accommodating cavities, so the intermediate body between two adjacent accommodating cavities can be a single-layer structure, while the existing two mutually independent accommodating cavities have two The wall thickness of the layer's side walls. Therefore, in the embodiment of the present application, the thickness of the side wall between two adjacent accommodating cavities is reduced by one layer by arranging the intermediate body. In this way, the space between two adjacent accommodating cavities is fully utilized.
  • the volume of the accommodating cavities can be increased when the circuit board assembly occupies a certain space, thereby facilitating the arrangement of components. Moreover, since there is no installation gap between two adjacent accommodating cavities, and the two adjacent accommodating cavities are composed of an outer frame and an intermediate body, there is no stress band between adjacent two accommodating cavities, reducing The board-level stress of frame boards with different heights is eliminated, ensuring the strength of circuit board components. To sum up, the circuit board assembly provided by the embodiment of the present application realizes the full utilization of the space between adjacent accommodating cavities, increases the volume of the accommodating cavities in a unit space, and reduces the two independent parts of the frame board. Accommodates stress between cavities.
  • the outer frame includes at least two outer frame bodies, the intermediate body is located between two adjacent outer frame bodies, and one end of the intermediate body has at least one supporting surface, and the supporting surface and the first step surface Or the second step surface is flush.
  • the end surface of one end of the intermediate body has two support surfaces with different heights, one of which is flush with the first step surface, and the other support surface is flush with the second step surface.
  • the lower board is a contour board.
  • the lower plate, the outer frame and the intermediate body are in an integrated structure
  • the end face of the outer frame facing the upper plate has a first stepped surface and a second stepped surface
  • the upper plate and the first stepped surface and The second steps are face-to-face.
  • connection steps between the lower layer board, the outer frame and the intermediate body can be reduced, and the process flow can be shortened.
  • there are no connecting parts such as solder between the lower layer board and the outer frame and the intermediate body, which can make the thickness of the circuit board assembly smaller, and effectively reduce the volume of the circuit board assembly.
  • the upper plate, the outer frame and the intermediate body are in an integrated structure, the first stepped surface and the second stepped face face the upper plate, and the outer frame and the other end of the intermediate body are connected to the lower plate .
  • connection steps between the upper layer board, the outer frame and the intermediate body can be reduced, and the process flow can be shortened.
  • there are no connecting parts such as solder between the upper layer board and the outer frame and the intermediate body, which can make the thickness of the circuit board assembly smaller, and effectively reduce the volume of the circuit board assembly.
  • the number of the upper plate is one, and the upper plate has an integrated first horizontal area and a second horizontal area, the first horizontal area is opposite to the first step surface, and the second horizontal area is opposite to the second horizontal area.
  • the two steps face each other.
  • the integral structure of the upper board can improve the overall strength of the circuit board assembly.
  • one ends of two adjacent upper layer boards are overlapped in the thickness direction of the circuit board assembly, so that one end of one upper layer board is suspended at one end of the other upper layer board.
  • the first upper layer board is extended toward the direction of the second upper layer board so that the two upper layer boards overlap, which increases the area of the first upper layer board, and more components can be arranged on the first upper layer board, thereby increasing the number of circuit board components The utilization rate of the layout area.
  • the two upper-layer boards are a first upper-layer board and a second upper-layer board that are independent of each other, the first upper-layer board is opposite to the first step surface, and the second upper-layer board the plate is opposite to the second step surface;
  • the vertical distance between the first upper plate and the lower plate is greater than the vertical distance between the second upper plate and the lower plate
  • the assembly gap can prevent the first upper layer board and the second upper layer board from influencing each other during installation.
  • the first upper layer board and the second upper layer board are circuit boards integrated with radio frequency (RF) circuits.
  • RF radio frequency
  • the first upper layer board and the second upper layer board can be radio frequency boards, so that the communication module is smaller and thinner.
  • one of the two adjacent outer frames and the intermediate body form an integral structure, and the other of the two adjacent outer frames is connected to the two intermediate bodies. There are openings between the ends.
  • one of the two adjacent outer frames and the intermediate body can be in an integrated structure, and the other of the two adjacent outer frames and the two ends of the intermediate body can be evenly spaced. There are openings.
  • the outer frame that is integrated with the intermediate body can form a relatively closed accommodating cavity, while the other outer frame that has a gap with the intermediate body is relatively simple to manufacture and low in cost, which can reduce manufacturing costs and improve Production efficiency.
  • two adjacent outer frame bodies and the intermediate body form an integrated structure.
  • the components that will cause interference are arranged inside the closed accommodating cavity, preventing them from affecting the components outside the accommodating cavity.
  • the side of the lower layer board and the upper layer board facing away from the outer frame is provided with components.
  • a second aspect of the embodiments of the present application provides an electronic device, at least including: the circuit board assembly in the above first aspect.
  • an intermediate body is arranged between two adjacent accommodation cavities in the circuit board assembly, and the two accommodation cavities are separated by the intermediate body.
  • the intermediate body is an integral structure.
  • the intermediate body can connect the two accommodating cavities Therefore, the intermediate body between two adjacent accommodating cavities can be a single-layer structure, so that the wall thickness of the side wall between two adjacent accommodating cavities is reduced by one layer.
  • the circuit board assembly realizes the full utilization of the space between adjacent accommodating cavities, increases the volume of the accommodating cavities in a unit space, and reduces the stress between the two accommodating cavities separated by the frame board.
  • FIG. 1 is a structural diagram of an implementation of a circuit board assembly
  • Fig. 2 is a configuration diagram of components in the circuit board assembly in Fig. 1;
  • FIG. 3 is a structural diagram of another implementation of a circuit board assembly
  • Fig. 4 is the structural representation of A-A section among Fig. 3;
  • FIG. 5 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • FIG. 6 is an exploded view of an electronic device provided in an embodiment of the present application.
  • FIG. 7 is a structural diagram of a circuit board assembly provided in an embodiment of the present application.
  • Fig. 8 is the structural representation of A-A section in Fig. 7;
  • FIG. 9 is a structural diagram of another circuit board assembly provided in the embodiment of the present application.
  • FIG. 10 is a structural diagram of another circuit board assembly provided by the embodiment of the present application.
  • Fig. 11 is the structural representation of A-A section in Fig. 10;
  • FIG. 12 is a structural diagram of another circuit board assembly provided by the embodiment of the present application.
  • Fig. 13 is a schematic structural view of section A-A in Fig. 12;
  • FIG. 14 is a perspective view of another circuit board assembly provided by the embodiment of the present application.
  • Fig. 15 is a front view of another circuit board assembly provided by the embodiment of the present application.
  • FIG. 16 is a perspective view of another circuit board assembly provided by the embodiment of the present application.
  • Fig. 17 is a front view of another circuit board assembly provided by the embodiment of the present application.
  • Electronic equipment needs to implement more and more functions, and there are more and more components arranged inside the electronic equipment, and the corresponding components arranged on the circuit board assembly increase, resulting in a larger volume occupied by the circuit board assembly.
  • the volume of the electronic device is relatively large, which affects the overall appearance of the electronic device.
  • the layout area of the circuit board components needs to be fully utilized, and a sandwich veneer (or four-sandwich veneer) design can be used.
  • the sandwich veneer is to set a frame plate between two circuit boards.
  • a circuit board and the frame board are arranged to form an accommodating cavity, and components can be accommodated in the accommodating cavity.
  • the circuit board assembly only needs to increase a little thickness (Z direction), so that the area of the circuit board assembly (X-Y direction) can be reduced more, so that the volume of the circuit board assembly can be reduced more, and the layout area of the circuit board assembly can be improved.
  • the utilization rate makes the electronic equipment smaller and better in appearance.
  • the circuit board assembly 40 may include an upper board 42, a lower board 41 and a frame board 43a between the upper board 42 and the lower board 41, the upper board 42, the lower board 41 and the frame board 43a are common
  • An accommodating cavity 45 is formed around, and the accommodating cavity 45 is used for arranging components 44 .
  • the height of the containing cavity 45 depends on the highest component 44 inside the containing cavity 45 .
  • there are more spaces not fully utilized in the thickness direction (Z direction) of the circuit board assembly 40 due to the low height, there are more spaces not fully utilized in the thickness direction (Z direction) of the circuit board assembly 40, resulting in a larger overall thickness of the circuit board assembly 40 , the electronic equipment is thicker and the volume is larger.
  • Figures 3 and 4 show another implementation of the circuit board assembly 40.
  • the difference from the implementation shown in Figures 1 and 2 is that the frame plate 43a of the circuit board assembly 40 is two mutually independent frames.
  • the board 43a and the upper board 42 are also two independent upper boards 42 .
  • the height of one of the frame plates 43a is greater than that of the other frame plate 43a, so that two accommodating cavities 45 with different heights are surrounded between the upper floor plate 42, the lower floor plate 41 and the frame plate 43a, and the accommodating cavities of different heights
  • the body 45 can be used to accommodate components 44 of different heights.
  • the thickness direction (Z direction) of the circuit board assembly 40 In the thickness direction (Z direction) of the circuit board assembly 40 , the space is fully utilized, and the thickness of part of the circuit board assembly 40 can be reduced.
  • the two accommodating cavities 45 are two independent accommodating cavities 45 surrounded by two mutually separated frame plates 43a and the upper layer plate 42 and the lower layer plate 41, between the two accommodating cavities 45
  • the distance is a+b+c, where b+c is the sum of the thicknesses of the side walls of the two frame plates 43a, and a is the safe installation gap between the two frame plates 43a.
  • b+c is the sum of the thicknesses of the side walls of the two frame plates 43a
  • a is the safe installation gap between the two frame plates 43a.
  • the distance between two adjacent accommodating cavities is relatively large, and the space between two accommodating cavities 45 cannot carry components 44 and is not fully utilized, so that when the circuit board assembly 40 occupies a certain space,
  • the volumes of two adjacent accommodating cavities 45 are small, which is not conducive to the arrangement of components 44 .
  • the safe installation gap refers to the installation gap set up to avoid the mutual influence of the installation of adjacent components.
  • the embodiments of the present application provide a circuit board assembly and an electronic device.
  • An intermediate body is arranged between two adjacent accommodation cavities in the circuit board assembly, and the two accommodation cavities are separated by the intermediate body.
  • the body is an integral structure.
  • the intermediate body can separate two accommodating cavities, so the intermediate body between two adjacent accommodating cavities can be a single-layer structure, while the existing two mutually separated accommodating cavities have two The wall thickness of the layer's side walls. Therefore, in the embodiment of the present application, the thickness of the side wall between two adjacent accommodating cavities is reduced by one layer by arranging the intermediate body.
  • the space between two adjacent accommodating cavities is fully utilized. Since there is only the wall thickness of the intermediate body between the two accommodating cavities, the volume of the accommodating cavities can be increased when the circuit board assembly occupies a certain space. Larger, which is more conducive to the arrangement of components. Moreover, since there is no installation gap between the two adjacent accommodating cavities, and the two adjacent accommodating cavities are composed of the overall structure of the outer frame and the intermediate body, there is no stress zone between the two adjacent accommodating cavities. The board-level stress of the frame boards with different heights is reduced, ensuring the strength of the circuit board assembly.
  • the circuit board assembly and the electronic equipment realized by the embodiment of the present application realize the full utilization of the space between adjacent accommodation cavities, increase the volume of the accommodation cavities in a unit space, and reduce the independent cost of the frame board.
  • the stress between the two containing cavities realize the full utilization of the space between adjacent accommodation cavities, increase the volume of the accommodation cavities in a unit space, and reduce the independent cost of the frame board. The stress between the two containing cavities.
  • An embodiment of the present application provides an electronic device, which may include but not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computer, UMPC), handheld computers, walkie-talkies, netbooks, POS machines , personal digital assistant (personal digital assistant, PDA), driving recorder, security equipment and other mobile terminals, fixed terminals or foldable terminals with circuit board components.
  • an electronic device may include but not limited to mobile phones, tablet computers, notebook computers, ultra-mobile personal computers (ultra-mobile personal computer, UMPC), handheld computers, walkie-talkies, netbooks, POS machines , personal digital assistant (personal digital assistant, PDA), driving recorder, security equipment and other mobile terminals, fixed terminals or foldable terminals with circuit board components.
  • the mobile phone is described as the above-mentioned electronic device 100 as an example, wherein the mobile phone can be a foldable mobile phone, and the foldable mobile phone can be an inwardly foldable mobile phone (that is, the display screen is folded inwardly). ), can also be folded outwards (that is, the display screen is folded outwards); the mobile phone can also be a bar mobile phone.
  • a straight mobile phone is taken as an example.
  • the mobile phone may include: a display screen 10 , a rear cover 20 , a middle frame 30 located between the display screen 10 and the rear cover 20 , a circuit board assembly 40 and a battery 50 .
  • the circuit board assembly 40 and the battery 50 can be arranged on the middle frame 30, for example, the circuit board assembly 40 and the battery 50 are arranged on the side of the middle frame 30 facing the rear cover 20, or the circuit board assembly 40 and the battery 50 can be arranged on The middle frame 30 is on a side facing the display screen 10 .
  • an opening area may be provided on the middle frame 30 for placing components on the circuit board assembly 40 in the opening area of the middle frame 30 .
  • the battery 50 can be connected with the charging management module and the circuit board assembly 40 through the power management module, the power management module receives the input of the battery 50 and/or the charging management module, and provides the processor, internal memory, external memory, display screen 10, Power supply for cameras and communication modules.
  • the power management module can also be used to monitor parameters such as battery capacity, battery cycle times, and battery health status (leakage, impedance).
  • the power management module can also be disposed in the processor of the circuit board assembly 40 .
  • the power management module and the charging management module can also be set in the same device.
  • the display screen 10 may be an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display screen, or a liquid crystal display screen (Liquid Crystal Display, LCD).
  • OLED Organic Light-Emitting Diode
  • LCD Liquid Crystal Display
  • the back cover 20 may be a metal back cover, a glass back cover, a plastic back cover, or a ceramic back cover 20.
  • the material of the back cover 20 is not limited.
  • the middle frame 30 may include a middle board 32 and a frame 31 .
  • the frame 31 is arranged around the periphery of the middle plate 32 for a week.
  • the frame 31 may include a top frame, a bottom frame, a left frame and a right frame, and the top frame, the bottom frame, the left frame and the right frame form a circular frame.
  • the middle plate 32 may be an aluminum plate, an aluminum alloy plate, or a magnesium alloy plate, and the material of the middle plate 32 is not limited.
  • the frame 31 may be a metal frame or a ceramic frame, and the material of the frame is not limited.
  • the middle plate 32 and the frame 31 can be clamped, welded, glued or integrally formed, or the middle plate 32 and the frame 31 can be fixedly connected by injection molding.
  • the mobile phone may include but not limited to the structure shown in FIG.
  • the screen 10 , the middle plate 32 and the battery cover, the battery cover may be the back cover 20 formed by the frame 31 and the back cover 20 in one piece (Unibody).
  • the circuit board assembly 40 and the battery 50 are located in the space enclosed by the middle board 32 and the battery cover.
  • the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100 .
  • the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or separate certain components, or arrange different components.
  • the electronic device 100 may also include devices such as a camera (such as a front camera and a rear camera) and a flashlight.
  • circuit board assembly 40 provided by the embodiment of the present application will be described in detail below with reference to the accompanying drawings.
  • the circuit board assembly 40 may include a plurality of circuit boards and a plurality of components electrically connected to the circuit boards.
  • the circuit board can be a printed circuit board (printed circuit board, PCB), a flexible circuit board, an integrated circuit (or called a chip).
  • PCB printed circuit board
  • a PCB is used as an example for illustration.
  • the circuit board can be a single-sided board or a double-sided board.
  • the single-sided board can refer to a circuit board that carries components on one side
  • the double-sided board can refer to a circuit board that carries components on both sides.
  • the circuit board may be a radio frequency (radio frequency, RF) board or an application processor (application processor, AP) board.
  • the RF board can be used to carry radio frequency integrated circuit (RF IC), radio frequency power amplifier (radio frequency power amplifier, RFPA), wireless fidelity (wireless fidelity, WIFI) chip, etc.
  • RF IC radio frequency integrated circuit
  • RFPA radio frequency power amplifier
  • WIFI wireless fidelity
  • the AP board can be used to carry system on chip (system on chip, SOC) components, double data rate (double data rate, DDR) memory, main power management unit (power management unit, PMU), auxiliary PMU and so on.
  • Components can be, for example, connectors, electronic transformers, relays, laser devices, packaged devices, biometric identification modules, processors, memories (such as DDR memories), power modules, and the like.
  • components can also be SOC components, main PMU, RF IC, RF PA, WIFI chip, auxiliary PMU, etc.
  • components can also be obtained by stacking.
  • the SOC component and the DDR memory can be stacked to form a package on package (PoP) component. Wherein, the SOC component and the DDR memory can also be set separately.
  • the circuit board may also include combinations of the above devices.
  • a circuit board may include a PCB and a processor, among others.
  • solder can be used for mechanical connection and/or electrical connection, and the shape of the solder can be spherical, polyhedral, ellipsoid, truncated cone, chamfered, strip, rod, etc. There is no limitation on the shape of the solder.
  • the circuit board assembly 40 may at least include a lower board 41 and an upper board 42, one of the lower board 41 and the upper board 42 has an outer frame 43, and the outer The frame 43 is located between the lower board 41 and the upper board 42 .
  • the circuit board assembly 40 may include an upper layer board 42 , an outer frame 43 and a lower layer board 41 which are sequentially stacked. Wherein, the upper layer board 42 and the lower layer board 41 may be circuit boards.
  • the upper layer board 42 and the lower layer board 41 can be a single panel, and one side of the upper layer board 42 and the lower layer board 41 can be used to set the components 44, for example, the side of the upper layer board 42 and the lower layer board 41 facing the outer frame 43 can be used for Components 44 are set.
  • the components 44 can also be arranged on the side of the upper layer board 42 and the lower layer board 41 away from the outer frame 43 .
  • the upper layer board 42 and the lower layer board 41 may also be double-sided boards, for example, both sides of the upper layer board 42 and the lower layer board 41 may be used for setting components 44 .
  • the thickness (height) direction of the circuit board assembly 40 is the Z direction shown in FIG. 7
  • the length direction of the circuit board assembly 40 is the X direction shown in FIG.
  • the width direction is the Y direction shown in FIG. 7 .
  • the circuit board assembly 40 may include more layers of circuit boards and outer frames 43, that is to say, in addition to the upper layer board 42 and the lower layer board 41, the circuit board assembly 40 may also include other layers of circuits plate.
  • the multi-layer circuit boards and the outer frame 43 are stacked along the thickness direction of the circuit board assembly 40, and an outer frame 43 is arranged between two adjacent layers of circuit boards.
  • the number of layers of the circuit board is 3 layers, 4 layers, 5 layers, 6 layers, etc.
  • the number of layers of the outer frame 43 can be 2 layers, 3 layers, 4 layers, 5 layers, etc.
  • the number of layers of 43 includes but is not limited to the above numbers.
  • at least one layer of the multilayer outer frame 43 is a stepped outer frame, and correspondingly, at least one layer of the multilayer circuit board forms a stepped circuit board.
  • the outer frame 43 can be a stepped outer frame, and the end face of one end of the outer frame 43 has at least a first stepped surface 434 and a second stepped surface 435, and the end face of the outer frame 43 refers to the outer frame along the circuit board.
  • One end surface in the thickness direction (Z direction) of the module 40 is located on the first stepped surface 434 and the second stepped surface 435 , and the first stepped surface 434 and the second stepped surface 435 have different heights in the thickness direction of the circuit board assembly 40 . That is to say, the vertical distances between the first stepped surface 434 and the second stepped surface 435 relative to the other end surface in the thickness direction of the outer frame 43 may be different.
  • the height h1 of the first stepped surface 434 is the distance between the first stepped surface 434 and the lower plate 41
  • the height h2 of the second stepped surface 435 is the second The distance between the stepped surface 435 and the lower plate 41, the height h1 of the first stepped surface 434 and the height h2 of the second stepped surface 435 are different, wherein h1 may be greater than h2, or h2 may be greater than h1.
  • the end surface of one end of the outer frame 43 may include more stepped surfaces, that is to say, in addition to the first stepped surface 434 and the second stepped surface 435 on the end surface of the outer frame 43, Other stepped surfaces may also be included.
  • the number of stepped surfaces on one end surface of the outer frame 43 may be 3, 4, 5, 6, etc., including but not limited to the above number.
  • the heights of the respective step surfaces may be completely different, or may be partly the same.
  • the end surface of the other end of the outer frame 43 along the Z direction may also have at least two stepped surfaces. That is to say, both ends of the outer frame 43 along the Z direction may have a plurality of stepped surfaces.
  • the laminate 42 is located on the first stepped surface 434 and the second stepped surface 435 for illustration.
  • the upper plate 42 can at least include a first upper plate 421 and a second upper plate 422, the first upper plate 421 is located on the first step surface 434 (refer to Figure 7), and the second upper plate 422 is located on the second upper plate 422.
  • the second step surface 435 On the second step surface 435 . Since the heights of the first stepped surface 434 and the second stepped surface 435 are different, the thicknesses of the circuit board assembly 40 corresponding to the first stepped surface 434 and the second stepped surface 435 are also different.
  • the first upper layer board 421 and the second upper layer board 422 is arranged in a ladder shape.
  • the lower board 41 may be a board of equal height, so that the process difficulty of the lower board 41 is relatively low.
  • first upper layer board 421 and the second upper layer board 422 may be upper layer boards 42 that are independent from each other.
  • the vertical distance between the first upper board 421 and the lower board 41 is greater than the vertical distance between the second upper board 422 and the lower board 41 . That is, the height of the first accommodating cavity 451 corresponding to the first upper layer 421 is greater than the height of the second accommodating cavity 452 corresponding to the second upper layer 422 .
  • the first accommodating cavity 451 can be used for arranging the components 44 with a higher height
  • the second accommodating cavity 452 can be used for arranging the components 44 with a shorter height.
  • the communication module on the circuit board assembly 40 is often relatively thick, when the communication module is used in the electronic device 100, the electronic device 100 cannot be made thinner and more delicate, which will make the electronic device 100 thicker and larger, which will affect the electronic device 100.
  • the overall appearance of the device 100 the communication module can be integrated on the circuit board assembly 40 provided by the embodiment of the present application, so that the communication module is smaller and thinner.
  • the communication module may include chips such as radio frequency, baseband, and radio frequency power amplifier.
  • the first upper layer board 421 and the second upper layer board 422 may be radio frequency boards for carrying RF IC, RF PA, WIFI chips, etc.
  • the number of upper boards 42 may be more, and one of the stepped surfaces is correspondingly connected to one of the upper boards 42 . All the upper layer boards 42 may be independent upper layer boards 42 . Of course, it may also be that part of the upper plate 42 is an integrated step plate, and the other part of the upper plate 42 is an independent upper plate 42 .
  • the number of upper boards 42 may be 2, 3, 4, 5, etc., including but not limited to the above-mentioned numbers.
  • the circuit board assembly 40 can also include at least one intermediate body 433 , and the outer frame 43 can include a cavity for accommodating components 44 , and the components 44 in the cavity can be fixed on the upper layer 42 or the lower layer 41 .
  • the upper plate 42, the lower plate 41, and the outer frame 43 surround the outside of the cavity, and the intermediate body 433 is located in the cavity, and the intermediate body 433 can divide the cavity into at least two accommodating cavities with different heights and separated from each other. 45, each containing cavity 45 is provided with components 44. Due to the provision of the intermediate body 433 , the distance between two adjacent accommodating cavities 45 is the wall thickness of the intermediate body 433 along the X direction.
  • the intermediate body between two adjacent accommodating cavities 45 can be a single-layer structure, so that the wall thickness of the side wall between two adjacent accommodating cavities 45 is larger than that of the existing two-layer side wall. One layer is reduced.
  • there is no stress zone between two adjacent accommodating cavities 45 which reduces the board-level stress of the frame boards 43 a of different heights and ensures the strength of the circuit board assembly 40 .
  • a plurality of intermediate bodies 433 may be provided in the outer frame 43, for example, the number of intermediate bodies 433 is 2, 3, 4, 5, etc., including but not limited to the above-mentioned number. In this way, a plurality of intermediate bodies 433 divide the cavity of the outer frame 43 into more accommodating cavities 45, for example, the number of accommodating cavities 45 is 3, 4, 5, 6, etc., including but not limited to the above quantity. In this way, the components 44 can be divided according to height and function, and they can be arranged in different accommodating cavities 45, so that the space in the Z direction of the circuit board assembly 40 can be fully utilized, and the mutual interaction of some components 44 can be avoided. interference. Wherein, the heights of the accommodating cavities 45 may be completely different, or partly the same. In other examples, no intermediate body 433 may be provided between two adjacent accommodating cavities 45 , so that the accommodating cavities 45 can accommodate more components 44 , which facilitates the arrangement of components 44 .
  • the components 44 there is at least one closed accommodation cavity 45 among the plurality of accommodation cavities 45 with different heights.
  • the components 44 that will cause interference are arranged inside the closed accommodating cavity 45 to prevent them from affecting the components 44 outside the accommodating cavity 45 .
  • the first accommodating cavity 451 can be set as a closed accommodating cavity 45
  • the second accommodating cavity 452 can also be set as a closed accommodating cavity 45
  • the first accommodating cavity 451 and the second accommodating cavity can also be arranged
  • the cavities 452 are all configured as closed accommodating cavities 45 .
  • all accommodating cavities 45 can be closed accommodating cavities 45; they can also be partly closed accommodating cavities 45; The accommodating cavity 45.
  • the outer frame 43 includes at least two outer frames, the two outer frames may be a first outer frame 431 and a second outer frame 432, and the middle body 433 is located on the opposite side. Adjacent to the space between the two outer frames, the intermediate body 433 separates the two outer frames to form two accommodation cavities 45 with different heights.
  • the outer frame 43 may include more outer frames, for example, the number of outer frames may be 3, 4, 5, 6, etc., including but not limited to the above number. In this way, the plurality of intermediate bodies 433 can separate the plurality of outer frames to form a plurality of accommodating cavities 45 with different heights or partially the same.
  • two adjacent outer frame bodies may form an integrated structure with the intermediate body 433 between the two adjacent outer frame bodies.
  • the first outer frame body 431 , the second outer frame body 432 , and the intermediate body 433 between the first outer frame body 431 and the second outer frame body 432 may be an integrated structure.
  • the outer frame 43 and the intermediate body 433 are integrally formed with high strength, and there is no need to manufacture the outer frame 43 and the intermediate body 433 separately, which reduces the number of process steps.
  • the two adjacent outer frame bodies and the intermediate body 433 may also be independent of each other.
  • one end of the intermediate body 433 may have at least one supporting surface 4331 , and the supporting surface 4331 of the intermediate body 433 faces the same side as the stepped surface of the outer frame 43 .
  • there may be one supporting surface 4331 on the intermediate body 433 and the supporting surface 4331 may be flush with the first stepped surface 434 of the first outer frame body 431 .
  • a supporting surface 4331 may also be flush with the second stepped surface 435 of the second outer frame body 432 .
  • FIG. 7 along the Z direction
  • the intermediate body 433 can be a stepped intermediate body, one of which supports
  • the surface 4331 may be flush with the first stepped surface 434
  • the other supporting surface 4331 may be flush with the second stepped surface 435 .
  • the lower layer board 41 , the outer frame 43 and the intermediate body 433 can be in an integrated structure, and the lower layer board 41 , the outer frame 43 , and the intermediate body 433 adopt an integrated multi-cavity design.
  • the connection steps between the lower layer board 41, the outer frame 43, and the intermediate body 433 can be reduced, and the process flow can be shortened.
  • the connection between the lower board 41 and the outer frame 43 and the intermediate body 433 needs to use connecting components, such as connecting through a solder layer, and the solder layer has a certain thickness, which will increase the thickness of the circuit board assembly 40 .
  • the lower layer board 41, the outer frame 43, and the intermediate body 433 have an integrated structure, there are no connecting parts such as solder layers between the lower layer board 41, the outer frame 43, and the intermediate body 433, which can make the thickness of the circuit board assembly 40 smaller and have It is beneficial to reduce the volume of the circuit board assembly 40 .
  • the end surface of the outer frame 43 towards the end of the upper plate 42 can have a first stepped surface 434 and a second stepped surface 435, and the upper plate 42 can be connected with the first stepped surface 434 and the second stepped surface 435.
  • the upper plate 42 can also be connected to the supporting surface 4331 on the intermediate body 433 .
  • the upper layer 42, the outer frame 43, and the intermediate body 433 can be integrated, and the upper layer 42, the outer frame 43, and the intermediate body 433 form an integrated multi-cavity structure.
  • Body step plate its principle is similar to the integrated structure of the lower plate 41, outer frame 43, and intermediate body 433, and will not be repeated.
  • the first stepped surface 434 and the second stepped surface 435 face the upper plate 42, and the outer frame 43 and the other end surface of the intermediate body 433 are connected to the lower plate 41 along the thickness direction of the outer frame 43 .
  • the upper plate 42 is integrated with the outer frame 43 and the intermediate body 433
  • the first stepped surface 434, the second stepped surface 435 and the support surface 4331 are located in the integrated structure of the upper layer plate 42, the outer frame 43, and the intermediate body 433.
  • the first stepped surface 434, the second stepped surface 435 and the supporting surface 4331 cannot be observed, and the first stepped surface 434, the second stepped surface 435 and the supporting surface 4331 will no longer exist.
  • the number of the upper board 42 can be one, the upper board 42 is an integrated step board, and the upper board 42 has an integrated first horizontal area and a second In the horizontal area, the first horizontal area is opposite to the first stepped surface 434 , and the second horizontal area is opposite to the second stepped surface 435 .
  • a side of the first horizontal region facing the first stepped surface 434 is connected to the first stepped surface 434
  • a side of the second horizontal region facing the second stepped surface 435 is connected to the second stepped surface 435 .
  • the integrated structure of the upper board 42 can improve the overall strength of the circuit board assembly 40 .
  • an opening 46 between at least one of the two adjacent outer frames and at least one end of the intermediate body 433, and one end of the intermediate body 433 Refers to one end along the Y direction. Wherein, there may be an opening 46 between an outer frame body and the middle body 433 .
  • one end of the first outer frame body 431 and the intermediate body 433 may have an opening 46 , the first outer frame body 431 is connected to the other end of the intermediate body 433 , and the number of openings 46 is one.
  • both ends of the first outer frame body 431 and the intermediate body 433 can have openings 46, that is to say, there is a gap between the first outer frame body 431 and the intermediate body 433, which can be used as a safe installation gap to avoid
  • the mutually independent intermediate body 433 and the first outer frame body 431 interact with each other during installation, and at this time, the number of openings 46 is two.
  • the principle of the second outer frame body 432 is similar to that of the first outer frame body 431 , which will not be repeated here.
  • one end of the first outer frame body 431 and the intermediate body 433 has an opening 46
  • the same end of the second outer frame body 432 and the intermediate body 433 has an opening 46
  • One end has an opening 46
  • the other end of the second outer frame body 432 and the middle body 433 has an opening 46
  • Both ends of the body 433 have openings 46 .
  • the principle of the second outer frame body 432 is similar to that of the first outer frame body 431 , which will not be repeated here.
  • the opening 46 can be used as a channel for circuit routing in the circuit board assembly 40 , which can meet the requirements for installing some components 44 .
  • One of the outer frame bodies and the intermediate body 433 in the two adjacent outer frame bodies can be in an integrated structure, and there can be a gap between the other outer frame body in the two adjacent outer frame bodies and the two ends of the intermediate body 433. Opening 46.
  • the outer frame body with an integral structure with the intermediate body 433 can form a relatively closed accommodating cavity 45, and another outer frame body with a gap with the intermediate body 433 is relatively simple to make and has a low cost, which can reduce the production cost. cost and improve production efficiency.
  • one end of two adjacent upper layer boards 42 is overlapped in the thickness direction of the circuit board assembly 40, so that one end of one upper layer board 42 is suspended in the other.
  • One end of an upper plate 42 is suspended for example, the first upper board 421 is suspended above the second upper board 422 .
  • Part of the first upper layer 421 and part of the second upper layer 422 overlapped in the thickness direction may be used for disposing the components 44 .
  • Extending the first upper layer board 421 to the direction of the second upper layer board 422 so that the two upper layer boards 42 overlap the area of the first upper layer board 421 is increased, and more components and parts 44 can be arranged on the first upper layer board 421, thereby increasing
  • the utilization rate of the layout area of the circuit board assembly 40 can achieve a higher degree of integration.
  • the two upper layer boards 42 The upper plate 42 needs to be provided with a safe installation gap in the thickness direction.
  • the first upper layer board 421 and the second upper layer board 422 can be set as an integrated structure, and the first upper layer board 421 and the second upper layer board 422 do not need to set a safe installation gap in the thickness direction, and the first upper layer board 421 The closer distance to the second upper layer board 422 in the thickness direction can reduce the thickness of the circuit board assembly 40 facing the first upper layer board 421 and reduce the volume of the circuit board assembly 40 .
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a An indirect connection through an intermediary may be an internal communication between two elements or an interaction relationship between two elements.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请实施例提供一种电路板组件及电子设备，电路板组件至少包括：下层板和上层板，下层板和上层板中的其中一个上一体成型有外边框和至少一个中间体，外边框和中间体位于下层板和上层板之间；外边框的其中一端的端面至少具有第一台阶面和第二台阶面，上层板或下层板位于第一台阶面和第二台阶面上，且第一台阶面和第二台阶面在电路板组件的厚度方向上高度不同；中间体将上层板、下层板以及外边框围成的腔体分割成至少两个高度不同且相互隔开的容纳腔体，每个容纳腔体内设有元器件。这样，相邻容纳腔体之间无需避让出安全的安装间隙，使得单位空间内容纳腔体的体积增大，有利于对元器件的排布。

Description

电路板组件及电子设备
本申请要求于2021年06月30日提交中国专利局、申请号为202110745656.6、申请名称为“电路板组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，特别涉及一种电路板组件及电子设备。
背景技术
电子设备可以包括用于固定元器件的电路板组件。电路板组件可以包括多个印刷电路板(printed circuit board，PCB)。每个PCB可以承载元器件或其他PCB，从而PCB可以为元器件供电。由于电子设备需要实现的功能越来越多，布置在电子设备内部的元器件也就越来越多。相应地，电路板组件在电子设备内的占用空间也就越来越大。
目前，电路板组件可以包括多个下层板和多个上层板，上层板和下层板之间设有多个相互独立的框架板。上层板、下层板和各个相互独立的框架板围设形成多个间隔设置且相互独立的容纳腔体。多个框架板的高度不同，从而形成多个高度不同的容纳腔体，以分别容纳不同高度的元器件，可以减少对电路板组件厚度方向的空间占用。
然而，由于各个框架板为独立的，所以，安装时，相邻的两个框架板之间需要避让出安全的安装间隙，但是这样导致相邻两个容纳腔体之间的空间未被充分利用，使得在电路板组件占用空间一定的情况下，相邻两个容纳腔体的体积较小，不利于对元器件的排布。
发明内容
本申请提供一种电路板组件及电子设备，解决了相邻的框架板之间由于需要避让出安全的安装间隙而导致相邻两个容纳腔体的体积较小的技术问题。
本申请实施例的第一方面提供一种电路板组件，至少包括：下层板和上层板，下层板和上层板中的其中一个上一体成型有外边框和至少一个中间体，外边框和中间体位于下层板和上层板之间；
外边框的其中一端的端面至少具有第一台阶面和第二台阶面，上层板或下层板位于第一台阶面和第二台阶面上，且第一台阶面和第二台阶面在电路板组件的厚度方向上高度不同；
中间体将上层板、下层板以及外边框围成的腔体分割成至少两个高度不同且相互隔开的容纳腔体，每个容纳腔体内设有元器件。
如此设置，在电路板组件中相邻的两个容纳腔体之间设置中间体，通过中间体将两个容纳腔体隔开，中间体为整体结构，装配时，两个容纳腔体之间无需避让出安全的安装间隙，从而减小了相邻两个容纳腔体之间的距离，提高电路板组件布板面积的利用率。另外，中间体可以将两个容纳腔体隔开，所以，两个相邻的容纳腔体之间的中间体可以为单层结 构，而现有两个相互独立的容纳腔体之间具有两层侧壁的壁厚。因此，本申请实施例中，通过设置中间体，使得相邻两个容纳腔体之间的侧壁的壁厚减小了一层。这样，相邻两个容纳腔体之间的空间得到充分利用。由于两个容纳腔体之间只有中间体的壁厚，在电路板组件占用空间一定的情况，使得容纳腔体的体积可以增大，从而更利于元器件的排布。而且，由于相邻两个容纳腔体之间不存在安装间隙，相邻两个容纳腔体为外边框与中间体组成，所以，相邻两个容纳腔体之间不存在应力带，减小了不同高度框架板的板级应力，确保了电路板组件的强度。综上，本申请实施例提供的电路板组件，实现了相邻容纳腔体之间空间的充分利用，使得单位空间内容纳腔体的体积增大，减小了框架板所独立出的两个容纳腔体之间的应力。
在一种可能的实现方式中，外边框包括至少两个外框体，中间体位于相邻两个外框体之间，中间体的其中一端具有至少一个支撑面，支撑面与第一台阶面或第二台阶面平齐。
在一种可能的实现方式中，中间体的其中一端的端面具有两个高度不同的支撑面，其中一个支撑面与第一台阶面平齐，另一个支撑面与第二台阶面平齐。
在一种可能的实现方式中，下层板为等高板。
如此设置，下层板的工艺难度较低。
在一种可能的实现方式中，下层板与外边框和中间体呈一体式结构，外边框朝向上层板的一端的端面具有第一台阶面和第二台阶面，上层板与第一台阶面和第二台阶面相连。
如此设置，在电路板组件的制作过程中，可以减少下层板与外边框和中间体之间连接步骤，缩短工艺流程。另外，下层板与外边框和中间体之间没有焊料等连接部件，可以使得电路板组件的厚度更小，有利用减小电路板组件的体积。
在一种可能的实现方式中，上层板与外边框和中间体呈一体式结构，第一台阶面和第二台阶面朝向上层板，外边框和中间体的另一端的端面与下层板相连。
如此设置，在电路板组件的制作过程中，可以减少上层板与外边框和中间体之间连接步骤，缩短工艺流程。另外，上层板与外边框和中间体之间没有焊料等连接部件，可以使得电路板组件的厚度更小，有利用减小电路板组件的体积。
在一种可能的实现方式中，上层板的数量为一个，且上层板具有一体式的第一水平区域和第二水平区域，第一水平区域与第一台阶面相对，第二水平区域与第二台阶面相对。
如此设置，上层板为一体式的结构可以提高电路板组件的整体强度。
在一种可能的实现方式中，上层板的数量为多个，且其中一个上层板至少与第一台阶面相连，另一个上层板至少与第二台阶面相连。
在一种可能的实现方式中，相邻两个上层板的一端在电路板组件的厚度方向上重叠设置，以使其中一个上层板的一端悬空位于另一个上层板的一端。
如此设置，将第一上层板向第二上层板的方向延伸以使两个上层板重叠，增加了第一上层板面积，可以在第一上层板设置更多的元器件，从而增加电路板组件的布板面积的利用率。
在一种可能的实现方式中，上层板的数量为两个，两个上层板分别为相互独立的第一上层板和第二上层板，第一上层板与第一台阶面相对，第二上层板与第二台阶面相对；
第一上层板与下层板之间垂直距离大于第二上层板与下层板之间的垂直距离；
且第二上层板的一端与中间体的侧壁之间具有装配间隙。
如此设置，装配间隙可以避免第一上层板和第二上层板安装时互相影响。
在一种可能的实现方式中，第一上层板和第二上层板为集成有射频(RF)电路的电路板。
如此设置，第一上层板和第二上层板可以为射频板，使得通信模块体积更小，更薄。
在一种可能的实现方式中，相邻两个外框体中的至少一个外框体与中间体的至少一端之间具有开口。
在一种可能的实现方式中，相邻两个外框体中的其中一个外框体与中间体呈一体式结构，相邻两个外框体中的另一个外框体与中间体的两端之间均有开口。
如此设置，相邻两个外框体中的其中一个外框体与中间体可以呈一体式结构，相邻两个外框体中的另一个外框体与中间体的两端之间可以均有开口。这样，与中间体为一体结构的外框体可以形成较为封闭的容纳腔体，而另一个与中间体具有间隙的外框体，由于制作起来较为简单，成本较低，可以降低制作成本，提高制作效率。
在一种可能的实现方式中，相邻两个外框体与中间体呈一体式结构。
在一种可能的实现方式中，至少两个高度不同的容纳腔体中具有至少一个封闭的容纳腔体。
如此设置，将会产生干扰的元器件设置在封闭的容纳腔体内部，防止其对该容纳腔体外部元器件的影响。
在一种可能的实现方式中，还包括：下层板和上层板背向外边框的一面设有元器件。
本申请实施例的第二方面提供一种电子设备，至少包括：上述第一方面中的电路板组件。
如此设置，电子设备中，通过在电路板组件中相邻的两个容纳腔体之间设置中间体，通过中间体将两个容纳腔体隔开，中间体为整体结构，装配时，两个容纳腔体之间无需避让出安全的安装间隙，从而减小了相邻两个容纳腔体之间的距离，提高电路板组件布板面积的利用率，另外，中间体可以将两个容纳腔体隔开，所以，两个相邻的容纳腔体之间的中间体可以为单层结构，使得相邻两个容纳腔体之间的侧壁的壁厚减小了一层。这样，电路板组件实现了相邻容纳腔体之间空间的充分利用，使得单位空间内容纳腔体的体积增大，减小了框架板所独立出的两个容纳腔体之间的应力。
附图说明
图1为一种电路板组件的一种实现方式的结构图；
图2为图1中电路板组件中元器件的设置结构图；
图3为一种电路板组件的另一种实现方式的结构图；
图4为图3中A-A剖面的结构示意图；
图5为本申请实施例提供的一种电子设备的结构示意图；
图6为本申请实施例提供的一种电子设备的爆炸图；
图7为本申请实施例提供的一种电路板组件的结构图；
图8为图7中A-A剖面的结构示意图；
图9为本申请实施例提供的另一种电路板组件的结构图；
图10为本申请实施例提供的另一种电路板组件的结构图；
图11为图10中A-A剖面的结构示意图；
图12为本申请实施例提供的另一种电路板组件的结构图；
图13为图12中A-A剖面的结构示意图；
图14为本申请实施例提供的另一种电路板组件的立体图；
图15为本申请实施例提供的另一种电路板组件的正视图；
图16为本申请实施例提供的另一种电路板组件的立体图；
图17为本申请实施例提供的另一种电路板组件的正视图。
附图标记说明：
100-电子设备；               10-显示屏；               20-后盖；
30-中框；                    31-边框；                 32-中板；
40-电路板组件；              41-下层板；               42-上层板；
421-第一上层板；             422-第二上层板；          43-外边框；
431-第一外框体；             432-第二外框体；          433-中间体；
4331-支撑面；                434-第一台阶面；          435-第二台阶面；
43a-框架板；                 44-元器件；               45-容纳腔体；
451-第一容纳腔体；           452-第二容纳腔体；        46-开口；
47-装配间隙；                50-电池。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
电子设备需要实现的功能越来越多，布置在电子设备内部的元器件也就越来越多，相应的布置在电路板组件上的元器件增多，导致电路板组件的占用的体积较大，电子设备的体积较大，影响电子设备的整体外观。为了使电子设备体积更小，电路板组件的布板面积需要得到充分利用，可以采用三明治单板(或四明治单板)设计，三明治单板即在两个电路板之间设置框架板，两个电路板与框架板围设成容纳腔体，容纳腔体内可以容置元器件。这样，电路板组件仅需增加少许厚度(Z方向)，就可以使得电路板组件的面积(X-Y方向)减小较多，使得电路板组件的体积减小较多，提升电路板组件布板面积的利用率，使得电子设备体积更小，外观更好。
参见图1和图2所示，电路板组件40可以包括上层板42、下层板41以及位于上层板42和下层板41之间的框架板43a，上层板42、下层板41和框架板43a共同围设成了一个容纳腔体45，容纳腔体45用于设置元器件44。而该容纳腔体45的高度取决于位于容纳腔体45内部高度最高的元器件44。对于其余相对高度较低的元器件44，由于高度较低，其在电路板组件40的厚度方向上(Z方向)，有较多空间未被充分利用，导致电路板组件40的整体厚度较大，电子设备较厚，体积较大。
图3和图4示出了电路板组件40的另一种实现方式，与图1和图2示出的实现方式不同的是，该电路板组件40的框架板43a为2个相互独立的框架板43a，上层板42也为2个相互独立的上层板42。其中一个框架板43a的高度大于另一个框架板43a的高度，从而使得上层板42、下层板41和框架板43a之间围设成了2个高度不同的容纳腔体45，不同 高度的容纳腔体45可以用于容置不同高度的元器件44。电路板组件40的厚度方向上(Z方向)，空间得到充分利用，可以降低部分电路板组件40的厚度。
如图4中所示，两个容纳腔体45为两个相互分离的框架板43a与上层板42和下层板41围成的两个独立的容纳腔体45，两个容纳腔体45之间距离为a+b+c，其中，b+c为两个框架板43a的侧壁厚度之和，a为两个框架板43a之间的安全的安装间隙。这样，相邻两个容纳腔体之间的距离较大，两个容纳腔体45之间的空间无法承载元器件44而未被充分利用，使得在电路板组件40占用空间一定的情况下，相邻两个容纳腔体45的体积较小，不利于对元器件44的排布。另外，电路板组件40上两个相互分离的框架板43a在安装间隙处存在板级应力带，对电路板组件40的强度不利。其中，安全的安装间隙是指为了避免相邻部件安装等互相影响而设置的安装间隙。
基于上述问题，本申请实施例提供一种电路板组件及电子设备，在电路板组件中相邻的两个容纳腔体之间设置中间体，通过中间体将两个容纳腔体隔开，中间体为整体结构，装配时，两个容纳腔体之间无需避让出安全的安装间隙，从而减小了相邻两个容纳腔体之间的距离，提高电路板组件布板面积的利用率。另外，中间体可以将两个容纳腔体隔开，所以，两个相邻的容纳腔体之间的中间体可以为单层结构，而现有两个相互分离的容纳腔体之间具有两层侧壁的壁厚。因此，本申请实施例中，通过设置中间体，使得相邻两个容纳腔体之间的侧壁的壁厚减小了一层。这样，相邻两个容纳腔体之间的空间得到充分利用，由于两个容纳腔体之间只有中间体的壁厚，在电路板组件占用空间一定的情况，使得容纳腔体的体积可以增大，从而更利于元器件的排布。而且，由于相邻两个容纳腔体之间不存在安装间隙，相邻两个容纳腔体为外边框整体结构与中间体组成，所以，相邻两个容纳腔体之间不存在应力带，减小了不同高度框架板的板级应力，确保了电路板组件的强度。综上，本申请实施例提供的电路板组件及电子设备，实现了相邻容纳腔体之间空间的充分利用，使得单位空间内容纳腔体的体积增大，减小了框架板所独立出的两个容纳腔体之间的应力。
本申请实施例提供一种电子设备，该电子设备可以包括但不限于为手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、行车记录仪、安防设备等具有电路板组件的移动终端、固定终端或可折叠终端。
本申请实施例中，参见图5所示，以手机为上述电子设备100为例进行说明，其中，手机可为可折叠的手机，可折叠手机可以为内折折叠手机(即显示屏向内折叠)，也可以为外折折叠手机(即显示屏向外折叠)；手机也可以为直板手机。
本申请实施例中，以直板手机为例。
参加图6所示，手机可以包括：显示屏10、后盖20以及位于显示屏10和后盖20之间的中框30、电路板组件40和电池50。
其中，电路板组件40和电池50可以设置在中框30上，例如，电路板组件40与电池50设置在中框30朝向后盖20的一面上，或者电路板组件40与电池50可以设置在中框30朝向显示屏10的一面上。其中，电路板组件40在中框30上设置时，中框30上可以开设开口区用于将电路板组件40上的元件置于中框30的开口区处。
其中，电池50可以通过电源管理模块与充电管理模块和电路板组件40相连，电源管 理模块接收电池50和/或充电管理模块的输入，并为处理器、内部存储器、外部存储器、显示屏10、摄像头以及通信模块等供电。电源管理模块还可以用于监测电池容量，电池循环次数，电池健康状态(漏电，阻抗)等参数。在其他一些实施例中，电源管理模块也可以设置于电路板组件40的处理器中。在另一些实施例中，电源管理模块和充电管理模块也可以设置于同一个器件中。
显示屏10可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏，也可以为液晶显示屏(Liquid Crystal Display，LCD)。
后盖20可以为金属后盖，也可以为玻璃后盖，还可以为塑料后盖，或者，还可以为陶瓷后盖20，本申请实施例中，对后盖20材质不作限定。
中框30可以包括中板32和边框31。边框31围绕中板32的外周设置一周。边框31可以包括顶边框、底边框、左侧边框和右侧边框，顶边框、底边框、左侧边框和右侧边框围成环形的边框。其中，中板32可以为铝板，也可以为铝合金板，还可以为镁合金板，对中板32的材质不作限定。边框31可以为金属边框，也可以为陶瓷边框，对边框的材质不作限定。其中，中板32和边框31之间可以卡接、焊接、粘合或一体成型，或者中板32与边框31之间通过注塑固定相连。
需要说明的是，在一些其他示例中，手机可以包括但不限于为图6所示的结构，手机的后盖20可以与边框31相连形成一体成型(Unibody)后盖，例如手机可以包括：显示屏10、中板32和电池盖，电池盖可以为边框31和后盖20一体成型(Unibody)形成的后盖20。这样电路板组件40和电池50位于中板32和电池盖围成的空间中。
可以理解的是，本申请实施例示意的结构并不构成对电子设备100的具体限定。在本申请另一些实施例中，电子设备100可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。例如电子设备100还可以包括摄像头(例如前置摄像头和后置摄像头)和闪光灯等器件。
以下结合附图，对本申请实施例提供的电路板组件40详细的说明。
电路板组件40可以包括多个电路板以及与电路板电连接的多个元器件。
电路板可以是印刷电路板(printed circuit board，PCB)、柔性电路板、集成电路(或称为芯片)。本申请实施例中，以电路板为PCB为例进行阐述。根据电路板上承载的元器件的数量，电路板可以是单面板、双面板，单面板可以指单侧承载元器件的电路板，双面板可以指双侧承载元器件的电路板。根据电路板上承载的元器件的类型，电路板可以是射频(radio frequency，RF)板、应用处理器(application processor，AP)板。RF板可以用于承载射频芯片(radio frequency integrated circuit，RF IC)、射频功率放大器(radio frequency power amplifier，RFPA)、无线保真(wireless fidelity，WIFI)芯片等。AP板例如可以用于承载片上系统(system on chip，SOC)元件、双倍数据率(double data rate，DDR)存储器、主电源管理芯片(power management unit，PMU)、辅PMU等。
元器件例如可以是连接器、电子变压器、继电器、激光器件、封装器件、生物特征识别模组、处理器、存储器(如DDR存储器)、电源模块等。元器件例如还可以是SOC元件、主PMU、RF IC、RF PA、WIFI芯片、辅PMU等。元器件除了可以是单个元器件，还可以是通过堆叠方式得到的。SOC元件与DDR存储器可以堆叠形成封装堆叠(package on package，PoP)元件。其中，SOC元件与DDR存储器也可以单独设置。
电路板还可以包括上述器件的组合。例如，电路板可以包括PCB和处理器等。
多个电路板可以通过焊料固定。焊料可以用于机械连接和/或电连接，焊料的形状可以是球形、多面体、椭球形、圆台形、倒角形、条形、棒形等，对焊料的形状不做限制。
图7和图8示出的电路板组件40的实现方式中，电路板组件40可以至少包括下层板41和上层板42，下层板41和上层板42中的其中一个上具有外边框43，外边框43位于下层板41和上层板42之间。电路板组件40可以包括依次层叠设置的上层板42、外边框43和下层板41。其中，上层板42和下层板41可以为电路板。上层板42和下层板41可以为单面板，上层板42和下层板41的其中一侧可以用于设置元器件44，例如，上层板42和下层板41朝向外边框43的一侧可以用于设置元器件44。当然的，也可以将元器件44设置在上层板42和下层板41背离外边框43的一侧。一些示例中，上层板42和下层板41也可以为双面板，例如上层板42和下层板41两侧均可以用于设置元器件44。
需要说明的是，本申请中，电路板组件40的厚度(高度)方向为图7中所示的Z方向，电路板组件40的长度方向为图7中所示的X方向，电路板组件40的宽度方向为图7中所示的Y方向。
一些示例中，沿Z方向，电路板组件40可以包括更多层的电路板和外边框43，也就是说，除了上层板42和下层板41外，电路板组件40还可以包括其他层的电路板。多层电路板和外边框43沿电路板组件40厚度方向层叠设置，相邻两层电路板之间设有一个外边框43。例如，电路板的层数是3层、4层、5层、6层等，外边框43的层数可以是2层、3层、4层、5层等，电路板的层数和外边框43的层数包括但不限于上述数量。其中，多层外边框43中的至少一层为台阶式外边框，相应的，多层电路板中的至少一层形成台阶式排布的电路板。
如图7中所示，外边框43可以为台阶式外边框，外边框43的其中一端的端面至少具有第一台阶面434和第二台阶面435，外边框43的该端面是指沿电路板组件40的厚度方向(Z方向)上的一端端面。上层板42或下层板41位于第一台阶面434和第二台阶面435上，且第一台阶面434和第二台阶面435在电路板组件40的厚度方向上高度不同。也就是说，第一台阶面434和第二台阶面435相对于外边框43的厚度方向上的另一端端面的垂直距离可以不同。
如图8中所示，沿Z方向，第一台阶面434(参见图7)的高度h1为第一台阶面434与下层板41之间的距离，第二台阶面435的高度h2为第二台阶面435与下层板41之间的距离，第一台阶面434的高度h1和第二台阶面435的高度h2不同，其中可以是h1大于h2，也可以是h2大于h1。其他一些示例中，沿X-Y方向，外边框43的一端的端面上可以包括更多的台阶面，也就是说，外边框43的一端端面上除了第一台阶面434和第二台阶面435外，还可以包括其他台阶面。例如，外边框43的一端端面上的台阶面可以为3个、4个、5个、6个等，包括但不限于上述数量。其中，各个台阶面的高度可以完全不同，也可以部分相同。另一些示例中，外边框43沿Z方向上另一端的端面也可以具有至少两个台阶面。也就是说，外边框43沿Z方向上的两端均可以具有多个台阶面。
本申请实施例以上层板42位于第一台阶面434和第二台阶面435上进行说明。
如图8中所示，上层板42可以至少包括第一上层板421和第二上层板422，第一上层板421位于第一台阶面434(参加图7)上，第二上层板422位于第二台阶面435上。由 于第一台阶面434和第二台阶面435的高度不同，这样，第一台阶面434和第二台阶面435对应的电路板组件40的厚度也不同，第一上层板421和第二上层板422呈阶梯状设置。
下层板41可以为等高板，这样下层板41的工艺难度较低。
其中，第一上层板421和第二上层板422可以是各自相互独立的上层板42。第一上层板421与下层板41之间垂直距离大于第二上层板422与下层板41之间的垂直距离。也就是，第一上层板421对应的第一容纳腔体451的高度大于第二上层板422对应的第二容纳腔体452的高度。这样，第一容纳腔体451可以用于设置高度较高的元器件44，第二容纳腔体452可以用于设置高度较矮的元器件44。
由于电路板组件40上的通信模块往往比较厚，将通信模块用于电子设备100时，电子设备100往往不能做得更加细薄精致，这样会使得电子设备100较厚，体积较大，影响电子设备100的整体外观。为了使电子设备100体积更小，可以将通信模块集成在本申请实施例提供的电路板组件40上，从而使得通信模块体积更小，更薄。其中，通信模块可以包括射频、基带、射频功率放大器等芯片，示例性的，第一上层板421和第二上层板422可以为射频板，用于承载RF IC、RF PA、WIFI芯片等。
一些示例中，上层板42的数量可以为更多数量，其中一个台阶面对应与其中一个上层板42相连。全部上层板42可以均为各自独立的上层板42。当然的，也可以是其中部分的上层板42为一体式台阶板，另外一部分的上层板42为各自独立的上层板42。例如，上层板42的数量可以是2个，3个，4个，5个等，包括但不限于上述数量。
如图7所示，电路板组件40还可以包括至少一个中间体433，外边框43可以包括容纳元器件44的腔体，腔体内的元器件44可以固定在上层板42或下层板41上。这样，上层板42、下层板41以及外边框43围设在腔体的外侧，中间体433位于腔体内，中间体433可以将腔体分割成至少两个高度不同且相互隔开的容纳腔体45，每个容纳腔体45内设有元器件44。由于设置了中间体433，相邻的两个容纳腔体45的距离为中间体433沿X方向上的壁厚。这样，两个容纳腔体45之间无需避让出安全的安装间隙，从而减小了相邻两个容纳腔体45之间的距离，提高电路板组件40布板面积的利用率。另外，两个相邻的容纳腔体45之间的中间体可以为单层结构，使得相邻两个容纳腔体45之间的侧壁的壁厚比现有的两层侧壁的壁厚减小了一层。而且，相邻两个容纳腔体45之间不存在应力带，减小了不同高度框架板43a的板级应力，确保了电路板组件40的强度。
为了避免第二上层板422与中间体433安装时互相影响，参见图8所示，在第二上层板422的一端与中间体433的侧壁之间可以具有装配间隙47。
一些示例中，外边框43内可以设置多个中间体433，例如，中间体433的数量是2个、3个、4个、5个等，包括但不限于上述数量。这样，多个中间体433将外边框43的腔体隔开成更多的容纳腔体45，例如容纳腔体45的数量是3个、4个、5个、6个等，包括但不限于上述数量。这样，可以将元器件44按高度和功能更细的进行划分，将其设置在不同的容纳腔体45内，使得电路板组件40的Z向上的空间利用更充分，避免部分元器件44的相互干扰。其中，各个容纳腔体45的高度可以完全不同，也可以部分相同。另一些示例中，相邻两个容纳腔体45之间可以不设中间体433，以使容纳腔体45可以容纳更多元器件44，有利于元器件44的排布。
为了避免元器件44之间相互干扰，多个高度不同的容纳腔体45中具有至少一个封闭 的容纳腔体45。这样，将会产生干扰的元器件44设置在封闭的容纳腔体45内部，防止其对该容纳腔体45外部元器件44的影响。例如，可以将第一容纳腔体451设置为封闭的容纳腔体45，也可将第二容纳腔体452设置为封闭的容纳腔体45，还可以将第一容纳腔体451和第二容纳腔体452均设置为封闭的容纳腔体45。当容纳腔体45为2个以上时，容纳腔体45可以全部是封闭的容纳腔体45；也可以部分是封闭的容纳腔体45；若不存在相互干扰的元器件，还可以不设置封闭的容纳腔体45。
本申请实施例中，如图7中所示，外边框43包括至少两个外框体，两个外框体可以为第一外框体431和第二外框体432，中间体433位于相邻两个外框体之间，中间体433将两个外框体分隔开来形成两个高度不同的容纳腔体45。其他一些示例中，外边框43可以包括更多的外框体，例如外框体的数量可以是3个，4个，5个，6个等，包括但不限于上述数量。这样，多个中间体433可以将多个外框体分隔开来形成多个高度不同或部分相同的容纳腔体45。
本申请实施例中，如图7中所示，相邻两个外框体可以与相邻两个外框体之间的中间体433呈一体式结构。例如，第一外框体431、第二外框体432和第一外框体431、第二外框体432之间的中间体433可以为一体式结构。这样，外边框43与中间体433一体成型，强度较高，且无需分开制作外边框43和中间体433，减少了工艺步骤。当然的，相邻两个外框体与中间体433也可以是相互独立的。
其中，如图7所示，沿Z方向，中间体433的其中一端可以具有至少一个支撑面4331，中间体433的支撑面4331与外边框43的台阶面朝向同一侧。例如，中间体433上的支撑面4331可以为一个，支撑面4331可以与第一外框体431的第一台阶面434平齐。另一些示例中，一个支撑面4331也可以与第二外框体432的第二台阶面435平齐。其他一些示例中，例如图7中，中间体433上的支撑面4331为两个，两个支撑面4331的高度可以不同，也就是说，中间体433可以为台阶式的中间体，其中一个支撑面4331可以与第一台阶面434平齐，另一个支撑面4331可以与第二台阶面435平齐。
图9示出的电路板组件40的实现方式中，下层板41和外边框43、中间体433可以为一体结构，下层板41和外边框43、中间体433采用一体式多腔体设计。这样，在电路板组件40的制作过程中，可以减少下层板41和外边框43、中间体433之间连接步骤，缩短工艺流程。另外，由于下层板41和外边框43、中间体433之间连接时需要使用连接部件，如通过焊锡层连接，而焊锡层具有一定的厚度，会增加电路板组件40的厚度。当下层板41和外边框43、中间体433为一体结构时，下层板41和外边框43、中间体433之间没有如焊锡层等连接部件，可以使得电路板组件40的厚度更小，有利于减小电路板组件40的体积。
此时，外边框43朝向上层板42的一端的端面可以具有第一台阶面434和第二台阶面435，上层板42可以与第一台阶面434和第二台阶面435相连，另外，上层板42还可以与中间体433上的支撑面4331相连。
图10和图11示出的电路板组件40的实现方式中，上层板42与外边框43、中间体433可以为一体结构，上层板42与外边框43、中间体433构成了一体式多腔体台阶板，其原理与下层板41和外边框43、中间体433可以为一体结构类似，不再赘述。
此时，第一台阶面434和第二台阶面435朝向上层板42，沿外边框43厚度方向，外 边框43、中间体433的另一端的端面与下层板41相连。可以理解的是，由于上层板42与外边框43、中间体433为一体结构，第一台阶面434、第二台阶面435和支撑面4331位于上层板42与外边框43、中间体433的一体式结构内，将无法观察到第一台阶面434、第二台阶面435和支撑面4331，第一台阶面434、第二台阶面435和支撑面4331将不复存在。
图12和图13示出的电路板组件40的实现方式中，上层板42的数量可以为一个，上层板42是一体式台阶板，且上层板42具有一体式的第一水平区域和第二水平区域，第一水平区域与第一台阶面434相对，第二水平区域与第二台阶面435相对。第一水平区域朝向第一台阶面434的一侧与第一台阶面434相连，第二水平区域朝向第二台阶面435的一侧与第二台阶面435相连。这样，上层板42为一体式的结构，可以提高电路板组件40的整体强度。
图14和图15示出的电路板组件40的实现方式中，相邻两个外框体中的至少一个外框体与中间体433的至少一端之间具有开口46，该中间体433的一端指沿Y方向上的一端。其中，可以是一个外框体与中间体433之间具有开口46。例如，第一外框体431与中间体433的一端可以具有开口46，第一外框体431与中间体433的另一端相连，开口46的数量为1。或者，第一外框体431与中间体433的两端可以均具有开口46，也就是说，第一外框体431与中间体433之间具有间隙，该间隙可以作为安全的安装间隙，避免相互独立的中间体433与第一外框体431在安装过程中互相影响，此时，开口46的数量为2。第二外框体432与第一外框体431的原理类似，不再赘述。
一些示例中，可以是两个外框体与中间体433之间均具有开口46，例如第一外框体431与第二外框体432与中间体433之间均可以具有该开口46，第一外框体431与中间体433之间可以具有1个或2个开口46，第二外框体432与中间体433之间可以具有1个或2个开口46。例如，第一外框体431与中间体433的一端具有开口46，第二外框体432与中间体433的同一端具有开口46；也可以是，第一外框体431与中间体433的一端具有开口46，第二外框体432与中间体433的另一端具有开口46；还可以是，第一外框体431与中间体433的一端具有开口46，第二外框体432与中间体433的两端均具有开口46。第二外框体432与第一外框体431的原理类似，不再赘述。
当然的，也可以是第一外框体431和第二外框体432与中间体433之间均具有2个开口46。
当外框体与中间体433之间具有开口46时，可以将该开口46作为电路板组件40中电路走线的通道，可以满足某些元器件44安装的需求。
相邻两个外框体中的其中一个外框体与中间体433可以呈一体式结构，相邻两个外框体中的另一个外框体与中间体433的两端之间可以均有开口46。这样，与中间体433为一体结构的外框体可以形成较为封闭的容纳腔体45，而另一个与中间体433具有间隙的外框体，由于制作起来较为简单，成本较低，可以降低制作成本，提高制作效率。
图16和图17示出的电路板组件40的实现方式中，相邻两个上层板42的一端在电路板组件40的厚度方向上重叠设置，以使其中一个上层板42的一端悬空位于另一个上层板42的一端。例如，第一上层板421悬空位于第二上层板422的上方。
在厚度方向重叠的部分第一上层板421和部分第二上层板422可以用于设置元器件44。 将第一上层板421向第二上层板422的方向延伸以使两个上层板42重叠，增加了第一上层板421面积，可以在第一上层板421设置更多的元器件44，从而增加电路板组件40的布板面积的利用率，可以实现更高的集成度。
由于，第一上层板421和第二上层板422在厚度方向具有部分重叠，为了避免在厚度方向上两个上层板42或两个上层板42之间的元器件44安装时受到影响，两个上层板42在厚度方向上需要设置安全的安装间隙。一些实施例中，可以将第一上层板421和第二上层板422设置为一体结构，第一上层板421和第二上层板422在厚度方向上无需设置安全的安装间隙，第一上层板421和第二上层板422在厚度方向上的距离更近，可以降低第一上层板421正对的电路板组件40的厚度，减小电路板组件40的体积。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (17)

  1. 一种电路板组件，其特征在于，至少包括：下层板和上层板，所述下层板和所述上层板中的其中一个上一体成型有外边框和至少一个中间体，所述外边框和所述中间体位于所述下层板和所述上层板之间；
    所述外边框的其中一端的端面至少具有第一台阶面和第二台阶面，所述上层板或所述下层板位于所述第一台阶面和所述第二台阶面上，且所述第一台阶面和所述第二台阶面在所述电路板组件的厚度方向上高度不同；
    所述中间体将所述上层板、所述下层板以及所述外边框围成的腔体分割成至少两个高度不同且相互隔开的容纳腔体，每个所述容纳腔体内设有元器件。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述外边框包括至少两个外框体，所述中间体位于相邻两个所述外框体之间，所述中间体的其中一端具有至少一个支撑面，所述支撑面与所述第一台阶面或所述第二台阶面平齐。
  3. 根据权利要求2所述的电路板组件，其特征在于，所述中间体的其中一端的端面具有两个高度不同的支撑面，其中一个所述支撑面与所述第一台阶面平齐，另一个所述支撑面与所述第二台阶面平齐。
  4. 根据权利要求1-3任一所述的电路板组件，其特征在于，所述下层板为等高板。
  5. 根据权利要求4所述的电路板组件，其特征在于，所述下层板与所述外边框和所述中间体呈一体式结构，所述外边框朝向所述上层板的一端的端面具有所述第一台阶面和所述第二台阶面，所述上层板与所述第一台阶面和所述第二台阶面相连。
  6. 根据权利要求4所述的电路板组件，其特征在于，所述上层板与所述外边框和所述中间体呈一体式结构，所述第一台阶面和所述第二台阶面朝向所述上层板，所述外边框和所述中间体的另一端的端面与所述下层板相连。
  7. 根据权利要求5或6所述的电路板组件，其特征在于，所述上层板的数量为一个，且所述上层板具有一体式的第一水平区域和第二水平区域，所述第一水平区域与所述第一台阶面相对，所述第二水平区域与所述第二台阶面相对。
  8. 根据权利要求5或6所述的电路板组件，其特征在于，所述上层板的数量为多个，且其中一个所述上层板至少与所述第一台阶面相连，另一个所述上层板至少与所述第二台阶面相连。
  9. 根据权利要求8所述的电路板组件，其特征在于，相邻两个所述上层板的一端在所述电路板组件的厚度方向上重叠设置，以使其中一个所述上层板的一端悬空位于另一个所述上层板的一端。
  10. 根据权利要求8所述的电路板组件，其特征在于，所述上层板的数量为两个，两个所述上层板分别为相互独立的第一上层板和第二上层板，所述第一上层板与所述第一台阶面相对，所述第二上层板与所述第二台阶面相对；
    所述第一上层板与所述下层板之间垂直距离大于所述第二上层板与所述下层板之间的垂直距离；
    且所述第二上层板的一端与所述中间体的侧壁之间具有装配间隙。
  11. 根据权利要求10所述的电路板组件，其特征在于，所述第一上层板和所述第二上层板为集成有射频RF电路的电路板。
  12. 根据权利要求2或3所述的电路板组件，其特征在于，相邻两个所述外框体中的至少一个所述外框体与所述中间体的至少一端之间具有开口。
  13. 根据权利要求12所述的电路板组件，其特征在于，相邻两个所述外框体中的其中一个所述外框体与所述中间体呈一体式结构，相邻两个所述外框体中的另一个所述外框体与所述中间体的两端之间均有所述开口。
  14. 根据权利要求2或3所述的电路板组件，其特征在于，相邻两个所述外框体与所述中间体呈一体式结构。
  15. 根据权利要求1-14任一所述的电路板组件，其特征在于，所述至少两个高度不同的容纳腔体中具有至少一个封闭的所述容纳腔体。
  16. 根据权利要求1-15任一所述的电路板组件，其特征在于，还包括：所述下层板和所述上层板背向所述外边框的一面设有元器件。
  17. 一种电子设备，其特征在于，至少包括：上述权利要求1-16任一所述的电路板组件。
PCT/CN2022/093606 2021-06-30 2022-05-18 电路板组件及电子设备 WO2023273676A1 (zh)

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JPH10247786A (ja) * 1997-03-03 1998-09-14 Alps Electric Co Ltd 送受信ユニット、並びにその送受信ユニットを用いた電話機
CN111086303A (zh) * 2018-10-23 2020-05-01 宁波舜宇光电信息有限公司 用于摄像模组的保护膜及其制造方法
CN111698827A (zh) * 2020-04-27 2020-09-22 华为技术有限公司 电路板组件、电子设备、电路板组件的加工方法
CN112204732A (zh) * 2018-05-31 2021-01-08 华为技术有限公司 一种电路板及移动终端

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Publication number Priority date Publication date Assignee Title
JPH10247786A (ja) * 1997-03-03 1998-09-14 Alps Electric Co Ltd 送受信ユニット、並びにその送受信ユニットを用いた電話機
CN112204732A (zh) * 2018-05-31 2021-01-08 华为技术有限公司 一种电路板及移动终端
CN111086303A (zh) * 2018-10-23 2020-05-01 宁波舜宇光电信息有限公司 用于摄像模组的保护膜及其制造方法
CN111698827A (zh) * 2020-04-27 2020-09-22 华为技术有限公司 电路板组件、电子设备、电路板组件的加工方法

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