WO2023238390A1

WO2023238390A1 - Wiring device

Info

Publication number: WO2023238390A1
Application number: PCT/JP2022/023469
Authority: WO
Inventors: 晃一佐藤; 墾基松岡
Original assignee: 株式会社カイジョー
Priority date: 2022-06-10
Filing date: 2022-06-10
Publication date: 2023-12-14
Also published as: CN117597771A; TW202350065A; JP7263633B1

Abstract

[Problem] Provided is a vacuum suction wire guide that is used in order to highly accurately insert a wire or coated line into a hole provided in a substrate. [Solution] An embodiment of the present invention pertains to a wiring device 100 for wiring, using a wire 11 or a coated line, a hole 17 provided in a substrate 16 and a connection point on the substrate located apart from the hole by a predetermined distance. The wiring device 100 has: a capillary 21 for sending out the wire or coated line; a wire guide 12 including suction openings 13a-13c for suctioning the wire or coated line; a horn 22 that holds the capillary and the wire guide; and a wire guide movement machine that moves the wire guide in a direction for moving the wire or coated line sent out from the capillary toward or away from the suction openings.

Description

wiring device

The present invention relates to a wiring device.

There are two or more rows of holes provided in the substrate, and a wire or coated wire drawn out from the tip of a capillary held by an ultrasonic horn is passed through one of the holes. The covered wire is drawn under the substrate, the capillary is raised while the covered wire is let out, the substrate is moved horizontally, and the capillary is lowered to join the other end of the wire or the covered wire to the substrate. Thereafter, the wire or coated wire is cut, the capillary is raised, the substrate is moved horizontally, the capillary is positioned above one of the plurality of holes, and the wire is let out from the tip of the capillary while lowering the capillary. Alternatively, the other end of the wire or coated wire is joined to the substrate by passing the coated wire through the hole, drawing the wire or coated wire under the substrate, and performing the same operation as above. By repeating these steps, a wire or coated wire is passed through each of two or more rows of holes, and the other end of each wire or coated wire is bonded to the substrate. The wiring is assembled in this way.

By the way, as described above, the other end of the wire or coated wire is bonded to the substrate, but as shown in FIG. There is a substrate on which a base (base with some thickness) 18 is arranged, and an electrode (not shown) provided on the substrate base 18 corresponds to the other end of the wire or coated wire.

In the case of such a substrate 16, the ultrasonic horn 22 and the substrate base 18 interfere as shown in FIG. The wire 11 or coated wire is inserted into one of the plurality of holes 17. Therefore, if there is resistance between the hole 17 of the substrate 16 and the wire 11 or the coated wire when inserting the wire 11 or the coated wire, the wire 11 or the coated wire may be bent and inserted into the hole 17 (Fig. 9 reference).

Further, as shown in FIG. 10, when the wire 11 or the covered wire is inserted, the tip of the wire 11 or the covered wire may shake due to vibration of the device or surrounding airflow, so the wire 11 or the covered wire may Sometimes it doesn't fit.

It is necessary to prevent failure in inserting the wire 11 or the covered wire into the hole 17 as described above.

An object of one aspect of the present invention is to provide a wiring device that can accurately insert a wire or a coated wire into a hole provided in a substrate.

Various aspects of the present invention will be explained below.
[1] A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole using a wire or a covered wire,
a capillary for feeding out the wire or the coated wire;
a wire guide equipped with a suction port that suctions the wire or the covered wire;
a horn that holds the capillary and the wire guide;
a wire guide moving machine that moves the wire guide in a direction in which the suction port approaches and in a direction in which the suction port moves away from the wire or the coated wire fed out from the capillary;
A wiring device comprising:

[2] The wire guide has a groove, and the suction port is provided on the inner surface of the groove,
The wiring device according to item [1] above, wherein a cross section of the inner surface of the groove has a V-shape or a U-shape.

[3] a lifting mechanism that lifts and lowers the capillary and the wire guide held by the horn;
a control unit;
The control unit is configured to cause the wire or the coated wire drawn out from the capillary to be attracted to the suction port of the wire guide, and to lower the capillary and the wire guide using the elevating mechanism so as to insert the wire or the coated wire into the hole. The wiring device according to [1] or [2] above, wherein the wiring device is controlled to insert the covered wire.

[4] After the wire or the coated wire is inserted into the hole, the control unit removes the suction of the wire or the coated wire from the suction port and raises the capillary and the wire guide using the lifting mechanism. and controlling the wire guide moving mechanism to move the wire guide in a direction that moves the wire or the coated wire away from the suction port.

[5] It has an XY stage on which the substrate is placed,
an X-axis moving mechanism for moving the XY stage in the X direction;
a Y-axis moving mechanism for moving the XY stage in the Y direction;
The wiring device according to [1] or [2] above, wherein the connection point is an electrode, and the wire or the covered wire drawn out from the capillary is bonded to the electrode.

[6] The elevating mechanism has a slide member that can be raised and lowered,
The horn is attached to the slide member via a connecting member,
The wiring device according to [3] above, wherein the wire guide moving mechanism is attached to the slide member.

[7] The wire guide moving mechanism is a mechanism for moving the wire guide within a plane that includes the axis of the wire or the coated wire attracted to the suction port and the axis of the horn. The wiring device according to [1] or [2] above, characterized by:

[8] The wiring according to [1] or [2] above, wherein the wire guide moving mechanism includes a rotating shaft attached to the wire guide and a rotating mechanism that rotates the rotating shaft. Device.

According to various aspects of the present invention, it is possible to provide a wiring device that can accurately insert a wire or a coated wire into a hole provided in a substrate.

FIG. 1 is a cross-sectional view for explaining a wiring device including a vacuum suction wire guide according to one embodiment of the present invention. 2 is a perspective view schematically showing the entire wiring device shown in FIG. 1. FIG. FIG. 2 is a perspective view of the entire wiring device shown in FIG. 1 viewed from a different direction from FIG. 2, and a partially enlarged perspective view of a vacuum suction wire guide. (A) to (D) are cross-sectional views for explaining the wiring method of the wire 11 or the covered wire. (A) to (D) are cross-sectional views for explaining the wiring method of the wire 11 or the covered wire. FIG. 2 is a perspective view showing how each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base arranged on a substrate are wired with wires or coated wires. FIG. 2 is a perspective view showing how each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base arranged on a substrate are wired with wires or coated wires. (A) is a top view showing the board 16, the board base 18, and the board 39 excluding the wiring device shown in FIGS. 6 and 7, and (B) is a cross-sectional view of (A). It is a sectional view showing an example where insertion of a wire or a coated wire into a hole provided in a board failed. FIG. 3 is a cross-sectional view showing an example in which a wire or a covered wire fails to be inserted into a hole provided in a substrate.

Hereinafter, embodiments of the present invention will be described in detail using the drawings. However, those skilled in the art will easily understand that the present invention is not limited to the following description, and that the form and details thereof can be changed in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the contents described in the embodiments shown below.

FIG. 1 is a cross-sectional view for explaining a wiring device equipped with a vacuum suction wire guide according to one embodiment of the present invention. FIG. 2 is a perspective view schematically showing the entire wiring device shown in FIG. 3 is a perspective view of the entire wiring device shown in FIG. 1 viewed from a different direction from FIG. 2, and a perspective view in which a part of the vacuum suction wire guide is enlarged.

<Vacuum suction wire guide 10>
First, the vacuum suction wire guide 10 will be explained.
As shown in FIG. 1, the vacuum suction wire guide 10 guides a wire 11 (which may be a coated wire). As shown in FIG. 3, the vacuum suction wire guide 10 has a wire guide 12, this wire guide 12 has a groove 12a, and an inner surface 12b of the groove 12a has a first suction port 13a and a second suction port. 13b and a third suction port 13c are provided. The first to third suction ports 13a to 13c are suction ports for vacuum suctioning the wire 11 or the coated wire.
The cross section of the groove preferably has a V-shape or a U-shape. In this case, it is preferable to provide the first to third suction ports 13a to 13c at the bottom of the groove 12a.

As shown in FIG. 1, the first to third suction ports 13a to 13c are connected to an exhaust path 14, and this exhaust path 14 is provided inside the wire guide 12. The exhaust path 14 is connected to a vacuum exhaust mechanism 15. That is, the first to third suction ports 13a to 13c are connected to the vacuum exhaust mechanism 15 via the exhaust path 14, and by evacuating the exhaust path 14 by the vacuum exhaust mechanism 15, the first to third suction ports 13a to 13c are The wire 11 or the covered wire is attracted to the suction ports 13a to 13c. Note that the evacuation mechanism 15 is constituted by, for example, a vacuum pump or the like.

According to the vacuum suction wire guide 10 according to the present embodiment, the first suction port 13a, the second suction port 13b, and the third suction port 13c are provided on the inner surface 12b of the groove 12a, and the first to third suction ports The wire 11 or the covered wire is attracted to 13a to 13c. Therefore, the wire 11 or the coated wire can be securely fixed with good positional accuracy.
Furthermore, by making the cross-sectional shape of the groove 12a V-shaped or U-shaped and providing the first to third suction ports 13a to 13c at the bottom of the groove 12a, the wire 11 can be placed at the bottom of the groove 12a with better positioning accuracy. It becomes possible to fix it.

<Wiring device>
As shown in FIG. 1, the wiring device 100 has a hole 17 provided in a substrate 16 and a connection point 19 on the substrate 16 located a predetermined distance away from the hole 17 (see FIGS. 5C and 5D). This is a device for wiring with wire 11 or coated wire. In detail, the connection point 19 is provided on a substrate base 18 arranged on the substrate 16.

Specifically, as shown in FIGS. 1 to 3, the wiring device 100 includes the vacuum suction wire guide 10 described above. Further, the wiring device 100 has a capillary 21 for feeding out the wire 11 or the coated wire, and this capillary 21 is held by an ultrasonic horn 22. Further, the wiring device 100 moves the wire guide 12 in a direction 61 in which the first to third suction ports 13a to 13c are brought closer to the wire 11 or the coated wire fed out from the capillary 21 and in a direction 62 in which the first to third suction ports 13a are moved away from the wire 11 or the coated wire as shown in FIGS. 2 and 3. It has a wire guide moving mechanism 30 shown in (see FIGS. 4(A) and 5(B)). The wiring device 100 also includes a lifting mechanism (Z-axis moving mechanism) 40 that moves the capillary 21 and wire guide 12 held by the ultrasonic horn 22 up and down.

As shown in FIG. 1, the wiring device 100 has an XY stage 26 on which a substrate 16 is placed. It has an X-axis moving mechanism 29 that moves the XY stage 26 in the X direction 27. The wiring device 100 also includes a Y-axis moving mechanism 33 that moves the XY stage 26 in the Y direction 28.

As shown in FIG. 2, the wiring device 100 has a control section 50. This control unit 50 controls the on/off operation of the evacuation mechanism 15 shown in FIG. 1, the capillary 21, the ultrasonic horn 22, the wire guide movement mechanism 30 shown in FIG. 2, the Z-axis movement mechanism 40, and the It controls the mechanism 29 and the Y-axis moving mechanism 33.

As shown in FIGS. 1 and 3, the wire guide moving mechanism 30 moves the wire 11 or the coated wire vacuum-adsorbed to the first to third suction ports 13a to 13c into a plane parallel to the longitudinal direction, and an ultrasonic horn 22. This is a mechanism for moving the wire guide 12 within a plane 70 that overlaps with a plane parallel to the longitudinal direction (see FIGS. 5(A) and 5(B)). In other words, the wire guide moving mechanism 30 has a surface that includes the axis of the wire 11 or the coated wire vacuum-adsorbed to the first to third suction ports 13a to 13c and the axis of the ultrasonic horn 22. This is a mechanism for moving the wire guide 12 within the wire guide 70.

Furthermore, as shown in FIGS. 2 and 3, the Z-axis moving mechanism 40 includes a slide member 41 that can be moved up and down. A wire guide moving mechanism 30 is attached to this slide member 41.

To explain in detail, the wire guide moving mechanism 30 has a rotation mechanism 32, and this rotation mechanism 32 can use, for example, a motor, a rotary actuator, or the like. The rotation mechanism 32 rotates the rotation shaft 31, and the rotation shaft 31 is attached to the wire guide 12. The ultrasonic horn 22 is attached to the slide member 41 via a connecting member 42, and the rotation mechanism 32 is also attached. As a result, the slide member 41 moves up and down in the direction of the arrow 43, thereby making it possible to move up and down the ultrasonic horn 22 and the wire guide 12 to which the capillary 21 is attached. Note that the slide member 41 and the connecting member 42 may be integrally formed.

The control unit 50 shown in FIG. The wire 11 or the coated wire may be inserted into the hole 17 by lowering the wire guide 21 and the wire guide 12.

Further, after the wire 11 or the coated wire is inserted into the hole 17, the control unit 50 removes the vacuum suction of the wire 11 or the coated wire from the first to third suction ports 13a to 13c, and moves the wire 11 or the coated wire by the Z-axis moving mechanism 40. Even if the capillary 21 and the wire guide 12 are raised and the wire guide moving mechanism 30 is controlled to move the wire guide 12 in a direction 62 that moves the wire 11 or the coated wire away from the first to third suction ports 13a to 13c. good.

<Wiring method of wire 11 or coated wire>
4(A) to (D) and FIG. 5(A) to (D) are cross-sectional views for explaining the wiring method of the wire 11 or the coated wire.

First, as shown in FIG. 4A, by moving the wire guide 12 in the direction of the arrow 61, the wire 11 or the coated wire is fixed to the first to third suction ports 13a to 13c of the wire guide 12. move to position.

Next, as shown in FIG. 4(B), the wire 11 or the coated wire is let out from the capillary 21, and then the evacuation mechanism 15 shown in FIG. 1 connected to the evacuation path 14 of the wire guide 12 is turned on. The wire 11 or the coated wire is vacuum-adsorbed and fixed to the first to third suction ports 13a to 13c.

Next, as shown in FIG. 4(C), with the wire 11 or the coated wire fixed to the wire guide 12, the wire guide 12, capillary 21, and ultrasonic horn are moved by the Z-axis moving mechanism 40 shown in FIGS. 2 and 3. 22 is lowered, the tip of the wire 11 or coated wire is inserted into the hole 17 of the substrate 16, and the wire or coated wire is pulled under the substrate 16.

Next, as shown in FIG. 4(D), by turning off the vacuum evacuation mechanism 15 shown in FIG. The vacuum suction of the wire 11 or the coated wire is removed, and the wire guide 12 is temporarily retracted.

Next, as shown in FIG. 5A, while feeding out the wire 11 or the coated wire from the capillary 21, the wire guide 12, capillary 21, and ultrasonic horn 22 are moved by the arrow 25 using the Z-axis moving mechanism 40 shown in FIGS. raise it in the direction of

Next, as shown in FIG. 5(B), the wire guide 12 is moved in a direction 62 that moves the first to third suction ports 13a to 13c away from the wire 11 or the coated wire, thereby retracting the wire guide 12. . Specifically, the rotation shaft 31 is rotated by the rotation mechanism 32 of the wire guide moving mechanism 30 shown in FIGS. 2 and 3, and the wire guide 12 is retracted.

Next, as shown in FIG. 5(C), the substrate 16 is moved in the X direction 27. Specifically, the substrate 16 is moved in the X direction 27 by moving the XY stage 26 on which the substrate 16 is placed in the X direction 27 by the X-axis moving mechanism 29 shown in FIG. At this time, since the wire guide 12 is retracted in the step shown in FIG. 5(B), the wire guide 12 does not interfere with the substrate base 18. Thereafter, the wire guide 12, the capillary 21, and the ultrasonic horn 22 are lowered as shown by the arrow 36, and the wire 11 or the coated wire is wired to the connection point 19 provided on the substrate base 18 at the tip of the capillary 21. Note that when the connection point 19 is, for example, the electrode 37 shown in FIG. 6, the wire 11 or the covered wire may be bonded to the electrode 37.

Next, as shown in FIG. 5(D), the wire 11 or the coated wire is cut, and the wire guide 12, capillary 21, and ultrasonic horn 22 are moved in the direction of the arrow 38 by the Z-axis moving mechanism 40 shown in FIGS. to rise in the direction.

The operations of the wiring devices shown in FIGS. 4(A) to 5(D) above are controlled by the control unit 50 shown in FIG. 2.

Further, by repeating the steps from FIG. 4A to FIG. and each of the plurality of connection points 19 provided on the substrate base 18 disposed on the substrate 16 at a predetermined distance from the plurality of holes 17 can be wired with the wires 11 or coated wires. Note that in the embodiment shown in FIG. 5(D), the connection point 19 is provided directly on the substrate base 18, but the connection point 19 is not limited to this, and the connection point 19 as shown in FIGS. It may be. That is, the connection point 19 may be a connection point on the substrate 39 disposed on the substrate base 18. This connection point may be an electrode. Note that FIG. 8(A) is a top view showing the board 16, board base 18, and board 39 excluding the wiring device shown in FIGS. 6 and 7, and FIG. FIG.

According to this embodiment, the wire 11 or the coated wire drawn out from the capillary 21 is fixed by vacuum suction by the wire guide 12, and then the capillary 21 is lowered and the wire 11 or the coated wire is guided by the wire guide 12. while inserting it into the hole 17 of the board 16. Therefore, it is possible to prevent the wire 11 or the covered wire from being bent and inserted into the hole 17, and when the wire 11 or the covered wire is inserted, the tip of the wire 11 or the covered wire swings, so that the wire 11 or the covered wire is inserted into the hole 17. You can prevent it from entering. Therefore, it becomes possible to insert the wire 11 or the coated wire into the hole 17 of the substrate 16 with high accuracy and stability.

10... Vacuum suction wire guide 11... Wire 12... Wire guide 12a... Groove 12b... Inner surface 13a... First suction port 13b... Second suction port 13c... Third suction port 14... Exhaust route 15... Vacuum exhaust mechanism 16 ... Substrate 17 ... Hole 18 ... Substrate base 19 ... Connection point 21 ... Capillary 22 ... Ultrasonic horn 26 ... XY stage 27 ... X direction 28 ... Y direction 29 ... X-axis movement mechanism 30 ... Wire guide movement mechanism 31 ... Rotation axis 32 …Rotation mechanism (motor)
33...Y-axis movement mechanism 40...Elevating mechanism (Z-axis movement mechanism)
41...Sliding member 42...Connection member 50...Control unit 100...Wiring device

Claims

A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole using a wire or a coated wire,
a capillary for feeding out the wire or the coated wire;
a wire guide equipped with a suction port that suctions the wire or the covered wire;
a horn that holds the capillary and the wire guide;
a wire guide moving machine that moves the wire guide in a direction in which the suction port approaches and in a direction in which the suction port moves away from the wire or the coated wire fed out from the capillary;
A wiring device comprising:
The wire guide has a groove, the suction port is provided on the inner surface of the groove,
The wiring device according to claim 1, wherein a cross section of the inner surface of the groove has a V-shape or a U-shape.
a lifting mechanism that lifts and lowers the capillary and the wire guide held by the horn;
a control unit;
The control unit is configured to cause the wire or the coated wire drawn out from the capillary to be attracted to the suction port of the wire guide, and to lower the capillary and the wire guide using the elevating mechanism so as to insert the wire or the coated wire into the hole. The wiring device according to claim 1 or 2, wherein the wiring device is controlled to insert the covered wire.
After the wire or the coated wire is inserted into the hole, the controller removes the suction of the wire or the coated wire from the suction port, raises the capillary and the wire guide by the elevating mechanism, and 4. The wiring device according to claim 3, wherein the wire guide is controlled by a wire guide moving mechanism to move the wire guide in a direction that moves the wire or the covered wire away from the suction port.
an XY stage on which the substrate is placed;
an X-axis moving mechanism for moving the XY stage in the X direction;
a Y-axis moving mechanism for moving the XY stage in the Y direction;
3. The wiring device according to claim 1, wherein the connection point is an electrode, and the wire or the covered wire drawn out from the capillary is bonded to the electrode.
The elevating mechanism has a slide member that can be moved up and down,
The horn is attached to the slide member via a connecting member,
The wiring device according to claim 3, wherein the wire guide moving mechanism is attached to the slide member.
The wire guide moving mechanism is a mechanism for moving the wire guide within a plane that includes the axis of the wire or the coated wire attracted to the suction port and the axis of the horn. The wiring device according to claim 1 or 2.
The wiring device according to claim 1 or 2, wherein the wire guide moving mechanism includes a rotating shaft attached to the wire guide and a rotating mechanism that rotates the rotating shaft.