JP7143554B1 - Wiring device - Google Patents

Abstract

Each of the first connection points provided in a plurality of rows on the first substrate (11) and the plurality of second connection points provided on the first substrate (11) at a predetermined distance from the first connection points. A wiring device for wiring each connection point with a covered wire (14), comprising a vertically movable capillary (25) for drawing out the covered wire (14) and a vertically movable capillary (25) arranged near the capillary (25). It comprises a guide (16), a first elevating mechanism (18) for elevating the capillary (25), and a second elevating mechanism (19) for elevating the guide (16). After the covered wire is laid in the row, when wiring the covered wire in the second row of the first connection points, the guide (16) is lowered by the second elevating mechanism (19) to lower the second row. A wiring device for moving a covered wire (14) wired in one row in a direction away from the second row.

Description

The present invention relates to wiring devices.

There are two or more rows in which a plurality of holes are provided in the substrate, and a covered wire drawn out from the tip of the capillary is passed through one of the plurality of holes, and the covered wire is pulled under the substrate to remove the covered wire. The other end of the coated wire is joined to the substrate by raising the capillary while extending it, moving the substrate horizontally, and lowering the capillary. After that, the covered wire is cut, the capillary is raised, the substrate is horizontally moved to position the capillary above one of the plurality of holes, and the covered wire drawn out from the tip of the capillary is lowered while the capillary is lowered. The other end of the covered wire is joined to the substrate by passing it through the hole, drawing the covered wire under the substrate, and performing the same operation as above. By repeating these steps, the covered wire is passed through each of two or more rows of holes, and the other end of each covered wire is joined to the substrate. The wiring is assembled in this way.

If the number of covered wires increases or the distance between the plurality of holes becomes shorter (that is, if the pitch of the holes in one row becomes narrower and the distance between adjacent holes in one row becomes shorter), then the covered wires will already be covered. When the covered wire drawn out from the tip of the capillary is passed through a row of holes next to a row of holes through which the wire is passed or a hole next to a hole through which the covered wire has already been passed, As the density of the existing covered wires increases, the existing covered wires fall down on the side of the next hole to be passed through, and the fallen covered wires interfere with the covered wires to be passed through the hole. There were times when the covered wire would not pass through the hole.

Patent Document 1 discloses a method for suppressing such interference of covered wires. However, this method has the problem of complicating the mechanism and increasing the manufacturing cost.

Japanese Patent Publication No. 60-57699

An object of one aspect of the present invention is to provide a wiring device capable of preventing a covered wire to be passed from interfering with an existing covered wire by regulating the collapse of the covered wire already existing on the substrate. do.
Another aspect of the present invention is to provide a wiring device capable of preventing a covered wire to be connected from interfering with an existing covered wire by regulating the collapse of the covered wire already existing on the substrate. Make it an issue.

Various aspects of the invention are described below.
[A] Each of first connection points provided in a plurality of rows on a first substrate and a plurality of connection points provided on the first substrate or the second substrate at a predetermined distance from the first connection points A wiring device for wiring each of the second connection points with a covered wire,
A liftable capillary for feeding the coated wire, a liftable guide arranged near the capillary, a first lifting mechanism for lifting and lowering the capillary, and a second lifting mechanism for lifting and lowering the guide,
After the covered wire is wired at least to the first row of the first connection points, the guide is lowered by the second elevating mechanism when wiring the covered wire to the second row of the first connection points. A wiring device characterized by moving the coated wire laid in the first row in a direction away from the second row by moving the covered wire.

[B] The wiring according to [A] above, wherein the first connection point is a hole provided in the first substrate, and the coated wire drawn out from the capillary is inserted through the hole. Device.

[C] The wiring according to [C] above, wherein the first connection point is an electrode provided on the first substrate, and the covered wire drawn out from the capillary is bonded to the electrode. Device.

[D] The wiring device according to [A] to [C] above, wherein the guide has a length in a direction intersecting the covered wire laid at the first connection point.

[E] The second elevating mechanism includes a rod-shaped member having one end connected or integrally connected to the guide, a cam follower provided at the other end of the rod-shaped member, and arranged in contact with the cam follower. a plate cam, a connection member having one end rotatably connected to the rod-shaped member, a piston holding the other end of the connection member, and a cylinder for moving the piston vertically,
By moving the piston vertically, the cam follower moves while contacting the plate cam, thereby moving the guide in a direction away from or close to the perpendicular to the first row. The wiring device according to [A] to [D].

According to one aspect of the present invention, it is possible to provide a wiring device capable of suppressing the covered wire to be passed from interfering with the existing covered wire by restricting the collapse of the covered wire already existing on the substrate. can.
In addition, according to one aspect of the present invention, there is provided a wiring device capable of suppressing interference of a covered wire to be connected with an existing covered wire by restricting collapse of the covered wire already existing on the substrate. be able to.

It is a figure which shows typically the wiring apparatus provided with the pressing device which concerns on one aspect|mode of this invention. (B) is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1, and (A) is a plan view of (B) viewed from above. (A) shows the position of the first holding guide 16 with respect to the capillary 25 when holding the first covered wire 14 shown in FIG. 1, and (B) shows the first covered wire 14 shown in FIG. FIG. 10 is a diagram showing the position when the first pressing guide 16 is retracted from the capillary 25 at the time. 4 is a diagram showing the positional relationship between a first pressing guide 16 and a capillary 25; FIG. 4 is a diagram showing the positional relationship between a first pressing guide 16 and a capillary 25; FIG. (B) is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1, and (A) is a plan view of (B) viewed from above. (A) and (B) are diagrams for explaining first and second modifications of the first embodiment. (A) and (B) are diagrams for explaining a second modification of the first embodiment. 2 is a flow chart of operations for explaining a method of assembling wiring using the wiring device shown in FIG. 1; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; FIG. 10 is a diagram illustrating a method of assembling wiring while holding down an existing covered wire according to one aspect of the present invention; 1 is a schematic diagram for explaining a wiring device according to one aspect of the present invention; FIG. 1 is a schematic diagram for explaining a wiring device according to one aspect of the present invention; FIG.

Embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art will readily understand that various changes in form and detail may be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the descriptions of the embodiments shown below.

(First embodiment)
FIG. 1 is a diagram schematically showing a wiring device provided with a pressing device according to one aspect of the present invention. FIG. 2(B) shows that the first holding guide 16 shown in FIG. 11 (also referred to as a "first substrate") is a cross-sectional view showing a state in which it is passed through a second hole 21, and FIG. 2A is a plan view of FIG. 2B viewed from above. . 2A and 2B do not show the portion above the capillary 25 of the head 23 shown in FIG.

As shown in FIGS. 2A and 2B, a pressing device 15 according to one aspect of the present invention includes a plurality of first holes 12 (“first connection One end 14b of a first covered wire 14 (also referred to as a “covered wire”) is inserted into each of a plurality of first holes (first connection points) 12 in a first row 13 in which the points” are aligned. A first covered wire (covered wire) 14 is inserted into each of the substrate 11 or a plurality of first electrodes (also referred to as “electrodes”) on the substrate 11 at a predetermined distance from each of the plurality of first holes 12 . This is a device that presses the first covered wire 14 already passed through the hole (inserted) against the substrate 11 to which the other end 14a of the wire is connected. In this specification, various types of coated wires can be used as the “coated wire”, and for example, a coated wire in which copper is coated with a resin-based material may be used.

In this embodiment, the first connection point is the first hole 12, and the coated wire 14 is inserted into the first hole 12. However, the first connection point is provided on the first substrate. An electrode may be used, and the coated wire 14 may be bonded to the electrode.

This pressing device 15 has a pressing guide mechanism for pressing the first covered wire 14, one end of which is inserted into each of the plurality of first holes 12, and inserting a new covered wire 24 into the hole. there is

In addition, the pressing device 15 according to one aspect of the present invention has a length in a direction that intersects the first covered wire 14 (see FIG. 2A), and the first covered wire 14 is placed in the first position. It has a first pressing guide 16 (also referred to as a "guide") for pressing in a direction away from the row 13 of .
The pressing device 15 also has a vertical movement mechanism 18 for moving a first pressing guide (guide) 16 in a vertical direction 17 with respect to the substrate 11 .

The pressing device 15 also includes a first pressing movement mechanism 19 (“second elevating mechanism”) that moves the first pressing guide 16 in a direction perpendicular to the surface of the substrate 11 and closer to the perpendicular to the first row 13 . ).

In this embodiment, the substrate 11 having the first row 13 in which the plurality of first holes 12 are aligned is used. It is also possible to use a substrate having a first row of aligned portions. In this case, the pressing device of the third modified example applies the first coating to each of the plurality of first joints in the first row in which the plurality of first joints provided on the substrate are aligned. One end of a wire or first wire is connected to each of the substrate or a plurality of first electrodes on the substrate at a predetermined distance from each of the plurality of first joints. This is a device that presses the first covered wire or the first wire already connected to the junction with respect to the substrate to which the other end of the first wire is connected. The pressing device of the third modification also has the pressing guide mechanism, the first pressing guide 16, the vertical movement mechanism 18, and the first pressing movement mechanism 19 described above. In this specification, the term "joint" includes various joints (for example, terminals, pads, etc.) as long as they can join coated wires or wires.

Further, the pressing device 15 according to one aspect of the present invention has a second row 20 parallel to the first row 13 provided on the substrate 11 and a plurality of second holes 21 arranged in a row. One end of the second covered wire 22 is inserted into each of the plurality of second holes 21 in the row 20 , and the substrate 11 or the plurality of second wires on the substrate 11 are located at a predetermined distance from each of the plurality of second holes 21 . The device presses the first covered wire 14 and the second covered wire 22 against the substrate 11 in which the other end 22a of the second covered wire 22 is connected to each of the electrodes.

The first holding guide 16 has a length in a direction that intersects the second covered wire 22 (see FIG. 2A), and separates the first covered wire 14 and the second covered wire 22 from each other. It presses in a direction away from the first row 13 and the second row 20 .

The first presser moving mechanism 19 is a mechanism that moves the first presser guide 16 in a direction that is perpendicular to the surface of the substrate 11 and closer to the perpendicular to the second row 20 .

In this embodiment, the substrate 11 having the second row 20 parallel to the first row 13 and having the plurality of second holes 21 arranged in a line is used. As a third modified example of the embodiment, it is also possible to use a substrate having a second row parallel to the first row and a plurality of second joints arranged in a row. In this case, the pressing device of the third modification includes the plurality of joint portions in the second row parallel to the first row provided on the substrate and in which the plurality of second joint portions are arranged in a row. One end of a second coated wire or a second wire is connected to each of the second joints, and a substrate or a plurality of second electrodes on the substrate are provided at a predetermined distance from each of the plurality of second joints. It is a device for pressing the first and second covered wires or the first and second wires against the substrate to which the other ends of the second covered wires or the second wires are connected respectively.

The first pressing guide 16 may be rod-shaped, or may have a ring-shaped or rectangular planar shape (FIGS. 7(A) and 8(A)).

Details will be described below.
A substrate (first substrate) 11 has a first row 13 in which a plurality of first holes (first connection points) 12 are arranged in a row, and a second row in which a plurality of second holes 21 are arranged in a row. A row 20 is provided, and three or more rows of holes are further provided (see FIG. 2A). The second row 20 is positioned parallel to the first row 13, and the third and subsequent rows are positioned parallel to each other. One end 14b of a first covered wire (covered wire) 14 is inserted into each of the plurality of first holes 12, and a substrate (first substrate) 11 or The other end 14a of the first coated wire 14 is connected to each of a plurality of first electrodes (also referred to as "second connection points") on the substrate 11 (FIGS. 1 and 2A and 2B). )reference). One end of a second covered wire 22 is inserted into each of the plurality of second holes 21 , and a substrate 11 or a plurality of second wires on the substrate 11 are located at a predetermined distance from each of the plurality of second holes 21 . The other end 22a of the second covered wire 22 is connected to each of the electrodes (see FIG. 2(A)). The surface of the substrate 11 to which the other ends 22a of the second coated wires 22 are connected is located higher than the surface of the substrate 11 on which the first rows 13 and the second rows 20 are arranged. That is, the substrate 11 is provided with steps.

The pressing device 15 presses the first covered wire 14 and the second covered wire 22 that have already been passed (inserted) through the holes as shown in FIGS. The pressing device 15 has a first pressing guide 16 , a vertical movement mechanism 18 and a first pressing movement mechanism 19 . The first pressing guide 16 has a length in a direction crossing the first covered wire 14 and the second covered wire 22 . The vertical movement mechanism 18 is a mechanism for moving the first pressing guide 16 in the vertical direction 17 (see FIG. 1). The first presser moving mechanism 19 is a mechanism for moving the first presser guide 16 in a direction perpendicular to the surface of the substrate 11 and a perpendicular to the first row 13 and away from it.

As shown in FIG. 1 , the wiring device according to one aspect of the present invention includes the pressing device 15 described above and has a head 23 .
Inside the head 23, a capillary 25 for drawing out the covered wire 24, a first holding guide (guide) 16 arranged near the capillary 25, and a first holding movement mechanism 19 are arranged.
The first pressing movement mechanism 19 is a mechanism for moving the first pressing guide 16 laterally, upwardly or downwardly of the capillary 25 .
The vertical movement mechanism 18 (also referred to as “first lifting mechanism”) is a mechanism for moving the head 23 in the Z-axis direction (vertical direction) 17 .
The wiring device also has an XY stage 26 on which the substrate 11 is placed, and an X-axis moving mechanism 29 that moves the XY stage 26 in the X direction 27 .
The wiring device also has a Y-axis movement mechanism 30 that moves the XY stage 26 in the Y direction 28 .
Further, in this embodiment, the capillary 25 for feeding the covered wire 24 is arranged inside the head 23, but as a third modification of this embodiment, the capillary 25 for feeding the covered wire 24 or wire is arranged inside the head 23. It is also possible to

Details will be described below.
The wiring device shown in FIG. 1 has an XY stage 26 having an X-axis moving mechanism 29 for moving in the X direction 27 and a Y-axis moving mechanism 30 for moving in the Y direction 28 . A head 23 is arranged above the substrate 11 placed on the XY stage 26 . A vertical movement mechanism 18 is attached to the head 23 to move it in the Z-axis direction (vertical direction) 17 . Inside the head 23, a capillary 25 for drawing out the coated wire 24, a first pressing guide 16, and a first pressing moving mechanism 19 are arranged. The mechanism by which the capillary 25 pays out the covered wire 24 is not shown because it uses a known technique. The first pressing movement mechanism 19 is a mechanism for moving the first pressing guide 16 laterally, upwardly or downwardly of the capillary 25 .

3(A) and (B) are diagrams showing the positional relationship between the first presser moving mechanism 19 and the capillary 25 shown in FIG. 1, and FIG. FIG. 3B shows the position of the first holding guide 16 with respect to the capillary 25 when holding down the first holding guide 16 from the capillary 25 when the first covered wire 14 shown in FIG. 1 is not held. It shows the position when

As shown in FIGS. 3A and 3B, the first presser moving mechanism (second elevating mechanism) 19 has one end connected or integrally connected to the first presser guide (guide) 16. A rod-shaped member 31, a cam follower 32 provided at the other end of the rod-shaped member 31, a plate cam 33 arranged in contact with the cam follower 32, a connection member 34 rotatably connected to the rod-shaped member 31 at one end, It has a piston 35 holding the other end of the connecting member 34, and a cylinder 37 for moving the piston 35 in the vertical direction (downward direction 36a, upward direction 36b).
By moving the piston 35 in the vertical direction, the cam follower 32 moves while contacting the plate cam 33, thereby moving the first holding guide (guide) 16 to a line perpendicular to the first row (for example, FIG. 3(A), ( It is possible to move in a direction 38 away from or in a direction 39 approaching the coated wire 24) shown in B). Although cam followers and cylinders have been described here, any mechanism that can move vertically or in an inclined direction with a motor, ball screw, or the like may be used.

That is, as shown in FIGS. 3A and 3B, by moving the piston 35 of the cylinder 37 in the downward direction 36a, the first pressing guide 16 can be moved in the direction 39 to approach the coated wire 24. Also, by moving the piston 35 of the cylinder 37 in the upward direction 36 b , the first pressing guide 16 can be moved in the direction 38 away from the covered wire 24 .

In this embodiment, the first presser movement mechanism 19 shown in FIGS. 3A and 3B is used, but the first presser movement mechanism shown in FIGS. 4 and 5 may be used instead. .
4 and 5 are diagrams showing the positional relationship between the first pressing guide 16 and the capillary 25. FIG. FIG. 4 shows the substrate 11 in a state in which one end 14b of the first covered wire 14 is passed through the first hole of the substrate 11 and the other end 14a of the first covered wire 14 is connected to the substrate 11. It shows the position where the first pressing guide 16 is retracted from the capillary 25 when one covered wire 14 is not pressed. FIG. 5 shows the position of the first holding guide 16 with respect to the capillary 25 when holding the first covered wire 14, and shows the state where the first holding guide 16 holds the first covered wire 14. FIG. ing.

As shown in FIGS. 4 and 5, the first presser moving mechanism 41 has a cylinder 43 with a piston 42 connected to the first presser guide 16, the cylinder 43 moving the piston 42 to the first position. It reciprocates in a direction inclined with respect to a line perpendicular to the row (for example, the coated wire 24 shown in FIG. 4). The reason for moving the piston 42 in an inclined direction is that if the first pressing guide 16 is moved straight up, it interferes with the capillary 25 .

That is, as shown in FIGS. 4 and 5, by moving the piston 42 of the cylinder 43 in an upward direction 44 inclined with respect to the covered wire 24, the first pressing guide 16 moves away from the covered wire 24 in a direction 45. By moving the piston 42 of the cylinder 43 in the downward direction 46, the first pressing guide 16 can be moved in the direction 47 in which the covered wire 24 is approached.

Further, as shown in FIG. 1, the pressing device 15 according to one aspect of the present invention further includes the following configuration, which will be described with reference to FIGS. 2 and 6. FIG. FIG. 6(B) is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1, and FIG. 6(A) is a plan view of FIG. 6(B) viewed from above. 6A and 6B do not show the portion above the capillary 25 of the head 23 shown in FIG.

Further, the holding device 15 has a plurality of third holes 51 arranged in a row as shown in FIG. One end 53 b of the third covered wire 53 is inserted into each of the plurality of third holes 51 in the three rows 52 , and the substrate 11 or the plurality of wires on the substrate 11 are located at a predetermined distance from each of the plurality of third holes 51 . is a device that presses the third covered wire 53 against the substrate 11 in a state where the other end 53a of the third covered wire 53 is connected to each of the third electrodes.
2A and 6A may be such that the first row 13 shown in FIG. 2A and the third row 52 shown in FIG. 6A face each other. However, the first row 13 shown in FIG. 2(A) and the third row 52 shown in FIG. 6(A) may be positioned on the sides of the polygon.
As shown in FIG. 1, the pressing device 15 moves the first pressing guide 16 and the first pressing moving mechanism 19 along an arrow 54 around a line perpendicular to the surface of the substrate 11 (for example, the coated wire 24 drawn out from the capillary 25). It has a rotating mechanism 55 that rotates as follows.
In this embodiment, the substrate 11 is used which has a third row 52 in which a plurality of third holes 51 are arranged in a row, as shown in FIG. As a third modification of the present embodiment, it is also possible to use a substrate having a third row in which a plurality of third bonding portions are arranged in a row at a predetermined distance from the first row 13 . In this case, the pressing device of the third modified example is arranged such that the plurality of third joints in the third row in which the plurality of third joints are arranged in a line at a predetermined distance from the first row provided on the substrate. One end 53b of the third covered wire 53 is inserted into each of the portions, and the third covered wire is inserted into each of the substrate or the plurality of third electrodes on the substrate at a predetermined distance from each of the plurality of third joint portions. Alternatively, it is a device that presses the third covered wire or the third wire against the substrate to which the other end of the third wire is connected.

The first pressing guide 16 has a length in a direction crossing the third covered wire 53 and presses the third covered wire 53 away from the third row 52 .
The first presser moving mechanism 19 moves the first presser guide 16 perpendicular to the surface of the substrate 11 and in the third direction with the third row 52 of the substrate 11 positioned below the first presser guide 16 . It is a mechanism for moving in a direction approaching a perpendicular line (for example, the covered wire 25 drawn out from the capillary 25) to the row 52 of the capillaries.

Further, as shown in FIG. 6A, the pressing device 15 has a fourth row 56 parallel to the third row 52 provided on the substrate 11 and a plurality of fourth holes 57 arranged in a row. One end of the fourth covered wire 58 is inserted into each of the plurality of fourth holes 57 in the fourth row 56, and the substrate 11 or a plurality of wires on the substrate 11 are spaced apart from each of the plurality of fourth holes 57 by a predetermined distance. The device presses the third covered wire 53 and the fourth covered wire 58 against the substrate 11 in a state where the other end 58a of the fourth covered wire 58 is connected to each of the fourth electrodes.
The first holding guide 16 has a length in a direction crossing the fourth covered wire 58, and the third covered wire 53 and the fourth covered wire 58 are arranged in the third row 52 and the fourth covered wire 58, respectively. It presses in the direction away from the row 56 .
The first presser moving mechanism 19 moves the first presser guide 16 perpendicular to the surface of the substrate 11 and in the fourth direction with the fourth row 56 of the substrate 11 positioned below the first presser guide 16 . 2(B) and 3(A) in the direction perpendicular to the row 56 of .

Details will be described below.
The substrate 11 is provided with a third row 52 in which a plurality of third holes 51 are arranged in a row and a fourth row 56 in which a plurality of fourth holes 57 are arranged in a row. A plurality of rows of holes are provided (see FIG. 6A). The fourth row 56 is positioned parallel to the third row 52, and the third and subsequent rows are positioned parallel to each other. One end 53b of the third coated wire 53 is inserted into each of the plurality of third holes 31, and the substrate 11 or the plurality of third electrodes on the substrate 11 are located at a predetermined distance from each of the plurality of third holes 51. are connected to the other ends 53a of the third coated wires 53 (see FIGS. 1 and 6A and 6B). One end of a fourth coated wire 58 is inserted into each of the plurality of fourth holes 57 , and the substrate 11 or the plurality of fourth wires on the substrate 11 are located at a predetermined distance from each of the plurality of fourth holes 57 . The other end 58a of the fourth covered wire 58 is connected to each of the electrodes (see FIG. 2(A)). The surface of the substrate 11 to which the other end 58a of the fourth covered wire 58 is connected is located higher than the surface of the substrate 11 on which the third row 52 and the fourth row 56 are arranged. That is, the substrate 11 is provided with steps.

The pressing device 15 presses the first covered wire 14 and the second covered wire 22 that have already been passed (inserted) through the holes as shown in FIGS. The pressing device 15 has a first pressing guide 16 , a vertical movement mechanism 18 and a first pressing movement mechanism 19 . The first pressing guide 16 has a length in a direction crossing the first covered wire 14 and the second covered wire 22 . The vertical movement mechanism 18 is a mechanism for moving the first pressing guide 16 in the vertical direction 17 (see FIG. 1). The first presser moving mechanism 19 is a mechanism for moving the first presser guide 16 in a direction perpendicular to the surface of the substrate 11 and a perpendicular to the first row 13 and away from it.
In addition, in this embodiment, the substrate 11 having the fourth row 56 parallel to the third row 52 and having a plurality of fourth holes 57 arranged in a line is used. As a third modification of the embodiment, it is also possible to use a substrate having a fourth row parallel to the third row and a fourth row in which a plurality of fourth joints are aligned. In this case, the pressing device of the third modification includes a fourth row parallel to the third row provided on the substrate and a fourth row in which a plurality of fourth joint portions are arranged in a row. One end of a fourth covered wire or a fourth wire is connected to each of the fourth junctions, and a substrate or a plurality of fourth electrodes on the substrate are located at a predetermined distance from each of the plurality of fourth junctions. A holding device for holding the third and fourth covered wires or the third and fourth wires against the substrate to which the other ends of the fourth covered wires or the fourth wires are connected respectively.

According to this embodiment, the first and second covered wires 14, 22 shown in FIGS. and the fourth covered wires 53 and 58 are pressed by the first pressing guide 16, so that when the next covered wire 24 drawn out from the capillary 25 is passed through the second hole 21 or the fourth hole 57 of the substrate 11, , the first and second covered wires 14, 22 or the third and fourth covered wires 53, 58 can be prevented from falling on the hole side. As a result, the bulging of the inserted covered wire makes it impossible to pass the covered wire through the hole in the substrate, and the bulging of the inserted covered wire makes it impossible to recognize the position of the hole with a camera or the like. can be improved.
Further, it is possible to prevent the next covered wire 24 to be passed from interfering with the first and second covered wires 14, 22 or the third and fourth covered wires 53, 58 already passed through the holes.

In this embodiment, as shown in FIG. 1, the holding device 15 that can rotate around the capillary 25 is used. By providing the XY stage 26, the XY stage 26 may be rotated.

Further, in this embodiment, as shown in FIG. 1, one pressing device 15 that can rotate around the capillary 25 is used, but it is also possible to implement it with the following modifications.

7A and 7B are diagrams for explaining a first modification of the present embodiment, and FIG. 7B shows a first capillary 61, a second capillary 62, a second 4 is a diagram schematically showing a presser guide, a first presser movement mechanism 41, and a second presser movement mechanism 66. FIG. FIG. 7A is a top plan view of the first capillary 61, the second capillary 62, and the second pressing guide shown in FIG. 7B. Since the parts other than those shown in FIGS. 7A and 7B are the same as those of the present embodiment, description thereof is omitted. Although FIG. 7A shows the integrated pressing guide 63, the second pressing guide 16 of the first modified example uses the same one as the first pressing guide 16 (see FIG. 6 ( A), (B)), not integrated.

The first presser moving mechanism 41 has a cylinder 43 with a piston 42 connected to the presser guide 16, and the second presser moving mechanism 66 has a piston 64 connected to the presser guide 16. (see FIGS. 4 and 5).

In a first modification, a plurality of third holes 51 shown in FIG. 6A are arranged in a line at a predetermined distance from the first row 13 provided on the substrate 11 shown in FIG. 2A. One end 53 b of the third covered wire 53 is inserted into each of the plurality of third holes 51 in the three rows 52 , and the substrate 11 or the plurality of wires on the substrate 11 are located at a predetermined distance from each of the plurality of third holes 51 . is a pressing device that presses the third covered wire 53 against the substrate 11 in a state where the other end 53a of the third covered wire 53 is connected to each of the third electrodes.
This holding device has a length in a direction intersecting the third covered wire 53 shown in FIG. a second holding guide 16;
and a second presser moving mechanism 66 shown in FIG. 7B that moves the second presser guide 16 in a direction perpendicular to the surface of the substrate 11 and closer to the perpendicular to the third row 52 . The second pressing guide 16 referred to here has a structure similar to that of the first pressing guide described above.
A vertical movement mechanism 18 shown in FIG. 1 is a mechanism for moving the second pressing guide in the vertical direction with respect to the substrate 11 .

That is, the pressing device of the first modification has two sets of the pressing device 15 and the capillary 25 shown in FIG. The capillaries are arranged opposite each other, and the holding device used for the capillaries not shown in FIG.
In addition, in the first modification, the substrate 11 having the third row 52 in which the plurality of third holes 51 are arranged in a row and which is separated from the first row 13 by a predetermined distance as shown in FIG. However, as a fourth modification of the first modification, it is also possible to use a substrate having a third row in which a plurality of third joints are arranged in a row at a predetermined distance from the first row. be. In this case, the pressing device of the fourth modification provides a third joint for each of the plurality of third joints in the third row in which the plurality of third joints spaced apart from the first row by a predetermined distance are arranged in a row. One ends of three coated wires or third wires are connected, and the third coated wires or third wires are connected to the substrate or each of the plurality of third electrodes on the substrate at a predetermined distance from each of the plurality of third joints. It is a pressing device that presses the third coated wire or the third wire against the substrate to which the other end of the third wire is connected.

In addition, as shown in FIG. 6A, the holding device of the first modification has a fourth row 56 parallel to the third row 52 provided on the substrate 11 and a plurality of fourth holes 57. One end of the fourth coated wire 58 is inserted into each of the plurality of fourth holes 57 in the fourth row 56 in which the substrate 11 or The third covered wire 53 and the fourth covered wire 58 are pressed against the substrate 11 in a state where the other end 58a of the fourth covered wire 58 is connected to each of the plurality of fourth electrodes on the substrate 11. It is a device.
The second pressing guide 16 has a length in a direction crossing the fourth covered wire 58, and moves the third covered wire 53 and the fourth covered wire 58 to the third row 52 and the fourth row. It presses in the direction away from the row 56 .
A second presser moving mechanism (for example, a second presser moving mechanism 66 shown in FIG. 7A) moves the fourth row 56 of the substrate 11 below the second presser guide 16 to move the substrate 11 downward. 2 is a mechanism for moving the second pressing guide 16 in a direction perpendicular to the surface of the substrate 11 and closer to a perpendicular to the fourth row 56 (for example, the covered wire 24 shown in FIG. 6B).
In addition, in the above-described first modification, the substrate 11 having the fourth row 56 parallel to the third row 52 and having a plurality of fourth holes 57 arranged in a row is used. However, as a fourth modification of the first modification, it is also possible to use a substrate having a fourth row parallel to the third row and a fourth row in which a plurality of fourth bonding portions are aligned. It is possible. In this case, the pressing device of the fourth modification includes a fourth row parallel to the third row and a fourth row in which the plurality of fourth joints are arranged in a line. One end of a fourth coated wire or a fourth wire is connected to each of the fourth wires, and a fourth wire is connected to each of the substrate or the plurality of fourth electrodes on the substrate at a predetermined distance from each of the plurality of fourth joints. A holding device for holding the third and fourth covered wires or the third and fourth wires against the substrate to which the other end of the covered wire or the fourth wire is connected.

In the first modified example, the pressing device having the first pressing guide and the second pressing guide is used, but the following modifications are possible.

FIG. 7A is a diagram for explaining a second modification, and is a plan view showing an integrated pressing guide 63 in which the first pressing guide and the second pressing guide are integrally formed. . The integral pressing guide 63 is a pressing guide 63b having a rectangular planar shape. FIG. 7(B) is a cross-sectional view of the integrated presser guide 63 shown in FIG. 7(A). However, in FIG. 7A, the first capillary 61 and the second capillary 62 are shown, and in FIG. 7B, in addition to the first capillary 61 and the second capillary 62, the first , the presser moving mechanism 41 and the second presser moving mechanism 66 are shown.
Further, the integrated presser guide 63a may have a ring-shaped planar shape (see FIGS. 8A and 8B).
The first hold down movement mechanism 41 also has a cylinder 43 with a piston 42 connected to an integral hold down guide 63 . This piston 42 can be freely controlled by the control unit in connection with and separation from the integrated presser guide 63 . The second hold down movement mechanism 66 also has a cylinder 65 with a piston 64 connected to the integral hold down guide 63 . The piston 64 can be freely controlled in connection and separation with the integral pressing guide 63 by a control section.
The integrated presser guides 63 and 63a are not connected to the third moving mechanism 66 when moved by the first presser moving mechanism 41 . In this case, by using the first capillary 61, the operations shown in FIGS. 1 and 2A and 2B can be performed.
Also, the integrated presser guides 63 and 63a are not connected to the first presser moving mechanism 41 when moved by the third moving mechanism 66 . In this case, by using the third capillary 66, the operations shown in FIGS. 1 and 6A and 6B can be performed.

A wiring device comprising first and second pressing moving mechanisms 41, 66, first and second capillaries 61, 62, and first and second pressing guides 16 of the first modification is shown in FIG. It has a head 23, but differs from the head 23 shown in FIG. 1 in that it is arranged as shown in FIGS. 41, 66, first and second capillaries 61, 62, and first and second holding guides (not shown).
Inside the head 23 are a first capillary 61 for feeding the covered wire, a first holding guide, a first holding movement mechanism 41, a second capillary 62 for feeding the covered wire, a second holding guide, and a second holding. A moving mechanism 66 is arranged.
The first pressing movement mechanism 41 is a mechanism for moving the first pressing guide to the tip of the first capillary 61 or below the first capillary 61 .
The second pressing movement mechanism 66 is a mechanism for moving the second pressing guide to the tip of the second capillary 62 or below the second capillary 62 .
The vertical movement mechanism 17 is a mechanism for moving the head 23 in the Z-axis direction 17 .
In the second modification, the head 23 includes a first capillary 61 for feeding the covered wire, a first holding guide, a first holding movement mechanism 41, and a second capillary 62 for feeding the covered wire. As a fourth modification to the second modification, the head 23 includes a first capillary 61 for feeding the covered wire or wire, a first holding guide, a first holding movement mechanism 41, A second capillary 62 can also be arranged to pay out the coated wire or wire.

The wiring device provided with the first and second pressing moving mechanisms 41, 66, the first and second capillaries 61, 62, and the integrated pressing guides 63, 63a of the second modification is the head 23 shown in FIG. 1, except that the head 23 shown in FIG. 1 is arranged as shown in FIGS. 7A and 7B and FIGS. 66, first and second capillaries 61, 62, and integrated holding guides 63, 63a.
In the head 23, there are a first capillary 61 for feeding the covered wire, integrated holding guides 63 and 63a, a first holding movement mechanism 41, a second capillary 62 for feeding the covered wire, and a second holding movement mechanism 66. are placed.
The first pressing movement mechanism 41 is a mechanism for moving the integrated pressing guides 63 and 63 a to the tip of the first capillary 61 or below the first capillary 61 .
The second pressing movement mechanism 66 is a mechanism for moving the integrated pressing guides 63 and 63 a to the tip of the second capillary 62 or below the second capillary 62 .
The vertical movement mechanism 17 is a mechanism for moving the head 23 in the Z-axis direction 17 .

Effects similar to those of the present embodiment can be obtained in the first to fourth modifications.
It is also possible to implement the first to fourth modifications in combination with each other.

(Second embodiment)
FIG. 9 is a flow chart of operations explaining a method of assembling wiring using the wiring device shown in FIG. 10 to 15 are diagrams illustrating a method of assembling wiring while holding down an existing coated wire according to one aspect of the present invention.

First, as shown in FIG. 10, the capillary 25 is moved above the second hole 21, and the first pressing guide 16 is moved in a direction closer to the covered wire 24 drawn out from the capillary 25 below the capillary 25. (Pressure guide installation S1 shown in FIG. 9).

Next, as shown in FIGS. 11 and 2B, the head 23 is lowered to move the capillary 25 and the first holding guide 16 downward, and the first holding guide 16 pushes the first covered wire 14. is pressed, the tip of the covered wire 24 (wire) is inserted into the second hole 21 (S2 in FIG. 9). At this time, it is possible to prevent the existing first covered wire 14 from interfering with the covered wire 24 to be inserted into the second hole 21 .

Next, as shown in FIG. 12, the covered wire 24 inserted into the second hole 21 is pulled under the substrate 11, and the covered wire 24 is let out from the capillary 25 to reach the capillary 25 and the first holding guide 16. is raised, and the first pressing guide 16 is moved to a position where it is retracted from the capillary 25 as shown in FIG. 3(B) or FIG. 4 (S3 in FIG. 9). As for the timing for retracting the first pressing guide 16, it is sufficient that it is retracted before the capillary 25 is lifted.

Next, as shown in FIG. 13, the XY stage 26 on which the substrate 11 is mounted is horizontally moved in the X direction 27 by the X-axis moving mechanism 29, and the head 23 is lowered to move the covered wire 24 at the tip of the capillary 25. The other end 24b (wire) is joined to the substrate 11 or an electrode on the substrate (S4 in FIG. 9). At this time, since the first pressing guide 16 is retracted, interference with the coated wire 24 can be prevented.

Next, as shown in FIG. 14, the head 23 is raised to raise the capillary 25 to cut the coated wire 24 (S5 in FIG. 9).

Next, as shown in FIG. 15, the XY stage 26 on which the substrate 11 is mounted is horizontally moved in the X direction 27 by the X-axis movement mechanism 29, and the coated wire is inserted above the next hole of the substrate 11. The capillary 25 and the first pressing guide 16 are moved (S6 in FIG. 9).

Thereafter, by repeating the operations shown in FIGS. 10 to 15, wiring can be assembled.

The same effects as in the first embodiment can be obtained in this embodiment as well.

(Third Embodiment)
16 and 17 are schematic diagrams for explaining a wiring device according to one aspect of the present invention. This wiring device has a hold-down device.

The wiring device according to this embodiment includes first connection points 102 provided in a plurality of rows on a first substrate 101 and a second substrate 103 provided at a predetermined distance from the first connection points 102 . It is a device for wiring each of the plurality of second connection points 104 with a covered wire 105 .

This wiring device includes a vertically movable capillary for drawing out the coated wire 105, a vertically movable guide arranged near this capillary, a first lifting mechanism for lifting and lowering this capillary, and a second lifting mechanism for lifting and lowering this guide. and

As shown in FIG. 16 , after the covered wire 105 is wired to at least the first row of the first connection points 102 by this wiring device, the covered wire 105 is laid to the second row of the first connection points 102 . At this time, the covered wire 105 laid in the first row is moved away from the second row by lowering the guide by the second elevating mechanism. Thereby, the covered wire 105 can be connected to the first connection point 102 of the second row while pressing the covered wire 105 of the first row.

Further, after the covered wire 105 has been wired to at least the first row of the second connection points 104 by this wiring device, when wiring the covered wire 105 to the second row of the second connection points 104, the second 2. By lowering the guide by means of the elevating mechanism 2, the coated wire 105 laid in the first row is moved away from the second row. Thereby, the covered wire 105 can be connected to the second connection point 104 of the second row while pressing the covered wire 105 of the first row.

Next, the first substrate 101 is rotated by 180° as indicated by an arrow 106 shown in FIG. As a result, as shown in FIG. 17 , the first substrate 101 is connected to the first connection point 102 of the first substrate 101 and the second connection point 104 of the second substrate 103 by the covered wire 105 . and the second substrate 103 are opposed to each other.

After that, the space between the first substrate 101 and the second substrate 103 and the coated wires 105 are sealed with a mold resin (not shown). Thereby, the first substrate 101 and the second substrate 103 are integrated.

By appropriately combining the first to third embodiments, it is also possible to carry out various modes of embodiments.

(Appendix)
Various other aspects of the invention are described below.
[1] One end of a coated wire is inserted into each of the plurality of holes in a row in which the plurality of holes provided in the substrate are aligned, and the substrate or the substrate is located at a predetermined distance from each of the plurality of holes. A pressing device for pressing the covered wire against a substrate in which the other end of the first covered wire is connected to each of a plurality of first electrodes of
A pressing device comprising a pressing guide mechanism for pressing the covered wire, one end of which is inserted into each of the plurality of holes, and inserting a new covered wire into the hole.

[2] One end of a coated wire or wire is connected to each of the plurality of joints in a row in which the plurality of joints provided on the substrate are aligned, and the one end of the wire is separated from each of the plurality of joints by a predetermined distance. A pressing device for pressing the covered wire or the wire against a substrate in which the other end of the covered wire or the wire is connected to each of a substrate or a plurality of electrodes on the substrate,
A pressing device, comprising a pressing guide mechanism for pressing a covered wire or wire, one end of which is connected to each of the plurality of joints, to connect a new covered wire or wire to the joint.

[3] One end of a first covered wire is inserted into each of the plurality of first holes in a first row in which the plurality of first holes provided in the substrate are aligned, The first covering is applied to the substrate in which the other end of the first covered wire is connected to each of the substrate or each of the plurality of first electrodes on the substrate at a predetermined distance from each of the holes. A holding device for holding a wire,
a first pressing guide having a length in a direction intersecting the first covered wire and pressing the first covered wire in a direction away from the first row;
a vertical movement mechanism for moving the first holding guide in the vertical direction with respect to the substrate;
a first presser moving mechanism for moving the first presser guide in a direction perpendicular to the surface of the substrate and closer to the perpendicular to the first row;
A holding device comprising:

[4] In [3] above,
The first presser movement mechanism includes a rod-shaped member having one end connected or integrally connected to the first presser guide, a cam follower provided at the other end of the rod-shaped member, and the cam follower being brought into contact with the cam follower. a plate cam arranged; a connection member having one end rotatably connected to the rod-shaped member; a piston holding the other end of the connection member; and a cylinder for moving the piston vertically. ,
By moving the piston in the vertical direction, the cam follower moves while contacting the plate cam, thereby moving the first pressing guide in a direction away from or in a direction closer to the perpendicular to the first row. A holding device characterized by:

[5] In [3] above,
The first presser moving mechanism has a cylinder having a piston connected to the first presser guide, the cylinder reciprocatingly moving the piston in a direction inclined with respect to a vertical line to the first row. A holding device, characterized in that it

[6] In any one of [3] to [5] above,
Each of the plurality of second holes in the second row parallel to the first row provided in the substrate and in which the plurality of second holes are arranged in a row is provided with a second hole. One end of the coated wire is inserted, and the other end of the second coated wire is connected to each of the substrate or the plurality of second electrodes on the substrate at a predetermined distance from each of the plurality of second holes. a holding device for holding the first covered wire and the second covered wire against the substrate in a folded state,
The first pressing guide has a length in a direction intersecting the second covered wire, and separates the first covered wire and the second covered wire from the first row and the second covered wire. is pressed in the direction away from the row of
The pressing device, wherein the first pressing movement mechanism is a mechanism for moving the first pressing guide in a direction perpendicular to the surface of the substrate and closer to a perpendicular to the second row.

[7] In any one of [3] to [6] above,
One end of a third coated wire is inserted into each of the plurality of third holes in a third row in which the plurality of third holes are arranged in a line at a predetermined distance from the first row provided in the substrate. inserted into the substrate in a state in which the other end of the third covered wire is connected to each of the substrate or the plurality of third electrodes on the substrate, which are separated from each of the plurality of third holes by a predetermined distance; On the other hand, a holding device for holding the third covered wire,
Having an XY stage on which the substrate is placed,
Having an X-axis movement mechanism for moving the XY stage in the X direction,
Having a Y-axis movement mechanism for moving the XY stage in the Y direction,
a rotating mechanism for rotating the first pressing guide and the first pressing movement mechanism around a line perpendicular to the surface of the substrate;
The first pressing guide has a length in a direction intersecting the third covered wire and presses the third covered wire in a direction away from the third row,
The first presser moving mechanism moves the first presser guide perpendicular to the surface of the substrate and the third row of the substrate under the first presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 3.

[8] In [7] above,
In each of the plurality of fourth holes in the fourth row parallel to the third row provided in the substrate and in which the plurality of fourth holes are arranged in a row One end of the covered wire is inserted, and the other end of the fourth covered wire is connected to each of the substrate or the plurality of fourth electrodes on the substrate at a predetermined distance from each of the plurality of fourth holes. a holding device for holding the third covered wire and the fourth covered wire against the substrate in a folded state,
The first holding guide has a length in a direction intersecting the fourth covered wire, and separates the third covered wire and the fourth covered wire from the third row and the fourth covered wire. is pressed in the direction away from the row of
The first presser moving mechanism moves the first presser guide perpendicular to the surface of the substrate and the fourth line of the substrate under the first presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 4.

[9] Equipped with the pressing device according to any one of [3] to [8] above,
having a head
A capillary for feeding a coated wire, the first holding guide, and the first holding movement mechanism are arranged in the head,
The first pressing movement mechanism is a mechanism for moving the first pressing guide laterally, upwardly or downwardly of the capillary,
The vertical movement mechanism is a mechanism for moving the head in the Z-axis direction,
Having an XY stage on which the substrate is placed,
Having an X-axis movement mechanism for moving the XY stage in the X direction,
A wiring device comprising a Y-axis moving mechanism for moving the XY stage in the Y direction.

[10] In any one of [3] to [9] above,
The pressing device, wherein the first pressing guide has a ring-shaped or rectangular planar shape.

[11] In any one of [3] to [6] above,
One end of a third coated wire is inserted into each of the plurality of third holes in a third row in which the plurality of third holes are arranged in a line at a predetermined distance from the first row provided in the substrate. inserted into the substrate in a state in which the other end of the third covered wire is connected to each of the substrate or the plurality of third electrodes on the substrate, which are separated from each of the plurality of third holes by a predetermined distance; On the other hand, a holding device for holding the third covered wire,
an XY stage on which the substrate is placed;
an X-axis movement mechanism for moving the XY stage in the X direction;
a Y-axis movement mechanism for moving the XY stage in the Y direction;
a second holding guide having a length in a direction intersecting the third covered wire and holding the third covered wire in a direction away from the third row;
a second presser moving mechanism for moving the second presser guide in a direction perpendicular to the surface of the substrate and closer to a perpendicular to the third row;
has
The pressing device, wherein the vertical movement mechanism is a mechanism for moving the second pressing guide in the vertical direction with respect to the substrate.

[12] In the above [11],
In each of the plurality of fourth holes in the fourth row parallel to the third row provided in the substrate and in which the plurality of fourth holes are arranged in a row One end of the covered wire is inserted, and the other end of the fourth covered wire is connected to each of the substrate or the plurality of fourth electrodes on the substrate at a predetermined distance from each of the plurality of fourth holes. a holding device for holding the third covered wire and the fourth covered wire against the substrate in a folded state,
The second pressing guide has a length in a direction intersecting the fourth covered wire, and separates the third covered wire and the fourth covered wire from the third row and the fourth covered wire. is pressed in the direction away from the row of
The second presser moving mechanism moves the second presser guide perpendicular to the surface of the substrate and the fourth row of the substrate under the second presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 4.

[13] In the above [11] or [12],
An integrated pressing guide in which the first pressing guide and the second pressing guide are integrally formed,
The integrated pressing guide has a ring-shaped or rectangular planar shape,
The integrated pressing guide is not connected to the third moving mechanism when moved by the first pressing moving mechanism,
A pressing device, wherein the integrated pressing guide is not connected to the first pressing moving mechanism when moved by the third moving mechanism.

[14] The pressing device according to [11] or [12] above,
having a head
The head includes a first capillary for feeding the covered wire, the first holding guide, the first holding movement mechanism, a second capillary for feeding the covered wire, the second holding guide, and the second holding guide. A presser movement mechanism is arranged,
The first pressing movement mechanism is a mechanism for moving the first pressing guide to the tip of the first capillary or below the first capillary,
The second pressing movement mechanism is a mechanism for moving the second pressing guide to the tip of the second capillary or below the second capillary,
The wiring device, wherein the vertical movement mechanism is a mechanism for moving the head in the Z-axis direction.

[15] The pressing device according to [13] above is provided,
having a head
A first capillary for feeding the covered wire, the integrated holding guide, the first holding movement mechanism, a second capillary for feeding the covered wire, and the second holding movement mechanism are arranged in the head. ,
The first presser movement mechanism is a mechanism for moving the integrated presser guide to the tip of the first capillary or below the first capillary,
The second presser moving mechanism is a mechanism for moving the integrated presser guide to the tip of the second capillary or below the second capillary,
The wiring device, wherein the vertical movement mechanism is a mechanism for moving the head in the Z-axis direction.

[16] One end of a first coated wire or a first wire is connected to each of the plurality of first joints in a first row in which the plurality of first joints provided on the substrate are arranged in a row and the other end of the first coated wire or the first wire is connected to the substrate or each of the plurality of first electrodes on the substrate at a predetermined distance from each of the plurality of first joints. A pressing device for pressing the first coated wire or the first wire against the substrate in a folded state,
A first wire having a length in a direction intersecting the first covered wire or the first wire and holding the first covered wire or the first wire in a direction away from the first row a holding guide of
a vertical movement mechanism for moving the first holding guide in the vertical direction with respect to the substrate;
a first presser moving mechanism for moving the first presser guide in a direction perpendicular to the surface of the substrate and closer to the perpendicular to the first row;
A holding device comprising:

[17] In [16] above,
The first presser movement mechanism includes a rod-shaped member having one end connected or integrally connected to the first presser guide, a cam follower provided at the other end of the rod-shaped member, and the cam follower being brought into contact with the cam follower. a plate cam arranged; a connection member having one end rotatably connected to the rod-shaped member; a piston holding the other end of the connection member; and a cylinder for moving the piston vertically. ,
By moving the piston in the vertical direction, the cam follower moves while contacting the plate cam, thereby moving the first pressing guide in a direction away from or in a direction closer to the perpendicular to the first row. A holding device characterized by:

[18] In [16] above,
The first presser moving mechanism has a cylinder having a piston connected to the first presser guide, the cylinder reciprocatingly moving the piston in a direction inclined with respect to a vertical line to the first row. A holding device, characterized in that it

[19] In any one of [16] to [18] above,
Each of the plurality of second bonding portions in the second row parallel to the first row provided on the substrate and in which the plurality of second bonding portions are aligned in a row One ends of two coated wires or second wires are connected to each of the substrate or the plurality of second electrodes on the substrate at a predetermined distance from each of the plurality of second joints. A pressing device for pressing the first and second covered wires or the first and second wires against a substrate to which the other end of the covered wire or the second wire is connected,
The first pressing guide has a length in a direction intersecting the second covered wire or the second wire, and the first and second covered wires or the first and second holding the wire in a direction away from the first row and the second row,
The pressing device, wherein the first pressing movement mechanism is a mechanism for moving the first pressing guide in a direction perpendicular to the surface of the substrate and closer to a perpendicular to the second row.

[20] In any one of [16] to [19] above,
a third covered wire or a One end of a third wire is connected to the substrate or to each of the plurality of third electrodes on the substrate at a predetermined distance from each of the plurality of third junctions. a pressing device for pressing the third coated wire or the third wire against the substrate to which the other ends of the wires of the third wire are connected;
Having an XY stage on which the substrate is placed,
Having an X-axis movement mechanism for moving the XY stage in the X direction,
Having a Y-axis movement mechanism for moving the XY stage in the Y direction,
a rotating mechanism for rotating the first pressing guide and the first pressing movement mechanism around a line perpendicular to the surface of the substrate;
The first pressing guide has a length in a direction intersecting the third covered wire or the third wire, and moves the third covered wire or the third wire to the third covered wire or the third wire. It presses in the direction away from the row,
The first presser moving mechanism moves the first presser guide perpendicular to the surface of the substrate and the third row of the substrate under the first presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 3.

[21] In the above [20],
In each of the plurality of fourth bonding portions in the fourth row parallel to the third row provided on the substrate and in which the plurality of fourth bonding portions are aligned in a row One ends of four covered wires or fourth wires are connected to each of the substrate or the plurality of fourth electrodes on the substrate at a predetermined distance from each of the plurality of fourth joints. A pressing device for pressing the third and fourth covered wires or the third and fourth wires against a substrate to which the other end of the covered wire or the fourth wire is connected,
The first pressing guide has a length in a direction intersecting the fourth covered wire or the fourth wire, and the third and fourth covered wires or the third and fourth holding the wire in a direction away from the third row and the fourth row,
The first presser moving mechanism moves the first presser guide perpendicular to the surface of the substrate and the fourth line of the substrate under the first presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 4.

[22] The pressing device according to any one of [16] to [21] above,
having a head
A capillary for feeding out the first coated wire or the first wire, the first holding guide, and the first holding movement mechanism are arranged in the head,
The first pressing movement mechanism is a mechanism for moving the first pressing guide laterally, upwardly or downwardly of the capillary,
The vertical movement mechanism is a mechanism for moving the head in the Z-axis direction,
Having an XY stage on which the substrate is placed,
Having an X-axis movement mechanism for moving the XY stage in the X direction,
A wiring device comprising a Y-axis moving mechanism for moving the XY stage in the Y direction.

[23] In any one of [16] to [22] above,
The pressing device, wherein the first pressing guide has a ring-shaped or rectangular planar shape.

[24] In any one of [16] to [19] above,
a third covered wire or a One end of a third wire is connected to the substrate or to each of the plurality of third electrodes on the substrate at a predetermined distance from each of the plurality of third junctions. a pressing device for pressing the third coated wire or the third wire against the substrate to which the other ends of the wires of the third wire are connected;
an XY stage on which the substrate is placed;
an X-axis movement mechanism for moving the XY stage in the X direction;
a Y-axis movement mechanism for moving the XY stage in the Y direction;
A second wire having a length in a direction intersecting the third covered wire or the third wire and holding the third covered wire or the third wire in a direction away from the third row a holding guide of
a second presser moving mechanism for moving the second presser guide in a direction perpendicular to the surface of the substrate and closer to a perpendicular to the third row;
has
The pressing device, wherein the vertical movement mechanism is a mechanism for moving the second pressing guide in the vertical direction with respect to the substrate.

[25] In [24] above,
In each of the plurality of fourth bonding portions in the fourth row parallel to the third row provided on the substrate and in which the plurality of fourth bonding portions are aligned in a row One ends of four covered wires or fourth wires are connected to each of the substrate or the plurality of fourth electrodes on the substrate at a predetermined distance from each of the plurality of fourth joints. A pressing device for pressing the third and fourth covered wires or the third and fourth wires against a substrate to which the other end of the covered wire or the fourth wire is connected,
The second pressing guide has a length in a direction intersecting the fourth covered wire or the fourth wire, and the third and fourth covered wires or the third and fourth holding the wire in a direction away from the third row and the fourth row,
The second presser moving mechanism moves the second presser guide perpendicular to the surface of the substrate and the fourth row of the substrate under the second presser guide. A pressing device characterized by being a mechanism for moving in a direction approaching a line perpendicular to the row of 4.

[26] In the above [24] or [25],
An integrated pressing guide in which the first pressing guide and the second pressing guide are integrally formed,
The integrated pressing guide has a ring-shaped or rectangular planar shape,
The integrated pressing guide is not connected to the third moving mechanism when moved by the first pressing moving mechanism,
A pressing device, wherein the integrated pressing guide is not connected to the first pressing moving mechanism when moved by the third moving mechanism.

[27] Equipped with the pressing device according to [24] or [25] above,
having a head
The head includes a first capillary for feeding a covered wire or wire, the first holding guide, the first holding movement mechanism, a second capillary for feeding the covered wire or wire, the second holding guide, The second holding movement mechanism is arranged,
The first pressing movement mechanism is a mechanism for moving the first pressing guide to the tip of the first capillary or below the first capillary,
The second pressing movement mechanism is a mechanism for moving the second pressing guide to the tip of the second capillary or below the second capillary,
The wiring device, wherein the vertical movement mechanism is a mechanism for moving the head in the Z-axis direction.

[28] Equipped with the pressing device according to [26] above,
having a head
The head includes a first capillary for feeding the coated wire or wire, the integrated holding guide, the first holding movement mechanism, a second capillary for feeding the covered wire or wire, and the second holding movement mechanism. is placed,
The first presser movement mechanism is a mechanism for moving the integrated presser guide to the tip of the first capillary or below the first capillary,
The second presser moving mechanism is a mechanism for moving the integrated presser guide to the tip of the second capillary or below the second capillary,
The wiring device, wherein the vertical movement mechanism is a mechanism for moving the head in the Z-axis direction.

DESCRIPTION OF SYMBOLS 11... Substrate 12... First hole 13... First row 14... First covered wire 14a... Other end of first covered wire 14b... One end of first covered wire 15... Pressing device 16... First covered wire Pressing guide 17... Vertical direction (Z-axis direction)
DESCRIPTION OF SYMBOLS 18... Up-and-down movement mechanism 19... 1st presser movement mechanism 20... 2nd row 21... 2nd hole 22... 2nd covered wire 22a... The other end of 2nd covered wire 23... Head 24... Covered wire 25 ... Capillary 26... XY stage 27... X direction 28... Y direction 29... X axis movement mechanism 30... Y axis movement mechanism 31... Rod-shaped member 32... Cam follower 33... Plate cam 33a... Third lock part 34... Connecting member 35... Piston 36a... Downward 36b... Upward 37... Cylinder 38... Direction away from the perpendicular to the first row 39... Direction approaching the perpendicular to the first row 41... First presser movement mechanism 42... Piston 43... Cylinder 44... Up Direction 46...Downward 47...Direction approaching the covered wire 51...Third hole 52...Third row 53...Third covered wire 53a...Other end of third covered wire 53b...One end of third covered wire 56... Fourth row 57... Fourth hole 58... Fourth covered wire 58a... Other end of fourth covered wire 58 61... First capillary 62... Second capillary 63, 63a... Integrated pressing guide 64 Piston 65 Cylinder 66 Second presser moving mechanism 101 First board 102 First connection point 103 Second board 104 Second connection point 105 Covered wire

Claims (5)

Each of a plurality of first connection points provided in a row on a first substrate, and a plurality of second connections provided on the first substrate or the second substrate at a predetermined distance from the first connection points. A wiring device for wiring each point with a covered wire,
A liftable capillary for feeding the coated wire, a liftable guide arranged near the capillary, a first lifting mechanism for lifting and lowering the capillary, and a second lifting mechanism for lifting and lowering the guide,
After the covered wire is wired at least to the first row of the first connection points, the guide is lowered by the second elevating mechanism when wiring the covered wire to the second row of the first connection points. A wiring device characterized by moving the coated wire laid in the first row in a direction away from the second row by moving the covered wire. 2. The wiring device according to claim 1, wherein said first connection point is a hole provided in said first substrate, and a covered wire drawn out from said capillary is inserted through said hole. 2. The wiring device according to claim 1, wherein the first connection point is an electrode provided on the first substrate, and the coated wire drawn out from the capillary is bonded to the electrode. The wiring device according to any one of claims 1 to 3, wherein the guide has a length in a direction crossing the covered wire laid at the first connection point. The second elevating mechanism includes a rod-shaped member having one end connected or integrally connected to the guide, a cam follower provided at the other end of the rod-shaped member, and a plate cam arranged in contact with the cam follower. , a connecting member having one end rotatably connected to the rod-shaped member, a piston holding the other end of the connecting member, and a cylinder for moving the piston vertically,
The cam follower moves while contacting the plate cam by vertically moving the piston, thereby moving the guide in a direction away from or closer to a line perpendicular to the first row. The wiring device according to any one of Items 1 to 4.

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