TWI832490B - Wiring device - Google Patents

Wiring device Download PDF

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Publication number
TWI832490B
TWI832490B TW111138911A TW111138911A TWI832490B TW I832490 B TWI832490 B TW I832490B TW 111138911 A TW111138911 A TW 111138911A TW 111138911 A TW111138911 A TW 111138911A TW I832490 B TWI832490 B TW I832490B
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Taiwan
Prior art keywords
pressing
substrate
row
covered wire
guide
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TW111138911A
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Chinese (zh)
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TW202329776A (en
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松岡墾基
黄民
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日商海上股份有限公司
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Publication of TWI832490B publication Critical patent/TWI832490B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/788Means for moving parts
    • H01L2224/78821Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

一種配線裝置,其是利用包覆線對在第一基板設置為多個行狀的第一連接點各自、與距所述第一連接點有預定距離的設置於所述第一基板的多個第二連接點各自進行佈線的配線裝置,所述配線裝置具備:能夠升降的毛細管,其使包覆線14陸續放出;能夠升降的引導件,其配置於毛細管的附近;第一升降機構,其使毛細管升降;以及第二升降機構,其使引導件升降,在至少對所述第一連接點的第一行佈設包覆線後,在對所述第一連接點的第二行佈設包覆線時,通過利用第二升降機構使引導件下降而使對所述第一行所佈設的包覆線向遠離所述第二行的方向移動。A wiring device that uses covered wire pairs to provide first connection points in a plurality of rows on a first substrate, and a plurality of third connection points provided on the first substrate at a predetermined distance from the first connection points. A wiring device for wiring two connection points respectively. The wiring device is provided with: a capillary tube that can be lifted and lowered to continuously release the covered wire 14; a guide that can be lifted and lowered, which is arranged near the capillary tube; and a first lifting mechanism that allows the covered wire 14 to be continuously released. Capillary tube lifting; and a second lifting mechanism that raises and lowers the guide, and after arranging covered wires on at least the first row of the first connection points, arranging the covered wires on the second row of the first connection points When the guide is lowered by using the second lifting mechanism, the covered wires arranged in the first row are moved in a direction away from the second row.

Description

配線裝置Wiring device

本發明涉及配線裝置。The present invention relates to wiring devices.

有兩行以上由設置於基板上的多個孔排列成的行,使從毛細管的前端陸續放出的包覆線穿過這些多個孔的一個孔,將該包覆線引入至基板下,一邊陸續放出包覆線一邊使毛細管上升,基板進行水平移動,使毛細管下降,由此將包覆線的另一端與基板接合。之後,將該包覆線切斷,使毛細管上升,使基板水平移動並使毛細管位於上述的多個孔的一個孔的上方,使毛細管下降並且使從毛細管的前端陸續放出的包覆線穿過孔,將該包覆線引入至基板下,進行與上述同樣的操作,由此將包覆線的另一端與基板接合。通過重複這些,使包覆線穿過由多個孔排列成的兩行以上的各個孔,將該各個包覆線的另一端與基板接合。這樣來組裝配線。There are two or more rows arranged with a plurality of holes arranged on the substrate, so that the coated wire successively released from the front end of the capillary tube passes through one of these multiple holes, and the coated wire is introduced under the substrate. The capillary tube is raised while the coated wire is being released one after another, and the substrate is moved horizontally to lower the capillary tube, thereby bonding the other end of the coated wire to the substrate. After that, the coated wire is cut, the capillary is raised, the substrate is moved horizontally so that the capillary is positioned above one of the plurality of holes, the capillary is lowered, and the coated wires successively released from the front end of the capillary are passed through. hole, introduce the covered wire under the substrate, and perform the same operation as above, thereby bonding the other end of the covered wire to the substrate. By repeating these steps, the covered wire is passed through two or more rows of holes arranged in a plurality of holes, and the other end of each covered wire is bonded to the substrate. Assemble the assembly line this way.

有時存在如下情況:若包覆線的根數增加,或者上述的多個孔的相互的間隔變短(也就是說若排成一行的孔形成狹間距並且相鄰的孔的一行的間隔變短),在將從毛細管的前端陸續放出的包覆線穿過已經穿有包覆線的一行的孔的相鄰的一行的孔、或者已經穿有包覆線的孔的相鄰的孔時,由於基板上已經存在的包覆線的密集度增加,因此該現有的包覆線向接下來試圖穿過的孔側傾倒,向試圖穿過該孔的包覆線傾倒的包覆線產生干涉,從而使該包覆線無法穿過所試圖穿過的孔。Sometimes the following situation occurs: if the number of covered wires increases, or the mutual spacing of the above-mentioned multiple holes becomes shorter (that is, if the holes in a row form a narrow spacing and the spacing of adjacent holes in a row becomes short), when the covered wire that is successively released from the front end of the capillary passes through the holes in the adjacent row of holes in the row of covered wires, or the holes adjacent to the holes in the covered wire. , due to the increased density of the existing covered wires on the substrate, the existing covered wires fall towards the side of the hole that they try to pass through next, causing interference with the covered wires that fall towards the covered wires that try to pass through the holes. , so that the covered wire cannot pass through the hole it is trying to pass through.

在專利文獻1中公開了抑制這樣的包覆線的干涉的方法。然而,在該方法中,存在機構變得複雜、製造成本增加的問題。 現有技術文獻 專利文獻 Patent Document 1 discloses a method of suppressing such interference of covered wires. However, this method has problems in that the mechanism becomes complicated and the manufacturing cost increases. existing technical documents patent documents

專利文獻1:日本特公昭60-57699號公報Patent document 1: Japanese Patent Publication No. 60-57699

發明所要解決的問題Problems to be solved by inventions

本發明的一個方式的課題在於,提供一種能夠通過對在基板上已經存在的包覆線的傾倒進行限制來抑制試圖穿過的包覆線與現有的包覆線發生干涉的配線裝置。An object of one aspect of the present invention is to provide a wiring device capable of suppressing interference between a covered wire trying to pass through and an existing covered wire by restricting the falling of a covered wire already existing on a substrate.

另外,本發明的一個方式的課題在於,提供一種能夠通過對在基板上已經存在的包覆線的傾倒進行限制來抑制試圖連接的包覆線與現有的包覆線發生干涉的配線裝置。 用於解決問題的手段 Another object of one aspect of the present invention is to provide a wiring device capable of suppressing interference between a covered wire that is intended to be connected and an existing covered wire by restricting the fall of a covered wire that is already present on a substrate. means to solve problems

以下對本發明的各種的方式進行說明。Various aspects of the present invention will be described below.

[A]一種配線裝置,其是利用包覆線對在第一基板設置為多個行狀的第一連接點各自、與距所述第一連接點有預定距離的設置於所述第一基板或第二基板的多個第二連接點各自進行佈線的配線裝置,其特徵在於, 所述配線裝置具備:能夠升降的毛細管,其使所述包覆線陸續放出;能夠升降的引導件,其配置於所述毛細管的附近;第一升降機構,其使所述毛細管升降;以及第二升降機構,其使所述引導件升降, 在至少對所述第一連接點的第一行佈設包覆線後,在對所述第一連接點的第二行佈設包覆線時,通過利用所述第二升降機構使引導件下降而使對所述第一行所佈設的包覆線向遠離所述第二行的方向移動。 [A] A wiring device that uses covered wire pairs to provide first connection points in a plurality of rows on a first substrate, each of which is provided at a predetermined distance from the first connection point on the first substrate or A wiring device in which a plurality of second connection points of a second substrate are individually wired, characterized in that: The wiring device is provided with: a capillary tube that can be raised and lowered to continuously discharge the covered wire; a guide that can be raised and lowered that is arranged near the capillary tube; a first lifting mechanism that raises and lowers the capillary tube; and a third lifting mechanism. Two lifting mechanisms, which raise and lower the guide piece, After laying the covered wires on at least the first row of the first connection points, when laying the covered wires on the second row of the first connection points, the guide is lowered by using the second lifting mechanism. The covered wires arranged in the first row are moved in a direction away from the second row.

[B]在上述[A]所記載的配線裝置的基礎上,其特徵在於,所述第一連接點是設置於所述第一基板上的孔,從所述毛細管陸續放出的包覆線插通所述孔。[B] On the basis of the wiring device described in [A] above, the first connection point is a hole provided on the first substrate, and the covered wire plug that is successively released from the capillary tube is through the hole.

[C]在上述[ A]所記載的配線裝置的基礎上,其特徵在於,所述第一連接點是設置於所述第一基板上的電極,從所述毛細管陸續放出的包覆線與所述電極接合。[C] Based on the wiring device described in [A] above, the first connection point is an electrode provided on the first substrate, and the covered wire successively discharged from the capillary tube and The electrodes are joined.

[D]在上述[A]~[C]所記載的配線裝置的基礎上,其特徵在於,所述引導件在相對於對第一連接點所佈設的包覆線交叉的方向上具有長度。[D] In the wiring device described in [A] to [C] above, the guide has a length in a direction intersecting with the covered wire laid out at the first connection point.

[E]在上述[A]~[D]所記載的配線裝置的基礎上,其特徵在於,所述第二升降機構具有:棒狀構件,其一端連接於所述引導件、或一體地與所述引導件相連;凸輪從動件,其設置於所述棒狀構件的另一端;板凸輪,其配置為與所述凸輪從動件接觸;連接構件,其一端以能夠旋轉的方式連接於所述棒狀構件;活塞,其保持所述連接構件的另一端;以及氣缸,其使所述活塞沿上下方向移動。[E] Based on the wiring device described in the above [A] to [D], it is characterized in that the second lifting mechanism has a rod-shaped member, one end of which is connected to the guide, or is integrally connected to the guide. The guide is connected; a cam follower is provided at the other end of the rod-shaped member; a plate cam is configured to contact the cam follower; and a connecting member has one end rotatably connected to the the rod-shaped member; a piston that holds the other end of the connecting member; and a cylinder that moves the piston in the up and down direction.

通過使所述活塞沿上下方向移動而使所述凸輪從動件一邊與所述板凸輪接觸一邊移動,由此使所述引導件沿遠離或靠近相對於所述第一行的垂線的方向移動。 發明效果 By moving the piston in the up and down direction, the cam follower moves while in contact with the plate cam, thereby moving the guide in a direction away from or closer to a vertical line with respect to the first row. . Invention effect

根據本發明的一個方式,能夠提供一種配線裝置,能夠通過對在基板上已經存在的包覆線的傾倒進行限制來抑制試圖穿過的包覆線與現有的包覆線發生干涉。According to one aspect of the present invention, it is possible to provide a wiring device that can suppress interference between a covered wire trying to pass through and the existing covered wire by restricting the falling of a covered wire already existing on a substrate.

另外,根據本發明的一個方式,能夠提供一種配線裝置,能夠通過對在基板上已經存在的包覆線的傾倒進行限制來抑制試圖連接的包覆線與現有的包覆線發生干涉。In addition, according to one aspect of the present invention, it is possible to provide a wiring device that can suppress interference between a covered wire that is intended to be connected and an existing covered wire by restricting the fall of a covered wire that already exists on a substrate.

以下,使用圖式對本發明的實施方式進行詳細地說明。但是,本發明不限於以下的說明,本發明所屬技術領域中具有通常知識者容易理解在不偏離本發明的主旨以及該範圍的前提下能夠對其方式以及詳細內容進行各種各樣的變更。因此,本發明不受以下所示的實施方式的記載內容的限定性解釋。 (第一實施方式) Hereinafter, embodiments of the present invention will be described in detail using drawings. However, the present invention is not limited to the following description. It will be easily understood by those of ordinary skill in the technical field to which the present invention belongs that various changes can be made in the modes and details without departing from the spirit and scope of the present invention. Therefore, the present invention is not to be interpreted in a limiting sense by the description of the embodiments shown below. (first embodiment)

圖1是示意性地表示本發明的一個方式所涉及的具備按壓裝置的配線裝置的圖。圖2中的(B)是表示使對通過圖1所示的第一按壓引導件16已經穿過孔的(插入完畢的)第一包覆線14一邊進行按壓一邊從毛細管25陸續放出的包覆線24穿過基板11(也稱為「第一基板」)的第二孔21的情形的剖視圖,圖2中的(A)是從上方觀察圖2中的(B)的俯視圖。需要說明的是,在圖2中的(A)、(B)中,未圖示比圖1所示的頭23的毛細管25靠上的部分。FIG. 1 is a diagram schematically showing a wiring device equipped with a pressing device according to one embodiment of the present invention. (B) in FIG. 2 shows a package that is released from the capillary tube 25 while pressing the first covered wire 14 that has been passed through the hole through the first pressing guide 16 shown in FIG. 1 (inserted). (A) in FIG. 2 is a top view of (B) in FIG. 2 viewed from above. In addition, in (A) and (B) of FIG. 2, the part above the capillary tube 25 of the head 23 shown in FIG. 1 is not shown.

如圖2中的(A)、(B)所示,本發明的一個方式所涉及的按壓裝置15是如下裝置,其在設置於基板(第一基板)11上的多個第一孔12(也稱為「第一連接點」)排成一行而成的第一行13中的多個第一孔(第一連接點)12分別插入第一包覆線14(也稱為「包覆線」)的一端14b,相對於在分別距多個第一孔12有預定距離的基板11或分別在基板11上的多個第一電極(也稱為「電極」)連接有第一包覆線(包覆線)14的另一端14a後的狀態的基板11,按壓已經穿過孔的(插入完畢的)第一包覆線14。需要說明的是,在本說明書中「包覆線」能夠使用各種的包覆線,例如可以使用通過樹脂系材料包覆銅而成的包覆線。As shown in (A) and (B) of FIG. 2 , the pressing device 15 according to one embodiment of the present invention is a device in which a plurality of first holes 12 ( A plurality of first holes (first connection points) 12 in a first row 13 (also called "first connection points") are respectively inserted into first covered wires 14 (also called "covered wires"). ”), a first covered wire is connected to a substrate 11 that is a predetermined distance away from the first holes 12 or a plurality of first electrodes (also referred to as “electrodes”) respectively on the substrate 11 The substrate 11 is in a state where the other end 14 a of the (covered wire) 14 is behind, and the first covered wire 14 (which has been inserted) that has passed through the hole is pressed. It should be noted that in this specification, various types of covered wires can be used as the "covered wire". For example, a covered wire in which copper is coated with a resin-based material can be used.

需要說明的是,在本實施方式中,設為以第一連接點為第一孔12並將包覆線14插入至第一孔12的結構,但也可以設為是將第一連接點設為設置於第一基板上的電極並將包覆線14與電極接合的結構。It should be noted that in this embodiment, the first connection point is set as the first hole 12 and the covered wire 14 is inserted into the first hole 12. However, the first connection point may also be set as the first hole 12. It is a structure in which electrodes are provided on the first substrate and the covered wire 14 is bonded to the electrodes.

該按壓裝置15具有按壓引導機構,該按壓引導機構對一端被分別插入至多個第一孔12的第一包覆線14進行按壓,且用於將新的包覆線24插入至孔中。The pressing device 15 has a pressing guide mechanism that presses the first covered wires 14 whose one ends are respectively inserted into the plurality of first holes 12 and is used to insert new covered wires 24 into the holes.

另外,本發明的一個方式所涉及的按壓裝置15具有第一按壓引導件16(也稱為「引導件」),該第一按壓引導件16在相對於第一包覆線14交叉的方向上具有長度(參照圖2中的(A)),且將第一包覆線14向遠離第一行13的方向按壓。In addition, the pressing device 15 according to one aspect of the present invention includes a first pressing guide 16 (also referred to as a “guide”) in a direction intersecting the first covering line 14 has a length (refer to (A) in FIG. 2 ), and the first covered wire 14 is pressed in a direction away from the first row 13 .

另外,該按壓裝置15具有使第一按壓引導件(引導件)16相對於基板11而沿上下方向17移動的上下移動機構18。In addition, this pressing device 15 has a vertical movement mechanism 18 that moves the first pressing guide (guide) 16 in the vertical direction 17 relative to the substrate 11 .

另外,該按壓裝置15具有第一按壓移動機構19(也稱為「第二升降機構」),該第一按壓移動機構19使第一按壓引導件16向靠近相對於基板11的表面的垂線且相對於第一行13的垂線的方向移動。In addition, the pressing device 15 has a first pressing movement mechanism 19 (also called a “second lifting mechanism”) that moves the first pressing guide 16 closer to a perpendicular line relative to the surface of the substrate 11 and Move relative to the direction of the vertical line in the first row 13.

需要說明的是,在本實施方式中,使用具有多個第一孔12排成一行而成的第一行13的基板11,但作為本實施方式的第三變形例,也能夠使用具有多個第一接合部排成一行而成的第一行的基板。在該情況下,第三變形例的按壓裝置是如下裝置,其在設置於基板上的多個第一接合部排成一行而成的第一行中的所述多個第一接合部分別連接第一包覆線或第一導線的一端,相對於在分別距所述多個第一接合部有預定距離的所述基板或分別在所述基板上的多個第一電極連接有所述第一包覆線或第一導線的另一端後的狀態的基板,按壓已經與接合部連接的第一包覆線或第一導線。在第三變形例的按壓裝置中也具有上述的按壓引導機構、第一按壓引導件16、上下移動機構18、第一按壓移動機構19。另外,在本說明書中所謂「接合部」,只要是能夠接合包覆線或導線的話,則包括各種的接合部(例如端子、焊盤等)。It should be noted that in this embodiment, the substrate 11 having the first row 13 in which the plurality of first holes 12 are aligned is used. However, as a third modification of the present embodiment, a substrate having a plurality of first holes 12 can also be used. The first row of substrates is formed by arranging the first joint portions in a row. In this case, the pressing device according to the third modified example is a device in which the plurality of first joining portions are respectively connected to each other in a first row in which a plurality of first joining portions are arranged in a line on the substrate. One end of a first covered wire or a first conductive wire is connected to the substrate with a predetermined distance from the plurality of first joint portions or a plurality of first electrodes respectively on the substrate. A substrate with the other end of a covered wire or first conductor pressing the first covered wire or first conductor that has been connected to the joint portion. The pressing device according to the third modified example also includes the above-mentioned pressing guide mechanism, the first pressing guide 16, the vertical movement mechanism 18, and the first pressing movement mechanism 19. In addition, the "joining part" in this specification includes various joining parts (such as terminals, pads, etc.) as long as the covered wire or the conductive wire can be joined.

另外,本發明的一個方式所涉及的按壓裝置15是如下裝置,其在與設置於基板11上的第一行13平行的第二行20並且多個第二孔21排成一行而成的第二行20中的多個第二孔21分別插入第二包覆線22的一端,相對於在分別距多個第二孔21有預定距離的基板11或分別在基板11上的多個第二電極連接有第二包覆線22的另一端22a後的狀態的基板11,按壓第一包覆線14以及第二包覆線22。In addition, the pressing device 15 according to one aspect of the present invention is a device in which a plurality of second holes 21 are aligned in a second row 20 parallel to the first row 13 provided on the substrate 11 . The plurality of second holes 21 in the two rows 20 are respectively inserted into one end of the second covered wire 22, relative to the substrate 11 which is a predetermined distance from the plurality of second holes 21 or the plurality of second holes 21 respectively on the substrate 11. The substrate 11 with the other end 22 a of the second covered wire 22 connected to the electrode presses the first covered wire 14 and the second covered wire 22 .

第一按壓引導件16在相對於第二包覆線22交叉的方向上具有長度(參照圖2中的(A)),將第一包覆線14以及第二包覆線22向遠離第一行13以及第二行20的方向按壓。The first pressing guide 16 has a length in a direction crossing the second covered wire 22 (see (A) in FIG. 2 ), and moves the first covered wire 14 and the second covered wire 22 away from the first covered wire 22 . Press in the direction of row 13 and the second row 20.

第一按壓移動機構19是使第一按壓引導件16向靠近相對於基板11的表面的垂線且相對於第二行20的垂線的方向移動的機構。The first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 in a direction closer to the perpendicular to the surface of the substrate 11 and relative to the perpendicular to the second row 20 .

需要說明的是,在本實施方式中,使用了具有與第一行13平行的第二行20並且多個第二孔21排成一行而成的第二行20的基板11,作為本實施方式的第三變形例,也能夠使用與第一行平行的第二行並且多個第二接合部排成一行而成的基板。在該情況下,第三變形例的按壓裝置是如下裝置,在分別與設置於基板上的第一行平行的第二行並且多個第二接合部排成一行而成的第二行中的多個第二接合部連接第二包覆線或第二導線的一端,相對於在分別距多個第二接合部有預定距離的基板或分別在基板上的多個第二電極連接有第二包覆線或第二導線的另一端後的狀態的基板,按壓第一包覆線以及第二包覆線或第一導線以及第二導線。It should be noted that in this embodiment, a substrate 11 having a second row 20 parallel to the first row 13 and a second row 20 in which a plurality of second holes 21 are aligned is used. In the third modification, a substrate in which a second row is parallel to the first row and a plurality of second bonding portions are aligned can be used. In this case, the pressing device according to the third modified example is a device in which a plurality of second joint portions are arranged in a second row in a second row that is parallel to the first row provided on the substrate. A plurality of second bonding portions are connected to one end of a second covered wire or a second conductor, and a plurality of second electrodes are connected to a substrate at a predetermined distance from the plurality of second bonding portions or to a plurality of second electrodes respectively on the substrate. The substrate in a state of covering the other end of the wire or the second conductor presses the first covered wire and the second covered wire or the first conductor and the second conductor.

第一按壓引導件16可以是棒狀,也可以具有環狀或矩形的平面形狀(圖7中的(A)以及圖8中的(A))。The first pressing guide 16 may be rod-shaped, or may have an annular or rectangular planar shape ((A) in FIG. 7 and (A) in FIG. 8 ).

以下進行詳細說明。The details are explained below.

在基板(第一基板)11,設置有多個第一孔(第一連接點)12排成一行而成的第一行13、多個第二孔21排成一行而成的第二行20,並且進一步地設置有三行以上的多個孔的行(參照圖2中的(A))。第二行20位於與第一行13平行的位置,第三行以下也設置為彼此平行。在多個第一孔12分別插入第一包覆線(包覆線)14的一端14b,在分別距多個第一孔12有預定距離的基板(第一基板)11或分別在基板11上的多個第一電極(也稱為「第二連接點」)連接有第一包覆線14的另一端14a(參照圖1以及圖2中的(A)、(B))。在多個第二孔21分別插入第二包覆線22的一端,在分別距多個第二孔21有預定距離的基板11或分別在基板11上的多個第二電極連接有第二包覆線22的另一端22a(參照圖2中的(A))。連接有第二包覆線22的另一端22a的基板11的表面位於比配置有第一行13以及第二行20的基板11的表面高的位置。也就是說,在基板11設置有臺階。The substrate (first substrate) 11 is provided with a first row 13 in which a plurality of first holes (first connection points) 12 are arranged in a row, and a second row 20 in which a plurality of second holes 21 are arranged in a row. , and furthermore, three or more rows of multiple holes are provided (see (A) in FIG. 2 ). The second row 20 is located parallel to the first row 13, and the third row and below are also arranged parallel to each other. One end 14 b of the first covered wire (covered wire) 14 is inserted into the plurality of first holes 12 respectively, and is respectively inserted into the substrate (first substrate) 11 at a predetermined distance from the plurality of first holes 12 or respectively on the substrate 11 A plurality of first electrodes (also called "second connection points") are connected to the other end 14a of the first covered wire 14 (see (A) and (B) in FIGS. 1 and 2 ). One end of the second coated wire 22 is inserted into the plurality of second holes 21 respectively, and a second coated wire is connected to the substrate 11 at a predetermined distance from the plurality of second holes 21 or to a plurality of second electrodes on the substrate 11 respectively. The other end 22a of the covered wire 22 (refer to (A) in Fig. 2). The surface of the substrate 11 to which the other end 22 a of the second covered wire 22 is connected is located higher than the surface of the substrate 11 on which the first row 13 and the second row 20 are arranged. That is, the substrate 11 is provided with a step.

如圖2中的(A)、(B)所示按壓裝置15對已經穿過孔的(插入完畢的)第一包覆線14以及第二包覆線22進行按壓。按壓裝置15具有第一按壓引導件16、上下移動機構18以及第一按壓移動機構19。第一按壓引導件16在相對於第一包覆線14以及第二包覆線22交叉的方向上具有長度。另外上下移動機構18是使第一按壓引導件16沿上下方向17移動的機構(參照圖1)。另外第一按壓移動機構19是使第一按壓引導件16向靠近或遠離相對於基板11的表面的垂線且相對於第一行13的垂線的方向移動的機構。As shown in (A) and (B) of FIG. 2 , the pressing device 15 presses the first covered wire 14 and the second covered wire 22 that have passed through the holes (inserted). The pressing device 15 has a first pressing guide 16 , a vertical movement mechanism 18 , and a first pressing movement mechanism 19 . The first pressing guide 16 has a length in a direction intersecting the first covered wire 14 and the second covered wire 22 . The vertical movement mechanism 18 is a mechanism that moves the first pressing guide 16 in the vertical direction 17 (see FIG. 1 ). In addition, the first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 in a direction closer to or farther away from a perpendicular to the surface of the substrate 11 and relative to a perpendicular to the first row 13 .

如圖1所示,本發明的一個方式所涉及的配線裝置具備上述的按壓裝置15,具有頭23。As shown in FIG. 1 , a wiring device according to one embodiment of the present invention includes the above-mentioned pressing device 15 and has a head 23 .

在頭23內,配置有使包覆線24陸續放出的毛細管25、配置於毛細管25的附近的第一按壓引導件(引導件)16以及第一按壓移動機構19。In the head 23 , a capillary tube 25 for sequentially releasing the covered wire 24 , a first pressing guide (guide) 16 arranged near the capillary tube 25 , and a first pressing movement mechanism 19 are arranged.

第一按壓移動機構19是使第一按壓引導件16向毛細管25的側方、上方或下方移動的機構。The first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 to the side, above, or below the capillary tube 25 .

上下移動機構18(也稱為「第一升降機構」)是使頭23沿Z軸方向(上下方向)17移動的機構。The vertical movement mechanism 18 (also called the "first lifting mechanism") is a mechanism that moves the head 23 in the Z-axis direction (up-and-down direction) 17 .

另外,配線裝置具有載置基板11的XY載物台26,具有使XY載物台26沿X方向27移動的X軸移動機構29。In addition, the wiring device has an XY stage 26 on which the substrate 11 is mounted, and an X-axis moving mechanism 29 that moves the XY stage 26 in the X direction 27 .

另外,配線裝置具有使XY載物台26沿Y方向28移動的Y軸移動機構30。In addition, the wiring device has a Y-axis moving mechanism 30 that moves the XY stage 26 in the Y direction 28 .

另外,在本實施方式中,在頭23內配置有使包覆線24陸續放出的毛細管25,但作為本實施方式的第三變形例,也能夠在頭23內配置使包覆線24或導線陸續放出的毛細管25。In addition, in the present embodiment, the capillary tube 25 for sequentially releasing the covered wire 24 is disposed in the head 23. However, as a third modification of the present embodiment, the capillary tube 25 may be disposed in the head 23 so that the covered wire 24 or the conductive wire can be discharged. The capillary tube 25 is released one after another.

以下進行詳細地說明。This is explained in detail below.

圖1所示的配線裝置具有XY載物台26,該XY載物台26具備使對象沿X方向27的X軸移動機構29、使對象沿Y方向28移動的Y軸移動機構30。在載置於該XY載物台26上的基板11的上方配置有頭23。頭23安裝有使對象沿Z軸方向(上下方向)17移動的上下移動機構18。在頭23內,配置有使包覆線24陸續放出的毛細管25、第一按壓引導件16以及第一按壓移動機構19。由於毛細管25使包覆線24陸續放出的機構使用公知的技術,未進行圖示。另外第一按壓移動機構19是使第一按壓引導件16向毛細管25的側方、上方或下方移動的機構。The wiring device shown in FIG. 1 has an XY stage 26 equipped with an X-axis moving mechanism 29 for moving the object in the X direction 27 and a Y-axis moving mechanism 30 for moving the object in the Y direction 28 . A head 23 is arranged above the substrate 11 placed on the XY stage 26 . The head 23 is equipped with an up-and-down movement mechanism 18 for moving the object in the Z-axis direction (up-and-down direction) 17 . In the head 23, a capillary tube 25 for sequentially releasing the covered wire 24, a first pressing guide 16, and a first pressing movement mechanism 19 are arranged. The capillary tube 25 is a mechanism for successively releasing the coated wire 24 using a known technology and is not shown in the figure. The first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 to the side, above, or below the capillary tube 25 .

圖3中的(A)、(B)是表示圖1所示的第一按壓移動機構19和毛細管25的位置關係的圖,圖3中的(A)表示在按壓圖1所示的第一包覆線14時的第一按壓引導件16相對於毛細管25的位置,圖3中的(B表示在不按壓圖1所示的第一包覆線14時使第一按壓引導件16從毛細管25退避後的位置。(A) and (B) in FIG. 3 are diagrams showing the positional relationship between the first pressing and moving mechanism 19 shown in FIG. 1 and the capillary tube 25 . (A) in FIG. 3 shows when the first pressing and moving mechanism 19 shown in FIG. 1 is pressed. The position of the first pressing guide 16 relative to the capillary tube 25 when the wire 14 is covered, (B in Figure 3 represents the position of the first pressing guide 16 from the capillary tube when the first covered wire 14 shown in Figure 1 is not pressed. 25The position after retreat.

如圖3中的(A)、(B)所示,第一按壓移動機構(第二升降機構)19具有:棒狀構件31,其一端與第一按壓引導件(引導件)16連接或一體地與第一按壓引導件(引導件)16相連;凸輪從動件32,其設置於棒狀構件31的另一端;板凸輪33,其配置為凸輪從動件32接觸;連接構件34,其一端以能夠旋轉的方式連接於棒狀構件31;活塞35,其保持連接構件34的另一端;以及氣缸37,其使活塞35沿上下方向(下方向36a、上方向36b)移動。As shown in (A) and (B) of FIG. 3 , the first pressing and moving mechanism (second lifting mechanism) 19 has a rod-shaped member 31 , one end of which is connected to or integrated with the first pressing guide (guide) 16 ground is connected to the first pressing guide (guide) 16; a cam follower 32 provided at the other end of the rod-shaped member 31; a plate cam 33 configured so that the cam follower 32 contacts; a connecting member 34 One end is rotatably connected to the rod-shaped member 31; the piston 35 holds the other end of the connecting member 34; and the air cylinder 37 moves the piston 35 in the up-down direction (downward direction 36a, upward direction 36b).

通過使活塞35沿上下方向移動而使凸輪從動件32一邊與板凸輪33接觸一邊移動,由此能夠使第一按壓引導件(引導件)16向遠離相對於第一行的垂線(例如圖3中的(A)、(B)所示的包覆線24)的方向38或靠近相對於第一行的垂線(例如圖3中的(A)、(B)所示的包覆線24)的方向39移動。在此,雖然通過凸輪從動件、氣缸而進行了說明,但也可以任意是通過馬達、滾珠螺桿等而能夠沿上下、傾斜方向移動的機構。By moving the piston 35 in the up-down direction and moving the cam follower 32 while in contact with the plate cam 33, the first pressing guide (guide) 16 can be moved away from the vertical line with respect to the first row (for example, FIG. The direction 38 of the covered line 24 shown in (A) and (B) in Figure 3) or close to the vertical line relative to the first row (for example, the covered line 24 shown in (A) and (B) in Figure 3 ) to move in direction 39. Here, although the cam follower and the air cylinder have been described, any mechanism capable of moving up and down or in the tilt direction using a motor, a ball screw, etc. may be used.

也就是說,如圖3中的(A)、(B)所示,通過使氣缸37的活塞35向下方向36a移動,能夠使第一按壓引導件16向靠近包覆線24的方向39移動,另外通過使氣缸37的活塞35向上方向36b移動,能夠使第一按壓引導件16向遠離包覆線24的方向38移動。That is, as shown in (A) and (B) of FIG. 3 , by moving the piston 35 of the cylinder 37 in the downward direction 36 a, the first pressing guide 16 can be moved in the direction 39 close to the covering wire 24 , and by moving the piston 35 of the air cylinder 37 in the upward direction 36b, the first pressing guide 16 can be moved in the direction 38 away from the covered wire 24.

在本實施方式中,雖然使用圖3中的(A)、(B)所示的第一按壓移動機構19,但也可以對圖4以及圖5所示的第一按壓移動機構進行變更來實施。In this embodiment, the first pressing and moving mechanism 19 shown in (A) and (B) in FIG. 3 is used. However, the first pressing and moving mechanism shown in FIGS. 4 and 5 may be modified. .

圖4以及圖5是表示第一按壓引導件16與毛細管25的位置關係的圖。圖4表示第一包覆線14的一端14b穿過基板11的第一孔,第一包覆線14的另一端14a相對於與基板11連接後的狀態的基板11,在不按壓第一包覆線14時使第一按壓引導件16從毛細管25退避後的位置。圖5表示與在按壓第一包覆線14時的第一按壓引導件16相對於毛細管25的位置,表示通過第一按壓引導件16按壓第一包覆線14的狀態。4 and 5 are diagrams showing the positional relationship between the first pressing guide 16 and the capillary tube 25. Figure 4 shows that one end 14b of the first covered wire 14 passes through the first hole of the substrate 11, and the other end 14a of the first covered wire 14 is in a state where the first package is not pressed relative to the substrate 11 after being connected to the substrate 11. The wire covering 14 is a position in which the first pressing guide 16 is retracted from the capillary tube 25 . FIG. 5 shows the position of the first pressing guide 16 relative to the capillary tube 25 when the first covering wire 14 is pressed, and shows a state in which the first pressing guide 16 presses the first covering wire 14 .

如圖4以及圖5所示,第一按壓移動機構41具有氣缸43,該氣缸43具備與第一按壓引導件16連接的活塞42,該氣缸43是使活塞42沿相對於與第一行相對的垂線(例如圖4所示的包覆線24)傾斜的方向往復移動的裝置。使活塞42沿傾斜的方向移動的理由,是由於若使第一按壓引導件16向正上方移動則會與毛細管25發生干涉。As shown in FIGS. 4 and 5 , the first pressing and moving mechanism 41 has a cylinder 43 having a piston 42 connected to the first pressing guide 16 . The cylinder 43 moves the piston 42 along a direction opposite to the first row. A device that reciprocates in an inclined direction of a vertical line (such as the covering line 24 shown in Figure 4). The reason why the piston 42 is moved in the inclined direction is that if the first pressing guide 16 is moved directly upward, it will interfere with the capillary tube 25 .

也就是說,如圖4以及圖5所示,通過使氣缸43的活塞42沿相對於包覆線24傾斜的上方向44移動,能夠使第一按壓引導件16向遠離包覆線24的方向45移動,另外通過使氣缸43的活塞42向下方向46移動,能夠使第一按壓引導件16向靠近包覆線24的方向47移動。That is, as shown in FIGS. 4 and 5 , by moving the piston 42 of the cylinder 43 in the upward direction 44 inclined with respect to the covered wire 24 , the first pressing guide 16 can be moved in a direction away from the covered wire 24 45, and by moving the piston 42 of the cylinder 43 in the downward direction 46, the first pressing guide 16 can be moved in the direction 47 closer to the covering wire 24.

另外,如圖1所示,本發明的一個方式所涉及的按壓裝置15進一步地具備以下的構成,參照圖2以及圖6來進行說明。圖6中的(B)是用於說明圖1所示的按壓裝置15的剖視圖,圖6中的(A)是從上方觀察圖6中的(B)的俯視圖。需要說明的是,在圖6中的(A)、(B)中,未對比圖1所示的頭23的毛細管25靠上的部分進行圖示。In addition, as shown in FIG. 1 , the pressing device 15 according to one embodiment of the present invention further includes the following configuration, which will be described with reference to FIGS. 2 and 6 . (B) in FIG. 6 is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1 , and (A) in FIG. 6 is a top view of (B) in FIG. 6 viewed from above. It should be noted that in (A) and (B) of FIG. 6 , the upper portion of the capillary tube 25 of the head 23 shown in FIG. 1 is not shown.

另外,按壓裝置15是如下裝置,其在分別距設置於圖2中的(A)所示的基板11上的第一行13有預定距離的圖6中的(A)所示的多個第三孔51排成一行而成的第三行52中的多個第三孔51插入第三包覆線53的一端53b,相對於在分別距多個第三孔51有預定距離的基板11或分別在基板11上的多個第三電極連接第三包覆線53的另一端53a後的狀態的基板11,按壓第三包覆線53。In addition, the pressing device 15 is a device that presses a plurality of first rows 13 shown in FIG. 6(A) at a predetermined distance from the first row 13 shown in FIG. 2(A) . A plurality of third holes 51 in a third row 52 in which the three holes 51 are arranged in a row are inserted into one end 53b of the third covered wire 53, relative to the substrate 11 or the substrate 11 or the like at a predetermined distance from the plurality of third holes 51 respectively. The third covered wire 53 is pressed against the substrate 11 in a state where the plurality of third electrodes on the substrate 11 are connected to the other end 53 a of the third covered wire 53 .

圖2中的(A)和圖6中的(A)的位置關係可以是圖2中的(A)所示的第一行13和圖6中的(A)所示的第三行52處於對置的位置,也可以是圖2中的(A)所示的第一行13和圖6中的(A)所示的第三行52處於多邊形的邊上的位置。The positional relationship between (A) in Fig. 2 and (A) in Fig. 6 may be that the first row 13 shown in (A) in Fig. 2 and the third row 52 shown in (A) in Fig. 6 are in The opposing positions may be a position where the first row 13 shown in FIG. 2(A) and the third row 52 shown in FIG. 6(A) are on the sides of the polygon.

如圖1所示,按壓裝置15具有使第一按壓引導件16以及第一按壓移動機構19在相對於基板11的表面的垂線(例如從毛細管25陸續放出的包覆線24)的周圍如箭頭54那樣旋轉的旋轉機構55。As shown in FIG. 1 , the pressing device 15 has a structure such that the first pressing guide 16 and the first pressing moving mechanism 19 are arranged as arrows around a perpendicular line relative to the surface of the substrate 11 (for example, the covering line 24 successively released from the capillary tube 25 ). The rotating mechanism 55 rotates like 54.

需要說明的是,在本實施方式中,使用具有距第一行13有預定距離的圖6中的(A)所示的多個第三孔51排成一行而成的第三行52的基板11,但作為本實施方式的第三變形例,也能夠使用具有距第一行13有預定距離的多個第三接合部排成一行而成的第三行的基板。在該情況下,第三變形例的按壓裝置是如下裝置,其在分別距設置於基板上的第一行有預定距離的多個第三接合部排成一行而成的第三行中的多個第三接合部插入第三包覆線53的一端53b,相對於在分別距多個第三接合部有預定距離的基板或分別在基板上的多個第三電極連接第三包覆線或第三導線的另一端後的狀態的基板,按壓第三包覆線或第三導線。It should be noted that in this embodiment, a substrate having a third row 52 in which a plurality of third holes 51 shown in FIG. 6(A) is aligned at a predetermined distance from the first row 13 is used. 11. However, as a third modification of this embodiment, a substrate having a third row in which a plurality of third bonding portions are arranged in a line at a predetermined distance from the first row 13 can also be used. In this case, the pressing device according to the third modified example is a device in which a plurality of third joint portions in a third row are aligned at a predetermined distance from the first row provided on the substrate. A third joint part is inserted into one end 53b of the third covered wire 53, and the third covered wire is connected with respect to a substrate at a predetermined distance from the plurality of third joint parts or a plurality of third electrodes respectively on the substrate. After the other end of the third wire is in the state of the substrate, press the third covered wire or the third wire.

第一按壓引導件16是在相對於第三包覆線53交叉的方向上具有長度,使第三包覆線53向遠離第三行52的方向按壓的裝置。The first pressing guide 16 has a length in a direction intersecting the third covered wires 53 and is a device that presses the third covered wires 53 in a direction away from the third row 52 .

第一按壓移動機構19是如下機構,其在使基板11的第三行52位於第一按壓引導件16的下方的狀態下,使第一按壓引導件16向靠近相對於基板11的表面的垂線且相對於第三行52的垂線(例如從毛細管25陸續放出的包覆線25)的方向移動的機構。The first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 closer to the perpendicular to the surface of the substrate 11 in a state where the third row 52 of the substrate 11 is located below the first pressing guide 16 And a mechanism that moves relative to the direction of the vertical line of the third row 52 (for example, the covered line 25 that is successively released from the capillary tube 25).

另外,如圖6中的(A)所示,按壓裝置15是如下裝置,其在與設置於基板11上的第三行52平行的第四行56並且多個第四孔57排成一行而成的第四行56中的多個第四孔57分別插入第四包覆線58的一端,相對於分別在距多個第四57孔有預定距離的基板11或分別在基板11上的多個第四電極連接第四包覆線58的另一端58a後的狀態的基板11,按壓第三包覆線53以及第四包覆線58。In addition, as shown in (A) of FIG. 6 , the pressing device 15 is a device in which a fourth row 56 parallel to the third row 52 provided on the substrate 11 and a plurality of fourth holes 57 are aligned. The plurality of fourth holes 57 in the fourth row 56 are respectively inserted into one end of the fourth covered wire 58, with respect to the substrate 11 having a predetermined distance from the plurality of fourth holes 57 or the plurality of holes 57 respectively on the substrate 11. The third covered wire 53 and the fourth covered wire 58 are pressed on the substrate 11 in a state where the fourth electrode is connected to the other end 58 a of the fourth covered wire 58 .

第一按壓引導件16是在相對於第四包覆線58交叉的方向上具有長度,使第三包覆線53以及第四包覆線58向遠離第三行52以及第四行56的方向按壓的裝置。The first pressing guide 16 has a length in a direction crossing the fourth covered wire 58 so that the third covered wire 53 and the fourth covered wire 58 are directed away from the third row 52 and the fourth row 56 Pressing device.

第一按壓移動機構19是如下機構,其在使基板11的第四行56位於第一按壓引導件16的下方的狀態下,使第一按壓引導件16向靠近相對於基板11的表面的垂線且相對於第四行56的垂線(例如圖2中的(B)以及圖3中的(A)所示的包覆線24)的方向移動。The first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 closer to the perpendicular line relative to the surface of the substrate 11 in a state where the fourth row 56 of the substrate 11 is located below the first pressing guide 16 And moves relative to the direction of the vertical line of the fourth row 56 (for example, the covering line 24 shown in (B) in FIG. 2 and (A) in FIG. 3 ).

以下進行詳細地說明。This is explained in detail below.

在基板11,設置有多個第三孔51排成一行而成的第三行52、多個第四孔57排成一行而成的第四行56,並且進一步地設置有三行以上的多個孔的行(參照圖6中的(A))。第四行56位於與第三行52平行的位置,第三行以下設置為彼此平行。分別在多個第三孔31插入第三包覆線53的一端53b,在分別距多個第三孔51有預定距離的基板11或分別在基板11上的多個第三電極連接第三包覆線53的另一端53a(參照圖1以及圖6中的(A)、(B))。分別在多個第四孔57插入第四包覆線58的一端,在分別距多個第四孔57有預定距離的基板11或分別在基板11上的多個第四電極連接第四包覆線58的另一端58a(參照圖2中的(A))。連接有第四包覆線58的另一端58a的基板11的表面位於比配置有第三行52以及第四行56的基板11的表面高的位置。也就是說,在基板11設置有臺階。The substrate 11 is provided with a third row 52 in which a plurality of third holes 51 are arranged in a line, a fourth row 56 in which a plurality of fourth holes 57 are arranged in a line, and further a plurality of three or more rows are provided. row of holes (refer to (A) in Figure 6). The fourth row 56 is positioned parallel to the third row 52, and the third row and below are arranged parallel to each other. One end 53b of the third covered wire 53 is inserted into the plurality of third holes 31 respectively, and the third package is connected to the substrate 11 at a predetermined distance from the plurality of third holes 51 or to a plurality of third electrodes respectively on the substrate 11. The other end 53a of the covered wire 53 (see (A) and (B) in FIG. 1 and FIG. 6 ). One end of the fourth covered wire 58 is inserted into the plurality of fourth holes 57 respectively, and the fourth covering is connected to the substrate 11 at a predetermined distance from the plurality of fourth holes 57 or to a plurality of fourth electrodes respectively on the substrate 11 The other end 58a of the line 58 (refer to (A) in Fig. 2). The surface of the substrate 11 to which the other end 58 a of the fourth covered wire 58 is connected is located higher than the surface of the substrate 11 on which the third row 52 and the fourth row 56 are arranged. That is, the substrate 11 is provided with a step.

如圖2中的(A)、(B)所示,按壓裝置15對已經穿過孔的(插入完畢的)第一包覆線14以及第二包覆線22進行按壓。按壓裝置15具有第一按壓引導件16、上下移動機構18以及第一按壓移動機構19。第一按壓引導件16在相對於第一包覆線14以及第二包覆線22交叉的方向上具有長度。另外上下移動機構18是使第一按壓引導件16沿上下方向17移動的機構(參照圖1)。另外第一按壓移動機構19是使第一按壓引導件16向靠近或遠離相對於基板11的表面的垂線且相對於第一行13的垂線的方向移動的機構。As shown in (A) and (B) of FIG. 2 , the pressing device 15 presses the first covered wire 14 and the second covered wire 22 that have passed through the holes (inserted). The pressing device 15 has a first pressing guide 16 , a vertical movement mechanism 18 , and a first pressing movement mechanism 19 . The first pressing guide 16 has a length in a direction intersecting the first covered wire 14 and the second covered wire 22 . The vertical movement mechanism 18 is a mechanism that moves the first pressing guide 16 in the vertical direction 17 (see FIG. 1 ). In addition, the first pressing movement mechanism 19 is a mechanism that moves the first pressing guide 16 in a direction closer to or farther away from a perpendicular to the surface of the substrate 11 and relative to a perpendicular to the first row 13 .

需要說明的是,在本實施方式中,使用了具有與第三行52平行的第四行56並且多個第四孔57排成一行而成的第四行56的基板11,但作為本實施方式的第三變形例,也能夠使用具有與第三行平行的第四行並且多個第四接合部排成一行而成的第四行的基板。在該情況下,第三變形例的按壓裝置是如下裝置,其分別在與設置於基板的第三行平行的第四行並且多個第四接合部排成一行而成的第四行中的多個第四接合部連接第四包覆線或第四導線的一端,相對於在分別距多個第四接合部有預定距離的基板或在基板上的多個第四電極連接第四包覆線或第四導線的另一端後的狀態的基板,按壓第三包覆線以及第四包覆線或第三導線以及第四導線。It should be noted that in this embodiment, the substrate 11 having the fourth row 56 parallel to the third row 52 and the fourth row 56 in which a plurality of fourth holes 57 are aligned is used. However, as this embodiment In a third modified example of the method, a substrate having a fourth row parallel to the third row and a fourth row in which a plurality of fourth bonding portions are aligned can be used. In this case, the pressing device according to the third modified example is a device in which each of the fourth rows is parallel to the third row provided on the substrate and the fourth row in which a plurality of fourth joint portions are aligned. A plurality of fourth bonding portions are connected to one end of a fourth covered wire or a fourth conductor, and the fourth covering is connected to a substrate or a plurality of fourth electrodes on the substrate that are respectively spaced from the plurality of fourth bonding portions at a predetermined distance. After the other end of the wire or the fourth wire is in the state of the substrate, the third covered wire and the fourth covered wire or the third wire and the fourth wire are pressed.

根據本實施方式,通過利用第一按壓引導件16按壓已經配置於基板11上圖2中的(A)、(B)所示的第一包覆線14以及第二包覆線22或圖6中的(A)、(B)所示的第三包覆線53以及第四包覆線58,能夠在使從毛細管25陸續放出的接下來的包覆線24穿過基板11的第二孔21或第四孔57時,防止第一包覆線14以及第二包覆線22或第三包覆線53以及第四包覆線58向該孔側傾倒。由此,能夠改善因插入完畢的包覆線(導線)的鼓起而使包覆線變得在基板的孔中無法穿過孔、因插入完畢的包覆線的鼓起而無法通過攝影機等進行孔的位置的識別。According to this embodiment, by using the first pressing guide 16 to press the first covered wire 14 and the second covered wire 22 shown in (A) and (B) of FIG. 2 that have been arranged on the substrate 11 or FIG. 6 The third covered wire 53 and the fourth covered wire 58 shown in (A) and (B) can pass the next covered wire 24 successively released from the capillary tube 25 through the second hole of the substrate 11 21 or the fourth hole 57, prevent the first covered wire 14 and the second covered wire 22 or the third covered wire 53 and the fourth covered wire 58 from falling to the side of the hole. This can improve the problem of the bulging of the inserted covered wire (conducting wire) causing the covered wire to be unable to pass through the hole in the board, and the bulging of the inserted covered wire making it impossible to pass through the camera, etc. Identify the location of the hole.

另外能夠消除試圖穿過的接下來的包覆線24與已經穿過孔的第一包覆線14以及第二包覆線22或第三覆線53以及第四包覆線58發生干涉。In addition, interference between the next covered wire 24 trying to pass through and the first covered wire 14 and the second covered wire 22 or the third covered wire 53 and the fourth covered wire 58 that have already passed through the hole can be eliminated.

需要說明的是,在本實施方式中,如圖1所示,使用能夠在毛細管25的周圍的旋轉的按壓裝置15,但可以並非是使按壓裝置15旋轉,而通過設置使XY載物台26旋轉的旋轉機構,使XY載物台26旋轉。It should be noted that in this embodiment, as shown in FIG. 1 , the pressing device 15 that can rotate around the capillary tube 25 is used. However, instead of rotating the pressing device 15 , the XY stage 26 may be arranged to rotate. The rotating rotation mechanism causes the XY stage 26 to rotate.

另外,在本實施方式中,如圖1所示,使用能夠在毛細管25的周圍旋轉的一個按壓裝置15,但也能夠如以下這樣進行變更來實施。In addition, in this embodiment, as shown in FIG. 1 , one pressing device 15 that can rotate around the capillary tube 25 is used, but it can also be implemented by changing it as follows.

圖7中的(A)、(B)是說明本實施方式的第一變形例的圖,圖7中的(B)是示意性地表示第一毛細管61、第二毛細管62、第二按壓引導件、第一按壓移動機構41以及第二按壓移動機構66的圖。圖7中的(A)是從上方觀察圖7中的(B)所示的第一毛細管61、第二毛細管62以及第二按壓引導件的俯視圖。圖7中的(A)、(B)所示的部分以外由於與本實施方式相同,因此省略說明。需要說明的是,在圖7中的(A)中示出了一體型按壓引導件63,但第一變形例的第二按壓引導件16使用與第一按壓引導件16相同的機構(參照圖6中的(A)、(B)),而並非一體型。(A) and (B) in FIG. 7 are diagrams illustrating the first modification of the present embodiment, and (B) in FIG. 7 schematically illustrates the first capillary tube 61 , the second capillary tube 62 , and the second pressing guide. , the first pressing and moving mechanism 41 and the second pressing and moving mechanism 66 . (A) in FIG. 7 is a top view of the first capillary tube 61 , the second capillary tube 62 and the second pressing guide shown in (B) in FIG. 7 . Parts other than those shown in (A) and (B) in FIG. 7 are the same as in the present embodiment, and therefore description is omitted. It should be noted that (A) in FIG. 7 shows an integrated pressing guide 63 , but the second pressing guide 16 of the first modification uses the same mechanism as the first pressing guide 16 (see FIG. 7 ). (A) and (B) in 6) are not integrated.

另外,第一按壓移動機構41具有氣缸43,該氣缸43具備與按壓引導件16連接的活塞42,另外第二按壓移動機構66具有氣缸65,該氣缸65具備與按壓引導件16連接的活塞64(參照圖4以及圖5)。In addition, the first pressing and moving mechanism 41 has a cylinder 43 including a piston 42 connected to the pressing guide 16 , and the second pressing and moving mechanism 66 has a cylinder 65 including a piston 64 connected to the pressing guide 16 (Refer to Figure 4 and Figure 5).

第一變形例是如下按壓裝置,其相對於分別距設置於圖2中的(A)所示的基板11上的第一行13有預定距離的圖6中的(A)所示的多個第三孔51排成一行而成的第三行52中的多個第三孔51插入第三包覆線53的一端53b,相對於分別距多個第三孔51有預定距離的基板11或分別在基板11上的多個第三電極連接有第三包覆線53的另一端53a後的狀態的基板11,按壓第三包覆線53。The first modification is a pressing device that is configured to hold a plurality of pressing devices shown in FIG. A plurality of third holes 51 in a third row 52 in which the third holes 51 are arranged in a row are inserted into one end 53 b of the third covered wire 53 , relative to the substrate 11 or The substrate 11 in a state where the other end 53 a of the third covered wire 53 is connected to each of the plurality of third electrodes on the substrate 11 presses the third covered wire 53 .

該按壓裝置具有:圖示的第二按壓引導件16,其在相對於圖6中的(A)所示的第三包覆線53交叉的方向上具有長度,使第三包覆線53向遠離第三行52的方向按壓;以及This pressing device has a second pressing guide 16 as shown in the figure, which has a length in a direction intersecting with the third covered wire 53 shown in (A) of FIG. 6 , so that the third covered wire 53 is directed toward Press away from the third row 52; and

圖7中的(B)所示的第二按壓移動機構66,其使第二按壓引導件16向靠近相對於基板11的表面的垂線且相對於第三行52的垂線的方向移動。在此,第二按壓引導件16具有與前述的第一按壓引導件同樣的結構。The second pressing movement mechanism 66 shown in (B) of FIG. 7 moves the second pressing guide 16 in a direction close to the perpendicular to the surface of the substrate 11 and relative to the perpendicular to the third row 52 . Here, the second pressing guide 16 has the same structure as the aforementioned first pressing guide.

圖1所示的上下移動機構18是使第二按壓引導件相對於基板11而沿上下方向移動的機構。The vertical movement mechanism 18 shown in FIG. 1 is a mechanism that moves the second pressing guide in the vertical direction relative to the substrate 11 .

也就是說,在第一變形例的按壓裝置中,具有兩組圖1所示的按壓裝置15以及毛細管25,如圖7中的(A)所示的第一毛細管61以及第二毛細管62那樣兩個毛細管配置為對置,圖1中未示出的毛細管中所使用的按壓裝置配置於與第一按壓裝置15相反的一側。That is, in the pressing device of the first modified example, there are two sets of the pressing device 15 and the capillary tube 25 shown in FIG. 1 , such as the first capillary tube 61 and the second capillary tube 62 shown in (A) of FIG. 7 The two capillary tubes are arranged to face each other, and the pressing device used in the capillary tube (not shown in FIG. 1 ) is arranged on the opposite side to the first pressing device 15 .

需要說明的是,在上述第一變形例中,使用具有距第一行13有預定距離的圖6中的(A)所示的多個第三孔51排成一行而成的第三行52的基板11,但作為相對於第一變形例的第四變形例,也能夠使用具有距第一行有預定距離的多個第三接合部排成一行而成的第三行的基板。在該情況下,第四變形例的按壓裝置是如下按壓裝置,其在分別距第一行有預定距離的多個第三接合部排成一行而成的第三行中的多個第三接合部連接有第三包覆線或第三導線的一端,相對於分別距多個第三接合部有預定距離的基板或分別在基板上的多個第三電極連接有第三包覆線或第三導線的另一端後的狀態的基板,按壓第三包覆線或第三導線。It should be noted that in the above-described first modification, a third row 52 having a plurality of third holes 51 shown in FIG. 6(A) arranged in a row at a predetermined distance from the first row 13 is used. However, as a fourth modification to the first modification, a substrate having a third row in which a plurality of third bonding portions are arranged in a line at a predetermined distance from the first row can also be used. In this case, the pressing device according to the fourth modified example is a pressing device in which a plurality of third joints in a third row in which a plurality of third joint portions are aligned at a predetermined distance from the first row are aligned. One end of the third covered wire or the third conductor is connected to the substrate at a predetermined distance from the plurality of third bonding portions or to a plurality of third electrodes respectively on the substrate. After the other end of the three wires is in the state of the substrate, press the third covered wire or the third wire.

另外,如圖6中的(A)所示,第一變形例的按壓裝置是如下裝置,其在分別與設置於基板11上的第三行52平行的第四行56並且多個第四孔57排成一行而成的第四行56中的多個第四孔57連接第四包覆線58的一端,相對於分別距多個第四孔57有預定距離的基板11或分別在基板11上的多個第四電極連接有第四包覆線58的另一端58a後的狀態的基板11,按壓第三包覆線53以及第四包覆線58。In addition, as shown in (A) of FIG. 6 , the pressing device according to the first modification is a device in which a fourth row 56 and a plurality of fourth holes are respectively provided in a fourth row 56 parallel to the third row 52 provided on the substrate 11 . The plurality of fourth holes 57 in the fourth row 56 formed by 57 are connected to one end of the fourth covered wire 58, relative to the substrate 11 which is a predetermined distance away from the plurality of fourth holes 57 or respectively on the substrate 11 The third covered wire 53 and the fourth covered wire 58 are pressed against the substrate 11 in a state where the other ends 58 a of the fourth covered wires 58 are connected to the plurality of fourth electrodes on the substrate 11 .

第二按壓引導件16是在相對於第四包覆線58交叉的方向上具有長度,對第三包覆線53以及第四包覆線58向遠離第三行52以及第四行56的方向按壓的機構。The second pressing guide 16 has a length in a direction intersecting the fourth covered wire 58 , and extends in a direction away from the third row 52 and the fourth row 56 of the third coated wire 53 and the fourth row 58 . Pressing mechanism.

第二按壓移動機構(例如圖7中的(A)所示的第二按壓移動機構66)是如下機構,其在使基板11的第四行56位於第二按壓引導件16的下方的狀態下,使第二按壓引導件16向靠近相對於基板11的表面的垂線且相對於第四行56的垂線((例如圖6中的(B)所示的包覆線24))的方向移動。The second pressing and moving mechanism (for example, the second pressing and moving mechanism 66 shown in (A) of FIG. 7 ) is a mechanism that positions the fourth row 56 of the substrate 11 below the second pressing guide 16 , the second pressing guide 16 is moved in a direction close to the perpendicular to the surface of the substrate 11 and relative to the perpendicular to the fourth row 56 (for example, the covering line 24 shown in (B) of FIG. 6 ).

需要說明的是,在上述第一變形例中,使用了具有與第三行52平行的第四行56並且多個第四孔57排成一行而成的第四行56的基板11,但作為相對於第一變形例的第四變形例,也能夠使用具有與第三行平行的第四行並且多個第四接合部排成一行而成的第四行的基板。在該情況下,第四變形例的按壓裝置是如下按壓裝置,其在分別與第三行平行的第四行並且多個第四接合部排成一行而成的第四行中的多個第四接合部連接第四包覆線或第四導線的一端,相對於分別距多個第四接合部有預定距離的基板或分別在基板上的多個第四電極的連接有第四包覆線或第四導線的另一端後的狀態的基板,按壓第三包覆線以及第四包覆線或第三導線以及第四導線。It should be noted that in the above-described first modification, the substrate 11 having the fourth row 56 parallel to the third row 52 and the fourth row 56 in which the plurality of fourth holes 57 are aligned is used. However, as In the fourth modification of the first modification, a substrate having a fourth row parallel to the third row and a fourth row in which a plurality of fourth bonding portions are aligned can also be used. In this case, the pressing device of the fourth modified example is a pressing device in which a plurality of fourth rows are respectively parallel to the third row and a plurality of fourth joint portions are aligned in a row. The four bonding parts are connected to one end of the fourth covered wire or the fourth conductor, and the fourth covered line is connected to a substrate that is a predetermined distance away from the plurality of fourth bonding parts or to a plurality of fourth electrodes respectively on the substrate. Or the substrate in a state behind the other end of the fourth wire, presses the third covered wire and the fourth covered wire or the third wire and the fourth wire.

在第一變形例中,使用了具有第一按壓引導件和第二按壓引導件的按壓裝置,但也能夠如以下這樣進行變更來實施。In the first modified example, a pressing device having a first pressing guide and a second pressing guide is used, but it can also be implemented with changes as follows.

圖7中的(A)是說明第二變形例的圖,且是表示使上述的第一按壓引導件和第二按壓引導件形成為一體的一體型按壓引導件63的俯視圖。該一體型按壓引導件63是平面形狀為矩形的按壓引導件63b。圖7中的(B)是圖7中的(A)所示的一體型按壓引導件63的剖視圖。但是,在圖7中的(A)中,示出第一毛細管61以及第二毛細管62,在圖7中的(B)中,在第一毛細管61以及第二毛細管62的基礎上,示出第一按壓移動機構41以及第二按壓移動機構66。(A) in FIG. 7 is a diagram illustrating the second modification, and is a plan view showing the integrated pressing guide 63 in which the above-mentioned first pressing guide and the second pressing guide are integrated. This integrated pressing guide 63 is a pressing guide 63b having a rectangular planar shape. (B) in FIG. 7 is a cross-sectional view of the integrated pressing guide 63 shown in (A) in FIG. 7 . However, in (A) of FIG. 7 , the first capillary tube 61 and the second capillary tube 62 are shown. In (B) of FIG. 7 , in addition to the first capillary tube 61 and the second capillary tube 62 , it is shown that The first pressing and moving mechanism 41 and the second pressing and moving mechanism 66 .

另外,一體型按壓引導件63a的平面形狀可以是環狀(參照圖8中的(A)、(B))。In addition, the planar shape of the integrated pressing guide 63 a may be annular (see (A) and (B) in FIG. 8 ).

另外,第一按壓移動機構41具有氣缸43,該氣缸43具備與一體型按壓引導件63連接的活塞42。該活塞42形成為能夠通過控制部自如地控制與一體型按壓引導件63的連接以及分離。另外第二按壓移動機構66具有氣缸65,該氣缸65具備與一體型按壓引導件63連接的活塞64。該活塞64形成為能夠通過控制部自如地控制與一體型按壓引導件63的連接以及分離。In addition, the first pressing movement mechanism 41 has an air cylinder 43 including a piston 42 connected to the integrated pressing guide 63 . This piston 42 is formed so that the connection and separation with the integrated pressing guide 63 can be freely controlled by a control part. In addition, the second pressing movement mechanism 66 has an air cylinder 65 equipped with a piston 64 connected to the integrated pressing guide 63 . This piston 64 is formed so that the connection and separation with the integrated pressing guide 63 can be freely controlled by a control part.

上述的一體型按壓引導件63、63a在通過第一按壓移動機構41使對象移動時不與第三移動機構66連接。該情況下,通過使用第一毛細管61,能夠進行圖1以及圖2中的(A)、(B)所示那樣的動作。The above-described integrated pressing guides 63 and 63a are not connected to the third moving mechanism 66 when the object is moved by the first pressing and moving mechanism 41 . In this case, by using the first capillary tube 61 , operations shown in (A) and (B) in FIGS. 1 and 2 can be performed.

另外一體型按壓引導件63、63a在通過第三移動機構66使對象移動時不與第一按壓移動機構41連接。在該情況下,通過使用第三毛細管66,能夠進行圖1以及圖6中的(A)、(B)所示那樣的動作。When the object is moved by the third moving mechanism 66 , the integrated pressing guides 63 and 63 a are not connected to the first pressing moving mechanism 41 . In this case, by using the third capillary tube 66 , operations shown in (A) and (B) in FIG. 1 and FIG. 6 can be performed.

具備第一變形例的第一按壓移動機構41以及第二按壓移動機構66、第一毛細管61以及第二毛細管62、第一按壓引導件16以及第二按壓引導件16的配線裝置具有圖1所示的頭23,但與圖1所示的頭23不同的點是在圖7中的(A)、(B)以及圖8中的(A)、(B)所示的那樣的配置中具備第一按壓移動機構41以及第二按壓移動機構66、第一毛細管61以及第二毛細管62、第一按壓引導件以及第二按壓引導件(未圖示)。The wiring device including the first pressing movement mechanism 41 and the second pressing movement mechanism 66, the first capillary tube 61 and the second capillary tube 62, the first pressing guide 16 and the second pressing guide 16 according to the first modified example has the structure shown in FIG. 1 The head 23 shown in Fig. 1 is different from the head 23 shown in Fig. 1 in that it is provided with the arrangement shown in (A) and (B) in Fig. 7 and (A) and (B) in Fig. 8 The first pressing movement mechanism 41 and the second pressing movement mechanism 66, the first capillary tube 61 and the second capillary tube 62, the first pressing guide and the second pressing guide (not shown).

在頭23內,配置有使包覆線陸續放出的第一毛細管61、第一按壓引導件、第一按壓移動機構41、使包覆線陸續放出的第二毛細管62、第二按壓引導件、第二按壓移動機構66。The head 23 is provided with a first capillary tube 61 for successively releasing the coated wire, a first pressing guide, a first pressing movement mechanism 41, a second capillary tube 62 for successively releasing the coated wire, and a second pressing guide. The second press movement mechanism 66 is pressed.

第一按壓移動機構41是使第一按壓引導件向第一毛細管61的前端或第一毛細管61的下方移動的機構。The first pressing movement mechanism 41 is a mechanism that moves the first pressing guide toward the front end of the first capillary tube 61 or below the first capillary tube 61 .

第二按壓移動機構66是使第二按壓引導件向第二毛細管62的前端或第二毛細管62的下方移動的機構。The second pressing movement mechanism 66 is a mechanism that moves the second pressing guide toward the front end of the second capillary tube 62 or below the second capillary tube 62 .

上下移動機構17是使頭23沿Z軸方向17移動的機構。The vertical movement mechanism 17 is a mechanism that moves the head 23 in the Z-axis direction 17 .

需要說明的是,在上述第二變形例中,在頭23內,配置有使包覆線陸續放出的第一毛細管61、第一按壓引導件、第一按壓移動機構41、使包覆線陸續放出的第二毛細管62,作為相對於第二變形例的第四變形例。在頭23內,也能夠配置使包覆線或導線陸續放出的第一毛細管61、第一按壓引導件、第一按壓移動機構41、使包覆線或導線陸續放出的第二毛細管62。It should be noted that in the above-mentioned second modification, the first capillary tube 61 for successively releasing the covered wire, the first pressing guide, and the first pressing and moving mechanism 41 are arranged in the head 23 . The discharged second capillary tube 62 serves as a fourth modification relative to the second modification. The head 23 may also be provided with a first capillary tube 61 for successively releasing a covered wire or a conductive wire, a first pressing guide, a first pressing movement mechanism 41, and a second capillary tube 62 for successively releasing a covered wire or a conductive wire.

具備第二變形例的第一按壓移動機構41以及第二按壓移動機構66、第一毛細管61以及第二毛細管62、一體型按壓引導件63、63a的配線裝置具有圖1所示的頭23,但與圖1所示的頭23不同的點是在如圖7中的(A)、(B)以及圖8中的(A)、(B)所示的那樣的配置中具備第一按壓移動機構41以及第二按壓移動機構66、第一毛細管61以及第二毛細管62、一體型按壓引導件63、63a。The wiring device including the first pressing movement mechanism 41 and the second pressing movement mechanism 66 of the second modification, the first capillary tube 61 and the second capillary tube 62, and the integrated pressing guides 63 and 63a has the head 23 shown in FIG. 1, However, the point that is different from the head 23 shown in FIG. 1 is that it is equipped with the first pressing movement in the arrangement shown in (A) and (B) in FIG. 7 and (A) and (B) in FIG. 8 The mechanism 41 and the second pressing movement mechanism 66, the first capillary tube 61 and the second capillary tube 62, and the integrated pressing guides 63 and 63a.

在頭23內,配置有使包覆線陸續放出的第一毛細管61、一體型按壓引導件63和63a、第一按壓移動機構41、使包覆線陸續放出的第二毛細管62、第二按壓移動機構66。The head 23 is provided with a first capillary tube 61 for successively releasing the coated wire, integrated pressing guides 63 and 63a, a first pressing movement mechanism 41, a second capillary tube 62 for successively releasing the coated wire, and a second pressing unit 62 for successively releasing the coated wire. Moving mechanism 66.

第一按壓移動機構41是使一體型按壓引導件63、63a向第一毛細管61的前端或第一毛細管61的下方移動的機構。The first pressing movement mechanism 41 is a mechanism that moves the integrated pressing guides 63 and 63 a toward the front end of the first capillary tube 61 or below the first capillary tube 61 .

第二按壓移動機構66是使一體型按壓引導件63、63a向第二毛細管62的前端或第二毛細管62的下方移動的機構。The second pressing movement mechanism 66 is a mechanism that moves the integrated pressing guides 63 and 63 a toward the front end of the second capillary tube 62 or below the second capillary tube 62 .

上下移動機構17是使頭23沿Z軸方向17移動的機構。The vertical movement mechanism 17 is a mechanism that moves the head 23 in the Z-axis direction 17 .

第一至第四變形例中也能夠獲得與本實施方式同樣的效果。The same effects as those of the present embodiment can also be obtained in the first to fourth modified examples.

另外,也能夠將第一至第四變形例彼此組合來實施。 (第二實施方式) In addition, the first to fourth modifications can also be implemented in combination with each other. (Second Embodiment)

圖9是說明使用圖1所示的配線裝置組裝配線的方法的動作的流程圖。圖10~圖15是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。FIG. 9 is a flowchart illustrating the operation of a method of assembling a wiring device using the wiring device shown in FIG. 1 . 10 to 15 are diagrams illustrating a method of assembling an assembly line while pressing a conventional covered wire according to one embodiment of the present invention.

首先,如圖10所示,使毛細管25向第二孔21的上方移動,使第一按壓引導件16向靠近從毛細管25的下方的毛細管25陸續放出的包覆線24的方向移動(圖9所示的按壓引導件設置S1)。First, as shown in FIG. 10 , the capillary tube 25 is moved above the second hole 21 , and the first pressing guide 16 is moved in a direction closer to the covered wire 24 that is successively discharged from the capillary tube 25 below the capillary tube 25 ( FIG. 9 Press guide setup shown S1).

接下來,如圖11以及圖2中的(B)所示,使頭23下降並使毛細管25以及第一按壓引導件16向下方移動,通過第一按壓引導件16而一邊按壓第一包覆線14一邊將包覆線24(導線)的前端插入第二孔21(圖9的S2)。此時,能夠防止現有的第一包覆線14與試圖插入第二孔21的包覆線24發生干涉。Next, as shown in FIG. 11 and FIG. 2(B) , the head 23 is lowered and the capillary 25 and the first pressing guide 16 are moved downward, and the first coating is pressed by the first pressing guide 16 Insert the front end of the covered wire 24 (conductor) into the second hole 21 (S2 in Figure 9) while holding the wire 14. At this time, interference between the existing first covered wire 14 and the covered wire 24 trying to be inserted into the second hole 21 can be prevented.

接下來,如圖12所示,將插入至第二孔21的包覆線24向基板11的下方導入,且將包覆線24從毛細管25陸續放出而使毛細管25以及第一按壓引導件16上升,並且使第一按壓引導件16向從如圖3中的(B)或圖4所示那樣的毛細管25退避後的位置移動(圖9的S3)。使第一按壓引導件16退避的時機只要退避至使毛細管25上升即可。Next, as shown in FIG. 12 , the covered wire 24 inserted into the second hole 21 is introduced below the substrate 11 , and the covered wire 24 is successively released from the capillary tube 25 so that the capillary tube 25 and the first pressing guide 16 The first pressing guide 16 is raised and moved to a position retreated from the capillary tube 25 as shown in FIG. 3(B) or FIG. 4 (S3 in FIG. 9). The timing for retracting the first pressing guide 16 only requires that the capillary tube 25 is raised.

接下來,如圖13所示,通過X軸移動機構29使載置有基板11的XY載物台26沿X方向27水平移動,使頭23下降並在毛細管25的前端使包覆線24(導線)的另一端24b與基板11或基板上的電極接合(圖9的S4)。此時,由於第一按壓引導件16被退避,因此能夠防止與包覆線24發生干涉。Next, as shown in FIG. 13 , the XY stage 26 on which the substrate 11 is mounted is moved horizontally in the X direction 27 by the X-axis moving mechanism 29 to lower the head 23 and move the coated wire 24 ( The other end 24b of the wire) is bonded to the substrate 11 or an electrode on the substrate (S4 in Fig. 9). At this time, since the first pressing guide 16 is retracted, interference with the covered wire 24 can be prevented.

接下來,如圖14所示,使頭23上升並使毛細管25上升,切斷包覆線24(導線)(圖9的S5)。Next, as shown in FIG. 14 , the head 23 is raised, the capillary tube 25 is raised, and the covered wire 24 (conducting wire) is cut (S5 in FIG. 9 ).

接下來,如圖15所示,通過X軸移動機構29使載置有基板11的XY載物台26沿X方向27水平移動,使毛細管25以及第一按壓引導件16向插入包覆線的基板11的接下來的孔的上方移動(圖9的S6)。Next, as shown in FIG. 15 , the XY stage 26 on which the substrate 11 is mounted is moved horizontally in the X direction 27 by the The upper portion of the next hole in the substrate 11 moves (S6 in Fig. 9).

之後,通過重複圖10至圖15所示的動作,能夠組裝配線。Thereafter, by repeating the operations shown in FIGS. 10 to 15 , the assembly line can be assembled.

在本實施方式中也能夠獲得與第一實施方式同樣的效果。 (第三實施方式) The same effects as those of the first embodiment can also be obtained in this embodiment. (Third Embodiment)

圖16以及圖17是用於說明本發明的一個方式所涉及的配線裝置的示意圖。該配線裝置具備按壓裝置。16 and 17 are schematic diagrams for explaining a wiring device according to one embodiment of the present invention. This wiring device is equipped with a pressing device.

基於本實施方式的配線裝置是利用包覆線105對在第一基板101設置為多個行狀的第一連接點102各自、與距第一連接點102有預定距離的設置於第二基板103的多個第二連接點104各自進行佈線的裝置。The wiring device according to this embodiment uses the covered wires 105 to pair each of the first connection points 102 provided in a plurality of rows on the first substrate 101 and to provide a predetermined distance from the first connection point 102 on the second substrate 103 . A device for wiring each of the plurality of second connection points 104 .

該配線裝置具備使包覆線105陸續放出的能夠升降的毛細管、配置於該毛細管的附近的能夠升降的引導件、使該毛細管升降的第一升降機構、以及使該引導升降的第二升降機構。This wiring device includes an elevating capillary tube for successively releasing the covered wire 105, an elevating and lowering guide disposed near the capillary tube, a first lifting mechanism for elevating and lowering the capillary tube, and a second elevating and lowering mechanism for elevating and lowering the guide. .

如圖16所示,在通過該配線裝置在至少第一連接點102的第一行佈設包覆線105後,在第一連接點102的第二行佈設包覆線105時,通過利用第二升降機構使引導下降而使對第一行所佈設的包覆線105向遠離第二行的方向移動。由此,能夠一邊按壓第一行的包覆線105一邊將包覆線105連接於第二行的第一連接點102。As shown in FIG. 16 , after the covered wires 105 are laid in at least the first row of the first connection points 102 through the wiring device, when the covered wires 105 are laid in the second row of the first connection points 102 , by using the second The lifting mechanism lowers the guide to move the covered wires 105 laid out in the first row in a direction away from the second row. Thereby, the covered wire 105 in the first row can be connected to the first connection point 102 in the second row while pressing the coated wire 105 in the first row.

另外,在通過該配線裝置至少在第二連接點104的第一行佈設包覆線105後,在第二連接點104的第二行佈設包覆線105時,通過利用第二升降機構使引導下降而使對第一行所佈設的包覆線105向遠離第二行的方向移動。由此,能夠一邊按壓第一行的包覆線105一邊將包覆線105連接於第二行的第二連接點104。In addition, after the covered wires 105 are laid out in at least the first row of the second connection points 104 through the wiring device, when the covered wires 105 are laid in the second row of the second connection points 104, the guide is guided by using the second lifting mechanism. Lowering causes the covered wires 105 laid out in the first row to move away from the second row. Thereby, it is possible to connect the covered wires 105 to the second connection points 104 in the second row while pressing the covered wires 105 in the first row.

接下來,如圖16所示的箭頭106那樣使第一基板101旋轉180°。由此,如圖17所示,在利用包覆線105將第一基板101的第一連接點102和第二基板103的第二連接點104連接後的狀態下使第一基板101和第二基板103對置。Next, the first substrate 101 is rotated 180° as shown by arrow 106 in FIG. 16 . Therefore, as shown in FIG. 17 , in a state where the first connection point 102 of the first substrate 101 and the second connection point 104 of the second substrate 103 are connected by the covered wire 105 , the first substrate 101 and the second substrate 101 are connected. The substrates 103 face each other.

之後,利用模具樹脂(未圖示)對第一基板101與第二基板103之間以及包覆線105進行密封。由此,將第一基板101和第二基板103形成為一體。After that, mold resin (not shown) is used to seal the space between the first substrate 101 and the second substrate 103 and the covered wire 105 . Thereby, the first substrate 101 and the second substrate 103 are integrated.

需要說明的是,通過適當地組合第一至第三實施方式,也能夠通過各種的方式的實施方式來實施。 (附記) It should be noted that by appropriately combining the first to third embodiments, various embodiments can be implemented. (P.S.)

以下對本發明的其他的各種的方式進行說明。Various other aspects of the present invention will be described below.

[1]一種按壓裝置,其分別在設置於基板上的多個孔排成一行而成的行中的所述多個孔插入包覆線的一端,相對於在分別距所述多個孔有預定距離的所述基板或分別在所述基板上的多個第一電極連接所述第一包覆線的另一端後的狀態的基板,按壓所述包覆線,其特徵在於,[1] A pressing device that inserts one end of a covered wire into a plurality of holes arranged in a row on a substrate, with respect to the plurality of holes spaced apart from each other. The substrate at a predetermined distance or the substrate in a state where a plurality of first electrodes respectively on the substrate are connected to the other end of the first covered wire, pressing the covered wire, is characterized in that:

所述按壓裝置具有用於按壓在分別所述多個孔插入一端的包覆線,將新的包覆線插入孔中的按壓引導機構。The pressing device has a pressing guide mechanism for pressing the coated wire at one end inserted into the plurality of holes and inserting a new coated wire into the hole.

[2]一種按壓裝置,其在設置於基板上的多個接合部排成一行而成的行中的所述多個接合部分別連接包覆線或導線的一端,相對於在分別距所述多個接合部有預定距離的所述基板或分別在所述基板上的多個電極連接有所述包覆線或所述導線的另一端後的狀態的基板,按壓所述包覆線或所述導線,其特徵在於,[2] A pressing device in which one end of a covered wire or a conductive wire is connected to each of the plurality of joints in a row in which a plurality of joints provided on a substrate are arranged in a row, and the plurality of joints are arranged at a distance from each other. The substrate with a plurality of bonding portions at a predetermined distance or a substrate in a state where the other end of the covered wire or the conductor is connected to a plurality of electrodes on the substrate, and the covered wire or the conductor is pressed The above-mentioned conductor is characterized in that,

所述按壓裝置具有用於按壓一端與所述多個接合部分別連接的包覆線或導線,將新的包覆線或導線連接與接合部的按壓引導機構。The pressing device has a pressing guide mechanism for pressing the coated wire or wire having one end connected to each of the plurality of joints, and for connecting the new covered wire or wire to the joint.

[3]一種按壓裝置,其分別在設置於基板上的多個第一孔排成一行而成的第一行中的所述多個第一孔插入第一包覆線的一端,相對於在分別距所述多個第一孔有預定距離的所述基板或分別在所述基板上的多個第一電極連接有所述第一包覆線的另一端後的狀態的基板,按壓所述第一包覆線,其特徵在於,[3] A pressing device that inserts one end of a first covered wire into a first row of a plurality of first holes arranged in a line on a substrate, relative to the The substrate with a predetermined distance from the plurality of first holes or a substrate with a plurality of first electrodes on the substrate connected to the other end of the first covered wire, press the The first covered wire is characterized by:

所述按壓裝置具有:The pressing device has:

第一按壓引導件,其在相對於所述第一包覆線交叉的方向上具有長度,將所述第一包覆線向遠離所述第一行的方向按壓;a first pressing guide having a length in a direction intersecting with the first covering line and pressing the first covering line in a direction away from the first row;

上下移動機構,其使所述第一按壓引導件相對於所述基板沿上下方向移動;以及An up-and-down movement mechanism that moves the first pressing guide in the up-and-down direction relative to the substrate; and

第一按壓移動機構,其使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第一行的垂線的方向移動。A first pressing movement mechanism moves the first pressing guide in a direction close to a perpendicular to the surface of the substrate and relative to a perpendicular to the first row.

[4]在上述[3]中的按壓裝置的基礎上,其特徵在於,[4] Based on the pressing device in [3] above, it is characterized in that:

所述第一按壓移動機構具有:棒狀構件,其一端連接於所述第一按壓引導件、或一體地與所述第一按壓引導件相連;凸輪從動件,其設置於所述棒狀構件的另一端;板凸輪,其配置為與所述凸輪從動件接觸;連接構件,其一端以能夠旋轉的方式連接於所述棒狀構件;活塞,其保持所述連接構件的另一端;以及氣缸,其使所述活塞沿上下方向移動,The first pressing movement mechanism has: a rod-shaped member, one end of which is connected to the first pressing guide, or is integrally connected to the first pressing guide; and a cam follower, which is provided on the rod-shaped member. the other end of the member; a plate cam configured to contact the cam follower; a connecting member with one end rotatably connected to the rod-shaped member; a piston holding the other end of the connecting member; and a cylinder that moves said piston in an up-and-down direction,

通過使所述活塞沿上下方向移動而使所述凸輪從動件一邊與所述板凸輪接觸一邊移動,由此使所述第一按壓引導件沿遠離或靠近相對於所述第一行的垂線的方向移動。By moving the piston in the up and down direction, the cam follower moves while contacting the plate cam, thereby moving the first pressing guide away from or closer to a vertical line with respect to the first row. move in the direction.

[5]在上述[3]中的按壓裝置的基礎上,其特徵在於,[5] Based on the pressing device in [3] above, it is characterized in that:

所述第一按壓移動機構具有氣缸,該氣缸具備與所述第一按壓引導件連接的活塞,所述氣缸是使所述活塞沿相對於與所述第一行相對的垂線傾斜的方向往復移動的機構。The first pressing movement mechanism has a cylinder having a piston connected to the first pressing guide, and the cylinder reciprocates the piston in a direction inclined with respect to a vertical line opposite to the first row. of institutions.

[6]在上述[3]至[5]中任一項中的按壓裝置的基礎上,其特徵在於,[6] The pressing device according to any one of [3] to [5] above, characterized in that:

所述按壓裝置分別在設置於所述基板上的與所述第一行平行的第二行並且多個第二孔排成一行而成的所述第二行中的所述多個第二孔的插入第二包覆線的一端,相對於在分別距所述多個第二孔有預定距離的所述基板或分別在所述基板上的多個第二電極連接有所述第二包覆線的另一端後的狀態的基板,按壓所述第一包覆線以及所述第二包覆線,The pressing devices are respectively disposed on the substrate in a second row parallel to the first row and the plurality of second holes in the second row are arranged in a line. One end of the second coated wire is inserted, and the second coated wire is connected to the substrate at a predetermined distance from the plurality of second holes or to a plurality of second electrodes respectively on the substrate. The substrate in the state behind the other end of the wire presses the first covered wire and the second covered wire,

所述第一按壓引導件是在相對於所述第二包覆線交叉的方向上具有長度,將所述第一包覆線以及所述第二包覆線向遠離所述第一行以及所述第二行的方向按壓的機構,The first pressing guide has a length in a direction crossing the second covered line, and moves the first covered line and the second covered line away from the first row and the first covered line. Describe the direction of the second row of the pressing mechanism,

所述第一按壓移動機構使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第二行的垂線的方向移動的機構。The first pressing movement mechanism is a mechanism that moves the first pressing guide in a direction closer to a perpendicular to the surface of the substrate and relative to a perpendicular to the second row.

[7]在上述[3]至[6]中任一項中的按壓裝置的基礎上,其特徵在於,[7] The pressing device according to any one of [3] to [6] above, characterized in that:

所述按壓裝置分別在距設置於所述基板上的所述第一行有預定距離的多個第三孔排成一行而成的第三行中的所述多個第三孔插入第三包覆線的一端,相對於在分別距所述多個第三孔有預定距離的所述基板或分別在所述基板上的多個第三電極連接有所述第三包覆線的另一端後的狀態的基板,按壓所述第三包覆線,The pressing device inserts a third package into the plurality of third holes in a third row formed by arranging a plurality of third holes at a predetermined distance from the first row on the substrate. One end of the covered wire is connected to the other end of the third covered wire relative to the substrate at a predetermined distance from the plurality of third holes or a plurality of third electrodes respectively on the substrate. state of the substrate, pressing the third covered wire,

所述按壓裝置具有載置所述基板的XY載物台,The pressing device has an XY stage on which the substrate is placed,

所述按壓裝置具有使所述XY載物台沿X方向移動的X軸移動機構,The pressing device has an X-axis moving mechanism that moves the XY stage in the X direction,

所述按壓裝置具有使所述XY載物台沿Y方向移動的Y軸移動機構,The pressing device has a Y-axis moving mechanism that moves the XY stage in the Y direction,

所述按壓裝置具有使所述第一按壓引導件以及所述第一按壓移動機構在相對於所述基板的表面的垂線的周圍旋轉的旋轉機構,The pressing device has a rotation mechanism that rotates the first pressing guide and the first pressing movement mechanism about a perpendicular line relative to a surface of the substrate,

所述第一按壓引導件是在相對於所述第三包覆線交叉的方向上具有長度,將所述第三包覆線向遠離所述第三行的方向按壓的機構,The first pressing guide has a length in a direction intersecting with the third covering line, and is a mechanism for pressing the third covering line in a direction away from the third row,

所述第一按壓移動機構是在使所述基板的所述第三行位於所述第一按壓引導件的下方的狀態下,使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第三行的垂線的方向移動的機構。The first pressing movement mechanism moves the first pressing guide closer to the surface relative to the substrate in a state where the third row of the substrate is located below the first pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the third row.

[8]在上述[7]中的按壓裝置的基礎上,其特徵在於,[8] Based on the pressing device in [7] above, it is characterized in that:

所述按壓裝置分別在設置於所述基板上的與所述第三行平行的第四行並且多個第四孔排成一行而成的所述第四行中的所述多個第四孔插入第四包覆線的一端,相對於在分別距所述多個第四孔有預定距離的所述基板或分別在所述基板上的多個第四電極連接有所述第四包覆線的另一端後的狀態的基板,按壓所述第三包覆線以及所述第四包覆線,The pressing devices are respectively disposed on the substrate in a fourth row parallel to the third row and the plurality of fourth holes in the fourth row are arranged in a line. One end of the fourth covered wire is inserted, and the fourth covered wire is connected with respect to the substrate at a predetermined distance from the plurality of fourth holes or a plurality of fourth electrodes respectively on the substrate. After the other end of the substrate is in the state, press the third covered line and the fourth covered line,

所述第一按壓引導件是在相對於所述第四包覆線交叉的方向上具有長度,將所述第三包覆線以及所述第四包覆線向遠離所述第三行以及所述第四行的方向按壓的機構,The first pressing guide has a length in a direction crossing the fourth covering line, and moves the third covering line and the fourth covering line away from the third row and the Describe the direction of the fourth row of the pressing mechanism,

所述第一按壓移動機構是在使所述基板的所述第四行位於所述第一按壓引導件的下方的狀態下,使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第四行的垂線的方向移動的機構。The first pressing movement mechanism moves the first pressing guide closer to the surface of the substrate in a state where the fourth row of the substrate is located below the first pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the fourth row.

[9]一種配線裝置,其特徵在於,[9] A wiring device characterized by:

所述配線裝置具備上述[3]至[8]中任一項所記載的按壓裝置,The wiring device includes the pressing device according to any one of [3] to [8] above,

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使包覆線陸續放出的毛細管、所述第一按壓引導件以及所述第一按壓移動機構,In the head, a capillary tube for successively releasing the covered wire, the first pressing guide and the first pressing movement mechanism are arranged,

所述第一按壓移動機構是使所述第一按壓引導件向所述毛細管的側方、上方或下方移動的機構,The first pressing movement mechanism is a mechanism that moves the first pressing guide to the side, above or below the capillary tube,

所述上下移動機構是使所述頭向Z軸方向移動的機構,The up-and-down movement mechanism is a mechanism that moves the head in the Z-axis direction,

所述配線裝置具有載置所述基板的XY載物台,The wiring device has an XY stage on which the substrate is placed,

所述配線裝置具有使所述XY載物台沿X方向移動的X軸移動機構,The wiring device has an X-axis moving mechanism that moves the XY stage in the X direction,

所述配線裝置具有使所述XY載物台沿Y方向移動的Y軸移動機構。The wiring device has a Y-axis moving mechanism that moves the XY stage in the Y direction.

[10]在上述[3]至[9]中任一項中的按壓裝置的基礎上,[10] On the basis of the pressing device in any one of the above [3] to [9],

所述第一按壓引導件具有環狀或矩形的平面形狀。The first pressing guide has an annular or rectangular planar shape.

[11]在上述[3]至[6]中任一項中的按壓裝置的基礎上,其特徵在於,[11] The pressing device according to any one of [3] to [6] above, characterized in that:

所述按壓裝置分別在距設置於所述基板上的所述第一行有預定距離的多個第三孔排成一行而成的第三行中的所述多個第三孔插入第三包覆線的一端,相對於在分別距所述多個第三孔有預定距離的所述基板或分別在所述基板上的多個第三電極連接有所述第三包覆線的另一端後的狀態的基板,按壓所述第三包覆線,The pressing device inserts a third package into the plurality of third holes in a third row formed by arranging a plurality of third holes at a predetermined distance from the first row on the substrate. One end of the covered wire is connected to the other end of the third covered wire relative to the substrate at a predetermined distance from the plurality of third holes or a plurality of third electrodes respectively on the substrate. state of the substrate, pressing the third covered wire,

所述按壓裝置具有:The pressing device has:

XY載物台,其載置所述基板;XY stage, which carries the substrate;

X軸移動機構,其使所述XY載物台沿X方向移動;X-axis moving mechanism, which moves the XY stage along the X direction;

Y軸移動機構,其使所述XY載物台沿Y方向移動;Y-axis moving mechanism, which moves the XY stage along the Y direction;

第二按壓引導件,其在相對於所述第三包覆線交叉的方向上具有長度,將所述第三包覆線向遠離所述第三行的方向按壓;以及a second pressing guide having a length in a direction intersecting with the third covering line, pressing the third covering line in a direction away from the third row; and

第二按壓移動機構,其使所述第二按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第三行的垂線的方向移動,a second pressing movement mechanism that moves the second pressing guide in a direction closer to a perpendicular to the surface of the substrate and relative to a perpendicular to the third row,

所述上下移動機構是使所述第二按壓引導件相對於所述基板而沿上下方向移動的機構。The vertical movement mechanism is a mechanism that moves the second pressing guide in the vertical direction relative to the substrate.

[12]在上述[11]中的按壓裝置的基礎上,其特徵在於,[12] Based on the pressing device in [11] above, it is characterized in that:

所述按壓裝置分別在設置於所述基板上的與所述第三行平行的第四行並且多個第四孔排成一行而成的所述第四行中的所述多個第四孔的分別插入第四包覆線的一端,相對於在分別距所述多個第四孔有預定距離的所述基板或分別在所述基板上的多個第四電極連接有所述第四包覆線的另一端後的狀態的基板,按壓所述第三包覆線以及所述第四包覆線,The pressing devices are respectively disposed on the substrate in a fourth row parallel to the third row and the plurality of fourth holes in the fourth row are arranged in a line. One end of the fourth covered wire is respectively inserted, and the fourth package is connected to the substrate at a predetermined distance from the plurality of fourth holes or to a plurality of fourth electrodes respectively on the substrate. The substrate in the state behind the other end of the covered wire presses the third covered wire and the fourth covered wire,

所述第二按壓引導件是在相對於所述第四包覆線交叉的方向上具有長度,將所述第三包覆線以及所述第四包覆線向遠離所述第三行以及所述第四行的方向按壓的機構,The second pressing guide has a length in a direction intersecting with the fourth covering line, and moves the third covering line and the fourth covering line away from the third row and the Describe the direction of the fourth row of the pressing mechanism,

所述第二按壓移動機構是在使所述基板的所述第四行位於所述第二按壓引導件的下方的狀態下,使所述第二按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第四行的垂線的方向移動的機構。The second pressing movement mechanism moves the second pressing guide closer to the surface of the substrate in a state where the fourth row of the substrate is located below the second pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the fourth row.

[13]在上述[11]或[12]中的按壓裝置的基礎上,其特徵在於,[13] Based on the pressing device in [11] or [12] above, it is characterized in that:

所述按壓裝置是使所述第一按壓引導件和所述第二按壓引導件形成一體的一體型按壓引導件,The pressing device is an integrated pressing guide in which the first pressing guide and the second pressing guide are integrated,

所述一體型按壓引導件具有環狀或矩形的平面形狀,The integrated pressing guide has an annular or rectangular planar shape,

所述一體型按壓引導件在借助所述第一按壓移動機構而移動時不與所述第三移動機構連接,The integrated pressing guide is not connected to the third moving mechanism when moving by the first pressing moving mechanism,

所述一體型按壓引導件在借助所述第三移動機構而移動時不與所述第一按壓移動機構連接。The integrated pressing guide is not connected to the first pressing moving mechanism when moving by the third moving mechanism.

[14]一種配線裝置,其特徵在於,[14] A wiring device, characterized in that:

所述配線裝置具備上述[11]或[12]所記載的按壓裝置,The wiring device includes the pressing device described in [11] or [12] above,

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使包覆線陸續放出的第一毛細管、所述第一按壓引導件、所述第一按壓移動機構、使包覆線陸續放出的第二毛細管、所述第二按壓引導件、所述第二按壓移動機構,In the head, a first capillary tube for successively releasing the coated wire, the first pressing guide, the first pressing movement mechanism, a second capillary tube for successively releasing the coated wire, and the second capillary tube for successively releasing the coated wire are arranged. the pressing guide and the second pressing movement mechanism,

所述第一按壓移動機構是使所述第一按壓引導件向所述第一毛細管的前端或所述第一毛細管的下方移動的機構,The first pressing movement mechanism is a mechanism that moves the first pressing guide toward the front end of the first capillary tube or below the first capillary tube,

所述第二按壓移動機構是使所述第二按壓引導件向所述第二毛細管的前端或所述第二毛細管的下方移動的機構,The second pressing movement mechanism is a mechanism that moves the second pressing guide toward the front end of the second capillary tube or below the second capillary tube,

所述上下移動機構是使所述頭沿Z軸方向移動的機構。The vertical movement mechanism is a mechanism that moves the head in the Z-axis direction.

[15]一種配線裝置,其特徵在於,[15] A wiring device, characterized in that:

所述配線裝置具備上述[13]所記載的按壓裝置,The wiring device includes the pressing device described in [13] above,

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使包覆線陸續放出的第一毛細管、所述一體型按壓引導件、所述第一按壓移動機構、使包覆線陸續放出的第二毛細管、所述第二按壓移動機構,In the head, a first capillary tube for successively releasing the coated wire, the integrated pressing guide, the first pressing movement mechanism, a second capillary tube for successively releasing the coated wire, and the second capillary tube for successively releasing the coated wire are arranged. Press the moving mechanism,

所述第一按壓移動機構是使所述一體型按壓引導件向所述第一毛細管的前端或所述第一毛細管的下方移動的機構,The first pressing movement mechanism is a mechanism that moves the integrated pressing guide toward the front end of the first capillary tube or below the first capillary tube,

所述第二按壓移動機構是使所述一體型按壓引導件向所述第二毛細管的前端或所述第二毛細管的下方移動的機構,The second pressing movement mechanism is a mechanism that moves the integrated pressing guide toward the front end of the second capillary tube or below the second capillary tube,

所述上下移動機構是使所述頭沿Z軸方向移動的機構。The vertical movement mechanism is a mechanism that moves the head in the Z-axis direction.

[16]一種按壓裝置,其在設置於基板上的多個第一接合部排成一行而成的第一行中的所述多個第一接合部分別連接第一包覆線或第一導線的一端,相對於在分別距所述多個第一接合部有預定距離的所述基板或分別在所述基板上的多個第一電極連接有所述第一包覆線或所述第一導線的另一端後的狀態的基板,按壓所述第一包覆線或所述第一導線,其特徵在於,[16] A pressing device that connects a first covered wire or a first conductive wire to each of the plurality of first joining portions in a first row in which a plurality of first joining portions arranged on a substrate are aligned. One end of the substrate is connected to the first covered wire or the first electrode with respect to the substrate at a predetermined distance from the plurality of first bonding portions or to a plurality of first electrodes respectively on the substrate. The substrate in the state after the other end of the wire presses the first covered wire or the first wire, is characterized in that,

所述按壓裝置具有:The pressing device has:

第一按壓引導件,其在相對於所述第一包覆線或所述第一導線交叉的方向上具有長度,將所述第一包覆線或所述第一導線向遠離所述第一行的方向按壓;A first pressing guide has a length in a direction crossing the first covered wire or the first conductive wire, and moves the first covered wire or the first conductive wire away from the first Press in the direction of the row;

上下移動機構,其使所述第一按壓引導件相對於所述基板而沿上下方向移動;以及An up-and-down movement mechanism that moves the first pressing guide in the up-and-down direction relative to the substrate; and

第一按壓移動機構,其使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第一行的垂線的方向移動。A first pressing movement mechanism moves the first pressing guide in a direction close to a perpendicular to the surface of the substrate and relative to a perpendicular to the first row.

[17]在上述[16]中的按壓裝置的基礎上,其特徵在於,[17] Based on the pressing device in [16] above, it is characterized in that,

所述第一按壓移動機構具有:棒狀構件,其一端與所述第一按壓引導件連接、或一體地與第一按壓引導件相連;凸輪從動件,其設置於所述棒狀構件的另一端;板凸輪,其配置為與所述凸輪從動件接觸;連接構件,其一端以能夠旋轉的方式連接於所述棒狀構件;活塞,其保持所述連接構件的另一端;以及氣缸,其使所述活塞沿上下方向移動,The first pressing movement mechanism has: a rod-shaped member, one end of which is connected to the first pressing guide, or is integrally connected to the first pressing guide; and a cam follower, which is provided on the side of the rod-shaped member. the other end; a plate cam configured to be in contact with the cam follower; a connecting member with one end rotatably connected to the rod-shaped member; a piston holding the other end of the connecting member; and a cylinder , which moves the piston in the up and down direction,

通過使所述活塞沿上下方向移動而使所述凸輪從動件一邊與所述板凸輪接觸一邊移動,由此使所述第一按壓引導件沿遠離或靠近相對於所述第一行的垂線的方向移動。By moving the piston in the up and down direction, the cam follower moves while contacting the plate cam, thereby moving the first pressing guide away from or closer to a vertical line with respect to the first row. move in the direction.

[18]在上述[16]中的按壓裝置的基礎上,其特徵在於,[18] Based on the pressing device in [16] above, it is characterized in that,

所述第一按壓移動機構具有氣缸,該氣缸具備與所述第一按壓引導件連接的活塞,所述氣缸是使所述活塞沿相對於與所述第一行相對的垂線傾斜的方向往復移動的機構。The first pressing movement mechanism has a cylinder having a piston connected to the first pressing guide, and the cylinder reciprocates the piston in a direction inclined with respect to a vertical line opposite to the first row. of institutions.

[19]在上述[16]至[18]中任一項中的按壓裝置的基礎上,其特徵在於,[19] The pressing device according to any one of [16] to [18] above, characterized in that,

所述按壓裝置在設置於所述基板上的與所述第一行平行的第二行並且多個第二接合部排成一行而成的所述第二行中的所述多個第二接合部分別連接第二包覆線或第二導線的一端,相對於在分別距所述多個第二接合部有預定距離的所述基板或分別在所述基板上的多個第二電極連接有所述第二包覆線或所述第二導線的另一端後狀態的基板,按壓所述第一包覆線以及第二包覆線或所述第一導線以及第二導線,The pressing device is provided on the substrate in a second row parallel to the first row and the plurality of second joints in the second row in which a plurality of second joint portions are arranged in a line. One end of each of the second covered wires or the second conductive wires is respectively connected to the substrate at a predetermined distance from the second joint portions or to a plurality of second electrodes on the substrate. The substrate in the state behind the other end of the second covered wire or the second conductive wire presses the first covered wire and the second covered wire or the first conductive wire and the second conductive wire,

所述第一按壓引導件是在相對於所述第二包覆線或所述第二導線交叉的方向上具有長度,將所述第一包覆線以及第二包覆線或所述第一導線以及第二導線向遠離所述第一行以及所述第二行的方向按壓的機構,The first pressing guide has a length in a direction crossing the second covered wire or the second conductor, and connects the first covered wire and the second covered wire or the first a mechanism for pressing the conductor and the second conductor in a direction away from the first row and the second row,

所述第一按壓移動機構是使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第二行的垂線的方向移動的機構。The first pressing movement mechanism is a mechanism that moves the first pressing guide in a direction closer to a perpendicular to the surface of the substrate and relative to a perpendicular to the second row.

[20]在上述[16]至[19]中任一項中的按壓裝置的基礎上,其特徵在於,[20] The pressing device according to any one of [16] to [19] above, characterized in that:

所述按壓裝置在距設置於所述基板上的所述第一行有預定距離的多個第三接合部排成一行而成的第三行中的所述多個第三接合部分別連接第三包覆線或第三導線的一端,相對於分別距所述多個第三接合部有預定距離的所述基板或分別在所述基板上的多個第三電極連接所述第三包覆線或所述第三導線的另一端後的狀態的基板,按壓所述第三包覆線或所述第三導線,The pressing device connects the plurality of third joint portions in a third row in which a plurality of third joint portions are arranged in a line at a predetermined distance from the first row on the substrate, respectively. One end of the three covered wires or the third conductive wire is connected to the third coating relative to the substrate at a predetermined distance from the plurality of third joint portions or to a plurality of third electrodes respectively on the substrate. After the other end of the wire or the third wire is in a state of the substrate, pressing the third covered wire or the third wire,

所述按壓裝置具有載置所述基板的XY載物台,The pressing device has an XY stage on which the substrate is placed,

所述按壓裝置具有使所述XY載物台沿X方向移動的X軸移動機構,The pressing device has an X-axis moving mechanism that moves the XY stage in the X direction,

所述按壓裝置具有使所述XY載物台沿Y方向移動的Y軸移動機構,The pressing device has a Y-axis moving mechanism that moves the XY stage in the Y direction,

所述按壓裝置具有使所述第一按壓引導件以及所述第一按壓移動機構在相對於所述基板的表面的垂線的周圍旋轉的旋轉機構,The pressing device has a rotation mechanism that rotates the first pressing guide and the first pressing movement mechanism about a perpendicular line relative to a surface of the substrate,

所述第一按壓引導件是在相對於所述第三包覆線或所述第三導線交叉的方向上具有長度,將所述第三包覆線或所述第三導線向遠離所述第三行的方向按壓的機構,The first pressing guide has a length in a direction crossing the third covered wire or the third conductive wire, and moves the third covered wire or the third conductive wire away from the third Three rows of directional pressing mechanism,

所述第一按壓移動機構是在使所述基板的所述第三行位於所述第一按壓引導件的下方的狀態下,使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第三行的垂線的方向移動的機構。The first pressing movement mechanism moves the first pressing guide closer to the surface relative to the substrate in a state where the third row of the substrate is located below the first pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the third row.

[21]在上述[20]中的按壓裝置的基礎上,其特徵在於,[21] Based on the pressing device in [20] above, it is characterized in that:

所述按壓裝置在設置於所述基板上的與所述第三行平行的第四行並且多個第四接合部排成一行而成的所述第四行中的所述多個第四接合部分別連接第四包覆線或第四導線的一端,相對於在分別距所述多個第四接合部有預定距離的所述基板或分別在所述基板上的多個第四電極連接有所述第四包覆線或所述第四導線的另一端後的狀態的基板,按壓所述第三包覆線以及第四包覆線或所述第三導線以及第四導線,The pressing device is provided on the substrate in a fourth row parallel to the third row and the plurality of fourth joints in the fourth row in which a plurality of fourth joint portions are arranged in a row. One end of the fourth covered wire or the fourth conductor is respectively connected to the substrate at a predetermined distance from the fourth joint portions or to a plurality of fourth electrodes on the substrate. The substrate in a state behind the other end of the fourth covered wire or the fourth conductive wire presses the third covered wire and the fourth covered wire or the third conductive wire and the fourth conductive wire,

所述第一按壓引導件是在相對於所述第四包覆線或所述第四導線交叉的方向上具有長度,將所述第三包覆線以及第四包覆線或所述第三導線以及第四導線向遠離所述第三行以及所述第四行的方向按壓的機構,The first pressing guide has a length in a direction crossing the fourth covered wire or the fourth conductor, and connects the third covered wire and the fourth covered wire or the third a mechanism for pressing the conductor and the fourth conductor in a direction away from the third row and the fourth row,

所述第一按壓移動機構是在使所述基板的所述第四行位於所述第一按壓引導件的下方的狀態下,使所述第一按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第四行的垂線的方向移動的機構。The first pressing movement mechanism moves the first pressing guide closer to the surface of the substrate in a state where the fourth row of the substrate is located below the first pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the fourth row.

[22]一種配線裝置,其特徵在於,[22] A wiring device, characterized in that:

所述配線裝置具備上述[16]至[21]中任一項所記載的按壓裝置,The wiring device includes the pressing device according to any one of the above [16] to [21],

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使第一包覆線或第一導線陸續放出的毛細管、所述第一按壓引導件以及所述第一按壓移動機構,In the head, a capillary tube for successively releasing the first covered wire or the first conductor, the first pressing guide and the first pressing moving mechanism are arranged,

所述第一按壓移動機構是使所述第一按壓引導件向所述毛細管的側方、上方或下方移動的機構,The first pressing movement mechanism is a mechanism that moves the first pressing guide to the side, above or below the capillary tube,

所述上下移動機構是使所述頭沿Z軸方向移動的機構,The up-and-down movement mechanism is a mechanism that moves the head in the Z-axis direction,

所述配線裝置具有載置所述基板的XY載物台,The wiring device has an XY stage on which the substrate is placed,

所述配線裝置具有使所述XY載物台沿X方向移動的X軸移動機構,The wiring device has an X-axis moving mechanism that moves the XY stage in the X direction,

所述配線裝置具有使所述XY載物台沿Y方向移動的Y軸移動機構。The wiring device has a Y-axis moving mechanism that moves the XY stage in the Y direction.

[23]在上述[16]至[22]中任一項中的按壓裝置的基礎上,其特徵在於,[23] The pressing device according to any one of [16] to [22] above, characterized in that:

所述第一按壓引導件具有環狀或矩形的平面形狀。The first pressing guide has an annular or rectangular planar shape.

[24]在上述[16]至[19]中任一項中的按壓裝置的基礎上,其特徵在於,[24] The pressing device according to any one of [16] to [19] above, characterized in that:

所述按壓裝置在距設置於所述基板上的所述第一行有預定距離的多個第三接合部排成一行而成的第三行中的所述多個第三接合部分別連接第三包覆線或第三導線的一端,相對於在分別距所述多個第三接合部有預定距離的所述基板或分別在所述基板上的多個第三電極連接所述第三包覆線或所述第三導線的另一端後的狀態的基板,按壓所述第三包覆線或所述第三導線,The pressing device connects the plurality of third joint portions in a third row in which a plurality of third joint portions are arranged in a line at a predetermined distance from the first row on the substrate, respectively. One end of the three covered wires or the third conductor is connected to the third package with respect to the substrate or a plurality of third electrodes respectively on the substrate at a predetermined distance from the plurality of third joints. The substrate in the state after the other end of the covered wire or the third conductor presses the third covered wire or the third conductor,

所述按壓裝置具有:The pressing device has:

XY載物台,其載置所述基板;XY stage, which carries the substrate;

X軸移動機構,其使所述XY載物台沿X方向移動;X-axis moving mechanism, which moves the XY stage along the X direction;

Y軸移動機構,其使所述XY載物台沿Y方向移動;Y-axis moving mechanism, which moves the XY stage along the Y direction;

第二按壓引導件,其在相對於所述第三包覆線或所述第三導線交叉的方向上具有長度,將所述第三包覆線或所述第三導線向遠離所述第三行的方向按壓;以及A second pressing guide has a length in a direction crossing the third covered wire or the third conductive wire, and moves the third covered wire or the third conductive wire away from the third Press in the row direction; and

第二按壓移動機構,其使所述第二按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第三行的垂線的方向移動,a second pressing movement mechanism that moves the second pressing guide in a direction closer to a perpendicular to the surface of the substrate and relative to a perpendicular to the third row,

所述上下移動機構是使所述第二按壓引導件相對於所述基板而沿上下方向移動的機構。The vertical movement mechanism is a mechanism that moves the second pressing guide in the vertical direction relative to the substrate.

[25]在上述[24]中的按壓裝置的基礎上,其特徵在於,[25] Based on the pressing device in [24] above, it is characterized in that:

所述按壓裝置在設置於所述基板上的與所述第三行平行的第四行並且多個第四接合部排成一行而成的所述第四行中的所述多個第四接合部分別連接第四包覆線或第四導線的一端,相對於在分別距所述多個第四接合部有預定距離的所述基板或分別在所述基板上的多個第四電極連接有所述第四包覆線或所述第四導線的另一端後的狀態的基板,按壓所述第三包覆線以及第四包覆線或所述第三導線以及第四導線,The pressing device is provided on the substrate in a fourth row parallel to the third row and the plurality of fourth joints in the fourth row in which a plurality of fourth joint portions are arranged in a row. One end of the fourth covered wire or the fourth conductor is respectively connected to the substrate at a predetermined distance from the fourth joint portions or to a plurality of fourth electrodes on the substrate. The substrate in a state behind the other end of the fourth covered wire or the fourth conductive wire presses the third covered wire and the fourth covered wire or the third conductive wire and the fourth conductive wire,

所述第二按壓引導件是在相對於所述第四包覆線或所述第四導線交叉的方向上具有長度,將所述第三包覆線以及第四包覆線或所述第三導線以及第四導線向遠離所述第三行以及所述第四行的方向按壓的機構,The second pressing guide has a length in a direction crossing the fourth covered wire or the fourth conductive wire, and connects the third covered wire and the fourth covered wire or the third a mechanism for pressing the conductor and the fourth conductor in a direction away from the third row and the fourth row,

所述第二按壓移動機構是在使所述基板的所述第四行位於所述第二按壓引導件的下方的狀態下,使所述第二按壓引導件向靠近相對於所述基板的表面的垂線且相對於所述第四行的垂線的方向移動的機構。The second pressing movement mechanism moves the second pressing guide closer to the surface of the substrate in a state where the fourth row of the substrate is located below the second pressing guide. vertical line and a mechanism that moves relative to the direction of the vertical line of the fourth row.

[26]在上述[24]或[25]中的按壓裝置的基礎上,其特徵在於,[26] Based on the pressing device in [24] or [25] above, it is characterized in that:

所述按壓裝置是將所述第一按壓引導件和所述第二按壓引導件形成一體的一體型按壓引導件,The pressing device is an integrated pressing guide in which the first pressing guide and the second pressing guide are integrated,

所述一體型按壓引導件具有環狀或矩形的平面形狀,The integrated pressing guide has an annular or rectangular planar shape,

所述一體型按壓引導件在借助所述第一按壓移動機構而移動時不與所述第三移動機構連接,The integrated pressing guide is not connected to the third moving mechanism when moving by the first pressing moving mechanism,

所述一體型按壓引導件在借助所述第三移動機構而移動時不與所述第一按壓移動機構連接。The integrated pressing guide is not connected to the first pressing moving mechanism when moving by the third moving mechanism.

[27]一種配線裝置,其特徵在於,[27] A wiring device, characterized in that:

所述配線裝置具備上述[24]或[25]所記載的按壓裝置,The wiring device includes the pressing device described in [24] or [25] above,

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使包覆線或導線陸續放出的第一毛細管、所述第一按壓引導件、所述第一按壓移動機構、使包覆線或導線陸續放出的第二毛細管、所述第二按壓引導件、所述第二按壓移動機構,In the head, a first capillary tube for successively releasing the covered wire or conductor, the first pressing guide, the first pressing movement mechanism, a second capillary tube for successively releasing the covered wire or conductor are arranged. the second pressing guide and the second pressing moving mechanism,

所述第一按壓移動機構是使所述第一按壓引導件向所述第一毛細管的前端或所述第一毛細管的下方移動的機構,The first pressing movement mechanism is a mechanism that moves the first pressing guide toward the front end of the first capillary tube or below the first capillary tube,

所述第二按壓移動機構是使所述第二按壓引導件向所述第二毛細管的前端或所述第二毛細管的下方移動的機構,The second pressing movement mechanism is a mechanism that moves the second pressing guide toward the front end of the second capillary tube or below the second capillary tube,

所述上下移動機構是使所述頭沿Z軸方向移動的機構。The vertical movement mechanism is a mechanism that moves the head in the Z-axis direction.

[28]一種配線裝置,其特徵在於,[28] A wiring device, characterized in that:

所述配線裝置具備上述[26]所記載的按壓裝置,The wiring device includes the pressing device described in [26] above,

所述配線裝置具有頭,The wiring device has a head,

在所述頭內,配置有使包覆線或導線陸續放出的第一毛細管、所述一體型按壓引導件、所述第一按壓移動機構、使包覆線或導線陸續放出的第二毛細管、所述第二按壓移動機構,The head is provided with a first capillary tube for successively releasing the covered wire or conductor, the integrated pressing guide, the first pressing movement mechanism, a second capillary tube for successively releasing the covered wire or conductor, The second pressing movement mechanism,

所述第一按壓移動機構是使所述一體型按壓引導件向所述第一毛細管的前端或所述第一毛細管的下方移動的機構,The first pressing movement mechanism is a mechanism that moves the integrated pressing guide toward the front end of the first capillary tube or below the first capillary tube,

所述第二按壓移動機構是使所述一體型按壓引導件向所述第二毛細管的前端或所述第二毛細管的下方移動的機構,The second pressing movement mechanism is a mechanism that moves the integrated pressing guide toward the front end of the second capillary tube or below the second capillary tube,

所述上下移動機構是使所述頭沿Z軸方向移動的機構。The vertical movement mechanism is a mechanism that moves the head in the Z-axis direction.

11:基板; 12:第一孔; 13:第一行; 14:第一包覆線; 14a:第一包覆線的另一端; 14b:第一包覆線的一端; 15:按壓裝置; 16:第一按壓引導件; 17:上下方向(Z軸方向); 18:上下移動機構; 19:第一按壓移動機構; 20:第二行; 21:第二孔; 22:第二包覆線 22a:第二包覆線的另一端 23:頭; 24:包覆線; 25:毛細管; 26:XY載物台; 27:X方向; 28:Y方向; 29:X軸移動機構; 30:Y軸移動機構; 31:棒狀構件; 32:凸輪從動件; 33:板凸輪; 33a:第三鎖止部; 34:連接構件; 35:活塞; 36a:下方向; 36b:上方向; 37:氣缸; 38:遠離相對於第一行的垂線的方向; 39:靠近相對於第一行的垂線的方向; 41:第一按壓移動機構; 42:活塞; 43:氣缸; 44:上方向; 45:方向 46:下方向; 47:靠近包覆線的方向; 51:第三孔; 52:第三行; 53:第三包覆線; 53a:第三包覆線的另一端; 53b:第三包覆線的一端; 54:箭頭 55:旋轉機構 56:第四行; 57:第四孔; 58:第四包覆線; 58a:第四包覆線58的另一端; 61:第一毛細管; 62:第二毛細管; 63、63a:一體型按壓引導件; 64:活塞; 65:氣缸; 66:第二按壓移動機構; 101:第一基板; 102:第一連接點; 103:第二基板; 104:第二連接點; 105:包覆線。 11:Substrate; 12: The first hole; 13: first line; 14: First covered wire; 14a: The other end of the first covered wire; 14b: One end of the first covered wire; 15: Pressing device; 16: First pressing guide; 17: Up and down direction (Z-axis direction); 18: Up and down moving mechanism; 19: First press moving mechanism; 20: second line; 21: The second hole; 22:Second covered wire 22a: The other end of the second covered wire 23: Head; 24: Covered wire; 25: Capillary; 26:XY stage; 27:X direction; 28: Y direction; 29:X-axis moving mechanism; 30: Y-axis moving mechanism; 31: Rod-shaped member; 32: Cam follower; 33: Plate cam; 33a: The third locking part; 34: Connecting components; 35: piston; 36a: downward direction; 36b: upward direction; 37: Cylinder; 38: Direction away from the vertical line relative to the first row; 39: Close to the direction of the vertical line relative to the first row; 41: First press moving mechanism; 42: piston; 43: Cylinder; 44: Upward direction; 45: Direction 46: downward direction; 47: Direction close to the covering line; 51: The third hole; 52: Third line; 53: The third covered line; 53a: The other end of the third covered wire; 53b: One end of the third covered wire; 54:Arrow 55: Rotating mechanism 56: fourth line; 57: The fourth hole; 58: The fourth covered line; 58a: the other end of the fourth covered wire 58; 61: first capillary; 62: Second capillary; 63, 63a: Integrated pressing guide; 64: piston; 65: Cylinder; 66: Second pressing movement mechanism; 101: first substrate; 102: First connection point; 103: second substrate; 104: Second connection point; 105: Covered wire.

圖1是示意性地表示本發明的一個方式所涉及的具備按壓裝置的配線裝置的圖。 圖2中的(B)是用於說明圖1所示的按壓裝置15的剖視圖,圖2中的(A)是從上方觀察圖2中的(B)的俯視圖。 圖3中的(A)是表示與在按壓圖1所示的第一包覆線14時的第一按壓引導件16相對於毛細管25的位置的圖,圖3中的(B)是表示在不按壓圖1所示的第一包覆線14時使第一按壓引導件16從毛細管25退避後的位置的圖。 圖4是表示第一按壓引導件16與毛細管25的位置關係的圖。 圖5是表示第一按壓引導件16與毛細管25的位置關係的圖。 圖6中的(B)是用於說明圖1所示的按壓裝置15的剖視圖,圖6中的(A)是從上方觀察圖6中的(B)的俯視圖。 圖7中的(A)、(B)是說明第一實施方式的第一變形例以及第二變形例的圖。 圖8中的(A)、(B)是說明第一實施方式的第二變形例的圖。 圖9是說明使用圖1所示的配線裝置組裝配線的方法的動作的流程圖。 圖10是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖11是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖12是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖13是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖14是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖15是說明本發明的一個方式所涉及的一邊按壓現有的包覆線一邊組裝配線的方法的圖。 圖16是用於說明本發明的一個方式所涉及的配線裝置的示意圖。 圖17是用於說明本發明的一個方式所涉及的配線裝置的示意圖。 FIG. 1 is a diagram schematically showing a wiring device equipped with a pressing device according to one embodiment of the present invention. (B) in FIG. 2 is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1 , and (A) in FIG. 2 is a top view of (B) in FIG. 2 viewed from above. (A) in FIG. 3 is a diagram showing the position of the first pressing guide 16 relative to the capillary tube 25 when the first covered wire 14 shown in FIG. 1 is pressed. (B) in FIG. 3 is a diagram showing A diagram showing the position of the first pressing guide 16 retracted from the capillary tube 25 when the first covered wire 14 shown in FIG. 1 is not pressed. FIG. 4 is a diagram showing the positional relationship between the first pressing guide 16 and the capillary tube 25 . FIG. 5 is a diagram showing the positional relationship between the first pressing guide 16 and the capillary tube 25 . (B) in FIG. 6 is a cross-sectional view for explaining the pressing device 15 shown in FIG. 1 , and (A) in FIG. 6 is a top view of (B) in FIG. 6 viewed from above. (A) and (B) in FIG. 7 are diagrams illustrating a first modification example and a second modification example of the first embodiment. (A) and (B) in FIG. 8 are diagrams illustrating a second modification of the first embodiment. FIG. 9 is a flowchart illustrating the operation of a method of assembling a wiring device using the wiring device shown in FIG. 1 . FIG. 10 is a diagram illustrating a method of assembling an assembly line while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 11 is a diagram illustrating a method of assembling an assembly line while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 12 is a diagram illustrating a method of assembling a wiring while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 13 is a diagram illustrating a method of assembling an assembly line while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 14 is a diagram illustrating a method of assembling a wiring while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 15 is a diagram illustrating a method of assembling an assembly line while pressing a conventional covered wire according to one embodiment of the present invention. FIG. 16 is a schematic diagram for explaining a wiring device according to one embodiment of the present invention. FIG. 17 is a schematic diagram for explaining a wiring device according to one embodiment of the present invention.

11:基板 11:Substrate

12:第一孔 12:The first hole

13:第一行 13: first line

14:第一包覆線 14: First covered wire

14a:第一包覆線的另一端 14a: The other end of the first covered wire

14b:第一包覆線的一端 14b: One end of the first covered wire

15:按壓裝置 15: Pressing device

16:第一按壓引導件 16: First pressing guide

17:上下方向(Z軸方向) 17: Up and down direction (Z-axis direction)

18:上下移動機構 18: Up and down moving mechanism

19:第一按壓移動機構 19: First press moving mechanism

23:頭 23:head

24:包覆線 24: Covered wire

25:毛細管 25:Capillary tube

26:XY載物台 26:XY stage

27:X方向 27:X direction

28:Y方向 28:Y direction

29:X軸移動機構 29:X-axis moving mechanism

30:Y軸移動機構 30: Y-axis moving mechanism

54:箭頭 54:Arrow

55:旋轉機構 55: Rotating mechanism

Claims (5)

一種配線裝置,其是利用包覆線對在第一基板設置為多個行狀的第一連接點各自、與距所述第一連接點有預定距離的設置於所述第一基板或第二基板的多個第二連接點各自進行佈線的配線裝置,其中,所述配線裝置具備:能夠升降的毛細管,其使所述包覆線陸續放出;能夠升降的引導件,其配置於所述毛細管的附近;第一升降機構,其使所述毛細管升降;以及第二升降機構,其使所述引導件升降,在至少對所述第一連接點的第一行佈設包覆線後,在對所述第一連接點的第二行佈設包覆線時,通過利用所述第二升降機構使引導件下降而使對所述第一行所佈設的包覆線向遠離所述第二行的方向移動。 A wiring device that uses covered wire pairs to provide a plurality of row-shaped first connection points on a first substrate, each of which is provided on the first substrate or the second substrate at a predetermined distance from the first connection point. A wiring device for wiring a plurality of second connection points respectively, wherein the wiring device is equipped with: a capillary tube that can be lifted and lowered to continuously release the covered wire; and a guide that can be lifted and lowered and arranged on the capillary tube. Near the When laying covered wires in the second row of the first connection point, the second lifting mechanism is used to lower the guide so that the covered wires laid in the first row are moved away from the second row. Move. 如請求項1所述的配線裝置,其中,所述第一連接點是設置於所述第一基板上的孔,從所述毛細管陸續放出的包覆線插通所述孔。 The wiring device according to claim 1, wherein the first connection point is a hole provided on the first substrate, and the covered wire successively released from the capillary tube is inserted into the hole. 如請求項1所述的配線裝置,其中,所述第一連接點是設置於所述第一基板上的電極,從所述毛細管陸續放出的包覆線與所述電極接合。 The wiring device according to claim 1, wherein the first connection point is an electrode provided on the first substrate, and the covered wire successively released from the capillary tube is bonded to the electrode. 如請求項1至3中任一項所述的配線裝置,其中,所述引導件在相對於對第一連接點所佈設的包覆線交叉的方向上具有長度。 The wiring device according to any one of claims 1 to 3, wherein the guide has a length in a direction intersecting with the covered wire routed to the first connection point. 如請求項1至3中任一項所述的配線裝置,其中,所述第二升降機構具有:棒狀構件,其一端連接於所述引導件、或一體地與所述引導件相連;凸輪從動件,其設置於所述棒狀構件的另一端;板凸輪,其配置為與所述凸輪從動件接觸;連接構件,其一端以能夠旋轉的方式連接於所述棒狀構件;活塞,其保持所述連接構件的另一端;以及氣缸,其使所述活塞沿上下方向移動, 通過使所述活塞沿上下方向移動而使所述凸輪從動件一邊與所述板凸輪接觸一邊移動,由此使所述引導件沿遠離或靠近相對於所述第一行的垂線的方向移動。 The wiring device according to any one of claims 1 to 3, wherein the second lifting mechanism has: a rod-shaped member with one end connected to the guide or integrally connected to the guide; and a cam a follower provided at the other end of the rod-shaped member; a plate cam configured to be in contact with the cam follower; a connecting member with one end rotatably connected to the rod-shaped member; and a piston , which holds the other end of the connecting member; and a cylinder which moves the piston in the up and down direction, By moving the piston in the up and down direction, the cam follower moves while in contact with the plate cam, thereby moving the guide in a direction away from or closer to a vertical line with respect to the first row. .
TW111138911A 2022-01-06 2022-10-13 Wiring device TWI832490B (en)

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CN101208576A (en) * 2004-07-01 2008-06-25 阿威德热合金有限公司 Fluid-containing cooling plate for an electronic component
CN105802345A (en) * 2014-12-30 2016-07-27 深圳Tcl工业研究院有限公司 Nano-metal conductive printing ink and its preparation method and printed circuit board

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