CN117597771A - Wiring device - Google Patents
Wiring device Download PDFInfo
- Publication number
- CN117597771A CN117597771A CN202280018184.7A CN202280018184A CN117597771A CN 117597771 A CN117597771 A CN 117597771A CN 202280018184 A CN202280018184 A CN 202280018184A CN 117597771 A CN117597771 A CN 117597771A
- Authority
- CN
- China
- Prior art keywords
- wire
- guide
- wiring device
- capillary
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 238000004804 winding Methods 0.000 claims abstract description 39
- 238000001179 sorption measurement Methods 0.000 claims abstract description 8
- 238000005253 cladding Methods 0.000 claims abstract description 3
- 230000007246 mechanism Effects 0.000 claims description 64
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
Abstract
The invention provides a vacuum adsorption winding guide for inserting a winding or cladding wire into a hole provided in a substrate with high precision. One embodiment of the present invention is a wiring device (100) for wiring a hole (17) provided in a substrate (16) and a connection point on the substrate at a predetermined distance from the hole by a wire (11) or a covered wire, wherein the wiring device (100) comprises: a capillary (21) that draws out the wire or the covered wire; a winding guide (12) provided with suction ports (13 a-13 c) for sucking the winding wire or the covered wire; a horn (22) holding the capillary tube and the wire guide; and a wire guide moving unit that moves the wire guide in a direction to bring the suction port close to the wire or the covered wire drawn out from the capillary and in a direction to separate from the wire or the covered wire drawn out from the capillary.
Description
Technical Field
The present invention relates to a wiring device.
Background
The wire or the clad wire drawn out from the tip of the capillary held by the ultrasonic horn is passed through one of the holes, the wire or the clad wire is drawn down into the substrate, the capillary is lifted up while the clad wire is drawn out, the substrate is moved horizontally, and the capillary is lowered, whereby the other end of the wire or the clad wire is bonded to the substrate. Then, the wire or the clad wire is cut off, the capillary is raised, the substrate is moved horizontally, the capillary is positioned above one of the holes, the capillary is lowered, the wire or the clad wire drawn out from the tip of the capillary is passed through the hole, the wire or the clad wire is drawn down into the substrate, and the other end of the wire or the clad wire is bonded to the substrate by the same operation as described above. By repeating these operations, the wire or the coated wire is passed through each of two or more rows of holes formed by arranging the plurality of holes, and the other end of each wire or coated wire is bonded to the substrate. Thus, the wiring is assembled.
Disclosure of Invention
Problems to be solved by the invention
However, as described above, the other end of the wire or the covered wire is bonded to the substrate, but as shown in fig. 9, there is a substrate as follows: a substrate base 18 (a base having a certain thickness) is disposed on the substrate 17 spaced apart from two or more rows of holes 17 provided in the substrate 16, and an electrode (not shown) provided on the substrate base 18 corresponds to the other end of the wire or the covered wire.
In the case of the substrate 16 as described above, as shown in fig. 9, since the ultrasonic horn 22 interferes with the substrate base 18, the wire 11 or the clad wire drawn out from the tip of the capillary 21 is inserted into one of the holes 17 in a state where the tip of the capillary 21 cannot be sufficiently brought close to the substrate 16. Therefore, when there is resistance between the hole 17 of the substrate 16 and the wire 11 or the covered wire when the wire 11 or the covered wire is inserted, the wire 11 or the covered wire may be bent and inserted into the hole 17 (see fig. 9).
In addition, as shown in fig. 10, when the wire 11 or the covered wire is inserted, the tip of the wire 11 or the covered wire may not enter the hole 17 because the wire 11 or the covered wire swings due to vibration of the device, flow of surrounding air current, or the like.
It is necessary to prevent the insertion failure of the wire 11 or the clad wire into the hole 17.
An aspect of the present invention is to provide a wiring device capable of inserting a wire or a covered wire into a hole provided in a substrate with high accuracy.
Means for solving the problems
Hereinafter, various aspects of the present invention will be described.
[1] A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole by a wire winding or cladding wire,
the wiring device includes:
a capillary that draws out the wire or the covered wire;
a winding guide having an adsorption port for adsorbing the winding or the covered wire;
a horn holding the capillary tube and the wire guide; and
and a wire guide moving unit that moves the wire guide in a direction to bring the suction port close to the wire or the covered wire drawn out from the capillary and in a direction to separate from the wire or the covered wire drawn out from the capillary.
[2] The wiring device according to the above [1], characterized in that,
the winding guide member has a groove, the suction port is provided on an inner surface of the groove,
the cross section of the inner surface of the groove has a V-shape or a U-shape.
[3] The wiring device according to the above [1] or [2], characterized in that,
the wiring device includes:
a lifting mechanism for lifting and lowering the capillary tube and the wire guide held by the horn; and
the control part is used for controlling the control part to control the control part,
the control unit controls the winding wire or the wrapping wire drawn out from the capillary to be sucked into the suction port of the winding guide, and causes the capillary and the winding guide to be lowered by the elevating mechanism, thereby inserting the winding wire or the wrapping wire into the hole.
[4] The wiring device according to the above [3], wherein the control unit controls to release the wire or the covered wire from the suction port after the wire or the covered wire is inserted into the hole, the capillary and the wire guide are lifted by the lifting mechanism, and the wire guide is moved in a direction to separate the wire or the covered wire from the suction port by the wire guide moving mechanism.
[5] The wiring device according to the above [1] or [2], characterized in that,
the wiring device has an XY stage for mounting the substrate,
the wiring device is provided with an X-axis moving mechanism for moving the XY table along the X direction,
the wiring device has a Y-axis moving mechanism for moving the XY stage in the Y direction,
the connection point is an electrode, and the wire drawn out of the capillary or the clad wire is welded to the electrode.
[6] The wiring device according to the above [3], characterized in that,
the lifting mechanism has a lifting slide member,
the horn is mounted to the slide member via a connecting member,
the winding guide moving mechanism is mounted to the slide member.
[7] The wiring device according to the above [1] or [2], wherein the wire guide moving mechanism moves the wire guide in a plane including an axis of the wire or the coated wire and an axis of the horn, the axis being adsorbed to the adsorption port.
[8] The wiring device according to the above [1] or [2], wherein the wire guide moving mechanism includes: a rotation shaft mounted to the winding guide; and a rotation mechanism that rotates the rotation shaft.
Effects of the invention
According to various aspects of the present invention, a wiring device capable of inserting a wire or a covered wire into a hole provided in a substrate with high accuracy can be provided.
Drawings
Fig. 1 is a cross-sectional view for explaining a wiring device including a vacuum suction wire guide according to an embodiment of the present invention.
Fig. 2 is a perspective view schematically showing the whole of the wiring device shown in fig. 1.
Fig. 3 is a perspective view of the entire wiring device shown in fig. 1, as viewed from a direction different from that of fig. 2, and a perspective view of a part of the vacuum suction wire guide enlarged.
Fig. 4 (a) to 4 (D) are cross-sectional views for explaining a wiring method of the wire 11 or the covered wire.
Fig. 5 (a) to 5 (D) are cross-sectional views for mechanically explaining a wiring method of the wire 11 or the covered wire.
Fig. 6 is a perspective view showing a case where wiring is performed to each of a plurality of holes of a substrate and each of a plurality of connection points provided on a substrate base disposed on the substrate by a wire or a clad wire.
Fig. 7 is a perspective view showing a case where wiring is performed to each of a plurality of holes of a substrate and each of a plurality of connection points provided on a substrate base disposed on the substrate by a wire or a clad wire.
Fig. 8 (a) is a plan view showing the substrate 16, the substrate base 18, and the substrate 39 excluding the wiring device shown in fig. 6 and 7, and fig. 8 (B) is a cross-sectional view of fig. 8 (a).
Fig. 9 is a cross-sectional view showing an example in which insertion of a wire or a clad wire into a hole provided in a substrate fails.
Fig. 10 is a cross-sectional view showing an example in which a wire or a clad wire is to be inserted into a hole provided in a substrate.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be readily understood by those skilled in the art that the present invention is not limited to the following description, and various changes in form and details may be made therein without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the description of the embodiments described below.
Fig. 1 is a cross-sectional view for explaining a wiring device including a vacuum suction wire guide according to an embodiment of the present invention. Fig. 2 is a perspective view schematically showing the whole of the wiring device shown in fig. 1.
Fig. 3 is a perspective view of the entire wiring device shown in fig. 1, as viewed from a direction different from that of fig. 2, and a perspective view of a part of the vacuum suction wire guide enlarged.
< vacuum suction wire winding guide 10 >)
First, the vacuum suction wire guide 10 will be described.
As shown in fig. 1, the vacuum suction wire guide 10 is a member for guiding a wire 11 (which may be a covered wire). As shown in fig. 3, the vacuum suction wire guide 10 includes a wire guide 12, the wire guide 12 includes a groove 12a, and a first suction port 13a, a second suction port 13b, and a third suction port 13c are provided on an inner surface 12b of the groove 12 a. The first to third suction ports 13a to 13c are suction ports for vacuum sucking the wire 11 or the cover wire.
The grooves preferably have a V-shape or a U-shape in cross section. In this case, the first to third suction ports 13a to 13c are preferably provided at the bottom of the groove 12 a.
As shown in fig. 1, the first to third suction ports 13a to 13c are connected to an exhaust path 14, and the exhaust path 14 is provided inside the winding guide 12. The exhaust path 14 is connected to a vacuum exhaust mechanism 15. In other words, the first to third suction ports 13a to 13c are connected to the vacuum exhaust mechanism 15 via the exhaust path 14, and the vacuum exhaust mechanism 15 exhausts the air through the exhaust path 14, so that the wire 11 or the coating wire is sucked to the first to third suction ports 13a to 13c. The vacuum exhaust mechanism 15 is constituted by, for example, a vacuum pump.
According to the vacuum suction wire guide 10 of the present embodiment, the first suction port 13a, the second suction port 13b, and the third suction port 13c are provided on the inner surface 12b of the groove 12a, and the wire 11 or the coated wire is sucked into the first suction port 13a to the third suction port 13c. Therefore, the winding wire 11 or the covered wire can be reliably fixed with high positional accuracy.
Further, by forming the groove 12a in a V-shape or a U-shape in cross section and providing the first to third suction ports 13a to 13c at the bottom of the groove 12a, the wire 11 can be fixed to the bottom of the groove 12a with higher positional accuracy.
< wiring device >
As shown in fig. 1, the wiring device 100 is a device that performs wiring through a wire 11 or a covered wire to a hole 17 provided in a substrate 16 and a connection point 19 (see fig. 5 (C) and 5 (D)) on the substrate 16 at a predetermined distance from the hole 17. Specifically, the connection point 19 is provided on the substrate base 18 disposed on the substrate 16.
Specifically, as shown in fig. 1 to 3, the wiring device 100 includes the vacuum suction wire guide 10 described above. The wiring device 100 further includes a capillary 21 for drawing out the wire 11 or the covered wire, and the capillary 21 is held by an ultrasonic horn 22. The wiring device 100 further includes a wire guide moving mechanism 30 shown in fig. 2 and 3, and the wire guide moving mechanism 30 moves the wire guide 12 in a direction 61 to bring the first to third suction ports 13a to 13c closer to the wire 11 or the coated wire drawn out from the capillary 21 and in a direction 62 to separate from the wire 11 or the coated wire drawn out from the capillary 21 (see fig. 4 (a) and 5 (B)). The wiring device 100 further includes a lifting mechanism (Z-axis moving mechanism) 40 for lifting and lowering the capillary 21 held by the ultrasonic horn 22 and the wire guide 12.
As shown in fig. 1, the wiring device 100 has an XY table 26 on which the substrate 16 is placed. An X-axis moving mechanism 29 for moving the XY stage 26 in the X direction 27 is provided. The wiring device 100 further includes a Y-axis moving mechanism 33 that moves the XY table 26 in the Y direction 28.
As shown in fig. 2, the wiring device 100 includes a control unit 50. The control unit 50 controls the vacuum evacuation mechanism 15 shown in fig. 1 to be turned on and off, the capillary 21, the ultrasonic horn 22, the wire guide moving mechanism 30 shown in fig. 2, the Z-axis moving mechanism 40, the X-axis moving mechanism 29 shown in fig. 1, and the Y-axis moving mechanism 33.
As shown in fig. 1 and 3, the wire guide moving mechanism 30 moves the wire guide 12 in a plane 70 in which a parallel surface parallel to the longitudinal direction of the wire 11 or the coated wire sucked to the first suction port 13a to the third suction port 13c by vacuum overlaps with a parallel surface parallel to the longitudinal direction of the ultrasonic horn 22 (see fig. 5 a and 5B). In other words, the wire guide moving mechanism 30 moves the wire guide 12 in the surface 70 including the axial center of the wire 11 or the coated wire vacuum-sucked to the first suction port 13a to the third suction port 13c and the axial center of the ultrasonic horn 22.
As shown in fig. 2 and 3, the Z-axis moving mechanism 40 includes a vertically movable slide member 41. The winding guide moving mechanism 30 is attached to the slide member 41.
In detail, the winding guide moving mechanism 30 includes a rotating mechanism 32, and the rotating mechanism 32 can be a motor, a rotary actuator, or the like. The rotation mechanism 32 is a member that rotates the rotation shaft 31, and the rotation shaft 31 is attached to the winding guide 12. The ultrasonic horn 22 is attached to the slide member 41 via a connecting member 42, and the rotation mechanism 32 is attached thereto. Thereby, the slide member 41 is lifted and lowered as indicated by arrow 43, and the ultrasonic horn 22 with the capillary 21 attached thereto and the wire guide 12 can be lifted and lowered. Further, the slide member 41 and the connecting member 42 may be integrally formed.
The control unit 50 shown in fig. 2 may also perform the following control: the wire 11 or the covered wire drawn out from the capillary 21 is vacuum-sucked into the first suction port 13a to the third suction port 13c of the wire guide 12, and the capillary 21 and the wire guide 12 are lowered by the Z-axis moving mechanism 40, whereby the wire 11 or the covered wire is inserted into the hole 17.
The control unit 50 may perform the following control: after the wire 11 or the covered wire is inserted into the hole 17, vacuum suction of the wire 11 or the covered wire is released from the first suction port 13a to the third suction port 13c, the capillary 21 and the wire guide 12 are lifted up by the Z-axis moving mechanism 40, and the wire guide 12 is moved in the direction 62 in which the wire 11 or the covered wire is separated from the first suction port 13a to the third suction port 13c by the wire guide moving mechanism 30.
Wiring method of winding 11 or covered wire
Fig. 4 (a) to 4 (D) and fig. 5 (a) to 5 (D) are cross-sectional views for explaining a wiring method of the wire 11 or the covered wire.
First, as shown in fig. 4 (a), the first to third suction ports 13a to 13c of the wire guide 12 are moved to the position where the wire 11 is fixed or the wire is covered by moving the wire guide 12 as indicated by an arrow 61.
Next, as shown in fig. 4 (B), the wire 11 or the covered wire is drawn out from the capillary 21, and thereafter, the vacuum evacuation mechanism 15 shown in fig. 1, which is connected to the evacuation path 14 of the wire guide 12, is turned on, so that the wire 11 or the covered wire is vacuum-sucked and fixed to the first suction port 13a to the third suction port 13c.
Next, as shown in fig. 4 (C), in a state where the wire 11 or the coated wire is fixed to the wire guide 12, the capillary 21, and the ultrasonic horn 22 are lowered by the Z-axis moving mechanism 40 shown in fig. 2 and 3, the tip of the wire 11 or the coated wire is inserted into the hole 17 of the substrate 16, and the wire or the coated wire is pulled down into the substrate 16.
Next, as shown in fig. 4 (D), the vacuum evacuation mechanism 15 shown in fig. 1 connected to the evacuation path 14 is turned off, and the vacuum suction of the wire 11 or the covered wire is released from the first suction port 13a to the third suction port 13c of the wire guide 12, so that the wire guide 12 is temporarily retracted.
Next, as shown in fig. 5 (a), while the wire 11 or the coated wire is pulled out from the capillary 21, the wire guide 12, the capillary 21, and the ultrasonic horn 22 are raised in the direction of the arrow 25 by the Z-axis moving mechanism 40 shown in fig. 2 and 3.
Next, as shown in fig. 5 (B), the wire guide 12 is retracted by moving the wire guide 12 in the direction 62 in which the first to third suction ports 13a to 13c are separated from the wire 11 or the covered wire. Specifically, the rotation mechanism 32 of the winding guide moving mechanism 30 shown in fig. 2 and 3 rotates the rotation shaft 31 to retract the winding guide 12.
Next, as shown in (C) of fig. 5, the substrate 16 is moved in the X direction 27. Specifically, the XY table 26 on which the substrate 16 is mounted is moved in the X direction 27 by the X-axis moving mechanism 29 shown in fig. 1, and the substrate 16 is thereby moved in the X direction 27. At this time, since the winding guide 12 is retracted through the process shown in fig. 5 (B), the winding guide 12 does not interfere with the substrate base 18. Then, the wire guide 12, the capillary 21, and the ultrasonic horn 22 are lowered as indicated by an arrow 36, and the wire 11 or the covered wire is routed to a connection point 19 provided on the substrate base 18 at the tip of the capillary 21. In addition, in the case where the connection point 19 is, for example, the electrode 37 shown in fig. 6, the wire 11 or the covered wire may be welded to the electrode 37.
Next, as shown in fig. 5 (D), the wire 11 or the covered wire is cut, and the wire guide 12, the capillary 21, and the ultrasonic horn 22 are raised in the direction of the arrow 38 by the Z-axis moving mechanism 40 shown in fig. 2 and 3.
The operation of the wiring device from (a) in fig. 4 to (D) in fig. 5 is controlled by the control unit 50 shown in fig. 2.
By repeating the steps (a) to (D) in fig. 4, wiring can be performed by the wire 11 or the clad wire for each of the plurality of holes 17 provided in the substrate 16 shown in fig. 6, 7, and 8 and each of the plurality of connection points 19 provided on the substrate base 18 arranged on the substrate 16 at a predetermined distance from the plurality of holes 17. In the embodiment shown in fig. 5 (D), the connection point 19 is directly provided on the substrate base 18, but the connection point 19 shown in fig. 6 to 8 may be used without limitation. In other words, the connection point 19 may be a connection point on the substrate 39 disposed on the substrate base 18. The connection point may also be an electrode. Fig. 8 (a) is a plan view showing the substrate 16, the substrate base 18, and the substrate 39 excluding the wiring device shown in fig. 6 and 7, and fig. 8 (B) is a cross-sectional view of fig. 8 (a).
According to the present embodiment, while the wire 11 or the covered wire drawn out from the capillary 21 is vacuum-sucked and fixed by the wire guide 12, the capillary 21 is lowered to guide the wire 11 or the covered wire by the wire guide 12, and the guide wire 11 or the covered wire is inserted into the hole 17 of the substrate 16. Therefore, the wire 11 or the coated wire can be prevented from being bent and inserted into the insertion hole 17, and the wire 11 or the coated wire can be prevented from swinging at the tip end thereof without entering the hole 17. Therefore, the wire 11 or the covered wire can be inserted into the hole 17 of the substrate 16 with high accuracy and stability.
Description of the reference numerals
10: vacuum sucking the winding guide;
11: winding;
12: a winding guide;
12a: a ditch;
12b: an inner surface;
13a: a first adsorption port;
13b: a second adsorption port;
13c: a third adsorption port;
14: an exhaust path;
15: a vacuum exhaust mechanism;
16: a substrate;
17: a hole;
18: a substrate base;
19: a connection point;
21: a capillary tube;
22: an ultrasonic horn;
26: an XY table;
27: an X direction;
28: a Y direction;
29: an X-axis moving mechanism;
30: a winding guide moving mechanism;
31: a rotation shaft;
32: a rotation mechanism (motor);
33: a Y-axis moving mechanism;
40: lifting mechanisms (Z-axis movement mechanisms);
41: a sliding member;
42: a connecting member;
50: a control unit;
100: wiring device.
Claims (8)
1. A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole by a wire winding or cladding wire,
the wiring device includes:
a capillary that draws out the wire or the covered wire;
a winding guide having an adsorption port for adsorbing the winding or the covered wire;
a horn holding the capillary tube and the wire guide; and
and a wire guide moving unit that moves the wire guide in a direction to bring the suction port close to the wire or the covered wire drawn out from the capillary and in a direction to separate from the wire or the covered wire drawn out from the capillary.
2. The wiring device of claim 1, wherein the wiring device comprises a plurality of wires,
the winding guide member has a groove, the suction port is provided on an inner surface of the groove,
the cross section of the inner surface of the groove has a V-shape or a U-shape.
3. The wiring device according to claim 1 or 2, wherein,
the wiring device includes:
a lifting mechanism for lifting and lowering the capillary tube and the wire guide held by the horn; and
the control part is used for controlling the control part to control the control part,
the control unit controls the winding wire or the wrapping wire drawn out from the capillary to be sucked into the suction port of the winding guide, and causes the capillary and the winding guide to be lowered by the elevating mechanism, thereby inserting the winding wire or the wrapping wire into the hole.
4. The wiring device according to claim 3, wherein the control unit is configured to release the wire or the covered wire from the suction port after the wire or the covered wire is inserted into the hole, to raise the capillary and the wire guide by the lifting mechanism, and to move the wire guide in a direction to separate the wire or the covered wire from the suction port by the wire guide moving mechanism.
5. The wiring device according to claim 1 or 2, wherein,
the wiring device has an XY stage for mounting the substrate,
the wiring device is provided with an X-axis moving mechanism for moving the XY table along the X direction,
the wiring device has a Y-axis moving mechanism for moving the XY stage in the Y direction,
the connection point is an electrode, and the wire drawn out of the capillary or the clad wire is welded to the electrode.
6. The wiring device of claim 3, wherein,
the lifting mechanism has a lifting slide member,
the horn is mounted to the slide member via a connecting member,
the winding guide moving mechanism is mounted to the slide member.
7. The wiring device according to claim 1 or 2, wherein the wire guide moving mechanism moves the wire guide in a plane including an axial center of the wire or the covered wire and an axial center of the horn, which are adsorbed to the adsorption port.
8. The wiring device according to claim 1 or 2, wherein the wire guide moving mechanism has: a rotation shaft mounted to the winding guide; and a rotation mechanism that rotates the rotation shaft.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/023469 WO2023238390A1 (en) | 2022-06-10 | 2022-06-10 | Wiring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117597771A true CN117597771A (en) | 2024-02-23 |
Family
ID=86054449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280018184.7A Pending CN117597771A (en) | 2022-06-10 | 2022-06-10 | Wiring device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7263633B1 (en) |
| CN (1) | CN117597771A (en) |
| TW (1) | TW202350065A (en) |
| WO (1) | WO2023238390A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112630A (en) * | 1982-12-17 | 1984-06-29 | Matsushita Electric Ind Co Ltd | Wire bonding device |
| JPH04214644A (en) * | 1990-12-12 | 1992-08-05 | Nec Kyushu Ltd | Wire bonding device |
| JPH10256299A (en) * | 1997-03-13 | 1998-09-25 | Toshiba Corp | Wire-bonding method and device thereof |
| JPH10308408A (en) * | 1997-05-08 | 1998-11-17 | Toshiba Corp | Semiconductor manufacturing equipment |
| US7307348B2 (en) * | 2005-12-07 | 2007-12-11 | Micron Technology, Inc. | Semiconductor components having through wire interconnects (TWI) |
| JP6138332B1 (en) * | 2016-12-22 | 2017-05-31 | ハイソル株式会社 | Vacuum transfer method |
-
2022
- 2022-06-10 WO PCT/JP2022/023469 patent/WO2023238390A1/en unknown
- 2022-06-10 JP JP2022570553A patent/JP7263633B1/en active Active
- 2022-06-10 CN CN202280018184.7A patent/CN117597771A/en active Pending
-
2023
- 2023-05-02 TW TW112116344A patent/TW202350065A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202350065A (en) | 2023-12-16 |
| WO2023238390A1 (en) | 2023-12-14 |
| JP7263633B1 (en) | 2023-04-24 |
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