JP7263633B1 - Wiring device - Google Patents

Abstract

A vacuum suction wire guide used for accurately inserting a wire or coated wire into a hole provided in a substrate is provided. A wiring device (100) for wiring a hole (17) provided in a substrate (16) and a connection point on the substrate at a predetermined distance from the hole with a wire (11) or a coated wire. a capillary 21 for feeding the wire or the covered wire; a wire guide 12 having suction ports 13a to 13c for sucking the wire or the covered wire; a horn 22 for holding the capillary and the wire guide; The wiring device 100 has a wire guide mover for moving the wire guide in directions to move the suction port toward and away from the wire or the coated wire drawn out from the capillary. [Selection diagram] Fig. 1

Description

The present invention relates to wiring devices.

There are two or more rows of a plurality of holes provided in the substrate, and a wire or coated wire drawn out from the tip of the capillary held by the ultrasonic horn is passed through one of the plurality of holes, and the wire or The covered wire is drawn under the substrate, the capillary is raised while the covered wire is paid out, the substrate moves horizontally, and the capillary is lowered to join the other end of the wire or the covered wire to the substrate. After that, the wire or coated wire is cut, the capillary is raised, the substrate is horizontally moved to position the capillary above one of the plurality of holes, and the wire drawn out from the tip of the capillary is lowered while the capillary is lowered. Alternatively, the other end of the wire or covered wire is joined to the substrate by passing the covered wire through the hole, pulling the wire or covered wire under the substrate, and performing the same operation as above. By repeating these steps, a wire or covered wire is passed through each of two or more rows of holes, and the other end of each wire or covered wire is bonded to the substrate. The wiring is assembled in this way.

By the way, the other end of the wire or coated wire is joined to the substrate as described above, but as shown in FIG. There is a substrate on which a base (foundation having a certain thickness) 18 is arranged and an electrode (not shown) provided on the substrate base 18 corresponds to the other end of the wire or covered wire.

In the case of such a substrate 16, since the ultrasonic horn 22 and the substrate base 18 interfere with each other as shown in FIG. A coated wire 11 or coated wire is inserted into one of the plurality of holes 17 . Therefore, if there is resistance between the hole 17 of the substrate 16 and the wire 11 or the coated wire when inserting the wire 11 or the coated wire, the wire 11 or the coated wire may be bent and inserted into the hole 17 (FIG. 9). reference).

Further, as shown in FIG. 10, when the wire 11 or the covered wire is inserted, the tip of the wire 11 or the covered wire may sway due to the vibration of the device or the surrounding air flow. may not enter.

It is necessary to prevent failure of insertion of wire 11 or coated wire into hole 17 as described above.

An object of one aspect of the present invention is to provide a wiring device that can accurately insert a wire or a covered wire into a hole provided in a substrate.

Various aspects of the invention are described below.
[1] A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole with a wire or covered wire,
a capillary for feeding the wire or the coated wire;
a wire guide having a suction port for sucking the wire or the coated wire;
a horn that holds the capillary and the wire guide;
a wire guide mover that moves the wire guide in a direction in which the suction port approaches or moves away from the wire or the coated wire fed out from the capillary;
A wiring device comprising:

[2] The wire guide has a groove, and the suction port is provided on the inner surface of the groove,
The wiring device according to [1] above, wherein the cross section of the inner surface of the groove is V-shaped or U-shaped.

[3] a lifting mechanism for lifting and lowering the capillary and the wire guide held by the horn;
a control unit;
The control unit causes the wire or the coated wire drawn out from the capillary to be attracted to the suction port of the wire guide, and lowers the capillary and the wire guide by the elevating mechanism to move the wire or the coated wire into the hole. The wiring device according to the above [1] or [2], wherein the wiring device is controlled to insert the coated wire.

[4] After the wire or the covered wire is inserted into the hole, the control unit removes the wire or the covered wire from the suction port, and lifts the capillary and the wire guide by the elevating mechanism. The wiring device according to the above [3], wherein the wire guide moving mechanism moves the wire guide in a direction in which the wire or the coated wire is moved away from the suction port.

[5] having an XY stage on which the substrate is placed;
Having an X-axis movement mechanism for moving the XY stage in the X direction,
Having a Y-axis movement mechanism for moving the XY stage in the Y direction,
The wiring device according to the above [1] or [2], wherein the connection point is an electrode, and the wire or the coated wire drawn out from the capillary is bonded to the electrode.

[6] The elevating mechanism has a slide member that can be raised and lowered,
The horn is attached to the slide member via a connection member,
The wiring device according to [3], wherein the wire guide moving mechanism is attached to the slide member.

[7] The wire guide moving mechanism is a mechanism for moving the wire guide within a plane including the axis of the wire or the coated wire attracted to the suction port and the axis of the horn. The wiring device according to the above [1] or [2], characterized by:

[8] The wiring according to [1] or [2] above, wherein the wire guide moving mechanism has a rotating shaft attached to the wire guide, and a rotating mechanism for rotating the rotating shaft. Device.

According to various aspects of the present invention, it is possible to provide a wiring device capable of accurately inserting a wire or a covered wire into a hole provided in a substrate.

1 is a cross-sectional view for explaining a wiring device provided with a vacuum suction wire guide according to one aspect of the present invention; FIG. It is a perspective view which shows typically the whole wiring apparatus shown in FIG. FIG. 3 is a perspective view of the entire wiring device shown in FIG. 1 as viewed from a direction different from that of FIG. 2 , and an enlarged perspective view of a part of the vacuum suction wire guide; (A) to (D) are cross-sectional views for explaining the wiring method of the wire 11 or the covered wire. (A) to (D) are cross-sectional views for explaining the wiring method of the wire 11 or the covered wire. FIG. 3 is a perspective view showing how wires or coated wires are wired between each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base arranged on the substrate. FIG. 3 is a perspective view showing how wires or coated wires are wired between each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base arranged on the substrate. (A) is a top view showing the substrate 16, the substrate base 18 and the substrate 39 excluding the wiring device shown in FIGS. 6 and 7, and (B) is a cross-sectional view of (A). FIG. 10 is a cross-sectional view showing an example of failure in inserting a wire or coated wire into a hole provided in a substrate; FIG. 4 is a cross-sectional view showing an example of failure in inserting a wire or coated wire into a hole provided in a substrate;

Embodiments of the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art will readily understand that various changes in form and detail may be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the descriptions of the embodiments shown below.

FIG. 1 is a cross-sectional view for explaining a wiring device having a vacuum suction wire guide according to one aspect of the present invention. 2 is a perspective view schematically showing the entire wiring device shown in FIG. 1. FIG. FIG. 3 is a perspective view of the entire wiring device shown in FIG. 1 as seen from a direction different from that of FIG. 2, and a perspective view enlarging a part of the vacuum suction wire guide.

<Vacuum adsorption wire guide 10>
First, the vacuum suction wire guide 10 will be described.
As shown in FIG. 1, a vacuum suction wire guide 10 guides a wire 11 (which may be a coated wire). As shown in FIG. 3, the vacuum suction wire guide 10 has a wire guide 12, this wire guide 12 has a groove 12a, and the inner surface 12b of the groove 12a has a first suction port 13a and a second suction port. 13b and a third suction port 13c are provided. The first to third suction ports 13a to 13c are suction ports for vacuum-sucking the wire 11 or coated wire.
The cross-section of the groove preferably has a V-shape or a U-shape. In this case, it is preferable to provide the first to third suction ports 13a to 13c at the bottom of the groove 12a.

As shown in FIG. 1, the first to third suction ports 13a to 13c are connected to an exhaust path 14, which is provided inside the wire guide 12. As shown in FIG. The evacuation path 14 is connected to the evacuation mechanism 15 . That is, the first to third suction ports 13a to 13c are connected to the evacuation mechanism 15 via the exhaust path 14, and the evacuation path 14 is evacuated by the evacuation mechanism 15, whereby the first to third suction ports 13a to 13c The wire 11 or coated wire is sucked by the suction ports 13a to 13c. The evacuation mechanism 15 is composed of, for example, a vacuum pump.

According to the vacuum suction wire guide 10 according to this embodiment, the first suction port 13a, the second suction port 13b and the third suction port 13c are provided on the inner surface 12b of the groove 12a, and the first to third suction ports are provided. The wire 11 or coated wire is sucked to 13a-13c. Therefore, the wire 11 or the covered wire can be reliably fixed with high positional accuracy.
Further, the cross-sectional shape of the groove 12a is V-shaped or U-shaped, and the first to third suction ports 13a to 13c are provided at the bottom of the groove 12a, so that the wire 11 can be positioned more accurately at the bottom of the groove 12a. It can be fixed.

<Wiring device>
As shown in FIG. 1, the wiring device 100 includes a hole 17 provided in a substrate 16 and a connection point 19 (see FIGS. 5C and 5D) on the substrate 16 which is separated from the hole 17 by a predetermined distance. is wired by the wire 11 or covered wire. Specifically, the connection points 19 are provided on a substrate base 18 which is arranged on the substrate 16 .

Specifically, as shown in FIGS. 1 to 3, the wiring device 100 includes the vacuum suction wire guide 10 described above. The wiring device 100 also has a capillary 21 for feeding out the wire 11 or coated wire, and this capillary 21 is held by an ultrasonic horn 22 . 2 and 3, the wiring device 100 moves the wire guide 12 in a direction 61 to move the first to third suction ports 13a to 13c closer to and away from the wire 11 or coated wire drawn out from the capillary 21. (see FIGS. 4A and 5B). The wiring device 100 also has an elevating mechanism (Z-axis moving mechanism) 40 for elevating the capillary 21 held by the ultrasonic horn 22 and the wire guide 12 .

As shown in FIG. 1, the wiring device 100 has an XY stage 26 on which the substrate 16 is placed. It has an X-axis moving mechanism 29 that moves the XY stage 26 in the X direction 27 . The wiring device 100 also has a Y-axis moving mechanism 33 that moves the XY stage 26 in the Y direction 28 .

As shown in FIG. 2 , the wiring device 100 has a control section 50 . 1, the capillary 21, the ultrasonic horn 22, the wire guide movement mechanism 30 shown in FIG. 2, the Z-axis movement mechanism 40, and the X-axis movement shown in FIG. It controls the mechanism 29 and the Y-axis movement mechanism 33 .

As shown in FIGS. 1 and 3, the wire guide moving mechanism 30 includes a plane parallel to the longitudinal direction of the wire 11 or coated wire vacuum-sucked by the first to third suction ports 13a to 13c, and an ultrasonic horn 22. is a mechanism for moving the wire guide 12 within a plane 70 that overlaps with a plane parallel to the longitudinal direction of (see FIGS. 5A and 5B). In other words, the wire guide moving mechanism 30 has a surface including the axial center of the wire 11 or coated wire vacuum-sucked by the first to third suction ports 13a to 13c and the axial center of the ultrasonic horn 22. A mechanism for moving the wire guide 12 within 70 .

Moreover, as shown in FIGS. 2 and 3, the Z-axis movement mechanism 40 has a slide member 41 that can move up and down. A wire guide moving mechanism 30 is attached to the slide member 41 .

To explain in detail, the wire guide moving mechanism 30 has a rotating mechanism 32, and this rotating mechanism 32 can use, for example, a motor, a rotary actuator, or the like. The rotating mechanism 32 rotates the rotating shaft 31 , and the rotating shaft 31 is attached to the wire guide 12 . The ultrasonic horn 22 is attached to the slide member 41 through the connection member 42, and the rotation mechanism 32 is attached. As a result, the slide member 41 moves up and down as indicated by an arrow 43, thereby allowing the ultrasonic horn 22 and the wire guide 12 to which the capillary 21 is attached to move up and down. Note that the slide member 41 and the connection member 42 may be integrally formed.

The control unit 50 shown in FIG. 2 causes the wire 11 or the coated wire drawn out from the capillary 21 to be vacuum-sucked to the first to third suction ports 13a to 13c of the wire guide 12, and the Z-axis moving mechanism 40 moves the capillary. 21 and the wire guide 12 may be lowered to insert the wire 11 or the coated wire into the hole 17 .

After the wire 11 or covered wire is inserted into the hole 17, the control unit 50 removes the vacuum suction of the wire 11 or covered wire from the first to third suction ports 13a to 13c. Even if the capillary 21 and the wire guide 12 are lifted and the wire guide moving mechanism 30 is controlled to move the wire guide 12 in the direction 62 in which the wire 11 or the coated wire is kept away from the first to third suction ports 13a to 13c. good.

<Method of wiring wire 11 or covered wire>
FIGS. 4A to 4D and 5A to 5D are sectional views for explaining the wiring method of the wire 11 or covered wire.

First, as shown in FIG. 4A, by moving the wire guide 12 in the direction of an arrow 61, the wire 11 or the coated wire is fixed to the first to third suction ports 13a to 13c of the wire guide 12. move to position.

Next, as shown in FIG. 4B, the wire 11 or coated wire is let out from the capillary 21, and then the evacuation mechanism 15 shown in FIG. , the wire 11 or the coated wire is vacuum-sucked and fixed to the first to third suction ports 13a to 13c.

Next, as shown in FIG. 4C, with the wire 11 or coated wire fixed to the wire guide 12, the wire guide 12, the capillary 21 and the ultrasonic horn are moved by the Z-axis moving mechanism 40 shown in FIGS. 22 is lowered, the tip of the wire 11 or covered wire is inserted into the hole 17 of the substrate 16 and the wire or covered wire is pulled under the substrate 16 .

Next, as shown in FIG. 4(D), by turning off the evacuation mechanism 15 shown in FIG. The wire 11 or coated wire is released from vacuum suction, and the wire guide 12 is temporarily retracted.

Next, as shown in FIG. 5A, the wire guide 12, the capillary 21 and the ultrasonic horn 22 are moved by the Z-axis moving mechanism 40 shown in FIGS. in the direction of

Next, as shown in FIG. 5B, the wire guide 12 is retracted by moving the wire guide 12 in a direction 62 in which the first to third suction ports 13a to 13c are moved away from the wire 11 or the coated wire. . Specifically, the rotating mechanism 32 of the wire guide moving mechanism 30 shown in FIGS. 2 and 3 rotates the rotating shaft 31 to retract the wire guide 12 .

Next, the substrate 16 is moved in the X direction 27 as shown in FIG. 5(C). Specifically, the substrate 16 is moved in the X direction 27 by moving the XY stage 26 on which the substrate 16 is mounted in the X direction 27 by the X-axis moving mechanism 29 shown in FIG. At this time, since the wire guide 12 is retracted in the process shown in FIG. After that, the wire guide 12, the capillary 21 and the ultrasonic horn 22 are lowered as indicated by the arrow 36, and the wire 11 or covered wire is wired to the connection point 19 provided on the substrate base 18 at the tip of the capillary 21. If the connection point 19 is, for example, an electrode 37 shown in FIG. 6, the wire 11 or coated wire may be bonded to the electrode 37 .

Next, as shown in FIG. 5(D), the wire 11 or coated wire is cut, and the wire guide 12, capillary 21 and ultrasonic horn 22 are moved along the arrow 38 by the Z-axis moving mechanism 40 shown in FIGS. direction.

The operation of the wiring device shown in FIGS. 4A to 5D is controlled by the controller 50 shown in FIG.

4A to 5D are repeated to form a plurality of holes 17 provided in a plurality of rows in the substrate 16 as shown in FIGS. 6, 7 and 8. and each of the plurality of connection points 19 provided on the substrate base 18 arranged on the substrate 16 at a predetermined distance from the plurality of holes 17 can be wired by wires 11 or coated wires. In the embodiment shown in FIG. 5(D), the connection point 19 is provided directly on the board base 18, but the connection point 19 is not limited to this, and the connection point 19 as shown in FIGS. may be That is, the connection point 19 may be a connection point on the board 39 arranged on the board base 18 . This connection point may be an electrode. 8A is a top view showing the substrate 16, the substrate base 18 and the substrate 39 excluding the wiring device shown in FIGS. 6 and 7, and FIG. 8B is a top view of FIG. 8A. It is a sectional view.

According to this embodiment, the wire 11 or the covered wire drawn out from the capillary 21 is vacuum-sucked and fixed by the wire guide 12, and the capillary 21 is lowered to guide the wire 11 or the covered wire by the wire guide 12. and insert it into the hole 17 of the substrate 16. Therefore, it is possible to prevent the wire 11 or the covered wire from being bent and inserted into the hole 17 . can be prevented from entering Therefore, it becomes possible to insert the wire 11 or the covered wire into the hole 17 of the substrate 16 with high precision and stability.

DESCRIPTION OF SYMBOLS 10... Vacuum suction wire guide 11... Wire 12... Wire guide 12a... Groove 12b... Inner surface 13a... First suction port 13b... Second suction port 13c... Third suction port 14... Exhaust path 15... Evacuation mechanism 16 Substrate 17 Hole 18 Substrate base 19 Connection point 21 Capillary 22 Ultrasonic horn 26 XY stage 27 X direction 28 Y direction 29 X axis movement mechanism 30 Wire guide movement mechanism 31 Rotation axis 32 …Rotating mechanism (motor)
33 Y-axis moving mechanism 40 Elevating mechanism (Z-axis moving mechanism)
DESCRIPTION OF SYMBOLS 41... Slide member 42... Connection member 50... Control part 100... Wiring device

Claims (8)

A wiring device for wiring a hole provided in a substrate and a connection point on the substrate at a predetermined distance from the hole with a wire or a coated wire,
a capillary for feeding the wire or the coated wire;
a wire guide having a suction port for sucking the wire or the coated wire;
a horn that holds the capillary and the wire guide;
a wire guide moving mechanism for moving the wire guide in a direction in which the suction port approaches and in a direction away from the wire or the coated wire drawn out from the capillary;
A wiring device comprising: The wire guide has a groove, and the suction port is provided on the inner surface of the groove,
2. The wiring device according to claim 1, wherein the inner surface of the groove has a V-shaped or U-shaped cross section. an elevating mechanism for elevating the capillary and the wire guide held by the horn;
a control unit;
The control unit causes the wire or the coated wire drawn out from the capillary to be attracted to the suction port of the wire guide, and lowers the capillary and the wire guide by the elevating mechanism to move the wire or the coated wire into the hole. 3. The wiring device according to claim 1, wherein control is performed so as to insert the coated wire. After the wire or the covered wire is inserted into the hole, the control unit removes the suction of the wire or the covered wire from the suction port, raises the capillary and the wire guide by the lifting mechanism, and 4. The wiring device according to claim 3, wherein a wire guide moving mechanism is controlled to move the wire guide in a direction in which the wire or the coated wire is moved away from the suction port. Having an XY stage on which the substrate is placed,
Having an X-axis movement mechanism for moving the XY stage in the X direction,
Having a Y-axis movement mechanism for moving the XY stage in the Y direction,
3. The wiring device according to claim 1, wherein said connection point is an electrode, and said wire or said covered wire drawn out from said capillary is bonded to said electrode. The elevating mechanism has a slide member that can be raised and lowered,
The horn is attached to the slide member via a connection member,
4. The wiring device according to claim 3, wherein the wire guide moving mechanism is attached to the slide member. The wire guide moving mechanism is a mechanism for moving the wire guide within a plane including the axis of the wire or the coated wire attracted to the suction port and the axis of the horn. The wiring device according to claim 1 or 2. 3. The wiring device according to claim 1, wherein the wire guide moving mechanism has a rotating shaft attached to the wire guide and a rotating mechanism for rotating the rotating shaft.

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