CN106455468B

CN106455468B - Electronic component supply device and electronic component mounting device

Info

Publication number: CN106455468B
Application number: CN201610638469.7A
Authority: CN
Inventors: 加贺谷宏之
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2015-08-06
Filing date: 2016-08-05
Publication date: 2020-10-16
Anticipated expiration: 2036-08-05
Also published as: JP2017037878A; CN106455468A; JP6655322B2

Abstract

The invention provides an electronic component supply device, which can inhibit the interruption period of the supply interruption of the electronic component from lengthening and reduce the device cost. The electronic component supply device is provided with: a transfer head disposed in the 1 st space and movable above a tray on which a plurality of electronic components are mounted; a 1 st shuttle component and a 2 nd shuttle component which can move between a 1 st space and a 2 nd space and can move between the transfer head and the tray in the vertical direction, and which transport the electronic component transferred from the tray by the transfer head to the mounting head; a relative position determination unit configured to determine whether or not a part of the tray overlaps at least one of the 1 st shuttle and the 2 nd shuttle in a horizontal plane; and a transfer head control unit that controls the transfer head so that the electronic component is transferred from the tray to at least one of the 1 st shuttle and the 2 nd shuttle overlapping a part of the tray.

Description

Electronic component supply device and electronic component mounting device

Technical Field

The invention relates to an electronic component supply device and an electronic component mounting device.

Background

In a manufacturing process of an electronic device, an electronic component mounting apparatus is used which mounts an electronic component on a substrate using a mounting head. An electronic component is supplied to a mounting head by an electronic component supply device (see patent document 1).

As a supply method of the electronic component supply device, the following methods are known: a feeder system that feeds the electronic components held in the tape reel to the mounting head, a tray system that feeds the electronic components mounted on the tray to the mounting head, and a shuttle system that feeds the electronic components to the mounting head using a transport component called a shuttle component.

In the tray mode, trays are stored in a tray storage device. When the electronic components are supplied to the mounting head, the tray is pulled out from the tray storage device and moved to the component supply area. The mounting head acquires the electronic component from the tray arranged in the component supply area. When the number of trays arranged in the component supply area is 1, after the empty tray is moved from the component supply area to the tray storage device, the tray on which the electronic components are mounted needs to be moved from the tray storage device to the component supply area. The supply of the electronic components is interrupted until the tray on which the electronic components are mounted is disposed in the component supply area after the tray disposed in the component supply area becomes empty. If the interruption period of the supply interruption of the electronic component becomes long, the stop period of the mounting operation of the electronic component by the mounting head becomes long, and the production efficiency of the electronic component mounting apparatus is lowered. By setting the number of trays arranged in the component supply area to 2, the interruption period can be shortened. However, there is a limit to the size of the component supply area. Therefore, if it is attempted to arrange 2 trays in the component feeding area, the size of the trays needs to be reduced. As a result, it may be difficult to mount a plurality of large electronic components on the tray.

Patent document 1: japanese laid-open patent publication No. 11-145680

The shuttle system is a system in which the electronic components are moved from the tray to the shuttle component using a transfer head independent from the mounting head, and the shuttle component is moved to the component supply area. The mounting head acquires the electronic component from the shuttle component arranged in the component supply area. In the shuttle system, a technique capable of suppressing the length of the interrupt period is also desired. In addition, unlike the feeder method and the tray method, the shuttle method requires a transfer head. Even when the transfer head is required, a technique capable of reducing the cost of the apparatus while suppressing the size and complexity of the electronic component supply apparatus is desired.

Disclosure of Invention

An object of an embodiment of the present invention is to provide an electronic component supply device that reduces device cost by suppressing an interruption period during which supply of electronic components is interrupted in a shuttle system. Another object of an embodiment of the present invention is to provide an electronic component mounting apparatus that suppresses a reduction in production efficiency and reduces apparatus cost.

According to the 1 st aspect of the present invention, there is provided an electronic component supply device including: a transfer head which is disposed in the 1 st space, has a suction nozzle for detachably holding an electronic component, and is movable above a tray on which a plurality of the electronic components are mounted; a 1 st shuttle component which is movable between the 1 st space and a 2 nd space in which a mounting head for mounting the electronic component on a substrate is movable, is movable between the transfer head and the tray in a vertical direction, and conveys the electronic component transferred from the tray by the transfer head to the mounting head; a 2 nd shuttle member which is movable between the 1 st space and the 2 nd space, is movable between the transfer head and the tray in a vertical direction, and conveys the electronic component transferred from the tray by the transfer head to the mounting head; a tray position data acquisition unit that acquires position data of the tray in a horizontal plane; a 1 st shuttle position data acquiring unit configured to acquire position data of the 1 st shuttle in a horizontal plane; a 2 nd shuttle position data acquiring unit configured to acquire position data of the 2 nd shuttle in a horizontal plane; a relative position determination unit that determines whether or not a part of the tray overlaps at least one of the 1 st shuttle and the 2 nd shuttle on the horizontal plane based on the position data of the tray, the position data of the 1 st shuttle, and the position data of the 2 nd shuttle; and a transfer head control unit configured to control the transfer head so that the electronic component is transferred from the tray to at least one of the 1 st shuttle and the 2 nd shuttle overlapping a part of the tray, based on a determination result of the relative position determination unit.

According to the 1 st aspect of the present invention, since the electronic component is supplied to the mounting head by at least one of the 1 st shuttle component and the 2 nd shuttle component, the interruption period during which the supply of the electronic component to the mounting head is interrupted is suppressed from becoming long. In the 1 st space, the tray is disposed below the transfer head. The 1 st shuttle and the 2 nd shuttle are movable in the vertical direction between the transfer head and the tray. The transfer head transfers the electronic component from the tray to at least one of the 1 st shuttle and the 2 nd shuttle overlapping a part of the tray in a horizontal plane. Thus, the moving distance of the transfer head when the electronic component is mounted on at least one of the 1 st shuttle unit and the 2 nd shuttle unit is suppressed. Therefore, the electronic component supply device is prevented from being large and complicated, and the device cost is reduced.

In the 1 st aspect of the present invention, it is preferable that: a 1 st mounting determination unit configured to determine whether or not the electronic component is mounted on the 1 st shuttle unit; a 2 nd mounting determination unit configured to determine whether or not the electronic component is mounted on the 2 nd shuttle unit; and a shuttle control unit configured to arrange at least one of the 1 st shuttle and the 2 nd shuttle on which the electronic component is mounted in the 2 nd space based on a determination result of the 1 st mounting determination unit and a determination result of the 2 nd mounting determination unit.

At least one of a 1 st shuttle component mounted with electronic components and a 2 nd shuttle component mounted with electronic components is arranged in the 2 nd space, thereby suppressing the interruption of the supply of the electronic components to the mounting head.

In the 1 st aspect of the present invention, it is preferable that the shuttle control unit includes a remaining number acquiring unit that acquires data of a remaining number of the electronic components mounted on the 1 st shuttle in the 2 nd space, and the shuttle control unit moves the 2 nd shuttle mounted with the electronic components to the 2 nd space before the electronic components run out of the 1 st shuttle based on the remaining number data.

If the mounting operation of mounting the plurality of electronic components mounted on the 1 st shuttle component on the substrate by the mounting head is performed, the electronic components are exhausted from the 1 st shuttle component or the 1 st shuttle component is empty in some cases. Before the electronic component runs out of the 1 st shuttle component, the 2 nd shuttle component carrying the electronic component is moved to the 2 nd space, thereby suppressing the interruption of the supply of the electronic component to the mounting head.

In the 1 st aspect of the present invention, it is preferable that the shuttle control unit moves the 2 nd shuttle mounted with the electronic component to the 2 nd space before the 1 st shuttle moves from the 2 nd space to the 1 st space based on the position data of the 1 st shuttle.

Even if the 1 st shuttle component is moved from the 2 nd space to the 1 st space due to any cause such as the mounting operation of the electronic component by the mounting head running out of the electronic component from the 1 st shuttle component or the operation of the 1 st shuttle component becoming abnormal, the 2 nd shuttle component mounted with the electronic component is moved to the 2 nd space before the 1 st shuttle component is moved from the 2 nd space to the 1 st space, thereby suppressing the interruption of the supply of the electronic component to the mounting head.

In the 1 st aspect of the present invention, it is preferable that: a transfer head driving device for moving the suction nozzle of the transfer head only in the 1 st axis direction and the vertical direction in the horizontal plane; a tray driving device which moves the tray only in a 2 nd axis direction within the horizontal plane orthogonal to the 1 st axis direction; a 1 st shuttle drive device that moves the 1 st shuttle only in the 2 nd axis direction; and a 2 nd shuttle driving device which moves the 2 nd shuttle only in the 2 nd axis direction.

In a state where the number of control shafts of each of the transfer head driving device, the tray driving device, the 1 st shuttle driving device, and the 2 nd shuttle driving device is reduced, it is possible to perform a process of transferring the electronic component of the tray to at least one of the 1 st shuttle and the 2 nd shuttle, and a process of moving at least one of the 1 st shuttle and the 2 nd shuttle on which the electronic component is mounted. Therefore, the electronic component supply device can be prevented from being large and complicated, and the device cost can be reduced.

In the 1 st aspect of the present invention, it is preferable that the 1 st shuttle and the 2 nd shuttle are disposed at different positions in the 1 st axis direction.

The 1 st shuttle and the 2 nd shuttle are disposed at different positions in the X axis direction, whereby the 1 st shuttle and the 2 nd shuttle can smoothly move in the 2 nd axis direction without interfering with each other.

In the 1 st aspect of the present invention, it is preferable that the 1 st shuttle and the 2 nd shuttle are disposed at the same height.

Since the 1 st shuttle and the 2 nd shuttle are disposed at the same height, the amount of movement of the transfer head in the vertical direction is substantially the same in each of the process of transferring the electronic component to the 1 st shuttle and the process of transferring the electronic component to the 2 nd shuttle. Similarly, in each of the processing of acquiring the electronic component from the 1 st shuttle and the processing of acquiring the electronic component from the 2 nd shuttle, the amount of movement of the mounting head in the vertical direction is substantially the same. Therefore, the load of the control of each of the transfer head and the mounting head is reduced.

In the 1 st aspect of the present invention, it is preferable that the tray includes a 1 st region, a 2 nd region, and a 3 rd region, the 1 st region overlaps with the 1 st shuttle, the 2 nd region overlaps with the 2 nd shuttle, the 3 rd region is set between the 1 st region and the 2 nd region in the 1 st axis direction, and does not overlap with both the 1 st shuttle and the 2 nd shuttle, and the electronic component is supported in each of the 1 st region, the 2 nd region, and the 3 rd region.

When the 1 st shuttle overlaps the tray, the transfer head can transfer the electronic component from at least one of the 2 nd area and the 3 rd area to the 1 st shuttle. When the 2 nd shuttle overlaps the tray, the transfer head can transfer the electronic component from at least one of the 1 st area and the 3 rd area to the 2 nd shuttle. When both the 1 st shuttle and the 2 nd shuttle overlap the tray, the transfer head can transfer the electronic component from the 3 rd area to at least one of the 1 st shuttle and the 2 nd shuttle.

In the 1 st aspect of the present invention, it is preferable that the outer shape of the 1 st shuttle and the outer shape of the 2 nd shuttle are smaller than the outer shape of the tray.

The shape of the shuttle 1 and the shape of the shuttle 2 are smaller than the shape of the tray, thereby realizing miniaturization and simplification of the electronic component supply device. Further, since the 1 st shuttle and the 2 nd shuttle are lightweight, the load of the driving device for driving the 1 st shuttle and the 2 nd shuttle is reduced. In addition, since the outer shapes of the 1 st shuttle and the 2 nd shuttle are smaller than the outer shape of the tray, the transfer head can smoothly transfer the electronic components from the tray to the 1 st shuttle and the 2 nd shuttle in a state where the 1 st shuttle and the 2 nd shuttle are overlapped with the tray.

According to the 2 nd aspect of the present invention, there is provided an electronic component mounting apparatus comprising: the electronic component supply device according to claim 1; and a mounting head having a suction nozzle detachably holding the electronic component, and mounting the electronic component supplied from the electronic component supply device on a substrate.

According to the 2 nd aspect of the present invention, the reduction in production efficiency is suppressed, and the apparatus cost is reduced.

According to the 3 rd aspect of the present invention, there is provided an electronic component mounting apparatus comprising: a transfer head which is disposed in the 1 st space, has a suction nozzle for detachably holding an electronic component, and is movable above a tray on which a plurality of the electronic components are mounted; a mounting head which is disposed in the 2 nd space and mounts the electronic component on a substrate; a 1 st shuttle component which is movable between the 1 st space and the 2 nd space, is movable between the transfer head and the tray in a vertical direction, and conveys the electronic component transferred from the tray by the transfer head to the mounting head; a 2 nd shuttle member which is movable between the 1 st space and the 2 nd space, is movable between the transfer head and the tray in a vertical direction, and conveys the electronic component transferred from the tray by the transfer head to the mounting head; a tray position data acquisition unit that acquires position data of the tray in a horizontal plane; a 1 st shuttle position data acquiring unit configured to acquire position data of the 1 st shuttle in a horizontal plane; a 2 nd shuttle position data acquiring unit configured to acquire position data of the 2 nd shuttle in a horizontal plane; a relative position determination unit that determines whether or not a part of the tray overlaps at least one of the 1 st shuttle and the 2 nd shuttle on the horizontal plane based on the position data of the tray, the position data of the 1 st shuttle, and the position data of the 2 nd shuttle; and a transfer head control unit configured to control the transfer head so that the electronic component is transferred from the tray to at least one of the 1 st shuttle and the 2 nd shuttle overlapping a part of the tray, based on a determination result of the relative position determination unit.

According to the 3 rd aspect of the present invention, the reduction in production efficiency is suppressed, and the apparatus cost is reduced.

ADVANTAGEOUS EFFECTS OF INVENTION

According to an aspect of the present invention, there is provided an electronic component supply device that reduces the device cost by suppressing an increase in an interruption period of supply interruption of an electronic component. Further, according to an aspect of the present invention, there is provided an electronic component mounting apparatus that suppresses a reduction in production efficiency and reduces apparatus cost.

Drawings

Fig. 1 is a plan view schematically showing an example of an electronic component mounting apparatus according to the present embodiment.

Fig. 2 is a view showing an example of the mounting head according to the present embodiment.

Fig. 3 is a perspective view showing an example of the electronic component supply device according to the present embodiment.

Fig. 4 is a perspective view showing an example of the transfer head and the transfer head driving device according to the present embodiment.

Fig. 5 is a functional block diagram showing an example of the control system according to the present embodiment.

Fig. 6 is a schematic view of the electronic component supply device according to the present embodiment, as viewed from the-Y side.

Fig. 7 is a schematic view of the electronic component supply device according to the present embodiment, as viewed from the + Z side.

Fig. 8 is a flowchart showing an example of the operation of the electronic component supply device according to the present embodiment.

Fig. 9 is a schematic diagram showing an example of the operation of the electronic component supply device according to the present embodiment.

Fig. 10 is a schematic diagram showing an example of the operation of the electronic component supply device according to the present embodiment.

Description of the reference numerals

1 electronic component supply device

2 transfer head

3 tray storage device

3K opening

3W wall surface

4 support member

4A upper surface

5 base part

6 foot parts

7 conveying device

8 chuck mechanism

9 worktable assembly

10 tray driving device

11 st shuttle

12 nd 2 shuttle

13 suction nozzle

14 st shuttle drive

15 nd 2 shuttle drive

20 transfer head driving device

21X-axis driving device

22Z-axis driving device

23 actuator

24 transfer mechanism

25 guide member

26 belt wheel

27 cable carrier

28 fixing part

50 mounting head

51 suction nozzle

52 substrate shooting device

53 suction nozzle driving device

54Z-axis driving part

55 rotary driving part

60 mounting head driving device

61X-axis portal frame

62Y-axis portal frame

70 substrate conveying device

71 guide member

72 substrate holding device

100 electronic component mounting apparatus

200 control device

201 transfer head position data acquisition unit

202 transfer head control section

203 tray position data acquiring unit

204 tray control part

205 relative position determining unit

210 shuttle position data acquiring unit

211 st shuttle position data acquiring unit

212 shuttle 2 position data acquiring part

220 shuttle component control

221 st shuttle control

222 nd shuttle control

230 mounting determination unit

231 st mounting determination unit

232 nd mounting determination unit

240 remaining number acquiring unit

241 st surplus number acquiring unit

242 nd surplus number acquiring unit

C electronic component

P substrate

T tray

Detailed Description

Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. Some of the components may not be used. The components in the embodiments described below include components that can be easily conceived by those skilled in the art, substantially the same components, and all equivalent components.

In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each portion is described with reference to the XYZ rectangular coordinate system. A direction parallel to a 1 st axis in a horizontal plane is referred to as an X-axis direction (1 st axis direction), a direction parallel to a 2 nd axis in a horizontal plane orthogonal to the 1 st axis is referred to as a Y-axis direction (2 nd axis direction), and a direction parallel to a 3 rd axis orthogonal to the 1 st axis and the 2 nd axis, respectively, is referred to as a Z-axis direction (3 rd axis direction). A rotation direction (tilt direction) about the 1 st axis (X axis) is defined as θ X direction, a rotation direction (tilt direction) about the 2 nd axis (Y axis) is defined as θ Y direction, and a rotation direction (tilt direction) about the 3 rd axis (Z axis) is defined as θ Z direction. The XY plane is a horizontal plane. The Z-axis direction is a vertical direction (vertical direction).

[ outline of electronic component mounting apparatus ]

Fig. 1 is a plan view schematically showing an example of an electronic component mounting apparatus 100 according to the present embodiment. The electronic component mounting apparatus 100 mounts the electronic component C on the substrate P. The electronic component mounting apparatus 100 is also referred to as a surface mounting apparatus 100 or a mounter 100. The electronic component C may be a lead-type electronic component (insertion-type electronic component) having a lead, or may be a chip-type electronic component (mounted-type electronic component) having no lead. The lead type electronic component is mounted on the substrate P by inserting a lead into the opening of the substrate P. The chip-type electronic component is mounted on the substrate P by being mounted thereon.

As shown in fig. 1, the electronic component mounting apparatus 100 includes: an electronic component supply device 1 for supplying an electronic component C; a mounting head 50 having a suction nozzle 51 detachably holding an electronic component C, for mounting the electronic component C supplied from the electronic component supply device 1 on a substrate P; a head driving device 60 that moves the mounting head 50 in the XY plane; a substrate transfer device 70 that transfers a substrate P on which electronic components C are mounted; and a control device 200 that controls the electronic component mounting device 100 including the electronic component supply device 1.

The electronic component supply device 1 supplies the electronic component C to the mounting head 50. The electronic components C supplied from the electronic component supply apparatus 1 may be the same kind of electronic components or different kinds of electronic components. The electronic components C supplied from the electronic component supply apparatus 1 may be the same size (outer dimensions) or different sizes.

The electronic component supply device 1 is a shuttle-type electronic component supply device that supplies electronic components C to the mounting head 50 using a transfer component called a shuttle component. The electronic component supply device 1 is disposed on one side (+ Y side) of the conveyance path of the substrate P of the substrate conveyance device 70.

The electronic component supply device 1 includes: a tray storage device 3 that stores a plurality of trays T; a support member 4 that supports the tray T drawn out from the tray storage device 3; a transfer head 2 that is movable above a tray T supported by a support member 4 and detachably holds an electronic component C mounted on the tray T; and a 1 st shuttle 11 and a 2 nd shuttle 12 which are movable between the 1 st space SP1 and the 2 nd space SP2 and transfer the electronic component C transferred from the tray T by the transfer head 2 to the mounting head 50.

The transfer head 2 is disposed in the 1 st space SP 1. The 1 st space SP1 is a space in which the transfer head 2 can move. The mounting head 50 is disposed in the 2 nd space SP 2. The 2 nd space SP2 is a space in which the mounting head 50 can move. The 1 st space SP1 and the 2 nd space SP2 are different spaces. The 1 st space SP1 is set on the + Y side of the 2 nd space SP 2.

The substrate P is disposed in the 2 nd space SP 2. The 2 nd space SP2 includes a component supply area. The mounting head 50 can mount the electronic component C arranged in the component supply area on the substrate P. The electronic component C supplied from the 1 st space SP1 to the 2 nd space SP2 by at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 is mounted on the substrate P.

The substrate transfer device 70 transfers the substrate P on which the electronic component C is mounted. The substrate transfer apparatus 70 includes: a guide member 71 that guides the substrate P in the X-axis direction; and an actuator capable of moving the substrate holding device 72 capable of holding the substrate P in the Z-axis direction. The substrate P is guided by the guide member 71 and is movable in the X-axis direction. The substrate transfer device 70 moves the substrate P at least in the X-axis direction. The substrate transfer device 70 may move the substrate P in 6 directions of the X axis, the Y axis, the Z axis, θ X, θ Y, and θ Z. An electronic component C is mounted on at least a part of the surface of the substrate P.

The substrate transport device 70 enables the substrate P to move so that the surface of the substrate P and at least a part of the mounting head 50 face each other. The substrate P is supplied from a substrate supply device (not shown) to the electronic component mounting device 100. The substrate P supplied from the substrate supply device is conveyed to a predetermined position of the guide member 71 and held by the substrate holding device 72. The substrate holding device 72 holds the substrate P such that the surface of the substrate P is parallel to the XY plane. The mounting head 50 mounts the electronic component C on the surface of the substrate P arranged at a predetermined position thereof. After the electronic component C is mounted on the substrate P, the substrate P is conveyed to the apparatus of the next step by the substrate conveying apparatus 70.

The mounting head driving device 60 moves the mounting head 50 in the X-axis direction and the Y-axis direction, respectively. The mounting head driving device 60 includes: an X-axis gantry 61 for moving the mounting head 50 in the X-axis direction; and a Y-axis gantry 62 for moving the mounting head 50 in the Y-axis direction. The suction nozzles 51 are moved in the X-axis direction and the Y-axis direction together with the mounting head 50 by moving the mounting head 50 in the X-axis direction and the Y-axis direction by the mounting head driving device 60.

[ mounting head ]

Fig. 2 is a diagram showing an example of the mounting head 50 according to the present embodiment. As shown in fig. 2, the mounting head 50 has: a suction nozzle 51 that detachably holds the electronic component C; and a substrate imaging device 52 capable of acquiring an image of the substrate P. A plurality of suction nozzles 51 are arranged in the mounting head 50. The plurality of suction nozzles 51 can be driven, respectively. The mounting head 50 is mounted on the substrate P by holding the electronic component C supplied from the electronic component supply device 1 by the suction nozzle 51. The electronic component C is mounted on the substrate P held by the substrate holding device 72 by the suction nozzle 51.

The suction nozzle 51 includes a suction nozzle that sucks and holds the electronic component C. The suction nozzle 51 includes a suction mechanism for sucking and holding the electronic component C. The suction nozzle 51 has an opening provided at a distal end portion and an internal flow path connected to the opening. The gas in the internal flow path of the suction nozzle 51 is sucked by a suction device including a vacuum pump. By performing the suction operation of the nozzle 51 in a state where the tip of the nozzle 51 is in contact with the electronic component C, the electronic component C is sucked and held by the tip of the nozzle 51. By releasing the suction operation of the suction nozzle 51, the electronic component C is released from the suction nozzle 51.

The mounting head 50 has a nozzle driving device 53, and the nozzle driving device 53 can move the nozzles 51 in the Z-axis direction and the θ Z direction. The nozzle drive device 53 includes: a Z-axis drive unit 54 that moves the suction nozzle 51 in the Z-axis direction; and a rotation driving unit 55 that moves (rotates) the suction nozzle 51 in the θ Z direction. The Z-axis drive section 54 includes a Z-axis actuator that generates power that enables the suction nozzle 51 to move in the Z-axis direction. The rotation driving portion 55 includes a θ -axis actuator that generates power that enables the suction nozzle 51 to move in the Z direction.

The nozzles 51 are movable in 4 directions of the X axis, the Y axis, the Z axis, and θ Z by the head driving device 60 and the nozzle driving device 53 provided in the mounting head 50. The suction nozzle 51 may be movable in 6 directions of X, Y, Z, θ X, θ Y, and θ Z.

[ outline of electronic component supply device ]

Fig. 3 is a perspective view showing an example of the electronic component supply device 1 according to the present embodiment. As shown in fig. 3, the electronic component mounting apparatus 1 includes: a tray storage device 3 that stores a plurality of trays T; a support member 4 that supports the tray T drawn out from the tray storage device 3; and a base member 5 that supports the tray storage device 3 and the support member 4. The tray storage device 3 is disposed above (+ Z side) the base member 5. The support member 4 is disposed to protrude from the tray storage 3 to the + Y side.

The base member 5 is supported by a plurality of foot members 6. The leg member 6 includes a height adjustment mechanism capable of adjusting the position of the base member 5 in the Z-axis direction. The electronic component supply device 1 is supported on a support surface such as a floor surface of a factory via a plurality of foot members 6.

A plurality of electronic components C are mounted on the tray T. A tray T on which a plurality of electronic components C are mounted is stored in the tray storage device 3. Further, the tray T on which the electronic component C is not mounted may be stored in the tray storage device 3. In the tray storage device 3, a plurality of trays T are arranged in the Z-axis direction.

The electronic component supply device 1 includes a transport device 7, and the transport device 7 transports the tray T between the internal space and the external space of the tray storage device 3. The conveyor 7 is provided to the support member 4. The conveying device 7 pulls out 1 tray T determined among the plurality of trays T stored in the internal space of the tray storage device 3 from the internal space of the tray storage device 3, and moves to the support member 4 disposed in the external space of the tray storage device 3. Further, the conveyor 7 can move the tray T supported by the support member 4 to the internal space of the tray storage 3. The tray storage 3 has an opening 3K connecting an inner space and an outer space of the tray storage 3. The conveyor 7 can move the tray T between the internal space and the external space of the tray storage 3 through the opening 3K.

The conveyance device 7 includes: a chuck (chuck) mechanism 8 capable of holding a part of the tray T; a table member 9 which movably supports the tray T; and a tray driving device 10 that moves the tray T supported by the table member 9 by moving the table member 9. The tray driving device 10 moves the table member 9 only in the Y-axis direction. The tray driving device 10 includes: an actuator that generates power for moving the table member 9 in the Y-axis direction; and a guide member 10G that guides the table member 9 in the Y-axis direction. The actuator, the guide member 10G, and the table member 9 of the tray driving device 10 are supported on the upper surface 4A of the support member 4. The chuck mechanism 8 is supported by a table member 9.

The electronic component supply device 1 includes: a transfer head 2 having a suction nozzle 13 for detachably holding an electronic component C; and a 1 st shuttle 11 and a 2 nd shuttle 12 which are movable between the 1 st space SP1 and the 2 nd space SP2 and transfer the electronic component C transferred from the tray T by the transfer head 2 to the mounting head 50.

The electronic component supply device 1 further includes: a transfer head driving device 20 for moving the suction nozzles 13 of the transfer head 2 only in the X-axis direction and the Z-axis direction; a tray driving device 10 for moving the tray T only in the Y-axis direction; a 1 st shuttle driving device 14 that moves the 1 st shuttle 11 only in the Y-axis direction; and a 2 nd shuttle driving device 15 that moves the 2 nd shuttle 12 only in the Y-axis direction.

The 1 st shuttle drive device 14 includes: an actuator that generates a power for moving the 1 st shuttle 11 in the Y-axis direction; and a guide member 14G that guides the 1 st shuttle 11 in the Y-axis direction. The actuator of the 1 st shuttle driving device 14, the guide member 14G, and the 1 st shuttle 11 are supported on the upper surface 4A of the support member 4.

The 2 nd shuttle driving device 15 includes: an actuator that generates a power for moving the 2 nd shuttle 12 in the Y-axis direction; and a guide member 15G that guides the 2 nd shuttle member 12 in the Y-axis direction. The actuator of the 2 nd shuttle driving device 15, the guide member 15G, and the 2 nd shuttle 12 are supported on the upper surface 4A of the support member 4.

The 1 st shuttle 11 is a plate-like member, and has an upper surface (support surface) 11A on which the electronic component C is mounted, and a lower surface 11B facing in the opposite direction to the upper surface 11A. The 1 st shuttle member 11 can move from the 1 st space SP1 to the 2 nd space SP2 in a state where the electronic component C is mounted on the upper surface 11A.

The 2 nd shuttle component 12 is a plate-like component, and has an upper surface (support surface) 12A on which the electronic component C is mounted, and a lower surface 12B facing in the opposite direction to the upper surface 12A. The 2 nd shuttle unit 12 can move from the 1 st space SP1 to the 2 nd space SP2 in a state where the electronic component C is mounted on the upper surface 12A.

The configuration of the 1 st shuttle 11 and the configuration of the 2 nd shuttle 12 are substantially the same. In addition, the size of the outer shape of the 1 st shuttle 11 and the size of the outer shape of the 2 nd shuttle 12 are substantially the same.

The 1 st shuttle 11 and the 2 nd shuttle 12 are disposed at different positions in the X-axis direction. The 1 st shuttle 11 is disposed in a space on the-X side of the 2 nd shuttle 12.

The 1 st shuttle 11 and the 2 nd shuttle 12 are disposed at substantially the same height. The position of the upper surface 11A of the 1 st shuttle 11 in the Z-axis direction and the position of the upper surface 12A of the 2 nd shuttle 12 in the Z-axis direction are substantially the same.

The profile of the 1 st shuttle 11 and the profile of the 2 nd shuttle 12 are substantially the same in the XY plane. In the XY plane, the outer shape of the 1 st shuttle 11 and the outer shape of the 2 nd shuttle 12 are smaller than the outer shape of the tray T.

[ transfer head ]

Fig. 4 is a perspective view showing an example of the transfer head 2 and the transfer head driving device 20 according to the present embodiment. The transfer head 2 is movable above the tray T drawn out from the tray stocker 3 and supported by the table member 9 (support member 4). The transfer head 2 is disposed in the opening 3K of the tray stocker 3. At least a part of the transfer head driving device 20 is supported by the wall surface 3W of the tray storage device 3.

The transfer head 2 has a suction nozzle 13 that detachably holds the electronic component C. The transfer head 2 transfers the electronic component C mounted on the tray T supported by the table unit 9 to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12. The transfer head 2 holds the electronic component C mounted on the tray T supported by the table component 9 by the suction nozzle 13. The nozzle 13 mounts the electronic component C on at least one of the 1 st shuttle 11 and the 2 nd shuttle 12.

The suction nozzle 13 includes a suction nozzle that sucks and holds the electronic component C. The suction nozzle 13 includes a suction mechanism for sucking and holding the electronic component C. The suction nozzle 13 has an opening provided at a distal end portion and an internal flow path connected to the opening. The gas in the internal flow path of the suction nozzle 13 is sucked by a suction device including a vacuum pump. By performing the suction operation of the suction nozzle 13 in a state where the tip of the suction nozzle 13 is in contact with the electronic component C, the electronic component C is sucked and held by the tip of the suction nozzle 13. The suction operation of the suction nozzle 13 is released, whereby the electronic component C is released from the suction nozzle 13.

The transfer head driving device 20 moves the suction nozzles 13 only in the X-axis direction and the Z-axis direction. The transfer head driving device 20 includes: an X-axis drive device 21 for moving the transfer head 2 only in the X-axis direction; and a Z-axis drive device 22 for moving the suction nozzle 13 relative to the transfer head 2 only in the Z-axis direction. The suction nozzle 13 is moved in the X-axis direction together with the transfer head 2 by moving the transfer head 2 in the X-axis direction by the X-axis drive device 21.

The X-axis drive device 21 includes: an actuator 23 that generates power for moving the transfer head 2 in the X-axis direction; a transmission mechanism 24 that transmits the power generated by the actuator 23 to the transfer head 2; and a guide member 25 that guides the transfer head 2 in the X-axis direction. In the present embodiment, the actuator 23 includes a rotary motor. The transfer mechanism 24 comprises a belt mounted on the actuator 23 and the transfer head 2. The drive belt is supported by a plurality of pulleys 26. If the actuator 23 is operated, the belt of the transmission mechanism 24 supported by the pulley 26 is moved. If the belt moves, the transfer head 2 is guided by the guide member 25 to move in the X-axis direction.

At least a part of the Z-axis drive device 22 is disposed in the transfer head 2 or the suction nozzle 13. The Z-axis drive device 22 includes an actuator that generates power for moving the suction nozzle 13 in the Z-axis direction relative to the transfer head 2. A cable for supplying power to the actuator of the Z-axis drive device 22 and a tube for connecting the suction device and the internal flow path of the suction nozzle 13 are supported by a cable bearer (27). The cable bearing portion 27 is a member whose bent portion changes depending on the position of the transfer head 2 in the X-axis direction. One end of the cable bearing portion 27 is connected to the transfer head 2. The other end of the cable bearing portion 27 is connected to a fixing member 28 fixed to the wall surface 3W of the tray storage device 3. The cable and the pipe are supported in the cable bearing portion 27, so that even if the transfer head 2 moves in the X-axis direction, a large load is suppressed from acting on the cable and the pipe, or vibration is suppressed from occurring.

The suction nozzle 13 is movable only in 2 directions of the X axis and the Z axis by a transfer head driving device 20 including an X axis driving device 21 and a Z axis driving device 22.

[ control System ]

Fig. 5 is a functional block diagram showing an example of a control system of the electronic component supply device 1 according to the present embodiment. The control system includes: a control device 200; a transfer head 2 including a suction nozzle 13; a transfer head driving device 20; a tray driving device 10; the 1 st shuttle drive device 14; and a 2 nd shuttle drive 15.

The control device 200 includes a computer system. The control device 200 includes: a processor such as a CPU (Central processing Unit); a storage device including an internal memory such as a rom (read Only memory) or a ram (random access memory) and an external memory such as a hard disk device; and an input/output interface circuit capable of inputting/outputting signals among the transfer head 2, the transfer head driving device 20, the tray driving device 10, the 1 st shuttle component driving device 14, the 2 nd shuttle component driving device 15, and the mounting head 50. The processor generates a control signal for controlling the electronic component supply apparatus 1 in accordance with a computer program stored in the storage device. Various functions of the control device 200 are performed by a processor.

As shown in fig. 5, the control device 200 includes: a transfer head position data acquisition unit 201, a transfer head control unit 202, a tray position data acquisition unit 203, a tray control unit 204, a shuttle member position data acquisition unit 210, a shuttle member control unit 220, a relative position determination unit 205, a mounting determination unit 230, and a remaining number acquisition unit 240.

The transfer head position data acquisition unit 201 acquires position data of the nozzles 13 of the transfer head 2 in the XY plane (in the horizontal plane) and position data of the nozzles 13 of the transfer head 2 in the Z-axis direction. The transfer head position data acquisition unit 201 acquires drive amount data of the X-axis drive unit 21 of the transfer head drive unit 20, and acquires position data of the suction nozzles 13 in the X-axis direction based on the drive amount data. The transfer head position data acquisition unit 201 acquires drive amount data of the Z-axis drive unit 22 of the transfer head drive unit 20, and acquires position data of the suction nozzles 13 in the Z-axis direction based on the drive amount data.

Further, a nozzle position detection device, such as an encoder system, capable of detecting the position of the nozzle 13 in the X-axis direction and the Z-axis direction may also be provided. The transfer head position data acquisition unit 201 may acquire the position data of the nozzles 13 in the X-axis direction and the Z-axis direction from the nozzle position detection device.

The transfer head control unit 202 outputs a control signal for controlling the operation of the transfer head 2 including the suction nozzles 13 and a control signal for controlling the transfer head driving device 20.

The tray position data acquisition unit 203 acquires position data of the tray T in the XY plane (in the horizontal plane). The tray position data acquisition unit 203 acquires drive amount data of the tray driving device 10, and acquires position data of the tray T in the Y-axis direction based on the drive amount data.

Further, a tray position detection device such as an encoder system capable of detecting the position of the tray T (table member 9) in the Y-axis direction may also be provided. The tray position data acquiring unit 203 may acquire position data of the tray T in the Y-axis direction from the tray position detecting device.

The tray control unit 204 outputs a control signal for controlling the tray driving device 10.

The shuttle position data acquisition unit 210 includes: a 1 st shuttle position data acquisition unit 211 that acquires position data of the 1 st shuttle 11 within the XY plane (within the horizontal plane); and a 2 nd shuttle position data acquisition unit 212 that acquires position data of the 2 nd shuttle 12 in the XY plane (in the horizontal plane). The 1 st shuttle position data acquiring unit 211 acquires drive amount data of the 1 st shuttle drive device 14, and acquires position data of the 1 st shuttle 11 in the Y axis direction based on the drive amount data. The 2 nd shuttle position data acquiring unit 212 acquires drive amount data of the 2 nd shuttle driving device 15, and acquires position data of the 2 nd shuttle 12 in the Y axis direction based on the drive amount data.

Further, a shuttle position detection device such as an encoder system capable of detecting the position of the 1 st shuttle 11 and the position of the 2 nd shuttle 12 in the Y axis direction may be provided. The shuttle position data acquiring unit 210 may acquire the position data of the 1 st shuttle 11 and the position data of the 2 nd shuttle 12 in the Y axis direction from the shuttle position detecting device.

The shuttle control unit 220 outputs a control signal for controlling the 1 st shuttle drive device 14 and the 2 nd shuttle drive device 15. The shuttle unit controller 220 includes: a 1 st shuttle control unit 221 that outputs a control signal for controlling the 1 st shuttle driving device 14; and a 2 nd shuttle control unit 222 that outputs a control signal for controlling the 2 nd shuttle driving device 15.

The relative position determining unit 205 determines whether or not a part of the tray T overlaps with at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 on the XY plane (horizontal plane) based on the position data of the tray T acquired by the tray position data acquiring unit 203, the position data of the 1 st shuttle 11 acquired by the 1 st shuttle position data acquiring unit 211, and the position data of the 2 nd shuttle 12 acquired by the 2 nd shuttle position data acquiring unit 212.

The transfer head control unit 202 outputs a control signal for controlling the transfer head 2 including the nozzle 13 so that the electronic component C is transferred from the tray T to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 overlapping a part of the tray T, based on the determination result of the relative position determination unit 205.

The mounting determination unit 230 determines whether or not the electronic component C is mounted on the 1 st shuttle 11 or the 2 nd shuttle 12 in the 1 st space SP 1. The mounting determination unit 230 determines whether or not the electronic component C mounted on the tray T is mounted on the 1 st shuttle 11 or the 2 nd shuttle 12 based on the control signal output from the transfer head control unit 202. That is, the mounting determination unit 230 determines whether or not the electronic component C is mounted on the 1 st shuttle 11 or the 2 nd shuttle 12 based on the movement of the transfer head 2 (the transfer operation of the electronic component C from the tray T to the 1 st shuttle 11 or the 2 nd shuttle 12 by the transfer head 2). The mounting determination unit 230 includes: a 1 st mounting determination unit 231 that determines whether or not the electronic component C is mounted on the 1 st shuttle 11; and a 2 nd mounting determination unit 232 that determines whether or not the electronic component C is mounted on the 2 nd shuttle unit 12. The 1 st mounting determination unit 231 determines whether or not an operation (transfer operation) of transferring the electronic component C from the tray T to the 1 st shuttle 11 by the transfer head 2 is performed based on the control signal output from the transfer head control unit 202, and determines whether or not the electronic component C is mounted on the 1 st shuttle 11 based on the determination result.

The 1 st mounting determination unit 231 determines the number of electronic components C mounted on the 1 st shuttle 11 in the 1 st space SP1 based on the number of times of the movement (transfer movement) of transferring the electronic components C from the tray T to the 1 st shuttle 11 by the transfer head 2.

Similarly, the 2 nd mounting determination unit 232 determines whether or not an operation (transfer operation) of transferring the electronic component C from the tray T to the 2 nd shuttle 12 by the transfer head 2 is performed based on the control signal output from the transfer head control unit 202, and determines whether or not the electronic component C is mounted on the 2 nd shuttle 12 based on the determination result. The 2 nd mounting determination unit 232 determines the number of electronic components C mounted on the 2 nd shuttle 12 in the 1 st space SP1 based on the number of times of the operation (transfer operation) of transferring the electronic components C from the tray T to the 2 nd shuttle 12 by the transfer head 2.

An electronic component detection device capable of detecting the electronic component C mounted on the 1 st shuttle 11 in the 1 st space SP1 may be provided. The 1 st mounting determination unit 231 may determine whether or not the electronic component C is mounted on the 1 st shuttle 11 in the 1 st space SP1, or the number of the electronic components C mounted on the 1 st shuttle 11 in the 1 st space SP1, based on the detection result of the electronic component detection apparatus.

The electronic component detection apparatus may further include: a light projection unit that irradiates detection light onto the upper surface 11A of the 1 st shuttle 11; and a light receiving unit capable of receiving the reflected light of the detection light irradiated to the upper surface 11A, wherein the electronic component detection device optically detects the electronic component C mounted on the upper surface 11A of the 1 st shuttle 11 based on the light receiving result of the light receiving unit. When the electronic component C is mounted on the upper surface 11A of the 1 st shuttle 11, the characteristics (for example, the light amount) of the reflected light received by the light receiving unit are different from each other. Therefore, the 1 st mounting determination unit 231 can determine whether or not the electronic component is mounted on the 1 st shuttle 11, or the number of the electronic components C mounted on the 1 st shuttle 11, based on the light reception result of the light receiving unit of the electronic component detection apparatus. The electronic component detection device may include an imaging device capable of acquiring an optical image of the 1 st shuttle 11. The 1 st mounting determination unit 231 may determine whether or not the electronic components are mounted on the 1 st shuttle 11, or the number of the electronic components C mounted on the 1 st shuttle 11, based on the result of the imaging by the imaging device. Similarly, an electronic component detection device capable of detecting the electronic component C mounted on the 2 nd shuttle component 12 in the 1 st space SP1 may be provided. The 2 nd mounting determination unit 232 can determine whether or not the electronic component is mounted on the 2 nd shuttle 12 or the number of the electronic components C mounted on the 2 nd shuttle 12 based on the detection result of the electronic component detection device.

The shuttle control unit 220 outputs a control signal for arranging at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 determined to have the electronic component C mounted in the 1 st space SP1 in the 2 nd space SP2, based on the determination result of the mounting determination unit 230 including the 1 st mounting determination unit 231 and the 2 nd mounting determination unit 232.

The remaining number acquiring unit 240 acquires the remaining number data of the electronic component C mounted on the 1 st shuttle 11 or the 2 nd shuttle 12 in the 2 nd space SP 2. The remaining number acquiring unit 240 acquires data on the remaining number of the electronic components C mounted on the 1 st shuttle component 11 disposed in the 2 nd space SP2 or the remaining number of the electronic components C mounted on the 2 nd shuttle component 12 disposed in the 2 nd space SP2 based on a drive signal for driving the mounting head 50 supplied from the mounting head 50 or the mounting head driving device 60 of the electronic component mounting device 100. That is, the remaining number determining unit 240 obtains the remaining number of the electronic components C mounted on the 1 st shuttle component 11 or the 2 nd shuttle component 12 in the 2 nd space SP2 based on the movement of the mounting head 50 (the mounting operation of the electronic components C mounted on the 1 st shuttle component 11 or the 2 nd shuttle component 12 on the board P by the mounting head 50). The remaining number acquiring unit 240 includes: a 1 st remaining number acquiring unit 241 for acquiring data of the remaining number of the electronic components C mounted on the 1 st shuttle 11 in the 2 nd space SP 2; and a 2 nd remaining number acquiring unit 242 that acquires data of the remaining number of the electronic components C mounted on the 2 nd shuttle 12 in the 2 nd space SP 2. The 1 st remaining number acquiring unit 241 acquires the number data of the operations (mounting operations) performed by the mounting head 50 to mount the electronic components C mounted on the 1 st shuttle component 11 on the substrate P based on the driving signal supplied from the mounting head 50 or the mounting head driving device 60 to drive the mounting head 50, and determines the number of the electronic components C remaining in the 1 st shuttle component 11 in the 2 nd space SP2 based on the number data. Similarly, the 2 nd remaining number acquiring unit 242 determines the number of the electronic components C remaining in the 2 nd shuttle component 12 in the 2 nd space SP2 based on the number data of the number of times of the operation (mounting operation) of mounting the electronic components C mounted on the 2 nd shuttle component 12 on the board P by the mounting head 50 based on the drive signal for driving the mounting head 50 supplied from the mounting head 50 or the mounting head driving device 60.

Further, an electronic component detection device capable of detecting the electronic components C remaining in the 1 st shuttle 11 in the 2 nd space SP2 may be provided. The 1 st remaining number obtaining unit 241 may determine the number of the electronic components C remaining in the 1 st shuttle 11 in the 2 nd space SP2 based on the detection result of the electronic component detecting apparatus. The electronic component detection device comprises: a light projection unit that irradiates detection light onto the upper surface 11A of the 1 st shuttle 11; and a light receiving unit capable of receiving the reflected light of the detection light irradiated to the upper surface 11A, wherein the electronic component detection device optically detects the electronic component C mounted on the upper surface 11A of the 1 st shuttle 11 based on the light receiving result of the light receiving unit. When the electronic component C is left on the upper surface 11A of the shuttle 11 of the 1 st stage, the characteristics (for example, the light amount) of the reflected light received by the light receiving unit are different from those when no electronic component is left. Therefore, the 1 st remaining number acquiring unit 241 can determine the number of the electronic components C remaining in the 1 st shuttle 11 in the 2 nd space SP2 based on the light reception result of the light receiving unit of the electronic component detecting apparatus. The electronic component detection device may include an imaging device capable of acquiring an optical image of the 1 st shuttle 11. The 1 st remaining number acquiring unit 241 can determine the number of the electronic components C remaining in the 1 st shuttle 11 in the 2 nd space SP2 based on the imaging result of the imaging device. Similarly, an electronic component detection device capable of detecting the electronic components C remaining in the 2 nd shuttle 12 in the 2 nd space SP2 is provided, and the 2 nd remaining number acquisition unit 242 may determine the number of the electronic components C remaining in the 2 nd shuttle 12 in the 2 nd space SP2 based on the detection result of the electronic component detection device.

When the 1 st shuttle 11 is disposed in the 2 nd space SP2, the shuttle control unit 220 outputs a control signal for moving the 2 nd shuttle 12 having the electronic component C mounted thereon in the 1 st space SP1 from the 1 st space SP1 to the 2 nd space SP2 before the electronic component C runs out of the 1 st shuttle 11 in the 2 nd space SP2, based on the remaining number data acquired by the 1 st remaining number acquisition unit 241 of the remaining number acquisition unit 240. In addition, when the 2 nd shuttle unit 12 is disposed in the 2 nd space SP2, the shuttle unit control unit 220 outputs a control signal for moving the 1 st shuttle unit 11 having the electronic component C mounted thereon in the 1 st space SP1 from the 1 st space SP1 to the 2 nd space SP2 before the electronic component C runs out of the 2 nd shuttle unit 12 in the 2 nd space SP2, based on the remaining number data acquired by the 2 nd remaining number acquiring unit 242 of the remaining number acquiring unit 240.

[ relationship between tray and 1 st shuttle and 2 nd shuttle ]

Next, the relationship between the tray T and the 1 st shuttle 11 and the 2 nd shuttle 12 according to the present embodiment will be described. Fig. 6 is a schematic view of the electronic component supply device 1 according to the present embodiment as viewed from the-Y side (mounting head 50 side). Fig. 7 is a schematic view of the electronic component supply device 1 according to the present embodiment, as viewed from the + Z side.

As shown in fig. 6 and 7, the electronic component supply device 1 includes: a transfer head 2 disposed in the 1 st space SP1, having a suction nozzle 13 that detachably holds an electronic component C, and movable above a tray T on which a plurality of electronic components C are mounted; a 1 st shuttle component 11 which is movable between a 1 st space SP1 and a 2 nd space SP2, is movable between the transfer head 2 and the tray T in the Z-axis direction, and transfers the electronic component C transferred from the tray T by the transfer head 2 to the mounting head 50 of the 2 nd space SP 2; and a 2 nd shuttle component 12 which is movable between the 1 st space SP1 and the 2 nd space SP2, is movable between the transfer head 2 and the tray T in the Z-axis direction, and transports the electronic component C transferred from the tray T by the transfer head 2 to the mounting head 50 of the 2 nd space SP 2. The 1 st space SP1 is a space located on the + Y side of the 2 nd space SP 2.

The electronic component supply device 1 further includes: a transfer head driving device 20 for moving the suction nozzles 13 of the transfer head 2 only in the X-axis direction and the Z-axis direction; a tray driving device 10 including a table member 9 for supporting the tray T and moving the tray T only in the Y-axis direction; a 1 st shuttle driving device 14 that moves the 1 st shuttle 11 only in the Y-axis direction; and a 2 nd shuttle driving device 15 that moves the 2 nd shuttle 12 only in the Y-axis direction.

The 1 st shuttle 11 and the 2 nd shuttle 12 are disposed at the same height. In the Z-axis direction, the position of the upper surface 11A of the 1 st shuttle 11 and the position of the upper surface 12A of the 2 nd shuttle 12 are substantially the same.

The upper surface (supporting surface) of the tray T on which the electronic component C is mounted includes: a 1 st area AR1 overlapping the 1 st shuttle 11 in the XY plane; a 2 nd area AR2 overlapping the 2 nd shuttle 12 in the XY plane; and a 3 rd area AR3 which is set between the 1 st area AR1 and the 2 nd area AR2 in the X-axis direction and does not overlap with both the 1 st shuttle 11 and the 2 nd shuttle 12. The electronic component C is supported on each of the 1 st area AR1, the 2 nd area AR2, and the 3 rd area AR3 of the tray T. In the tray T after being pulled out from the tray storage device 3 to the support member 4 (table member 9), a plurality of electronic components C are mounted in each of the 1 st area AR1, the 2 nd area AR2, and the 3 rd area AR3 of the tray T. A plurality of electronic components C are arranged in the Y-axis direction in the 1 st area AR 1. A plurality of electronic components C are arranged in the Y-axis direction in the 2 nd area AR 2. A plurality of electronic components C are arranged in the Y-axis direction in the 3 rd area AR 3. In the example shown in fig. 7, 5 electronic components C are mounted in each of the 1 st area AR1, the 2 nd area AR2, and the 3 rd area AR3 of the tray T after being pulled out from the tray storage device 3 to the support member 4.

[ method of supplying electronic component ]

Next, a method of supplying the electronic component C to the mounting head 50 using the electronic component supply device 1 according to the present embodiment will be described. Fig. 8 is a flowchart showing an example of the operation of the electronic component supply device 1 according to the present embodiment. Fig. 9 and 10 are schematic diagrams showing an example of the operation of the electronic component supply device 1 according to the present embodiment.

The controller 200 controls the conveyor 7 to pull out the tray T from the tray storage 3 (step S10). The tray T drawn out from the tray stocker 3 is supported by the table member 9 of the conveyor 7 on the support member 4.

The tray position data acquisition unit 203 acquires position data of the tray T in the Y-axis direction (step S20).

The 1 st shuttle position data acquisition unit 211 acquires position data of the 1 st shuttle 11 in the Y axis direction (step S30).

The 2 nd shuttle position data obtaining unit 212 obtains position data of the 2 nd shuttle 12 in the Y axis direction (step S40).

The 1 st mounting determination unit 231 determines whether or not the electronic component is mounted on the 1 st shuttle unit 11 in the 1 st space SP1 (step S50).

When it is determined at step S50 that the electronic component C is mounted on the 1 st shuttle 11 disposed in the 1 st space SP1 (step S50: Yes), the 1 st shuttle control unit 221 moves the 1 st shuttle 11 having the electronic component C mounted thereon to the 2 nd space SP2 and disposes the electronic component C in the 2 nd space SP2 (step S60).

When it is determined in step S50 that the electronic component C is not mounted on the 1 st shuttle 11 disposed in the 1 st space SP1 (step S50: No), the relative position determination unit 205 determines whether or not a part of the tray T and the 1 st shuttle 11 overlap each other on the XY plane based on the position data of the tray T and the position data of the 1 st shuttle 11 (step S70).

Fig. 9 shows a state in which a part of the tray T after being pulled out from the tray storage device 3 is overlapped with the 1 st shuttle 11 on which the electronic component C is not mounted. Fig. 9 shows a state in which the 2 nd shuttle unit 12 mounted with the electronic component C is disposed in the 2 nd space SP 2. As shown in fig. 9, the 1 st shuttle 11 is disposed above the 1 st area AR1 of the tray T and overlaps the 1 st area AR1 of the tray T in the XY plane. 5 electronic components C are mounted on each of the 1 st area AR1, the 2 nd area AR2, and the 3 rd area AR3 of the tray T after being pulled out from the tray storage device 3.

When it is determined in step S70 that a part of the tray T overlaps the 1 st shuttle 11 (step S70: Yes), the transfer head control unit 202 outputs a control signal to the transfer head 2 and the transfer head driving device 20 so that the electronic component C is transferred from the tray T to the 1 st shuttle 11 determined to overlap the part of the tray T (step S80).

As shown in fig. 9, when the 1 st shuttle 11 overlaps the 1 st area AR1 of the tray T, the transfer head 2 cannot hold the electronic component C placed in the 1 st area AR1 of the tray T by the 1 st shuttle 11 using the nozzles 13. That is, when the 1 st shuttle 11 overlaps the 1 st area AR1 of the tray T, the transfer head 2 cannot transfer the electronic component C disposed in the 1 st area AR1 of the tray T to the 1 st shuttle 11. When the 1 st shuttle 11 overlaps the 1 st area AR1 of the tray T, the transfer head control unit 202 outputs a control signal for transferring at least one of the electronic component C disposed in the 2 nd area AR2 of the tray T and the electronic component C disposed in the 3 rd area AR3 to the 1 st shuttle 11.

For example, when the electronic component C placed in the 3 rd area AR3 of the tray T is transferred to the 1 st shuttle 11, the transfer head control unit 202 controls the X-axis drive unit 21 of the transfer head drive unit 20 to place the transfer head 2 above the 3 rd area AR3 of the tray T. The tray control unit 204 controls the tray driving device 10 to adjust the position of the tray T in the Y axis direction so that the position of the electronic component C in the Y axis direction, which is specified among the plurality of electronic components C arranged in the 3 rd area AR3 of the tray T, coincides with the position of the suction nozzle 13 in the Y axis direction.

The transfer head control unit 202 controls the Z-axis drive unit 22 of the transfer head drive unit 20 to move the suction nozzles 13 in the-Z direction so that the tip portions of the suction nozzles 13 are brought into contact with the electronic components C arranged in the 3 rd area AR3 of the tray T in a state where the transfer head 2 is arranged above the 3 rd area AR3 of the tray T. The transfer head control unit 202 outputs a control signal to the transfer head 2 in a state where the tip of the nozzle 13 is in contact with the electronic component C specified in the plurality of electronic components C arranged in the 3 rd area AR3 of the tray T, and the electronic component C is sucked and held by the nozzle 13. After the electronic component C placed in the 3 rd area AR3 of the tray T is sucked and held by the suction nozzle 13, the transfer head control unit 202 controls the Z-axis drive device 22 of the transfer head drive device 20 to move the electronic component C sucked and held by the suction nozzle 13 in the + Z direction, and controls the X-axis drive device 21 of the transfer head drive device 20 to move the electronic component C sucked and held by the suction nozzle 13 above the 1 st shuttle 11. The transfer head control unit 202 controls the Z-axis drive unit 22 of the transfer head drive unit 20 to move the suction nozzle 13 in the-Z direction in a state where the transfer head 2 is disposed above the 1 st shuttle 11, and mounts the electronic component C sucked and held by the suction nozzle 13 on the 1 st shuttle 11. After the electronic component C sucked and held by the suction nozzle 13 is mounted on the shuttle 11 No. 1, the transfer head control part 202 releases the suction holding of the electronic component C by the suction nozzle 13. Thus, the electronic component C disposed in the 3 rd area AR3 of the tray T is mounted on the 1 st shuttle 11.

In the present embodiment, the suction nozzles 13 of the transfer head 2 are movable only in the X-axis direction and the Z-axis direction. When a part of the tray T overlaps the 1 st shuttle 11, the transfer head 2 is controlled so that the electronic component C is transferred to the 1 st shuttle 11 overlapping the part of the tray T, whereby the electronic component C can be transferred from the tray T to the 1 st shuttle 11 without moving the transfer head 2 in the Y-axis direction.

The transfer head 2 can transfer the plurality of electronic components C to the shuttle 11 No. 1. In the 3 rd area AR3, a plurality of electronic components C are arranged in the Y-axis direction. After transferring any 1 electronic component C among the plurality of electronic components C arranged in the Y axis direction in the 3 rd area AR3 to the 1 st shuttle 11, the tray control unit 204 controls the tray driving device 10 to move the tray T in steps in the Y axis direction so that the position of the other electronic components C in the Y axis direction among the plurality of electronic components C arranged in the 3 rd area AR3 of the tray T coincides with the position of the suction nozzle 13 in the Y axis direction. After the positions of the other electronic components C and the nozzles 13 are aligned in the Y-axis direction, the other electronic components C are transferred to the 1 st shuttle 11 by the transfer head 2. The transfer head control unit 202 can transfer the other electronic component C from the 3 rd area AR3 of the tray T to the 1 st shuttle 11 by moving the transfer head 2 only in the X-axis direction and the Z-axis direction.

The above description has been given of an example in which the electronic component C disposed in the 3 rd area AR3 of the tray T is transferred to the 1 st shuttle 11. The operation of transferring the electronic component C disposed in the 2 nd area AR2 of the tray T to the 1 st shuttle 11 is the same as the operation of transferring the electronic component C disposed in the 3 rd area AR3 of the tray T to the 1 st shuttle 11, and thus detailed description thereof is omitted.

In the present embodiment, it is assumed that 2 electronic components C out of 5 electronic components C arranged in the Y axis direction in the 3 rd area AR3 of the tray T are transferred to the 1

st shuttle

11, and 1 electronic component C out of 5 electronic components C arranged in the Y axis direction in the 2 nd area AR2 of the tray T is transferred to the 1 st shuttle 11. The 1 st shuttle 11 mounts 3 electronic components C. In the shuttle 11 of the 1 st embodiment, a plurality of (3) electronic components C are arranged along the Y axis direction.

After the electronic component C is transferred from at least one of the 2 nd area AR2 and the 3 rd area AR3 of the tray T to the 1 st shuttle 11, it is determined whether or not the electronic component is mounted on the 1 st shuttle 11 in the 1 st space SP1 (step S50). When it is determined that the electronic component C is mounted on the 1 st shuttle 11 disposed in the 1 st space SP1, the 1 st shuttle 11 on which the electronic component C is mounted is moved to the 2 nd space SP2 (step S60).

When it is determined in step S70 that a part of the tray T and the 1 st shuttle 11 do not overlap (step S70: No), the 1 st shuttle control unit 221 controls the 1 st shuttle driving device 14 to adjust the position of the 1 st shuttle 11 in the Y axis direction so that the 1 st shuttle 11 overlaps the 1 st region AR1 of the tray T (step S90).

After the position of the 1 st shuttle 11 in the Y axis direction is adjusted, it is determined whether or not a part of the tray T overlaps the 1 st shuttle 11 (step S70), and the same processing as described above is performed.

In the example shown in fig. 9, the 2 nd shuttle unit 12 mounted with the electronic component C is disposed in the 2 nd space SP 2. The mounting head 50 mounts the electronic component C mounted on the 2 nd shuttle component 12 on the substrate P. The mounting head 50 sequentially mounts the plurality of electronic components C mounted on the 2 nd shuttle component 12 on the board P. As the mounting operation of the electronic components C on the substrate P by the mounting head 50 proceeds, the remaining number of the electronic components C mounted on the 2 nd shuttle component 12 decreases. The 2 nd remaining number acquiring unit 242 acquires remaining number data indicating the number of electronic components C remaining in the 2 nd shuttle 12.

The 1 st shuttle control unit 221 moves the 1 st shuttle 11 mounted with the electronic components C from the 1 st space SP1 to the 2 nd space SP2 before the electronic components C run out from the 2 nd shuttle 12 (before the remaining number of the electronic components C becomes zero) based on the data of the remaining number of the electronic components C remaining in the 2 nd shuttle 12. Thus, the mounting head 50 can mount the electronic component C mounted on the 1 st shuttle component 11 on the board P.

The 2 nd remaining number acquiring unit 242 determines whether or not the number of electronic components C remaining in the 2 nd shuttle 12 is zero. When determining that the number of the electronic components C remaining in the shuttle 212 becomes zero, the shuttle 2 control unit 222 outputs a control signal to the shuttle 2 driving device 15 so that the shuttle 212 that becomes empty moves from the space 2 SP2 to the space 1 SP 1.

After the 2 nd shuttle 12 moves to the 1 st space SP1, the 2 nd mounting determination unit 232 determines whether or not the electronic component is mounted on the 2 nd shuttle 12 in the 1 st space SP1 (step S100).

When it is determined in step S100 that the electronic component C is not mounted on the shuttle 212 disposed in the 1 st space SP1 (step S100: No), the relative position determination unit 205 determines whether or not a part of the tray T overlaps the shuttle 212 on the XY plane based on the position data of the tray T and the position data of the shuttle 2 (step S120).

When it is determined in step S100 that the electronic component C is mounted on the 2 nd shuttle 12 disposed in the 1 st space SP1 (step S100: Yes), the 2 nd shuttle control unit 222 moves the 2 nd shuttle 12 mounted with the electronic component C to the 2 nd space SP2 and disposes the electronic component C in the 2 nd space SP2 (step S110).

Fig. 10 shows a state in which the 1 st shuttle 11 having 3 electronic components C mounted thereon is disposed in the 2 nd space SP2, and the 2 nd shuttle 12 that is empty is disposed in the 1 st space SP 1. As shown in fig. 10, the 2 nd shuttle 12 is disposed above the 2 nd area AR2 of the tray T and overlaps the 2 nd area AR2 of the tray T.

If it is determined in step S120 that a part of the tray T overlaps the shuttle 212 (step S120: Yes), the transfer head control unit 202 outputs a control signal to the transfer head 2 and the transfer head driving device 20 so that the electronic component C is transferred from the tray T to the shuttle 212 determined to overlap the part of the tray T (step S130).

As shown in fig. 10, when the 2 nd shuttle 12 overlaps the 2 nd area AR2 of the tray T, the transfer head 2 cannot transfer the electronic component C disposed in the 2 nd area AR2 of the tray T to the 2 nd shuttle 12 due to the 2 nd shuttle 12. When the 2 nd shuttle 12 overlaps the 2 nd area AR2 of the tray T, the transfer head control unit 202 outputs a control signal for transferring at least one of the 1 st area AR1 electronic component C disposed on the tray T and the 3 rd area AR3 electronic component C to the 2 nd shuttle 12. The transfer head 2 mounts at least one of the electronic component C disposed in the 1 st area AR1 and the electronic component C disposed in the 3 rd area AR3 of the tray T on the 2 nd shuttle 12 based on the control signal output from the transfer head control unit 202.

The transfer head 2 can transfer the plurality of electronic components C to the 2 nd shuttle 12. After transferring 1 electronic component C out of the plurality of electronic components C arranged in the Y axis direction in the tray T to the 2 nd shuttle 12, the tray control unit 204 controls the tray driving device 10 to move the tray T in steps in the Y axis direction so that the position of the other electronic components C in the Y axis direction among the plurality of electronic components C arranged in the tray T coincides with the position of the suction nozzle 13 in the Y axis direction. After the position of the other electronic component C is aligned with the position of the suction nozzle 13 in the Y-axis direction, the other electronic component C is transferred to the 2 nd shuttle 12 by the transfer head 2. The transfer head control unit 202 can transfer the other electronic components C from the tray T to the 2 nd shuttle 12 by moving the transfer head 2 only in the X-axis direction and the Z-axis direction.

After the electronic component C is transferred from at least one of the 1 st area AR1 and the 3 rd area AR3 of the tray T to the 2 nd shuttle member 12, it is determined whether or not the electronic component is mounted on the 2 nd shuttle member 12 in the 1 st space SP1 (step S100). When it is determined that the electronic component C is mounted on the 2 nd shuttle unit 12 disposed in the 1 st space SP1, the 2 nd shuttle unit 12 mounted with the electronic component C is moved to the 2 nd space SP2 (step S110).

When it is determined in step S120 that a part of the tray T and the 2 nd shuttle 12 do not overlap (step S120: No), the 2 nd shuttle control unit 222 controls the 2 nd shuttle driving device 15 to adjust the position of the 2 nd shuttle 12 in the Y axis direction so that the 2 nd shuttle 12 overlaps the 2 nd area AR2 of the tray T (step S140).

After the position of the 2 nd shuttle 12 in the Y axis direction is adjusted, it is determined whether or not a part of the tray T overlaps the 2 nd shuttle 12 (step S120), and the same processing as described above is performed.

In the example shown in fig. 10, the 1 st shuttle 11 mounted with the electronic component C is disposed in the 2 nd space SP 2. The mounting head 50 mounts the electronic component C mounted on the 1 st shuttle component 11 on the substrate P. The mounting head 50 sequentially mounts the plurality of electronic components C mounted on the 1 st shuttle component 11 on the board P. As the mounting operation of the electronic components C on the substrate P by the mounting head 50 proceeds, the remaining number of the electronic components C mounted on the 1 st shuttle component 11 decreases. The 1 st remaining number acquiring unit 241 acquires remaining number data indicating the number of electronic components C remaining in the 1 st shuttle 11.

The 2 nd shuttle control unit 222 moves the 2 nd shuttle 12 mounted with the electronic components C from the 1 st space SP1 to the 2 nd space SP2 before the electronic components C run out from the 1 st shuttle 11 (before the remaining number of the electronic components C becomes zero) based on the data of the remaining number of the electronic components C remaining in the 1 st shuttle 11. Thus, the mounting head 50 can mount the electronic component C mounted on the 2 nd shuttle component 12 on the board P.

The 1 st remaining number acquiring unit 241 determines whether or not the number of electronic components C remaining in the 1 st shuttle 11 is zero. When determining that the number of the electronic components C remaining in the 1 st shuttle 11 becomes zero, the 1 st shuttle control unit 221 outputs a control signal to the 1 st shuttle driving device 14 so that the 1 st shuttle 11 that becomes empty moves from the 2 nd space SP2 to the 1 st space SP 1.

Next, the above-described process is repeated. When the electronic component C mounted on the tray T supported by the table member 9 runs out (when the tray T is empty), the control device 200 controls the conveying device 7 to store the tray T that is empty in the tray storage device 3, and to pull out the tray T on which the electronic component C is mounted from the tray storage device 3 and support the tray by the table member 9.

[ Effect and Effect ]

As described above, according to the present embodiment, since the electronic component C is supplied to the mounting head 50 by at least one of the 1 st shuttle component 11 and the 2 nd shuttle component 12, the interruption period in which the supply of the electronic component C to the mounting head 50 is interrupted is suppressed from becoming long. Further, since the electronic components C are sequentially transferred from the 1 st space SP1 to the 2 nd space SP2 by using the 1 st shuttle component 11 and the 2 nd shuttle component 12, it is possible to supply large electronic components C to the mounting head 50 without increasing the size of the component supply area.

According to the present embodiment, in the 1 st space SP1, the tray T is disposed below the transfer head 2. The 1 st shuttle 11 and the 2 nd shuttle 12 are movable in the Z-axis direction between the transfer head 2 and the tray T. The transfer head 2 transfers the electronic component C from the tray T to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 that overlap a part of the tray T in the XY plane. The tray T is moved stepwise in the Y-axis direction so that the electronic component C specified among the plurality of electronic components C arranged in the Y-axis direction in the tray T is held by the transfer head 2, that is, the specified electronic component C is arranged at the same position as the suction nozzle 13 of the transfer head 2 in the Y-axis direction. This suppresses the moving distance of the transfer head 2 when the electronic component C is mounted on at least one of the 1 st shuttle 11 and the 2 nd shuttle 12. Therefore, the electronic component supply device 1 is prevented from being large and complicated, and the device cost is reduced.

Further, according to the present embodiment, the shuttle control unit 220 is provided, and the shuttle control unit 220 arranges at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 on which the electronic component C is mounted in the 2 nd space SP2 based on the determination result of the 1 st mounting determination unit 231 and the determination result of the 2 nd mounting determination unit 232, and the 1 st mounting determination unit 231 determines whether or not the electronic component is mounted on the 1 st shuttle 11, and the 2 nd mounting determination unit 232 determines whether or not the electronic component is mounted on the 2 nd shuttle 12. Therefore, at least one of the 1 st shuttle unit 11 mounted with the electronic component C and the 2 nd shuttle unit 12 mounted with the electronic component C is disposed in the 2 nd space SP 2. Thereby, the interruption of the supply of the electronic component C to the mounting head 50 is suppressed.

Further, according to the present embodiment, the 1 st remaining number acquiring unit 241 and the 2 nd remaining number acquiring unit 242 are provided, the 1 st remaining number acquiring unit 241 acquires the data of the remaining number of the electronic components C mounted on the 1 st shuttle 11 in the 2 nd space SP2, and the 2 nd remaining number acquiring unit 242 acquires the data of the remaining number of the electronic components C mounted on the 2 nd shuttle 12 in the 2 nd space SP 2. Thus, the shuttle control unit 220 can move the 2 nd shuttle member 12 mounted with the electronic component C from the 1 st space SP1 to the 2 nd space SP2 before the electronic component C runs out of the 1 st shuttle member 11 arranged in the 2 nd space SP2, or can move the 1 st shuttle member 11 mounted with the electronic component C from the 1 st space SP1 to the 2 nd space SP2 before the electronic component C runs out of the 2 nd shuttle member 12 arranged in the 2 nd space SP2, based on the remaining number data. Therefore, the interruption of the supply of the electronic component C to the mounting head 50 is suppressed.

In addition, according to the present embodiment, the transfer head 2 is movable only in the X-axis direction and the Z-axis direction, the tray T is movable only in the Y-axis direction, and the 1 st shuttle 11 and the 2 nd shuttle 12 are movable only in the Y-axis direction. By stepping the tray T in the Y-axis direction, the transfer head 2 can smoothly transfer any of the plurality of electronic components C mounted on the tray T to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12. In addition, in a state where the number of control axes of the transfer head driving device 20, the tray driving device 10, the 1 st shuttle driving device 14, and the 2 nd shuttle driving device 15 is reduced, it is possible to perform a process of transferring the electronic component C of the tray T to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12, and a process of moving at least one of the 1 st shuttle 11 and the 2 nd shuttle 12 on which the electronic component C is mounted. Therefore, the electronic component supply device 1 can be prevented from being large and complicated, and the device cost can be reduced.

In addition, according to the present embodiment, the 1 st shuttle 11 and the 2 nd shuttle 12 are disposed at different positions in the X axis direction. Therefore, the 1 st shuttle 11 and the 2 nd shuttle 12 can smoothly move in the Y-axis direction without interfering with each other.

In addition, according to the present embodiment, the 1 st shuttle 11 and the 2 nd shuttle 12 are disposed at the same height. Thus, the amount of movement of the transfer head 2 in the Z-axis direction is substantially the same in each of the process of transferring the electronic component C from the tray T to the 1 st shuttle 11 and the process of transferring the electronic component C from the tray T to the 2 nd shuttle 12. Similarly, the amount of movement of the mounting head 50 in the Z-axis direction is substantially the same in each of the process of acquiring the electronic component C from the 1 st shuttle component 11 and the process of acquiring the electronic component C from the 2 nd shuttle component 12. Therefore, the load of the control of each of the transfer head 2 and the mounting head 50 is reduced.

In addition, according to the present embodiment, the tray T includes: the 1 st area AR1 overlapping the 1 st shuttle 11, the 2 nd area AR2 overlapping the 2 nd shuttle 12, and the 3 rd area AR not overlapping both the 1 st shuttle 11 and the 2 nd shuttle 12 are set between the 1 st area AR1 and the 2 nd area AR2 in the X-axis direction. The electronic components C are mounted on the 1 st area AR1, the 2 nd area AR2, and the 3 rd area AR3 of the tray T, respectively. Thus, when the 1 st shuttle 11 overlaps the tray T, the transfer head 2 can transfer the electronic component C from at least one of the 2 nd area AR2 and the 3 rd area AR3 to the 1 st shuttle 11. When the 2 nd shuttle 12 overlaps the tray T, the transfer head 2 can transfer the electronic component C from at least one of the 1 st area AR1 and the 3 rd area AR3 to the 2 nd shuttle 12. When both the 1 st shuttle 11 and the 2 nd shuttle 12 overlap the tray T, the transfer head 2 can transfer the electronic component C from the 3 rd area AR3 to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12.

In addition, according to the present embodiment, the outer shape of the 1 st shuttle 11 and the outer shape of the 2 nd shuttle 12 are smaller than the outer shape of the tray T. Therefore, the electronic component supply device 1 can be miniaturized and simplified. Further, since the 1 st shuttle 11 and the 2 nd shuttle 12 are reduced in weight, the load of the 1 st shuttle driving device 14 that drives the 1 st shuttle 11 and the load of the 2 nd shuttle driving device 15 that drives the 2 nd shuttle 12 are reduced. Further, since the outer shape of the 1 st shuttle 11 and the outer shape of the 2 nd shuttle 12 are smaller than the outer shape of the tray T, the transfer head 2 can smoothly transfer the electronic component C from the tray T to the 1 st shuttle 11 and the 2 nd shuttle 12 in a state where the 1 st shuttle 11 and the 2 nd shuttle 12 are overlapped with the tray T.

[ other embodiments ]

In the above-described embodiment, in a state where the 2 nd shuttle unit 12 is disposed in the 1 st space SP1 and the 1 st shuttle unit 11 is disposed in the 2 nd space SP2, the shuttle unit control unit 220 may move the 2 nd shuttle unit 12 having the electronic component C mounted thereon from the 1 st space SP1 to the 2 nd space SP2 before the 1 st shuttle unit 11 moves from the 2 nd space SP2 to the 1 st space SP1 based on the position data of the 1 st shuttle unit 11 acquired by the 1 st shuttle unit position data acquisition unit 211. Even if the electronic component C runs out of the 1 st shuttle component 11 disposed in the 2 nd space SP2 due to the mounting operation of the electronic component C by the mounting head 50, or the 1 st shuttle component 11 is required to move from the 2 nd space SP2 to the 1 st space SP1 due to any cause such as an abnormality in the operation of the 1 st shuttle component 11 in the 2 nd space SP2, the 2 nd shuttle component 12 mounted with the electronic component C is moved from the 1 st space SP1 to the 2 nd space SP2 before the 1 st shuttle component 11 moves from the 2 nd space SP2 to the 1 st space SP1, thereby suppressing interruption of the supply of the electronic component C to the mounting head 50.

Similarly, in a state where the 1 st shuttle unit 11 is disposed in the 1 st space SP1 and the 2 nd shuttle unit 12 is disposed in the 2 nd space SP2, the shuttle unit controller 220 may move the 1 st shuttle unit 11 mounted with the electronic component C from the 1 st space SP1 to the 2 nd space SP2 before the 2 nd shuttle unit 12 moves from the 2 nd space SP2 to the 1 st space SP1 based on the position data of the 2 nd shuttle unit 12 acquired by the 2 nd shuttle unit position data acquiring unit 212.

In the above-described embodiment, the transfer head 2 is configured to transfer the electronic component C mounted on the tray T in the 1 st space SP1 to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12. In the 1 st space SP1, a plurality of electronic components C may be mounted on a table member (9) which is a component of the electronic component supply device 1, and the transfer head 2 may transfer the electronic components C mounted on the table member in the 1 st space SP1 to at least one of the 1 st shuttle 11 and the 2 nd shuttle 12.

In the above-described embodiment, the

suction nozzles

51 and 13 are suction nozzles for suction-holding the electronic component C. One or both of the

suction nozzles

51 and 13 may be a holding suction nozzle for holding the electronic component C by holding the electronic component C therebetween.

Claims

1. An electronic component supply device is provided with:

a transfer head which is disposed in the 1 st space, has a suction nozzle for detachably holding an electronic component, and is movable above a tray on which a plurality of the electronic components are mounted;

a 1 st shuttle component which is movable between the 1 st space and a 2 nd space in which a mounting head which mounts the electronic component on a substrate is movable, the shuttle component being disposed in the 1 st space so as to overlap with a 1 st area of the tray, and the shuttle component being configured to transport the electronic component transferred from the tray by the transfer head to the mounting head;

a 2 nd shuttle component which is movable between the 1 st space and the 2 nd space, is disposed in the 1 st space so as to overlap with the 2 nd area of the tray, and conveys the electronic component transferred from the tray by the transfer head to the mounting head;

a tray position data acquisition unit that acquires position data of the tray in a horizontal plane;

a 1 st shuttle position data acquiring unit configured to acquire position data of the 1 st shuttle in a horizontal plane;

a 2 nd shuttle position data acquiring unit configured to acquire position data of the 2 nd shuttle in a horizontal plane;

a relative position determination unit that determines whether or not a part of the tray overlaps at least one of the 1 st shuttle and the 2 nd shuttle on the horizontal plane based on the position data of the tray, the position data of the 1 st shuttle, and the position data of the 2 nd shuttle; and

a transfer head control unit configured to control the transfer head so that the electronic component is transferred from the tray to at least one of the 1 st shuttle and the 2 nd shuttle overlapping a part of the tray based on a determination result of the relative position determination unit,

the 2 nd shuttle unit is disposed in the 2 nd space when the 1 st shuttle unit is disposed in the 1 st space, the 1 st shuttle unit is disposed in the 2 nd space when the 2 nd shuttle unit is disposed in the 1 st space,

the transfer head control unit transfers the electronic component from an area of the tray not overlapping with the 1 st shuttle to the 1 st shuttle overlapping with the 1 st area, and transfers the electronic component from an area of the tray not overlapping with the 2 nd shuttle to the 2 nd shuttle overlapping with the 2 nd area.

2. The electronic component supply device according to claim 1, comprising:

a 1 st mounting determination unit configured to determine whether or not the electronic component is mounted on the 1 st shuttle unit;

a 2 nd mounting determination unit configured to determine whether or not the electronic component is mounted on the 2 nd shuttle unit; and

and a shuttle member control unit configured to arrange at least one of the 1 st shuttle member and the 2 nd shuttle member, on which the electronic component is mounted, in the 2 nd space based on a determination result of the 1 st mounting determination unit and a determination result of the 2 nd mounting determination unit.

3. The electronic parts supply apparatus according to claim 2,

a remainder acquiring unit configured to acquire remainder data of the electronic components mounted on the 1 st shuttle in the 2 nd space,

the shuttle control unit moves the 2 nd shuttle unit mounted with the electronic component to the 2 nd space before the electronic component is used up from the 1 st shuttle unit based on the remaining number data.

4. The electronic parts supply apparatus according to claim 2 or 3,

the shuttle control unit moves the 2 nd shuttle unit having the electronic component mounted thereon to the 2 nd space before the 1 st shuttle unit moves from the 2 nd space to the 1 st space based on the position data of the 1 st shuttle unit.

5. The electronic component supply device according to any one of claims 1 to 3, comprising:

a transfer head driving device for moving the suction nozzle of the transfer head only in the 1 st axis direction and the vertical direction in the horizontal plane;

a tray driving device which moves the tray only in a 2 nd axis direction within the horizontal plane orthogonal to the 1 st axis direction;

a 1 st shuttle drive device that moves the 1 st shuttle only in the 2 nd axis direction; and

a 2 nd shuttle drive device that moves the 2 nd shuttle only in the 2 nd axis direction.

6. The electronic parts supply apparatus according to claim 5,

the 1 st shuttle and the 2 nd shuttle are disposed at different positions in the 1 st axis direction.

7. The electronic parts supply apparatus according to claim 6,

the 1 st shuttle and the 2 nd shuttle are disposed at the same height.

8. The electronic parts supply apparatus according to claim 5,

the tray includes the 1 st area, the 2 nd area, and the 3 rd area, the 3 rd area is set between the 1 st area and the 2 nd area in the 1 st axis direction, and does not overlap with both the 1 st shuttle and the 2 nd shuttle,

the electronic component is supported in the 1 st region, the 2 nd region, and the 3 rd region, respectively.

9. The electronic component supply device according to any one of claims 1 to 3, 6 to 8,

the profile of the 1 st shuttle and the profile of the 2 nd shuttle are smaller than the profile of the tray.

10. An electronic component mounting apparatus includes:

the electronic component supply device of any one of claim 1 to claim 9; and

and a mounting head having a suction nozzle for detachably holding the electronic component, and mounting the electronic component supplied from the electronic component supply device on a substrate.

11. An electronic component mounting apparatus includes:

a mounting head which is disposed in the 2 nd space and mounts the electronic component on a substrate;

a 1 st shuttle component which is movable between the 1 st space and the 2 nd space, is arranged in the 1 st space so as to overlap with a 1 st area of the tray, and conveys the electronic component transferred from the tray by the transfer head to the mounting head;