WO2023221178A1 - Led显示面板及制作方法 - Google Patents

Led显示面板及制作方法 Download PDF

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Publication number
WO2023221178A1
WO2023221178A1 PCT/CN2022/096439 CN2022096439W WO2023221178A1 WO 2023221178 A1 WO2023221178 A1 WO 2023221178A1 CN 2022096439 W CN2022096439 W CN 2022096439W WO 2023221178 A1 WO2023221178 A1 WO 2023221178A1
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WO
WIPO (PCT)
Prior art keywords
transparent electrode
conductive member
substrate
display panel
led
Prior art date
Application number
PCT/CN2022/096439
Other languages
English (en)
French (fr)
Inventor
郑泽科
Original Assignee
惠州华星光电显示有限公司
Tcl华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠州华星光电显示有限公司, Tcl华星光电技术有限公司 filed Critical 惠州华星光电显示有限公司
Priority to US17/758,134 priority Critical patent/US20240194841A1/en
Publication of WO2023221178A1 publication Critical patent/WO2023221178A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the present application relates to the field of display technology, and specifically relates to an LED display panel and a manufacturing method.
  • This application provides an LED display panel, including:
  • An LED array including a plurality of LED chips arranged in an array on the substrate;
  • a conductive member is disposed between the LED chip and the substrate.
  • the LED chip is fixed and electrically connected to the substrate through the conductive member.
  • the conductive member includes a light-curing conductive glue, and the light-curing conductive glue Transform from liquid to solid state under visible light conditions;
  • the conductive member has viscosity and the viscosity is adjustable.
  • This application also provides an LED display panel, including:
  • An LED array including a plurality of LED chips arranged in an array on the substrate;
  • a conductive member is disposed between the LED chip and the substrate, and the LED chip is fixed and electrically connected to the substrate through the conductive member;
  • the conductive member has viscosity and the viscosity is adjustable.
  • This application also provides a method for manufacturing an LED display panel, including:
  • the plurality of LED chips are energized, and the viscosity of the corresponding conductive member is adjusted according to the light-emitting state of the plurality of LED chips.
  • This application also proposes a method for manufacturing an LED display panel, including:
  • the plurality of LED chips are energized, and the viscosity of the corresponding conductive member is adjusted according to the light-emitting state of the plurality of LED chips.
  • a conductive member with viscosity is provided between the LED chip and the substrate and the viscosity of the conductive member is adjustable, so that the conductive member is kept at a lower viscosity level before testing the LED chip.
  • the viscosity of the conductive parts corresponding to the LED chip with normal light emission is increased to achieve fixation, while the viscosity of the conductive parts corresponding to the LED chip with abnormal light emission remains unchanged or even reduced, so that the LED chip can be directly replaced from the substrate or the LED can be repaired.
  • the viscosity of the conductive parts corresponding to the LED chip is enhanced until it is fixed, ultimately achieving efficient LED detection and repair, effectively improving the efficiency of LED detection and repair.
  • Figure 1 is a schematic structural diagram of the display panel of the present application before the LED chip is transferred to the substrate;
  • Figure 2 is a first structural schematic diagram of the display panel described in this application.
  • Figure 3 is a schematic structural diagram of the display panel in this application completing the testing stage
  • Figure 4 is a second structural schematic diagram of the display panel described in this application.
  • Figure 5 is a third structural schematic diagram of the display panel described in this application.
  • Figure 6 is a fourth structural schematic diagram of the display panel described in this application.
  • FIG. 7 is a flow chart of the manufacturing process of the display panel according to the present application.
  • the present application provides an LED display panel, including a substrate 100 , an LED array, and a conductive member 300 .
  • the LED array includes a plurality of LED chips 200 arrayed on the substrate 100 .
  • the conductive member 300 is disposed between the LED chip 200 and the substrate 100.
  • the LED chip 200 is fixed and electrically connected to the substrate 100 through the conductive member 300.
  • the conductive member 300 has adhesiveness and adjustable viscosity. .
  • a conductive member 300 with viscosity is provided between the LED chip 200 and the substrate 100 and the viscosity of the conductive member 300 is adjustable, so that the conductive member 300 can be kept at a low temperature before testing the LED chip 200 .
  • the viscosity level after completing the test of the LED chip 200, the viscosity of the conductive member 300 corresponding to the LED chip 200 that emits normal light is increased to achieve fixation, while the viscosity of the conductive member 300 corresponding to the LED chip 200 that emits abnormal light remains unchanged or even reduced, thereby The LED chip 200 can be directly replaced or repaired from the substrate 100. After the replacement or repair is completed, the viscosity of the conductive member 300 corresponding to the LED chip 200 can be enhanced to fix it, ultimately achieving efficient LED detection and repair, effectively improving LED detection. and patching efficiency.
  • the substrate 100 may be a transparent glass substrate 100 or a polyimide substrate 100 or the like.
  • the LED chip 200 can be an ordinary LED, or a Mini-LED, Micro-LED, etc.
  • the conductive member 300 may be photosensitive glue, heat-sensitive glue, pressure-sensitive glue, water-soluble glue, etc. mixed with conductive particles.
  • the viscosity of the conductive member 300 is adjustable can include two situations.
  • the first situation is: the viscosity of the conductive member 300 can be adjusted reversibly, that is, the viscosity of the conductive member 300 can be adjusted from low viscosity to High viscosity, and can be adjusted from high viscosity to low viscosity, such as hot melt glue, hydrogel made of polyhydroxyethyl methacrylate polymer similar to the principle of "snail slime", acrylic hydrogel, etc.
  • the second case is: the viscosity of the conductive member 300 is irreversibly adjusted, that is, the viscosity of the conductive member 300 can be adjusted from low viscosity to high viscosity until solidified from the mucus state to a solid state. At this time, the viscosity of the conductive member 300 cannot be adjusted anymore. Because it has low viscosity, it cannot be restored to a low-viscosity liquid state, such as ultraviolet curable adhesive, pressure-sensitive adhesive, etc.
  • the conductive member 300 includes a photo-curing conductive glue, which changes from a liquid state to a solid state under visible light conditions.
  • the light-curing conductive adhesive is the above-mentioned photosensitive adhesive with "irreversible" viscosity adjustment, and the light-curing conductive adhesive can automatically solidify into a solid state under the irradiation of visible light, thereby connecting the LED chip 200 with the substrate. 100 for fixation.
  • the conductive member 300 is set as a light-curing conductive glue. After the LED chip 200 is transferred to the substrate 100 and the test of the LED chip 200 is completed, visible light is used to illuminate the LED chip that emits normal light. 200 corresponds to the conductive member 300 (i.e., the light-curing conductive glue), which solidifies the light-curing conductive glue to fix the LED chip 200 that emits normal light on the substrate 100; the LED chip 200 that emits abnormal light is shielded to make it corresponding
  • the conductive part 300 i.e., photo-curable conductive glue
  • the abnormal LED chip 200 is not fixed to the substrate 100, and the abnormal LED chip 200 can be directly repaired or directly removed from the base plate 100.
  • the substrate 100 is removed or the abnormal LED chip 200 is directly attached to the transfer device and taken away, so that the LED chip 200 with abnormal light emission can be repaired and replaced more quickly and conveniently, thereby improving the repair efficiency.
  • the LED chip 200 may include a light-emitting part 210 and an electrode part 220 electrically connected to the light-emitting part 210 .
  • the light-emitting part 210 may be located on a side of the LED chip 200 away from the substrate 100 , that is, close to the light-emitting side of the display panel.
  • the electrode part 220 may be located between the LED chip 200 and the substrate 100 , to achieve electrical connection between the LED chip 200 and the substrate 100 .
  • the light-emitting part 210 may be a semiconductor light-emitting part of the LED chip 200
  • the electrode part 220 may be a chip electrode electrically connected to the semiconductor light-emitting part.
  • the electrode part 220 includes at least one transparent electrode, and the transparent electrode is connected to the conductive member 300 .
  • the transparent electrode can be prepared from a transparent conductive film material, such as indium tin oxide (ITO).
  • ITO indium tin oxide
  • the display panel can fix the normal LED chip 200 and the substrate 100 during the LED chip 200 testing stage without affecting the rapid repair and replacement of abnormal chips, further improving the detection of the LED chip 200 and repair efficiency.
  • a light-shielding wall 600 may be provided in the space, and the light-shielding wall 600 may be disposed on the substrate 100 .
  • the light-shielding walls 600 on the peripheral side of each LED chip 200 may be continuously arranged to form a closed rectangular frame, which encloses the LED chip 200 therein.
  • the distance from the side of the light-shielding wall 600 away from the substrate 100 to the substrate 100 is greater than or equal to the distance from the side of the LED chip 200 away from the substrate 100 to the substrate 100 distance.
  • the height of the light-shielding wall 600 on the substrate 100 may be greater than or equal to the LED chip. 200 on the substrate 100, so that the light-shielding wall 600 can fully block the side light of the LED chip 200.
  • the light-shielding wall 600 is provided so that the light-shielding wall 600 can block the light emitted from the side of each LED chip 200, thereby avoiding or reducing abnormal light exposure from the normally emitting LED chip 200 during the test phase.
  • the conductive member 300 corresponding to the LED chip 200 causes it to solidify, thereby improving the manufacturing yield of the display panel.
  • the substrate 100 may include an electrode connection part (not shown in the figure) electrically connected to the electrode part 220 of the LED chip 200 .
  • the electrode connection part may include The positive electrode connection part and the negative electrode connection part are electrically connected to the pixel driving circuit on the substrate 100, and when the substrate 100 is in an energized state, the There is an operating voltage on the electrode connection portion that can drive the LED chip 200 to emit light.
  • the electrode portion 220 corresponding to one LED chip 200 may include two insulated transparent electrodes, and the two transparent electrodes respectively constitute the positive electrode and the negative electrode of the LED chip 200 .
  • the electrode portion 220 of the LED chip 200 may include a first transparent electrode 221 and a second transparent electrode 222 , and the first transparent electrode 221 and the second transparent electrode 222 may respectively serve as electrodes of the LED chip 200 . Positive and negative poles.
  • the number of the conductive members 300 is consistent with that of the transparent electrodes.
  • the conductive member 300 may include a first conductive part 310 electrically connected to the first transparent electrode 221 and a second conductive part 320 electrically connected to the second transparent electrode 222 .
  • the first transparent electrode 221 needs to correspond to the position of the positive electrode connection part
  • the second transparent electrode 222 needs to correspond to the position of the negative electrode connection part. location correspondence.
  • the first conductive part 310 needs to be insulated from the second conductive part 320 to prevent the positive and negative electrodes of the LED chip 200 from being short-circuited by the first conductive part 310 and the second conductive part 320 The problem.
  • the conductive member 300 may be disposed on the electrode connection part, and the orthographic projection of the electrode connection part on the conductive member 300 may be located within the conductive member 300, so that the conductive member The component 300 can completely cover the electrode connection portion, thereby fully adhering the electrode portion 220 of the LED chip 200 to the substrate 100, thereby improving the adhesion strength of the LED chip 200 and the substrate 100.
  • the first conductive part 310 and the second conductive part 320 may be provided separately to achieve mutual insulation.
  • the distance between the first conductive part 310 and the second conductive part 320 is less than or equal to the distance between the first transparent electrode 221 and the second transparent electrode 222 .
  • the first direction is parallel to the connecting direction of the first transparent electrode 221 and the second transparent electrode 222 .
  • the orthographic projection of the first transparent electrode 221 on the first conductive part 310 can be completely located within the first conductive part 310 , and the second transparent electrode 222 is on the first conductive part 310 .
  • the orthographic projections on the two conductive parts 320 can all be located within the second conductive part 320 , the first conductive part 310 can play a sufficient adhesion and fixation role on the first transparent electrode 221 , and the second conductive part 310 can fully adhere and fix the first transparent electrode 221 .
  • 320 can play a sufficient adhesion and fixation effect on the second transparent electrode 222 .
  • the LED chip 200 may further include an insulating part 230 disposed between the first transparent electrode 221 and the second transparent electrode 222 .
  • the insulating part 230 It can be made of insulating materials, such as SiOx, SiNx and other inorganic insulating materials, or the insulating part 230 can also be made of organic insulating materials, which is not specifically limited in this embodiment.
  • the thickness of the insulating part 230 may be equal to the thickness of the first transparent electrode 221 or the second transparent electrode 222 and the thickness of the conductive member 300
  • the insulating part 230 can not only realize the insulation arrangement of the first transparent electrode 221 and the second transparent electrode 222, but also The insulation arrangement of the first conductive part 310 and the second conductive part 320 is realized, thereby fully improving the stability of the electrical connection structure between the LED chip 200 and the substrate 100 and reducing circuit faults such as short circuits.
  • the conductive member 300 can be disposed on the transparent electrode of the LED chip 200, and the orthographic projection of the transparent electrode on the conductive member 300 is located on the conductive member 300. 300, so that the conductive member 300 can completely cover the transparent electrode, thereby improving the connection strength between the transparent electrode and the electrode connection portion on the substrate 100.
  • a light-curing conductive adhesive can be coated or sprayed on the transparent electrode of the LED chip 200 to form the conductive member 300 , so that the conductive member 300 can be formed.
  • the alignment process or steps required when disposing the conductive member 300 on the substrate 100 are omitted, effectively improving the production efficiency of the display panel and the alignment of the LED chip 200, the conductive member 300, and the substrate 100. bit precision.
  • a plurality of positioning grooves 400 may be provided in an array on the substrate 100 .
  • the conductive members 300 are located in the positioning grooves 400 .
  • the positioning grooves 400 can be aligned with each other.
  • the conductive member 300 performs position restriction to reduce the positional deviation of the conductive member 300 and the LED chip 200 on the substrate 100 and improve transfer accuracy and yield.
  • the depth of the positioning groove 400 may be equal to the thickness of the conductive member 300 , and the depth of the positioning groove 400 may be less than or equal to the thickness of the conductive member 300 and the thickness of the transparent electrode.
  • the positioning groove 400 can have a better anti-glue overflow effect, reducing glue overflow when the conductive member 300 is in a mucus state, thereby preventing the first conductive part 310 and the second conductive part 320 from interfering with each other. Glue overflow from the conductive component 300 may cause a short circuit problem.
  • the depth of the positioning groove 400 may also be greater than the thickness of the conductive member 300, and the depth of the positioning groove 400 may be less than or equal to the thickness of the conductive member. 300 and the thickness of the transparent electrode, that is to say, the LED chip 200 may be partially located in the conductive groove. At this time, the positioning groove 400 can not only prevent the conductive member 300 from overflowing, but also position the LED chip 200 and prevent position deviation.
  • a plurality of barrier members 500 may be provided in an array on the substrate 100 .
  • the barrier members 500 may be provided with positioning grooves 400 corresponding to the LED chips 200 .
  • the shape and size of the positioning groove 400 may be consistent with the shape and size of the LED chip 200 .
  • the conductive member 300 may be disposed in the positioning groove 400 of the barrier member 500.
  • the depth of the positioning groove 400 may be greater than or equal to the conductive member.
  • the thickness of the conductive member 300 and the depth of the positioning groove 400 may be less than or equal to the sum of the thicknesses of the conductive member 300 and the transparent electrode, so that the barrier member 500 surrounds the conductive member 300 to form a barrier. wall, thereby preventing the conductive component 300 from overflowing glue.
  • the LED chip 200 can also be partially located in the positioning groove 400 of the barrier member 500, so that the barrier member 500 can use the positioning groove 400 to play a good positioning and restricting role on the LED chip 200. The position stability of the LED chip 200 on the substrate 100 is improved.
  • an embodiment of the present application also provides a method for manufacturing an LED display panel, which is used to manufacture the display panel in the above embodiment.
  • the manufacturing method of the LED display panel includes:
  • the conductive member 300 can be a light-curing conductive glue.
  • the light-curing conductive glue can be automatically cured under visible light irradiation, that is, the light-curing conductive glue can be a liquid with low viscosity. Solidifies into a more viscous solid state.
  • the transparent electrode of the LED chip 200 may be electrically connected to the substrate 100 through the conductive member 300 .
  • S400 energize the plurality of LED chips 200, and adjust the viscosity of the corresponding conductive member 300 according to the light-emitting states of the plurality of LED chips 200.
  • the power-on detection of the LED chip 200 can be achieved by energizing the substrate 100, and by adjusting the viscosity of the conductive parts 300 corresponding to the plurality of LED chips 200, so that the LEDs that emit light normally can
  • the viscosity of the conductive member 300 corresponding to the chip 200 increases, and the viscosity of the conductive member 300 of the LED chip 200 that emits abnormal light remains unchanged or decreases.
  • adjusting the viscosity of the conductive members 300 corresponding to the plurality of LED chips 200 can be realized by whether the LED chips 200 emit light. Specifically, when the substrate 100 is energized, the qualified LED chip 200 emits light normally after being energized, and the visible light emitted by it is irradiated onto the photo-curing conductive glue through the transparent electrode, causing the photo-curing conductive glue to solidify to achieve The qualified LED chip 200 has a fixed electrical connection with the substrate 100; while the problematic LED chip 200 (i.e., the broken lamp) does not emit light, the viscosity of the light-curing conductive adhesive corresponding to the abnormal LED chip 200 remains unchanged.
  • the problematic LED chip 200 i.e., the broken lamp
  • the photo-curing conductive adhesive corresponding to the abnormal LED chip 200 remains in a liquid state with low viscosity, so that the LED chip 200 can be directly replaced from the substrate 100 Or repair the LED chip 200. After the replacement or repair is completed, the adhesiveness of the conductive member 300 corresponding to the LED chip 200 is enhanced to fix it, ultimately achieving efficient LED detection and repair, effectively improving the efficiency of LED detection and repair.
  • the solder paste used to connect the LED chip 200 and the substrate 100 in conventional technology is replaced with a conductive member 300 with adjustable viscosity, and the conductive member 300 is preferably a photo-curing conductive adhesive, and the LED chip is
  • the electrode of 200 is set as a transparent electrode, so that when the LED chip 200 is detecting a bad light, the visible light emitted by the normal LED chip 200 can be irradiated to the light-curing conductive adhesive through the transparent electrode of the LED chip 200, thereby achieving qualified
  • the LED chip 200 is fixedly electrically connected to the substrate 100; while the problematic LED chip 200 (i.e., the broken lamp) does not emit light, the viscosity of the light-curing conductive adhesive corresponding to the abnormal LED chip 200 remains unchanged, so that it can be directly removed from the substrate 100 Replace the LED chip 200 or repair the LED chip 200. After the replacement or repair is completed, the viscosity of the conductive member 300 corresponding to the LED chip 200 is enhanced until it is fixed, ultimately

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED显示面板及制作方法，包括基板（100）、LED阵列和导电件（300），LED阵列包括阵列设置于基板（100）上的多个LED芯片（200），导电件（300）设置于LED芯片（200）与基板（100）之间，LED芯片（200）通过导电件（300）与基板（100）固定且电连接，导电件（300）具有粘性且粘性可调。

Description

LED显示面板及制作方法 技术领域
本申请涉及显示技术的领域，具体涉及一种LED显示面板及制作方法。
 背景技术
在LED显示面板制作中，巨量的LED芯片转移至目标基板上之后，通常需要进行坏灯检测和修补，以确保面板上的所有像素发光正常。
但是，在对LED芯片进行坏灯检测时，由于LED芯片已经与目标基板上的电路固定连接，若检测出坏灯则需拆解LED芯片与目标基板之间的连接结构，替换或修补LED芯片时又需要重新将LED芯片与目标基板固定，操作繁琐，导致显示面板的检测与修补效率低下。
 技术问题
当前的LED显示面板存在LED芯片的检测与修补操作繁琐导致效率低下的问题。
 技术解决方案
本申请提供一种LED显示面板，包括：
基板；
LED阵列，包括阵列设置于所述基板上的多个LED芯片；以及
导电件，设置于所述LED芯片与所述基板之间，所述LED芯片通过所述导电件与所述基板固定且电连接，所述导电件包括光固化导电胶，所述光固化导电胶在可见光条件下由液态转变为固态；
其中，所述导电件具有粘性且粘性可调。
本申请还提供一种LED显示面板，包括：
基板；
LED阵列，包括阵列设置于所述基板上的多个LED芯片；以及
导电件，设置于所述LED芯片与所述基板之间，所述LED芯片通过所述导电件与所述基板固定且电连接；
其中，所述导电件具有粘性且粘性可调。
本申请还提供一种LED显示面板的制作方法，包括：
提供一基板和多个LED芯片；
在所述基板或者所述LED芯片上设置粘性可调的导电件；
将所述LED芯片转移至所述基板，使所述LED芯片通过所述导电件与所述基板电性连接；
对多个所述LED芯片通电，以及根据多个所述LED芯片的发光状态调整对应导电件的粘性。
本申请还提出了一种LED显示面板的制作方法，包括：
提供一基板和多个LED芯片；
在所述基板或者所述LED芯片上设置粘性可调的导电件；
将所述LED芯片转移至所述基板，使所述LED芯片通过所述导电件与所述基板电性连接；
对多个所述LED芯片通电，以及根据多个所述LED芯片的发光状态调整对应导电件的粘性。
 有益效果
本申请通过在所述LED芯片与所述基板之间设置具有粘性的导电件且导电件的粘性可调，在对LED芯片测试之前使所述导电件保持在较低的粘性水平，在完成对LED芯片的测试之后使发光正常的LED芯片对应的导电件粘性增强以实现固定，同时使发光异常的LED芯片对应的导电件粘性不变甚至降低，从而可以直接从基板上替换LED芯片或修补LED芯片，替换或修补完成后再增强该LED芯片对应的导电件的粘性至固定，最终实现高效的LED检测与修补，有效提升LED检测与修补的效率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请所述显示面板在LED芯片转移至基板之前的结构示意图；
图2是本申请所述显示面板的第一种结构示意图；
图3是本申请所述显示面板完成测试阶段的结构示意图；
图4是本申请所述显示面板的第二种结构示意图；
图5是本申请所述显示面板的第三种结构示意图；
图6是本申请所述显示面板的第四种结构示意图；
图7为本申请所述显示面板的制作流程框图。
附图标记说明：
基板100、LED芯片200、发光部210、电极部220、第一透明电极221、第二透明电极222、绝缘部230、导电件300、第一导电部310、第二导电部320、定位槽400、阻隔件500、遮光挡墙600。
本申请的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
在LED显示面板制作中，巨量的LED芯片转移至目标基板上之后，通常需要进行坏灯检测和修补，以确保面板上的所有像素发光正常。
但是，在对LED芯片进行坏灯检测时，由于LED芯片已经与目标基板上的电路固定连接，若检测出坏灯则需拆解LED芯片与目标基板之间的连接结构，替换或修补LED芯片时又需要重新将LED芯片与目标基板固定，操作繁琐，导致显示面板的检测与修补效率低下。本申请基于上述技术问题提出了以下方案。
请参阅图1至图6，本申请提供一种LED显示面板，包括基板100、LED阵列和导电件300，所述LED阵列包括阵列设置于所述基板100上的多个LED芯片200，所述导电件300设置于所述LED芯片200与所述基板100之间，所述LED芯片200通过所述导电件300与所述基板100固定且电连接，所述导电件300具有粘性且粘性可调。
本申请通过在所述LED芯片200与所述基板100之间设置具有粘性的导电件300且导电件300的粘性可调，在对LED芯片200测试之前使所述导电件300保持在较低的粘性水平，在完成对LED芯片200的测试之后使发光正常的LED芯片200对应的导电件300粘性增强以实现固定，同时使发光异常的LED芯片200对应的导电件300粘性不变甚至降低，从而可以直接从基板100上替换LED芯片200或修补LED芯片200，替换或修补完成后再增强该LED芯片200对应的导电件300的粘性至固定，最终实现高效的LED检测与修补，有效提升LED检测与修补的效率。
现结合具体实施例对本申请的技术方案进行描述。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
在本实施例中，所述基板100可以为透明的玻璃基板100或聚酰亚胺基板100等。
在本实施例中，所述LED芯片200可以为普通LED，也可以为Mini-LED、Micro-LED等。
在本实施例中，所述导电件300可以为掺有导电粒子的光敏胶、热敏胶、压敏胶、水溶性胶等。
需要说明的是，“所述导电件300的粘性可调”可以包括两种情况，第一种情况为：导电件300的粘性可逆地进行调节，即导电件300的粘性可以由低粘性调节为高粘性，并且还能由高粘性调节为低粘性，例如热熔胶、与“蜗牛黏液”原理相近的由聚羟基甲基丙烯酸乙酯的聚合物制成的水凝胶、丙烯酸水凝胶等；第二种情况为：导电件300的粘性不可逆地进行调节，即导电件300的粘性可以由低粘性调节为高粘性后直至由黏液态固化成固态，此时导电件300的粘性无法再调节为低粘性，也就无法恢复成低粘性的液态，如紫外线固化胶、压敏胶等。
请参阅图1和图2，在本申请的显示面板中，所述导电件300包括光固化导电胶，所述光固化导电胶在可见光条件下由液态转变为固态。此时，所述光固化导电胶为上述的粘性“不可逆”调节的光敏胶，而且所述光固化导电胶在可见光的照射下可以自动固化成固态，从而将所述LED芯片200与所述基板100进行固定。
本实施例通过将所述导电件300设置为光固化导电胶，在所述LED芯片200转移至所述基板100上并完成对所述LED芯片200的测试后，利用可见光照射发光正常的LED芯片200对应的导电件300（即光固化导电胶），使光固化导电胶固化从而将发光正常的LED芯片200固定在基板100上；对发光异常的LED芯片200则采取遮光处理，以使其对应的导电件300（即光固化导电胶）保持为粘性较低的黏液态，此时异常的LED芯片200并未与基板100进行固定，进而可以直接对异常的LED芯片200从进行修补或直接从基板100取下或使异常的LED芯片200直接附在转移装置上被带走，从而可以更加快速便捷地对发光异常的LED芯片200进行修补与替换，提高修补效率。
请参阅图1，在本申请的显示面板中，所述LED芯片200可以包括发光部210和与所述发光部210电连接的电极部220。所述发光部210可以位于所述LED芯片200远离所述基板100的一侧，即靠近所述显示面板的出光侧，所述电极部220可以位于所述LED芯片200与所述基板100之间，以实现所述LED芯片200与所述基板100的电连接。
在本实施例中，所述发光部210可以是所述LED芯片200的半导体发光部分，所述电极部220可以是与所述半导体发光部分电性连接的芯片电极。所述电极部220包括至少一个透明电极，所述透明电极与所述导电件300连接。
在本实施例中，所述透明电极可以通过由透明导电膜材料制备，如氧化铟锡（ITO）等。
如图2和图3所示，本实施例在对所述基板100通电以测试所述LED芯片200时，正常的LED芯片200发出的光可以穿过所述透明电极照射至光固化导电胶材质的导电件300中，使导电件300直接固化以实现LED芯片200与基板100的固定；而异常的LED芯片200不发光，异常的LED芯片200所对应的导电件300由于未受到可见光的照射而依旧保持为低粘性的黏液态，便于直接替换异常的LED芯片200或修补芯片。本实施例通过以上设置，使所述显示面板在LED芯片200测试阶段就可以将正常的LED芯片200与基板100进行固定，而且不影响异常芯片的快速修补与替换，进一步提高LED芯片200的检测与修补效率。
需要说明的是，为了避免或减少正常发光的LED芯片200发出的光对异常的LED芯片200对应的导电件300的不利影响，在本实施例中，相邻的两个所述LED芯片200之间可以设置遮光挡墙600，所述遮光挡墙600可以设置于所述基板100上。每一所述LED芯片200周侧的所述遮光挡墙600可以连续设置以形成封闭的矩形框，该矩形框将所述LED芯片200围合在其中。
在本实施例中，所述遮光挡墙600远离所述基板100一侧的侧面至所述基板100的距离大于或等于所述LED芯片200远离所述基板100一侧的侧面至所述基板100的距离。换言之，在所述显示面板的出光方向上，以所述基板100靠近所述LED芯片200的侧面为基准，所述遮光挡墙600在所述基板100上的高度可以大于或等于所述LED芯片200在所述基板100上的高度，以使所述遮光挡墙600能够充分遮挡所述LED芯片200的侧面出光。
本实施例通过设置遮光挡墙600，使所述遮光挡墙600可以对每个LED芯片200的侧面出光进行遮挡，从而在测试阶段，避免或减少正常发光的LED芯片200发出的光照射异常的LED芯片200对应的导电件300致使其固化的情况，提高显示面板的制作良率。
请参阅图1，在本申请的显示面板中，所述基板100可以包括与所述LED芯片200的电极部220电连接的电极连接部（图中未示出），所述电极连接部可以包括正电极连接部和负电极连接部，所述正电极连接部和所述负电极连接部与所述基板100上的像素驱动电路电连接，且在所述基板100处于通电状态下时，所述电极连接部上存在可以驱动所述LED芯片200发光的工作电压。
在本实施例中，一个所述LED芯片200对应的所述电极部220可以包括两个绝缘设置的所述透明电极，两个所述透明电极分别构成所述LED芯片200的正极和负极。具体地，所述LED芯片200的电极部220可以包括第一透明电极221和第二透明电极222，所述第一透明电极221与所述第二透明电极222可以分别作为所述LED芯片200的正极与负极。
在本实施例中，与所述透明电极对应地，所述导电件300与所述透明电极的数量一致。具体地，所述导电件300可以包括与所述第一透明电极221电连接的第一导电部310和与所述第二透明电极222电连接的第二导电部320。在所述LED芯片200转移至所述基板100上时，所述第一透明电极221需与所述正电极连接部的位置对应，所述第二透明电极222需与所述负电极连接部的位置对应。所述第一导电部310需与所述第二导电部320绝缘设置，以避免所述LED芯片200的正极与负极因所述第一导电部310与所述第二导电部320而产生短接的问题。
在本实施例中，所述导电件300可以设置于所述电极连接部上，所述电极连接部在所述导电件300上的正投影可以位于所述导电件300内，以使所述导电件300可以完全覆盖所述电极连接部，进而充分粘连所述LED芯片200的电极部220与所述基板100，提高LED芯片200与基板100的粘连强度。
请参阅图1，在本申请的显示面板中，所述第一导电部310可以与所述第二导电部320分离设置以实现彼此绝缘。在第一方向上，所述第一导电部310与所述第二导电部320的间距小于或等于所述第一透明电极221与所述第二透明电极222的间距。其中，所述第一方向与所述第一透明电极221与所述第二透明电极222的连线方向平行。
本实施例通过以上设置，使所述第一透明电极221在所述第一导电部310上的正投影可以全部位于所述第一导电部310内，所述第二透明电极222在所述第二导电部320上的正投影可以全部位于所述第二导电部320内，所述第一导电部310可以对所述第一透明电极221起到充分的粘连固定作用，所述第二导电部320可以对所述第二透明电极222起到充分的粘连固定作用。
请参阅图4，在本申请的显示面板中，所述LED芯片200还可以包括设置于所述第一透明电极221与所述第二透明电极222之间的绝缘部230，所述绝缘部230可以由绝缘材料制作，如SiOx、SiNx等无机绝缘材料，或者所述绝缘部230也可以由有机绝缘材料制作，本实施例对此不作具体限制。
在本实施例中，在所述显示面板的出光方向上，所述绝缘部230的厚度可以等于所述第一透明电极221或所述第二透明电极222的厚度与所述导电件300的厚度之和，此时，当所述LED芯片200转移至所述基板100上之后，所述绝缘部230不仅可以实现所述第一透明电极221与所述第二透明电极222的绝缘设置，还能实现所述第一导电部310与所述第二导电部320的绝缘设置，从而充分提高所述LED芯片200与所述基板100之间电连接结构的稳定性，减少短接等电路故障。
请参阅图2，在本申请的显示面板中，所述导电件300可以设置于所述LED芯片200的透明电极上，所述透明电极在所述导电件300上的正投影位于所述导电件300内，以使所述导电件300可以完全覆盖所述透明电极，提高所述透明电极与所述基板100上的电极连接部的连接强度。
在本实施例中，在所述LED芯片200在转移至所述基板100上之前，可以先在LED芯片200的透明电极上涂覆或喷涂光固化导电胶以形成所述导电件300，从而可以省略将所述导电件300设置在所述基板100上时所需的对位工序或步骤，有效提高所述显示面板的制作效率及所述LED芯片200、导电件300、基板100三者的对位精度。
请参阅图5，在本申请的显示面板中，所述基板100上可以阵列设置有多个所述定位槽400，所述导电件300位于所述定位槽400内，所述定位槽400可以对所述导电件300进行位置限制，以减少所述导电件300及所述LED芯片200在所述基板100上位置偏移，提高转移精度和良率。
在本实施例中，在所述显示面板的出光方向上，所述定位槽400的深度可以等于所述导电件300的厚度，且所述定位槽400的深度可以小于或等于所述导电件300与所述透明电极的厚度之和。此时，所述定位槽400可以起到较好的防溢胶效果，减少所述导电件300处于粘液状态时的溢胶情况，进而避免第一导电部310与所述第二导电部320因导电件300的溢胶而产生短接的问题。
在本实施例中，在所述显示面板的出光方向上，所述定位槽400的深度也可以大于所述导电件300的厚度，且所述定位槽400的深度可以小于或等于所述导电件300与所述透明电极的厚度之和，也就是说，所述LED芯片200可以部分位于所述导电槽中。此时，所述定位槽400除了可以防止所述导电件300的溢胶情况，还能对所述LED芯片200起到定位和防止位置偏移效果。
请参阅图6，在本申请的显示面板中，所述基板100上可以阵列设置有多个阻隔件500，所述阻隔件500上设置有与所述LED芯片200对应的定位槽400，所述定位槽400的形状与尺寸可以与所述LED芯片200的形状与尺寸一致。
在本实施例中，所述导电件300可以设置于所述阻隔件500的定位槽400中，在所述显示面板的出光方向上，所述定位槽400的深度可以大于或等于所述导电件300的厚度，以及所述定位槽400的深度可以小于或等于所述导电件300与所述透明电极的厚度之和，以使所述阻隔件500环绕在所述导电件300的周侧形成挡墙，从而防止导电件300的溢胶问题。更进一步地，所述LED芯片200也可部分位于所述阻隔件500的定位槽400中，使所述阻隔件500可以利用所述定位槽400对LED芯片200起到良好的定位和限制作用，提高LED芯片200在所述基板100上的位置稳定性。
请参阅图7，本申请实施例还提供一种LED显示面板的制作方法，用于制作上述实施例中的所述显示面板。所述LED显示面板的制作方法包括：
S100、提供一基板100和多个LED芯片200。
S200、在所述基板100或者所述LED芯片200上设置导电且粘性可调的导电件300。
在本实施例中，所述导电件300可以为光固化导电胶，作为优选地，所述光固化导电胶可以在可见光照射下自动固化，即所述光固化导电胶可以由粘性较低的液态固化成粘性较高的固态。
S300、将所述LED芯片200转移至所述基板100，使所述LED芯片200通过所述导电件300与所述基板100电性连接。
在本实施例中，具体地，所述LED芯片200的透明电极可以通过所述导电件300与所述基板100电性连接。
S400、对多个所述LED芯片200通电，以及根据多个所述LED芯片200的发光状态调整对应导电件300的粘性。
在本实施例中，可以通过对所述基板100通电以实现所述LED芯片200的通电检测，通过调整多个所述LED芯片200对应的所述导电件300的粘性，以使正常发光的LED芯片200对应的导电件300粘性增强，发光异常的LED芯片200的导电件300粘性不变或减小。
在本实施例中，调整多个所述LED芯片200对应的所述导电件300的粘性可以通过所述LED芯片200发光与否来实现。具体地，在对所述基板100通电时，合格的LED芯片200通电之后正常发光，且其发出的可见光通过所述透明电极照射至所述光固化导电胶上，使光固化导电胶固化以实现合格LED芯片200与基板100的固定电连接；而有问题的LED芯片200（即坏灯）不发光，该异常的LED芯片200对应的光固化导电胶的粘性不变。
S500、更换或修补发光异常的所述LED芯片200，再增强所述导电件300的粘性，完成LED显示面板的制作。
在本实施例中，由于异常LED芯片200不发光，使得异常的所述LED芯片200对应的所述光固化导电胶仍保持为粘性较低的液态，从而可以直接从基板100上替换LED芯片200或修补LED芯片200，替换或修补完成后再增强该LED芯片200对应的导电件300的粘性至固定，最终实现高效的LED检测与修补，有效提升LED检测与修补的效率。
本申请实施例通过将常规技术中用于连接LED芯片200与基板100的锡膏替换成粘性可调的导电件300，且所述导电件300优选为光固化导电胶，并将所述LED芯片200的电极设置为透明电极，使所述LED芯片200在进行坏灯检测时，正常LED芯片200发出的可见光可以通过所述LED芯片200的透明电极照射至所述光固化导电胶上，实现合格LED芯片200与基板100的固定电连接；而有问题的LED芯片200（即坏灯）不发光，该异常的LED芯片200对应的光固化导电胶的粘性不变，从而可以直接从基板100上替换LED芯片200或修补LED芯片200，替换或修补完成后再增强该LED芯片200对应的导电件300的粘性至固定，最终实现高效的LED检测与修补，有效提升LED检测与修补的效率。
以上对本申请实施例所提供的一种LED显示面板及制作方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种LED显示面板，包括：
    基板；
    LED阵列，包括阵列设置于所述基板上的多个LED芯片；以及
    导电件，设置于所述LED芯片与所述基板之间，所述LED芯片通过所述导电件与所述基板固定且电连接，所述导电件包括光固化导电胶，所述光固化导电胶在可见光条件下由液态转变为固态；
    其中，所述导电件具有粘性且粘性可调。
  2. 根据权利要求1所述的LED显示面板，其中，所述LED芯片包括发光部和与所述发光部电连接的电极部；
    其中，所述电极部包括至少一个透明电极，所述透明电极与所述导电件连接。
  3. 根据权利要求2所述的LED显示面板，其中，所述LED显示面板还包括设置于相邻两个所述LED芯片之间的遮光挡墙。
  4. 根据权利要求3所述的LED显示面板，其中，所述遮光挡墙远离所述基板一侧的侧面至所述基板的距离大于或等于所述LED芯片远离所述基板一侧的侧面至所述基板的距离。
  5. 根据权利要求3所述的LED显示面板，其中，所述基板上阵列设置有多个定位槽，所述导电件位于所述定位槽内；
    其中，在所述显示面板的出光方向上，所述定位槽的深度大于或等于所述导电件的厚度，以及所述定位槽的深度小于或等于所述导电件与所述透明电极的厚度之和。
  6. 根据权利要求3所述的LED显示面板，其中，所述基板上阵列设置有多个阻隔件，所述阻隔件上设置有与所述LED芯片对应的定位槽；
    其中，所述导电件设置于所述定位槽中，在所述显示面板的出光方向上，所述定位槽的深度大于或等于所述导电件的厚度，以及所述定位槽的深度小于或等于所述导电件与所述透明电极的厚度之和。
  7. 根据权利要求2所述的LED显示面板，其中，所述导电件设置于所述LED芯片的透明电极上，所述透明电极在所述导电件上的正投影位于所述导电件内。
  8. 根据权利要求2所述的LED显示面板，其中，所述LED芯片的电极部包括相互绝缘的第一透明电极和第二透明电极，所述导电件包括与所述第一透明电极电连接的第一导电部和与所述第二透明电极电连接的第二导电部；
    其中，所述第一导电部与所述第二导电部绝缘设置。
  9. 根据权利要求8所述的LED显示面板，其中，所述第一导电部与所述第二导电部分离设置，且在第一方向上，所述第一导电部与所述第二导电部的间距小于或等于所述第一透明电极与所述第二透明电极的间距；
    其中，所述第一方向与所述第一透明电极与所述第二透明电极的连线方向平行。
  10. 根据权利要求8所述的LED显示面板，其中，所述LED芯片还包括设置于所述第一透明电极与所述第二透明电极之间的绝缘部；
    其中，在所述显示面板的出光方向上，所述绝缘部的厚度等于所述第一透明电极或所述第二透明电极的厚度与所述导电件的厚度之和。
  11. 一种LED显示面板，包括：
    基板；
    LED阵列，包括阵列设置于所述基板上的多个LED芯片；以及
    导电件，设置于所述LED芯片与所述基板之间，所述LED芯片通过所述导电件与所述基板固定且电连接；
    其中，所述导电件具有粘性且粘性可调。
  12. 根据权利要求11所述的LED显示面板，其中，所述LED芯片包括发光部和与所述发光部电连接的电极部；
    其中，所述电极部包括至少一个透明电极，所述透明电极与所述导电件连接。
  13. 根据权利要求12所述的LED显示面板，其中，所述LED芯片的电极部包括相互绝缘的第一透明电极和第二透明电极，所述导电件包括与所述第一透明电极电连接的第一导电部和与所述第二透明电极电连接的第二导电部；
    其中，所述第一导电部与所述第二导电部绝缘设置。
  14. 根据权利要求13所述的LED显示面板，其中，所述第一导电部与所述第二导电部分离设置，且在第一方向上，所述第一导电部与所述第二导电部的间距小于或等于所述第一透明电极与所述第二透明电极的间距；
    其中，所述第一方向与所述第一透明电极与所述第二透明电极的连线方向平行。
  15. 根据权利要求14所述的LED显示面板，其中，所述基板上阵列设置有多个阻隔件，所述阻隔件上设置有与所述LED芯片对应的定位槽；
    其中，所述导电件设置于所述定位槽中，在所述显示面板的出光方向上，所述定位槽的深度大于或等于所述导电件的厚度，以及所述定位槽的深度小于或等于所述导电件与所述透明电极的厚度之和。
  16. 根据权利要求13所述的LED显示面板，其中，所述LED芯片还包括设置于所述第一透明电极与所述第二透明电极之间的绝缘部；
    其中，在所述显示面板的出光方向上，所述绝缘部的厚度等于所述第一透明电极或所述第二透明电极的厚度与所述导电件的厚度之和。
  17. 根据权利要求12所述的LED显示面板，其中，所述导电件设置于所述LED芯片的透明电极上，所述透明电极在所述导电件上的正投影位于所述导电件内。
  18. 根据权利要求12所述的LED显示面板，其中，所述LED显示面板还包括设置于相邻两个所述LED芯片之间的遮光挡墙；
    其中，所述遮光挡墙远离所述基板一侧的侧面至所述基板的距离大于或等于所述LED芯片远离所述基板一侧的侧面至所述基板的距离。
  19. 根据权利要求12所述的LED显示面板，其中，所述基板上阵列设置有多个定位槽，所述导电件位于所述定位槽内；
    其中，在所述显示面板的出光方向上，所述定位槽的深度大于或等于所述导电件的厚度，以及所述定位槽的深度小于或等于所述导电件与所述透明电极的厚度之和。
  20. 一种LED显示面板的制作方法，包括：
    提供一基板和多个LED芯片；
    在所述基板或者所述LED芯片上设置粘性可调的导电件；
    将所述LED芯片转移至所述基板，使所述LED芯片通过所述导电件与所述基板电性连接；
    对多个所述LED芯片通电，以及根据多个所述LED芯片的发光状态调整对应导电件的粘性。
PCT/CN2022/096439 2022-05-19 2022-05-31 Led显示面板及制作方法 WO2023221178A1 (zh)

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