WO2023217171A1 - 一种抛光装置 - Google Patents

一种抛光装置 Download PDF

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Publication number
WO2023217171A1
WO2023217171A1 PCT/CN2023/093186 CN2023093186W WO2023217171A1 WO 2023217171 A1 WO2023217171 A1 WO 2023217171A1 CN 2023093186 W CN2023093186 W CN 2023093186W WO 2023217171 A1 WO2023217171 A1 WO 2023217171A1
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WO
WIPO (PCT)
Prior art keywords
polishing
polished
disc
workpiece
diameter
Prior art date
Application number
PCT/CN2023/093186
Other languages
English (en)
French (fr)
Inventor
王宇
余建琳
Original Assignee
眉山博雅新材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 眉山博雅新材料股份有限公司 filed Critical 眉山博雅新材料股份有限公司
Publication of WO2023217171A1 publication Critical patent/WO2023217171A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/0031—Machines having several working posts; Feeding and manipulating devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/005—Blocking means, chucks or the like; Alignment devices
    • B24B13/0055—Positioning of lenses; Marking of lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres

Definitions

  • This specification relates to a polishing device, in particular to a polishing device applied to small-sized workpieces.
  • Ring polishing machine is a common polishing equipment that can be used to process optical or electronic components.
  • an existing ring polishing machine is used to ring polish small-sized workpieces, due to the large size of the liquid guide groove on the polishing disc (about 7-10mm), the small-sized workpiece may overturn or overturn on the processing station. Safety accidents such as getting stuck between the throwing plate and the polishing plate. Therefore, it is necessary to propose an efficient and safe polishing device for polishing small-sized workpieces.
  • the polishing device includes a frame, a polishing disc arranged on the frame, a companion polishing disc and a clamp, wherein the companion polishing disc is provided with at least one polishing position.
  • the polishing station is used to place the workpiece to be polished; the accompanying polishing plate is clamped by the clamp, and the clamp includes a plurality of claws, and the claws at least extend from above the at least one polishing position to the edge of the accompanying polishing plate.
  • the first claw is provided with a pretensioning part corresponding to the position of the at least one polishing position.
  • the pretensioning part includes a scale scale and a pretensioner.
  • the scale scale is preset with A scale value that represents the polishing removal efficiency, and the pretensioner adjusts the polishing efficiency of the workpiece to be polished based on the scale value; during the polishing process, the polishing disc rotates, and the accompanying polishing disc rotates and/or swings, To achieve the polishing of the workpiece to be polished.
  • the polishing device further includes a flatness detection mechanism and a pressure adjustment mechanism; the flatness detection mechanism detects whether the flatness of the polishing disk meets preset requirements during the polishing process; the pressure adjustment mechanism is based on The detection result of the flatness detection mechanism adjusts the pressure exerted by the polishing disc on the polishing disc.
  • the polishing device further includes a driving mechanism, which is connected to the clamp through a stylus and is used to drive the accompanying polishing plate to rotate and/or swing.
  • the pressure adjustment mechanism is provided on the driving mechanism; the pressure adjustment mechanism controls the stylus to apply adjustable pressure to the accompanying throwing plate; or, the pressure adjustment mechanism is provided on the On the clamp; the pressure adjustment mechanism controls the clamp to apply an adjustable pressure in the direction of gravity to the accompanying throwing plate.
  • a liquid guide groove may be provided on the polishing surface of the polishing disk, and the width of the liquid guide groove ranges from 1 mm to 5 mm.
  • the width of the liquid guide groove is 3%-20% of the diameter of the workpiece to be polished.
  • the width of the liquid guide groove ranges from 1 mm to 3 mm.
  • the width of the liquid guide groove ranges from 2mm to 5mm.
  • the diameter-to-thickness ratio of the companion throwing disk is less than 8:1.
  • the diameter of the polishing disc is 60%-80% of the diameter of the polishing disc.
  • the diameter of the accompanying throwing plate is not less than 100 mm.
  • the material density of the accompanying throwing plate is 5g/cm 2 -20g/cm 2 .
  • the at least one polishing position has a diameter of 8mm-45mm.
  • the total area of the at least one polishing station is less than 50% of the area of the polishing disc.
  • the diameter of any one of the at least one polishing position accounts for 12% to 60% of the diameter of the polishing disc.
  • the at least one polishing position is evenly arranged on the polishing disc.
  • the distance between two adjacent polishing positions is 10mm-15mm.
  • the diameter ratio of the polishing position to the workpiece to be polished is 1.2-1.5.
  • a counterweight is provided in the polishing position, and the counterweight applies an adjustable pressure in the direction of gravity to the workpiece to be polished.
  • the counterweight is connected to the workpiece to be polished in the polishing position through an elastic member.
  • Figure 1 is a schematic structural diagram of an exemplary polishing device according to some embodiments of this specification.
  • Figure 2 is a partial structural schematic diagram of an exemplary polishing device according to some embodiments of this specification.
  • Figure 3 is a schematic structural diagram of an exemplary polishing disc according to some embodiments of the present specification.
  • Figure 4 is a schematic structural diagram of an exemplary driving mechanism according to some embodiments of this specification.
  • Figure 5 is a partial structural schematic diagram of an exemplary driving mechanism according to some embodiments of this specification.
  • Figure 6 is a schematic structural diagram of an exemplary accompanying selling plate according to some embodiments of this specification.
  • Figure 7 is a schematic structural diagram of an exemplary polishing device according to other embodiments of this specification.
  • connection should be understood in a broad sense.
  • it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or it can be an integral connection.
  • Electrical connection it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two components.
  • said words may be replaced by other expressions if they serve the same purpose.
  • the embodiment of this specification proposes a polishing device for polishing small-sized workpieces on a driving mechanism (for example, a single-axis machine or a multi-axis machine).
  • the accompanying polishing disc is clamped by a fixture (for example, clamped at the stylus of a single-axis machine or a multi-axis machine) and contacted with the polishing disc, and then the polishing disc is aligned through rotation and/or swinging. Polishing of the workpiece to be polished in the polishing position.
  • the size of the accompanying polishing plate, the number, size and distribution of the polishing positions on the accompanying polishing plate are all designed based on the polishing requirements of small-sized workpieces, and the polishing pressure can be adjusted during the polishing process, which can achieve safe and efficient polishing of small-sized workpieces.
  • Figure 1 is a schematic structural diagram of an exemplary polishing device according to some embodiments of this specification.
  • the polishing device 100 may include a frame 1 , a polishing disc 2 disposed on the frame 1 , a companion polishing disc 3 , and a clamp 5 for holding the companion polishing disc 3 .
  • the axes of the polishing disc 2 and the polishing disc 3 are along the direction of gravity of the workpiece to be polished (for example, vertically (straight direction), the side of the accompanying polishing disc 3 close to the polishing disc 2 has a relatively flat accompanying polishing surface, and the side of the polishing disc 2 close to the accompanying polishing disc 3 has a polishing surface.
  • the accompanying polishing surface of the polishing disc 3 and the polishing surface of the polishing disc 2 are arranged to fit together along the gravity direction of the workpiece to be polished.
  • the polishing disc 2 may include a crystal polishing disc, a wool polishing disc, a velvet polishing disc, etc.
  • different polishing discs 2 can be selected according to different polishing requirements of the workpiece to be polished.
  • the polishing disc 2 of appropriate size, appropriate polishing surface material, appropriate hardness, etc. can be selected according to different polishing requirements of the workpiece to be polished. More description about the polishing disc 2 can be seen in Figure 2 and will not be described again here.
  • the polishing disc 3 may have a certain weight, and accordingly may play a role in leveling the polishing disc 2 during the polishing process.
  • the diameter of the accompanying polishing disc 3 should not be less than 100mm.
  • the companion plate 3 may include a quartz plate, a microcrystalline plate, a granite plate, a glass plate, etc.
  • the material density of the accompanying throwing plate 3 may be 5g/cm 2 -20g/cm 2 .
  • the material of the accompanying throwing plate 3 may be 8g/cm 2 -16g/cm 2 .
  • the material of the accompanying throwing plate 3 may be 11g/cm 2 -14g/cm 2 .
  • the material of the accompanying throwing plate 3 may be 13g/cm 2 .
  • the accompanying polishing disc 3 can be designed with the accompanying polishing specifications (including the diameter and/or material of the accompanying polishing disc 3 ) according to the accompanying polishing requirements of the workpiece to be polished.
  • At least one polishing position 4 is provided on the polishing disc 3 for placing the workpiece to be polished.
  • the polishing position 4 may be a groove that runs through the polishing disc 3 .
  • the shape of the polishing position 4 can be circular, square, triangular or any regular or irregular shape, and can be designed according to the actual needs of the workpiece to be polished. More description about the polishing position 4 can be seen in Figure 6 and will not be repeated here.
  • the workpiece to be polished can be placed in the polishing position 4. Due to its own gravity, the surface to be polished of the workpiece to be polished is in contact with the polishing surface of the polishing disc 2. Further, the polishing disc 2 can rotate, and the accompanying polishing disc 3 can rotate and/or swing (for example, rotate and/or swing along a horizontal plane perpendicular to the gravity direction of the workpiece to be polished), driving the rotation and/or swing of the workpiece to be polished, To achieve polishing of the workpiece to be polished. In some embodiments, the swing range of the accompanying polishing disc 3 is within the range of the polishing surface of the polishing disc 2 .
  • Figure 2 is a partial structural schematic diagram of an exemplary polishing device according to some embodiments of this specification.
  • the polishing disc 3 is clamped by the clamp 5 and is located above the polishing disc 2 .
  • the "up" and “down” mentioned in the embodiments of this specification mean that the direction opposite to the direction of gravity is up, and the direction that is the same as the direction of gravity is down.
  • the clamp 5 includes a plurality of claws 52.
  • the claws 52 at least include a first claw extending from above the at least one polishing position 4 to the edge of the accompanying polishing plate 3.
  • the first claw is provided with a predetermined position corresponding to the position of the at least one polishing position 4.
  • the tightening part and the pre-tightening part include a scale scale and a pre-tightening piece.
  • the scale scale is preset with a scale value (which can represent the polishing removal efficiency).
  • the pre-tightening piece adjusts the pre-tightening force of the workpiece to be polished based on the scale value, thereby adjusting the polishing to be polished. polishing efficiency of the workpiece.
  • the card The claws 52 can correspond to the polishing positions 4 one-to-one, that is, a first claw is provided above each polishing position 4 .
  • the number of claws 52 may be greater than the number of polishing positions 4 , and a first claw is provided above each polishing position 4 , and the remaining claws may be second claws.
  • the preloading force of the pretensioner on the workpiece to be polished can be adjusted by adjusting the displacement of the pretensioner to adjust the pressure of the pretensioner on the workpiece to be polished in the direction of gravity.
  • the scale ruler can quantify the relationship between the displacement of the pretensioner and the polishing efficiency, that is, it can characterize the polishing efficiency.
  • Polishing removal efficiency refers to the amount of workpiece to be polished removed per unit time during the polishing process.
  • the scale is preset with a scale value that represents the polishing removal efficiency. It means that there are multiple scale values preset on the scale to represent different polishing removal efficiencies when the preloader exerts different preload forces on the workpiece to be polished.
  • the first scale can indicate that the polishing removal efficiency is 0.5 microns/hour at the first pressure of the pretensioner, that is, during the polishing process, the first preload force adjusted by the pretensioner based on the first scale value is used. When the workpiece is polished, the polishing removal amount per hour is 0.5 microns.
  • the second scale can indicate that the polishing removal efficiency is 1 micron/hour at the second pressure of the pretensioner, that is, during the polishing process, when the second preload force adjusted by the pretensioner based on the second scale value is used,
  • the polishing removal volume of the workpiece to be polished is 1 micron per hour.
  • the numerical examples here are only used to explain the scale value on the scale that represents the polishing efficiency.
  • the specific design of the scale value is not limited.
  • the scale value can also be the polishing removal efficiency level (level 1, level 2, etc.).
  • the polishing removal efficiency represented by the scale value can also be the percentage of the workpiece thickness polished per hour, etc.
  • the scale value on the scale that represents the polishing efficiency can be calculated based on the different polishing requirements of the workpiece to be polished, the size, material, hardness, etc. of the polishing disc 2 .
  • the calculation method of the scale value can be determined according to the actual working conditions and will not be described in detail here.
  • the scale value on the scale scale can also correspond to different polishing disk rotation speeds and accompanying polishing disk swings to represent different polishing removal efficiencies.
  • the corresponding relationship between the polishing removal efficiency represented by each scale value, the rotation speed of the polishing disk, and the swing amplitude of the accompanying polishing disk can be calculated and stored in advance. Polishing plate swing, etc.) Select different scale values to adjust the polishing removal efficiency of the workpiece to be polished.
  • the pretensioning member may include a pretensioning spring.
  • the pretensioning part passes upward through the first claw in the direction of gravity and is installed on the first claw.
  • the preloading part is also equipped with a preloading force adjustment knob and a scale.
  • the upper end of the preload spring is connected to the preload force adjustment button, and the lower end is in direct or indirect contact with the workpiece to be polished.
  • the preload adjustment knob and scale can be located above the first jaw.
  • the displacement of the preloading force adjustment button is adjusted to adjust the displacement of the preloading spring (i.e., the amount of deformation), thereby adjusting the preloading force of the preloading spring to achieve adjustment to be polished
  • the pressure exerted by the workpiece in the direction of gravity is adjusted to adjust the displacement of the preloading spring (i.e., the amount of deformation), thereby adjusting the preloading force of the preloading spring to achieve adjustment to be polished.
  • the design of the pre-tightening part on the polishing device enables the polishing device to predict and monitor the polishing efficiency when polishing small-sized workpieces.
  • the preload force of the preloader to be polished can also be adjusted according to different polishing requirements. For example, first adjust the preload force to the first scale and polish at the first polishing efficiency corresponding to the first scale. 1 hour, then adjust the preload force to the second scale according to the polishing progress and polish for 1 hour at the second polishing efficiency corresponding to the second scale, and then continue to adjust.
  • the polishing efficiency of small-sized workpieces can be effectively improved by adjusting the pre-tensioning part, so as to achieve the purpose of mass production of small-sized polished workpieces.
  • the diameter held by the clamp 5 is adjustable.
  • the diameter held by the clamp 5 can be adjusted according to the outer diameter of the accompanying throwing plate 3 .
  • the clamp 5 may include a clamp base 51 and a plurality of claws 52 to clamp the accompanying throwing disc 3 .
  • a plurality of jaws 52 may be adjustably connected to the clamp base 51 .
  • the lower inner sides of the plurality of claws 52 form a certain clamping range for clamping the accompanying throwing plate 3 .
  • the diameter range clamped by the plurality of claws 52 can be adjusted by adjusting the position and/or distance of the plurality of claws 52 relative to the clamp base 51 .
  • the diameter held by the plurality of claws 52 of the clamp 5 can be adjusted to a certain size (for example, 10-15 mm) larger than the outer diameter of the companion disc 3 .
  • the clamp 5 may also include a locking mechanism 53 for clamping and fixing the accompanying throwing plate 3 .
  • locking mechanism 53 may include a locking screw.
  • a rubber gasket can be attached to the front end of the locking screw (for example, the joint between the outer periphery of the throw plate 3 and the locking screw) and the locking screw can be tightened.
  • a concave hole 511 may be provided in the center of the upper end surface of the clamp base 51 for transmission connection with the stylus ball head 611 of the driving mechanism 6 .
  • a further description of the drive mechanism 6 can be found in FIGS. 4 and 5 .
  • the concave hole 511 may be hemispherical, arc-shaped, etc., which is not limited in this specification.
  • the clamp 5 includes a clamp base 51 and four claws 52 .
  • the clamp base 51 is two cylinders arranged in a stepped manner, and four claws 52 are evenly distributed and connected to the steps along the circumferential direction.
  • the four claws 52 can be L-shaped, one end of each claw 52 is adjustably connected to the clamp base 51 , and the other end faces the polishing surface of the polishing disc 2 .
  • the space enclosed below the four claws 52 is used to clamp the accompanying throwing plate 3. By adjusting the position of the four claws 52 relative to the clamp base 51, the size of the space enclosed below is adjusted to clamp the accompanying throwing plate 3.
  • a locking screw is installed on each claw 52, and the locking screw penetrates the claw 52 and resists the side wall of the throw tray 3 to tightly clamp the throw tray 3.
  • the central axis of the clamped accompanying throwing plate 3 remains on the same axis as the central axis of the clamp base 51 .
  • the number of polishing bits 4 on the polishing disc 3 corresponds to the number of claws 52 one by one.
  • four polishing positions 4 are provided below the four claws 52 , and four pretensioning portions are provided at the positions of the four claws 52 corresponding to the four polishing positions 4 .
  • the number of claws 52 and polishing positions 4 is only an example and is not limited here.
  • the polishing device 100 may further include a flatness detection mechanism and a pressure adjustment mechanism.
  • the flatness detection mechanism is used to detect the flatness of the polishing surface of the polishing disc 2 .
  • the pressure adjustment mechanism adjusts the pressure exerted by the polishing disk 3 on the polishing disk 2 according to the detection results of the flatness detection mechanism.
  • the flatness detection mechanism detects the flatness of the polishing surface of the polishing disc 2 in real time, and the pressure adjustment mechanism adjusts the pressure exerted by the polishing disc 3 on the polishing disc 2 in real time, so the polishing disc 3 It can have a smoothing effect on the polishing disc 2 during the polishing process, which not only improves the polishing effect, but also effectively increases the service life of the polishing disc 2 .
  • the flatness detection mechanism may be a laser flatness detection mechanism.
  • the laser flatness detection mechanism uses optical principles to detect the flatness of the polishing surface of the polishing disc 2 .
  • the laser flatness detection mechanism can emit a vertical linear laser to illuminate the polishing surface of the polishing disc 2 (the polishing surface part that is not blocked by the polishing disc 3 during the polishing process) and receive the reflected laser, and obtain the laser flatness based on the reflection of the laser.
  • the distance between the laser emitting part and the polished surface of the detection mechanism is based on the distance between the laser emitting part and the polished surface relative to the preset reference distance, and the offset of the detected point is calculated.
  • the microprocessor in the laser flatness detection mechanism sets the flatness preset conditions, and compares the offset with the flatness preset conditions to obtain the flatness error value.
  • the microprocessor can further determine whether the flatness error value meets the flatness requirements, and finally sends the flatness detection result (for example, the flatness error value that does not meet the preset conditions) to the pressure adjustment mechanism.
  • the flatness detection mechanism can also be other flatness detection mechanisms, such as a leveling instrument, which is not limited here.
  • the pressure adjustment mechanism adjusts the pressure exerted by the polishing disc 3 on the polishing disc 2 according to the received flatness detection results. For example, the greater the flatness error value, the greater the pressure exerted by the pressure adjustment mechanism on the polishing disc 2 by adjusting the polishing disc 3 .
  • the pressure adjusted by the pressure adjustment mechanism is calculated differently according to different situations such as the polishing requirements of the workpiece to be polished and the material of the polishing surface of the polishing disc 2 .
  • the pressure adjustment mechanism is provided on the clamp 5 .
  • the pressure adjustment mechanism controls the clamp 5 to apply an adjustable pressure in the direction of gravity to the polishing disc 3, thereby realizing that the polishing disc 3 applies an adjustable pressure in the direction of gravity to the polishing disc 2.
  • the pressure adjustment mechanism may be an air pressure adjustment mechanism.
  • the clamp 5 can be connected to an air pressure adjustment mechanism (not shown in the figure), and the air pressure adjustment mechanism can be used to apply adjustable pressure in the direction of gravity.
  • the air pressure adjustment mechanism may include a controller, an electrical pressure application component, a pressure detection component, etc.
  • the electrical pressure component can be fixedly connected above the clamp 5 and used to exert pressure on the clamp 5 in the direction of gravity.
  • the controller can receive the flatness detection results detected by the flatness detection mechanism, and through further calculation, control the electrical pressure component to adjust the pressure.
  • the electrical pressure application component is used to apply pressure in the direction of gravity, and the pressure detection component is used to detect the amount of pressure applied.
  • the controller adjusts the electrical pressure application component in real time to apply pressure in the direction of gravity to the clamp 5 based on the amount of pressure detected by the pressure detection component. , thereby realizing that the accompanying polishing disc 3 applies pressure in the direction of gravity to the polishing disc 2.
  • the pressure exerted by the fixture 5 on the polishing disc 3 to the polishing disc 2 can be adjusted to better smooth the polishing disc 2 .
  • the polishing device 100 may further include a driving mechanism 6 , which may be connected to the clamp 5 through a stylus ball head 611 for driving the accompanying polishing plate 3 to rotate and/or swing. More descriptions about the driving mechanism 6 can be seen in Figures 4 and 5 and will not be described again here.
  • the polishing device 100 further includes a liquid collection tank 7 for collecting polishing liquid overflowing from the polishing disc 2 (for example, the liquid guide tank 21 shown in FIG. 3 ).
  • the liquid collecting tank 7 may be in the shape of a bowl with an upper end open, and the polishing disc 2 is located in the cavity of the liquid collecting tank 7 .
  • the liquid collection tank 7 can be connected to a flow guide device, and the polishing liquid collected in the liquid collection tank 7 is transported to the liquid guide tank 21 again through the flow guide device, so that the polishing liquid can be recycled.
  • Figure 3 is a schematic structural diagram of an exemplary polishing disc according to some embodiments of the present specification.
  • a liquid guide groove 21 may be provided on the polishing surface of the polishing disk 2 for guiding polishing liquid.
  • the polishing fluid overflowing from the liquid guide tank 21 can flow into the liquid collecting tank 7 .
  • the size of the liquid guide groove 21 needs to meet preset requirements.
  • the small-sized liquid guide groove 21 is provided on the polishing disk 2, which can effectively avoid safety accidents such as overturning of small-sized workpieces or getting stuck between the accompanying polishing disk and the polishing disk during the polishing process, and ensure the efficiency and safety of small-sized workpieces during the polishing process.
  • the width of the liquid guide groove 21 may be set to 1 mm-5 mm.
  • liquid guide grooves 21 of different widths can be provided for workpieces of different sizes to be polished.
  • the width of the liquid guide groove 21 may be 3%-20% of the diameter of the workpiece to be polished.
  • the width of the liquid guide groove 21 may be 3%-15% of the diameter of the workpiece to be polished.
  • the width of the liquid guide groove 21 may be 3%-12% of the diameter of the workpiece to be polished.
  • the width of the liquid guide trough 21 should be set as small as possible to avoid overturning of small-sized workpieces to be polished.
  • the liquid guide trough 21 with a width that is too small can easily be The impurities generated during the polishing process are blocked and are not conducive to the discharge of the polishing fluid.
  • the diameter of the workpiece to be polished when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide groove 21 may be between 1 mm and 3 mm. In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide groove 21 may be between 1.5 mm and 2.5 mm. In some embodiments, when the diameter of the workpiece to be polished is less than 25.4 mm, the diameter of the liquid guide groove 21 may be between 1 mm and 2 mm.
  • the width of the liquid guide groove 21 can be set slightly larger to facilitate discharge of the polishing liquid.
  • the diameter of the liquid guide groove 21 may be 2mm-5mm.
  • the diameter of the liquid guide groove 21 may be 2mm-4mm.
  • the diameter of the liquid guide groove 21 may be 3mm-4mm.
  • the diameter of the liquid guide channel 21 may be in the range of 1.5mm-2.5mm. In some embodiments, the diameter of the liquid guide channel 21 may be in the range of 1.6mm-2.4mm. In some embodiments, the diameter of the liquid guide channel 21 may be in the range of 1.7mm-2.3mm. In some embodiments, the diameter of the liquid guide channel 21 may be in the range of 1.8mm-2.2mm. In some embodiments, the diameter of the liquid guide channel 21 may be in the range of 1.9mm-2.1mm. In some embodiments, the diameter of the liquid guide channel 21 may be 2.0 mm.
  • the polishing disc 2 may be rotated by a power source.
  • a first motor 22 may be provided below the polishing disc 2 for driving the rotation of the polishing disc 2 .
  • the output shaft of the first motor 22 is drivingly connected to the polishing disc 2 and arranged coaxially. Since the accompanying polishing surface of the accompanying polishing disc 3 contacts the polishing surface of the polishing disc 2 along the gravity direction of the workpiece to be polished, the lower first motor 22 can also drive the rotation of the accompanying polishing disc 3 when driving the polishing disc 2 to rotate.
  • the polishing disc 2 can be rotated through other power sources, which is not limited in this specification.
  • FIG. 4 is a schematic structural diagram of an exemplary driving mechanism according to some embodiments of this specification
  • FIG. 5 is a partial structural schematic diagram of an exemplary driving mechanism according to some embodiments of this specification.
  • the driving mechanism 6 can be used to drive the accompanying throwing plate 3 to rotate and/or swing.
  • the driving mechanism 6 may be a single-axis machine or a multi-axis machine. The following description takes a single-axis machine as an example.
  • the driving mechanism 6 may include a stylus 61 , a swing arm structure 62 and a swing arm driving structure 63 .
  • stylus 61 can swing.
  • the stylus 61 can swing horizontally to drive the clamp 5 and the accompanying throwing plate 3 to swing together.
  • a stylus ball head 611 may be provided at the lower end of the stylus 61 for connecting with the clamp 5 .
  • the stylus ball head 611 is in contact with the concave hole 511 on the upper end surface of the clamp base to achieve a sliding connection between the stylus 61 and the clamp 5 .
  • the shape of the stylus ball head 611 may be a hemispherical shape, an arc shape, or any other shape that is suitable for the shape of the concave hole 511 .
  • the height of the stylus 61 relative to the clamp 5 (or the polishing disc 2) in the direction of gravity can be adjusted to adapt to the polishing requirements of different workpieces to be polished.
  • the swing arm structure 62 can drive the stylus 61 to swing, and the swing arm driving structure 63 can provide a driving force for the swing arm mechanism 62 to swing.
  • the swing arm structure 62 may include a swing bar 621, a swing frame 622, and a fixed plate 623.
  • One end of the swing rod 621 is rotationally connected to the frame 1 (for example, fixedly connected to the frame 1 through the first support 64 ), and the other end is connected to the swing arm driving structure 63 .
  • the swing frame 622 is slidably sleeved on the swing bar 621 .
  • the fixed plate 623 is connected to the swing frame 622 and used to fix the stylus 61 .
  • the swing arm driving structure 63 includes a driving turntable 631, a driving rod 632 and a second motor (not shown in the figure).
  • the upper end surface of the driving turntable 631 may be provided with a chute 633 (for example, an inverted T-shaped chute), and one end of the driving rod 632 is connected to the chute 633 through a bolt 634 (for example, an inverted T-shaped bolt).
  • the driving rod 632 is rotationally connected to the bolt 634 and can rotate around the central axis of the bolt 634 .
  • the other end of the driving rod 632 is rotationally connected to the other end of the swing rod 621 through a connecting bolt 635.
  • the second motor can be installed in the frame 1 and located below the driving turntable 631.
  • the output of the second motor The shaft is drivingly connected to the driving turntable 631.
  • the driving force of the second motor is transmitted to the driving turntable 631, and then to the driving rod 632, and then to the swing bar 621, so that the swing bar 621 repeatedly swings horizontally around the first support 64, and the repeated horizontal swing of the swing bar 621 drives the swing bar 621.
  • the frame 622 then drives the stylus 61 to repeatedly swing horizontally.
  • the chute 633 may be opened along the radial direction of the driving turntable 631 .
  • the length of chute 633 is less than the diameter of drive turntable 631 .
  • the length of the chute 633 is 1/2-2/3 of the diameter of the driving turntable 631 .
  • the size of the bolt 634 and the slide groove 633 are adapted and the two are in sliding fit.
  • the driving mechanism 6 further includes a second support 65 , and the second support 65 is fixedly connected to the frame 1 .
  • a transmission block 636 may be fixed above the second support 65 .
  • the transmission block 636 may be in the shape of a long strip with a certain width, and its extending direction passes through the axis of the drive turntable 631 .
  • the connecting bolt 635 passes through the driving rod 632 and the swing bar 621. The lower end surface of the connecting bolt 635 is in contact with the upper end surface of the transmission block 636.
  • the connecting bolt 635 can contact and slide on the transmission block 636.
  • the connecting bolt 635 makes an arc-shaped reciprocating motion on the transmission block 636, thereby realizing repeated horizontal swing of the fork bar 621.
  • the movement of the swing arm structure 62 and/or the swing arm drive structure 63 can also be realized by an electric slide table, a linear module, a single-axis driver, etc., which is not limited in this specification.
  • the pressure adjustment mechanism may be provided on the drive mechanism 6 .
  • the pressure adjustment mechanism controls the stylus 61 to apply adjustable pressure to the accompanying throwing plate 3 .
  • the pressure adjustment mechanism can be disposed on the swing frame 622, and the pressure adjustment mechanism can control the swing frame 622 to rotate around the axis of the swing rod 621, so that the swing frame 622 controls the stylus 61 to apply adjustable pressure to the accompanying throwing plate 3. .
  • the greater the flatness error value detected by the flatness detection mechanism the greater the angle the pressure adjustment mechanism controls the swing frame 622 to rotate counterclockwise around the axis of the swing rod 621 (taking Figure 4 as an example), then the swing frame 622 drives the stylus 61 to The greater the pressure exerted by the accompanying selling plate 3.
  • the pressure adjustment mechanism may include a controller, a rotating component, a pressure detection component, etc.
  • the controller can receive the flatness detection results detected by the flatness detection mechanism, and control the rotating assembly to adjust the pressure after further calculation.
  • the rotating assembly is used to control the swing frame 622 to rotate around the axis of the swing rod 621 .
  • the rotating component may be a linear drive component such as a cylinder or a motor, and is disposed on the rear side of the swing frame 622 (the side opposite to the stylus 61).
  • the rotating assembly provides a horizontal thrust to the swing frame 622 so that the swing frame 622 rotates around the axis of the swing rod 621 .
  • the rotating component may be a driving motor.
  • the driving motor is disposed in a sleeve connecting the swing frame 622 and the swing rod 621 to drive the sleeve to rotate relative to the swing rod 621 so that the swing frame 622 rotates around the axis of the swing rod 621 Turn.
  • the driving structure 6 can also be implemented by a multi-axis machine having multiple swingable stylus 61 .
  • the multi-axis polishing device 200 shown in Figure 7 has two stylus pens 61.
  • the multi-axis machine drives two stylus pens 61. Swing to drive two sets of clamps 5 and accompany The swing of the selling plate 3 (for example, swing in the horizontal direction).
  • the multi-axis machine method more workpieces to be polished can be polished at the same time, which improves production efficiency.
  • Figure 6 is a schematic structural diagram of an exemplary accompanying selling plate according to some embodiments of this specification.
  • the accompanying polishing plate in order to ensure that the size and/or weight of the accompanying polishing plate can be suitable for different small-size polishing application scenarios, and at the same time ensure that the accompanying polishing plate is not easily deformed during the polishing process, and at the same time comprehensively consider the cost and processing requirements, etc., the accompanying polishing plate
  • the diameter-to-thickness ratio needs to meet certain requirements.
  • the diameter-to-thickness ratio of the accompanying throwing plate 3 refers to the ratio between the diameter and the axial thickness of the accompanying throwing plate 3 .
  • the diameter-to-thickness ratio of the companion throw disk 3 is no greater than 10:1.
  • the diameter-to-thickness ratio of the companion throw disc 3 is less than 8:1.
  • the diameter-to-thickness ratio of the companion throw disc 3 may be less than 7:1.
  • the diameter-to-thickness ratio of the companion throw disc 3 may be less than 6:1.
  • the diameter-to-thickness ratio of the companion throw plate 3 may include 7.8:1, 7.5:1, 7:1, 6.5:1, 6:1, 5.6:1, 4.8:1, etc.
  • the diameter of the polishing disc 3 is 60%-80% of the diameter of the polishing disc 2 . In some embodiments, the diameter of the polishing disc 3 is 65%-75% of the diameter of the polishing disc 2 . In some embodiments, the diameter of the polishing disc 3 is approximately 70% of the diameter of the polishing disc 2 . It should be noted that the “approximately” used in the embodiments of this specification may mean that the index value is allowed to fluctuate within the range of ⁇ 5%.
  • the total area of the polishing positions 4 provided on the polishing disc 3 will affect the overall strength of the polishing disc 3 and the polishing effect.
  • the total area of the polishing positions 4 may be the sum of the areas of all polishing positions 4 .
  • the area ratio of the polishing position 4 to the accompanying polishing disc 3 is Certain requirements must be met.
  • the total area of the polishing bits 4 on the accompanying polishing disc 3 is less than 60% of the area of the accompanying polishing disc 3 . In some embodiments, the total area of the polishing bits 4 on the accompanying polishing disc 3 is less than 50% of the area of the accompanying polishing disc 3 . In some embodiments, the total area of the polishing bits 4 on the accompanying polishing disc 3 is less than 40% of the area of the accompanying polishing disc 3 .
  • the diameter of one polishing station 4 accounts for 12%-60% of the diameter of the polishing disc 3 . In some embodiments, the diameter of one polishing station 4 accounts for 18%-53% of the diameter of the polishing disc 3 . In some embodiments, the diameter of one polishing station 4 accounts for 20%-45% of the diameter of the polishing disc 3 . In some embodiments, the diameter of one polishing station 4 accounts for 22%-40% of the diameter of the polishing disc 3 . In some embodiments, the diameter of one polishing station 4 accounts for 24%-32% of the diameter of the accompanying polishing disc 3 . In some embodiments, the diameter of one polishing station 4 accounts for approximately 25% of the diameter of the accompanying polishing disc 3 .
  • the size of the polishing position 4 needs to meet certain requirements.
  • At least one polishing station 4 has a diameter of 8 mm to 45 mm. In some embodiments, at least one polishing station 4 has a diameter of 8 mm to 44 mm. In some embodiments, at least one polishing station 4 has a diameter of 9 mm to 43 mm. In some embodiments, at least one polishing station 4 has a diameter of 10 mm to 42 mm. In some embodiments, at least one polishing station 4 has a diameter of 11 mm to 41 mm. In some embodiments, at least one polishing station 4 has a diameter of 12 mm to 40 mm. In some embodiments, at least one polishing station 4 has a diameter of 13mm-39mm.
  • At least one polishing station 4 has a diameter of 14 mm to 38 mm. In some embodiments, at least one polishing station 4 has a diameter of 15mm-37mm. In some embodiments, at least one polishing station 4 has a diameter of 16 mm to 36 mm. In some embodiments, at least one polishing station 4 has a diameter of 17mm-35mm.
  • the diameter of at least one polishing position 4 may include 8.5mm, 9.5mm, 10.5mm, 11.5mm, 12.5mm, 13.5mm, 14.5mm, 15.5mm, 16.5mm, 17.5mm, 18mm, 18.5mm, 19mm, 19.5mm ,...,45mm, etc.
  • the diameter of the polishing position 4 needs to be larger than the diameter of the workpiece to be polished by a certain size to ensure that when the workpiece to be polished is placed in the polishing position 4 for polishing processing, the polishing position 4 will not affect the position of the workpiece to be polished in the polishing position.
  • the irregular movement in the polishing position 4 can ensure that the workpiece to be polished will not slip out of the polishing position 4 due to the movement during the polishing process.
  • the diameter ratio of the polishing position 4 to the workpiece to be polished may be 1.2-1.5. In some embodiments, the diameter ratio of the polishing position 4 to the workpiece to be polished may be 1.3-1.4. In some embodiments, the diameter ratio of the polishing station 4 to the workpiece to be polished may be approximately 1.35.
  • the diameter of the polishing position 4 is 5 mm to 8 mm larger than the diameter of the workpiece to be polished. In some embodiments, the diameter of the polishing position 4 is 5 mm to 7 mm larger than the diameter of the workpiece to be polished. In some embodiments, the diameter of the polishing station 4 is 6 mm to 8 mm larger than the diameter of the workpiece to be polished. In some embodiments, the diameter of the polishing position 4 is 6 mm to 7 mm larger than the diameter of the workpiece to be polished. In some embodiments, the diameter of the polishing station 4 is 6.5 mm larger than the diameter of the workpiece to be polished.
  • the polishing device 100 can be equipped with multiple models of accompanying polishing discs 3 at the same time (different models include different sizes and/or weights of the accompanying polishing discs 3, different sizes and/or numbers of polishing positions 4, etc.), and can be configured according to the requirements.
  • the polishing of the polished workpiece requires replacement of the polishing disc 3.
  • At least one polishing position 4 is evenly arranged on the polishing disc 3 to ensure that the gravity of the entire polishing disc 3 is uniform in the direction of gravity, thereby ensuring uniform polishing when the workpiece to be polished is placed in the polishing position 4 for polishing processing.
  • multiple polishing positions are evenly arranged in the radial and/or circumferential direction of the polishing disc 3 .
  • six polishing positions 4 are provided on the accompanying polishing plate 3 , and the six polishing positions 4 are evenly arranged in the radial and circumferential directions of the accompanying polishing plate 3 .
  • polishing positions 4 can also be three, four, five, etc., and can be designed according to actual needs, and its arrangement can also be It can be done in other ways, and this manual does not limit this.
  • the spacing between adjacent polishing positions 4 (for example, The distance between the center points of adjacent polishing positions, the distance between the edges of adjacent polishing positions, etc.) should meet certain requirements.
  • the distance between two adjacent polishing stations 4 is 10mm-15mm. In some embodiments, the distance between two adjacent polishing stations 4 is 11 mm-14 mm. In some embodiments, the distance between two adjacent polishing stations 4 is 11 mm-13 mm. In some embodiments, the distance between two adjacent polishing stations 4 is 12 mm.
  • a counterweight (not shown in the figure) may be provided in the polishing station 4, and the counterweight may apply an adjustable pressure in the direction of gravity to the workpiece to be polished.
  • the counterweight acts on the workpiece to be polished, exerting pressure on the workpiece to be polished toward the polishing disc 2.
  • the relative force between the workpiece to be polished and the polishing disc 2 increases, thereby improving the polishing effect.
  • the preloading part when the polishing requirements of the workpiece to be polished are low, the preloading part may not be used, and a counterweight may be provided in the polishing position 4 of the polishing device.
  • the polishing accuracy and polishing efficiency of the polishing device of this embodiment are relatively lower than when the pretensioner is used.
  • the pressure in the direction of gravity exerted by the counterweight block on the workpiece to be polished can be adjusted.
  • the counterweight provided in the polishing position 4 of the polishing device can also be used in conjunction with the pretensioner.
  • the polishing device has better polishing accuracy and polishing efficiency.
  • the counterweight block can be used to pressurize and the preloading part can be used to adjust the preload force to achieve the optimal pressure value for the workpiece to be polished, thereby improving polishing accuracy and polishing efficiency.
  • the upper end surface of the counterweight block is connected to the lower end of the pretensioning part, and the lower end surface is in contact with the workpiece to be processed.
  • the counterweight block exerts a certain pressure on the workpiece to be polished by its own weight, and at the same time, the preloading part applies an adjustable preload force in the direction of gravity to the workpiece to be polished through the counterweight block.
  • the weight of the counterweight may be determined based on the size and/or weight of the workpiece itself, the polishing effect to be achieved, etc.
  • the weight may range from 10g to 150g. In some embodiments, the weight may range from 30g to 120g. In some embodiments, the weight may range from 40g to 100g. In some embodiments, the weight may range from 50g to 80g. In some embodiments, the weight may be 60g.
  • the counterweight is detachably connected in the polishing station 4, and the polishing device 100 can be equipped with counterweights of multiple weight models at the same time, and the counterweights (for example, the weight models of the counterweights) can be replaced according to the polishing requirements.
  • the counterweight may be connected to the workpiece to be polished in the polishing station 4 through an elastic member.
  • the counterweight block and the elastic piece are arranged along the direction of gravity of the workpiece.
  • the counterweight block and the elastic piece can be adapted to workpieces of different heights to be polished. During the polishing process, the counterweight block continues to exert pressure on the workpiece to be polished to improve the polishing effect. .
  • the counterweight block can be connected to the bottom end surface of the clamp base 51 through an elastic member, and the lower end surface of the counterweight block contacts the upper end surface of the workpiece to be polished.
  • the counterweight block in order to ensure that the counterweight block stably fits on the upper end surface of the workpiece to be polished and always maintains stable pressure during the polishing process, can be the same size and shape as the horizontal surface of the workpiece to be polished. Blocky body.
  • This specification also provides a method for polishing a workpiece to be polished using the polishing device 100 described in any of the above embodiments, including some or all of the following steps:
  • polishing disc 3 select and/or design the polishing disc 3 (and/or the polishing position 4 thereon) based on the polishing requirements of the workpiece to be polished, where the polishing requirements of the workpiece to be polished include the size, weight and/or material of the workpiece to be polished etc., the parameters of the accompanying polishing plate 3 include material and/or size, etc., and the parameters of polishing position 4 include material, size, quantity and/or position distribution, etc.;
  • the polishing disc 2 is driven by the first motor 22.
  • the driving mechanism 6 drives the accompanying polishing disc 3 to rotate through the stylus 61 and/ Or swing to achieve polishing of the workpiece to be polished.
  • the beneficial effects that may be brought about by the embodiments of this specification include but are not limited to: 1) The accompanying polishing disc and polishing position are designed based on the polishing requirements of the workpiece to be polished, which can be adapted to the polishing process of small-sized workpieces; 2) The polishing pressure can be adjusted during the polishing process (For example, the pressure exerted by the fixture, the pressure exerted by the counterweight block, etc.), safe and efficient polishing of small-sized workpieces can be achieved; 3) By replacing different polishing discs, the same polishing device can process a variety of different sizes and/or or required workpieces; 4) The small-sized liquid guide groove on the polishing disc ensures the efficiency and safety of small-sized workpieces during the polishing process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

一种抛光装置,包括机架（1）、设置于机架（1）上的抛光盘（2）、陪抛盘（3）和夹具（5）。在陪抛盘（3）上设置至少一个用于放置待抛光工件的抛光位（4），通过夹具（5）将陪抛盘（3）夹持并与抛光盘（2）接触，进而通过转动和/或摆动实现对抛光位（4）中的待抛光工件的抛光。其中，夹具（5）包括多个卡爪（52），卡爪（52）至少包括从至少一个抛光位（4）上方延伸至陪抛盘（3）边缘的第一卡爪，第一卡爪上对应于至少一个抛光位（4）的位置设置有预紧部。预紧部包括刻度标尺和预紧件，刻度标尺上预设有表征抛光去除效率的刻度值，预紧件基于刻度值调节对待抛光工件的抛光效率，通过上述设置实现小尺寸工件安全高效的抛光加工。

Description

一种抛光装置
优先权信息
本申请要求于2022年05月10日提交的申请号为202210500353.2的中国申请的优先权，其全部内容通过引用并入本文。
技术领域
本说明书涉及一种抛光装置，特别涉及一种应用于小尺寸工件的抛光装置。
背景技术
环形抛光机是一种常见的抛光设备，可用于加工光学或电子元件。然而，如果使用现有的环形抛光机对小尺寸工件进行环抛，由于抛光盘上的导液槽尺寸较大(约7-10mm)，有可能会发生小尺寸工件在加工工位上倾覆或卡在陪抛盘与抛光盘之间等安全事故。因此，有必要提出一种应用于小尺寸工件抛光的高效安全的抛光装置。
发明内容
本说明书实施例之一提供一种抛光装置，所述抛光装置包括机架、设置于机架上的抛光盘、陪抛盘和夹具，其中，所述陪抛盘上设置有至少一个抛光位，所述抛光位用于放置待抛光工件；所述陪抛盘通过所述夹具夹持，所述夹具包括多个卡爪，所述卡爪至少包括从所述至少一个抛光位上方延伸至所述陪抛盘边缘的第一卡爪，所述第一卡爪上对应于所述至少一个抛光位的位置设置有预紧部，所述预紧部包括刻度标尺和预紧件，所述刻度标尺上预设有表征抛光去除效率的刻度值，所述预紧件基于所述刻度值调节对所述待抛光工件的抛光效率；在抛光过程中，所述抛光盘转动，所述陪抛盘转动和/或摆动，以实现所述待抛光工件的抛光。
在一些实施例中，所述抛光装置还包括平整度检测机构和压力调整机构；所述平整度检测机构检测抛光过程中所述抛光盘的平整度是否满足预设要求；所述压力调整机构根据所述平整度检测机构的检测结果调节所述陪抛盘对所述抛光盘施加的压力。
在一些实施例中，所述抛光装置还包括驱动机构，所述驱动机构通过铁笔与所述夹具连接，用于驱动所述陪抛盘转动和/或摆动。
在一些实施例中，所述压力调整机构设置在所述驱动机构上；所述压力调整机构控制所述铁笔向所述陪抛盘施加可调节的压力；或者，所述压力调整机构设置在所述夹具上；所述压力调整机构控制所述夹具向所述陪抛盘施加重力方向上的可调节的压力。
在一些实施例中，所述抛光盘的抛光面上可以设置导液槽，所述导液槽的宽度的取值范围为1mm-5mm。
在一些实施例中，所述导液槽的宽度是待抛光工件的直径的3％-20％。
在一些实施例中，所述待抛光工件的直径小于25.4mm时，所述导液槽的宽度的取值范围为1mm-3mm。
在一些实施例中，所述待抛光工件的直径在25.4mm-50.8mm之间时，所述导液槽的宽度的取值范围为2mm-5mm。
在一些实施例中，所述陪抛盘的径厚比小于8:1。
在一些实施例中，所述陪抛盘的直径是所述抛光盘的直径的60％-80％。
在一些实施例中，所述陪抛盘的直径不小于100mm。
在一些实施例中，所述陪抛盘的材料密度为5g/cm2-20g/cm2。
在一些实施例中，所述至少一个抛光位的直径为8mm-45mm。
在一些实施例中，所述至少一个抛光位的总面积小于所述陪抛盘的面积的50％。
在一些实施例中，所述至少一个抛光位中的任意一个的直径占所述陪抛盘的直径的12％-60％。
在一些实施例中，所述至少一个抛光位在所述陪抛盘上均匀排布。
在一些实施例中，相邻两个抛光位之间的间距为10mm-15mm。
在一些实施例中，所述抛光位与所述待抛光工件的直径比为1.2-1.5。
在一些实施例中，所述抛光位内设置有配重块，所述配重块向所述待抛光工件施加重力方向的可调节的压力。
在一些实施例中，所述配重块通过弹力件连接于所述抛光位内的所述待抛光工件。
附图说明
本说明书将以示例性实施例的方式进一步说明，这些示例性实施例将通过附图进行详细描述。这些实施例并非限制性的，在这些实施例中，相同的编号表示相同的结构，其中：
图1是根据本说明书一些实施例所示的示例性抛光装置的结构示意图。
图2是根据本说明书一些实施例所示的示例性抛光装置的局部结构示意图。
图3是根据本说明书一些实施例所示的示例性抛光盘的结构示意图。
图4是根据本说明书一些实施例所示的示例性驱动机构的结构示意图。
图5是根据本说明书一些实施例所示的示例性驱动机构的局部结构示意图。
图6是根据本说明书一些实施例所示的示例性陪抛盘的结构示意图。
图7是根据本说明书另一些实施例所示的示例性抛光装置的结构示意图。
图中：1、机架；2、抛光盘；21、导液槽；22、第一电机；3、陪抛盘；4、抛光位； 5、夹具；51、夹具座；511、凹孔；52、卡爪；53、锁紧机构；6、驱动机构；61、铁笔；611、铁笔球头；62、摆臂结构；621、摆杆；622、摆架；623、固定盘；63、摆臂驱动结构；631、驱动转盘；632、驱动杆；633、滑槽；634、螺栓；635、连接螺栓；636、传动块；64、第一支座；65、第二支座；7、集液槽。
具体实施方式
为了更清楚地说明本说明书实施例的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本说明书的一些示例或实施例，对于本领域的普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图将本说明书应用于其它类似情景。除非从语言环境中显而易见或另做说明，图中相同标号代表相同结构或操作。
应当理解，“安装”、“相连”、“连接”、“耦合”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，还可以是两个元件内部的连通。然而，如果其他词语可实现相同的目的，则可通过其他表达来替换所述词语。
如本说明书和权利要求书中所示，除非上下文明确提示例外情形，“一”、“一个”、“一种”和/或“该”等词并非特指单数，也可包括复数。一般说来，术语“包括”与“包含”仅提示包括已明确标识的步骤和元素，而这些步骤和元素不构成一个排它性的罗列，方法或者设备也可能包含其它的步骤或元素。
为了安全高效地完成小尺寸工件的抛光加工，本说明书实施例中提出一种在驱动机构(例如，单轴机或多轴机)上实现小尺寸工件抛光的抛光装置，在陪抛盘上设置至少一个用于放置待抛光工件的抛光位，通过夹具将陪抛盘夹持(例如，夹持在单轴机或多轴机的铁笔处)并与抛光盘接触，进而通过转动和/或摆动实现对抛光位中的待抛光工件的抛光。陪抛盘的尺寸、陪抛盘上抛光位的数量、尺寸、分布等均基于小尺寸工件抛光要求设计，且抛光过程中可以调节抛光压力，相应可以实现小尺寸工件安全高效的抛光加工。
以下将结合图1-7对本说明书实施例所涉及的抛光装置进行详细说明。值得注意的是，以下实施例仅用以解释本说明书，并不构成对本说明书的限定。
图1是根据本说明书一些实施例所示的示例性抛光装置的结构示意图。如图1所示，抛光装置100可以包括机架1、设置于机架1上的抛光盘2、陪抛盘3和用于夹持陪抛盘3的夹具5。
在一些实施例中，抛光盘2和陪抛盘3的轴线均沿待抛光工件的重力方向(例如，竖 直方向)设置，陪抛盘3靠近抛光盘2的一侧具有相对平整的陪抛面，抛光盘2靠近陪抛盘3的一侧具有抛光面。陪抛盘3的陪抛面与抛光盘2的抛光面沿待抛光工件的重力方向相互贴合设置。
在一些实施例中，抛光盘2可以包括水晶抛光盘、羊毛抛光盘、绒布抛光盘等。
在一些实施例中，可以根据待抛光工件的抛光要求不同，选择不同的抛光盘2。在一些实施例中，可以根据待抛光工件的抛光要求不同，选择合适的尺寸、合适的抛光面材质、合适的硬度等的抛光盘2。关于抛光盘2的更多描述可见图2，在此不再赘述。
在一些实施例中，陪抛盘3可以具有一定重量，相应可以在抛光过程中起到平整抛光盘2的作用。
为了使陪抛盘3本身就有较好的平整抛光盘3的作用，陪抛盘3的直径不小于100mm。在一些实施例中，陪抛盘3可以包括石英盘、微晶盘、花岗石盘、玻璃盘等。在一些实施例中，陪抛盘3的材料密度可以是5g/cm2-20g/cm2。在一些实施例中，陪抛盘3的材质可以是8g/cm2-16g/cm2。在一些实施例中，陪抛盘3的材质可以是11g/cm2-14g/cm2。在一些实施例中，陪抛盘3的材质可以是13g/cm2。具体地，陪抛盘3可以根据待抛光工件的陪抛要求来设计陪抛盘3的陪抛规格(包括陪抛盘3直径和/或材质)。
在一些实施例中，陪抛盘3上设置有至少一个抛光位4，用于放置待抛光工件。
在一些实施例中，抛光位4可以是贯穿陪抛盘3的槽位。在一些实施例中，抛光位4的形状可以是圆形、方形、三角形或任意规则或不规则形状，可以根据待抛光工件的实际需求设计。关于抛光位4的更多描述可见图6，在此不再赘述。
在抛光过程中，待抛光工件可以放置于抛光位4内，由于自身重力作用，待抛光工件的待抛光表面与抛光盘2的抛光面接触。进一步地，抛光盘2可以转动，陪抛盘3可以转动和/或摆动(例如，沿与待抛光工件重力方向相互垂直的水平面转动和/或摆动)，带动待抛光工件的转动和/或摆动，以实现待抛光工件的抛光。在一些实施例中，陪抛盘3的摆动范围在抛光盘2的抛光面范围内。
图2是根据本说明书一些实施例所示的示例性抛光装置的局部结构示意图。
在一些实施例中，如图2所示，陪抛盘3通过夹具5夹持，设于抛光盘2的上方。本说明书实施例所述的“上”、“下”是指与重力方向相反的方向为上，与重力方向相同的方向为下。夹具5包括多个卡爪52，卡爪52至少包括从至少一个抛光位4上方延伸至陪抛盘3边缘的第一卡爪，第一卡爪上对应于至少一个抛光位4的位置设置有预紧部，预紧部包括刻度标尺和预紧件，刻度标尺上预设有刻度值(可以表征抛光去除效率)，预紧件基于刻度值调节对待抛光工件的预紧力，从而调节抛光待抛光工件时的抛光效率。在一些实施例中，卡 爪52与抛光位4可以一一对应，即每个抛光位4上方均设置有第一卡爪。在一些实施例中，卡爪52的数量也可以多于抛光位4的数量，并且，在每个抛光位4上方均设置有第一卡爪，其余卡爪可以是第二卡爪。
在一些实施例中，预紧件对待抛光工件的预紧力的调节，可以是通过调节预紧件的位移来调节预紧件对待抛光工件在重力方向上的压力。刻度标尺可以量化预紧件的位移量与抛光效率之间的关系，即表征抛光效率。
抛光去除效率，是指待抛光工件在抛光过程中单位时间内的去除量。刻度标尺上预设有表征抛光去除效率的刻度值，是指刻度标尺上预设多个刻度值，用来表示在预紧件向待抛光工件施压不同的预紧力时不同的抛光去除效率。例如，第一刻度可以表示在预紧件的第一压力时表征抛光去除效率为0.5微米/小时，即在抛光过程中，采用预紧件基于第一刻度值调节的第一预紧力时，待抛光工件每小时的抛光去除量为0.5微米。又例如，第二刻度可以表示在预紧件的第二压力时抛光去除效率为1微米/小时，即在抛光过程中，采用预紧件基于第二刻度值调节的第二预紧力时，待抛光工件每小时的抛光去除量为1微米。此处的数值举例，仅用于解释刻度标尺上的表征抛光效率的刻度值，刻度值的具体设计不做限定，例如，刻度值也可以是抛光去除效率级别(1级、2级等)，刻度值所表征的抛光去除效率也可以是每小时抛光的工件厚度百分比等。
刻度标尺上的表征抛光效率的刻度值，可以根据待抛光工件的抛光要求不同，抛光盘2的尺寸、材质、硬度等的不同来计算得出。刻度值的计算方法可以根据实际工况确定，在此不赘述。在一些实施例中，刻度标尺上的刻度值还可以对应于不同的抛光盘转速、陪抛盘摆幅表征不同的抛光去除效率。在一些实施例中，每个刻度值所表征的抛光去除效率与抛光盘转速、陪抛盘摆幅的对应关系可以预先计算并存储，在抛光过程中，可根据实际工况(抛光盘转速、陪抛盘摆幅等)选择不同的刻度值来调整对待抛光工件的抛光去除效率。
在一些实施例中，预紧件可以包括预紧弹簧。预紧部沿重力方向向上穿过第一卡爪，并安装在第一卡爪上。预紧部上还设有预紧力调节钮和刻度标尺。预紧弹簧的上端与预紧力调节钮连接，下端与待抛光工件直接或间接抵接。预紧力调节钮和刻度标尺可以位于第一卡爪的上方。在抛光过程中，根据不同的抛光需求基于刻度标尺，通过调节预紧力调节钮的位移来调节预紧弹簧的位移(即变形量)，从而调节预紧弹簧的预紧力，实现调节对待抛光工件在重力方向上施加的压力。
抛光装置上预紧部的设计，使得该抛光装置在对小尺寸工件进行抛光时，可以对抛光效率进行预测及监控。在抛光过程中，也可以根据不同的抛光需求，来调节预紧件对待抛光工件的预紧力。例如，先将预紧力调节到第一刻度，在第一刻度对应的第一抛光效率下抛光 1小时，再根据抛光进度将预紧力调节到第二刻度并在第二刻度对应的第二抛光效率下抛光1小时，之后可以在继续调整。抛光过程中，通过预紧部的调节，可以有效提高小尺寸工件的抛光效率，以达到对小尺寸抛光工件进行量产的目的。
在一些实施例中，夹具5所夹持的直径大小可调节。例如，可以根据陪抛盘3的外径尺寸调节夹具5所夹持的直径大小。
在一些实施例中，夹具5可以包括夹具座51和多个卡爪52，实现对陪抛盘3的夹持。在一些实施例中，多个卡爪52可以可调节地连接在夹具座51上。在一些实施例中，多个卡爪52的下方内侧形成一定的夹持范围，用于夹持陪抛盘3。在一些实施例中，可以通过调整多个卡爪52相对于夹具座51的位置和/或距离，调节多个卡爪52所夹持的直径范围。例如，可以根据陪抛盘3的外径尺寸，将夹具5的多个卡爪52所夹持的直径调整至比陪抛盘3的外径大一定尺寸(例如，10-15mm)。
在一些实施例中，夹具5还可以包括锁紧机构53，用于将陪抛盘3夹持固定。在一些实施例中，锁紧机构53可以包括锁紧螺丝。在一些实施例中，可以在锁紧螺丝的前端处(例如，陪抛盘3的外周与锁紧螺丝的贴合处)垫附橡胶垫片并将锁紧螺丝紧固。
在一些实施例中，夹具座51上端面的中心可以开设有凹孔511，用于与驱动机构6的铁笔球头611传动连接。关于驱动机构6的更多描述可见图4和图5。在一些实施例中，凹孔511可以是半球形、圆弧形等，本说明书对此不做限制。
仅作为示例，如图3所示，夹具5包括夹具座51和四个卡爪52。夹具座51为以台阶式布局的两个圆柱体，四个卡爪52沿圆周向均匀分布连接在台阶上。四个卡爪52可以呈L型，每个卡爪52的一端可调节地连接在夹具座51上，另一端端部面向抛光盘2的抛光面。四个卡爪52的下方合围成的空间用于夹持陪抛盘3，通过调节四个卡爪52相对夹具座51的位置，调整下方合围成的空间大小，以夹紧陪抛盘3。每个卡爪52上安装一个锁紧螺丝，锁紧螺丝穿透卡爪52并抵住陪抛盘3的侧壁以紧固夹持陪抛盘3。夹持后的陪抛盘3的中心轴保持与夹具座51的中心轴位于同一轴线上。陪抛盘3上的抛光位4的数量与卡爪52的数量一一对应。在该实施例中，四个卡爪52下方对应的设有四个抛光位4，四个卡爪52对应于四个抛光位4的位置设置有四个预紧部。该实施例中，卡爪52和抛光位4的数量仅作为示例，在此不做限定。
在一些实施例中，抛光装置100还可以包括平整度检测机构和压力调整机构。平整度检测机构，用于检测抛光盘2的抛光面的平整度。压力调整机构根据平整度检测机构的检测结果调节陪抛盘3对抛光盘2施加的压力。在抛光过程中，平整度检测机构实时检测抛光盘2的抛光面的平整度，压力调整机构实时调节陪抛盘3对抛光盘2施加的压力，因此陪抛盘3 可以在抛光过程中对抛光盘2起到平整作用，不仅可以提高抛光效果，还可以有效地提高抛光盘2的使用寿命。
在一些实施例中，平整度检测机构可以是激光平整度检测机构。激光平整度检测机构采用光学原理完成对抛光盘2的抛光面的平整度检测。例如，激光平整度检测机构，可以发射垂直线形激光照射在抛光盘2的抛光面(抛光过程中，陪抛盘3未遮挡的抛光面部分)并接收反射的激光，基于激光的反射情况获取激光平整度检测机构的激光发射部与抛光面之间的间距，基于激光发射部与抛光面之间的间距相对于预设基准距离计算被检测点的偏移量。激光平整度检测机构内的微处理器中设定平整度预设条件，将偏移量与平整度预设条件进行比对获得平整度误差值。微处理器还可以进一步判断平整度误差值是否满足平整度要求，最后将平整度检测结果(例如，不满足预设条件的平整度误差值)发送给压力调整机构。平整度检测机构还可以是其他的平整度检测机构，例如找平仪等，在此不做限定。
压力调整机构根据接收到的平整度检测结果，调节陪抛盘3对抛光盘2施加的压力。例如，平整度误差值越大，压力调整机构调节陪抛盘3对抛光盘2施加的压力越大。在一些实施例中，压力调整机构调节的压力大小还根据待抛光工件的抛光要求、抛光盘2的抛光面材质等不同情况来做不同计算。
在一些实施例中，压力调整机构设置在夹具5上。压力调整机构控制夹具5向陪抛盘3施加重力方向上的可调节的压力，进而实现陪抛盘3对抛光盘2施加重力方向上的可调节的压力。
在一些实施例中，压力调整机构可以是气压调整机构。夹具5可以与气压调整机构(图中未示出)连接，气压调整机构可以用于施加重力方向上的可调节的压力。在一些实施例中，气压调整机构可以包括控制器、电气施压组件、压力检测组件等。电气施压组件可以固定连接在夹具5的上方，用于对夹具5施加重力方向上的压力。控制器可以接收平整度检测机构检测到的平整度检测结果，并经过进一步的计算控制电气施压组件进行压力调节。电气施压组件用于施加重力方向上的压力，压力检测组件用于检测施加的压力大小，控制器根据压力检测组件检测到的压力大小实时调整电气施压组件对夹具5施加重力方向上的压力，进而实现陪抛盘3向抛光盘2施加重力方向上的压力。在一些实施例中，可以根据抛光盘2的抛光面材质，调节夹具5带动陪抛盘3向抛光盘2施加的压力大小，以起到更好的平整抛光盘2的作用。
在一些实施例中，抛光装置100还可以包括驱动机构6，驱动机构6可以通过铁笔球头611与夹具5连接，用于驱动陪抛盘3转动和/或摆动。关于驱动机构6的更多描述可见图4和图5，在此不再赘述。
在一些实施例中，抛光装置100还包括集液槽7，用于收集从抛光盘2(例如，图3所示的导液槽21)溢出的抛光液。在一些实施例中，集液槽7可以是上端开口的碗状，抛光盘2位于集液槽7的腔体内。在一些实施例中，集液槽7可以与导流装置连接，通过导流装置将集液槽7收集到的抛光液再次输送到导液槽21中，以使抛光液可以循环使用。
图3是根据本说明书一些实施例所示的示例性抛光盘的结构示意图。
在一些实施例中，如图3所示，抛光盘2的抛光面上可以设置导液槽21，用于导流抛光液。导液槽21溢出的抛光液可以流入集液槽7。
在一些实施例中，为了适配小尺寸工件的抛光，导液槽21的尺寸需满足预设要求。抛光盘2上开设小尺寸的导液槽21，可以有效避免小尺寸工件在抛光过程中倾覆或卡在陪抛盘与抛光盘之间等安全事故，确保小尺寸工件在抛光过程中的高效安全。在一些实施例中，导液槽21的宽度可以设置为1mm-5mm。
由于不同尺寸的工件发生倾覆的条件不同，因此对于不同尺寸的待抛光工件，可以设置不同宽度的导液槽21。在一些实施例中，导液槽21的宽度可以是待抛光工件的直径的3％-20％。在一些实施例中，导液槽21的宽度可以是待抛光工件的直径的3％-15％。在一些实施例中，导液槽21的宽度可以是待抛光工件的直径的3％-12％。
为了使导液槽21能够适配更多尺寸的待抛光工件，导液槽21的宽度应设置得尽量小，避免小尺寸的待抛光工件发生倾覆，但宽度过小的导液槽21易被抛光过程中产生的杂质堵塞，不利于抛光液的排出。在一些实施例中，待抛光工件的直径小于25.4mm时，导液槽21的直径可以在1mm-3mm。在一些实施例中，待抛光工件的直径小于25.4mm时，导液槽21的直径可以在1.5mm-2.5mm。在一些实施例中，待抛光工件的直径小于25.4mm时，导液槽21的直径可以在1mm-2mm。
对于较大尺寸的待抛光工件，导液槽21的宽度可以设置得略大，以利于排出抛光液。在一些实施例中，待抛光工件的直径在25.4mm-50.8mm时，导液槽21的直径可以在2mm-5mm。在一些实施例中，待抛光工件的直径在25.4mm-50.8mm时，导液槽21的直径可以在2mm-4mm。在一些实施例中，待抛光工件的直径在25.4mm-50.8mm时，导液槽21的直径可以在3mm-4mm。
在一些实施例中，导液槽21的直径可以在1.5mm-2.5mm范围内。在一些实施例中，导液槽21的直径可以在1.6mm-2.4mm范围内。在一些实施例中，导液槽21的直径可以在1.7mm-2.3mm范围内。在一些实施例中，导液槽21的直径可以在1.8mm-2.2mm范围内。在一些实施例中，导液槽21的直径可以在1.9mm-2.1mm范围内。在一些实施例中，导液槽21的直径可以是2.0mm。
在一些实施例中，抛光盘2可以通过动力源实现转动。在一些实施例中，如图3所示，抛光盘2的下方可以设有第一电机22，用于驱动抛光盘2的转动。在一些实施例中，第一电机22的输出轴与抛光盘2传动连接且同轴设置。由于陪抛盘3的陪抛面与抛光盘2的抛光面沿待抛光工件重力方向上面接触，下方第一电机22驱动抛光盘2自转时也可以带动陪抛盘3的自转。
在一些实施例中，抛光盘2可以通过其他动力源实现转动，本说明书对此不做限制。
图4是根据本说明书一些实施例所示的示例性驱动机构的结构示意图；图5是根据本说明书一些实施例所示的示例性驱动机构的局部结构示意图。
在一些实施例中，驱动机构6可以用于驱动陪抛盘3转动和/或摆动。在一些实施例中，驱动机构6可以是单轴机，也可以是多轴机。以下以单轴机为例进行描述。
在一些实施例中，如图4所示，驱动机构6可以包括铁笔61、摆臂结构62和摆臂驱动结构63。
在一些实施例中，铁笔61可以摆动。例如，铁笔61可以沿水平方面摆动，以一并带动夹具5和陪抛盘3的摆动。
在一些实施例中，铁笔61下端部可以设置铁笔球头611，用于与夹具5连接。例如，铁笔球头611与夹具座上端面的凹孔511相接触以实现铁笔61与夹具5的滑动连接。在一些实施例中，铁笔球头611的形状可以是半球形、圆弧形等任何与凹孔511的形状相适配的形状。
在一些实施例中，铁笔61在重力方向相对于夹具5(或抛光盘2)的高度可以调节，以适应不同待抛光工件的抛光要求。
在一些实施例中，摆臂结构62可以带动铁笔61摆动，摆臂驱动结构63可以提供摆臂机构62摆动的驱动力。
在一些实施例中，摆臂结构62可以包括摆杆621、摆架622和固定盘623。摆杆621的一端转动连接在机架1(例如，通过第一支座64与机架1固定连接)上，另一端与摆臂驱动结构63连接。摆架622可滑动套设在摆杆621上。固定盘623连接在摆架622上，用于固定铁笔61。
在一些实施例中，摆臂驱动结构63包括驱动转盘631、驱动杆632和第二电机(图中未示出)。驱动转盘631的上端面可以开设有滑槽633(例如，倒T型滑槽)，驱动杆632的一端端部通过螺栓634(例如，倒T型螺栓)与滑槽633传动连接。驱动杆632与螺栓634转动连接且可绕螺栓634的中心轴转动。驱动杆632另一端通过连接螺栓635与摆杆621的另一端转动连接。第二电机可以安装于机架1内且位于驱动转盘631下方，第二电机的输出 轴与驱动转盘631传动连接。第二电机的驱动力传递至驱动转盘631，再传递至驱动杆632，再传递至摆杆621，使得摆杆621绕第一支座64做反复水平摆动，摆杆621的反复水平摆动带动摆架622，进而带动铁笔61反复水平摆动。
在一些实施例中，滑槽633可以沿驱动转盘631的径向开设。在一些实施例中，滑槽633的长度小于驱动转盘631的直径。例如，滑槽633的长度为驱动转盘631的直径的1/2-2/3。在一些实施例中，螺栓634与滑槽633的尺寸相适配且二者滑动配合。
在一些实施例中，驱动机构6还包括第二支座65，第二支座65固定连接在机架1上。如图5所示，第二支座65上方可以固定设有传动块636。传动块636可以是具有一定宽度的长条状，其延长方向经过驱动转盘631的轴心线。连接螺栓635穿过驱动杆632和摆杆621，连接螺栓635的下端面与传动块636的上端面贴合，连接螺栓635可以在传动块636上面接触滑动。驱动转盘631转动时，由于摆杆621的一端与第一支座64铰接，使得连接螺栓635在传动块636上做弧形的往复运动，进而实现摆杆621反复水平摆动。
在一些实施例中，摆臂结构62和/或摆臂驱动结构63的运动还可以通过电动滑台、线性模组、单轴驱动器等实现，本说明书对此不作限制。
在一些实施例中，压力调整机构可以设置在驱动机构6上。压力调整机构控制铁笔61向陪抛盘3施加可调节的压力。
在一些实施例中，压力调整机构可以设置在摆架622上，压力调整机构可以控制摆架622绕摆杆621的轴线转动，以实现摆架622控制铁笔61向陪抛盘3施加可调节的压力。例如，平整度检测机构检测到平整度误差值越大，压力调整机构控制摆架622绕摆杆621的轴线逆时针转动角度越大(以图4为示例)，则摆架622带动铁笔61向陪抛盘3施加的压力越大。
在一些实施例中，压力调整机构可以包括控制器、转动组件、压力检测组件等。控制器可以接收平整度检测机构检测到的平整度检测结果，并经过进一步的计算控制转动组件进行压力调节。转动组件用于控制摆架622绕摆杆621的轴线转动。例如，转动组件可以是气缸、电机等直线驱动组件，设置在摆架622的后侧方(与铁笔61反方向的一侧)。转动组件向摆架622提供一个水平推力可实现摆架622绕摆杆621的轴线转动。又例如，转动组件可以是驱动电机，设置在摆架622与摆杆621连接的轴套内的驱动电机，用于驱动轴套相对于摆杆621转动，实现摆架622绕摆杆621的轴线转动。
在一些实施例中，驱动结构6也可以通过多轴机实现，多轴机具有多根可以摆动的铁笔61。仅作为示例，如图7所示的多轴抛光装置200，多轴机具有两根铁笔61，相应地，抛光盘2、陪抛盘3和夹具5也有两组，多轴机驱动两根铁笔61摆动，以带动两组夹具5和陪 抛盘3的摆动(例如，沿水平方向摆动)。通过多轴机方式可以实现同时对更多个待抛光工件的抛光，提高了生产效率。
图6是根据本说明书一些实施例所示的示例性陪抛盘的结构示意图。
在一些实施例中，为了保证陪抛盘的尺寸和/或重量能够适用于不同的小尺寸抛光应用场景，同时保证陪抛盘在抛光加工过程中不易变形，同时综合考虑成本及加工要求等，陪抛盘的径厚比需满足一定要求。
陪抛盘3的径厚比是指陪抛盘3的直径与轴向厚度的比例。在一些实施例中，陪抛盘3的径厚比不大于10:1。在一些实施例中，陪抛盘3的径厚比小于8:1。在一些实施例中，陪抛盘3的径厚比可以小于7:1。在一些实施例中，陪抛盘3的径厚比可以小于6:1。例如，陪抛盘3的径厚比可以包括7.8:1、7.5:1、7:1、6.5:1、6:1、5.6:1、4.8:1等。
为了保证陪抛盘3可以在抛光盘2的抛光面上具有一定的转动和/或摆动的行程，以提高待抛光工件的抛光效果。在一些实施例中，陪抛盘3的直径是抛光盘2的直径的60％-80％。在一些实施例中，陪抛盘3的直径是抛光盘2的直径的65％-75％。在一些实施例中，陪抛盘3的直径大约是抛光盘2的直径的70％。需要说明的是，本说明书实施例所使用的“大约”可以指数值允许在±5％的范围内浮动。
在一些实施例中，陪抛盘3上开设的抛光位4的总面积，会影响抛光盘3整体的强度以及陪抛效果。抛光位4的总面积可以是全部抛光位4的面积之和。为了保证陪抛盘3有足够的强度，保证陪抛盘3在抛光加工过程中不易变形，同时综合考虑抛光盘3相对于抛光盘2的陪抛效率，抛光位4在陪抛盘3的面积占比上需满足一定要求。
在一些实施例中，陪抛盘3上的抛光位4的总面积小于陪抛盘3的面积的60％。在一些实施例中，陪抛盘3上的抛光位4的总面积小于陪抛盘3的面积的50％。在一些实施例中，陪抛盘3上的抛光位4的总面积小于陪抛盘3的面积的40％。
在一些实施例中，一个抛光位4的直径占陪抛盘3的直径的12％-60％。在一些实施例中，一个抛光位4的直径占陪抛盘3的直径的18％-53％。在一些实施例中，一个抛光位4的直径占陪抛盘3的直径的20％-45％。在一些实施例中，一个抛光位4的直径占陪抛盘3的直径的22％-40％。在一些实施例中，一个抛光位4的直径占陪抛盘3的直径的24％-32％。在一些实施例中，一个抛光位4的直径大约占陪抛盘3的直径的25％。
在一些实施例中，为了更好地满足小尺寸工件的加工要求，抛光位4的尺寸需满足一定要求。
在一些实施例中，至少一个抛光位4的直径为8mm-45mm。在一些实施例中，至少一个抛光位4的直径为8mm-44mm。在一些实施例中，至少一个抛光位4的直径为9mm-43mm。 在一些实施例中，至少一个抛光位4的直径为10mm-42mm。在一些实施例中，至少一个抛光位4的直径为11mm-41mm。在一些实施例中，至少一个抛光位4的直径为12mm-40mm。在一些实施例中，至少一个抛光位4的直径为13mm-39mm。在一些实施例中，至少一个抛光位4的直径为14mm-38mm。在一些实施例中，至少一个抛光位4的直径为15mm-37mm。在一些实施例中，至少一个抛光位4的直径为16mm-36mm。在一些实施例中，至少一个抛光位4的直径为17mm-35mm。例如，至少一个抛光位4的直径可以包括8.5mm、9.5mm、10.5mm、11.5mm、12.5mm、13.5mm、14.5mm、15.5mm、16.5mm、17.5mm、18mm、18.5mm、19mm、19.5mm、……、45mm等。
在一些实施例中，抛光位4的直径需比待抛光工件的直径大一定尺寸，以保证待抛光工件置于抛光位4中进行抛光加工时，抛光位4不仅不影响待抛光工件在抛光位4内的不规则运动，又能确保待抛光工件不会因为抛光过程中的运动而从抛光位4里滑脱。在一些实施例中，抛光位4与待抛光工件的直径比可以是1.2-1.5。在一些实施例中，抛光位4与待抛光工件的直径比可以是1.3-1.4。在一些实施例中，抛光位4与待抛光工件的直径比可以大约是1.35。
在一些实施例中，抛光位4的直径比待抛光工件的直径大5mm-8mm。在一些实施例中，抛光位4的直径比待抛光工件的直径大5mm-7mm。在一些实施例中，抛光位4的直径比待抛光工件的直径大6mm-8mm。在一些实施例中，抛光位4的直径比待抛光工件的直径大6mm-7mm。在一些实施例中，抛光位4的直径比待抛光工件的直径大6.5mm。
在一些实施例中，抛光装置100可以同时配备多种型号的陪抛盘3(不同型号包括陪抛盘3的尺寸和/或重量不同、抛光位4的尺寸和/或数量不同等)，可以根据待抛光工件的抛光需求更换陪抛盘3。
在一些实施例中，至少一个抛光位4在陪抛盘3上均匀排布，确保整个陪抛盘3在重力方向上重力均匀，从而保证待抛光工件置于抛光位4中进行抛光加工时抛光均匀。
在一些实施例中，多个抛光位在陪抛盘3的径向和/或周向上均匀排布。例如，如图6所示，陪抛盘3上设置有六个抛光位4，六个抛光位4在陪抛盘3的径向和周向上均匀排布。具体地，陪抛盘3的中心设有一个抛光位4，另外五个抛光位4沿圆周方向均匀排布，且每相邻两个抛光位4的圆心间距均相等。
需要说明的是，图6所示的抛光位的排布和数量仅为示例，抛光位4的数量也可以是三个、四个、五个等，可以根据实际需求设计，其排布方式也可以是其他方式，本说明书对此不作限制。
在一些实施例中，综合考虑抛光效果、抛光效率等，相邻抛光位4间的间距(例如， 相邻抛光位中心点间的距离、相邻抛光位边缘间的距离等)应满足一定要求。
在一些实施例中，相邻两个抛光位4之间的间距为10mm-15mm。在一些实施例中，相邻两个抛光位4之间的间距为11mm-14mm。在一些实施例中，相邻两个抛光位4之间的间距为11mm-13mm。在一些实施例中，相邻两个抛光位4之间的间距为12mm。
在一些实施例中，抛光位4内可以设置有配重块(图中未示出)，配重块可以向待抛光工件施加重力方向上的可调节的压力。在抛光过程中，配重块作用于待抛光工件，向待抛光工件施加朝向抛光盘2的压力，相应地，待抛光工件与抛光盘2的相对作用力增大，进而可以提升抛光效果。
在一些实施例中，当待抛光工件的抛光要求较低时，也可以不使用预紧部，可以在抛光装置的抛光位4内设置配重块。该实施例的抛光装置的抛光精度及抛光效率，与使用预紧部时相比相对较低。该实施例的抛光装置，通过更换不同型号(例如，厚度、重量不同)的配重块，来实现配重块向待抛光工件施加重力方向上的压力可调节。
在一些实施例中，抛光装置的抛光位4内设置的配重块也可以与预紧部配合使用。该抛光装置的抛光精度及抛光效率更佳。当待抛光工件的抛光要求较高时，可以既使用配重块加压又使用预紧部进行预紧力调节，以达到对待抛光工件施加最佳压力值，以提高抛光精度及抛光效率。例如，配重块的上端面与预紧部的下端连接，下端面与待加工工件抵接。配重块通过自身的重量对待抛光工件实施一定的压力，同时预紧部通过配重块向待抛光工件施加重力方向的可调节的预紧力。
在一些实施例中，可以根据待抛光工件本身的尺寸和/或重量、需要达到的抛光效果等确定配重块的重量。
在一些实施例中，配重块的重量可以是10g-150g。在一些实施例中，配重块的重量可以是30g-120g。在一些实施例中，配重块的重量可以是40g-100g。在一些实施例中，配重块的重量可以是50g-80g。在一些实施例中，配重块的重量可以是60g。
在一些实施例中，配重块可拆卸地连接在抛光位4内，抛光装置100可以同时配备多种重量型号的配重块，根据抛光需求更换配重块(例如，配重块的重量型号可以包括10g、15g、20g、25g、30g、35g、……、150g等)。
在一些实施例中，配重块可以通过弹力件连接于抛光位4内的待抛光工件。配重块与弹力件沿工件重力方向布置，配重块与弹力件配合可以适应于不同高度的待抛光工件，且在抛光过程中，持续保持配重块对待抛光工件施加压力，以提升抛光效果。
在一些实施例中，配重块可以通过弹力件连接在夹具座51的底端面上，配重块的下端面与待抛光工件的上端面接触。
在一些实施例中，为了保证配重块稳定的贴合在待抛光工件的上端面上，并在抛光过程中始终保持稳定的压力，配重块可以是与待抛光工件水平面尺寸、形状相同的块状体。
本说明书还提供一种通过上述任一实施例所述的抛光装置100对待抛光工件进行抛光的方法，包含以下步骤中的部分或全部：
001)、基于待抛光工件的抛光要求选择和/或设计陪抛盘3(和/或其上的抛光位4)，其中，待抛光工件的抛光要求包括待抛光工件的尺寸、重量和/或材质等，陪抛盘3的参数包括材质和/或尺寸等，抛光位4的参数包括材质、尺寸、数量和/或位置分布等；
002)、将陪抛盘3置于抛光盘2上，且陪抛盘3的陪抛面与抛光盘2的抛光面接触，并将待抛光工件置于抛光位4内，由于自身重力，待抛光工件的待抛光表面与抛光盘的抛光面接触；
003)、基于陪抛盘3的外径尺寸，将夹具5的多个卡爪52所夹持的直径调整至比陪抛盘3的外径大一定尺寸(例如，10-15mm)，通过锁紧机构53将陪抛盘3夹持固定；
004)、基于陪抛盘3的厚度，通过固定盘623调整铁笔球头611相对于夹具5的高度，使铁笔球头611与夹具5的凹孔511实现传动连接；
005)、基于抛光盘2的抛光面材质，通过气压装置调节夹具5向陪抛盘3(或抛光盘2)施加的压力大小；
006)、基于待抛光工件的尺寸、重量和/或材质等，调整配重块向待抛光工件施加重力方向上的压力大小；
007)、启动第一电机22和驱动机构6，抛光盘2在第一电机22的驱动下，抛光盘2自转时带动陪抛盘3的自转，驱动机构6通过铁笔61带动陪抛盘3转动和/或摆动，从而实现对待抛光工件的抛光。
本说明书实施例可能带来的有益效果包括但不限于：1)基于待抛光工件的抛光要求设计的陪抛盘和抛光位，可以适应小尺寸工件的抛光加工；2)抛光过程中可以调节抛光压力(例如，夹具施加的压力、配重块施加的压力等)，可以实现小尺寸工件安全高效的抛光加工；3)通过更换不同的抛光盘，使得同一台抛光装置可以加工多种不同尺寸和/或要求的工件；4)抛光盘上小尺寸的导液槽，确保小尺寸工件在抛光过程中的高效安全。
上文已对基本概念做了描述，显然，对于本领域技术人员来说，上述详细披露仅仅作为示例，而并不构成对本说明书的限定。虽然此处并没有明确说明，本领域技术人员可能会对本说明书进行各种修改、改进和修正。该类修改、改进和修正在本说明书中被建议，所以该类修改、改进、修正仍属于本说明书示范实施例的精神和范围。
同时，本说明书使用了特定词语来描述本说明书的实施例。如“一个实施例”、“一实施 例”、和/或“一些实施例”意指与本说明书至少一个实施例相关的某一特征、结构或特点。因此，应强调并注意的是，本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一个替代性实施例”并不一定是指同一实施例。此外，本说明书的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
同理，应当注意的是，为了简化本说明书披露的表述，从而帮助对一个或多个发明实施例的理解，前文对本说明书实施例的描述中，有时会将多种特征归并至一个实施例、附图或对其的描述中。但是，这种披露方法并不意味着本说明书对象所需要的特征比权利要求中提及的特征多。实际上，实施例的特征要少于上述披露的单个实施例的全部特征。
最后，应当理解的是，本说明书中所述实施例仅用以说明本说明书实施例的原则。其他的变形也可能属于本说明书的范围。因此，作为示例而非限制，本说明书实施例的替代配置可视为与本说明书的教导一致。相应地，本说明书的实施例不仅限于本说明书明确介绍和描述的实施例。

Claims (20)

  1. 一种抛光装置，其特征在于，所述抛光装置包括机架(1)、设置于机架(1)上的抛光盘(2)、陪抛盘(3)和夹具(5)，其中，
    所述陪抛盘(3)上设置有至少一个抛光位(4)，所述抛光位(4)用于放置待抛光工件；所述陪抛盘(3)通过所述夹具(5)夹持，所述夹具(5)包括多个卡爪(52)，所述卡爪(52)至少包括从所述至少一个抛光位(4)上方延伸至所述陪抛盘(3)边缘的第一卡爪，所述第一卡爪上对应于所述至少一个抛光位(4)的位置设置有预紧部，所述预紧部包括刻度标尺和预紧件，所述刻度标尺上预设有表征抛光去除效率的刻度值，所述预紧件基于所述刻度值调节对所述待抛光工件的抛光效率；
    在抛光过程中，所述抛光盘(2)转动，所述陪抛盘(3)转动和/或摆动，以实现所述待抛光工件的抛光。
  2. 如权利要求1所述的抛光装置，其特征在于，所述抛光装置还包括平整度检测机构和压力调整机构；所述平整度检测机构检测抛光过程中所述抛光盘的平整度是否满足预设要求；所述压力调整机构根据所述平整度检测机构的检测结果调节所述陪抛盘对所述抛光盘施加的压力。
  3. 如权利要求2所述的抛光装置，其特征在于，所述抛光装置还包括驱动机构(6)，所述驱动机构(6)通过铁笔(61)与所述夹具(5)连接，用于驱动所述陪抛盘(3)转动和/或摆动。
  4. 如权利要求2所述的抛光装置，其特征在于，所述压力调整机构设置在所述驱动机构(6)上；所述压力调整机构控制所述铁笔(61)向所述陪抛盘(3)施加可调节的压力；
    或者，
    所述压力调整机构设置在所述夹具(5)上；所述压力调整机构控制所述夹具(5)向所述陪抛盘(3)施加重力方向上的可调节的压力。
  5. 如权利要求1所述的抛光装置，其特征在于，所述抛光盘(2)的抛光面上可以设置导液槽(21)，所述导液槽(21)的宽度的取值范围为1mm-5mm。
  6. 如权利要求5所述的抛光装置，其特征在于，所述导液槽(21)的宽度是待抛光工件的直径的3％-20％。
  7. 如权利要求5所述的抛光装置，其特征在于，所述待抛光工件的直径小于25.4mm时，所述导液槽(21)的宽度的取值范围为1mm-3mm。
  8. 如权利要求5所述的抛光装置，其特征在于，所述待抛光工件的直径在25.4mm-50.8mm之间时，所述导液槽(21)的宽度的取值范围为2mm-5mm。
  9. 如权利要求1所述的抛光装置，其特征在于，所述陪抛盘(3)的径厚比小于8:1。
  10. 如权利要求1-9任一项所述的抛光装置，其特征在于，所述陪抛盘(3)的直径是所述抛光盘(2)的直径的60％-80％。
  11. 如权利要求10所述的抛光装置，其特征在于，所述陪抛盘(3)的直径不小于100mm。
  12. 如权利要求1-11任一项所述的抛光装置，其特征在于，所述陪抛盘(3)的材料密度为5g/cm2-20g/cm2。
  13. 如权利要求1所述的抛光装置，其特征在于，所述至少一个抛光位(4)的直径为8mm-45mm。
  14. 如权利要求1所述的抛光装置，其特征在于，所述至少一个抛光位(4)的总面积小于所述陪抛盘(3)的面积的50％。
  15. 如权利要求1所述的抛光装置，其特征在于，所述至少一个抛光位(4)中的任意一个的直径占所述陪抛盘(3)的直径的12％-60％。
  16. 如权利要求1所述的抛光装置，其特征在于，所述至少一个抛光位(4)在所述陪抛盘(3)上均匀排布。
  17. 如权利要求1所述的抛光装置，其特征在于，相邻两个抛光位(4)之间的间距为10mm-15mm。
  18. 如权利要求1所述的抛光装置，其特征在于，所述抛光位(4)与所述待抛光工件的直径比为1.2-1.5。
  19. 如权利要求1所述的抛光装置，其特征在于，所述抛光位(4)内设置有配重块，所述配重块向所述待抛光工件施加重力方向的可调节的压力。
  20. 如权利要求19所述的抛光装置，其特征在于，所述配重块通过弹力件连接于所述抛光位(4)内的所述待抛光工件。
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