WO2023204099A1 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
WO2023204099A1
WO2023204099A1 PCT/JP2023/014706 JP2023014706W WO2023204099A1 WO 2023204099 A1 WO2023204099 A1 WO 2023204099A1 JP 2023014706 W JP2023014706 W JP 2023014706W WO 2023204099 A1 WO2023204099 A1 WO 2023204099A1
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WO
WIPO (PCT)
Prior art keywords
interlayer connection
conductor
axis
connection conductor
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/014706
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English (en)
French (fr)
Japanese (ja)
Inventor
恒亮 西尾
隆達 水上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2024516213A priority Critical patent/JPWO2023204099A1/ja
Priority to CN202390000255.0U priority patent/CN223024647U/zh
Publication of WO2023204099A1 publication Critical patent/WO2023204099A1/ja
Priority to US18/830,893 priority patent/US20250008647A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Definitions

  • the present invention relates to a multilayer substrate including a signal conductor layer.
  • a transmission line described in Patent Document 1 As an invention related to a conventional multilayer board, for example, a transmission line described in Patent Document 1 is known.
  • This transmission line includes a signal line, two ground conductors, and a plurality of GND vias.
  • the signal line is located between two ground conductors in the vertical direction.
  • the signal line extends in the front-rear direction.
  • a plurality of GND vias electrically connects two ground conductors.
  • Multiple GND vias are located on both the left and right sides of the signal line.
  • the plurality of GND vias are lined up along the signal line.
  • the intervals between the plurality of GND vias are uneven. Therefore, the characteristic impedance generated in the signal line is also non-uniform.
  • a propagation mode (hereinafter referred to as an unnecessary propagation mode) other than the desired propagation mode (for example, TEM mode) occurs.
  • unnecessary propagation modes flow through the two ground conductors.
  • Such unnecessary propagation modes are radiated as noise to the outside of the transmission line between two GND vias that are widely spaced among the plurality of GND vias. As a result, noise is generated in the transmission line.
  • an object of the present invention is to provide a multilayer substrate that can suppress the generation of noise.
  • a multilayer substrate includes: A laminate having a structure in which a plurality of insulator layers are stacked in the Z-axis direction; a signal conductor layer provided in the laminate and having a linear shape extending in an X-axis direction perpendicular to the Z-axis direction; a first reference conductor layer provided in the laminate, located in the positive direction of the Z-axis from the signal conductor layer, and overlapping with the signal conductor layer when viewed in the Z-axis direction; a second reference conductor layer provided in the laminate, located in the negative direction of the Z-axis from the signal conductor layer, and overlapping with the signal conductor layer when viewed in the Z-axis direction; electrically connecting the first reference conductor layer and the second reference conductor layer, and located in the positive direction of the Y-axis perpendicular to the X-axis direction and the Z-axis direction from the signal conductor layer, and , a first interlayer connection conductor, a second interlayer connection conductor
  • a fourth interlayer connecting conductor, a fifth interlayer connecting conductor, and a sixth interlayer connecting conductor arranged in this order toward the positive direction of an eleventh interlayer that is connected to the signal conductor layer, is located in the positive direction of the Z-axis from the signal conductor layer, and penetrates one or more of the plurality of insulator layers along the Z-axis; a connecting conductor; It is equipped with The distance in the X-axis direction between the second interlayer connection conductor and the third interlayer connection conductor is longer than the distance in the X-axis direction between the first interlayer connection conductor and the second interlayer connection conductor, The distance in the X-axis direction between the fifth interlayer connection conductor and the sixth interlayer connection conductor is longer than the distance in the X-axis direction between the fourth interlayer connection conductor and the fifth interlayer connection conductor, A reference conductor layer of the first reference conductor layer and the second reference conductor layer that overlaps with the eleventh interlayer connection conductor is provided with a first opening that overlap
  • the first opening When viewed in the Z-axis direction, the first opening is located in the negative direction of the X-axis from the vicinity of the first reference straight line connecting the second interlayer connection conductor and the fifth interlayer connection conductor, When viewed in the Z-axis direction, the first opening is located in the positive direction of the X-axis from the eleventh interlayer connection conductor.
  • the generation of noise can be suppressed.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a top view of the insulator layer 16c.
  • FIG. 3 is a cross-sectional view of the multilayer substrate 10.
  • FIG. 4 is a front view of the multilayer substrate 10 in use.
  • FIG. 5 is a top view of the insulator layer 16c.
  • FIG. 6 is an exploded perspective view of the multilayer substrate 10b.
  • FIG. 7 is a cross-sectional view of the multilayer substrate 10b.
  • FIG. 8 is a top view of the insulator layer 16c.
  • FIG. 9 is a cross-sectional view of the multilayer substrate 10d.
  • FIG. 10 is a cross-sectional view of the multilayer substrate 10e.
  • FIG. 11 is a top view of the insulator layer 16c.
  • FIG. 12 is a cross-sectional view of the multilayer substrate 10g.
  • FIG. 13 is a top view of the insulator layer 16c.
  • FIG. 1 is an exploded perspective view of the multilayer substrate 10.
  • FIG. 2 is a top view of the insulator layer 16c. In FIG. 2, the signal conductor layers 20 are shown overlapped.
  • FIG. 3 is a cross-sectional view of the multilayer substrate 10.
  • FIG. 4 is a front view of the multilayer substrate 10 in use.
  • direction is defined as follows.
  • the stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction.
  • the up-down direction coincides with the Z-axis direction.
  • the upward direction is the positive direction of the Z axis.
  • the downward direction is the negative direction of the Z axis.
  • the direction in which the signal conductor layer 20 of the multilayer substrate 10 extends is defined as the left-right direction.
  • the left-right direction coincides with the X-axis direction.
  • the right direction is the positive direction of the X axis.
  • the left direction is the negative direction of the X axis.
  • the line width direction of the signal conductor layer 20 is defined as the front-back direction.
  • the front-back direction coincides with the Y-axis direction.
  • the forward direction is the positive direction of the Y axis.
  • the rear direction is the negative direction of the Y axis.
  • the up-down direction, the front-back direction, and the left-right direction are orthogonal to each other. Note that the upper and lower directions in the vertical direction may be interchanged, the left and right directions in the horizontal direction may be interchanged, and the front and rear directions in the longitudinal direction may be interchanged.
  • X is a component or member of the multilayer substrate 10.
  • each part of X is defined as follows.
  • the front part of the X means the front half of the X.
  • the rear part of the X means the rear half of the X.
  • the left part of X means the left half of X.
  • the right side of X means the right half of X.
  • the upper part of X means the upper half of X.
  • the lower part of X means the lower half of X.
  • the front end of X means the front end of X.
  • the rear end of X means the end of X in the rear direction.
  • the left end of X means the left end of X.
  • the right end of X means the right end of X.
  • the upper end of X means the upper end of X.
  • the lower end of X means the lower end of X.
  • the front end of X means the front end of X and its vicinity.
  • the rear end of X means the rear end of X and its vicinity.
  • the left end of X means the left end of X and its vicinity.
  • the right end of X means the right end of X and its vicinity.
  • the upper end of X means the upper end of X and its vicinity.
  • the lower end of X means the lower end of X and its vicinity.
  • Multilayer substrate 10 transmits high frequency signals.
  • the multilayer substrate 10 is used to electrically connect two circuits in electronic devices such as smartphones.
  • the multilayer board 10 includes a laminate 12, a signal conductor layer 20, a first reference conductor layer 22, a second reference conductor layer 24, signal terminals 26a, 26b, interlayer connection conductors v1 to v8, v11, v12, a plurality of interlayer connection conductors v9, and a plurality of interlayer connection conductors v10.
  • the laminate 12 has a plate shape. Therefore, the laminate 12 has an upper main surface and a lower main surface.
  • the upper main surface and the lower main surface of the laminate 12 have a rectangular shape with long sides extending in the left-right direction. Therefore, the length of the laminate 12 in the left-right direction is longer than the length of the laminate 12 in the front-rear direction.
  • the laminate 12 has flexibility.
  • the laminate 12 has a structure in which insulator layers 16a to 16c and protective layers 18a and 18b are stacked in the Z-axis direction.
  • the protective layer 18a, the insulator layers 16a to 16c, and the protective layer 18b are arranged in this order from top to bottom.
  • the insulator layers 16a to 16c have an upper main surface and a lower main surface that are arranged in the vertical direction.
  • the material of the insulating layers 16a to 16c is thermoplastic resin.
  • the thermoplastic resin is, for example, a liquid crystal polymer.
  • the insulator layers 16a to 16c are vertically adjacent to each other and fused together.
  • the protective layers 18a and 18b will be described later.
  • a high frequency signal is transmitted to the signal conductor layer 20.
  • the signal conductor layer 20 is provided on the laminate 12 .
  • the signal conductor layer 20 is located on the upper main surface of the insulator layer 16b.
  • the signal conductor layer 20 has a linear shape extending in the left-right direction (X-axis direction).
  • the first reference conductor layer 22 is provided on the laminate 12, as shown in FIG.
  • the first reference conductor layer 22 is located above the signal conductor layer 20 (in the positive direction of the Z-axis) and overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction).
  • the first reference conductor layer 22 is located on the upper main surface of the insulator layer 16a.
  • the first reference conductor layer 22 covers substantially the entire upper main surface of the insulator layer 16a.
  • a reference potential is connected to the first reference conductor layer 22 .
  • the reference potential is, for example, a ground potential.
  • the second reference conductor layer 24 is provided on the laminate 12, as shown in FIG.
  • the second reference conductor layer 24 is located below the signal conductor layer 20 (in the negative direction of the Z-axis) and overlaps with the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction).
  • the second reference conductor layer 24 is located on the lower main surface of the insulator layer 16c.
  • the second reference conductor layer 24 covers substantially the entire lower main surface of the insulator layer 16c.
  • a reference potential is connected to the second reference conductor layer 24 .
  • the reference potential is, for example, a ground potential.
  • the signal conductor layer 20, first reference conductor layer 22, and second reference conductor layer 24 as described above have a stripline structure.
  • the reference conductor layer that overlaps with the interlayer connection conductor v11 (eleventh interlayer connection conductor) of the first reference conductor layer 22 and the second reference conductor layer 24 includes a signal conductor layer 20 when viewed in the vertical direction (Z-axis direction).
  • a first opening Op1 is provided which overlaps with the first opening Op1.
  • the interlayer connection conductor v11 overlaps with the second reference conductor layer 24 and does not overlap with the first reference conductor layer 22. Therefore, the second reference conductor layer 24 is provided with a first opening Op1 that overlaps the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). The structure of the first opening Op1 will be described later.
  • the signal terminal 26a is provided at the left end of the laminate 12. More specifically, the signal terminal 26a is located on the upper main surface (the main surface located in the positive direction of the Z-axis) of the laminate 12. The signal terminal 26a overlaps the left end portion of the signal conductor layer 20 when viewed in the vertical direction. The signal terminal 26a has a circular shape when viewed in the vertical direction. The signal terminal 26a is an external terminal to which a high frequency signal is input/output. The signal terminal 26a is not in contact with the first reference conductor layer 22.
  • the interlayer connection conductor v11 (eleventh interlayer connection conductor) electrically connects the signal terminal 26a and the left end portion of the signal conductor layer 20.
  • the interlayer connection conductor v11 vertically penetrates the insulator layer 16a.
  • the structure of the signal terminal 26b and the interlayer connection conductor v12 is bilaterally symmetrical to the structure of the signal terminal 26a and the interlayer connection conductor v11, so a description thereof will be omitted.
  • interlayer connection conductor v1 first interlayer connection conductor
  • interlayer connection conductor v2 second interlayer connection conductor
  • interlayer connection conductor v3 third interlayer connection conductor
  • interlayer connection conductor v7 seventh interlayer connection conductor
  • the interlayer connection conductor) and the plurality of interlayer connection conductors v9 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24.
  • FIG. 1 first interlayer connection conductor
  • interlayer connection conductor v2 second interlayer connection conductor
  • interlayer connection conductor v3 third interlayer connection conductor
  • interlayer connection conductor v7 seventh interlayer connection conductor
  • interlayer connection conductor v1 first interlayer connection conductor
  • interlayer connection conductor v2 second interlayer connection conductor
  • interlayer connection conductor v3 third interlayer connection conductor
  • interlayer connection conductor v7 seventh interlayer connection conductor
  • the interlayer connection conductor) and the plurality of interlayer connection conductors v9 are located before the signal conductor layer 20 (in the positive direction of the Y axis).
  • the interlayer connection conductor v7, the interlayer connection conductor v1 (first interlayer connection conductor), the interlayer connection conductor v2 (second interlayer connection conductor), the interlayer connection conductor v3 (third interlayer connection conductor), and the plurality of interlayer connection conductors v9 are used for signal They are arranged in this order along the conductor layer 20 toward the right (positive direction of the X-axis).
  • the distance D2 in the left-right direction (X-axis direction) between the interlayer connection conductor v2 (second interlayer connection conductor) and the interlayer connection conductor v3 (third interlayer connection conductor) is the distance D2 between the interlayer connection conductor v1 (first interlayer connection conductor) and the interlayer connection conductor v3 (third interlayer connection conductor). It is longer than the distance D1 in the left-right direction (X-axis direction) from the connection conductor v2 (second interlayer connection conductor).
  • the distance D4 in the left-right direction between the interlayer connection conductor v7 and the interlayer connection conductor v1 is shorter than the distance D2 in the left-right direction between the interlayer connection conductor v2 and the interlayer connection conductor v3.
  • the distance D5 in the left-right direction between the leftmost interlayer connection conductor v9 of the plurality of interlayer connection conductors v9 and the interlayer connection conductor v3 is shorter than the distance D2 in the left-right direction between the interlayer connection conductor v2 and the interlayer connection conductor v3. .
  • the distance D6 in the left-right direction between the plurality of interlayer connection conductors v9 is shorter than the distance D2 in the left-right direction between the interlayer connection conductors v2 and v3.
  • the distance D1, the distance D4, the distance D5, and the distance D6 are equal to each other.
  • interlayer connection conductor v4 (fourth interlayer connection conductor), interlayer connection conductor v5 (fifth interlayer connection conductor), interlayer connection conductor v6 (sixth interlayer connection conductor), interlayer connection conductor v8 (eighth interlayer connection conductor),
  • the interlayer connection conductor) and the plurality of interlayer connection conductors v10 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24.
  • interlayer connection conductor v4 (fourth interlayer connection conductor), interlayer connection conductor v5 (fifth interlayer connection conductor), interlayer connection conductor v6 (sixth interlayer connection conductor), interlayer connection conductor v8 (eighth interlayer connection conductor),
  • the interlayer connection conductor) and the plurality of interlayer connection conductors v10 are located after the signal conductor layer 20 (in the negative direction of the Y axis).
  • the interlayer connection conductor v8 the interlayer connection conductor v4 (fourth interlayer connection conductor), the interlayer connection conductor v5 (fifth interlayer connection conductor), the interlayer connection conductor v6 (sixth interlayer connection conductor), and the plurality of interlayer connection conductors v10 are used for signal They are arranged in this order along the conductor layer 20 toward the right (positive direction of the X-axis).
  • the distance D12 in the left-right direction (X-axis direction) between the interlayer connection conductor v5 (fifth interlayer connection conductor) and the interlayer connection conductor v6 (sixth interlayer connection conductor) is the distance D12 between the interlayer connection conductor v4 (fourth interlayer connection conductor) and the interlayer connection conductor v6 (sixth interlayer connection conductor). It is longer than the distance D11 in the left-right direction (X-axis direction) from the connection conductor v5 (fifth interlayer connection conductor).
  • the distance D14 in the left-right direction between the interlayer connection conductor v8 and the interlayer connection conductor v4 is shorter than the distance D12 in the left-right direction between the interlayer connection conductor v5 and the interlayer connection conductor v6.
  • the distance D15 in the left-right direction between the leftmost interlayer connection conductor v10 of the plurality of interlayer connection conductors v10 and the interlayer connection conductor v6 is shorter than the distance D12 in the left-right direction between the interlayer connection conductor v5 and the interlayer connection conductor v6.
  • the distance D16 in the left-right direction between the plurality of interlayer connection conductors v10 is shorter than the distance D12 in the left-right direction between the interlayer connection conductors v5 and v6.
  • the distance D11, the distance D14, the distance D15, and the distance D16 are equal to each other.
  • the interlayer connection conductor v1 overlaps the interlayer connection conductor v4 when viewed in the front-rear direction.
  • the interlayer connection conductor v2 overlaps the interlayer connection conductor v5 when viewed in the front-rear direction.
  • the interlayer connection conductor v3 overlaps the interlayer connection conductor v6 when viewed in the front-rear direction.
  • the interlayer connection conductor v7 overlaps the interlayer connection conductor v8 when viewed in the front-rear direction.
  • Each of the plurality of interlayer connection conductors v9 overlaps with the plurality of interlayer connection conductors v10.
  • the interlayer connection conductor v1 does not need to overlap the interlayer connection conductor v4 when viewed in the front-rear direction.
  • the interlayer connection conductor v2 does not need to overlap the interlayer connection conductor v5 when viewed in the front-rear direction.
  • the interlayer connection conductor v3 does not need to overlap the interlayer connection conductor v6 when viewed in the front-rear direction.
  • the interlayer connection conductor v7 does not need to overlap the interlayer connection conductor v8 when viewed in the front-rear direction.
  • Each of the plurality of interlayer connection conductors v9 does not need to overlap with the plurality of interlayer connection conductors v10.
  • the interlayer connection conductor v11 (eleventh interlayer connection conductor) includes interlayer connection conductor v1 (first interlayer connection conductor), interlayer connection conductor v2 (second interlayer connection conductor), and interlayer connection conductor v4. (4th interlayer connection conductor), interlayer connection conductor v5 (5th interlayer connection conductor), interlayer connection conductor v7 (7th interlayer connection conductor), and interlayer connection conductor v8 (8th interlayer connection conductor) positioned.
  • the distance D50 in the left-right direction between the interlayer connection conductor v11 and the first reference straight line X1 (described later) is shorter than a half wavelength of the high-frequency signal transmitted through the signal conductor layer 20.
  • the interlayer connection conductor v11 does not overlap with the first opening Op1, which will be described later, when viewed in the vertical direction.
  • the first reference conductor layer 22, second reference conductor layer 24, and signal terminals 26a, 26b as described above are formed by etching metal foil provided on the upper or lower main surface of the insulating layers 16a to 16c, for example. It is formed by applying The metal foil is, for example, copper foil.
  • the interlayer connection conductors v1 to v8, v11, v12 and the plurality of interlayer connection conductors v9, v10 are, for example, via hole conductors.
  • the via hole conductor is produced by forming through holes in the insulator layers 16a to 16c, filling the through holes with conductive paste, and sintering the conductive paste.
  • the material of the interlayer connection conductors v1 to v8, v11, v12 and the plurality of interlayer connection conductors v9, v10 is a mixture of resin and metal.
  • the first reference straight line X1 is a line that connects the interlayer connection conductor v2 (second interlayer connection conductor) and the interlayer connection conductor v5 (fifth interlayer connection conductor). Then, when viewed in the vertical direction (Z-axis direction), the intersection between the first reference straight line X1 and the center line CL of the signal conductor layer 20 is defined as a first intersection P1.
  • the second reference straight line X2 is a line that passes through the interlayer connection conductor v3 (third interlayer connection conductor) and the interlayer connection conductor v6 (sixth interlayer connection conductor). Then, when viewed in the vertical direction (Z-axis direction), the intersection between the second reference straight line X2 and the center line CL of the signal conductor layer 20 is defined as a second intersection P2.
  • first intersection point P1 and the second intersection point P2 is divided into four equal parts by the first point p1, the second point p2, and the third point p3, which are arranged toward the right (positive direction of the X axis). ing. Further, a point separated from the first intersection point P1 in the left direction (in the negative direction of the X axis) by the distance between the first point p1 and the second point p2 is defined as a fourth point p4.
  • the structure of the first opening Op1 will be described below.
  • the first opening Op1 has a slit shape extending in the front-rear direction. Therefore, the width of the first opening Op1 in the front-rear direction (Y-axis direction) is larger than the width of the first opening Op1 in the left-right direction (X-axis direction).
  • the width of the first opening Op1 in the front-rear direction (Y-axis direction) is the same as that of the lower end (the negative end of the Y-axis) of the interlayer connection conductor v2 (the second interlayer connection conductor) and the width of the interlayer connection conductor v5 (the fifth interlayer connection conductor). conductor) to the upper end (end in the positive direction of the Y-axis) in the front-rear direction (Y-axis direction).
  • the first opening Op1 is located near the interlayer connection conductors v2 and v5. More specifically, when viewed in the vertical direction (Z-axis direction), the first opening Op1 is located to the left (on the X-axis) of the vicinity of the first reference straight line negative direction). Note that being located near the first reference straight line X1 means being located to the left of the first straight line L1 and to the right of the second straight line L2.
  • the first straight line L1 is a line that passes through the first point p1 and is orthogonal to the signal conductor layer 20.
  • the second straight line L2 is a line that passes through the fourth point p4 and is orthogonal to the signal conductor layer 20.
  • the center C1 of the first opening Op1 in the front-back direction and the left-right direction (X-axis direction) is located between the first straight line L1 and the second straight line L2.
  • the first opening Op1 is located between the first straight line L1 and the second straight line L2 when viewed in the vertical direction (Z-axis direction).
  • the first opening Op1 when viewed in the vertical direction (Z-axis direction), the first opening Op1 is located to the right (in the positive direction of the X-axis) of the interlayer connection conductor v11 (the eleventh interlayer connection conductor). Furthermore, when viewed in the vertical direction (Z-axis direction), the left end (end in the negative direction of the X-axis) of the first opening Op1 is connected to the interlayer connection conductor v1 (first interlayer connection conductor) and the interlayer connection conductor v4 (fourth It is located to the right (in the positive direction of the X-axis) of the straight line X3 connecting the connecting conductor).
  • the left end (end in the negative direction of the X-axis) of the first opening Op1 is the right end (end in the X-axis negative direction) of the interlayer connection conductor v1 (first interlayer connection conductor) (the end in the positive direction of the X-axis) and the right end (the end in the positive direction of the X-axis) of the interlayer connection conductor v4 (the fourth interlayer connection conductor).
  • the right end (end in the positive direction of the X-axis) of the first opening Op1 is located from the third straight line L3 that passes through the second point p2 and is perpendicular to the signal conductor layer 20. It is located on the left (negative direction of the X axis).
  • the entire first opening Op1 is located between the first straight line L1 and the second straight line L2 when viewed in the vertical direction (Z-axis direction). More precisely, the first opening Op1 is located between the first reference straight line X1 and the first straight line L1.
  • the front end (the end in the positive direction of the Y-axis) of the first opening Op1 is located behind the front end (the end in the positive direction of the Y-axis) of the interlayer connection conductor v2 (the second interlayer connection conductor) (in the negative direction of the Y-axis). It is located in The rear end (end in the negative direction of the Y-axis) of the first opening Op1 is in front of the rear end (end in the negative direction of the Y-axis) of the interlayer connection conductor v5 (fifth interlayer connection conductor) (positive direction of the Y-axis) It is located in
  • a first opening Op1 is provided in the second reference conductor layer 24, which is provided at a vertically different position from the signal terminal 26a.
  • the fourth straight line L4 is a line that passes through the third point p3 and is orthogonal to the signal conductor layer 20.
  • the protective layer 18a is an insulator layer that covers the upper main surface of the insulator layer 16a. Thereby, the protective layer 18a protects the first reference conductor layer 22.
  • the protective layer 18a is provided with openings h1 to h6.
  • the opening h1 overlaps the signal terminal 26a when viewed in the vertical direction. Thereby, the signal terminal 26a is exposed to the outside from the multilayer substrate 10.
  • the opening h2 is located after the opening h1.
  • a portion of the first reference conductor layer 22 is exposed to the outside from the multilayer substrate 10 via the opening h2.
  • the opening h3 is located in front of the opening h1.
  • a portion of the first reference conductor layer 22 is exposed to the outside from the multilayer substrate 10 via the opening h3.
  • the structure of the openings h4 to h6 is symmetrical to the structure of the openings h1 to h3, so a description thereof will be omitted.
  • the protective layer 18b is a protective layer that covers the lower main surface of the insulator layer 16c. Thereby, the protective layer 18b protects the second reference conductor layer 24.
  • the multilayer substrate 10 as described above has flexibility. Therefore, as shown in FIG. 4, the multilayer substrate 10 can be bent. Specifically, the multilayer substrate 10 has a first section A1, a second section A2, and a third section A3. The first section A1, the second section A2, and the third section A3 are arranged in this order from left to right when the multilayer substrate 10 is not bent. As shown in FIG. 2, the first section A1 is a section to the left of the first reference straight line X1 that connects the interlayer connection conductor v2 and the interlayer connection conductor v5.
  • the second section A2 is a section between the first reference straight line X1 that connects the interlayer connection conductor v2 and the interlayer connection conductor v5 and the second reference straight line X2 that connects the interlayer connection conductor v3 and the interlayer connection conductor v6.
  • the third section A3 is a section to the right of the second reference straight line X2 that connects the interlayer connection conductor v3 and the interlayer connection conductor v6.
  • a portion a2 of the second section A2 is bent downward with respect to the first section A1. That is, the multilayer board 10 has a first reference straight line X1 connecting interlayer connection conductor v2 (second interlayer connection conductor) and interlayer connection conductor v5 (fifth interlayer connection conductor) and interlayer connection conductor v3 (third interlayer connection conductor). and the second reference straight line X2 connecting the interlayer connection conductor v6 (sixth interlayer connection conductor).
  • the end of the portion a2 in the negative direction of the X-axis is located in the positive direction of the X-axis from the end of the second section A2 in the negative direction of the X-axis.
  • the end of the portion a2 in the positive direction of the X-axis is located in the negative direction of the X-axis from the end of the second section A2 in the positive direction of the X-axis.
  • the first section A1 and the third section A3 are not bent.
  • the first section A1 and the third section A3 may be slightly bent. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are larger than the radius of curvature of the portion a2 of the second section A2.
  • the generation of noise can be suppressed. More specifically, in the multilayer board 10, the distance D2 in the left-right direction between the interlayer connection conductor v2 and the interlayer connection conductor v3 is longer than the distance D1 in the left-right direction between the interlayer connection conductor v1 and the interlayer connection conductor v2. The distance D12 in the left-right direction between the interlayer connection conductor v5 and the interlayer connection conductor v6 is longer than the distance D11 in the left-right direction between the interlayer connection conductor v4 and the interlayer connection conductor v5. Therefore, the characteristic impedance generated in the signal conductor layer 20 tends to be non-uniform.
  • a propagation mode (hereinafter referred to as an unnecessary propagation mode) other than the desired propagation mode (TEM mode) occurs.
  • the unnecessary propagation mode may be radiated as noise from the region between the first reference straight line X1 and the second reference straight line X2.
  • the first opening Op1 when viewed in the vertical direction, is located to the left of the vicinity of the first reference straight line X1 connecting the second interlayer connection conductor v2 and the fifth interlayer connection conductor v5. Furthermore, when viewed in the vertical direction, the first opening Op1 is located to the right of the eleventh interlayer connection conductor v11. Thereby, the first opening Op1 is located near the interlayer connection conductors v2 and v5. The center C1 of the first opening Op1 is located near the first reference straight line X1 in the left-right direction, and is not located near the interlayer connection conductors v2, v5.
  • the width of the first opening Op1 in the front-rear direction is more than half of the distance D60 in the front-rear direction between the rear end of the interlayer connection conductor v2 and the front end of the interlayer connection conductor v5.
  • the multilayer board 10 is a part of the second section A2 between the first reference straight line X1 that connects the interlayer connection conductor v2 and the interlayer connection conductor v5 and the straight line X2 that connects the interlayer connection conductor v3 and the interlayer connection conductor v6. It is bent at a2. There is no interlayer connection conductor in part a2 of the second section A2. Therefore, even if the portion a2 of the second section A2 is bent, the distance between the signal conductor layer 20 and the interlayer connection conductor is unlikely to change in the portion a2 of the second section A2. As a result, the characteristic impedance generated in the signal conductor layer 20 is less likely to fluctuate in the portion a2 of the second section A2. Therefore, according to the multilayer substrate 10, the characteristic impedance generated in the signal conductor layer 20 is suppressed from varying from the desired characteristic impedance (for example, 50 ⁇ ).
  • the desired characteristic impedance for example, 50 ⁇
  • the width of the first opening Op1 in the front-rear direction is larger than the width of the first opening Op1 in the left-right direction. That is, the first opening Op1 has a longitudinal direction in the front-rear direction. Therefore, the first opening Op1 prevents the unnecessary propagation mode from flowing to the right. Furthermore, since the width of the first opening Op1 in the left-right direction is small, the area of the first opening Op1 does not become too large. As a result, noise is suppressed from being radiated from the first opening Op1. Further, the strength of the multilayer substrate 10 can be maintained.
  • the front end of the first opening Op1 is located behind the front end of the interlayer connection conductor v2.
  • the rear end of the first opening Op1 is located in front of the rear end of the interlayer connection conductor v5.
  • the generation of noise can be suppressed. More specifically, the characteristic impedance generated in the interlayer connection conductor v11 and the sections before and after it tends to vary from a desired characteristic impedance. Therefore, unnecessary propagation modes are likely to occur in the interlayer connection conductor v11. Thereby, the unnecessary propagation mode flows to the right in the second reference conductor layer 24 near the first reference straight line X1.
  • the interlayer connection conductor v11 is located in the section where the interlayer connection conductor v1, the interlayer connection conductor v2, the interlayer connection conductor v4, the interlayer connection conductor v5, the interlayer connection conductor v7, and the interlayer connection conductor v8 are provided.
  • This suppresses unnecessary propagation modes from being radiated as noise to the outside of the multilayer board 10 by the interlayer connection conductors v1, interlayer connection conductors v2, interlayer connection conductors v4, interlayer connection conductors v5, interlayer connection conductors v7, and interlayer connection conductors v8. be done.
  • FIG. 5 is a top view of the insulator layer 16c.
  • the multilayer substrate 10a differs from the multilayer substrate 10 in that the second openings Op2 to Op5, the third opening Op6, and the fourth openings Op7 to Op10 are provided in the second reference conductor layer 24.
  • the second opening Op2 is located to the front left of the first opening Op1.
  • the second opening Op3 is located at the rear left of the first opening Op1.
  • the second opening Op4 is located on the right front of the first opening Op1.
  • the second opening Op5 is located on the right rear of the first opening Op1. Furthermore, when viewed in the left-right direction, the front end of the first opening Op1 overlaps with the rear end of the second opening Op2 and the rear end of the second opening Op4.
  • the rear end of the first opening Op1 overlaps the front end of the second opening Op3 and the front end of the second opening Op5.
  • Each of the widths of the second openings Op2 to Op5 in the front-rear direction is larger than the width of the second openings Op2 to Op5 in the left-right direction.
  • the second openings Op2 to Op5 are located between the first straight line L1 and the second straight line L2.
  • the centers C2 to C5 of the second openings Op2 to Op5 in the left-right direction (X-axis direction) are located between the first straight line L1 and the second straight line L2.
  • the width W1 in the front-back direction (Y-axis direction) of the region where the first opening Op1 and the second openings Op2 to Op5 are present is equal to the width W1 of the interlayer connection conductor v2 (the fourth Distance in the front-back direction (Y-axis direction) between the rear end (end in the negative direction of the Y-axis) of the interlayer connection conductor) and the front end (end in the positive direction of the Y-axis) of the interlayer connection conductor v5 (fifth interlayer connection conductor) It is more than half of D60.
  • the third opening Op6 and the fourth openings Op7 to Op10 are located near the interlayer connection conductor v12.
  • the third opening Op6 has a laterally symmetrical structure with the first opening Op1.
  • the fourth openings Op7 to Op10 have a structure on the left and right sides of the second openings Op2 to Op5. Therefore, description of the structures of the third opening Op6 and the fourth openings Op7 to Op10 will be omitted.
  • This suppresses noise generated by the interlayer connection conductor v12 from being radiated.
  • the other structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10a can achieve the effects (a), (c), (d), (e), and (f).
  • the width W1 in the front-rear direction of the region where the first opening Op1 and the second openings Op2 to Op5 are present is the same as the rear end of the interlayer connection conductor v4 and the interlayer This is more than half of the distance D60 in the front-rear direction from the front end of the connecting conductor v5.
  • the flow of unnecessary propagation modes propagating through the second reference conductor layer 24 is efficiently blocked by the first opening Op1 and the second openings Op2 to Op5. Therefore, unnecessary propagation modes are suppressed from being radiated as noise between the interlayer connection conductor v2 and the interlayer connection conductor v3 and between the interlayer connection conductor v5 and the interlayer connection conductor v6.
  • the third opening Op6 has a line-symmetric structure with respect to the first opening Op1 and the third straight line L3.
  • the fourth openings Op7 to Op10 have a line-symmetric structure with respect to the second openings Op2 to Op5 and the third straight line L3.
  • FIG. 6 is an exploded perspective view of the multilayer substrate 10b.
  • FIG. 7 is a cross-sectional view of the multilayer substrate 10b.
  • the multilayer substrate 10b differs from the multilayer substrate 10 in that the first reference conductor layer 22 is provided with an opening Op30.
  • the opening Op30 does not overlap the first opening Op1 when viewed in the vertical direction. This makes it difficult for the characteristic impedance generated in the signal conductor layer 20 to fluctuate. Furthermore, the influence of noise is suppressed by locating the opening Op1 closer to the interlayer connection conductor v11 than the opening Op30.
  • the other structure of the multilayer substrate 10b is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the multilayer substrate 10b can exhibit the effects (a) to (f). Moreover, according to the multilayer substrate 10b, the characteristic impedance generated in the signal conductor layer 20 is suppressed from varying from a desired characteristic impedance.
  • FIG. 8 is a top view of the insulator layer 16c.
  • the line width w1 of the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the vertical direction is such that the line width w1 of the portion where the signal conductor layer 20 overlaps with the first opening Op1 of the signal conductor layer 20 when viewed in the vertical direction is It differs from the multilayer substrate 10 in that the line width w2 is thicker than that of the multilayer substrate 10.
  • the other structure of the multilayer substrate 10c is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the multilayer substrate 10b can exhibit the effects (a) to (f).
  • the characteristic impedance generated in the signal conductor layer 20 is suppressed from varying from the desired characteristic impedance. More specifically, capacitance is unlikely to be formed between the signal conductor layer 20 and the second reference conductor layer 24 in the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the vertical direction. Therefore, the characteristic impedance generated in the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the vertical direction tends to be higher than the desired characteristic impedance.
  • the line width w1 of the portion of the signal conductor layer 20 that overlaps with the first opening Op1 when viewed in the vertical direction is the line width w1 of the portion of the signal conductor layer 20 that does not overlap with the first opening Op1 when viewed in the vertical direction. Thicker than w2.
  • the characteristic impedance generated in the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the vertical direction approaches the desired characteristic impedance.
  • FIG. 9 is a cross-sectional view of the multilayer substrate 10d.
  • the multilayer substrate 10d differs from the multilayer substrate 10 in that it further includes a conductor 50.
  • the conductor 50 is filled in the first opening Op1.
  • the conductivity of the conductor 50 is lower than the conductivity of the second reference conductor layer 24 .
  • the other structure of the multilayer substrate 10d is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10d can achieve the effects (a) to (f).
  • the conductor 50 is filled in the first opening Op1.
  • the conductivity of the conductor 50 is lower than that of the second reference conductor layer 24. Therefore, even if the unnecessary propagation mode flows in the right direction through the second reference conductor layer 24, it is attenuated by the conductor 50. Therefore, unnecessary propagation modes are suppressed from being radiated as noise between the interlayer connection conductor v2 and the interlayer connection conductor v3 and between the interlayer connection conductor v5 and the interlayer connection conductor v6.
  • the conductor 50 is filled in the first opening Op1. This suppresses noise from entering the multilayer substrate 10 through the first opening Op1. Further, noise is suppressed from being radiated to the outside of the multilayer substrate 10 from the first opening Op1.
  • FIG. 10 is a cross-sectional view of the multilayer substrate 10e.
  • the multilayer substrate 10e differs from the multilayer substrate 10 in that it further includes an insulator 60 and a conductor 62.
  • the insulator 60 is filled in the first opening Op1.
  • the material of the insulator 60 may be the same as or different from the material of the insulator layers 16a to 16c. Furthermore, the material of the insulator 60 may be the same as or different from the material of the protective layers 18a and 18b.
  • a conductor 62 covers the insulator 60.
  • the conductivity of the conductor 62 is lower than the conductivity of the second reference conductor layer 24 .
  • the other structure of the multilayer substrate 10e is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10d can achieve the effects (a) to (f), (i), and (j).
  • FIG. 11 is a top view of the insulator layer 16c.
  • the multilayer board 10f is different from the multilayer board 10 in that it includes a plurality of interlayer connection conductors v7 and a plurality of interlayer connection conductors v8.
  • the plurality of interlayer connection conductors v7 are lined up along the signal conductor layer 20 on the left (in the negative direction of the X axis) from the interlayer connection conductor v1 (first interlayer connection conductor).
  • the distance D7 in the left-right direction (X-axis direction) between the plurality of interlayer connection conductors v7 (seventh interlayer connection conductor) is the distance between interlayer connection conductor v2 (second interlayer connection conductor) and interlayer connection conductor v3 (third interlayer connection conductor). is shorter than the distance D2 in the left-right direction (X-axis direction).
  • interlayer connection conductor v7 (seventh interlayer connection conductor) located on the rightmost side (in the positive direction of the X axis) and interlayer connection conductor v1 (first interlayer connection conductor)
  • the distance D8 in the left-right direction (X-axis direction) with the connecting conductor) is the distance D8 in the left-right direction (X-axis direction) between the interlayer connecting conductor v2 (second interlayer connecting conductor) and the interlayer connecting conductor v3 (third interlayer connecting conductor). shorter than distance D2. Spacing D7 and distance D8 are equal to distance D1.
  • the plurality of interlayer connection conductors v8 are lined up along the signal conductor layer 20 on the left side (in the negative direction of the X axis) of the interlayer connection conductor v4 (fourth interlayer connection conductor).
  • the distance D17 in the left-right direction (X-axis direction) between the plurality of interlayer connection conductors v8 (eighth interlayer connection conductor) is the distance between interlayer connection conductor v5 (fifth interlayer connection conductor) and interlayer connection conductor v6 (sixth interlayer connection conductor). is shorter than the distance D12 in the left-right direction (X-axis direction).
  • the interlayer connecting conductor v8 (eighth interlayer connecting conductor) located on the rightmost side (in the positive direction of the X axis) among the plurality of interlayer connecting conductors v8 (eighth interlayer connecting conductor) and the interlayer connecting conductor v4 (fourth interlayer connecting conductor)
  • the distance D18 in the left-right direction (X-axis direction) with the connecting conductor) is the distance D18 in the left-right direction (X-axis direction) between the interlayer connecting conductor v5 (fifth interlayer connecting conductor) and the interlayer connecting conductor v6 (sixth interlayer connecting conductor). It is shorter than distance D12.
  • the interval D17 and the distance D18 are equal to the distance D11.
  • Interlayer connection conductor v11 (11th interlayer connection conductor) includes interlayer connection conductor v1 (first interlayer connection conductor), interlayer connection conductor v2 (second interlayer connection conductor), interlayer connection conductor v4 (fourth interlayer connection conductor), and interlayer connection conductor v4 (fourth interlayer connection conductor). It is located in a section surrounded by a connection conductor v5 (fifth interlayer connection conductor), a plurality of interlayer connection conductors v7 (seventh interlayer connection conductor), and a plurality of interlayer connection conductors v8 (eighth interlayer connection conductor).
  • the other structure of the multilayer substrate 10f is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the multilayer substrate 10f can achieve the effects (a) to (f).
  • FIG. 12 is a cross-sectional view of the multilayer substrate 10g.
  • the multilayer board 10g differs from the multilayer board 10 in that it further includes a signal conductor layer 21, a first reference conductor layer 22a, an insulator layer 16d, and interlayer connection conductors v15 and v16.
  • the insulator layer 16d is laminated on the insulator layer 16a. However, the insulator layer 16d is provided only on the left end portion of the multilayer substrate 10g.
  • the signal conductor layer 21 is located on the upper main surface of the insulator layer 16a.
  • the interlayer connection conductor v15 vertically penetrates the insulator layer 16a.
  • the interlayer connection conductor v15 electrically connects the left end of the signal conductor layer 20 and the right end of the signal conductor layer 21.
  • the interlayer connection conductor v11 electrically connects the left end portion of the signal conductor layer 21 and the signal terminal 26a.
  • the interlayer connection conductors v11 and v15 do not overlap with the first opening Op1 when viewed in the vertical direction.
  • the first reference conductor layer 22a is located on the upper main surface of the insulator layer 16a.
  • the interlayer connection conductor v16 electrically connects the first reference conductor layer 22a and the first reference conductor layer 22.
  • the other structure of the multilayer substrate 10g is the same as that of the multilayer substrate 10, so a description thereof will be omitted.
  • the multilayer substrate 10g can exhibit the effects (a) to (f).
  • FIG. 13 is a top view of the insulator layer 16c.
  • the multilayer substrate 10h differs from the multilayer substrate 10 in that the first opening Op1 is located between the first reference straight line X1 and the straight line X3 when viewed in the vertical direction. More precisely, the first opening Op1 is located to the left of the first reference straight line X1 and to the right of the straight line X3.
  • the other structure of the multilayer substrate 10h is the same as that of the multilayer substrate 10, so the description thereof will be omitted.
  • the multilayer substrate 10h can exhibit the effects (a) to (f).
  • the multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a to 10h, and can be modified within the scope of the gist thereof. Furthermore, the structures of the multilayer substrates 10, 10a to 10h may be combined arbitrarily.
  • the number of second openings is not limited to four.
  • the number of second openings may be 1 or more and 3 or less, or 5 or more.
  • the signal conductor layer 20 may be curved when viewed in the vertical direction.
  • the multilayer substrates 10, 10a to 10g include sections where the X-axis direction coincides with the left-right direction and sections where the X-axis direction does not match the left-right direction.
  • the first opening Op1 may be provided not in the second reference conductor layer 24 but in the first reference conductor layer 22. In this case, there is no conductor layer within the first opening Op1. Therefore, the first opening Op1 is different from, for example, an opening provided in the first reference conductor layer 22 for the signal terminal 26a.
  • the signal conductor layer 20 may be bent in the front direction or the rear direction when viewed in the vertical direction.
  • the opening Op1 may be provided in the first reference conductor layer 22.
  • the purpose of the multilayer substrates 10, 10a to 10h is to remove noise caused by the capacitance formed between the reference conductor overlapping the interlayer connection conductor v11 and the interlayer connection conductor v11. Therefore, in the multilayer substrate 10g, the first opening Op1 may be provided in the first reference conductor layer 22, since it is only necessary to provide a reference conductor that overlaps the interlayer connection conductor v11, or it may be provided in the second reference conductor layer 24. may be provided.
  • Multilayer substrate 12 Laminated bodies 16a to 16d: Insulator layers 18a, 18b: Protective layers 20, 21: Signal conductor layer 22: First reference conductor layer 24: Second reference conductor layer 26a, 26b: Signal terminals 50, 62: Conductor 60: Insulator A1: First section A2: Second section A3: Third section C1 to C5: Center CL: Center line L1: First straight line L2: Second straight line L3: Third straight line Op1: First opening Op2 to Op5: Second opening Op30: Opening Op6: Third opening Op7 to Op10: Fourth opening P1: First intersection P2: Second intersection p1: First point p2: Second point p3: th 3 points p4: 4th points v1 to v12, v15: interlayer connection conductor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2023/014706 2022-04-18 2023-04-11 多層基板 Ceased WO2023204099A1 (ja)

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US18/830,893 US20250008647A1 (en) 2022-04-18 2024-09-11 Multilayer substrate

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044716A (ja) * 1999-08-03 2001-02-16 Mitsubishi Electric Corp ストリップライン給電装置
WO2019131286A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2020189699A1 (ja) * 2019-03-20 2020-09-24 株式会社村田製作所 伝送路基板、および伝送路基板の実装構造

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KR101378027B1 (ko) * 2009-07-13 2014-03-25 가부시키가이샤 무라타 세이사쿠쇼 신호선로 및 회로기판
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001044716A (ja) * 1999-08-03 2001-02-16 Mitsubishi Electric Corp ストリップライン給電装置
WO2019131286A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
WO2020189699A1 (ja) * 2019-03-20 2020-09-24 株式会社村田製作所 伝送路基板、および伝送路基板の実装構造

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