JPWO2023204099A1 - - Google Patents
Info
- Publication number
- JPWO2023204099A1 JPWO2023204099A1 JP2024516213A JP2024516213A JPWO2023204099A1 JP WO2023204099 A1 JPWO2023204099 A1 JP WO2023204099A1 JP 2024516213 A JP2024516213 A JP 2024516213A JP 2024516213 A JP2024516213 A JP 2024516213A JP WO2023204099 A1 JPWO2023204099 A1 JP WO2023204099A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022067996 | 2022-04-18 | ||
| PCT/JP2023/014706 WO2023204099A1 (ja) | 2022-04-18 | 2023-04-11 | 多層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023204099A1 true JPWO2023204099A1 (https=) | 2023-10-26 |
| JPWO2023204099A5 JPWO2023204099A5 (https=) | 2024-11-01 |
Family
ID=88419904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024516213A Pending JPWO2023204099A1 (https=) | 2022-04-18 | 2023-04-11 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250008647A1 (https=) |
| JP (1) | JPWO2023204099A1 (https=) |
| CN (1) | CN223024647U (https=) |
| WO (1) | WO2023204099A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012074101A1 (ja) * | 2010-12-03 | 2012-06-07 | 株式会社村田製作所 | 高周波信号線路及び電子機器 |
| JP2012134551A (ja) * | 2009-07-13 | 2012-07-12 | Murata Mfg Co Ltd | 信号線路及び回路基板 |
| WO2020189699A1 (ja) * | 2019-03-20 | 2020-09-24 | 株式会社村田製作所 | 伝送路基板、および伝送路基板の実装構造 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3710652B2 (ja) * | 1999-08-03 | 2005-10-26 | 三菱電機株式会社 | ストリップライン給電装置 |
| WO2019131286A1 (ja) * | 2017-12-28 | 2019-07-04 | 株式会社村田製作所 | 多層基板および伝送線路装置 |
-
2023
- 2023-04-11 CN CN202390000255.0U patent/CN223024647U/zh active Active
- 2023-04-11 WO PCT/JP2023/014706 patent/WO2023204099A1/ja not_active Ceased
- 2023-04-11 JP JP2024516213A patent/JPWO2023204099A1/ja active Pending
-
2024
- 2024-09-11 US US18/830,893 patent/US20250008647A1/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012134551A (ja) * | 2009-07-13 | 2012-07-12 | Murata Mfg Co Ltd | 信号線路及び回路基板 |
| WO2012074101A1 (ja) * | 2010-12-03 | 2012-06-07 | 株式会社村田製作所 | 高周波信号線路及び電子機器 |
| WO2020189699A1 (ja) * | 2019-03-20 | 2020-09-24 | 株式会社村田製作所 | 伝送路基板、および伝送路基板の実装構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023204099A1 (ja) | 2023-10-26 |
| CN223024647U (zh) | 2025-06-24 |
| US20250008647A1 (en) | 2025-01-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240830 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240830 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250715 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20251202 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260302 |