CN223024647U - 多层基板 - Google Patents

多层基板 Download PDF

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Publication number
CN223024647U
CN223024647U CN202390000255.0U CN202390000255U CN223024647U CN 223024647 U CN223024647 U CN 223024647U CN 202390000255 U CN202390000255 U CN 202390000255U CN 223024647 U CN223024647 U CN 223024647U
Authority
CN
China
Prior art keywords
interlayer connection
connection conductor
axis
conductor
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202390000255.0U
Other languages
English (en)
Chinese (zh)
Inventor
西尾恒亮
水上隆达
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN223024647U publication Critical patent/CN223024647U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202390000255.0U 2022-04-18 2023-04-11 多层基板 Active CN223024647U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-067996 2022-04-18
JP2022067996 2022-04-18
PCT/JP2023/014706 WO2023204099A1 (ja) 2022-04-18 2023-04-11 多層基板

Publications (1)

Publication Number Publication Date
CN223024647U true CN223024647U (zh) 2025-06-24

Family

ID=88419904

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202390000255.0U Active CN223024647U (zh) 2022-04-18 2023-04-11 多层基板

Country Status (4)

Country Link
US (1) US20250008647A1 (https=)
JP (1) JPWO2023204099A1 (https=)
CN (1) CN223024647U (https=)
WO (1) WO2023204099A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
KR101378027B1 (ko) * 2009-07-13 2014-03-25 가부시키가이샤 무라타 세이사쿠쇼 신호선로 및 회로기판
KR101454720B1 (ko) * 2010-12-03 2014-10-27 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호선로 및 전자기기
WO2019131286A1 (ja) * 2017-12-28 2019-07-04 株式会社村田製作所 多層基板および伝送線路装置
JP7160180B2 (ja) * 2019-03-20 2022-10-25 株式会社村田製作所 伝送路基板、および伝送路基板の実装構造

Also Published As

Publication number Publication date
WO2023204099A1 (ja) 2023-10-26
JPWO2023204099A1 (https=) 2023-10-26
US20250008647A1 (en) 2025-01-02

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