WO2023200319A1 - Carte combinée utilisant un tissu conducteur et son procédé de fabrication - Google Patents

Carte combinée utilisant un tissu conducteur et son procédé de fabrication Download PDF

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Publication number
WO2023200319A1
WO2023200319A1 PCT/KR2023/005180 KR2023005180W WO2023200319A1 WO 2023200319 A1 WO2023200319 A1 WO 2023200319A1 KR 2023005180 W KR2023005180 W KR 2023005180W WO 2023200319 A1 WO2023200319 A1 WO 2023200319A1
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WO
WIPO (PCT)
Prior art keywords
conductive
antenna coil
conductive fabric
sheet
cob
Prior art date
Application number
PCT/KR2023/005180
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English (en)
Korean (ko)
Inventor
이재희
이호경
Original Assignee
동시테크 주식회사
이재희
이호경
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동시테크 주식회사, 이재희, 이호경 filed Critical 동시테크 주식회사
Publication of WO2023200319A1 publication Critical patent/WO2023200319A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2401/00—Physical properties
    • D10B2401/16—Physical properties antistatic; conductive

Definitions

  • the present invention relates to a combined contact and non-contact card, also known as a Combi card. More specifically, the connection structure between the lower terminal of the COB of the Combi card and the antenna coil contact point prevents contact failure or short circuit even from external shock or distortion. It relates to a combination card that can prevent and a method of manufacturing the same.
  • a contact card is an IC card in which a COB (Chip on Board) with an IC chip mounted on it is exposed to the card body, and the external terminal of the COB directly contacts the card terminal to transmit and receive data.
  • COB Chip on Board
  • a representative example is a credit card.
  • Non-contact cards are RF cards (radio frequency) in which an IC chip transmits and receives data wirelessly using an antenna coil built into the card body, and transportation cards and access cards are representative examples.
  • the configuration of a general combination card 100' is shown in Figures 1 and 2.
  • the combination card (100') consists of a card body (10') that forms the overall card, a COB (20') that processes information, and an antenna coil (30') for RF wireless communication. do.
  • the COB (20') has an IC chip (22') for information processing attached to the lower center of a rectangular pad (21'), an external terminal for contact type at the top of the pad (21'), and an external terminal for contact at the bottom.
  • a pair of COB lower terminals (23') connected to the antenna coil (30') are provided.
  • the card body 10' is manufactured by laminating and heat-pressing several synthetic resin sheets with each function.
  • the sheet material is mainly PVC, but various resins such as PC, PETG, PET, and ABS can also be used.
  • An inlay layer (11') is formed in the middle of the cross section of the card body (10').
  • the antenna coil 30' is wired on or inside the inlay layer 11'. Since the contact point 31' of the antenna coil 30' is connected to the COB lower terminal 23', it is wired at a corresponding position of the COB receiving groove 16', which will be described later.
  • the inlay layer 11' may be composed of one sheet, but may also be composed of two or more sheets stacked as shown in FIG. 2.
  • a front printing sheet 12' on which the shape of the front of the card is printed is laminated on one side of the inlay layer 11', and a back printing sheet 13' on which the shape of the back of the card is printed is laminated on the opposite side.
  • Transparent overlay sheets 14' and 15' are laminated on the surfaces of the rear printing sheet 13' and the front printing sheet 12' to protect the printing sheets 12' and 13'.
  • a COB receiving groove 16 is formed at a predetermined position of the card body 10' to accommodate the COB 20'.
  • the COB receiving groove 16' is formed by milling the surface of the card body 10' to the shape of the COB 20' using a milling machine, and at this time, the contact point 31' of the antenna coil is exposed. Another method other than milling is to form the COB receiving groove (16') by laminating sheets from which the portion corresponding to the COB receiving groove (16') has been previously removed when manufacturing the card body (10'). However, most COB receiving grooves (16') are currently used.
  • the receiving groove 16' is formed by a milling method.
  • the most important and difficult process is the process of effectively connecting the COB lower terminal 23' and the contact point 31' of the antenna coil.
  • the conductive adhesive (24') was suitable for general PCB circuits, but when applied to the combi card, problems occurred in that the curing conditions, drying conditions, conductivity, and adhesive strength did not meet the required level, and when the card was bent or twisted, the conductive adhesive ( 24'), a crack occurred in the adhesive area, causing a contact defect.
  • Republic of Korea Patent Registration No. 10-0852127 discloses the use of an elastic conductive sponge as an intermediate medium that can conduct electricity between the COB terminal and the antenna coil terminal.
  • the conductive sponge is too thick to be suitable as a card contact material, and even if it is made thin enough to be applicable to cards, it is difficult to meet the required elastic properties. There are currently no examples of applying the above technology.
  • the purpose of the present invention is to provide a combi card and a manufacturing method thereof that can prevent contact failure or short circuit even when external shock or distortion occurs through a connection structure between the lower terminal of the COB of the combi card and the antenna coil contact point.
  • the present invention relates to a combination card (100) including a conductive fabric interposed between the COB lower terminal (23) and the antenna coil contact point (31) to conduct electricity to each other, wherein one surface of the conductive fabric (40) is formed by milling.
  • a combination card with excellent contact durability is provided, characterized in that conductive fluff (41) is formed and the conductive fluff (41) is directly contacted to the COB lower terminal (23) without any other conductive media.
  • the conductive fabric 40 may be a fabric, knitted fabric, or non-woven fabric woven by bundling several strands of conductive fibers 42.
  • the diameter of the conductive fiber may be 3 to 20 ⁇ m, and the thickness of the conductive fabric 40 may be 30 to 400 ⁇ m.
  • the present invention includes the steps of (a) wiring an antenna coil on one surface of a first sheet and removing an insulating layer coated with the antenna coil to form an antenna coil contact point; (b) bonding a conductive fabric to the antenna coil contact point to form an inlay layer through which the antenna coil and the conductive fabric conduct electricity to each other; (c) forming a card body by laminating a front printed sheet and a rear printed sheet on both sides of the inlay layer, and laminating an overlay sheet on each surface of the printed sheet; (d) milling the card body to form a COB receiving groove, and milling to form conductive fluff on the surface of the conductive fabric exposed to the COB receiving groove; And (e) adhering the COB to the COB receiving groove using a hot melt film or adhesive, and directly contacting the conductive fabric on which the conductive fluff is formed to the lower terminal of the COB without any other conductive media.
  • Providing a method for manufacturing a combination card comprising: do.
  • a conductive adhesive layer may be formed on the conductive fabric and bonded to the antenna coil contact point 31.
  • the conductive fabric in step (b), may be bonded to the antenna coil contact point 31 by ultrasonic fusion.
  • step (b) stacking a second sheet with a portion corresponding to the conductive fabric removed on the first sheet to form an inlay layer into which the antenna coil and the conductive fabric are inserted. Additional steps may be included.
  • step (b') a step (b") of stacking a third sheet on the second sheet to form an inlay layer into which an antenna coil and a conductive fabric are inserted may be further included.
  • step (b) a step (b''') of forming an inlay layer into which an antenna coil and a conductive fabric are inserted by stacking a third sheet on the first sheet may be further included.
  • the COB lower terminal (23) and the antenna coil contact point (31) are directly contacted with a conductive fabric formed with conductive fluff (41) that is bulky and has appropriate elasticity, thereby protecting the COB lower terminal ( It is possible to effectively maintain the contact point between 23) and the conductive fabric 40, the manufacturing process is simple compared to the prior art that requires the use of a conductive adhesive, and there is no need for equipment to spray the conductive adhesive.
  • Figure 1 is a perspective view showing the configuration of a general combination card.
  • Figure 2 is a perspective view showing the configuration of a general combination card.
  • Figure 3 is a cross-sectional view showing the manufacturing process of a combination card according to an embodiment of the present invention.
  • Figure 4 shows a weaving form of a conductive fabric according to an embodiment of the present invention.
  • Figure 5 shows a combination card manufactured according to an embodiment of the present invention.
  • (a) shows a card in which fluff is formed on a conductive fabric through milling
  • (b) shows a card in which COB is combined with the card body.
  • Figure 6 is a photograph showing that fluff is formed on the surface of the conductive fabric in a combination card manufactured according to an embodiment of the present invention.
  • Figure 3 shows the manufacturing process of the combination card 100 according to an embodiment of the present invention
  • Figure 5 is an actual manufactured combination card manufactured according to an embodiment of the present invention
  • (a) is conductive through milling. It is a card with fluff formed on the fabric
  • (b) represents a card with COB bonded to the card body.
  • Figure 6 is a photograph showing that fluff is formed on the surface of the conductive fabric in a combination card manufactured according to an embodiment of the present invention.
  • the present invention is a combination in which the COB lower terminal 23 provided on the rear of the pad 21 of the COB 20 and the antenna coil contact 31 located on the inlay layer 11 are energized with each other using the conductive fabric 40 as a medium.
  • the conductive fabric 40 As a card, some of the conductive fibers 42 on the upper part of the conductive fabric 40 are broken through a milling process to form conductive fluff 41, and a separate conductive adhesive is used due to the bulkiness and elasticity of the fluff.
  • a combination card is provided in which the COB lower terminal (23) and the conductive fabric (40) are in direct contact.
  • This fluff structure of the present invention is conductive and has appropriate bulkiness and elasticity, so it can effectively make contact without a separate conductive adhesive, and can effectively maintain the contact point between the COB lower terminal 23 and the conductive fabric 40 even when exposed to external shock.
  • the manufacturing process is simple and has the advantage of not requiring conductive adhesive spraying equipment.
  • the conductive fabric 40 may be a fabric made by bundling several strands of conductive fibers 42 and crossing them as warps and wefts, as shown in FIG. 4, or it may be a knitted fabric or a non-woven fabric.
  • the conductive fiber 42 has a structure in which synthetic fibers such as polyester, acrylic, and nylon or natural fibers such as silk are plated or coated with a conductive metal such as copper, nickel, or silver.
  • plating may be electroless plating of metal after surface treatment of yarn (fiber) with a basic solution.
  • the diameter of the conductive fiber may be 3 to 20 ⁇ m, but is not limited thereto.
  • the thickness of the conductive fabric 40 can be adjusted depending on the diameter and number of strands of the conductive fibers 42.
  • the thickness of the conductive fabric may be 30 to 400 ⁇ m, but is not limited thereto. If the fabric thickness is less than 30 ⁇ m, it may be difficult to form sufficient fluff by milling, and if it is more than 400 ⁇ m, there may be a problem of increasing the thickness of the produced combi card. Considering this, the fabric thickness should be 100 ⁇ 300. ⁇ m is preferable.
  • the conductive fabric is bonded to the terminal of the antenna coil.
  • one side of the conductive fabric may be in the form of a conductive adhesive or an adhesive tape formed with a conductive adhesive, and if necessary, a release paper may be provided. These conductive fabrics can be glued directly to the antenna coil contacts, saving production time.
  • the conductive fabric may be bonded to the antenna coil terminal by ultrasonic welding.
  • the present invention provides a method for manufacturing a combination card using a conductive fabric as a conductive medium.
  • the manufacturing process itself of the combination card of the present invention is not significantly different from the conventional process.
  • the card body is manufactured in the order of inlay layer production -> printing sheet lamination -> overlay sheet lamination, then a COB receiving groove (16) is formed in the card body using a milling machine, and then the COB (20) is adhered.
  • a combination card (100) is produced.
  • the method of manufacturing a combination card is (a) wiring the antenna coil 30 on one side of the first sheet 11a, removing the insulating layer coated on the antenna coil, and forming the antenna coil contact point 31. ) forming a; (b) bonding conductive fabric 40 to the antenna coil contact point 31 to form an inlay layer 11 through which the antenna coil 30 and the conductive fabric 40 conduct electricity to each other; (c) Laminating a front printing sheet 12 and a back printing sheet 13 on both sides of the inlay layer, respectively, and overlay sheets 14 and 15 on each surface of the printing sheets 12 and 13.
  • Forming a card body 10 by stacking; (d) Milling the card body 10 to form a COB receiving groove 16, and milling to form conductive fluff 41 on the surface of the conductive fabric 40 exposed on the COB receiving groove 16. ; and (e) attaching the COB to the COB receiving groove using a hot melt film or adhesive, and directly contacting the conductive fabric 40 on which the conductive fluff 41 is formed to the COB lower terminal 23 without any other conductive medium. may include.
  • a conductive adhesive layer may be formed on one side of the conductive fabric 40 and bonded to the antenna coil contact point 31.
  • the conductive adhesive layer may be mainly manufactured by mixing epoxy resin, urethane resin, silicone resin, polyimide resin, etc. with conductive particles such as silver, copper, and carbon black.
  • step (b) the conductive fabric 40 may be bonded to the antenna coil contact point 31 by ultrasonic fusion.
  • a second sheet (11b) from which a portion corresponding to the conductive fabric is removed is laminated on the first sheet (11a) to form an antenna coil (30) and a conductive fabric (40).
  • a step (b') of forming the inserted inlay layer 11 may be further included.
  • Step b' the third sheet 11c is laminated on the second sheet 11b to form an inlay layer into which the antenna coil 30 and the conductive fabric 40 are inserted ( Step b") may be further included.
  • Step (b) the third sheet 11c is immediately laminated on the first sheet 11a to form an inlay layer into which the antenna coil 30 and the conductive fabric 40 are inserted ( Step b''') may be further included.
  • the inlay layer can be simply manufactured using one sheet, and in some cases, it can be manufactured in two or three or more sheets.
  • Figure 3 shows the inlay layer produced by stacking three sheets (the first sheet 11a, the second sheet 11b, and the third sheet 11c).
  • the manufacturing process of the inlay layer consisting of one sheet is as follows.
  • the antenna coil is wired and fixed on the first sheet 11a.
  • a method of fixing the antenna coil may include, for example, fusion using ultrasonic waves at the same time as the coil wiring, but is not limited thereto. Since the surface of the antenna coil is covered with an insulating layer like an enamel wire, the insulating layer of the coil must be removed in order to make electrical contact with the conductive fabric of the present invention.
  • the insulating layer forms the antenna coil contact point 31 by exposing the coil core by grinding or scratching the coil fixed to the first sheet 11a. A conductive fabric cut to a certain size is attached to the antenna coil contact point 31.
  • one side of the conductive fabric may be in the form of a conductive adhesive or an adhesive tape formed with a conductive adhesive, and if necessary, a release paper may be provided.
  • This conductive fabric can be bonded directly to the antenna coil contact point 31, saving production time.
  • the conductive fabric may be bonded to the antenna coil terminal by ultrasonic welding.
  • the printing sheet 12, 13 stacking process is performed immediately without additional processing, or another sheet is stacked and the antenna coil and the conductive fabric are completely inserted into the inlay layer. After making it, a printing sheet lamination process may be performed.
  • the conductive fabric is a relatively thick material as shown in FIG. 3, it can be reinforced by laminating a sheet (second sheet) about the thickness of the conductive fabric to improve stackability with other sheets (e.g., printing sheets) in the future. At this time, the portion corresponding to the conductive fabric in the reinforced sheet (second sheet) is removed in advance by punching, etc., and matched with the first sheet.
  • the conductive fluff 41 is formed on the surface of the conductive fabric 40 by milling the card body 10, and the part other than the COB lower terminal 23 and the conductive fabric 40 of the inlay layer are not formed.
  • the COB is firmly adhered to the receiving groove (16) by attaching the portions using a hot melt film or adhesive.
  • the present invention relates to a combined contact and non-contact card, also known as a Combi card. More specifically, the connection structure between the lower terminal of the COB of the Combi card and the antenna coil contact point prevents contact failure or short circuit even from external shock or distortion. It relates to a combination card that can prevent and a method of manufacturing the same.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne une carte combinée comprenant un tissu conducteur interposé entre une borne inférieure d'un COB et un point de contact de bobine d'antenne pour permettre à la borne inférieure et au point de contact de bobine d'antenne de devenir conducteurs l'un par rapport à l'autre, un duvet conducteur étant formé sur une surface du tissu conducteur par fraisage, et le duvet conducteur étant en contact direct avec la borne inférieure du COB sans autre milieu conducteur, de telle sorte que la carte combinée a une excellente durabilité de point de contact.
PCT/KR2023/005180 2022-04-15 2023-04-17 Carte combinée utilisant un tissu conducteur et son procédé de fabrication WO2023200319A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220047214A KR20230148057A (ko) 2022-04-15 2022-04-15 전도성 원단을 이용한 콤비카드 및 이의 제조방법
KR10-2022-0047214 2022-04-15

Publications (1)

Publication Number Publication Date
WO2023200319A1 true WO2023200319A1 (fr) 2023-10-19

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PCT/KR2023/005180 WO2023200319A1 (fr) 2022-04-15 2023-04-17 Carte combinée utilisant un tissu conducteur et son procédé de fabrication

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KR (1) KR20230148057A (fr)
WO (1) WO2023200319A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100852127B1 (ko) * 2007-03-30 2008-08-13 주식회사 하이스마텍 도전성 스폰지를 이용한 콤비카드 및 그 제조방법
KR20100073686A (ko) * 2008-12-23 2010-07-01 대구대학교 산학협력단 도전사 섬유태그 안테나의 ｒｆｉｄ 칩 부착방법
KR101249137B1 (ko) * 2011-11-30 2013-04-01 김선희 콤비카드 제조방법
KR101368721B1 (ko) * 2013-05-29 2014-03-03 유비벨록스(주) 콤비형 아이씨 카드 제조 시스템의 솔더링 장치 및 방법
KR20190011094A (ko) * 2017-07-24 2019-02-01 대구대학교 산학협력단 기모 처리된 초미립 도전 섬유소 알에프아이디 태그 안테나

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100679285B1 (ko) 2004-06-16 2007-02-05 한국조폐공사 조립식 콤비카드 및 이의 제조방법
KR100602621B1 (ko) 2004-06-16 2006-07-19 한국조폐공사 조립식 콤비카드 및 이의 제조방법
KR100622140B1 (ko) 2005-04-26 2006-09-19 한국조폐공사 섬유단자를 갖는 콤비카드 및 이의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100852127B1 (ko) * 2007-03-30 2008-08-13 주식회사 하이스마텍 도전성 스폰지를 이용한 콤비카드 및 그 제조방법
KR20100073686A (ko) * 2008-12-23 2010-07-01 대구대학교 산학협력단 도전사 섬유태그 안테나의 ｒｆｉｄ 칩 부착방법
KR101249137B1 (ko) * 2011-11-30 2013-04-01 김선희 콤비카드 제조방법
KR101368721B1 (ko) * 2013-05-29 2014-03-03 유비벨록스(주) 콤비형 아이씨 카드 제조 시스템의 솔더링 장치 및 방법
KR20190011094A (ko) * 2017-07-24 2019-02-01 대구대학교 산학협력단 기모 처리된 초미립 도전 섬유소 알에프아이디 태그 안테나

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