WO2023200319A1

WO2023200319A1 - Combi card using conductive fabric and method for manufacturing same

Info

Publication number: WO2023200319A1
Application number: PCT/KR2023/005180
Authority: WO
Inventors: 이재희; 이호경
Original assignee: 동시테크 주식회사; 이재희; 이호경
Priority date: 2022-04-15
Filing date: 2023-04-17
Publication date: 2023-10-19
Also published as: KR20230148057A

Abstract

The present invention provides a combi card including a conductive fabric interposed between a lower terminal of a COB and an antenna coil contact point to enable the lower terminal and the antenna coil contact point to become conductive to each other, wherein conductive fluff is formed on one surface of the conductive fabric by milling, and the conductive fluff is in direct contact with the lower terminal of the COB without another conductive medium, so that the combi card has excellent contact point durability.

Description

Combi card using conductive fabric and its manufacturing method

The present invention relates to a combined contact and non-contact card, also known as a Combi card. More specifically, the connection structure between the lower terminal of the COB of the Combi card and the antenna coil contact point prevents contact failure or short circuit even from external shock or distortion. It relates to a combination card that can prevent and a method of manufacturing the same.

Smart cards are divided into contact cards and contactless cards depending on the method of transmitting and receiving data. A contact card is an IC card in which a COB (Chip on Board) with an IC chip mounted on it is exposed to the card body, and the external terminal of the COB directly contacts the card terminal to transmit and receive data. A representative example is a credit card. Non-contact cards are RF cards (radio frequency) in which an IC chip transmits and receives data wirelessly using an antenna coil built into the card body, and transportation cards and access cards are representative examples.

Recently, a contact/non-contact combination card, so-called 'Combi card', which integrates contact and non-contact functions into one card, has been widely used.

The configuration of a general combination card 100' is shown in Figures 1 and 2. Referring to Figures 1 and 2, the combination card (100') consists of a card body (10') that forms the overall card, a COB (20') that processes information, and an antenna coil (30') for RF wireless communication. do. The COB (20') has an IC chip (22') for information processing attached to the lower center of a rectangular pad (21'), an external terminal for contact type at the top of the pad (21'), and an external terminal for contact at the bottom. A pair of COB lower terminals (23') connected to the antenna coil (30') are provided.

The card body 10' is manufactured by laminating and heat-pressing several synthetic resin sheets with each function. The sheet material is mainly PVC, but various resins such as PC, PETG, PET, and ABS can also be used.

An inlay layer (11') is formed in the middle of the cross section of the card body (10'). The antenna coil 30' is wired on or inside the inlay layer 11'. Since the contact point 31' of the antenna coil 30' is connected to the COB lower terminal 23', it is wired at a corresponding position of the COB receiving groove 16', which will be described later. The inlay layer 11' may be composed of one sheet, but may also be composed of two or more sheets stacked as shown in FIG. 2.

A front printing sheet 12' on which the shape of the front of the card is printed is laminated on one side of the inlay layer 11', and a back printing sheet 13' on which the shape of the back of the card is printed is laminated on the opposite side. Transparent overlay sheets 14' and 15' are laminated on the surfaces of the rear printing sheet 13' and the front printing sheet 12' to protect the printing sheets 12' and 13'.

A COB receiving groove 16 is formed at a predetermined position of the card body 10' to accommodate the COB 20'. The COB receiving groove 16' is formed by milling the surface of the card body 10' to the shape of the COB 20' using a milling machine, and at this time, the contact point 31' of the antenna coil is exposed. Another method other than milling is to form the COB receiving groove (16') by laminating sheets from which the portion corresponding to the COB receiving groove (16') has been previously removed when manufacturing the card body (10'). However, most COB receiving grooves (16') are currently used. The receiving groove 16' is formed by a milling method.

Among all the processes related to the above-described combination card, the most important and difficult process is the process of effectively connecting the COB lower terminal 23' and the contact point 31' of the antenna coil.

Initially, a method of bonding using a conductive adhesive was used to join the COB lower terminal (23') and the contact point (31') of the antenna coil. However, the conductive adhesive (24') was suitable for general PCB circuits, but when applied to the combi card, problems occurred in that the curing conditions, drying conditions, conductivity, and adhesive strength did not meet the required level, and when the card was bent or twisted, the conductive adhesive ( 24'), a crack occurred in the adhesive area, causing a contact defect.

Accordingly, most people are currently joining the COB lower terminal (23') and the contact point (31') of the antenna coil by soldering by hand. However, since this method has to be done manually, productivity is very low and production costs also increase. There is a problem.

Republic of Korea Patent Publication Nos. 10-2005-0119538, 10-2005-0119539 and Patent Registration No. 10-0622140 disclose conductive fibers to solve contact defects between the COB lower terminal (23') and the antenna coil contact (31'). It is disclosed that it is used as a contact medium. However, these patents also assume the use of anisotropic conductor film (ACF) or conductive adhesive to bond the COB lower terminal to the conductive fiber. Conductive fabric has metal plated or coated on the yarn, so it lacks elasticity compared to regular fabric, so there is a possibility that cracks may still occur at the bonded area due to the use of conductive adhesive, resulting in contact defects. To date, there have been no examples of applying the above technology.

Republic of Korea Patent Registration No. 10-0852127 discloses the use of an elastic conductive sponge as an intermediate medium that can conduct electricity between the COB terminal and the antenna coil terminal. However, the conductive sponge is too thick to be suitable as a card contact material, and even if it is made thin enough to be applicable to cards, it is difficult to meet the required elastic properties. There are currently no examples of applying the above technology.

(Prior document 001) Republic of Korea Patent Publication No. 10-2005-0119538

(Prior document 002) Republic of Korea Patent Registration No. 10-2005-0119539

(Prior document 003) Republic of Korea Patent Registration No. 10-0622140

(Prior document 004) Republic of Korea Patent Registration No. 10-0852127

The purpose of the present invention is to provide a combi card and a manufacturing method thereof that can prevent contact failure or short circuit even when external shock or distortion occurs through a connection structure between the lower terminal of the COB of the combi card and the antenna coil contact point.

The present invention relates to a combination card (100) including a conductive fabric interposed between the COB lower terminal (23) and the antenna coil contact point (31) to conduct electricity to each other, wherein one surface of the conductive fabric (40) is formed by milling. A combination card with excellent contact durability is provided, characterized in that conductive fluff (41) is formed and the conductive fluff (41) is directly contacted to the COB lower terminal (23) without any other conductive media.

In one aspect, the conductive fabric 40 may be a fabric, knitted fabric, or non-woven fabric woven by bundling several strands of conductive fibers 42.

In one aspect, the diameter of the conductive fiber may be 3 to 20 μm, and the thickness of the conductive fabric 40 may be 30 to 400 μm.

On the other hand, the present invention includes the steps of (a) wiring an antenna coil on one surface of a first sheet and removing an insulating layer coated with the antenna coil to form an antenna coil contact point; (b) bonding a conductive fabric to the antenna coil contact point to form an inlay layer through which the antenna coil and the conductive fabric conduct electricity to each other; (c) forming a card body by laminating a front printed sheet and a rear printed sheet on both sides of the inlay layer, and laminating an overlay sheet on each surface of the printed sheet; (d) milling the card body to form a COB receiving groove, and milling to form conductive fluff on the surface of the conductive fabric exposed to the COB receiving groove; And (e) adhering the COB to the COB receiving groove using a hot melt film or adhesive, and directly contacting the conductive fabric on which the conductive fluff is formed to the lower terminal of the COB without any other conductive media. Providing a method for manufacturing a combination card, comprising: do.

In one aspect, in step (b), a conductive adhesive layer may be formed on the conductive fabric and bonded to the antenna coil contact point 31.

In one aspect, in step (b), the conductive fabric may be bonded to the antenna coil contact point 31 by ultrasonic fusion.

In one aspect, after step (b), (b') stacking a second sheet with a portion corresponding to the conductive fabric removed on the first sheet to form an inlay layer into which the antenna coil and the conductive fabric are inserted. Additional steps may be included.

In one aspect, after step (b'), a step (b") of stacking a third sheet on the second sheet to form an inlay layer into which an antenna coil and a conductive fabric are inserted may be further included.

In one aspect, after step (b), a step (b''') of forming an inlay layer into which an antenna coil and a conductive fabric are inserted by stacking a third sheet on the first sheet may be further included.

In the combination card according to the present invention, the COB lower terminal (23) and the antenna coil contact point (31) are directly contacted with a conductive fabric formed with conductive fluff (41) that is bulky and has appropriate elasticity, thereby protecting the COB lower terminal ( It is possible to effectively maintain the contact point between 23) and the conductive fabric 40, the manufacturing process is simple compared to the prior art that requires the use of a conductive adhesive, and there is no need for equipment to spray the conductive adhesive.

Figure 1 is a perspective view showing the configuration of a general combination card.

Figure 2 is a perspective view showing the configuration of a general combination card.

Figure 3 is a cross-sectional view showing the manufacturing process of a combination card according to an embodiment of the present invention.

Figure 4 shows a weaving form of a conductive fabric according to an embodiment of the present invention.

Figure 5 shows a combination card manufactured according to an embodiment of the present invention. (a) shows a card in which fluff is formed on a conductive fabric through milling, and (b) shows a card in which COB is combined with the card body.

Figure 6 is a photograph showing that fluff is formed on the surface of the conductive fabric in a combination card manufactured according to an embodiment of the present invention.

The present invention will be described in detail below through drawings and examples. The following examples are only examples of the present invention, and the technical idea of the present invention is not limited to the following examples.

Figure 3 shows the manufacturing process of the combination card 100 according to an embodiment of the present invention, and Figure 5 is an actual manufactured combination card manufactured according to an embodiment of the present invention, (a) is conductive through milling. It is a card with fluff formed on the fabric, and (b) represents a card with COB bonded to the card body. Figure 6 is a photograph showing that fluff is formed on the surface of the conductive fabric in a combination card manufactured according to an embodiment of the present invention.

The present invention is a combination in which the COB lower terminal 23 provided on the rear of the pad 21 of the COB 20 and the antenna coil contact 31 located on the inlay layer 11 are energized with each other using the conductive fabric 40 as a medium. As a card, some of the conductive fibers 42 on the upper part of the conductive fabric 40 are broken through a milling process to form conductive fluff 41, and a separate conductive adhesive is used due to the bulkiness and elasticity of the fluff. Instead, a combination card is provided in which the COB lower terminal (23) and the conductive fabric (40) are in direct contact.

This fluff structure of the present invention is conductive and has appropriate bulkiness and elasticity, so it can effectively make contact without a separate conductive adhesive, and can effectively maintain the contact point between the COB lower terminal 23 and the conductive fabric 40 even when exposed to external shock. Compared to the prior art, the manufacturing process is simple and has the advantage of not requiring conductive adhesive spraying equipment.

In one aspect, the conductive fabric 40 may be a fabric made by bundling several strands of conductive fibers 42 and crossing them as warps and wefts, as shown in FIG. 4, or it may be a knitted fabric or a non-woven fabric.

In one aspect, the conductive fiber 42 has a structure in which synthetic fibers such as polyester, acrylic, and nylon or natural fibers such as silk are plated or coated with a conductive metal such as copper, nickel, or silver. For example, plating may be electroless plating of metal after surface treatment of yarn (fiber) with a basic solution.

The diameter of the conductive fiber may be 3 to 20㎛, but is not limited thereto.

The thickness of the conductive fabric 40 can be adjusted depending on the diameter and number of strands of the conductive fibers 42. The thickness of the conductive fabric may be 30 to 400㎛, but is not limited thereto. If the fabric thickness is less than 30㎛, it may be difficult to form sufficient fluff by milling, and if it is more than 400㎛, there may be a problem of increasing the thickness of the produced combi card. Considering this, the fabric thickness should be 100~300. ㎛ is preferable.

The conductive fabric is bonded to the terminal of the antenna coil. In one aspect, one side of the conductive fabric may be in the form of a conductive adhesive or an adhesive tape formed with a conductive adhesive, and if necessary, a release paper may be provided. These conductive fabrics can be glued directly to the antenna coil contacts, saving production time. In another aspect, the conductive fabric may be bonded to the antenna coil terminal by ultrasonic welding.

Meanwhile, the present invention provides a method for manufacturing a combination card using a conductive fabric as a conductive medium.

The manufacturing process itself of the combination card of the present invention is not significantly different from the conventional process. First, the card body is manufactured in the order of inlay layer production -> printing sheet lamination -> overlay sheet lamination, then a COB receiving groove (16) is formed in the card body using a milling machine, and then the COB (20) is adhered. A combination card (100) is produced.

The method of manufacturing a combination card according to an embodiment of the present invention is (a) wiring the antenna coil 30 on one side of the first sheet 11a, removing the insulating layer coated on the antenna coil, and forming the antenna coil contact point 31. ) forming a; (b) bonding conductive fabric 40 to the antenna coil contact point 31 to form an inlay layer 11 through which the antenna coil 30 and the conductive fabric 40 conduct electricity to each other; (c) Laminating a front printing sheet 12 and a back printing sheet 13 on both sides of the inlay layer, respectively, and

overlay sheets

14 and 15 on each surface of the

printing sheets

12 and 13. Forming a card body 10 by stacking; (d) Milling the card body 10 to form a COB receiving groove 16, and milling to form conductive fluff 41 on the surface of the conductive fabric 40 exposed on the COB receiving groove 16. ; and (e) attaching the COB to the COB receiving groove using a hot melt film or adhesive, and directly contacting the conductive fabric 40 on which the conductive fluff 41 is formed to the COB lower terminal 23 without any other conductive medium. may include.

In one aspect, in step (b), a conductive adhesive layer may be formed on one side of the conductive fabric 40 and bonded to the antenna coil contact point 31. The conductive adhesive layer may be mainly manufactured by mixing epoxy resin, urethane resin, silicone resin, polyimide resin, etc. with conductive particles such as silver, copper, and carbon black.

In one aspect, in step (b), the conductive fabric 40 may be bonded to the antenna coil contact point 31 by ultrasonic fusion.

In one embodiment, after step (b), a second sheet (11b) from which a portion corresponding to the conductive fabric is removed is laminated on the first sheet (11a) to form an antenna coil (30) and a conductive fabric (40). A step (b') of forming the inserted inlay layer 11 may be further included.

In one aspect, after step (b'), the third sheet 11c is laminated on the second sheet 11b to form an inlay layer into which the antenna coil 30 and the conductive fabric 40 are inserted ( Step b") may be further included.

In one aspect, after step (b), the third sheet 11c is immediately laminated on the first sheet 11a to form an inlay layer into which the antenna coil 30 and the conductive fabric 40 are inserted ( Step b''') may be further included.

In the present invention, the inlay layer can be simply manufactured using one sheet, and in some cases, it can be manufactured in two or three or more sheets. Figure 3 shows the inlay layer produced by stacking three sheets (the first sheet 11a, the second sheet 11b, and the third sheet 11c).

The manufacturing process of the inlay layer consisting of one sheet is as follows. The antenna coil is wired and fixed on the first sheet 11a. A method of fixing the antenna coil may include, for example, fusion using ultrasonic waves at the same time as the coil wiring, but is not limited thereto. Since the surface of the antenna coil is covered with an insulating layer like an enamel wire, the insulating layer of the coil must be removed in order to make electrical contact with the conductive fabric of the present invention. The insulating layer forms the antenna coil contact point 31 by exposing the coil core by grinding or scratching the coil fixed to the first sheet 11a. A conductive fabric cut to a certain size is attached to the antenna coil contact point 31. In one aspect, one side of the conductive fabric may be in the form of a conductive adhesive or an adhesive tape formed with a conductive adhesive, and if necessary, a release paper may be provided. This conductive fabric can be bonded directly to the antenna coil contact point 31, saving production time. In another aspect, the conductive fabric may be bonded to the antenna coil terminal by ultrasonic welding.

If the conductive fabric in the inlay layer produced as above is thin, the

printing sheet

12, 13 stacking process is performed immediately without additional processing, or another sheet is stacked and the antenna coil and the conductive fabric are completely inserted into the inlay layer. After making it, a printing sheet lamination process may be performed.

Meanwhile, if the conductive fabric is a relatively thick material as shown in FIG. 3, it can be reinforced by laminating a sheet (second sheet) about the thickness of the conductive fabric to improve stackability with other sheets (e.g., printing sheets) in the future. At this time, the portion corresponding to the conductive fabric in the reinforced sheet (second sheet) is removed in advance by punching, etc., and matched with the first sheet.

As described above, the conductive fluff 41 is formed on the surface of the conductive fabric 40 by milling the card body 10, and the part other than the COB lower terminal 23 and the conductive fabric 40 of the inlay layer are not formed. The COB is firmly adhered to the receiving groove (16) by attaching the portions using a hot melt film or adhesive.

Claims

In the combination card including a conductive fabric interposed between the COB lower terminal and the antenna coil contact point to conduct electricity to each other,

A combination card with excellent contact durability, characterized in that conductive fluff is formed on one side of the conductive fabric by milling, and the conductive fluff is directly contacted to the COB lower terminal without any other conductive media.
According to paragraph 1,

A combination card, characterized in that the conductive fabric is a fabric, knitted fabric, or non-woven fabric woven by bundling several strands of conductive fibers.
According to paragraph 2,

A combination card, characterized in that the diameter of the conductive fiber is 3 to 20 ㎛, and the thickness of the conductive fabric is 30 to 400 ㎛.
(a) wiring an antenna coil on one side of the first sheet and forming an antenna coil contact point by removing an insulating layer covering the antenna coil;

(b) bonding a conductive fabric to the antenna coil contact point to form an inlay layer through which the antenna coil and the conductive fabric conduct electricity to each other;

(c) forming a card body by laminating a front printed sheet and a rear printed sheet on both sides of the inlay layer, and laminating an overlay sheet on each surface of the printed sheet;

(d) milling the card body to form a COB receiving groove, and milling to form conductive fluff on the surface of the conductive fabric exposed to the COB receiving groove; and

(e) adhering the COB to the COB receiving groove using a hot melt film or adhesive, and directly contacting the conductive fabric on which the conductive fluff is formed to the COB lower terminal without any other conductive media.

Combi card manufacturing method.
According to paragraph 4,

In step (b), a conductive adhesive layer is formed on the conductive fabric and bonded to the antenna coil contact point.
According to paragraph 4,

In step (b), the conductive fabric is bonded to the antenna coil contact by ultrasonic welding.
According to paragraph 4,

After step (b), it further includes a step (b') of forming an inlay layer into which an antenna coil and a conductive fabric are inserted by laminating a second sheet from which a portion corresponding to the conductive fabric is removed on the first sheet. A method of manufacturing a combination card, characterized in that:
In paragraph 7

After step (b'), the combi card further comprises a step (b'') of stacking a third sheet on the second sheet to form an inlay layer into which an antenna coil and a conductive fabric are inserted. Manufacturing method.
In paragraph 4

After step (b), the combi card further comprises a step (b''') of stacking a third sheet on the first sheet to form an inlay layer into which an antenna coil and a conductive fabric are inserted. Manufacturing method.