KR20240034343A - Method for manufacturing combi card using conductive adhesive film - Google Patents

Abstract

The present invention includes the steps of preparing a COB substrate in which COB molds and lower terminals are continuously arranged; A film that is removed after being laminated with the COB substrate, a release film having an open area at a portion corresponding to each COB mold arranged on the COB substrate and a portion corresponding to a COB lower terminal on one side of the release film. Manufacturing a conductive adhesive film having a conductive adhesive member formed thereon; manufacturing a COB substrate in which the conductive adhesive member is adhered to the lower terminal by laminating the conductive adhesive film to the COB substrate; manufacturing individual COBs by punching the COB substrate; Forming a COB receiving groove for accommodating the COB at a predetermined position of the card body in which the antenna coil is embedded and exposing the antenna coil terminal; and mounting the COB in the COB receiving groove so that the lower terminal of the COB and the antenna coil terminal of the card body communicate with each other through the conductive adhesive member.

Description

Method for manufacturing combi card using conductive adhesive film}

The present invention relates to a combined contact and non-contact card, also known as a Combi card. More specifically, the present invention relates to a combination card that automates the connection between the lower terminal of the COB of the Combi card and the antenna coil terminal of the card body, while providing a robust connection structure. This relates to a method of manufacturing a combination card that can prevent terminal failure or short circuit even when exposed to external shock or distortion.

Smart cards are divided into contact cards and contactless cards depending on the method of transmitting and receiving data. A contact card is an IC card in which a COB (Chip on Board) with an IC chip mounted on it is exposed to the card body, and the external terminal of the COB directly contacts the card terminal to transmit and receive data. A representative example is a credit card. Non-contact cards are RF cards (radio frequency) in which an IC chip transmits and receives data wirelessly using an antenna coil built into the card body, and transportation cards and access cards are representative examples.

Recently, a contact/non-contact combination card, so-called 'Combi card', which integrates contact and non-contact functions into one card, has been widely used.

The configuration of a general combination card 100' is shown in Figures 1A and 1B. Referring to FIGS. 1A and 1B, the combination card 100' consists of a card body 10' that forms the overall card, a COB 21' that processes information, and an antenna coil 17' for RF wireless communication. do. The COB (21') has a mold (22') for accommodating an IC chip for information processing formed in the lower center of a rectangular pad (21'), and an external terminal for contact type at the top of the pad (21'). A, a pair of COB lower terminals (23') connected to the antenna coil (17') are provided at the bottom.

The card body 10' is manufactured by laminating and heat-pressing several synthetic resin sheets with each function. The sheet material is mainly PVC, but various resins such as PC, PETG, PET, and ABS can also be used.

An inlay layer (11') is formed in the middle of the cross section of the card body (10'). The antenna coil 17' is wired on or inside the inlay layer 11'. Since the terminal 18' of the antenna coil 17' is connected to the COB lower terminal 23', it is wired at a corresponding position in the COB receiving groove 16', which will be described later. The inlay layer 11' may be composed of one sheet, but may also be composed of two or more sheets stacked as shown in FIG. 1B.

A front printing sheet 12' on which the shape of the front of the card is printed is laminated on one side of the inlay layer 11', and a back printing sheet 13' on which the shape of the back of the card is printed is laminated on the opposite side. Transparent overlay sheets 14' and 15' are laminated on the surfaces of the rear printing sheet 13' and the front printing sheet 12' to protect the printing sheets 12' and 13'.

A COB receiving groove 16 is formed at a predetermined position of the card body 10' to accommodate the COB 21'. The COB receiving groove 16' is formed by milling the surface of the card body 10' to the shape of the COB 21' using a milling machine, and at this time, the terminal 18' of the antenna coil is exposed. Another method other than milling is to form the COB receiving groove (16') by laminating sheets from which the portion corresponding to the COB receiving groove (16') has been previously removed when manufacturing the card body (10'). However, most COB receiving grooves (16') are currently used. The receiving groove 16' is formed by a milling method.

Among all the processes related to the above-described combination card, the most important and difficult process is the process of effectively connecting the COB lower terminal 23' and the antenna coil terminal 18' to each other using an energizing medium 24'.

At first, a method of bonding the COB lower terminal 23' and the terminal 18' of the antenna coil using a conductive adhesive as a medium 24' was used. However, conductive adhesives were suitable for manufacturing general PCB circuits, but when applied to combi cards, problems occurred in that the curing conditions, drying conditions, conductivity, and adhesive strength did not meet the required level, and when bending or twisting of the card occurred, the conductive adhesive (conductive adhesive) was used at the adhesive site. As cracks occurred, terminal defects occurred.

Accordingly, most people currently join the COB lower terminal (23') and the antenna coil terminal (18') by soldering them manually. However, since this method has to be done manually, productivity is very low and production costs also increase. There is a problem.

Republic of Korea Patent Publication Nos. 10-2005-0119538, 10-2005-0119539 and Patent Registration No. 10-0622140 disclose conductive fibers to solve terminal defects in the COB lower terminal (23') and the antenna coil terminal (18'). It discloses the use of as a terminal medium. However, these patents also assume the use of an anisotropic conductor film (ACF) or conductive adhesive to join the COB lower terminal and the conductive fiber, and do not disclose a method of joining the conductive fiber. This must be done manually, so productivity is very low. , there is a problem that production costs are also rising.

Republic of Korea Patent Registration No. 10-0852127 discloses the use of an elastic conductive sponge as an intermediate medium that can conduct electricity between the COB terminal and the antenna coil terminal. However, the conductive sponge is too thick to be suitable as a card terminal material, and even if it is made thin enough to be applicable to cards, it is difficult to meet the required elastic properties. There are currently no examples of applying the above technology.

(Prior document 001) Republic of Korea Patent Publication No. 10-2005-0119538 (Prior document 002) Republic of Korea Patent Registration No. 10-2005-0119539 (Prior document 003) Republic of Korea Patent Registration No. 10-0622140 (Prior document 004) Republic of Korea Patent Registration No. 10-0852127

In the present invention, when manufacturing a combination card, the connection between the lower terminal of the COB and the conductive medium of the antenna coil terminal of the card body is mechanized and automated, rather than the conventional manual connection, so that the COB mounting speed on the card body is fast and accurate, and at the same time, through a sturdy connection structure. The purpose is to provide a combination card and a manufacturing method thereof that can prevent terminal failure or short circuit even when external shock or card is twisted.

The present invention includes the steps of preparing a COB substrate in which COB molds and lower terminals are continuously arranged; A film that is removed after being laminated with the COB substrate, a release film having an open area at a portion corresponding to each COB mold arranged on the COB substrate and a portion corresponding to a COB lower terminal on one side of the release film. Manufacturing a conductive adhesive film having a conductive adhesive member formed thereon; manufacturing a COB substrate in which the conductive adhesive member is adhered to the lower terminal by laminating the conductive adhesive film to the COB substrate; manufacturing individual COBs by punching the COB substrate; Forming a COB receiving groove for accommodating the COB at a predetermined position of the card body in which the antenna coil is embedded and exposing the antenna coil terminal; and mounting the COB in the COB receiving groove so that the lower terminal of the COB and the antenna coil terminal of the card body communicate with each other through the conductive adhesive member.

In one aspect, the perforation hole may be formed in the COB substrate and/or the conductive adhesive member film.

In one aspect, the COB substrate may be a reel-to-reel COB substrate.

In one aspect, the conductive adhesive film may be a reel-to-reel film.

In one aspect, the conductive adhesive member film further includes a protective film to protect the viscous adhesive member adhered to the release film, and the protective film may be removed before lamination with the COB substrate.

In one aspect, the conductive adhesive member may be based on a conductive fabric, and a conductive adhesive may be applied to both sides of the fabric.

In one aspect, the conductive fabric may be a fabric, knitted fabric, or non-woven fabric woven by bundling several strands of conductive fibers.

In one aspect, the diameter of the conductive fiber may be 3 to 20 μm, and the thickness of the conductive fabric may be 30 to 400 μm.

The method of manufacturing a combination card according to the present invention is to pre-attach the conductive adhesive member to the internal terminal of the COB board by using a conductive adhesive film, lamination, and transfer method, then punch the COB board to separate each COB, and then separate the COB into a card. By mounting it on the main body, the process speed is improved compared to the conventional manual joining process, thereby increasing productivity and reducing manpower requirements.

Figure 1a is a perspective view showing the configuration of a general combination card, and Figure 1b is a perspective view showing the structure of a general combination card.
Figure 2 shows the structure of a reel-to-reel COB substrate according to an embodiment of the present invention, where (a) shows the front side and (b) shows the back side.
Figure 3 shows the actual (front) view of a reel-to-reel COB substrate currently on the market.
Figure 4 shows a reel-to-reel conductive adhesive film according to an embodiment of the present invention.
Figure 5 shows a conventionally sold conductive adhesive fabric.
Figure 6 shows a weaving form of a conductive fabric according to an embodiment of the present invention.
Figure 7 shows the actual reel-to-reel conductive adhesive member film produced according to an embodiment of the present invention.
Figure 8 shows a COB manufacturing process in which a conductive adhesive member is introduced according to an embodiment of the present invention.
Figure 9 shows a COB substrate with a conductive adhesive member introduced.
Figure 10 shows a COB manufacturing process in which a conductive adhesive member is introduced according to another embodiment of the present invention.
Figure 11 shows a structure in which a COB with a conductive adhesive member introduced is inserted into a card body according to an embodiment of the present invention.

The present invention will be described in detail below through drawings and examples. The following examples are only examples of the present invention, and the technical idea of the present invention is not limited to the following examples.

When explaining the present invention with reference to the drawings, in order to manufacture the combination card of the present invention, a COB substrate 20 is first prepared as shown in FIG. 2. The COB substrate 20 is a collection of COBs in which COBs 21 are arranged continuously. The combi card manufacturing device vacuum-sucks the COBs 21 one by one from the COB substrate and inserts them into the COB receiving groove formed in the card body. Adhere.

In the present invention, the COB substrate may be a reel-to-reel substrate or a flat plate substrate.

Figure 2 shows the structure of a reel-to-reel COB substrate according to an embodiment of the present invention, where (a) shows the front side and (b) shows the back side. Figure 3 shows the actual (front) view of a reel-to-reel COB board currently being sold.

The reel-to-reel COB board is flexible and can be wound on a reel like a tape. Most reel-to-reel boards currently in use have precise markings on both sides of the board, like camera film. In order to control movement, perforation holes 24 with a certain pitch are formed continuously. The reeling and releasing of reel-to-reel COB boards is controlled in a winding reel facility.

COBs 21 are continuously arranged at regular intervals on the COB substrate. COB 21 includes a mold 22 and a lower terminal 23 to protect the IC chip. On the COB board, each mold and lower terminal have a constant pitch. This mold 22 and the lower terminal 23 are inserted into the COB receiving groove of the card body, which will be described later, and are located inside the card.

Meanwhile, the flat COB method may be a rectangular flat sheet with multiple COBs arranged up and down and left and right. These flat COBs may be somewhat flexible or may be substantially inflexible.

The reel-to-reel method has the advantage of enabling a continuous process compared to the flat panel method, so it is currently mainly used in the manufacture of combi cards, and in the present invention, a reel-to-reel COB substrate can be preferably used.

When the COB substrate is prepared as described above, a film on which a conductive adhesive member is formed for lamination with the COB substrate (hereinafter referred to as a conductive adhesive member film) is manufactured.

Figure 4 shows the structure of a conductive adhesive member film according to an embodiment of the present invention.

The conductive adhesive member film 30 includes two layers, a release film 32 and a conductive adhesive member 31 formed in a specific area on the release film.

The conductive adhesive member film 30 of the present invention is used to effectively transfer the corresponding conductive adhesive member 31 to the lower terminals 23 arranged continuously on the COB substrate. The conductive adhesive member film is laminated with the COB substrate and the conductive adhesive member 31 is transferred to the lower terminal 23, and then the release film 32 is removed.

As shown in Figure 4, in the conductive adhesive member film 30, the conductive adhesive member 31 is not formed throughout the release film, but is a release film corresponding to the area corresponding to the lower terminal 23 of the COB substrate. formed on the This involves cutting only the conductive adhesive member 31 in the desired area (half cutting based on the conductive adhesive film) from the film in which the conductive adhesive member 31 and the release film 32 are laminated, and removing the remaining unnecessary conductive adhesive member portion. It can be formed by doing.

Since the conductive adhesive member 31 has adhesive properties, it is usually sold in roll form with one or both sides protected with a release film (release paper). Therefore, in one aspect, if the release film of the sold conductive adhesive member film (adhesive member + release film) satisfies the physical properties (durability) for half cutting, the unnecessary conductive adhesive member portion (excluding the area corresponding to the COB lower terminal) It is possible to remove it by cutting (half cutting) only the part.

Meanwhile, in another aspect, a separate release film other than the release film included in the sold conductive adhesive film may be used. For example, when it is difficult for the release film of a conventionally sold conductive adhesive film to meet the physical properties of the half cutting, or to reduce the loss of the conductive adhesive member during the manufacturing process, a separate release film may be used.

In the release film 32 of the present invention, a portion corresponding to each COB mold arranged on the COB substrate has an open area 33. This open area prevents the thick mold 22 and the release film 32 from interfering with each other when combining the conductive adhesive film and the COB substrate, so that the conductive adhesive member 31 effectively adheres to the COB lower terminal 23. This is to make it possible. Accordingly, the open area is formed to fit the mold size or be wider than the mold to accommodate the COB mold, and may be formed by punching the release film to pick out the open area portion.

In one aspect, perforation holes 34 having a certain pitch may be continuously formed at both ends of the conductive adhesive film of the present invention to control accurate movement of the film.

In one aspect, the positions and pitches of the perforation holes 44 of the COB substrate and the perforation holes 34 of the conductive adhesive film may be formed to be the same. This facilitates accurate bonding of the COB substrate and the conductive adhesive film.

In the present invention, the conductive adhesive member may be any material that is conductive and adhesive, but in one embodiment, it may be based on a conductive fabric and have adhesive properties imparted to it by applying a conductive adhesive to its surface. Conductive adhesives may be manufactured by mixing conductive particles such as silver, copper, and carbon black with epoxy resin, urethane resin, silicone resin, and polyimide resin.

Figure 5 shows a conventionally sold conductive adhesive fabric. A conductive adhesive is applied to the surface of the conductive fabric and protected with a release film.

In one aspect, the conductive fabric 40 may be a fabric made by bundling several strands of conductive fibers 42 and crossing them as warps and wefts, as shown in FIG. 6, or it may be a knitted fabric or a non-woven fabric.

In one aspect, the conductive fiber has a structure in which synthetic fibers such as polyester, acrylic, and nylon or natural fibers such as silk are plated or coated with a conductive metal such as copper, nickel, or silver. For example, plating may be electroless plating of metal after surface treatment of yarn (fiber) with a basic solution.

The diameter of the conductive fiber may be 3 to 20㎛, but is not limited thereto.

The thickness of the conductive adhesive member 31 can be adjusted depending on the diameter and number of strands of the conductive fiber and the conductive adhesive. The thickness of the conductive adhesive member may be 30 to 400㎛, but is not limited thereto. If the thickness of the adhesive member is less than 30㎛, the adhesive properties may be poor, and if it is more than 400㎛, there may be a problem of increasing the thickness of the manufactured combination card. Considering this, it is preferable that the fabric thickness is 100~300㎛. do.

Figure 7 shows the actual reel-to-reel conductive adhesive member film produced according to an embodiment of the present invention.

The conductive adhesive film according to FIG. 7 was manufactured in the following manner. While the commercially available conductive adhesive fabric (protected by the first release film) is unwound from the winding reel device, a separate release film (second release film) is unwound from the winding reel device and laminated to each other, and the first release film of the adhesive fabric is While removing, use a Thompson cutting machine to cut only the adhesive fabric in the part corresponding to the COB internal terminal without cutting the second release film. When the unnecessary part of the cut conductive adhesive fabric is removed by winding it in a winding reel device, only the conductive adhesive fabric corresponding to the COB internal terminal exists on the second release film. Afterwards, the protective film is laminated onto the conductive adhesive fabric again, and then open areas and perforation holes are simultaneously formed through Thompson punching to manufacture the conductive adhesive member film of the present invention.

Figure 8 shows a COB manufacturing process into which a conductive adhesive member is introduced according to an embodiment of the present invention, and Figure 9 shows a COB substrate into which a conductive adhesive member is introduced.

As shown in Figure 8, the above-described COB substrate and the conductive adhesive film are engaged in a reel-to-reel manner and pressed together by a rubber roller, etc., so that the conductive adhesive member of the conductive adhesive film is firmly adhered to the COB lower terminal.

In one embodiment, after the lamination, the release film 32 of the conductive adhesive member film is removed, and in the combination card manufacturing device, the COB substrate is separated by punching into the designed COB shape, and attached to a vacuum suction device to form a COB receiving groove in the card body. It will be installed in .

Figure 10 shows a COB manufacturing process in which a conductive adhesive member is introduced according to another embodiment of the present invention.

As shown in FIG. 10, after the lamination, the COB substrate can be half-cut into the COB shape in the combi card manufacturing device without removing the release film 32 of the conductive adhesive film. At this time, the release film is not cut, and the conductive adhesive member attached to the COB remains adhered to the release film, which can increase the stability of transport or transportation of the COB.

The manufacturing process of the card body of the combination card of the present invention follows a conventional process. Figure 11 shows a structure in which a COB with a conductive adhesive member introduced is inserted into a card body according to an embodiment of the present invention. First, the card body is manufactured in the order of inlay layer production -> printing sheet lamination -> overlay sheet lamination, then a COB receiving groove (16) is formed in the card body using a milling machine, and then the COB (21) is adhered. A combination card (100) is produced.

The card body 10 is manufactured by stacking several synthetic resin sheets with each function and heat-pressing them. The sheet material is mainly PVC, but various resins such as PC, PETG, PET, and ABS can also be used.

An inlay layer (11) is formed in the middle of the cross section of the card body (10). The antenna coil 17 is wired on or inside the surface of the inlay layer 11. The terminal 18 of the antenna coil 17 is connected to the COB lower terminal 23 and is therefore wired at a corresponding position in the COB receiving groove 16. The inlay layer 11 may be composed of one sheet, but may also be composed of two or more sheets stacked as shown in FIG. 11.

A front printing sheet 12 on which the shape of the front of the card is printed is laminated on one side of the inlay layer 11, and a back printing sheet 13 on which the shape of the back of the card is printed is laminated on the opposite side. Transparent overlay sheets 14 and 15 are laminated on the surfaces of the rear printing sheet 13 and the front printing sheet 12 to protect the printing sheets 12 and 13.

A COB receiving groove 16 is formed at a predetermined position of the card body 10 to accommodate the COB 21. The COB receiving groove 16 is formed by milling the surface of the card body 10 to the shape of the COB 21 using a milling machine, and at this time, the terminal 18 of the antenna coil is exposed. As a method other than milling, the COB receiving groove 16 may be formed by laminating sheets from which the portion corresponding to the COB receiving groove 16 has been previously removed when manufacturing the card body 10, but currently, most COB receiving grooves ( 16) is formed by the milling method.

100: Combi card 10: Card body
11: Inlay layer 12: Front printing sheet
13: Rear printed sheet 14: Front overlay sheet
15: Rear overlay sheet 16: COB receiving groove
17: antenna coil 18: antenna coil terminal
20: COB substrate 21: COB
22: COB mold 23: COB lower terminal
24: perforation hole 30: conductive adhesive member film
31: Conductive adhesive member 32: Release film
33: Open area 34: Perforation hall

Claims (8)

Preparing a COB substrate in which COBs equipped with a COB mold and lower terminals are continuously arranged;
A film that is removed after being laminated with the COB substrate, a release film having an open area at a portion corresponding to each COB mold arranged on the COB substrate and a portion corresponding to a COB lower terminal on one side of the release film. Manufacturing a conductive adhesive film having a conductive adhesive member formed thereon;
manufacturing a COB substrate in which the conductive adhesive member is adhered to the lower terminal by laminating the conductive adhesive film to the COB substrate;
manufacturing individual COBs by punching the COB substrate;
Forming a COB receiving groove for accommodating the COB at a predetermined position of the card body in which the antenna coil is embedded and exposing the antenna coil terminal;
Characterized in that it includes the step of mounting the COB in the COB receiving groove so that the lower terminal of the COB and the antenna coil terminal of the card body communicate through the conductive adhesive member.
Combi card manufacturing method.
According to paragraph 1,
A method of manufacturing a combination card, characterized in that the perforation hole is formed in the COB substrate and the conductive adhesive film.
According to paragraph 1,
A method of manufacturing a combi card, characterized in that the COB substrate is a reel-to-reel COB substrate.
According to paragraph 1,
A method of manufacturing a combi card, wherein the conductive adhesive film is a reel-to-reel film.
According to paragraph 1,
The conductive adhesive member film further includes a release film and a protective film to protect the conductive adhesive member, and the protective film is removed before lamination with the COB substrate.
According to paragraph 1,
A method of manufacturing a combi card, characterized in that the conductive adhesive member is based on a conductive fabric, and a conductive adhesive is applied to both sides of the fabric.
According to clause 6,
A method of manufacturing a combi card, characterized in that the conductive fabric is a fabric, knitted fabric, or non-woven fabric woven by bundling several strands of conductive fibers.
In clause 7,
A method of manufacturing a combi card, characterized in that the diameter of the conductive fiber is 3 to 20 ㎛, and the thickness of the conductive fabric is 30 to 400 ㎛.