WO2023197513A1 - Carte de circuit imprimé - Google Patents

Carte de circuit imprimé Download PDF

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Publication number
WO2023197513A1
WO2023197513A1 PCT/CN2022/116394 CN2022116394W WO2023197513A1 WO 2023197513 A1 WO2023197513 A1 WO 2023197513A1 CN 2022116394 W CN2022116394 W CN 2022116394W WO 2023197513 A1 WO2023197513 A1 WO 2023197513A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
circuit board
printed circuit
connector
shielding sleeve
Prior art date
Application number
PCT/CN2022/116394
Other languages
English (en)
Chinese (zh)
Inventor
陆平
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Publication of WO2023197513A1 publication Critical patent/WO2023197513A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente demande divulgué une carte de circuit imprimé. La carte de circuit imprimé comprend : une première couche conductrice ; une seconde couche conductrice, la seconde couche conductrice et la première couche conductrice étant empilées ; un premier élément de connexion, le premier élément de connexion étant électriquement connecté à la première couche conductrice et à la seconde couche conductrice ; et un manchon de blindage, le manchon de blindage étant emmanché sur le premier élément de connexion, et le manchon de blindage et le premier élément de connexion étant espacés et agencés de manière coaxiale. Au moyen de la structure décrite, la présente demande peut protéger l'interférence d'un signal externe au premier élément de connexion, facilite la transmission de signal du premier élément de connexion, réduit la diaphonie entre différents signaux, et améliore la stabilité et l'intégrité de la transmission de signal.
PCT/CN2022/116394 2022-04-15 2022-09-01 Carte de circuit imprimé WO2023197513A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210399334.5 2022-04-15
CN202210399334.5A CN114900947A (zh) 2022-04-15 2022-04-15 印制电路板

Publications (1)

Publication Number Publication Date
WO2023197513A1 true WO2023197513A1 (fr) 2023-10-19

Family

ID=82716480

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/116394 WO2023197513A1 (fr) 2022-04-15 2022-09-01 Carte de circuit imprimé

Country Status (2)

Country Link
CN (1) CN114900947A (fr)
WO (1) WO2023197513A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure
US20150014045A1 (en) * 2013-07-15 2015-01-15 Massachusetts Institute Of Technology Sleeved Coaxial Printed Circuit Board Vias
US20160278207A1 (en) * 2015-03-19 2016-09-22 Multek Technologies Ltd. Selective segment via plating process and structure
CN215912274U (zh) * 2021-06-25 2022-02-25 深南电路股份有限公司 具有屏蔽孔的线路板
CN114258194A (zh) * 2020-09-24 2022-03-29 深南电路股份有限公司 一种电路板及其制造方法
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

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DE3426278A1 (de) * 1984-07-17 1986-01-30 Schroff Gmbh, 7541 Straubenhardt Leiterplatte
JPH0396066U (fr) * 1990-01-21 1991-10-01
SE9502326D0 (sv) * 1995-06-27 1995-06-27 Sivers Ima Ab Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang
JP2689971B2 (ja) * 1995-12-22 1997-12-10 日本電気株式会社 プリント基板接続用同軸端子及びプリント基板の接続構造
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JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
JP3973402B2 (ja) * 2001-10-25 2007-09-12 株式会社日立製作所 高周波回路モジュール
US6933450B2 (en) * 2002-06-27 2005-08-23 Kyocera Corporation High-frequency signal transmitting device
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
DE102004036890A1 (de) * 2004-07-19 2006-02-16 Würth Elektronik Rot am See GmbH & Co. KG Leiterplattenanordnung
US7679005B2 (en) * 2005-03-23 2010-03-16 Endicott Interconnect Technologies, Inc. Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same
US7977582B2 (en) * 2008-01-28 2011-07-12 International Business Machines Corporation Flexible multilayer printed circuit assembly with reduced EMI emissions
US10045434B2 (en) * 2014-12-15 2018-08-07 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Reducing impedance discontinuities on a printed circuit board (‘PCB’)
US11160163B2 (en) * 2017-11-17 2021-10-26 Texas Instruments Incorporated Electronic substrate having differential coaxial vias
US11289802B2 (en) * 2019-04-08 2022-03-29 Apple Inc. Millimeter wave impedance matching structures
CN211580310U (zh) * 2020-04-13 2020-09-25 珠海市魅族科技有限公司 印刷线路板间的信号连接器、主板和电子设备
CN211578990U (zh) * 2020-04-13 2020-09-25 珠海市魅族科技有限公司 印刷线路板间的信号连接器、主板和电子设备
CN212910169U (zh) * 2020-06-17 2021-04-06 东莞联桥电子有限公司 一种抗电磁干扰的多层电路板结构
CN112566356B (zh) * 2020-11-20 2022-03-18 深圳市金晟达电子技术有限公司 一种毫米波雷达印制电路板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130105987A1 (en) * 2011-11-02 2013-05-02 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. Laminate interconnect having a coaxial via structure
US20150014045A1 (en) * 2013-07-15 2015-01-15 Massachusetts Institute Of Technology Sleeved Coaxial Printed Circuit Board Vias
US20160278207A1 (en) * 2015-03-19 2016-09-22 Multek Technologies Ltd. Selective segment via plating process and structure
CN114258194A (zh) * 2020-09-24 2022-03-29 深南电路股份有限公司 一种电路板及其制造方法
CN215912274U (zh) * 2021-06-25 2022-02-25 深南电路股份有限公司 具有屏蔽孔的线路板
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

Also Published As

Publication number Publication date
CN114900947A (zh) 2022-08-12

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