WO2023197513A1

WO2023197513A1 - Printed circuit board

Info

Publication number: WO2023197513A1
Application number: PCT/CN2022/116394
Authority: WO
Inventors: 陆平
Original assignee: 深南电路股份有限公司
Priority date: 2022-04-15
Filing date: 2022-09-01
Publication date: 2023-10-19
Also published as: CN114900947A

Abstract

The present application discloses a printed circuit board. The printed circuit board comprises: a first conductive layer; a second conductive layer, the second conductive layer and the first conductive layer being stacked; a first connecting member, the first connecting member being electrically connected to the first conductive layer and the second conductive layer; and a shielding sleeve, the shielding sleeve being sleeved on the first connecting member, and the shielding sleeve and the first connecting member being spaced apart and coaxially arranged. By means of the described structure, the present application can shield the interference of an external signal to the first connecting member, facilitates signal transmission of the first connecting member, reduces crosstalk between different signals, and improves the stability and integrity of signal transmission.

Description

printed circuit board

This application is based on the Chinese invention application with application number 202210399334.5 and titled "Printed Circuit Board" submitted on April 15, 2022, and claims its priority.

Technical field

This application applies to the technical field of printed circuit boards.

Background technique

PCB (Printed Circuit Board), also known as printed circuit board or printed circuit board, is an important electronic component that is widely used. It is the support for electronic components and the carrier for the electrical connection of electronic components.

After extensive testing, the inventor realized that the impedance fluctuations of circuit board connectors would cause serious signal reflection, restrict the improvement of signal transmission bandwidth, and thus affect the quality of the entire signal transmission. The structure of traditional circuit board connectors is generally that the connector realizes the connection between different conductive layers. Copper sheets and multiple ground holes are laid around the connector as a reference to ensure the continuity of the signal return path.

The connectors of this conventional structure are simple to design and PCB processing is easy, but it is difficult to optimize the impedance. Generally, the impedance fluctuates greatly and the impedance matching is poor. The bandwidth of the signal transmitted using this structure is not high. In severe cases, it will cause signal The increase in the bit error rate of the signal at the receiving end leads to signal restoration errors.

Contents of the invention

The present application provides a printed circuit board to solve the problem of large impedance fluctuations of the signal connectors of the printed circuit board existing in the prior art.

In order to solve the above technical problems, the present application provides a printed circuit board, including: a first conductive layer; a second conductive layer, the second conductive layer and the first conductive layer are stacked; a first connector, a first connector The first conductive layer and the second conductive layer are electrically connected; a shielding sleeve is provided with the first connecting piece, and is spaced apart and coaxially with the first connecting piece.

The beneficial effects of this application are: different from the situation in the prior art, the printed circuit board of this application is sleeved with the first connector through a shielding sleeve, and is spaced and coaxially arranged with the first connector, which can shield external signals from the The interference of the first connector is beneficial to the signal transmission of the first connector, reduces the crosstalk between different signals, improves the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, which is beneficial to the first connector Impedance matching optimization increases the impedance matching of the first connector, reduces the fluctuation of the impedance of the first connector, ultimately reduces signal reflection and increases signal transmission bandwidth, which is beneficial to signal interconnection between printed circuit board layers.

Description of the drawings

Figure 1 is a schematic structural diagram of an embodiment of the printed circuit board of the present application;

Figure 2 is a schematic top view of the printed circuit board in the embodiment of Figure 1;

Figure 3 is a schematic front cross-sectional structural diagram of the printed circuit board in the embodiment of Figure 1;

Figure 4 is a schematic diagram of impedance comparison between the comparative example and the embodiment.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

It should be noted that if there are directional instructions (such as up, down, left, right, front, back...) in the embodiments of the present application, the directional instructions are only used to explain the position of a certain posture (as shown in the accompanying drawings). The relative positional relationship, movement conditions, etc. between the components under the display). If the specific posture changes, the directional indication will also change accordingly.

In addition, if there are descriptions involving “first”, “second”, etc. in the embodiments of this application, the descriptions of “first”, “second”, etc. are only for descriptive purposes and shall not be understood as indications or implications. Its relative importance or implicit indication of the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions in various embodiments can be combined with each other, but it must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions does not exist. , nor is it within the scope of protection required by this application.

Please refer to Figures 1-3. Figure 1 is a schematic structural diagram of a printed circuit board according to an embodiment of the present application. FIG. 2 is a schematic top structural view of the printed circuit board in the embodiment of FIG. 1 , and FIG. 3 is a schematic front cross-sectional structural view of the printed circuit board in the embodiment of FIG. 1 .

The printed circuit board 100 of this embodiment includes a first connector 107, a first conductive layer 101, a second conductive layer 102 and a shielding sleeve 106.

The second conductive layer 102 and the first conductive layer 101 are stacked. Among them, the printed circuit board 100 of this embodiment may further include multiple conductive layers on the basis of the first conductive layer 101 and the second conductive layer 102. Each conductive layer may be sequentially stacked and attached to the insulating layer, thereby forming Printed circuit board 100. The insulating layer may include one or more of epoxy resin, polyimide, bismaleimide triazine (BT), and ceramic base. Among them, the stacked arrangement means that the conductive layers and insulating layers are arranged and arranged in a fixed order from top to bottom.

The first connector 107 conducts the first conductive layer 101 and the second conductive layer 102 . The material of the first connecting member 107 may include metal or other conductive materials to electrically connect the first conductive layer 101 and the second conductive layer 102 .

Among them, the first conductive layer 101 and the second conductive layer 102 can be respectively disposed on the opposite sides of the printed circuit board 100, or one can be disposed on the surface of the printed circuit board 100, and the other can be disposed on the printed circuit board 100. can also be arranged inside the printed circuit board 100, which is not limited here. That is to say, the first connector 107 can be disposed based on the positions of the first conductive layer 101 and the second conductive layer 102, penetrating the printed circuit board 100 or partially penetrating the printed circuit board 100, to electrically connect the first conductive layer 101 and the second conductive layer 102. Second conductive layer 102.

In a specific application scenario, when at least one of the first conductive layer 101 and the second conductive layer 102 is disposed on the surface of the printed circuit board 100, the first connector 107 may include a hollow connection post, so that on the first electrical connection The first conductive layer 101 and the second conductive layer 102 simultaneously use a hollow structure to match the plug connector, thereby realizing conduction between the printed circuit board 100 and the plug connector. In another specific application scenario, when both the first conductive layer 101 and the second conductive layer 102 are disposed inside the printed circuit board 100, the first connector 107 may include a solid connection post to electrically connect the first conductive layer 101 to the printed circuit board 100. Conductive layer 101 and second conductive layer 102 .

The shielding sleeve 106 of this embodiment is sleeved on the first connecting member 107 and is spaced apart from and coaxially with the first connecting member 107 . Among them, the shielding sleeve 106 can include a metal shielding sleeve or a shielding sleeve made of other materials, thereby shielding the interference of external signals on the first connector 107, facilitating the signal transmission of the first connector 107, and reducing crosstalk between different signals. Improve the integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector 107, which is beneficial to the optimization of the impedance matching of the first connector 107, increasing the impedance matching of the first connector 107, and reducing the impedance of the first connector 107 The fluctuations ultimately reduce signal reflection and improve signal transmission bandwidth, which is beneficial to signal interconnection between 100 layers of printed circuit boards.

An insulating layer can be filled between the shielding sleeve 106 and the first connector 107 for support to improve the structural stability of the printed circuit board.

Through the above structure, the printed circuit board of this embodiment is sleeved with the first connector through the shielding sleeve, and is spaced and coaxially arranged with the first connector, which can shield the interference of external signals on the first connector, which is beneficial to the first connector. The signal transmission of the connecting piece reduces the crosstalk between different signals, improves the stability and integrity of the signal transmission, thereby reducing the impedance fluctuation of the first connecting piece, which is conducive to the optimization of the impedance matching of the first connecting piece and increases the first connecting piece's impedance matching. The impedance matching reduces the fluctuation of the impedance of the first connector, ultimately reducing signal reflection and increasing the signal transmission bandwidth, which is beneficial to signal interconnection between printed circuit board layers.

In other embodiments, the first conductive layer 101 and the second conductive layer 102 are respectively disposed on opposite side surfaces of the printed circuit board 100, and the first connector 107 penetrates the printed circuit board 100 to conduct conduction along the penetration direction. The first conductive layer 101 and the second conductive layer 102 on opposite sides of the printed circuit board 100 .

The first connector 107 may include a hollow connecting post, so that while the first conductive layer 101 and the second conductive layer 102 are connected, the hollow structure is used to match the plug connector, thereby realizing the printed circuit board 100 and the plug connector. conduction between.

In other embodiments, the first conductive layer 101 can also be disposed on the upper surface or lower surface of the printed circuit board 100, and the second conductive layer 102 is disposed inside the printed circuit board 100; the first connector 107 is partially penetrated The printed circuit board 100 is used to electrically connect the first conductive layer 101 and the second conductive layer 102 . Similarly, the first connector 107 may include a hollow connection post, a hollow structure using the hollow connection post to match the plug connector, and a channel for the first conductive layer 101 and the second conductive layer 102.

In other embodiments, the first conductive layer 101 can also be disposed inside the printed circuit board 100, and the second conductive layer 102 can be disposed on the lower surface or the upper surface of the printed circuit board 100; the first connector 107 is partially penetrated The printed circuit board 100 is used to electrically connect the first conductive layer 101 and the second conductive layer 102 . Similarly, the first connector 107 may include a hollow connection post, a hollow structure using the hollow connection post to match the plug connector, and a channel for the first conductive layer 101 and the second conductive layer 102 .

In other embodiments, the printed circuit board 100 further includes: a third conductive layer 103 and a fourth conductive layer 104 . The third conductive layer 103 is adjacent to the first conductive layer 101 and is electrically connected to each other, and the fourth conductive layer 104 is adjacent to the second conductive layer 102 and is electrically connected to each other.

Among them, the connection between the third conductive layer 103 and the first conductive layer 101 and between the fourth conductive layer 104 and the second conductive layer 102 can be conducted through via holes, metal base, conductive paste or conductive glue. This is not limited.

The shielding sleeve 106 connects and conducts the third conductive layer 103 and the fourth conductive layer 104 .

Therefore, the printed circuit board 100 of this embodiment can realize signal transmission not only through the first connector 107 that penetrates the printed circuit board 100, but also through the second conductive layer 102, the fourth conductive layer 104, and the shielding layer that are connected to each other. The sleeve 106, the third conductive layer 103 and the first conductive layer 101 realize signal return. The second conductive layer 102, the fourth conductive layer 104, the shielding sleeve 106, the third conductive layer 103 and the first conductive layer 101 that are connected to each other provide a complete reference path for the first connector 107 to ensure signal integrity. Avoid incomplete signal return paths or signal returns that increase the return path length across layers, thereby affecting the integrity of signal returns. The above settings enable the printed circuit board 100 of this embodiment to be applied to high-frequency signals or other application scenarios that require signal return.

The printed circuit board 100 of this embodiment can also be applied to the application scenario of DC signal transmission, and the signal transmission is realized directly through the first connector 107 .

Among them, since the printed circuit board 100 is commonly prepared using a laminated printed circuit board process, but under this manufacturing process, it is difficult for the shielding sleeve 106 to directly connect the first conductive layer 101 and the second conductive layer 102. Therefore, this method In the embodiment, the third conductive layer 103 and the fourth conductive layer 104 are connected and connected through the shielding sleeve 106, wherein the third conductive layer 103 and the first conductive layer 101 are adjacent conductive layers, and the fourth conductive layer 104 and the second conductive layer 102 are adjacent conductive layers, and the third conductive layer 103 has an electrical connection relationship with the first conductive layer 101, and the fourth conductive layer 104 and the second conductive layer 102 have an electrical connection relationship. The connection relationship is equivalent to combining the shielding sleeve 106, the third conductive layer 103, and the fourth conductive layer 104 to jointly realize the connection between the first conductive layer 101 and the second conductive layer 102, thereby improving the process of the laminated printed circuit board. Under the preparation conditions, the shielding area of the first connector 107 by the shielding sleeve 106 is maximized, thereby ensuring the signal shielding effect of the shielding sleeve 106, thereby reducing the impedance fluctuation of the first connector 107, which is beneficial to the first connector 107. Impedance matching is optimized and adapted to the preparation of laminated printed circuit board processes.

In one example, under the preparation conditions of the laminated printed circuit board process, the first conductive layer 101 may be the top conductive layer disposed on one side surface of the printed circuit board 100, that is, the first conductive layer, The second conductive layer 102 may be the bottom conductive layer disposed on the other side surface of the printed circuit board 102, that is, the last conductive layer.

In one example, under the manufacturing conditions of the laminated printed circuit board process, the shielding sleeve 106 used to cover the first connector 107 is a buried hole, that is, there is no via hole extending to the surface of the printed circuit board 100 , one end of the buried hole is connected to the third conductive layer 103, and the other end of the buried hole is connected to the fourth conductive layer 104. Through the buried hole, the third conductive layer 103 and the fourth conductive layer 104 are combined to realize the first conductive layer 101 and the second conductive layer 104. connections between layers 102.

In other embodiments, when the manufacturing process of the printed circuit board 100 does not limit the connection between the shielding sleeve 106 and the first conductive layer 101 and the second conductive layer 102 respectively, the shielding sleeve 106 can directly conduct the printed circuit board. The first conductive layer 101 and the second conductive layer 102 on the opposite surfaces of the circuit board 100 completely surround the first connector 107 and increase the shielding area of the first connector 107 by the shielding sleeve 106 to ensure the shielding sleeve 106 The signal shielding effect further reduces the impedance fluctuation of the first connector 107, which is beneficial to the optimization of the impedance matching of the first connector 107.

In other embodiments, the printed circuit board 100 may further include multiple intermediate conductive layers 105 , which are stacked between the third conductive layer 103 and the fourth conductive layer 104 to realize the printed circuit board 100 function. The specific number of the intermediate conductive layers 105 can be set based on the thickness requirements or functional requirements of the printed circuit board 100, for example: 5 layers, 10 layers, 20 layers, etc., which are not limited here.

When there is a ground layer in the multi-layer middle conductive layer 105, the shielding sleeve 106 can be connected to the ground layer. When the middle conductive layer 105 is not a ground layer, the shielding sleeve 106 is not connected to it to ensure the shielding effect.

In other embodiments, the printed circuit board 100 further includes at least two second connectors 108 , and some of the second connectors 108 are electrically connected to the first conductive layer 101 and the third conductive layer 103 , thereby realizing the connection between the first conductive layer 101 and the third conductive layer 103 . electrical connection between the third conductive layer 103 . The other part of the second connector 108 connects the second conductive layer 102 and the fourth conductive layer 104 to achieve electrical connection between the second conductive layer 102 and the fourth conductive layer 104 .

The second connector 108 in this embodiment can be a metallized blind hole, thereby electrically connecting the first conductive layer 101 on the surface of the printed circuit board 100 and the third conductive layer 103 inside, and electrically connecting the printed circuit. The second conductive layer 102 on the surface of the board 100 and the fourth conductive layer 104 on the interior.

The number of the second connecting member 108 between the first conductive layer 101 and the third conductive layer 103 is at least one, and the number of the second connecting member 108 between the second conductive layer 102 and the fourth conductive layer 104 is also at least one. , specifically it can be 1, 4, 6, 8, 9, etc. The number of the above two second connectors 108 can be the same or different, and their positions can be the same or different. The specific number and position are based on actual needs. Settings are not limited here.

Among them, when the number of the second connecting members 108 between the adjacent conductive layers is greater, the electrical connection effect is better, and the surrounding of the first connecting member 107 is stronger, and then combined with the shielding sleeve 106 The better the signal shielding effect of the first connector 107 is.

Among them, part of the second connectors 108 is electrically connected to the first conductive layer 101 and the third conductive layer 103, and another part of the second connectors 108 is electrically connected to the second conductive layer 102 and the fourth conductive layer 104, and the shielding sleeve The barrel 106 is electrically connected to the third conductive layer 103 and the fourth conductive layer 104, thereby providing a complete reference path for the first connector 107 to ensure signal integrity, so that the signal can pass through another part of the second connector 108 and the shielding sleeve. The barrel 106 and part of the second connector 108 return to avoid an incomplete signal return path or a long signal return path, thereby improving the integrity of the signal return.

In other embodiments, on the projection of the preset plane 103 and between the second conductive layer 102 and the fourth conductive layer 104, and realize the surrounding of the first connector 107, and then combine with the shielding sleeve 106 to shield the signal of the first connector 107 The better. The preset plane x refers to the plane where each conductive layer of the printed circuit board 100 is located.

In an example, on the projection of the preset plane x, each second connecting member 108 may be spaced a certain distance from the shielding sleeve 106 . For example, each second connector 108 for electrically connecting the first conductive layer 101 and the third conductive layer 103 is spaced apart from the shielding sleeve 106 by a first set distance L1; Each second connecting member 107 of the layer 104 is separated from the shielding sleeve 106 by a second set distance L2, where the first set distance L1 and the second set distance L2 may be equal or unequal, thereby achieving part of the second set distance L2. The connecting piece 108 and another part of the second connecting piece 108 are evenly arranged around the shielding sleeve 106 .

In other embodiments, the first conductive layer 101 is provided with conductive lines that are electrically connected to the first connector 107 .

Specifically, the first circuit 109 is provided on the first conductive layer 101 . The first line 109 includes a first surrounding member 1093, a first intermediate connecting member 1092 and a first wiring member 1091. The first surrounding member 1093 is arranged around the first connecting member 107 and is electrically connected to the first connecting member 107; One end of the intermediate connector 1092 is connected to the first surrounding member 107, and the other end of the first intermediate connector 1092 is connected to the first routing member 1091, thereby realizing the first routing member 1091, the first intermediate connector 1092, and the first surrounding member in sequence. The electrical connection between the component 1093 and the first connecting component 107.

The first wiring member 1091 can also be connected to external devices, external circuits and/or other conductive lines of the first conductive layer 101, which is not limited here.

The materials of the first wiring member 1091, the first intermediate connection member 1092, and the first surrounding member 1093 may include metal or other conductive materials.

Through the above structure, the printed circuit board 100 of this embodiment can realize signal transmission through the first wiring member 1091, the first intermediate connector 1092, the first surrounding member 1093 and the first connector 107 in sequence.

In other embodiments, the second conductive layer 102 is also provided with conductive lines that are electrically connected to the first connector 107 .

Specifically, the second circuit 110 is provided on the second conductive layer 102 . The structure of the second line 110 is similar to the structure of the first line 109. Specifically, the second line includes a second surrounding member, a second intermediate connecting member and a second routing member. The second surrounding member is arranged around the first connecting member. and is electrically connected to the first connecting piece; one end of the second intermediate connecting piece is connected to the second surrounding piece, and the other end of the second intermediate connecting piece is connected to the second wiring piece; thereby realizing the second wiring piece and the second intermediate connection in sequence electrical connection between the component, the second surrounding component and the first connecting component 107.

The second wiring member can also be connected to external devices, external circuits and/or other conductive lines of the second conductive layer 102, which is not limited here.

Through the above structure, the printed circuit board 100 of this embodiment can sequentially pass through the first wiring member 1091, the first intermediate connector 1092, the first surrounding member 1093, the first connecting member 107, the second surrounding member, and the second intermediate member. The connecting piece and the second wiring piece realize signal transmission.

In other embodiments, the first wiring member 1091 is also electrically connected to the first conductive layer 101, and the second wiring member is also electrically connected to the second conductive layer 102. Then, the printed circuit board 100 of this embodiment can also be Signal return is achieved through the second wiring member, the second conductive layer, another part of the second connector 108, the shielding sleeve 106, part of the second connector 108, the first conductive layer, and the first wiring member 1091, thereby providing the signal It provides a complete reference path to ensure signal integrity and avoids incomplete signal return paths or signal return due to cross-layer increase in return path length, which in turn affects the integrity of signal returns. The above settings enable the printed circuit board 100 of this embodiment to be applied to high-frequency signals or other application scenarios that require signal return.

In other embodiments, on the projection of the preset plane x, the first intermediate connection member 1092 does not overlap with each conductive layer, and the first wiring member 1091 overlaps with each conductive layer. As shown in Figure 2, you can see the specific positional relationship between the first intermediate connector 1092 and the first wiring member 1091 on the projection of the preset plane x. The first intermediate connector 1092 is located at the edge of the shielding sleeve 106. In the hollow area, the first intermediate connection member 1092 does not overlap with the first conductive layer 101, and the first wiring member 1091 passes through the first conductive layer 101. Therefore, the first wiring member 1091 and the first conductive layer 101 overlap.

The width of the first intermediate connection member 1092 is greater than the width of the first wiring member 1091 . Since on the projection of the preset plane The impedance of the line component 1091 has an impact. Therefore, by making the width of the first intermediate connection component 1092 larger than the width of the first wiring component 1091, the impedance between the first intermediate connection component 1092 and the first routing component 1091 can be balanced. This further makes the impedances between the first intermediate connection member 1092 and the first wiring member 1091 the same, thereby improving the signal transmission quality of the entire first line 109 .

In other embodiments, similarly, on the projection of the preset plane x, the second intermediate connection member does not overlap with each conductive layer, and the second wiring member overlaps with each conductive layer. As shown in FIG. 1 , it can be seen that the second intermediate connection member on the projection of the preset plane x does not overlap with the second conductive layer 102 , and the second wiring member overlaps with the second conductive layer 102 .

Wherein, the width of the second intermediate connecting member is greater than the width of the second wiring member. Since the second intermediate connector does not overlap with each conductive layer on the projection of the preset plane The impedance of The impedance is the same as that between the second wiring components, thereby improving the signal transmission quality of the entire second line 110 .

In other embodiments, the difference between the width of the first intermediate connection member 1092 and the width of the first routing member 1091 and the difference between the width of the second intermediate connection member and the width of the second routing member are at least is 0.05 mm, specifically it can be 0.05 mm, 0.08 mm, 0.10 mm, 0.15 mm, 0.30 mm, 0.41 mm, etc. The specific width can be set based on the specific width of the first intermediate connector 1092 and the first wiring member 1091. Here No restrictions.

That is, the width W1 of the line on the first line 109 and the second line 110 that is opposite to the shielding sleeve 106 is greater than the width W2 of the line on the first line 109 and the second line 110 that is opposite to each conductive layer, and W1-W2 ≧0.05mm.

Within this difference range, the impedance between the intermediate connector and the routing component can be balanced.

In other embodiments, the inner diameter R of the shielding sleeve 106 is at least 0.3 mm. Specifically, it can be 0.3 mm, 0.5 mm, 0.8 mm, 1.0 mm, 2.0 mm or 5.0 mm, etc., and is not limited here.

In other embodiments, the outer diameter r of the first connecting member 107 is at least 0.1 mm, and may specifically be 0.1 mm, 0.3 mm, 0.5 mm, 0.9 mm, 1.2 mm, 2.6 mm, etc., which is not limited here. The shielding sleeve The distance between the barrel 106 and the first connecting piece 107 is at least 0.2 mm, and may specifically be 0.2 mm, 0.4 mm, 0.5 mm, 0.9 mm, 1.5 mm, 2.3 mm, 3.5 mm, etc.

In other embodiments, the distance between the second connector 108 and the first connector 107 ≧(R-r)/2, that is, the distance between the second connector 108 and the first connector 107 is at least greater than the shielding sleeve 106 half of the difference between the inner diameter R and the outer diameter r of the first connector 107, so that within this distance, the first connector 107 can be surrounded to achieve a shielding function to a certain extent, and the distance between the structures can be prevented. If it is too short, it will be difficult to position accurately and may easily cause short circuits and other situations.

The above-mentioned connection structure impedance of the printed circuit board 100 of this embodiment is easy to calculate. It is known that the outer diameter r of the first connector 107, the inner diameter R of the shielding sleeve 106, and the distance between the first connector 107 and the shielding sleeve 106 are known. After filling the dielectric constant DK of the insulating medium, the above parameters can be directly calculated to calculate the impedance. There is no need to know the complex physical structure of the conventional via structure and then use simulation software to model and simulate it to calculate the impedance.

Through the above structure, in this embodiment, the first connector is sleeved through the shielding sleeve and is spaced and coaxially arranged with the first connector, which can shield the interference of external signals on the first connector and facilitate the signal transmission of the first connector. transmission, reducing crosstalk between different signals, improving the stability and integrity of signal transmission, thereby reducing the impedance fluctuation of the first connector, which is conducive to optimizing the impedance matching of the first connector and increasing the impedance matching of the first connector , reducing the fluctuation of the impedance of the first connecting piece, ultimately reducing signal reflection and improving signal transmission bandwidth, which is beneficial to signal interconnection between printed circuit board layers. This embodiment provides a complete reference path for the first connector through the connection between the second line, the second conductive layer, the second connector, the shielding sleeve, the first conductive layer, and the first line to ensure signal integrity. , to avoid the signal return path being incomplete or the signal return increasing the return path length across layers, thereby affecting the integrity of the signal return, making the printed circuit board suitable for high-frequency signals or other application scenarios that require signal return. Moreover, this embodiment utilizes the connection between the second connector and the shielding sleeve to realize signal return between the first conductive layer and the second conductive layer, and can be applied to the laminated printed circuit board process, giving full play to the advantages of the laminated circuit board. The advantages of the process enable printed circuit boards to be implemented on a large scale on HDI (High Density Interconnector) circuit boards.

Next, the impedance of the printed circuit board with the above structure of the present application will be tested through comparative simulation.

Comparative example structure: the first connecting member penetrates the printed circuit board, and the first connecting member is surrounded by six metallized holes that penetrate the printed circuit board.

Structure of the embodiment: the first connecting member penetrates the printed circuit board, and the shielding sleeve sleeves the first connecting member and is spaced apart and coaxially with the first connecting member. One end of the shielding sleeve is connected to 6 second connectors on the conductive layer adjacent to the surface, and the other end is connected to another 6 second connectors on the conductive layer adjacent to the surface to connect to the printed circuit board. opposite sides of.

The impedance of the above structure is determined using simulation software under the same environment.

Please refer to FIG. 4 , which is a schematic diagram of impedance comparison between the comparative example and the embodiment.

It can be seen from the figure that under the same situation, the matching impedance is 50ohm, the impedance of the comparative structure (upper curve) is 60.26ohm, and the impedance of the embodiment structure (lower curve) is 50.11ohm. It can be seen that the impedance matching of the structure of the embodiment of the present application Sex is very high.

Therefore, the printed circuit board of this embodiment can shield the interference of external signals on the first connector, facilitate signal transmission of the first connector, reduce crosstalk between different signals, improve the stability and integrity of signal transmission, thereby reducing The impedance fluctuation of the first connecting piece is conducive to the optimization of the impedance matching of the first connecting piece, increasing the impedance matching of the first connecting piece, reducing the fluctuation of the impedance of the first connecting piece, and ultimately reducing signal reflection and improving signal transmission bandwidth. , which is conducive to signal interconnection between printed circuit board layers.

The technical features of the above embodiments can be combined in any way. To simplify the description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, all possible combinations should be used. It is considered to be within the scope of this manual.

The above-described embodiments only express several implementation modes of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all fall within the protection scope of the present application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

A printed circuit board, wherein the printed circuit board includes:

first conductive layer;

a second conductive layer, the second conductive layer and the first conductive layer are stacked;

A first connection member, the first connection member is electrically connected to the first conductive layer and the second conductive layer;

A shielding sleeve is used to cover the first connecting piece. There is a gap between the shielding sleeve and the first connecting piece and they are arranged coaxially.
The printed circuit board according to claim 1, wherein

The first conductive layer and the second conductive layer are respectively provided on opposite side surfaces of the printed circuit board;

The first connecting member penetrates the printed circuit board to electrically connect the first conductive layer and the second conductive layer.
The printed circuit board according to claim 1, wherein the printed circuit board further includes:

a third conductive layer, the third conductive layer is adjacent to the first conductive layer and is electrically connected to each other;

a fourth conductive layer, the fourth conductive layer is adjacent to the second conductive layer and is electrically connected to each other;

The shielding sleeve is electrically connected to the third conductive layer and the fourth conductive layer.
The printed circuit board according to claim 3, wherein the printed circuit board further includes at least two second connectors;

Part of the second connecting member is electrically connected to the first conductive layer and the third conductive layer;

Another part of the second connecting member is electrically connected to the second conductive layer and the fourth conductive layer.
The printed circuit board according to claim 4, wherein

On the projection of the preset plane, some of the second connecting members and another part of the second connecting members are evenly arranged around the shielding sleeve.
The printed circuit board according to claim 1, wherein a first circuit is provided on the first conductive layer;

The first circuit includes a first surrounding member, a first intermediate connecting member and a first wiring member. The first surrounding member surrounds the first connecting member and is electrically connected to the first connecting member; One end of the first intermediate connector is electrically connected to the first surrounding member, and the other end of the first intermediate connector is electrically connected to the first wiring member.
The printed circuit board according to claim 1, wherein a second circuit is provided on the second conductive layer;

The second circuit includes a second surrounding member, a second intermediate connecting member and a second wiring member. The second surrounding member surrounds the first connecting member and is electrically connected to the first connecting member; One end of the second intermediate connector is electrically connected to the second surrounding member, and the other end of the second intermediate connector is electrically connected to the second wiring member.
The printed circuit board according to claim 6, wherein

On the projection of the preset plane, the first intermediate connector does not overlap with each conductive layer, the first wiring member overlaps with each conductive layer, and the width of the first intermediate connector is greater than that of the first trace. The width of the line piece.
The printed circuit board according to claim 7, wherein

On the projection of the preset plane, the second intermediate connector does not overlap with each conductive layer, and the second routing member overlaps with each conductive layer; the width of the second intermediate connector is greater than that of the third Second, the width of the wiring components.
The printed circuit board of claim 8, wherein the difference between the width of the first intermediate connection member and the width of the first wiring member is at least 0.05 mm.
The printed circuit board of claim 9, wherein the difference between the width of the second intermediate connection member and the width of the second wiring member is at least 0.05 mm.
The printed circuit board of claim 1, wherein the shielding sleeve has an inner diameter of at least 0.3 mm.
The printed circuit board of claim 1, wherein the outer diameter of the first connector is at least 0.1 mm, and the distance between the shielding sleeve and the first connector is at least 0.2 mm.
The printed circuit board according to claim 1, wherein the first conductive layer is provided on one side surface of the printed circuit board, and the second conductive layer is provided inside the printed circuit board;

The first connecting member partially penetrates the printed circuit board to electrically connect the first conductive layer and the second conductive layer.
The printed circuit board according to claim 1, wherein the second conductive layer is disposed on one side surface of the printed circuit board, and the first conductive layer is disposed inside the printed circuit board;

The first connecting member partially penetrates the printed circuit board to electrically connect the first conductive layer and the second conductive layer.
The printed circuit board according to claim 3, wherein the first conductive layer is a top conductive layer disposed on one side surface of the printed circuit board, and the second conductive layer is a top conductive layer disposed on one side surface of the printed circuit board. The underlying conductive layer on the other surface of the printed circuit board.
The printed circuit board according to claim 3, wherein the shielding sleeve is a buried hole.
The printed circuit board of claim 4, wherein the second connection member is a blind hole.
The printed circuit board according to claim 4, wherein

Each of the second connectors for electrically connecting the first conductive layer and the third conductive layer is separated from the shielding sleeve by a first set distance;

Each of the second connectors for electrically connecting the second conductive layer and the fourth conductive layer is spaced apart from the shielding sleeve by a second set distance.
The printed circuit board of claim 1, wherein an insulating layer is filled between the shielding sleeve and the first connector.