CN215912274U

CN215912274U - Circuit board with shielding hole

Info

Publication number: CN215912274U
Application number: CN202121439517.2U
Authority: CN
Inventors: 韩国荣; 彭军; 杨阳; 薛阳
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2022-02-25
Anticipated expiration: 2031-06-25

Abstract

The application provides a circuit board with shielding hole. The circuit board with the shielding hole comprises a circuit board main body, a first signal wire and a second signal wire; the circuit board main body is provided with a first side and a second side which are arranged in a back-to-back mode; the first signal line is arranged on the first side; the second signal line is arranged on the second side; the circuit board main body is provided with a signal hole for connecting a first signal wire and a second signal wire and a shielding hole surrounding at least part of the signal hole along the circumferential direction of the signal hole; the aperture structure of the shield aperture extends circumferentially around the periphery of the signal aperture. The circuit board with the shielding holes can effectively reduce signal leakage in the signal holes.

Description

Circuit board with shielding hole

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a circuit board with shielding holes.

Background

The circuit board is a provider of electrical connection of electronic components, and is generally provided with multiple layers of signal lines, and the multiple layers of signal lines are communicated with each other through signal holes.

Referring now to fig. 1, fig. 1 is a perspective view of a shielding hole and a signal hole of a circuit board in the prior art; specifically, in order to prevent signal leakage, a plurality of shielding holes 15 are often arranged around the signal hole 14 at intervals, so that the plurality of shielding holes 15 entirely surround the signal hole 14, and further, the signal is shielded; however, since the signal holes 14 need to be connected with the first signal line 12 and the second signal line 13 on the outer layer, in the process of disposing the shielding holes 15, generally 1-2 shielding holes 15 need to be disposed less to avoid the routing space of the first signal line 12 and the second signal line 13.

However, the spacing between the shielding holes 15 on the conventional circuit board cannot be made small, which results in serious signal leakage.

SUMMERY OF THE UTILITY MODEL

The application provides a circuit board with shielding hole, this circuit board with shielding hole can solve on the current circuit board the interval between each shielding hole can't be done for a short time, leads to the comparatively serious problem of signal leakage.

In order to solve the technical problem, the application adopts a technical scheme that: a circuit board having a shield hole is provided. The circuit board with the shielding hole comprises a circuit board main body, a first signal wire and a second signal wire; the circuit board main body is provided with a first side and a second side which are arranged in a back-to-back mode; the first signal line is arranged on the first side; the second signal line is arranged on the second side; the circuit board main body is provided with a signal hole for connecting a first signal wire and a second signal wire and a shielding hole surrounding at least part of the signal hole along the circumferential direction of the signal hole; the aperture structure of the shield aperture extends circumferentially around the periphery of the signal aperture.

The shielding holes are two in number and are respectively a first shielding hole and a second shielding hole which are connected with each other; the first shielding hole is positioned on the first side of the circuit board main body and is an arc-shaped slotted hole, and a wiring area of a first signal line is formed between the two arc-shaped ends of the arc-shaped slotted hole; the second shielding hole is positioned on the second side of the circuit board main body and is an arc-shaped slotted hole, and a wiring area of a second signal line is formed between the two arc-shaped ends of the arc-shaped slotted hole.

Wherein, circuit board main part includes: an inner laminate and at least one outer laminate; the inner layer plate is provided with a third shielding hole, and the third shielding hole penetrates through the inner layer plate; at least one outer laminate laminated with the inner laminate; the first shielding hole and/or the second shielding hole are/is formed in the outer layer plate and penetrate through the outer layer plate; the first shielding hole and the second shielding hole are connected through a third shielding hole;

the signal hole comprises a first hole section, a second hole section and a third hole section which are sequentially connected in the axial direction, the first hole section is surrounded by the first shielding hole, the second hole section is located in the third shielding hole, and the third hole section is surrounded by the second shielding hole.

And the inner side wall of the third shielding hole is provided with a conductive layer to form a closed shielding ring, a hole plugging medium is filled in the shielding ring, and the second hole section of the signal hole penetrates through the hole plugging medium.

Wherein, the plug hole medium is a prepreg.

The first shielding hole, the second shielding hole and/or the third shielding hole are/is coaxially arranged with the signal hole, and the aperture of the first shielding hole, the aperture of the second shielding hole and/or the aperture of the third shielding hole are/is the same.

The radian range of the first shielding hole and/or the second shielding hole circumferentially surrounding the signal hole is 270 degrees to 360 degrees.

Wherein, the thickness of the outer layer plate is 0.1 mm to 0.15 mm.

The first signal line and the second signal line are arranged oppositely along the radial direction of the signal hole.

The depth of the first shielding hole is larger than the thickness of the first signal line, and the depth of the first shielding hole is smaller than three times of the thickness of the first signal line; and/or the depth of the second shielding hole is larger than the thickness of the second signal line, and the depth of the second shielding hole is smaller than three times the thickness of the second signal line.

According to the circuit board with the shielding hole, the circuit board is provided with the circuit board main body, the first side of the circuit board main body is provided with the first signal line, and the second side of the circuit board main body is provided with the second signal line; a signal hole for connecting the first signal line and the second signal line is formed in the circuit board main body, so that the first signal line and the second signal line are interconnected through the signal hole; meanwhile, a shielding hole surrounding at least part of the signal hole along the circumferential direction of the signal hole is formed, so that signal leakage in the signal hole is prevented; the hole structure of the shielding hole extends in the peripheral circumferential direction of the signal hole, so that the shielding hole can seamlessly surround the signal hole at the corresponding position along the circumferential direction of the signal hole, the shielding effect of the shielding hole is effectively improved, and signal leakage in the signal hole is reduced.

Drawings

FIG. 1 is a perspective view of a prior art shielding hole and signal hole in a circuit board;

fig. 2a is a schematic overall structure diagram of a circuit board with a shielding hole according to an embodiment of the present application;

FIG. 2b is a top view of FIG. 2 a;

fig. 3 is a schematic structural diagram of a first shielding hole and a second shielding hole on a circuit board according to an embodiment of the present application;

fig. 4 is a cross-sectional view taken along a-a direction of a circuit board having a shielding hole corresponding to fig. 2b according to an embodiment of the present application;

fig. 5 is a cross-sectional view taken along line B-B of the circuit board with shielding holes in fig. 2B according to an embodiment of the present application;

FIG. 6 is a transverse cross-sectional view of the structure shown in FIG. 2a provided in accordance with an embodiment of the present application;

fig. 7 is a flowchart of a method for manufacturing a circuit board having a shielding hole according to an embodiment of the present application;

FIG. 8 is a sub-flowchart of step S11 of FIG. 7 according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a product after being processed in step S111 according to an embodiment of the present application;

fig. 10a is a schematic structural diagram of a product after being processed in step S112 according to an embodiment of the present application;

fig. 10b is a schematic structural diagram of a product after being processed in step S113 according to an embodiment of the present application;

FIG. 11 is a sub-flowchart of step S11 according to another embodiment of the present application;

fig. 12 is a schematic structural diagram of a product after being processed in step S21 according to an embodiment of the present application;

FIG. 13 is a schematic structural view of the inner plate after via filling processing according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of a product after being processed in step S22 according to an embodiment of the present application;

fig. 15 is a schematic structural diagram of a product after being processed in step S23 according to an embodiment of the present application;

fig. 16 is a schematic structural diagram of a product after being processed in step S24 according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The present application will be described in detail with reference to the accompanying drawings and examples.

Referring to fig. 2a and fig. 2b, fig. 2a is a schematic diagram of an overall structure of a circuit board with a shielding hole according to an embodiment of the present application; FIG. 2b is a top view of FIG. 2 a; in the present embodiment, there is provided a wiring board 10 having a shielding hole, the wiring board 10 including a wiring board main body 11, a first signal line 12, and a second signal line 13.

The circuit board main body 11 may be a core board, such as a copper clad laminate; the circuit board main body 11 is provided with a first side and a second side which are arranged in a reverse manner; the first signal line 12 is arranged on a first side of the circuit board main body 11, and the second signal line 13 is arranged on a second side of the circuit board main body 11; in a specific embodiment, the circuit board main body 11 is further provided with a signal hole 14, and the first signal line 12 and the second signal line 13 are communicated through the signal hole 14.

Specifically, the signal hole 14 may penetrate through the first side and the second side of the circuit board main body 11, a conductive layer is electroplated in the signal hole 14, and the two end ports of the signal hole 14 may be respectively provided with a pad, and the pad is connected with the conductive layer; in a specific implementation process, the first signal line 12 and the second signal line 13 are specifically connected with a pad arranged at a port of the signal hole 14, so as to connect the conductive layer in the signal hole 14 through the pad, and further communicate the first signal line 12 and the second signal line 13 through the conductive layer in the signal hole 14; the conductive layer may be a copper layer.

Further, in order to prevent the signal leakage in the signal hole 14, a shielding hole 15 may be further provided on the circuit board main body 11 to shield the signal in the signal hole 14; specifically, the shielding hole 15 penetrates through the first side and the second side of the circuit board main body 11, and surrounds at least part of the signal hole 14 along the circumferential direction of the signal hole 14; referring to fig. 2a and 2b, in order to effectively improve the shielding effect of the shielding hole 15 and reduce signal leakage in the signal hole 14, the hole structure of the shielding hole 15 may extend in the peripheral circumference of the signal hole 14, that is, the hole structure of the shielding hole 15 is a continuous arc structure arranged around the signal hole 14, so that the shielding hole 15 can surround the signal hole 14 at a corresponding position along the circumferential direction of the signal hole 14 without intermission, compared with the scheme in the prior art in which a plurality of shielding holes 15 are arranged at intervals along the circumferential direction of the signal hole 14, the problem that a signal in the signal hole 14 leaks from a gap between two shielding holes 15 can be effectively avoided, and then the shielding effect can be effectively improved and the signal leakage can be reduced.

In a specific embodiment, the shielding hole 15 may surround a portion of the signal hole 14 along the circumferential direction of the signal hole 14 at the hole section of the signal hole 14 corresponding to the routing area of the first signal line 12 and the second signal line 13, so as to avoid the routing area; it is understood that the arc corresponding to the shielding hole 15 is less than 360 degrees; however, to ensure the shielding effect, the radian can be further larger than 270 degrees; the signal hole 14 is different from other hole sections of the hole section corresponding to the routing area, and the shielding hole 15 can be arranged around the signal hole 14 in a circle along the circumferential direction of the signal hole 14 so as to enhance the shielding effect and prevent the signal leakage in other hole sections of the signal hole 14; it will be appreciated that the arc subtended by the length of the shield aperture 15 is 360 degrees.

In an embodiment, referring to fig. 3, fig. 3 is a perspective view of a circuit board with a shielding hole according to an embodiment of the present application; the number of the shielding holes 15 is two, and the shielding holes are respectively a first shielding hole 15a and a second shielding hole 15b which are connected with each other; the signal hole 14 comprises a first hole section 14a and a second hole section 14b which are axially connected in sequence; the first shielding hole 15a is located on the first side of the circuit board main body 11 and extends toward the second side, that is, the first shielding hole 15a extends from the first side of the circuit board main body 11 toward the second side to surround at least a first hole section 14a of the signal hole 14, the first shielding hole 15a is an arc-shaped slot, and a routing area of the first signal line 12 is formed between two arc-shaped ends of the arc-shaped slot; the second shielding hole 15b is located at the second side of the circuit board main body 11 and extends toward the first side, that is, the second shielding hole 15b extends from the second side of the circuit board main body 11 toward the first side to surround at least the second hole section 14b of the signal hole 14, and the second shielding hole 15b is an arc-shaped slot hole, and a routing area of the second signal line 13 is formed between two arc-shaped ends of the arc-shaped slot hole. The extending positions of the first shielding hole 15a and the second shielding hole 15b are not limited as long as the routing of the first signal line 12 and the second signal line 13 is not affected; in a specific embodiment, referring to fig. 3, a portion of the first shielding hole 15a may extend to a position near the second signal line 13, and a portion of the second shielding hole 15b may extend to a position near the first signal line 12; of course, in other embodiments, the first shielding hole 15a and the second shielding hole 15b may also extend to the positions contacting each other for the convenience of processing, that is, the first shielding hole 15a and the second shielding hole 15b stop extending continuously as long as the portion of the first shielding hole 15a is connected with the portion of the second shielding hole 15 b.

In another embodiment, refer to fig. 4 and 5, wherein fig. 4 is a sectional view of a-a direction of a circuit board having a shielding hole corresponding to fig. 2b provided in an embodiment of the present application; fig. 5 is a cross-sectional view taken along line B-B of the circuit board with shielding holes in fig. 2B according to an embodiment of the present application; the number of the shielding holes 15 is three, and the shielding holes are respectively a first shielding hole 15a, a second shielding hole 15b and a third shielding hole 15c which are connected with each other; the structures and functions of the first shielding hole 15a and the second shielding hole 15b may refer to the related descriptions of the first shielding hole 15a and the second shielding hole 15b in the embodiment corresponding to fig. 3, and are not described herein again; and the first shielding hole 15a and the second shielding hole 15b are connected through the third shielding hole 15 c; specifically, in this embodiment, the signal hole 14 includes a first hole section 14c, a second hole section 14d, and a third hole section 14e, which are axially connected in sequence, wherein the first hole section 14c of the signal hole 14 is surrounded by the first shielding hole 15a, the second hole section 14d is located in the third shielding hole 15c, and the third hole section 14e is surrounded by the second shielding hole 15 b.

Specifically, in this embodiment, referring to fig. 4, the wiring board main body 11 includes an inner layer board 11a and at least one outer layer board 11b laminated with the inner layer board 11 a; the third shielding hole 15c is formed in the inner plate 11a and penetrates through the first surface and the second surface of the inner plate 11 a; at least one outer laminate 11b is laminated on the first surface and/or the second surface of the inner laminate 11 a; in a specific embodiment, the number of the outer plates 11b is two, and two outer plates 11b are laminated on the first surface and the second surface of the inner plate 11a, respectively, and in the specific embodiment, the first shielding hole 15a is formed on one of the outer plates 11b, and the second shielding hole 15b is formed on the other outer plate 11 b. Specifically, the thickness of the outer laminate 11b may be 0.1 mm to 0.15 mm to facilitate laser machining of the first shielding hole 15a and the second shielding hole 15 b. Specifically, in this embodiment, a transverse cross-sectional view of the inner panel 11a can be seen in fig. 6, fig. 6 is a transverse cross-sectional view of the structure shown in fig. 2a provided in accordance with an embodiment of the present invention; it can be seen that the third shielding hole 15c has a closed ring shape, and the cross section thereof may be circular.

Conductive layers are arranged in the first shielding hole 15a, the second shielding hole 15b and the third shielding hole 15c so as to form shielding rings to shield signals in the signal hole 14; specifically, the conductive layer in the third shielding hole 15c forms a closed shielding ring, that is, the third shielding hole 15c forms a closed loop along the circumferential direction of the signal hole 14, so as to shield the signal of the second hole section 14d of the signal hole 14 in all directions in the circumferential direction of the signal hole 14, thereby preventing the signal of the second hole section 14d of the signal hole 14 from leaking, and further effectively improving the shielding effect. Of course, in other embodiments, the third shielding hole 15c may also be an arc-shaped slot, which is not limited in this application. The conductive layer may be a copper layer.

Referring to fig. 4 or 5, the third shielding hole 15c is further filled with a plug medium 16, and the signal hole 14 penetrates through the plug medium 16; wherein the dielectric constant of the plug dielectric 16 may range from 2 to 4, such as 3.6; the plug dielectric 16 may be a low loss material with a loss value not exceeding 0.005, such as a prepreg or a resin.

Specifically, in order to improve the uniformity of the signal shielding effect of the shielding hole 15 on the signal hole 14 along the circumferential direction of the signal hole 14, the signal quality is improved; the first shielding hole 15a, the second shielding hole 15b and/or the third shielding hole 15c may be arranged coaxially with the signal hole 14, that is, the central axis of the cylinder in which the first shielding hole 15a, the second shielding hole 15b and/or the third shielding hole 15c is located coincides with the central axis of the signal hole 14.

In a specific embodiment, the first shielding holes 15a, the second shielding holes 15b and/or the third shielding holes 15c may be circular holes, and the apertures R of the first shielding holes 15a, the second shielding holes 15b and/or the third shielding holes 15c are the same to facilitate the interconnection between the adjacent shielding holes 15; referring to fig. 2b, it should be noted that, when the first shielding hole 15a, the second shielding hole 15b and/or the third shielding hole 15c are arc-shaped slots, the respective corresponding aperture R refers to the diameter of the circle corresponding to the hole edge.

Specifically, the depth of the first shielding hole 15a may be slightly greater than the thickness of the first signal line 12, and/or the depth of the second shielding hole 15b may be slightly greater than the thickness of the second signal line 13; specifically, the depth of the first shielding hole 15a is greater than the thickness of the first signal line 12, and the depth of the first shielding hole 15a may be less than three times the thickness of the first signal line 12; and/or the depth of the second shielding hole 15b is greater than the thickness of the second signal line 13, and the depth of the second shielding hole 15b is less than three times the thickness of the second signal line 13; the depth of the third shielding hole 15c is increased as much as possible while the signal line and the shielding hole 15 are not short-circuited, so that the shielding effect of the shielding hole 15 is effectively enhanced, and signal leakage is reduced. The thickness of the signal line specifically refers to the dimension of the signal line along the length direction of the signal hole 14; the depth of the shield hole refers specifically to the dimension of the shield hole along the length of the signal hole 14.

Specifically, the arc-shaped slot holes such as the first shielding hole 15a and the second shielding hole 15b circumferentially surround the signal hole 14 in an arc range of 270 degrees to 360 degrees, so as to ensure that the arc-shaped slot holes surround the signal hole 14 in a wide range along the circumferential direction of the signal hole 14 as far as possible while the first signal line 12 or the second signal line 13 is normally routed, thereby improving the shielding effect of the shielding hole 15 and reducing the signal leakage in the signal hole 14.

In the circuit board 10 with a shielding hole provided in this embodiment, by providing the circuit board main body 11, the first signal line 12 is provided on the first side of the circuit board main body 11, and the second signal line 13 is provided on the second side of the circuit board main body 11; a signal hole 14 for connecting the first signal line 12 and the second signal line 13 is formed in the circuit board main body 11, so that the first signal line 12 and the second signal line 13 are interconnected through the signal hole 14; meanwhile, by opening a shielding hole 15 surrounding at least a part of the signal hole 14 in the circumferential direction of the signal hole 14, signal leakage in the signal hole 14 is prevented; the hole structure of the shielding hole 15 extends in the peripheral circumferential direction of the signal hole 14, so that the shielding hole 15 can surround the signal hole 14 at the corresponding position along the circumferential direction of the signal hole 14 without a gap, the shielding effect of the shielding hole 15 is effectively improved, and signal leakage in the signal hole 14 is reduced.

Referring to fig. 7, fig. 7 is a flowchart illustrating a method for manufacturing a circuit board with a shielding hole according to an embodiment of the present application; in this embodiment, a method for manufacturing a circuit board having a shielding hole is provided, where the method includes:

step S11: a signal hole and a shielding hole surrounding at least part of the signal hole along the circumferential direction of the signal hole are formed in the circuit board main body.

Wherein, the pore structure of shielding hole 15 extends in signal hole 14's peripheral circumference, shielding hole 15's pore structure is the continuous arc structure that encircles signal hole 14 and set up promptly, thereby make shielding hole 15 can follow signal hole 14's the non-intermittent signal hole 14 that surrounds relevant position department of the circumferential direction of signal hole 14, compare in prior art, with the scheme that a plurality of shielding holes 15 set up along signal hole 14's circumferential direction interval, the problem that the signal in the signal hole 14 was revealed from the gap between two shielding holes 15 takes place effectively, and then can effectively improve shielding effect, reduce signal leakage.

The circuit board main body 11 may be a core board, such as a copper clad laminate; the circuit board body 11 has a first side and a second side that are opposite to each other.

In a specific implementation, referring to fig. 8, fig. 8 is a sub-flowchart of step S11 in fig. 7 according to an embodiment of the present application; step S11 specifically includes:

step S111: a first shielding hole is formed in the first side of the circuit board main body.

Specifically, the structure of the circuit board main body 11 after being processed in step S111 can be specifically referred to fig. 9, and fig. 9 is a schematic structural diagram of a product after being processed in step S111 according to an embodiment of the present application; wherein, the first shielding hole 15a is an arc-shaped slot; specifically, a laser drilling method may be adopted to form a continuous arc-shaped slot on the first side of the circuit board main body 11, and a conductive layer is formed in the arc-shaped slot to form a first shielding hole 15 a; specifically, a conductive layer can be formed in the arc-shaped slot hole by adopting an electroplating mode. Of course, in other embodiments, the first side of the circuit board main body 11 may also be provided with an arc-shaped slot by mechanical drilling, which is not limited in this application.

Step S112: and a second shielding hole is formed in the second side of the circuit board main body.

Specifically, the structure of the circuit board main body 11 after being processed in step S112 can specifically refer to fig. 10a, and fig. 10a is a schematic structural diagram of a product after being processed in step S112 according to an embodiment of the present application; wherein, the second shielding hole 15b is an arc-shaped slot; the specific processing manner of the second shielding hole 15b can refer to the processing manner of the first shielding hole 15a, and the same or similar technical effects can be achieved, and no further description is provided herein.

Specifically, the radian of the arc-shaped slot can be set according to the width of the first signal line 12 or the second signal line 13 processed in the later stage, as long as the routing area of the first signal line 12 and the second signal line 13 can be avoided; in a preferred embodiment, the arc range of the arc slot may be 270 degrees to 360 degrees, excluding 360 degrees; so as to effectively ensure the shielding effect of the first shielding hole 15a on the processed signal hole 14 while preventing the first shielding hole 15a from being short-circuited with the first signal line 12 or the second signal line 13.

Step S113: and the circuit board main body is provided with a signal hole which penetrates through the first side and the second side.

Specifically, the structure of the circuit board main body 11 after being processed in step S113 can specifically refer to fig. 10b, and fig. 10b is a schematic structural diagram of a product after being processed in step S113 according to an embodiment of the present application; specifically, a through hole may be formed in the circuit board main body 11 by laser drilling or mechanical drilling, and then a conductive layer is formed on at least an inner sidewall of the through hole to form the signal hole 14; specifically, the conductive layer can be formed in the through hole by electroplating or copper deposition.

Of course, in other specific embodiments, step S113 may also be performed before step S111 or step S112, and the sequence of step S111 to step S113 is not limited in this application.

In another embodiment, the circuit board body 11 may specifically include an inner board 11a and an outer board 11b which are stacked; wherein, the inner layer board 11a and the outer layer board 11b can be core board layers, such as copper clad laminate; referring to fig. 11, fig. 11 is a sub-flowchart of step S11 according to another embodiment of the present application; step S11 specifically includes:

step S21: a first shielding hole is formed in the inner layer plate.

Specifically, the structure of the inner layer board 11a after being processed in step S21 can be specifically seen in fig. 12, and fig. 12 is a schematic structural view of a product after being processed in step S21 according to an embodiment of the present disclosure; specifically, a through hole may be formed in the inner layer plate 11a by laser drilling or mechanical drilling, and then a conductive layer is formed on the inner side wall of the through hole to form a closed shielding ring, thereby forming a closed first shielding hole 21; it is understood that, in this embodiment, the first shielding hole 21 has a circular shape; the first shielding hole 21 in this embodiment corresponds to the third shielding hole 15c in the structural embodiment described above with respect to the wiring board 10 having the shielding holes.

In specific implementation, referring to fig. 13, fig. 13 is a schematic structural diagram of an inner plate after a hole plugging process according to an embodiment of the present application; after step S21, a plugging process is performed on the first shielding hole 21 by using the plugging medium 16; the structure of the product after the treatment of this step can be seen in fig. 13; the plug dielectric 16 may be a prepreg.

Step S22: an outer laminate is laminated on the inner laminate to form a wiring board main body.

Specifically, the structure of the circuit board main body 11 after being processed in step S22 can be specifically seen in fig. 14, and fig. 14 is a schematic structural diagram of a product after being processed in step S22 according to an embodiment of the present disclosure; the first outer laminate 11b may be laminated on a first side of the inner laminate 11a, and the second outer laminate 11b may be laminated on a second side of the inner laminate 11a to form the wiring board body 11.

Step S23: and a second shielding hole is formed in the outer layer plate.

Specifically, the structure of the circuit board main body 11 after being processed in step S23 can be specifically seen in fig. 15, and fig. 15 is a schematic structural diagram of a product after being processed in step S23 according to an embodiment of the present disclosure; specifically, an arc-shaped slot hole can be formed in the outer layer plate 11b by laser drilling, and a conductive layer is formed in the arc-shaped slot hole to form the second shielding hole 22; wherein the conductive layer in the second shielding via 22 is connected to the conductive layer in the first shielding via 21. The specific structure of the arc-shaped slot can be referred to the above description, and is not described herein again.

In one embodiment, when the inner ply 11a is laminated on a first side with a first outer ply 11b and on a second side with a second outer ply 11 b; step S23 specifically includes forming a second shielding hole 22 on the first outer layer plate 11b, and forming a second shielding hole 22 on the second outer layer plate 11b, and the specific structure can be seen in fig. 15; it is to be understood that the two second shielding holes 22 correspond to the first shielding hole 15a and the second shielding hole 15b in the structural embodiment described above with respect to the wiring board 10 having the shielding holes.

Step S24: a signal hole is formed in the circuit board main body.

Specifically, the structure of the circuit board main body 11 after being processed in step S24 can be specifically seen in fig. 16, and fig. 16 is a schematic structural diagram of a product after being processed in step S24 according to an embodiment of the present disclosure; forming a through hole on the circuit board main body 11 by adopting a laser drilling or mechanical drilling mode, and then forming a conductive layer in the through hole by adopting an electroplating or copper deposition processing mode to form a signal hole 14; wherein the signal hole 14 passes through the first shielding hole 21 and is surrounded by the second shielding hole 22.

Step S12: a first signal line and a second signal line connected to the signal hole are formed on the first side and the second side of the circuit board main body, respectively.

Specifically, the first signal line 12 and the second signal line 13 are respectively disposed at positions of the signal hole 14 where the shielding hole 15 is not disposed, and the specific arrangement manner can refer to the prior art, and can achieve the same or similar technical effects, which is not described herein again; specifically, the product structure after the processing of step S12 can be specifically seen in fig. 2 a.

Of course, in other embodiments, step S12 may be performed after step S22 and before step S23; or after the hole plugging treatment, a through hole is firstly formed on the hole plugging medium 16 and electroplating is carried out to form a second hole section 14d of the signal hole 14; then, after laminating the outer laminate 11b, a first hole section 14c and a third hole section 14e are formed, respectively; the order of forming the signal holes 14 is not limited in this application.

In the method for manufacturing the circuit board 10 with the shielding hole provided in this embodiment, the signal hole 14 and the shielding hole 15 surrounding at least part of the signal hole 14 along the circumferential direction of the signal hole 14 are formed in the circuit board main body 11; then, a first signal line 12 and a second signal line 13 connected to a signal hole 14 are formed on the first side and the second side of the wiring board main body 11, respectively; therefore, the first signal wire 12 and the second signal wire 13 can be connected with each other, and the hole structure of the shielding hole 15 extends in the peripheral circumferential direction of the signal hole 14, so that the shielding hole 15 can surround the signal hole 14 at the corresponding position along the circumferential direction of the signal hole 14 without a gap, the shielding effect of the shielding hole 15 is effectively improved, and the signal leakage in the signal hole 14 is reduced.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.

Claims

1. A wiring board having a shielding hole, comprising:

the circuit board comprises a circuit board main body, a first side and a second side, wherein the first side and the second side are arranged in a back-to-back manner;

a first signal line disposed at the first side;

the second signal wire is arranged on the second side;

the circuit board main body is provided with a signal hole for connecting the first signal wire and the second signal wire and a shielding hole surrounding at least part of the signal hole along the circumferential direction of the signal hole; the aperture structure of the shield aperture extends circumferentially around the periphery of the signal aperture.

2. The wiring board with shielding holes according to claim 1, wherein the number of the shielding holes is two, and the shielding holes are respectively a first shielding hole and a second shielding hole which are connected with each other; the first shielding hole is positioned on the first side of the circuit board main body and is an arc-shaped slotted hole, and a wiring area of the first signal line is formed between the two arc-shaped ends of the arc-shaped slotted hole; the second shielding hole is positioned on the second side of the circuit board main body and is an arc-shaped slotted hole, and a wiring area of the second signal line is formed between the two arc-shaped ends of the arc-shaped slotted hole.

3. The wiring board with a shielding hole according to claim 2, wherein the wiring board main body comprises:

the inner-layer plate is provided with a third shielding hole, and the third shielding hole penetrates through the inner-layer plate;

at least one outer laminate laminated with the inner laminate; the first shielding hole and/or the second shielding hole are/is formed in the outer plate and penetrate through the outer plate; the first shielding hole and the second shielding hole are connected through the third shielding hole;

4. The circuit board with shielding holes according to claim 3, wherein the inner side wall of the third shielding hole is provided with a conductive layer to form a closed shielding ring, the shielding ring is filled with a plug hole medium, and the second hole section of the signal hole penetrates through the plug hole medium.

5. The wiring board with shielding holes according to claim 4, wherein the plug hole medium is a prepreg.

6. The wiring board with shielding holes according to claim 3, wherein the first shielding hole, the second shielding hole and/or the third shielding hole are/is arranged coaxially with the signal hole, and the first shielding hole, the second shielding hole and/or the third shielding hole have the same diameter.

7. The wiring board with shielding holes according to claim 3, wherein the radian range of the first shielding hole and/or the second shielding hole circumferentially surrounding the signal hole is 270 degrees to 360 degrees.

8. The wiring board with shielding holes of claim 3, wherein the thickness of the outer layer board is 0.1 mm to 0.15 mm.

9. The wiring board with a shielding hole according to claim 3, wherein the first signal line and the second signal line are disposed opposite to each other in a radial direction of the signal hole.

10. The wiring board with shielding holes of claim 3, wherein the depth of the first shielding hole is greater than the thickness of the first signal line, and the depth of the first shielding hole is less than three times the thickness of the first signal line; and/or the depth of the second shielding hole is larger than the thickness of the second signal line, and the depth of the second shielding hole is smaller than three times the thickness of the second signal line.