DE102004036890A1 - Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted - Google Patents

Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted

Info

Publication number
DE102004036890A1
DE102004036890A1 DE200410036890 DE102004036890A DE102004036890A1 DE 102004036890 A1 DE102004036890 A1 DE 102004036890A1 DE 200410036890 DE200410036890 DE 200410036890 DE 102004036890 A DE102004036890 A DE 102004036890A DE 102004036890 A1 DE102004036890 A1 DE 102004036890A1
Authority
DE
Germany
Prior art keywords
circuit board
hole
printed circuit
signal
filling material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200410036890
Other languages
German (de)
Inventor
Roland Dipl.-Ing. Schönholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuerth Elektronik Rot Am See & Co KG GmbH
WUERTH ELEKTRONIK ROT AM SEE G
Original Assignee
Wuerth Elektronik Rot Am See & Co KG GmbH
WUERTH ELEKTRONIK ROT AM SEE G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuerth Elektronik Rot Am See & Co KG GmbH, WUERTH ELEKTRONIK ROT AM SEE G filed Critical Wuerth Elektronik Rot Am See & Co KG GmbH
Priority to DE200410036890 priority Critical patent/DE102004036890A1/en
Publication of DE102004036890A1 publication Critical patent/DE102004036890A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/096Vertically aligned vias, holes or stacked vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809Coaxial layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Abstract

The circuit board device has an inner circuit board (1) in which a screening hole (2) is provided which is surrounded by a metal sleeve (3) and filled with a filling material (7). A signal hole is arranged in the filling material within the screening hole and is through-contacted. An independent claim is included for a method of manufacturing a circuit board.

Description

  • The The invention is based on a printed circuit board into which a signal is introduced should.
  • at Multilayer printed circuit boards are often required in different ways Layers to introduce a high-frequency signal. In the previously known ways For example, here's a jump in impedance, depending on the level to which the signal is to be introduced.
  • in the Prior art will be bores that have a certain value of Impedance must have or by a high-frequency signal is passed through a variety of geometrically arranged Abschirmbohrungen to the reference position coupled. This type of coupling or shielding is inaccurate and only conditionally to simulate.
  • Of the Invention is based on the object, a circuit board assembly or a printed circuit board and / or a method for producing a To create a circuit board where it is possible to send a signal in one to introduce constant shielding.
  • to solution this task strikes The invention relates to a printed circuit board arrangement or a printed circuit board with the features of claim 1 and / or a method with the in claim 5 mentioned features. Further developments of the invention are the subject of dependent claims.
  • The PCB contains So where a signal is introduced is to be nested, an outer serving the shielding Bore and an inner the signal guide hole. Both Holes are defined by their metallization. Between the the shield hole surrounding metal sleeve and the signal hole is a filler present, which is selected according to the purpose. Through the variations the bore diameter and the selection of the filler material of the shield hole let yourself the exact desired Impedance value of the signal-carrying Make a hole.
  • These Type of coaxial bore system provides completely new possibilities, high-frequency signals to lead in a circuit board.
  • Especially It makes sense if the signal hole coaxial with the metal sleeve of the Shielding hole is arranged.
  • In Further development of the invention can be provided that the inside lying PCB on both sides with at least one other layer is pressed, preferably made of an insulating layer and a conductive Layer is built up.
  • The Printed circuit board with the signal routing becomes like this produced. At the beginning is a double-sided or multilayer printed circuit board produced by sequential crimping the internal structure of a multilayer and hereinafter referred to as internal Printed circuit board is called.
  • In this internal circuit board is at least one shield hole with a larger diameter drilled. The bore wall is then metallized. Subsequently, will the hole with the filler filled, for example, a paint system. This filler then hardens out. Subsequently, will the surface of the internal multilayer planarized and structured. there the PCB layout is created.
  • Then you can in a further sequence on the inside PCB on both sides at least Another layer will be pressed, made of insulating material and a conductive Layer is built up.
  • In the now inside holes of the multilayer are now drilled in the smaller diameter signal leading holes. Subsequently they are metallized. This creates the coaxial system from shield hole and signal leading conductor.
  • Further Features, Details and Benefits The invention results from the claims and abstract, their wording by reference to the content of the description is made, the following description of a preferred embodiment the invention and with reference to the drawing. Hereby show:
  • 1 a section through a printed circuit board with a shield hole and a signal-carrying bore;
  • 2 schematically a perspective view of the arrangement, in section in 1 is shown.
  • 3 one of the 1 corresponding representation in a printed circuit board assembly with two sequences;
  • 4 one of the 3 corresponding representation in a further embodiment;
  • 5 a still further embodiment.
  • The sectional view of the 1 , which is laid through a printed circuit board assembly, shows in the middle a multilayer printed circuit board 1 , Through this multilayer PCB 1 is a hole 2 passed through, the wall then with a metallization 3 is provided. As a result, a sleeve is formed, which lines the bore wall. After metallization to form the sleeve, the bore is filled with a filler material 7 filled, for example, a paint layer, which then hardens. With both sides of the multilayer board is then another layer 4 pressed, on its multilayer printed circuit board side facing a metallic layer 5 and further out, an insulating layer 6 having. The metallic layer 5 connects itself with the metallization of the bore wall of the bore 2 ,
  • Subsequently, coaxial with the bore 2 that is now through the filler material 7 is filled, another smaller in diameter bore 8th introduced, the bore wall is then also metallized. With at the ends of the metallic sleeve formed thereby 9 is in each case a conductor track 10 connected. The cut of the 1 shows this metallic sleeve 9 in side view, 2 in partially cut representation.
  • What in 1 for a single hole has been described, of course, applies to a variety of holes in the circuit board 1 can be arranged. 2 shows one of these coaxial holes in partial section, the other in partial view. On both sides of the middle PCB 1 and the two outer layers 4 The current unit is signal lines 10 present with the metallic sleeve 9 the signal leading bore 8th are connected.
  • The 3 shows an arrangement in which two circuit boards, as shown in 1 are shown, with the interposition of a prepreg 11 are pressed sequentially. This allows using the through holes from the outer signal leading web 10 a signal to the internal signal routing 10 be coupled. The two in 3 Coaxial holes to be seen are through the prepreg 11 separated from each other.
  • 4 shows an arrangement in which a coaxial bore passes completely through the two sequences. This will cause the injected signal to the signal path 10 coupled in the middle of the array, which is common to both sequences. This results in an "offset stripline" system.
  • 5 now shows an arrangement where centrally two signal paths 10 are present through a prepreg 11 are separated from each other. Through the through hole, the signal is thus coupled into both sequences. This results in a "Broadside Stripline" system.

Claims (7)

  1. Circuit board arrangement with signal routing, with 1.1 an internal circuit board ( 1 ), 1.2 one in the circuit board ( 1 ) arranged shielding hole ( 2 ), the 1.2.1 of a metallic sleeve ( 3 ) and 1.2.2 with filling material ( 7 ) is filled, as well as 1.3 a signal hole ( 8th ), 1.3.1 in the filling material ( 7 ) within the shield hole ( 2 ) is arranged and 1.3.2 plated through.
  2. Printed circuit board arrangement according to Claim 1, in which the signal bore ( 8th ) coaxial with the metal sleeve ( 3 ) of the shield hole ( 2 ) is arranged.
  3. Printed circuit board arrangement according to Claim 1 or 2, in which the internal printed circuit board ( 1 ) on both sides with at least one further layer ( 4 ) made of an insulating (6) and a conductive layer ( 5 ) is constructed.
  4. Printed circuit board assembly according to one of the preceding Claims, in which the holes have a circular cross-section.
  5. Method for producing a printed circuit board ( 1 ) with the following process steps: 5.1 in a printed circuit board ( 1 ) becomes a hole ( 2 ), 5.2 the hole wall of the hole ( 2 ) is metallized, 5.3 in the interior of the bore ( 2 ) a filling material ( 7 ), 5.4 in the filling material ( 7 ) becomes a hole ( 8th ), 5.5 the hole ( 8th ) is metallized.
  6. Method according to Claim 5, in which the inner hole ( 8th ) coaxial with the metallized wall of the outer hole ( 2 ) is drilled.
  7. Method according to Claim 5 or 6, in which the circuit board ( 1 ) on both sides with another layer ( 4 ) from a conductive layer ( 5 ) and an insulating layer ( 6 ) is pressed.
DE200410036890 2004-07-19 2004-07-19 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted Withdrawn DE102004036890A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200410036890 DE102004036890A1 (en) 2004-07-19 2004-07-19 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410036890 DE102004036890A1 (en) 2004-07-19 2004-07-19 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted

Publications (1)

Publication Number Publication Date
DE102004036890A1 true DE102004036890A1 (en) 2006-02-16

Family

ID=35668654

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410036890 Withdrawn DE102004036890A1 (en) 2004-07-19 2004-07-19 Circuit board device, such as multilayer circuit board for high-frequency signals, has signal hole arranged in filling material within screening hole and through-contacted

Country Status (1)

Country Link
DE (1) DE102004036890A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1945010A2 (en) 2007-01-11 2008-07-16 Samsung Electronics Co., Ltd. Multi-layer substrate and electronic device having the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239385B1 (en) * 1998-02-27 2001-05-29 Agilent Technologies, Inc. Surface mountable coaxial solder interconnect and method
US6249242B1 (en) * 1998-08-07 2001-06-19 Hitachi, Ltd. High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system
EP1307078A2 (en) * 2001-10-25 2003-05-02 Hitachi, Ltd. High frequency circuit module
DE10305855A1 (en) * 2003-02-13 2004-08-26 Robert Bosch Gmbh RF multilayer board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239385B1 (en) * 1998-02-27 2001-05-29 Agilent Technologies, Inc. Surface mountable coaxial solder interconnect and method
US6249242B1 (en) * 1998-08-07 2001-06-19 Hitachi, Ltd. High-frequency transmitter-receiver apparatus for such an application as vehicle-onboard radar system
EP1307078A2 (en) * 2001-10-25 2003-05-02 Hitachi, Ltd. High frequency circuit module
DE10305855A1 (en) * 2003-02-13 2004-08-26 Robert Bosch Gmbh RF multilayer board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1945010A2 (en) 2007-01-11 2008-07-16 Samsung Electronics Co., Ltd. Multi-layer substrate and electronic device having the same
EP1945010A3 (en) * 2007-01-11 2009-08-26 Samsung Electronics Co., Ltd. Multi-layer substrate and electronic device having the same
EP2464202A1 (en) * 2007-01-11 2012-06-13 Samsung Electronics Co., Ltd. Multi-Layer Substrate and Electronic Device Having the Same
CN101222824B (en) * 2007-01-11 2012-06-27 三星电子株式会社 Multi-layer substrate and electronic device having the same
US8502085B2 (en) 2007-01-11 2013-08-06 Samsung Electronics Co., Ltd. Multi-layer substrate with a via hole and electronic device having the same
KR101335987B1 (en) 2007-01-11 2013-12-04 삼성전자주식회사 Multi-layer substrate

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