WO2023197497A1 - 一种双色cob光源 - Google Patents

一种双色cob光源 Download PDF

Info

Publication number
WO2023197497A1
WO2023197497A1 PCT/CN2022/114192 CN2022114192W WO2023197497A1 WO 2023197497 A1 WO2023197497 A1 WO 2023197497A1 CN 2022114192 W CN2022114192 W CN 2022114192W WO 2023197497 A1 WO2023197497 A1 WO 2023197497A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
chipset
electrode pad
negative electrode
warm
Prior art date
Application number
PCT/CN2022/114192
Other languages
English (en)
French (fr)
Inventor
曾虹源
Original Assignee
江门市莱可半导体科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江门市莱可半导体科技有限公司 filed Critical 江门市莱可半导体科技有限公司
Publication of WO2023197497A1 publication Critical patent/WO2023197497A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Definitions

  • the invention relates to the field of intelligent lighting technology, and in particular to a two-color COB light source.
  • COB Chip on Board
  • COB light source usually includes a substrate, which is provided with a light-emitting area, a cold light positive electrode pad, a cold light negative electrode pad, a warm light positive electrode pad, a warm light negative electrode pad and a conductive circuit etc.; COB light sources are widely used due to their long life, no pollution, and high light efficiency.
  • existing COB light sources generally can only use the formal packaging process.
  • the wiring method will cause gold wires to cross to varying degrees during bonding.
  • dual-color temperature COB products use the formal packaging process.
  • the inability to achieve regular arrangement makes it impossible to achieve uniform color mixing when applying optical devices.
  • the flip-chip method can solve the problem of uniform light mixing, it will cause the problem of low luminous efficiency.
  • the technical problem to be solved by the present invention is to provide a two-color COB light source to solve the above-mentioned defects of the existing technology, so as to solve the problems of existing COB light sources such as line crossing, inability to achieve regular arrangement, uneven color mixing and low luminous efficiency. and other technical problems, through a unique circuit layout, the flip-chip circuit is applied to the formal installation, and the formal installation effect is achieved, so that the formal substrate has both the flip-chip circuit design and the characteristics of the light extraction efficiency of the formal installation, and at the same time can achieve two-color
  • the luminous effect is that the lines are arranged in a regular manner and can avoid crossing lines. The light effect is greatly improved, the luminous efficiency is high, and it can save space and reduce manufacturing costs.
  • the technical solution of the present invention is:
  • a two-color COB light source including a substrate, which is provided with a power supply positive electrode pad, a plurality of sequentially connected warm light chipsets, a plurality of sequentially connected cold light chipsets, and a plurality of negative electrode pads, the warm light chips
  • the group and the cold light chipset are electrically connected to the positive electrode pad and the negative electrode pad of the power supply respectively, and the power supply positive electrode pad and the negative electrode pad are arranged around the warm light chipset and the cold light chipset in sequence.
  • the negative electrode pads include several warm light negative electrode pads and several cold light negative electrode pads, and the warm light chipset is electrically connected to the power supply positive electrode pad and the warm light negative electrode pad respectively, and the The luminescent chipset is electrically connected to the power supply positive electrode pad and the luminescent negative electrode pad respectively.
  • the negative electrode pad further includes a main warm light negative electrode pad and a main cold light negative electrode pad, and the main warm light negative electrode pad and the main cold light negative electrode pad are respectively welded to the warm light negative electrode pad and the cold light negative electrode pad.
  • the disk is electrically connected.
  • the warm-light negative electrode pads and the cold-light negative electrode pads are arranged in a cross distribution in sequence; the power supply positive electrode pad, the warm-light negative electrode pad and the cold-light negative electrode pads are all arranged along the edge of the circle on the The periphery of the warm light chipset and the cold light chipset.
  • the substrate is arranged in a square shape, and each of the warm light chipsets and the cold light chipsets are arranged alternately in sequence.
  • a warm light chip is welded to the warm light chipset, and a cold light chip is welded to the cold light chipset.
  • the warm light chipset includes a first warm light chipset, a second warm light chipset, a third warm light chipset, a fourth warm light chipset, a fifth warm light chipset, and a sixth warm light chip. group, the first warm light chipset, the second warm light chipset, the third warm light chipset, the fourth warm light chipset, the fifth warm light chipset and the sixth warm light chipset are all related to the warm light chipset. Photocathode pad connection.
  • the luminescent chips include a first luminescent chipset, a second luminescent chipset, a third luminescent chipset, a fourth luminescent chipset, a fifth luminescent chipset and a sixth luminescent chipset.
  • the first luminescent chip The second luminescent chipset, the third luminescent chipset, the fourth luminescent chipset, the fifth luminescent chipset and the sixth luminescent chipset are all connected to the luminescent negative electrode pad.
  • the power supply positive electrode pad is located at the upper left corner of the substrate, and the main warm light negative electrode pad and the main cold light negative electrode pad are both located at the lower right corner of the substrate.
  • the main warm light negative electrode pad and the main cold light negative electrode pad are arranged symmetrically with each other with the diagonal line of the substrate as the symmetry axis.
  • the invention provides a two-color COB light source, which has the following beneficial effects: the warm light chipset and the cold light chipset in the two-color COB light source are electrically connected to the positive electrode pad and the negative electrode pad of the power supply respectively.
  • the positive electrode pad and the negative electrode pad are arranged around the warm light chipset and the cold light chipset in sequence.
  • the positive electrode pad and the negative electrode pad of the power supply are arranged around the warm light chipset and the cold light chipset in order, realizing the
  • the flip-chip circuit is applied to the formal installation and achieves the formal installation effect, so that the formal substrate has both the flip-chip circuit design and the light emission efficiency characteristics of the formal installation.
  • it can achieve a two-color luminous effect, and its circuit arrangement is regular and can By avoiding line crossing, the light efficiency is greatly improved, the luminous efficiency is high, and it can save space and reduce manufacturing costs.
  • Figure 1 is a schematic structural diagram of the present invention
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as “first” and “second” may explicitly or implicitly include at least one of these features.
  • “plurality” means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.
  • the two-color COB light source includes a substrate 1.
  • the substrate 1 is provided with a power supply positive electrode pad 2, a number of warm light chipsets connected in sequence, and a number of cold light chips connected in sequence. chipset and several negative electrode pads.
  • the warm light chipset and the cold light chipset are electrically connected to the positive electrode pad 2 and the negative electrode pad of the power supply respectively.
  • the positive electrode pad 2 and the negative electrode pad of the power supply surround the warm electrode in turn.
  • Optical chipset and luminescent chipset settings It can be understood that the substrate 1 is arranged in a square shape, and the cross-section of the substrate 1 is square or rectangular.
  • the power supply positive electrode pad 2, warm light chipset, cold light chipset and negative electrode pad are all welded to the substrate. 1 can be used to connect to an external power supply.
  • the substrate 1 can be a general PCB circuit board, etc., or a general aluminum substrate or copper substrate, etc.
  • the negative electrode pad includes several warm light negative electrode pads 3 and several cold light negative electrode pads 4.
  • the warm light chipset is electrically connected to the power supply positive electrode pad 2 and the warm light negative electrode pad 3 respectively.
  • the cold light chipset is electrically connected to the power supply positive electrode pad 2 and the cold light negative electrode pad 4 respectively;
  • the negative electrode pad also includes a main warm light negative electrode pad 5 and a main cold light negative electrode pad 6.
  • the main warm light negative electrode pad 5 And the main cold light negative electrode pad 6 is electrically connected to the warm light negative electrode pad 3 and the cold light negative electrode pad 4 respectively; the warm light negative electrode pad 3 and the cold light negative electrode pad 4 are arranged in a cross distribution in sequence; the power supply positive electrode pad 2.
  • the warm-light negative electrode pad 3 and the cold-light negative electrode pad 4 are distributed along the circular edge and arranged on the periphery of the warm-light chipset and the cold-light chipset; the substrate 1 is arranged in a square shape, and each warm-light chipset and luminescent chipsets are arranged in alternating order. It can be understood that the power supply positive electrode pad 2, the warm light negative electrode pad 3 and the cold light negative electrode pad 4 are arranged in sequence along the edge of the circle.
  • the number of the warm light negative electrode pad 3 and the cold light negative electrode pad 4 can be determined according to It is set according to the requirements and is not limited by the present invention.
  • a warm light chip is welded to the warm light chipset, and a cold light chip is welded to the cold light chipset; the warm light chipset includes a first warm light chipset 7, a second warm light chipset 8, and a third warm light chip set.
  • the chipset 9, the fourth warm light chipset 10, the fifth warm light chipset 11 and the sixth warm light chipset 12 are all connected to the warm light negative electrode pad 3;
  • the cold light chip includes the first cold light chipset 13, the The second luminescent chipset 14, the third luminescent chipset 15, the fourth luminescent chipset 16, the fifth luminescent chipset 17 and the sixth luminescent chipset 18.
  • the first luminescent chipset 13, the second luminescent chipset 14, the The third cold light chipset 15, the fourth cold light chipset 16, the fifth cold light chipset 17 and the sixth cold light chipset 18 are all connected to the cold light negative electrode pad 4; the number of the first warm light chipset 7, the second warm light chipset 7 The number of optical chipsets 8, the third warm light chipset 9, the fourth warm light chipset 10, the fifth warm light chipset 11 and the sixth warm light chipset 12 are respectively the same as the number of the third warm light chipset 10.
  • the quantity of the first luminescent chipset 13 , the quantity of the second luminescent chipset 14 , the quantity of the third luminescent chipset 15 , the quantity of the fourth luminescent chipset 16 , the quantity of the fifth luminescent chipset 17 and the sixth luminescent chipset 18 The numbers are correspondingly equal; the power supply positive electrode pad 2 is arranged at the upper left corner of the substrate 1, the main warm light negative electrode pad 5 and the main cold light negative electrode pad 6 are both arranged at the lower right corner of the substrate 1; the main warm light negative electrode pad 5 The photonegative electrode pad 5 and the main luminescent negative electrode pad 6 are arranged symmetrically with each other with the diagonal line of the substrate 1 as the symmetry axis.
  • the warm light chipset and the cold light chipset are electrically connected to the positive electrode pad 2 and the negative electrode pad of the power supply respectively through wires, and each warm light chipset and the cold light chipset are connected in series through wires.
  • the wire can be a welding wire or a power wire, etc.
  • the above-mentioned chipset may also have chipsets of other colors. The above is only an example and is not limited by the present invention.
  • a white oil layer is provided at the bottom and outer edge of each chip.
  • the white oil layer can be white oil, etc., by filling the white oil at the bottom of the blue light chip. , used to elevate the chip.
  • White oil is used on the edge of the chip to form a wall, thereby raising the chip and making the chip relatively independent, thus preventing the chipset from being interfered and obscured by phosphor powders of other colors in the chip array; during production
  • the bottom layer is used for lines and the surface layer serves as a cushion.
  • the above-mentioned warm light chip can be a warm white light LED chip or LED light-emitting lamp bead, etc.
  • the above-mentioned cold light chip can be a cold white light LED chip or LED light-emitting lamp bead, etc.
  • the working voltage of each group of chips is the same.
  • the above-mentioned chipset can also be arranged in various orders, which will not be described in detail in the present invention.
  • the present invention has a reasonable design and a unique structure.
  • the positive electrode pad and the negative electrode pad of the power supply are arranged around the warm light chipset and the cold light chipset in order, so that the flip-chip circuit can be applied to the formal assembly.
  • the substrate of formal installation has both the flip-chip circuit design and the light emission efficiency characteristics of formal installation.
  • it can achieve a two-color light-emitting effect, and its circuit arrangement does not need to cross, avoiding short circuit faults, and the light efficiency is greatly improved.
  • the light effect is greatly improved, the luminous efficiency is high, and it can save space and reduce manufacturing costs, thereby improving the convenience and reliability of production and the reliability of finished products.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及智能照明技术领域，具体公开了一种双色COB光源，包括基板，所述基板上设置有电源正极焊盘、若干个依次连接的暖光芯片组、若干个依次连接的冷光芯片组及若干个负极焊盘，所述暖光芯片组及冷光芯片组均分别与所述电源正极焊盘及负极焊盘电性连接，所述电源正极焊盘及负极焊盘均依次环绕所述暖光芯片组及冷光芯片组设置。本发明通过独特的线路布局，将倒装的线路应用到正装上，并实现正装效果，使得正装的基板既具备倒装的线路设计，又具有正装的出光效率的特性，同时能实现双色发光效果，其线路排布规整，又能避免线路交叉，光效得到大大提升，发光效率较高，并且能够节省空间，降低制造成本。

Description

一种双色COB光源 技术领域
本发明涉及智能照明技术领域，特别涉及一种双色COB光源。
 背景技术
人因照明或以人为本的照明与灯光、气候和空间完美地融为一体，满足特殊环境内人员的个性化需求。为此，以人为本的照明对于照明领域的跨进亦具有特殊意义。根据具体工作和活动设计的办公区域和办公室照明显著提高了员工的创造力和工作效率。人们在良好视觉条件下更容易集中注意力，宜人的住所与灯光氛围亦能提高人们的幸福感和积极性。人因照明的实现离不开双色LED光源，数字化多色产品的演变和发展。本着提升目前双色COB光源性能的前提下，创造设计本产品。COB(即Chip on Board)，板上芯片封装，COB光源通常包括基板，基板上设置有发光区、冷光正极焊盘、冷光负极焊盘、暖光正极焊盘、暖光负极焊盘和导电线路等；COB光源以寿命长、无污染、光效高等特点而得到广泛的应用。然而现有的COB光源为了实现高光效一般只能采用正装工艺，其线路布线方式会造成金线键合时会有不同程度的交叉现象，现阶段产品制作双色温COB采用正装的封装工艺的产品无法做到规整排布，导致应用光学器件是无法做到均匀的混色，采用倒装方式虽然能解决混光均匀问题，但会造成发光效率较低的问题。
 技术解决方案
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种双色COB光源，解决现有的COB光源存在的线路交叉、无法做到规整排布、混色不均匀且发光效率较低等技术问题，通过独特的线路布局，将倒装的线路应用到正装上，并实现正装效果，使得正装的基板既具备倒装的线路设计，又具有正装的出光效率的特性，同时能实现双色发光效果，其线路排布规整，又能避免线路交叉，光效得到大大提升，发光效率较高，并且能够节省空间，降低制造成本。
为了解决上述技术问题，本发明的技术方案是：
一种双色COB光源，包括基板，所述基板上设置有电源正极焊盘、若干个依次连接的暖光芯片组、若干个依次连接的冷光芯片组及若干个负极焊盘，所述暖光芯片组及冷光芯片组均分别与所述电源正极焊盘及负极焊盘电性连接，所述电源正极焊盘及负极焊盘均依次环绕所述暖光芯片组及冷光芯片组设置。
优选地，所述负极焊盘包括若干个暖光负极焊盘及若干个冷光负极焊盘，所述暖光芯片组分别与所述电源正极焊盘及暖光负极焊盘电性连接，所述冷光芯片组分别与所述电源正极焊盘及冷光负极焊盘电性连接。
优选地，所述负极焊盘还包括主暖光负极焊盘及主冷光负极焊盘，所述主暖光负极焊盘及主冷光负极焊盘分别与所述暖光负极焊盘及冷光负极焊盘电性连接。
优选地，所述暖光负极焊盘及冷光负极焊盘均依次交叉分布设置；所述电源正极焊盘、暖光负极焊盘及冷光负极焊盘均沿着圆形的边缘分布设置于所述暖光芯片组及冷光芯片组的外围。
优选地，所述基板呈方形设置，每一所述暖光芯片组及冷光芯片组之间均依次相间分布设置。
优选地，所述暖光芯片组上焊接有暖光芯片，所述冷光芯片组上焊接有冷光芯片。
优选地，所述暖光芯片组包括第一暖光芯片组、第二暖光芯片组、第三暖光芯片组、第四暖光芯片组、第五暖光芯片组及第六暖光芯片组，所述第一暖光芯片组、第二暖光芯片组、第三暖光芯片组、第四暖光芯片组、第五暖光芯片组及第六暖光芯片组均与所述暖光负极焊盘连接。
优选地，所述冷光芯片包括第一冷光芯片组、第二冷光芯片组、第三冷光芯片组、第四冷光芯片组、第五冷光芯片组及第六冷光芯片组，所述第一冷光芯片组、第二冷光芯片组、第三冷光芯片组、第四冷光芯片组、第五冷光芯片组及第六冷光芯片组均与所述冷光负极焊盘连接。
优选地，所述电源正极焊盘设置于所述基板的左上角处，所述主暖光负极焊盘及主冷光负极焊盘均设置于所述基板的右下角处。
优选地，所述主暖光负极焊盘及主冷光负极焊盘均以所述基板的对角线为对称轴相互对称分布设置。
 有益效果
采用上述技术方案，本发明提供的一种双色COB光源，具有以下有益效果：该双色COB光源中的暖光芯片组及冷光芯片组均分别与电源正极焊盘及负极焊盘电性连接，电源正极焊盘及负极焊盘均依次环绕暖光芯片组及冷光芯片组设置，通过独特的线路布局，将电源正极焊盘及负极焊盘均依次环绕暖光芯片组及冷光芯片组设置，实现将倒装的线路应用到正装上，并实现正装效果，使得正装的基板既具备倒装的线路设计，又具有正装的出光效率的特性，同时能实现双色发光效果，其线路排布规整，又能避免线路交叉，光效得到大大提升，发光效率较高，并且能够节省空间，降低制造成本。
 附图说明
图1为本发明的结构示意图；
图中，1-基板、2-电源正极焊盘、3-暖光负极焊盘、4-冷光负极焊盘、5-主暖光负极焊盘、6-主冷光负极焊盘、7-第一暖光芯片组、8-第二暖光芯片组、9-第三暖光芯片组、10-第四暖光芯片组、11-第五暖光芯片组、12-第六暖光芯片组、13-第一冷光芯片组、14-第二冷光芯片组、15-第三冷光芯片组、16-第四冷光芯片组、17-第五冷光芯片组、18-第六冷光芯片组。
 本发明的实施方式
下面结合附图对本发明的具体实施方式作进一步说明。在此需要说明的是，对于这些实施方式的说明用于帮助理解本发明，但并不构成对本发明的限定。此外，下面所描述的本发明各个实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互组合。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
如图1所示，在本发明的结构示意图中，该双色COB光源包括基板1，该基板1上设置有电源正极焊盘2、若干个依次连接的暖光芯片组、若干个依次连接的冷光芯片组及若干个负极焊盘，该暖光芯片组及冷光芯片组均分别与该电源正极焊盘2及负极焊盘电性连接，该电源正极焊盘2及负极焊盘均依次环绕该暖光芯片组及冷光芯片组设置。可以理解的，该基板1呈方形设置，该基板1的横截面为正方形，也可以是矩形等，该电源正极焊盘2、暖光芯片组、冷光芯片组及负极焊盘均焊接于该基板1上，可用于接入外部供电电源，该基板1可以是通用的PCB电路板等，也可以是通用的铝基板或铜基板等。
具体地，该负极焊盘包括若干个暖光负极焊盘3及若干个冷光负极焊盘4，该暖光芯片组分别与该电源正极焊盘2及暖光负极焊盘3电性连接，该冷光芯片组分别与该电源正极焊盘2及冷光负极焊盘4电性连接；该负极焊盘还包括主暖光负极焊盘5及主冷光负极焊盘6，该主暖光负极焊盘5及主冷光负极焊盘6分别与该暖光负极焊盘3及冷光负极焊盘4电性连接；该暖光负极焊盘3及冷光负极焊盘4均依次交叉分布设置；该电源正极焊盘2、暖光负极焊盘3及冷光负极焊盘4均沿着圆形的边缘分布设置于该暖光芯片组及冷光芯片组的外围；该基板1呈方形设置，每一该暖光芯片组及冷光芯片组之间均依次相间分布设置。可以理解的，该该电源正极焊盘2、暖光负极焊盘3及冷光负极焊盘4沿着圆形的边缘依次设置，该暖光负极焊盘3及冷光负极焊盘4的数量可根据需求进行设置，本发明不作限定。
具体地，该暖光芯片组上焊接有暖光芯片，该冷光芯片组上焊接有冷光芯片；该暖光芯片组包括第一暖光芯片组7、第二暖光芯片组8、第三暖光芯片组9、第四暖光芯片组10、第五暖光芯片组11及第六暖光芯片组12，该第一暖光芯片组7、第二暖光芯片组8、第三暖光芯片组9、第四暖光芯片组10、第五暖光芯片组11及第六暖光芯片组12均与该暖光负极焊盘3连接；该冷光芯片包括第一冷光芯片组13、第二冷光芯片组14、第三冷光芯片组15、第四冷光芯片组16、第五冷光芯片组17及第六冷光芯片组18，该第一冷光芯片组13、第二冷光芯片组14、第三冷光芯片组15、第四冷光芯片组16、第五冷光芯片组17及第六冷光芯片组18均与该冷光负极焊盘4连接；该第一暖光芯片组7的数量、第二暖光芯片组8的数量、第三暖光芯片组9的数量、第四暖光芯片组10的数量、第五暖光芯片组11的数量及第六暖光芯片组12的数量分别与该第一冷光芯片组13的数量、第二冷光芯片组14的数量、第三冷光芯片组15的数量、第四冷光芯片组16的数量、第五冷光芯片组17的数量及第六冷光芯片组18的数量对应相等；该电源正极焊盘2设置于该基板1的左上角处，该主暖光负极焊盘5及主冷光负极焊盘6均设置于该基板1的右下角处；该主暖光负极焊盘5及主冷光负极焊盘6均以该基板1的对角线为对称轴相互对称分布设置。该暖光芯片组及冷光芯片组均通过导线分别与电源正极焊盘2及负极焊盘电性连接，每一暖光芯片组之间及冷光芯片组之间均通过导线串联连接。可以理解的，该导线可以是电焊线或电源线等。该上述芯片组还可以有其它颜色的芯片组，以上仅做举例说明，本发明不作限定。
可以理解的，上述芯片组的外部围设有白油层，即在每颗芯片的底部和外侧边缘均设置有白油层，该白油层可以是白油等，通过将白油填充在蓝光芯片的底部，用于将芯片抬高，芯片的边缘使用白油形成围墙，从而使得芯片抬高并且使得芯片相对独立，进而使得芯片组在芯片阵列中免受其他颜色芯片组荧光粉干扰和遮蔽；生产时底层做线路、表层起到垫高作用，在采用喷涂工艺在制作暖光部分时无需制作双工艺高低钢网，和钢网间保持安全距离金线无塌陷脱焊风险。上述暖光芯片可以是暖白光LED芯片或LED发光灯珠等，上述冷光芯片可以是冷白光LED芯片或LED发光灯珠等，每组芯片的工作电压都为一致。上述芯片组还可以有多种排列顺序，本发明不再赘述。
可以理解的，本发明设计合理，构造独特，通过独特的线路布局，将电源正极焊盘及负极焊盘均依次环绕暖光芯片组及冷光芯片组设置，实现将倒装的线路应用到正装上，并实现正装效果，使得正装的基板既具备倒装的线路设计，又具有正装的出光效率的特性，同时能实现双色发光效果，其线路排布又不用交叉，避免短路故障，光效得到大大提升，光效得到大大提升，发光效率较高，并且能够节省空间，降低制造成本，进而提高生产的便捷可靠性以及成品的可靠性。
以上结合附图对本发明的实施方式作了详细说明，但本发明不限于所描述的实施方式。对于本领域的技术人员而言，在不脱离本发明原理和精神的情况下，对这些实施方式进行多种变化、修改、替换和变型，仍落入本发明的保护范围内。

Claims (10)

  1. 一种双色COB光源，包括基板，其特征在于：所述基板上设置有电源正极焊盘、若干个依次连接的暖光芯片组、若干个依次连接的冷光芯片组及若干个负极焊盘，所述暖光芯片组及冷光芯片组均分别与所述电源正极焊盘及负极焊盘电性连接，所述电源正极焊盘及负极焊盘均依次环绕所述暖光芯片组及冷光芯片组设置。
  2. 根据权利要求1所述的双色COB光源，其特征在于：所述负极焊盘包括若干个暖光负极焊盘及若干个冷光负极焊盘，所述暖光芯片组分别与所述电源正极焊盘及暖光负极焊盘电性连接，所述冷光芯片组分别与所述电源正极焊盘及冷光负极焊盘电性连接。
  3. 根据权利要求2所述的双色COB光源，其特征在于：所述负极焊盘还包括主暖光负极焊盘及主冷光负极焊盘，所述主暖光负极焊盘及主冷光负极焊盘分别与所述暖光负极焊盘及冷光负极焊盘电性连接。
  4. 根据权利要求2所述的双色COB光源，其特征在于：所述暖光负极焊盘及冷光负极焊盘均依次交叉分布设置；所述电源正极焊盘、暖光负极焊盘及冷光负极焊盘均沿着圆形的边缘分布设置于所述暖光芯片组及冷光芯片组的外围。
  5. 根据权利要求1所述的双色COB光源，其特征在于：所述基板呈方形设置，每一所述暖光芯片组及冷光芯片组之间均依次相间分布设置。
  6. 根据权利要求1所述的双色COB光源，其特征在于：所述暖光芯片组上焊接有暖光芯片，所述冷光芯片组上焊接有冷光芯片。
  7. 根据权利要求2所述的双色COB光源，其特征在于：所述暖光芯片组包括第一暖光芯片组、第二暖光芯片组、第三暖光芯片组、第四暖光芯片组、第五暖光芯片组及第六暖光芯片组，所述第一暖光芯片组、第二暖光芯片组、第三暖光芯片组、第四暖光芯片组、第五暖光芯片组及第六暖光芯片组均与所述暖光负极焊盘连接。
  8. 根据权利要求2所述的双色COB光源，其特征在于：所述冷光芯片包括第一冷光芯片组、第二冷光芯片组、第三冷光芯片组、第四冷光芯片组、第五冷光芯片组及第六冷光芯片组，所述第一冷光芯片组、第二冷光芯片组、第三冷光芯片组、第四冷光芯片组、第五冷光芯片组及第六冷光芯片组均与所述冷光负极焊盘连接。
  9. 根据权利要求3所述的双色COB光源，其特征在于：所述电源正极焊盘设置于所述基板的左上角处，所述主暖光负极焊盘及主冷光负极焊盘均设置于所述基板的右下角处。
  10. 根据权利要求9所述的双色COB光源，其特征在于：所述主暖光负极焊盘及主冷光负极焊盘均以所述基板的对角线为对称轴相互对称分布设置。
PCT/CN2022/114192 2022-04-16 2022-08-23 一种双色cob光源 WO2023197497A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210398052.3A CN114678459A (zh) 2022-04-16 2022-04-16 一种双色cob光源
CN202210398052.3 2022-04-16

Publications (1)

Publication Number Publication Date
WO2023197497A1 true WO2023197497A1 (zh) 2023-10-19

Family

ID=82077294

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/114192 WO2023197497A1 (zh) 2022-04-16 2022-08-23 一种双色cob光源

Country Status (2)

Country Link
CN (1) CN114678459A (zh)
WO (1) WO2023197497A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117693088A (zh) * 2023-12-29 2024-03-12 中山市成源光电科技有限公司 一种对cob光源调光调色的方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114678459A (zh) * 2022-04-16 2022-06-28 江门市莱可半导体科技有限公司 一种双色cob光源

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130163241A1 (en) * 2011-11-25 2013-06-27 Citizen Holdings Co., Ltd. Mounting method of light-emitting element and lighting device including light-emitting element
US20150155435A1 (en) * 2013-12-03 2015-06-04 Samsung Electronics Co., Ltd. Light emitting device and illumination system having the same
CN206639799U (zh) * 2016-12-19 2017-11-14 深圳市源磊科技有限公司 一种调色cob光源
CN213660402U (zh) * 2020-10-14 2021-07-09 深圳市同一方光电技术有限公司 双色温cob光源
CN114678459A (zh) * 2022-04-16 2022-06-28 江门市莱可半导体科技有限公司 一种双色cob光源
CN217134401U (zh) * 2022-04-16 2022-08-05 江门市莱可半导体科技有限公司 一种双色cob光源

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130163241A1 (en) * 2011-11-25 2013-06-27 Citizen Holdings Co., Ltd. Mounting method of light-emitting element and lighting device including light-emitting element
US20150155435A1 (en) * 2013-12-03 2015-06-04 Samsung Electronics Co., Ltd. Light emitting device and illumination system having the same
CN206639799U (zh) * 2016-12-19 2017-11-14 深圳市源磊科技有限公司 一种调色cob光源
CN213660402U (zh) * 2020-10-14 2021-07-09 深圳市同一方光电技术有限公司 双色温cob光源
CN114678459A (zh) * 2022-04-16 2022-06-28 江门市莱可半导体科技有限公司 一种双色cob光源
CN217134401U (zh) * 2022-04-16 2022-08-05 江门市莱可半导体科技有限公司 一种双色cob光源

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117693088A (zh) * 2023-12-29 2024-03-12 中山市成源光电科技有限公司 一种对cob光源调光调色的方法

Also Published As

Publication number Publication date
CN114678459A (zh) 2022-06-28

Similar Documents

Publication Publication Date Title
WO2023197497A1 (zh) 一种双色cob光源
US8421373B2 (en) Light-mixing multichip package structure
EP2290279B1 (en) Light-mixing LED package structure for increasing color render index and brightness
TW201435241A (zh) 高清晰度ｌｅｄ顯示器及其超小點間距貼片式ｌｅｄ複合燈
WO2009012624A1 (fr) Dispositif de lumière blanche et son procédé de fabrication
CN103840071A (zh) 一种led灯条制作方法及led灯条
WO2015093180A1 (ja) 発光装置
CN102024804B (zh) 能够提高演色性及亮度的混光式发光二极管封装结构
JP2012028652A (ja) 高輝度かつ高発色指数を有する温かみのある白色光ｌｅｄランプおよびｌｅｄモジュール
JP2017098566A (ja) 発光素子の実装方法
CN217134401U (zh) 一种双色cob光源
CN113921688A (zh) 一种新型多彩led光源
TWI764096B (zh) 雙面顯示封裝結構
CN109449145A (zh) 一种高可靠性的cob封装结构及其高效封装方法
WO2024066607A1 (zh) 显示背板及显示装置
JPWO2015182272A1 (ja) 発光装置
CN216698417U (zh) 一种新型多彩led光源
CN215527727U (zh) 一种红绿蓝暖白正白五合一调光柔性灯带
CN210956669U (zh) 一种镜面铝基板cob光源
CN211238246U (zh) 一种rgbw集成线路封装灯珠
CN209822638U (zh) 一种多色led集成电路的封装结构
CN218783937U (zh) 一种恒压式rgbcw五色cob光源
CN209747512U (zh) 一种led显示结构
CN219433099U (zh) 一种利用led pn结中间绝缘部分的线路过线结构
CN218721140U (zh) 一种条状双色恒压cob光源

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22937135

Country of ref document: EP

Kind code of ref document: A1