WO2023197346A1 - 显示面板及显示装置的制备方法 - Google Patents

显示面板及显示装置的制备方法 Download PDF

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Publication number
WO2023197346A1
WO2023197346A1 PCT/CN2022/087795 CN2022087795W WO2023197346A1 WO 2023197346 A1 WO2023197346 A1 WO 2023197346A1 CN 2022087795 W CN2022087795 W CN 2022087795W WO 2023197346 A1 WO2023197346 A1 WO 2023197346A1
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WO
WIPO (PCT)
Prior art keywords
layer
inorganic encapsulation
encapsulation layer
display panel
viscosity
Prior art date
Application number
PCT/CN2022/087795
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English (en)
French (fr)
Inventor
杨宗鹏
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/755,527 priority Critical patent/US20240172527A1/en
Publication of WO2023197346A1 publication Critical patent/WO2023197346A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of display, and in particular, to a method of manufacturing a display panel and a display device.
  • OLED organic light emitting diode
  • the main packaging structure of OLED display panels is a multi-film stack of inorganic film + organic film + inorganic film.
  • the OLED display panel needs to be transferred from the panel production site to the mold. Set up a production site to carry out the subsequent module manufacturing process.
  • the module production site is far away from the panel production site, and the logistics and transportation distance of OLED display panels after the packaging process is long.
  • a temporary protective film needs to be attached to the surface of the inorganic film to protect the packaging layer.
  • inorganic films usually adopt chemical vapor deposition (Chemical vapor deposition). Vapor Deposition (CVD), the organic film layer is printed by inkjet printing.
  • CVD chemical vapor deposition
  • the process of inorganic/organic/inorganic encapsulation layer is complex and takes a long time, and it is easy to produce large impurity particles.
  • the temporary protective film covers the surface of the inorganic film , the large impurity particle protrusions will be compressed downwards to destroy the device structure of the lower layer of the packaging layer, causing abnormal display of the display panel and resulting in yield loss.
  • the present application provides a method for preparing a display panel and a display device to reduce the problem of large impurity particles damaging the display panel, improve the manufacturing yield of the display panel, and reduce the yield loss of the display panel.
  • This application provides a display panel, which includes:
  • a display function layer is provided on the array substrate layer
  • a first inorganic encapsulation layer is provided on the side of the display function layer facing away from the array substrate layer;
  • a composite barrier layer is provided on the side of the first inorganic encapsulation layer facing away from the display function layer, including:
  • a viscosity-reducing adhesive layer is provided between the substrate and the first inorganic encapsulation layer
  • a second inorganic encapsulation layer is provided between the adhesive reducing layer and the first inorganic encapsulation layer;
  • An organic adhesive layer is provided between the second inorganic encapsulation layer and the first inorganic encapsulation layer.
  • the viscosity of the viscosity-reducing adhesive layer before the viscosity-reducing treatment is greater than 500 gf/25 mm, and the viscosity after the viscosity-reducing treatment is less than 2 gf/25 mm. .
  • the material of the viscosity-reducing layer is ultraviolet viscosity-reducing glue, and the viscosity-reducing treatment is ultraviolet light irradiation.
  • the viscosity of the organic viscose layer is greater than 500 gf/25 mm before and after the viscosity reducing treatment.
  • the material of the organic adhesive layer is pressure-sensitive adhesive.
  • the first inorganic encapsulation layer covers the entire display function layer and part of the array substrate layer
  • the organic adhesive layer covers the entire first inorganic encapsulation layer
  • the second inorganic encapsulation layer covers the organic adhesive layer
  • the adhesive reducing layer covers the entire second inorganic encapsulation layer, the side walls of the organic adhesive layer and part of the array substrate layer.
  • the side walls of the second inorganic encapsulation layer are flush with the side walls of the organic adhesive layer.
  • the distance between the side walls of the adhesive reducing layer and the side walls of the second inorganic encapsulation layer is greater than 1 mm, and the side walls of the second inorganic encapsulation layer are The distance between the wall and the side wall of the first inorganic encapsulation layer is greater than 100 microns, and the distance between the side wall of the first inorganic encapsulation layer and the side wall of the display function layer is greater than 200 microns.
  • the thickness of the adhesive reducing layer ranges from 15 microns to 50 microns
  • the thickness of the second inorganic encapsulation layer ranges from 0.5 microns to 2 microns
  • the organic adhesive layer ranges from 0.5 microns to 2 microns.
  • the thickness of the glue layer ranges from 10 microns to 25 microns
  • the thickness of the first inorganic encapsulation layer ranges from 0.3 microns to 1 micron.
  • the display panel further includes a water-absorbent layer, the water-absorbent layer is provided between the first inorganic encapsulation layer and the organic adhesive layer, and the water-absorbent layer covers Parts of the array substrate layer, sidewalls of the first inorganic encapsulation layer, and parts of the top surface of the first inorganic encapsulation layer, the organic adhesive layer completely covers the top surface of the water-absorbing layer.
  • the material of the water-absorbing layer includes single or mixed water-absorbing substances among acrylic-based organic substances and epoxy-based organic substances.
  • the thickness of the water-absorbing layer covering the array substrate layer is greater than the sum of the thicknesses of the first inorganic encapsulation layer and the display function layer.
  • An embodiment of the present application provides a display panel, which includes:
  • a display function layer is provided on the array substrate layer
  • a first inorganic encapsulation layer is provided on the side of the display function layer away from the array substrate layer, covering the display function layer and part of the array substrate layer;
  • a composite barrier layer is provided on the side of the first inorganic encapsulation layer facing away from the display function layer, including:
  • a viscosity-reducing adhesive layer is provided between the substrate and the first inorganic encapsulation layer
  • a second inorganic encapsulation layer is provided between the adhesive reducing layer and the first inorganic encapsulation layer;
  • An organic adhesive layer is provided between the second inorganic encapsulation layer and the first inorganic encapsulation layer.
  • the viscosity of the viscosity-reducing adhesive layer before the viscosity-reducing treatment is greater than 500 gf/25 mm, and the viscosity after the viscosity-reducing treatment is less than 2 gf/25 mm. .
  • the viscosity of the organic viscose layer is greater than 500 gf/25 mm before and after the viscosity reducing treatment.
  • the organic adhesive layer covers the entire first inorganic encapsulation layer
  • the second inorganic encapsulation layer covers the organic adhesive layer
  • the adhesive reducing layer Covering the entire second inorganic encapsulation layer, the sidewalls of the organic adhesive layer and part of the array substrate layer.
  • the side walls of the second inorganic encapsulation layer are flush with the side walls of the organic adhesive layer.
  • the distance between the side walls of the adhesive reducing layer and the side walls of the second inorganic encapsulation layer is greater than 1 mm, and the side walls of the second inorganic encapsulation layer are The distance between the wall and the side wall of the first inorganic encapsulation layer is greater than 100 microns, and the distance between the side wall of the first inorganic encapsulation layer and the side wall of the display function layer is greater than 200 microns.
  • the display panel further includes a water-absorbent layer, the water-absorbent layer is provided between the first inorganic encapsulation layer and the organic adhesive layer, and the water-absorbent layer covers Parts of the array substrate layer, sidewalls of the first inorganic encapsulation layer, and parts of the top surface of the first inorganic encapsulation layer, the organic adhesive layer completely covers the top surface of the water-absorbing layer.
  • inventions of the present application also provide a method of manufacturing a display device.
  • the preparation method includes:
  • the preparation method includes:
  • the composite barrier layer is attached to the first inorganic encapsulation layer, and the organic adhesive layer is in contact with the first inorganic encapsulation layer to obtain the display panel according to any embodiment of the present application;
  • the preparation method includes:
  • the present application provides a method for preparing a display panel and a display device, by first preparing a second inorganic encapsulation layer and an organic encapsulation layer on a base including a viscosity-reducing adhesive layer to form a composite barrier film, and then attaching the composite barrier film to On the first inorganic encapsulation layer on the display functional layer, while ensuring that the encapsulation layer of the display panel is well protected during the transportation of the display panel from the panel preparation workshop to the module preparation workshop, a
  • it is conducive to timely discovery of defects on the second inorganic encapsulation layer and/or the organic encapsulation layer, and the removal of unqualified composite barrier films.
  • the process of the encapsulation layer of the display panel is by CVD-spraying.
  • the three-step preparation process of ink printing and CVD is adjusted to the two-step preparation process of CVD and lamination, which simplifies the preparation process of the encapsulation layer, reduces the preparation time of the encapsulation layer, and reduces the damage of large impurity particles to the display panel. phenomenon, improving the manufacturing yield of display panels.
  • Figure 1 is a schematic structural diagram of a first type of display panel provided by an embodiment of the present application.
  • Figure 2 is a schematic diagram of the first planar structure of a display panel provided by an embodiment of the present application
  • Figure 3 is a schematic diagram of the second structure of the display panel provided by the embodiment of the present application.
  • Figure 4 is a flowchart of a method for manufacturing a display device provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display device manufacturing method in a panel manufacturing workshop according to an embodiment of the present application.
  • the present application provides a display panel. Please refer to Figures 1 to 3.
  • Figure 1 shows a first structural schematic diagram of a display panel provided by an embodiment of the present application.
  • Figure 2 shows The first schematic structural diagram of the display panel provided by the embodiment of the present application is shown in Figure 3.
  • the second schematic structural diagram of the display panel provided by the embodiment of the present application is shown in Figure 3.
  • the display panel provided by the embodiment of the present application is include:
  • the display function layer 20 is provided on the array substrate layer 10;
  • the first inorganic encapsulation layer 30 is provided on the side of the display function layer 20 facing away from the array substrate layer 10;
  • the composite barrier layer 40 is provided on the side of the first inorganic encapsulation layer 30 away from the display function layer 20 and includes:
  • the adhesive reducing layer 42 is provided between the substrate 41 and the first inorganic encapsulation layer 30;
  • the second inorganic encapsulation layer 43 is provided between the adhesive reducing layer 42 and the first inorganic encapsulation layer 30;
  • the organic adhesive layer 44 is provided between the second inorganic encapsulation layer 43 and the first inorganic encapsulation layer 30 .
  • the substrate 41 is an organic substrate.
  • the materials of the substrate include but are not limited to polyimide (PI) and polyethylene terephthalate (PET).
  • the substrate is provided on the display panel.
  • the surface of the display panel is covered with an encapsulation layer of the display panel, and is used to protect the encapsulation layer of the display panel during the process of the display panel from the panel preparation workshop to the module to the preparation workshop.
  • the viscosity-reducing adhesive layer 42 is an organic adhesive layer, and the viscosity of the viscosity-reducing adhesive layer 42 can be adjusted arbitrarily through viscosity-reducing treatment.
  • the viscosity reducing adhesive layer 42 is used to bond the substrate 41 and the second inorganic encapsulation layer 43.
  • the viscosity reducing adhesive layer 42 has a viscosity greater than 500 grams force/25 mm; in the second state, after the viscosity reducing treatment, the viscosity of the tackiness reducing adhesive layer 42 is reduced to less than 2 gram force/25 mm, thereby facilitating the viscosity reducing adhesive layer 42 Removed from the second inorganic encapsulation layer 43 .
  • the viscosity-reducing adhesive layer 42 is made of different materials, and the viscosity-reducing treatment method is different.
  • the materials of the viscosity-reducing adhesive layer 42 include organic adhesive materials whose viscosity is reduced by ultraviolet light and organic adhesive materials whose viscosity is reduced by heat.
  • the viscosity reduction treatment includes ultraviolet irradiation treatment and heating treatment.
  • the organic adhesive layer 44 is an organic layer with viscosity and is used to bond the first inorganic encapsulation layer 30 and the second inorganic encapsulation layer 43.
  • the organic adhesive layer 44 is located on the first inorganic encapsulation layer.
  • the flexible encapsulation layer of the display panel is formed to achieve planarization and stress relief. function to realize flexible packaging of the display panel.
  • the viscosity of the organic adhesive layer 44 is greater than 500 gf/25 mm, thereby ensuring that the first inorganic encapsulation layer 30 and the second inorganic encapsulation layer 43 are firmly bonded together through the organic adhesive layer 44 .
  • the organic adhesive layer 44 is preferably a pressure sensitive adhesive (PSA).
  • PSA pressure sensitive adhesive
  • the materials of the organic adhesive layer include but are not limited to vinyl, polyurethane, polyester, vinyl acetate, etc.
  • the first inorganic encapsulation layer 30 covers the entire display function layer 20 and part of the array substrate layer 10 to encapsulate the display function layer 20 ;
  • the organic adhesive layer 44 covers the entire first inorganic encapsulation layer 30;
  • the second inorganic encapsulation layer 43 covers the organic adhesive layer 44, preferably the side wall of the second inorganic encapsulation layer 43 is in contact with the The side walls of the organic adhesive layer 44 are flush, or the second inorganic encapsulation layer 43 covers the upper surface and side surfaces of the organic adhesive layer 44;
  • the adhesive reducing layer 42 covers the entire second inorganic encapsulation layer 43 , the sidewalls of the organic adhesive layer 44 and part of the array substrate layer 10 .
  • the distance X1 between the sidewalls of the first inorganic encapsulation layer 30 and the sidewalls of the display function layer 20 is greater than 200 microns, thereby ensuring that the first inorganic encapsulation layer 30 can completely cover the display function layer 20;
  • the distance X2 between the side wall of the second inorganic encapsulation layer and the side wall of the first inorganic encapsulation layer is greater than 100 microns to ensure that the adhesive reducing layer 42 completely covers the first inorganic encapsulation layer 30;
  • the distance X3 between the side walls of the adhesive reducing layer 42 and the side walls of the second inorganic encapsulation layer is greater than 1 mm to ensure that the adhesive reducing layer 42 can completely cover the encapsulating layer and a sufficient area.
  • the array substrate layer 10 avoids the problem of delamination between the adhesive layer 42 and the array substrate layer 10 .
  • the thickness of the display function layer 20 is generally only a few microns, the thickness of the first inorganic encapsulation layer 30 ranges from 0.3 microns to 1 micron, and the thickness of the second inorganic encapsulation layer 43 ranges from 0.5 microns to 2 microns.
  • the thickness of the organic adhesive layer ranges from 10 microns to 25 microns, and the thickness of the adhesive reducing layer ranges from 15 microns to 50 microns.
  • the display panel further includes a water-absorbing layer 50 , and the water-absorbing layer 50 is provided between the first inorganic encapsulation layer 30 and the organic adhesive layer 44 .
  • the water-absorbing layer 50 covers part of the array substrate layer 10 , the sidewalls of the first inorganic encapsulation layer 30 , and part of the top surface of the first inorganic encapsulation layer 30 , and the organic adhesive layer 44 completely covers them.
  • the material of the water-absorbing layer 50 includes but is not limited to single or mixed water-absorbing substances among acrylic-based organic matter and epoxy-based organic matter.
  • the water-absorbing layer 50 is provided on the side of the first inorganic encapsulation layer to absorb external intrusion.
  • the moisture in the display panel prolongs the intrusion path of the moisture and improves the encapsulation effect of the encapsulation layer.
  • the thickness of the water-absorbing layer 50 covering the array substrate layer 10 is greater than the sum of the thicknesses of the first inorganic encapsulation layer 30 and the display function layer 20 , and the width of the water-absorbing layer 50 is determined according to the thickness of the water-absorbing layer 50 .
  • the water absorption capacity of the material and the coating accuracy of the water absorption layer 50 are designed.
  • the present application also provides a method for preparing a display device. Please refer to Figures 4 and 5.
  • Figure 4 shows a flow chart of a method for preparing a display device provided by an embodiment of the present application.
  • Figure 5 shows a flow chart of a method of preparing a display device provided by an embodiment of the present application.
  • a structural schematic diagram of a preparation method of a display device, the preparation method comprising:
  • the preparation method includes:
  • Step S11 Provide a substrate, and sequentially prepare a viscosity-reducing adhesive layer, a second inorganic encapsulation layer, and an organic adhesive layer on the substrate to obtain a composite barrier layer;
  • Step S12 Prepare a first inorganic encapsulation layer on the array substrate and display functional layer
  • Step S13 Attach the composite barrier layer to the first inorganic encapsulation layer, and the organic adhesive layer is in contact with the first inorganic encapsulation layer to obtain the display panel according to any embodiment of the present application. ;
  • Step S2 Transport the display panel from the panel preparation workshop to the module preparation workshop;
  • the preparation method includes:
  • Step S31 Process the viscosity-reducing adhesive layer through a viscosity-reducing operation to reduce the viscosity of the viscosity-reducing adhesive layer;
  • Step S32 Remove the adhesive reducing layer and the base.
  • step S11 a substrate is provided, and a viscosity-reducing adhesive layer, a second inorganic encapsulation layer, and an organic adhesive layer are sequentially prepared on the substrate.
  • the steps of obtaining the composite barrier layer include:
  • a layer of viscosity-reducing adhesive is compounded on the base by methods such as gluing, inkjet printing, or lamination, and the thickness of the viscosity-reducing adhesive layer ranges from 15 microns to 50 microns;
  • the projection of the second inorganic encapsulating layer on the substrate falls into the adhesive reducing layer on the substrate. within the projection on, and the distance between the sides of the second inorganic encapsulation layer and the side of the adhesive reducing layer is greater than 1 mm, and the thickness of the second inorganic encapsulation layer is 0.5 microns-2 microns;
  • the step of preparing the first inorganic encapsulation layer on the array substrate and the display functional layer in step S12 includes:
  • the first inorganic encapsulation layer is prepared on the array substrate and the display functional layer through processes such as CVD or ALD; the first inorganic encapsulation layer covers the entire display functional layer and part of the array substrate layer, so
  • the distance X1 between the side wall of the first inorganic encapsulation layer and the side wall of the display function layer is greater than 200 microns, and the thickness of the first inorganic encapsulation layer ranges from 0.3 microns to 1 micron.
  • Figure 5 ( a) refer to Figure 5 ( a).
  • step S12 and step S13 may also include:
  • a water-absorbing layer is prepared on the array substrate and the first inorganic encapsulation layer by glue coating or inkjet printing, specifically refer to (b) in FIG. 5 .
  • step S13 The step of attaching the composite barrier layer to the first inorganic encapsulation layer in step S13 includes:
  • the composite barrier layer is attached to the first inorganic encapsulation layer; specifically refer to (c) in Figure 5 .
  • step S31 the viscosity-reducing adhesive layer is processed through a viscosity-reducing operation. Reducing the viscosity of the viscosity-reducing adhesive layer includes:
  • the viscosity-reducing layer is a UV-type viscosity-reducing layer
  • ultraviolet light is used to irradiate the viscosity-reducing layer to reduce the viscosity of the viscosity-reducing layer to less than 2 gf/25 mm;
  • the viscosity-reducing adhesive layer is a heated viscosity-reducing adhesive layer
  • the viscosity-reducing adhesive layer is heated to reduce the viscosity of the viscosity-reducing adhesive layer to less than 2 gf/25 mm.
  • the step of removing the tack-reducing adhesive layer and the base in step S32 is to tear off the tack-reducing adhesive layer after the tack-reducing treatment and remove the base at the same time, specifically refer to (d) in FIG. 5 .
  • the preparation method also includes processes such as frame assembly and driving circuit board lamination.
  • embodiments of the present application provide a method for preparing a display panel and a display device.
  • the second inorganic encapsulation layer and the organic encapsulation layer are first prepared on a substrate including an adhesive reducing layer to form a composite barrier film, and then The composite barrier film is attached to the first inorganic encapsulation layer on the display functional layer.
  • the encapsulation layer of the display panel is While providing good protection, on the one hand, it is helpful to timely discover defects on the second inorganic encapsulation layer and/or the organic encapsulation layer and eliminate unqualified composite barrier films; on the other hand, the encapsulation of the display panel
  • the layer manufacturing process is adjusted from a three-step preparation process of CVD-inkjet printing-CVD to a two-step preparation process of CVD-lamination, which simplifies the preparation process of the encapsulation layer, reduces the preparation time of the encapsulation layer, and reduces the number of large particles.
  • the phenomenon of impurity particles damaging the display panel improves the manufacturing yield of the display panel and reduces the yield loss of the display panel.

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  • Manufacturing & Machinery (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种显示面板及显示装置的制备方法，显示面板包括：阵列基板层（10）；显示功能层（20）；第一无机封装层（30）；以及复合阻隔层（40），复合阻隔层（40）包括：基底（41）；减粘胶层（42），设于基底（41）和第一无机封装层（30）之间；第二无机封装层（43），设于减粘胶层（42）和第一无机封装层（30）之间；有机粘胶层（44），设于第二无机封装层（43）和第一无机封装层（30）之间。

Description

显示面板及显示装置的制备方法 技术领域
本申请涉及显示领域，尤其涉及一种显示面板及显示装置的制备方法。
 背景技术
由于具有结构简单、自发光、响应速度快、超轻薄、低功耗等优点，有机发光二极管(Organic Light Emitting Diode，OLED)显示器正被各大显示器厂商大力开发。目前，OLED显示面板主要的封装结构为无机膜+有机膜+无机膜的多膜层叠构，在无机/有机/无机封装层的叠构完成之后，需要将OLED显示面板从面板制作场地转移至模组制作场地进行后段的模组制程。模组制作场地与面板制作场地距离较远，封装制程之后OLED显示面板的物流运输距离较远，一般需要在无机膜的表面贴附一层临时保护膜，以保护封装层。
其中，无机膜通常采用化学气相沉积（Chemical Vapor Deposition，CVD）制作，有机膜层则通过喷墨打印来进行，无机/有机/无机封装层的制程复杂且时间长，容易产生大颗粒的杂质粒子，当临时保护膜覆盖无机膜的表面时，大颗粒的杂质粒子凸起受到压合作用会向下破坏封装层下层的器件结构，从而引起显示面板显示异常，导致良率损失。
 技术问题
本申请提供一种显示面板及显示装置的制备方法，以减小了大颗粒杂质粒子破坏显示面板的问题，提高显示面板的制造良率，降低显示面板的良率损失。
 技术解决方案
本申请提供一种显示面板，所述显示面板包括：
阵列基板层；
显示功能层，设于所述阵列基板层上；
第一无机封装层，设于所述显示功能层背离所述阵列基板层的一侧；以及
复合阻隔层，设于所述第一无机封装层背离所述显示功能层的一侧，包括：
基底；
减粘胶层，设于所述基底和所述第一无机封装层之间；
第二无机封装层，设于所述减粘胶层和所述第一无机封装层之间；
有机粘胶层，设于所述第二无机封装层和所述第一无机封装层之间。
可选地，在本申请的一些实施例中，所述减粘胶层在减粘处理前的粘度大于500克力/25毫米，在所述减粘处理后的粘度小于2克力/25毫米。
可选地，在本申请的一些实施例中，所述减粘胶层的材料为紫外光减粘胶，所述减粘处理为紫外光照射。
可选地，在本申请的一些实施例中，在所述减粘处理前后，所述有机粘胶层的粘度均大于500克力/25毫米。
可选地，在本申请的一些实施例中，所述有机胶粘层的材料为压敏胶。
可选地，在本申请的一些实施例中，所述第一无机封装层覆盖整个所述显示功能层和部分所述阵列基板层，所述有机粘胶层覆盖整个所述第一无机封装层，所述第二无机封装层覆盖所述有机粘胶层，所述减粘胶层覆盖整个所述第二无机封装层、所述有机粘胶层的侧壁以及部分所述阵列基板层。
可选地，在本申请的一些实施例中，所述第二无机封装层的侧壁与所述有机粘胶层的侧壁齐平。
可选地，在本申请的一些实施例中，所述减粘胶层的侧壁与所述第二无机封装层的侧壁之间的距离大于1毫米，所述第二无机封装层的侧壁与所述第一无机封装层的侧壁之间的距离大于100微米，所述第一无机封装层的侧壁和所述显示功能层的侧壁之间的距离大于200微米。
可选地，在本申请的一些实施例中，所述减粘胶层的厚度范围为15微米-50微米，所述第二无机封装层的厚度范围为0.5微米-2微米，所述有机粘胶层的厚度范围为10微米-25微米，所述第一无机封装层的厚度范围为0.3微米-1微米。
可选地，在本申请的一些实施例中，所述显示面板还包括吸水层，所述吸水层设于所述第一无机封装层和所述有机粘胶层之间，所述吸水层覆盖部分所述阵列基板层、所述第一无机封装层的侧壁、以及部分所述第一无机封装层的顶面，所述有机粘胶层完全覆盖所述吸水层的顶面。
可选地，在本申请的一些实施例中，所述吸水层的材料包括亚克力系有机物、环氧系有机物中的单一或混合吸水物质。
可选地，在本申请的一些实施例中，覆盖所述阵列基板层的所述吸水层的厚度大于所述第一无机封装层和所述显示功能层的厚度之和。
本申请实施例提供了一种显示面板，所述显示面板包括：
阵列基板层；
显示功能层，设于所述阵列基板层上；
第一无机封装层，设于所述显示功能层背离所述阵列基板层的一侧，覆盖所述显示功能层和部分所述阵列基板层；以及
复合阻隔层，设于所述第一无机封装层背离所述显示功能层的一侧，包括：
基底；
减粘胶层，设于所述基底和所述第一无机封装层之间；
第二无机封装层，设于所述减粘胶层和所述第一无机封装层之间；
有机粘胶层，设于所述第二无机封装层和所述第一无机封装层之间。
可选地，在本申请的一些实施例中，所述减粘胶层在减粘处理前的粘度大于500克力/25毫米，在所述减粘处理后的粘度小于2克力/25毫米。
可选地，在本申请的一些实施例中，在所述减粘处理前后，所述有机粘胶层的粘度均大于500克力/25毫米。
可选地，在本申请的一些实施例中，所述有机粘胶层覆盖整个所述第一无机封装层，所述第二无机封装层覆盖所述有机粘胶层，所述减粘胶层覆盖整个所述第二无机封装层、所述有机粘胶层的侧壁以及部分所述阵列基板层。
可选地，在本申请的一些实施例中，所述第二无机封装层的侧壁与所述有机粘胶层的侧壁齐平。
可选地，在本申请的一些实施例中，所述减粘胶层的侧壁与所述第二无机封装层的侧壁之间的距离大于1毫米，所述第二无机封装层的侧壁与所述第一无机封装层的侧壁之间的距离大于100微米，所述第一无机封装层的侧壁和所述显示功能层的侧壁之间的距离大于200微米。
可选地，在本申请的一些实施例中，所述显示面板还包括吸水层，所述吸水层设于所述第一无机封装层和所述有机粘胶层之间，所述吸水层覆盖部分所述阵列基板层、所述第一无机封装层的侧壁、以及部分所述第一无机封装层的顶面，所述有机粘胶层完全覆盖所述吸水层的顶面。
同时，本申请实施例还提供了一种显示装置的制备方法，所述制备方法包括：
在面板制备车间，所述制备方法包括：
提供基底，并在所述基底上依次制备减粘胶层、第二无机封装层和有机粘胶层，得到复合阻隔层；
在阵列基板和显示功能层上制备第一无机封装层；
将所述复合阻隔层贴附于所述第一无机封装层上，所述有机粘胶层与所述第一无机封装层接触，得到本申请任意一项实施例所述的显示面板；
将所述显示面板从面板制备车间运输至模组制备车间；
在模组制备车间，所述制备方法包括：
通过减粘操作处理所述减粘胶层，降低所述减粘胶层的粘度；
去除所述减粘胶层和所述基底。
 有益效果
本申请提供了一种显示面板及显示装置的制备方法，通过将第二无机封装层和有机封装层先制备于包括减粘胶层的基底上形成复合阻隔膜，然后将所述复合阻隔膜贴合于显示功能层上的第一无机封装层上，在保证所述显示面板从面板制备车间运输至模组制备车间的过程中，所述显示面板的封装层得到了良好的保护的同时，一方面，有利于及时发现所述第二无机封装层和/或所述有机封装层上的缺陷，剔除不合格的复合阻隔膜，另一方面，所述显示面板的封装层的制程由CVD-喷墨打印-CVD三道制备工艺调整为CVD-贴合两道制备工艺，简化了所述封装层的制备流程，缩减了所述封装层的制备时间，减少了大颗粒杂质粒子破坏所述显示面板的现象，提高了显示面板的制造良率。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的显示面板的第一种结构示意简图；
图2为本申请实施例提供的显示面板的第一种平面结构示意简图；
图3为本申请实施例提供的显示面板的第二种结构示意简图；
图4为本申请实施例提供的显示装置的制备方法的流程示图；
图5为本申请实施例提供的显示装置的制备方法在面板制备车间内的结构示意图。
 本发明的实施方式
在一种实施例中，本申请提供一种显示面板，请参照图1至图3，图1示出了本申请实施例提供的显示面板的第一种结构示意简图，图2示出了本申请实施例提供的显示面板的第一种平面结构示意简图，图3示出了本申请实施例提供的显示面板的第二种结构示意简图，本申请实施例提供的所述显示面板包括：
阵列基板层10；
显示功能层20，设于所述阵列基板层10上；
第一无机封装层30，设于所述显示功能层20背离所述阵列基板层10的一侧；以及
复合阻隔层40，设于所述第一无机封装层30背离所述显示功能层20的一侧，包括：
基底41；
减粘胶层42，设于所述基底41和所述第一无机封装层30之间；
第二无机封装层43，设于所述减粘胶层42和所述第一无机封装层30之间；
有机粘胶层44，设于所述第二无机封装层43和所述第一无机封装层30之间。
具体的，所述基底41为有机基底，所述基底的材料包括但不限于聚酰亚胺（PI）和聚对苯二甲酸乙二醇酯（PET），所述基底设于所述显示面板的表面，覆盖所述显示面板的封装层，用于在所述显示面板在从面板制备车间向模组至制备车间的过程中保护所述显示面板的封装层。
所述减粘胶层42为有机胶黏层，所述减粘胶层42的粘度可任意通过减粘处理进行调节。在第一状态下，即在未经减粘处理之前，所述减粘胶层42用于粘接所述基底41和所述第二无机封装层43，所述减粘胶层42的粘度大于500克力/25毫米；在第二状态下，通过所述减粘处理后，所述减粘胶层42的粘度降低至2克力/25毫米以下，从而便于将所述减粘胶层42从所述第二无机封装层43上撕除。根据所述减粘胶层42的材料不同，所述减粘处理的方式不同，所述减粘胶层42的材料包括受紫外光照粘度降低的有机胶黏材料和受热粘度降低的有机胶黏材料，相应的，所述减粘处理包括紫外光照处理和加热处理。
所述有机粘胶层44为具有粘性的有机层，用于粘接所述第一无机封装层30和所述第二无机封装层43，所述有机粘胶层44位于所述第一无机封装层30和所述第二无机封装层43之间，与所述第一无机封装层30和所述第二无机封装层43共同构成所述显示面板的柔性封装层，起到平坦化和应力释放的作用，实现所述显示面板的柔性封装。在所述减粘处理前后，所述有机粘胶层44的粘度均大于500克力/25毫米，从而保证在所述第一状态和所述第二状态下，所述第一无机封装层30和所述第二无机封装层43均通过所述有机粘胶层44牢固的粘接在一起。所述有机胶粘层44优选为压敏胶（pressure sensitive adhesive，PSA），所述有机粘胶层的材料包括但不限于乙烯类、聚氨脂类、聚酯类、乙酸乙烯酯类等。
在一种实施例中，如图1和图2所示，所述第一无机封装层30覆盖整个所述显示功能层20和部分所述阵列基板层10，对所述显示功能层20进行封装；所述有机粘胶层44覆盖整个所述第一无机封装层30；所述第二无机封装层43覆盖所述有机粘胶层44，优选所述第二无机封装层43的侧壁与所述有机粘胶层44的侧壁齐平，或所述第二无机封装层43覆盖所述有机粘胶层44的上表面和侧面；所述减粘胶层42覆盖整个所述第二无机封装层43、所述有机粘胶层44的侧壁以及部分所述阵列基板层10。
所述第一无机封装层30的侧壁和所述显示功能层20的侧壁之间的距离X1大于200微米，从而保证所述第一无机封装层30能够完全覆盖所述显示功能层20；所述第二无机封装层的侧壁与所述第一无机封装层的侧壁之间的距离X2大于100微米，以保证所述减粘胶层42完全覆盖所述第一无机封装层30；所述减粘胶层42的侧壁与所述第二无机封装层的侧壁之间的距离X3大于1毫米，以保证所述减粘胶层42能够完整覆盖所述封装层和足够面积的阵列基板层10，避免所述减粘胶层42与所述阵列基板层10之间出现分层的问题。
所述显示功能层20的厚度一般仅有几微米，所述第一无机封装层30的厚度范围为0.3微米-1微米，所述第二无机封装层43的厚度范围为0.5微米-2微米，所述有机粘胶层的厚度范围为10微米-25微米，所述减粘胶层的厚度范围为15微米-50微米。
在另一种实施例中，如图3所示，所述显示面板还包括吸水层50，所述吸水层50设于所述第一无机封装层30和所述有机粘胶层44之间，所述吸水层50覆盖部分所述阵列基板层10、所述第一无机封装层30的侧壁、以及部分所述第一无机封装层30的顶面，所述有机粘胶层44完全覆盖所述吸水层50的顶面。所述吸水层50的材料包括但不限于亚克力系有机物、环氧系有机物中的单一或混合吸水物质，所述吸水层50设于所述第一无机封装层的侧边，用于吸收外界侵入所述显示面板的水分，延长所述水分的侵入路径，提高所述封装层的封装效果。进一步，覆盖所述阵列基板层10的所述吸水层50的厚度大于所述第一无机封装层30和所述显示功能层20的厚度之和，所述吸水层50的宽度根据所述吸水层材料的吸水能力与所述吸水层50的涂覆精度进行设计。
本申请还提供一种显示装置的制备方法，请参照图4和图5，图4示出了本申请实施例提供的显示装置的制备方法的流程图，图5示出了本申请实施例提供的显示装置的制备方法的结构示意图，所述制备方法包括：
在面板制备车间，所述制备方法包括：
步骤S11、提供基底，并在所述基底上依次制备减粘胶层、第二无机封装层和有机粘胶层，得到复合阻隔层；
步骤S12、在阵列基板和显示功能层上制备第一无机封装层；
步骤S13、将所述复合阻隔层贴附于所述第一无机封装层上，所述有机粘胶层与所述第一无机封装层接触，得到本申请任意一项实施例所述的显示面板；
步骤S2、将所述显示面板从面板制备车间运输至模组制备车间；
在模组制备车间，所述制备方法包括：
步骤S31、通过减粘操作处理所述减粘胶层，降低所述减粘胶层的粘度；
步骤S32、去除所述减粘胶层和所述基底。
具体的，步骤S11中提供基底，并在所述基底上依次制备减粘胶层、第二无机封装层和有机粘胶层，得到复合阻隔层的步骤包括：
提供基底；
通过涂胶、喷墨打印或贴合等方法在所述基底复合一层减粘胶，所述减粘胶层的厚度范围为15微米-50微米；
通过化学气相沉积（Chemical Vapor Deposition，CVD）或原子层沉积（Atom Layer Deposition，ALD）等工艺在所述减粘胶层上制备所述第二无机封装层；所述第二无机封装层在所述基底上的投影落入所述减粘胶层在所述基底上的投影内，且所述第二无机封装层的侧边与所述减粘胶层的侧边之间的距离大于1毫米，所述第二无机封装层的厚度为0.5微米-2微米；
通过涂胶、喷墨打印或贴合等方法在所述第二无机封装层上复合一层有机粘胶；所述有机粘胶层的侧边与所述第二无机封装层的侧边平齐，所述有机粘胶层的厚度范围为10微米-25微米，所述有机粘胶层背离所述第二无机封装层的表面贴合有一层离型膜。
步骤S12中在阵列基板和显示功能层上制备第一无机封装层的步骤包括：
过CVD或ALD等工艺在所述阵列基板和所述显示功能层上制备所述第一无机封装层；所述第一无机封装层覆盖整个所述显示功能层和部分所述阵列基板层，所述第一无机封装层的侧壁和所述显示功能层的侧壁之间的距离X1大于200微米，所述第一无机封装层的厚度范围为0.3微米-1微米，具体参照图5中（a）。
在步骤S12和步骤S13之间还可以包括：
通过涂胶或喷墨打印等方法在所述阵列基板和所述第一无机封装层上制备吸水层，具体参照图5中（b）。
步骤S13中将所述复合阻隔层贴附于所述第一无机封装层上的步骤包括：
撕除所述第二无机封装层表面的离型膜；
将所述复合阻隔层贴附于所述第一无机封装层上；具体参照图5中（c）。
步骤S31中通过减粘操作处理所述减粘胶层，降低所述减粘胶层的粘度包括：
当所述减粘胶层为紫外光型减粘胶层时，采用紫外光照射所述减粘胶层，将所述减粘胶层的粘度降低至2克力/25毫米以下；
当所述减粘胶层为加热型减粘胶层时，对所述减粘胶层进行加热处理，将所述减粘胶层的粘度降低至2克力/25毫米以下。
步骤S32中去除所述减粘胶层和所述基底的步骤为撕除减粘处理后的所述减粘胶层，同时去除所述基底，具体参照图5中（d）。
在步骤S32之后，所述制备方法还包括边框组装和驱动电路板压合等过程。
综上所述，本申请实施例提供了一种显示面板及显示装置的制备方法，通过将第二无机封装层和有机封装层先制备于包括减粘胶层的基底上形成复合阻隔膜，然后将所述复合阻隔膜贴合于显示功能层上的第一无机封装层上，在保证所述显示面板从面板制备车间运输至模组制备车间的过程中，所述显示面板的封装层得到了良好的保护的同时，一方面，有利于及时发现所述第二无机封装层和/或所述有机封装层上的缺陷，剔除不合格的复合阻隔膜，另一方面，所述显示面板的封装层的制程由CVD-喷墨打印-CVD三道制备工艺调整为CVD-贴合两道制备工艺，简化了所述封装层的制备流程，缩减了所述封装层的制备时间，减少了大颗粒杂质粒子破坏所述显示面板的现象，提高了显示面板的制造良率，降低了显示面板的良率损失。
以上对本申请实施例所提供的显示面板及显示装置的制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其中，所述显示面板包括：
    阵列基板层；
    显示功能层，设于所述阵列基板层上；
    第一无机封装层，设于所述显示功能层背离所述阵列基板层的一侧；以及
    复合阻隔层，设于所述第一无机封装层背离所述显示功能层的一侧，包括：
    基底；
    减粘胶层，设于所述基底和所述第一无机封装层之间；
    第二无机封装层，设于所述减粘胶层和所述第一无机封装层之间；
    有机粘胶层，设于所述第二无机封装层和所述第一无机封装层之间。
  2. 如权利要求1所述的显示面板，其中，所述减粘胶层在减粘处理前的粘度大于500克力/25毫米，在所述减粘处理后的粘度小于2克力/25毫米。
  3. 如权利要求2所述的显示面板，其中，所述减粘胶层的材料为紫外光减粘胶，所述减粘处理为紫外光照射。
  4. 如权利要求2所述的显示面板，其中，在所述减粘处理前后，所述有机粘胶层的粘度均大于500克力/25毫米。
  5. 如权利要求4所述的显示面板，其中，所述有机胶粘层的材料为压敏胶。
  6. 如权利要求1所述的显示面板，其中，所述第一无机封装层覆盖整个所述显示功能层和部分所述阵列基板层，所述有机粘胶层覆盖整个所述第一无机封装层，所述第二无机封装层覆盖所述有机粘胶层，所述减粘胶层覆盖整个所述第二无机封装层、所述有机粘胶层的侧壁以及部分所述阵列基板层。
  7. 如权利要求6所述的显示面板，其中，所述第二无机封装层的侧壁与所述有机粘胶层的侧壁齐平。
  8. 如权利要求7所述的显示面板，其中，所述减粘胶层的侧壁与所述第二无机封装层的侧壁之间的距离大于1毫米，所述第二无机封装层的侧壁与所述第一无机封装层的侧壁之间的距离大于100微米，所述第一无机封装层的侧壁和所述显示功能层的侧壁之间的距离大于200微米。
  9. 如权利要求6所述的显示面板，其中，所述减粘胶层的厚度范围为15微米-50微米，所述第二无机封装层的厚度范围为0.5微米-2微米，所述有机粘胶层的厚度范围为10微米-25微米，所述第一无机封装层的厚度范围为0.3微米-1微米。
  10. 如权利要求1所述的显示面板，其中，所述显示面板还包括吸水层，所述吸水层设于所述第一无机封装层和所述有机粘胶层之间，所述吸水层覆盖部分所述阵列基板层、所述第一无机封装层的侧壁、以及部分所述第一无机封装层的顶面，所述有机粘胶层完全覆盖所述吸水层的顶面。
  11. 如权利要求10所述的显示面板，其中，所述吸水层的材料包括亚克力系有机物、环氧系有机物中的单一或混合吸水物质。
  12. 如权利要求10所述的显示面板，其中，覆盖所述阵列基板层的所述吸水层的厚度大于所述第一无机封装层和所述显示功能层的厚度之和。
  13. 一种显示面板，其中，所述显示面板包括：
    阵列基板层；
    显示功能层，设于所述阵列基板层上；
    第一无机封装层，设于所述显示功能层背离所述阵列基板层的一侧，覆盖所述显示功能层和部分所述阵列基板层；以及
    复合阻隔层，设于所述第一无机封装层背离所述显示功能层的一侧，包括：
    基底；
    减粘胶层，设于所述基底和所述第一无机封装层之间；
    第二无机封装层，设于所述减粘胶层和所述第一无机封装层之间；
    有机粘胶层，设于所述第二无机封装层和所述第一无机封装层之间。
  14. 如权利要求13所述的显示面板，其中，所述减粘胶层在减粘处理前的粘度大于500克力/25毫米，在所述减粘处理后的粘度小于2克力/25毫米。
  15. 如权利要求14所述的显示面板，其中，在所述减粘处理前后，所述有机粘胶层的粘度均大于500克力/25毫米。
  16. 如权利要求13所述的显示面板，其中，所述有机粘胶层覆盖整个所述第一无机封装层，所述第二无机封装层覆盖所述有机粘胶层，所述减粘胶层覆盖整个所述第二无机封装层、所述有机粘胶层的侧壁以及部分所述阵列基板层。
  17. 如权利要求16所述的显示面板，其中，所述第二无机封装层的侧壁与所述有机粘胶层的侧壁齐平。
  18. 如权利要求17所述的显示面板，其中，所述减粘胶层的侧壁与所述第二无机封装层的侧壁之间的距离大于1毫米，所述第二无机封装层的侧壁与所述第一无机封装层的侧壁之间的距离大于100微米，所述第一无机封装层的侧壁和所述显示功能层的侧壁之间的距离大于200微米。
  19. 如权利要求13所述的显示面板，其中，所述显示面板还包括吸水层，所述吸水层设于所述第一无机封装层和所述有机粘胶层之间，所述吸水层覆盖部分所述阵列基板层、所述第一无机封装层的侧壁、以及部分所述第一无机封装层的顶面，所述有机粘胶层完全覆盖所述吸水层的顶面。
  20. 一种显示装置的制备方法，其中，所述制备方法包括：
    在面板制备车间，所述制备方法包括：
    提供基底，并在所述基底上依次制备减粘胶层、第二无机封装层和有机粘胶层，得到复合阻隔层；
    在阵列基板和显示功能层上制备第一无机封装层；
    将所述复合阻隔层贴附于所述第一无机封装层上，所述有机粘胶层与所述第一无机封装层接触，得到如权利要求1至19任意一项所述的显示面板；
    将所述显示面板从面板制备车间运输至模组制备车间；
    在模组制备车间，所述制备方法包括：
    通过减粘操作处理所述减粘胶层，降低所述减粘胶层的粘度；
    去除所述减粘胶层和所述基底。
PCT/CN2022/087795 2022-04-11 2022-04-20 显示面板及显示装置的制备方法 WO2023197346A1 (zh)

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