WO2020056862A1 - Oled封装结构的保护膜、oled封装结构及其保护膜的制备方法 - Google Patents

Oled封装结构的保护膜、oled封装结构及其保护膜的制备方法 Download PDF

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Publication number
WO2020056862A1
WO2020056862A1 PCT/CN2018/113250 CN2018113250W WO2020056862A1 WO 2020056862 A1 WO2020056862 A1 WO 2020056862A1 CN 2018113250 W CN2018113250 W CN 2018113250W WO 2020056862 A1 WO2020056862 A1 WO 2020056862A1
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WO
WIPO (PCT)
Prior art keywords
film
auxiliary
base film
packaging structure
oled
Prior art date
Application number
PCT/CN2018/113250
Other languages
English (en)
French (fr)
Inventor
程家有
吴建霖
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/478,130 priority Critical patent/US11539030B2/en
Publication of WO2020056862A1 publication Critical patent/WO2020056862A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations

Definitions

  • the present application relates to the field of display technology, and in particular, to a protective film for an OLED packaging structure, an OLED packaging structure, and a method for preparing the protective film.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • OLEDs are very sensitive to oxygen and water, and oxygen and water penetrate into the OLED device, it will affect the life. Therefore, OLED devices are usually packaged with a packaging structure to isolate water vapor and oxygen.
  • OLED devices are usually packaged with a packaging structure to isolate water vapor and oxygen.
  • protective films In order to thin-film encapsulation of OLED in the production process and to meet the requirements of flexibility and thinness, it is necessary to attach protective films to OLED semi-finished products. For the subsequent process tearing film, the release force of the protective film must not be too high, otherwise it will destroy the film packaging The quality of the layer affects the packaging effect.
  • the edge of the OLED is prone to be contaminated by dust or particles, which affects the yield of the product.
  • the embodiments of the present application provide a protective film for an OLED packaging structure, an OLED packaging structure and a method for preparing the protective film, which can effectively protect the OLED packaging structure, and can better avoid dust contamination at the edge portion of the OLED packaging structure, and Improve yield and productivity.
  • An embodiment of the present application provides a protective film for an OLED packaging structure.
  • the protective film includes a base film and an auxiliary film located on at least two opposite sides of the base film and connected to the base film.
  • the base film is soft.
  • the protective film covers the OLED packaging structure
  • the base film covers the top of the OLED packaging structure
  • the auxiliary film covers at least opposite sides of the OLED packaging structure.
  • the base film includes a first base film and a second base film, and the first base film and the second base film are stacked on top of each other;
  • the auxiliary film It includes a first auxiliary film and a second auxiliary film.
  • the first auxiliary film and the second auxiliary film are stacked on top of each other.
  • the first auxiliary film is connected to at least opposite sides of the first base film, and the second The auxiliary film is connected to at least two opposite sides of the second base film.
  • the material of the first base film and the first auxiliary film is at least one of PET, OPP, or PMMA.
  • the material of the second base film and the second auxiliary film is at least one of acrylic glue system, silica gel system, and PU glue system.
  • the first auxiliary film covers a peripheral surface of the first base film
  • the second auxiliary film covers a peripheral surface of the second base film
  • the viscosity of the second auxiliary film is less than or equal to the viscosity of the first auxiliary film.
  • the protective film further includes a release film, and before the protective film is used to cover the OLED packaging structure, the bottom of the base film and the auxiliary film The surface covers the upper surface of the release film.
  • An embodiment of the present application further provides an OLED packaging structure, including:
  • An OLED encapsulation layer which includes a first inorganic material layer, a second inorganic material layer, and an organic material layer located between the first inorganic material layer and the second inorganic material layer;
  • a protective layer located on top of the OLED packaging layer the protective layer being a protective film of the OLED packaging structure, wherein the protective film includes a base film and at least two opposite sides of the base film, And an auxiliary film connected to the base film, the auxiliary film is softer than the base film, and when the protective film covers the OLED packaging structure, the base film covers the top of the OLED packaging structure, The auxiliary film covers at least two opposite sides of the OLED packaging structure.
  • connection layer is an evaporation layer
  • the OLED packaging layer is connected to the base layer through the evaporation layer.
  • the base film includes a first base film and a second base film, and the first base film and the second base film are stacked on top of each other;
  • the auxiliary film includes a first An auxiliary film and a second auxiliary film, the first auxiliary film and the second auxiliary film are stacked on top of each other, the first auxiliary film is connected to at least opposite sides of the first base film, and the second auxiliary film is connected On at least two opposite sides of the second base film.
  • the material of the first base film and the first auxiliary film is at least one of PET, OPP, or PMMA.
  • the material of the second base film and the second auxiliary film is at least one of acrylic glue system, silica gel system, and PU glue system.
  • the first auxiliary film covers a peripheral surface of the first base film
  • the second auxiliary film covers a peripheral surface of the second base film
  • the viscosity of the second auxiliary film is less than or equal to the viscosity of the first auxiliary film.
  • the protective film further includes a release film, and before the protective film is used to cover the OLED packaging structure, the lower surfaces of the base film and the auxiliary film are laminated on An upper surface of the release film.
  • the base film covers the first inorganic material layer on the top of the OLED packaging structure, and the auxiliary film Covering the peripheral surface of the OLED packaging structure.
  • the auxiliary film after the auxiliary film covers the peripheral surface of the OLED packaging structure, the auxiliary film automatically hangs down and extends to the peripheral surface of the OLED packaging structure. On the grassroots level.
  • An embodiment of the present application further provides a method for preparing a protective film of an OLED packaging structure, and the method includes:
  • An auxiliary film is formed on at least opposite sides of the base film, and the auxiliary film is softer than the base film.
  • the method further includes:
  • a release film is formed on the lower surfaces of the base film and the auxiliary film.
  • the forming a base film includes: forming a first base film and a second base film stacked on top of each other;
  • the forming an auxiliary film on at least opposite sides of the base film includes forming a first auxiliary film on at least opposite sides of the first base film, and the first auxiliary film is compared with the first base film.
  • the film is soft, and a second auxiliary film is formed on at least two opposite sides of the second base film, and the second cover film is softer than the second base film.
  • the protective film of the OLED package structure provided in the embodiments of the present application includes a base film and an auxiliary film located on at least two opposite sides of the base film and connected to the base film.
  • the base film is soft.
  • the protective film covers the OLED packaging structure
  • the base film covers the top of the OLED packaging structure
  • the auxiliary film covers at least opposite sides of the OLED packaging structure.
  • the protective film provided in the embodiments of the present application can effectively protect the OLED packaging structure, and can better avoid dust contamination at the edge portion of the OLED packaging structure, and improve yield and production efficiency.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an OLED packaging structure according to an embodiment of the present application.
  • FIG. 3 is another schematic structural diagram of an OLED packaging structure according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a protective film according to an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of a method for preparing a protective film of an OLED package structure according to an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a manufacturing process of a protective film according to an embodiment of the present application.
  • FIG. 7 is a schematic flowchart of a method for manufacturing an OLED packaging structure according to an embodiment of the present application.
  • FIG. 8 is another schematic flowchart of a method for manufacturing an OLED packaging structure according to an embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless specifically defined otherwise.
  • the "first" or “under” of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • the embodiments of the present application provide a protective film for an OLED packaging structure, an OLED packaging structure, and a method for preparing the protective film.
  • the OLED packaging structure can be integrated into a display panel or an electronic device.
  • the OLED packaging structure can be fabricated using an OLED packaging structure.
  • the electronic device may be a smart wearable device, a smart phone, a tablet computer, a smart TV and other devices.
  • the application provides a protective film for an OLED packaging structure, which is supplied to a laminator device after the thin film encapsulation (TFE) process to attach the base layer of the OLED process.
  • the protective film is used to protect the OLED semi-finished product and can effectively prevent dust contamination.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 100 may include a cover display panel 10, a control circuit 20, and a casing 30. It should be noted that the electronic device 100 shown in FIG. 1 is not limited to the above, and may also include other devices, such as a camera, an antenna structure, and a pattern unlocking module.
  • the display panel 10 is disposed on the casing 30, and the display panel 10 may be an OLED package structure.
  • the OLED packaging structure 10 may include a base layer 11, a connection layer 12, an OLED packaging layer 13, and a protective layer 14.
  • the OLED encapsulation layer 13 includes a first inorganic material layer 131, a second inorganic material layer 132, and an organic material layer 133 located between the first inorganic material layer 131 and the second inorganic material layer 132.
  • the protective layer 14 is located on top of the OLED packaging layer 13.
  • the protective layer 14 may be a protective film.
  • connection layer 12 may be an evaporation layer
  • the OLED encapsulation layer 13 is connected to the base layer 11 through the evaporation layer 12.
  • the display panel 10 may be fixed to the casing 30, and the display panel 10 and the casing 30 form a closed space to accommodate devices such as the control circuit 20.
  • the casing 30 may be made of a flexible material, such as a plastic casing or a silicone casing.
  • control circuit 20 is installed in the housing 30.
  • the control circuit 20 may be a main board of the electronic device 100.
  • the control circuit 20 may integrate a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of the functional components such as camera, distance sensor, ambient light sensor, receiver and processor.
  • the display panel 10 is installed in the casing 30. At the same time, the display panel 10 is electrically connected to the control circuit 20 to form a display surface of the electronic device 100.
  • the display panel 10 may include a display area and a non-display area.
  • the display area may be used for displaying a screen of the electronic device 100 or for a user to perform touch control. This non-display area can be used to set various functional components.
  • FIG. 2 is a schematic structural diagram of an OLED packaging structure provided in an embodiment of the present application
  • FIG. 3 is another structural schematic diagram of an OLED packaging structure provided in an embodiment of the present application.
  • the OLED packaging structure 10 may include a base layer 11, a connection layer 12, an OLED packaging layer 13 and a protective layer 14.
  • the OLED encapsulation layer 13 includes a first inorganic material layer 131, a second inorganic material layer 132, and an organic material layer 133 located between the first inorganic material layer 131 and the second inorganic material layer 132.
  • connection layer 12 may be an evaporation layer
  • the OLED encapsulation layer 13 is connected to the base layer 11 through the evaporation layer 12.
  • the protective layer 14 is located on top of the OLED packaging layer 13.
  • the protective layer 14 may be a protective film.
  • the protective film 14 may include a base film 141 and an auxiliary film 142.
  • the auxiliary film 142 is located on at least two opposite sides of the base film 141, and the auxiliary film 142 is connected to the base film 141.
  • the auxiliary film 142 is softer than the base film 141.
  • the base film 141 covers the first inorganic material layer 131 on top of the OLED packaging structure 10
  • the auxiliary film 142 covers at least opposite sides of the OLED packaging structure 10.
  • the auxiliary film 142 covers the peripheral surface of the OLED packaging structure 10
  • the auxiliary film 142 is softer than the base film 141, after the auxiliary film 142 will cover the peripheral surface of the OLED packaging structure 10, the auxiliary film 142 will The peripheral surface of the OLED package structure 10 extends to the upper surface 111 of the base layer 11, and the auxiliary film 142 extending to the upper surface 111 of the base layer 11 is attached to a non-outside area of the OLED package structure 10 orthographically projected on the base layer.
  • connection layer 12 and the OLED packaging layer 13 on the OLED packaging structure 10 are sealed in a closed space formed by the protective film 14 and the base layer 11, which can effectively seal the edge portion of the OLED packaging structure. , Effectively avoid dust contamination at the edge.
  • the auxiliary film 142 automatically hangs down to extend along the peripheral surface of the OLED packaging structure 10 to the base layer 11 and may extend to the base layer 11.
  • the surface may also extend to the side of the base layer 11 to cover at least two opposite sides of the OLED packaging structure 10, for example, to cover the peripheral surface of the OLED packaging structure 10.
  • the base film 141 includes a first base film 1411 and a second base film 1412, and the first base film 1411 and the second base film 1412 are stacked on top of each other;
  • the auxiliary film 142 includes a first auxiliary film 1421 and A second auxiliary film 1422, the first auxiliary film 1421 and the second auxiliary film 1422 are stacked on top of each other, the first auxiliary film 1421 is connected to at least opposite sides of the first base film 1411, and the second auxiliary film 1422 is connected to At least two opposite sides of the second base film 1412.
  • the material of the first base film 1411 and the first auxiliary film 1421 may be at least one of PET, OPP, or PMMA.
  • the material of the second base film 1412 and the second auxiliary film 1422 may be at least one of an acrylic rubber system, a silicone rubber system, and a PU rubber system.
  • the first base film 1411 can be a common base film commonly used on laminators, and has a certain hardness and stiffness, which can better protect the OLED packaging structure 10 and reduce scratches, bumps, and shatters.
  • the second base film 1412 is softer than the first base film 1411 and is easy to bend, stretch or deform.
  • the first auxiliary film 1421 can be a common adhesive film commonly used on laminators, has a certain hardness and stiffness, can better protect the OLED packaging structure 10, and reduce scratches, bumps, and shatters.
  • the material of the second auxiliary film 1422 is softer than that of the first auxiliary film 1421 and is easy to bend, stretch or deform.
  • the viscosity of the second auxiliary film 1422 is not greater than (less than or equal to) the viscosity of the first auxiliary film 1421, for example, the second auxiliary film
  • the viscosity of 1422 is smaller than the viscosity of the first auxiliary film 1421, which makes it easier to tear the film in subsequent processes.
  • the viscosity of the second auxiliary film 1422 also needs to satisfy the viscosity required for the OLED packaging structure 10 to be maintained in the next process.
  • the first base film 1411 is adhered to the first inorganic material layer 131 on the top of the OLED packaging structure 10 through an ordinary adhesive film as the second base film 1421.
  • a first inorganic material layer 131 covering the top of the OLED packaging structure 10 is used, and the auxiliary film 142 is adhered to at least opposite sides of the OLED packaging structure 10 through a soft adhesive film as a second auxiliary film 1422 to cover At least two opposite sides of the OLED packaging structure 10.
  • the first auxiliary film 1421 covers the peripheral surface of the first base film 1411
  • the second auxiliary film cover 1422 covers the peripheral surface of the second base film 1412.
  • the first base film 1411 is adhered to the first inorganic material layer 131 on the top of the OLED packaging structure 10 through an ordinary adhesive film as the second base film 1421.
  • a first inorganic material layer 131 covering the top of the OLED packaging structure 10 is used.
  • the auxiliary film 142 is adhered to the peripheral surface of the OLED packaging structure 10 through a soft adhesive film as a second auxiliary film 1422 to cover the OLED package.
  • the OLED package structure provided in the embodiment of the present application can be used to encapsulate the top and at least opposite sides of the OLED package structure by a protective film, wherein the protective film includes a base film and at least two opposite sides of the base film and is connected to the base film.
  • FIG. 4 is a schematic structural diagram of a protective film according to an embodiment of the present application.
  • the protective film 14 includes a base film 141, an auxiliary film 142, and a release film 143.
  • the auxiliary film 142 is located on at least two opposite sides of the base film 141, and the auxiliary film 142 is connected to the base film 141.
  • the auxiliary film 142 is softer than the base film 141.
  • the base film 141 includes a first base film 1411 and a second base film 1412.
  • the first base film 1411 and the second base film 1412 are stacked on top of each other.
  • the auxiliary film 142 includes a first auxiliary film 1421 and a second auxiliary film 1422.
  • the first auxiliary film 1421 and the second auxiliary film 1422 are stacked on top of each other.
  • the first auxiliary film 1421 is connected to at least opposite sides of the first base film 1411, and the second auxiliary film 1422 is connected to the second base film 1412. At least opposite sides.
  • the material of the first base film 1411 and the first auxiliary film 1421 may be at least one of PET, OPP, or PMMA.
  • the material of the second base film 1412 and the second auxiliary film 1422 may be at least one of an acrylic rubber system, a silicone rubber system, and a PU rubber system.
  • the first base film 1411 can be a common base film commonly used on laminators, and has a certain hardness and stiffness, which can better protect the OLED packaging structure 10 and reduce scratches, bumps, and shatters.
  • the second base film 1412 is softer than the first base film 1411 and is easy to bend, stretch or deform.
  • the first auxiliary film 1421 can be a common adhesive film commonly used on laminators, has a certain hardness and stiffness, can better protect the OLED packaging structure 10, and reduce scratches, bumps, and shatters.
  • the material of the second auxiliary film 1422 is softer than that of the first auxiliary film 1421 and is easy to bend, stretch or deform.
  • the viscosity of the second auxiliary film 1422 is not greater than (less than or equal to) the viscosity of the first auxiliary film 1421, for example, the second auxiliary film
  • the viscosity of 1422 is smaller than the viscosity of the first auxiliary film 1421, which makes it easier to tear the film in subsequent processes.
  • the viscosity of the second auxiliary film 1422 also needs to satisfy the viscosity required for the OLED packaging structure 10 to be maintained in the next process.
  • the first auxiliary film 1421 covers the peripheral surface of the first base film 1411
  • the second auxiliary film cover 1422 covers the peripheral surface of the second base film 1412.
  • the lower surfaces of the base film 141 and the auxiliary film 142 are laminated on the upper surface of the release film 143.
  • the protective film 14 can be effectively protected, and the release film 143 is torn off when the protective film 14 is used. It can more effectively avoid dust or water vapor pollution of the protective film 14 and prevent oxidation of the film.
  • the release film 143 on the protective film 14 is torn off, and the protective film from which the release film 143 is removed is attached to the OLED packaging structure 10 so that the substrate
  • the film 141 covers the top of the OLED packaging structure 10
  • the auxiliary film 142 covers at least two opposite sides of the OLED packaging structure 10.
  • the protective film of the OLED packaging structure provided in the embodiments of the present application includes a base film and an auxiliary film located on at least two opposite sides of the base film and connected to the base film.
  • the auxiliary film is softer than the base film.
  • the protective film covers the OLED packaging structure
  • the base film covers the top of the OLED packaging structure
  • the auxiliary film covers at least two opposite sides of the OLED packaging structure.
  • the protective film provided in the embodiments of the present application can effectively protect the OLED packaging structure, and can better avoid dust contamination at the edge portion of the OLED packaging structure, and improve yield and production efficiency.
  • the following describes the method for preparing the protective film of the OLED packaging structure and the method for manufacturing the OLED packaging structure.
  • FIG. 5 is a schematic flowchart of a method for preparing a protective film of an OLED package structure according to an embodiment of the present application.
  • the preparation method of the protective film of the OLED packaging structure includes:
  • a base film is formed. Among them, a first base film and a second base film that are stacked on top of each other are formed.
  • an auxiliary film is formed on at least two opposite sides of the base film, and the auxiliary film is softer than the base film.
  • a first auxiliary film is formed on at least opposite sides of the first base film, the first auxiliary film is softer than the first base film, and on at least opposite sides of the second base film A second auxiliary film is formed, and the second cover film is softer than the second base film.
  • the method further includes forming a release film on the lower surfaces of the base film and the auxiliary film.
  • the first base film is a common base film
  • the first auxiliary film is a soft base film
  • the second base film is a common adhesive film
  • the second auxiliary film is soft Soft adhesive film.
  • a slit coater Lip coater or T-die slot coater
  • the ordinary base film 1411 is coated on the ordinary adhesive film 1412.
  • a soft adhesive film 1422 is coated on the edge of the ordinary adhesive film 1412, and then a soft base film 1421 is coated on the edge of the ordinary base film 1411.
  • the soft base film 1421 is coated on the soft adhesive film 1422.
  • the ordinary base film 1411 and the ordinary adhesive film 1412 require greater rigidity and stiffness than the soft base film 1421 and the soft adhesive film 1422.
  • the protective film 14 is peeled from the coater 200 and laminated on the release film 143.
  • a base film is formed, and an auxiliary film is formed on at least opposite sides of the base film, and the auxiliary film is softer than the base film.
  • the protective film provided in the embodiment of the present application when the protective film covers the OLED packaging structure, the base film covers the top of the OLED packaging structure, and the auxiliary film covers at least opposite sides of the OLED packaging structure, which can effectively protect The OLED packaging structure can better avoid dust contamination at the edge portion of the OLED packaging structure, and improve yield and production efficiency.
  • FIG. 7 is a schematic flowchart of a method for manufacturing an OLED packaging structure according to an embodiment of the present application.
  • the preparation method of the OLED packaging structure includes:
  • Step 201 An OLED package structure is formed on a base layer.
  • the OLED package structure includes a first inorganic material layer, a second inorganic material layer, and an organic material layer located between the first inorganic material layer and the second inorganic material layer. ;
  • Step 202 A protective film is provided on the OLED packaging structure.
  • the protective film includes a base film and an auxiliary film located on at least two opposite sides of the base film and connected to the base film.
  • the auxiliary film is compared with the base film.
  • Step 203 Cover the first inorganic material layer on the top of the OLED packaging structure with the base film, and cover at least two opposite sides of the OLED packaging structure with the auxiliary film.
  • FIG. 8 is another schematic flowchart of a method for manufacturing an OLED packaging structure according to an embodiment of the present application.
  • the preparation method of the OLED packaging structure includes:
  • Step 301 forming an evaporation layer on the base layer
  • an OLED packaging structure is formed on the evaporation layer.
  • the OLED packaging structure includes a first inorganic material layer, a second inorganic material layer, and an organic material located between the first inorganic material layer and the second inorganic material layer.
  • Floor
  • Step 303 Connect the OLED packaging structure to the base layer through the evaporation layer.
  • Step 304 A protective film is provided on the OLED packaging structure.
  • the protective film includes a base film and an auxiliary film located on at least two opposite sides of the base film and connected to the base film.
  • the auxiliary film is compared with the base film.
  • the base film covers the first inorganic material layer on the top of the OLED packaging structure, and the auxiliary film covers at least two opposite sides of the OLED packaging structure.
  • an OLED packaging structure is formed on a base layer.
  • the OLED packaging structure includes a first inorganic material layer, a second inorganic material layer, and the first inorganic material layer and the first inorganic material layer.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请实施例公开了一种OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法，其中，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。

Description

OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法 技术领域
本申请涉及显示技术领域，具体涉及一种OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法。
 背景技术
目前，OLED（Organic Light-Emitting Diode, 有机发光二极管）是一种新型的照明以及显示技术，具有很多优异的特性，相比于传统的液晶显示器，OLED具有自发光、宽视角、高对比度、超快响应速率以及轻薄可挠等诸多优点，因此OLED在显示领域有着广阔的应用前景。
然而，由于OLED对氧气、水等非常敏感，氧气、水等渗透进入OLED器件后会影响寿命，因此，OLED器件通常采用封装结构进行封装，以隔绝水汽和氧气。为对生产制程中OLED进行薄膜封装以及满足柔性和轻薄的需求，需对OLED半成品进行保护膜贴合，为后续工艺撕膜需求，要求保护膜的离型力不能过高，否则会破坏薄膜封装层的质量，影响封装效果，但是，OLED的边缘容易发生被粉尘或微粒（particle)沾染的现象，影响产品的良率。
 技术问题
本申请实施例提供一种OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
 技术解决方案
本申请实施例提供一种OLED封装结构的保护膜，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。
在本申请实施例所述的OLED封装结构的保护膜中，所述基膜包括第一基膜和第二基膜，所述第一基膜和第二基膜上下层叠设置；所述辅膜包括第一辅膜和第二辅膜，所述第一辅膜和第二辅膜上下层叠设置，所述第一辅膜连接在所述第一基膜的至少相对两侧，所述第二辅膜连接在所述第二基膜的至少相对两侧。
在本申请实施例所述的OLED封装结构的保护膜中，所述第一基膜和第一辅膜的材质为PET、OPP或者PMMA中的至少一种。
在本申请实施例所述OLED封装结构的保护膜中，所述第二基膜和第二辅膜的材质为亚克力胶系、硅胶系、PU胶系中的至少一种。
在本申请实施例所述的OLED封装结构的保护膜中，所述第一辅膜覆盖所述第一基膜的周缘表面，所述第二辅膜覆盖所述第二基膜的周缘表面。
在本申请实施例所述的OLED封装结构的保护膜中，所述第二辅膜的粘度小于或者等于所述第一辅膜的粘度。
在本申请实施例所述的OLED封装结构的保护膜中，所述保护膜还包括离型膜，当所述保护膜用于覆盖所述OLED封装结构之前，所述基膜和辅膜的下表面覆盖于所述离型膜的上表面。
本申请实施例还提供一种OLED封装结构，包括：
基层；
连接层；
OLED封装层，所述OLED封装层包括第一无机材料层，第二无机材料层，以及位于所述第一无机材料层与第二无机材料层之间的有机材料层；
保护层，所述保护层位于所述OLED封装层的顶部，所述保护层为所述OLED封装结构的保护膜，其中，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。
在本申请实施例所述的OLED封装结构中，所述连接层为蒸镀层，所述OLED封装层通过所述蒸镀层与所述基层连接。
在本申请实施例所述的OLED封装结构中，所述基膜包括第一基膜和第二基膜，所述第一基膜和第二基膜上下层叠设置；所述辅膜包括第一辅膜和第二辅膜，所述第一辅膜和第二辅膜上下层叠设置，所述第一辅膜连接在所述第一基膜的至少相对两侧，所述第二辅膜连接在所述第二基膜的至少相对两侧。
在本申请实施例所述的OLED封装结构中，所述第一基膜和第一辅膜的材质为PET、OPP或者PMMA中的至少一种。
在本申请实施例所述的OLED封装结构中，所述第二基膜和第二辅膜的材质为亚克力胶系、硅胶系、PU胶系中的至少一种。
在本申请实施例所述的OLED封装结构中，所述第一辅膜覆盖所述第一基膜的周缘表面，所述第二辅膜覆盖所述第二基膜的周缘表面。
在本申请实施例所述的OLED封装结构中，所述第二辅膜的粘度小于或者等于所述第一辅膜的粘度。
在本申请实施例所述的OLED封装结构中，所述保护膜还包括离型膜，当所述保护膜用于覆盖所述OLED封装结构之前，所述基膜和辅膜的下表面层叠于所述离型膜的上表面。
在本申请实施例所述的OLED封装结构中，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部的第一无机材料层，所述辅膜覆盖所述OLED封装结构的周缘表面。
在本申请实施例所述的OLED封装结构中，在所述辅膜覆盖所述OLED封装结构的周缘表面后，所述辅膜自动垂下并沿着所述OLED封装结构的周缘表面延伸至所述基层上。
本申请实施例还提供一种OLED封装结构的保护膜的制备方法，所述方法包括：
形成基膜；
在所述基膜的至少相对两侧形成辅膜，所述辅膜相较于所述基膜软。
在本申请实施例所述的OLED封装结构的保护膜的制备方法中，所述方法还包括：
在所述基膜和辅膜的下表面形成离型膜。
在本申请实施例所述的OLED封装结构的保护膜的制备方法中，所述形成基膜，包括：形成上下层叠设置的第一基膜和第二基膜；
所述在所述基膜的至少相对两侧形成辅膜，包括：在所述第一基膜的至少相对两侧形成第一辅膜，所述第一辅膜相较于所述第一基膜软，以及在所述第二基膜的至少相对两侧形成第二辅膜，所述第二覆膜相较于所述第二基膜软。
 有益效果
本申请实施例提供的OLED封装结构的保护膜，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。本申请实施例提供的保护膜，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的结构示意图。
图2为本申请实施例提供的OLED封装结构的结构示意图。
图3为本申请实施例提供的OLED封装结构的另一结构示意图。
图4为本申请实施例提供的保护膜的结构示意图。
图5为本申请实施例提供的OLED封装结构的保护膜的制备方法的流程示意图。
图6为本申请实施例提供的保护膜的制作工艺示意图。
图7为本申请实施例提供的OLED封装结构的制备方法的流程示意图。
图8为本申请实施例提供的OLED封装结构的制备方法的另一流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本申请实施例提供一种OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法，该OLED封装结构可以集成在显示面板或电子设备中，该OLED封装结构可以采用OLED封装结构的制作方法制成，该电子设备可以是智能穿戴设备、智能手机、平板电脑、智能电视等设备。
现有的OLED制程中，贴膜机用的保护膜设计简单，不能有效的阻挡粉尘沾染的现象。本申请提供一种OLED封装结构的保护膜，供给薄膜封装（TFE）制程后过塑机（laminator）设备对OLED制程基层进行贴合，该保护膜用于保护OLED半成品并能够有效防止粉尘沾染。
请参阅图1，图1为本申请实施例提供的电子设备的结构示意图。该电子设备100可以包括盖板显示面板10、控制电路20、以及壳体30。需要说明的是，图1所示的电子设备100并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。
其中，显示面板10设置于壳体30上，该显示面板10可以为OLED封装结构。
其中，该OLED封装结构10，可以包括基层11、连接层12、OLED封装层13和保护层14。
其中，该OLED封装层13包括第一无机材料层131，第二无机材料层132，以及位于该第一无机材料层131与第二无机材料层132之间的有机材料层133。
该保护层14位于该OLED封装层13的顶部，该保护层14可以为保护膜。
在一些实施例中，该连接层12可以为蒸镀层，该 OLED封装层13通过该蒸镀层12与该基层11连接。
在一些实施例中，显示面板10可以固定到壳体30上，显示面板10和壳体30形成密闭空间，以容纳控制电路20等器件。
在一些实施例中，壳体30可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路20安装在壳体30中，该控制电路20可以为电子设备100的主板，控制电路20上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该显示面板10安装在壳体30中，同时，该显示面板10电连接至控制电路20上，以形成电子设备100的显示面。该显示面板10可以包括显示区域和非显示区域。该显示区域可以用来显示电子设备100的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
请参阅图2及图3，图2为本申请实施例提供的OLED封装结构的结构示意图，图3为本申请实施例提供的OLED封装结构的另一结构示意图。该OLED封装结构10可以包括基层11、连接层12、OLED封装层13和保护层14。
其中，该OLED封装层13包括第一无机材料层131，第二无机材料层132，以及位于该第一无机材料层131与第二无机材料层132之间的有机材料层133。
在一些实施例中，该连接层12可以为蒸镀层，该 OLED封装层13通过该蒸镀层12与该基层11连接。
该保护层14位于该OLED封装层13的顶部，该保护层14可以为保护膜。
如图3所示，该保护膜14可以包括基膜141和辅膜142。其中，该辅膜142位于该基膜141的至少相对两侧，且该辅膜142与该基膜141连接，该辅膜142相比该基膜141软，当保护膜14覆盖OLED封装结构10时，该基膜141覆盖于该OLED封装结构10的顶部，该辅膜142覆盖该OLED封装结构10的至少相对两侧。
具体的，当保护膜14覆盖OLED封装结构10时，该基膜141覆盖于该OLED封装结构10的顶部的第一无机材料层131，该辅膜142覆盖该OLED封装结构10的至少相对两侧。例如，该辅膜142覆盖该OLED封装结构10的周缘表面，且由于该辅膜142相比该基膜141软，则在将覆盖该OLED封装结构10的周缘表面后，该辅膜142会沿着该OLED封装结构10的周缘表面延伸至基层11的上表面111，该延伸至基层11的上表面111的辅膜142贴合于OLED封装结构10正投影在该基层上的区域之外的非投影区域上，以将该OLED封装结构10上的连接层12、OLED封装层13封装在由保护膜14和基层11之间形成的密闭空间内，可以有效的对OLED封装结构的边缘部分进行密封，有效避免了边缘部分的粉尘沾染。
例如，该辅膜142覆盖该OLED封装结构10的周缘表面后，该辅膜142会自动垂下来，以沿着该OLED封装结构10的周缘表面延伸至基层11上，可以延伸至基层11的上表面，也可以延伸至基层11的侧面，以将该OLED封装结构10的至少相对两侧进行包覆，比如，将该OLED封装结构10的周缘表面进行包覆。
在一些实施例中，该基膜141包括第一基膜1411和第二基膜1412，该第一基膜1411和第二基膜1412上下层叠设置；该辅膜142包括第一辅膜1421和第二辅膜1422，该第一辅膜1421和第二辅膜1422上下层叠设置，该第一辅膜1421连接在该第一基膜1411的至少相对两侧，该第二辅膜1422连接在该第二基膜1412的至少相对两侧。
例如，该第一基膜1411和第一辅膜1421的材质可以为PET、OPP或者PMMA中的至少一种。
例如，该第二基膜1412和第二辅膜1422的材质可以为亚克力胶系、硅胶系、PU胶系中的至少一种。
其中，该第一基膜1411可以为过塑机上常用的普通基膜，具有一定的硬度和挺性，可以较好的保护OLED封装结构10，减少被划损、撞裂、撞碎等现象。而第二基膜1412相比于第一基膜1411的材质更软，易于弯折、拉伸或变形。
其中，该第一辅膜1421可以为过塑机上常用的普通胶粘膜，具有一定的硬度和挺性，可以较好的保护OLED封装结构10，减少被划损、撞裂、撞碎等现象。而第二辅膜1422相比于第一辅膜1421的材质更软，易于弯折、拉伸或变形。例如，为了为后续工艺撕膜需求，以保证保护膜的离型力不过高，则第二辅膜1422的粘度不大于（小于或者等于）第一辅膜1421的粘度，比如，第二辅膜1422的粘度小于第一辅膜1421的粘度，使得后续工艺中可以更容易地撕膜。其中，第二辅膜1422的粘度还需满足OLED封装结构10在搬运至下个制程中不脱离所需的粘度。
具体的，当保护膜14覆盖OLED封装结构10时，该第一基膜1411通过作为第二基膜1421的普通胶粘膜粘接在该OLED封装结构10的顶部的第一无机材料层131上，以覆盖于该OLED封装结构10的顶部的第一无机材料层131，该辅膜142通过作为第二辅膜1422的软胶粘膜粘接在该OLED封装结构10的至少相对两侧上，以覆盖该OLED封装结构10的至少相对两侧。
在一些实施例中，该第一辅膜1421覆盖该第一基膜1411的周缘表面，该第二辅膜覆1422盖该第二基膜1412的周缘表面。
具体的，当保护膜14覆盖OLED封装结构10时，该第一基膜1411通过作为第二基膜1421的普通胶粘膜粘接在该OLED封装结构10的顶部的第一无机材料层131上，以覆盖于该OLED封装结构10的顶部的第一无机材料层131，该辅膜142通过作为第二辅膜1422的软胶粘膜粘接在该OLED封装结构10的周缘表面，以覆盖该OLED封装结构10的周缘表面。
本申请实施例提供的OLED封装结构，可以通过保护膜封装OLED封装结构的顶部以及至少相对两侧，其中该保护膜包括基膜以及位于该基膜至少相对两侧、且与该基膜连接的辅膜，该辅膜相比该基膜软，当该保护膜覆盖该OLED封装结构时，该基膜覆盖于该OLED封装结构的顶部，该辅膜覆盖该OLED封装结构的至少相对两侧，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
请参阅图4，图4为本申请实施例提供的保护膜的结构示意图。该保护膜14包括基膜141，辅膜142和离型膜143。
其中，该辅膜142位于该基膜141的至少相对两侧，且该辅膜142与该基膜141连接，该辅膜142相比该基膜141软。
该基膜141包括第一基膜1411和第二基膜1412，该第一基膜1411和第二基膜1412上下层叠设置；该辅膜142包括第一辅膜1421和第二辅膜1422，该第一辅膜1421和第二辅膜1422上下层叠设置，该第一辅膜1421连接在该第一基膜1411的至少相对两侧，该第二辅膜1422连接在该第二基膜1412的至少相对两侧。
例如，该第一基膜1411和第一辅膜1421的材质可以为PET、OPP或者PMMA中的至少一种。
例如，该第二基膜1412和第二辅膜1422的材质可以为亚克力胶系、硅胶系、PU胶系中的至少一种。
其中，该第一基膜1411可以为过塑机上常用的普通基膜，具有一定的硬度和挺性，可以较好的保护OLED封装结构10，减少被划损、撞裂、撞碎等现象。而第二基膜1412相比于第一基膜1411的材质更软，易于弯折、拉伸或变形。
其中，该第一辅膜1421可以为过塑机上常用的普通胶粘膜，具有一定的硬度和挺性，可以较好的保护OLED封装结构10，减少被划损、撞裂、撞碎等现象。而第二辅膜1422相比于第一辅膜1421的材质更软，易于弯折、拉伸或变形。例如，为了为后续工艺撕膜需求，以保证保护膜的离型力不过高，则第二辅膜1422的粘度不大于（小于或者等于）第一辅膜1421的粘度，比如，第二辅膜1422的粘度小于第一辅膜1421的粘度，使得后续工艺中可以更容易地撕膜。其中，第二辅膜1422的粘度还需满足OLED封装结构10在搬运至下个制程中不脱离所需的粘度。
在一些实施例中，该第一辅膜1421覆盖该第一基膜1411的周缘表面，该第二辅膜覆1422盖该第二基膜1412的周缘表面。
其中，当该保护膜14用于覆盖该OLED封装结构10之前，该基膜141和辅膜142的下表面层叠于该离型膜143的上表面。通过将该基膜141和辅膜142的下表面层叠于该离型膜143的上表面，可以有效的保护该保护膜14，在使用该保护膜14时再将该离型膜143撕掉，能更有效的避免保护膜14的粉尘或水汽污染以及避免膜的氧化。
其中，当保护膜14覆盖OLED封装结构10时，将保护膜14上的离型膜143撕掉，并将撕掉离型膜143的保护膜贴合到OLED封装结构10上，以使该基膜141覆盖于该OLED封装结构10的顶部，该辅膜142覆盖该OLED封装结构10的至少相对两侧。
本申请实施例提供的OLED封装结构的保护膜，该保护膜包括基膜以及位于该基膜至少相对两侧、且与该基膜连接的辅膜，该辅膜相比该基膜软，当该保护膜覆盖该OLED封装结构时，该基膜覆盖于该OLED封装结构的顶部，该辅膜覆盖该OLED封装结构的至少相对两侧。本申请实施例提供的保护膜，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
为了进一步描述本申请，下面从OLED封装结构的保护膜的制备方法以及OLED封装结构的制备方法的方向进行描述。
请参阅图5至图6，图5为本申请实施例提供的OLED封装结构的保护膜的制备方法的流程示意图，图6为本申请实施例提供的保护膜的制作工艺示意图。该OLED封装结构的保护膜的制备方法包括：
步骤101，形成基膜。其中，形成上下层叠设置的第一基膜和第二基膜。
步骤102，在所述基膜的至少相对两侧形成辅膜，所述辅膜相较于所述基膜软。其中，在所述第一基膜的至少相对两侧形成第一辅膜，所述第一辅膜相较于所述第一基膜软，以及在所述第二基膜的至少相对两侧形成第二辅膜，所述第二覆膜相较于所述第二基膜软。
在一些实施例中，还包括在所述基膜和辅膜的下表面形成离型膜。
例如，第一基膜为普通基膜（common base film），第一辅膜为软基膜（soft base film），第二基膜为普通胶粘膜（common adhesive film），第二辅膜为软胶粘膜（soft adhesive film）。
例如，如图6所示，可以使用夹缝式涂布机（Lip coater or T-die slot coater）实现此保护膜制作，具体流程如下：
A、利用夹缝式涂布机200将普通胶粘膜1412涂布在滚筒300的中间位置。
B、在普通胶粘膜1412上再涂布普通基膜1411。
C、在普通胶粘膜1412的边缘处涂布有软胶粘膜1422，然后在普通基膜1411的边缘处涂布有软基膜1421，其中，软基膜1421涂布在软胶粘膜1422上。其中，普通基膜1411和普通胶粘膜1412相比于软基膜1421和软胶粘膜1422，要求有较大的硬度与挺性。
D、完成涂布后，将该保护膜14从涂布机200上揭下，并层叠在离型膜143上。
E、在使用时，撕除该保护膜14上的离型膜143。
本申请实施例提供的OLED封装结构的保护膜的制备方法，通过形成基膜，在所述基膜的至少相对两侧形成辅膜，所述辅膜相较于所述基膜软。本申请实施例提供的保护膜，当该保护膜覆盖该OLED封装结构时，该基膜覆盖于该OLED封装结构的顶部，该辅膜覆盖该OLED封装结构的至少相对两侧，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
请参阅图7，图7为本申请实施例提供的OLED封装结构的制备方法的流程示意图。该OLED封装结构的制备方法包括：
步骤201，在基层上形成OLED封装结构，所述OLED封装结构包括第一无机材料层，第二无机材料层，以及位于所述第一无机材料层与第二无机材料层之间的有机材料层；
步骤202，在OLED封装结构上设置保护膜，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软；
步骤203，将所述基膜覆盖所述OLED封装结构顶部的第一无机材料层，以及将所述辅膜覆盖所述OLED封装结构的至少相对两侧。
请参阅图8，图8为本申请实施例提供的OLED封装结构的制备方法的另一流程示意图。该OLED封装结构的制备方法包括：
步骤301，在基层上形成蒸镀层；
步骤302，在蒸镀层上形成OLED封装结构，所述OLED封装结构包括第一无机材料层，第二无机材料层，以及位于所述第一无机材料层与第二无机材料层之间的有机材料层；
步骤303，将OLED封装结构通过所述蒸镀层连接在所述基层上；
步骤304，在OLED封装结构上设置保护膜，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软；
步骤305，将所述基膜覆盖所述OLED封装结构顶部的第一无机材料层，以及将所述辅膜覆盖所述OLED封装结构的至少相对两侧。
本申请实施例提供的OLED封装结构的制备方法，通过在基层上形成OLED封装结构，所述OLED封装结构包括第一无机材料层，第二无机材料层，以及位于所述第一无机材料层与第二无机材料层之间的有机材料层；在OLED封装结构上设置保护膜，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软；将所述基膜覆盖所述OLED封装结构顶部的第一无机材料层，以及将所述辅膜覆盖所述OLED封装结构的至少相对两侧，可以有效的保护OLED封装结构，且能更好的避免了OLED封装结构边缘部分的粉尘沾染，以及提高良率和生产效率。
以上对本申请实施例提供的OLED封装结构的保护膜、OLED封装结构及其保护膜的制备方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种OLED封装结构的保护膜，其包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。
  2. 如权利要求1所述的OLED封装结构的保护膜，其中，所述基膜包括第一基膜和第二基膜，所述第一基膜和第二基膜上下层叠设置；所述辅膜包括第一辅膜和第二辅膜，所述第一辅膜和第二辅膜上下层叠设置，所述第一辅膜连接在所述第一基膜的至少相对两侧，所述第二辅膜连接在所述第二基膜的至少相对两侧。
  3. 如权利要求2所述的OLED封装结构的保护膜，其中，所述第一基膜和第一辅膜的材质为PET、OPP或者PMMA中的至少一种。
  4. 如权利要求2或3所述OLED封装结构的保护膜，其中，所述第二基膜和第二辅膜的材质为亚克力胶系、硅胶系、PU胶系中的至少一种。
  5. 如权利要求2所述的OLED封装结构的保护膜，其中，所述第一辅膜覆盖所述第一基膜的周缘表面，所述第二辅膜覆盖所述第二基膜的周缘表面。
  6. 如权利要求2所述的OLED封装结构的保护膜，其中，所述第二辅膜的粘度小于或者等于所述第一辅膜的粘度。
  7. 如权利要求1所述的OLED封装结构的保护膜，其中，所述保护膜还包括离型膜，当所述保护膜用于覆盖所述OLED封装结构之前，所述基膜和辅膜的下表面层叠于所述离型膜的上表面。
  8. 一种OLED封装结构，其包括：
    基层；
    连接层；
    OLED封装层，所述OLED封装层包括第一无机材料层，第二无机材料层，以及位于所述第一无机材料层与第二无机材料层之间的有机材料层；
    保护层，所述保护层位于所述OLED封装层的顶部，所述保护层为所述OLED封装结构的保护膜，其中，所述保护膜包括基膜以及位于所述基膜至少相对两侧、且与所述基膜连接的辅膜，所述辅膜相比所述基膜软，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部，所述辅膜覆盖所述OLED封装结构的至少相对两侧。
  9. 如权利要求8所述的OLED封装结构，其中，所述连接层为蒸镀层，所述OLED封装层通过所述蒸镀层与所述基层连接。
  10. 如权利要求8所述的OLED封装结构，其中，所述基膜包括第一基膜和第二基膜，所述第一基膜和第二基膜上下层叠设置；所述辅膜包括第一辅膜和第二辅膜，所述第一辅膜和第二辅膜上下层叠设置，所述第一辅膜连接在所述第一基膜的至少相对两侧，所述第二辅膜连接在所述第二基膜的至少相对两侧。
  11. 如权利要求10所述的OLED封装结构，其中，所述第一基膜和第一辅膜的材质为PET、OPP或者PMMA中的至少一种。
  12. 如权利要求10或11所述OLED封装结构，其中，所述第二基膜和第二辅膜的材质为亚克力胶系、硅胶系、PU胶系中的至少一种。
  13. 如权利要求10所述的OLED封装结构，其中，所述第一辅膜覆盖所述第一基膜的周缘表面，所述第二辅膜覆盖所述第二基膜的周缘表面。
  14. 如权利要求10所述的OLED封装结构，其中，所述第二辅膜的粘度小于或者等于所述第一辅膜的粘度。
  15. 如权利要求8所述的OLED封装结构，其中，所述保护膜还包括离型膜，当所述保护膜用于覆盖所述OLED封装结构之前，所述基膜和辅膜的下表面层叠于所述离型膜的上表面。
  16. 如权利要求8所述的OLED封装结构，其中，当所述保护膜覆盖所述OLED封装结构时，所述基膜覆盖于所述OLED封装结构的顶部的第一无机材料层，所述辅膜覆盖所述OLED封装结构的周缘表面。
  17. 如权利要求16所述的OLED封装结构，其中，在所述辅膜覆盖所述OLED封装结构的周缘表面后，所述辅膜自动垂下并沿着所述OLED封装结构的周缘表面延伸至所述基层上。
  18. 一种OLED封装结构的保护膜的制备方法，其包括：
    形成基膜；
    在所述基膜的至少相对两侧形成辅膜，所述辅膜相较于所述基膜软。
  19. 如权利要求18所述的OLED封装结构的保护膜的制备方法，其中，所述方法还包括：
    在所述基膜和辅膜的下表面形成离型膜。
  20. 如权利要求18所述的OLED封装结构的保护膜的制备方法，其中，所述形成基膜，包括：形成上下层叠设置的第一基膜和第二基膜；
    所述在所述基膜的至少相对两侧形成辅膜，包括：在所述第一基膜的至少相对两侧形成第一辅膜，所述第一辅膜相较于所述第一基膜软，以及在所述第二基膜的至少相对两侧形成第二辅膜，所述第二覆膜相较于所述第二基膜软。
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