WO2023190309A1 - 表面改質材用樹脂組成物 - Google Patents

表面改質材用樹脂組成物 Download PDF

Info

Publication number
WO2023190309A1
WO2023190309A1 PCT/JP2023/012147 JP2023012147W WO2023190309A1 WO 2023190309 A1 WO2023190309 A1 WO 2023190309A1 JP 2023012147 W JP2023012147 W JP 2023012147W WO 2023190309 A1 WO2023190309 A1 WO 2023190309A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
surface modification
modification material
resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/012147
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
敏彦 片山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to KR1020247034089A priority Critical patent/KR20240170544A/ko
Priority to CN202380027266.2A priority patent/CN118871514A/zh
Priority to JP2024512442A priority patent/JPWO2023190309A1/ja
Publication of WO2023190309A1 publication Critical patent/WO2023190309A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00

Definitions

  • the present invention relates to a resin composition for surface modification materials.
  • fan-out type WLP fan-out type wafer level package
  • connections provided to the semiconductor chips in the structure are An insulating resin film has been formed by coating a varnish-like resin composition on the surface area on the side where the terminal is arranged (Patent Document 1, etc.)
  • a fan-out type WLP obtained by a conventional manufacturing process is, for example, a structure in which a semiconductor chip is sealed with a resin composition such as an epoxy resin encapsulant, that is, a structure including a cured epoxy resin. It is made of a synthetic resin film.
  • the present inventors studied fan-out WLPs obtained by the above-described conventional manufacturing process. As a result, it was found that the quality of this insulating resin film greatly affects the reliability of fan-out type WLP.
  • a resin varnish which is a raw material for an insulating resin film
  • the solvent contained in the resin varnish is dried, and the raw material is cured.
  • Forms a sticky resin film The present inventors found that in the above treatment, the surface of the structure was not sufficiently wetted with the resin varnish, which was an ideal condition, and that in particularly extreme cases, the resin varnish was repelled by the surface of the structure, and the structure It was confirmed that there were cases where the resin varnish was not sufficiently applied to the surface. From the above, the present inventors found that in order to improve the reliability of fan-out type WLP, it is important to improve the film quality of the insulating resin film formed on the sealing structure. .
  • an object of the present invention is to improve the reliability of processing performed on the surface of a structure containing a cured epoxy resin. More specifically, the objective was to improve the quality of the insulating resin film when performing a process of forming an insulating resin film in contact with the surface.
  • the above-mentioned resin composition for surface modification material used in a process including A resin composition for a surface modification material, the resin composition for a surface modification material containing a phenoxy resin.
  • a resin composition for surface modification material containing an epoxy resin.
  • a resin composition for a surface modification material wherein the epoxy resin includes a trifunctional or higher functional epoxy resin.
  • a resin composition for a surface modification material, wherein the epoxy resin contains one or more selected from the group consisting of a phenol novolac type epoxy resin and a cresol novolac type epoxy resin.
  • a resin composition for a surface modification material in the resin composition for surface modification material according to any one of [1] to [6] above, A resin composition for a surface modification material, further comprising a surfactant. [8] In the resin composition for surface modification material according to any one of [1] to [7] above, A resin composition for a surface modification material, further comprising a solvent. [9] In the resin composition for surface modification material according to any one of [1] to [8] above, A resin composition for a surface modification material, wherein the cured product of the epoxy resin composition further contains an inorganic filler.
  • the above-mentioned process further modifies the surface of the above-mentioned surface to produce a photosensitive material containing one or more selected from the group consisting of a polybenzoxazole resin or a precursor thereof, and a polyimide resin or a precursor thereof.
  • a resin composition for a surface modification material which includes a step of attaching a resin composition.
  • the resin composition for surface modification material has a contact angle of ⁇ 1 with respect to the photosensitive resin composition of the first region before the step of attaching the resin composition for surface modification material.
  • a resin composition for a surface modification material wherein ⁇ 1> ⁇ 2, where ⁇ 2 is a contact angle of the first region with the photosensitive resin composition after the step of removing the resin composition.
  • ⁇ 1> ⁇ 2 is a contact angle of the first region with the photosensitive resin composition after the step of removing the resin composition.
  • a resin composition for a surface modification material wherein the surface includes a second region formed of metal wiring.
  • the resin composition for surface modification material has a contact angle of ⁇ 1 with respect to the photosensitive resin composition of the second region before the step of attaching the resin composition for surface modification material.
  • a resin composition for a surface modification material wherein ⁇ 1 ⁇ 2, where ⁇ 2 is a contact angle of the second region to the photosensitive resin composition after the step of removing the resin composition.
  • a non-photosensitive resin composition for surface modification materials In the resin composition for surface modification material according to any one of [1] to [13] above, A non-photosensitive resin composition for surface modification materials.
  • a resin composition for surface modification material that does not substantially contain a curing agent In the resin composition for surface modification material according to any one of [1] to [15] above, A resin composition for surface modification material that does not substantially contain a curing agent.
  • a resin composition for a surface modification material wherein (amount of the epoxy resin/amount of the phenoxy resin) is 1 to 10 on a mass basis.
  • a resin composition for surface modification materials used in the manufacture of electronic devices In the resin composition for surface modification material according to any one of [4] to [6] above, A resin composition for a surface modification material, wherein (amount of the epoxy resin/amount of the phenoxy resin) is 1 to 10 on a mass basis.
  • a resin composition for a surface modification material that can improve the wettability of the surface of a structure and improve the reliability of processing performed on the surface of a structure containing a cured epoxy resin composition. be done.
  • FIG. 1 is a longitudinal cross-sectional view showing an example of the configuration of an electronic device according to an embodiment.
  • a description that does not indicate whether it is substituted or unsubstituted includes both those without a substituent and those with a substituent.
  • alkyl group includes not only an alkyl group without a substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
  • (meth)acrylic represents a concept that includes both acrylic and methacrylic. The same applies to similar expressions such as "(meth)acrylate”.
  • organic group as used herein means an atomic group obtained by removing one or more hydrogen atoms from an organic compound, unless otherwise specified.
  • a "monovalent organic group” refers to an atomic group obtained by removing one hydrogen atom from an arbitrary organic compound.
  • the resin composition for a surface modification material of this embodiment includes a step of attaching the resin composition for a surface modification material to the surface of a structure including a first region formed by a cured product of an epoxy resin composition, and then , a step of modifying the surface by removing the resin composition for the surface modification material from the surface, the resin composition for the surface modification material used in a process including the step of modifying the surface by removing the resin composition for the surface modification material from the surface;
  • the resin composition for materials contains a phenoxy resin.
  • the resin composition for a surface modification material of the present embodiment it is possible to improve the reliability of the treatment performed on the surface of a structure containing a cured epoxy resin composition.
  • the quality of the insulating resin film can be improved.
  • the resin composition for a surface modification material of this embodiment contains a phenoxy resin.
  • Phenoxy resin has an epoxy resin skeleton and many hydroxyl groups (-OH) in the molecule. Therefore, when the resin composition for surface modification material is removed from the surface of a structure containing a cured epoxy resin composition, it is thought that a very small amount of phenoxy resin remains on the surface in a strongly bound state. .
  • the resin composition for the surface modification material of this embodiment is sufficiently removed from the surface by washing with a solvent, etc., but a very small amount of phenoxy resin that cannot be visually confirmed is strongly removed by interaction with the surface. It is thought that it remains in an adsorbed state. It is thought that this changed the properties of the surface and improved the reliability of subsequent treatments performed on the surface, such as the formation of an insulating resin film.
  • the insulating resin film formed on the surface is free of microvoids and has sufficient adhesion at the interface with the surface, and its quality is significantly improved. It is thought that this will improve.
  • the resin composition for a surface modification material of the present embodiment attaches the resin composition for a surface modification material to the surface of the structure including the first region formed by the cured product of the epoxy resin composition. and then modifying the surface by removing the resin composition for surface modification material from the surface.
  • the resin composition for surface modification material of this embodiment is preferably applied to the manufacture of electronic devices such as semiconductor devices. That is, the above-mentioned structure may be a member in manufacturing an electronic device such as a semiconductor device. Furthermore, each of the above processes may be part of the manufacturing process of an electronic device such as a semiconductor device.
  • adhering means that the resin composition for surface modifier of this embodiment comes into contact with the above-mentioned surface, and any known method can be used as a means for this.
  • Known methods include, for example, table coating, spin coating, dip coating, die coating, spray coating, bar coating, roll coating, curtain flow coating, slit coating, inkjet coating, and dispensing. etc. can be mentioned. These are appropriately selected in consideration of the shape, size, productivity, etc. of the structure.
  • the resin composition for a surface modification material of this embodiment contains a phenoxy resin.
  • phenoxy resin is a polyhydroxypolyether synthesized from bisphenols and epichlorohydrin, but in this specification, it refers to polyfunctional epoxy resins (e.g., bisepoxy compounds) and polyfunctional phenols. Polymers obtained by polyaddition reaction (phenoxy resin in a broad sense) are also included in phenoxy resin.
  • phenoxy resins include phenoxy resins containing a bisphenol A skeleton, phenoxy resins containing a bisphenol F skeleton, phenoxy resins containing a bisphenol A skeleton and a bisphenol F skeleton, biphenyl type phenoxy resins, phenoxy resins containing a bisphenol S skeleton, and biphenyl type phenoxy resins.
  • examples include phenoxy resins and phenoxy resins containing a bisphenol S skeleton.
  • phenoxy resins containing a bisphenol A skeleton it is preferable to include one or more selected from the group consisting of phenoxy resins containing a bisphenol A skeleton, phenoxy resins containing a bisphenol F skeleton, and phenoxy resins containing a bisphenol A skeleton and a bisphenol F skeleton. At this time, these may be used alone or in combination of two or more.
  • the phenoxy resin preferably has a reactive group such as an epoxy group at both ends of the molecular chain or within the molecular chain.
  • the reactive group in the phenoxy resin is capable of crosslinking with the epoxy group in the epoxy resin.
  • the weight average molecular weight Mw of the phenoxy resin is preferably 2,500 or more and 120,000 or less.
  • the lower limit of the weight average molecular weight Mw of the phenoxy resin is preferably 2,500 or more, more preferably 2,750 or more, and particularly preferably 3,000 or more.
  • the weight average molecular weight Mw of the phenoxy resin is equal to or greater than the above lower limit, the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • the upper limit of the weight average molecular weight Mw of the phenoxy resin is preferably 120,000 or less, more preferably 80,000 or less, particularly preferably 60,000 or less.
  • the weight average molecular weight Mw of the phenoxy resin is less than or equal to the above upper limit, the wetting and spreading properties during surface modification treatment can be improved, and the workability of surface modification treatment can be improved.
  • the content of phenoxy resin in the resin composition for a surface modification material of the present embodiment to be at least the above lower limit value and at most the above upper limit value, the wettability and surface modification of the surface of the structure can be improved after the surface modification treatment. It is possible to obtain a resin composition for a surface modification material that is well balanced with processing workability.
  • a polystyrene equivalent value is used, which is determined from a standard polystyrene (PS) calibration curve obtained by GPC measurement, for example.
  • PS polystyrene
  • the measurement conditions are, for example, as follows.
  • the lower limit of the content of phenoxy resin in the resin composition for surface modification material of this embodiment is when the total solid content in the resin composition for surface modification material of this embodiment is 100 parts by mass. , preferably 5 parts by mass or more, more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more.
  • the content of the phenoxy resin is at least the above lower limit, the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • the total solid content in the resin composition for surface modification material of this embodiment is 100 parts by mass.
  • the amount is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, and even more preferably 40 parts by mass or less.
  • the content of the phenoxy resin is at most the above upper limit, the wetting and spreading properties during the surface modification treatment can be improved, and the workability of the surface modification treatment can be improved.
  • the content of phenoxy resin in the resin composition for a surface modification material of the present embodiment to be at least the above lower limit value and at most the above upper limit value, the wettability and surface modification of the surface of the structure can be improved after the surface modification treatment. It is possible to obtain a resin composition for a surface modification material that is well balanced with processing workability.
  • the resin composition for a surface modification material of this embodiment further contains an epoxy resin. This improves the solvent solubility of the phenoxy resin and improves the wetting and spreading properties when the resin composition for surface modification material of this embodiment is attached to the surface of the structure, as well as The wettability of the surface of the structure can be improved more suitably.
  • an epoxy resin having two or more epoxy groups in one molecule can be used.
  • the epoxy resin monomers, oligomers, and polymers in general can be used, and the molecular weight and molecular structure thereof are not particularly limited.
  • the epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, cresol naphthol type epoxy resin, biphenyl type epoxy resin, biphenylaralkyl type epoxy resin, phenoxy resin, naphthalene skeleton type epoxy resin, and bisphenol A type epoxy resin.
  • Resin bisphenol A diglycidyl ether type epoxy resin, bisphenol F type epoxy resin, bisphenol F diglycidyl ether type epoxy resin, bisphenol S diglycidyl ether type epoxy resin, glycidyl ether type epoxy resin, cresol novolac type epoxy resin, aromatic polyester
  • functional epoxy resins include functional epoxy resins, aliphatic epoxy resins, aliphatic polyfunctional epoxy resins, alicyclic epoxy resins, and polyfunctional alicyclic epoxy resins. Epoxy resins may be used alone or in combination.
  • a polyfunctional epoxy resin having three or more functions in the molecule that is, a polyfunctional epoxy resin having three or more epoxy groups in one molecule is used.
  • a polyfunctional epoxy resin having three or more epoxy groups in one molecule is used.
  • the compatibility with the phenoxy resin is improved, and the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • trifunctional or higher polyfunctional epoxy resins examples include phenol novolac epoxy resins, cresol novolak epoxy resins, triphenylmethane epoxy resins, dicyclopentadiene epoxy resins, bisphenol A epoxy resins, and tetramethylbisphenol F. It is preferable to contain one or more epoxy resins selected from the group consisting of type epoxy resins, and preferably one or more types selected from the group consisting of phenol novolac type epoxy resins and cresol novolac type epoxy resins. More preferred. Thereby, the compatibility with the phenoxy resin is improved, and the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • the weight average molecular weight (Mw) of the epoxy resin is not particularly limited, but is, for example, preferably 300 to 3,000, more preferably 300 to 2,000, and still more preferably 300 to 1,000.
  • Mw weight average molecular weight
  • the resin composition for a surface modification material of this embodiment may contain a thermosetting resin other than the above-mentioned epoxy resin.
  • thermosetting resins include, for example, resins with triazine rings such as urea resins and melamine resins; unsaturated polyester resins; maleimide resins such as bismaleimide compounds; polyurethane resins; diallyl phthalate resins; silicone resins. ; Benzoxazine resin; Polyimide resin; Polyamideimide resin; Cyanate ester resin such as cyanate resin such as benzocyclobutene resin, novolak type cyanate resin, bisphenol A type cyanate resin, bisphenol E type cyanate resin, tetramethylbisphenol F type cyanate resin. etc. These may be used alone or in combination of two or more.
  • the resin composition for surface modification material of this embodiment preferably contains a surfactant.
  • a surfactant include fluorine surfactants, silicone surfactants, alkyl surfactants, and acrylic surfactants.
  • the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable, for example, in that it suppresses unintentional reactions with other components in the composition and improves the storage stability of the composition.
  • the surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom.
  • a surfactant for example, a nonionic surfactant containing at least one of a fluorine atom and a silicon atom is preferable.
  • surfactants include, for example, F-251, F-253, F-281, F-430, F-477, F-551 of the "Megafac” series manufactured by DIC Corporation, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F- 565, F-568, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, 3M Corporation Fluorine-containing oligomer structure surfactants such as FC4430 and FC4432 manufactured by Neos Co., Ltd.; (trademark) series (for example, SD 100 TS, SD 670, SD 850, SD 860, SD 882), silicone surfactants such as BYK-333, BYK-349, BYK-313, BYK-323 manufactured by BYK Chemie. It will be used as FC4430 and FC
  • the resin composition for surface modification material of this embodiment contains a surfactant
  • it can contain one or more surfactants.
  • the lower limit of the content is, when the phenoxy resin in the resin composition for surface modification material of embodiment is 100 parts by mass, Preferably it is 0.001 part by mass or more, more preferably 0.005 part by mass or more.
  • the content of the surfactant is at least the above lower limit, the adhesion of the resin composition for surface modification material can be improved.
  • the upper limit of the surfactant content in this embodiment is preferably 1 part by mass or less, more preferably 0.5 part by mass or less. When the content of the surfactant is at most the above upper limit, the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • the resin composition for surface modification material of this embodiment preferably contains a solvent. Thereby, the adhesion of the resin composition for surface modification material to the surface of the structure can be improved, and the surface of the structure can be easily modified.
  • the solvent usually includes an organic solvent.
  • the organic solvent is not particularly limited as long as it can dissolve or disperse each of the above-mentioned components and does not substantially chemically react with each component.
  • organic solvents examples include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and benzyl.
  • Alcohol propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, ⁇ -butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. . These may be used alone or in combination.
  • the resin composition for surface modification material of this embodiment contains a solvent
  • the resin composition for surface modification material of this embodiment is usually varnish-like. More specifically, the resin composition for a surface modification material of this embodiment is preferably a varnish-like composition in which at least a phenoxy resin and an epoxy resin are dissolved in a solvent. Since the resin composition for a surface-modifying material of this embodiment is varnish-like, it can be easily attached to the surface of a structure.
  • the concentration of the total solid content (nonvolatile components) in the resin composition for surface modification material is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. By setting it as this range, each component can be fully dissolved or dispersed. Furthermore, by adjusting the content of nonvolatile components, the viscosity of the resin composition for surface modification material can be appropriately controlled. As another aspect, the proportion of phenoxy resin and epoxy resin in the entire resin composition for surface modification material is preferably 20 to 50% by mass. By using a certain amount of phenoxy resin and epoxy resin, the surface of the structure can be easily modified.
  • the resin composition for surface modification material contains an epoxy resin
  • (amount of epoxy resin/amount of phenoxy resin) is preferably 1 to 10, more preferably 1.5 to 8, and more preferably 1 to 10, more preferably 1.5 to 8, based on mass. Preferably it is 2-5.
  • the resin composition for a surface-modifying material according to the present embodiment may contain components other than the above-mentioned components, if necessary.
  • examples of such components include water, fillers such as silica, sensitizers, film-forming agents, and the like.
  • the resin composition for surface modification material of this embodiment is usually non-photosensitive.
  • the resin composition for a surface-modifying material of the present embodiment does not substantially contain a photosensitizer (for example, 1% by mass or less of the total nonvolatile components).
  • the resin composition for a surface modification material of the present embodiment usually does not substantially contain a curing agent (for example, 1% by mass or less of the total nonvolatile components).
  • the structure to which the resin composition for surface modification material of the present embodiment is attached includes a first region formed of a cured product of the epoxy resin composition on the surface.
  • the resin composition for a surface modification material of this embodiment is used for adhering to the surface of a structure including a first region formed by a cured product of an epoxy resin composition.
  • Epoxy resin examples of the epoxy resin that can be used in the epoxy resin composition in this embodiment include known epoxy resins that are generally used in epoxy resin compositions for sealing.
  • Known epoxy resins include phenols such as phenol novolac type epoxy resins and orthocresol novolac type epoxy resins, phenols such as cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, and/or ⁇ -naphthol and ⁇ .
  • Epoxidized novolak resin obtained by condensing or co-condensing naphthols such as naphthol and dihydroxynaphthalene with a compound having an aldehyde group such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst;
  • aralkyl type resins such as phenol aralkyl type resins synthesized from biphenylene, biphenylene skeleton phenol aralkyl type resins, naphthol aralkyl type resins
  • Glycidyl ester type epoxy resin obtained by the reaction of epichlorohydrin Glycidylamine type epoxy resin obtained by the reaction of epichlorohydrin with a polyamine such as diaminodiphenylmethane or isocyanuric acid; Dicyclo which is an epoxide of a co-condensed resin of dicyclopentadiene and phenols Pentadiene type epoxy resin; triphenolmethane type epoxy resin, trimethylolpropane type epoxy resin; terpene-modified epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefin bonds with peracid such as peracetic acid; alicyclic epoxy and epoxy resins obtained by modifying these epoxy resins with silicone, acrylonitrile, butadiene, isoprene rubber, polyamide resin, etc.
  • the content of all epoxy resins in the epoxy resin composition in this embodiment is preferably 5% by mass or more, more preferably 6% by mass or more, and still more preferably 7% by mass or more based on the entire epoxy resin composition. It is. Further, regarding the structure obtained using the epoxy resin composition, the content of the total epoxy resin in the epoxy resin composition is preferably 15% by mass or less, more preferably 14% by mass or less based on the entire epoxy resin composition. It is not more than 13% by mass, more preferably not more than 13% by mass.
  • the epoxy equivalent of all the epoxy resins in the epoxy resin composition is preferably 100 g/eq or more, more preferably 120 g/eq or more, and still more preferably 150 g/eq or more. Further, from the viewpoint of improving high temperature reliability and reflow resistance of a structure obtained using an epoxy resin composition, the epoxy equivalent of all epoxy resins in the epoxy resin composition is preferably 500 g/eq or less. , more preferably 480 g/eq or less, still more preferably 450 g/eq or less.
  • curing agent examples include known curing agents that are generally used in epoxy resin compositions for sealing. Specific examples of known curing agents include phenolic curing agents and amine curing agents (curing agents having an amino group).
  • phenolic curing agents examples include phenols such as phenol, cresol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol, and/or naphthols such as ⁇ -naphthol, ⁇ -naphthol, and dihydroxynaphthalene, and formaldehyde. , benzaldehyde, salicylaldehyde, and other compounds having an aldehyde group under an acidic catalyst.
  • Phenol aralkyl type phenol resin dicyclopentadiene type phenol resin, terpene modified phenol resin such as biphenylene skeleton-containing polyfunctional phenol resin synthesized from resin, phenols and/or naphthols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl.
  • terpene modified phenol resin such as biphenylene skeleton-containing polyfunctional phenol resin synthesized from resin, phenols and/or naphthols and dimethoxyparaxylene or bis(methoxymethyl)biphenyl.
  • amine curing agent examples include linear aliphatic diamines having 2 to 20 carbon atoms such as ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, metaphenylenediamine, paraphenylenediamine, paraxylenediamine, 4,4' - Diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylsulfone, 4,4'-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1 , 5-diaminonaphthalene, metaxylene diamine, paraxylene diamine, 1,1-bis(4-aminophenyl)cyclohexane, dicyanodiamide, and the like.
  • curing agents include polyoxystyrene such as polyparaoxystyrene; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA); trimellitic anhydride (TMA); Acid anhydrides, including aromatic acid anhydrides such as pyromellitic acid (PMDA) and benzophenonetetracarboxylic acid (BTDA); polymercaptan compounds such as polysulfides, thioesters, and thioethers; isocyanates such as isocyanate prepolymers and blocked isocyanates.
  • Compounds include organic acids such as carboxylic acid-containing polyester resins.
  • a polyfunctional phenol resin and a phenol aralkyl phenol resin it is preferable to include one or two of a polyfunctional phenol resin and a phenol aralkyl phenol resin, and a triphenylmethane phenol resin.
  • a biphenylene skeleton-containing polyfunctional phenol resin is included. These may be used alone or in combination of two or more.
  • the content of the curing agent in the epoxy resin composition is determined based on the total amount of the epoxy resin composition in order to achieve excellent fluidity and improve filling properties and adhesion during molding. Preferably it is 1% by mass or more, more preferably 2% by mass or more, still more preferably 3% by mass or more.
  • the content of the curing agent in the epoxy resin composition is preferably determined based on the entire epoxy resin composition. is 25% by mass or less, more preferably 15% by mass or less, even more preferably 10% by mass or less.
  • the inorganic filler has a function of reducing an increase in moisture absorption and a decrease in strength due to curing of the resin composition, and inorganic fillers commonly used in the field can be used.
  • inorganic fillers include fused silica, spherical silica, crystalline silica, alumina, silicon nitride, and aluminum nitride, and these inorganic fillers may be used alone or in combination.
  • the average particle size D 50 of the inorganic filler can be, for example, 0.01 ⁇ m or more and 150 ⁇ m or less.
  • the lower limit of the amount of inorganic filler in the epoxy resin composition is preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass, based on the total mass of the epoxy resin composition. % by mass or more.
  • the lower limit is within the above range, it is possible to more effectively reduce the increase in moisture absorption and the decrease in strength that occur when the resulting epoxy resin composition is cured, thus improving the solder crack resistance of the cured product. Further improvements can be made.
  • the upper limit of the amount of inorganic filler in the epoxy resin composition is preferably 93% by mass or less, more preferably 91% by mass or less, and even more preferably is 90% by mass or less.
  • the resulting epoxy resin composition has good fluidity and good moldability.
  • metal hydroxides such as aluminum hydroxide and magnesium hydroxide
  • inorganic flame retardants such as zinc borate, zinc molybdate, and antimony trioxide, which will be described later
  • these inorganic flame retardants and the above-mentioned inorganic filler are used. It is preferable that the total amount of materials is within the above range.
  • the epoxy resin composition of this embodiment may contain the following components in addition to the curing agent, epoxy resin, and inorganic filler.
  • the curing accelerator has a function of promoting the reaction between the epoxy group of the epoxy resin and the reactive group of the curing agent, and a curing accelerator commonly used in the field is used.
  • curing accelerators include phosphorus atom-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, and adducts of phosphonium compounds and silane compounds;
  • Examples include amidines and tertiary amines such as diazabicyclo(5,4,0)undecene-7, benzyldimethylamine, and 2-methylimidazole, as well as nitrogen atom-containing compounds such as quaternary salts of the above-mentioned amidines and amines. These can be used alone or in combination of two or more.
  • phosphorus atom-containing compounds are preferred from the viewpoint of curability, and from the viewpoint of fluidity when molding the structure, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds are particularly preferred; Phosphorus atom-containing compounds such as tetra-substituted phosphonium compounds and adducts of phosphonium compounds and silane compounds are particularly preferred in that mold contamination during continuous molding is slight.
  • the coupling agent has the function of improving the adhesion between the epoxy resin and the inorganic filler when the epoxy resin composition contains the inorganic filler, and for example, a silane coupling agent is used. .
  • silane coupling agents can be used, but aminosilane is preferably used. Thereby, the fluidity and solder resistance of the epoxy resin composition can be improved.
  • aminosilane examples include, but are not limited to, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -Aminopropylmethyldimethoxysilane, N-phenyl ⁇ -aminopropyltriethoxysilane, N-phenyl ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltriethoxysilane, N-6-(amino Hexyl)3-aminopropyltrimethoxysilane, N-(3-(trimethoxysilylpropyl)-1,3-benzenedimethanamine, etc.).
  • the lower limit of the blending ratio of a coupling agent such as a silane coupling agent is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, particularly preferably 0.1% by mass based on the total epoxy resin composition. % or more. If the lower limit of the blending ratio of a coupling agent such as a silane coupling agent is within the above range, the interfacial strength between the epoxy resin and the inorganic filler will not decrease, and the cured epoxy resin composition of this embodiment Good solder crack resistance can be obtained in electronic devices using this method.
  • the upper limit of the blending ratio of coupling agents such as silane coupling agents is preferably 1% by mass or less, more preferably 0.8% by mass or less, particularly preferably 0.6% by mass based on the total resin composition. It is as follows. If the upper limit of the blending ratio of a coupling agent such as a silane coupling agent is within the above range, the interfacial strength between the epoxy resin and the inorganic filler will not decrease, and the cured epoxy resin composition of this embodiment Good solder crack resistance can be obtained in electronic devices using this method.
  • the blending ratio of the coupling agent such as a silane coupling agent is within the above range, the water absorption of the cured epoxy resin composition will not increase, and the cured epoxy resin composition of this embodiment can be used. It is possible to obtain good solder crack resistance in electronic devices that have been used for a long time.
  • the inorganic flame retardant has a function of improving the flame retardance of the epoxy resin composition, and a commonly used inorganic flame retardant is used.
  • metal hydroxides that inhibit combustion reactions by dehydrating and absorbing heat during combustion and composite metal hydroxides that can shorten combustion time are preferably used.
  • metal hydroxides examples include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, barium hydroxide, and zirconia hydroxide.
  • the composite metal hydroxide is a hydrotalcite compound containing two or more metal elements, where at least one metal element is magnesium, and the other metal elements are calcium, aluminum, tin, titanium, or iron. , cobalt, nickel, copper, or zinc.
  • a magnesium hydroxide/zinc solid solution is easily available commercially.
  • aluminum hydroxide and magnesium hydroxide/zinc solid solution are preferred from the viewpoint of balance between adhesion and high temperature reliability.
  • the inorganic flame retardants may be used alone or in combination of two or more. Further, for the purpose of reducing the influence on adhesion, the surface may be treated with a silicon compound such as a silane coupling agent or an aliphatic compound such as wax.
  • the inorganic flame retardant in the epoxy resin composition of this embodiment, it is preferable to dry the inorganic flame retardant at 125°C for 20 hours, and calculate the weight after cooling in a desiccator to the initial weight. Assuming that the above inorganic flame retardant was put into a high temperature tank at 200°C, heat treated for 1000 hours, and the weight after cooling in a desiccator was taken as the weight after treatment, the weight reduction rate after treatment with respect to the initial weight was 0.1 weight. It is preferable not to use a flame retardant of % or more, and furthermore, it is desirable to configure the epoxy resin composition only with a flame-retardant resin without using an inorganic flame retardant.
  • colorants such as carbon black, red iron oxide, and titanium oxide; ion scavengers; natural waxes such as carnauba wax, synthetic waxes such as polyethylene wax, and higher fatty acids such as stearic acid and zinc stearate. Mold release agents such as and metal salts thereof or paraffin; low stress additives such as silicone oil and silicone rubber may be appropriately blended.
  • the epoxy resin composition in this embodiment can be obtained by mixing the above-mentioned curing agent and epoxy resin, and if necessary, the above-mentioned other components by a method commonly used in the field.
  • the structure to which the resin composition for surface modification material of the present embodiment is attached includes not only the first region on the surface but also preferably a second region formed of metal wiring on the surface.
  • metals that can be used for the metal wiring forming the second region known metals that can be used for wiring of electronic devices can be used.
  • Known metals include copper, aluminum, nickel, vanadium, titanium, chromium, cobalt, gold, tungsten, and alloys containing these metals, with copper and aluminum being more preferred, and copper being even more preferred.
  • the method for forming the metal wiring is not particularly limited, and any existing method can be applied.
  • methods described in JP-A No. 2007-157879, Japanese Patent Application Publication No. 2001-521288, JP-A No. 2004-214501, and JP-A No. 2004-101850 can be used.
  • photolithography, lift-off, electrolytic plating, electroless plating, etching, printing, and a combination of these methods can be used. More specifically, a patterning method that combines sputtering, photolithography, and etching, and a patterning method that combines photolithography and electrolytic plating can be mentioned.
  • the thickness of the metal wiring is preferably 0.1 ⁇ m or more and 50 ⁇ m or less, more preferably 1 ⁇ m or more and 10 ⁇ m or less at the thickest part.
  • the method for manufacturing an electronic device using the resin composition for surface modification material of the present embodiment includes the steps of preparing a structure including a first region formed of a cured product of the epoxy resin composition; This process includes a step of attaching the resin composition for surface modification material to a surface, and a step of removing the resin composition for surface modification material from the surface to modify the surface.
  • a surface modification method to a structure, which includes the steps of: attaching a resin composition for surface modification material; and modifying the surface by removing the resin composition for surface modification material from the surface.
  • the surface of the structure can be modified.
  • the wettability of the structure surface is improved, coating unevenness is suppressed when coating the structure surface, and when performing a treatment to form an insulating resin film in contact with the surface. , the quality of the insulating resin film can be improved.
  • the above structure including a first region formed by a cured product of an epoxy resin composition is prepared.
  • the above-mentioned structure is not particularly limited, but is formed by, for example, molding an epoxy resin composition so as to seal an electronic component and curing the composition.
  • the epoxy resin composition may be formed to seal a wiring board together with electronic components, for example.
  • a cured epoxy resin composition is provided to seal one side and the other side of the wiring board and electronic components mounted on the wiring board. Further, the epoxy resin composition may be formed to seal part or all of the wiring board, for example. At this time, on the surface of the structure, the portion where the cured epoxy resin composition is exposed becomes the first region.
  • the cured epoxy resin composition is provided so as to seal the entire other part of the wiring board without sealing the connection terminal or wiring so that the connection terminal or wiring is exposed. There is. At this time, on the surface of the structure, the portion where the cured epoxy resin composition is exposed becomes the first region, and the portion where the connecting terminal or wiring is exposed becomes the second region.
  • Step of attaching a resin composition for surface modification material to the surface of a structure Next, the resin composition for surface modification material is applied to the surface of the structure.
  • any known attachment method can be used.
  • Known attachment methods include, for example, table coating, spin coating, dip coating, die coating, spray coating, bar coating, roll coating, curtain flow coating, slit coating, inkjet coating, and dispensing. Laws, etc. can be mentioned. These are appropriately selected in consideration of the shape, size, productivity, etc. of the structure.
  • the surface modification material resin composition is removed from the surface of the structure to modify the surface.
  • any known cleaning method can be used to remove the resin composition for surface modification material from the surface of the structure, but for example, a method of cleaning by spraying a solvent onto the structure may be used. Can be mentioned.
  • the solvent is not particularly limited as long as it dissolves the resin composition for surface modification material, but examples include ketones such as cyclohexanone, cyclopentanone, and methyl-2-n-amyl ketone; Alcohols such as butanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol; propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol mono Ethers such as ethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate , tert-
  • completely remove the resin composition for surface modifier from the surface it is preferable to completely remove the resin composition for surface modifier from the surface.
  • completely removed refers to, for example, that when a cross-sectional image of the surface of the structure is observed, a layer made of the resin composition for surface modifier is not observed.
  • the process in the electronic device manufacturing method of this embodiment further includes a step of forming an insulating resin film in contact with the modified surface.
  • the insulating resin film at this time may be a photosensitive resin film or a non-photosensitive resin film.
  • the method includes a step of obtaining a transparent resin film.
  • the method for drying the solvent is not particularly limited as long as the solvent can be evaporated from a solution containing the raw material of the photosensitive resin film and the solvent, and any known method can be used depending on the type of polymer.
  • the drying step can be performed, for example, at a temperature of 30° C. or more and 150° C. or less, and for 1 minute or more and 1 hour or less.
  • Examples of the solution containing the raw materials and solvent for the photosensitive resin film at this time include the following photosensitive resin compositions.
  • the photosensitive resin composition of the present embodiment preferably contains one or more selected from the group consisting of polybenzoxazole resin or its precursor, and polyimide resin or its precursor. Thereby, shrinkage due to curing (heating) can be reduced.
  • the process in the method for manufacturing an electronic device of the present embodiment further includes applying a polybenzoxazole resin or a precursor thereof to the above-mentioned surface that has been modified, and a polyimide resin or a precursor thereof.
  • the photosensitive resin composition includes a step of attaching a photosensitive resin composition containing one or more types of.
  • the resin composition for a surface-modified material of this embodiment is a group consisting of a polybenzoxazole resin or a precursor thereof, and a polyimide resin or a precursor thereof, on the surface whose surface has been further modified in the above-mentioned process. It is used for applications including a step of attaching a photosensitive resin composition containing one or more selected from the following.
  • Polybenzoxazole resin can be obtained by heat-treating a polyamide resin as a precursor to undergo dehydration and ring closure.
  • polyimide resin is produced by (i) first reacting diamine and acid dianhydride (condensation polymerization) to synthesize polyamide, and (ii) then imidizing the polyamide (ring-closing reaction). , (iii) can be obtained by introducing a desired functional group to the polymer terminal as necessary.
  • raw material diamines examples include 3,4'-diaminodiphenyl ether (3,4'-ODA), 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (TFMB), 3,3 ',5,5'-tetramethylbenzidine, 2,3,5,6-tetramethyl-1,4-phenylenediamine, 3,3'-diaminodiphenylsulfone, 3,3'dimethylbenzidine, 3,3'- Bis(trifluoromethyl)benzidine, 2,2'-bis(p-aminophenyl)hexafluoropropane, bis(trifluoromethoxy)benzidine (TFMOB), 2,2'-bis(pentafluoroethoxy)benzidine (TFEOB) , 2,2'-trifluoromethyl-4,4'-oxydianiline (OBABTF), 2-phenyl-2-trifluoromethyl-bis(p-aminophenyl)methane
  • raw acid dianhydrides examples include pyromellitic anhydride (PMDA), diphenyl ether-3,3',4,4'-tetracarboxylic dianhydride (ODPA), benzophenone-3,3', 4,4'-tetracarboxylic dianhydride (BTDA), biphenyl-3,3',4,4'-tetracarboxylic dianhydride (BPDA), diphenylsulfone-3,3',4,4'- Tetracarboxylic dianhydride (DSDA), diphenylmethane-3,3',4,4'-tetracarboxylic dianhydride, 2,2-bis(3,4-phthalic anhydride)propane, 2,2-bis Examples include (3,4-phthalic anhydride)-1,1,1,3,3,3-hexafluoropropane (6FDA).
  • usable acid dianhydrides are not limited to these. One type or two or more types of acid dianhydrides can be used.
  • the ratio of diamine and acid dianhydride used is basically 1:1 in molar ratio. However, one may be used in excess in order to obtain a desired terminal structure. Specifically, by using an excessive amount of diamine, the ends (both ends) of the polyimide resin tend to become amino groups. On the other hand, by using an excessive amount of acid dianhydride, the ends (both ends) of the polyimide resin tend to become acid anhydride groups.
  • some reagent is reacted with the terminal amino group and/or acid anhydride group of the polyimide resin or its precursor so that the polyimide resin terminal has a desired functional group. It's okay.
  • the weight average molecular weight of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor in this embodiment is, for example, 5,000 to 100,000, preferably 7,000 to 75,000, more preferably 10 ,000 to 50,000.
  • the weight average molecular weight of the polybenzoxazole resin and the polyimide resin is large to a certain extent, sufficient heat resistance of the resin film can be obtained, for example.
  • the weight average molecular weight of the polyimide resin is not too large, it becomes easy to dissolve the polybenzoxazole resin or its precursor and the polyimide resin or its precursor in an organic solvent.
  • the weight average molecular weight can usually be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance.
  • the photosensitive resin composition of this embodiment preferably contains a photosensitizer.
  • the photosensitizer is not particularly limited as long as it is capable of curing the photosensitive resin composition by generating active species when exposed to light.
  • the photosensitizer preferably contains a photoradical generator.
  • a photoradical generator is particularly effective in polymerizing the above polyimide resin.
  • the photoradical generator that can be used is not particularly limited, and known ones can be used as appropriate.
  • the photosensitive resin composition may contain only one type of photosensitizer, or may contain two or more types of photosensitizer.
  • the content of the photosensitizer is, for example, 5 parts by mass or more and 30 parts by mass or less, preferably 10 parts by mass or more and 25 parts by mass, based on 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor. Parts by mass or less.
  • the photosensitive resin composition of this embodiment preferably contains a crosslinking agent.
  • a crosslinking agent for example, the crosslinking agent and other components contained in the photosensitive resin composition can react, or the crosslinking agents can polymerize with each other. It is thought that the particles become intertwined and improve the chemical resistance and elongation rate of the resin film.
  • the content of the crosslinking agent is, for example, 0.1 part by mass or more, preferably 0.5 part by mass or more, more preferably is 1 part by mass or more.
  • the content of the crosslinking agent is 0.1 part by mass or more, the resin film can have high chemical resistance.
  • the content of the crosslinking agent is, for example, 30 parts by mass or less, preferably 20 parts by mass or less, more preferably 10 parts by mass, based on 100 parts by mass of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor. Parts by mass or less.
  • the content of the crosslinking agent is 30 parts by mass or less, the ratio of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor in the photosensitive resin composition is maintained, and the elongation rate of the resin film is good. In addition, the adhesion between the resin film and the structure is sufficiently improved.
  • the photosensitive resin composition of this embodiment may contain only one type of crosslinking agent, or may contain two or more types of crosslinking agents.
  • the photosensitive resin composition of this embodiment preferably contains a coupling agent, more preferably a silane coupling agent.
  • a silane coupling agent for example, the adhesion between the resin film and the structure can be further improved.
  • silane coupling agent examples include an amino group-containing silane coupling agent, an epoxy group-containing silane coupling agent, a (meth)acryloyl group-containing silane coupling agent, a mercapto group-containing silane coupling agent, and a vinyl group-containing silane coupling agent.
  • a silane coupling agent such as a ureido group-containing silane coupling agent, a sulfide group-containing silane coupling agent, a silane coupling agent having a cyclic anhydride structure, and the like can be used.
  • amino group-containing silane coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltrimethoxysilane, and ⁇ -aminopropylmethyldiethoxy.
  • Silane ⁇ -aminopropylmethyldimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltriethoxysilane, N- ⁇ (aminoethyl) ⁇ -amino Examples include propylmethyldimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropylmethyldiethoxysilane, and N-phenyl- ⁇ -amino-propyltrimethoxysilane.
  • epoxy group-containing silane coupling agent examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -glycidyl Examples include propyltrimethoxysilane.
  • Examples of (meth)acryloyl group-containing silane coupling agents include ⁇ -((meth)acryloyloxypropyl)trimethoxysilane, ⁇ -((meth)acryloyloxypropyl)methyldimethoxysilane, ⁇ -((meth) Examples include acryloyloxypropyl)methyldiethoxysilane.
  • Examples of the mercapto group-containing silane coupling agent include 3-mercaptopropyltrimethoxysilane.
  • Examples of the vinyl group-containing silane coupling agent include vinyltris( ⁇ -methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane.
  • Examples of the ureido group-containing silane coupling agent include 3-ureidopropyltriethoxysilane.
  • Examples of the sulfide group-containing silane coupling agent include bis(3-(triethoxysilyl)propyl)disulfide, bis(3-(triethoxysilyl)propyl)tetrasulfide, and the like.
  • Examples of the silane coupling agent having a cyclic anhydride structure include 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilylpropylsuccinic anhydride, and the like. It will be done.
  • a silane coupling agent having a cyclic anhydride structure is particularly preferably used.
  • the cyclic anhydride structure easily reacts with the main chain, side chain, and/or terminal of polybenzoxazole resin or its precursor and polyimide resin or its precursor, and therefore has a particularly good adhesion-improving effect. is expected to be obtained.
  • a silane coupling agent When a silane coupling agent is used, it may be used alone or two or more adhesion aids may be used in combination.
  • the amount used is, for example, 0.1 to 20 parts by weight, preferably 0.1 to 20 parts by weight, based on 100 parts by weight of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor. is 0.3 to 15 parts by weight, more preferably 0.4 to 12 parts by weight, even more preferably 0.5 to 10 parts by weight.
  • the photosensitive resin composition of this embodiment preferably contains a surfactant.
  • a surfactant examples include fluorine surfactants, silicone surfactants, alkyl surfactants, and acrylic surfactants.
  • the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable, for example, in that it suppresses unintentional reactions with other components in the composition and improves the storage stability of the composition.
  • the surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improving coating properties), improving developability, and improving adhesive strength.
  • a surfactant for example, a nonionic surfactant containing at least one of a fluorine atom and a silicon atom is preferable.
  • surfactants include, for example, F-251, F-253, F-281, F-430, F-477, F-551 of the "Megafac” series manufactured by DIC Corporation, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F- 565, F-568, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, 3M Corporation Fluorine-containing oligomer structure surfactants such as FC4430 and FC4432 manufactured by Neos Co., Ltd.; (trademark) series (for example, SD 100 TS, SD 670, SD 850, SD 860, SD 882), silicone surfactants such as BYK-333, BYK-349, BYK-313, BYK-323 manufactured by BYK Chemie. It will be used as FC4430 and FC
  • the photosensitive resin composition of this embodiment contains a surfactant
  • it can contain one or more surfactants.
  • the amount thereof is, for example, 0.000 parts by mass when the content of the polybenzoxazole resin or its precursor and the polyimide resin or its precursor is 100 parts by mass. 001 to 1 part by weight, preferably 0.005 to 0.5 part by weight.
  • the photosensitive resin composition of this embodiment preferably contains a solvent. Thereby, a resin film can be easily formed on the structure by a coating method.
  • the solvent usually includes an organic solvent.
  • the organic solvent is not particularly limited as long as it can dissolve or disperse each of the above-mentioned components and does not substantially chemically react with each component.
  • organic solvents examples include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and benzyl.
  • Alcohol propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, ⁇ -butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. . These may be used alone or in combination.
  • the photosensitive resin composition of this embodiment contains a solvent
  • the photosensitive resin composition of this embodiment is usually varnish-like.
  • the photosensitive resin composition of the present embodiment is preferably a varnish-like composition in which at least a polybenzoxazole resin or its precursor and a polyimide resin or its precursor are dissolved in a solvent. . Since the photosensitive resin composition of this embodiment is varnish-like, it is possible to form a uniform film by coating. Further, since the polybenzoxazole resin or its precursor and the polyimide resin or its precursor are "dissolved" in the solvent, a homogeneous cured film can be obtained.
  • the concentration of the total solid content (nonvolatile components) in the photosensitive resin composition is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. By setting it as this range, each component can be fully dissolved or dispersed. In addition, good coating properties can be ensured, which in turn leads to improved flatness during spin coating. Furthermore, by adjusting the content of nonvolatile components, the viscosity of the photosensitive resin composition can be appropriately controlled.
  • the photosensitive resin composition of the present embodiment may contain components other than the above-mentioned components, if necessary.
  • examples of such components include polybenzoxazole resins or their precursors, polyimide resins or resins other than their precursors, water, fillers such as silica, curing catalysts, sensitizers, film-forming agents, etc. .
  • the resin composition for a surface modification material has a contact angle of ⁇ 1 with respect to the photosensitive resin composition of the first region before the step of attaching the resin composition for a surface modification material.
  • the contact angle of the first region to the photosensitive resin composition after the step of removing the material resin composition is ⁇ 2
  • the resin composition for surface modification material has a contact angle of ⁇ 1 with respect to the photosensitive resin composition of the second region before the step of attaching the resin composition for surface modification material, and
  • the contact angle of the second region to the photosensitive resin composition after the step of removing the photosensitive resin composition is ⁇ 2
  • the wettability of the surface of the structure can be improved more suitably after the surface modification treatment of the structure.
  • the measurement of the contact angle in the first region and the second region can be performed at 25°C.
  • the photosensitive resin composition used for measuring the contact angle is usually in the form of a varnish containing an organic solvent.
  • a photosensitive resin composition actually used in the manufacturing method of electronic devices can be used.
  • wafer coating resin manufactured by Sumitomo Bakelite Co., Ltd. used in the examples described later can be mentioned.
  • the second embodiment of the step of forming an insulating resin film includes applying a solution containing a polymerizable monomer and a solvent; , it is preferable to include a step of drying the solvent and polymerizing the polymerizable monomer.
  • the method for drying the solvent is not particularly limited as long as the solvent can be evaporated from the solution containing the polymerizable monomer and the solvent, and any known method can be used depending on the type of the polymerizable monomer.
  • Examples of the method for drying the solvent include conditions at a temperature of 30° C. or more and 150° C. or less, and for 1 minute or more and 1 hour or less.
  • the step of polymerizing the polymerizable monomer is not particularly limited, and known methods can be used depending on the type of the polymerizable monomer.
  • Examples of the step of polymerizing the polymerizable monomer include heat treatment and irradiation with energy rays.
  • Examples of the energy rays at this time include radiation, ultraviolet rays, visible rays, and electron beams.
  • Examples of the solution containing the polymerizable monomer and the solvent at this time include the following resin compositions.
  • polymerizable monomer As the polymerizable monomer contained in the solution containing the polymerizable monomer and solvent of this embodiment, it is possible to use known polymerizable monomers used in photosensitive resin compositions. There are no particular limitations on what can be used, but for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, isodecyl (meth)acrylate.
  • the solution of this embodiment contains a solvent. Thereby, a resin film can be easily formed on the structure by a coating method.
  • the solvent usually includes an organic solvent.
  • the organic solvent is not particularly limited as long as it can dissolve or disperse each of the above-mentioned components and does not substantially chemically react with each component.
  • organic solvents examples include acetone, methyl ethyl ketone, toluene, propylene glycol methyl ethyl ether, propylene glycol dimethyl ether, propylene glycol 1-monomethyl ether 2-acetate, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and benzyl.
  • Alcohol propylene carbonate, ethylene glycol diacetate, propylene glycol diacetate, propylene glycol monomethyl ether acetate, dipropylene glycol methyl-n-propyl ether, butyl acetate, ⁇ -butyrolactone, methyl lactate, ethyl lactate, butyl lactate, etc. . These may be used alone or in combination.
  • the solution of this embodiment contains a solvent, it is usually varnish-like. More specifically, the solution containing the polymerizable monomer and the solvent of this embodiment is a varnish-like composition in which the polymerizable monomer is dissolved in the solvent. Since the solution containing the polymerizable monomer and solvent of this embodiment is varnish-like, it is possible to form a uniform film by coating. Furthermore, since the polymerizable monomer is "dissolved" in the solvent, a homogeneous cured film can be obtained.
  • the concentration of total solids (nonvolatile components) in the solution containing the polymerizable monomer and solvent is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. used. By setting it as this range, each component can be fully dissolved or dispersed. In addition, good coating properties can be ensured, which in turn leads to improved flatness during spin coating. Furthermore, by adjusting the content of nonvolatile components, the viscosity of the solution containing the polymerizable monomer and solvent can be appropriately controlled.
  • the solution containing the polymerizable monomer and the solvent of the present embodiment may contain components other than the above-mentioned components as necessary.
  • Such components include, for example, photosensitizers, crosslinking agents, silane coupling agents, surfactants, resins other than polymerizable monomers, water, fillers such as silica, curing catalysts, sensitizers, and film formation. agents, etc.
  • the solution containing the polymerizable monomer and solvent of this embodiment preferably contains a photosensitizer.
  • the photosensitizer is not particularly limited as long as it is capable of curing a solution containing a polymerizable monomer and a solvent by generating active species when exposed to light.
  • the photosensitizer preferably contains a photoradical generator.
  • Photoradical generators are particularly effective in polymerizing polymerizable monomers.
  • the photoradical generator that can be used is not particularly limited, and known ones can be used as appropriate.
  • the solution containing the polymerizable monomer and the solvent may contain only one type of photosensitizer, or may contain two or more types of photosensitizer.
  • the content of the photosensitizer is, for example, 5 parts by mass or more and 30 parts by mass or less, and preferably 10 parts by mass or more and 25 parts by mass or less, based on 100 parts by mass of the polymerizable monomer.
  • the solution containing the polymerizable monomer and solvent of this embodiment preferably contains a crosslinking agent.
  • a crosslinking agent for example, the crosslinking agent reacts with other components contained in a solution containing a polymerizable monomer and a solvent, or the crosslinking agents polymerize with each other. It is thought that the resin film becomes closely intertwined with the solution containing polymer and solvent, thereby improving the chemical resistance and elongation rate of the resin film.
  • the content of the crosslinking agent is, for example, 0.1 part by mass or more, preferably 0.5 part by mass or more, and more preferably 1 part by mass or more, based on 100 parts by mass of the polymerizable monomer.
  • the content of the crosslinking agent is 0.1 part by mass or more, the resin film can have high chemical resistance.
  • the content of the crosslinking agent is, for example, 30 parts by mass or less, preferably 20 parts by mass or less, and more preferably 10 parts by mass or less, based on 100 parts by mass of the polymerizable monomer.
  • the content of the crosslinking agent is 30 parts by mass or less, the ratio of the polymerizable monomer in the solution containing the polymerizable monomer and the solvent is maintained, the elongation rate of the resin film is good, and the resin film is The adhesion between the structure and the structure is sufficiently improved.
  • the solution containing the polymerizable monomer and solvent of this embodiment may contain only one type of crosslinking agent, or may contain two or more types of crosslinking agents.
  • the solution containing the polymerizable monomer and solvent of this embodiment preferably contains a silane coupling agent.
  • a silane coupling agent for example, the adhesion between the resin film and the structure can be further improved.
  • silane coupling agent examples include an amino group-containing silane coupling agent, an epoxy group-containing silane coupling agent, a (meth)acryloyl group-containing silane coupling agent, a mercapto group-containing silane coupling agent, and a vinyl group-containing silane coupling agent.
  • a silane coupling agent such as a ureido group-containing silane coupling agent, a sulfide group-containing silane coupling agent, a silane coupling agent having a cyclic anhydride structure, and the like can be used.
  • amino group-containing silane coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltrimethoxysilane, and ⁇ -aminopropylmethyldiethoxy.
  • Silane ⁇ -aminopropylmethyldimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropyltriethoxysilane, N- ⁇ (aminoethyl) ⁇ -amino Examples include propylmethyldimethoxysilane, N- ⁇ (aminoethyl) ⁇ -aminopropylmethyldiethoxysilane, and N-phenyl- ⁇ -amino-propyltrimethoxysilane.
  • epoxy group-containing silane coupling agent examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropylmethyldiethoxysilane, ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -glycidyl Examples include propyltrimethoxysilane.
  • Examples of (meth)acryloyl group-containing silane coupling agents include ⁇ -((meth)acryloyloxypropyl)trimethoxysilane, ⁇ -((meth)acryloyloxypropyl)methyldimethoxysilane, ⁇ -((meth) Examples include acryloyloxypropyl)methyldiethoxysilane.
  • Examples of the mercapto group-containing silane coupling agent include 3-mercaptopropyltrimethoxysilane.
  • Examples of the vinyl group-containing silane coupling agent include vinyltris( ⁇ -methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane.
  • Examples of the ureido group-containing silane coupling agent include 3-ureidopropyltriethoxysilane.
  • Examples of the sulfide group-containing silane coupling agent include bis(3-(triethoxysilyl)propyl)disulfide, bis(3-(triethoxysilyl)propyl)tetrasulfide, and the like.
  • Examples of the silane coupling agent having a cyclic anhydride structure include 3-trimethoxysilylpropylsuccinic anhydride, 3-triethoxysilylpropylsuccinic anhydride, 3-dimethylmethoxysilylpropylsuccinic anhydride, and the like. It will be done.
  • a silane coupling agent having a cyclic anhydride structure is particularly preferably used.
  • the details are unknown, it is presumed that the cyclic anhydride structure easily reacts with the main chain, side chain, and/or terminal of the polymerizable monomer, and therefore a particularly good effect of improving adhesion can be obtained.
  • a silane coupling agent When a silane coupling agent is used, it may be used alone or two or more adhesion aids may be used in combination.
  • the amount used is, for example, 0.1 to 20 parts by weight, preferably 0.3 to 15 parts by weight, based on 100 parts by weight of the polymerizable monomer. The amount is preferably 0.4 to 12 parts by weight, more preferably 0.5 to 10 parts by weight.
  • the solution containing the polymerizable monomer and solvent of this embodiment preferably contains a surfactant.
  • a surfactant include fluorine surfactants, silicone surfactants, alkyl surfactants, and acrylic surfactants.
  • the surfactant is preferably nonionic. The use of a nonionic surfactant is preferable, for example, in that it suppresses unintentional reactions with other components in the composition and improves the storage stability of the composition.
  • the surfactant preferably contains a surfactant containing at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improving coating properties), improving developability, and improving adhesive strength.
  • a surfactant for example, a nonionic surfactant containing at least one of a fluorine atom and a silicon atom is preferable.
  • F-251, F-253, F-281, F-430, F-477, F-551 of the "Megafac" series manufactured by DIC Corporation F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F- 565, F-568, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, R-94, etc.
  • Fluorine-containing surfactants with oligomer structure fluorine-containing nonionic surfactants such as Ftergent 250 and Ftergent 251 manufactured by Neos Co., Ltd., SILFOAM (registered trademark) series manufactured by Wacker Chemie (for example, SD 100 TS) , SD 670, SD 850, SD 860, SD 882) and the like. Further, FC4430 and FC4432 manufactured by 3M Corporation can also be mentioned as preferred surfactants.
  • the solution containing the polymerizable monomer and solvent of this embodiment contains a surfactant
  • it can contain one or more surfactants.
  • the amount thereof is, for example, 0.001 to 1 part by mass when the content of the polymerizable monomer is 100 parts by mass. , preferably 0.005 to 0.5 parts by mass.
  • the resin composition for surface modification material has a contact angle of ⁇ 1 with respect to the insulating resin film of the first region before the step of attaching the resin composition for surface modification material.
  • the contact angle of the first region to the insulating resin film after the step of removing the resin composition is ⁇ 2
  • the resin composition for surface modification material has a contact angle of ⁇ 1 with respect to the insulating resin film of the second region before the step of attaching the resin composition for surface modification material.
  • the contact angle of the second region to the insulating resin film after the step of removing the resin composition is ⁇ 2
  • the electronic device 1 manufactured by the above manufacturing method includes a cured epoxy resin composition 10, a semiconductor chip 40 consisting of a diced die 20 and an electrode pad 30, and a passivation film 50.
  • An insulating resin film 60 made of the photosensitive resin composition described above, and a conductive film 110 formed to cover the exposed electrode pad 30 and the insulating resin film 60 are provided on the structure. .
  • the interface between the cured epoxy resin composition 10 and the insulating resin film 60 is the first region
  • the interface between the electrode pad 30 and the insulating resin film 60 or the conductive film 110 is the second region. It is.
  • the first region and the second region are surface-modified using the resin composition for surface modification material according to the present embodiment.
  • Cured epoxy resins (E-1) to (E-4), which are base materials for obtaining a structure with a base layer (corresponding to the first region) formed on the surface, were prepared as follows. . First, the components shown in Table 1 were mixed using a mixer. Next, the obtained mixture was melt-kneaded in a co-rotating twin-screw extruder having a cylinder inner diameter of 65 mm at a screw rotation speed of 30 rpm and a resin temperature of 110°C.
  • the melt-kneaded resin composition was supplied from above a rotor with a diameter of 20 cm at a rate of 2 kg/hr, and the rotor was rotated at 3000 rpm. It passed through a plurality of small holes (hole diameter 0.9 mm) on the outer periphery. Thereafter, by cooling, granular base materials (E-1) to (E-4) were obtained.
  • (E-5) commercially available copper for sputtering was used as is.
  • Table 1 shows details of the raw materials for each base material (E-1) to (E-4) for obtaining a structure with a base layer formed on the surface. Details of the raw materials for each component in Table 1 are as follows.
  • Coupled (coupling agent) ⁇ Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Dow Corning Toray Co., Ltd., product number: CF-4083)
  • ⁇ Coupling agent 2 Hydrolyzed product of silane coupling agent (hydrolysate of ⁇ -glycidoxypropylmethyldimethoxysilane
  • ⁇ Coupling agent 3 3-mercaptopropyltrimethoxysilane (manufactured by Chisso Corporation, product number: S810) )
  • Epoxy resin ⁇ Epoxy resin 1: Biphenyl type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product number: YX-4000K) ⁇ Epoxy resin 2: Trisphenylmethane/biphenyl mixed epoxy resin (manufactured by Mitsubishi Chemical Corporation, product number: YL6677) ⁇ Epoxy resin 3: Biphenylaralkyl epoxy resin (manufactured by Nippon Kayaku Co., Ltd., product number: NC3000L) ⁇ Epoxy resin 4: Mixture of biphenylaralkyl epoxy resin and biphenol glycidyl ether (manufactured by Nippon Kayaku Co., Ltd., product number: CER-3000-L) (hardening agent) ⁇ Curing agent 1: Tris-phenylmethane mixed phenol resin (manufactured by Air Water Co., Ltd., product number: HE910-20) ⁇ Curing agent 2: Phenol novolac type
  • ⁇ Curing accelerator 1 Tetraphenylphosphonium ⁇ 4,4'-sulfonyldiphenolate
  • ⁇ Curing accelerator 2 Tetraphenylphosphonium bis(naphthalene-2,3-dioxy)phenyl silicate
  • ⁇ Curing accelerator 3 Triphenylphosphine Adduct with p-benzoquinone (manufactured by K.I. Kasei Co., Ltd., product number: TPP-BQ)
  • ⁇ Curing accelerator 4 Tetraphenylphosphonium-2,3-dihydroxynaphthalate
  • Phenoxy resin > (A-1) Phenoxy resin containing bisphenol A skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jER1256, Mw: 51,000, epoxy equivalent: 7,800 g/eq) (A-2) Phenoxy resin containing bisphenol A skeleton and bisphenol F skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jER4275, Mw: 60,000, epoxy equivalent: 9,000 g/eq) (A-3) Phenoxy resin containing bisphenol F skeleton (manufactured by Mitsubishi Chemical Corporation, product number: jERYX7105, Mw: 3,000, epoxy equivalent: 487 g/eq)
  • (E-1) to (E-4) A 4 mm square semiconductor element with a thickness of 0.15 mm is placed on a circuit board with a thickness of 0.1 mm, a width of 77.5 mm, and a length of 240 mm, which is made of a glass-based epoxy resin copper-clad laminate with a heat resistance grade of FR-4. Twelve pieces bonded with silver paste were fixed to the upper mold by a substrate fixing means, with the surface on which the semiconductor element was mounted facing downward. Next, after supplying the resin granules made of each of the base materials (E-1) to (E-4) into the lower mold cavity, they were molded using a compression molding machine (manufactured by TOWA Corporation) for 12 hours while reducing the pressure inside the cavity. Each semiconductor element was formed into a panel to obtain a structure with a base layer formed on the surface. The molding conditions at this time were a mold temperature of 175° C., a molding pressure of 2.0 MPa, and a curing time of 120 seconds.
  • the resin composition for surface modification material was applied by spin coating onto the structure obtained in the above [Preparation of structure].
  • a drying step the structure coated with the resin composition for surface modification material was dried at 110° C. for 3 minutes to form a resin film for surface modification with a thickness of 5 ⁇ m on the structure.
  • cyclopentanone was sprayed on the obtained surface-modifying resin film for 30 seconds while rotating at a rotation speed of 2500 rpm, and then spin drying was performed at the same rotation speed for 20 seconds to form a structure.
  • the upper resin film for surface modification material was removed.
  • a photosensitive resin composition was applied by spin coating onto the structure after the above-mentioned [surface modification treatment]. Next, the structure coated with the photosensitive resin composition was dried at 120° C. for 5 minutes to form a photosensitive resin film having a thickness of 5 ⁇ m on the structure.
  • photosensitive resin compositions used to prepare the photosensitive resin film are as follows. These contain polybenzoxazole precursors and are photosensitive resin compositions.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
PCT/JP2023/012147 2022-03-30 2023-03-27 表面改質材用樹脂組成物 Ceased WO2023190309A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020247034089A KR20240170544A (ko) 2022-03-30 2023-03-27 표면 개질재용 수지 조성물
CN202380027266.2A CN118871514A (zh) 2022-03-30 2023-03-27 表面改性材料用树脂组合物
JP2024512442A JPWO2023190309A1 (https=) 2022-03-30 2023-03-27

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-055266 2022-03-30
JP2022055266 2022-03-30

Publications (1)

Publication Number Publication Date
WO2023190309A1 true WO2023190309A1 (ja) 2023-10-05

Family

ID=88201718

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/012147 Ceased WO2023190309A1 (ja) 2022-03-30 2023-03-27 表面改質材用樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2023190309A1 (https=)
KR (1) KR20240170544A (https=)
CN (1) CN118871514A (https=)
TW (1) TW202348699A (https=)
WO (1) WO2023190309A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120606190B (zh) * 2025-08-11 2025-10-28 锦州阳光能源有限公司 一种光伏组件用助焊材料及其制备方法、串焊复合层压焊接工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003020323A (ja) * 2001-04-19 2003-01-24 Canon Inc エポキシ樹脂組成物、基材の表面改質方法、インクジェット記録ヘッド及びインクジェット記録装置
JP2007211114A (ja) * 2006-02-08 2007-08-23 Nippon Shokubai Co Ltd 基材表面改質用樹脂組成物及び積層体
JP2008255140A (ja) * 2007-03-30 2008-10-23 Fujifilm Corp エポキシ樹脂成形体、エポキシ樹脂成形体の表面改質方法、及びそれを用いた導電性膜の形成方法
JP2012214872A (ja) * 2011-03-29 2012-11-08 Fujifilm Corp 金属膜を有する積層体の製造方法
JP2013028713A (ja) * 2011-07-28 2013-02-07 Daicel Corp プライマー組成物および該プライマー組成物を用いた光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6171583B2 (ja) 2013-05-31 2017-08-02 富士通株式会社 電子装置及びその製造方法
WO2020255749A1 (ja) 2019-06-21 2020-12-24 パナソニックＩｐマネジメント株式会社 封止用組成物、半導体装置及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003020323A (ja) * 2001-04-19 2003-01-24 Canon Inc エポキシ樹脂組成物、基材の表面改質方法、インクジェット記録ヘッド及びインクジェット記録装置
JP2007211114A (ja) * 2006-02-08 2007-08-23 Nippon Shokubai Co Ltd 基材表面改質用樹脂組成物及び積層体
JP2008255140A (ja) * 2007-03-30 2008-10-23 Fujifilm Corp エポキシ樹脂成形体、エポキシ樹脂成形体の表面改質方法、及びそれを用いた導電性膜の形成方法
JP2012214872A (ja) * 2011-03-29 2012-11-08 Fujifilm Corp 金属膜を有する積層体の製造方法
JP2013028713A (ja) * 2011-07-28 2013-02-07 Daicel Corp プライマー組成物および該プライマー組成物を用いた光半導体装置

Also Published As

Publication number Publication date
CN118871514A (zh) 2024-10-29
KR20240170544A (ko) 2024-12-03
TW202348699A (zh) 2023-12-16
JPWO2023190309A1 (https=) 2023-10-05

Similar Documents

Publication Publication Date Title
JP7840247B2 (ja) 電子デバイスの製造方法
TWI825365B (zh) 樹脂組成物、硬化物、密封用薄膜及密封結構體
JP6477925B2 (ja) 半導体装置の製造方法
TWI886199B (zh) 樹脂組成物
CN101120440A (zh) 区域安装型半导体装置及用于该半导体装置的小片接合用树脂组合物、密封用树脂组合物
JP7601143B2 (ja) 樹脂組成物
JP2016213321A (ja) 半導体装置の製造方法及び半導体装置
WO2012165239A1 (ja) 液状樹脂組成物およびそれを用いた半導体装置
JP2023171548A (ja) 中空パッケージおよびその製造方法
JP2021178880A (ja) 封止用樹脂組成物、ウエハーレベルパッケージ、パネルレベルパッケージおよび電子装置
WO2023190309A1 (ja) 表面改質材用樹脂組成物
JP7647942B2 (ja) 樹脂組成物、硬化物、シート状積層材料、樹脂シート、プリント配線板、及び半導体装置
JP2022019609A (ja) 感光性樹脂組成物、電子デバイスの製造方法、電子デバイスおよび感光性樹脂組成物の製造方法
JP7647809B2 (ja) 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス
WO2020255749A1 (ja) 封止用組成物、半導体装置及び半導体装置の製造方法
JP7396246B2 (ja) 封止用途の樹脂組成物
JP2024117683A (ja) 樹脂組成物
TWI884185B (zh) 樹脂組成物
TW202409176A (zh) 樹脂組成物
JP7852657B2 (ja) 樹脂組成物
TWI891410B (zh) 環氧樹脂組合物、樹脂糊料、膜型接著劑、印刷電路板、半導體晶片封裝及電子裝置
JP2002265561A (ja) エポキシ樹脂および樹脂組成物
JP2025083078A (ja) 回路基板の製造方法
JP2025105144A (ja) 樹脂組成物
JP2017010991A (ja) 半導体装置製造用部材、半導体装置及びその製造方法、熱硬化性樹脂組成物、並びに、熱硬化性樹脂フィルム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23780319

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2024512442

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 202380027266.2

Country of ref document: CN

ENP Entry into the national phase

Ref document number: 20247034089

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 23780319

Country of ref document: EP

Kind code of ref document: A1