TW202348699A - 表面改質材料用樹脂組成物 - Google Patents

表面改質材料用樹脂組成物 Download PDF

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Publication number
TW202348699A
TW202348699A TW112111973A TW112111973A TW202348699A TW 202348699 A TW202348699 A TW 202348699A TW 112111973 A TW112111973 A TW 112111973A TW 112111973 A TW112111973 A TW 112111973A TW 202348699 A TW202348699 A TW 202348699A
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TW
Taiwan
Prior art keywords
resin composition
surface modification
resin
epoxy resin
modification materials
Prior art date
Application number
TW112111973A
Other languages
English (en)
Chinese (zh)
Inventor
片山敏彦
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202348699A publication Critical patent/TW202348699A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW112111973A 2022-03-30 2023-03-29 表面改質材料用樹脂組成物 TW202348699A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-055266 2022-03-30
JP2022055266 2022-03-30

Publications (1)

Publication Number Publication Date
TW202348699A true TW202348699A (zh) 2023-12-16

Family

ID=88201718

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111973A TW202348699A (zh) 2022-03-30 2023-03-29 表面改質材料用樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2023190309A1 (https=)
KR (1) KR20240170544A (https=)
CN (1) CN118871514A (https=)
TW (1) TW202348699A (https=)
WO (1) WO2023190309A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120606190B (zh) * 2025-08-11 2025-10-28 锦州阳光能源有限公司 一种光伏组件用助焊材料及其制备方法、串焊复合层压焊接工艺

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003020323A (ja) * 2001-04-19 2003-01-24 Canon Inc エポキシ樹脂組成物、基材の表面改質方法、インクジェット記録ヘッド及びインクジェット記録装置
JP2007211114A (ja) * 2006-02-08 2007-08-23 Nippon Shokubai Co Ltd 基材表面改質用樹脂組成物及び積層体
JP2008255140A (ja) * 2007-03-30 2008-10-23 Fujifilm Corp エポキシ樹脂成形体、エポキシ樹脂成形体の表面改質方法、及びそれを用いた導電性膜の形成方法
JP5579160B2 (ja) * 2011-03-29 2014-08-27 富士フイルム株式会社 金属膜を有する積層体の製造方法
JP5808599B2 (ja) * 2011-07-28 2015-11-10 株式会社ダイセル プライマー組成物および該プライマー組成物を用いた光半導体装置
JP6171583B2 (ja) 2013-05-31 2017-08-02 富士通株式会社 電子装置及びその製造方法
WO2020255749A1 (ja) 2019-06-21 2020-12-24 パナソニックＩｐマネジメント株式会社 封止用組成物、半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN118871514A (zh) 2024-10-29
KR20240170544A (ko) 2024-12-03
WO2023190309A1 (ja) 2023-10-05
JPWO2023190309A1 (https=) 2023-10-05

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