WO2023185194A1 - 一种光电共封装结构及通信设备 - Google Patents

一种光电共封装结构及通信设备 Download PDF

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Publication number
WO2023185194A1
WO2023185194A1 PCT/CN2023/070781 CN2023070781W WO2023185194A1 WO 2023185194 A1 WO2023185194 A1 WO 2023185194A1 CN 2023070781 W CN2023070781 W CN 2023070781W WO 2023185194 A1 WO2023185194 A1 WO 2023185194A1
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WIPO (PCT)
Prior art keywords
circuit board
photoelectric conversion
conversion module
pin
optoelectronic
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Application number
PCT/CN2023/070781
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English (en)
French (fr)
Inventor
张顺
王文怡
陈冲
翟宁
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华为技术有限公司
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Publication of WO2023185194A1 publication Critical patent/WO2023185194A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits

Definitions

  • the present application relates to the field of communication technology, and in particular to an optoelectronic co-packaging structure and communication equipment.
  • Optical communication technology has become a large-capacity, low-cost, and mass-produced technology, and is widely used in applications such as switch interconnection and server interfaces.
  • optical communication technology it is necessary to realize the connection between optical fiber carrying data and network communication equipment such as switches.
  • optical and electrical co-encapsulation technology has become one of the technical hot spots that can achieve higher speed and larger bandwidth connections.
  • optoelectronic co-encapsulation is to encapsulate photoelectric conversion modules and electrical chips on the same substrate.
  • the co-encapsulated structural components may include encapsulated circuit boards, and the electrical chips and photoelectric conversion modules are arranged on the same side of the encapsulated circuit board.
  • the encapsulated circuit board can be placed on the control circuit board in the switch and electrically connected to the control circuit board.
  • An optical interface is provided on the panel of the switch, and the optical interface and photoelectric conversion The module is electrically connected.
  • the external optical fiber can be connected to the optical interface, thereby connecting the external optical fiber to the photoelectric conversion module, and then the external optical fiber is connected to the electrical chip through the photoelectric conversion module, so that the connection between the optical cable and the switch and other equipment can be realized. connections between.
  • the electrical chip and the photoelectric conversion module are located on the same side of the packaged circuit board, resulting in an increase in the size of the packaged circuit board, higher packaging costs, and higher link losses.
  • This application provides an optoelectronic co-encapsulation structure and communication equipment, which solves the problem that the existing optoelectronic co-encapsulation structure causes the electric chip and the photoelectric conversion module to be located on the same side of the package circuit board, resulting in an increase in the size of the package circuit board, an increase in packaging costs, and an increase in Link loss problem.
  • the first aspect of this application provides an optoelectronic co-packaging structure, including: a carrier circuit board, a photoelectric conversion module, a packaged circuit board and an electrical chip;
  • the carrying circuit board includes a first side and a second side opposite to the first side, the package circuit board is located on the first side, the electrical chip is disposed on the package circuit board, and the The electrical chip is electrically connected to the packaged circuit board, and the photoelectric conversion module is disposed on the second side, that is, the photoelectric conversion module and the packaged circuit board are separated and decoupled, and the photoelectric conversion module and the packaged circuit board are respectively disposed on Carrying the opposite sides of the circuit board, this can ensure that the setting of the photoelectric conversion module will not affect the size of the packaged circuit board, thereby significantly reducing the size of the packaged circuit board, reducing the processing difficulty and cost of the packaged circuit board, and facilitating the packaging of the circuit Board processing is realized.
  • Reducing the size of the packaged circuit board can also reduce the loss of the signal transmission link and improve the transmission effect. It can also reduce restrictions on the size of the connection pins on the packaged circuit board, further reducing the processing difficulty of the packaged circuit board. And it helps to improve the connection reliability of the entire transmission link.
  • a first conductive via hole is provided on the carrier circuit board, and the photoelectric conversion module is electrically connected to the package circuit board through the first conductive via hole.
  • the direct electrical connection between the photoelectric conversion module and the packaged circuit board is realized through the first conductive via hole, which reduces the inter-board wiring on the high-speed connection link between the photoelectric conversion module and the packaged circuit board, shortens the signal transmission path, and significantly It reduces the high-speed link loss and improves the signal transmission quality, that is, while reducing the size of the packaged circuit board, it effectively reduces the transmission link loss and improves the signal transmission quality. It also eliminates the need for high-speed wiring between boards and the use of expensive high-speed boards, which helps reduce the processing cost and difficulty of carrying circuit boards.
  • the vertical projection of the photoelectric conversion module on the carrier circuit board is a first projection
  • the vertical projection of the package circuit board on the carrier circuit board is a second projection
  • at least Part of the first projection overlaps with the second projection. That is to say, the space occupied by the photoelectric conversion module and the packaged circuit board on the carrier circuit board at least partially overlaps.
  • This can reduce the space occupied by the photoelectric conversion module and the packaged circuit board on the carrier circuit board and help reduce the size of the carrier circuit board.
  • the size makes it easier to reduce the processing difficulty and cost of carrying circuit boards. It also helps to shorten the distance between the photoelectric conversion module and the package circuit board, and helps to reduce the path of the connection link between the two, so that the two can be electrically connected through the first conductive via hole.
  • the package circuit board has a first pin on a side facing the carrying circuit board, and the photoelectric conversion module has a second pin on a side facing the carrying circuit board, so Two ends of the first conductive via are electrically connected to the first pin and the second pin respectively.
  • the photoelectric conversion module and the package circuit board can be electrically connected through the first conductive via hole.
  • the vertical projection of the first pin on the carrier circuit board coincides with the vertical projection of the second pin on the carrier circuit board, and the first conductive
  • the extending direction of the via hole is perpendicular to the carrying circuit board. That is to say, the extension direction of the first conductive via hole is past the first pin and the second pin and perpendicular to the direction of the carrying circuit board. This ensures that the photoelectric conversion module and the packaged circuit board are directly connected through the first conductive via hole. At the same time, it can also reduce the extension length of the first conductive via hole, which helps to further reduce the path of the connection link between the photoelectric conversion module and the electrical chip, and reduces high-speed link loss.
  • the vertical projection of the first pin on the carrier circuit board is offset from the vertical projection of the second pin on the carrier circuit board. This reduces the constraints on the arrangement and setting of the first pin and the second pin, increases the flexibility of the setting of the first pin and the second pin, and enriches the application scenarios of the optoelectronic co-packaging structure.
  • the carrier circuit board includes at least two substrates arranged in a stack
  • connection via hole is provided on each layer of the substrate, and the connection via holes on at least two layers of the substrate are staggered, and the connection via holes on two adjacent layers of substrate are electrically connected to form the first Conductive vias.
  • the adjacent connection vias are connected to form a first conductive via, so that the first conductive via is used to project the offset first pin and the second lead on the carrier circuit board. electrical connection between the feet.
  • the circuit board also includes a metal layer.
  • the metal layer is disposed between the connection vias on two adjacent substrates.
  • the connection via passes through the metal layer. connect. It can effectively increase the electrical contact area between two connection vias, reduce or avoid the instability of the electrical connection caused by the misalignment of the connection vias of two adjacent layers of substrates, and improve the electrical connection between the connection vias. stability.
  • the first conductive via includes a through hole, a blind hole or a buried hole.
  • it further includes a power supply module, the power supply module is electrically connected to the photoelectric conversion module, and the power supply module is disposed on the carrier circuit board.
  • the power supply module is used to power the photoelectric conversion module, which helps ensure the stability and flexibility of the power supply to the photoelectric module.
  • the carrier circuit board is also provided with a second conductive via hole
  • the power supply module is disposed on the first side
  • the power supply module communicates with the second conductive via hole through the second conductive via hole.
  • the photoelectric conversion module is electrically connected. That is to say, the power supply module and the photoelectric conversion module are located on opposite sides of the carrier circuit board, and the power supply module and the photoelectric conversion module can be directly electrically connected through the second conductive via hole, avoiding the need for inter-board wiring (such as wiring on the carrier circuit board). Line) realizes the connection between the power supply module and the photoelectric conversion module, which helps to shorten the path of the connection link and further reduce link loss.
  • the photoelectric conversion module has a third pin on a side facing the circuit board, the power supply module has a fourth pin, and both ends of the second conductive via hole connected to the third pin and the fourth pin respectively. Thereby, the electrical connection between the power supply module and the photoelectric conversion module is realized through the second conductive via hole.
  • the photoelectric conversion module includes a first part and a second part, the vertical projection of the first part on the carrier circuit board overlaps the second projection, and the second part is on The vertical projection on the carrier circuit board is located outside the second projection, the first pin is located on the first part, and the third pin is located on the second part;
  • the vertical projection of the third pin on the carrier circuit board coincides with the vertical projection of the fourth pin on the carrier circuit board, and the extension direction of the second conductive via hole is consistent with the carrier circuit board.
  • the circuit board is vertical. That is to say, the extension direction of the second conductive via hole is past the third pin and the fourth pin and perpendicular to the direction of the carrying circuit board. This ensures that the photoelectric conversion module and the power supply module are directly connected through the second conductive via hole.
  • the extension length of the second conductive via hole can be reduced, which helps to further reduce the path of the connection link between the power supply module and the photoelectric conversion module, reduce link loss, and improve the power supply efficiency of the power supply module.
  • a second aspect of the present application provides a communication device, which at least includes a housing and any of the above-mentioned optoelectronic co-packaging structures, and the optoelectronic co-packaging structure is disposed in the housing.
  • the housing is provided with an optical interface for connecting external optical fibers, and the optical interface is connected to the photoelectric conversion module.
  • the package circuit board encapsulating the electrical chip in the optoelectronic co-encapsulation structure has a smaller size, is easy to process and implement, helps to reduce the processing difficulty and cost of the entire communication equipment, and has higher connection stability. Moreover, the optoelectronic co-packaging structure has lower high-speed transmission link loss and can effectively improve the transmission performance of communication equipment.
  • it further includes a control circuit board, the carrying circuit board is disposed on the control circuit board, and the carrying circuit board and the control circuit board are electrically connected. That is to say, installing a separate control board in the communication equipment can help reduce the design difficulty of the control circuit board and facilitate the processing of the control circuit board and the optoelectronic co-packaging structure compared with using the carrier circuit board in the optoelectronic co-packaging structure as the control board. accomplish.
  • it further includes an internal optical fiber located in the housing, and the optical interface is connected to the photoelectric conversion module through the internal optical fiber.
  • the electrical connection between the external optical fiber and the photoelectric conversion module is realized, and then the electrical connection between the external optical fiber and the electrical chip is realized, and the signal transmission between the communication equipment and the external optical fiber is realized.
  • Figure 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application.
  • Figure 2 is a schematic diagram of signal transmission in a communication device provided by an embodiment of the present application.
  • Figure 3 is a schematic front view of an optoelectronic co-packaging structure in the related art
  • Figure 4 is a schematic diagram of the assembly of an optoelectronic co-packaging structure and a control circuit board in the related art
  • Figure 5 is a schematic diagram of a connection scenario of an optoelectronic co-packaging structure in a communication device in the related art
  • Figure 6 is a schematic diagram of another optoelectronic co-packaging structure in the related art.
  • Figure 7 is a schematic front view of an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • Figure 8 is a schematic cross-sectional view of an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • Figure 9 is a schematic diagram of the dimensions of a circuit board packaged in an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • Figure 10 is a schematic cross-sectional structural diagram of a communication device provided by an embodiment of the present application.
  • Figure 11 is a schematic assembly diagram of a co-packaging structure and a control circuit board provided by an embodiment of the present application;
  • Figure 12 is a schematic diagram of another optoelectronic co-packaging structure provided by an embodiment of the present application.
  • Figure 13 is a schematic diagram of the assembly of another optoelectronic co-packaging structure and a control circuit board provided by an embodiment of the present application;
  • FIG. 14 is a schematic diagram of another optoelectronic co-packaging structure provided by an embodiment of the present application.
  • the communication device provided by the embodiment of the present application may be a communication device used for signal interaction, such as a switch, a router, a network transmission device, a broadband access device, etc.
  • a communication device used for signal interaction such as a switch, a router, a network transmission device, a broadband access device, etc.
  • the following description takes the communication device as a switch as an example.
  • the signal transmission between the switch and the external optical fiber is mostly realized with the help of a photoelectric conversion module.
  • the external optical fiber is connected to the photoelectric conversion module, and the photoelectric conversion module is electrically connected to the electrical chip of the communication equipment.
  • the photoelectric conversion module is used to realize the conversion of optical signals to electrical signals. Signals and the conversion of electrical signals to optical signals, thereby realizing signal transmission between the electrical chip of the communication device and the external optical fiber.
  • the optical signal on the external optical fiber is converted into an electrical signal through the photoelectric conversion module and transmitted to the electrical chip, thereby realizing the transmission of the signal from the external optical fiber to the communication device.
  • the electrical signal of the electronic chip is converted into an optical signal after passing through the photoelectric conversion module and transmitted to the external optical fiber, thereby realizing the transmission of the signal from the communication device to the external optical fiber.
  • Co-packaged Optics technology has received widespread attention.
  • Co-packaged Optics (CPO) technology combines optical engine (OE), also known as Optoelectronic conversion module) and electrical chips are co-packaged, and the packaging structure is applied to communication equipment such as switches to realize signal transmission between communication equipment and external optical fibers.
  • OE optical engine
  • Optoelectronic conversion module optical engine
  • electrical chips electrical chips are co-packaged, and the packaging structure is applied to communication equipment such as switches to realize signal transmission between communication equipment and external optical fibers.
  • FIG. 1 is a schematic structural diagram of a communication device provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of signal transmission in a communication device provided by an embodiment of the present application.
  • the communication device 100 includes a housing 20 , and the housing 20 may include a panel 21 .
  • the panel 21 may be located on the front of the entire communication device 100 , that is, on the front appearance of the entire communication device 100 .
  • An optical interface 211 may be provided on the panel 21, and the optical interface 211 is used to connect to an external optical fiber.
  • the number of optical interfaces 211 may be one, or the number of optical interfaces 211 may be multiple. When the number of optical interfaces 211 is multiple, the plurality of optical interfaces 211 can be arranged in parallel in multiple rows on the panel 21 .
  • the optoelectronic co-packaging structure 10 is disposed in the housing 20 .
  • the optoelectronic co-packaging structure 10 may include a photoelectric conversion module 12 and an electrical chip 14 .
  • the electrical chip 14 is electrically connected to the photoelectric conversion module 12 .
  • An internal optical fiber 40 is also provided in the housing 20.
  • the photoelectric conversion module 12 can be connected to the optical interface 211 through the internal optical fiber 40.
  • the optical interface 211 is connected to an external optical fiber, so that the external optical fiber is connected to the photoelectric conversion module 12, thereby Realizing the connection between the external optical fiber and the electrical chip 14 also realizes the signal transmission between the external optical fiber and the communication device 100 .
  • FIG. 3 is a schematic front view of an optoelectronic co-encapsulation structure in the related art
  • FIG. 4 is a schematic assembly diagram of an optoelectronic co-encapsulation structure and a control circuit board in the related art.
  • the optoelectronic co-packaging structure 1 may include a packaged circuit board 1a, an electrical chip 1b and a photoelectric conversion module 1c. Among them, the electrical chip 1b and the photoelectric conversion module 1c are arranged on the same surface of the packaged circuit board 1a. There are multiple photoelectric conversion modules 1c, and the multiple photoelectric conversion modules 1c are arranged around the circumference of the electrical chip 1b.
  • the photoelectric conversion module 1c is electrically connected to the electrical chip 1b through the wiring 1e on the packaged circuit board 1a, thereby realizing signal transmission between the electrical chip 1b and the external optical fiber.
  • Figure 5 is a schematic diagram of a connection scenario of an optoelectronic co-packaging structure in a communication device in the related art.
  • the packaging circuit board 1a can be arranged on the control circuit board 2a of the switch, and the photoelectric conversion module 1c and the control circuit board 2a can also be electrically connected. Connection to realize the transmission of control signals or power signals, etc.
  • the optical interface 2c is electrically connected to the photoelectric conversion module 1c through the internal optical fiber 2d.
  • the transmission link between the switch and the external optical fiber is the electrical chip 1b, the packaged circuit board 1a, and the photoelectric conversion module. Module 1c, external optical fiber.
  • Figure 3 shows a commonly used 51.2T capacity optoelectronic hybrid packaging structure. There are 16 3.2T photoelectric conversion modules on the packaging circuit board. The length L11 and width L12 of the packaging circuit board are approximately 126mm*126mm. The size processing limit of the current package circuit board 1a of the electronic chip 1b is 110mm*100mm, which exceeds the current processing capacity and cannot be processed.
  • the high-speed link loss will also increase.
  • the increased link loss due to the increase in the size of the packaged circuit board 1a is 0.14db/mm ⁇ 0.18db/mm. Losses need to be further reduced.
  • the transmission of power signals and the like between the photoelectric conversion module 1c and the control circuit board 2a needs to pass through the packaged circuit board 1a.
  • the increase in the number of connection pins on the packaged circuit board 1a will also lead to an increase in the size and processing difficulty of the packaged circuit board 1a.
  • the size of the photoelectric conversion module 1c and the connecting pins are usually compressed.
  • the pins are required to be less than 0.5 mm, small pins and the photoelectric conversion module 1c are also more difficult to process, and the risk of contact reliability is also high, which will reduce the connection reliability of the entire link.
  • Figure 6 is a schematic diagram of another optoelectronic co-packaging structure in the related art.
  • the related technology uses near-packaged optics (NPO) technology, which arranges the photoelectric conversion module and the electrical chip on different substrates.
  • NPO near-packaged optics
  • the optoelectronic co-packaging structure 3 includes an adapter circuit board 3a, a package circuit board 3c, an electrical chip 3b and a photoelectric conversion module 3d.
  • the package circuit board 3c and the photoelectric conversion module 3d are arranged on the adapter circuit board.
  • multiple photoelectric conversion modules 3d are arranged around the circumference of the packaged circuit board 3c.
  • the electrical chip 3b is arranged on the side of the packaged circuit board 3c facing away from the switching circuit board 3a.
  • the photoelectric conversion modules 3d pass through the switching circuit.
  • the traces 3e on the board 3a are electrically connected to the package circuit board 3c, thereby achieving electrical connection with the electrical chip 3b.
  • the photoelectric conversion module 3d is separated from the packaged circuit board 3c.
  • the photoelectric conversion module 3d does not occupy the space of the packaged circuit board 3c, thereby reducing the size of the packaged circuit board 3c and facilitating the processing of the packaged circuit board 3c.
  • the optoelectronic co-packaging structure 3 is applied to the switch (refer to Figure 5).
  • the switching circuit board 3a is provided on the control circuit board of the switch.
  • the optical interface is electrically connected to the photoelectric conversion module 3d through internal optical fibers.
  • the transmission link between the switch and the external optical fiber is the electrical chip 3b, the packaging circuit board 3c, the wiring of the switching circuit board 3e, the photoelectric conversion module 3d, and the external optical fiber.
  • the photoelectric conversion module 3d and the package circuit board 3c are electrically connected through the wiring 3e on the transfer circuit board 3a.
  • the wiring 3e on the transfer circuit board will increase the loss of the high-speed connection link.
  • the loss is usually 0.05db/mm ⁇ 0.08db/mm.
  • the wiring 3e of the switching circuit board is used to realize high-speed signal transmission, so the switching circuit board 3a needs to use high-speed boards, which increases the cost of the switching circuit board 3a, and the existence of wiring will also increase the cost of the switching circuit board 3a.
  • the number of layers increases the processing difficulty of the transfer circuit board 3a.
  • embodiments of the present application provide an optoelectronic co-packaging structure, which effectively reduces the size of the packaged circuit board, reduces the difficulty and cost of packaging, and also effectively reduces the loss of the high-speed signal transmission link and facilitates signal transmission. Develop towards high speed and large capacity.
  • FIG. 7 is a schematic front view of an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • the optoelectronic co-packaging structure 10 includes a packaging circuit board 13 and an electrical chip 14 .
  • the packaging circuit board 13 is used to package the electrical chip 14 .
  • the electrical chip 14 is disposed on the packaging circuit board 13 .
  • the electrical chip 14 14 is a carrier of an integrated circuit.
  • the electrical chip 14 may be a silicon chip.
  • the electrical chip 14 may be a bare chip (Die), or the electrical chip 14 may be a chip integrated with electronic devices.
  • the electrical chip 14 may be a silicon chip integrated with electronic devices such as a processor and a memory.
  • the electrical chip 14 can be fixedly mounted on the package circuit board 13 by welding or other methods.
  • a protective member 16 is also provided on the packaged circuit board 13 .
  • the protective member 16 is arranged around the outer periphery of the electrical chip 14 to encapsulate and protect the electrical chip 14 .
  • the protective member 16 may be an insulating structural member such as resin or silicone, and the protective member 16 may be disposed on the package circuit board 13 by adhesion or other methods.
  • the packaged circuit board 13 can be a Printed Circuit Board (PCB for short) or a substrate (Substrate).
  • PCB Printed Circuit Board
  • substrate Substrate
  • the packaged circuit board 13 can be a rigid printed circuit board, which can play a certain rigid supporting role. To ensure the stability of the electronic chip 14.
  • FIG. 8 is a schematic cross-sectional view of an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • the optoelectronic co-packaging structure 10 also includes a carrier circuit board 11 and a photoelectric conversion module 12 , wherein the carrier circuit board 11 at least includes a first side 111 and a second side 112 , and the first side 111 and the second side 112 .
  • the two side surfaces 112 are two opposite sides of the carrier circuit board 11 .
  • the package circuit board 13 is disposed on the first side 111 of the carrier circuit board 11 .
  • the electrical chip 14 is disposed on the package circuit board 13 . Specifically, the electrical chip 14 can be It is located on the side of the packaging circuit board 13 facing away from the carrying circuit board 11 .
  • the photoelectric conversion module 12 is disposed on the second side 112 of the carrier circuit board 11 , that is, the photoelectric conversion module 12 and the package circuit board 13 are separated and decoupled, and the photoelectric conversion module 12 and the package circuit board 13 are respectively disposed opposite the carrier circuit board 11 . This ensures that the setting of the photoelectric conversion module 12 will not affect the size of the packaged circuit board 13, thereby significantly reducing the size of the packaged circuit board 13, reducing the processing difficulty and cost of the packaged circuit board 13, and facilitating packaging. The processing of circuit board 13 is realized.
  • the reduction in the size of the packaged circuit board 13 can also reduce the loss of the high-speed signal transmission link between the electrical chip and the photoelectric conversion module, and improve the transmission effect. At the same time, it can also reduce restrictions on the size of the connection pins on the packaged circuit board 13, further reduce the processing difficulty of the packaged circuit board 13, and help improve the connection reliability of the entire transmission link. Moreover, the reduction in size can also improve the flatness of the packaged circuit board 13, improve the connection quality between the packaged circuit board 13 and the carrier circuit board 11, the electrical chip 14, etc., and improve the reliability of the package.
  • heat dissipation modules (not shown in the figure) are usually provided around the electrical chip 14.
  • the package circuit board 13, the electrical chip 14 and the photoelectric conversion module 12 are arranged on opposite sides of the carrier circuit board 11, which can avoid The interference between the heat dissipation module and the photoelectric conversion module 12 improves the rationality of the layout of the photoelectric co-packaging structure 10 .
  • a first conductive via 113 is opened on the carrier circuit board 11.
  • the photoelectric conversion module 12 and the packaged circuit board 13 are respectively located on opposite sides of the carrier circuit board 11.
  • the photoelectric conversion module 12 and the packaged circuit The board 13 can be electrically connected through the first conductive via 113 , thereby realizing the electrical connection between the photoelectric conversion module 12 and the electrical chip 14 .
  • the direct electrical connection between the photoelectric conversion module 12 and the packaging circuit board 13 is realized through the first conductive via 113.
  • the photoelectric conversion module 12 and the package circuit board 13 are connected by wiring.
  • the inter-board wiring on the high-speed connection link between the conversion module 12 and the packaged circuit board 13 shortens the signal transmission path and significantly reduces the high-speed link loss.
  • the link loss can be reduced by about 2dB to 3dB, effectively improving the signal. Transmission quality. That is to say, the optoelectronic co-packaging structure 10 provided by the embodiment of the present application can not only reduce the size of the packaged circuit board 13, but also effectively reduce the transmission link loss and improve the signal transmission quality.
  • the use of the first conductive via 113 to connect the photoelectric conversion module 12 and the packaged circuit board 13 can eliminate the need for high-speed wiring between boards, avoid the use of expensive high-speed boards, reduce the processing cost of the carrier circuit board 11, and also help The number of layers and structural design of the carrier circuit board 11 are simplified, and the processing difficulty of the carrier circuit board 11 is reduced.
  • the packaged circuit board 13 can be fixed on the carrier circuit board 11 by welding or other methods, or the optoelectronic co-packaging structure 10 can also include a plug connector (Socket connector), and the packaged circuit board 13 can be connected by plugging.
  • the device is vertically plugged into the carrier circuit board 11, and the package circuit board 13 is electrically connected to the carrier circuit board through the plug connector.
  • the number of photoelectric conversion modules 12 included in the optoelectronic co-packaging structure 10 may be one, or the number of photoelectric conversion modules 12 may also be multiple to meet the high-density connection requirements of communication equipment. . Specifically, when the number of photoelectric conversion modules 12 is multiple, the plurality of photoelectric conversion modules 12 can be distributed on the carrier circuit board 11 along the circumferential direction of the package circuit board 13.
  • the photoelectric conversion module 12 can also be fixedly arranged on the carrier circuit board 11 through welding or other methods, or the photoelectric conversion module 12 can also be vertically plugged into the carrier circuit board 11 through a plug connector, and the photoelectric conversion module 12 can be The plug connector realizes the electrical connection to the carrier circuit board 11 .
  • the photoelectric conversion module 12 can be any structural component capable of converting optical signals and electrical signals.
  • the photoelectric conversion module 12 may be an integrated structure of active devices and passive devices.
  • the active devices may include drivers, modulators, photodetectors, transimpedance amplifiers, etc.
  • the driver is connected to the modulator, and the driver is used to amplify the electrical signal so that the electrical signal swing meets the requirements of driving the modulator.
  • Modulators are used to convert electrical signals into optical signals, and photodetectors are used to convert optical signals into electrical signals.
  • the transimpedance amplifier is used to convert weak electrical signals into amplified electrical signals to meet the input swing requirements of the subsequent-stage signal processing circuit (such as the electrical chip 14).
  • the passive components of the photoelectric conversion module 12 may include optical waveguides, gratings, optical fibers, etc., which can transmit or enhance optical signals and other functions.
  • first conductive vias 113 there may be a plurality of first conductive vias 113 on the circuit board 11 , and the plurality of first conductive vias 113 are arranged at intervals.
  • One photoelectric conversion module 12 can be connected to the circuit board 11 through the plurality of first conductive vias 113 .
  • the package circuit board 13 is electrically connected.
  • the number of first conductive vias 113 can be selected and set according to actual connection requirements.
  • the first conductive via hole 113 on the carrier circuit board 11 may be a metallized via hole, and the first conductive via hole 113 may be a through hole, a blind hole, a buried hole, etc. opened on the carrier circuit board 11, which can realize electrical conduction. Just pass the function.
  • the metallization method can be electroplating, filling, hole plugging, etc., which is not limited in the embodiment of the present application.
  • the carrying circuit board 11 may be a PCB circuit board, or the carrying circuit board 11 may also be a carrying board, an organic substrate, a ceramic board, etc. that only play a supporting role and can play a supporting role and form a first conductive board on it.
  • the via hole 113 (and the second conductive via hole) is sufficient to achieve electrical connection.
  • FIG. 9 is a schematic diagram of the dimensions of a circuit board packaged in an optoelectronic co-packaging structure provided by an embodiment of the present application.
  • Figure 10 is a schematic cross-sectional structural diagram of a communication device provided by an embodiment of the present application.
  • the carrier circuit board 11 can be used as a control circuit board of the communication device 100, and the control circuit board is used to control the overall operation of the communication device.
  • a control circuit board 30 can also be provided in the communication device 100 , that is, the carrying circuit board 11 is used as a transfer board that plays a carrying and switching role, which helps to reduce the control cost.
  • the design difficulty of the circuit board 30 facilitates the processing and implementation of the control circuit board 30 and the optoelectronic co-packaging structure 10 .
  • the carrier circuit board 11 is used in a switch and a control circuit board 30 is installed in the switch, that is, the carrier circuit board 11 serves as an adapter board.
  • the carrier circuit board 11 is disposed on the control circuit board 30 , and the carrier circuit board 11 is electrically connected to the control circuit board 30 , thereby realizing the electrical connection between the control circuit board 30 and the electrical chip 14 .
  • the photoelectric conversion module 12 is connected to the optical interface 211 on the panel 21 through the internal optical fiber 40. Each optical interface 211 is connected to a photoelectric conversion module 12.
  • the optical interface 211 is connected to the external optical fiber, thereby realizing the external optical fiber and the photoelectric conversion module.
  • the connection of 12 realizes the connection between the external optical fiber and the electrical chip 14, and realizes the signal transmission between the external optical fiber and the communication device 100.
  • the optical signal on the external optical fiber is transmitted to the photoelectric conversion module 12 through the optical interface 211 and the internal optical fiber 40.
  • the optical signal is converted into an electrical signal through the photoelectric conversion module 12, and the output electrical signal passes through the first conductive via 113.
  • the package circuit board 13 is transmitted to the electrical chip 14, realizing the transmission of signals from the external optical fiber to the communication device 100.
  • the electrical signal of the electrical chip 14 can be transmitted to the photoelectric conversion module 12 through the package circuit board 13 and the first conductive via hole 113 in sequence, and then converted into an optical signal output by the photoelectric conversion module 12.
  • the optical signal passes through the internal optical fiber 40 and the optical signal.
  • the interface 211 transmits to the external optical fiber, thereby realizing the transmission of signals from the communication device 100 to the external optical fiber.
  • the communication device 100 may also include a support member 50 .
  • the support member 50 may be located between the control circuit board 30 and the carrier circuit board 11 .
  • the support member 50 may be a conductive structural member.
  • the control circuit board 30 may be connected to the control circuit board 30 through the support member 50 . Carrying the electrical connections of the circuit board 11 .
  • the support member 50 may be a metal support structure member, or the support member 50 may be a board-to-board connector (Board to Board, B2B connector for short).
  • the support member 50 may also be other structural members capable of realizing electrical connection between the carrying circuit board 11 and the control circuit board 30 .
  • the support member 50 may also be an insulating member, disposed between the control circuit board 30 and the carrier circuit board 11 , and only serves as a rigid support.
  • the communication device 100 may also include a cable, and the carrier circuit board 11 may be electrically connected to the control circuit board 30 through the cable.
  • the carrier circuit board 11 is electrically connected to the control circuit board 30, so that the control circuit board 30 is connected to the electrical chip 14.
  • This connection link is used to transmit low-speed signals, such as control signals, power signals, etc., and the connection link is used to transmit low-speed signals, such as control signals, power signals, etc.
  • the method is relatively simple.
  • Figure 11 is a schematic assembly diagram of a co-packaging structure and a control circuit board provided by an embodiment of the present application.
  • the circuit is packaged
  • the vertical projection of the board 13 on the carrier circuit board 11 (that is, the package circuit board 13 is projected onto the carrier circuit board 11 in the direction vertical to the carrier circuit board 11) is the second projection, and the first projection can at least partially overlap with the second projection.
  • the space occupied by the photoelectric conversion module 12 and the packaged circuit board 13 on the carrier circuit board 11 at least partially overlaps. This can reduce the space occupied by the photoelectric conversion module 12 and the packaged circuit board 13 on the carrier circuit board 11 , help reduce the size of the carrier circuit board 11 , and facilitate the processing difficulty and cost of the carrier circuit board 11 .
  • overlapping at least part of the first projection and the second projection also helps to shorten the distance between the photoelectric conversion module 12 and the package circuit board 13, and helps to reduce the path of the high-speed connection link between the two. , so that the two can be electrically connected through the first conductive via 113 .
  • a second pin 121 may be provided on one side of the circuit board 11.
  • the first pin 131 and the second pin 121 may be located at both ends of the first conductive via hole 113, and the first pin 131 and the second pin 121 may be disposed on one side of the circuit board 11.
  • the pins 121 can be electrically connected to both ends of the first conductive via hole 113 respectively, so that the photoelectric conversion module 12 and the package circuit board 13 can be electrically connected through the first conductive via hole 113 .
  • the number of first pins 131 can be multiple, and the number of second pins 121 can also be multiple.
  • the number of second pins 121 can correspond to the number of first pins 131, carrying the circuit board.
  • the number of first conductive vias 113 on 11 is also multiple.
  • a fifth pin 141 can be provided on the side of the electrical chip 14 facing the packaged circuit board 13, and an inter-board wiring 132 is provided on the packaged circuit board 13.
  • the fifth pin 141 can be routed between the boards.
  • the wire 132 is electrically connected to the first pin 131, thereby realizing the electrical connection between the electrical chip 14 and the packaging circuit board 13, and further realizing the electrical connection between the electrical chip 14 and the photoelectric conversion module 12.
  • the first pin 131 and the second pin 121 may be arranged in corresponding positions.
  • the first pin 131 is positioned vertically on the carrier circuit board 11 .
  • the projection may completely coincide with the vertical projection of the second pin 121 on the carrier circuit board 11 , that is, the first pin 131 and the second pin 121 are arranged in mirror symmetry with the carrier circuit board 11 as the symmetry line.
  • Both ends of the first conductive via 113 are electrically connected to the first pin 131 and the second pin 121 respectively, so that the extension direction of the first conductive via 113 can be kept perpendicular to the carrying circuit board 11 , that is, the first conductive via 113
  • the extension direction of the via hole 113 is through the first pin 131 and the second pin 121 and is perpendicular to the direction of the circuit board 11 .
  • the first conductive via hole 113 is a vertical direction connecting the first pin 131 and the second pin 121 . Vias.
  • the photoelectric conversion module 12 and the packaged circuit board 13 are directly connected through the first conductive via hole 113, it can also reduce the extension length of the first conductive via hole 113, which helps to further reduce the size of the photoelectric conversion module 12 and the packaging circuit board 13.
  • the paths connecting the links between 14 electrical chips reduce high-speed link losses.
  • Figure 12 is a schematic diagram of another optoelectronic co-packaging structure provided by an embodiment of the present application.
  • the first pin 131 and the second pin 121 can be disposed in a staggered manner. Specifically, see the vertical projection of the first pin 131 on the carrier circuit board 11 as shown in FIG. 12 It can be misaligned with the vertical projection of the second pin 121 on the carrier circuit board 11 , that is, the vertical projection of the first pin 131 on the carrier circuit board 11 and the vertical projection of the second pin 121 on the carrier circuit board 11 Without completely overlapping, the first pin 131 and the vertical projection of the second pin 121 on the carrier circuit board 11 may be staggered in position.
  • the extension direction of the first conductive via hole 113 can be arranged obliquely to the carrying circuit board 11, that is, the extension direction of the first conductive via hole 113 is through
  • the first pin 131 and the second pin 121 are inclined to the direction of the circuit board 11 .
  • the extension direction of part of the first conductive vias 113 may be perpendicular to the carrier circuit board 11
  • the extension direction of part of the first conductive vias 113 may be inclined to the carrier circuit board 11 .
  • the specific shape and extension direction of the first conductive vias 113 The setting can be selected according to the needs, and the first pin 131 and the second pin 121 can be connected through the first conductive via 113 .
  • the carrier circuit board 11 may include at least two layers of substrates 114 that are superimposed.
  • the carrier circuit board 11 includes multiple layers of substrates 114 , one of which faces the package circuit board 13 .
  • the other substrate faces the photoelectric conversion module 12 .
  • a connection via hole 115 may be provided on each layer of substrate 114.
  • the connection via hole 115 may be a metallized via hole to achieve electrical conduction.
  • connection vias 115 on at least two layers of the multi-layer substrate 114 are offset.
  • the staggered arrangement of the two connecting via holes 115 means that the center lines of the two connecting via holes 115 do not coincide with each other and are staggered from each other.
  • the connection vias 115 on two adjacent layers of substrates are electrically connected, so that the first conductive vias 113 are formed by connecting the connection vias 115 on the multilayer substrate 114 in sequence.
  • the connection via hole 115 located on the substrate 114 facing the package circuit board 13 can be electrically connected to the first pin 131
  • the connection via hole 115 located on the substrate 114 facing the photoelectric conversion module 12 can be electrically connected to the second pin 121 .
  • Contact connection so that the first pin 131 and the second pin 121 projected out of alignment on the carrier circuit board 11 can be connected through the first conductive via 113 .
  • the circuit board 11 may include five stacked substrates 114 .
  • Each substrate 114 is provided with a connection via 115 .
  • the extending direction of the connection via 115 may be perpendicular to the substrate 114 .
  • the two connection vias 115 on two adjacent substrates 114 are offset from each other, and the connection vias 115 on the two adjacent substrates 114 are electrically connected to form a first conductive via 113.
  • Connections on the substrate adjacent to the package circuit board 13 The via hole is electrically connected to the first pin 131, and the connection via hole on the substrate adjacent to the photoelectric conversion module 12 is electrically connected to the second pin 121, so that the package circuit board 13 and photoelectric conversion are realized through the first conductive via hole 113. Electrical connection of module 12.
  • the cross-sectional shape of the connecting via hole 115 may be a regular or irregular shape such as a trapezoid, a quadrilateral, or a triangle, and the specific shape may be selected and set according to actual requirements.
  • a metal layer 116 may be provided between two connecting vias 115 on two adjacent substrates 114, and the connecting vias 115 on two adjacent substrates 114 may pass through the metal layer 116. Electrical connection is achieved, thereby forming the first conductive via 113 . Since the connection vias on the two adjacent substrates are misaligned, it is easy to cause instability in the electrical connection due to the misalignment of the two connection vias, so that the connection vias on the two adjacent substrates are electrically connected through the metal layer 116 . For connection, the metal layer can effectively increase the electrical contact area between the two connection vias, thereby improving the connection stability between the connection vias 115 .
  • FIG. 13 is a schematic diagram of the assembly of another optoelectronic co-packaging structure and a control circuit board provided by an embodiment of the present application.
  • the optoelectronic co-packaging structure 10 may also include a power supply module 15.
  • the power supply module 15 is electrically connected to the photoelectric conversion module 12.
  • the power supply module 15 is used to supply power to the photoelectric conversion module 12, which helps ensure that the photoelectric conversion module 12 power supply stability and flexibility.
  • the power supply module 15 can be disposed on the carrier circuit board 11 to improve the integration of the entire optoelectronic co-packaging structure 10 .
  • the power supply module 15 may also be provided on the control circuit board 30 of the communication device 100 .
  • the power supply module 15 can be disposed on the first side 111 of the carrier circuit board 11 , that is, the power supply module 15 and the packaged circuit board 13 are located on the same side of the carrier circuit board 11 . On the surface.
  • the power supply module 15 can also be disposed on the second side 112 of the circuit board 11 , that is, the power supply module 15 and the photoelectric conversion module 12 are located on the same surface of the circuit board 11 .
  • the power supply module 15 is disposed on the first side 111 of the circuit board 11
  • the photoelectric conversion module 12 is disposed on the second side 112 of the circuit board 11
  • the power supply module 15 and the photoelectric conversion module 12 is located on opposite sides of the circuit board 11 .
  • the second conductive via hole 117 can also be provided on the carrier circuit board 11, so that the power supply module 15 and the photoelectric conversion module 12 can be directly electrically connected through the second conductive via hole 117, avoiding the need for inter-board wiring (such as the carrier circuit).
  • the wiring of the board 11 realizes the connection between the power supply module 15 and the photoelectric conversion module 12, which helps to shorten the path of the connection link and further reduce the link loss.
  • the second conductive via 117 is also a metallized via, which can be a through hole, a blind hole, a buried hole, etc. opened on the carrier circuit board 11.
  • the metallization method can also be electroplating filling, plugging, etc.
  • a third pin 122 can be provided on the side of the photoelectric conversion module 12 facing the carrying circuit board 11
  • a fourth pin (not shown in the figure) can be provided on the power supply module 15, and a second conductive via hole Both ends of 117 can be electrically connected to the third pin 122 and the fourth pin respectively, so that the power supply module 15 and the photoelectric conversion module 12 are electrically connected through the second conductive via 117 .
  • the second pin 121 of the photoelectric conversion module 12 is used to transmit high-speed signals to realize a high-speed connection between the photoelectric conversion module 12 and the electrical chip 14 .
  • the third pin 122 of the photoelectric conversion module 12 can be used to transmit low-speed signals, such as control signals, power signals, etc., and its connection is relatively simple.
  • FIG. 14 is a schematic diagram of another optoelectronic co-packaging structure provided by an embodiment of the present application.
  • the photoelectric conversion module 12 can be divided into a first part 12a and a second part 12b, wherein the vertical projection of the first part 12a on the carrier circuit board 11 is located in the second projection (that is, the package circuit board 13 is located on (projection on the carrier circuit board 11), that is, the vertical projection of the first portion 12a on the carrier circuit board 11 overlaps with the second projection.
  • the vertical projection of the second part 12b on the carrier circuit board 11 is located outside the second projection, that is, the vertical projection of the second part 12b on the carrier circuit board 11 does not overlap with the second projection.
  • the first pin 131 is located on the first part 12a, that is to say, the projection of the first pin 131 on the carrier circuit board 11 is located within the second projection, which facilitates the implementation of the first pin 131 and the second pin 121 on the carrier circuit board 11.
  • the projections on the board 11 overlap, thereby realizing the electrical connection between the first pin 131 and the second pin 121 through the vertical first conductive via 113 .
  • the third pin 122 is located on the second part 12b, that is to say, the projection of the third pin 122 on the carrying circuit board 11 is located outside the second projection.
  • the position of the third pin 122 may correspond to the position of the fourth pin, that is, the projection of the third pin 122 on the carrier circuit board 11 may coincide with the projection of the fourth pin on the carrier circuit board 11.
  • the third pin 122 and the fourth pin are arranged in mirror symmetry with the carrier circuit board 11 as a symmetry line.
  • the extension direction of the second conductive via hole 117 can be kept perpendicular to the carrier circuit board 11 , that is, the extension direction of the second conductive via hole 117 is past the third pin 122 and the fourth pin and perpendicular to the carrier circuit board 11 direction.
  • the extension length of the second conductive via hole 117 helps to further reduce the length of the power supply module 15 and the photoelectric conversion module. 12 connecting link paths reduce link losses and improve the power supply efficiency of the power module.

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Abstract

本申请实施例提供一种光电共封装结构及通信设备，光电共封装结构包括承载电路板、光电转换模块、封装电路板和电芯片，光电转换模块和封装电路板分别位于承载电路板相对的第一侧面和第二侧面上，电芯片设置在封装电路板上，使光电转换模块与封装电路板分离，从而显著减小封装电路板的尺寸，降低封装电路板的加工难度和成本，同时也能够减小高速信号传输链路的损耗。并且在承载电路板上开设第一导电过孔，通过第一导电过孔使封装电路板和光电转换模块直接电连接，减少光电转换模块和封装电路板连接链路上的板间走线，缩短信号传输路径，显著降低高速链路损耗，同时免去高速板间走线，也有助于降低承载电路板的加工难度和成本。

Description

一种光电共封装结构及通信设备
本申请要求于2022年03月31日提交中国专利局、申请号为202210331667.4、申请名称为“一种光电共封装结构及通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信技术领域，特别涉及一种光电共封装结构及通信设备。
背景技术
光通信技术已经成为一种大容量、低成本以及批量产品化的技术，广泛的应用于交换机互联以及服务器接口等应用中。在光通信技术中，需要实现承载数据的光纤至交换机等网络通信设备之间的连接，其中，光电共封装技术已成为了能够实现更高速率、更大带宽连接的技术热点之一。
目前，光电共封装是将光电转换模块和电芯片封装在同一个基板上，具体的，共封装的结构件可以包括有封装电路板，电芯片和光电转换模块设置在封装电路板的同一面上，光电转换模块通常为多个，多个光电转换模块环绕电芯片的外周设置，光电转换模块与电芯片连接。将共封装结构件应用于交换机等设备上时，封装电路板可以设置在交换机内的控制电路板上，并与控制电路板电连接，在交换机的面板上开设有光接口，光接口与光电转换模块电连接，外接的光纤可以与光接口连接，从而将外接的光纤与光电转换模块连接，进而使外接的光纤通过光电转换模块实现与电芯片的连接，这样就能够实现光缆与交换机等设备之间的连接。
然而，电芯片和光电转换模块位于封装电路板的同一面上，导致封装电路板尺寸增大，使封装成本较高，且具有较高的链路损耗。
发明内容
本申请提供一种光电共封装结构及通信设备，解决了现有的光电共封装结构使电芯片和光电转换模块位于封装电路板同一面上导致封装电路板尺寸增大，增加封装成本且增大链路损耗的问题。
本申请的第一方面提供一种光电共封装结构，包括：承载电路板、光电转换模块、封装电路板和电芯片；
所述承载电路板包括第一侧面和与所述第一侧面相对的第二侧面，所述封装电路板位于所述第一侧面上，所述电芯片设置在所述封装电路板上，且所述电芯片与所述封装电路板电连接，所述光电转换模块设置在所述第二侧面上，也即光电转换模块与封装电路板分离解耦，且光电转换模块与封装电路板分别设置在承载电路板相对的两侧面上，这样就能够保证光电转换模块的设置不会影响封装电路板的尺寸，从而显著减小封装电路板的尺寸，降低封装电路板的加工难度和成本，便于封装电路板的加工实现。封装电路板尺寸的减小 也能够减小信号传输链路的损耗，提升传输效果，同时也能够减小对封装电路板上连接引脚尺寸等的限制，进一步减小封装电路板的加工难度，且有助于提升整个传输链路的连接可靠性。
所述承载电路板上开设有第一导电过孔，所述光电转换模块通过所述第一导电过孔与所述封装电路板电连接。通过第一导电过孔实现了光电转换模块和封装电路板间的直接电连接，减少了光电转换模块和封装电路板高速连接链路上的板间走线，缩短了信号传输的路径，显著的降低了高速链路损耗，提升信号传输质量，也即在减小封装电路板尺寸的同时，有效的降低了传输链路损耗，提升信号传输质量。而且免去板间的高速走线，避免使用昂贵的高速板材，有助于降低承载电路板的加工成本和加工难度。
在一种可能的实现方式中，所述光电转换模块在所述承载电路板上的垂直投影为第一投影，所述封装电路板在所述承载电路板上的垂直投影为第二投影，至少部分所述第一投影与所述第二投影重叠。也即光电转换模块与封装电路板在承载电路板上占用的空间至少部分重合，这样可以减小光电转换模块和封装电路板在承载电路板上的占用空间，有助于减小承载电路板的尺寸，便于降低承载电路板的加工难度和加工成本。而且还有助于拉近光电转换模块与封装电路板之间的距离，有利于减小两者之间的连接链路的路径，便于两者能够通过第一导电过孔实现电连接。
在一种可能的实现方式中，所述封装电路板面向所述承载电路板的一面上具有第一引脚，所述光电转换模块面向所述承载电路板的一面上具有第二引脚，所述第一导电过孔的两端分别与所述第一引脚和所述第二引脚电连接。从而使光电转换模块与封装电路板能够通过第一导电过孔实现电连接。
在一种可能的实现方式中，所述第一引脚在所述承载电路板上的垂直投影与所述第二引脚在所述承载电路板上的垂直投影相重合，所述第一导电过孔的延伸方向与所述承载电路板垂直。也就是说，第一导电过孔的延伸方向为过第一引脚和第二引脚且垂直承载电路板的方向，这样在保证光电转换模块和封装电路板通过第一导电过孔直接连接的同时，还能够减小第一导电过孔的延伸长度，有助于进一步减小光电转换模块和电芯片的连接链路的路径，降低高速链路损耗。
在一种可能的实现方式中，所述第一引脚在所述承载电路板上的垂直投影与所述第二引脚在所述承载电路板上的垂直投影相错位。这样就减小了对第一引脚和第二引脚的排布设置约束，增加了第一引脚和第二引脚设置的灵活性，丰富了光电共封装结构的应用场景。
在一种可能的实现方式中，所述承载电路板包括层叠设置的至少两层基板；
每层所述基板上开设有连接过孔，且至少其中两层所述基板上的所述连接过孔错位设置，相邻两层基板上的所述连接过孔电连接以形成所述第一导电过孔。通过使至少两层的连接过孔错位设置，相邻的连接过孔连接形成第一导电过孔，从而通过第一导电过孔实现在承载电路板上投影错位的第一引脚和第二引脚之间的电连接。
在一种可能的实现方式中，所述承载电路板还包括金属层，相邻两层基板上的所述连接过孔之间设置有所述金属层，所述连接过孔通过所述金属层连接。能够有效的增大两个连接过孔之间的电接触面积，减小或避免由于相邻两层基板的连接过孔错位设置而导致电连接的不稳定性，提升连接过孔间的电连接稳定性。
在一种可能的实现方式中，第一导电过孔包括通孔、盲孔或埋孔。
在一种可能的实现方式中，还包括供电模块，所述供电模块与所述光电转换模块电连接，所述供电模块设置在所述承载电路板上。供电模块用于给光电转换模块供电，有助于保证对光电模块的供电稳定性和灵活性。
在一种可能的实现方式中，所述承载电路板上还开设有第二导电过孔，所述供电模块设置在所述第一侧面上，所述供电模块通过所述第二导电过孔与所述光电转换模块电连接。也即供电模块与光电转换模块位于承载电路板相对的两侧面上，并且供电模块与光电转换模块能够通过第二导电过孔直接实现电连接，避免了通过板间走线(例如承载电路板走线)实现供电模块与光电转换模块的连接，有助于缩短连接链路的路径，进一步降低链路损耗。
在一种可能的实现方式中，所述光电转换模块面向所述承载电路板的一面上具有第三引脚，所述供电模块上具有第四引脚，所述第二导电过孔的两端分别与所述第三引脚和所述第四引脚连接。从而通过第二导电过孔实现供电模块与光电转换模块之间的电连接。
在一种可能的实现方式中，所述光电转换模块包括第一部分和第二部分，所述第一部分在所述承载电路板上的垂直投影与所述第二投影重叠，所述第二部分在所述承载电路板上的垂直投影位于所述第二投影外，所述第一引脚位于所述第一部分上，所述第三引脚位于所述第二部分上；
所述第三引脚在所述承载电路板上的垂直投影与所述第四引脚在所述承载电路板上的垂直投影相重合，所述第二导电过孔的延伸方向与所述承载电路板垂直。也即第二导电过孔的延伸方向为过第三引脚和第四引脚且垂直于承载电路板的方向，在保证光电转换模块和供电模块通过第二导电过孔直接连接的同时，还能够减小第二导电过孔的延伸长度，有助于进一步减小供电模块与光电转换模块间连接链路的路径，降低链路损耗，提升电源模块的供电效率。
本申请的第二方面提供一种通信设备，至少包括壳体和上述任一所述的光电共封装结构，所述光电共封装结构设置在所述壳体内。
所述壳体上开设有用于连接外接光纤的光接口，所述光接口与所述光电转换模块连接。该光电共封装结构中封装电芯片的封装电路板具有较小的尺寸，便于加工实现，有助于降低整个通信设备的加工难度和加工成本，且具有更高的连接稳定性。而且该光电共封装结构具有较低的高速传输链路损耗，能够有效的提升通信设备的传输性能。
在一种可能的实现方式中，还包括控制电路板，所述承载电路板设置在所述控制电路板上，且所述承载电路板和所述控制电路板电连接。也即在通信设备中另设控制板，与使用光电共封装结构中的承载电路板做控制板相比，有助于降低控制电路板的设计难度，便于控制电路板以及光电共封装结构的加工实现。
在一种可能的实现方式中，还包括位于所述壳体内的内接光纤，所述光接口通过所述内接光纤与所述光电转换模块连接。从而实现了外接光纤与光电转换模块的电连接，进而实现外接光纤与电芯片的电连接，实现通信设备与外接光纤的信号传输。
附图说明
图1为本申请实施例提供的一种通信设备的结构示意图；
图2为本申请实施例提供的一种通信设备中的信号传输示意图；
图3为相关技术中一种光电共封装结构的正视示意图；
图4为相关技术中一种光电共封装结构与控制电路板的装配示意图；
图5为相关技术中一种光电共封装结构在通信设备中的连接场景示意图；
图6为相关技术中另一种光电共封装结构示意图；
图7为本申请实施例提供的一种光电共封装结构的正视示意图；
图8为本申请实施例提供的一种光电共封装结构的剖面示意图；
图9为本申请实施例提供的一种光电共封装结构中封装电路板的尺寸示意图；
图10为本申请实施例提供的一种通信设备的剖面结构示意图；
图11为本申请实施例提供的一种共封装结构与控制电路板的装配示意图；
图12为本申请实施例提供的另一种光电共封装结构的示意图；
图13为本申请实施例提供的又一种光电共封装结构与控制电路板的装配示意图；
图14为本申请实施例提供的又一种光电共封装结构的示意图。
附图标记说明：
100-通信设备；           10-光电共封装结构；        11-承载电路板；
111-第一侧面；           112-第二侧面；             113-第一导电过孔；
114-基板；               115-连接过孔；             116-金属层；
117-第二导电过孔；       12-光电转换模块；          12a-第一部分；
12b-第二部分；           121-第二引脚；             122-第三引脚；
13-封装电路板；          131-第一引脚；             14-电芯片；
15-供电模块；            16-保护件；                20-壳体；
21-面板；                211-光接口；               30-控制电路板；
40-内接光纤。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请。
本申请实施例提供的一种通信设备，可以是交换机、路由器、网络传送设备、宽带接入设备等用于信号交互的通信设备。以下以该通信设备为交换机为例进行说明。
交换机与外接光纤之间的信号传输多借助光电转换模块来实现，具体的，外接光纤与光电转换模块连接，光电转换模块与通信设备的电芯片电连接，光电转换模块用于实现光信号至电信号以及电信号至光信号的转换，从而实现通信设备的电芯片与外接光纤之间的信号传输。
具体的，外接光纤上的光信号经过光电转换模块后转换成电信号并传输至电芯片，实现信号从外接光纤至通信设备的传输。电芯片的电信号经过光电转换模块后转换成光信号并传输至外接光纤，实现信号从通信设备至外接光纤的传输。
随着光通信技术朝向高速大容量的方向演进，光电合封(Co-packaged Optics，简称CPO)技术受到了广泛的关注，光电合封技术就是将光引擎(Optical engine，简称OE，又称为光电转换模块)和电芯片进行共封装，并将封装结构应用于交换机等通信设备中，以实现通信设备与外接光纤的信号传输。
图1为本申请实施例提供的一种通信设备的结构示意图，图2为本申请实施例提供的一种通信设备中的信号传输示意图。
参见图1所示，通信设备100包括有壳体20，壳体20可以包括有面板21，面板21可以位于整个通信设备100的正面，也即位于整个通信设备100的外观正面上。在面板21上可以开设有光接口211，光接口211用于与外接光纤连接。
其中，光接口211的数量可以为一个，或者，光接口211的数量也可以为多个。当光接口211的数量为多个时，多个光接口211可以采用多行并列排布的方式设置在面板21上。
结合图2所示，光电共封装结构10设置在壳体20内，光电共封装结构10可以包括有光电转换模块12和电芯片14，电芯片14与光电转换模块12电连接。
在壳体20内还设置有内接光纤40，光电转换模块12可以通过内接光纤40与光接口211连接，光接口211与外接光纤连接，这样就使外接光纤与光电转换模块12连接，从而实现外接光纤与电芯片14的连接，也就实现了外接光纤与通信设备100之间的信号传输。
图3为相关技术中一种光电共封装结构的正视示意图，图4为相关技术中一种光电共封装结构与控制电路板的装配示意图。
常见的光电共封装结构多采用光电转换模块与电芯片封装于同一基板上，例如，参见图3所示，光电共封装结构1可以包括有封装电路板1a、电芯片1b和光电转换模块1c，其中，电芯片1b和光电转换模块1c设置在封装电路板1a的同一面上，光电转换模块1c为多个，多个光电转换模块1c围绕着电芯片1b的周向设置。
结合图4所示，光电转换模块1c通过封装电路板1a上的走线1e与电芯片1b电连接，从而实现电芯片1b与外接光纤之间的信号传输。
图5为相关技术中一种光电共封装结构在通信设备中的连接场景示意图。
参见图5所示，以将该光电共封装结构1应用于交换机中为例，封装电路板1a可以设置在交换机的控制电路板2a上，光电转换模块1c与控制电路板2a之间也可以电连接，以实现控制信号或电源信号等的传输。交换机壳体的面板2b上具有光接口2c，光接口2c通过内接光纤2d与光电转换模块1c电连接，交换机与外接光纤之间的传输链路为电芯片1b、封装电路板1a、光电转换模块1c、外接光纤。
但是由于光电转换模块1c与电芯片1b位于封装电路板1a的同一面上，光电转换模块1c占用较大的封装电路板1a空间，导致封装电路板1a的尺寸变大，增大了封装电路板1a的加工难度和加工成本。例如图3中为一个常用的51.2T容量的光电混合封装结构，在封装电路板上设置有16个3.2T的光电转换模块，封装电路板的长L11和宽L12的尺寸约为126mm*126mm，而当前电芯片1b的封装电路板1a的尺寸加工极限为110mm*100mm，超出当前的加工能力而无法实现加工。
同时随着封装电路板1a尺寸的增大，高速链路损耗也会有所增加，通常由于封装电路板1a尺寸增大而增加的链路损耗为0.14db/mm～0.18db/mm，链路损耗有待进一步降低。
而且，光电转换模块1c与控制电路板2a之间电源信号等的传输均需要经过封装电路板1a，封装电路板1a上连接引脚等的增加，也会导致封装电路板1a尺寸以及加工难度的增加。而为控制封装电路板1a的尺寸，通常通过压缩光电转换模块1c和连接引脚(如光电转换模块、电芯片与封装电路板之间实现连接的引脚)的尺寸，例如要求引脚小于0.5mm， 小的引脚以及光电转换模块1c的加工难度也较高，接触可靠性风险也高，会降低整个链路的连接可靠性。
图6为相关技术中另一种光电共封装结构示意图。
为减小封装电路板的尺寸以便于实现封装电路板的加工，相关技术中采用了近光电封装技术(Near-packaged Optics，简称NPO)，将光电转换模块与电芯片设置于不同的基板上。具体的，参见图6所示，光电共封装结构3包括转接电路板3a、封装电路板3c、电芯片3b和光电转换模块3d，封装电路板3c和光电转换模块3d设置在转接电路板3a的同一面上，多个光电转换模块3d围绕封装电路板3c的周向设置，电芯片3b设置在封装电路板3c背向转接电路板3a的一面上，光电转换模块3d通过转接电路板3a上的走线3e与封装电路板3c电连接，进而实现与电芯片3b的电连接。这样就将光电转换模块3d从封装电路板3c上分离，光电转换模块3d的设置不占用封装电路板3c的空间，从而减小封装电路板3c的尺寸，便于封装电路板3c的加工实现。
将该光电共封装结构3应用于交换机中(参照图5)，转接电路板3a设置在交换机的控制电路板上，光接口通过内接光纤与光电转换模块3d电连接。交换机与外接光纤之间的传输链路为电芯片3b、封装电路板3c、转接电路板的走线3e、光电转换模块3d、外接光纤。
然而，光电转换模块3d与封装电路板3c之间通过转接电路板3a上的走线3e实现电连接，转接电路板的走线3e会增加高速连接链路的损耗，走线的链路损耗通常为0.05db/mm～0.08db/mm。而且转接电路板的走线3e为实现高速信号传输走线，使转接电路板3a需要使用高速板材，增加转接电路板3a的成本，而且走线的存在也会增加转接电路板3a的层数，增加转接电路板3a的加工难度。
基于此，本申请实施例提供一种光电共封装结构，有效的降低了封装电路板的尺寸，降低封装难度和成本，同时还有效的降低了高速信号传输链路的损耗，有助于信号传输向高速大容量的方向发展。
以下结合附图，对本申请实施例提供的一种光电共封装结构及其在通信设备中的设置进行详细的说明。
图7为本申请实施例提供的一种光电共封装结构的正视示意图。
参见图7所示，光电共封装结构10包括封装电路板13和电芯片14，其中，封装电路板13用于实现对电芯片14的封装，电芯片14设置在封装电路板13上，电芯片14为集成电路的载体，例如，电芯片14可以是硅芯片。
其中，电芯片14可以是裸芯片(Die)，或者，电芯片14也可以是集成有电子器件的芯片，例如电芯片14可以是集成了处理器、存储器等电子器件的硅芯片。电芯片14可以通过焊接等方式固定设置在封装电路板13上。
在封装电路板13上还设置有保护件16，保护件16围设在电芯片14的外周上，以对电芯片14起到封装以及保护作用。其中，保护件16可以是树脂或硅胶等绝缘的结构件，保护件16可以通过粘接等方式设置在封装电路板13上。
封装电路板13可以是印制电路板(Printed Circuit Board，简称PCB)或载板(Substrate)，例如，封装电路板13可以是具有刚性的印制电路板，能够起到一定的刚性支撑作用，以保证电芯片14的设置稳定性。
图8为本申请实施例提供的一种光电共封装结构的剖面示意图。
参见图8所示，该光电共封装结构10还包括有承载电路板11和光电转换模块12，其中，承载电路板11至少包括有第一侧面111和第二侧面112，第一侧面111和第二侧面112为承载电路板11上相对的两个侧面，封装电路板13设置在承载电路板11的第一侧面111上，电芯片14设置在封装电路板13上，具体的，电芯片14可以位于封装电路板13上背向承载电路板11的一面。
光电转换模块12设置在承载电路板11的第二侧面112上，也即光电转换模块12与封装电路板13分离解耦，且光电转换模块12与封装电路板13分别设置在承载电路板11相对的两侧面上，这样就能够保证光电转换模块12的设置不会影响封装电路板13的尺寸，从而显著减小封装电路板13的尺寸，降低封装电路板13的加工难度和加工成本，便于封装电路板13的加工实现。
封装电路板13尺寸的减小也能够减小电芯片与光电转换模块间高速信号传输链路的损耗，提升传输效果。同时也能够减小对封装电路板13上连接引脚尺寸等的限制，进一步减小封装电路板13的加工难度，且有助于提升整个传输链路的连接可靠性。而且尺寸的缩小还能够提升封装电路板13的平整度，改善封装电路板13与承载电路板11、电芯片14等的连接质量，提升封装的可靠性。
另外，电芯片14的周围通常还会设置散热模块等(图中未示出)，将封装电路板13及电芯片14与光电转换模块12设置在承载电路板11相对的两侧上，可以避免散热模块与光电转换模块12之间的干涉，提升光电共封装结构10布局的合理性。
继续参见图8所示，在承载电路板11上开设有第一导电过孔113，光电转换模块12和封装电路板13分别位于承载电路板11相对的两侧面上，光电转换模块12和封装电路板13可以通过第一导电过孔113实现电连接，从而实现光电转换模块12与电芯片14之间的电连接。
也即通过第一导电过孔113实现了光电转换模块12和封装电路板13间的直接电连接，与相关技术中采用转接电路板上走线实现两者之间的连接相比，减少光电转换模块12和封装电路板13高速连接链路上的板间走线，缩短了信号传输的路径，显著的降低了高速链路损耗，其链路损耗可以减少约2dB～3dB，有效的提升信号传输质量。也即本申请实施例提供的光电共封装结构10，在减小封装电路板13尺寸的同时，还能够有效的降低传输链路损耗，提升信号传输质量。
而且采用第一导电过孔113连接光电转换模块12和封装电路板13，能够免去板间的高速走线，避免使用昂贵的高速板材，降低承载电路板11的加工成本，同时还有助于简化承载电路板11的层数以及结构设计，降低承载电路板11的加工难度。
其中，封装电路板13可以通过焊接等方式固定设置在承载电路板11上，或者，光电共封装结构10还可以包括有插接连接器(Socket连接器)，封装电路板13可以通过插接连接器垂直插接在承载电路板11上，且封装电路板13通过插接连接器实现与承载电路板的电连接。
需要说明的是，本申请实施例中，光电共封装结构10包括的光电转换模块12的数量可以是一个，或者，光电转换模块12的数量也可以是多个，以满足通信设备的高密连接需求。具体的，当光电转换模块12的数量为多个时，多个光电转换模块12可以沿着封装 电路板13的周向方向分布在承载电路板11上。
其中，光电转换模块12也可以通过焊接等方式固定设置在承载电路板11上，或者，光电转换模块12也可以通过插接连接器垂直插接在承载电路板11上，且光电转换模块12通过插接连接器实现与承载电路板11的电连接。
光电转换模块12可以是任何能够实现光信号与电信号间转换的结构件。例如，光电转换模块12可以是有源器件和无源器件的集成结构，具体的，有源器件可以包括驱动器、调制器、光探测器、跨阻放大器等。
其中，驱动器与调制器连接，驱动器用于放大电信号，使电信号摆幅满足驱动调制器的要求。调制器用于将电信号转换为光信号，光探测器用于将光信号转换为电信号。跨阻放大器用于将微弱的电信号转换为放大的电信号，满足后级信号处理电路(如电芯片14)的输入摆幅要求。
光电转换模块12的无源器件可以包括有光波导、光栅和光纤等，能够起到传输或增强光信号等功能。
参见图8所示，承载电路板11上的第一导电过孔113可以为多个，多个第一导电过孔113间隔设置，一个光电转换模块12可以通过多个第一导电过孔113与封装电路板13电连接。第一导电过孔113的数量可以根据实际连接需求选择设定。
承载电路板11上的第一导电过孔113可以为金属化过孔，第一导电过孔113可以是开设在承载电路板11上的通孔、盲孔或者埋孔等，能够实现电性导通功能即可。其金属化的方式可以是电镀填平、塞孔等，在本申请实施例中不作限制。
承载电路板11可以是PCB电路板，或者，承载电路板11也可以是仅起到承载支撑作用的承载板、有机基板、陶瓷板等，能够起到支撑作用并能在其上形成第一导电过孔113(以及第二导电过孔)以实现电性连接即可。
图9为本申请实施例提供的一种光电共封装结构中封装电路板的尺寸示意图。
对比于图3中封装电路板13的长L11与封装电路板13的宽L12的尺寸为126*126mm。本申请实施例中，同样为一个51.2T容量的光电共封装结构10，在承载电路板11上设置16个3.2T的光电转换模块12。参见图9所示，封装电路板13的长L1与封装电路板13的宽L2的尺寸只需要约为90mm*90mm即可实现，显著的减小了封装电路板13的长宽尺寸，使封装电路板13能够满足当前封装电路板的加工极限要求，降低了封装电路板13的加工难度和加工成本。
图10为本申请实施例提供的一种通信设备的剖面结构示意图。
将该光电共封装结构10应用于交换机等通信设备100中时，承载电路板11可以作为通信设备100的控制电路板使用，控制电路板用于对通信设备的整体运行实现控制。
或者，参见图10所示，也可以在通信设备100中另设置有控制电路板30，也即承载电路板11作为一个起到承载与转接作用的转接板使用，这样有助于降低控制电路板30的设计难度，便于控制电路板30以及光电共封装结构10的加工实现。
以下以承载电路板11应用于交换机中，在交换机内设置有控制电路板30，也即承载电路板11作为转接板为例进行说明。
承载电路板11设置在控制电路板30上，且承载电路板11与控制电路板30电连接，从而实现控制电路板30与电芯片14的电连接。光电转换模块12通过内接光纤40与面板 21上的光接口211实现连接，每个光接口211对应连接有一个光电转换模块12，光接口211与外接光纤连接，从而实现外接光纤与光电转换模块12的连接，也就实现了外接光纤与电芯片14之间的连接，实现外接光纤与通信设备100的信号传输。
具体的，外接光纤上的光信号经过光接口211、内接光纤40传输至光电转换模块12，经过光电转换模块12实现光信号至电信号的转换，输出的电信号通过第一导电过孔113、封装电路板13传输至电芯片14，实现了信号从外接光纤至通信设备100的传输。相反的，电芯片14的电信号可以依次经过封装电路板13、第一导电过孔113传输至光电转换模块12，经过光电转换模块12转换为光信号输出，光信号经过内接光纤40、光接口211传输至外接光纤，实现了信号从通信设备100至外接光纤的传输。
其中，通信设备100还可以包括有支撑件50，支撑件50可以位于控制电路板30与承载电路板11之间，支撑件50可以是导电结构件，控制电路板30可以通过支撑件50实现与承载电路板11的电连接。
例如，支撑件50可以是金属的支撑结构件，或者，支撑件50也可以是板到板连接器(Board to Board，简称B2B连接器)。或者，支撑件50也可以是其他能够实现承载电路板11和控制电路板30间电连接的结构件。
或者，支撑件50也可以为绝缘件，设置在控制电路板30与承载电路板11之间，仅起到刚性支撑的作用。通信设备100还可以包括有线缆，承载电路板11可以通过线缆与控制电路板30电连接。
其中，需要说明的是，承载电路板11与控制电路板30电连接，以使控制电路板30与电芯片14连接，该连接链路用于传输低速信号，例如控制信号、电源信号等，连接方式较为简单。
图11为本申请实施例提供的一种共封装结构与控制电路板的装配示意图。
参见图11所示，以光电转换模块12在承载电路板11上的垂直投影(也即将光电转换模块12沿垂直承载电路板11的方向投到承载电路板11上)为第一投影，封装电路板13在承载电路板11上的垂直投影(也即将封装电路板13沿垂直承载电路板11的方向投到承载电路板11上)为第二投影，第一投影可以与第二投影至少部分重叠，也即光电转换模块12与封装电路板13在承载电路板11上占用的空间至少部分重合。这样可以减小光电转换模块12和封装电路板13在承载电路板11上的占用空间，有助于减小承载电路板11的尺寸，便于降低承载电路板11的加工难度和加工成本。
而且，使至少部分的第一投影与第二投影重叠，还有助于拉近光电转换模块12与封装电路板13之间的距离，有利于减小两者之间的高速连接链路的路径，便于两者能够通过第一导电过孔113实现电连接。
其中，为实现封装电路板13与光电转换模块12的电连接，继续参见图11所示，封装电路板13面向承载电路板11的一面上可以设置有第一引脚131，光电转换模块12面向承载电路板11的一面上可以设置有第二引脚121，第一引脚131和第二引脚121可以分别位于第一导电过孔113的两端，且第一引脚131和第二引脚121可以分别与第一导电过孔113的两端电接触连接，从而使光电转换模块12与封装电路板13能够通过第一导电过孔113实现电连接。
具体的，第一引脚131的数量可以为多个，第二引脚121的数量也可以为多个，第二 引脚121的数量可以与第一引脚131的数量相对应，承载电路板11上的第一导电过孔113的数量也为多个。
需要说明的是，在电芯片14面向封装电路板13的一面上可以设置有第五引脚141，在封装电路板13上设置有板间走线132，第五引脚141可以通过板间走线132与第一引脚131电连接，从而实现电芯片14与封装电路板13的电连接，进而实现电芯片14与光电转换模块12的电连接。
其中，在一种可能的实施方式中，参见图11所示，第一引脚131和第二引脚121的设置位置可以相对应，换言之，第一引脚131在承载电路板11上的垂直投影可以与第二引脚121在承载电路板11上的垂直投影完全重合，也即第一引脚131和第二引脚121以承载电路板11为对称线呈镜像对称设置。
第一导电过孔113的两端分别与第一引脚131和第二引脚121电连接，这样第一导电过孔113的延伸方向就可以与承载电路板11保持垂直，也即第一导电过孔113的延伸方向为过第一引脚131和第二引脚121且垂直承载电路板11的方向，第一导电过孔113为连接第一引脚131和第二引脚121的竖直过孔。这样在保证光电转换模块12和封装电路板13通过第一导电过孔113实现直接连接的同时，还能够减小第一导电过孔113的延伸长度，有助于进一步减小光电转换模块12和电芯片14间连接链路的路径，降低高速链路损耗。
图12为本申请实施例提供的另一种光电共封装结构的示意图。
或者，在另一种可能的实施方式中，第一引脚131和第二引脚121可以错位设置，具体的，参见图12所示，第一引脚131在承载电路板11上的垂直投影可以与第二引脚121在承载电路板11上的垂直投影相错位，也即第一引脚131在承载电路板11上的垂直投影与第二引脚121在承载电路板11上的垂直投影不完全重合，第一引脚131可以和第二引脚121在承载电路板11上的垂直投影在位置上错开。这样就减小了对第一引脚131和第二引脚121的排布设置约束，增加了第一引脚131和第二引脚121设置的灵活性，丰富了光电共封装结构10的应用场景。
其中，为实现第一引脚131和第二引脚121的电连接，第一导电过孔113的延伸方向可以倾斜于承载电路板11设置，也即第一导电过孔113的延伸方向为过第一引脚131和第二引脚121并倾斜于承载电路板11的方向。或者，部分第一导电过孔113的延伸方向可以与承载电路板11垂直，部分第一导电过孔113的延伸方向可以与承载电路板11倾斜，第一导电过孔113具体的形状和延伸方向可以根据需求选择设定，能够通过第一导电过孔113将第一引脚131和第二引脚121导通即可。
例如，继续参见图12所示，承载电路板11可以包括有叠加设置的至少两层基板114，以承载电路板11上包括有多层基板114为例，其中一层基板面向封装电路板13，其中另一层基板面向光电转换模块12。可以在每层基板114上开设有连接过孔115，连接过孔115可以为金属化过孔，能够实现电性导通。
多层基板114中至少两层基板上的连接过孔115是错位设置的。其中，两个连接过孔115错位设置是指两个连接过孔115的中心线不重合，相互错开。相邻两层基板上的连接过孔115电连接，这样将多层基板114上的连接过孔115依次连接起来就形成了第一导电过孔113。而位于面向封装电路板13的基板114上的连接过孔115可以与第一引脚131电接触连接，位于面向光电转换模块12的基板114上的连接过孔115可以与第二引脚121 电接触连接，从而通过第一导电过孔113可以实现在承载电路板11上投影错位的第一引脚131和第二引脚121的导通。
例如，参见图12所示，承载电路板11可以包括有五层层叠设置的基板114，每层基板114上均设置有连接过孔115，连接过孔115的延伸方向可以垂直于基板114，相邻两层基板114上的两个连接过孔115相互错位，且相邻两层基板114上的连接过孔115电连接以形成第一导电过孔113.邻近封装电路板13的基板上的连接过孔与第一引脚131电接触连接，邻近光电转换模块12的基板上的连接过孔与第二引脚121电接触连接，从而通过第一导电过孔113实现封装电路板13和光电转换模块12的电连接。
其中，连接过孔115的截面形状可以是梯形、四边形或三角形等规则或不规则图形，具体的形状可以根据实际需求选择设定。
其中，继续参见图12所示，在相邻两层基板114上的两个连接过孔115之间可以设置有金属层116，相邻两层基板114上的连接过孔115可以通过金属层116实现电连接，从而形成第一导电过孔113。由于相邻两层基板上的连接过孔错位设置，容易发生两连接过孔由于错位而导致的电连接的不稳定性，而使相邻两层基板上的连接过孔通过金属层116实现电连接，金属层能够有效的增大两个连接过孔之间的电接触面积，从而提升连接过孔115间的连接稳定性。
图13为本申请实施例提供的又一种光电共封装结构与控制电路板的装配示意图。
参见图13所示，光电共封装结构10还可以包括有供电模块15，供电模块15与光电转换模块12电连接，供电模块15用于给光电转换模块12供电，有助于保证对光电转换模块12的供电稳定性和灵活性。
其中，供电模块15可以设置在承载电路板11上，以提升整个光电共封装结构10的集成度。或者，供电模块15也可以设置在通信设备100的控制电路板30上。
当供电模块15设置在承载电路板11上时，具体的，供电模块15可以设置在承载电路板11的第一侧面111上，也即供电模块15与封装电路板13位于承载电路板11的同一面上。或者，供电模块15也可以设置在承载电路板11的第二侧面112上，也即供电模块15与光电转换模块12位于承载电路板11的同一面上。
参见图13所示，当供电模块15设置在承载电路板11的第一侧面111上，而光电转换模块12设置在承载电路板11的第二侧面112上，也即供电模块15与光电转换模块12位于承载电路板11相对的两侧面上。
承载电路板11上还可以开设有第二导电过孔117，这样供电模块15与光电转换模块12就能够通过第二导电过孔117直接实现电连接，避免了通过板间走线(例如承载电路板11的走线)实现供电模块15与光电转换模块12的连接，有助于缩短连接链路的路径，进一步降低链路损耗。
而且还有助于减少承载电路板11上有源层的设置，能够降低承载电路板11的层数，有利于降低承载电路板11的加工成本和加工难度。
第二导电过孔117也为金属化过孔，可以是开设在承载电路板11上的通孔、盲孔或者埋孔等，其金属化的方式也可以是电镀填平、塞孔等。
其中，在光电转换模块12面向承载电路板11的一面上还可以设置有第三引脚122，在供电模块15上可以设置有第四引脚(图中未示出)，第二导电过孔117的两端可以分别 与第三引脚122和第四引脚电接触连接，从而使供电模块15和光电转换模块12通过第二导电过孔117电连接。
也就是说，光电转换模块12的第二引脚121用于传输高速信号，以实现光电转换模块12与电芯片14之间的高速连接。而光电转换模块12的第三引脚122可以用于传输低速信号，例如控制信号、电源信号等，其连接较为简单。
图14为本申请实施例提供的又一种光电共封装结构的示意图。
参见图14所示，其中，光电转换模块12可以分为第一部分12a和第二部分12b，其中，第一部分12a在承载电路板11上的垂直投影位于第二投影(也即封装电路板13在承载电路板11上的投影)内，也即第一部分12a在承载电路板11上的垂直投影与第二投影重叠。第二部分12b在承载电路板11上的垂直投影位于第二投影外，即第二部分12b在承载电路板11上的垂直投影与第二投影不重叠。
第一引脚131位于第一部分12a上，也就是说，第一引脚131在承载电路板11上的投影位于第二投影内，便于实现第一引脚131和第二引脚121在承载电路板11上的投影相重合，从而实现第一引脚131通过竖直的第一导电过孔113与第二引脚121的电连接。
第三引脚122位于第二部分12b上，也就是说，第三引脚122在承载电路板11上的投影位于第二投影外。第三引脚122的位置可以与第四引脚的位置相对应，也即第三引脚122在承载电路板11上的投影可以与第四引脚在承载电路板11上的投影相重合，第三引脚122和第四引脚以承载电路板11为对称线呈镜像对称设置。
这样第二导电过孔117的延伸方向就可以与承载电路板11保持垂直，也即第二导电过孔117的延伸方向为过第三引脚122和第四引脚且垂直于承载电路板11的方向。这样在保证光电转换模块12和供电模块15通过第二导电过孔117直接连接的同时，还能够减小第二导电过孔117的延伸长度，有助于进一步减小供电模块15与光电转换模块12间连接链路的路径，降低链路损耗，提升电源模块的供电效率。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (15)

  1. 一种光电共封装结构，其特征在于，包括：承载电路板、光电转换模块、封装电路板和电芯片；
    所述承载电路板包括第一侧面和与所述第一侧面相对的第二侧面，所述封装电路板位于所述第一侧面上，所述电芯片设置在所述封装电路板上，且所述电芯片与所述封装电路板电连接，所述光电转换模块设置在所述第二侧面上；
    且所述承载电路板上开设有第一导电过孔，所述光电转换模块通过所述第一导电过孔与所述封装电路板电连接。
  2. 根据权利要求1所述的光电共封装结构，其特征在于，所述光电转换模块在所述承载电路板上的垂直投影为第一投影，所述封装电路板在所述承载电路板上的垂直投影为第二投影，至少部分所述第一投影与所述第二投影重叠。
  3. 根据权利要求1或2所述的光电共封装结构，其特征在于，所述封装电路板面向所述承载电路板的一面上具有第一引脚，所述光电转换模块面向所述承载电路板的一面上具有第二引脚，所述第一导电过孔的两端分别与所述第一引脚和所述第二引脚电连接。
  4. 根据权利要求3所述的光电共封装结构，其特征在于，所述第一引脚在所述承载电路板上的垂直投影与所述第二引脚在所述承载电路板上的垂直投影相重合，所述第一导电过孔的延伸方向与所述承载电路板垂直。
  5. 根据权利要求3所述的光电共封装结构，其特征在于，所述第一引脚在所述承载电路板上的垂直投影与所述第二引脚在所述承载电路板上的垂直投影相错位。
  6. 根据权利要求5所述的光电共封装结构，其特征在于，所述承载电路板包括层叠设置的至少两层基板；
    每层所述基板上开设有连接过孔，且至少其中两层所述基板上的所述连接过孔错位设置，相邻两层基板上的所述连接过孔电连接以形成所述第一导电过孔。
  7. 根据权利要求6所述的光电共封装结构，其特征在于，所述承载电路板还包括金属层，相邻两层基板上的所述连接过孔之间设置有所述金属层，所述连接过孔通过所述金属层连接。
  8. 根据权利要求1-7任一所述的光电共封装结构，其特征在于，所述第一导电过孔包括通孔、盲孔或埋孔。
  9. 根据权利要求2-8任一所述的光电共封装结构，其特征在于，还包括供电模块，所述供电模块与所述光电转换模块电连接，所述供电模块设置在所述承载电路板上。
  10. 根据权利要求9所述的光电共封装结构，其特征在于，所述承载电路板上还开设有第二导电过孔，所述供电模块设置在所述第一侧面上，所述供电模块通过所述第二导电过孔与所述光电转换模块电连接。
  11. 根据权利要求10所述的光电共封装结构，其特征在于，所述光电转换模块面向所述承载电路板的一面上具有第三引脚，所述供电模块上具有第四引脚，所述第二导电过孔的两端分别与所述第三引脚和所述第四引脚连接。
  12. 根据权利要求11所述的光电共封装结构，其特征在于，所述光电转换模块包括第一部分和第二部分，所述第一部分在所述承载电路板上的垂直投影与所述第二投影重叠， 所述第二部分在所述承载电路板上的垂直投影位于所述第二投影外，所述第一引脚位于所述第一部分上，所述第三引脚位于所述第二部分上；
    所述第三引脚在所述承载电路板上的垂直投影与所述第四引脚在所述承载电路板上的垂直投影相重合，所述第二导电过孔的延伸方向与所述承载电路板垂直。
  13. 一种通信设备，其特征在于，至少包括壳体和上述权利要求1-12任一所述的光电共封装结构，所述光电共封装结构设置在所述壳体内；
    所述壳体上开设有用于连接外接光纤的光接口，所述光接口与所述光电转换模块连接。
  14. 根据权利要求13所述的通信设备，其特征在于，还包括控制电路板，所述承载电路板设置在所述控制电路板上，且所述承载电路板和所述控制电路板电连接。
  15. 根据权利要求14所述的通信设备，其特征在于，还包括位于所述壳体内的内接光纤，所述光接口通过所述内接光纤与所述光电转换模块连接。
PCT/CN2023/070781 2022-03-31 2023-01-05 一种光电共封装结构及通信设备 WO2023185194A1 (zh)

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