WO2022127073A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2022127073A1
WO2022127073A1 PCT/CN2021/103117 CN2021103117W WO2022127073A1 WO 2022127073 A1 WO2022127073 A1 WO 2022127073A1 CN 2021103117 W CN2021103117 W CN 2021103117W WO 2022127073 A1 WO2022127073 A1 WO 2022127073A1
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WO
WIPO (PCT)
Prior art keywords
chip
electrically connected
pad
eml
optical module
Prior art date
Application number
PCT/CN2021/103117
Other languages
English (en)
French (fr)
Inventor
张加傲
王欣南
于琳
慕建伟
Original Assignee
青岛海信宽带多媒体技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202023086705.XU external-priority patent/CN213780448U/zh
Priority claimed from CN202011507499.7A external-priority patent/CN112505855B/zh
Application filed by 青岛海信宽带多媒体技术有限公司 filed Critical 青岛海信宽带多媒体技术有限公司
Publication of WO2022127073A1 publication Critical patent/WO2022127073A1/zh
Priority to US17/853,742 priority Critical patent/US20220337022A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H04B10/503—Laser transmitters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0265—Intensity modulators

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • the EML laser includes an electro-absorption modulation region and a light-emitting region, and the electro-absorption modulation region and the light-emitting region are realized by an EA modulator and a DFB laser, respectively.
  • An embodiment of the present disclosure provides an optical module, including: a circuit board; a light emitting component electrically connected to the circuit board for converting an electrical signal into an optical signal; the light emitting component includes: a ceramic substrate for carrying device; an EML laser assembly, including an EML laser chip; at least two channels, carried by the ceramic substrate, wherein one channel includes: a driving component, disposed on the surface of the ceramic substrate, including a driving chip; and a driving multiplexing pad, disposed On the surface of the ceramic substrate, it is used to electrically connect the signal pad of the driver chip and one end of the first magnetic bead, and the other end of the first magnetic bead is connected to the first voltage; it is also used to connect the DC blocking capacitor One end of the capacitor is electrically connected to one end of the first magnetic bead; the EML multiplexing pad is arranged on the surface of the ceramic substrate and is used to electrically connect the other end of the DC blocking capacitor and the other end of the second magnetic bead; It is also used to electrically connect the E
  • Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals
  • Fig. 2 is a schematic diagram of the structure of an optical network unit
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present disclosure.
  • FIG. 5 is a structural diagram of a circuit board in an embodiment of the disclosure.
  • FIG. 6 is a schematic diagram of an exploded structure of a circuit board in an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of an appearance structure of a light emitting component provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of an exploded structure of a light emitting assembly provided by an embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram of the connection of the internal components of the light emitting assembly provided by the embodiment of the present disclosure.
  • FIG. 10 is a partial schematic diagram of the internal components of the light emitting assembly provided by the embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of an equivalent circuit of the connection of each component in the light emitting component provided by the embodiment of the present disclosure.
  • One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals.
  • Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides.
  • the passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used.
  • the optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module.
  • the optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board.
  • the main electrical connections include power supply, I2C signal, data information and grounding, etc.
  • the electrical connection realized by the gold finger has become the optical module.
  • the mainstream connection method of the industry based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.
  • FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal.
  • the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100 , the optical module 200 , the optical fiber 101 and the network cable 103 .
  • One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device.
  • the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.
  • the optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101;
  • the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100;
  • the optical module internally realizes the mutual conversion of optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal.
  • the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber .
  • the optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100 .
  • the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal serves as the upper computer of the optical module to monitor the operation of the optical module.
  • the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.
  • Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module.
  • the common optical module host computer also has optical lines. terminal etc.
  • FIG. 2 is a schematic structural diagram of an optical network terminal.
  • the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to an optical module electrical port such as a golden finger;
  • the cage 106 is provided with a radiator 107 , and the radiator 107 has raised portions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the optical network terminal 100 .
  • the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .
  • the cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.
  • FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural diagram of an exploded optical module according to an embodiment of the present disclosure.
  • the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , an unlocking part 203 , a circuit board 300 , and an optical transceiver assembly 400 .
  • the upper casing 201 is covered with the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body.
  • the lower case 202 includes a main board and two side plates located on both sides of the main board and perpendicular to the main board; the upper case includes a cover plate, and the cover plate covers the two side plates of the upper case. the side plate to form a wrapping cavity; the upper shell can also include two side walls located on both sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize the upper shell 201 is closed on the lower case 202 .
  • One of the two openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect optical fibers.
  • the optical transceiver assembly 400 inside the module; the circuit board 300, the optical transceiver assembly 400 and other optoelectronic devices are located in the package cavity.
  • the combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the optical transceiver assembly 400 and other devices into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the module;
  • the upper casing and the lower casing are generally made of metal materials, which are used to achieve electromagnetic shielding and heat dissipation.
  • the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.
  • the unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.
  • the unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.
  • the circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP), etc.
  • electronic components such as capacitors, resistors, triodes, MOS tubes
  • chips such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP, etc.
  • the circuit board 300 connects the electrical components in the optical module together according to the circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.
  • the circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver components are located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.
  • metal pins/gold fingers are formed on the end surface of one side of the rigid circuit board for connecting with the electrical connector. Connector connections; these are inconvenient to implement with flexible circuit boards.
  • Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.
  • flexible circuit boards can be used to connect the rigid circuit boards and optical transceiver components.
  • the optical transceiver assembly includes two parts, an optical transmitting assembly and an optical receiving assembly, which are respectively used to realize the transmission of optical signals and the reception of optical signals.
  • FIG. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural diagram of an exploded circuit board 300 according to an embodiment of the present disclosure.
  • the optical module 200 includes at least two light emitting components and a light receiving component 402. The at least two light emitting components are electrically connected to the circuit board 300 through the first flexible board respectively, and the light receiving component 402 is connected to the circuit board 300 through the first flexible board.
  • the two flexible boards 500 are electrically connected to the circuit board 300 , and the light-emitting components and the light-receiving components 402 are stacked on top of each other, instead of arranging the light-emitting components and the light-receiving components on the surface of the circuit board 300 , so that the space requirement of the circuit board 300 is not increased. , thereby reducing the volume size of the optical module and realizing the miniaturized packaging of the optical module.
  • the at least two light emitting components may include a first light emitting component 401 and a second light emitting component 403, the first light emitting component 401 is electrically connected to the circuit board 300 through the first flexible board 700, and the second light emitting component 403 is electrically connected to the circuit board 300 through the third flexible board 800 to realize the layout of the multi-channel light emitting chips.
  • the light emitting assembly generally includes a casing, a light transmitter and a lens assembly.
  • the light transmitter is fixed inside the casing for emitting light beams;
  • the lens assembly is located on the light-emitting light path of the light transmitter and is fixed inside the casing for Change the transmission direction of the beam so that the laser beam enters the external fiber. That is, the light emitted by the light transmitter enters the optical fiber after being reflected by the lens assembly.
  • FIG. 7 is a schematic diagram of an appearance structure of a light emitting assembly provided by an embodiment of the present disclosure
  • FIG. 8 is a schematic diagram of an exploded structure of a light emitting assembly provided by an embodiment of the present disclosure
  • the light emitting assembly provided by the present disclosure 401 includes a cover plate 401a and a cavity 401b, the cover plate 401a and the cavity 401b are connected by cover, and the cavity 401b is provided with a ceramic substrate 601, a driving chip 602 and an EML laser chip 603 and other structures.
  • FIG. 9 is a schematic connection diagram of the internal structures of the light emitting assembly provided by the embodiment of the present disclosure; in FIG. 9, taking the integrated eight channels as an example, the light emitting assembly includes a ceramic substrate, an EML laser assembly and at least two channels, wherein one channel includes The driving components, the driving multiplexing pads and the EML multiplexing pads will be described in detail below with reference to FIG. 9 and FIG. 10 .
  • FIG. 9 is a schematic diagram of the connection of the internal components of the light emitting assembly provided by the embodiment of the present disclosure
  • FIG. 10 is a partial schematic diagram of the internal components of the light emitting assembly provided by the embodiment of the present disclosure
  • the surface of the ceramic substrate 601 is provided with There is a driving component.
  • the driving component includes a driving chip 602 and a first substrate.
  • the first substrate is provided with a positive electrode connection area and a negative electrode connection area.
  • the positive electrode of the driving chip 602 is electrically connected to the positive electrode connection area, and the negative electrode is electrically connected to the negative electrode connection area.
  • a driving multiplexing pad 6042 and a driving power supply pad 6044 are provided near the driving chip 602.
  • the driving multiplexing pad 6042 is used to electrically connect the signal pad of the driving chip 602 and one end of the first magnetic bead 606.
  • the first The other end of the magnetic bead 606 is connected to the first voltage; the driving multiplexing pad 6042 is also used to electrically connect one end of the DC blocking capacitor 608 with one end of the first magnetic bead 606 .
  • the driving multiplexing pad 6042 mainly integrates the functions of power supply and signal transmission to the EML laser chip 603 , the driving multiplexing pad 6042 can provide the first voltage for the driving chip 602 , and the driving power supply pad 6044 can provide the driving chip 602 with a second voltage , the first voltage and the second voltage are different, which can provide different voltages to the driving chip 602 to ensure its normal operation.
  • the positive electrode of the driving chip 602 is electrically connected to the positive electrode connection area on the first substrate, the positive electrode connection area is connected to the driving multiplexing pad 6042 by wire bonding, and the driving multiplexing pad 6042 is connected to the first substrate.
  • the magnetic bead 606 is electrically connected, and the first magnetic bead 606 is electrically connected to the power supply pin on the circuit board 300. Therefore, the voltage on the power supply pin is transmitted to the driving chip 602 through the first magnetic bead and the driving multiplexing pad 6042, The first voltage is provided for the driver chip 602; the positive electrode of the driver chip 602 is electrically connected to the positive electrode connection area on the first substrate, the positive electrode connection area is connected to the driving multiplexing pad 6042 by wire bonding, and the driving multiplexing pad 6042 is connected to the filter capacitor 609.
  • the filter capacitor 609 is electrically connected to the power supply pin on the circuit board 300.
  • the voltage on the power supply pin is transmitted to the drive chip 602 through the filter capacitor 609 and the drive multiplexing pad 6042, providing the first power supply for the drive chip 602. Two voltages; wherein the voltage values of the first voltage and the second voltage are different.
  • the surface of the ceramic substrate 601 is also provided with an EML laser assembly.
  • the EML laser assembly includes an EML laser chip 603 and a second substrate.
  • the second substrate is also provided with a positive electrode connection area and a negative electrode connection area.
  • the positive electrode of the EML laser chip 603 is electrically connected to the positive electrode connection area. connected, and the negative electrode is electrically connected to the negative electrode connection area.
  • An EML multiplexing pad 6052 is provided near the EML laser chip 603, and the EML multiplexing pad 6052 is used to electrically connect the other end of the DC blocking capacitor 608 and the other end of the second magnetic bead 607; it is also used to connect the EML laser
  • the component is electrically connected to the other end of the second magnetic bead 607 , and one end of the second magnetic bead 607 is connected to the power supply voltage of the EML laser chip 603 .
  • the EML multiplexing pad 6052 is used for supplying voltage to the EML laser chip 603 and receiving driving signals from the driving chip 602 .
  • the positive electrode of the EML laser chip 603 is electrically connected to the positive electrode connection area on the second substrate, and the positive electrode connection area is connected to the EML multiplexing pad 6052 by wire bonding, and the EML multiplexing pad 6052 is connected to the second substrate.
  • the two magnetic beads 607 are electrically connected, and the second magnetic beads 607 are electrically connected to the power supply pins on the circuit board 300 . Therefore, the voltage on the power supply pins is transmitted to the EML laser chip 603 through the two magnetic beads 607 and the EML multiplexing pads 6052 . On, the EML laser chip 603 is supplied with voltage.
  • the positive electrode of the driving chip 602 is electrically connected to the positive electrode connection area on the first substrate, the positive electrode connection area is connected to the driving multiplexing pad 6042 by wire bonding, and the driving multiplexing pad 6042 is electrically connected to one end of the DC blocking capacitor 608, and the DC blocking capacitor
  • the other end of 608 is electrically connected to the EML multiplexing pad 6052, the EML multiplexing pad 6052 is electrically connected to the positive electrode connection area of the second substrate, and the positive electrode connection area of the second substrate is electrically connected to the positive electrode of the EML laser chip 603, thereby realizing
  • the driving signal generated by the driving chip 602 is transmitted to the EML laser chip 603, and the EML laser chip 603 operates normally according to the driving signal.
  • the driving multiplexing pad 6042 is to transmit the driving signal to the right of the driving chip 602 on the one hand, and to supply the voltage to the driving chip 602 to the left on the other hand, and the two branches are in opposite directions and parallel. Work.
  • the EML multiplexing pad 6052 When the EML multiplexing pad 6052 receives the signal from the driving chip 602, it provides voltage to the EML laser chip 603 to the right, and the two branches work in parallel.
  • one end of the filter capacitor 609 is electrically connected to the power supply pin on the circuit board 300, and the other end is grounded.
  • one end of the first magnetic bead 606 is electrically connected to the power supply pin on the circuit board 300 , the other end is electrically connected to the DC blocking capacitor 608 , and one end of the second magnetic bead 607 is electrically connected to the power supply on the circuit board 300 .
  • the pin is electrically connected, and the other end is electrically connected to the DC blocking capacitor 608 .
  • the driver chip 602 is on the left side, and the EML laser chip 603 is on the right side.
  • the first magnetic bead transmits the voltage to the left to provide voltage for the driver chip 602, and the second magnetic bead transmits the voltage.
  • the direction of the voltage is to transmit to the right to provide voltage for the EML laser chip 603.
  • the first magnetic bead 606 and the second magnetic bead 607 are both electrically connected to the DC blocking capacitor 608.
  • the function of the DC blocking capacitor 608 is to isolate Direct current is used for alternating current to avoid the interference of the current flowing through the first magnetic bead 606 and the second magnetic bead 607 .
  • the surface of the ceramic substrate 601 is further provided with a first ground pad 6041, which is disposed adjacent to the driving chip 602 and is used to electrically connect the negative electrode of the driving chip 602 and the ceramic substrate 601 to realize the grounding of the negative electrode of the driving chip 602.
  • the negative electrode of the driving chip 602 is electrically connected to the negative electrode connection area of the first substrate, and the negative electrode connection area of the first substrate is connected to the first ground pad 6041 by wire bonding, and the first ground pad
  • the 6041 is wired to the ceramic substrate 601, and the ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300 to realize the grounding of the negative electrode of the driving chip 602.
  • the second ground pad 6043 is disposed adjacent to the driving chip 602 and is used to electrically connect the negative electrode of the driving chip 602 and the negative electrode of the EML laser chip to achieve isolation between channels.
  • the negative electrode of the driving chip 602 is connected to the second ground pad 6043
  • the second ground pad 6043 is electrically connected to the fourth ground pad 6053
  • the fourth ground pad 6053 is connected to the second ground pad 6043.
  • the negative electrode connection area of the second substrate is connected, and the negative electrode connection area of the second substrate is electrically connected to the EML laser chip 603, so that the negative electrode of the driving chip 602 is electrically connected to the EML laser chip 603 to realize isolation between channels.
  • the third ground pad 6051 is disposed adjacent to the EML laser chip 603, and is used to electrically connect the negative electrode of the EML laser chip 603 and the ceramic substrate to ground the negative electrode of the EML laser chip; in some embodiments of the present disclosure , the negative electrode of the EML laser chip 603 is electrically connected to the negative electrode connection area of the second substrate, the negative electrode connection area of the second substrate is wired to the third ground pad 6051, and the third ground pad 6051 is wired to the ceramic substrate 601, The ceramic substrate 601 is electrically connected to the ground pin on the circuit board 300 so that the negative electrode of the driving chip 602 is grounded.
  • FIG. 11 is a schematic diagram of an equivalent circuit of the connection of each component in the light emitting component provided by the embodiment of the present disclosure.
  • the peripheral circuit of the driver chip 602 includes a first branch 6061 connected in series to the power line and a power supply connected in parallel
  • the second branch 6062 on the line, the first branch includes the first magnetic bead 607, and provides the first voltage for the driver chip 602 through the first magnetic bead 607;
  • the peripheral circuit of the EML laser chip 603 includes the first voltage connected in series on the power line.
  • the third branch 6071 has a second magnetic bead 608 , and provides voltage to the EML laser chip 603 through the second magnetic bead 608 .
  • the DC current is isolated between the peripheral circuit of the driver chip 602 and the peripheral circuit of the EML laser chip 603 through the DC blocking capacitor 608, thereby ensuring that the voltages between the peripheral circuit of the driver chip 602 and the peripheral circuit of the EML laser chip 603 do not interfere with each other.
  • the present disclosure provides an optical module, including a circuit board and a light emitting assembly, the light emitting assembly includes a ceramic substrate, the surface of the ceramic substrate carries at least two channels, adjacent channels are shielded and isolated, and each channel includes a driver chip, an EML laser
  • the chip provides the first voltage and realizes the transmission of signals to the EML laser chip.
  • the main function of the driving power supply pad is to provide the second voltage to the driving chip.
  • the main function of the EML multiplexing pad is to provide voltage to the EML laser chip and ensure the EML laser chip.
  • connection is as follows: one end of the driving chip is electrically connected to the driving multiplexing pad, the driving multiplexing pad is electrically connected to the first magnetic bead, and the first magnetic bead is electrically connected to the power supply lead on the circuit board.
  • the pin is electrically connected to provide the first voltage to the driving chip, one end of the driving chip is electrically connected to the driving multiplexing pad, the driving multiplexing pad is electrically connected to the DC blocking capacitor, and the DC blocking capacitor is electrically connected to the EML multiplexing pad to realize driving Communication between the chip and the EML laser chip; one end of the drive chip is electrically connected to one end of the drive power supply pad, the other end of the drive power supply pad is electrically connected to one end of the filter capacitor, and the other end of the filter capacitor is electrically connected to the power supply on the circuit board
  • the pins are electrically connected to input the second voltage to the driving chip; the EML multiplexing pad provides voltage to the EML laser chip by connecting with the second magnetic bead, and receives the signal from the driving chip by connecting with the DC blocking capacitor.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

一种光模块（200）包括电路板（300）和光发射组件（401），光发射组件（401）包括陶瓷基板（601）、EML激光器组件和至少两个通道，一个通道包括驱动组件、驱动复用焊盘（6042）、驱动供电焊盘（6044）和EML复用焊盘（6052），其中驱动复用焊盘（6042）设置在驱动芯片（602）附近以保证驱动芯片（602）的正常工作，驱动复用焊盘（6042）的主要功能是向驱动芯片（602）提供第一电压和实现向EML激光器芯片（603）传输信号，驱动供电焊盘（6044）的主要功能是向驱动芯片（602）提供第二电压，EML复用焊盘（6052）的主要功能是向EML激光器芯片（603）提供电压和保证EML激光器芯片（603）接收来自驱动芯片（602）的信号。通过在陶瓷基板（601）上布设多通道的驱动外围电路和EML外围电路等保证驱动芯片（602）和EML激光器芯片（603）的正常工作。

Description

一种光模块
本公开要求在2020年12月18日提交中国专利局、申请号为202011507499.7、专利名称为“一种光模块”、在2020年12月18日提交中国专利局、申请号为202023086705.X、专利名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
EML激光器包括电吸收调制区和发光区，电吸收调制区和发光区分别通过EA调制器和DFB激光器实现。
发明内容
本公开实施例提供一种光模块，包括：电路板；光发射组件，与所述电路板电连接，用于将电信号转换为光信号；所述光发射组件包括：陶瓷基板，用于承载器件；EML激光器组件，包括EML激光器芯片；至少两个通道，由所述陶瓷基板承载，其中一个通道包括：驱动组件，设置于所述陶瓷基板表面，包括驱动芯片；驱动复用焊盘，设置于所述陶瓷基板表面，用于将所述驱动芯片的信号焊盘和第一磁珠的一端电连接，所述第一磁珠的另一端接入第一电压；还用于将隔直电容的一端与所述第一磁珠的一端电连接；EML复用焊盘，设置于所述陶瓷基板表面，用于将所述隔直电容的另一端和第二磁珠的另一端电连接；还用于将EML激光器组件和第二磁珠的另一端电连接，所述第二磁珠的一端接入所述EML激光器芯片的供电电压。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为光通信终端连接关系示意图；
图2为光网络单元结构示意图；
图3为本公开实施例提供的一种光模块的结构示意图；
图4为本公开实施例提供的一种光模块的分解结构示意图；
图5为本公开实施例中电路板的结构图；
图6为本公开实施例中电路板的分解结构示意图；
图7为本公开实施例提供的光发射组件的外观结构示意图；
图8为本公开实施例提供的光发射组件的分解结构示意图；
图9为本公开实施例提供的光发射组件的内部各部件的连接示意图；
图10本公开实施例提供的光发射组件的内部各部件的局部示意图；
图11为本公开实施例提供的光发射组件中各组件连接的等效电路示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输，利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备使用的是电信号，为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，就需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能，光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接，主要的电连接包括供电、I2C信号、数据信息以及接地等；采用金手指实现的电连接方式已经成为光模块行业的主流连接方式，以此为基础，金手指上引脚的定义形成了多种行业协议/规范。
图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接。
光纤101的一端连接远端服务器，网线103的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成；而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。
光模块200的光口对外接入光纤101，与光纤101建立双向的光信号连接；光模块200的电口对外接入光网络终端100中，与光网络终端100建立双向的电信号连接；在光模块内部实现光信号与电信号的相互转换，从而实现在 光纤与光网络终端之间建立信息连接。在本公开的某一些实施例中，来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。
光网络终端具有光模块接口102，用于接入光模块200，与光模块200建立双向的电信号连接；光网络终端具有网线接口104，用于接入网线103，与网线103建立双向的电信号连接；光模块200与网线103之间通过光网络终端100建立连接。在本公开的某一些实施例中，光网络终端将来自光模块的信号传递给网线，将来自网线的信号传递给光模块，光网络终端作为光模块的上位机监控光模块的工作。
至此，远端服务器通过光纤、光模块、光网络终端及网线，与本地信息处理设备之间建立双向的信号传递通道。
常见的信息处理设备包括路由器、交换机、电子计算机等；光网络终端是光模块的上位机，向光模块提供数据信号，并接收来自光模块的数据信号，常见的光模块上位机还有光线路终端等。
图2为光网络终端结构示意图。如图2所示，在光网络终端100中具有电路板105，在电路板105的表面设置笼子106；在笼子106内部设置有电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100中，在本公开的某一些实施例中光模块的电口插入笼子106内部的电连接器，光模块的光口与光纤101连接。
笼子106位于电路板上，将电路板上的电连接器包裹在笼子中，从而使笼子内部设置有电连接器；光模块插入笼子中，由笼子固定光模块，光模块产生的热量传导给笼子106，然后通过笼子上的散热器107进行扩散。
图3为本公开实施例提供的一种光模块结构示意图，图4为本公开实施例提供光模块分解结构示意图。如图3、图4所示，本公开实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203、电路板300及光收发组件400。
上壳体201盖合在下壳体202上，以形成具有两个开口的包裹腔体；包裹腔体的外轮廓一般呈现方形体。在本公开的某一些实施例中，下壳体202包括主板以及位于主板两侧、与主板垂直设置的两个侧板；上壳体包括盖板，盖板盖合在上壳体的两个侧板上，以形成包裹腔体；上壳体还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁，由两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口的其中一个开口为电口204，电路板的金手指从电口204伸出，插入光网络终端等上位机中；另一个开口为光口205，用于外部光纤接入以连接光模块内部的光收发组件400；电路板300、光收发组件400等光电器件位于包裹腔体中。
采用上壳体、下壳体结合的装配方式，便于将电路板300、光收发组件400等器件安装到壳体中，由上壳体、下壳体形成模块最外层的封装保护壳体；上壳体及下壳体一般采用金属材料，利用实现电磁屏蔽以及散热，一般不会将光模块的壳体做成一体部件，这样在装配电路板等器件时，定位部件、散热以及电磁屏蔽部件无法安装，也不利于生产自动化。
解锁部件203位于包裹腔体/下壳体202的外壁，用于实现光模块与上位机之间的固定连接，或解除光模块与上位机之间的固定连接。
解锁部件203具有与上位机笼子匹配的卡合部件；拉动解锁部件的末端可以在使解锁部件在外壁的表面相对移动；光模块插入上位机的笼子里，由解锁部件的卡合部件将光模块固定在上位机的笼子里；通过拉动解锁部件，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块与上位机的卡合关系，从而可以将光模块从上位机的笼子里抽出。
电路板300上设置有电路走线、电子元件(如电容、电阻、三极管、MOS管)及芯片(如MCU、激光驱动芯片、限幅放大芯片、时钟数据恢复CDR、电源管理芯片、数据处理芯片DSP)等。
电路板300通过电路走线将光模块中的用电器件按照电路设计连接在一起，以实现供电、电信号传输及接地等电功能。
电路板一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；当光收发组件位于电路板上时，硬性电路板也可以提供平稳的承载；硬性电路板还可以插入上位机笼子中的电连接器中，在本公开的某一些实施例中，在硬性电路板一侧末端表面形成金属引脚/金手指，用于与电连接器连接；这些都是柔性电路板不便于实现的。
部分光模块中也会使用柔性电路板，作为硬性电路板的补充；柔性电路板一般与硬性电路板配合使用，如硬性电路板与光收发组件之间可以采用柔性电路板连接。
光收发组件包括光发射组件及光接收组件两部分，分别用于实现光信号的发射与光信号的接收。附图5为本公开实施例提供的一种电路板300的结构示意图，附图6为本公开实施例提供的电路板300的分解结构示意图。如 图5、图6所示，光模块200包括至少两个光发射组件与光接收组件402，至少两个光发射组件分别通过第一柔性板与电路板300电连接，光接收组件402通过第二柔性板500与电路板300电连接，且光发射组件与光接收组件402层叠设置，而不是将光发射组件与光接收组件设置在电路板300表面上，如此可不增加电路板300的空间需求，从而减小光模块的体积尺寸，实现光模块的小型化封装。
在示例中，至少两个光发射组件可包括第一光发射组件401与第二光发射组件403，第一光发射组件401通过第一柔性板700与电路板300电连接，第二光发射组件403通过第三柔性板800与电路板300电连接，实现多路光发射芯片的布局。
光发射组件一般包括壳体、光发射器与透镜组件，光发射器固定于壳体的内部，用于发射光束；透镜组件位于光发射器发光光路上，且固定在壳体的内部，用于改变光束的传输方向，使得激光光束进入外部光纤。即，光发射器发出的光经透镜组件反射后进入光纤中。
需要说明的是，上述是以双发射结构和双接收结构为例进行说明，单发射结构和单接收结构也在本公开保护范围内。
图7为本公开实施例提供的光发射组件的外观结构示意图；图8为本公开实施例提供的光发射组件的分解结构示意图；如图7和图8所示，本公开提供的光发射组件401包括盖板401a和腔体401b，盖板401a和腔体401b盖合连接，腔体401b内设有陶瓷基板601、驱动芯片602和EML激光器芯片603等结构。
图9为本公开实施例提供的光发射组件的内部各结构的连接示意图；图9中以集成八通道为例，光发射组件包括陶瓷基板、EML激光器组件和至少两个通道，其中一个通道包括驱动组件、驱动复用焊盘和EML复用焊盘，下面结合图9和图10对各结构进行具体说明。
图9为本公开实施例提供的光发射组件的内部各部件的连接示意图；图10本公开实施例提供的光发射组件的内部各部件的局部示意图；本公开实施例中，陶瓷基板601表面设有驱动组件，驱动组件包括驱动芯片602和第一基板，第一基板上设有正极连接区域和负极连接区域，驱动芯片602的正极与正极连接区域电连接，负极与负极连接区域电连接。在驱动芯片602的附近设置有驱动复用焊盘6042和驱动供电焊盘6044，驱动复用焊盘6042用于将驱动芯片602的信号焊盘和第一磁珠606的一端电连接，第一磁珠606的另一端接入第一电压；驱动复用焊盘6042还用于将隔直电容608的一端与第 一磁珠606的一端电连接。
其中驱动复用焊盘6042主要集成供电和向EML激光器芯片603传输信号功能，驱动复用焊盘6042可以为驱动芯片602提供第一电压，驱动供电焊盘6044可以为驱动芯片602提供第二电压，第一电压和第二电压不同，其可以向驱动芯片602提供不同的电压保证其正常工作。在本公开的某一些实施例中，驱动芯片602的正极与第一基板上的正极连接区域电连接，正极连接区域与驱动复用焊盘6042打线连接，驱动复用焊盘6042与第一磁珠606电连接，第一磁珠606与电路板300上的供电引脚电连接，因此，供电引脚上的电压经过第一磁珠、驱动复用焊盘6042输送至驱动芯片602上，为驱动芯片602提供第一电压；驱动芯片602的正极与第一基板上的正极连接区域电连接，正极连接区域与驱动复用焊盘6042打线连接，驱动复用焊盘6042与滤波电容609电连接，滤波电容609与电路板300上的供电引脚电连接，因此，供电引脚上的电压经过滤波电容609、驱动复用焊盘6042输送至驱动芯片602上，为驱动芯片602提供第二电压；其中第一电压和第二电压的电压值不同。
陶瓷基板601表面还设有EML激光器组件，EML激光器组件包括EML激光器芯片603和第二基板，第二基板上同样设有正极连接区域和负极连接区域，EML激光器芯片603的正极与正极连接区域电连接，负极与负极连接区域电连接。在EML激光器芯片603的附近设置有EML复用焊盘6052，EML复用焊盘6052用于将隔直电容608的另一端和第二磁珠607的另一端电连接；还用于将EML激光器组件和第二磁珠607的另一端电连接，第二磁珠607的一端接入EML激光器芯片603的供电电压。
EML复用焊盘6052用于向EML激光器芯片603提供电压和接收来自驱动芯片602的驱动信号。在本公开的某一些实施例中，EML激光器芯片603的正极与第二基板上的正极连接区域电连接，正极连接区域与EML复用焊盘6052打线连接，EML复用焊盘6052与第二磁珠607电连接，第二磁珠607与电路板300上的供电引脚电连接，因此，供电引脚上的电压经过二磁珠607、EML复用焊盘6052输送至EML激光器芯片603上，为EML激光器芯片603提供电压。
驱动芯片602的正极与第一基板上的正极连接区域电连接，正极连接区域与驱动复用焊盘6042打线连接，驱动复用焊盘6042与隔直电容608的一端电连接，隔直电容608的另一端与EML复用焊盘6052电连接，EML复用焊盘6052与第二基板的正极连接区域电连接，第二基板的正极连接区域与 EML激光器芯片603的正极电连接，从而实现将驱动芯片602产生的驱动信号传输至EML激光器芯片603上，EML激光器芯片603根据该驱动信号进行正常工作。
以图7中的左右方向为例，驱动复用焊盘6042一方面是使驱动芯片602向右传递驱动信号，另一方面是向左为驱动芯片602提供电压，两条支路方向相反且并行工作。
EML复用焊盘6052接收来自驱动芯片602的信号的同时，向右为EML激光器芯片603提供电压，两条支路并行工作。
在本公开实施例中，滤波电容609一端与电路板300上的供电引脚电连接，另一端接地。
在本公开实施例中，第一磁珠606的一端与电路板300上的供电引脚电连接，另一端与隔直电容608电连接，第二磁珠607的一端与电路板300上的供电引脚电连接，另一端与隔直电容608电连接。以图7中的左右方向为例，驱动芯片602位于左侧，EML激光器芯片603位于右侧，第一磁珠传递电压的方向是向左传递为驱动芯片602提供电压，而第二磁珠传递电压的方向是向右传递为EML激光器芯片603提供电压，为了避免相互电流的干扰，第一磁珠606和第二磁珠607均与隔直电容608电连接，隔直电容608的作用为隔直流通交流，以避免流经第一磁珠606和第二磁珠607的电流的干扰。
在本公开实施例中，陶瓷基板601的表面还设有第一接地焊盘6041，与驱动芯片602相邻设置，用于电连接驱动芯片602的负极和陶瓷基板601以实现驱动芯片602负极接地；在本公开的某一些实施例中，驱动芯片602的负极与第一基板的负极连接区域电连接，第一基板的负极连接区域打线连接至第一接地焊盘6041，第一接地焊盘6041打线至陶瓷基板601上，陶瓷基板601与电路板300上的接地引脚电连接从而实现驱动芯片602负极接地。
第二接地焊盘6043与驱动芯片602相邻设置，用于电连接驱动芯片602的负极和所述EML激光器芯片的负极以实现通道之间的隔离。在本公开的某一些实施例中，驱动芯片602的负极打线连接至第二接地焊盘6043上，第二接地焊盘6043与第四接地焊盘6053电连接，第四接地焊盘6053与第二基板的负极连接区域连接，第二基板的负极连接区域与EML激光器芯片603电连接，从而实现驱动芯片602的负极与EML激光器芯片603电连接以实现通道之间的隔离。
第三接地焊盘6051与EML激光器芯片603相邻设置，用于电连接EML激光器芯片603的负极和所述陶瓷基板以使所述EML激光器芯片的负极接地； 在本公开的某一些实施例中，EML激光器芯片603的负极与第二基板的负极连接区域电连接，第二基板的负极连接区域打线连接至第三接地焊盘6051，第三接地焊盘6051打线至陶瓷基板601上，陶瓷基板601与电路板300上的接地引脚电连接从而实现驱动芯片602负极接地。
图11为本公开实施例提供的光发射组件中各组件连接的等效电路示意图，如图11所示，驱动芯片602的外围电路包括串联在电源线上的第一支路6061和并联在电源线上的第二支路6062，第一支路包括第一磁珠607，经过第一磁珠607为驱动芯片602提供第一电压；EML激光器芯片603的外围电路包括串联在电源线上的第三支路6071和并联在电源线上的第四支路6072，第三支路6071具有第二磁珠608，经过第二磁珠608为EML激光器芯片603提供电压。驱动芯片602的外围电路和EML激光器芯片603的外围电路之间通过隔直电容608进行直流电流的隔断，从而保证驱动芯片602的外围电路和EML激光器芯片603的外围电路之间电压互不干扰。
本公开提供了一种光模块，包括电路板和光发射组件，光发射组件包括陶瓷基板，陶瓷基板表面承载至少两个通道，相邻通道之间屏蔽隔离，每个通道均包括驱动芯片、EML激光器驱动芯片、驱动复用焊盘、驱动供电焊盘和EML复用焊盘，其中驱动复用焊盘设置在驱动芯片附近以保证驱动芯片的正常工作，驱动复用焊盘的主要功能是向驱动芯片提供第一电压和实现向EML激光器芯片传输信号，驱动供电焊盘的主要功能是向驱动芯片提供第二电压，EML复用焊盘的主要功能是向EML激光器芯片提供电压和保证EML激光器芯片接收来自驱动芯片的信号。在本公开的某一些实施例中连接方式为：驱动芯片的一端与驱动复用焊盘电连接，驱动复用焊盘与第一磁珠电连接，第一磁珠与电路板上的供电引脚电连接以向驱动芯片提供第一电压，驱动芯片的一端与驱动复用焊盘电连接，驱动复用焊盘与隔直电容电连接，隔直电容与EML复用焊盘电连接实现驱动芯片和EML激光器芯片之间的通信；驱动芯片的一端与驱动供电焊盘的一端电连接，驱动供电焊盘的另一端与滤波电容的一端电连接，滤波电容的另一端与电路板上的供电引脚电连接以向驱动芯片输入第二电压；EML复用焊盘通过与第二磁珠相连向EML激光器芯片提供电压，通过与隔直电容相连以接收来自驱动芯片的信号。通过上述过程可以在陶瓷基板上布设多通道的驱动外围电路和EML外围电路等并保证驱动芯片和EML激光器芯片的正常工作。
最后应说明的是：以上实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述实施例对本公开进行了详细的说明，本领域的普通技术 人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的精神和范围。

Claims (10)

  1. 一种光模块，其特征在于，包括：
    电路板；
    光发射组件，与所述电路板电连接，用于将电信号转换为光信号；
    所述光发射组件包括：
    陶瓷基板，用于承载器件；
    EML激光器组件，包括EML激光器芯片；
    至少两个通道，由所述陶瓷基板承载，其中一个通道包括：
    驱动组件，设置于所述陶瓷基板表面，包括驱动芯片；
    驱动复用焊盘，设置于所述陶瓷基板表面，用于将所述驱动芯片的信号焊盘和第一磁珠的一端电连接，所述第一磁珠的另一端接入第一电压；
    还用于将隔直电容的一端与所述第一磁珠的一端电连接；
    EML复用焊盘，设置于所述陶瓷基板表面，用于将所述隔直电容的另一端和第二磁珠的另一端电连接；
    还用于将EML激光器组件和第二磁珠的另一端电连接，所述第二磁珠的一端接入所述EML激光器芯片的供电电压。
  2. 根据权利要求1所述的光模块，其特征在于，所述通道上还包括：
    驱动供电焊盘，设置于所述陶瓷基板表面，用于将述驱动芯片的信号焊盘和滤波电容电连接，所述滤波电容与所述电路板上的供电引脚电连接以实现向所述驱动芯片提供第二电压。
  3. 根据权利要求1所述的光模块，其特征在于，所述通道还包括：
    第一接地焊盘，与所述驱动芯片相邻设置，用于电连接所述驱动芯片的负极和所述陶瓷基板以实现所述驱动芯片的负极接地；
    第二接地焊盘，与所述驱动芯片相邻设置，用于电连接所述驱动芯片的负极和所述EML激光器芯片的负极以实现通道之间的隔离。
  4. 根据权利要求1所述的光模块，其特征在于，所述通道还包括：
    第三接地焊盘，与所述EML激光器芯片相邻设置，用于电连接所述EML激光器芯片的负极和所述陶瓷基板以实现所述EML激光器芯片的负极接地；
    第四接地焊盘，与所述EML激光器芯片相邻设置，用于电连接所述EML激光器芯片的负极和所述驱动芯片的负极以实现通道之间的隔离。
  5. 根据权利要求2所述的光模块，其特征在于，所述滤波电容的一端与所述电路板上的供电引脚电连接，另一端接地。
  6. 根据权利要求1所述的光模块，其特征在于，所述第一磁珠的一端与所述电路板的供电引脚电连接，另一端与所述隔直电容电连接，所述第二磁珠的一端与所述电路板的供电引脚电连接，另一端与所述隔直电容电连接。
  7. 根据权利要求1所述的光模块，其特征在于，所述驱动复用焊盘的一端与所述驱动芯片电连接，另一端与所述第一磁珠的一端电连接，所述第一磁珠的另一端与所述电路板的供电引脚电连接以实现向所述驱动芯片提供第一电压。
  8. 根据权利要求1所述的光模块，其特征在于，所述驱动复用焊盘的一端与所述驱动芯片电连接，另一端与所述隔直电容的一端电连接，所述隔直电容的另一端与所述EML复用焊盘连接，所述EML复用焊盘与所述EML激光器芯片电连接，以实现所述驱动芯片与所述EML激光器芯片间的信号传递。
  9. 根据权利要求2所述的光模块，其特征在于，所述驱动供电焊盘的一端与所述滤波电容的一端电连接，所述滤波电容的另一端与所述电路板的供电引脚电连接以实现向所述驱动芯片提供第二电压。
  10. 根据权利要求1所述的光模块，其特征在于，所述EML复用焊盘的一端与所述EML激光器芯片电连接，另一端与所述第二磁珠的一端电连接，所述第二磁珠的另一端与所述电路板的供电引脚电连接以实现向所述EML激光器芯片提供电压。
PCT/CN2021/103117 2020-02-18 2021-06-29 一种光模块 WO2022127073A1 (zh)

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