WO2023182190A1 - Structure de fixation de carte de circuit imprimé et dispositif d'émission de lumière - Google Patents

Structure de fixation de carte de circuit imprimé et dispositif d'émission de lumière Download PDF

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Publication number
WO2023182190A1
WO2023182190A1 PCT/JP2023/010487 JP2023010487W WO2023182190A1 WO 2023182190 A1 WO2023182190 A1 WO 2023182190A1 JP 2023010487 W JP2023010487 W JP 2023010487W WO 2023182190 A1 WO2023182190 A1 WO 2023182190A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
electrode
hole
base
fixing
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Application number
PCT/JP2023/010487
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English (en)
Japanese (ja)
Inventor
浩明 渡邊
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Hoya株式会社
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Publication of WO2023182190A1 publication Critical patent/WO2023182190A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section

Definitions

  • the present invention relates to a circuit board fixing structure for fixing a circuit board on a base (e.g., a heat sink, a base plate), and particularly to a circuit board fixing structure having electrodes that serve both to fix the circuit board and supply power, and to a circuit board fixing structure equipped with the same.
  • This invention relates to a light irradiation device.
  • ultraviolet curing ink which is cured by irradiation with ultraviolet light
  • ultraviolet curing resins are used as sealants for FPDs (Flat Panel Displays) such as liquid crystal panels and organic EL (Electro Luminescence) panels.
  • FPDs Fluorescence Panel Displays
  • a light irradiation device that irradiates ultraviolet light is generally used to cure such ultraviolet curable ink or ultraviolet curable resin (for example, Patent Document 1).
  • the light irradiation device described in Patent Document 1 includes a heat sink, a plurality of light source modules fixed on the heat sink, a terminal block, etc. fixed to the side surface of the heat sink.
  • Each light source module has an electrode plate arranged to protrude toward the terminal block, and power is supplied to each light source module by fixing each electrode plate to the terminal block.
  • a fixing plate that presses the board of the light source module is arranged to cover each electrode plate, and each fixing plate and each electrode plate are fastened together to the terminal block, thereby fixing each light source module on the heat sink. It looks like this.
  • an electrode plate and a fixing plate are separately provided to supply stable power to the light source module and fix the light source module without applying excessive stress.
  • the electrode plate and the fixing plate protrude toward the terminal block (that is, they protrude toward the outside of the light source module)
  • the size in the direction perpendicular to the direction in which the light source modules are arranged becomes large (that is, it cannot be made thinner).
  • the fixing plate must also be attached and removed, so a configuration that allows easier replacement of the light source module is required. It was getting worse.
  • the present invention was made in view of the above circumstances, and its purpose is to easily replace the circuit board (light source module, etc.) on the base (heat sink, etc.) and to create a small circuit.
  • An object of the present invention is to provide a substrate fixing structure.
  • Another object of the present invention is to provide a light irradiation device including such a circuit board fixing structure.
  • the circuit board fixing structure of the present invention is a circuit board fixing structure for fixing a circuit board to the surface of a metal base, and in order to supply power to the circuit board, the circuit board fixing structure fixes the circuit board to the surface of a metal base.
  • a pair of second through holes that vertically penetrate the base, a pair of electrode members that are inserted into each of the second through holes, and a pair of electrode members that are attached to the front surface of the circuit board and engage with each of the electrode members, and the circuit board is a pair of fixing members fixed to the base, each electrode member having an electrode terminal extending along the second through hole, and arranged to cover the outer periphery of the electrode terminal to insulate the electrode terminal and the base. and an insulating member that restricts rotation of each electrode member with respect to the second through hole, so that when each fixed member and each electrode member are engaged, each of the positive electrode pattern and the negative electrode pattern It is characterized in that it is electrically connected to each electrode terminal via a member.
  • the electrode member and the fixing member serve both to fix the circuit board and supply power, there is no need to provide a dedicated member for supplying power to the circuit board, and the circuit board fixing structure It becomes possible to downsize the.
  • the task is simply to remove the fixing member and replace the circuit board (in other words, it is necessary to connect special parts to supply power to the circuit board). , wiring, etc.), it is possible to replace the circuit board with a simple operation.
  • the electrode member is restricted from rotating, the fixing member can be easily attached and detached.
  • At least a portion of the outer shape of the insulating member be formed with a flat portion parallel to the central axis of the second through hole, and that the flat portion be engaged with the second through hole.
  • At least a portion of the outer shape of the insulating member may include a protrusion that protrudes in a direction perpendicular to the central axis of the second through hole, and the second through hole may have an accommodating portion for accommodating the protrusion. desirable.
  • a fixing plate that is disposed on the back side of the base and has an opening through which the electrode terminal passes and which fits into a part of the insulating member.
  • each electrode member has a biasing member that biases each electrode member away from the circuit board.
  • the base has a surface on which the circuit board is placed, and includes a plate-shaped base section that is substantially parallel to the circuit board, and a plurality of plate-shaped base sections that stand up substantially perpendicularly from the back surface of the base section and extend parallel to each other.
  • radiating fins and each second through hole has a third through hole penetrating the base portion, and a portion of the plurality of radiating fins is perpendicular to the base so as to communicate with the third through hole. It is desirable that the fourth through hole is formed by being cut in the direction.
  • the base has a flow path inside thereof through which the refrigerant flows.
  • the light irradiation device of the present invention includes any one of the circuit board fixing structures described above, a plurality of light emitting elements arranged on the circuit board and supplied with power from a positive electrode pattern and a negative electrode pattern, It is characterized by having the following.
  • the pair of functional members have a mirror surface that reflects a portion of the light emitted from the plurality of light emitting elements.
  • the light emitted from the light emitting element has a wavelength in the ultraviolet region.
  • a compact circuit board fixing structure is realized in which the circuit board on the base can be easily replaced. Moreover, a light irradiation device including such a circuit board fixing structure is realized.
  • FIG. 1 is a diagram illustrating a schematic configuration of a light irradiation device including a circuit board fixing structure according to a first embodiment of the present invention.
  • FIG. 1 is an exploded perspective view illustrating a schematic configuration of a light irradiation device including a circuit board fixing structure according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view illustrating the structure of an electrode rod and an insulating sleeve of the circuit board fixing structure according to the first embodiment of the present invention. It is a figure explaining the schematic structure of the light irradiation device provided with the circuit board fixing structure concerning the 2nd embodiment of the present invention.
  • FIG. 1 is a diagram illustrating a schematic configuration of a light irradiation device 1 including a circuit board fixing structure 10 according to a first embodiment of the present invention
  • FIG. 1(a) is a perspective view
  • FIG. 1(b) is a perspective view.
  • ) is a front view
  • FIG. 1(c) is a rear view
  • FIG. 1(d) is a sectional view taken along line AA in FIG. 1(b).
  • FIG. 2 is an exploded perspective view of the light irradiation device 1 of FIG. 1,
  • FIG. 2(a) is a diagram seen diagonally from the front, and
  • FIG. 2(b) is a diagram seen diagonally from the rear.
  • the light irradiation device 1 of this embodiment is a light source device that is installed in a printing device or the like to cure ultraviolet curable ink or ultraviolet curable resin, and for example, the front surface (the surface where the LED module 100 is arranged) is irradiated. It is placed above the irradiation target so as to face the target, and emits ultraviolet light downward toward the irradiation target.
  • the front surface the surface where the LED module 100 is arranged
  • UV light is considered to mean light with a wavelength of 400 nm or less, but in this specification, ultraviolet light refers to a wavelength that can cure ultraviolet curable ink (for example, 250 to 420 nm).
  • the light irradiation device 1 of this embodiment includes two LED modules 100, a heat sink 200 (base), an anode terminal 300a for supplying power to each LED module 100, and a cathode terminal. It includes terminals 300b and the like, and a metal box-shaped case (not shown) that accommodates them. Note that in this specification, the anode terminal 300a and the cathode terminal 300b are also collectively referred to as the electrode member 300.
  • the LED module 100 includes a rectangular substrate 105 (circuit board) defined by the X-axis direction and the Y-axis direction, and a plurality of LED elements 110 (light-emitting elements) on the substrate 105.
  • Two LED modules 100 are arranged and fixed on the end face (see FIGS. 1(a), (b), and FIG. 2).
  • the substrates 105 are, for example, ceramic substrates made of aluminum nitride with high thermal conductivity, and each substrate 105 has a pair of through holes 120 (first through holes) formed at positions corresponding to the electrode members 300. (Fig. 1(d), Fig. 2).
  • heat dissipation grease (not shown) to the front surface (board mounting surface) of the heat sink 200 and then placing the board 105 on the heat sink 200, the back surface of the board 105 and the heat sink 200 are connected to each other. Heat dissipation grease is sandwiched between the substrate 105 and the heat sink 200 to improve the adhesion between the substrate 105 and the heat sink 200.
  • the LED module 100 includes 70 LED elements 110 arranged in 7 rows (Y-axis direction) x 10 LED elements (X-axis direction) on a substrate 105. .
  • the 70 LED elements 110 are arranged on the surface of the substrate 105 with their optical axes aligned in the Z-axis direction.
  • an anode pattern AP positive electrode pattern
  • a cathode pattern KP negative electrode pattern
  • soldering or the like eg, conductive adhesive (silver paste), brazing material, welding/welding, diffusion bonding, etc.
  • the anode pattern AP of this embodiment is electrically connected to the electrode bar 310 of the anode terminal 300a
  • the cathode pattern KP is electrically connected to the electrode bar 310 of the cathode terminal 300b (details will be described later).
  • the electrode rods 310 of the anode terminal 300a and the cathode terminal 300b are electrically connected to a driver circuit (not shown), and each LED element 110 has an anode terminal 300a, a cathode terminal 300b, an anode pattern AP, and a cathode pattern.
  • a drive current is supplied from the driver circuit via KP.
  • each LED element 110 When a drive current is supplied to each LED element 110, each LED element 110 emits ultraviolet light (for example, wavelength 385 nm) in an amount corresponding to the drive current.
  • the drive current supplied to each LED element 110 of this embodiment is adjusted so as to emit a substantially uniform amount of ultraviolet light, and the ultraviolet light emitted from the light irradiation device 1 is The light has a substantially uniform light intensity distribution in the X-axis direction and the Y-axis direction.
  • the heat sink 200 is a so-called air-cooled heat sink that is placed in close contact with the back surface of the substrate 105 of the LED module 100 and radiates heat generated by each LED element 110.
  • the heat sink 200 is made of a material with good thermal conductivity such as aluminum or copper, and is formed on a thin plate-shaped base portion 210 parallel to the XY plane and on a surface opposite to the surface in contact with the substrate 105.
  • a plurality of heat radiation fins 220 are provided. Each radiation fin 220 has a thin plate shape parallel to the YZ plane, and is provided at predetermined intervals in the X-axis direction. Note that in this embodiment, the plurality of radiation fins 220 are uniformly cooled by an airflow generated by a cooling fan (not shown).
  • a through hole 211 (second through hole) is formed in the heat sink 200 and extends vertically from the surface of the heat sink 200 (in a direction opposite to the Z-axis direction) so as to communicate with the through hole 120 of the substrate 105.
  • the electrode member 300 is inserted into the through hole 211 (FIGS. 1(c), (d), and FIG. 2).
  • the through hole 211 of this embodiment has a through hole 212 (third through hole) having a circular cross section that penetrates the base portion 210 so as to communicate with the through hole 120 of the substrate 105 , and a through hole 212 (third through hole) that penetrates the base portion 210 .
  • the through hole 222 (fourth through hole) is formed in the through hole 222 (fourth through hole).
  • the radiation fin 220 at a position corresponding to the through hole 212 is notched in a vertical direction (in a direction opposite to the Z-axis direction), and this notch 223 is aligned with the X-axis.
  • a through hole 222 having a rectangular cross section and penetrating through the radiation fins 220 in the Z-axis direction is formed in a space surrounded by the two radiation fins 220 sandwiched in the direction.
  • a recess 224 (accommodating part) that engages with a protrusion 332 of an insulating sleeve 330 of an electrode member 300 is formed in the radiation fin 220 forming the through hole 222 (FIG. 1(d)).
  • the electrode member 300 of this embodiment includes the anode terminal 300a connected to the anode pattern AP and the cathode terminal 300b connected to the cathode pattern KP, but the specific configurations are the same. Therefore, the cathode terminal 300b will be mainly explained below as a representative.
  • the electrode member 300 (cathode terminal 300b) of this embodiment includes an electrode rod 310 (electrode terminal), a fixing screw 320 (fixing member), and an insulating sleeve 330 (insulating member). has been done.
  • FIG. 3 is a perspective view illustrating the configuration of the electrode rod 310 and insulating sleeve 330 of this embodiment.
  • FIG. 3(a) is a perspective view showing an assembled state of the electrode rod 310 and the insulating sleeve 330
  • FIG. 3(b) is an exploded perspective view.
  • the electrode rod 310 is a cylindrical metal member
  • the insulating sleeve 330 is a resin member with a cylindrical distal end 330a and a square cylindrical base end 330b.
  • the distal end portion 330a of the insulating sleeve 330 fits into the through hole 212 formed in the base portion 210, and the base end portion 330b fits into the through hole 222 of the radiation fin 220, so that the electrode rod 310 is inserted into the insulating sleeve 330. (that is, the insulating sleeve 330 is attached to the outer peripheral surface of the electrode rod 310), and is inserted into the through hole 211 of the heat sink 200 (FIG. 1(d), FIG. 2).
  • protrusions 332 protruding outward are formed on both end surfaces of the insulating sleeve 330 in the Y-axis direction, respectively, and the electrode member 300
  • the protrusion 332 engages with the recess 224 of the radiation fin 220, and movement of the electrode member 300 in the Z-axis direction is restricted.
  • the electrode member 300 is configured not to fall off from the heat sink 200.
  • the tips of the electrode rod 310 and the insulating sleeve 330 are located on the same plane as the surface (placing surface) of the heat sink 200, or are located closer to the surface of the heat sink 200.
  • the electrode rod 310 and the base end 330b of the insulating sleeve 330 are arranged to protrude from the back side of the heat sink 200 (FIG. 2(b)).
  • the light irradiation device 1 of this embodiment is assembled with the electrode member 300 attached to the through hole 211. That is, the heat sink 200 with the electrode member 300 attached to the through hole 211 is prepared, heat dissipation grease is applied to the surface (mounting surface) of the heat sink 200, and each LED module 100 is mounted. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode rod 310 (on the Z-axis direction side) (that is, so that the through hole 120 communicates with the through hole 211), and the through hole 120 Attach the fixing screw 320.
  • the threaded portion 321 of the fixing screw 320 is screwed into the screw hole portion 310a (FIG. 1(d)) formed on the inner peripheral surface of the electrode rod 310, and the LED module 100 is , is held and fixed between the head of the fixing screw 320 and the heat sink 200 (FIG. 1(d)).
  • the base end 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and fits into the through hole 222 of the radiation fin 220, so that it cannot be fixed. Even if the screw 320 is rotated, the electrode member 300 does not rotate, and the fixing screw 320 can be easily attached and detached.
  • the cathode pattern KP is electrically connected to the electrode rod 310 via the fixing screws 320.
  • the anode pattern AP is electrically connected to the electrode rod 310 via the fixing screw 320. Therefore, when driving current for the LED elements 110 is supplied from the driver circuit connected to the pair of electrode rods 310, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.
  • the electrode member 300 serves both to fix the substrate 105 and to supply power. Therefore, there is no need to provide a dedicated member for supplying power to the board 105, and it is possible to downsize the light irradiation device 1 (circuit board fixing structure 10). Furthermore, even if it becomes necessary to replace the LED module 100 due to a failure of the LED module 100, the task is simply to remove the fixing screw 320 and replace the LED module 100 (in other words, the LED module 100 is powered (Because there is no need to connect special members for supplying the LED or perform wiring, etc.), it is possible to replace the LED module 100 with a simple operation.
  • the base end 330b of the insulating sleeve 330 of the electrode member 300 has a square cylindrical shape and is fitted into the through hole 222 of the radiation fin 220.
  • the electrode member 300 does not rotate, and the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the radiation fin 220 to restrict movement of the electrode member 300 in the Z-axis direction, so it is fixed.
  • the work of attaching and detaching the screw 320 can also be easily performed.
  • the light irradiation device 1 has been described as having the circuit board fixing structure 10, but the use of the circuit board fixing structure 10 is not limited to this, and the use of the circuit board fixing structure 10 is not limited to this.
  • the present invention can be applied to a device having a configuration in which a circuit board is supported on a base plate (base plate).
  • the light irradiation device 1 of the present embodiment has been described as having two LED modules 100, it is not limited to this, and the number of LED modules 100 may vary according to the specifications of the light irradiation device 1. Set as appropriate.
  • the light irradiation device 1 of the present embodiment has been described as one that emits ultraviolet light, it is not limited to such a configuration, and the present invention is a light source device that emits visible light or infrared light. It is also possible to apply it to
  • FIG. 4 is a diagram illustrating a schematic configuration of a light irradiation device 2 including a circuit board fixing structure 20 according to a second embodiment of the present invention
  • FIG. 4(a) is a front view
  • FIG. 4(b) is a front view
  • ) is a sectional view taken along line BB in FIG. 4(a)
  • FIG. 4(c) is a sectional view taken along line CC in FIG. 4(a).
  • the electrode member 300 is rotated by 90 degrees, and the protrusion 332 of the insulating sleeve 330 is aligned with the X-axis direction and the X-axis direction.
  • the light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that the light irradiation device 1 is arranged so as to protrude in opposite directions. Furthermore, in this embodiment, instead of the recess 224 of the radiation fin 220, an opening 226 ( The light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that a storage portion) is formed.
  • the base end 330b of the insulating sleeve 330 of the electrode member 300 has a rectangular cylindrical shape and is fitted into the through hole 222 of the radiation fin 220.
  • the electrode member 300 does not rotate.
  • the fixing screw 320 can be attached and detached similarly to the first embodiment. Work can be done easily.
  • FIG. 5 is a diagram illustrating a schematic configuration of a light irradiation device 3 including a circuit board fixing structure 30 according to a third embodiment of the present invention
  • FIG. 5(a) is a front view
  • FIG. 5(b) is a front view
  • ) is a sectional view taken along line DD in FIG. 5(a)
  • FIG. 5(c) is an enlarged view of portion E in FIG. 5(b).
  • the tip 330a of the electrode member 300 is longer than that of the first embodiment, and the tip of the insulating sleeve 330 is longer than that of the first embodiment.
  • the light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that a compression spring 340 (biasing member) is provided on the outer peripheral surface of the light irradiation device 330a. More specifically, when the compression spring 340 of this embodiment is attached to the tip 330a of the electrode member 300 (that is, the compression spring 340 is wound around the tip 330a), the electrode member 300 is attached to the heat sink 200.
  • the electrode member 300 is inserted into the through hole 211.
  • the protrusion 332 engages with the recess 224 of the radiation fin 220, and the movement of the electrode member 300 in the Z-axis direction is restricted.
  • the compression spring 340 is compressed, the distal end thereof contacts the back surface of the base portion 210 of the heat sink 200, and the other end thereof contacts the stepped portion 330c between the distal end portion 330a and the proximal end portion 330b of the electrode member 300. It has become.
  • the electrode member 300 of this embodiment is attached to the through hole 211 of the heat sink 200, the electrode member 300 is biased in a direction opposite to the Z-axis direction by the biasing force of the compression spring 340 (that is, the electrode member 300 is biased toward the substrate 105). (The electrode member 300 is urged away from the electrode member 300.) Therefore, even if there is play in the Z-axis direction between the protrusion 332 and the recess 224, it is canceled.
  • the biasing force of the compression spring 340 is also applied to the fixing screw 320, so that the LED module 100 also moves in a direction opposite to the Z-axis direction (that is, the base of the heat sink 200 210), and the LED module 100 is reliably brought into close contact with the heat sink 200.
  • the base end 330b of the insulating sleeve 330 of the electrode member 300 has a rectangular cylindrical shape and is fitted into the through hole 222 of the radiation fin 220. At the same time, the electrode member 300 does not rotate. Further, since the protrusion 332 of the insulating sleeve 330 engages with the recess 224 of the radiation fin 220 to restrict movement of the electrode member 300 in the Z-axis direction, the fixing screw 320 can be attached and detached similarly to the first embodiment. Work can be done easily.
  • FIG. 6 is a diagram illustrating a schematic configuration of a light irradiation device 4 including a circuit board fixing structure 40 according to a fourth embodiment of the present invention
  • FIG. 6(a) is a front view
  • FIG. 6(b) is a front view
  • ) is a cross-sectional view taken along line FF in FIG. 6(a)
  • FIG. 6(c) is an enlarged view of section G in FIG. 6(b).
  • the light irradiation device 4 of this embodiment includes a pair of substrate fixing members arranged on the substrate 105 of each LED module 100 so as to sandwich the LED elements 110 on the substrate 105 from the Y-axis direction.
  • the light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that it includes a functional member 400 (functional member).
  • the board fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 approximately in the center, and is arranged so that the through hole 410 communicates with the through hole 120 of the board 105.
  • the substrate 105 and the heat sink 200 are fastened together with a fixing screw 320 inserted into the heat sink 200 (FIG. 6(c)).
  • the substrate fixing member 400 When each substrate fixing member 400 is fixed by the fixing screw 320, the substrate fixing member 400 is crimped onto the anode pattern AP, and the electrode rod 310 of the anode pattern AP and the anode terminal 300a is connected to the anode pattern AP via the substrate fixing member 400 and the fixing screw 320. are electrically connected. Similarly, the substrate fixing member 400 is crimped onto the cathode pattern KP, and the cathode pattern KP and the electrode rod 310 of the cathode terminal 300b are electrically connected via the substrate fixing member 400 and the fixing screw 320.
  • the mutually opposing side surfaces (side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined to open toward the Z-axis direction.
  • a reflecting mirror 420 is formed in the. Therefore, of the ultraviolet light emitted from the LED element 110, a component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). Therefore, the utilization efficiency of the ultraviolet light emitted from the LED element 110 increases.
  • the substrate fixing member 400 also serves as the reflecting mirror 420, but in other embodiments, the substrate fixing member 400 may have other functions such as a lens holder function. .
  • FIG. 7 is a diagram illustrating a schematic configuration of a light irradiation device 5 including a circuit board fixing structure 50 according to a fifth embodiment of the present invention
  • FIG. 7(a) is a front view
  • FIG. 7(b) is a front view.
  • ) is a rear view
  • FIG. 7(c) is a sectional view taken along line HH in FIG. 7(a)
  • FIG. 7(d) is a sectional view taken along line JJ in FIG. 7(a).
  • FIG. 7(e) is a cross-sectional view taken along the line KK in FIG. 7(d).
  • FIG. 8 is an exploded perspective view of the light irradiation device 5 of FIG. 7,
  • FIG. 8(a) is a view seen diagonally from the front, and
  • FIG. 8(b) is a view seen diagonally from the rear.
  • the light irradiation device 5 of this embodiment includes a water-cooled heat sink 500 instead of the air-cooled heat sink 200, and the electrode member 300 (anode terminal 300a and cathode terminal 300b) has a different shape.
  • the light irradiation device 1 differs from the light irradiation device 1 of the first embodiment in that it includes different electrode members 600 (an anode terminal 600a and a cathode terminal 600b) and a back fixing plate 700.
  • the water-cooled heat sink 500 is a thin plate-shaped cooling device parallel to the XY plane that is disposed in close contact with the back surface of the substrate 105 of the LED module 100 and radiates heat generated by each LED element 110.
  • a water channel 550 (flow path) that reciprocates in the X-axis direction approximately at the center of the water-cooled heat sink 500 is formed (FIG. 7(e)), and a refrigerant (for example, water) flows through the water-cooled heat sink 500.
  • Water is supplied from a water supply port 552 formed on the back surface of the water bottle 500, flows through a water channel 550, and is discharged from a drain port 554.
  • the water-cooled heat sink 500 has a through hole 511 (second through hole) that penetrates from the surface of the water-cooled heat sink 500 perpendicularly (in a direction opposite to the Z-axis direction) so as to communicate with the through hole 120 of the substrate 105.
  • the electrode member 600 is accommodated in the through hole 511 (FIGS. 7(c), (d), (e), and FIG. 8).
  • the through hole 511 of this embodiment is a long hole with a substantially oval cross section so as to fit with the electrode member 600.
  • the electrode member 600 of this embodiment includes an electrode rod 610, a fixing screw 620, and an insulating sleeve 630.
  • the electrode rod 610 is a cylindrical metal member
  • the insulating sleeve 630 is a resin member that accommodates the electrode rod 610.
  • the insulating sleeve 630 has a main body part 630b having an oval shape in XY cross section and has two flat parts 632 obtained by cutting a cylinder along two XZ planes, and protrudes forward (in the Z-axis direction) from the main body part 630b. It has a cylindrical tip 630a.
  • the insulating sleeve 630 is adapted to fit into a through hole 511 formed in the water-cooled heat sink 500, and the electrode rod 610 is inserted and fixed into the insulating sleeve 630 (that is, the insulating sleeve 630 is attached to the outer peripheral surface of the electrode rod 610). is attached) and inserted into the through hole 511 of the water-cooled heat sink 500 (FIGS. 7(c), (d), FIG. 8).
  • the electrode member 600 is inserted until the tip 630a of the insulating sleeve 630 touches the tip of the through hole 511 formed in the water-cooled heat sink 500, the electrode member 600 is completely accommodated in the through hole 511. (Fig. 7(c), (d)).
  • the back surface fixing plate 700 is a resin or metal plate-shaped member that is fixed to the back surface of the water-cooled heat sink 500 with screws (not shown) or adhesive.
  • the back fixing plate 700 has a circular opening 710 that is slightly larger than the outer diameter of the electrode rod 610, and is fixed so that the electrode rod 610 is exposed from the opening 710.
  • the back fixing plate 700 is configured to come into contact with the main body 630b of the insulating sleeve 630 (that is, the back fixing plate 700 prevents the electrode member 600 from moving in the Z-axis direction. movement is regulated), and the electrode member 600 is prevented from falling off the water-cooled heat sink 500 (FIGS. 7(c) and 7(d)).
  • the light irradiation device 5 of this embodiment is assembled with the electrode member 600 attached to the through hole 511. That is, the water-cooled heat sink 500 with the electrode member 600 attached to the through-hole 511 is prepared, heat dissipation grease is applied to the surface (placing surface) of the water-cooled heat sink 500, and each LED module 100 is mounted. Then, alignment is performed so that the through hole 120 of the substrate 105 is located above the electrode rod 610 (on the Z-axis direction side) (that is, so that the through hole 120 communicates with the through hole 511), and the through hole 120 Attach the fixing screw 620.
  • the fixing screw 620 When the fixing screw 620 is attached to the through hole 120, the threaded portion 621 of the fixing screw 620 is screwed into a screw hole (not shown) formed on the inner peripheral surface of the electrode rod 610, and the LED module 100 is attached to the fixing screw 620. and the water-cooled heat sink 500 and is fixed therebetween.
  • the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has an oval-shaped cross section and is fitted into the through hole 511, so that the fixing screw 620 cannot be rotated. Even if the electrode member 600 is rotated, the fixing screw 620 can be easily attached and detached.
  • the cathode pattern KP is electrically connected to the electrode rod 610 (cathode terminal 600b) via the fixing screw 620.
  • the anode pattern AP is electrically connected to the electrode rod 610 (anode terminal 600a) via the fixing screw 620. Therefore, when driving current for the LED elements 110 is supplied from the driver circuit connected to the pair of electrode rods 610, power is supplied to each LED element 110 via the anode pattern AP and the cathode pattern KP.
  • the electrode member 600 serves both to fix the substrate 105 and to supply power. Therefore, there is no need to provide a dedicated member for supplying power to the board 105, and the light irradiation device 5 (circuit board fixing structure 50) can be downsized. Furthermore, even if it becomes necessary to replace the LED module 100 due to a failure of the LED module 100, the task is simply to remove the fixing screw 620 and replace the LED module 100 (in other words, if the LED module 100 is powered (Because there is no need to connect special members for supplying the LED or perform wiring, etc.), it is possible to replace the LED module 100 with a simple operation.
  • the electrode member 600 does not rotate in accordance with the rotation of the fixing screw 620, and the movement of the electrode member 600 in the Z-axis direction is restricted by the back fixing plate 700, so that the electrode member 600 cannot be fixed.
  • the work of attaching and detaching the screw 620 can also be easily performed.
  • FIG. 9 is a diagram illustrating a schematic configuration of a light irradiation device 6 including a circuit board fixing structure 60 according to a sixth embodiment of the present invention, in which FIG. 9(a) is a front view and FIG. 9(b) is a front view. ) is a rear view, FIG. 9(c) is a sectional view taken along line LL in FIG. 9(a), and FIG. 9(d) is a sectional view taken along line MM in FIG. 9(a). , FIG. 9(e) is a cross-sectional view taken along the line NN in FIG. 9(d).
  • the insulating sleeve 630 As shown in FIGS. 9(b), (c), (d), and (e), in the light irradiation device 6 of this embodiment, the insulating sleeve 630
  • the main body part 630b of the insulating sleeve 630 has a cylindrical shape;
  • the light irradiation device 5 differs from the light irradiation device 5 of the fifth embodiment in that the opening 710 of the fixed plate 700 has a rectangular shape, and the rear end 630c fits into the opening 710.
  • the rear end 630c of the insulating sleeve 630 of the electrode member 600 has a rectangular cylindrical shape and is fitted into the opening 710 of the back fixing plate 700, so that the fixing screw 620
  • the electrode member 600 does not rotate in accordance with the rotation of the electrode member 600.
  • a part of the proximal end surface of the main body portion 630b of the insulating sleeve 630 comes into contact with the back surface fixing plate 700, and movement of the electrode member 600 in the Z-axis direction is restricted. Therefore, as in the fifth embodiment, the fixing screw 620 can be easily attached and detached (FIGS. 9(c) and 9(d)).
  • FIG. 10 is a diagram illustrating a schematic configuration of a light irradiation device 7 including a circuit board fixing structure 70 according to a seventh embodiment of the present invention
  • FIG. 10(a) is a front view
  • FIG. 10(b) is a front view
  • ) is a sectional view taken along line OO in FIG. 10(a)
  • FIG. 10(c) is a sectional view taken along line PP in FIG. 10(b).
  • the cross-sectional shape of the through hole 511 of the water-cooled heat sink 500 is substantially rectangular. This is different from device 5.
  • the main body portion 630b of the insulating sleeve 630 of the electrode member 600 has an oval-shaped cross section and is fitted into the through hole 511, so that the electrode is rotated in accordance with the rotation of the fixing screw 620. Member 600 does not rotate. Furthermore, since the proximal end surface of the insulating sleeve 630 comes into contact with the back fixing plate 700 and movement of the electrode member 600 in the Z-axis direction is restricted (FIG. 10(b)), it is easy to attach and detach the fixing screw 620. be able to.
  • FIG. 11 is a diagram illustrating a schematic configuration of a light irradiation device 8 including a circuit board fixing structure 80 according to an eighth embodiment of the present invention, FIG. 11(a) is a front view, and FIG. 11(b) ) is a sectional view taken along the QQ line in FIG. 11(a).
  • the light irradiation device 8 of this embodiment includes a pair of substrate fixing members arranged on the substrate 105 of each LED module 100 so as to sandwich the LED elements 110 on the substrate 105 from the Y-axis direction.
  • the light irradiation device 5 is different from the light irradiation device 5 of the fifth embodiment in that it includes the light irradiation device 400.
  • the board fixing member 400 is a metal rectangular plate-shaped member having a through hole 410 approximately in the center, and is arranged so that the through hole 410 communicates with the through hole 120 of the board 105.
  • the substrate 105 and the water-cooled heat sink 500 are fastened together by fixing screws 620 inserted into the substrate 105 (FIG. 11(b)).
  • the substrate fixing member 400 When each substrate fixing member 400 is fixed by the fixing screw 620, the substrate fixing member 400 is crimped onto the anode pattern AP (not shown in FIG. 11), and the anode pattern AP is connected to the anode pattern AP via the substrate fixing member 400 and the fixing screw 620.
  • the electrode rod 610 of the anode terminal 600a is electrically connected.
  • the substrate fixing member 400 is crimped onto the cathode pattern KP (not shown in FIG. 11), and the cathode pattern KP and the electrode rod 610 of the cathode terminal 600b are electrically connected via the substrate fixing member 400 and fixing screws 620. Connected.
  • the mutually opposing side surfaces (side surfaces facing the LED element 110) of the pair of substrate fixing members 400 are tapered surfaces that are inclined to open toward the Z-axis direction.
  • a reflecting mirror 420 is formed in the. Therefore, of the ultraviolet light emitted from the LED element 110, a component with a large divergence angle is incident on the reflection mirror 420, reflected, and guided forward (in the Z-axis direction). Therefore, the utilization efficiency of the ultraviolet light emitted from the LED element 110 increases.
  • the task is simply to remove the fixing screw 620 and replace the LED module 100, so the LED module 100 can be replaced with a simple task. It becomes possible to do so.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne une structure de fixation de carte de circuit imprimé de petite taille qui permet le remplacement facile d'une carte de circuit imprimé sur une base.　Cette structure de fixation de carte de circuit imprimé, destinée à fixer une carte de circuit imprimé à une surface d'une base, comprend : un motif positif et un motif négatif formés sur la surface de la carte de circuit imprimé pour alimenter électriquement la carte de circuit imprimé ; une paire de premiers trous traversants passant à travers la carte de circuit imprimé à partir du motif positif et du motif négatif, respectivement ; une paire de seconds trous traversants passant à travers la base verticalement de façon à se raccorder aux premiers trous traversants ; une paire d'éléments électrodes respectivement insérés à travers les seconds trous traversants ; et une paire d'éléments de fixation solidarisés aux éléments électrodes respectifs pour fixer la carte de circuit imprimé à la base. Chaque élément électrode comprend : une borne d'électrode s'étendant le long du second trou traversant ; et un élément isolant qui est agencé pour recouvrir la périphérie externe de la borne d'électrode, qui isole la borne d'électrode de la base, et qui limite la rotation de chaque élément électrode par rapport au second trou traversant. Lorsque chaque élément de fixation et chaque élément électrode sont solidarisés, le motif d'électrode positif et le motif d'électrode négatif sont électriquement connectés chacun à chaque borne d'électrode avec chaque élément de fixation entre eux.
PCT/JP2023/010487 2022-03-19 2023-03-17 Structure de fixation de carte de circuit imprimé et dispositif d'émission de lumière WO2023182190A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022044767A JP2023138198A (ja) 2022-03-19 2022-03-19 回路基板固定構造、光照射装置
JP2022-044767 2022-03-19

Publications (1)

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WO2023182190A1 true WO2023182190A1 (fr) 2023-09-28

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PCT/JP2023/010487 WO2023182190A1 (fr) 2022-03-19 2023-03-17 Structure de fixation de carte de circuit imprimé et dispositif d'émission de lumière

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JP (1) JP2023138198A (fr)
WO (1) WO2023182190A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175608A (ja) * 2012-02-24 2013-09-05 Stanley Electric Co Ltd ヒートシンク及びこれを備えた照明装置
WO2013168253A1 (fr) * 2012-05-09 2013-11-14 テイ・エス テック株式会社 Dispositif électroluminescent
JP2020109719A (ja) * 2018-12-29 2020-07-16 Hoya株式会社 回路基板支持構造、及びこれを備える光照射装置
JP2020123504A (ja) * 2019-01-30 2020-08-13 Hoya株式会社 回路基板固定構造、及びこれを備える光照射装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013175608A (ja) * 2012-02-24 2013-09-05 Stanley Electric Co Ltd ヒートシンク及びこれを備えた照明装置
WO2013168253A1 (fr) * 2012-05-09 2013-11-14 テイ・エス テック株式会社 Dispositif électroluminescent
JP2020109719A (ja) * 2018-12-29 2020-07-16 Hoya株式会社 回路基板支持構造、及びこれを備える光照射装置
JP2020123504A (ja) * 2019-01-30 2020-08-13 Hoya株式会社 回路基板固定構造、及びこれを備える光照射装置

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