WO2023182115A1 - Appareil de traitement de substrat - Google Patents

Appareil de traitement de substrat Download PDF

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Publication number
WO2023182115A1
WO2023182115A1 PCT/JP2023/010208 JP2023010208W WO2023182115A1 WO 2023182115 A1 WO2023182115 A1 WO 2023182115A1 JP 2023010208 W JP2023010208 W JP 2023010208W WO 2023182115 A1 WO2023182115 A1 WO 2023182115A1
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WO
WIPO (PCT)
Prior art keywords
carrier
section
processing
substrate
substrates
Prior art date
Application number
PCT/JP2023/010208
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English (en)
Japanese (ja)
Inventor
賢治 天久
進一 谷口
旭紘 岩▲崎▼
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2023182115A1 publication Critical patent/WO2023182115A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a substrate processing apparatus that processes a plurality of substrates in a processing tank.
  • FPD Full Panel Display
  • OLED Electro Luminescence
  • optical disk substrates such as liquid crystal display devices or organic EL (Electro Luminescence) display devices
  • magnetic disk substrates such as magneto-optical disk substrates
  • magneto-optical disk substrates such as magneto-optical disks
  • photomask substrates such as ceramic substrates, or solar panels.
  • Substrate processing apparatuses are used to perform various treatments on substrates such as battery substrates.
  • a batch-type substrate processing apparatus in which a plurality of substrates are immersed in a processing liquid stored in a processing tank and subjected to processing such as etching.
  • a batch-type substrate processing apparatus described in Patent Document 1 includes a substrate processing section.
  • the substrate processing section has a configuration in which a first chemical solution tank, a first rinsing solution tank, a second chemical solution tank, a second rinsing solution tank, and a drying processing section are arranged in this order on a straight line.
  • the first delivery position and the second delivery position are set so as to be further aligned on a straight line from the drying processing part of the substrate processing part.
  • a plurality of unprocessed substrates carried into the substrate processing apparatus are received by the main transport mechanism at the first delivery position and transported to the substrate processing section.
  • the plurality of unprocessed substrates are transported, for example, to a position above the first chemical tank or the second chemical tank. Further, the plurality of substrates are immersed in a chemical solution in a tank located below for a predetermined time and then pulled up. Thereafter, the plurality of substrates are transported to a position above the first rinsing liquid tank or the second rinsing liquid tank. Further, the plurality of substrates are immersed in a rinsing liquid in a tank located below for a predetermined time and then pulled up.
  • the plurality of substrates After being treated with the chemical in the first chemical tank or the second chemical tank, the plurality of substrates are transported to the drying processing section. After the drying process by the drying process section, the plurality of substrates are taken out from the second delivery position and carried out from the substrate processing apparatus.
  • a chuck cleaning unit is provided at the first transfer position, and a plurality of substrate transfer mechanisms are arranged side by side of the first transfer position (in a direction perpendicular to the above-mentioned one straight line). It is provided.
  • two substrate transfer mechanisms are provided at the second transfer position, and a plurality of substrate transfer mechanisms are arranged side by side of the second transfer position (in a direction perpendicular to the above-mentioned one straight line).
  • a hoop holding section is provided near the plurality of substrate transfer mechanisms.
  • the hoop holding unit is configured to be able to hold a container (FOUP) that accommodates a plurality of substrates, and includes an opener that opens and closes the lid of the container.
  • FOUP container
  • a plurality of structures (a chuck cleaning unit, a plurality of substrate transfer mechanisms, and a hoop holding section) provided in the first and second transfer positions and their surroundings in the above-mentioned substrate processing apparatus are provided adjacent to each other. . Therefore, it is difficult to secure a sufficiently large maintenance space for each configuration, and therefore the workability of maintenance is low.
  • the first delivery position and the second delivery position so as to sandwich the substrate processing section. It will be done.
  • a new conveyance path is created to connect the hoop holding part and the first delivery position, or to connect the hoop holding part and the second delivery position. It is necessary to provide a new transport route.
  • providing a new transport path in the substrate processing apparatus may increase the footprint of the substrate processing apparatus.
  • An object of the present invention is to provide a substrate processing apparatus that can improve the workability of maintenance of each part of the substrate processing apparatus while suppressing the expansion of the footprint.
  • a substrate processing apparatus includes a substrate loading/unloading section configured to be able to carry in a plurality of substrates and to be able to carry out a plurality of substrates, and a substrate loading/unloading section extending in parallel in a first direction from the substrate loading/unloading section.
  • the transport section has a first end and a second end arranged in order in the first direction, and the transport section has a plurality of substrates carried into the substrate loading/unloading section.
  • the carrier containing the carrier is configured to be transportable in a first direction from the first end to the second end, and the processing section includes a third end and a fourth end that are arranged in order in the first direction.
  • a maintenance space for the processing section is formed adjacent to at least a portion of the processing section in the third direction, and the transport section overlaps at least a portion of the processing section and the maintenance space in a plan view.
  • a plurality of unprocessed substrates are loaded into the substrate loading/unloading section.
  • the plurality of substrates are transported in the first direction from the first end to the second end of the transport section while being accommodated in the carrier.
  • the plurality of substrates transported to the second end of the transport section are transported in the second direction from the fourth end to the third end of the processing section while being accommodated in the carrier.
  • the carrier accommodating the plurality of substrates is immersed between the fourth end and the third end in at least one of the plurality of processing liquids respectively stored in the plurality of processing tanks. Thereby, a predetermined process is commonly performed on a plurality of substrates housed in the carrier.
  • the plurality of substrates after being processed are transferred to a substrate loading/unloading section and then transported out.
  • the third end and the fourth end of the processing section are separated with the plurality of processing tanks in between, there is no need for passing the substrate to the fourth end of the processing section.
  • the structure and the structure for removing the substrate from the third end of the processing section are not provided in close proximity. Furthermore, a maintenance space is formed adjacent to at least a portion of the processing section. Therefore, it is possible to easily secure a sufficiently large maintenance space for each part of the substrate processing apparatus. Furthermore, according to the above configuration, there is no need to provide the transport section at a position away from the processing section and the maintenance space in plan view.
  • the processing unit may allow movement of the carrier in the second direction and restrict movement of the carrier in the first direction.
  • the moving direction of the carrier in the processing section is limited to the second direction.
  • the length of the carrier transport path in the processing section in plan view is the same as that between the third end and the fourth end of the processing section. Do not exceed the distance between Therefore, the carrier transport path is prevented from becoming excessively long.
  • the maintenance space may be formed adjacent to the plurality of processing tanks, and the transport section may be provided at a position above the maintenance space and the plurality of processing tanks.
  • the transport section since the maintenance space is adjacent to the plurality of processing tanks, the workability of maintenance for the plurality of processing tanks is improved.
  • the transport section since the transport section is provided above the maintenance space and the plurality of processing tanks, particles generated in the maintenance space and the plurality of processing tanks are prevented from adhering to the plurality of substrates being transported.
  • the transport section may overlap at least a portion of the maintenance space in a plan view, and may not overlap the processing section in a plan view. In this case, the space above the maintenance space can be effectively utilized. Furthermore, since the conveyance section is not provided above the processing section, the degree of freedom in designing the treatment section in the height direction is not limited by the conveyance section.
  • the substrate processing apparatus further includes a first transport device that transports the carrier from the second end of the transport section to the fourth end of the processing section, and the substrate loading/unloading section is , a substrate insertion section that is provided adjacent to the first end of the transport section and inserts the plurality of unprocessed substrates carried into the substrate loading/unloading section into the empty carrier; A substrate that is provided adjacent to the third end of the processing section and is taken out to carry out the plurality of processed substrates housed in the carrier passed from the processing section from the substrate loading/unloading section.
  • the device may include a take-out part and a second transport device that transports the empty carrier from which the plurality of substrates have been taken out from the board take-out part to the board insertion part.
  • a plurality of unprocessed substrates are accommodated in an empty carrier in the substrate insertion section.
  • the carrier containing the plurality of substrates is transported to the fourth end of the processing section by the transport section and the first transport device. Further, the carrier is transported from the fourth end to the third end within the processing section. Thereafter, a plurality of processed substrates are taken out from the carrier in which the processed substrates are stored in the substrate removal section.
  • the empty carrier is transported to the board insertion section by the second transport device. Thereby, the empty carrier transported to the substrate insertion section can be used for processing a plurality of new substrates. Therefore, there is no need to prepare an excessive number of carriers for accommodating a plurality of substrates.
  • the carrier cleaning unit may further include a carrier cleaning unit that cleans an empty carrier from which a plurality of substrates have been taken out after being processed by the processing unit.
  • the clean carrier after cleaning can be used to process a plurality of new substrates.
  • FIG. 1 is a schematic plan view showing the basic configuration of a substrate processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus taken along line AA in FIG.
  • FIG. 3 is a plan view of a carrier used in the substrate processing apparatus of FIG. 1.
  • FIG. 4 is a side view of the carrier of FIG. 3.
  • FIG. 5 is a cross-sectional view of the carrier taken along line BB in FIG. 4.
  • FIG. 6 is a diagram for explaining transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG.
  • FIG. 7 is a diagram for explaining transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG. 1.
  • FIG. 8 is a diagram for explaining transport paths of a plurality of substrates and carriers in the substrate processing apparatus of FIG. 1.
  • substrates include FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disks.
  • FPD Full Panel Display
  • organic EL Electro Luminescence
  • semiconductor substrates semiconductor substrates
  • optical disk substrates optical disk substrates
  • magnetic disk substrates magnetic disk substrates
  • magneto-optical disks Refers to substrates, photomask substrates, ceramic substrates, solar cell substrates, etc.
  • the substrate described below has a rectangular shape in plan view.
  • FIG. 1 is a schematic plan view showing the basic configuration of a substrate processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus 1 taken along line AA in FIG.
  • the substrate processing apparatus 1 mainly includes a substrate loading/unloading block 100, a relay block 200, a processing block 300, and a cleaning block 400.
  • arrows indicating the X direction, Y direction, and Z direction which are orthogonal to each other, are added to the predetermined figures after FIG. 1 and FIG. 2. are doing.
  • the X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.
  • the direction in which the arrow heads is defined as a + direction
  • the direction opposite to the + direction is defined as a - direction.
  • the X direction when simply referred to as the X direction, the X direction includes the +X direction and the ⁇ X direction.
  • the Y direction includes the +Y direction and the ⁇ Y direction.
  • the Z direction includes the +Z direction and the -Z direction.
  • the substrate loading/unloading block 100 includes a plurality of hoop shelves 110, hoop transport devices 111, 112, openers 120, 130, substrate delivery robots 140, 150, two hoop placement units 190, and a control unit 160 (FIG. 2). . Further, the substrate loading/unloading block 100 has an end surface portion 101, one side surface portion 102, and the other side surface portion 103, which constitute a part of the outer wall of the substrate processing apparatus 1.
  • the end surface section 101 is located at one end of the substrate processing apparatus 1 facing the -X direction, and is orthogonal to the X direction.
  • the one side surface portion 102 and the other side surface portion 103 extend parallel to the +X direction from both ends of the end surface portion 101 in a plan view so as to face each other in the Y direction.
  • the two hoop placement parts 190 are provided so as to protrude from the end face part 101 in the -X direction.
  • Each hoop placement section 190 is configured to be able to place a FOUP (Front Opening Unified Pod) 8 that accommodates a plurality of substrates in multiple stages.
  • FOUP Front Opening Unified Pod
  • passage openings (not shown) for allowing the hoop 8 to pass in the X direction are formed in portions corresponding to the respective hoop placement portions 190.
  • the hoop 8 is formed with openings for taking out the substrate from the internal space of the hoop 8 and for inserting the substrate into the internal space of the hoop 8. Further, the hoop 8 includes a lid for opening and closing its opening. The opening of the hoop 8 is closed when the hoop 8 is transported and on standby, and is opened when the substrate is taken out and inserted into the hoop 8.
  • the hoop 8 is hatched and the carrier 9 is marked with a dot pattern so that the hoop 8 and a carrier 9, which will be described later, can be clearly distinguished.
  • the hoop 8 is placed on one of the two hoop placement sections 190 lined up in the Y direction, and the hoop 8 is placed on the other hoop placement section 190. do not have.
  • the plurality of hoop shelves 110 are provided at positions spaced apart from each other by a predetermined distance in the +X direction from the end surface portion 101.
  • 16 hoop shelves 110 are fixed by fixing members (not shown) so that they are lined up in 4 rows and 4 columns in a plane parallel to the Z direction and the Y direction.
  • Each hoop shelf 110 is configured such that a hoop 8 can be placed thereon.
  • the hoop 8 is placed on each of the three hoop shelves 110 among the four hoop shelves 110 located at the top, and the hoop 8 is placed on the remaining one hoop shelf 110.
  • the number of hoops 8 and the arrangement of hoop shelves 110 may be changed as appropriate depending on the device design specifications.
  • the two openers 120 and 130 are provided at positions separated from each other by a predetermined distance in the +X direction from the plurality of hoop shelves 110.
  • two openers 120 and 130 are fixed by a fixing member (not shown) so as to be lined up in the Y direction.
  • One opener 120 is located near one side 102
  • the other opener 130 is located near the other side 103 .
  • Each opener 120, 130 is configured to be able to place the hoop 8 thereon and open/close the lid of the hoop 8 placed thereon.
  • the hoop 8 is placed on one opener 120, and no hoop 8 is placed on the other opener 130.
  • the substrate transfer robot 140 is provided adjacent to the opener 120 in the +X direction.
  • the substrate transfer robot 140 is configured to be rotatable around an axis in the Z direction and movable in the Z direction (capable of moving up and down).
  • the substrate transfer robot 140 is provided with a hand for transferring one or more substrates.
  • the hand is supported by an articulated arm and can move forward and backward in the horizontal direction.
  • the substrate delivery robot 140 takes out the substrate from the hoop 8 with the hoop 8 containing unprocessed substrates placed on the opener 120, and transfers the taken out substrate to a carrier, which will be described later, arranged in the relay block 200. Used for insertion into 9.
  • the substrate transfer robot 150 is provided adjacent to the opener 130 in the +X direction.
  • the substrate transfer robot 150 has the same configuration as the substrate transfer robot 140. With the empty hoop 8 placed on the opener 130, the substrate delivery robot 150 takes out the substrate from a carrier 9, which will be described later, placed in the relay block 200, and places the taken out substrate into the hoop 8 on the opener 130. Used for insertion.
  • the hoop conveyance device 111 is located between the end surface portion 101 and the plurality of hoop shelves 110 in the X direction.
  • the hoop conveying device 111 has a gripping part (not shown) configured to be able to grip the hoop 8, and is configured to be able to move the gripping part in the Y direction and in the Z direction. Thereby, the hoop transport device 111 transports the hoop 8 between one of the two hoop placement sections 190 and one of the plurality of hoop shelves 110.
  • the hoop transport device 112 is located between the multiple hoop shelves 110 and the two openers 120 and 130 in the X direction.
  • the hoop transport device 112 has the same configuration as the hoop transport device 111.
  • the hoop transport device 112 transports the hoop 8 between one of the plurality of hoop shelves 110 and one of the two openers 120 and 130.
  • the control unit 160 (FIG. 2) is composed of a computer including a CPU (central processing unit), ROM (read only memory), and RAM (random access memory), and controls the operation of each component in the substrate processing apparatus 1. do.
  • the relay block 200 mainly includes two carrier support sections 210 and 220, a first standby section 230, a second standby section 240, and a standby transport device 250.
  • the carrier support section 210 is provided adjacent to the substrate transfer robot 140 of the substrate loading/unloading block 100 in the +X direction. Further, the carrier support section 210 is configured to be able to support the carrier 9 that accommodates a plurality of substrates in multiple stages. Details of the carrier 9 will be described later. Further, the carrier support section 210 is configured to support the carrier 9 and to change the attitude of the supported carrier 9. Details of the configuration of the carrier support section 210 for changing the attitude of the carrier 9 will be described later. Note that in the example of FIG. 1, the carrier 9 is supported on the carrier support section 210.
  • the carrier support section 220 is provided adjacent to the substrate transfer robot 150 of the substrate loading/unloading block 100 in the +X direction. Further, the carrier support section 220 has the same configuration as the carrier support section 210. In addition, in the example of FIG. 1, the carrier 9 is not supported on the carrier support part 220.
  • the first standby section 230 is provided adjacent to the carrier support section 210 in the +X direction. Further, the first standby section 230 is configured to be able to support the carrier 9. Further, the first standby section 230 can transfer the carrier 9 supported by the first standby section 230 to the carrier support section 210 and receive the carrier 9 supported by the carrier support section 210 from the carrier support section 210. configured to be possible.
  • the second standby section 240 is provided adjacent to the carrier support section 220 in the +X direction. Further, the second standby section 240 is configured to be able to support the carrier 9. Further, the second standby section 240 can transfer the carrier 9 supported by the second standby section 240 to the carrier support section 220 and receive the carrier 9 supported by the carrier support section 220 from the carrier support section 220. configured to be possible.
  • the standby transport device 250 is provided between the first standby section 230 and the second standby section 240.
  • the standby transport device 250 is configured to be able to hold the carrier 9 and to be movable in the Y direction between the first standby section 230 and the second standby section 240.
  • the standby transport device 250 transports the carrier 9 supported by the second standby section 240 to the first standby section 230, for example.
  • the processing block 300 includes a first transport section 310, a second transport section 320, and a processing section 330.
  • the first transport section 310 and the processing section 330 are arranged in this order in the +Y direction and are provided so as to extend in parallel from the relay block 200 in the +X direction.
  • the second transport section 320 is formed to extend in the Y direction, and connects the end of the first transport section 310 facing the +X direction and the end of the processing section 330 facing the +X direction.
  • first end TA1 first end facing the -X direction
  • the other end facing the + 2 is called the end TA2.
  • one end facing the -X direction is appropriately referred to as a third end TA3
  • the other end facing the +X direction is appropriately referred to as a fourth end TA4. It is called.
  • the first transport unit 310 includes a main transport device 311 and two sub-transport devices 312A and 312B.
  • the main transport device 311 includes a movable stage 311a and a guide rail 311b.
  • the guide rail 311b is provided to extend from the first end TA1 of the first transport section 310 to the second end TA2.
  • the movable stage 311a is configured to be movable in the X direction on the guide rail 311b and to be able to place the carrier 9 thereon.
  • the main transport device 311 further includes a drive mechanism (not shown) that moves the movable stage 311a in the X direction on the guide rail 311b.
  • the main conveyance device 311 moves the placed carrier 9 close to the second conveyance section 320. It is transported in the +X direction to the second end TA2.
  • the sub-transport device 312A and the sub-transport device 312B are provided at the first end TA1 and the second end TA2 of the first transport section 310 in the X direction, respectively.
  • the sub-transfer device 312A moves the carrier 9 onto the movable stage 311a of the main transfer device 311 disposed at the first end TA1. Place it on. Further, the sub-transport device 312A transports the empty carrier 9 from the first standby section 230 to the carrier support section 210.
  • the sub-transport device 312B transfers the carrier 9 to a transport device 321 of the second transport unit 320, which will be described later.
  • the first transport section 310 is provided at a position spaced apart from the installation surface of the substrate processing apparatus 1 in the +Z direction (upward).
  • the space located in the -Z direction (below) of the first transport section 310 can be used as a maintenance space MS1 for maintaining the processing section 330, which will be described later. Therefore, in the substrate processing apparatus 1 according to the present embodiment, as shown in FIG. 1, the first transport section 310 overlaps the maintenance space MS1 of the processing section 330 in plan view.
  • a worker WP is shown who performs maintenance work on the processing section 330 below the first transport section 310 in the maintenance space MS1.
  • the second transport section 320 includes a transport device 321.
  • the transport device 321 is configured to support the carrier 9 and to change the attitude of the supported carrier 9. Details of the configuration of the transport device 321 for changing the attitude of the carrier 9 will be described later.
  • the transport device 321 is configured to be movable in the Y direction. Thereby, the second transport section 320 can receive the carrier 9 from the sub-transport device 312B near the second end TA2 of the first transport section 310. Further, the second transport section 320 can change the attitude of the carrier 9 received from the sub-transport device 312B, and move the carrier 9 to a position near the fourth end TA4 of the processing section 330.
  • the processing section 330 includes a plurality of (five in this example) liquid processing units 331, a drying unit 332, and a plurality of (three in this example) main transport devices 333A, 333B, and 333C.
  • the plurality of liquid processing units 331 and drying units 332 are arranged in the X direction such that the drying unit 332 is located at the third end TA3.
  • the plurality of main transport devices 333A, 333B, and 333C are arranged in this order on a straight line extending in the +X direction from the third end TA3 toward the fourth end TA4.
  • Each of the main transport devices 333A, 333B, and 333C is configured to be able to hold the carrier 9, and is also configured to be able to transport the held carrier 9 between the plurality of liquid processing units 331 and drying units 332.
  • the main transport device 333C located farthest from the relay block 200 receives the carrier 9 when the second transport unit 320 transports the carrier 9 near the processing unit 330. Further, the main transport device 333C transports the received carrier 9 to any one of the plurality of liquid processing units 331.
  • Each of the plurality of liquid processing units 331 includes one or more processing tanks 331a and lifters 331b.
  • Each liquid processing unit 331 in this example includes two processing tanks 331a.
  • Each processing tank 331a is configured such that the carrier 9 can be inserted into and taken out from a position above the processing tank 331a. Further, a processing liquid (chemical liquid or rinsing liquid) for cleaning a plurality of substrates accommodated in the carrier 9 is stored in the processing tank 331a.
  • the lifter 331b of each liquid processing unit 331 is configured to be able to hold the carrier 9. Further, the lifter 331b is configured to be able to receive the carrier 9 from any of the plurality of main transport devices 333A, 333B, 333C, and to pass the carrier 9 to any of the plurality of main transport devices 333A, 333B, 333C. has been done. Further, the lifter 331b is configured to be capable of immersing the carrier 9 in the processing liquid and lifting the carrier 9 from the processing liquid for each of the two processing tanks 331a of the liquid processing unit 331. As a result, the carrier 9 containing unprocessed substrates is passed to the processing section 330, and the plurality of substrates accommodated in the carrier 9 are immersed in one or more processing liquids for a predetermined period of time. Common processing is performed.
  • the drying unit 332 performs a drying process on the carrier 9 transported by the main transport device 333A located closest to the relay block 200. Through this drying process, the plurality of substrates housed in the carrier 9 are dried. The carrier 9 after the drying process is transferred to the second standby section 240 of the relay block 200 by the main conveyance device 333A located closest to the relay block 200.
  • a plurality of processing liquids respectively corresponding to a plurality of treatments to be performed on the substrate are arranged in the -X direction in the order of the processing to be performed on the substrate. It is stored as follows.
  • the control unit 160 in FIG. 2 allows each of the main transport devices 333A, 333B, and 333C to move in the -X direction while holding the carrier 9, and allows the main transport devices 333A, 333B, and 333C to move in the +X direction while holding the carrier 9. Limit movement.
  • a further maintenance space MS2 is formed on the +Y direction side of the processing section 330.
  • a sufficiently large maintenance space for the processing section 330 is ensured.
  • the cleaning block 400 includes a cleaning conveyance device 410 and a carrier cleaning unit 420.
  • the carrier cleaning unit 420 is provided so as to extend in the X direction at a position to the side (+Y direction) of the substrate loading/unloading block 100 and the relay block 200. Further, the carrier cleaning unit 420 includes a plurality of carrier cleaning tanks 421, a carrier drying section 422, and a plurality of carrier waiting sections 423 arranged in the X direction.
  • Each of the plurality of carrier cleaning tanks 421, the carrier drying section 422, and the plurality of carrier waiting sections 423 is configured such that the carrier 9 can be inserted and taken out from a position above the tank, drying section, or waiting section. Further, each of the plurality of carrier cleaning tanks 421 stores a processing liquid (chemical liquid or rinsing liquid) for cleaning the carrier 9. The carrier drying section 422 performs a drying process on the inserted carrier 9.
  • the cleaning conveyance device 410 is configured to be able to convey empty carriers 9 between the second standby section 240 of the relay block 200, the plurality of carrier cleaning tanks 421, the carrier drying section 422, and the plurality of carrier standby sections 423. .
  • an empty carrier 9 is transported between a plurality of carrier cleaning tanks 421 and immersed in a processing liquid stored in one of the carrier cleaning tanks 421. As a result, the empty carrier 9 that has been used to process a plurality of substrates in the processing block 300 is cleaned.
  • the carrier 9 after cleaning is transported to the carrier drying section 422 and subjected to a drying process.
  • the dried carrier 9 is transported to the carrier standby section 423 and held there. Thereafter, in accordance with the timing of receiving a plurality of substrates in the relay block 200, the carrier is taken out from the carrier standby section 423 by the cleaning conveyance device 410 and conveyed to the second standby section 240 of the relay block 200.
  • FIG. 3 is a plan view of the carrier 9 used in the substrate processing apparatus 1 of FIG. 1
  • FIG. 4 is a side view of the carrier 9 of FIG. 3
  • FIG. is a sectional view of the carrier 9 taken along the line BB in FIG. 4.
  • carrier 9 includes four frame members 10a, 10b, 10c, and 10d.
  • Each of the frame members 10a and 10b is formed of a substantially square plate-like member, and has an outer shape larger than the substrate to be processed.
  • Four openings 13 are formed in the central portion of each of the frame members 10a, 10b.
  • Each of the frame members 10c and 10d is formed of a substantially rectangular plate-like member. The length of the long side of frame members 10c, 10d is approximately equal to the length of one side of frame members 10a, 10b.
  • the frame members 10a and 10b are arranged so as to face each other and to be separated from each other.
  • a frame member 10c is provided to connect one side of the frame member 10a and one side of the frame member 10b.
  • a frame member 10d is provided to connect the other side of the frame member 10a and the other side of the frame member 10b. In this state, the frame members 10c and 10d are also arranged to face each other.
  • the carrier 9 has a rectangular tube shape.
  • a rectangular opening formed at one end of the carrier 9 having a rectangular tube shape functions as a substrate entrance/exit 12 for inserting a substrate into the carrier 9 and for taking out the substrate from the carrier 9.
  • a plurality of (six in this example) are arranged so as to connect the frame member 10a and the frame member 10b and to be distributed between the frame member 10c and the frame member 10d. ) support pieces 11 are provided.
  • Each support piece 11 is composed of a long plate member, and is provided in parallel with the frame members 10c and 10d. Furthermore, each support piece 11 has a plurality of grooves (not shown) formed at a predetermined standard pitch into which parts of the outer edges of a plurality of substrates housed in the carrier 9 can be inserted. The number of grooves formed in each support piece 11 is equal to the number of substrates to be accommodated in the carrier 9.
  • a plurality of protrusions pr are formed on each of the two opposing surfaces of the frame members 10c and 10d.
  • the plurality of protrusions pr extend in the direction of the long sides of the frame members 10c and 10d, and are formed to be lined up in the direction of the short sides at the above-mentioned reference pitch. As a result, a groove into which the outer edge of the substrate can be inserted is formed between each two adjacent protrusions pr.
  • the attitude of the carrier 9 is changed as appropriate.
  • a posture in which the plurality of support pieces 11 are located at the lower end and the frame members 10a and 10b are maintained parallel to the vertical direction is referred to as a vertical posture.
  • a posture in which the frame members 10a, 10b are maintained perpendicular to the vertical direction is called a horizontal posture.
  • the plurality of substrates When inserting a plurality of substrates into an empty carrier 9, the plurality of substrates are inserted into the carrier 9 through the substrate entrance/exit 12 of the carrier 9 in a horizontal position. At this time, both sides (two opposing sides) of the outer edge of each board are located between any two of the plurality of protrusions pr of the frame member 10c and among the plurality of protrusions pr of the frame member 10d. inserted between any two.
  • the carrier 9 containing a plurality of substrates when the carrier 9 containing a plurality of substrates is in a horizontal position, each substrate is held with both sides of the substrate supported by the plurality of protrusions pr.
  • the carrier 9 containing a plurality of substrates is in a vertical position, each substrate is held with the plurality of lower end portions of the substrate fitted into the plurality of grooves of the plurality of support pieces 11. .
  • each of the plurality of accommodated substrates is supported entirely on both sides by the plurality of protrusions pr.
  • each of the plurality of accommodated substrates is locally supported by the plurality of support pieces 11 at a plurality of portions at the lower end of the substrate. Therefore, when the carrier 9 is in the horizontal position, the load (load due to the weight of each board) applied to the outer edge of each accommodated board is reduced compared to when the carrier 9 is in the vertical position.
  • the vertical dimension (height) of the carrier 9 in the horizontal position is smaller than the vertical dimension (height) of the carrier 9 in the vertical position. It is formed so that
  • FIGS. 6 to 8 are diagrams for explaining transport routes for a plurality of substrates and carriers 9 in the substrate processing apparatus 1 of FIG. 1. Similar to FIG. 1, FIG. 6 shows a schematic plan view of the substrate processing apparatus 1. FIG. 7 shows a schematic external perspective view of the substrate processing apparatus 1 of FIG. 1 when viewed in one direction. FIG. 8 shows a schematic external perspective view of the substrate processing apparatus 1 of FIG. 1 viewed from another direction. Note that in FIGS. 7 and 8, illustration of the cleaning block 400 in FIG. 1 is omitted. Furthermore, in FIGS. 6 to 8, illustrations of the maintenance spaces MS1 and MS2 in FIG. 1 are also omitted, except for the maintenance space MS1 in FIG.
  • a case is assumed in which a series of treatments are performed on a plurality of unprocessed substrates W housed in one hoop 8.
  • one hoop 8 is carried into the substrate loading/unloading block 100, and as shown in FIG. 6, is placed on the opener 120 and the lid is opened.
  • an empty carrier 9 is supported in a horizontal position on the carrier support portion 210 of the relay block 200.
  • the substrate entrance/exit 12 (FIG. 5) of the carrier 9 faces the ⁇ X direction so as to face the hoop 8.
  • the substrate transfer robot 140 takes out a plurality of unprocessed substrates W from one hoop 8 and inserts them into the carrier 9.
  • the transport paths of the plurality of substrates W in this case are shown in FIGS. 6 to 8 by thick dotted arrows a1.
  • the lid of the empty hoop 8 is closed, and the hoop transport device 112 holds the hoop 8 and places it on one of the hoop shelves 110.
  • the carrier 9 containing the plurality of substrates W is received by the carrier support section 210 and placed on the movable stage 311a of the main transport device 311 by the sub transport device 312A of the first transport section 310.
  • the conveyance path of the carrier 9 in this case is shown in FIGS. 6 to 8 by a thick solid arrow a2.
  • the carrier 9 placed on the movable stage 311a moves in the +X direction from a position near the relay block 200 (first end TA1) to a position near the second transport section 320 (second end TA2). transported in a horizontal position.
  • the state of the carrier 9 conveyed by the main conveyance device 311 of the first conveyance section 310 is shown in the balloon BA3 of FIG. 8 .
  • the carrier 9 that has reached a position near the second transport section 320 is transferred to the transport device 321 of the second transport section 320 by the sub transport device 312B of the first transport section 310. Therefore, the attitude of the carrier 9 passed to the transport device 321 is changed from a horizontal attitude to a vertical attitude by the transport device 321.
  • balloon BA2 of FIG. 7 the state of the attitude change of the carrier 9 in the transport device 321 is schematically shown.
  • the transport device 321 includes a movable base 322 and a carrier holder 323.
  • the movable pedestal 322 is provided so as to be movable in the Y direction within the second transport section 320.
  • the carrier holder 323 includes a first holder 323a and a second holder 323b.
  • the first holding portion 323a has a rectangular flat plate shape capable of holding the lower end portion of the carrier 9 when it is in a horizontal position.
  • the second holding portion 323b has a rectangular flat plate shape capable of holding the lower end portion of the carrier 9 when it is in a vertical posture.
  • the first holding part 323a and the second holding part 323b are connected such that one side of the first holding part 323a and one side of the second holding part 323b touch each other and the two holding parts are orthogonal to each other.
  • the movable base 322 holds the carrier so that the first holding part 323a and the second holding part 323b are both parallel to the Y direction, and the carrier holding tool 323 is rotatable around an axis extending in the Y direction. A part of the tool 323 is held.
  • the transport device 321 further includes a drive unit (not shown) that can adjust the rotation angle of the carrier holder 323 on the movable base 322.
  • a drive unit (not shown) that can adjust the rotation angle of the carrier holder 323 on the movable base 322.
  • the transport device 321 further includes a drive unit (not shown) that moves the movable pedestal 322 in the Y direction in the second transport unit 320.
  • a drive unit (not shown) that moves the movable pedestal 322 in the Y direction in the second transport unit 320.
  • the carrier 9 that has reached a position near the processing section 330 is received by the main transport device 333C of the processing section 330 from the transport device 321.
  • the carrier 9 received by the main transport device 333C is transported to one or more liquid processing units 331 by the main transport device 333C and other main transport devices 333B and 333A, and is maintained in a vertical posture. It is immersed in various processing solutions for a predetermined period of time. As a result, the plurality of substrates W accommodated in the carrier 9 are processed according to the immersed processing liquid.
  • a balloon BA4 in FIG. 8 shows the state of the carrier 9 being transported by the main transport devices 333A, 333B, and 333C of the processing section 330.
  • each main transport device 333A, 333B, 333C includes a movable support column 333a and a pair of chuck members 333b.
  • the movable support column 333a is provided on the side (+Y direction side) of the plurality of liquid processing units 331 so as to be movable in the X direction and movable in the Z direction (movable up and down).
  • a pair of chuck members 333b are provided to extend above the liquid processing unit 331 from the upper end of the movable support column 333a.
  • the pair of chuck members 333b are configured to be able to sandwich and hold the carrier 9 in a vertical position.
  • each of the main transport devices 333A, 333B, and 333C has a drive unit (not shown) that can switch between holding the carrier 9 by the pair of chuck members 333b and releasing the carrier 9 from the pair of chuck members 333b.
  • the carrier 9 is delivered between the plurality of main transport devices 333A, 333B, 333C and the plurality of liquid processing units 331.
  • the carrier 9 accommodating the plurality of substrates W treated with the treatment liquid is further transported to a drying unit 332 close to the relay block 200. Thereby, the carrier 9 and the plurality of substrates W in the carrier 9 are dried by the drying unit 332.
  • a series of transport paths of the carrier 9 in the processing block 300 are shown in FIGS. 6 to 8 by thick solid arrows a3.
  • the carrier 9 containing a plurality of processed substrates W is transported from the drying unit 332 to the carrier support section 220 of the relay block 200 by the main transport device 333A, and is supported by the carrier support section 220.
  • the conveyance path of the carrier 9 in this case is shown in FIGS. 6 to 8 by a thick dotted arrow a4.
  • the attitude of the carrier 9 passed to the carrier support part 220 is changed from the vertical attitude to the horizontal attitude by the carrier support part 220.
  • the state of the attitude change of the carrier 9 in the carrier support section 220 is schematically shown.
  • the carrier support section 220 includes a fixed pedestal 211 and a carrier holder 212 fixed within the relay block 200.
  • the carrier holder 212 includes a first holder 212a and a second holder 212b.
  • the first holding portion 212a has a rectangular flat plate shape capable of holding the lower end portion of the carrier 9 when it is in a horizontal position.
  • the second holding portion 212b has a rectangular flat plate shape capable of holding the lower end portion of the carrier 9 when it is in a vertical posture.
  • the first holding part 212a and the second holding part 212b are connected such that one side of the first holding part 212a and one side of the second holding part 212b touch each other and the two holding parts are orthogonal to each other.
  • the fixed base 211 holds the carrier so that the first holding part 212a and the second holding part 212b are both parallel to the Y direction, and the carrier holding tool 212 is rotatable around an axis extending in the Y direction. A portion of the tool 212 is held.
  • the carrier support section 220 further includes a drive section (not shown) that can adjust the rotation angle of the carrier holder 212 on the fixed base 211.
  • a drive section (not shown) that can adjust the rotation angle of the carrier holder 212 on the fixed base 211.
  • the rotation angle of the carrier holder 212 is adjusted so that the second holding part 212b is horizontal and the first holding part 212a is vertical.
  • the rotation angle of the carrier holder 212 is adjusted so that the second holding part 212b becomes vertical and the first holding part 212a becomes horizontal.
  • the attitude of the carrier 9 is changed from the vertical attitude to the horizontal attitude.
  • the substrate entrance/exit 12 (FIG. 5) of the carrier 9 faces in the -X direction.
  • the lid of the hoop 8 containing the plurality of processed substrates W is closed, held by the hoop transport device 112, and placed on one of the plurality of hoop shelves 110. Further, the hoop 8 is transferred to the hoop mounting section 190 by the hoop transfer device 111 and is carried out from the substrate processing apparatus 1 .
  • the attitude of the empty carrier 9 in the carrier support part 220 is changed from the horizontal attitude to the vertical attitude again by the carrier support part 220.
  • the empty carrier 9 returned to the vertical position in the carrier support section 220 is transported by the main transport device 333A and received by the second standby section 240.
  • the empty carrier 9 received from the carrier support unit 220 by the second standby unit 240 is transported to the carrier cleaning unit 420 by the cleaning transport device 410 of the cleaning block 400 while maintaining the vertical posture.
  • the conveyance path of the carrier 9 in this case is shown in FIG. 6 by a thick dashed line arrow c1.
  • the carrier 9 is further conveyed by a cleaning conveyance device 410 between a plurality of carrier cleaning tanks 421, a carrier drying section 422, and a plurality of carrier waiting sections 423.
  • a cleaning conveyance device 410 between a plurality of carrier cleaning tanks 421, a carrier drying section 422, and a plurality of carrier waiting sections 423.
  • the carrier 9 after use is subjected to a cleaning process and a drying process.
  • the carrier 9 after the cleaning process and the drying process is accommodated in one of the plurality of carrier standby parts 423.
  • the vertical posture of the carrier 9 is maintained.
  • a case is assumed in which a series of treatments are performed on a plurality of unprocessed substrates W accommodated in another new hoop 8.
  • the clean carrier 9 accommodated in the carrier standby section 423 of the cleaning block 400 is transported as a new carrier 9 from the carrier cleaning unit 420 to the second waiting section 240 by the cleaning transport device 410.
  • a new conveyance path of the carrier 9 is shown in FIG. 6 by a thick dashed line arrow c2.
  • the new carrier 9 delivered to the second standby section 240 is conveyed to the first standby section 230 by the standby conveyance device 250 while maintaining its vertical posture, and is supported by the first standby section 230.
  • a new conveyance path for the carrier 9 is shown in FIG. 6 by a thick two-dot chain arrow b1.
  • the first standby unit 230 passes the new carrier 9 supported by the first standby unit 230 to the carrier support unit 210. Therefore, the posture of the new carrier 9 passed to the carrier support section 210 is changed from the vertical posture to the horizontal posture by the carrier support section 210.
  • the two carrier supports 210 and 220 in the relay block 200 have the same configuration.
  • the new attitude of the carrier 9 is changed, as shown in the balloon BA1 in FIG. Thereafter, the plurality of unprocessed substrates W accommodated in another new hoop 8 are inserted into a new carrier 9 in a horizontal position.
  • a new carrier 9 containing a plurality of unprocessed substrates W is transported along a transport path indicated by a series of arrows a2, a3, and a4 shown in FIGS. 6 to 8. As a result, a series of processes are performed on the plurality of substrates W accommodated in the new carrier 9.
  • the third end TA3 and the fourth end TA4 of the processing section 330 sandwich the plurality of processing tanks 331a of the plurality of liquid processing units 331. They are separated. As a result, a structure for carrying the carrier 9 into the fourth end TA4 of the processing section 330 and a structure for carrying out the carrier 9 from the third end TA3 of the processing section 330 are provided in close proximity. do not have. Furthermore, a maintenance space MS1 is formed adjacent to the processing section 330 in which a large number of processing tanks 331a are lined up. Therefore, a sufficiently large maintenance space is secured for each part of the substrate processing apparatus 1.
  • the first transport section 310 for transporting the carrier 9 to the fourth end TA4 of the processing section 330 is located at a position away from the processing section 330 and the maintenance spaces MS1 and MS2 in plan view. cannot be set up.
  • the first transport section 310 is located at a position spaced apart from the processing section 330 in the -Y direction and above the maintenance space MS1, as shown in FIG. Furthermore, the first transport section 310 is located above the plurality of processing tanks 331a of the processing section 330. Generally, a clean downflow is formed in a clean room in which the substrate processing apparatus 1 is installed. Thereby, particles and the like generated in the maintenance space MS1 and the plurality of processing tanks 331a are prevented from adhering to the plurality of substrates W in the carrier 9 transported in the first transport section 310.
  • the first transport section 310 overlaps the maintenance space MS1 in a plan view, and does not overlap the processing section 330 in a plan view. Thereby, the space above the maintenance space MS1 can be effectively utilized. Further, since the first transport section 310 is not provided above the processing section 330, the degree of freedom in designing the processing section 330 in the height direction is not limited by the first transport section 310.
  • the used carrier 9 used for processing a plurality of substrates W is cleaned by the carrier cleaning unit 420.
  • the carrier 9 after being cleaned by the carrier cleaning unit 420 is used to process a plurality of new substrates W. Therefore, in order to process a large number of substrates W, there is no need to prepare an excessive number of carriers 9.
  • the vertical dimension of the first transport section 310 is determined according to the vertical dimension (height) of the carrier 9 to be transported.
  • the carrier 9 used in the above-mentioned substrate processing apparatus 1 has a vertical dimension (height) of the carrier 9 in a horizontal position and a vertical dimension (height) of the carrier 9 in a vertical position. smaller than Furthermore, in the first transport section 310, the carrier 9 is transported in a horizontal position. Therefore, the vertical dimension of the first conveyance section 310 can be made smaller than when the carrier 9 is conveyed in a vertical position. As a result, even if there is a limit to the vertical dimension of the substrate processing apparatus 1, the vertical dimension of the first transport section 310 is reduced, so that there is a sufficient height below the first transport section 310 for maintenance. A space MS1 is formed.
  • the first transport section 310 is provided at a position above the maintenance space MS1, but the present invention is limited to this. Not done.
  • the first conveyance unit 310 may be provided at a position below the maintenance space MS1 instead of at a position above the maintenance space MS1.
  • some components of the substrate processing apparatus 1 and the maintenance space MS1 are provided above a predetermined installation surface, and other components including the first transport section 310 are provided below the installation surface. You can.
  • the first transport section 310 may be provided so that at least a portion thereof overlaps the processing section 330 in a plan view. That is, the first transport section 310 may be provided such that at least a portion thereof is located above or below the processing section 330.
  • the frame members 10a and 10b of the carrier 9 in the vertical posture are maintained parallel to the vertical direction, but the frame members of the carrier 9 in the vertical posture 10a and 10b may be maintained substantially parallel to the vertical direction. That is, the carrier 9 in the vertical position only needs to be able to hold the plurality of accommodated substrates W in parallel or substantially parallel to the vertical direction.
  • the frame members 10a and 10b of the carrier 9 in the horizontal position are maintained perpendicular to the vertical direction, but the frame members 10a and 10b of the carrier 9 in the horizontal position are maintained perpendicular to the vertical direction.
  • the members 10a and 10b may be maintained substantially perpendicular to the vertical direction. That is, the carrier 9 in the horizontal position only needs to be able to hold the plurality of accommodated substrates W in parallel or substantially parallel to the horizontal direction.
  • the maintenance space MS1 is formed so as to be adjacent to all of the plurality of processing tanks 331a of the processing section 330 in the Y direction. is not limited to this.
  • the maintenance space MS1 may be formed adjacent to some of the processing tanks 331a of the processing section 330 in the Y direction.
  • the substrate processing apparatus 1 includes a cleaning block 400 that cleans the used carrier 9 used to process a plurality of substrates W
  • the present invention is not limited thereto.
  • the substrate processing apparatus 1 may not be provided with the cleaning block 400.
  • the used carrier 9 from which a plurality of substrates W have been taken out at the carrier support section 220 of the relay block 200 may be transported to the carrier support section 210 without being cleaned.
  • the used carrier 9 may be taken out of the substrate processing apparatus 1 and discarded without being cleaned.
  • the carrier support section 210 and the first standby section 230 are separately provided in the relay block 200, but the present invention is not limited to this. If it is possible to add the function of changing the posture of the carrier 9 to the first standby section 230, the carrier support section 210 may not be provided.
  • the carrier support section 220 and the second standby section 240 are separately provided in the relay block 200, but the present invention is not limited to this. If it is possible to add the function of changing the posture of the carrier 9 to the second standby section 240, the carrier support section 220 may not be provided.
  • the transport device 321 has the function of changing the attitude of the carrier 9 and the function of transporting the carrier 9. Not limited.
  • a component having a function of changing the attitude of the carrier 9 and a component having a function of transporting the carrier 9 may be separately provided in place of the above-described transport device 321.
  • the substrate W to be processed has a rectangular shape in plan view, but the substrate to be processed may have a circular shape in plan view. However, it may have a polygonal shape other than a quadrangle, such as a triangle or a pentagon when viewed in plan.
  • the carrier 9 supports both sides of the rectangular substrate W when the rectangular substrate W is accommodated in a horizontal position
  • the present invention is not limited thereto.
  • the carrier 9 may be configured to be able to support the center portion of the substrate W in a horizontal position.
  • the processing liquid for cleaning the substrate W is stored in the plurality of processing tanks 331a of the processing section 330, but the present invention is not limited to this. Not limited. In at least some of the plurality of processing tanks 331a of the processing section 330, a plating solution for performing plating processing on the substrate W, a liquid for modifying the surface condition of the substrate W, etc. is stored as a processing solution. Good too.
  • the above embodiment is an example in which the present invention is applied to cleaning processing of a plurality of substrates W, but the present invention is not limited to this, and other processing such as plating processing or surface modification processing of a plurality of substrates W can be applied. The present invention may also be applied to.
  • openings 13 are formed in the center portion of each of the frame members 10a, 10b, but the present invention is not limited to this.
  • the number of openings 13 is not limited to four, and other numbers such as one, two, three, or five openings 13 may be formed in the central portion of each of the frame members 10a, 10b. Alternatively, the opening 13 may not be formed in the center portion of each of the frame members 10a, 10b.
  • the shapes of the frame members 10a and 10b may be changed in design as appropriate.
  • the pair of chuck members 333b hold the carrier 9 by sandwiching the carrier 9 in the X direction.
  • the pair of chuck members 333b may hold the carrier 9 by sandwiching the carrier 9 in the Y direction, or may hold the carrier 9 by sandwiching the carrier 9 in a direction intersecting the X and Y directions in a horizontal plane. You may.
  • the substrate loading/unloading block 100 and the relay block 200 are examples of the substrate loading/unloading section
  • the +X direction is an example of the first direction
  • the first transport section 310 is an example of the transport section.
  • the processing section 330 is an example of the processing section
  • the first end TA1 of the first transport section 310 is an example of the first end
  • the second end TA2 of the first transport section 310 is an example of the second end. This is an example of the end of
  • the third end TA3 of the processing section 330 is an example of the third end
  • the fourth end TA4 of the processing section 330 is an example of the fourth end
  • the plurality of liquid processing units 331 The plurality of processing tanks 331a are an example of a plurality of processing tanks
  • the -X direction is an example of a second direction
  • the Y direction is an example of a third direction
  • the maintenance space MS1 is an example of a maintenance space. be.
  • the substrate processing apparatus 1 is an example of a substrate processing apparatus
  • the transfer apparatus 321 is an example of a first transfer apparatus, and includes an opener 120, a substrate transfer robot 140, a carrier support section 210, and a first standby section 230.
  • the element group is an example of a substrate insertion section
  • the component group including the opener 130, the substrate transfer robot 150, the carrier support section 220, and the second standby section 240 is an example of a substrate ejection section
  • the standby transfer device 250 is an example of the second standby section.
  • the carrier cleaning unit 420 is an example of the carrier cleaning section.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un appareil de traitement de substrat comprenant : une unité de chargement/déchargement de substrat ; et une unité de transport et une unité de traitement qui sont disposées de façon à s'étendre en parallèle à partir de l'unité d'unité de chargement/déchargement de substrat dans une première direction. L'unité de transport transporte un support, qui loge des substrats non traités, à partir de l'unité de chargement/déchargement de substrat dans la première direction. L'unité de traitement comprend une pluralité de réservoirs de traitement. Dans l'unité de traitement, le support dans lequel est logée la pluralité de substrats est transporté dans une seconde direction opposée à la première direction. Le support transporté est immergé dans au moins un liquide parmi une pluralité de liquides de traitement stockés dans la pluralité de réservoirs de traitement. Un espace de maintenance est formé de façon à être adjacent à l'unité de traitement dans une vue en plan. L'unité de transport chevauche partiellement au moins une partie de l'unité de traitement et l'espace de maintenance dans une vue en plan.
PCT/JP2023/010208 2022-03-24 2023-03-16 Appareil de traitement de substrat WO2023182115A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-048784 2022-03-24
JP2022048784A JP2023142093A (ja) 2022-03-24 2022-03-24 基板処理装置

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WO2023182115A1 true WO2023182115A1 (fr) 2023-09-28

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JP (1) JP2023142093A (fr)
WO (1) WO2023182115A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817894A (ja) * 1994-06-27 1996-01-19 Dainippon Screen Mfg Co Ltd 基板表面処理装置
JP2002359225A (ja) * 2001-06-01 2002-12-13 Smt:Kk 基板洗浄装置および基板洗浄システム
US20060144822A1 (en) * 2004-12-30 2006-07-06 Innolux Display Corp. Apparatus and method for wet-etching
JP2013051267A (ja) * 2011-08-30 2013-03-14 Dainippon Screen Mfg Co Ltd 槽キャリア及び基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817894A (ja) * 1994-06-27 1996-01-19 Dainippon Screen Mfg Co Ltd 基板表面処理装置
JP2002359225A (ja) * 2001-06-01 2002-12-13 Smt:Kk 基板洗浄装置および基板洗浄システム
US20060144822A1 (en) * 2004-12-30 2006-07-06 Innolux Display Corp. Apparatus and method for wet-etching
JP2013051267A (ja) * 2011-08-30 2013-03-14 Dainippon Screen Mfg Co Ltd 槽キャリア及び基板処理装置

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TW202343646A (zh) 2023-11-01

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