WO2023181487A1 - 水晶振動素子及びその製造方法 - Google Patents

水晶振動素子及びその製造方法 Download PDF

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Publication number
WO2023181487A1
WO2023181487A1 PCT/JP2022/041362 JP2022041362W WO2023181487A1 WO 2023181487 A1 WO2023181487 A1 WO 2023181487A1 JP 2022041362 W JP2022041362 W JP 2022041362W WO 2023181487 A1 WO2023181487 A1 WO 2023181487A1
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WIPO (PCT)
Prior art keywords
axis
crystal
pair
vibrating element
main surfaces
Prior art date
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Ceased
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PCT/JP2022/041362
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English (en)
French (fr)
Japanese (ja)
Inventor
大輝 後藤
裕司 熊野
魁藏 牧野
貴志 長谷
光洋 山田
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Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2024509736A priority Critical patent/JP7689659B2/ja
Priority to CN202280093940.2A priority patent/CN118947063A/zh
Publication of WO2023181487A1 publication Critical patent/WO2023181487A1/ja
Priority to US18/816,495 priority patent/US12438517B2/en
Anticipated expiration legal-status Critical
Priority to JP2025088031A priority patent/JP7800758B2/ja
Priority to US19/327,157 priority patent/US20260012156A1/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H03H9/02023—Characteristics of piezoelectric layers, e.g. cutting angles consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • the present invention relates to a crystal vibrating element and a method for manufacturing the same.
  • Crystal resonator elements are used as timing devices, sensors, oscillators, etc. in various electronic devices such as mobile communication terminals, communication base stations, and home appliances.
  • the crystal vibrating element includes a crystal piece having a pair of main surfaces and a pair of excitation electrodes provided on the pair of main surfaces of the crystal piece.
  • a crystal vibrating element includes a twice-rotated crystal piece having a rectangular planar shape, with the side along the axis as the first side and the side along the Z' axis as the second side.
  • Patent Document 2 describes an A crystal vibrating element is disclosed that includes a crystal piece having a pair of main surfaces parallel to the Z' axis and rotated around the Z axis in a range of 33 degrees to 34 degrees.
  • JP 2021-78062 Publication Japanese Patent Application Publication No. 2017-192032
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a crystal resonator element with a small temperature change in frequency and a low ESR value, and a simple manufacturing method thereof.
  • a crystal vibrating element includes a crystal piece having a pair of main surfaces facing each other, and a pair of excitation electrodes provided on the pair of main surfaces of the crystal piece, and a crystal axis of the crystal.
  • the axes obtained by rotating the X-axis and the Y-axis at a rotation angle ⁇ with the Z-axis as the rotation axis are respectively defined as the X'-axis and Y'-axis
  • a method for manufacturing a crystal vibrating element includes: a crystal piece having a pair of main surfaces facing each other; and a pair of excitation electrodes provided on the pair of main surfaces of the crystal piece.
  • a method for manufacturing a crystal vibrating element comprising: preparing a crystal having X, Y and Z axes as crystal axes; and rotating the X and Y axes at a rotation angle ⁇ with the Z axis as a rotation axis.
  • FIG. 1 is an exploded perspective view of a crystal resonator according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the crystal resonator shown in FIG. 1.
  • FIG. 2 is a diagram for explaining the angle of the crystal piece shown in FIG. 1.
  • FIG. It is a graph for explaining the relationship between rotation angle ⁇ and frequency temperature characteristics.
  • 1 is a flowchart showing part of a method for manufacturing a crystal resonator according to an embodiment of the present invention.
  • FIG. 3 is a diagram for explaining a method of manufacturing a crystal resonator element according to an embodiment of the present invention.
  • FIG. 3 is a diagram for explaining a method of manufacturing a crystal resonator element according to an embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of a crystal resonator according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the crystal resonator shown in FIG.
  • the crystal resonator 100 includes a crystal resonator element 102, a lid member 140, a base member 150, and a joining member 190.
  • the crystal vibrating element 102 is provided between the base member 150 and the lid member 140.
  • the base member 150 and the lid member 140 constitute a holder for accommodating the crystal vibrating element 102.
  • the base member 150 has a flat plate shape, and the crystal vibrating element 102 is accommodated in the recess of the lid member 140.
  • the shapes of the base member 150 and the lid member 140 are not limited to the above as long as at least the excited part of the crystal vibrating element 102 is housed in the holder.
  • the base member 150 may have a recess on the side of the lid member 140, or both the base member 150 and the lid member 140 may have recesses on opposite sides.
  • the crystal vibrating element 102 is an electromechanical energy conversion element that can convert electrical energy and mechanical energy using a piezoelectric effect.
  • the crystal vibrating element 102 includes a crystal piece 110, a first excitation electrode 120 and a second excitation electrode 130 forming a pair of excitation electrodes, and a first extraction electrode 122 and a second extraction electrode 132 forming a pair of extraction electrodes. , a first connection electrode 124 and a second connection electrode 134 forming a pair of connection electrodes.
  • the crystal piece 110 has an upper surface 112 and a lower surface 114 that face each other.
  • the upper surface 112 is located on the opposite side to the side facing the base member 30, that is, on the side facing the top wall portion 141 of the lid member 140, which will be described later.
  • the lower surface 114 is located on the side facing the base member 150.
  • the upper surface 112 and the lower surface 114 have a rectangular shape.
  • the upper surface 112 and the lower surface 114 correspond to a pair of main surfaces of the crystal piece 110.
  • the main vibration of the crystal vibrating element 10 using the crystal piece 110 is the thickness shear vibration mode.
  • the upper surface 112 and lower surface 114 of the crystal piece 110 are provided in a planar shape, but the invention is not limited to this.
  • the upper surface 112 and the lower surface 114 may be provided in a mesa shape, an inverted mesa shape, a convex shape, or a bevel shape.
  • the first excitation electrode 120 and the second excitation electrode 130 apply a voltage to the crystal piece 110.
  • the first excitation electrode 120 is provided on the upper surface 112 of the crystal piece 110
  • the second excitation electrode 130 is provided on the lower surface 114 of the crystal piece 110.
  • the first excitation electrode 120 and the second excitation electrode 130 face each other with the crystal piece 110 in between.
  • the first excitation electrode 120 and the second excitation electrode 130 each have a rectangular shape, and are arranged so that substantially the entirety thereof overlaps with each other.
  • planar shape of each of the first excitation electrode 120 and the second excitation electrode 130 when the top surface 112 of the crystal blank 110 is viewed from above is not limited to a rectangular shape.
  • the planar shape of each of the first excitation electrode 120 and the second excitation electrode 130 may be polygonal, circular, elliptical, or a combination thereof.
  • the first extraction electrode 122 electrically connects the first excitation electrode 120 and the first connection electrode 124
  • the second extraction electrode 132 electrically connects the second excitation electrode 130 and the second connection electrode 134.
  • the first extraction electrode 122 is provided from the upper surface 112 to the lower surface 114 of the crystal piece 110
  • the second extraction electrode 132 is provided on the lower surface 114 of the crystal piece 110.
  • the first connection electrode 124 and the second connection electrode 134 electrically connect the crystal vibrating element 102 to the base member 150.
  • the first connection electrode 124 and the second connection electrode 134 are provided at both ends of one short side of the lower surface 114 of the crystal piece 110.
  • the first excitation electrode 120, the first extraction electrode 122, and the first connection electrode 124 are integrally provided. The same applies to the second excitation electrode 130, the second extraction electrode 132, and the second connection electrode 134.
  • the electrodes of these crystal vibrating elements 102 have, for example, a multilayer structure in which a base layer and a surface layer are laminated in this order.
  • the base layer is a chromium (Cr) layer that has good adhesion to the crystal piece 110
  • the surface layer is a gold (Au) layer that has good chemical stability.
  • the base member 150 holds the crystal vibrating element 102 so as to be able to vibrate it.
  • the base member 150 includes a base body 151, connection electrodes 160, 162, extraction electrodes 164, 166, external electrodes 170, 172, 174, 176, and conductive holding members 180, 182.
  • the base 151 is a plate-shaped insulator having an upper surface 152 and a lower surface 154 facing each other in the thickness direction.
  • the upper surface 152 and the lower surface 154 correspond to a pair of main surfaces of the base body 151.
  • the upper surface 152 is located on the side facing the crystal vibrating element 102 and the lid member 140, and corresponds to a mounting surface on which the crystal vibrating element 102 is mounted.
  • the base 151 is preferably made of a heat-resistant material. From a similar point of view, the base 151 may be made of a material having a coefficient of thermal expansion close to that of the crystal piece 110.
  • the base 151 is provided by, for example, a ceramic substrate, a glass substrate, or a crystal substrate.
  • the corner portion of the base body 151 has a notched side surface that is partially cut into a cylindrical curved shape (also called a castellation shape). Note that the shape of the corner portion of the base body 151 is not limited to this, and the shape of the notch may be planar, or there may be no notch, and a substantially right-angled corner portion may remain.
  • connection electrodes 160 and 162 are electrically connected to the crystal vibrating element 102.
  • the connection electrode 160 is electrically connected to the connection electrode 124 of the crystal resonator 102, and the connection electrode 162 is connected to the connection electrode 134 of the crystal resonator 102.
  • the extraction electrode 164 electrically connects the connection electrode 160 and the external electrode 170, and the extraction electrode 166 electrically connects the connection electrode 162 and the external electrode 172.
  • the extraction electrodes 164 and 166 are provided on the upper surface 152 of the base 151.
  • the external electrodes 170 and 172 are external terminals for electrically connecting the crystal vibrating element 102 to an external substrate.
  • the external electrode 170 electrically connects the first excitation electrode 120 of the crystal vibrating element 102 to the external substrate
  • the external electrode 172 electrically connects the second excitation electrode 130 of the crystal vibrating element 102 to the external substrate.
  • one of the external electrodes 174 and 176 is a ground electrode that grounds the lid member 140, and the other is a dummy electrode that is not electrically connected to the crystal vibrating element 102.
  • Each of the external electrodes 170, 172, 174, and 176 is provided continuously from the side surfaces of the notches provided at the four corners of the base 151 to the lower surface 154. In the example shown in FIG.
  • external electrodes 170 and 172 are located at diagonal corners on the top surface 152 of the base 151, and external electrodes 174 and 176 are located at different diagonals on the top surface 152 of the base 151. ing.
  • the external electrodes 170, 172, 174, 176 are not limited to the above. Both external electrodes 174 and 176 may be ground electrodes, or both may be dummy electrodes. External electrodes 174 and 176 may be omitted. External electrode 174 may be electrically connected to one of external electrodes 170 and 172, and external electrode 176 may be electrically connected to the other of external electrodes 170 and 172.
  • the conductive holding members 180 and 182 electrically connect the base member 150 and the crystal vibrating element 102, and also mechanically hold the crystal vibrating element 102.
  • the conductive holding member 180 electrically connects the first connection electrode 124 of the crystal vibrating element 102 and the connection electrode 160 of the base member 150.
  • the conductive holding member 182 electrically connects the second connection electrode 134 of the crystal vibrating element 102 and the connection electrode 162 of the base member 150.
  • the conductive holding members 180 and 182 are cured conductive adhesives containing a thermosetting resin, a photocurable resin, or the like.
  • the main component of the conductive holding members 180 and 182 is, for example, silicone resin.
  • the conductive holding members 180 and 182 contain conductive particles, and the conductive particles are, for example, metal particles containing silver (Ag).
  • the main component of the conductive holding members 180 and 182 is not limited to silicone resin, and may be, for example, epoxy resin or acrylic resin.
  • the conductive particles included in the conductive holding members 180 and 182 are not limited to silver particles, and may be formed of other metals, conductive ceramics, conductive organic materials, or the like.
  • the conductive holding members 180, 182 may include a conductive polymer.
  • the lid member 140 has a top wall portion 141 and a side wall portion 142 extending from the outer edge of the top wall portion 141 toward the base member 150.
  • the top wall part 141 faces the base member 150 with the crystal resonator element 102 in between, and the side wall part 142 surrounds the crystal resonator element 102 with a space therebetween.
  • the material of the lid member 140 is preferably a conductive material, and more preferably a highly airtight metal material. Since the lid member 140 is made of a conductive material, the lid member 140 is provided with an electromagnetic shielding function that reduces electromagnetic waves entering and exiting the internal space 101.
  • the material of the lid member 140 is desirably a material having a coefficient of thermal expansion close to that of the base member 150.
  • a material with a coefficient of thermal expansion near room temperature that is similar to glass or ceramic over a wide temperature range is preferable. It is a Fe--Ni--Co based alloy that matches the .
  • the lid member 140 is electrically connected to at least one of the external electrodes 174 and 176 by a grounding member (not shown).
  • the joining member 190 joins the base member 150 and the lid member 140 and seals the internal space 101 in which the crystal vibrating element 102 is accommodated.
  • the joining member 190 is provided in a frame shape around the entire outer edge of the base member 150 and is sandwiched between the tip of the side wall 142 of the lid member 140 and the upper surface 152 of the base member 150.
  • the joining member 190 is made of an insulating material.
  • the joining member 190 is provided using an organic adhesive containing, for example, epoxy, vinyl, acrylic, urethane, or silicone resin.
  • the material of the bonding member 190 is not limited to an organic adhesive, and may be provided with an inorganic adhesive such as a silicon adhesive containing water glass or a calcium adhesive containing cement. .
  • the material of the bonding member 190 may be low melting point glass (for example, lead boric acid type, tin phosphate type, etc.).
  • FIG. 3 is a diagram for explaining the angle of the crystal piece shown in FIG.
  • FIG. 4 is a graph for explaining the relationship between rotation angle ⁇ and frequency temperature characteristics.
  • FIG. 5 is a graph for explaining the relationship between rotation angle ⁇ and frequency temperature characteristics.
  • FIG. 6 is a graph for explaining the relationship between the rotation angle ⁇ and the electromechanical coupling coefficient.
  • the main surfaces 112 and 114 of the crystal piece 110 are Z'X' planes perpendicular to the Y'' axis.
  • the crystal piece 110 is formed by etching a crystal substrate (for example, a crystal wafer) obtained by cutting and polishing a synthetic quartz crystal.
  • the top surface 112 of the crystal piece 110 has a rectangular shape with long sides parallel to the X'-axis direction and short sides parallel to the Z'-axis direction. Further, the crystal piece 110 has a plate shape with a thickness parallel to the Y'' axis direction.
  • the X' axis, Y'' axis, and Z' axis are defined based on crystallographic axes of quartz. Specifically, the X' axis and Y' axis are rotated by a rotation angle ⁇ about the Z axis, which is the crystallographic axes of the crystal, as the rotation axis. It is the axis.
  • the Y'' axis and the Z' axis are axes obtained by rotating the Y' axis and the Z axis at a rotation angle ⁇ using the X' axis as a rotation axis.
  • the X axis corresponds to the electric axis (polar axis) of the crystal
  • the Y axis corresponds to the mechanical axis of the crystal
  • the Z axis corresponds to the optical axis of the crystal.
  • the angle ⁇ can be rephrased as an angle formed by an axis obtained by projecting the X-axis onto the upper surface along the Y''-axis and the X'-axis.
  • the relationship of 30 degrees ⁇ 40 degrees preferably holds true.
  • the rotation angle ⁇ when the rotation angle ⁇ is changed, the frequency temperature curve rotates around the inflection point.
  • 1 degree ⁇ 14 degrees and 30 degrees ⁇ 40 degrees the guaranteed temperature of the crystal resonator 102 can be extended to the high temperature side.
  • FIG. 7 is a flowchart showing part of a method for manufacturing a crystal resonator according to an embodiment of the present invention.
  • 8 and 9 are diagrams for explaining a method of manufacturing a crystal resonator element according to an embodiment of the present invention.
  • crystal XT0 is prepared (S110).
  • the crystal XT0 is a crystal cut in the XY plane perpendicular to the Z axis.
  • the X' axis and Y' axis of the crystal XT0 are specified (S120), and the crystal XT0 is cut along the ZX' plane and the Y'Z plane (S130).
  • the crystal XT0 is placed on the rotation stage so that one XY plane contacts the mounting surface of the rotation stage and the other XY plane faces upward.
  • the rotation stage is rotated in the in-plane direction of the mounting surface while measuring the crystal orientation of the crystal XT0 using the X-ray orientation measuring device using the other XY plane as the measurement surface. This specifies the X'-axis direction and Y'-axis direction of the crystal XT0.
  • the crystal XT0 on the rotary stage is cut along the X' axis and the Y' axis by a blade of a crystal cutting device provided perpendicular to the mounting surface of the rotary stage.
  • crystal XT1 is cut out from crystal XT0.
  • step S130 it is only necessary that the crystal XT0 is cut on the Y'Z plane, which becomes the measurement plane of the X-ray azimuth measuring device in the subsequent step S140, and it is not necessary to cut the crystal XT0 on the ZX' plane. good.
  • crystal orientation measurement and cutting processing of such crystals please refer to W. L. Bond and J. A.
  • the Y'' axis and Z' axis of the crystal XT1 are specified (S140), and the crystal XT1 is cut along the X'Y'' plane and the Z'X' plane (S150).
  • the Y'Z plane of the crystal XT1 placed on the mounting surface of the rotation stage is used as the measurement plane of the X-ray orientation measuring device, and the Y'' axis direction and Z' axis direction of the crystal XT1 are specified.
  • the crystal XT1 on the rotation stage is cut along the Y'' axis and the Z' axis. At this time, a plurality of substrate-shaped crystals XT2 are cut out from the crystal XT1.
  • a plurality of crystal pieces 110 are formed in one crystal XT2 by etching, for example, and excitation electrodes and the like are provided, thereby forming a collective substrate of the crystal vibrating element 102.
  • each of the plurality of crystal pieces 110 may be given a shape such as a mesa shape, an inverted mesa shape, a convex shape, or a bevel shape by etching.
  • the collective substrate is separated into individual pieces to form the crystal resonator element 102. Note that the method for forming the plurality of crystal pieces 110 in the crystal XT2 is not limited to etching processing, and processing such as mechanical cutting may also be used.
  • the method of imparting a shape to each of the plurality of crystal pieces 110 is not limited to etching, but may also be a process such as chemical mechanical polishing.
  • the process of imparting a shape to each of the plurality of crystal pieces 110 may be performed before providing the excitation electrode or the like, or may be performed after providing the excitation electrode or the like.
  • the axes obtained by rotating the X-axis and the Y-axis at the rotation angle ⁇ with the Z-axis as the rotation axis are respectively referred to as the X'-axis and the Y'-axis
  • the axes obtained by rotating the Y' axis and the Z axis at a rotation angle ⁇ with the X' axis as the rotation axis are respectively the Y'' axis and the Z' axis.
  • the crystal resonator element 102 with small temperature change in frequency and low ESR value is provided.
  • each of the pair of main surfaces 112 and 114 of the crystal piece 110 is rectangular with sides parallel to the X' axis and the Z' axis.
  • the size of the crystal piece 110 can be maximized by efficiently utilizing the internal space 101 of the crystal resonator 100. Therefore, the ESR value can be kept low.
  • the method for manufacturing the crystal vibrating element 102 includes specifying the Y'' axis and the Z' axis of the crystal XT1, and This includes cutting the crystal XT1, specifying the Y'' axis and the Z' axis of the crystal XT1, and cutting the crystal XT1 in the Z'Y' plane and the Z'X' plane.
  • the crystal vibrating element 102 that has good frequency-temperature characteristics and can suppress the occurrence of secondary vibrations. Furthermore, there is no need to tilt the crystal during measurement using a crystal orientation measuring device or during processing using a crystal cutting device. Therefore, compared to a manufacturing method in which the crystal orientation is measured or the crystal is cut by tilting the crystal, the crystal vibrating element 102 can be easily manufactured, and the angular error of the crystal blank 110 can be reduced.
  • the internal space 101 may be sealed with metal. That is, the base member and the lid member may be joined by a joining member made of a metal material.
  • the connection electrode of the base member is spaced apart from the sealing member, and the connection electrode of the base member and the external electrode are electrically connected, for example, by a through electrode penetrating the base member.
  • the crystal piece includes a crystal piece having a pair of main surfaces facing each other, and a pair of excitation electrodes provided on the pair of main faces of the crystal piece, and the X-axis, which is the crystal axis of the crystal,
  • the axes obtained by rotating the X-axis and Y-axis by a rotation angle ⁇ with the Z-axis as the rotation axis are respectively the X'-axis and Y'-axis
  • the Y'-axis and Z-axis are
  • the axes obtained by rotating the axes at a rotation angle ⁇ are respectively the Y'' axis and the Z' axis
  • each of the pair of main surfaces of the crystal piece is perpendicular to the Y'' axis
  • each of the pair of main surfaces of the crystal piece has a rectangular shape with sides parallel to the X' axis and the Z' axis.
  • the main vibration is a thickness shear vibration mode.
  • the crystal vibrating element includes a crystal vibrating element according to any one of the above embodiments, a base member, and a lid member joined to the base member, and the crystal vibrating element includes a crystal vibrating element provided in an internal space between the base member and the lid member.
  • a vibrator is provided.
  • a method for manufacturing a crystal vibrating element including a crystal piece having a pair of main surfaces facing each other and a pair of excitation electrodes provided on the pair of main surfaces of the crystal piece.
  • One embodiment of the method for manufacturing the crystal vibrating element described above further includes cutting the crystal along a plane perpendicular to the Z' axis, and each of the pair of main surfaces of the crystal piece is parallel to the X' axis and the Z' axis. It has a rectangular shape with sides.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
PCT/JP2022/041362 2022-03-22 2022-11-07 水晶振動素子及びその製造方法 Ceased WO2023181487A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2024509736A JP7689659B2 (ja) 2022-03-22 2022-11-07 水晶振動素子及びその製造方法
CN202280093940.2A CN118947063A (zh) 2022-03-22 2022-11-07 水晶振动元件及其制造方法
US18/816,495 US12438517B2 (en) 2022-03-22 2024-08-27 Quartz vibration element and manufacturing method of quartz vibration element
JP2025088031A JP7800758B2 (ja) 2022-03-22 2025-05-27 水晶振動素子及びその製造方法
US19/327,157 US20260012156A1 (en) 2022-03-22 2025-09-12 Quartz vibration element and manufacturing method of quartz vibration element

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JP2022045837 2022-03-22
JP2022-045837 2022-03-22

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US18/816,495 Continuation US12438517B2 (en) 2022-03-22 2024-08-27 Quartz vibration element and manufacturing method of quartz vibration element

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024091474A (ja) * 2022-12-22 2024-07-04 ダイオーズ インコーポレイテッド 水晶発振器及びその製造方法
WO2025182135A1 (ja) * 2024-02-29 2025-09-04 株式会社村田製作所 圧電振動子

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JP2003324332A (ja) * 2002-02-28 2003-11-14 Toyo Commun Equip Co Ltd ２回回転ｙカット水晶振動子とこれを用いた発振器
JP2016096583A (ja) * 2016-02-08 2016-05-26 セイコーエプソン株式会社 Ｓｃカット水晶基板、振動素子、電子デバイス、発振器、及び電子機器

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