WO2023165304A1 - 灯板 - Google Patents

灯板 Download PDF

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Publication number
WO2023165304A1
WO2023165304A1 PCT/CN2023/074986 CN2023074986W WO2023165304A1 WO 2023165304 A1 WO2023165304 A1 WO 2023165304A1 CN 2023074986 W CN2023074986 W CN 2023074986W WO 2023165304 A1 WO2023165304 A1 WO 2023165304A1
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WO
WIPO (PCT)
Prior art keywords
light
primer layer
emitting chip
substrate
height
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Application number
PCT/CN2023/074986
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English (en)
French (fr)
Inventor
蓝荣南
吴春光
Original Assignee
西安青松光电技术有限公司
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Application filed by 西安青松光电技术有限公司 filed Critical 西安青松光电技术有限公司
Publication of WO2023165304A1 publication Critical patent/WO2023165304A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the embodiments of the present application relate to display technology, for example, to a light panel.
  • COB Chips on Board
  • the present application provides a lamp board to improve the thrust resistance of the light-emitting chip during the manufacturing process of the lamp board and prevent the light-emitting chip from falling off or being damaged during the production and rotation of the lamp board.
  • the embodiment of the present application provides a lamp panel, including:
  • a substrate and a plurality of light-emitting chips and a primer layer disposed on the first surface of the substrate;
  • the primer layer is arranged around the light-emitting chip, and along a direction perpendicular to the substrate, the thickness of the primer layer is smaller than the height of the light-emitting chip.
  • the vertical projection of the primer layer on the substrate covers a region of the first surface of the substrate not covered by the light-emitting chip.
  • the primer layer is a black glue layer.
  • the thickness of the primer layer is greater than one-third of the height of the light-emitting chip and less than the height of the light-emitting chip.
  • the light-emitting chip includes solder feet and a chip body, and the light-emitting chip is fixed to the substrate through solder feet;
  • the thickness of the primer layer is greater than the height of the solder pins and less than the height of the chip body.
  • the light board also includes:
  • the encapsulation adhesive layer is disposed on the side of the primer layer away from the substrate, and the The encapsulation adhesive layer covers the light-emitting chip and the primer layer.
  • the encapsulation adhesive layer and the primer layer are of the same material type.
  • materials of the encapsulation adhesive layer and the primer layer both include epoxy resin material.
  • the chip body has a height of 85um
  • the solder fillet has a height of 20-25um
  • the primer layer has a height of 30-75um.
  • the molecular size of the material of the primer layer is smaller than the molecular size of the material of the encapsulation adhesive layer.
  • a primer layer is provided on the first surface of the substrate, and the primer layer is arranged around the light-emitting chip.
  • the primer layer plays a role in fixing the light-emitting chip, improving the thrust that the light-emitting chip can withstand, and avoiding the production rotation of the light board.
  • the light-emitting chip falls off or is damaged during the process.
  • the thickness of the primer layer smaller than the height of the light-emitting chip, the repair of dead pixels of the light-emitting chip will not be affected after the primer layer is set.
  • Fig. 1 is a schematic structural diagram of a lamp panel provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of another lamp panel provided by the embodiment of the present application.
  • Fig. 3 is a schematic structural diagram of another lamp panel provided by the embodiment of the present application.
  • Fig. 4 is a flow chart of a method for manufacturing a lamp panel provided in an embodiment of the present application.
  • Fig. 5 is a flow chart of a method for manufacturing a lamp panel provided in an embodiment of the present application.
  • Fig. 6 is a schematic diagram of a spraying process provided by an embodiment of the present application.
  • the light-emitting chip on the COB lamp board is easy to fall off or be damaged.
  • the reason for the above problems is that the size of the light-emitting chip on the COB lamp board is small, usually below 8mil*4mil, and there are 2 pads.
  • the size of the pad is usually 0.12*0.12mm. Since the size of the light-emitting chip is small and there are only two pads, the push force that the light-emitting chip can withstand is relatively small. Usually, a thrust of 20g-30g can push the light-emitting chip off.
  • Fig. 1 is a schematic structural diagram of a lamp panel provided in the embodiment of the present application.
  • the lamp panel includes:
  • a substrate 10 and a plurality of light-emitting chips 20 and a primer layer 30 disposed on the first surface of the substrate 10;
  • the primer layer 30 is disposed around the light-emitting chip 20 , and along a direction perpendicular to the substrate 10 , the thickness of the primer layer 30 is smaller than the height of the light-emitting chip 20 .
  • the substrate 10 is a driving circuit board for driving the light-emitting chip 20 to emit light.
  • the driving circuit and the driving chip of the light-emitting chip 20 are arranged on the substrate 10 .
  • the driving chip can be arranged on the side of the substrate 10 away from the light-emitting chip 20 .
  • the first surface of the substrate 10 may be provided with pads, and the light emitting chip 20 is electrically connected to the pads.
  • the light emitting chip 20 may be an LED light emitting chip.
  • the light emitting chip 20 may include a red light emitting chip, a green light emitting chip, a blue light emitting chip, and the like.
  • the primer layer 30 is arranged around the light-emitting chip 20.
  • the primer layer 30 plays a role in fixing the light-emitting chip 20, increasing the tolerable thrust of the light-emitting chip 20, and preventing the light-emitting chip 20 from falling off or being damaged during the production and rotation of the lamp panel. And by setting the thickness of the primer layer 30 smaller than the height of the light-emitting chip 20 , after the primer layer 30 is set, it will not affect the maintenance of dead pixels of the light-emitting chip 20 .
  • the side thrust that the light-emitting chip 20 can withstand is increased from 20 grams to 30 grams to more than 500 grams, which effectively prevents accidental touches by fingers and friction during transportation, etc.
  • the light-emitting chip 20 is damaged due to factors.
  • the light-emitting chip 20 is attached to the substrate 10 by means of die bonding, it is necessary to perform a power-on test, detect the dead spots, and repair the dead spots.
  • the primer layer 30 can be prepared after the bad spots are repaired.
  • the aging test of the light-emitting chip 20 is carried out after the primer layer 30 is prepared. Since the aging test and the mounting of the light-emitting chip 20 are not in the same section, it needs to be transferred. By performing the aging test after the primer layer 30 is prepared, the transfer can be avoided. During the process, the light-emitting chip 20 falls off or is damaged, and at the same time, it will not affect the maintenance of dead pixels after the burn-in test.
  • a primer layer 30 is provided on the first surface of the substrate, and the primer layer 30 is arranged around the light-emitting chip 20.
  • the primer layer 30 plays a role in fixing the light-emitting chip 20, thereby increasing the thrust that the light-emitting chip 20 can withstand. Avoid falling off or damage of the light-emitting chip 20 during the production and rotation of the lamp panel. And by setting the thickness of the primer layer 30 smaller than the height of the light-emitting chip 20 , after the primer layer 30 is set, it will not affect the maintenance of dead pixels of the light-emitting chip 20 .
  • the vertical projection of the primer layer 30 on the substrate 10 covers the area of the first surface of the substrate 10 not covered by the light-emitting chip 20 .
  • the areas between adjacent light-emitting chips 20 are covered with the primer layer 30 , so that the primer layer 30 can better fix the light-emitting chips 20 , and further improve the withstand thrust of the light-emitting chips 20 .
  • the primer layer 30 is a black glue layer.
  • the primer layer 30 can block the color of the circuit on the substrate 10, avoiding the influence of the display due to the different color of the circuit on the substrate 10 of different lamp panels after splicing multiple lamp panels, and can make the light-emitting background of the light-emitting chip 20
  • the color is black to improve the contrast of the picture.
  • the primer layer 30 only exemplarily limits the primer layer 30 to be a black adhesive layer, and is not intended to As limited by the application, in other embodiments, the primer layer 30 may also be other darker colors, such as dark gray or gray.
  • the thickness of the primer layer 30 is greater than one third of the height of the light emitting chip 20 and less than the height of the light emitting chip 20 .
  • the thickness of the primer layer 30 is too large, it is difficult to maintain the light-emitting chip 20 during maintenance. For example, when replacing a dead point, it is not easy to remove the light-emitting chip 20 at the bad point. If it is too small, the fixing effect on the light-emitting chip 20 is weakened, which is not conducive to increasing the withstand thrust of the light-emitting chip 20 .
  • the thickness of the primer layer 30 by setting the thickness of the primer layer 30 to be greater than one-third of the height of the light-emitting chip 20 and smaller than the height of the light-emitting chip 20, the withstand thrust of the light-emitting chip 20 can be increased to a large extent, and the primer layer can be guaranteed
  • the provision of the layer 30 does not affect the maintenance of the light-emitting chip 20 .
  • the thickness of the primer layer 30 can be controlled between 50um-75um.
  • the thickness of the primer layer 30 in this embodiment is greater than one-third of the height of the light-emitting chips 20 and less than the height of the light-emitting chips 20, which is It means that the thickness of the primer layer 30 is greater than one-third of the height of the light-emitting chip 20 with the largest height, and smaller than the height of the light-emitting chip 20 with the smallest height.
  • Fig. 2 is a schematic structural diagram of another lamp panel provided by the embodiment of the present application.
  • the light-emitting chip 20 includes solder feet 21 and a chip body 22, and the light-emitting chip 20 is fixed to the substrate 10 through the solder feet 21;
  • the thickness of the primer layer 30 is greater than the height of the solder pins 21 and less than the height of the chip body 22 .
  • the light-emitting chip 20 is fixed on the substrate 10 by soldering the solder pins 21 on the substrate 10 .
  • Setting the thickness of the primer layer 30 to be greater than the height of the solder pin 21 and smaller than the height of the chip body 22 can greatly increase the withstand thrust of the light-emitting chip 20, and ensure that the setting of the primer layer 30 does not affect the light-emitting chip 20. repair.
  • the height of the chip body 22 is 85um
  • the height of the solder pins 21 is 20-25um
  • the height of the primer layer 30 is 30-75um, so as to ensure a greater increase in luminescence
  • the chip 20 can withstand thrust, and ensure that the setting of the primer layer 30 does not affect the maintenance of the light-emitting chip 20 .
  • Fig. 3 is a schematic structural diagram of another lamp panel provided by the embodiment of the present application.
  • the lamp panel also includes:
  • the encapsulation adhesive layer 40 , the encapsulation adhesive layer 40 is disposed on the side of the primer layer 30 away from the substrate 10 , and the encapsulation adhesive layer 40 covers the light-emitting chip 20 and the primer layer 30 .
  • the packaging adhesive layer 40 is used to protect the light-emitting chip 20, prevent the light-emitting chip 20 from being corroded by water and oxygen during the use of the lamp panel, and prevent the light-emitting chip 20 from being damaged by external forces.
  • the materials of the encapsulation adhesive layer 40 and the primer layer 30 are the same.
  • This setting can ensure that the encapsulation adhesive layer 40 and the primer layer 30 maintain the same expansion and contraction, thereby ensuring that the encapsulation adhesive layer 40 and the primer layer 30 are not prone to delamination during later use, thereby improving product reliability. Moreover, the encapsulation adhesive layer 40 and the primer layer 30 are prepared by the same process, reducing the process cost.
  • the same material type of the encapsulation layer 40 and the primer layer 30 may be: when the encapsulation layer 40 and the primer layer 30 both include a host material, the types of the host materials of the encapsulation layer 40 and the primer layer 30 are the same .
  • the encapsulation layer 40 and the primer layer 30 include two or more materials, the types of the two or more materials of the encapsulation layer 40 are in one-to-one correspondence with the types of the materials in the primer layer 30 .
  • the encapsulation adhesive layer 40 and the primer layer 30 both include a host material and a curing agent, then the types of the host materials of the encapsulation adhesive layer 40 and the primer layer 30 are the same, and the curing agent used by the encapsulation adhesive layer 40 and the primer layer 30 of the same type.
  • materials of the encapsulation adhesive layer 40 and the primer layer 30 both include epoxy resin materials.
  • the epoxy resin preparation process is simple, and the main materials of the encapsulation adhesive layer 40 and the primer layer 30 include epoxy resin materials, which can reduce the difficulty of the preparation process of the encapsulation adhesive layer 40 and the primer layer 30 , and reduce the production cost.
  • the curing agent used in the encapsulation adhesive layer 40 and the primer layer 30 both includes a thermal curing agent, so that the encapsulation adhesive layer 40 and the primer layer 30 can be cured by thermal curing.
  • a thermal curing agent By selecting different epoxy resins and thermal curing The type of agent, so that the encapsulation adhesive layer 40 and the primer layer 30 can have different curing temperatures and curing times.
  • Thermal curing has time-temperature equivalence, that is, the same curing effect can be achieved by increasing the temperature and extending the time.
  • the encapsulation adhesive layer 40 and the primer layer 30 are cured in a simple manner, and the process is simple and the cost is low.
  • the primer layer 30 can be cured at 150° C. for 2 hours.
  • the encapsulation adhesive layer 40 and the primer layer 30 may also use other materials except epoxy resin, which is not specifically limited in this embodiment.
  • other types of curing agents can also be used as the curing agent, so that the encapsulation adhesive layer 40 and the primer layer 30 can be cured at room temperature or by ultraviolet light.
  • the proportion of the curing agent in the encapsulation adhesive layer 40 and the primer layer 30 can be different or the same, and can be set according to the curing requirements of the encapsulation adhesive layer 40 and the primer layer 30 .
  • the molecular size of the material of the primer layer 30 is smaller than the molecular size of the material of the encapsulation adhesive layer 40 .
  • This setting makes the combination of the primer layer 30 and the substrate 10 better, avoids falling off during use, and improves the reliability of the lamp board.
  • An embodiment of the present application also provides a display panel, including at least two light panels provided in any embodiment of the present application.
  • FIG. 4 is a flow chart of a method for manufacturing a lamp panel provided in the embodiment of the present application. Referring to FIG. 4 , the method includes:
  • Fig. 5 is a flow chart of a method for manufacturing a light panel provided in an embodiment of the present application.
  • the method includes:
  • a fully automatic power-up is performed to detect bad points, and after the bad points are repaired, a glue-coating section is added to coat a layer of primer on the surface of the substrate and the gap between the light-emitting chips.
  • a primer layer is formed, which can greatly improve the tolerable thrust of the light-emitting chip. In this way, damage to the light-emitting chip in processes such as the aging link before packaging and the handling link is reduced.
  • a plurality of light-emitting chips and primer layers are arranged on the first surface of the substrate, including:
  • the primer material layer is cured by a thermal curing process to form a primer layer.
  • the primer layer can be sprayed in two different ways: use a nozzle to spray directly between adjacent light-emitting chips to form a primer material layer; After shielding, only the area between adjacent light-emitting chips is exposed, and then a primer material layer is formed by spraying with a nozzle.
  • Fig. 6 is a schematic diagram of a spraying process provided by the embodiment of the present application.
  • the first method is: the primer can be sprayed directly by spraying the nozzle. This method needs to control the height of the nozzle 51, as well as the angle and speed of spraying.
  • the nozzle 52 is as close as possible to the light-emitting chip 20.
  • spraying glue multiple nozzles 50 are used to spray glue at the same time, and one lamp board is divided into multiple times and multiple areas to complete the glue spraying. This gluing method is low in cost and easy to operate.
  • this method can only be coated between pixels (a pixel includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip), and the small gaps between the light-emitting chips 20 in the pixel point use
  • the colloid is filled by automatic flow.
  • the second spraying method is: place a jig above the light-emitting chip 20 to block the light-emitting chip 20 and open the gap between the light-emitting chips 20, and then spray primer. This method has lower requirements for the spraying process.
  • the primer layer 30 Before the primer layer 30 is coated, it is necessary to carry out a vacuum treatment, so that the air dissolved in the colloid is released through a negative pressure state, so as to avoid the existence of air bubbles in the colloid.
  • a vacuum machine can be used for vacuum treatment, the vacuum degree is less than 4Pa, for 20 minutes to remove the dissolved gas inside the colloid.
  • the spraying of the primer layer 30 needs to be carried out in a vacuum environment, and the entire lamp board needs to be glued in a vacuum chamber.
  • the vacuum cavity and other equipment used in the preparation of the primer layer 30 may be the same as those used in the preparation of the encapsulation adhesive layer.
  • the curing method of the primer material layer may also be ultraviolet curing or room temperature curing, which is not specifically limited in this embodiment.
  • the manufacturing method of the lamp panel provided in this embodiment is the same idea as the lamp panel provided in any embodiment of the present application, and has corresponding beneficial effects.
  • Light board For detailed technical details not described in this embodiment, please refer to the description in any embodiment of the present application.

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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本申请实施例公开了一种灯板。灯板包括：基板，以及设置于基板的第一表面的多个发光芯片和底胶层；所述底胶层环绕所述发光芯片设置，且沿垂直于所述基板的方向，所述底胶层的厚度小于所述发光芯片的高度。本申请实施例可以提高灯板制备过程中发光芯片的可耐受推力，避免灯板生产转运动过程中发光芯片脱落或损坏。

Description

灯板
本申请要求在2022年03月01日提交中国专利局、申请号为202220471871.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及显示技术，例如涉及一种灯板。
背景技术
在板上芯片封装(Chips on Board，COB)灯板的生产过程中，在发光芯片贴装之后，通常需要进行转运，发光芯片没有防护，极其容易因为操作人员误触摸，导致发光芯片掉落或损坏。
发明内容
本申请提供一种灯板，以提高灯板制备过程中发光芯片的可耐受推力，避免灯板生产转运动过程中发光芯片脱落或损坏。
第一方面，本申请实施例提供了一种灯板，包括：
基板，以及设置于基板的第一表面的多个发光芯片和底胶层；
所述底胶层环绕所述发光芯片设置，且沿垂直于所述基板的方向，所述底胶层的厚度小于所述发光芯片的高度。
可选的，所述底胶层在所述基板的垂直投影覆盖所述基板的第一表面未被所述发光芯片覆盖的区域。
可选的，所述底胶层为黑色胶层。
可选的，沿垂直于所述基板的方向，所述底胶层的厚度大于所述发光芯片的高度的三分之一，且小于所述发光芯片的高度。
可选的，所述发光芯片包括焊脚和芯片本体，所述发光芯片通过焊脚固定于所述基板；
沿垂直于所述基板的方向，所述底胶层的厚度大于所述焊脚的高度，且小于所述芯片本体的高度。
可选的，灯板还包括：
封装胶层，所述封装胶层设置于所述底胶层远离所述基板的一侧，且所述 封装胶层覆盖所述发光芯片和所述底胶层。
可选的，所述封装胶层和所述底胶层的材料类型相同。
可选的，所述封装胶层和所述底胶层的材料均包括环氧树脂材料。
可选的，沿垂直于所述基板的方向，所述芯片主体的高度为85um，所述焊脚的高度为20-25um，所述底胶层的高度为30-75um。
可选的，所述底胶层的材料的分子尺寸小于所述封装胶层的材料的分子尺寸。
本申请实施例通过在基板的第一表面设置底胶层，底胶层环绕发光芯片设置，底胶层对发光芯片起到固定作用，提高发光芯片可耐受的推力，避免灯板生产转运动过程中发光芯片脱落或损坏。且通过设置底胶层的厚度小于发光芯片的高度，使得设置底胶层后，不会影响发光芯片的坏点维修。
附图说明
图1是本申请实施例提供的一种灯板的结构示意图；
图2是本申请实施例提供的又一种灯板的结构示意图；
图3是本申请实施例提供的又一种灯板的结构示意图；
图4是本申请实施例提供的一种灯板的制作方法的流程图；
图5是本申请实施例提供的一种灯板的制作方法的流程图；
图6是本申请实施例提供的一种喷涂过程示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。
正如背景技术中提到的，COB灯板上发光芯片容易脱落或损坏，出现上述问题的原因在于：COB灯板上发光芯片的尺寸较小，通常是8mil*4mil以下，有2个焊盘，焊盘尺寸通常是0.12*0.12mm，由于发光芯片尺寸微小，且只有2个焊盘，导致发光芯片可耐受的推力较小，通常20克-30克的推力就可以将发光芯片推落。
基于此，本申请实施例提供了一种灯板的示意图，图1是本申请实施例提供的一种灯板的结构示意图，参考图1，该灯板包括：
基板10，以及设置于基板10的第一表面的多个发光芯片20和底胶层30；
底胶层30环绕发光芯片20设置，且沿垂直于基板10的方向，底胶层30的厚度小于发光芯片20的高度。
其中，基板10为驱动发光芯片20发光的驱动电路板，基板10上设置有发光芯片20的驱动电路和驱动芯片，驱动芯片可以设置于基板10远离发光芯片20的一侧。基板10的第一表面可以设置有焊盘，发光芯片20与焊盘电连接。发光芯片20可以为LED发光芯片。发光芯片20可以包括红色发光芯片、绿色发光芯片和蓝色发光芯片等。底胶层30环绕发光芯片20设置，底胶层30对发光芯片20起到固定作用，提高发光芯片20可耐受的推力，避免灯板生产转运动过程中发光芯片20脱落或损坏。且通过设置底胶层30的厚度小于发光芯片20的高度，使得设置底胶层30后，不会影响发光芯片20的坏点维修。
具体的，经过实验对比，设置底胶层30之后，发光芯片20可耐受的侧面推力从20克到30克，提升到了500克以上，有效的防止手指误触碰，以及转运中的摩擦等因素导致的发光芯片20损坏。
此外，发光芯片20通过固晶的方式贴装到基板10后需要进行上电测试，检测坏点，并维修坏点，可以在维修坏点后进行底胶层30的制备。制备完底胶层30后再进行发光芯片20的老化测试，由于老化测试和发光芯片20的贴装不在同一工段，需要转运，通过在制备完底胶层30后再进行老化测试，可以避免转运过程中发光芯片20脱落或损坏，同时也不会影响老化测试后坏点的维修。
本申请实施例通过在基板的第一表面设置底胶层30，底胶层30环绕发光芯片20设置，底胶层30对发光芯片20起到固定作用，提高发光芯片20可耐受的推力，避免灯板生产转运动过程中发光芯片20脱落或损坏。且通过设置底胶层30的厚度小于发光芯片20的高度，使得设置底胶层30后，不会影响发光芯片20的坏点维修。
可选的，参考图1，底胶层30在基板10的垂直投影覆盖基板10的第一表面未被发光芯片20覆盖的区域。这样设置，相邻发光芯片20之间的区域均覆盖有底胶层30，使得底胶层30可以更好的对发光芯片20进行固定，进一步提高发光芯片20的可耐受推力。
可选的，底胶层30为黑色胶层。
这样设置，底胶层30可以对基板10上的线路颜色进行遮挡，避免多个灯板拼接后由于不同灯板的基板10上线路颜色不同对显示产生影响，并且可以使得发光芯片20的发光背景色为黑色，提高画面对比度。
需要说明的是，本实施例仅示例性的限定底胶层30为黑色胶层，并非对本 申请的限定，在其他实施方式中底胶层30也可以为其他颜色较深的颜色，例如深灰色或灰色等。
可选的，沿垂直于基板10的方向，底胶层30的厚度大于发光芯片20的高度的三分之一，且小于发光芯片20的高度。
具体的，底胶层30的厚度过大时，使得发光芯片20维修时的维修难度较大，例如进行坏点替换时，不容易将坏点处的发光芯片20移出，底胶层30的厚度过小时，对发光芯片20的固定作用减弱，不利于增大发光芯片20的耐受推力。本实施例通过设置底胶层30的厚度大于发光芯片20的高度的三分之一，且小于发光芯片20的高度，可以较大程度的增大发光芯片20的耐受推力，且保证底胶层30的设置不影响发光芯片20的维修。示例性的，发光芯片20的高度为85um左右时,底胶层30的厚度可以控制在50um-75um之间。
此外，需要说明的是，由于不同颜色的发光芯片20的高度可能不同，本实施例中底胶层30的厚度大于发光芯片20的高度的三分之一，且小于发光芯片20的高度，是指底胶层30的厚度大于高度最大的发光芯片20的高度的三分之一，且小于高度最小的发光芯片20的高度。
图2是本申请实施例提供的又一种灯板的结构示意图，可选的，参考图2，发光芯片20包括焊脚21和芯片本体22，发光芯片20通过焊脚21固定于基板10；
沿垂直于基板10的方向，底胶层30的厚度大于焊脚21的高度，且小于芯片本体22的高度。
具体的，通过将焊脚21焊接于基板10上使发光芯片20固定于基板10上。设置底胶层30的厚度大于焊脚21的高度，且小于芯片本体22的高度可以较大程度的增大发光芯片20的耐受推力，且保证底胶层30的设置不影响发光芯片20的维修。
可选的，沿垂直于基板10的方向，芯片主体22的高度为85um，焊脚21的高度为20-25um，底胶层30的高度为30-75um，从而保证较大程度的增大发光芯片20的耐受推力，且保证底胶层30的设置不影响发光芯片20的维修。
图3是本申请实施例提供的又一种灯板的结构示意图，可选的，参考图3，灯板还包括：
封装胶层40，封装胶层40设置于底胶层30远离基板10的一侧，且封装胶层40覆盖发光芯片20和底胶层30。
具体的，封装胶层40用于保护发光芯片20，避免灯板使用过程中发光芯片20受水氧等的侵蚀，以及避免发光芯片20受外力损坏。
可选的，封装胶层40和底胶层30的材料类型相同。
这样设置，可以确保封装胶层40和底胶层30保持相同的涨缩，从而可以保证在后期使用过程中，封装胶层40和底胶层30不易产生分层现象，提高产品可靠性。并且使得封装胶层40和底胶层30采用相同的工艺制备，减小工艺成本。
需要说明的是，封装层40和底胶层30的材料类型相同可以是：封装层40和底胶层30均包括一种主体材料时，封装层40和底胶层30的主体材料的类型相同。封装层40和底胶层30包括两种或多种材料时，封装层40的两种或多种材料的类型分别与底胶层30中材料的类型一一对应相同。例如，封装胶层40和底胶层30均包括主体材料和固化剂，则封装胶层40和底胶层30的主体材料的类型相同，以及封装胶层40和底胶层30采用的固化剂的类型相同。
可选的，封装胶层40和底胶层30的材料均包括环氧树脂材料。具体的，环氧树脂制备工艺简单，封装胶层40和底胶层30的主体材料均包括环氧树脂材料可以降低封装胶层40和底胶层30的制备工艺难度，降低制作成本。
此外，封装胶层40和底胶层30采用的固化剂均包括热固化剂，使得封装胶层40和底胶层30可以采用热固化的方式进行固化，通过选用不同的环氧树脂以及热固化剂种类，使得封装胶层40和底胶层30可以具有不同的固化温度和固化时间，热固化具有时温等效性，即升高温度和延长时间都可以达到相同的固化效果，采用热固化的方式对封装胶层40和底胶层30进行固化，工艺简单，且成本较低。示例性的，对底胶层30可以在150℃下固化2小时。
需要说明的是，封装胶层40和底胶层30还可以采用除环氧树脂之外的其他材料，本实施例并不做具体限定。此外，固化剂也可以采用其他类型的固化剂，使得封装胶层40和底胶层30可以采用常温固化或紫外光固化等固化形式。此外，封装胶层40和底胶层30中固化剂的比例可以不同也可以相同，具体可以根据封装胶层40和底胶层30的固化需要设置。
可选的，底胶层30的材料的分子尺寸小于封装胶层40的材料的分子尺寸。
这样设置，使得底胶层30与基板10的结合性更好，避免使用过程中出现脱落等，提高灯板可靠性。
本申请实施例还提供了一种显示面板，包括至少两个本申请任意实施例提供的灯板。
本申请实施例还提供了一种灯板的制作方法，图4是本申请实施例提供的一种灯板的制作方法的流程图，参考图4，该方法包括：
S110、放置基板。
S120、在基板的第一表面设置多个发光芯片和底胶层；其中，底胶层环绕发光芯片设置，且沿垂直于基板的方向，底胶层的厚度小于发光芯片的高度。
图5是本申请实施例提供的一种灯板的制作方法的流程图，可选的，参考图5，该方法包括：
S110、放置基板。
S121、在基板的第一表面设置多个发光芯片。
S122、对发光芯片进行坏点检测和维修。
S123、在第一表面设置底胶层。
S130、对发光芯片进行老化测试和坏点维修。
S140、在底胶层远离基板的一侧设置封装胶层，且封装胶层覆盖发光芯片和底胶层。
本实施例通过在贴装完发光芯片之后，进行全自动上电检坏点，并维修坏点之后，增加一个涂胶的工段，在基板表面，发光芯片之间的空隙，涂敷一层底胶，底胶凝固之后形成底胶层，可以大幅度提高发光芯片的可耐受推力。从而减少封装之前的老化环节以及搬运环节等工序中的发光芯片损坏。
可选的，在基板的第一表面设置多个发光芯片和底胶层，包括：
采用喷涂工艺在第一表面形成底胶材料层；
采用热固化工艺对底胶材料层进行固化，形成底胶层。
具体的，底胶层的喷涂可以采用两种不同的方式：采用喷嘴在相邻发光芯片之间直接喷涂形成底胶材料层；或者，在发光芯片远离基板的一侧放置遮挡治具对发光芯片进行遮挡，仅裸露出相邻发光芯片之间的区域后采用喷嘴喷涂形成底胶材料层。
图6是本申请实施例提供的一种喷涂过程示意图，参考图6，第一种方式为：可以采用喷头直接喷涂的方式喷涂底胶。此方式需要控制喷嘴51的高度，以及喷射的角度和速度。喷嘴52尽可能贴近发光芯片20，喷胶时候，采用多个喷头50同时喷胶的方式，一个灯板分多次多区域完成喷胶。这种涂胶方式，成本低，操作简便。
此外，此种方式可以只在像素点(一个像素点包括一个红色发光芯片、一个绿色发光芯片以及一个蓝色发光芯片)之间进行涂敷，像素点内的发光芯片20之间的细小缝隙采用胶体自动流动的方式进行填充。
第二种喷涂方式为：在发光芯片20上方放置治具，挡住发光芯片20，发光芯片20的间隙开口，然后喷涂底胶，这种方式对喷涂工艺要求较低。
另外，底胶层30在涂敷之前，需要进行抽真空处理，将胶体内部溶解的空气通过负压状态析出，从而避免胶体内部存在气泡。可以采用真空机进行抽真空处理，真空度小于4Pa，抽20分钟，去除胶体内部溶解的气体。底胶层30喷涂需要在真空环境中进行，需要将整个灯板在真空腔体内进行涂胶。底胶层30制备采用的真空腔体等设备可以和采用封装胶层制备时采用的设备。
此外，底胶材料层的固化方式还可以为紫外固化或常温固化等，本实施例并不做具体限定。
本实施例提供的灯板的制作方法与本申请任意实施例提供的灯板属于相同的构思，具有相应的有益效果，未在本实施例详尽的技术细节详见本申请任意实施例所述的灯板。

Claims (10)

  1. 一种灯板，包括：
    基板，以及设置于基板的第一表面的多个发光芯片和底胶层；
    所述底胶层环绕所述发光芯片设置，且沿垂直于所述基板的方向，所述底胶层的厚度小于所述发光芯片的高度。
  2. 根据权利要求1所述的灯板，其中，
    所述底胶层在所述基板的垂直投影覆盖所述基板的第一表面未被所述发光芯片覆盖的区域。
  3. 根据权利要求2所述的灯板，其中，
    所述底胶层为黑色胶层。
  4. 根据权利要求1所述的灯板，其中，
    沿垂直于所述基板的方向，所述底胶层的厚度大于所述发光芯片的高度的三分之一，且小于所述发光芯片的高度。
  5. 根据权利要求1所述的灯板，其中，
    所述发光芯片包括焊脚和芯片本体，所述发光芯片通过焊脚固定于所述基板；
    沿垂直于所述基板的方向，所述底胶层的厚度大于所述焊脚的高度，且小于所述芯片本体的高度。
  6. 根据权利要求1所述的灯板，还包括：
    封装胶层，所述封装胶层设置于所述底胶层远离所述基板的一侧，且所述封装胶层覆盖所述发光芯片和所述底胶层。
  7. 根据权利要求6所述的灯板，其中，
    所述封装胶层和所述底胶层的材料类型相同。
  8. 根据权利要求7所述的灯板，其中，
    所述封装胶层和所述底胶层的材料均包括环氧树脂材料。
  9. 根据权利要求5所述的灯板，其中，
    沿垂直于所述基板的方向，所述芯片主体的高度为85um，所述焊脚的高度为20-25um，所述底胶层的高度为30-75um。
  10. 根据权利要求7所述的灯板，其中，
    所述底胶层的材料的分子尺寸小于所述封装胶层的材料的分子尺寸。
PCT/CN2023/074986 2022-03-01 2023-02-08 灯板 WO2023165304A1 (zh)

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EP1791187A1 (en) * 2005-11-29 2007-05-30 National Central University Light emitting device
KR20180017481A (ko) * 2016-08-09 2018-02-21 엘지이노텍 주식회사 광 센서 모듈 및 광 센서 모듈 제조 방법
CN215451409U (zh) * 2021-08-09 2022-01-07 重庆康佳光电技术研究院有限公司 一种cob封装结构以及显示面板
CN217641380U (zh) * 2022-03-01 2022-10-21 西安青松光电技术有限公司 一种灯板

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Publication number Priority date Publication date Assignee Title
EP1791187A1 (en) * 2005-11-29 2007-05-30 National Central University Light emitting device
KR20180017481A (ko) * 2016-08-09 2018-02-21 엘지이노텍 주식회사 광 센서 모듈 및 광 센서 모듈 제조 방법
CN215451409U (zh) * 2021-08-09 2022-01-07 重庆康佳光电技术研究院有限公司 一种cob封装结构以及显示面板
CN217641380U (zh) * 2022-03-01 2022-10-21 西安青松光电技术有限公司 一种灯板

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