WO2020073525A1 - Led 显示屏及其制作方法 - Google Patents

Led 显示屏及其制作方法 Download PDF

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Publication number
WO2020073525A1
WO2020073525A1 PCT/CN2018/124882 CN2018124882W WO2020073525A1 WO 2020073525 A1 WO2020073525 A1 WO 2020073525A1 CN 2018124882 W CN2018124882 W CN 2018124882W WO 2020073525 A1 WO2020073525 A1 WO 2020073525A1
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WIPO (PCT)
Prior art keywords
led display
glass substrate
led
display screen
optical glue
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PCT/CN2018/124882
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English (en)
French (fr)
Inventor
熊充
Original Assignee
惠州市华星光电技术有限公司
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Publication of WO2020073525A1 publication Critical patent/WO2020073525A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the present application relates to a display technology, in particular to an LED display screen and a manufacturing method thereof.
  • LED display screens are widely used in outdoor large-size display screens.
  • the common solution for LED display screens is to package the three primary colors of red, green and blue (R / G / B) chips in a single chip.
  • the LED device is then printed on the PCB to form an independent display module.
  • Multiple independent display screen modules are assembled mechanically to form a large-size display screen.
  • the pitch (dot pitch) of the pixels of the existing LED display screen can only be at least about 1 mm, and there is obvious graininess when viewed at close range, and the LED screen needs to splice multiple independent display modules, because The error of mechanical splicing leads to the presence of splicing seams on the display, which are between 0.5 and 1 mm. In addition, the splicing seams will become larger during the transportation or loading and unloading of the LED display.
  • Embodiments of the present application provide an LED display screen and a manufacturing method; to solve the technical problem that the existing LED display screen has obvious graininess when viewed at close range and a large splicing gap between display modules.
  • An embodiment of the present application provides an LED display screen, which includes:
  • a plurality of LED display modules arranged side by side on the glass substrate;
  • An optical glue disposed between the plurality of LED display modules and the glass substrate, for encapsulating the LED chips of the plurality of LED display modules and for fixing the plurality of LED display modules on the glass substrate;
  • the LED display module includes a PCB board and an LED chip disposed on a side of the PCB board facing the glass substrate, and the optical glue completely covers the LED chip;
  • the orthographic projection area of the LED chip is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer; the thickness of the optical glue is greater than the height of the LED chip.
  • the width of the splicing gap is less than or equal to 0.1 mm.
  • the splicing gap is filled with a reflective substance, and the reflective surface of the reflective substance faces the glass substrate.
  • An embodiment of the present application provides another LED display screen, which includes:
  • a plurality of LED display modules arranged side by side on the glass substrate;
  • An optical glue disposed between the plurality of LED display modules and the glass substrate, for encapsulating the LED chips of the plurality of LED display modules and for fixing the plurality of LED display modules on the glass substrate;
  • the LED display module includes a PCB board, an LED chip provided on a side of the PCB board facing the glass substrate, and an LED chip provided on a side of the PCB board facing away from the glass substrate for driving the LED chip to emit light
  • the optical glue completely covers the LED chip.
  • the orthographic projection area of the LED chip is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer.
  • the thickness of the optical glue is greater than the height of the LED chip.
  • the width of the splicing gap is less than or equal to 0.1 mm.
  • the splicing gap is filled with a reflective substance, and the reflective surface of the reflective substance faces the glass substrate.
  • the optical glue is a polymer transparent material.
  • the optical glue is silica gel.
  • the optical glue includes a space portion between the LED chip and the glass substrate, and the thickness of the space portion is less than or equal to 90 ⁇ m.
  • the application also relates to a method for manufacturing an LED display screen, which includes the steps of:
  • a layer of optical glue is coated on the glass substrate, and the thickness of the optical glue is less than the height of the LED chip;
  • the LED display module includes a PCB board and the LED chip provided on the PCB board;
  • a pressure plate is provided above the LED display module to reduce the thickness of the optical glue between the LED display module and the glass substrate;
  • the step 106 includes:
  • the manufacturing method of the LED display screen of the present application further includes:
  • the reflective substance is white ink.
  • the width of the splicing gap between adjacent LED display modules is less than or equal to 0.1 mm.
  • the orthographic projection area of the LED chip is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer.
  • the optical glue is a polymer transparent material.
  • the optical glue is silica gel.
  • the LED display screen and its manufacturing method of the present application fix multiple LED display modules on the glass substrate by optical glue, which improves the stability of the LED display screen and avoids In the process of transportation and loading and unloading, the splicing gap between the LED display modules becomes larger;
  • the setting of the orthographic projection area of the LED chip of the LED display module is less than or equal to 0.04 square mm and greater than or equal to 1 square micrometer, which improves the PPI index, enhances the display effect, and solves the graininess of the existing LED display when viewed at close range Obvious and display the technical problem of large splicing gap between modules.
  • FIG. 1 is a schematic structural diagram of an embodiment of an LED display screen of this application.
  • FIG. 2 is a flowchart of an embodiment of a method for manufacturing an LED display screen of the present application.
  • FIG. 1 is a schematic structural diagram of an embodiment of an LED display screen of the present application.
  • the LED display screen 100 of the embodiment of the present application includes a glass substrate 11, a plurality of LED display modules 12 and an optical glue 13.
  • a plurality of LED display modules 12 are arranged side by side on the glass substrate 11.
  • the optical glue 13 is disposed between the plurality of LED display modules 12 and the glass substrate 11, and is used to encapsulate the LED chips 122 of the plurality of LED display modules 12 and to fix the plurality of LED display modules 12 on the glass substrate 11.
  • the LED display module 12 includes a PCB board 121, an LED chip 122 provided on the side of the PCB board 121 facing the glass substrate 11 and a driving part 123 provided on the side of the PCB board 121 facing away from the glass substrate 11 for driving the LED chip 122 to emit light.
  • the optical glue 13 completely covers the LED chip 121.
  • the multiple LED display modules 12 and the glass substrate 11 are fixedly connected, which improves the stability of the multiple LED display modules 12 after splicing and avoids the LED display 100 during transportation and loading During the process, the splicing gap between the LED display modules 12 causes the LED display module 12 to loosen due to collision or vibration, thereby increasing the splicing gap.
  • the glass substrate 11 serves to protect the LED chip 122, and in the manufacturing process of this embodiment, the glass substrate 11 serves as a reference plane, so that the LED display module 12 is disposed on the same plane, and the flatness is improved .
  • the optical glue 13 plays a role of encapsulating the LED chip 122 and fixedly connecting the glass substrate 11 and the LED display module 12, and the optical glue 13 is a transparent material to facilitate the light emitted from the LED chip 121. Therefore, the optical glue 13 is not only a transparent polymer material, but also has the function of blocking moisture and adhesion. Optionally, the optical glue 13 is silica gel.
  • the thickness of the optical glue 13 is greater than the height of the LED chip 122. Setting the thickness of the optical glue 13 to be greater than the height of the LED chip 122 serves to protect the chip solder legs on the one hand, and supports and fixes the other hand. Since the optical glue 13 is interposed between the glass substrate 11 and the LED display module 12, the optical glue 13 plays a role of supporting the LED display module 12 to prevent the LED display module 12 from being stressed during the manufacturing process, which causes the LED chip 122 to press the glass The substrate 11 damages the LED chip 122.
  • the thickness of the optical adhesive 13 between the glass substrate 11 and the LED chip 122 can be adjusted according to the actual situation.
  • the thickness of the optical adhesive 13 in this part is smaller, the light transmittance of the LED display 100 is better, supporting the LED The performance of the display module 12 is weaker.
  • the effective part of the optical adhesive 13 supported by the LED display module 12 is the LED chip 122 and the PCB board 121. Therefore, as long as the optical adhesive 13 supports the PCB board 121 sufficiently to prevent the LED chip 122 from pressing the glass substrate 11, the glass adhesive can be minimized.
  • the thickness of the optical glue 13 between the substrate 11 and the LED chip 122 is the thickness of the optical glue 13 between the substrate 11 and the LED chip 122.
  • the thickness of the optical glue 13 between the glass substrate 11 and the LED chip 122 is less than 100 microns.
  • the thickness may be 90 microns, 70 microns, 50 microns, 30 microns, 20 microns, 10 microns, 5 microns, 2 microns, and 1 microns, or even 0 microns.
  • the orthographic projection area of the LED chip 122 is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer.
  • the area size of the LED chip 122 is set to be less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer. Compared with the LED chip in the prior art, the size of the LED chip 122 is reduced to increase the PPI index and enhance the display effect, thereby avoiding the phenomenon of obvious graininess when viewing the LED display screen 100 at close range.
  • the LED display module 12 may be a mini-LED or micro-LED display module.
  • the LED display screen 100 there is a splicing gap between adjacent LED display modules 12.
  • the width of the splicing gap is less than or equal to 0.1 mm.
  • the stitching gap becomes smaller, which improves the viewing effect of the LED display 100.
  • the splicing gap is filled with the reflective substance 14.
  • the reflective surface of the reflective substance 14 faces the glass substrate 11.
  • the reflective substance 14 may be white ink, so that the color of the reflective substance 14 is the same as the color of the surface of the PCB board 121 to cover the splicing gap, so that the splicing gap is not visible to the naked eye, thereby improving the viewing effect.
  • this application also relates to a method for manufacturing an LED display screen, which includes the steps of:
  • a layer of optical glue is coated on the glass substrate, and the thickness of the optical glue is less than the height of the LED chip.
  • the LED display module includes a PCB board and the LED chip provided on the PCB board.
  • a pressure plate is provided above the LED display module to reduce the thickness of the optical glue between the LED display module and the glass substrate.
  • the structure of the LED display screen is the same as the structure of the LED display screen 100 of the above embodiment.
  • the following is a detailed explanation of the above manufacturing method.
  • Step 101 Provide a glass substrate.
  • the glass substrate is placed horizontally.
  • Step 102 coat a layer of optical glue on the glass substrate, the thickness of the optical glue is less than the height of the LED chip.
  • the thickness of the first layer of optical glue is set to be smaller than the height of the LED chip, in order to prevent the optical glue from exceeding the PCB board of the LED display module, and to facilitate the adjustment of the position of the LED display module in subsequent steps.
  • Optical glue is a transparent polymer material.
  • the optical glue is silicone.
  • Step 103 Fix the LED display module on the fixing jig, and place the LED display module on the optical glue.
  • the LED chip of the LED display module is partially immersed in the optical glue.
  • the LED display module includes a PCB board and a PCB board. On the LED chip.
  • the orthographic projection area of the LED chip is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer. Reducing the size of the LED chip to improve the PPI index and enhance the display effect, avoiding the phenomenon of obvious graininess when viewing the LED display at close range.
  • the LED display module may be a mini-LED or micro-LED display module.
  • Step 104 Using the surface of the glass substrate as a reference plane, fix a plurality of LED display modules on the same plane by fixing fixtures.
  • the surface of the glass substrate is used as a reference plane for horizontal arrangement, and the LED display modules are initially positioned and arranged by fixing the jig to improve the flatness between the LED display modules.
  • Step 105 Inject optical glue again around the glass substrate, so that the optical glue completely immerses the LED chip.
  • the optical glue is injected again to completely immerse the LED chip in the optics, so as to encapsulate and protect the LED chip.
  • Step 106 Adjust the fixing jig to shorten the joint gap between adjacent LED display modules. Specifically, step 106 includes:
  • the width of the splicing gap between adjacent LED display modules is less than or equal to 0.1 mm.
  • Step 107 Set a pressure plate above the LED display module to reduce the thickness of the optical glue between the LED display module and the glass substrate.
  • the role of the pressure plate is to apply pressure to the LED display module to lower the LED display module.
  • the LED display module needs a large pressure to drop. Therefore, when a pressure plate is applied, the LED display module does not drop quickly, and causes the LED chip to press the glass substrate.
  • the thickness of the optical glue between the glass substrate and the LED chip can be adjusted by the weight of the pressure increasing and reducing plate.
  • Step 108 curing the optical glue, and then removing the pressing plate and the fixing jig.
  • the curing of optical glue improves the stability of multiple LED display modules after splicing, and avoids the splicing gap between the LED display modules during the transportation and loading and unloading of the LED display screen.
  • the LED display module is loosened due to collision or vibration, which further increases Large splicing gaps occur.
  • Step 109 Spray reflective material in the gap between the LED display modules.
  • the splicing gap is filled with a reflective substance, and the reflective surface of the reflective substance faces the glass substrate.
  • the reflective substance may be white ink, so that the color of the reflective substance is the same as the color of the surface of the PCB board to cover the splicing gap, so that the splicing gap cannot be seen by the naked eye, thereby improving the viewing effect.
  • the LED display screen and its manufacturing method of the present application fix multiple LED display modules on the glass substrate by optical glue, which improves the stability of the LED display screen and avoids In the process of transportation and loading and unloading, the splicing gap between the LED display modules becomes larger;
  • the setting of the orthographic projection area of the LED chip of the LED display module is less than or equal to 0.04 square millimeters and greater than or equal to 1 square micrometer, which improves the PPI index, enhances the display effect, and solves the graininess of the existing LED display when viewed at close range Obvious and display the technical problem of large splicing gap between modules.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

本申请提供一种LED显示屏及其制作方法，LED显示屏包括玻璃基板、光学胶和LED显示模块，LED显示模块并排设置在玻璃基板上；光学胶设置在LED显示模块和玻璃基板之间；LED显示模块包括PCB板和设置在PCB板面向玻璃基板一侧的LED芯片，光学胶完全包覆LED芯片。本申请通过光学胶将多个LED显示模块固定在玻璃基板上，提高了LED显示屏的稳定性。

Description

LED显示屏及其制作方法 技术领域
本申请涉及一种显示技术，特别涉及一种LED显示屏及其制作方法。
 背景技术
目前发光二极管(Light Emitting Diode,LED)显示屏被大量应用在户外的超大尺寸显示屏上，LED显示屏常用的方案是把红绿蓝（R/G/B）三基色的芯片封装在单颗LED器件中，然后再把LED器件打件在PCB上，形成一个独立的显示屏模块。把多个独立的显示屏模块通过机械组装形成一个大尺寸的显示屏。
现有的LED显示屏的像素之间的间距(点间距)最小只能做到1毫米左右，近距离观看时有明显的颗粒感，且LED屏需要将多个独立的显示模块进行拼接，由于机械拼接的误差存在，导致显示器有拼接缝存在，拼接缝在0.5~1毫米之间，另外，LED显示屏在运输或装卸的过程中，拼接缝会变大。
故，需要提供一种拼接缝隙小且观看时无明显颗粒感的LED显示屏及其制作方法，以解决上述技术问题。
 技术问题
本申请实施例提供一种LED显示屏以及制作方法；以解决现有的LED显示屏近距离观看时颗粒感明显且显示模块之间拼接缝隙较大的技术问题。
 技术解决方案
本申请实施例提供一种LED显示屏，其包括：
玻璃基板；
多个LED显示模块，并排设置在所述玻璃基板上；以及
光学胶，设置在所述多个LED显示模块和玻璃基板之间，用于封装所述多个LED显示模块的LED芯片和用于将所述多个LED显示模块固定在所述玻璃基板上；
所述LED显示模块包括PCB板和设置在所述PCB板面向所述玻璃基板一侧的LED芯片，所述光学胶完全包覆所述LED芯片；
所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米；所述光学胶的厚度大于所述LED芯片的高度。
在本申请的LED显示屏中，相邻所述LED显示模块之间存在有拼接缝隙，所述拼接缝隙的宽度小于等于0.1毫米。
在本申请的LED显示屏中，所述拼接缝隙内填充有反射物质，所述反射物质的反射面朝向所述玻璃基板。
本申请实施例提供另一种LED显示屏，其包括：
玻璃基板；
多个LED显示模块，并排设置在所述玻璃基板上；以及
光学胶，设置在所述多个LED显示模块和玻璃基板之间，用于封装所述多个LED显示模块的LED芯片和用于将所述多个LED显示模块固定在所述玻璃基板上；
所述LED显示模块包括PCB板、设置在所述PCB板面向所述玻璃基板一侧的LED芯片和设置在所述PCB板背向所述玻璃基板一侧的用于驱动所述LED芯片发光的驱动部件，所述光学胶完全包覆所述LED芯片。
在本申请的另一LED显示屏中，所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米。
在本申请的另一LED显示屏中，所述光学胶的厚度大于所述LED芯片的高度。
在本申请的另一LED显示屏中，相邻所述LED显示模块之间存在有拼接缝隙，所述拼接缝隙的宽度小于等于0.1毫米。
在本申请的另一LED显示屏中，所述拼接缝隙内填充有反射物质，所述反射物质的反射面朝向所述玻璃基板。
在本申请的另一LED显示屏中，所述光学胶为高分子的透明材料。
在本申请的另一LED显示屏中，所述光学胶为硅胶。
在本申请的另一LED显示屏中，所述光学胶包括位于所述LED芯片和所述玻璃基板之间的间隔部分，所述间隔部分的厚度小于等于90微米。
本申请还涉及一种LED显示屏的制作方法，其包括步骤：
101：提供一玻璃基板；
102：在所述玻璃基板上涂覆一层光学胶，所述光学胶的厚度小于LED芯片的高度；
103：将LED显示模块固定在固定治具上，并将所述LED显示模块放置在所述光学胶上，所述LED显示模块的所述LED芯片的部分浸没在所述光学胶内，所述LED显示模块包括PCB板和设置在所述PCB板上的所述LED芯片；
104：以所述玻璃基板的表面作为参考平面，通过所述固定治具将多个所述LED显示模块固定在同一平面；
105：在所述玻璃基板的四周再次注入所述光学胶，以使所述光学胶完全浸没所述LED芯片；
106：通过调节所述固定治具缩短相邻所述LED显示模块之间的拼接缝隙；
107：在所述LED显示模块上方设置一压板，以缩小所述LED显示模块和所述玻璃基板之间所述光学胶的厚度；
108：将所述光学胶进行固化，后撤掉所述压板和所述固定治具。
在本申请的LED显示屏的制作方法中，所述步骤106包括：
以所述玻璃基板的表面为参考平面，调节所述固定治具沿着X轴方向或/和Y向方向移动，直至相邻的所述固定治具相互接触。
在本申请的LED显示屏的制作方法中，所述LED显示屏的制作方法还包括：
109：在所述LED显示模块之间的缝隙中喷涂反射物质。
在本申请的LED显示屏的制作方法中，所述反射物质为白色油墨。
在本申请的LED显示屏的制作方法中，相邻所述LED显示模块之间的所述拼接缝隙的宽度小于等于0.1毫米。
在本申请的LED显示屏的制作方法中，所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米。
在本申请的LED显示屏的制作方法中，所述光学胶为高分子的透明材料。
在本申请的LED显示屏的制作方法中，所述光学胶为硅胶。
 有益效果
相较于现有技术的LED显示屏及其制作方法，本申请的LED显示屏及其制作方法通过光学胶将多个LED显示模块固定在玻璃基板上，提高了LED显示屏的稳定性，避免了在运输和装卸过程中，LED显示模块之间的拼接间隙变大；
另外，LED显示模块的LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米的设置，提高了PPI指数，增强了显示效果，解决了现有的LED显示屏近距离观看时颗粒感明显且显示模块之间拼接缝隙较大的技术问题。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面对实施例中所需要使用的附图作简单的介绍。下面描述中的附图仅为本申请的部分实施例，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获取其他的附图。
图1为本申请的LED显示屏的实施例的结构示意图；
图2为本申请的LED显示屏的制作方法的实施例的流程图。
 本发明的实施方式
请参照附图中的图式，其中相同的组件符号代表相同的组件。以下的说明是基于所例示的本申请具体实施例，其不应被视为限制本申请未在此详述的其它具体实施例。
请参照图1，图1为本申请的LED显示屏的实施例的结构示意图。本申请实施例的LED显示屏100，其包括玻璃基板11、多个LED显示模块12和光学胶13。
多个LED显示模块12并排设置在玻璃基板11上。光学胶13设置在多个LED显示模块12和玻璃基板11之间，用于封装多个LED显示模块12的LED芯片122和用于将多个LED显示模块12固定在玻璃基板11上。
LED显示模块12包括PCB板121、设置在PCB板121面向玻璃基板11一侧的LED芯片122和设置在PCB板121背向玻璃基板11一侧的用于驱动LED芯片122发光的驱动部件123。光学胶13完全包覆LED芯片121。
本实施例通过光学胶13的设置，将多个LED显示模块12和玻璃基板11进行固定连接，提高了多个LED显示模块12拼接后的稳定性，避免了LED显示屏100在运输和装卸的过程出现LED显示模块12之间的拼接缝隙因碰撞或震动导致LED显示模块12松动，进而增大了拼接缝隙的情况发生。
其中，玻璃基板11起到保护LED芯片122的作用，以及在本实施例的制程中，玻璃基板11起到参考平面的作用，以便于使得LED显示模块12之间同一平面设置，提高了平整性。光学胶13起到封装LED芯片122和使玻璃基板11和LED显示模块12固定连接的作用，且光学胶13为透明材料，便于透过LED芯片121发出的光线。因此光学胶13不但为高分子的透明材料，而且具有隔绝水汽和粘附的功能。可选的，光学胶13为硅胶。
在本LED显示屏100的实施例中，光学胶13的厚度大于LED芯片122的高度。将光学胶13的厚度设置大于LED芯片122的高度，一方面起到保护芯片焊脚的目的，另一方面起到支撑固定作用。由于光学胶13介于玻璃基板11和LED显示模块12之间，因此光学胶13起到支撑LED显示模块12的作用，以避免LED显示模块12在制程中受压力，而促使LED芯片122压迫玻璃基板11，从而损伤LED芯片122。
另外，位于玻璃基板11和LED芯片122之间的光学胶13的厚度，可根据实际情况进行调整，当该部分的光学胶13厚度越小，LED显示屏100的透光性越好，支撑LED显示模块12的性能就越弱。而光学胶13支撑于LED显示模块12有效部分是LED芯片122和PCB板121，因此只要光学胶13对PCB板121的支撑性能足够避免LED芯片122压迫玻璃基板11，便可以尽可能缩小位于玻璃基板11和LED芯片122之间的光学胶13的厚度。
在本实施例中，位于玻璃基板11和LED芯片122之间的光学胶13的厚度小于100微米。可选的，该厚度可以是90微米、70微米、50微米、30微米、20微米、10微米、5微米、2微米和1微米，甚至是0微米。
在本LED显示屏100的实施例中，LED芯片122的正投影面积小于等于0.04平方毫米且大于等于1平方微米。
将LED芯片122的面积尺寸设置为小于等于0.04平方毫米且大于等于1平方微米。相较于现有技术中的LED芯片，缩小LED芯片122的尺寸，达到提升PPI指数，增强显示效果，避免了在近距离观看LED显示屏100时，出现明显颗粒感的现象。其中可选的，LED显示模块12可以是mini-LED或micro-LED显示模块。
在本LED显示屏100的实施例中，相邻LED显示模块12之间存在有拼接缝隙。拼接缝隙的宽度小于等于0.1毫米。拼接缝隙变小，提高了LED显示屏100的观看效果。另外，拼接缝隙内填充有反射物质14。反射物质14的反射面朝向玻璃基板11。反射物质14可以是白色油墨，让反射物质14的颜色和PCB板121表面的颜色一致，以遮掩拼接缝隙，使得肉眼看不到拼接缝隙，进而提高观看效果。
请参照图2，本申请还涉及一种LED显示屏的制作方法，其包括步骤：
101：提供一玻璃基板。
102：在所述玻璃基板上涂覆一层光学胶，所述光学胶的厚度小于LED芯片的高度。
103：将LED显示模块固定在固定治具上，并将所述LED显示模块放置在所述光学胶上。所述LED显示模块的所述LED芯片的部分浸没在所述光学胶内。所述LED显示模块包括PCB板和设置在所述PCB板上的所述LED芯片。
104：以所述玻璃基板的表面作为参考平面，通过所述固定治具将多个所述LED显示模块固定在同一平面。
105：在所述玻璃基板的四周再次注入所述光学胶，以使所述光学胶完全浸没所述LED芯片。
106：通过调节所述固定治具缩短相邻所述LED显示模块之间的拼接缝隙。
107：在所述LED显示模块上方设置一压板，以缩小所述LED显示模块和所述玻璃基板之间所述光学胶的厚度。
108：将所述光学胶进行固化，后撤掉所述压板和所述固定治具。
109：在所述LED显示模块之间的缝隙中喷涂反射物质。
在本实施例中，LED显示屏的结构和上述实施例的LED显示屏100的结构一致，以下是对上述制作方法的详细阐述。
步骤101：提供一玻璃基板。其中玻璃基板水平放置。
步骤102：在玻璃基板上涂覆一层光学胶，光学胶的厚度小于LED芯片的高度。其中，将第一层光学胶的厚度设置为小于LED芯片的高度，是为了避免光学胶超过LED显示模块的PCB板，且便于后续步骤中调整LED显示模块的位置。光学胶为高分子的透明材料。可选的，光学胶为硅胶。
步骤103：将LED显示模块固定在固定治具上，并将LED显示模块放置在光学胶上，LED显示模块的LED芯片的部分浸没在光学胶内，LED显示模块包括PCB板和设置在PCB板上的LED芯片。
另外，LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米。缩小LED芯片的尺寸，达到提升PPI指数，增强显示效果，避免了在近距离观看LED显示屏时，出现明显颗粒感的现象。其中可选的，LED显示模块可以是mini-LED或micro-LED显示模块。
步骤104：以玻璃基板的表面作为参考平面，通过固定治具将多个LED显示模块，固定在同一平面。其中，以玻璃基板表面作为水平排布的参考平面，通过固定治具对LED显示模块进行初步的定位和排布，提高LED显示模块之间的平整度。
步骤105：在玻璃基板的四周再次注入光学胶，以使光学胶完全浸没所述LED芯片。其中，由于LED显示模块被固定治具固定并定位，因此，再次注入光学胶，使得光学完全浸没LED芯片，起到封装保护LED芯片的目的。
步骤106：通过调节固定治具缩短相邻LED显示模块之间的拼接缝隙。具体的，步骤106包括：
以玻璃基板的表面为参考平面，调节固定治具沿着X轴方向或/和Y向方向移动，直至相邻的固定治具相互接触。
以使得LED显示模块之间的拼接缝隙最小。相邻LED显示模块之间的拼接缝隙的宽度小于等于0.1毫米。
步骤107：在LED显示模块上方设置一压板，以缩小LED显示模块和玻璃基板之间所述光学胶的厚度。其中，压板的作用在于给LED显示模块施加压力，以使LED显示模块下降。另外由于光学胶的支撑性，使得LED显示模块需要较大的压力才能下降，因此当施加压板时，LED显示模块不会迅速下降，并使得LED芯片压迫玻璃基板。
所以，位于玻璃基板和LED芯片之间的光学胶的厚度，可以通过增减压板的重量进行调节。
步骤108：将光学胶进行固化，后撤掉压板和所述固定治具。光学胶的固化，提高了多个LED显示模块拼接后的稳定性，避免了LED显示屏在运输和装卸的过程出现LED显示模块之间的拼接缝隙因碰撞或震动导致LED显示模块松动，进而增大了拼接缝隙的情况发生。
步骤109：在LED显示模块之间的缝隙中喷涂反射物质。其中，拼接缝隙内填充有反射物质，反射物质的反射面朝向玻璃基板。反射物质可以是白色油墨，让反射物质的颜色和PCB板表面的颜色一致，以遮掩拼接缝隙，使得肉眼看不到拼接缝隙，进而提高观看效果。
相较于现有技术的LED显示屏及其制作方法，本申请的LED显示屏及其制作方法通过光学胶将多个LED显示模块固定在玻璃基板上，提高了LED显示屏的稳定性，避免了在运输和装卸过程中，LED显示模块之间的拼接间隙变大；
另外，LED显示模块的LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米的设置，提高了PPI指数，增强了显示效果，解决了现有的LED显示屏近距离观看时颗粒感明显且显示模块之间拼接缝隙较大的技术问题。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。

Claims (16)

  1. 一种LED显示屏，其包括：
    玻璃基板；
    多个LED显示模块，并排设置在所述玻璃基板上；以及
    光学胶，设置在所述多个LED显示模块和玻璃基板之间，用于封装所述多个LED显示模块的LED芯片和用于将所述多个LED显示模块固定在所述玻璃基板上；
    所述LED显示模块包括PCB板和设置在所述PCB板面向所述玻璃基板一侧的LED芯片，所述光学胶完全包覆所述LED芯片；
    所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米；所述光学胶的厚度大于所述LED芯片的高度。
  2. 根据权利要求1所述的LED显示屏，其中，相邻所述LED显示模块之间存在有拼接缝隙，所述拼接缝隙的宽度小于等于0.1毫米。
  3. 根据权利要求2所述的LED显示屏，其中，所述拼接缝隙内填充有反射物质，所述反射物质的反射面朝向所述玻璃基板。
  4. 一种LED显示屏，其包括：
    玻璃基板；
    多个LED显示模块，并排设置在所述玻璃基板上；以及
    光学胶，设置在所述多个LED显示模块和玻璃基板之间，用于封装所述多个LED显示模块的LED芯片和用于将所述多个LED显示模块固定在所述玻璃基板上；
    所述LED显示模块包括PCB板和设置在所述PCB板面向所述玻璃基板一侧的LED芯片，所述光学胶完全包覆所述LED芯片。
  5. 根据权利要求4所述的LED显示屏，其中，所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米。
  6. 根据权利要求4所述的LED显示屏，其中，所述光学胶的厚度大于所述LED芯片的高度。
  7. 根据权利要求4所述的LED显示屏，其中，相邻所述LED显示模块之间存在有拼接缝隙，所述拼接缝隙的宽度小于等于0.1毫米。
  8. 根据权利要求7所述的LED显示屏，其中，所述拼接缝隙内填充有反射物质，所述反射物质的反射面朝向所述玻璃基板。
  9. 根据权利要求8所述的LED显示屏，其中，所述反射物质为白色油墨。
  10. 根据权利要求4所述的LED显示屏，其中，所述光学胶为高分子的透明材料。
  11. 一种LED显示屏的制作方法，其包括步骤：
    101：提供一玻璃基板；
    102：在所述玻璃基板上涂覆一层光学胶，所述光学胶的厚度小于LED芯片的高度；
    103：将LED显示模块固定在固定治具上，并将所述LED显示模块放置在所述光学胶上，所述LED显示模块的所述LED芯片的部分浸没在所述光学胶内，所述LED显示模块包括PCB板和设置在所述PCB板上的所述LED芯片；
    104：以所述玻璃基板的表面作为参考平面，通过所述固定治具将多个所述LED显示模块固定在同一平面；
    105：在所述玻璃基板的四周再次注入所述光学胶，以使所述光学胶完全浸没所述LED芯片；
    106：通过调节所述固定治具缩短相邻所述LED显示模块之间的拼接缝隙；
    107：在所述LED显示模块上方设置一压板，以缩小所述LED显示模块和所述玻璃基板之间所述光学胶的厚度；
    108：将所述光学胶进行固化，后撤掉所述压板和所述固定治具。
  12. 根据权利要求11所述的LED显示屏的制作方法，其中，所述步骤106包括：
    以所述玻璃基板的表面为参考平面，调节所述固定治具沿着X轴方向或/和Y向方向移动，直至相邻的所述固定治具相互接触。
  13. 根据权利要求11所述的LED显示屏的制作方法，其中，所述LED显示屏的制作方法还包括：
    109：在所述LED显示模块之间的缝隙中喷涂反射物质。
  14. 根据权利要求13所述的LED显示屏的制作方法，其中，所述反射物质为白色油墨。
  15. 根据权利要求11所述的LED显示屏的制作方法，其中，相邻所述LED显示模块之间的所述拼接缝隙的宽度小于等于0.1毫米。
  16. 根据权利要求11所述的LED显示屏的制作方法，其中，所述LED芯片的正投影面积小于等于0.04平方毫米且大于等于1平方微米。
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CN107731122A (zh) * 2017-11-28 2018-02-23 深圳市秀狐科技有限公司 一种明胶led显示屏及其加工方法
CN108448012A (zh) * 2018-03-01 2018-08-24 佛山市国星光电股份有限公司 全彩led显示模组及其封装方法和显示屏

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