WO2023162924A1 - Dispositif de transfert, équipement de polissage et procédé de transfert - Google Patents

Dispositif de transfert, équipement de polissage et procédé de transfert Download PDF

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Publication number
WO2023162924A1
WO2023162924A1 PCT/JP2023/005980 JP2023005980W WO2023162924A1 WO 2023162924 A1 WO2023162924 A1 WO 2023162924A1 JP 2023005980 W JP2023005980 W JP 2023005980W WO 2023162924 A1 WO2023162924 A1 WO 2023162924A1
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WO
WIPO (PCT)
Prior art keywords
carrier
teeth
sun gear
internal gear
gear
Prior art date
Application number
PCT/JP2023/005980
Other languages
English (en)
Japanese (ja)
Inventor
貢 齋藤
隆一 金井
雅史 三浦
俊洋 廣嶋
優 森田
圭佑 江▲崎▼
Original Assignee
三菱マテリアルテクノ株式会社
株式会社Sumco
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱マテリアルテクノ株式会社, 株式会社Sumco filed Critical 三菱マテリアルテクノ株式会社
Publication of WO2023162924A1 publication Critical patent/WO2023162924A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/463—Mechanical treatment, e.g. grinding, ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a transfer device, polishing equipment, and a transfer method.
  • This application claims priority based on Japanese Patent Application No. 2022-027114 filed in Japan on February 24, 2022, the contents of which are incorporated herein.
  • a stop error which is a difference between a target stop position and an actual stop position when the operating sun gear and internal gear stop. Furthermore, this stopping error also occurs in the transfer section. If the stop error increases, it becomes difficult to fit the carrier to the internal gear and the sun gear, or to transfer the carrier from the state where the carrier is fitted to the internal gear and the sun gear to the outside of the polishing section.
  • the present invention has been made in view of such problems, and enables easy fitting of a carrier to the internal gear and the sun gear even when there is a stop error in the internal gear, the sun gear, and the transfer section.
  • a transfer device for easily transferring a carrier to the outside of a polishing section from a state in which the carrier is fitted to an internal gear and a sun gear, a polishing facility equipped with the transfer device, and a transfer method are provided. for the purpose.
  • a first aspect of the present invention has an internal gear and a sun gear that rotate on the support surface of a surface plate, and a planetary gear system type polishing unit for polishing a surface facing the thickness direction of a substrate, and a flat plate and a plurality of teeth provided on the outer peripheral edge of the carrier that can be fitted to the internal gear and the sun gear, respectively, and a through hole for accommodating the substrate.
  • a transfer unit for transferring the carrier; an imaging unit for acquiring images of at least a portion of the plurality of teeth of the internal gear and at least a portion of the plurality of teeth of the sun gear; a control unit for controlling a position of the carrier in a creeping direction along the support surface with respect to the internal gear and the sun gear by the transfer unit based on the image; and adjusting the orientation of the carrier about an axis orthogonal to the support surface, and the transfer section moves the plurality of teeth of the carrier onto the plurality of teeth of the internal gear and the plurality of teeth of the sun gear. Fit the teeth together.
  • the image acquired by the imaging section includes an image of at least a portion of the plurality of teeth of the actual internal gear and at least a portion of the plurality of teeth of the actual sun gear in the grinding section. Therefore, for example, even if there is a stop error in the internal gear, the sun gear, and the transfer unit, the control unit, based on this image, causes the internal gear and the sun gear to move the carrier in the creeping direction with the transfer unit. Adjusting the position and orientation of the carrier about the axis facilitates fitting the teeth of the carrier to the teeth of the internal gear and the teeth of the sun gear, respectively. Therefore, even if there is a stopping error in the internal gear, the sun gear, and the transfer section, the carrier can be easily fitted to the internal gear and the sun gear.
  • the transfer unit rotates a plurality of links arranged side by side along a connecting shaft and the plurality of links adjacent to each other along the connecting shaft. and a holding portion that is provided at a tip link that is the link closest to the first side along the connecting shaft among the plurality of links and holds the carrier in a detachable manner,
  • the link closest to the second side along the connecting shaft is supported by an installation surface, and the joint allows the holding portion to move in the creeping direction with respect to the internal gear and the sun gear. , and may be transferable around the axis.
  • the carrier held by the holding portion can be transferred to the installation surface by driving the joints to move the plurality of links.
  • the joint allows the carrier held by the holding portion to be transferred to the internal gear and the sun gear in the creeping direction and around the axis.
  • the imaging unit includes a first imaging unit that acquires the image of at least a part of the plurality of teeth of the sun gear; a second imaging section that acquires the images of at least some of the plurality of tooth portions, and the first imaging section and the second imaging section may be provided at the tip link.
  • images of at least some of the plurality of teeth of the sun gear and images of at least some of the plurality of teeth of the internal gear can be separately acquired by the first imaging section and the second imaging section. . Then, by driving the joints of the transfer unit to move the plurality of links, the first imaging unit and the second imaging unit are moved, and the images captured by the first imaging unit and the second imaging unit are captured. You can change the target you are looking for.
  • the The image of at least a part of the plurality of teeth of the sun gear acquired by the first imaging unit is defined as a first reference image, and the plurality of teeth of the internal gear acquired by the second imaging unit.
  • the control unit determines that the image of at least a part of the plurality of teeth of the sun gear acquired by the first imaging unit is calculating a first amount of movement, including an amount of movement of the carrier along the creeping direction and an amount of rotation of the carrier about the axis, with respect to the internal gear and the sun gear so as to match the first reference image; , based on the difference between the image of at least a part of the plurality of tooth portions of the internal gear acquired by the second imaging unit when the first movement amount is moved and rotated, and the second reference image, A second movement amount including a movement amount of the carrier along the creeping direction and a rotation amount of the carrier about the axis relative to the internal gear and the sun gear is calculated, and the carrier is moved to the above After moving and rotating by the first movement amount and the second movement amount, the plurality of teeth of the carrier are respectively fitted to the plurality of teeth of the internal gear and the plurality of teeth of the sun gear.
  • the carrier is moved by the transfer unit to a position where the plurality of teeth of the carrier are fitted to the plurality of teeth of the sun gear by moving the carrier by the first movement amount calculated by the control unit. can be loaded. Further, the transfer unit moves the carrier by the second movement amount calculated by the control unit, thereby transferring the carrier to a position where the plurality of teeth of the carrier are fitted to the plurality of teeth of the internal gear. be able to.
  • the carrier after moving and rotating the carrier by the first movement amount and the second movement amount, by fitting the plurality of teeth of the carrier to the plurality of teeth of the internal gear and the plurality of teeth of the sun gear, Even if the internal gear, the sun gear, and the transfer section have stop errors, the carrier can be fitted to the internal gear and the sun gear more easily.
  • a second aspect of the present invention provides a planetary gear system type polishing unit that has an internal gear and a sun gear that rotate on the support surface of a surface plate and polishes the surface facing the thickness direction of the substrate.
  • a carrier having a plurality of teeth provided on an outer peripheral edge thereof and fitted to the internal gear and the sun gear, respectively, and a through hole for accommodating the substrate are transferred to the outside of the polishing section.
  • a transfer device comprising a holding portion that detachably holds the carrier, a transfer portion that transfers the carrier, at least a portion of the plurality of tooth portions of the internal gear, and a plurality of the sun gears.
  • an imaging unit that acquires an image of at least a part of the teeth of the internal gear; and a position of the carrier in a creeping direction along the support surface with respect to the internal gear and the sun gear in a state where the plurality of teeth of the carrier are fitted to the plurality of teeth of the sun gear, respectively; and detecting the orientation of the carrier about an axis orthogonal to the support surface, holding the carrier by the holding section that adjusts the position and the orientation, and moving the carrier to the polishing section by the transfer section. Transfer to outside.
  • the image acquired by the imaging section includes an image of at least a portion of the plurality of teeth of the actual internal gear and at least a portion of the plurality of teeth of the actual sun gear in the grinding section.
  • the control unit determines the carrier that fits the internal gear and the sun gear for the internal gear and the sun gear. Detects the creepage position of and the orientation around the axis. Further, based on these positions and orientations, the control section adjusts the position of the holding section in the creeping direction and the orientation about the axis, thereby making it easier to hold the carrier by the holding section.
  • the carrier can be transferred to the outside of the polishing section by the transfer section having the holding section. Therefore, even if there is a stop error in the internal gear, the sun gear, and the transfer section, the carrier can be easily transferred to the outside of the polishing section from the state in which the carrier is fitted to the internal gear and the sun gear. can.
  • the carrier transferred to the outside of the polishing section is placed on a table such as a set table with high accuracy by the transfer section, for example.
  • a third aspect of the present invention is a polishing facility comprising the transfer device according to any one of (1) to (5) and the polishing section.
  • the carrier can be easily fitted to the internal gear and the sun gear, or the carrier can be fitted to the internal gear and the sun gear.
  • the polishing equipment can be configured using a transfer device that can easily transfer the carrier to the outside of the polishing section from the state.
  • a planetary gear system type polishing section that has an internal gear and a sun gear that rotate on the support surface of a surface plate and that polishes the surface facing the thickness direction of the substrate is provided with a flat plate.
  • the image includes an image of at least a portion of the teeth of the actual internal gear and of at least a portion of the teeth of the actual sun gear in the grinding section. Therefore, for example, even if there is a stopping error in the internal gear, the sun gear, and the transfer section, the position of the carrier in the surface direction and the orientation of the carrier around the axis with respect to the internal gear and the sun gear based on this image. By adjusting , it becomes easier to fit the plurality of teeth of the carrier to the plurality of teeth of the internal gear and the plurality of teeth of the sun gear. Therefore, even if there is a stopping error in the internal gear, the sun gear, and the transfer section, the carrier can be easily fitted to the internal gear and the sun gear.
  • a fifth aspect of the present invention is a planetary gear system type polishing unit that has an internal gear and a sun gear that rotate on the support surface of a surface plate and polishes the surface facing the thickness direction of the substrate.
  • a carrier having a plurality of teeth provided on an outer peripheral edge thereof and fitted to the internal gear and the sun gear, respectively, and a through hole for accommodating the substrate are transferred to the outside of the polishing section. In the transfer method, the plurality of teeth of the internal gear and the plurality of teeth of the sun gear are engaged with the plurality of teeth of the carrier, respectively.
  • the image includes an image of at least a portion of the teeth of the actual internal gear and of at least a portion of the teeth of the actual sun gear in the grinding section. For this reason, for example, even if there is a stop error in the internal gear, the sun gear, and the transfer section, based on this image, the creepage direction of the carrier fitted to the internal gear and the sun gear with respect to the internal gear and the sun gear. Detects position and orientation about an axis. Furthermore, by adjusting the position of the holding portion in the surface direction and the orientation around the axis based on these positions and orientations, the carrier can be more easily held by the holding portion. By transferring the holding section, the carrier can be transferred to the outside of the polishing section. Therefore, even if there is a stop error in the internal gear, the sun gear, and the transfer section, the carrier can be easily transferred to the outside of the polishing section from the state in which the carrier is fitted to the internal gear and the sun gear. can.
  • the carrier can be easily fitted to the internal gear and the sun gear. , the internal gear and the sun gear, the carrier can be easily transferred to the outside of the polishing section.
  • FIG. 5 is a cross-sectional view of a main part in FIG. 4; It is a figure explaining the state before and after a suction pad is crushed.
  • FIG. 4 is a cross-sectional view showing a state in which carriers and substrates are arranged on a set table; It is sectional drawing of the state which hold
  • FIG. 4 is a flow chart showing a polishing method using a transfer method according to an embodiment of the present invention; It is a figure explaining the preparatory process in the same polishing method. It is a figure which shows an example of a 1st reference
  • FIG. 10 is a diagram showing an example of positions of an internal gear, a sun gear, and a carrier in a reference position; It is a figure which shows an example which an internal gear and a sun gear displace from a reference position.
  • FIG. 10 is a diagram showing another example in which the internal gear and the sun gear are displaced from their reference positions;
  • FIG. 10 is a diagram for explaining the revolution of the carrier when the sun gear is fixed;
  • FIG. 10 is a diagram for explaining the rotation of the carrier when the sun gear is fixed; It is a figure explaining the coordinates etc. which are set to each tooth part. It is a figure explaining the distance etc. from the center of a holding
  • FIG. 10 is a diagram for explaining the position of the tooth portion in the first reference image and the actual position of the tooth portion before transformation e T e′ is performed;
  • FIG. 10 is a diagram for explaining the position of the tooth portion in the first reference image and the actual position of the tooth portion after the transformation eT e ' is performed;
  • FIG. 10 is a diagram illustrating distances (d s1x ⁇ d i1x , d s1y ⁇ d i1y );
  • FIG. 4 is a diagram for explaining an angle ( ⁇ i ⁇ s );
  • FIG. 1 An embodiment of the polishing equipment and transfer method according to the present invention will be described below with reference to FIGS. 1 to 27.
  • FIG. 1 An embodiment of the polishing equipment and transfer method according to the present invention will be described below with reference to FIGS. 1 to 27.
  • the polishing equipment 1 shown in FIG. 1 is equipment for polishing the surface of the substrate 200 facing the thickness direction.
  • the substrate 200 is formed in a flat plate shape that exhibits a circular shape when viewed from the thickness direction of the substrate 200 .
  • substrate 200 is made of silicon.
  • FIG. 2 shows a first holding portion 52 and a second holding portion 53 that hold the substrate 200 and a carrier 205 which will be described later.
  • the substrate may be made of glass or the like.
  • the substrate 200 before being polished by the polishing equipment 1 is also referred to as a substrate 200A.
  • the substrate 200 after being polished by the polishing equipment 1 is also referred to as a substrate 200B.
  • the thickness of the substrate 200A is 780 ⁇ m (micrometers).
  • the thickness of the substrate 200B is 770 ⁇ m.
  • the carrier 205 is formed in a flat plate shape having a circular shape when viewed from the thickness direction of the carrier 205 .
  • the carrier 205 is provided with a plurality of (three in this embodiment) through holes 206 .
  • a plurality of through holes 206 are formed at equal angles around the center axis of the carrier 205 .
  • a plurality of through holes 206 penetrate through the carrier 205 in the thickness direction.
  • the diameter of the through-hole 206 and the diameter of the substrate 200 are equal to each other.
  • Substrate 200 is accommodated within through hole 206 .
  • the thickness direction of the carrier 205 coincides with the thickness direction of the substrate 200 .
  • a plurality of teeth 207 are provided on the outer peripheral edge of the carrier 205 .
  • the plurality of teeth 207 are external teeth.
  • a semicircular depression 208 is formed between the teeth 207 adjacent to each other in the circumferential direction of the carrier 205 .
  • the carrier 205 has an outer diameter of 720 mm and a thickness of 770 ⁇ m.
  • the carrier 205 is made of stainless steel or the like. Carrier 205 and substrate 200 are not flexed when substrate 200 is accommodated within through hole 206 of carrier 205, such as on a flat support surface. At this time, the bottom surface of the carrier 205 and the bottom surface of the substrate 200 are substantially flush, and the top surface of the carrier 205 and the top surface of the substrate 200 are substantially flush.
  • the number of through-holes 206 provided in the carrier 205 is not limited, and the number of through-holes 206 may be one.
  • this polishing equipment 1 includes a carry-in basket 10 , a carry-out basket 15 , a set table 20 , a first conveying device 25 , a polishing device 30 , and a main controller 80 .
  • the carry-in basket 10 containing the substrates 200A is carried into the polishing facility 1 by a carry-in device (not shown).
  • the carry-out basket 15 containing the substrate 200B is carried out from the polishing facility 1 by a carry-out device (not shown).
  • the set table 20 is a table for placing the substrate 200 and the carrier 205. As shown in FIG. 7, the upper surface 21 of the set table 20 extends along the horizontal plane. The upper surface 21 is flat. As shown in FIG. 1, for example, the first transport device 25 is a manipulator. The first transport device 25 transports the substrate 200 between the baskets 10 and 15 and the set table 20 .
  • the polishing device 30 has a polishing section 31 and a second transfer device (transfer device) 46 of the present embodiment.
  • the polishing unit 31 of this embodiment is of a planetary gear system type.
  • the polishing section 31 has a first surface plate (surface plate) 32, a sun gear 33, an internal gear 34, and a second surface plate (not shown).
  • the first support surface (support surface) 32a of the first platen 32 is arranged along the horizontal plane.
  • the first support surface 32a is flat.
  • creeping direction is referred to as creeping direction.
  • the creepage direction includes a first creepage direction, which is one direction along the first support surface 32a, and a second creepage direction along the first support surface 32a and orthogonal to the first creepage direction.
  • the first surface plate 32 rotates in the vertical direction in a first direction about a first axis O1 orthogonal to the first support surface 32a.
  • the sun gear 33 is arranged coaxially with the first axis O1 on the first support surface 32a.
  • a plurality of teeth 37 are provided on the outer peripheral edge of the sun gear 33 .
  • the plurality of teeth 37 are cylindrical external teeth.
  • the plurality of tooth portions 37 are arranged at intervals in the circumferential direction of the sun gear 33 .
  • the sun gear 33 rotates on the first support surface 32a.
  • a plurality of teeth 37 fit into a plurality of teeth 207 of carrier 205 .
  • Sun gear 33 is inscribed in carrier 205 .
  • a plurality of teeth 39 are provided on the inner peripheral edge of the internal gear 34 .
  • the plurality of teeth 39 are cylindrical internal teeth.
  • the plurality of tooth portions 39 are spaced apart from each other in the circumferential direction of the internal gear 34 .
  • the internal gear 34 rotates on the first support surface 32a.
  • a plurality of teeth 39 fit into a plurality of teeth 207 of carrier 205 .
  • the internal gear 34 circumscribes the carrier 205 .
  • the second surface plate can be switched between a sandwiching state in which the sun gear 33 and the internal gear 34 are sandwiched together with the first surface plate 32 and a retracted state in which the sun gear 33 and the internal gear 34 are separated.
  • the sandwiched second platen is arranged coaxially with the first axis O1 and rotates about the first axis O1 in a second direction opposite to the first direction.
  • the second transfer device 46 transfers the carrier 205 to the polishing section 31 .
  • the second conveying device 46 has a manipulator (transfer section) 47, an imaging section 54, and a first control section 81 (see FIG. 1), which will be described later.
  • a manipulator 47 transfers the carrier 205 and the plurality of substrates 200 .
  • the manipulator 47 is a so-called articulated robot having multiple links 48 , multiple joints 49 , and a holding portion 50 .
  • the multiple links 48 are arranged side by side along the connecting axis O3. Below, the link 48 closest to the first side along the connecting axis O3 among the plurality of links 48 is also referred to as the tip link 48A.
  • the link 48 on the second side opposite to the first side along the connecting axis O3 is also referred to as a base end link 48B.
  • Each joint 49 rotatably connects ends of a plurality of links 48 adjacent to each other along the connecting axis O3.
  • a holding portion 50 is provided on the tip link 48A.
  • the base end link 48B is supported by the installation surface F.
  • the holding section 50 can transfer the carrier 205 and the plurality of substrates 200 to the internal gear 34 and the sun gear 33 of the polishing section 31 in the creeping direction and around a second axis O5, which will be described later. is. Note that there is no limit to the number of joints 49 provided in the second conveying device.
  • the holding unit 50 detachably holds the carrier 205 and the plurality of substrates 200 .
  • the holding section 50 has a frame 51, a first holding section 52, a second holding section 53, and a suction section (not shown).
  • the frame 51 is formed with a plurality of rotational symmetry (three-fold symmetry in this embodiment) with respect to the second axis (axis) O5.
  • the first holding portion 52 and the plurality of second holding portions 53 are not arranged on the same straight line along the radial direction of the frame 51, in FIG. The position of the portion 53 in the circumferential direction of the holding portion 50 is changed. As shown in FIG.
  • the frame 51 has a top plate 57 , a first peripheral wall 58 , a second peripheral wall 59 , a first bottom plate 60 and a second bottom plate 61 .
  • the top plate 57 is formed in a disc shape.
  • the top plate 57 is supported along the horizontal plane by a plurality of links 48 and a plurality of joints 49 .
  • the first peripheral wall 58 is formed in a tubular shape and arranged coaxially with the second axis O5.
  • the first peripheral wall 58 is fixed to the bottom surface of the top plate 57 .
  • the second peripheral wall 59 is formed in a tubular shape and arranged coaxially with the second axis O5.
  • the second peripheral wall 59 surrounds the first peripheral wall 58 from the outside and is fixed to the lower surface of the outer peripheral edge of the top plate 57 .
  • the lower end of the first peripheral wall 58 protrudes below the lower end of the second peripheral wall 59 .
  • the first bottom plate 60 is disc-shaped and arranged within the first peripheral wall 58 .
  • the first bottom plate 60 is fixed to a vertically intermediate portion of the first peripheral wall 58 .
  • the second bottom plate 61 is annularly formed and arranged between the first peripheral wall 58 and the second peripheral wall 59 .
  • the second bottom plate 61 is fixed to the lower end of the first peripheral wall 58 and the lower end of the second peripheral wall 59, respectively.
  • a plurality of communication holes 61 a are formed in the second bottom plate 61 .
  • the holding portion 50 has a plurality of first holding portions 52 .
  • the plurality of first holding portions 52 are spaced apart from each other around the second axis O5.
  • the plurality of first holding portions 52 hold the outer peripheral portion of the carrier 205 from the thickness direction.
  • the outer peripheral portion referred to here means a range (0.4r) from the outer peripheral edge of the object to be held toward the center, where r is the radius of the object to be held.
  • the carrier 205 is held by the plurality of first holding portions 52 such that the center axis of the carrier 205 coincides with the second axis O5 of the frame 51 .
  • each first holding portion 52 has a first main body 64 and a first moving portion 65 .
  • the first moving part 65 has a suction pad 67 and a movable tube 68 .
  • the suction pad 67 is formed in a cone shape (conical surface shape) from an elastic material such as synthetic rubber.
  • the suction pads 67 are arranged such that their outer diameters gradually increase toward the bottom.
  • the movable tube 68 extends upward (the other side in the thickness direction) from the suction pad 67 .
  • the space inside the movable tube 68 continues to the concave portion of the suction pad 67 .
  • a first engaging portion 68 a is fixed to the outer peripheral surface of the upper end portion of the movable tube 68 .
  • a portion of the movable tube 68 below the first engagement portion 68 a is disposed within the communication hole 61 a of the second bottom plate 61 .
  • the first body 64 is tubular with an inner diameter larger than the outer diameter of the movable tube 68 .
  • the first main body 64 is bent in an L shape.
  • a first end portion 64a of the first main body 64 extends in the vertical direction.
  • the second engaging portion 64b is fixed to the inner peripheral surface of the lower end of the first end portion 64a.
  • the second engaging portion 64b is formed along the entire circumference of the first end portion 64a of the first main body 64 .
  • the second engaging portion 64b supports the first engaging portion 68a from below the first engaging portion 68a.
  • the space between the second engaging portion 64b and the movable tube 68 is airtightly sealed.
  • the movable tube 68 can move vertically with respect to the second engaging portion 64b (the first end portion 64a of the first main body 64).
  • the first main body 64 is fixed to the second bottom plate 61 of the frame 51 or the like.
  • the movable tube 68 cannot move downward with respect to the first main body 64 from the state shown in FIG.
  • the movable tube 68 can move upward with respect to the first main body 64 from the state shown in FIG.
  • the lower end of the suction pad 67 of the first holding portion 52 is brought into contact with the upper surface of the outer peripheral portion of the carrier 205 .
  • the suction pad 67 is deformed so as to be crushed as indicated by the two-dot chain line L1, and the carrier 205 in contact with the suction pad 67 is held by the suction pad 67.
  • FIG. 7 shows a state in which the carrier 205 and the substrate 200 are arranged on the upper surface 21 of the set table 20.
  • Substrate 200 is received within through-hole 206 of carrier 205 .
  • the holding unit 50 is brought close to the carrier 205 and the substrate 200 in this state from above, and the suction pads 67 of the first holding unit 52 are brought into contact with the upper surface of the outer periphery of the carrier 205 .
  • the crushed suction pad 67 of the first holding portion 52 holds the outer peripheral portion of the carrier 205 .
  • the first engaging portion 68 a of the movable tube 68 is separated upward from the second engaging portion 64 b of the first main body 64 .
  • the position of the lower end of the crushed suction pad 67 with respect to the frame 51 at this time is called a reference position P521 .
  • the reference position P 521 is preferably the average circumferential position of the suction pad 67 at the lower end of the collapsed suction pad 67 with respect to the frame 51 .
  • the position of the lower end of the suction pad 67 with respect to the frame 51 when the carrier 205 is crushed and cannot move downward with respect to the frame 51 is referred to as a lower end position P522 .
  • the lower end position P 522 is the lower end position of the movement range of the suction pad 67 of the first holding portion 52 .
  • the reference position P521 of the suction pad 67 is indicated by a chain double-dashed line L4.
  • the vertical distance between the reference position P 521 and the lower end position P 522 of the collapsed suction pad 67 is referred to as an extension distance M 52 .
  • the extension distance M52 is the length by which the first holding portion 52 extends downward (one side in the thickness direction) from the state in which the first holding portion 52 holds the carrier 205 .
  • the first holding portion 52 can extend downward from the state where the carrier 205 is held.
  • the second holding part 53 holds the substrate 200 in the through hole 206 of the carrier 205 from above and below.
  • the holding portion 50 has a second holding portion 53A, a second holding portion 53B, and a second holding portion 53C as the second holding portion 53.
  • the second holding portions 53A and 53B have the same configuration as the first holding portion 52 except for the setting of the extension distance M52 .
  • the second holding portion 53A includes a second main body 71A, a first moving portion 65, a suction pad 67, and a movable tube 68 of the first holding portion 52. It has a second moving part 72A, a suction pad 74A, and a movable tube 75A.
  • the second moving portion 72A can move vertically with respect to the second main body 71A.
  • the suction pad 74A of the second moving portion 72A holds the substrate 200.
  • the suction pad 74A of the second holding portion 53A also has a reference position P 53A1 and a lower end position P 53A2 and an extension distance M 53A are defined respectively (see FIGS. 7 and 8).
  • the extension distance M 53A is the length by which the second holding portion 53A extends downward from the state in which the second holding portion 53A holds the substrate 200 .
  • the second holding portion 53B includes a second main body 71B, a second moving portion 72B, and a suction unit having substantially the same configuration as the first main body 64, the first moving portion 65, the suction pad 67, and the movable tube 68 of the first holding portion 52. It has a pad 74B and a movable tube 75B.
  • the second moving portion 72B can move vertically with respect to the second main body 71B.
  • the suction pad 74B of the second moving part 72B holds the substrate 200 .
  • the suction pad 74B of the second holding portion 53B also has a reference position P 53B1 and a lower end position P 53B2 and an extension distance M 53B are defined respectively (see FIGS. 7 and 8).
  • the extension distance M 53B is the length by which the second holding portion 53B extends downward from the state in which the second holding portion 53B holds the substrate 200 .
  • the second holding portion 53C has the same configuration as the first holding portion 52 except for the shape of the first main body 64 and setting of the extension distance M52 .
  • the second holding portion 53C includes a second moving portion 72C, a suction pad 74C, a suction pad 74C, and a suction pad 74C having substantially the same configuration as the first moving portion 65, the suction pad 67, and the movable tube 68 of the first holding portion 52. It has a movable tube 75C.
  • a second main body 78C of the second holding portion 53C has a straight tubular shape. The second main body 78 ⁇ /b>C extends in the vertical direction and is fixed to the first bottom plate 60 of the frame 51 .
  • the frame 51 connects the first main body 64 and the second main bodies 71A, 71B, 78C to each other.
  • the suction pad 74C of the second holding portion 53C also has a reference position P 53C1 and a lower end position P 53C2 and extension distance M 53C are defined respectively (see FIGS. 7 and 8).
  • the extension distance M 53C is the length by which the second holding portion 53C extends downward from the state in which the second holding portion 53C holds the substrate 200 .
  • the second holding parts 53A, 53B, 53C can each extend downward from the state where the substrate 200 is held.
  • Reference positions P 53A1 , P 53B1 , and P 53C1 are arranged on the two-dot chain line L4 shown in FIG.
  • the second holding portions 53A, 53B, and 53C are arranged with respect to each substrate 200 at equal angles around the axis of the substrate 200.
  • extension distances M 53A , M 53B , and M 53C are equivalent to each other.
  • Extension distance M 52 is longer than extension distances M 53A , M 53B , and M 53C by exceeding the thickness (length in the thickness direction) of carrier 205 .
  • extension distance M 52 is more than twice the thickness of carrier 205 greater than extension distances M 53A , M 53B , M 53C .
  • the suction unit has a suction pump and a plurality of on-off valves (not shown).
  • the suction pumps are connected to the first main body 64 and the second main bodies 71A, 71B, 71C by tubes (not shown).
  • the suction pump can suck the air in the concave portions of the suction pads 67, 74A, 74B, 74C through the tubes, the first main body 64, the second main bodies 71A, 71B, 71C, and the movable tubes 68, 75A, 75B, 75C.
  • a plurality of on-off valves can independently open and close a plurality of tubes.
  • the second conveying device 46 has a first imaging section 54A and a second imaging section 54B as the imaging section 54 .
  • the imaging units 54A and 54B are fixed to the second peripheral wall 59 of the frame 51 . That is, the imaging units 54A and 54B are provided at the tip link 48A of the manipulator 47. As shown in FIG.
  • the imaging units 54A and 54B are arranged so as to sandwich the frame 51 in the radial direction of the frame 51 .
  • the imaging units 54A and 54B each have an imaging device (not shown).
  • the imaging units 54A and 54B acquire images of objects arranged below the imaging units 54A and 54B by the imaging elements.
  • the imaging units 54A and 54B acquire images of at least some of the teeth 39 of the internal gear 34 and at least some of the teeth 37 of the sun gear 33 .
  • the details of the images acquired by the imaging units 54A and 54B will be described in detail in the later-described polishing method.
  • the imaging units 54A and 54B send the acquired images to the main control unit 80 .
  • a stocker 85 in which a plurality of carriers 205 are stacked is located near each of the second conveying device 46 and the set table 20 .
  • the carrier 205 in the stocker 85 does not contain the substrate 200 .
  • the main control unit 80 has a CPU (Central Processing Unit), a memory, etc., although not shown.
  • the memory stores control programs and the like for operating the CPU.
  • the main controller 80 is connected to the first transport device 25 and the polishing device 30 and controls the first transport device 25 and the polishing device 30 .
  • the main controller 80 functionally has a first controller (controller) 81 and a second controller 82 .
  • the first controller 81 controls the second transfer device 46 of the polishing device 30 .
  • the second controller 82 controls the first conveying device 25 and the polishing section 31 of the polishing device 30 .
  • FIG. 9 is a flow chart showing the polishing method S.
  • a preparatory step (step S1 shown in FIG. 9) is performed in advance.
  • the preparation step S1 as shown in FIG. 10
  • the multiple teeth 207 of the carrier 205 are fitted to the multiple teeth 39 of the internal gear 34 and the multiple teeth 37 of the sun gear 33 .
  • FIGS. 13 to 15 which will be described later, do not show the plurality of teeth 207 of the carrier 205, some of the plurality of teeth 39 of the internal gear 34, and the plurality of teeth 37 of the sun gear 33.
  • the pitch of the multiple teeth 37 of the sun gear 33 is defined as PS.
  • a pitch of the plurality of tooth portions 39 of the internal gear 34 is defined as PI.
  • Pitch PS and pitch PI are equal to each other.
  • two tooth portions 37A (at least part of the plurality of tooth portions 37 of the sun gear 33) adjacent in the circumferential direction are controlled by a polishing method. is used.
  • one tooth 39A (at least part of the plurality of teeth 39 of the internal gear 34) is used under control by a grinding method.
  • the imaging range RA of the first imaging section 54A on the first support surface 32a includes two teeth 37A. That is, the first imaging unit 54A acquires images of the two tooth portions 37A of the sun gear 33 .
  • the image of the two tooth portions 37A of the sun gear 33 acquired by the first imaging section 54A is defined as a first reference image IS.
  • FIG. 10 An example of the first reference image IS is shown in FIG.
  • the imaging range RB of the second imaging section 54B on the first support surface 32a includes one tooth 39A. That is, the second imaging section 54B acquires an image of one tooth portion 39A of the internal gear 34 .
  • the image of one tooth portion 39A of the internal gear 34 acquired by the second imaging section 54B is defined as a second reference image II.
  • An example of the second reference image II is shown in FIG.
  • reference positions of the internal gear 34 and the sun gear 33 in the creeping direction when the reference images IS and II are acquired are referred to as reference positions.
  • the orientations of the internal gear 34 and the sun gear 33 about the second axis O5 when the reference images IS and II are acquired are referred to as reference orientations.
  • At least some of the plurality of teeth 37 of the sun gear 33 used for control in the polishing method may be one tooth 37 or three or more teeth 37 .
  • at least a portion of the multiple teeth 39 of the internal gear 34 used for control in the grinding method may be two or more teeth 39 .
  • the positions of the internal gear 34, the sun gear 33, the carrier 205, and the two teeth 37A that are fitted to each other are included in the imaging range RA of the first imaging unit 54A, and the one tooth 39A is included in the second imaging.
  • the positions of the imaging units 54A and 54B included in the imaging range RB of the unit 54B are referred to as reference positions.
  • the image pickup units 54A and 54B are at the reference position, the image pickup units 54A and 54B are arranged to face the two tooth portions 37A and the one tooth portion 39A.
  • FIG. 10 shows reference positions P 37A1 and P 39A1 corresponding to two teeth 37A and one tooth 39A.
  • Reference positions P 54A1 and P 54B1 corresponding to imaging units 54A and 54B are shown.
  • the polishing device 30 is used as appropriate. It is arranged at the reference position when the carrier 205 is placed or when the carrier 205 is transferred to the outside of the polishing section 31 . At this time, stop errors may occur in the internal gear 34, the sun gear 33, and the manipulator 47 with respect to the positions when the reference images IS and II were obtained. However, the sum of this stopping error is less than half the pitch PS of the toothing 37, for example. That is, the two tooth portions 37A and the one tooth portion 39A to be controlled are not shifted by more than half the pitch PS within the imaging ranges RA and RB.
  • the carry-in basket 10 containing the substrate 200A is transported by the carry-in device.
  • the second platen of the polishing section 31 is in a retracted state.
  • the first control unit 81 drives the suction unit of the manipulator 47 to close the plurality of on-off valves.
  • step S5 the first transfer method
  • step S6 the second controller 82 causes the first transfer device 25 to accommodate the substrates 200A in the carry-in basket 10 in the through holes 206 of the carrier 205 on the set table 20.
  • step S7 the process proceeds to step S7.
  • step S7 the outer peripheral portion of the carrier 205 and the substrate 200A are held by the second transfer device 46 so that the carrier 205 and the substrate 200A are separated from each other.
  • the first controller 81 causes the manipulator 47 to bring the holder 50 closer to the carrier 205 and substrate 200 on the set table 20 from above, as shown in FIG.
  • the suction pad 67 is brought into contact with the upper surface of the outer periphery of the carrier 205 .
  • the suction pads 74A, 74B, 74C of the second holding portions 53A, 53B, 53C are brought into contact with the upper surface of the substrate 200A.
  • the air in the concave portions of the suction pads 67, 74A, 74B, 74C is respectively sucked, and the suction pads 67, 74A, 74B, 74C are deformed so as to be crushed.
  • the outer peripheral portion of the carrier 205 is held from above by the crushed suction pads 67 of the first holding portion 52, and the outer peripheral portion of the substrate 200A is held by the crushed suction pads 74A, 74B, 74C of the second holding portions 53A, 53B, 53C. is held from above.
  • extension distance M 52 is longer than extension distances M 53A , M 53B , and M 53C beyond the thickness of carrier 205 . Therefore, even if the carrier 205 held by the first holding portion 52 does not bend, the carrier 205 moves below the substrate 200A beyond the thickness of the carrier 205, and the upper surface of the carrier 205 is doubled. It is arranged at the position indicated by the dotted chain line L5. The carrier 205 held by the first holding portion 52 and the substrate 200A held by the second holding portions 53A, 53B, 53C are separated from each other.
  • the central portion of the carrier 205 (the central portion of the carrier 205 when viewed in the thickness direction) is curved downward due to the gravity acting on the carrier 205 .
  • the maximum value of displacement of the curved carrier 205 (maximum amount of deflection M 1 shown in FIG. 8) is found to be about 2 mm by simulation.
  • the carrier 205 held by the first holding portion 52 and the substrate 200A held by the second holding portions 53A, 53B, 53C are further separated from each other by curving the carrier 205 so as to protrude downward. .
  • the substrate 200A is held above the carrier 205 in the transfer step S7. As shown in FIG.
  • the imaging units 54A and 54B are arranged so as to face two teeth 37A and one tooth 39A, respectively, and the internal gear 34, the sun gear 33, the carrier 205, and the imaging units are arranged. 54A and 54B are placed at the reference position. At this time, it is assumed that the internal gear 34, the sun gear 33, and the manipulator 47 have stopped errors.
  • the positions corresponding to the imaging units 54A and 54B when the stop error occurs are called initial positions P54A2 and P54B2 .
  • step S10 an adjustment/fitting step is performed.
  • the first control unit 81 causes the manipulator 47 to adjust the position of the carrier 205 in the creeping direction with respect to the internal gear 34 and the sun gear 33, and the position of the carrier 205 in the surface direction with respect to the internal gear 34 and the sun gear 33, based on the images acquired by the imaging units 54A and 54B.
  • the orientation of the carrier 205 around the two axes O5 is adjusted.
  • the plurality of teeth 207 of the carrier 205 are fitted to the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 by the manipulator 47 .
  • the first imaging unit 54A acquires images of the two tooth portions 37A of the sun gear 33 .
  • the second imaging section 54B acquires an image of one tooth portion 39A of the internal gear 34 .
  • the first control unit 81 controls the creepage of the internal gear 34 and the sun gear 33 so that the images of the two tooth portions 37A of the sun gear 33 acquired by the first imaging unit 54A match the first reference image IS.
  • a first movement amount including a movement amount of the carrier 205 along the direction and a rotation amount of the carrier 205 around the second axis O5 is calculated. The details of the formulas and the like for obtaining the first movement amount and the second movement amount, which will be described later, will be described later in (5.).
  • the carrier 205 is not actually moved or rotated in the first movement amount calculation step S11, but is collectively moved in the fitting step S13, which will be described later.
  • the first movement amount calculation step S11 if the carrier 205 is moved by the first movement amount, as shown in FIG. It moves around two axes O5.
  • the positions corresponding to the imaging units 54A and 54B after the carrier 205 is moved by the first movement amount are referred to as first transfer positions P54A3 and P54B3 .
  • the details of the adjustment/fitting step S10 will be described later in (5.).
  • the carrier 205 may be moved by the first movement amount.
  • the second imaging unit 54B may acquire an image of one tooth portion 39A of the internal gear 34.
  • step S12 the image of one tooth portion 39A of the internal gear 34 acquired by the second imaging section 54B when moved by the first movement amount and the second reference image II , a second amount of movement including the amount of movement of the carrier 205 along the surface direction and the amount of rotation of the carrier 205 about the second axis O5 with respect to the internal gear 34 and the sun gear 33 is calculated. Note that in the second movement amount calculation step S12, only the second movement amount is calculated without actually moving the carrier 205 . After the second movement amount calculation step S12 is completed, the process proceeds to step S13.
  • the manipulator 47 moves the carrier 205 by the first movement amount and the second movement amount.
  • the carrier 205 moves in the creeping direction with respect to the internal gear 34 and the sun gear 33 and rotates around the second axis O5.
  • the positions corresponding to the imaging units 54A and 54B after the carrier 205 is moved by the first movement amount and the second movement amount are referred to as second transfer positions P54A4 and P54B4 .
  • the plurality of teeth 207 of the carrier 205 are fitted to the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 39 of the sun gear 33, respectively.
  • the carrier 205 is placed on the first support surface 32a of the first platen 32 to make the carrier 205 flat. Then, the substrate 200A is spaced above the carrier 205 when the carrier 205 is flattened.
  • the first controller 81 causes the manipulator 47 to move the holder 50 above the first support surface 32a. By moving the holding portion 50 downward, the carrier 205 and the substrate 200A held by the holding portions 52, 53A, 53B, and 53C of the holding portion 50 are lowered onto the first support surface 32a.
  • the carrier 205 is placed on the first support surface 32a, the carrier 205 is flattened as indicated by the two-dot chain line L5 in FIG.
  • the substrate 200A is accommodated from above in the through holes 206 of the carrier 205 on the first support surface 32a.
  • the first controller 81 causes the manipulator 47 to move the holder 50 downward to accommodate the substrate 200A in the through hole 206 of the carrier 205 .
  • a plurality of on-off valves of the second transfer device 46 are closed to release the carrier 205 and the substrate 200A from being held by the holding portions 52, 53A, 53B, and 53C.
  • the manipulator 47 retracts the holding portion 50 from the first support surface 32a.
  • the second control unit 82 puts the second surface plate of the polishing unit 31 in a sandwiched state, and moves the first surface plate 32 and the second surface plate in a predetermined orientation around the first axis O1. At the same time, at least one of the sun gear 33 and the internal gear 34 is rotated around the first axis O1.
  • the first surface plate 32, the second surface plate, etc. are rotated for a predetermined time, the surface facing the thickness direction of the substrate 200A is polished by the first surface plate 32 and the second surface plate, and the substrate 200A is polished. It becomes the substrate 200B after being processed.
  • the second control unit 82 puts the second surface plate of the polishing unit 31 in the retracted state.
  • the first control unit 81 performs a second transfer method (transfer method, step S15) that is substantially the reverse of the first transfer method S5, thereby transferring the carrier 205 from the polishing unit 31 to the polishing unit. 31 outside.
  • the first control unit 81 uses the manipulator 47 to arrange the imaging units 54A and 54B so as to face the two tooth portions 37A and the one tooth portion 39A, respectively.
  • the first control unit 81 adjusts the position and orientation (orientation) of the holding unit 50 of the manipulator 47 based on the position and orientation of the carrier 205 on the first support surface 32a of the polishing unit 31. adjust. Then, from the state in which the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 are engaged with the plurality of teeth 207 of the carrier 205 , the manipulator 47 moves the carrier 205 to the grinding section 31 . Transfer to outside.
  • step S17 in the first movement amount calculation step (step S17) and the second movement amount calculation step (step S18), steps similar to the first movement amount calculation step S11 and the second movement amount calculation step S12 are performed. to calculate the first movement amount and the second movement amount. That is, in the first movement amount calculation step S17 and the second movement amount calculation step S18, the first movement amount and the second movement amount are obtained using the mathematical expressions described in (5.) below.
  • step S19 the first control unit 81 controls the plurality of teeth 39 of the internal gear 34 and the plurality of teeth of the sun gear 33 based on the first reference image IS and the second reference image II.
  • the position of the carrier 205 in the creeping direction referred to here can be said to be the deviation of the position of the carrier 205 in the creeping direction with respect to the position of the carrier 205 fitted to the internal gear 34 and the sun gear 33, which are the reference position and the reference orientation.
  • the orientation of the carrier 205 about the second axis O5 referred to here is the orientation of the carrier 205 about the second axis O5 relative to the orientation of the carrier 205 fitted to the internal gear 34 and the sun gear 33, which are the reference position and reference orientation. It can be said to be a mistake.
  • the first control unit 81 holds the carrier 205 by the holding unit 50 whose position and orientation are adjusted. Specifically, the holding portions 52 , 53 A, 53 B, and 53 C of the holding portion 50 hold the carrier 205 and the substrate 200 B. By adjusting the position and orientation of the holding portion 50, the first holding portion 52 can reliably hold the carrier 205, and the second holding portions 53A, 53B, and 53C can reliably hold the substrate 200B.
  • the manipulator 47 moves the holding section 50 by the first movement amount and the second movement amount, and transfers the carrier 205 and the substrate 200B onto the upper surface 21 of the set table 20 outside the polishing section 31 . When the removing step S19 ends, all steps of the second transfer method S15 end.
  • the second control unit 8 proceeds to step S25.
  • the second controller 82 causes the first transport device 25 to accommodate the substrate 200B on the set table 20 in the unloading basket 15.
  • the unloading basket 15 containing the substrate 200B is unloaded from the polishing facility 1 by a suitable unloading device.
  • the substrate 200A is continuously polished by the polishing equipment 1.
  • the image acquired by the imaging unit 54 includes one tooth portion 39A of the actual internal gear 34 and the actual sun gear 33 in the polishing unit 31. includes images of two teeth 37A. Therefore, for example, even if there is a stop error in the internal gear 34, the sun gear 33, and the manipulator 47, the first control unit 81 controls the internal gear 34 and the sun gear 33 by the manipulator 47 based on this image.
  • the first control unit 81 controls the internal gear 34 and the sun gear 33 by the manipulator 47 based on this image.
  • the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 are aligned with the plurality of teeth of the carrier 205. It becomes easier to fit the tooth portions 207 together. Therefore, even if the internal gear 34, the sun gear 33, and the manipulator 47 have stop errors, the carrier 205 can be easily fitted to the internal gear 34 and the sun gear 33, respectively.
  • the manipulator 47 has multiple links 48 , multiple joints 49 , and multiple holding portions 50 . Therefore, the carrier 205 held by the holding portion 50 can be transferred to the installation surface F by driving the joints 49 to move the links 48 .
  • the carrier 205 held by the holding portion 50 can be transferred to the internal gear 34 and the sun gear 33 in the creeping direction and around the second axis O5 by the plurality of joints 49 .
  • the first imaging section 54A and the second imaging section 54B of the imaging section 54 are provided at the tip link 48A. Therefore, the images of the two tooth portions 37A of the sun gear 33 and the image of the single tooth portion 39A of the internal gear 34 can be separately acquired by the first imaging section 54A and the second imaging section 54B.
  • the first imaging unit 54A and the second imaging unit 54B are moved to move the first imaging unit 54A and the second imaging unit 54B. can change the subject in the image acquired by .
  • the first controller 81 calculates the first movement amount and the second movement amount. After the carrier 205 is moved and rotated by the manipulator 47 by the first movement amount and the second movement amount, the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 are engaged with the carrier 205 . are fitted to each other. By moving the first movement amount carrier 205 calculated by the first control unit 81 by the manipulator 47, the plurality of teeth 207 of the carrier 205 are fitted to the plurality of teeth 37 of the sun gear 33. A carrier 205 can be transferred.
  • the carrier 205 can be transferred.
  • the plurality of teeth 207 of the carrier 205 are attached to the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33, respectively.
  • the carrier 205 can be more easily fitted to the internal gear 34 and the sun gear 33, respectively, even if the internal gear 34, the sun gear 33, and the manipulator 47 have stop errors.
  • the second transfer device 46 transfers the carrier 205 from the polishing section 31 to the outside of the polishing section 31 .
  • the image acquired by the imaging unit 54 includes an image of one tooth 39A of the actual internal gear 34 and two teeth 37A of the actual sun gear 33 in the grinding unit 31 . Therefore, for example, even if the internal gear 34, the sun gear 33, and the manipulator 47 have stop errors, the first control unit 81 controls the internal gear 34 and the sun gear 33 based on this image. and the position of the carrier 205 fitted to the sun gear 33 in the creeping direction and the orientation about the second axis O5.
  • the first control unit 81 adjusts the position of the holding unit 50 in the creeping direction and the orientation about the second axis O5 based on these positions and orientations, so that the carrier 205 can be easily held by the holding unit 50. Become. Then, the carrier 205 can be transferred to the outside of the polishing section 31 by the manipulator 47 having the holding section 50 . Therefore, even if the internal gear 34, the sun gear 33, and the manipulator 47 have a stop error, the carrier 205 can be easily moved out of the polishing section 31 from the state in which the carrier 205 is fitted to the internal gear 34 and the sun gear 33, respectively. can be transferred to The carrier 205 transferred to the outside of the polishing section 31 is placed on the set table 20 with high precision by the manipulator 47 .
  • the polishing equipment 1 of the present embodiment even if there is a stop error in the internal gear 34, the sun gear 33, and the manipulator 47, the carrier 205 can be easily fitted to the internal gear 34 and the sun gear 33, respectively.
  • the polishing installation 1 can be configured using two transport devices 46 .
  • the image includes one tooth portion 39A of the actual internal gear 34 and two tooth portions 37A of the actual sun gear 33 in the grinding section 31. image is included.
  • the position of the carrier 205 in the creepage direction with respect to the ring gear 34 and the sun gear 33, and the second By adjusting the orientation of the carrier 205 about the axis O5, it becomes easier to fit the multiple teeth 207 of the carrier 205 to the multiple teeth 39 of the internal gear 34 and the multiple teeth 37 of the sun gear 33, respectively. Therefore, even if the internal gear 34, the sun gear 33, and the manipulator 47 have stop errors, the carrier 205 can be easily fitted to the internal gear 34 and the sun gear 33, respectively.
  • the image includes one tooth portion 39A of the actual internal gear 34 and two tooth portions 37A of the actual sun gear 33 in the grinding section 31. image is included. Therefore, for example, even if there is a stopping error in the internal gear 34, the sun gear 33, and the manipulator 47, the internal gear 34 and the sun gear 33 can be fitted to the internal gear 34 and the sun gear 33 based on this image.
  • the position of the carrier 205 in the surface direction and the orientation about the second axis O5 are detected. Further, by adjusting the position of the holding portion 50 in the surface direction and the orientation around the second axis O5 based on these positions and orientations, the carrier 205 can be easily held by the holding portion 50 .
  • the carrier 205 can be transferred to the outside of the polishing section 31 by transferring the holding section 50 . Therefore, even if the internal gear 34, the sun gear 33, and the manipulator 47 have a stop error, the carrier 205 can be easily moved out of the polishing section 31 from the state in which the carrier 205 is fitted to the internal gear 34 and the sun gear 33, respectively. can be transferred to
  • the second conveying device 46 only needs to fit the carrier 205 to the internal gear 34 and the sun gear 33 or transfer the carrier 205 from the polishing section 31 to the outside of the polishing section 31 .
  • the internal gear 34 and the sun gear are adjusted so that at least a partial image of the plurality of teeth 39 of the internal gear 34 acquired by the second imaging unit 54B matches the second reference image II.
  • a second amount of movement may be calculated that includes the amount of movement of the carrier 205 along the surface direction with respect to the gear 33 and the amount of movement of the carrier 205 around the second axis O5.
  • the internal gear 34 and the A first movement amount including a movement amount of the carrier 205 along the surface direction and a rotation amount of the carrier 205 around the second axis O5 with respect to the sun gear 33 may be calculated.
  • the plurality of teeth of the carrier 205 are attached to the plurality of teeth 39 of the internal gear 34 and the plurality of teeth 37 of the sun gear 33 .
  • the portions 207 may be fitted together.
  • the outer edge of the cross section perpendicular to the first axis O1 in the plurality of tooth portions of the sun gear 33 may be an involute curve.
  • the second conveying device 46 is assumed to have two imaging units 54A and 54B. However, the number of imaging units that the second conveying device has is not limited to this, and may be one or three or more.
  • the carrier 205 revolves clockwise about the first axis O1, but the orientation of the carrier 205 about the second axis O5 hardly changes (the carrier 205 hardly rotates).
  • the first controller 81 uses the manipulator 47 to adjust the position of the carrier 205 in the surface direction.
  • the first controller 81 uses the manipulator 47 to adjust the orientation of the carrier 205 around the second axis O5.
  • a general stopping error of the internal gear 34 and the sun gear 33 is a stopping error combining the stopping errors shown in FIG. 17 and the stopping errors shown in FIG.
  • the first control unit 81 uses the manipulator 47 to adjust the position of the carrier 205 in the creeping direction, and further adjusts the orientation of the carrier 205 about the second axis O5 so that the internal gear 34 and the sun gear 33 are generally adjusted. Stopping errors can be accommodated.
  • the carrier 205 is moved by the second movement.
  • the number of teeth of the internal gear 34 (the total number of the plurality of tooth portions 39) is defined as zi .
  • the number of teeth of the sun gear 33 is defined as zs .
  • the number of teeth of carrier 205 is defined as zc .
  • the number of teeth z i is 360. Let the number of teeth zs be 120 and the number of teeth zc be 120.
  • the orientation (rotation angle) of the carrier 205 rotates forward (counterclockwise) by 1.5 (3/2) rotations, as shown in FIG.
  • the carrier 205 revolves (3/4) ⁇ I and rotates (3/2) ⁇ I .
  • the counterclockwise (inner) tooth portion 37A is hereinafter referred to as the first tooth portion 37A1.
  • the tooth portion 37A on the clockwise side (outer side) is hereinafter referred to as a second tooth portion 37A2.
  • the tooth portion 39A of the internal gear 34 one tooth portion 39A1 is to be controlled. Axes perpendicular to each other along the first support surface 32a are referred to as an x-axis and a y-axis.
  • the coordinates of the center of the holding portion 50 of the manipulator 47 are defined as (x e , y e ), and the rotation angle around the second axis O5 is defined as ⁇ e .
  • the xe - axis and the ye - axis are along the first support surface 32a (along the creeping direction).
  • the symbol for the radius of the revolution circle of carrier 205 is defined as r i -c .
  • the design value of the radius of the revolution circle of the carrier 205 is 720 mm.
  • the coordinates of the first tooth portion 37A1 in the first reference image IS are defined as (x s1 , y s1 ).
  • the coordinates of the first tooth portion 39A1 in the second reference image II are defined as (x i1 , y i1 ).
  • the number of teeth zc of the carrier 205 is 120.
  • r c is the radius of the carrier 205 pitch circle.
  • ⁇ x e is the amount of movement of the carrier 205 in the x e- axis direction
  • ⁇ y e is the amount of movement of the carrier 205 in the y e- axis direction.
  • ⁇ e is the amount of rotation of the carrier 205 around the second axis O5.
  • the second movement amount includes movement amounts ⁇ x e , ⁇ y e , and ⁇ e .
  • the movement amount ⁇ x s1 is the distance in the x-axis direction between the actual image of the first tooth portion 37A1 acquired by the first imaging section 54A and the image of the first tooth portion 37A1 in the first reference image IS.
  • the movement amount ⁇ y s1 is the distance in the y-axis direction between the actual image of the first tooth portion 37A1 acquired by the first imaging section 54A and the image of the first tooth portion 37A1 in the first reference image IS.
  • ⁇ x s2 is the distance in the x-axis direction between the actual image of the second tooth portion 37A2 acquired by the first imaging section 54A and the image of the second tooth portion 37A2 in the first reference image IS.
  • ⁇ ys2 is the distance in the y-axis direction between the actual image of the second tooth portion 37A2 acquired by the first imaging section 54A and the image of the second tooth portion 37A2 in the first reference image IS.
  • ⁇ x i1 is the distance in the x-axis direction between the actual image of the first tooth 39A1 acquired by the second imaging unit 54B and the image of the first tooth 39A1 in the second reference image II.
  • ⁇ y i1 is the distance in the y-axis direction between the actual image of the first tooth portion 39A1 acquired by the second imaging section 54B and the image of the first tooth portion 39A1 in the second reference image II.
  • the distance (vector) from the center of the holding portion 50 (the end of the manipulator 47 on the first side) to each tooth portion in the reference images IS and II is a constant as follows. - The distance from the center of the holding portion 50 to the first tooth portion 37A1 in the first reference image IS is represented by the formula (7). - The distance from the center of the holding portion 50 to the second tooth portion 37A2 in the first reference image IS is represented by the formula (8). - The distance from the center of the holding portion 50 to the first tooth portion 39A1 in the second reference image II is represented by the formula (9).
  • a phase difference ⁇ (rad) between the actual image of the first tooth portion 37A1 acquired by the first imaging section 54A and the image of the first tooth portion 37A1 in the first reference image IS is expressed by the equation (12). .
  • Atan2(x, y) means an inverse function of tan defined by a value of 0 or more and less than 2 ⁇ .
  • the image of the two teeth 37A of the sun gear 33 acquired by the first imaging unit 54A matches the image of the two teeth 37A of the first reference image IS, acquired by the second imaging unit 54B.
  • the distance between the image of the first tooth portion 39A1 and the image of the first tooth portion 39A1 in the second reference image II is represented by Equation (15).
  • Equation (16) the phase difference (rad) between the image of the first tooth portion 39A1 acquired by the second imaging section 54B and the image of the first tooth portion 39A1 in the second reference image II is expressed by Equation (16). be done.
  • ( ⁇ i , ⁇ s ) is the phase difference between the carrier 205 and the internal gear 34 after moving by the first movement amount.
  • ( ⁇ i ⁇ s ) is positive when p iy is positive and ( ⁇ i ⁇ s ) is negative when p iy is negative.
  • the movement amounts ⁇ x e , ⁇ y e , and ⁇ e are expressed by equations (17) and (18).
  • the error of the distance from the center of the holding part 50 to each tooth is represented by the following formula. - The error of the distance from the center of the holding part 50 to the first tooth part 37A1 is represented by the formula (26). - The error of the distance from the center of the holding part 50 to the second tooth part 37A2 is represented by the formula (27). - The error of the distance from the center of the holding part 50 to the first tooth part 39A1 is represented by the formula (28).
  • the distance from the first tooth portion 37A1 to the second tooth portion 37A2 is represented by the formula (33).
  • the actual image of the first tooth portion 37A1 acquired by the first imaging section 54A and the image of the first tooth portion 37A1 in the first reference image IS are at coordinates (x s1 , y s1 ).
  • the coordinates of the image of the second tooth portion 37A2 in the first reference image IS are (x s2 , y s2 ).
  • the actual coordinates of the second tooth portion 37A2 are (x s2 +( ⁇ x s2 - ⁇ x s1 ), y s2 +( ⁇ y s2 - ⁇ y s1 )).
  • Equation (37) The transformation that controls the manipulator 47 to match the images of the teeth 37A1 and 37A2 in the first reference image IS with the actual images of the teeth 37A1 and 37A2 acquired by the first imaging unit 54A is expressed by the following equation (37): is represented by However, the coordinates (x e , y e ) of the center of the holding portion 50 of the manipulator 47 are used as a reference. It should be noted that equation (37) represents the first movement amount.
  • the second reference image is obtained after the images of the tooth portions 37A1 and 37A2 in the first reference image IS are matched with the actual tooth portions 37A1 and 37A2.
  • a distance pi between the image of the first tooth portion 39A1 in the image II and the actual first tooth portion 39A1 is obtained.
  • the movement of the coordinates of the second imaging section 54B (the movement of the coordinates of the first tooth section 39A1) is represented by Equation (40).
  • the distance (d s1x ⁇ d i1x , d s1y ⁇ d i1y ) is the distance from the first tooth portion 39A1 to the first tooth portion 37A1 as shown in FIG.
  • the position of the first tooth portion 39A1 in the second reference image II is defined as P39A11 .
  • the actual position of the first tooth portion 39A1 is defined as P 39A12 .
  • the angle ( ⁇ i ⁇ s ) formed by the line connecting the center of the sun gear 33 (the second axis O5) and the position P 39A11 and the line connecting the center of the sun gear 33 and the position P 39A12 is represented by the above formula (16).
  • the two tooth portions 37A of the sun gear 33 are in a state where the positions of the actual object and the first reference image IS match.
  • the solar-type planetary gear (sun gear fixed/internal gear is ( ⁇ i ⁇ s ) rotation). Therefore, the rotation and revolution angles of the carrier 205 can be obtained from the rotation ratio of the solar planetary gear.
  • the manipulator 47 should be controlled accordingly.
  • Table 3 shows the rotation angle ratios of the internal gear 34 and the like in the solar type with the sun gear 33 fixed.
  • the carrier 205 rotates ((z i z c +z s )/(z c z i +z s )) ⁇ i (z i /(z i +z s )) ⁇ i revolves.
  • the conversion matrix (the sum of the first movement amount and the second movement amount) for the manipulator 47 performed after the positions of the tooth portions 37A1, 37A2, and 39A1 are first detected by the imaging units 54A and 54B is (44) is represented by the formula.
  • "C" represents “cos”
  • "S” represents "sin”.
  • the transfer device, the polishing equipment, and the transfer method can easily fit the carrier to the internal gear and the sun gear, respectively, even if there is a stop error in the internal gear, the sun gear, and the transfer section.
  • the carriers can be easily transferred to the outside of the polishing section from the state in which the carriers are fitted to the gears. Therefore, industrial applicability is great.
  • Second conveying device (transfer device) 47 manipulator (transfer section) 48 link 49 joint 50 holding section 54 imaging section 54A first imaging section 54B second imaging section 200 substrate 205 carrier 206 through hole F installation surface II second reference image IS first reference image O5 second axis (axis) S5 First transfer method (transfer method) S15 Second transfer method (transfer method)

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif de transfert qui déplace, vers une partie de polissage de type planétaire comprenant un engrenage interne et une roue solaire qui tournent sur une surface de support d'un plateau et qui polissent la surface d'un substrat orienté dans la direction de l'épaisseur, un support dans lequel sont formées une pluralité de dents qui sont plates, prévues sur le bord périphérique externe et aptes à s'engrener avec l'engrenage interne et la roue solaire, ainsi qu'un trou traversant recevant le substrat, le dispositif de transfert comprenant une partie de transfert pour transférer le support, une partie de capture d'image pour acquérir une image d'au moins une partie de la pluralité de dents de l'engrenage interne et d'au moins une partie de la pluralité de dents de la roue solaire, ainsi qu'une unité de commande pour commander l'unité de transfert.
PCT/JP2023/005980 2022-02-24 2023-02-20 Dispositif de transfert, équipement de polissage et procédé de transfert WO2023162924A1 (fr)

Applications Claiming Priority (2)

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JP2022027114A JP2023123192A (ja) 2022-02-24 2022-02-24 移載装置、研磨設備、及び移載方法
JP2022-027114 2022-02-24

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WO2023162924A1 true WO2023162924A1 (fr) 2023-08-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117001448A (zh) * 2023-10-07 2023-11-07 通威微电子有限公司 一种研磨装置及研磨装置控制方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61191847U (fr) * 1985-05-21 1986-11-29
JPH04206931A (ja) * 1990-11-30 1992-07-28 Kyushu Electron Metal Co Ltd 研磨装置における半導体基板位置検出方法及び自動着脱装置
JPH05212670A (ja) * 1992-01-31 1993-08-24 Fujikoshi Kikai Kogyo Kk ラッピング装置のキャリア割り出し方法及びその装置
JP2000326222A (ja) * 1999-05-17 2000-11-28 Kashiwara Machine Mfg Co Ltd 両面研摩方法及び装置
JP2003175456A (ja) * 2001-12-11 2003-06-24 Fujikoshi Mach Corp 両面研磨装置
JP2005243996A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法
JP2017537479A (ja) * 2014-11-18 2017-12-14 エルジー・シルトロン・インコーポレーテッド ウェハー研磨装備のウェハーローディング装置及びウェハーローディング位置調整方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61191847U (fr) * 1985-05-21 1986-11-29
JPH04206931A (ja) * 1990-11-30 1992-07-28 Kyushu Electron Metal Co Ltd 研磨装置における半導体基板位置検出方法及び自動着脱装置
JPH05212670A (ja) * 1992-01-31 1993-08-24 Fujikoshi Kikai Kogyo Kk ラッピング装置のキャリア割り出し方法及びその装置
JP2000326222A (ja) * 1999-05-17 2000-11-28 Kashiwara Machine Mfg Co Ltd 両面研摩方法及び装置
JP2003175456A (ja) * 2001-12-11 2003-06-24 Fujikoshi Mach Corp 両面研磨装置
JP2005243996A (ja) * 2004-02-27 2005-09-08 Shin Etsu Handotai Co Ltd 半導体ウエーハ用キャリアの保持孔検出装置及び検出方法並びに半導体ウエーハの研磨方法
JP2017537479A (ja) * 2014-11-18 2017-12-14 エルジー・シルトロン・インコーポレーテッド ウェハー研磨装備のウェハーローディング装置及びウェハーローディング位置調整方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117001448A (zh) * 2023-10-07 2023-11-07 通威微电子有限公司 一种研磨装置及研磨装置控制方法

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